Working system

Abstract

To provide a working system which can suitably process an object.SOLUTION: Provided is a working system which comprises: a working device for working an object; a rotation device for rotating a holding part for holding the object; a movement device for moving at least either the working device or the holding part; a measurement device for measuring at least a part of the object held by the holding part; and a control device for controlling the movement device and the rotation device based on the measurement result from the measurement device and rotating the holding part to move at least either the working device or the holding part.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to the technical field of processing systems for processing objects, for example. [Background technology]

[0002] An example of a processing system for processing an object is described in Patent Document 1. In such a processing system, a technical challenge is to process the object appropriately. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] US Patent Application Publication No. 2014 / 0197576 Summary of the Invention

[0004] According to a first aspect, there is provided a processing system for processing an object, comprising: a processing device for processing the object; a rotation device for rotating a holding unit that holds the object; a moving device for moving at least one of the processing device and the holding unit; a measuring device for measuring at least a portion of the object held in the holding unit; and a control device that controls the moving device and the rotation device based on the measurement results of the measuring device to rotate the holding unit and move at least one of the processing device and the holding unit.

[0005] According to a second aspect, there is provided a processing system for processing an object, comprising: a processing device that irradiates an energy beam onto the object to process the object; a moving device that moves at least one of the irradiation position of the energy beam and the object; a rotating device that rotates a holding part that holds the object; a measuring device that measures at least a part of the object; and a control device that controls the moving device and the rotating device based on the measurement results of the measuring device to rotate the object and move at least one of the irradiation position and the object.

[0006] According to a third aspect, there is provided a processing system for processing an object, comprising: a processing device for processing the object; a rotation device for rotating a holding unit that holds the object; a moving device for moving at least one of the processing device and the holding unit; a measuring device for measuring at least a portion of the object held in the holding unit; and a control device for acquiring the relationship between the object held in the holding unit and the rotation axis of the rotation device based on the measurement results of the measuring device.

[0007] According to a fourth aspect, there is provided a processing system for processing an object, the processing system comprising: a processing device for processing the object; a holding unit having a first surface on which the object is placed and a second surface different from the first surface; and a cooling device for cooling the second surface.

[0008] According to a fifth aspect, there is provided a processing system for processing an object, the processing system comprising: a processing device for processing the object; a holding unit having a first surface on which the object is placed and a second surface different from the first surface; and a gas supply device for supplying gas to a space facing the second surface.

