Thermal and / or electromagnetic interference (EMI) management composites including silicone carbinols

Abstract

To provide methods and composites that provide increased flow rates for composites, such as polymer-inorganic composites useful for the management of thermal and / or electromagnetic interference (EMI) and other polymer-inorganic composites used for other purposes.SOLUTION: In exemplary embodiments, silicone carbinol is added to a composite in an amount sufficient for increasing flow rate of the composite. The increased flow rate of the composite enables a useful increase in functional filler content, which, in turn, allows increased benefits related to performance. For example, functional filler loadings / particle concentrations may be increased in a thermal and / or EMI management material for higher thermal and / or electrical conductivity as the silicone carbinol helps to retain a desired dispensing flow rate for the composite despite the higher functional filler loadings / particle concentrations in the composite.SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present disclosure relates to the use of silicone carbinols as components in polymer-inorganic composites useful for thermal and / or electromagnetic interference (EMI) management. [Background technology]

[0002] This section provides background information related to the present disclosure that is not necessarily prior art. Electrical components, such as semiconductors, integrated circuit packages, transistors, and the like, typically have a pre-designed temperature at which they optimally operate. Ideally, the pre-designed temperature is close to the temperature of the surrounding air. However, operation of the electrical components generates heat. If the heat is not removed, the electrical components may operate at temperatures significantly higher than their normal or desired operating temperature. Such excessive temperatures can adversely affect the operating characteristics of the electrical components and the operation of associated devices.

[0003] To avoid or at least mitigate adverse operating characteristics due to heat generation, heat must be removed, for example, by conduction from an operating electrical component to a heat sink. The heat sink can then be cooled by conventional convection and / or radiation techniques. During conduction, heat can be transferred from an operating electrical component to a heat sink by direct surface contact between the electrical component and the heat sink and / or by contact between the electrical component and the heat sink surface through an intermediate medium or thermal interface material (TIM). Thermal interface materials can be used to fill gaps between heat transfer surfaces to increase heat transfer efficiency compared to filling the gap with air, which has a relatively low thermal conductivity.

[0004] Additionally, a common problem in the operation of electronic devices is the generation of electromagnetic radiation within the equipment's electronic circuits. Such radiation can cause electromagnetic interference (EMI) or radio frequency interference (RFI), which can disrupt the operation of other electronic devices within a certain proximity. Without proper shielding, EMI / RFI interference can cause degradation or complete loss of important signals, thereby rendering electronic equipment inefficient or inoperable.

[0005] A common solution to ameliorating the effects of EMI / RFI is to use shields that absorb and / or reflect and / or redirect EMI energy. These shields are typically used to localize EMI / RFI within its source and to isolate other devices near the EMI / RFI source. These shields can be constructed from metals, polymer-inorganic composites, filled foams, foam materials wrapped or coated with absorbing and / or reflective materials, etc.

[0006] The term "EMI," as used herein, should generally be considered to include and refer to EMI and RFI emissions, and the term "electromagnetic" should generally be considered to include and refer to electromagnetic and radio frequencies from external and internal sources. Accordingly, the term shielding (as used herein) broadly includes and refers to reducing (or limiting) EMI and / or RFI so that it does not interfere, such as by attenuating, absorbing, reflecting, blocking, and / or redirecting energy, or some combination thereof, for example, for government compliance and / or the internal functioning of an electronic system.

[0007] When not comprised of metals, the mitigation / management materials often consist of inorganic-polymer or metal-polymer composites. The concentration of inorganic material, usually particles, in the polymer matrix is ​​often high for the purpose of achieving the desired management of thermal and / or EMI problems.

[0008] In some cases, the composite is a dispensable material such as a thermal gel, putty, or grease. Conventional thermal gels / putties are limited to use in large gaps (constant gaps) due to the large particle size used in the formulation to achieve high thermal conductivity. Conversely, conventional thermal greases are limited to use in small gaps under continuous pressure due to their tendency to slide out of the gap in a vertical position.

[0009] Additionally, composites may be used in applications where they are compressed between two parts of a device requiring management of thermal and / or EMI issues. This compression may occur during device assembly or during compression and expansion cycles during device use. As a result, the composite must be "soft" so that it can easily deflect and absorb compressive forces without transmitting them to the protected device and risking physical damage. As known to those skilled in the art, in some situations, the methods used to prepare such soft composites result in materials into which various organic species may migrate over time, especially after repeated compression and expansion cycles. These organic species may consist of polymers, monomers, additives used to form the composite or to enhance its performance during use, composites of organic and inorganic materials, etc. The term "oil bleed" is commonly used within the industry to describe this phenomenon and is used herein with the understanding that "oil" primarily refers to a range of organic species and "bleed" refers to the migration of material from within the composite to one or more locations outside the composite. DETAILED DESCRIPTION OF THE INVENTION

[0010] Example embodiments will now be described more fully with reference to the accompanying drawings. Disclosed herein is an innovative method for using silicone carbinols as components in composites that provides unexpected increases in flow rates of composites, such as polymer-inorganic composites useful for thermal and / or electromagnetic interference (EMI) management, as well as polymer-inorganic composites used for other purposes. The inventors have discovered unexpected and previously unknown advantages of including silicone carbinols in such composites as a replacement for traditional PDMS fluids and as a replacement for commonly used dispersants.

[0011] As experimentally demonstrated in liquid gap filler compositions (see, for example, Table 1 below), the use of silicone carbinol fluids provides an unexpected increase in flow rate, allowing for useful increases in functional filler content, which in turn allows for increased performance-related benefits: particle concentration can be increased while maintaining a desired dispense flow rate.

[0012] For example, the functional filler loading / particle concentration in the composite can be increased to achieve higher thermal and / or electrical conductivity because the silicone carbinol helps maintain a desired composite distribution flow rate even at high functional filler loading / particle concentrations in the composite. By increasing the composite flow rate, the silicone carbinol allows, accommodates, and / or compensates for higher functional filler loading / particle concentrations that would otherwise decrease the composite flow rate.

[0013] Polymer-inorganic composites offer a valuable option for controlling the effects of heat and electromagnetic radiation in electronic systems. Many composites require high concentrations of inorganic fillers in a polymer or other organic matrix to achieve desired properties. Key challenges in such systems include ensuring proper flow within the composite and of the bulk composite, ensuring effective deflection of solid materials under applied forces, and ensuring effective flow rates of liquid composites.

[0014] The present inventors have discovered that hydrocarbyl-functional organopolysiloxanes (broadly, silicone carbinols) include those in which the hydrocarbyl group has the formula: -R2-O-R1-CH2OH; R2 may have an aliphatic structure having 1 to 6 carbon atoms or an aromatic structure; R1 can be a linear or branched aliphatic chain containing 1 to 12 carbon atoms, a branched structure that may have a carbinol group, or R1 can be an aromatic structure that has a carbinol group. The carbinol group does not have to be present initially, as long as a precursor (e.g., an epoxide group) that can provide the carbinol group is present. This results in a thermal and / or EMI control composition with unique properties. In particular, the use of materials with hydrocarbyl-functional organopolysiloxanes allows for the achievement of unexpectedly high flow properties, even at high particle concentrations.

