Laser module, laser device, and laser processing apparatus

Abstract

To obtain a laser module that has a structure enabling only a target laser module to be easily replaced in a laser device in which a plurality of laser modules are arranged, and that can reduce electrical resistance loss when a large current is applied as compared with a conventional technique.SOLUTION: A laser module includes a heat sink on which a conductive layer is arranged, a first electrode member, an insulating layer, and a second electrode member that are arranged in a first region of the conductive layer, a laser diode element that is arranged in a second region of the conductive layer and has a first electrode surface and a second electrode surface, and a conductive wire that connects the second electrode member and the second electrode surface. The first electrode member includes a first member having a plate shape parallel to a ZX plane and a second member having a plate shape parallel to a YZ plane, and the second electrode member includes a third member having a plate shape parallel to the ZX plane and a fourth member having a plate shape parallel to the YZ plane. The second member and the fourth member each have an opening that can be connected, via a second screw member, to the fourth member and the second member of the different laser modules adjacent to each other.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to a laser module that outputs laser light, a laser device, and a laser processing device. [Background technology]

[0002] In a high-power laser light source consisting of multiple laser modules, it is useful to design a structure that allows for the removal and replacement of only a specific laser module in the event of damage to that module. Patent Document 1 discloses a laser device in which first and second groups of multiple laser modules are arranged adjacent to each other in a stepped configuration on a cooling block. Each laser module has a laser diode mounted on a mounting block and secured to the cooling block by a fixing member. The electrodes of the laser diodes of adjacent laser modules arranged on the same step in the first and second groups are electrically connected by an interconnecting member. The fixing member is positioned to press the end of the mounting block, and the laser module is secured in a predetermined position on the cooling block by securing the fixing member to the cooling block with a bolt. Furthermore, the laser module can be removed by removing the fixing member that secures the target laser module. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2007-142439 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the above-mentioned conventional technology, the interconnection member has a structure in which the spring structure is fixed to the fixing member and the cooling block member with screws, thereby bringing the spring structure into contact with the electrodes of the laser diode. However, in terms of the contact area between the spring structure and the electrodes of the laser diode, electrical connection by contact with the spring structure has a problem in that when a large current is passed, the loss in electrical resistance becomes large, leading to deterioration of the oscillation characteristics.

[0005] The present disclosure has been made in consideration of the above, and aims to provide a laser module in a laser device in which multiple laser modules are arranged, which has a structure that allows easy replacement of only the target laser module, and which can reduce electrical resistance loss when a large current is applied compared to conventional methods. [Means for solving the problem]

[0006] In order to solve the above-mentioned problems and achieve the object, the laser module of the present disclosure is a laser module used in a laser device in which each of a plurality of laser modules is fixed to a base member by an individual first screw member, and has a heat sink structure including: a conductive layer arranged on the side where the components constituting the laser module are placed, and which suppresses temperature rise of the components; a first electrode member arranged in a first region of the conductive layer; an insulating layer arranged on the first electrode member; a second electrode member arranged on the insulating layer; a laser diode element arranged in a second region different from the first region of the conductive layer, having a first electrode surface on the heat sink side and a second electrode surface on the opposite side to the first electrode surface; and a conductive wire electrically connecting the second electrode member and the second electrode surface. The Z-axis direction is the direction of laser light emission from the laser diode element, the Y-axis direction is the direction in which the members are stacked on the heat sink, and the X-axis direction is the direction perpendicular to both the Z-axis direction and the Y-axis direction. The first electrode member has a plate-like first member parallel to the ZX plane and arranged in the first region, and a plate-like second member parallel to the YZ plane, and has an L-shaped XY cross section. The second electrode member has a plate-like third member parallel to the ZX plane and arranged on the first member with an insulating layer interposed therebetween, and a plate-like fourth member parallel to the YZ plane, and has an L-shaped XY cross section. The second member and the fourth member are arranged on both sides of the insulating layer in the X-axis direction. The second member and the fourth member have openings that can be connected to the fourth member and the second member of a different laser module adjacent in the X-axis direction via second screw members, respectively. [Effects of the Invention]

[0007] According to the present disclosure, in a laser device in which multiple laser modules are arranged, a structure is provided that allows for easy replacement of only the target laser module, and the loss of electrical resistance when a large current is applied can be reduced compared to conventional cases. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view showing an example of a configuration of a laser device according to a first embodiment; [Figure 2]FIG. 1 is a perspective view showing an example of a configuration of a laser module according to a first embodiment; [Figure 3] FIG. 1 is a cross-sectional view schematically illustrating an example of the configuration of a laser module according to a first embodiment. [Figure 4] FIG. 1 is a cross-sectional view schematically illustrating an example of the configuration of a laser module according to a first embodiment. [Figure 5] FIG. 10 is a cross-sectional view schematically showing another example of the configuration of the laser module according to the first embodiment. [Figure 6] 1 is a side view of an example of a configuration of a part of a laser device according to a first embodiment, viewed from the Z-axis direction; [Figure 7] FIG. 10 is a perspective view showing an example of the configuration of a connecting member; [Figure 8] FIG. 10 is a cross-sectional view schematically illustrating an example of the configuration of a laser module according to a second embodiment. [Figure 9] FIG. 10 is a cross-sectional view schematically illustrating an example of the configuration of a laser module according to a third embodiment. [Figure 10] FIG. 10 is a cross-sectional view schematically illustrating an example of the configuration of a laser module according to a fourth embodiment. [Figure 11] FIG. 10 is a cross-sectional view schematically showing another example of the configuration of the laser module according to the fourth embodiment. [Figure 12] FIG. 13 is a diagram schematically illustrating an example of the configuration of a laser processing device according to a fifth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A laser module, a laser device, and a laser processing device according to embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings.

[0010] Embodiment 1 1 is a perspective view showing an example of the configuration of a laser device according to embodiment 1. The laser device 10 is applied to a high-power laser light source configured by arranging a plurality of laser modules 20-1 and 20-2. The laser device 10 includes a base 11, a plurality of laser modules 20-1 and 20-2, and a coupling optical system 50.

[0011] The base 11 is a base member to which the plurality of laser modules 20-1, 20-2 and the coupling optical system 50 are fixed. In the example of Fig. 1, a plurality of staircase structures are provided on the upper surface of the base 11, which is the surface on which the laser modules 20-1, 20-2 are arranged. The staircase structure of the base 11 has flat portions 12, which are flat surfaces on which the laser modules 20-1, 20-2 are arranged, and step portions 13 provided between the flat portions 12.

[0012] Each of the plurality of laser modules 20-1, 20-2 is a light source that emits laser light L in the range of several tens of watts to several hundreds of watts. The detailed configuration of the laser modules 20-1, 20-2 will be described later. The laser modules 20-1, 20-2 are fixed to the base 11 by screw members 41. The screw members 41 correspond to first screw members.

