X-ray measurement system

Abstract

To provide an X-ray measurement system capable of making measurement at a low cost while reflecting a state of a surface of an object to be measured.SOLUTION: An X-ray measurement system (1) includes: an irradiation unit (11) that irradiates a plurality of measurement points on a surface of an object (2) to be measured with an X-ray; a detection unit (14) that detects the X-ray diffracted by the object to be measured; a first calculation unit (211) that generates a temporary diffraction profile from a detection result by the detection unit and a temporary center position predetermined at the measurement point for each measurement point to calculate a camera length from the temporary diffraction profile; a second calculation unit (212) that calculates an inclination of the surface from a change ratio of the camera length on the surface and an incidence angle of the X-ray at the measurement point from the inclination and the camera length; and a third calculation unit (213) that calculates a measurement value at the measurement point from the detection result and the incidence angle.SELECTED DRAWING: Figure 7

Description

[Technical Field]

[0001] The present invention relates to an X-ray measurement system. [Background technology]

[0002] 2. Description of the Related Art Conventionally, X-ray measurement systems have been known that utilize the diffraction phenomenon of X-rays to measure the residual stress, half-value width, amount of retained austenite, etc. of an object to be measured.

[0003] In this regard, Patent Document 1 discloses an X-ray diffraction measurement system that creates three-dimensional shape data of an object to be measured, and calculates the distance between the X-ray irradiation point and the imaging surface, as well as the incident direction of the X-rays, using the three-dimensional shape data and the position and orientation of a housing that has an X-ray emitter. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 6600930 Summary of the Invention [Problem to be solved by the invention]

[0005] However, with the technology described in Patent Document 1, it takes time to measure the three-dimensional shape data of the object to be measured, and furthermore, the size of the housing increases because the measuring device for the three-dimensional shape data is mounted in the housing. Therefore, with the technology described in Patent Document 1, the cost required for performing X-ray measurement on the object to be measured increases.

[0006] The present invention has been made in view of the above problems, and its object is to provide an X-ray measurement system that can perform measurements at low cost while reflecting the surface condition of the object to be measured. [Means for solving the problem]

[0007] In order to solve the above problems, the X-ray measurement system of the present invention includes an irradiation unit that irradiates X-rays to a plurality of measurement points on the surface of an object to be measured, a detection unit that detects the X-rays diffracted by the object to be measured, a first calculation unit that generates a provisional diffraction profile for each measurement point from the detection results by the detection unit and a provisional center position that is predetermined for the measurement point and calculates a camera length from the provisional diffraction profile, a second calculation unit that calculates the inclination of the surface from the rate of change of the camera length on the surface and calculates the angle of incidence of the X-rays at the measurement point from the inclination, and a third calculation unit that calculates the measurement value of the measurement point from the detection results and the angle of incidence.

[0008] Moreover, the third calculation unit calculates the center position of the measurement point from the camera length and the incident angle, generates a diffraction profile from the center position and the detection result, and calculates the measurement value from the diffraction profile.

[0009] Further, the third calculation unit calculates the center position of the measurement point from the camera length, generates a diffraction profile from the center position and the detection result, calculates a provisional measurement value from the diffraction profile, and calculates the measurement value by correcting the provisional measurement value by the incident angle.

[0010] Furthermore, when the operation mode is a first mode, the third calculation unit calculates the center position of the measurement point from the camera length and the incident angle, and calculates the measurement value from the center position; when the operation mode is a second mode different from the first mode, the third calculation unit calculates the center position from the camera length, calculates a provisional measurement value from the center position, and calculates the measurement value by correcting the provisional measurement value by the incident angle.