[0009] The functions and other advantages of the present invention will become apparent from the following detailed description of the preferred embodiments. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a block diagram showing the system configuration of the machining system according to the first embodiment. [Figure 2] FIG. 2 is a cross-sectional view showing the structure of the processing system of the first embodiment. [Figure 3] FIG. 3 is a cross-sectional view showing the structure of the processing system of the first embodiment. [Figure 4] Each of FIGS. 4(a) to 4(e) is a cross-sectional view showing a state in which a certain area on a workpiece is irradiated with processing light and a modeling material is supplied. [Figure 5]Each of Figures 5(a) to 5(c) is a cross-sectional view showing the process of forming a three-dimensional structure. [Figure 6] FIG. 6 is a flowchart showing the flow of the coordinate matching operation. [Figure 7] FIG. 7 is a plan view showing a stage on which alignment marks are formed. [Figure 8] FIG. 8 is a cross-sectional view of the stage shown in FIG. 7 taken along the line VII-VII'. [Figure 9] FIG. 9 is a plan view showing a calibration plate on which alignment marks are formed. [Figure 10] FIG. 10 is a cross-sectional view of the calibration plate shown in FIG. 9 taken along the line IX-IX'. [Figure 11] FIG. 11 is a plan view showing the calibration plate placed on the stage. [Figure 12] FIG. 12 is a plan view showing the calibration plate irradiated with processing light. [Figure 13] FIG. 13 shows a workpiece supported by a stage so that the eccentricity, which is the amount of deviation between the rotation axis of the stage and the ideal rotation axis of the workpiece, is zero. [Figure 14] Figure 14(a) shows the movement trajectory of the target irradiation area on the workpiece during a period when the stage is rotating around a rotation axis parallel to the Z axis with zero eccentricity, Figure 14(b) shows the movement trajectory of the target irradiation area on the workpiece during a period when the stage is rotating around a rotation axis inclined with respect to the Z axis with zero eccentricity, and Figure 14(c) shows the movement trajectory of the target irradiation area on the workpiece during a period when the stage is rotating around a rotation axis perpendicular to the Z axis with zero eccentricity. [Figure 15] FIG. 15 shows a workpiece supported by a stage so that the eccentricity, which is the amount of deviation between the rotation axis of the stage and the ideal rotation axis of the workpiece, is not zero. [Figure 16]Figures 16(a) and 16(b) show the relative positional relationship between the workpiece supported by a stage rotating around a rotation axis parallel to the Z axis with the eccentricity not being zero, and the machining head. [Figure 17] Figures 17(a) and 17(b) show the relative positional relationship between the workpiece supported by a stage rotating around a rotation axis tilted with respect to the Z axis with the eccentricity not being zero, and the machining head. [Figure 18] Figures 18(a) and 18(b) show the relative positional relationship between the workpiece supported by a stage rotating around a rotation axis perpendicular to the Z axis with the eccentricity not being zero, and the machining head. [Figure 19] FIG. 19 is a block diagram showing an irradiation optical system equipped with a galvanometer mirror. [Figure 20] FIG. 20 is a flowchart showing the flow of the eccentricity amount obtaining operation. [Figure 21] FIG. 21 is a flowchart showing the flow of the operation for calculating the rotation axis of the stage in step S21 of FIG. [Figure 22] FIG. 22 is a flowchart showing the flow of the operation for calculating the rotation axis of the workpiece in step S22 of FIG. [Figure 23] FIG. 23 is a block diagram showing the system configuration of the machining system according to the second embodiment. [Figure 24] FIG. 24 is a cross-sectional view showing the structure of the processing system of the second embodiment. [Figure 25] FIG. 25 is a block diagram showing the system configuration of the machining system according to the third embodiment. [Figure 26] FIG. 26 is a cross-sectional view showing the structure of the processing system of the third embodiment. [Figure 27] FIG. 27 is a block diagram showing the system configuration of the machining system according to the fourth embodiment. [Figure 28] FIG. 28 is a cross-sectional view showing an example of the structure of the cooling device of the fourth embodiment. [Figure 29]FIG. 29 is a plan view showing an example of a calibration plate. [Figure 30] FIG. 30 is a plan view showing an example of a calibration plate. [Figure 31] FIG. 31 is a plan view showing an example of a calibration plate. [Figure 32] FIG. 32 is a plan view showing an example of the calibration pattern. [Figure 33] FIG. 33 is a plan view showing an example of the calibration pattern. [Figure 34] FIG. 34 is a plan view showing an example of the calibration pattern. [Figure 35] 35(a) and 35(b) are a plan view and a perspective view showing the stage. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, a machining system SYS, which is one embodiment of a machining system, will be described with reference to the drawings. In the following description, the positional relationships of various components constituting the machining system SYS will be described using an XYZ Cartesian coordinate system defined by mutually orthogonal X-, Y-, and Z-axes. For convenience of explanation, the following description assumes that the X-axis direction and the Y-axis direction are horizontal (i.e., a predetermined direction within a horizontal plane) and the Z-axis direction is vertical (i.e., a direction perpendicular to the horizontal plane, which is essentially the up-down direction or the direction of gravity). Furthermore, the rotation directions around the X-axis, Y-axis, and Z-axis (in other words, the tilt directions) are referred to as the θX direction, the θY direction, and the θZ direction, respectively. Here, the Z-axis direction may be the direction of gravity. Furthermore, the XY plane may be horizontal.