[0015] Table 1 below contains experimental results for TIM liquid gap filler formulations containing PDMS fluid, aluminum, zinc oxide, and silicone carbinol, showing an unexpected increase in flow rate with the addition of silicone carbinol. These experimental results demonstrated a positive impact on flow rate by adding silicone carbinol to the formulation. More specifically, Table 1 contains compelling data for these demonstration systems, which were primarily PDMS fluid + filler + filler dispersion (+ optional colorants and antioxidants). In these examples, "PDMS" is an abbreviation for PDMS fluid + filler + filler dispersion (+ optional colorants and antioxidants). As illustrated by Example 1, the formulation containing silicone carbinol revealed a surprising advantage of a higher (desirable) flow rate of 166.9 g / min compared to a flow rate of 74.9 g / min for the control formulation containing silanol but no silicone carbinol. The formulation of Example 2 revealed a surprising benefit in flow as a function of loading, as higher flow rates were achieved with the formulation containing a higher proportion of carbinol siloxane (broadly, silicone carbinol). Example 3 revealed comparable flow rates of 101 g / min and 102 g / min were achieved for both formulations containing silicone monocarbinol or silicone bicarbinol, respectively. Silicone dicarbinol (a carbinol group at each end) is expected to provide similar benefits. Dispersants typically only provide a beneficial viscosity reduction to a certain extent, assuming it is based on the amount of dispersant that can be bound to the particle surface. Adding additional dispersant does not significantly reduce viscosity and often causes a slight increase in the viscosity of the dispersion. The inventors have unexpectedly found that continued addition of carbinol siloxane results in a beneficial reduction in flow rate.

[0016] [Table 1]

[0017] While the experimental results shown in Table 1 above were obtained for a TIM liquid gap filler formulation, the same benefits of increased flow rate are expected when silicone carbinol is added to liquid gap fillers containing not only thermally conductive materials but also absorbents, and to liquid gap fillers containing a mixture of absorbents and thermally conductive particles. Additionally, the present invention has broad utility, as materials of the silicone carbinol class are likely to interact with the surface of fillers in a system in a manner strong enough to have a beneficial effect. Consequently, the present invention should have broad applicability to a wide range of formulated products used to control the thermal and / or electromagnetic properties of materials, where increased flow rate is desirable and allows for useful increases in functional filler content, which in turn allows for increased performance benefits.

[0018] This unexpected and previously unknown benefit of including silicone carbinol is not limited to dispensable liquid gap filler compositions but is also applicable to other compositions, such as gap filler pad compositions. When PDMS fluid is part of a gap filler pad composition, for example, the carbinol fluid acts more effectively to soften the composition. The carbinol fluid also acts as an effective particle dispersant in such systems, even in the absence of PDMS fluid. The carbinol fluid also acts to reduce material migration (e.g., oil bleed) in such systems, even in the absence of PDMS fluid, because the carbinol fluid interacts with the filler and reduces the migration of multiple species. Replacing 10% of the PDMS fluid used in a Tflex 900 gap filler pad containing PDMS fluid with silicone carbinol reduced the average Shore 00 hardness from 77 to 66. Therefore, the present invention should also have broad applicability to a wide range of formulated products used to control the thermal and electromagnetic properties of materials where migration of organic species within the composite to locations outside the composite is undesirable.

[0019] In exemplary embodiments, the silicone carbinol is added in an amount sufficient so that the resulting heat and / or EMI management material has the following advantageous properties: increased flow rate and reduced or undetectable material migration (e.g., oil bleed, etc.) compared to a heat and / or EMI management material having the same formulation but without the silicone carbinol. In addition to increased flow rate and reduced material migration, the composite may also be configured to have or include one or more (but not necessarily any or all) of the following features in the exemplary embodiments disclosed herein:

[0020] Distributable across all or multiple TIM applications on a board / system; Maintains reliability as a gap filler in consistent gaps up to 2 millimeters (mm); · Deflection down to minimum bondlines of less than 50 micrometers, for example for high power components in constant pressure applications; ·Can be used for minimum bondline constant pressure applications (as a grease) and as a thick gap filler for fixed gaps up to 2mm (as a dispensable gap filler / gel / putty), all-in-one dispensable; · Simplifying operations by integrating thermal and / or EMI management materials and increasing throughput by allowing dispensing of only one material instead of dispensing multiple materials or placing pads; A single composite that can be used for both constant gap and constant pressure applications with very low thermal resistance; Good pump-out resistance and vertical stability in one product; The use of silicone carbinols improves reliability or durability under high temperature and / or humidity conditions; and · The use of silicone carbinols can extend shelf life and allow materials to maintain good flow / processability for extended periods of time.

[0021] While high flow rate is one goal that can be achieved by adding silicone carbinol, high performance is also important. For example, a pad material including a silicone-based matrix can achieve a relatively high thermal conductivity. In comparison, the same pad material with silicone carbinol added to the matrix can achieve a higher thermal conductivity due to a higher thermally conductive filler loading while maintaining a similar flow rate and / or similar hardness / flexibility of the pad material.

[0022] As mentioned above, silicone carbinols interact with fillers and reduce the migration of multiple species, so they act to reduce material migration (e.g., oil bleed, etc.). This is important in that oil bleed is a concern not only because of potential contamination of optical components in electronic applications (e.g., optical transceivers, camera lenses, etc.), but also for aesthetic reasons. Therefore, it is desirable to reduce and / or prevent material migration, such as silicone oil bleed, from polymer-inorganic composites used to manage / mitigate thermal and / or EMI problems in devices.

[0023] However, it is difficult to balance the preparation of highly filled polymer composites for use as heat and / or EMI management materials that have the ability to meet desired heat and / or EMI management / mitigation requirements and other requirements while also being easily flexible under the application of low levels of force. Oil-bleeding in these materials can occur for several reasons. For example, conventional heat and / or EMI management materials are generally based on the use of silicone polymers. Silicone polymers typically contain polymers with a broad molecular weight (MW) distribution. It is generally believed that some of the polymers with low molecular weights can migrate within the matrix, to the extent that the migrated polymer material is visibly evident beyond the bounds of the composite, thereby resulting in undesirable aesthetics. In addition to silicone polymers, other additives in the composite, such as dispersants, stabilizers (e.g., UV stabilizers, thermal stabilizers, etc.), can also migrate. Composites using polymers not based on silicone materials also contain migratory species and face similar challenges, as discussed above for typical silicone-based systems.