[0011] The measurement value is a stress value of the object to be measured. [Effects of the Invention]

[0012] According to the present invention, the X-ray measurement system can perform measurements at low cost while reflecting the surface condition of the object to be measured. [Brief explanation of the drawings]

[0013] [Figure 1] 1 is a diagram showing the overall configuration of an X-ray measurement system according to an embodiment of the present invention. [Figure 2] 2 is a block diagram showing an example of a functional configuration of a control device shown in FIG. 1. FIG. [Figure 3] 2 is a diagram showing an example of a diffraction ring detected by a detection unit shown in FIG. 1. FIG. [Figure 4] 2 is a graph showing an example of a diffraction profile generated by the control device shown in FIG. 1. [Figure 5] 2 is a diagram showing the positional relationship between the X-ray measurement system shown in FIG. 1 and an object to be measured. FIG. [Figure 6] 2 is a graph showing the inclination of the surface of the object to be measured shown in FIG. 1 as a function of the camera length in the X-axis direction. [Figure 7] 2 is a flowchart showing an example of a processing flow of the X-ray measurement system shown in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0014] Hereinafter, an embodiment of the present invention (hereinafter referred to as "the present embodiment") will be described with reference to the accompanying drawings. To facilitate understanding of the description, the same components and steps in each drawing will be designated by the same reference numerals as much as possible, and redundant description will be omitted.

[0015] <Overall structure> FIG. 1 is a diagram showing an example of the configuration of an X-ray measurement system 1 according to this embodiment. The X-ray measurement system 1 performs X-ray measurement by irradiating an object 2 under test with X-rays and detecting the X-rays diffracted by the object 2 under test. The object 2 under test is an object to be measured, and may be, for example, an automobile part such as a gear, crankshaft, or shaft, or other parts. The object 2 under test may be, for example, a steel material. Measurement items for the object 2 under test include, for example, the hardness of the object 2 under test (for example, correlation with the half-width of the diffracted X-ray profile for a steel material), residual stress, and the amount of retained austenite (for example, the integrated intensity ratio of the diffracted X-ray profiles of the α phase and the γ phase). The object 2 under test has a curved surface. The X-ray measurement system 1 has two operating modes for measuring the object 2 under test: a detailed measurement mode and a simple measurement mode. When performing X-ray measurement on the object 2 under test, the X-ray measurement system 1 operates in either the detailed measurement mode or the simple measurement mode.

[0016] 1, the X-ray measurement system 1 includes, for example, a main body 10 and includes an irradiation unit 11, a substrate 13, and a detection unit 14 as its main components. The X-ray measurement system 1 also includes a control device 20. The main body 10 is held by an arm (not shown) or the like, and is movable within a predetermined range in position and angle, and the position and angle are controlled according to a control command from the control device 20.

[0017] Irradiation unit 11 irradiates measurement points on the surface of object 2 under test with X-rays. A plurality of measurement points are predetermined on the surface of object 2 under test by control device 20. Irradiation unit 11 is mainly composed of tube 111 and collimator 112. Tube 111 generates X-rays in accordance with control commands from control device 20 and irradiates the generated X-rays toward object 2 under test. Tube 111 is made of a material such as glass or metal. Collimator 112 has a function of adjusting the irradiation range of the X-rays generated by tube 111 in accordance with control commands from control device 20. Collimator 112 is provided below tube 111 (on the substrate side) and extends toward substrate 13. The X-rays generated by tube 111 pass through collimator 112 and are irradiated toward object 2 under test.

[0018] Substrate 13 is a plate-like member and is provided with detection unit 14. Substrate 13 is provided with a hole, and collimator 112 extending from the bulb 111 side protrudes from this hole toward object 2 under test.

[0019] Detecting unit 14 has, for example, a rectangular shape and is provided on substrate 13 on the side of object under test 2 (the side opposite tube 111). Detecting unit 14 detects X-rays diffracted from object under test 2. Specifically, detecting unit 14 detects diffraction rings, which are annular diffraction images of the diffracted X-rays. Diffraction rings are also called Debye rings or Debye-Scherrer rings. Detecting unit 14 is an imaging element for capturing an image of the diffraction rings, and is, for example, an SOI (Silicon on Insulator) sensor. Detecting unit 14 is, for example, configured with two chips provided on either side of collimator 112. The number of chips is not limited.