[0012] (1) Machining system SYS of the first embodiment First, a processing system SYS of a first embodiment (hereinafter, the processing system SYS of the first embodiment will be referred to as the "processing system SYSa") will be described. The processing system SYSa of the first embodiment is a processing system capable of forming a three-dimensional structure ST by performing additive processing. The processing system SYSa can form the three-dimensional structure ST by performing additive processing based on, for example, laser metal deposition (LMD). Laser metal deposition (LMD) may also be referred to as direct metal deposition, direct energy deposition, laser cladding, laser engineered net shaping, direct light fabrication, laser consolidation, shape deposition manufacturing, wire-feed laser deposition, gas-through-wire, laser powder fusion, laser metal forming, selective laser powder remelting, laser direct casting, laser powder deposition, laser additive manufacturing, or laser rapid forming. However, the processing system SYSa may form the three-dimensional structure ST by performing additive processing based on other additive processing methods.

[0013] The structure and operation of the machining system SYSa that performs such additional machining will be described below.

[0014] (1-1) Structure of the processing system SYSa First, the structure of the machining system SYSa of the first embodiment will be described with reference to Fig. 1 to Fig. 3. Fig. 1 is a system configuration diagram showing the system configuration of the machining system SYSa of the first embodiment. Fig. 2 and Fig. 3 are cross-sectional views each showing a schematic structure of the machining system SYSa of the first embodiment.

[0015] The processing system SYSa is capable of forming a three-dimensional structure ST (i.e., a three-dimensional object having size in all three directions, i.e., a solid object, i.e., an object having size in the X-axis, Y-axis, and Z-axis directions). The processing system SYSa is capable of forming the three-dimensional structure ST on a workpiece W, which serves as a base (i.e., a base material) for forming the three-dimensional structure ST. The processing system SYSa is capable of forming the three-dimensional structure ST by performing additive processing on the workpiece W. If the workpiece W is a stage 31 described below, the processing system SYSa is capable of forming the three-dimensional structure ST on the stage 31. If the workpiece W is a mounted object, which is an object placed on the stage 31, the processing system SYSa is capable of forming the three-dimensional structure ST on the mounted object. In this case, the processing system SYSa may form the three-dimensional structure ST integrated with the mounted object. The operation of forming the three-dimensional structure ST integrated with the mounted object is equivalent to the operation of adding a new structure to the mounted object. Alternatively, the processing system SYSa may form a three-dimensional structure ST that can be separated from the object. The object placed on the stage 31 may be another three-dimensional structure ST (i.e., an existing structure) formed by the processing system SYSa. In the following, an example will be described in which the workpiece W is the object placed on the stage 31.

[0016] As described above, the processing system SYSa can form a molded object by laser build-up welding. In other words, the processing system SYSa can also be said to be a 3D printer that forms an object using additive manufacturing technology. Note that additive manufacturing technology may also be called rapid prototyping, rapid manufacturing, or additive manufacturing.

[0017] The processing system SYSa processes a modeling material M with processing light EL to form a model. The modeling material M is a material that can be melted by irradiation with processing light EL of a predetermined intensity or higher. For example, at least one of a metallic material and a resinous material can be used as the modeling material M. However, materials other than metallic materials and resinous materials may also be used as the modeling material M. The modeling material M is a powdered or granular material. In other words, the modeling material M is a powdered or granular material. However, the modeling material M does not have to be a powdered or granular material. For example, at least one of a wire-shaped modeling material and a gaseous modeling material may be used as the modeling material M.

[0018] 1 to 3 , in order to form the three-dimensional structure ST, the processing system SYSa includes a material supply source 1, a processing unit 2, a stage unit 3, a measuring device 4, a light source 5, a gas supply source 6, and a control device 7. The processing unit 2, the stage unit 3, and the measuring device 4 may be housed in the internal space of a housing 8.