[0024] Thus, the use of silicone carbinols can also help solve the problem of how to prepare highly filled polymer composites that have the ability to easily deflect under the application of low levels of force, without undesirable migration or bleeding of material from the composite into surrounding areas. In addition to increasing the flow rate of the composite, silicone carbinols can therefore also provide a way to reduce the migration of more mobile materials in the composite.

[0025] Compared to heat and / or electromagnetic interference (EMI) management materials with a silicone carbinol additive, heat and / or electromagnetic interference (EMI) management materials with the same formulation without the silicone carbinol additive have a lower (less desirable) flow rate and a tendency to bleed significantly more. These can lead to aesthetic and performance issues in electronic applications. While conventional methods exist for reducing bleed from heat and / or electromagnetic interference (EMI) management materials (e.g., TIMs, etc.), such conventional methods are often found to significantly increase hardness. As a result, harder materials cannot easily deflect under the application of low levels of force. Therefore, exemplary embodiments are disclosed herein in which a silicone carbinol additive is added to a formulation for a heat and / or electromagnetic interference (EMI) management material to increase flow rate and reduce bleed without adversely changing other desired properties of the heat and / or electromagnetic interference (EMI) management material (e.g., flexibility, thermal conductivity, electrical conductivity, etc.).

[0026] In exemplary embodiments, the composite includes a functional filler (e.g., at least about 25% by weight, at least about 80% by weight, at least about 90% by weight, etc.) in a matrix or base material (e.g., a silicone-based polymer resin, a non-silicone-based polymer resin, etc.) to increase thermal conductivity and / or for EMI absorption. Functional fillers can include thermally conductive fillers, electrically conductive fillers, electromagnetic wave absorbing fillers, dielectric absorbing fillers, and fillers having two or more of the following properties: thermal conductivity, electrical conductivity, dielectric absorption, and electromagnetic wave absorption. Examples of functional fillers include stainless steel, diamond, carbon black, boron nitride, nickel cobalt, carbonyl iron, iron silicide, iron particles, iron-chromium compounds, silver, an alloy containing 85% iron, 9.5% silicon and 5.5% aluminum, an alloy containing about 20% iron and 80% nickel, ferrite, magnetic alloys, magnetic powders, magnetic flakes, magnetic particles, nickel-based alloys and powders, chromium alloys, oxides, copper, zinc oxide, alumina, graphite, ceramics, silicon carbide, manganese zinc, glass fibers, thermally conductive materials including carbon nanotubes (e.g., single-walled carbon nanotubes, multi-walled carbon nanotubes, etc.), metal composites (e.g., gallium and gallium alloys, etc.) having a melting point near or below room temperature, combinations thereof, and the like.

[0027] As an example, a composite may include less than about 10 weight percent of a matrix or base material containing silicone carbinol in a concentration ranging from 1 weight percent or less, or in embodiments where the majority of the matrix may be composed of silicone carbinol, and at least about 90 weight percent of a functional filler. In other exemplary embodiments, the composite may include various weight percents of silicone carbinol, such as about 10 weight percent or less, about 5-10 weight percent, about 0.1-2 weight percent, etc. The composite may also include various weight percents of the matrix or base material (e.g., about 7 weight percent, about 8 weight percent, more than 10 weight percent, etc.) and / or various weight percents of the functional filler (e.g., about 25 weight percent or more, at least about 80 weight percent but less than 90 weight percent, more than 90 weight percent, etc.).

[0028] In an exemplary embodiment, the silicone carbinol-containing composite may be in the form of a thermally conductive pad having a rectangular shape. Alternatively, the thermally conductive pad may have different shapes, such as different polygons (e.g., pentagons, triangles, etc.). In alternative embodiments, the silicone carbinol-containing composite may include a dispensable material, thermal grease, bulk putty, phase change TIM, etc.

[0029] Disclosed herein are exemplary methods for increasing composite flow rate and / or reducing material migration (e.g., silicone oil bleed, etc.) from composites, such as thermal and / or electromagnetic interference (EMI) management materials (e.g., thermal interface materials (TIMs), EMI absorbers, thermally conductive EMI absorbers, electrically conductive elastomers (ECEs), electrically conductive composites, combinations thereof, etc.) and polymer-inorganic composites used for other purposes.

[0030] In an exemplary embodiment, the method includes adding a silicone carbinol to a composite in an amount sufficient to increase the flow rate of the composite and / or reduce material migration from the composite. The composite may include a composite useful for thermal and / or electromagnetic interference (EMI) management. In an exemplary embodiment, the method may include using a carbinol PDMS fluid at higher levels as a significant part of the matrix, rather than as a filler dispersant.

[0031] In an exemplary embodiment, the method includes adding silicone carbinol to the composite so that the composite contains a concentration of silicone carbinol of 1 weight percent or less, or within a range of concentrations of silicone carbinol where the majority of the matrix is ​​comprised of silicone carbinol. The silicone carbinol may be part of the mixture as another agent in the mixture, which together can contribute to viscosity, flow rate, and thermal properties.

[0032] In an exemplary embodiment, the method includes adding a silicone carbinol to the composite to increase the flow rate of the composite, thereby enabling a useful increase in filler content in the composite for improved performance.

[0033] In an exemplary embodiment, the method includes adding a silicone carbinol to a composite in an amount sufficient to increase the flow rate of the composite and reduce material migration from the composite, wherein the composite is useful for thermal and / or electromagnetic interference (EMI) management.

[0034] In an exemplary embodiment, the silicone carbinol comprises a hydrocarbyl-functional organopolysiloxane, which may include a hydrocarbyl group having the formula ROCHCHOH, where R is a divalent hydrocarbon group containing from 2 to 6 carbon atoms.

[0035] In an exemplary embodiment, the composite is a polydimethylsiloxane (PDMS) based polymer-inorganic composite. In an exemplary embodiment, adding a silicone carbinol to the composite includes adding a carbinol siloxane to the composite. In an exemplary embodiment, adding the silicone carbinol to the composite comprises adding a sufficient amount of silicone carbinol fluid to the composite to act as an effective particle dispersant in the composite.

[0036] In an exemplary embodiment, the composite comprises silicone carbinol, aluminum, and zinc oxide in a matrix comprising polydimethylsiloxane (PDMS). In exemplary embodiments, the silicone carbinol comprises a carbinol polysiloxane in a matrix comprising polydimethylsiloxane (PDMS) such that the ratio of PDMS to carbinol polysiloxane is about 3:3.1, about 2.5:3.6, or about 1:1 or less.