[0020] The control device 20 is an information processing device that measures the above-mentioned measurement items for the device under test 2. The control device 20 is mainly configured to include, for example, a communication device 21, a storage device 22, a CPU (Central Processing Unit) 25, and a memory 26. The control device 20 functions as various functional components described below when the CPU 25 executes a predetermined program stored in the memory 26 or the storage device 22. The communication device 21 is configured with a communication interface for communicating with external devices. The storage device 22 is configured with a hard disk or the like, and stores various programs and information required to execute processing in the control device 20, as well as information on processing results. The control device 20 may be configured with a single information processing device or multiple information processing devices. Furthermore, FIG. 1 only shows a portion of the main hardware configuration of the control device 20, and the control device 20 may also include other components such as an operation device and a display device.

[0021] <Functional configuration> The overall configuration of the X-ray measurement system 1 has been described above. Next, the functional configuration of the control device 20 in the X-ray measurement system 1 will be described. FIG. 2 is a block diagram showing an example of the functional configuration of the control device 20. As shown in FIG. 2, the control device 20 is configured such that its main functional components include, for example, a drive unit 210, a first calculation unit 211, a second calculation unit 212, a third calculation unit 213, a mode switching unit 214, and a storage unit 220. Note that the functional means other than the storage unit 220 are realized by the CPU 25 executing programs stored in the storage device 22 or the like.

[0022] The driving unit 210 controls the driving operation of the position and angle of the main body unit 10. The driving unit 210 also controls the irradiation operation of the tube 111 and the operation of the collimator 112 to adjust the irradiation range of the irradiation unit 11.

[0023] The first calculation unit 211 generates a provisional diffraction profile, which is a provisional diffraction profile, for each of a plurality of measurement points on the surface of the object 2 from the detection results by the detection unit 14 and provisional center positions that are predetermined for the measurement points. The diffraction profile is information that indicates the distribution of X-ray intensity in the radial direction at a predetermined deflection angle with respect to the diffraction ring. Here, the detection results by the detection unit 14 and the diffraction profile will be described with reference to FIGS. 3 and 4.

[0024] FIG. 3 is a diagram showing an example of a diffraction ring C detected by the detection unit 14 shown in FIG. 1. In FIG. 3, the imaginary axis pointing to the right is the X-axis. In FIG. 3, the imaginary axis pointing upward is the Y-axis. The radius of a polar coordinate system centered at point P is the radius r. The deflection angle of the polar coordinate system centered at point P is the angle α. X-rays irradiated onto the object under test 2 are detected as the diffraction ring C in FIG. 3, for example. That is, the angle α is also the angle in the circumferential direction of the diffraction ring C. Each of the two chips constituting the detection unit 14 detects a portion of the diffraction ring C. The detection unit 14 may detect a portion of the diffraction ring C, or the entire circumference (entire periphery) of the diffraction ring C.

[0025] 4 is a graph showing an example of a diffraction profile generated by the control device 20 shown in FIG. 1. In FIG. 4, the horizontal axis represents the position in the radial r direction. In addition, in FIG. 4, the vertical axis represents the detected value indicating the intensity of the X-ray detected by the detection unit 14. The diffraction profile shown in FIG. 4 shows the relationship between the position in the radial r direction and the detected value, which is the X-ray intensity, when the deflection angle of the diffraction ring C is angle α. As shown in FIG. 4, when the deflection angle of the diffraction ring C is angle α, the detected value of the X-ray reaches the peak position r p The peak level is obtained by fitting the profile with a Gaussian function. Note that the peak level is not limited to the peak level of the Gaussian function, and may be, for example, the maximum intensity in the profile.