[0013] In the example shown in FIG. 1 , a first module group MG1 consisting of five laser modules 20-1 and a second module group MG2 consisting of five laser modules 20-2 are arranged on a base 11. The five laser modules 20-1 of the first module group MG1 are arranged in parallel in a staircase structure provided on the base 11 so that the emission directions of the laser beams L are parallel to each other, and the five laser modules 20-2 of the second module group MG2 are arranged in parallel in a staircase structure provided on the base 11 at a position different from the staircase structure on which the first module group MG1 is arranged so that the emission directions of the laser beams L are parallel to each other. However, in the first module group MG1, the five laser modules 20-1 are electrically connected in series, and in the second module group MG2, the five laser modules 20-2 are electrically connected in series. The first module group MG1 and the second module group MG2 are arranged so that the emission surfaces of the laser beams L face each other.

[0014] The combining optical system 50 combines and emits the laser light L emitted from the laser modules 20-1 and 20-2 of the first module group MG1 and the second module group MG2. The combining optical system 50 includes a plurality of mirrors 51, a mirror 52, and an optical combining element 53. Each of the plurality of mirrors 51 is provided corresponding to each of the plurality of laser modules 20-1 and 20-2. The plurality of mirrors 51 reflect the laser light L emitted from the corresponding laser modules 20-1 and 20-2. The plurality of mirrors 51 are fixed to the base 11.

[0015] The mirror 52 reflects the laser light L, which is emitted from each laser module 20-1 of the first module group MG1 and reflected by the mirror 51, toward the optical coupling element 53. The mirror 52 is fixed to the base 11.

[0016] The optical coupling element 53 coaxially couples the laser light L1 emitted from the first module group MG1 and reflected by the mirror 52 with the laser light L2 emitted from the second module group MG2. The laser light coupled by the optical coupling element 53 will be referred to as laser light Lx below. An example of the optical coupling element 53 is a polarizing element or a wavelength filter. In one example, when the polarization direction of the laser light L1 emitted from the first module group MG1 and the polarization direction of the laser light L2 emitted from the second module group MG2 differ by 90°, a polarizing element that reflects the polarized light from the first module group MG1 and transmits the polarized light from the second module group MG2 to couple the light coaxially can be used as the optical coupling element 53. In another example, when the wavelength band of the laser light L1 emitted from the first module group MG1 and the wavelength band of the laser light L2 emitted from the second module group MG2 are different, a wavelength filter that reflects the laser light L1 from the first module group MG1 and transmits the laser light L2 from the second module group MG2 to couple them coaxially can be used as the optical coupling element 53. The optical coupling element 53 is fixed to the base 11.

[0017] Laser light Lx in the range of several hundred watts to several kilowatts can be obtained by coupling using a coupling optical system 50 as shown in Fig. 1. Note that the coupling optical system 50 shown in Fig. 1 is an example and is not limiting.

[0018] Next, the structures of the laser modules 20-1 and 20-2 will be described. Hereinafter, the laser modules 20-1 and 20-2 will be referred to as laser modules 20 when they are not distinguished from one another. FIG. 2 is a perspective view showing an example of the configuration of a laser module according to the first embodiment. FIG. 3 is a cross-sectional view showing an example of the configuration of a laser module according to the first embodiment. FIG. 4 is a cross-sectional view showing an example of the configuration of a laser module according to the first embodiment. In FIGS. 2, 3, and 4, the emission direction of the laser light L is defined as the Z-axis direction, the direction perpendicular to the Z-axis in which the members constituting the laser module 20 are stacked is defined as the Y-axis direction, and the direction perpendicular to both the Z-axis and the Y-axis is defined as the X-axis direction. Hereinafter, the relative positional relationship between the two in the Y-axis direction will be expressed using up and down. FIG. 3 shows a YZ cross section of the laser module 20, and FIG. 4 shows an XY cross section of the laser module 20. The first optical element 31 and the second optical element 32 are not shown in FIG. 3.

[0019] The laser module 20 includes a mounting material 21, a heat sink 22, an anode member 23, an insulating sheet 24, a cathode member 25, a submount 26, a laser diode element 27, a conductive wire 28, an insulating bushing 29, a screw member 30, a first optical element 31, and a second optical element 32.

[0020] The mounting material 21 is a member on which the components that make up the laser module 20 are arranged. For example, the mounting material 21 has a plate-like structure extending in the Z-axis direction. As shown in FIG. 1 , the mounting material 21 has through holes 211 for fixing to the base 11 with screw members 41. The mounting material 21 also has screw holes 212 that screw into screw members 30 that fix the heat sink 22, the anode member 23, the insulating sheet 24, and the cathode member 25.

[0021] The heat sink 22 is fixed on the mounting material 21 and has a conductive layer disposed on the side where the components of the laser module 20 are disposed. The heat sink 22 is a heat dissipation member that suppresses temperature increases of the components of the laser module 20, specifically, the laser diode element 27. Here, the heat sink 22 has a structure that suppresses temperature increases of the laser diode element 27 by flowing a coolant through it. The heat sink 22 has a flat or rectangular parallelepiped structure extending in the Z-axis direction. The heat sink 22 includes a coolant flow path layer 221 and a heat sink conductive layer 222 disposed on the upper surface of the coolant flow path layer 221. The coolant flow path layer 221 is made of a thermally conductive material and has a flow path therein for the coolant to flow. An example of the coolant is water. The heat sink conductive layer 222 is made of a material that is both electrically and thermally conductive. As described below, the heat sink conductive layer 222 is a layer that realizes electrical connection between the anode member 23 and the submount 26, which is disposed at a different position from the anode member 23. The heat sink conductive layer 222 corresponds to a conductive layer. The coolant flow path layer 221 and the heat sink conductive layer 222 are made of copper (Cu), for example.

[0022] The heat sink 22 may have a heat sink insulating layer between the refrigerant flow path layer 221 and the heat sink conductive layer 222. The heat sink insulating layer is made of an insulating material with good thermal conductivity. For example, the heat sink insulating layer is made of aluminum nitride (AlN). When the heat sink 22 is made of the refrigerant flow path layer 221 and the heat sink conductive layer 222, they may be integrally formed from a conductive material such as copper.

[0023] The upper surface of the heat sink 22, i.e., the heat sink conductive layer 222, has an electrode arrangement region R1 corresponding to the first region and an element arrangement region R2 corresponding to a second region different from the electrode arrangement region R1. The heat sink 22 has through holes at positions corresponding to the screw holes 212 of the mounting material 21. The through holes of the heat sink 22 penetrate the heat sink 22 in the thickness direction, i.e., in the Y-axis direction which is the stacking direction of the members constituting the laser module 20.

[0024] The anode member 23 is a conductive member arranged in the electrode arrangement region R1 of the heatsink conductive layer 222. The anode member 23 is L-shaped in the XY plane. Specifically, the anode member 23 has a plate-like first member 231 that is parallel to the ZX plane and arranged in the electrode arrangement region R1, and a second member 232 that is parallel to the YZ plane, and the XY cross section is L-shaped. In one example, the anode member 23 has a structure in which the end of the first member 231 in the X-axis direction is bent toward the positive side of the Y-axis. The bent portion corresponds to the second member 232. Note that, although the case where the second member 232 is formed by bending the first member 231 is shown here, the second member 232 may also be joined to the end of the first member 231 in the positive direction of the X-axis by a method such as welding.