[0037] In an exemplary embodiment, the silicone carbinol comprises a silicone monocarbinol and / or bicarbinol and / or dicarbinol in a matrix comprising polydimethylsiloxane (PDMS) such that the ratio of PDMS to silicone monocarbinol and / or bicarbinol and / or dicarbinol is about 3:3.1 or less. By way of example only, exemplary embodiments may include a silicone monocarbinol containing hydroxy material having a molecular weight (Mn) of 1,000 and a viscosity of 10-25 millipascal seconds (mPa·s), or a molecular weight (Mn) of 5,000 and a viscosity of 60-80 mPa·s, or a molecular weight (Mn) of 10,000 and a viscosity of 140-180 mPa·s, etc. By way of further example only, exemplary embodiments may include silicone dicarbinol containing hydroxy(diol) materials having a molecular weight (Mn) of 1,000 and a viscosity of 50-70 millipascal seconds (mPA·s), or a molecular weight (Mn) of 5,000 and a viscosity of 80-160 mPA·s, or a molecular weight (Mn) of 15,000 and a viscosity of 300-700 mPA·s, etc.

[0038] In an exemplary embodiment, the silicone carbinol is present in an amount sufficient to reduce silicone oil bleed from the composite, thereby rendering the composite substantially or completely usable without migration of the silicone beyond the confines of the composite.

[0039] In an exemplary embodiment, the composite is a polymer-inorganic composite that is substantially free of siloxane polymers. In an exemplary embodiment, the method further includes adding one or more of a thermally conductive filler, an electrically conductive filler, an electromagnetic wave absorbing filler, a dielectric absorbing filler, and a filler having two or more of the following properties: thermal conductivity, electrical conductivity, dielectric absorption, and electromagnetic wave absorption to the composite.

[0040] In an exemplary embodiment, the composite has a mass flow rate of at least about 100 grams per minute (g / min) or greater. In an exemplary embodiment, the composite is a thermal and / or electromagnetic interference (EMI) management material that can be used to manage the thermal and / or electromagnetic properties of a device or system.

[0041] In exemplary embodiments, the composite is a thermal interface material, an EMI absorber, a thermally conductive absorber, a conductive elastomer, a conductive composite, or a combination of two or more thereof. In an exemplary embodiment, the method includes using a composite to manage thermal and / or electromagnetic properties of a device or system.

[0042] In an exemplary embodiment, the composite is capable of deflecting to a minimum bondline of less than about 50 micrometers. In an exemplary embodiment, the composite is a liquid gap filler composite that includes a silicone carbinol fluid.

[0043] In an exemplary embodiment, the method includes dispensing a composite onto a surface of a device to manage thermal and / or electromagnetic properties of the device or a system including the device. In an exemplary embodiment, the composite is in the form of a gap filler pad. The gap filler pad may be configured to be usable within gaps up to about 2 millimeters. The composite may also include a polydimethylsiloxane (PDMS) fluid. In such an exemplary method, adding silicone carbinol to the composite may include adding the silicone carbinol fluid to the PDMS fluid in an amount sufficient to enable the silicone carbinol fluid to act as an effective particle dispersant in the composite.

[0044] In exemplary embodiments, the composite includes a silicone carbinol in an amount sufficient to increase the flow rate of the composite and / or reduce material migration from the composite. The composite may include a composite useful for thermal and / or electromagnetic interference (EMI) management. The composite may include a composite useful for thermal and / or electromagnetic interference (EMI) management.

[0045] In an exemplary embodiment, the composite contains a higher level of carbinol PDMS fluid that is not used as a filler dispersion agent, but is a significant part of the matrix. In exemplary embodiments, the composite contains a concentration of silicone carbinol of 1 weight percent or less, or within a range of concentrations of silicone carbinol where the majority of the matrix is ​​made up of silicone carbinol. Silicone carbinol may be part of the mixture as another agent in the mixture, which together can contribute to viscosity, flow rate, and thermal properties.

[0046] In an exemplary embodiment, the composite includes a sufficient amount of silicone carbinol to increase the flow rate of the composite, thereby allowing for a useful increase in filler content in the composite for improved performance.

[0047] In an exemplary embodiment, the composite includes a silicone carbinol in an amount sufficient to increase the flow rate of the composite and reduce material migration from the composite, making the composite useful for thermal and / or electromagnetic interference (EMI) management.

[0048] In an exemplary embodiment, the silicone carbinol comprises a hydrocarbyl-functional organopolysiloxane, which may include a hydrocarbyl group having the formula ROCHCHOH, where R is a divalent hydrocarbon group containing from 2 to 6 carbon atoms.

[0049] In an exemplary embodiment, the composite is a polydimethylsiloxane (PDMS) based polymer-inorganic composite. In an exemplary embodiment, the silicone carbinol comprises a carbinol siloxane.

[0050] In an exemplary embodiment, the silicone carbinol comprises a sufficient amount of silicone carbinol fluid to act as an effective particle dispersant in the composite. In an exemplary embodiment, the composite comprises silicone carbinol, aluminum, and zinc oxide in a matrix comprising polydimethylsiloxane (PDMS).

[0051] In exemplary embodiments, the silicone carbinol comprises a carbinol polysiloxane in a matrix comprising polydimethylsiloxane (PDMS), such that the ratio of PDMS to carbinol polysiloxane is about 3:3.1, about 2.5:3.6, or about 1:1 or less.

[0052] In an exemplary embodiment, the silicone carbinol comprises a silicone monocarbinol and / or bicarbinol and / or dicarbinol in a matrix comprising polydimethylsiloxane (PDMS) such that the ratio of PDMS to silicone monocarbinol and / or bicarbinol and / or dicarbinol is about 3:3.1 or less. By way of example only, exemplary embodiments may include a silicone monocarbinol containing hydroxy material having a molecular weight (Mn) of 1,000 and a viscosity of 10-25 millipascal seconds (mPa·s), or a molecular weight (Mn) of 5,000 and a viscosity of 60-80 mPa·s, or a molecular weight (Mn) of 10,000 and a viscosity of 140-180 mPa·s, etc. By way of further example only, exemplary embodiments may include silicone dicarbinol containing hydroxy(diol) materials having a molecular weight (Mn) of 1,000 and a viscosity of 50-70 millipascal seconds (mPA·s), or a molecular weight (Mn) of 5,000 and a viscosity of 80-160 mPA·s, or a molecular weight (Mn) of 15,000 and a viscosity of 300-700 mPA·s, etc.

[0053] In an exemplary embodiment, the silicone carbinol is present in an amount sufficient to reduce silicone oil bleed from the composite, thereby rendering the composite substantially or completely usable without migration of the silicone beyond the confines of the composite.

[0054] In an exemplary embodiment, the composite is a polymer-inorganic composite that is substantially free of siloxane polymers. In an exemplary embodiment, the composite further comprises adding to the composite one or more of a thermally conductive filler, an electrically conductive filler, an electromagnetic wave absorbing filler, a dielectric absorbing filler, and a filler having two or more of the following properties: thermal conductivity, electrical conductivity, dielectric absorption, and electromagnetic wave absorption.