[0019] The material supply source 1 supplies the modeling material M to the processing unit 2. The material supply source 1 supplies a desired amount of modeling material M according to the required amount so that the amount of modeling material M required per unit time to form a three-dimensional structure ST is supplied to the processing unit 2.

[0020] The processing unit 2 processes the modeling material M supplied from the material supply source 1 to form a three-dimensional structure ST. In order to form the three-dimensional structure, the processing unit 2 includes a processing head 21 and a head drive system 22. Furthermore, the processing head 21 includes an irradiation optical system 211 and a material nozzle (i.e., a supply system that supplies the modeling material M) 212. The processing head 21 may also be referred to as a processing device.

[0021] The irradiation optical system 211 is an optical system (e.g., a focusing optical system) for emitting the processing light EL from the emission unit 213. Specifically, the irradiation optical system 211 is optically connected to the light source 5 that emits the processing light EL via an optical transmission member 51 such as an optical fiber or a light pipe. The irradiation optical system 211 emits the processing light EL propagated from the light source 5 via the optical transmission member 51. The irradiation optical system 211 irradiates the processing light EL downward (i.e., toward the -Z side) from the irradiation optical system 211. A stage 31 is disposed below the irradiation optical system 211. When a workpiece W is placed on the stage 31, the irradiation optical system 211 irradiates the processing light EL toward the workpiece W. For this reason, the irradiation optical system 211 may also be referred to as an irradiation device. Specifically, the irradiation optical system 211 can irradiate the processing light EL to a target irradiation area EA that is set on or near the workpiece W as an area to be irradiated (typically, condensed) with the processing light EL. Furthermore, the state of the irradiation optical system 211 can be switched between a state in which the processing light EL is irradiated onto the target irradiation area EA and a state in which the processing light EL is not irradiated onto the target irradiation area EA under the control of the control device 7. The direction of the processing light EL emitted from the irradiation optical system 211 is not limited to directly downward (i.e., coinciding with the -Z-axis direction), and may be, for example, a direction inclined by a predetermined angle with respect to the Z-axis.

[0022] The material nozzle 212 has a supply outlet 214. The material nozzle 212 supplies (e.g., ejects, jets, or sprays) the modeling material M from the supply outlet 214. The material nozzle 212 is physically connected to a material supply source 1, which is a supply source of the modeling material M, via a supply pipe 11 and a mixer 12. The material nozzle 212 supplies the modeling material M supplied from the material supply source 1 via the supply pipe 11 and the mixer 12. The material nozzle 212 may pressure-feed the modeling material M supplied from the material supply source 1 via the supply pipe 11. That is, the modeling material M from the material supply source 1 and a carrier gas (i.e., a pressure-feed gas, for example, an inert gas such as nitrogen or argon) may be mixed in the mixer 12 and then pressure-feed to the material nozzle 212 via the supply pipe 11. As a result, the material nozzle 212 supplies the modeling material M together with the carrier gas. As the transport gas, for example, a purge gas supplied from the gas supply source 6 is used. However, a gas supplied from a gas supply source other than the gas supply source 6 may be used as the transport gas. Although the material nozzle 212 is depicted as a tube in FIG. 1, the shape of the material nozzle 212 is not limited to this. The material nozzle 212 supplies the modeling material M downward (i.e., toward the -Z side) from the material nozzle 212. A stage 31 is disposed below the material nozzle 212. When a workpiece W is mounted on the stage 31, the material nozzle 212 supplies the modeling material M toward the workpiece W or the vicinity of the workpiece W. The traveling direction of the modeling material M supplied from the material nozzle 212 is a direction inclined at a predetermined angle (for example, an acute angle) with respect to the Z-axis direction, but may also be toward the -Z side (i.e., directly downward).