[0026] 2, the provisional diffraction profile is generated by the first calculation unit 211 based on polar coordinates centered on the provisional center position. The first calculation unit 211 generates provisional diffraction profiles for a plurality of angles (for example, N angles) in the diffraction ring C, and calculates the peak position r for each of the generated provisional diffraction profiles. p Furthermore, the first calculation unit 211 calculates the camera length from the generated provisional diffraction profile. Here, the camera length will be explained with reference to FIG.

[0027] 5 is a diagram showing the positional relationship between the X-ray measurement system 1 and the object 2 shown in FIG. 1. In FIG. 5, an X-ray irradiated from a point P on the collimator 112 to a measurement point Q on the object 2 is designated as X-ray x1. Also, in FIG. 5, an X-ray diffracted at the measurement point Q at a diffraction angle 2θ0 is designated as X-ray x1. p The X-rays directed toward the object 2 are designated as X-rays x2. The diffraction angle 2θ0 is a value indicating the diffraction angle when there is no residual stress in the object 2 to be measured, and is determined in advance by being stored in the storage unit 220, etc. L is the distance between point P on the collimator 112 and the measurement point Q on the object to be measured 2. The camera length is C L =r p / {tan(π-2θ0)} [Equation 1]. The first calculation unit 211 calculates the peak position rp By substituting the values ​​of the diffraction angle 2θ0, the camera length C L Calculate.

[0028] Returning to FIG. 2, the second calculation unit 212 calculates the camera length C L The surface inclination ξ is calculated from the rate of change of the surface inclination ξ. The surface inclination ξ indicates the state of unevenness and gradient on the surface of the object 2 to be measured. Here, the surface inclination of the object 2 to be measured will be explained with reference to FIG. 6. FIG. 6 shows the surface inclination of the object 2 to be measured shown in FIG. 1 in the X-axis direction with respect to the camera length C LA The graph shows the camera length C LA is the camera length C L For example, the camera length C calculated at each deviation angle of the diffraction ring C is L 6, the horizontal axis is the X axis indicating the position on the surface of the object 2 to be measured. Also, in FIG. 6, the vertical axis is the camera length C LA The surface slope ξ is calculated as ξ=arctan(ΔC LA / Δx) [Equation 2]. The second calculation unit 212 adds ΔC LA By substituting the value of / Δx, the surface slope ξ is calculated.

[0029] Returning to FIG. 2, the second calculation unit 212 calculates, for each measurement point, the angle of incidence ψ of the X-rays incident on the measurement point from the surface inclination ξ at the measurement point. T Calculate the angle of incidence ψ T is the angle between the normal direction of the surface of the object 2 and the normal direction of the grating surface of the object 2, and ψ T =ψ0-ξ [Equation 3], where ψ0 is the angle between the normal direction to the surface of the object to be measured 2 and the normal direction to the grating plane of the object to be measured 2 when there are no irregularities or gradients on the surface of the object to be measured 2, and is determined in advance by being stored in the storage unit 220, for example.

[0030] The third calculation unit 213 calculates the X-ray detection result by the detection unit 14 and the incident angle ψ calculated by the second calculation unit 212 for each measurement point. TThe third calculation unit 213 calculates the measurement value according to the measurement item at the measurement point from the above. The third calculation unit 213 calculates the measurement value using different calculation methods when the operation mode is the detailed measurement mode and when the operation mode is the simplified measurement mode, which is different from the detailed measurement mode. The calculation method of the measurement value by the third calculation unit 213 will be explained later with reference to FIG. 7, so the explanation will be omitted here. The normal stress σ, which is one of the measurement values, x is σ x =-{E / (1+ν)}×(1 / sin2ψ T ) × (1 / sin2η) × (δa1 / δcosα) [Equation 4]. Here, the X-ray Young's modulus is E, the X-ray Poisson's ratio is ν, and the first strain parameter of the measured strain is a1.

[0031] The mode switching unit 214 switches the operation mode to an operation mode different from the currently set operation mode in accordance with a control command input by the operator of the X-ray measurement system 1 or a control program for X-ray measurement stored in the memory unit 220.