[0055] In an exemplary embodiment, the composite has a mass flow rate of at least about 100 grams per minute (g / min) or greater. In an exemplary embodiment, the composite is a thermal and / or electromagnetic interference (EMI) management material that can be used to manage the thermal and / or electromagnetic properties of a device or system.

[0056] In exemplary embodiments, the composite is a thermal interface material, an EMI absorber, a thermally conductive absorber, a conductive elastomer, a conductive composite, or a combination of two or more thereof. In an exemplary embodiment, the composite is configured such that it can be used to manage the thermal and / or electromagnetic properties of a device or system.

[0057] In an exemplary embodiment, the composite is capable of deflecting to a minimum bondline of less than about 50 micrometers. In an exemplary embodiment, the composite is a liquid gap filler composite that includes a silicone carbinol fluid.

[0058] In an exemplary embodiment, the composite can be dispensed onto a surface of a device to manage the thermal and / or electromagnetic properties of the device or a system including the device. In an exemplary embodiment, the composite is in the form of a gap filler pad. The gap filler pad can be configured to be usable within gaps up to about 2 millimeters. The composite can also include a polydimethylsiloxane (PDMS) fluid. The composite can include a sufficient amount of silicone carbinol fluid to allow the silicone carbinol fluid to act as an effective particle dispersant in the composite.

[0059] In an exemplary embodiment, a device or system includes a composite material disclosed herein that is used to manage the thermal and / or electromagnetic properties of the device or system. In exemplary embodiments, one or more of thermally conductive fillers, electrically conductive fillers, electromagnetic wave absorbing fillers, dielectric absorbing fillers, and fillers having two or more of the following properties are added to the composite. For example, the method may include adding one or more of stainless steel, diamond, carbon black, boron nitride, nickel cobalt, carbonyl iron, iron silicide, iron particles, iron-chromium compounds, silver, an alloy containing 85% iron, 9.5% silicon, and 5.5% aluminum, an alloy containing about 20% iron and 80% nickel, ferrite, magnetic alloys, magnetic powders, magnetic flakes, magnetic particles, nickel-based alloys and powders, chromium alloys, oxides, copper, zinc oxide, alumina, graphite, ceramics, silicon carbide, manganese zinc, glass fibers, thermally conductive materials including carbon nanotubes (e.g., single-walled carbon nanotubes, multi-walled carbon nanotubes, etc.), metal composites (e.g., gallium and gallium alloys, etc.) having a melting point near or below room temperature, combinations thereof, and the like to the composite.

[0060] In an exemplary embodiment, an electronic device includes a heat source and a composite material disclosed herein. The composite material is positioned relative to the heat source to establish at least a portion of a thermally conductive heat path from the heat source through the composite material. The composite material includes a silicone carbinol in an amount sufficient to increase the flow rate of the composite material. The silicone carbinol may also reduce material migration (e.g., silicone oil bleed, etc.) from the composite material onto the heat source. The composite material may be configured to be EMI absorbent and / or conductive, such that the composite material is also operable to mitigate and / or manage EMI within the electronic device.

[0061] In an exemplary embodiment, an electronic device includes a heat source, a heat removal / dissipation structure, and a composite material disclosed herein. The composite material is positioned relative to the heat source and the heat removal / dissipation structure to establish at least a portion of a thermally conductive thermal path between the heat source and the heat removal / dissipation structure. The composite material includes a silicone carbinol in an amount sufficient to increase the flow rate of the composite material. The silicone carbinol may also reduce material migration (e.g., silicone oil bleed) from the composite material onto the heat source and the heat removal / dissipation structure. The composite material may be configured to be EMI absorbent and / or conductive, such that the composite material is also operable to mitigate and / or manage EMI within the electronic device.

[0062] In an exemplary embodiment, an electronic device includes a heat source, a board-level shield, and a composite material disclosed herein. The composite material is positioned relative to the heat source and the board-level shield to establish at least a portion of a thermally conductive thermal path between the heat source and the board-level shield. The composite material includes a silicone carbinol in an amount sufficient to increase the flow rate of the composite material. The silicone carbinol may also reduce material migration (e.g., silicone oil bleed, etc.) from the composite material onto the heat source and the board-level shield. The composite material may be configured to be EMI absorbent and / or conductive, such that the composite material is also operable to mitigate and / or manage EMI within the electronic device.

[0063] In an exemplary embodiment, an electronic device includes a heat source, a board-level shield, a heat removal / dissipation structure, and first and second composites as disclosed herein. The first composite is positioned relative to the heat source and the board-level shield to establish at least a portion of a first thermally conductive thermal path between the heat source and the board-level shield. The first composite includes a silicone carbinol in an amount sufficient to increase the flow rate of the first composite. The silicone carbinol may also reduce material migration (e.g., silicone oil bleed, etc.) from the first composite to the heat source and the board-level shield. The second composite is positioned relative to the board-level shield and the heat removal / dissipation structure to establish at least a portion of a second thermally conductive thermal path between the board-level shield and the heat removal / dissipation structure. The second composite includes a silicone carbinol in an amount sufficient to increase the flow rate of the second composite. The silicone carbinol may also reduce material migration (e.g., silicone oil bleed, etc.) from the second composite onto the board-level shield and the heat removal / dissipation structure. The first and / or second composites may be configured to be EMI absorptive and / or conductive, such that the first and / or second composites are also operable to mitigate and / or manage EMI within the electronic device.

[0064] In an exemplary embodiment, an electronic device includes an integrated circuit, a board-level shield, a heat sink, and first and second composites as disclosed herein. The first composite is positioned relative to the integrated circuit and the board-level shield to establish at least a portion of a first thermally conductive thermal path between the integrated circuit and the board-level shield. The first composite includes a silicone carbinol in an amount sufficient to increase the flow rate of the first composite. The silicone carbinol may also reduce material migration (e.g., silicone oil bleed) from the first composite to the integrated circuit and the board-level shield. The second composite is positioned relative to the board-level shield and the heat sink to establish at least a portion of a second thermally conductive thermal path between the board-level shield and the heat sink. The second composite includes a silicone carbinol in an amount sufficient to increase the flow rate of the second composite. The silicone carbinol may also reduce material migration (e.g., silicone oil bleed, etc.) from the second composite and reduce material migration (e.g., silicone oil bleed, etc.) from the second composite onto the board-level shield and heat sink. The first and / or second composites may be configured to be EMI absorptive and / or conductive, such that the first and / or second composites are also operable to mitigate and / or manage EMI within the electronic device.

