Manufacturing method of electronic component and manufacturing device

Abstract

To provide a manufacturing method of an electronic component in which a conductive block between the electronic component and a carrier is covered and blocked by a capillary underfill, and provide a manufacturing device.SOLUTION: A manufacturing method of an electronic component comprises steps of: providing a carrier; providing the electronic component; fixing a conductive block located on at least one surface of the electronic component to the carrier to form an entire assembly; and disposing the entire assembly in a chamber. The manufacturing method of an electronic component further comprises a step M1 of lowering a temperature in a chamber to a first predetermined temperature lower than room temperature, a step M2 of lowering a pressure in the chamber to a first predetermined pressure which is a vacuum pressure and maintaining the vacuum pressure for a predetermined time, a step M3 of raising the pressure in the chamber to a second predetermined pressure equal to or higher than one atmospheric pressure and maintaining the second predetermined pressure for a predetermined time, and a step M4 of raising the temperature in the chamber to a second predetermined temperature.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a method and an apparatus for manufacturing electronic components. [Background technology]

[0002] In conventional electronic component (e.g., chip) manufacturing processes, electronic components are typically secured to a carrier via multiple conductive blocks, and capillary underfill is applied from one or more sides of the electronic component. The capillary underfill then spreads along the gap between the electronic component and the carrier, filling the gap and covering and insulating the conductive blocks between the electronic component and the carrier. However, capillary underfill typically contains multiple tiny bubbles, and as the capillary underfill spreads along one or more sides of the electronic component in the process of filling the gap, various factors can cause unfilled spaces as the capillary underfill tip spreads. Specifically, as the capillary underfill spreads from at least one side of the electronic component to the other end, unfilled spaces can be formed due to various factors, such as bubbles generated by inconsistent flow speeds of the spreading tip of the underfill or by the convergence of the spreading tip of the underfill from multiple sides (referred to herein as a "backfilling phenomenon"). The bubbles generated by this phenomenon and the multiple tiny bubbles in the capillary underfill ultimately result in the formation of voids in the capillary underfill.

[0003] Conventional bubble removal methods typically involve increasing the temperature and applying a vacuum. However, this method is not recommended for advanced chiplet packages, systems in a package (SiP), or low-temperature fillers. Higher temperatures reduce the resin's viscosity, which increases the resin's fluidity and increases the risk of the resin extruding outside the electronic components or rising up onto the components, resulting in defects such as overflow and extrusion. Furthermore, polymeric materials tend to diffuse easily, and the pressure difference between the inside and outside of the bubbles can easily cause excessive material extraction during bubble removal.

[0004] Therefore, consumers are eagerly hoping to develop a more ideal and practical innovative structure to address the problems of the conventional structure described above, and those skilled in the art must make efforts to develop a breakthrough goal and direction.

[0005] In view of this, the inventor has been engaged in the manufacturing, development and design of related products for many years, and after detailed design and careful evaluation for the above purpose, has completed the development of the present invention, which has practical applications. Summary of the Invention

[0006] In order to solve the above problem, one embodiment of the present invention provides a method for manufacturing an electronic component, including the steps of: providing a carrier having a first surface; providing an electronic component having a conductive block on at least one surface; fixing the conductive block located on at least one surface of the electronic component to the first surface of the carrier to form an entire assembly; applying a capillary underfill from at least one side of the electronic component, the capillary underfill spreading along and filling a gap between the electronic component and the carrier to protect the conductive block; placing the entire assembly in a chamber; reducing the temperature in the chamber to a first predetermined temperature lower than room temperature; reducing the pressure in the chamber to a first predetermined pressure that is a vacuum pressure and maintaining the vacuum pressure for a predetermined time; increasing the pressure in the chamber to a second predetermined pressure that is equal to or higher than one atmosphere pressure and maintaining the second predetermined pressure for a predetermined time; and increasing the temperature in the chamber to the second predetermined temperature.

[0007] The first predetermined temperature and the first predetermined pressure can prevent problems such as the capillary underfill overflowing the outside of the electronic component or rising above the electronic component, and can also promote the reduction of the volume of bubbles caused by the backfilling phenomenon that occurs when the capillary underfill is applied from multiple sides of the electronic component. The second predetermined temperature and the second predetermined pressure are used to completely remove bubbles whose volume has been reduced in the gap between the electronic component and the carrier by gas dissolution and diffusion. The second predetermined temperature and the second predetermined pressure can also be used to remove bubbles caused by the backfilling phenomenon in order from large to small by changing the parameters and sequence according to the requirements of the manufacturing process.