[0023] In this embodiment, the material nozzle 212 is aligned with the irradiation optical system 211 so that the material nozzle 212 supplies the building material M toward the target irradiation area EA onto which the irradiation optical system 211 irradiates the processing light EL. In other words, the material nozzle 212 and the irradiation optical system 211 are aligned so that the target supply area MA, which is set on or near the workpiece W as the area onto which the material nozzle 212 supplies the building material M, coincides with (or at least partially overlaps with) the target irradiation area EA. Note that the material nozzle 212 and the irradiation optical system 211 may also be aligned so that the material nozzle 212 supplies the building material M to a molten pool MP (described later) formed by the processing light EL emitted from the irradiation optical system 211. Note that the material nozzle 212 does not have to supply the material to the molten pool MP. For example, the processing system SYSa may melt the building material M from the material nozzle 212 using the irradiation optical system 211 before the building material M reaches the workpiece W, and then adhere the molten building material M to the workpiece W.

[0024] The head drive system 22 moves the machining head 21. For this reason, the head drive system 22 may be referred to as a moving device. The head drive system 22 moves the machining head 21, for example, along at least one of the X-axis, Y-axis, Z-axis, θX direction, θY direction, and θZ direction. In the example shown in FIGS. 2 and 3 , the head drive system 22 moves the machining head 21 along each of the X-axis, Y-axis, and Z-axis. In this case, the head drive system 22 may include a head drive system 22X, a head drive system 22Y, and a head drive system 22Z. The head drive system 22X moves the machining head 21 along the X-axis. The head drive system 22Y moves the machining head 21 along the Y-axis. The head drive system 22Z moves the machining head 21 along the Z-axis.

[0025] Head drive system 22Y includes Y guide member 221Y connected to support frame 224, which is installed on the bottom surface of housing 8 (or a surface plate placed on the bottom surface of housing 8) via an anti-vibration device such as an air spring, and extending along the Y axis, Y slide member 222Y that is movable along Y guide member 221Y, and a motor (not shown) that moves Y slide member 222Y. Head drive system 22Y includes X guide member 221X connected to Y slide member 222Y and extending along the X axis, X slide member 222X that is movable along X guide member 221X, and a motor (not shown) that moves X slide member 222X. Head drive system 22Z includes Z guide member 221Z connected to X slide member 222X and extending along the Z axis, Z slide member 222Z that is movable along Z guide member 221Z, and a motor (not shown) that moves Z slide member 222Z. A machining head 21 is connected to the Z slide member 222Z. When the Y slide member 222Y moves along the Y guide member 221Y, the machining head 21 connected to the Y slide member 222Y via head drive systems 22X and 22Z moves along the Y axis. When the X slide member 222X moves along the X guide member 221X, the machining head 21 connected to the X slide member 222X via head drive system 22Z moves along the X axis. When the Z slide member 222Z moves along the Z guide member 221Z, the machining head 21 connected to the Z slide member 222Z moves along the Z axis.

[0026] When the head drive system 22 moves the machining head 21, the relative positions of the machining head 21, the stage 31, and the workpiece W placed on the stage 31 change. That is, the relative positions of the irradiation optical system 211 and the material nozzle 212 (supply outlet 214), the stage 31, and the workpiece W change. Therefore, the head drive system 22 may function as a position changing device for changing the relative positional relationship between the irradiation optical system 211 and the material nozzle 212 (supply outlet 214), the stage 31, and the workpiece W. Furthermore, when the relative positions of the machining head 21, the stage 31, and the workpiece W change, the target irradiation area EA and the target supply area MA (and further, the molten pool MP) move relative to the workpiece W. Therefore, the head drive system 22 may function as a moving device for moving the target irradiation area EA and the target supply area MA (and further, the molten pool MP) relative to the workpiece W.

[0027] The stage unit 3 includes a stage 31, a stage drive system 32, and a position measuring device 33. The stage 31 may also be called a table.