[0065] In addition to silicone carbinol, one or more other suitable fillers and / or additives may also be added to the bulk material for polymer-inorganic composites used for heat and / or EMI management or other purposes. For example, one or more of functional nanoparticles, conductive fillers, thermally conductive fillers, EMI or microwave absorbing fillers, magnetic fillers, coating fillers, catalysts for controlling cure, coupling agents for increasing filler loading, pigments or dyes for adding color, plasticizers, processing aids, flame retardants, extenders, tackifiers, antioxidants, ultraviolet (UV) stabilizers, thermal stabilizers, combinations thereof, etc. may also be added. The filler may be added to and mixed with a bulk material including a matrix or base material, thereby providing a mixture of the filler, silicone carbinol additive, and matrix or base material. Exemplary fillers include stainless steel, diamond, carbon black, boron nitride, nickel cobalt, carbonyl iron, iron silicide, iron particles, iron-chromium compounds, silver, an alloy containing 85% iron, 9.5% silicon, and 5.5% aluminum, an alloy containing about 20% iron and 80% nickel, ferrites, magnetic alloys, magnetic powders, magnetic flakes, magnetic particles, nickel-based alloys and powders, chromium alloys, oxides, copper, zinc oxide, alumina, graphite, ceramics, silicon carbide, manganese zinc, glass fibers, thermally conductive materials including carbon nanotubes (e.g., single-walled carbon nanotubes, multi-walled carbon nanotubes, and / or nanostructures), metal composites (e.g., gallium and gallium alloys) having a melting point near or below room temperature, combinations thereof, and the like. The fillers may include one or more of granules, spheroids, microspheres, ellipsoids, irregular spheroids, strands, flakes, powders, nanotubes, and / or combinations of any or all of these shapes. Additionally, exemplary embodiments may also include different grades (e.g., different sizes, different purities, different shapes, etc.) of the same (or different) fillers.

[0066] In exemplary embodiments, the composite complies with ROHS Directive 2011 / 65 / EU and (EU) 2015 / 863 and / or is REACH compliant as containing less than 0.1 wt.% of substances on the REACH / SVHC candidate list (June 25, 2020). In exemplary embodiments, the composite contains less than 0.01 wt.% cadmium at or below its regulatory threshold, 0.1 wt.% lead at or below its regulatory threshold, 0.1 wt.% mercury at or below its regulatory threshold, 0.1 wt.% hexavalent chromium at or below its regulatory threshold, 0.1 wt.% flame retardants PBB and PBDE (pentabromodiphenyl ether (CAS-No. 32534-81-9), octabromodiphenyl ether (CAS-No. 32536-52-0), and decabromodiphenyl ether (CAS-No. 11-11-1) at or below its regulatory threshold, and 0.1 wt.% hexabromodiphenyl ether (CAS-No. 11-11-1) at or below its regulatory threshold. 63-19-5), bis(2-ethylhexyl) phthalate (DEHP) (CAS-No. 117-81-7) at or below the regulatory threshold of 0.1% by weight, butyl benzyl phthalate (BBP) (CAS-No. 85-68-7) at or below the regulatory threshold of 0.1% by weight, dibutyl phthalate (DBP) (CAS-No. 84-74-2) at or below the regulatory threshold of 0.1% by weight, and diisobutyl phthalate (DIBP) (CAS-No. 84-69-5) at or below the regulatory threshold of 0.1% by weight.

[0067] Exemplary embodiments of the thermal and / or EMI management materials disclosed herein may be used in a wide range of industries (e.g., automotive, consumer goods, industrial, datacom / telecom, aerospace / defense, etc.) and a wide range of applications (e.g., automotive electronics, automotive advanced driver assistance systems (ADAS), automotive powertrain / electronic control units (ECUs), automotive infotainment, industrial power, routers, wireless infrastructure, drones / satellites, gaming systems, smart home devices, notebooks / tablets / portable devices, etc.).

[0068] In exemplary embodiments, the silicone carbinol-containing composite is a thermal interface material (TIM), such as a thermally conductive pad, a thermally conductive gap filler, a dispensable material, a thermal grease, a bulk putty, a phase change TIM, etc. In exemplary embodiments, the silicone carbinol-containing composite is a thermal and / or EMI management material having a relatively high thermal conductivity (e.g., 1 W / mK (watt per meter per Kelvin), 1.1 W / mK, 1.2 W / mK, 2.8 W / mK, 3 W / mK, 3.1 W / mK, 3.8 W / mK, 4 W / mK, 4.7 W / mK, 5 W / mK, 5.4 W / mK, 6 W / mK, 8 W / mK, greater than 8 W / mK, etc.), which depends on the particular materials used to make the thermal and / or EMI management material and the loading of the thermally conductive filler, if present. These thermal conductivities are merely examples, and other embodiments may include thermal and / or EMI management materials having thermal conductivities greater than 8 W / mK, less than 1 W / mK (e.g., at least about 0.3 W / mK), or values ​​within the range of 1 W / mK to 8 W / mK.

[0069] In exemplary embodiments, a thermal and / or EMI management material (e.g., a thermal interface material, a thermally conductive EMI absorber, etc.) including silicone carbinol can be used to define or provide a portion of a thermally conductive thermal path from a heat source to a heat removal / dissipation structure or component. The thermal and / or EMI management material can be used, for example, to help conduct thermal energy (e.g., heat, etc.) from a heat source in an electronic device. The thermal and / or EMI management material can typically be positioned between a heat source and a heat removal / dissipation structure or component (e.g., in direct physical contact, thermal contact, etc.) to establish a thermal junction, interface, pathway, or thermally conductive thermal path by which heat can be transferred (e.g., conducted) from the heat source to the heat removal / dissipation structure or component. During operation, the thermal and / or EMI management material can function to enable the transfer of heat (e.g., conduction of heat, etc.) from the heat source to the heat removal / dissipation structure or component along a thermal conduction path. In exemplary embodiments, the heat and / or EMI management material may also be operable to mitigate (eg, absorb) EMI incident on the heat and / or EMI management material.

[0070] Exemplary embodiments disclosed herein may be used with a wide range of heat sources, electronic devices, and / or heat removal / dissipation structures or components (e.g., heat spreaders, heat sinks, heat pipes, vapor chambers, external device cases, housings, or chassis, etc.) For example, a heat source may include one or more heat-generating components or devices, such as high-power integrated circuits (ICs), optical transceivers, 5G infrastructure devices (e.g., base stations, small cells, smart poles, etc.), memory in video cards, set-top boxes, televisions, gaming systems, automotive electronics used in autonomous driving (ADAS) (e.g., radar, multi-domain controllers, cameras, etc.), CPUs, die-in-underfill, semiconductor devices, flip-chip devices, graphics processing units (GPUs), digital signal processors (DSPs), multiprocessor systems, integrated circuits (ICs), multi-core processors, etc. Generally, a heat source can include any component or device that has a higher temperature than the heat and / or EMI management material or that transfers heat to the heat and / or EMI management material, whether the heat is generated by the heat source or simply transferred through or via the heat source. Thus, embodiments of the present disclosure should not be limited to use with a single type of heat source, electronic device, heat removal / dissipation structure, or the like.