[0025] The first member 231 has a through hole at a position corresponding to the screw hole 212 of the mounting member 21. The through hole of the first member 231 penetrates the first member 231 of the anode member 23 in the thickness direction, i.e., in the Y-axis direction. The second member 232 has an opening that penetrates the second member 232 in the thickness direction, i.e., in the X-axis direction. In this example, the opening is a notch 232a provided in the upper part of the second member 232. Also, in this example, two notches 232a are provided in the second member 232, but the number of notches 232a may be one, or three or more.

[0026] The anode member 23 is an electrode member connected to the P-type semiconductor side of the laser diode element 27, i.e., the anode surface 271 of the laser diode element 27. The anode member 23 supplies current to the laser diode element 27. The anode member 23 and the heat sink conductive layer 222 are electrically connected. The anode member 23 may be fixed to the heat sink 22 with a conductive adhesive using techniques such as soldering or silver sintering. An example of the anode member 23 is copper. In this example, the anode member 23 corresponds to the first electrode member, and the anode surface 271 corresponds to the first electrode surface.

[0027] The insulating sheet 24 is an insulating layer disposed on the first member 231 of the anode member 23 to insulate the anode member 23 from the cathode member 25. The insulating sheet 24 may be made of an insulating ceramic material, an insulating polymer material, or the like. The insulating sheet 24 may be fixed to the anode member 23 with an adhesive. The insulating sheet 24 has through-holes at positions corresponding to the screw holes 212 of the mounting member 21. The through-holes of the insulating sheet 24 penetrate the insulating sheet 24 in the thickness direction, i.e., in the Y-axis direction.

[0028] The negative electrode member 25 is disposed on the insulating sheet 24. The negative electrode member 25 is L-shaped in the XY plane. Specifically, the negative electrode member 25 includes a plate-like third member 251 that is parallel to the ZX plane and disposed on the first member 231 of the positive electrode member 23 via the insulating sheet 24, and a plate-like fourth member 252 that is parallel to the YZ plane, resulting in an L-shaped XY cross section. In one example, the negative electrode member 25 has a structure in which the end of the third member 251 in the X-axis direction is bent toward the positive side of the Y-axis. The bent portion corresponds to the fourth member 252. Note that, although the case where the fourth member 252 is formed by bending the third member 251 is shown here, the fourth member 252 may also be joined to the end of the third member 251 in the negative X-axis direction by a method such as welding.

[0029] The position of the fourth member 252 in the X-axis direction is on the opposite side of the insulating sheet 24 from the second member 232 of the anode member 23. In other words, the fourth member 252 and the second member 232 of the anode member 23 are disposed on both sides of the insulating sheet 24 in the X-axis direction. In addition, the end of the third member 251 in the X-axis direction is disposed at a distance from the second member 232 of the anode member 23 so as not to come into contact with each other.

[0030] The third member 251 has a through hole at a position corresponding to the screw hole 212 of the mounting member 21. The through hole of the third member 251 penetrates the third member 251 of the cathode member 25 in the thickness direction, i.e., in the Y-axis direction. The fourth member 252 has an opening that penetrates the fourth member 252 in the thickness direction, i.e., in the X-axis direction. In this example, the opening is a notch 252a provided in the upper part of the fourth member 252. Also, in this example, two notches 252a are provided in the fourth member 252, but the number of notches 252a may be one, or three or more. It is desirable that the position of the notch 252a of the fourth member 252 in the Z-axis direction be the same as the position of the notch 232a of the second member 232 of the anode member 23.

[0031] The negative electrode member 25 is an electrode member connected to the N-type semiconductor side of the laser diode element 27, i.e., the negative electrode surface 272 of the laser diode element 27. The negative electrode member 25 supplies current to the laser diode element 27. An example of the negative electrode member 25 is copper with a gold (Au) plated surface. The negative electrode member 25 may be fixed onto the insulating sheet 24 with an adhesive. In this example, the negative electrode member 25 corresponds to the second electrode member, and the negative electrode surface 272 corresponds to the second electrode surface.

[0032] The submount 26 is disposed on the element placement region R2 of the heatsink conductive layer 222. For example, the submount 26 is fixed to the heatsink 22 by a conductive adhesive. The submount 26 is an intermediate member for alleviating stress generated in the laser diode element 27 due to the difference in linear expansion coefficient between the heatsink 22 and the laser diode element 27. In other words, the submount 26 preferably has a linear expansion coefficient between that of the laser diode element 27 and that of the heatsink 22. Furthermore, the submount 26 preferably has thermal conductivity to transfer heat from the laser diode element 27 to the heatsink 22, and electrical conductivity to establish electrical connection with the anode member 23 via the heatsink conductive layer 222. An example of a material for the submount 26 is copper tungsten (CuW).

[0033] The laser diode element 27 is disposed on the submount 26. The laser diode element 27 has an anode surface 271 on the heat sink 22 side and a cathode surface 272 on the opposite side to the anode surface 271. In one example, the laser diode element 27 is fixed to the submount 26 with a conductive adhesive. The laser diode element 27 is an edge-emitting laser having a PN junction along the ZX plane and emitting laser light L in the Z-axis direction. In one example, the laser diode element 27 uses gallium arsenide (GaAs) as a substrate and indium gallium arsenide (InGaAs) as an active layer. The end face of the laser diode element 27 on the positive side of the Z-axis is positioned approximately in the same position as the end face of the heat sink 22 on the positive side of the Z-axis. The surface of the laser diode element 27 is gold-plated. Here, the laser diode element 27 is fixed on the submount 26 so that the surface in contact with the submount 26 is a P-type semiconductor and the upper surface is an N-type semiconductor.

[0034] The conductive wire 28 is a wiring member that electrically connects the cathode member 25 on the electrode arrangement region R1 of the heatsink conductive layer 222 to the cathode surface 272, which is the upper surface of the laser diode element 27 on the element arrangement region R2. The conductive wire 28 may be made of gold wire, copper wire, aluminum (Al) wire, or the like.

[0035] The heat sink 22, the anode member 23, the insulating sheet 24, and the cathode member 25 arranged on the electrode arrangement region R1 of the heat sink conductive layer 222, the submount 26 and the laser diode element 27 arranged on the element arrangement region R2 of the heat sink conductive layer 222, and the conductive wire 28 connecting the cathode member 25 and the laser diode element 27 form a heat sink structure.

[0036] The insulating bushing 29 is a member made of an insulating material that extends from the third member 251 of the cathode member 25 to at least the insulating sheet 24 and is arranged along the inner surface of the through-hole. The length of the insulating bushing 29 in the Y-axis direction is configured to be longer than the thickness of the third member 251 of the cathode member 25 in the Y-axis direction. In other words, when the conductive screw member 30 is inserted through the through-hole of the cathode member 25, the insulating sheet 24, the anode member 23, and the heat sink 22 and screwed into the screw hole 212 of the mounting material 21, the insulating bushing 29 serves to insulate the screw member 30 from the cathode member 25 so as to prevent electrical conduction between the cathode member 25 and the anode member 23.