[0008] Furthermore, as mentioned above, polymeric materials have the property of diffusing easily, so as long as the pressure difference between the inside and outside of the bubbles does not pull out too much of the material during the bubble removal process, a larger pressure difference contributes to defoaming. Furthermore, lowering the temperature of the material to increase viscosity is a measure to prevent the material from being pulled out during the bubble removal process. Increasing the viscosity of the material slows the bubble removal speed, but from a microscopic perspective, increasing the vacuum pressure difference between the inside and outside of the bubbles before the material is completely aged allows the bubbles to penetrate (dissolve) into the material more quickly and can be removed by the force of movement toward the edge of the electronic component due to the concentration gradient.

[0009] The above-mentioned objects, structures, and features of the present invention will be more clearly understood after the techniques, means, and effects used for the present invention are described in detail with reference to preferred embodiments and drawings. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a flowchart showing a method for manufacturing an electronic component according to an embodiment of the present invention. [Figure 2] 1 is a schematic diagram showing an electronic component manufacturing apparatus according to an embodiment of the present invention. [Figure 3A] 1A to 1C are schematic diagrams illustrating a manufacturing process of an electronic component. [Figure 3B] 1A to 1C are schematic diagrams illustrating a manufacturing process of an electronic component. [Figure 3C] 1A to 1C are schematic diagrams illustrating a manufacturing process of an electronic component. [Figure 3D] 1 is a schematic diagram showing a backfilling phenomenon that occurs when the tip of the capillary underfill converges in a three-way filling process. FIG. [Figure 3E] 1 is a schematic diagram showing the behavior of stress experienced by bubbles in a capillary underfill during the degassing process due to a vacuum pressure difference. FIG. [Figure 4A] 1A and 1B are schematic diagrams showing different capillary underfill filling methods. [Figure 4B] 1A and 1B are schematic diagrams showing different capillary underfill filling methods. [Figure 5] 1 is a graph showing the relationship between process temperature, process pressure, and process time according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0011] Therefore, in order to allow you, the judges, to further understand and appreciate the objects, features, and effects of the present invention, we will explain them in detail below in conjunction with the embodiments and drawings.

[0012] According to one embodiment of the present invention, with reference to Figures 3A to 3C, a method for manufacturing an electronic component is provided, which includes the following steps.

[0013] A carrier 100 having a first surface 100a is provided. An electronic component 101 having a conductive block 103 on at least one side of the electronic component 101 is provided. The conductive block 103 located on at least one side of the electronic component 101 is fixed to the first surface 100a of the carrier 100 to form an entire assembly, where the spacing between the conductive blocks 103 is B and the gap between the electronic component 101 and the carrier 100 is A. A capillary underfill 105 is applied from at least one side of the electronic component 101, and the capillary underfill 105 spreads along the gap A between the electronic component 101 and the carrier 100, filling the gap A and covering and shielding the conductive block 105 between the electronic component 101 and the carrier 100, thereby providing protection for the conductive block 103. The entire assembly is then placed in chamber 1 of FIG. 2. 1 and 5 , the temperature in chamber 1 is lowered to a first predetermined temperature below room temperature to increase the viscosity of capillary underfill 105, i.e., reduce the fluidity of capillary underfill 105. The pressure in chamber 1 is lowered to a first predetermined pressure, which is a vacuum pressure, and this vacuum pressure is maintained for a predetermined time to remove most of the bubbles 107 and bubbles (backfilled spaces) 109 or reduce their volume. Thereafter, the pressure in chamber 1 is increased to a second predetermined pressure of 1 atmosphere or more and maintained for a predetermined time. The temperature in chamber 1 is then increased to the second predetermined temperature to age the capillary underfill and / or increase the fluidity of capillary underfill 105, thereby further removing the remaining bubbles 107 and bubbles (backfilled spaces) 109. For example, in one embodiment of the present invention, the second predetermined pressure may be, but is not limited to, 1 atmosphere or more and 50 atmospheres or less.

[0014] 5 is a graph illustrating the three-way relationship between process temperature, process pressure, and process time according to one embodiment of the present invention. It should be understood that the process parameters shown in FIG. 5 are exemplary and are not intended to be limiting of the present invention.