[0032] The storage unit 220 stores a control program for the X-ray measurement system 1. The storage unit 220 also stores parameter information 221, measurement items 222, and measurement values ​​223.

[0033] The parameter information 221 indicates various parameters that are predetermined for X-ray measurement of the object to be measured 2. The parameter information 221 includes, for example, information about the position of the measurement point on the surface of the object to be measured 2, coordinates of a tentative center position that is a tentative center position, a diffraction angle 2θ0 that is the diffraction angle in the stress-free case, and a plurality of deviation angles for generating a diffraction profile in the diffraction ring C.

[0034] The measurement item 222 is information indicating an item that the X-ray measurement system 1 measures on the object 2. The measurement item 222 is, for example, a normal stress σ x Includes as an item.

[0035] The measurement value 223 is information indicating the result of the X-ray measurement system 1 performing measurement on the object 2. The measurement value 223 is, for example, a normal stress σ x Includes measurements of.

[0036] <Process flow> The above describes the functional configuration of the X-ray measurement system 1. Next, the operation of the X-ray measurement system 1 will be described with reference to Fig. 7. Fig. 7 is a flowchart showing an example of the processing flow of the X-ray measurement system 1 shown in Fig. 1.

[0037] (Step SP10) The X-ray measurement system 1 controls the position and angle of the main body 10 using the driving unit 210 to measure X-rays on the object to be measured 2. The X-ray measurement system 1 also controls the operation of the irradiation unit 11 and the detection unit 14 using the driving unit 210 to irradiate X-rays to multiple measurement points on the surface of the object to be measured 2 and detect X-rays diffracted by the object to be measured 2. The X-ray measurement system 1 also acquires, using the first calculation unit 211, detection values ​​of X-rays detected by the detection unit 14 for the multiple measurement points. Then, the process proceeds to step SP12.

[0038] (Step SP12) The X-ray measurement system 1 calculates the camera length C L Then, the X-ray measurement system 1 selects one measurement point for which a representative value of has not been calculated. The first calculation unit 211 of the X-ray measurement system 1 generates, for the selected measurement point, a provisional diffraction profile for each of a plurality of deviation angles with respect to the diffraction ring C when the diffraction ring C is centered at a predetermined provisional center position. Then, the process proceeds to step SP14.

[0039] (Step SP14) The X-ray measurement system 1 calculates the peak position r from the generated provisional diffraction profile for each of the plurality of deflection angles by the first calculation unit 211. p Furthermore, the X-ray measurement system 1 calculates the calculated peak position r for each of the multiple deflection angles by the first calculation unit 211. pThe camera length CL is calculated by substituting into Equation 1. Then, the process proceeds to step SP16.

[0040] (Step SP16) The X-ray measurement system 1 calculates the camera length C for each of the plurality of deflection angles by the second calculation unit 212. L From camera length C L The typical value of the camera length C LA Then, the process proceeds to step SP18.

[0041] (Step SP18) The X-ray measurement system 1 determines whether the operation mode is the detailed measurement mode by the third calculation unit 213. If the determination is affirmative, the process proceeds to step SP20. On the other hand, if the determination is negative, the process proceeds to step SP32.

[0042] (Step SP20) The X-ray measurement system 1 calculates the camera length C L If the determination is affirmative, the process proceeds to step SP22. If the determination is negative, the process returns to step SP12.

[0043] (Step SP22) The X-ray measurement system 1 selects one measurement point from the plurality of measurement points for which no measurement value has been calculated by the second calculation unit 212. The X-ray measurement system 1 calculates the camera length C LA From the angle of incidence ψ T Specifically, the X-ray measurement system 1 calculates the camera length C by the second calculation unit 212. LA into Equation 2 to calculate the inclination ξ of the surface of the object to be measured 2. Next, the X-ray measurement system 1, by the second calculation unit 212, substitutes the inclination ξ of the surface of the object to be measured 2 into Equation 3 to calculate the angle of incidence ψ T Then, the process proceeds to step SP24.