[0037] The screw member 30 is made of a conductive material. The screw member 30 is inserted through holes in the cathode member 25, the insulating sheet 24, the anode member 23, and the heat sink 22, and is screwed into the threaded hole 212 in the mounting material 21. This fixes the heat sink structure to the mounting material 21. The screw member 30 corresponds to a third screw member.

[0038] In this example, the screw member 30 is made of a conductive material, but it may be made of an insulating material, in which case the insulating bushing 29 may be unnecessary.

[0039] The first optical element 31 is provided on the end face of the laser diode element 27 on the optical axis of the laser light L emitted from the laser diode element 27, on the positive side of the Z axis. In this example, it is fixed to the end face of the heat sink 22 on the positive side of the Z axis with an adhesive or the like. The first optical element 31 is, for example, a fast axis collimator (FAC), which is an optical component that collimates the fast axis component of the laser light L emitted from the laser diode element 27.

[0040] The second optical element 32 is provided on an end face of the mount material 21 on the positive side of the Z axis on the optical axis of the laser light L emitted from the laser diode element 27. In this example, the second optical element 32 is fixed to the end face of the mount material 21 on the positive side of the Z axis with an adhesive or the like. The second optical element 32 is, for example, a slow axis collimator (SAC), which is an optical component that collimates the slow axis direction component of the laser light L that has passed through the first optical element 31.

[0041] With the above configuration, the P-type semiconductor of the laser diode element 27, i.e., the anode surface 271, is electrically connected to the anode member 23 via the submount 26 and the heat sink conductive layer 222. The N-type semiconductor of the laser diode element 27, i.e., the cathode surface 272, is electrically connected to the cathode member 25 via the conductive wire 28. In other words, by connecting the anode member 23 and the cathode member 25 to a power source, a current flows from the anode member 23 to the heat sink conductive layer 222 to the submount 26 to the anode surface 271 of the laser diode element 27 to the cathode surface 272 of the laser diode element 27 to the conductive wire 28 to the cathode member 25. This applies a current to the laser diode element 27, and laser light L, which is emitted light, can be obtained. In addition, heat generated by the laser diode element 27 is dissipated to the heat sink 22 via the submount 26.

[0042] The laser module 20 is not limited to the structures shown in FIGS. 2 to 4 as long as it is configured to emit laser light L from the laser diode element 27 by edge emission. FIG. 5 is a cross-sectional view schematically illustrating another example of the configuration of the laser module according to the first embodiment. FIG. 5 shows a YZ cross section of the laser module 20A. In one example, the submount 26 may be eliminated from the configuration of the laser module 20 shown in FIGS. 2 to 4, and the anode surface 271 of the laser diode element 27 may be directly bonded to the heat sink conductive layer 222, as in the laser module 20A shown in FIG. 5. In this case, the anode surface 271 of the laser diode element 27 may be bonded to the upper surface of the heat sink conductive layer 222 using a conductive adhesive such as solder.

[0043] 2 to 5 are disposed on a flat portion 12 of the staircase structure of a base 11 as shown in FIG. 1 and fixed with screw members 41. The second members 232 of the anode members 23 of the laser modules 20-1 and 20-2 in the first module group MG1 and the second module group MG2 are connected to the fourth members 252 of the cathode members 25 of the other laser modules 20-1 and 20-2 adjacent thereto in the ascending or descending direction via connecting members 61. The fourth members 252 of the cathode members 25 of the laser modules 20-1 and 20-2 in the first module group MG1 and the second module group MG2 are connected to the second members 232 of the anode members 23 of the other laser modules 20-1 and 20-2 adjacent thereto in the descending or ascending direction via connecting members 61. However, the anode members 23 or cathode members 25 of the laser modules 20-1, 20-2 arranged at the ends in the ascending and descending directions are connected to a power source, and are not connected to the cathode members 25 or anode members 23 of the other laser modules 20. In this way, the multiple laser modules 20-1, 20-2 in the first module group MG1 and the second module group MG2 are electrically connected in series.

[0044] Fig. 6 is a side view of an example of a configuration of a portion of the laser device according to embodiment 1, as viewed from the Z-axis direction. Fig. 6 shows laser modules 20a, 20b, and 20c arranged adjacent to each other in the ascending or descending direction of a staircase structure. Note that when there is no need to distinguish between the laser modules 20a, 20b, and 20c, they will simply be referred to as laser module 20.

[0045] The laser device 10 has a plurality of laser modules 20, a connecting member 61 arranged between the anode member 23 and the cathode member 25 of adjacent laser modules 20 in the ascending or descending direction, and a screw member 62 that fixes the connecting member 61 to the anode member 23 or fixes the connecting member 61 to the cathode member 25.

[0046] FIG. 7 is a perspective view showing an example of the configuration of the connecting member. The connecting member 61 is made of a plate-shaped conductive material. Threaded holes 612L and 612H for threaded engagement with the screw members 62 are provided on contact surfaces 611a and 611b of the connecting member 61 that come into contact with the anode member 23 and the cathode member 25. The threaded hole 612L is used to fasten the connecting member 61 to the anode member 23 or the cathode member 25 of a laser module 20 that is placed on a flat portion 12 at a lower position. The threaded hole 612H is used to fasten the connecting member 61 to the cathode member 23 or the anode member 25 of a laser module 20 that is placed on a flat portion 12 at a higher position. That is, the threaded holes 612L and the threaded holes 612H are provided at different positions in the Y-axis direction. Two threaded holes 612L and two threaded holes 612H are provided, corresponding to the positions of the notches 252a of the cathode member 25 and the notches 232a of the anode member 23 in the Z-axis direction. The contact surface 611b is the surface on the opposite side of the contact surface 611a in the X-axis direction.

[0047] This will be explained using Fig. 6. In Fig. 6, when the contact surface 611a contacts the anode member 23 of the laser module 20a arranged on the flat portion 12 at a lower position and the contact surface 611b contacts the cathode member 25 of the laser module 20b arranged on the flat portion 12 at a higher position, the notch 232a of the anode member 23 of the laser module 20a arranged at a lower position and the screw hole 612L of the contact surface 611a are aligned and fixed with the screw member 62. Furthermore, the notch 252a of the cathode member 25 of the laser module 20b arranged at a higher position and the screw hole 612H of the contact surface 611b are aligned and fixed with the screw member 62.

[0048] In this way, by providing the screw holes 612L and 612H at different positions in the Y-axis direction in the connecting member 61, it is possible to absorb the difference in the fixing positions in the Y-axis direction of the screw members 62 when installing the laser modules 20a and 20b on the base 11 having a staircase structure. Also, by providing the screw holes 612L and 612H on the two contact surfaces 611a and 611b in the X-axis direction, the connecting member 61 can be fixed between the two laser modules 20a and 20b without having to worry about the arrangement direction of the connecting member 61.