[0015] In an embodiment of the present invention, the first predetermined temperature can be reduced from below room temperature (30°C) to -40°C. The second predetermined temperature is 40°C to 300°C. The first predetermined pressure can be reduced from below 1 atmosphere (atm) to 10-4 torr. The second predetermined pressure can be 1 atmosphere (atm) to 50 atmospheres (atm). In an embodiment of the present invention, step 1 (M1) includes reducing the temperature in chamber 1 to a first predetermined temperature lower than room temperature. Step 2 (M2) includes reducing the pressure in chamber 1 to a first predetermined pressure, which is a vacuum pressure, and maintaining the vacuum pressure for a predetermined time. Step 3 (M3) includes increasing the pressure in chamber 1 to a second predetermined pressure, which is above 1 atmosphere, and maintaining the second predetermined pressure for a predetermined time. Step 4 (M4) includes increasing the temperature in chamber 1 to a second predetermined temperature.

[0016] 3A to 3C are schematic diagrams illustrating the manufacturing process of an electronic component. As shown in FIGS. 3A to 3C, in the manufacturing process of an electronic component, a conductive block 103 located on at least one side of an electronic component 101 is fixed to a first surface 100a of a carrier 100 (FIG. 3A). Then, a capillary underfill 105 is applied from at least one side of the electronic component 101 (FIG. 3B). The capillary underfill spreads along and flows into the gap between the electronic component 101 and the carrier 100, filling the gap and protecting the conductive block 103 (FIG. 3C). However, the capillary underfill 105 typically contains many tiny bubbles 107 and backfill spaces 109 created when the tips of the capillary underfill converge. These bubbles 107 and backfill spaces 109 subsequently form voids in the capillary underfill, which can reduce the reliability of the electronic component and cause electrical failures. As shown in FIG. 3D, the capillary underfill 105 spreads along three sides of the electronic component 101 during the gap filling process. Furthermore, when tips C, D, and E of the capillary underfill 105 converge, an unfilled space (i.e., a bubble (backfilled space) 109 in FIG. 3C) is formed. Conventionally, the problem of void formation in the capillary underfill 105 was solved by applying high temperature and high pressure. However, as a result, the fluidity of the capillary underfill 105 increased during the bubble removal process, causing the capillary underfill 105 to rise above the electronic component 101 and protrude. To solve this problem, the temperature was lowered below room temperature to increase the viscosity of the capillary underfill 105, and a vacuum was then applied, which prevented the capillary underfill 105 from rising above the electronic component 101 and protruding. The vacuum not only causes bubble movement and pulling according to Newton's law of motion, but also promotes dissolution and diffusion.First, the temperature is lowered below room temperature to increase the viscosity of the capillary underfill 105, and then a vacuum is applied to the chiplet, which is a minute gap between chips. This process can prevent the capillary underfill 105 from rising and overflowing when degassing the minute gap between electronic components 101. This method is suitable for degassing capillary underfill 105 for chiplets, multi-chip packages, and systems in packages (SiPs), as well as for low-temperature materials. Capillary underfill is a polymeric material, and gas molecules easily diffuse in the polymeric material. Therefore, as long as the polymeric material is not pulled out by the vacuum pressure difference between the inside and outside of the bubbles during the degassing process, a larger pressure difference contributes to the degassing speed. Figure 3E is a schematic diagram showing the behavior of stresses experienced by bubbles in the capillary underfill 105 during the degassing process due to a vacuum pressure difference. Lowering the temperature of the polymeric material, i.e., increasing the viscosity of the polymeric material, is done to prevent the polymeric material from being extracted during the bubble removal process. Generally, processes after the cooling and vacuum degassing processes include increasing the temperature and creating a high-pressure environment. This is because vacuum degassing alone does not necessarily eliminate bubbles completely; lowering the viscosity of the capillary underfill 105 at a higher temperature and promoting the dissolution and dispersion of the bubbles at a higher pressure are advantageous for the reduction and disappearance of the bubbles.

[0017] In an embodiment of the present invention, the capillary underfill 105 is applied from at least one side of the electronic component 101 by at least one of the methods shown in Figures 4A and 4B, and the capillary underfill 105 spreads along the gap A between the electronic component 101 and the carrier 100, thereby filling the gap A. Although Figures 4A and 4B show rectangular carrier 100 and electronic component 101, the present invention can be applied to carriers and electronic components with various shapes. In one embodiment of the present invention, the electronic component 101 may be, for example, a chip.