[0071] The exemplary embodiments are provided so that this disclosure will be thorough and will fully convey the scope to those skilled in the art. Numerous specific details are set forth, such as examples of specific components, devices, and methods, to provide a thorough understanding of the embodiments of the present disclosure. It will be apparent to those skilled in the art that the use of specific details is not necessary, that the exemplary embodiments can be embodied in many different forms, and that neither should be construed as limiting the scope of the present disclosure. In some exemplary embodiments, well-known processes, well-known device structures, and well-known technologies are not described in detail. Furthermore, advantages and improvements that may be achieved in one or more exemplary embodiments of the present disclosure are provided for illustrative purposes only and do not limit the scope of the present disclosure, as an exemplary embodiment of the present disclosure may provide all or none of the above advantages and improvements and still be within the scope of the present disclosure.

[0072] The specific dimensions, specific materials, and / or specific shapes disclosed herein are exemplary in nature and do not limit the scope of the present disclosure. The disclosure herein of a specific value and a specific range of values ​​for a given parameter does not exclude other values ​​and ranges of values ​​that may be useful in one or more examples disclosed herein. Furthermore, it is contemplated that any two specific values ​​for a particular parameter described herein may define the endpoints of a range of values ​​that may be suitable for the given parameter (i.e., the disclosure of a first and a second value for a given parameter can be interpreted as disclosing that any value between the first and second values ​​can be used for the particular parameter). For example, if parameter X is exemplified herein as having a value A and also as having a value Z, it is contemplated that parameter X may have a range of values ​​from about A to about Z. Similarly, the disclosure of two or more ranges of values ​​for a parameter (whether such ranges are nested, overlapping, or separate) is contemplated to encompass all possible combinations of ranges of values ​​that may be claimed using the endpoints of the disclosed ranges. For example, if a parameter X is exemplified herein as having a value in the range of 1 to 10, or 2 to 9, or 3 to 8, it is also contemplated that the parameter X may have other ranges of values, including 1 to 9, 1 to 8, 1 to 3, 1 to 2, 2 to 10, 2 to 8, 2 to 3, 3 to 10, and 3 to 9.

[0073] The terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to be limiting. For example, when permissive phrases such as "may include" or "may include" are used herein, at least one embodiment includes the feature. As used herein, the singular forms "a," "an," and "the" may be intended to include the plural forms as well, unless the context clearly dictates otherwise. The terms "comprise," "include," and "have" are inclusive and thus specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. Method steps, processes, and operations described herein should not be construed as necessarily requiring their performance in the particular order described or illustrated, unless specifically identified as an order of performance. It should also be understood that additional or alternative steps may be employed.

[0074] When an element or layer is described as "on," "engaged with," "connected to," or "bonded to" another element or layer, it may be directly on, engaged with, connected to, or bonded to that other element or layer, or to intervening elements or layers that may be present. In contrast, when an element is described as "directly on," "directly engaged with," "directly connected to," or "directly bonded to" another element or layer, there may be no intervening elements or layers. Other words used to describe relationships between elements should be interpreted in a similar manner (e.g., "between" and "directly between," "adjacent" and "directly adjacent," etc.). As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0075] The term "about," when applied to a value, indicates that the calculation or measurement allows for slight imprecision in the value (approximately or reasonably close to the value, depending on the approach to the accuracy of the value; approximately). If, for some reason, the imprecision provided by "about" is not understood in this ordinary sense in the art, "about," as used herein, refers to at least the variation that can result from ordinary methods of measuring or using such parameters. For example, the terms "generally," "about," and "substantially" can be used herein to mean within manufacturing tolerances. Alternatively, for example, the term "about," when used herein when modifying the amounts of components or reactants of the present invention, refers to variations in numerical values ​​that can occur, for example, in typical measuring and handling procedures used in producing concentrates or solutions in the real world, through inadvertent errors in these procedures, or through differences in the manufacture, source, or purity of components used to make the composition or carry out the method. The term "about" also encompasses amounts that differ due to different equilibrium conditions of a composition resulting from a particular initial mixture. Numerical quantities and equivalent amounts are included regardless of whether they are modified by the term "about."

[0076] Terms such as "first," "second," and "third" may be used herein to describe various elements, components, regions, layers, and / or sections, but these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms are used only to distinguish one element, component, region, layer, or section from another region, layer, or section. When used herein, terms such as "first," "second," and other numerical terms do not imply an order or sequence unless clearly indicated by context. Thus, a first element, component, region, layer, or section discussed below could be referred to as a second element, component, region, layer, or section without departing from the teachings of the exemplary embodiments.

[0077] Spatially relative terms such as "inside," "outside," "below," "down," "lower," "upper," "above," and the like may be used herein to facilitate the description of the relationship of one element or feature to another, as shown in the figures. Spatially relative terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation shown in the figures. For example, if the device in the figures is turned over, elements described as "below" or "below" other elements or features would then become "above" the other elements or features. Thus, the example term "below" can encompass both an orientation of above and below. The device may be oriented differently (rotated 90 degrees or in another orientation), and the spatially relative descriptors used herein may be interpreted accordingly.

[0078] The foregoing description of the embodiments has been provided for purposes of illustration and description. It is not intended to be exhaustive or to limit the disclosure. Individual elements, intended or described uses, or features of a particular embodiment are in most cases not limited to that particular embodiment, but, where applicable, are interchangeable and can be used in selected embodiments even if not specifically shown or described. The same can also be modified in many ways. Such modifications should not be considered a departure from the disclosure, and all such variations are intended to be included within the scope of the disclosure.

Claims

1. 1. A method comprising adding a silicone carbinol to a composite in an amount sufficient to increase flow rate of the composite and / or reduce material migration from the composite, wherein the silicone carbinol is in a matrix comprising a polymer, the amount of the silicone carbinol being equal to or greater than the amount of the polymer, and wherein the composite is useful for thermal and / or electromagnetic interference (EMI) management.

2. 10. The method of claim 1, wherein the weight ratio of the polymer to the silicone carbinol is 1 or less.

3. 10. The method of claim 1, wherein the silicone carbinol comprises an amount of carbinol polysiloxane equal to or greater than the amount of the polymer.

4. 4. The method of claim 3, wherein the weight ratio of said polymer to said carbinol polysiloxane is 1 or less.

5. the polymer of the matrix comprises polydimethylsiloxane (PDMS); The method of claim 1 , wherein the amount of the silicone carbinol is equal to or greater than the amount of the PDMS.