[0049] The screw members 62 are threaded into the threaded holes 612L, 612H of the connecting member 61 through the notches 232a, 252a of the second member 232 of the anode member 23 or the fourth member 252 of the cathode member 25, thereby fixing the connecting member 61 to the second member 232 of the anode member 23 or the fourth member 252 of the cathode member 25. Fixing the connecting member 61 to the second member 232 or the fourth member 252 with the screw members 62 makes it possible to obtain electrical connection between the fourth members 252 or the second members 232 of two adjacent laser modules 20. Furthermore, fixation with the screw member 62 brings the second member 232 of the anode member 23 into surface contact with the contact surface 611a of the connection member 61, and the fourth member 252 of the cathode member 25 into surface contact with the contact surface 611b of the connection member 61, making it possible to pass a large current between the anode member 23 and the cathode member 25 of two adjacent laser modules 20. The screw member 62 corresponds to the second screw member.

[0050] In this way, connecting members 61 with a large contact area between the anode member 23 and the cathode member 25 of adjacent laser modules 20a, 20b are arranged between the anode member 23 and the cathode member 25 and firmly fixed with screw members 62, thereby connecting the multiple laser modules 20a, 20b in series. This makes it possible to reduce loss due to electrical resistance even when a large current flows. In other words, a large current can be passed through the laser modules 20a, 20b, thereby achieving a high-output laser device 10.

[0051] 6 is merely an example, and it is sufficient that the anode member 23 and the cathode member 25 are electrically connected between two adjacent laser modules 20a, 20b. In one example, the connecting member 61 may not be provided, and the anode member 23 and the cathode member 25 may be directly connected by a combination of a screw and a nut. That is, it is sufficient that the second member 232 of the anode member 23 and the fourth member 252 of the cathode member 25 can be connected to the fourth member 252 and the second member 232 of a different laser module 20 adjacent in the X-axis direction via the screw member 62, respectively. In this case, the second member 232 and the fourth member 252 may have openings other than the notches 232a, 252a.

[0052] A case where a specific laser module 20 is damaged in such a laser device 10 will be described. Here, it is assumed that laser module 20b in FIG. 6 is damaged. In this case, the screw member 62 that secures the connecting member 61 between laser module 20b and the laser module 20a adjacent in the descending direction of laser module 20b is loosened, and the connecting member 61 is removed. Similarly, the screw member 62 that secures the connecting member 61 between laser module 20b and the laser module 20c adjacent in the ascending direction of laser module 20b is loosened, and the connecting member 61 is removed. Then, the screw member 41 that secures laser module 20b to the base 11 is removed. The screw member 41 is a member that secures the mount member 21 of laser module 20b to the base 11. After the screw member 41 is loosened, laser module 20b is removed.

[0053] Next, a new laser module 20b is placed on the base 11 and fixed to the base 11 with the screw members 41. After that, a connecting member 61 is placed between the laser module 20b and the adjacent laser module 20a in the descending direction, and the connecting member 61 is fixed with the screw members 62 between the cathode member 25 of the laser module 20b and the anode member 23 of the laser module 20a. Similarly, a connecting member 61 is placed between the laser module 20c in the ascending direction, and the connecting member 61 is fixed with the screw members 62 between the anode member 23 of the laser module 20b and the cathode member 25 of the laser module 20c. This makes it possible to replace only the damaged laser module 20b of the laser device 10. By forming the openings of the second member 232 and the fourth member 252 as the cutouts 232a and 252a, respectively, wiring between the laser modules 20a and 20b and attaching and detaching the laser module 20b can be easily performed.

[0054] The laser module 20, 20A according to the first embodiment includes an anode member 23 configured of a conductive member having an L-shaped XY cross section, the anode member 23 being made up of a first member 231 parallel to the ZX plane and a second member 232 parallel to the YZ plane, and a cathode member 25 configured of a conductive member having an L-shaped XY cross section, the cathode member 25 being made up of a third member 251 parallel to the ZX plane and a fourth member 252 parallel to the YZ plane, the cathode member 25 being made up of a conductive member having an L-shaped XY cross section, the cathode member 25 being made up of a third member 251 parallel to the ZX plane and a fourth member 252 parallel to the YZ plane, and the second member 232 is positioned at both ends of the laser module 20, 20A in the X-axis direction. The second member 232 and the fourth member 252 have openings that allow connection via screw members 62 to the fourth member 252 and the second member 232 of different laser modules 20, 20A adjacent to each other in the X-axis direction in the laser device 10. This simplifies the wiring between the laser modules 20, 20A when multiple laser modules 20, 20A are connected in series, and reduces loss due to electrical resistance.

[0055] Alternatively, a connecting member 61 is disposed between the second member 232 of the anode member 23 and the fourth member 252 of the cathode member 25 of adjacent laser modules 20, 20A, and the connecting member 61 is fixed to the second member 232 and the fourth member 252 via the notches 232a, 252a. The second member 232 of the anode member 23 and the fourth member 252 of the cathode member 25 have plate-like structures, and the connecting member 61 is fixed so as to contact the entire surfaces of the second member 232 and the fourth member 252. This increases the contact area when wiring between adjacent laser modules 20, 20A. This facilitates ensuring a contact surface between the anode member 23 and the cathode member 25 of two adjacent laser modules 20, 20A, thereby reducing electrical resistance loss due to wiring. Furthermore, the connecting member 61 is fixed to the anode member 23 and the cathode member 25 with screw members 62, facilitating wiring between two adjacent laser modules 20, 20A. Furthermore, each laser module 20, 20A can be easily removed or installed. That is, in a laser device 10 in which a plurality of laser modules 20, 20A are arranged, the laser device 10 has a structure that allows easy replacement of only the target laser module 20, 20A, and has the effect of reducing electrical resistance loss when a large current is applied compared to conventional devices.

[0056] Furthermore, compared to Patent Document 1, it is possible to simplify the wiring between the multiple laser modules 20, 20A while allowing a large current to flow through the laser modules 20, 20A, which also has the effect of enabling a high-output laser device 10 to be obtained.

[0057] Embodiment 2 In the laser module 20 according to the first embodiment, the heat sink structure is fixed to the mount material 21 by an insulating bushing 29 and a screw member 30. When the screw member 30 is used for fixing via the insulating bushing 29, stress is concentrated around the head of the screw member 30, which may cause the laminated region of the anode member 23, the insulating sheet 24, the cathode member 25, and the heat sink 22 to bend, or may cause a portion of the laminate of the heat sink 22, the anode member 23, the insulating sheet 24, and the cathode member 25 to peel off and float up. In the second embodiment, a laser module 20 that can solve these problems will be described.