[0018] As shown in FIG. 2 , according to one embodiment of the present invention, an electronics manufacturing apparatus is connected to a facility pressure 12, i.e., an external pressure source. The “facility pressure” generally refers to the pressure supplied by a factory. The manufacturing apparatus includes a processing chamber 1 having an extension space 3 communicating with the chamber 1, one or more gas inlets 5 connected to the facility pressure 12, and one or more gas outlets 7; a cooler 9 attached to the outside of the chamber 1 and connected to the chamber 1 via piping; a heater 10 attached within the chamber 1; a vacuum generator 11 attached to the outside of the chamber 1 and connected to the chamber 1 via the gas outlet 7; a controller 15; and a fan 17 for generating an airflow into the chamber 1. The cooler 9, heater 10, vacuum generator 11, and fan 17 are electrically connected to the controller 15 to transmit signals and are controlled by the controller 15. The controller 15 can execute the following steps: lowering the temperature in the chamber 1 to a first predetermined temperature lower than room temperature using the cooler 9, thereby increasing the viscosity of the capillary underfill 105; lowering the pressure in the chamber 1 to the first predetermined pressure, which is a vacuum pressure, using the vacuum generator 11 and maintaining this vacuum pressure for a predetermined time, thereby removing most of the bubbles 107 and bubbles (backfilled spaces) 109 or reducing the volume of the bubbles; raising the pressure in the chamber 1 to a second predetermined pressure of 1 atmosphere or more using the external pressure source and maintaining the second predetermined pressure for a predetermined time; and adjusting the heater 10 and fan 17 to increase the temperature in the chamber 1 to the second predetermined temperature, thereby aging the capillary underfill 105 and / or increasing the fluidity of the capillary underfill 105, thereby further removing the remaining bubbles 107 and bubbles (backfilled spaces) 109.

[0019] In an embodiment of the present invention, the controller 15 may be a programmable logic controller (PLC). In one embodiment of the present invention, the external pressure source (i.e., facility pressure 12) may be connected to, for example, a pressure adjusting member 13, which is electrically connected to the controller 115 and controlled by the controller 115 by sending signals to complete a predetermined pressure setting in the chamber 1. If the external pressure source (facility pressure) becomes insufficient or unstable, the pressure adjusting member 13 can strengthen or stabilize the pressure inside the chamber 1, allowing the pressure inside the chamber 1 to reach and maintain a second predetermined pressure that does not drop below 1 atmospheric pressure. In one embodiment of the present invention, the pressure adjusting member 13 may be a member such as a pressure pump or a compressor cylinder. The manufacturing apparatus further includes a vacuum sensor 19 connected to the chamber 1 for detecting the vacuum pressure inside the chamber 1, a pressure sensor 21 connected to the chamber 1 for detecting the pressure inside the chamber 1, and a temperature sensor 23 connected to the chamber 1 for detecting the temperature inside the chamber 1. The vacuum sensor 19, the pressure sensor 21, and the temperature sensor 23 are electrically connected to the controller 15 and are controlled by the controller 15 by sending signals thereto.

[0020] In an embodiment of the present invention, the vacuum sensor 19 may be, for example, a vacuum gauge, and the pressure sensor 21 may be, for example, a pressure gauge. In an embodiment of the present invention, the vacuum generator 11 may be, for example, a vacuum pump. As described above, the fan 17 is used to generate airflow toward the inside of the chamber 1 to promote temperature adjustment within the chamber 1, for example, to achieve a convection heating effect when the heater 10 is turned on for heating, and to achieve a convection cooling effect when the cooler 9 is turned on for cooling. The fan 17 is located within the chamber 1 and connected to the drive motor 17a via the transmission shaft 17b. The drive motor 17a is installed in the extension space 3 communicating with the chamber 1, and the chamber 1 and the extension space 3 are designed without a seal.

[0021] In one embodiment of the present invention, pressure and / or temperature adjustment is performed by controller 15. For example, to reduce the pressure inside chamber 1 to a predetermined vacuum pressure, controller 15 first turns on the vacuum setting and instructs vacuum generator 11 to evacuate the chamber, and then stops operation of vacuum generator 11 when controller 15 receives a measurement signal from vacuum sensor 19 indicating that the pressure inside the chamber has reduced to the vacuum setting. Of course, as described above, this method can also be used to increase the pressure inside chamber 1 or increase / decrease the temperature inside chamber 1.

[0022] Furthermore, as mentioned above, linear pressure and / or temperature regulation can also be achieved by the control of the controller 15. For example, the controller 15 can be designed with a linear rise / fall graph function so that the pressure and / or temperature inside the chamber can be regulated in a linear rise / fall manner. Since the design of a controller is well known to those skilled in the art of automatic control, the design principles and methods thereof will not be described here.