6. The method of claim 5 , wherein the weight ratio of the PDMS to the silicone carbinol is 1 or less.

7. the polymer of the matrix comprises polydimethylsiloxane (PDMS); The method of claim 1 , wherein the silicone carbinol comprises an amount of carbinol polysiloxane that is equal to or greater than the amount of the PDMS.

8. the polymer of the matrix comprises polydimethylsiloxane (PDMS); the silicone carbinol comprises a carbinol polysiloxane; The method of claim 1 , wherein the ratio of the PDMS to the carbinol polysiloxane is 1 or less.

9. the method includes adding the silicone carbinol to the composite in an amount sufficient to increase the flow rate of the composite and reduce material migration from the composite; and / or 10. The method of claim 1, wherein adding the silicone carbinol to the composite comprises adding a sufficient amount of silicone carbinol fluid to the composite to act as an effective particle dispersant in the composite.

10. The method of claim 1 , wherein the silicone carbinol comprises a hydrocarbyl-functional organopolysiloxane.

11. The hydrocarbyl-functional organopolysiloxane is ２ OCH ２ CH ２ a hydrocarbyl group having the formula: OH, ２ The method of claim 10, wherein R 1 is a divalent hydrocarbon group containing from 2 to 6 carbon atoms.

12. The method of claim 1 , wherein the composite comprises the silicone carbinol, aluminum, and zinc oxide in a matrix comprising polydimethylsiloxane (PDMS).

13. The method of claim 1 , wherein the composite is a polymer-inorganic composite that does not include a siloxane polymer.

14. the composite has a mass flow rate of at least 100 grams per minute (g / min) or greater; and / or The method of claim 1 , wherein the composite is capable of deflecting to a minimum bondline of less than 50 microns.

15. the composite is a liquid gap filler composite comprising a silicone carbinol fluid, and / or the composite is in the form of a gap filler pad; and / or The method of claim 1 , wherein the method comprises dispensing the composite material on a surface of the device to manage thermal and / or electromagnetic properties of the device or a system including the device.

16. the composite comprises a polydimethylsiloxane (PDMS) fluid; and 10. The method of claim 1, wherein adding the silicone carbinol to the composite comprises adding the silicone carbinol fluid to the PDMS fluid in an amount sufficient to enable the silicone carbinol fluid to act as an effective particle dispersant in the composite.

17. The method comprises: thermally conductive filler, Conductive filler, Electromagnetic wave absorbing filler, Dielectric absorbing filler, and A filler having two or more properties selected from the group consisting of thermal conductivity, electrical conductivity, dielectric absorption, and electromagnetic wave absorption. to the composite, thereby the composite is a thermal and / or electromagnetic interference (EMI) management material that can be used to manage the thermal and / or electromagnetic properties of a device or system; and / or 17. The method of any one of claims 1 to 16, wherein the composite is a thermal interface material, an EMI absorber, a thermally conductive absorber, a conductive elastomer, a conductive composite, or a combination of two or more thereof.

18. 1. A composite useful for heat and / or electromagnetic interference (EMI) management, the composite comprising a silicone carbinol in an amount sufficient to increase flow rate of the composite and / or reduce material migration from the composite, the silicone carbinol being present in a matrix comprising a polymer, the amount of silicone carbinol being equal to or greater than the amount of the polymer.

19. 20. The composite of claim 18, wherein the weight ratio of said polymer to said silicone carbinol is 1 or less.

20. 20. The composite of claim 18, wherein the silicone carbinol comprises an amount of carbinol polysiloxane that is equal to or greater than the amount of the polymer.

21. 21. The composite of claim 20, wherein the weight ratio of said polymer to said carbinol polysiloxane is 1 or less.

22. the polymer of the matrix comprises polydimethylsiloxane (PDMS); 20. The composite of claim 18, wherein the amount of the silicone carbinol is equal to or greater than the amount of the PDMS.

23. 23. The composite of claim 22, wherein the weight ratio of the PDMS to the silicone carbinol is 1 or less.

24. the polymer of the matrix comprises polydimethylsiloxane (PDMS); 20. The composite of claim 18, wherein the silicone carbinol comprises an amount of carbinol polysiloxane that is equal to or greater than the amount of the PDMS.

25. the polymer of the matrix comprises polydimethylsiloxane (PDMS); the silicone carbinol comprises a carbinol polysiloxane; 20. The composite of claim 18, wherein the ratio of the PDMS to the carbinol polysiloxane is 1 or less.

26. the composite comprises the silicone carbinol in an amount sufficient to increase the flow rate of the composite and reduce material migration from the composite; and / or 20. The composite of claim 18, wherein the silicone carbinol comprises a sufficient amount of silicone carbinol fluid to act as an effective particle dispersant in the composite.

27. 20. The composite of claim 18, wherein the silicone carbinol comprises a hydrocarbyl-functional organopolysiloxane.

28. The hydrocarbyl-functional organopolysiloxane is ２ OCH ２ CH ２ a hydrocarbyl group having the formula: OH, ２ 28. The composite of claim 27, wherein: comprises said hydrocarbyl group which is a divalent hydrocarbon group containing from 2 to 6 carbon atoms.

29. 20. The composite of claim 18, wherein the composite comprises the silicone carbinol, aluminum, and zinc oxide in a matrix comprising polydimethylsiloxane (PDMS).

30. 20. The composite of claim 18, wherein the composite is a polymer-inorganic composite that does not include a siloxane polymer.

31. the composite has a mass flow rate of at least 100 grams per minute (g / min) or greater; and / or 20. The composite of claim 18, wherein the composite is capable of deflecting to a minimum bondline of less than 50 micrometers.

32. 20. The composite of claim 18, wherein the composite is a thermal and / or electromagnetic interference (EMI) management material that can be used to manage thermal and / or electromagnetic properties of a device or system.

33. the composite is a liquid gap filler composite comprising a silicone carbinol fluid; or the composite is dispensable on a surface of the device to manage the thermal and / or electromagnetic properties of the device or a system including the device; or 20. The composite of claim 18, wherein the composite is in the form of a gap filler pad.

34. the composite comprises a polydimethylsiloxane (PDMS) fluid; and 20. The composite of claim 18, wherein the silicone carbinol comprises a sufficient amount of silicone carbinol fluid to act as an effective particle dispersant in the composite.

35. The composite material comprises: thermally conductive filler, Conductive filler, Electromagnetic wave absorbing filler, Dielectric absorbing filler, and A filler having two or more properties selected from the group consisting of thermal conductivity, electrical conductivity, dielectric absorption, and electromagnetic wave absorption. by further including one or more of the composite is a thermal and / or electromagnetic interference (EMI) management material that can be used to manage the thermal and / or electromagnetic properties of a device or system; and / or 35. The composite of any one of claims 18 to 34, wherein the composite is a thermal interface material, an EMI absorber, a thermally conductive absorber, a conductive elastomer, a conductive composite, or a combination of two or more thereof.

Images