[0058] FIG. 8 is a cross-sectional view schematically illustrating an example of the configuration of a laser module according to the second embodiment. FIG. 8 illustrates a YZ cross-section of a laser module 20B. The same components as those in the first embodiment are denoted by the same reference numerals, and their description will be omitted. The laser module 20B according to the second embodiment further includes a presser plate 33 on the negative electrode member 25. The area of ​​the presser plate 33 in contact with the third member 251 of the negative electrode member 25 is larger than the area of ​​the screw head of the screw member 30 in the ZX plane. It is desirable that the presser plate 33 has the same shape and area in the ZX plane as the third member 251 of the negative electrode member 25. The expression "the areas of the presser plate 33 and the third member 251 of the negative electrode member 25 are the same in the ZX plane" does not necessarily mean that the areas are exactly the same, but also includes cases where they are considered to be the same within a margin of error. The presser plate 33 has a through-hole at a position corresponding to the screw hole 212 of the mounting member 21. The through-hole of the presser plate 33 penetrates the presser plate 33 in the thickness direction, i.e., in the Y-axis direction. By adding such a pressing plate 33, the laminate of the heat sink 22, the anode member 23, the insulating sheet 24, and the cathode member 25 can be pressed evenly from the positive direction of the Y axis by the fastening force of the screw member 30. The pressing plate 33 is made of an insulating material, for example.

[0059] The laser module 20B of the second embodiment further includes a retaining plate 33 on the cathode member 25. The retaining plate 33 has a through-hole that is larger than the area of ​​the screw head of the screw member 30 and that is positioned corresponding to the screw hole 212 in the mount member 21. A stack including the heat sink 22, the anode member 23, the insulating sheet 24, and the cathode member 25 is fixed to the mount member 21 by the screw member 30 from above the retaining plate 33. When the screw member 30 is tightened, the fastening force of the screw member 30 can uniformly press the stack across the entire surface of the retaining plate 33. In other words, the anode member 23 can be uniformly pressed via the cathode member 25 and the insulating sheet 24, thereby improving the contact between the anode member 23 and the heat sink conductive layer 222 compared to the first embodiment. As a result, an effect of reducing contact resistance loss compared to the first embodiment can be obtained in addition to the effect of the first embodiment.

[0060] Embodiment 3 The conductive wire 28 connecting the negative electrode member 25 and the laser diode element 27 is very thin and vulnerable to contact. If the conductive wire 28 is touched, it can easily break or collapse. Therefore, in the third embodiment, a laser module 20 capable of protecting the conductive wire 28 from contact will be described.

[0061] FIG. 9 is a cross-sectional view schematically illustrating an example of the configuration of a laser module according to the third embodiment. FIG. 9 illustrates a YZ cross section of a laser module 20C. The same components as those in the first and second embodiments are denoted by the same reference numerals, and their description will be omitted. In the laser module 20C according to the third embodiment, the presser plate 33 has a flange 331 protruding from its upper portion on the laser diode element 27 side. The flange 331 has an area sufficient to cover at least the area in which the conductive wire 28 is disposed. The flange 331 is positioned and has a thickness sufficient to avoid contact with the upper portion of the conductive wire 28. With this configuration, the upper portion of the conductive wire 28 is covered by the flange 331 of the presser plate 33, thereby preventing an operator from coming into contact with the conductive wire 28 when replacing the laser module 20C.

[0062] In the third embodiment, a pressing plate 33 is used that has a flange 331 that covers the area where the conductive wire 28 is arranged. This protects the conductive wire 28 and prevents contact with the outside, thereby achieving the effect of reducing resistance loss caused by crushing or cutting of the conductive wire 28 in addition to the effect of the first and second embodiments.

[0063] Embodiment 4 In the first embodiment, laser light L is emitted from the end face on the positive side of the Z axis of the laser diode element 27, and leakage light Lr is emitted from the rear end face, which is the surface on the negative side of the Z axis opposite to this end face. When the insulating sheet 24 is made of a polymer material, outgassing occurs when the polymer material is irradiated with leakage light Lr. It is known that when silicon-based outgassing occurs, the outgassed siloxane penetrates electrical contacts and forms an insulating film such as SiO2, making it difficult for electricity to flow, i.e., electrical resistance increases. For this reason, it is necessary to minimize the generation of outgassing due to irradiation of leakage light Lr onto polymer materials. In the fourth embodiment, a laser module 20 that minimizes the generation of outgassing due to irradiation of leakage light Lr onto polymer materials will be described.

[0064] FIG. 10 is a cross-sectional view schematically illustrating an example of the configuration of a laser module according to the fourth embodiment. FIG. 10 illustrates a YZ cross section of a laser module 20D. The same components as those in the first embodiment are denoted by the same reference numerals, and their description will be omitted. In the laser module 20D according to the fourth embodiment, it is assumed that the insulating sheet 24 is made of a polymer material. In the laser module 20D according to the fourth embodiment, the anode member 23 further includes a fifth member 233 disposed between the end face of the insulating sheet 24 in the positive direction of the Z axis and the rear end face of the laser diode element 27. In one example, the fifth member 233 is a plate-like member parallel to the XY plane. In one example, the anode member 23 has a structure in which the end of the first member 231 in the Z axis direction is bent toward the positive direction of the Y axis. The bent portion corresponds to the fifth member 233. Although the fifth member 233 is formed by bending the first member 231 here, the fifth member 233 may be joined by welding or other methods to the end of the first member 231 in the positive direction of the Z axis. The fifth member 233 is arranged so as not to come into contact with the negative electrode member 25. By providing the fifth member 233 so as to block the gap between the rear end face of the laser diode element 27 and the insulating sheet 24 in this way, leakage light Lr from the rear end face of the laser diode element 27 does not reach the insulating sheet 24, thereby suppressing the generation of outgassing. The fifth member 233 corresponds to a light-blocking member.

[0065] Furthermore, a surface 233a of the fifth member 233 facing the rear end face of the laser diode element 27 may be subjected to a surface treatment having a light-absorbing function. Examples of the surface treatment include black plating, black painting, providing an oxide film, and roughening the surface by blasting. When the anode member 23 is made of aluminum, the oxide film can be provided by black anodizing. By performing a surface treatment having a light-absorbing function, it is possible to absorb leaked light Lr from the rear end face of the laser diode element 27.

[0066] FIG. 10 illustrates an example in which the anode member 23 is used to shield the gap between the rear end face of the laser diode element 27 and the insulating sheet 24. However, the configuration is not limited to that illustrated in FIG. 10 as long as it can block the leakage light Lr irradiated from the rear end face of the laser diode element 27 to the insulating sheet 24. FIG. 11 is a cross-sectional view schematically illustrating another example of the configuration of a laser module according to the fourth embodiment. FIG. 11 illustrates a YZ cross section of a laser module 20E. In the laser module 20E illustrated in FIG. 11, the cathode member 25 further includes a sixth member 253 disposed between the laser diode element 27 and the end face of the insulating sheet 24 in the positive direction of the Z axis. In one example, the sixth member 253 is a plate-like member parallel to the XY plane. In one example, the cathode member 25 has a structure in which the end of the third member 251 in the Z axis direction is bent toward the negative direction of the Y axis. The bent portion corresponds to the sixth member 253. Although the sixth member 253 is formed by bending the third member 251 here, the sixth member 253 may be joined by welding or other methods to the end of the third member 251 in the positive direction of the Z axis. The sixth member 253 is arranged so as not to come into contact with the anode member 23 and the heat sink conductive layer 222. Even in this case, a surface 253a of the sixth member 253 facing the laser diode element 27 may be subjected to a surface treatment having a light-absorbing function. The sixth member 253 corresponds to a light-shielding member.