[0044] (Step SP24) The X-ray measurement system 1 calculates the camera length C LA and the angle of incidence ψ T In the detailed measurement mode, the central position is a position that indicates the center of the diffraction ring C in a state in which the inclination of the surface of the object to be measured 2 is taken into consideration. The X-ray measurement system 1 calculates the central position from the angle of incidence ψ T and the center position. The X-ray measurement system 1 calculates the incident angle ψ T The center position is calculated by substituting the above. The center position is calculated by the camera length C LA and the angle of incidence ψ T Alternatively, the calculation may be performed by substituting the above into a predetermined calculation formula. Then, the process proceeds to step SP24.

[0045] (Step SP26) The X-ray measurement system 1 generates new diffraction profiles for each of a plurality of deflection angles with respect to the diffraction ring C when the center position is the center, using the third calculation unit 213. Then, the processing proceeds to the processing of step SP28.

[0046] (Step SP28) The X-ray measurement system 1 calculates a measurement value from the generated diffraction profile by the third calculation unit 213. Specifically, the X-ray measurement system 1 calculates a peak position r from the generated diffraction profile for each deviation angle by the third calculation unit 213. p Next, the X-ray measurement system 1 calculates the calculated peak position r p Then, the X-ray measurement system 1 calculates the angle of incidence ψ by the third calculation unit 213. T The measured values ​​are calculated by substituting the angle 2η into a predetermined formula. x is σx=-{E / (1+ν)}×(1 / sin2ψ T)×(1 / sin2η)×(δa1 / δcosα) [Equation 4]. Here, the X-ray Young's modulus is E. The X-ray Poisson's ratio is ν. The first strain parameter of the measured strain is a1. The central angle of the diffraction ring C is α. Then, the process proceeds to step SP30.

[0047] (Step SP30) The X-ray measurement system 1 determines whether or not the representative value of the camera length CL has been calculated for all target measurement points by the third calculation unit 213. If the determination is negative, the process returns to step SP22. On the other hand, if the determination is positive, the series of processes shown in FIG. 4 ends.

[0048] (Step SP32) The X-ray measurement system 1 calculates the camera length C LA The center position is calculated from the camera length C in the simple measurement mode. LA The X-ray measurement system 1 calculates the camera length C in the zero-stress standard piece stored in advance in the storage unit 220 by the third calculation unit 213. LA The X-ray measurement system 1 calculates the correspondence between the camera length C and the center position by the third calculation unit 213. LA The center position is calculated by substituting the above. The center position is calculated by the camera length C LA Alternatively, the calculation may be performed by substituting the above into a predetermined calculation formula. Then, the process proceeds to step SP34.

[0049] (Step SP34) The X-ray measurement system 1 generates new diffraction profiles for each of a plurality of deflection angles with respect to the diffraction ring C when the center position is the center, by the third calculation unit 213. Then, the processing proceeds to the processing of step SP36.

[0050] (Step SP36) The X-ray measurement system 1 calculates provisional measurement values, which are temporary measurement values, from the generated diffraction profile using the third calculation unit 213. The method for calculating the provisional measurement values ​​from the diffraction profile is the same as the method for calculating the measurement values ​​in the processing of step SP28, so its description will be omitted here. Then, the processing proceeds to the processing of step SP38.

[0051] (Step SP38) The X-ray measurement system 1 determines whether or not the provisional measurement values ​​have been calculated for all target measurement locations by the third calculation unit 213. If the determination is affirmative, the process proceeds to step SP40. On the other hand, if the determination is negative, the process returns to step SP12.

[0052] (Step SP40) The X-ray measurement system 1 calculates the camera length C LA From the angle of incidence ψ T Calculate the angle of incidence ψ T The calculation method for is the same as that in step SP22, so a description thereof will be omitted here. Then, the process proceeds to step SP42.