[0023] Although the preferred embodiments of the present invention have been specifically described above as technical features of the present invention, those skilled in the art may change or modify the present invention without departing from the spirit and principles of the present invention, and such changes or modifications shall fall within the scope of the claims defined below. [Explanation of symbols]

[0024] 1 chamber 3 Stretching space 5 Gas inlet 7 Gas outlet 9 Cooler 10 Heater 11 Vacuum Generator 12 Facility pressure 13 Pressure adjusting member 15 Controller 17 Fans 17a Drive motor 17b Conduction shaft 19 Vacuum sensor 21 Pressure Sensor 23 Temperature Sensor 100 Careers 100a First Surface 101 Electronic Components 103 Conductive Block 105 Capillary Underfill 107 Bubbles 109 Foam (backfilled space) A Gap B interval C Capillary underfill tip D Capillary underfill tip E Capillary Underfill Tip M1 Process 1 M2 process 2 M3 process 3 M4 process 4

Claims

1. providing a carrier having a first surface; providing an electronic component having a conductive block on at least one surface; affixing a conductive block located on at least one side of the electronic component to a first surface of the carrier to form an overall assembly; applying a capillary underfill from at least one side of the electronic component, the capillary underfill spreading along and filling a gap between the electronic component and the carrier, thereby providing protection to the conductive block; placing the entire assembly in a chamber, The step of adjusting the temperature and pressure in the chamber includes: (a) lowering the temperature in the chamber to a first predetermined temperature lower than room temperature to increase the viscosity of the capillary underfill; (b) reducing the pressure in the chamber to a first predetermined pressure, which is a vacuum pressure, and maintaining the vacuum pressure for a predetermined time to remove or reduce the volume of bubbles; (c) increasing the pressure in the chamber to a second predetermined pressure, the second predetermined pressure being equal to or greater than one atmosphere, and maintaining the second predetermined pressure for a predetermined period of time; (d) increasing the temperature in the chamber to a second predetermined temperature to age the capillary underfill and / or increase the fluidity of the capillary underfill, and (c) further removing any remaining bubbles.

2. 2. The method for manufacturing an electronic component according to claim 1, wherein the first predetermined temperature is in the range of 30° C. or lower to −40° C.

3. 2. The method for manufacturing an electronic component according to claim 1, wherein the first predetermined pressure is from below 1 atmosphere to 10@-4 torr.

4. 2. The method for manufacturing an electronic component according to claim 1, wherein the second predetermined temperature is in the range of 40 to 300 degrees Celsius.

5. 2. The method for manufacturing an electronic component according to claim 1, wherein the second predetermined pressure is in the range of 1 atmosphere (atm) to 50 atmospheres (atm).

6. An electronic component manufacturing apparatus connected to an external pressure source, a chamber having an extension space in communication with the chamber, one or more gas inlets connected to the external pressure source, and one or more gas outlets; a cooler attached to the outside of the chamber and connected to the chamber via a pipe; a heater attached to the chamber; a vacuum generator mounted outside the chamber and connected to the chamber; a fan for generating an airflow into the chamber; a controller; The controller reducing the temperature in the chamber to a first predetermined temperature lower than room temperature by the cooler to increase the viscosity of the capillary underfill; reducing the pressure in the chamber to a first predetermined pressure, which is a vacuum pressure, by the vacuum generator and maintaining the vacuum pressure for a predetermined time to remove or reduce the volume of bubbles; increasing the pressure in the chamber to a second predetermined pressure of at least one atmosphere using the external pressure source and maintaining the second predetermined pressure for a predetermined period of time; and further removing any remaining bubbles by increasing the temperature in the chamber to the second predetermined temperature using the heater and the fan and aging the capillary underfill and / or increasing the fluidity of the capillary underfill.

7. 7. The electronic component manufacturing apparatus according to claim 6, further comprising a pressure adjusting member provided between the external pressure source and the gas inlet, for adjusting the pressure in the chamber to reach the second predetermined pressure and maintaining the pressure at the second predetermined pressure.

8. 7. The electronic component manufacturing apparatus according to claim 6, further comprising a vacuum sensor connected to the chamber, detecting a vacuum pressure within the chamber, and electrically connected to the controller.

9. 7. The electronic component manufacturing apparatus according to claim 6, further comprising a pressure sensor connected to the chamber, detecting a pressure in the chamber, and electrically connected to the controller.

10. 7. The electronic component manufacturing apparatus according to claim 6, further comprising a temperature sensor connected to the chamber, detecting a temperature inside the chamber, and electrically connected to the controller.

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