[0067] In the fourth embodiment, a light-shielding member that blocks leaked light Lr from the rear end face of the laser diode element 27 is provided between the rear end face of the laser diode element 27 and the insulating sheet 24. In one example, the anode member 23 has a fifth member 233 that is arranged between the rear end face of the laser diode element 27 and the insulating sheet 24. Alternatively, the cathode member 25 has a sixth member 253 that is arranged between the rear end face of the laser diode element 27 and the insulating sheet 24. This prevents the leaked light Lr from the rear end face of the laser diode element 27 from reaching the insulating sheet 24, and suppresses poor electrical contact caused by outgassing that occurs when the leaked light Lr hits the polymer material, thereby reducing resistance loss.

[0068] Furthermore, by performing a surface treatment with a light-absorbing function on the surface facing the rear end face of the laser diode element 27, it is possible to further enhance the effect of preventing leakage light Lr from the rear end face of the laser diode element 27 from reaching the insulating sheet 24. Furthermore, since the leakage light Lr is blocked from being irradiated onto the insulating sheet 24, it is possible to use an insulating polymer material for the insulating sheet 24, which is cheaper than an insulating ceramic material.

[0069] Embodiment 5. The laser device 10 equipped with the laser modules 20-20E described in the first to fourth embodiments can be used as a light source for a laser processing device. Fig. 12 is a diagram schematically showing an example of the configuration of a laser processing device according to the fifth embodiment. The laser processing device 70 includes the laser device 10, an optical fiber 71, and a processing head 72.

[0070] The laser device 10 emits laser light Lx. The laser device 10 has a configuration as shown in Fig. 1. That is, the laser device 10 emits laser light Lx obtained by combining laser light L emitted from individual laser modules 20. Note that the laser modules 20 constituting the laser device 10 may be the laser modules 20A-20E described in the first to fourth embodiments.

[0071] The optical fiber 71 transmits the combined laser light Lx emitted from the laser device 10 to the processing head 72.

[0072] The processing head 72 collects the laser light Lx coupled from the optical fiber 71 and irradiates it onto the workpiece. The processing head 72 includes a focusing optical system that collects the laser light Lx transmitted through the optical fiber 71 and irradiates it onto the workpiece. During processing, the processing head 72 is positioned opposite the position on the workpiece that is to be processed.

[0073] A laser processing apparatus 70 according to a fifth embodiment includes a laser device 10 having a plurality of laser modules 20-20E, each of which has an anode member 23 formed of a conductive member having an L-shaped XY cross section, the anode member 23 being made up of a first member 231 parallel to the ZX plane and a second member 232 parallel to the YZ plane, and a cathode member 25 formed of a conductive member having an L-shaped XY cross section, the cathode member 25 being made up of a third member 251 parallel to the ZX plane and a fourth member 252 parallel to the YZ plane, the second member 232 and the fourth member 252 being positioned at both ends of the laser module 20-20E in the X-axis direction. The laser device 10 has a plurality of laser modules 20-20E arranged in the X-axis direction, and the anode member 23 and the cathode member 25 of adjacent laser modules 20-20E are fixed to each other via a connecting member 61. This makes it easier to ensure contact surfaces in the wiring between the anode members 23 and cathode members 25 of two adjacent laser modules 20-20E, reducing electrical resistance loss due to the wiring. This reduces electrical resistance loss when a large current is applied compared to conventional techniques, making it possible to perform laser processing using high-power laser light Lx. Furthermore, even if a laser module 20-20E constituting the laser device 10 is damaged, the laser processing device 70 can be used by simply replacing the damaged laser module 20-20E. In other words, damage to one laser module 20-20E does not require the entire laser device 10 to be discarded, and the laser device 10 can be used for a long period of time.

[0074] In the above example, the anode member 23, the insulating sheet 24, and the cathode member 25 are stacked in this order on the electrode arrangement region R1 of the heatsink conductive layer 222. However, the cathode member 25, the insulating sheet 24, and the anode member 23 may be stacked in this order on the electrode arrangement region R1 of the heatsink conductive layer 222. In this case, the surface of the laser diode element 27 facing the heatsink 22 serves as the cathode, i.e., the N-type semiconductor element, and the upper surface serves as the anode, i.e., the P-type semiconductor element. In this case, the cathode member 25 corresponds to the first electrode member, and the anode member 23 corresponds to the second electrode member. The cathode surface 272 corresponds to the first electrode surface, and the anode surface 271 corresponds to the second electrode surface.

[0075] The configurations shown in the above embodiments are merely examples, and may be combined with other known technologies, or different embodiments may be combined with each other. It is also possible to omit or modify parts of the configurations as long as they do not deviate from the gist of the invention.

[0076] Various aspects of the present disclosure are summarized below as appendices.