[0053] (Step SP42) The X-ray measurement system 1 calculates the incident angle ψ for each measurement point by the third calculation unit 213. T and the provisional measurement value σ xx The measured value is calculated from the normal stress σ x is σ x =σ xx ×sin2ψ0 / sin2ψ T It is expressed by [Equation 5], where the value σ xx is a provisional measurement value. The X-ray measurement system 1 calculates the provisional measurement value σ xx Substituting into Equation 5, the measured normal stress σ x Then, the series of processes shown in FIG. 4 ends.

[0054] <Effects> As described above, in this embodiment, the X-ray measurement system 1 includes an irradiation unit 11 that irradiates X-rays onto a plurality of measurement points on the surface of the object 2 under measurement, and a detection unit 14 that detects X-rays diffracted by the object 2 under measurement. The X-ray measurement system 1 also includes a first calculation unit 211 that generates a provisional diffraction profile for each measurement point from the detection result by the detection unit 14 and a provisional center position that is predetermined for the measurement point, and calculates a camera length from the provisional diffraction profile. The X-ray measurement system 1 also calculates the surface inclination ξ from the rate of change of the camera length CLA on the surface of the object 2 under measurement, and calculates the incidence angle ψ of the X-rays at the measurement point from the inclination ξ. T The X-ray measurement system 1 also includes a second calculation unit 212 that calculates the detection result and the incident angle ψ T Therefore, the X-ray measurement system 1 can perform measurement using X-rays at low cost while reflecting the state of the surface of the object 2 to be measured.

[0055] In this embodiment, the third calculation unit 213 calculates the camera length C LA and the angle of incidence ψ T The center position of the measurement point is calculated from the center position and the detection result, a diffraction profile is generated from the center position and the detection result, and a measurement value is calculated from the diffraction profile. Therefore, the X-ray measurement system 1 uses the camera length CLA and the incident angle ψ to generate the diffraction profile. T Since the above method is used, it is possible to perform X-ray measurement with high accuracy and low cost while reflecting the surface condition of the object 2 to be measured.

[0056] In this embodiment, the third calculation unit 213 calculates the camera length C LA The center position of the measurement point is calculated from the center position and the detection result, a diffraction profile is generated from the center position and the detection result, a provisional measurement value is calculated from the diffraction profile, and the provisional measurement value is calculated based on the incident angle ψ T Therefore, the X-ray measurement system 1 calculates the measurement value by correcting the provisional measurement value by the incident angle ψ T Since the measurement value is calculated using a simple method of correcting the value by the above, it is possible to perform X-ray measurement in a short time and at low cost while reflecting the surface condition of the object 2 to be measured.

[0057] In this embodiment, when the operation mode is the detailed measurement mode (first mode), the third calculation unit 213 calculates the camera length C LA and the angle of incidence ψ T The third calculation unit 213 calculates the center position of the measurement point from the camera length C LA The central position is calculated from the angle ψ. The provisional measurement value is calculated from the central position. T Therefore, the X-ray measurement system 1 can perform X-ray measurements that reflect the surface condition of the object 2 to be measured, by using a detailed measurement mode that allows highly accurate and low-cost measurements, and a simple measurement mode that allows short-time and low-cost measurements.

[0058] In this embodiment, the measurement value is a stress value of the object 2. Therefore, the X-ray measurement system 1 can measure the stress value of the object 2 at low cost while reflecting the state of the surface of the object 2.

[0059] <Modification> The present invention is not limited to the above-described embodiments. In other words, variations of the above-described embodiments, which are appropriately modified by a person skilled in the art, are also included within the scope of the present invention as long as they include the features of the present invention. Furthermore, the elements of the above-described embodiments and the modifications described below can be combined to the extent technically possible, and such combinations are also included within the scope of the present invention as long as they include the features of the present invention.