[0077] [Appendix 1] A laser module used in a laser device in which each of a plurality of laser modules is fixed to a base member by a respective first screw member, a heat sink having a conductive layer disposed on a side on which components constituting the laser module are placed, the heat sink suppressing a temperature rise of the components; a first electrode member disposed in a first region of the conductive layer; an insulating layer disposed on the first electrode member; a second electrode member disposed on the insulating layer; a laser diode element disposed in a second region different from the first region of the conductive layer, the laser diode element having a first electrode surface on the heat sink side and a second electrode surface on the opposite side to the first electrode surface; a conductive wire electrically connecting the second electrode member and the second electrode surface; a heat sink structure comprising: When the direction in which the laser light is emitted from the laser diode element is defined as a Z-axis direction, the direction in which the members are stacked on the heat sink is defined as a Y-axis direction, and the direction perpendicular to both the Z-axis direction and the Y-axis direction is defined as an X-axis direction, the first electrode member has a plate-like first member parallel to the ZX plane and disposed in the first region, and a plate-like second member parallel to the YZ plane, and has an L-shaped XY cross section; the second electrode member has a plate-like third member parallel to the ZX plane and disposed on the first member with the insulating layer interposed therebetween, and a plate-like fourth member parallel to the YZ plane, and has an L-shaped XY cross section; the second member and the fourth member are disposed on both sides of the insulating layer in the X-axis direction, The laser module is characterized in that the second member and the fourth member each have an opening that can be connected to the fourth member and the second member of a different laser module adjacent to the laser module in the X-axis direction via a second screw member. [Appendix 2] 2. The laser module according to claim 1, wherein the openings in the second member of the first electrode member and the fourth member of the second electrode member are notches. [Appendix 3] a connecting member made of a plate-shaped conductive material and arranged between the fourth member of another laser module adjacent in the X-axis direction or the second member of another laser module, The laser module according to claim 1 or 2, wherein the connecting member is fixed to the second member or the fourth member by the second screw member. [Appendix 4] The laser module described in any one of appendices 1 to 3, characterized in that the third member of the second electrode member, the insulating layer, the first member of the first electrode member, and the first region of the heat sink have through holes penetrating in the Y-axis direction, and the heat sink structure is fixed to a mounting material by a third screw member inserted into the through hole. [Appendix 5] 5. The laser module according to claim 4, wherein the third screw member is made of an insulating material. [Appendix 6] The laser module described in Appendix 4, further comprising an insulating bushing extending from the third member of the second electrode member to at least the insulating layer and disposed in the through hole. [Appendix 7] a pressing plate disposed on the third member of the second electrode member; 7. The laser module according to claim 4, wherein the area of ​​the retaining plate in contact with the third member is larger than the area of ​​the screw head of the third screw member. [Appendix 8] 8. The laser module according to claim 7, wherein the pressure plate has a rib portion that covers at least the area where the conductive wire is arranged. [Appendix 9] the insulating layer is made of a polymer material; 9. The laser module according to claim 1, further comprising a plate-shaped light-shielding member parallel to the XY plane and disposed between the insulating layer and the laser diode element. [Appendix 10] 10. The laser module according to claim 9, wherein the surface of the light-shielding member facing the rear end face of the laser diode element is subjected to a surface treatment having a light-absorbing function. [Appendix 11] the base member; a module group in which two or more laser modules according to any one of Supplementary Notes 1 to 10 are arranged adjacent to each other in the X-axis direction on the base member; a combining optical system that combines the laser beams emitted from the laser modules of the module group and outputs the combined laser beams; Equipped with A laser device, characterized in that the second member and the fourth member of two laser modules arranged adjacent to each other in the X-axis direction are connected by the second screw member. [Appendix 12] a laser device according to claim 11; an optical fiber that transmits the combined laser light emitted from the laser device; a processing head that focuses the laser light coupled from the optical fiber and irradiates the light toward a workpiece; A laser processing device comprising: [Explanation of symbols]

[0078] 10 laser device, 11 base, 12 flat portion, 13 step portion, 20, 20-1, 20-2, 20A, 20B, 20C, 20D, 20E, 20a, 20b, 20c laser module, 21 mounting material, 22 heat sink, 23 anode member, 24 insulating sheet, 25 cathode member, 26 submount, 27 laser diode element, 28 conductive wire, 29 insulating bushing, 30, 41, 62 screw member, 31 first optical element, 32 second optical element, 33 retainer plate, 50 coupling optical system, 51, 52 mirror, 53 optical coupling element, 61 connecting member, 70 laser processing device, 71 optical fiber, 72 processing head, 211 through hole, 212, 612L, 612H screw hole, 221 refrigerant flow path layer, 222 Heat sink conductive layer, 231 first member, 232 second member, 232a, 252a notch portion, 233 fifth member, 251 third member, 252 fourth member, 253 sixth member, 271 anode surface, 272 cathode surface, 331 flange portion, 611a, 611b contact surface, L, L1, L2, Lx laser light, Lr leakage light, MG1 first module group, MG2 second module group, R1 electrode arrangement area, R2 element arrangement area.

Claims

1. A laser module used in a laser device in which each of a plurality of laser modules is fixed to a base member by a respective first screw member, a heat sink having a conductive layer disposed on a side on which components constituting the laser module are placed, the heat sink suppressing a temperature rise of the components; a first electrode member disposed in a first region of the conductive layer; an insulating layer disposed on the first electrode member; a second electrode member disposed on the insulating layer; a laser diode element disposed in a second region different from the first region of the conductive layer, the laser diode element having a first electrode surface on the heat sink side and a second electrode surface on the opposite side to the first electrode surface; a conductive wire electrically connecting the second electrode member and the second electrode surface; a heat sink structure comprising: When the direction in which the laser light is emitted from the laser diode element is defined as a Z-axis direction, the direction in which the members are stacked on the heat sink is defined as a Y-axis direction, and the direction perpendicular to both the Z-axis direction and the Y-axis direction is defined as an X-axis direction, the first electrode member has a plate-like first member parallel to the ZX plane and disposed in the first region, and a plate-like second member parallel to the YZ plane, and has an L-shaped XY cross section; the second electrode member has a plate-like third member parallel to the ZX plane and disposed on the first member with the insulating layer interposed therebetween, and a plate-like fourth member parallel to the YZ plane, and has an L-shaped XY cross section; the second member and the fourth member are disposed on both sides of the insulating layer in the X-axis direction, The laser module is characterized in that the second member and the fourth member each have an opening that can be connected to the fourth member and the second member of a different laser module adjacent to the second member in the X-axis direction via a second screw member.

2. 2. The laser module according to claim 1, wherein the openings in the second member of the first electrode member and the fourth member of the second electrode member are notches.

3. a connecting member made of a plate-shaped conductive material and arranged between the fourth member of another laser module adjacent in the X-axis direction or the second member of another laser module, 2. The laser module according to claim 1, wherein the connecting member is fixed to the second member or the fourth member by the second screw member.

4. 2. The laser module according to claim 1, wherein the third member of the second electrode member, the insulating layer, the first member of the first electrode member, and the first region of the heat sink have through holes penetrating in the Y-axis direction, and the heat sink structure is fixed to a mounting material by a third screw member inserted into the through hole.

5. 5. The laser module according to claim 4, wherein the third screw member is made of an insulating material.

6. 5. The laser module according to claim 4, further comprising an insulating bushing that extends from the third member of the second electrode member to at least the insulating layer and is disposed in the through hole.

7. a pressing plate disposed on the third member of the second electrode member; 5. The laser module according to claim 4, wherein the area of ​​said retainer plate in contact with said third member is larger than the area of ​​the head of said third screw member.

8. 8. The laser module according to claim 7, wherein the pressing plate has a rib portion that covers at least an area where the conductive wires are arranged.

9. the insulating layer is made of a polymer material; 2. The laser module according to claim 1, further comprising a plate-shaped light-shielding member parallel to the XY plane, which is disposed between the insulating layer and the laser diode element.

10. 10. The laser module according to claim 9, wherein a surface treatment having a light-absorbing function is applied to the surface of the light-shielding member that faces the rear end face of the laser diode element.

11. the base member; a module group in which two or more laser modules according to any one of claims 1 to 10 are arranged adjacent to each other in an X-axis direction on the base member; a combining optical system that combines the laser beams emitted from the laser modules of the module group and outputs the combined laser beams; Equipped with A laser device, characterized in that the second member and the fourth member of two laser modules arranged adjacent to each other in the X-axis direction are connected by the second screw member.

12. The laser device according to claim 11; an optical fiber that transmits the combined laser light emitted from the laser device; a processing head that focuses the laser light coupled from the optical fiber and irradiates the light toward a workpiece; A laser processing device comprising:

Images