[0060] For example, in this embodiment, the X-ray measurement system 1 is configured to measure the incident angle ψ T In the detailed measurement mode, the X-ray measurement system 1 performs the step of generating a new diffraction profile after calculating the incident angle ψ TAlternatively, the step of generating a new diffraction profile after calculating the diffraction profile may be performed multiple times, and the measurement value may be calculated from the diffraction profile after the calculation. With this configuration, the X-ray measurement system 1 can perform X-ray measurement with high accuracy and low cost while reflecting the surface state of the object 2 to be measured.

[0061] In this embodiment, the X-ray measurement system 1 uses normal stress σ as a measurement value in the detailed measurement mode. x However, the present invention is not limited to this. In the detailed measurement mode, the X-ray measurement system 1 may calculate any measurement value as long as it is a measurement item that can be calculated from a diffraction profile. For example, in the detailed measurement mode, the X-ray measurement system 1 may calculate the shear stress τ. The shear stress τ is calculated as follows: τ=-[E / {2(1+ν)}]×{1 / sin2η}×{1 / sinψ T}×∂a2 / ∂sinα [Equation 6]. Here, the second strain parameter of the measured strain is a2. The X-ray measurement system 1 calculates the incident angle ψ T and the angle 2η are substituted into Equation 6 to calculate the shear stress τ. With this configuration, the X-ray measurement system 1 can perform low-cost X-ray measurements for various measurement items that can be calculated from a diffraction profile while reflecting the surface condition of the object 2 to be measured.

[0062] In this embodiment, the X-ray measurement system 1 also detects the incident angle ψ T The central position is calculated from the angle of incidence ψ and the diffraction profile is calculated from the calculated central position, but this is not limited to this. T The angle of the irradiation unit 11 relative to the measurement location may be adjusted depending on the situation, X-rays may be irradiated and detected again at the adjusted angle, and the measurement value may be calculated from the detection results. With this configuration, the X-ray measurement system 1 can perform X-ray measurement with high precision and low cost while reflecting the surface condition of the object 2 to be measured. [Explanation of symbols]

[0063] 1... X-ray measurement system, 2... object to be measured, 11... irradiation unit, 14... detection unit, 211... first calculation unit, 212... second calculation unit, 213... third calculation unit

Claims

1. an irradiation unit that irradiates X-rays onto a plurality of measurement points on the surface of the object to be measured; a detection unit that detects X-rays diffracted by the object to be measured; a first calculation unit that generates a provisional diffraction profile for each of the measurement points from the detection result by the detection unit and a provisional center position that is predetermined for the measurement point, and calculates a camera length from the provisional diffraction profile; a second calculation unit that calculates a tilt of the surface from a rate of change of the camera length on the surface and calculates an incident angle of the X-ray at the measurement point from the tilt; a third calculation unit that calculates a measurement value of the measurement location from the detection result and the incident angle; An X-ray measurement system comprising:

2. 2. The X-ray measurement system according to claim 1, wherein the third calculation unit calculates a center position of the measurement point from the camera length and the incident angle, generates a diffraction profile from the center position and the detection result, and calculates the measurement value from the diffraction profile.

3. 2. The X-ray measurement system according to claim 1, wherein the third calculation unit calculates a center position of the measurement point from the camera length, generates a diffraction profile from the center position and the detection result, calculates a provisional measurement value from the diffraction profile, and calculates the measurement value by correcting the provisional measurement value by the incident angle.

4. 2. The X-ray measurement system according to claim 1, wherein, when the operation mode is a first mode, the third calculation unit calculates a center position of the measurement point from the camera length and the incident angle, and calculates the measurement value from the center position, and when the operation mode is a second mode different from the first mode, the third calculation unit calculates the center position from the camera length, calculates a provisional measurement value from the center position, and calculates the measurement value by correcting the provisional measurement value by the incident angle.

5. 5. The X-ray measurement system according to claim 1, wherein the measurement value is a stress value of the object to be measured.

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