[0028] The stage 31 is capable of supporting the workpiece W. Note that the phrase "the stage 31 supports the workpiece W" here may refer to a state in which the workpiece W is directly or indirectly supported by the stage 31. The stage 31 may be capable of holding the workpiece W placed on the stage 31. In other words, the stage 31 may support the workpiece W by holding it. Therefore, the stage 31 may function as a holder that holds the workpiece W. Alternatively, the stage 31 may not be capable of holding the workpiece W. In this case, the workpiece W may be placed on the stage 31 without being clamped. Furthermore, the stage 31 is capable of releasing the held workpiece W when it is being held. The irradiation optical system 211 described above irradiates the processing light EL during at least a portion of the period during which the stage 31 supports the workpiece W. Furthermore, the material nozzle 212 described above supplies the modeling material M during at least a portion of the period during which the stage 31 supports the workpiece W. Note that the stage 31 may be equipped with a mechanical chuck, a vacuum suction chuck, or the like to hold the workpiece W.

[0029] In this embodiment, the stage 31 includes a stage 31θX and a stage 31θZ. The reason why the stage 31 includes the stage 31θX and the stage 31θZ is to move the stage 31 in each of the θX and θZ directions by a stage drive system 32, which will be described in detail later. The workpiece W is supported by the stage 31θZ. As will be described later, the stage 31θX is movable along the θX direction by the stage drive system 32 (i.e., rotatable around a rotation axis along the X-axis). The stage 31θZ is disposed in a recess formed in the stage 31θX so as to be rotatable around a rotation axis along the X-axis together with the stage 31θX in accordance with the rotation of the stage 31θX. The stage 31θZ is disposed in a recess formed in the stage 31θX so as to be movable along the θZ direction by the stage drive system 32 (i.e., rotatable around a rotation axis along the Z-axis) regardless of the rotation of the stage 31θX, as will be described later. The configuration of the stage 31 is not limited to the configuration shown in Figures 2 and 3. As an example, the stage 31θZ does not have to be placed in a recess formed in the stage 31θX.

[0030] The stage drive system 32 moves the stage 31. For this reason, the stage drive system 32 may be referred to as a movement device. The stage drive system 32 moves the stage 31, for example, along at least one of the X-axis, Y-axis, Z-axis, θX direction, θY direction, and θZ direction. In the example shown in FIGS. 2 and 3 , the stage drive system 32 moves the stage 31 along each of the θX direction and the θZ direction. That is, the stage drive system 32 rotates the stage 31 around a rotation axis along the X-axis and around a rotation axis along the Z-axis. For this reason, the stage drive system 32 may be referred to as a rotation device. In this case, the stage drive system 32 may include a stage drive system 32θX and a stage drive system 32θZ. The stage drive system 32θX rotates the stage 31 (particularly, stage 31θX) around a rotation axis along the X-axis. The stage drive system 32θZ rotates the stage 31 (particularly, the stage 31θZ) around a rotation axis along the Z axis. The stage drive system 32θX includes a pair of rotation shafts 321θX rotatably connected to a pair of support frames 323 that are installed on the bottom surface of the housing 8 (or on a surface plate disposed on the bottom surface of the housing 8) via vibration isolation devices such as air springs, and a motor 322θX that rotates the pair of rotation shafts 321θX around a rotation axis along the X axis. The pair of rotation shafts 321θX extend along the X axis direction. The pair of rotation shafts 321θX are connected to the stage 31θX so as to sandwich the stage 31 along the X axis direction. The stage drive system 32θZ includes a rotation shaft 321θZ that extends along the Z axis direction and is connected to the bottom surface of the stage 31θX (specifically, the surface facing the stage 31θZ), and a motor 322θZ that rotates the rotation shaft 321θZ around a rotation axis along the Z axis. When the pair of rotary shafts 321θX rotate, the stage 31θX rotates around a rotation axis along the X-axis. As a result, the stage 31θZ supported by the stage 31θX (and further, the workpiece W supported by the stage 31θZ) also rotates around a rotation axis along the X-axis. When the rotary shafts 321θZ rotate, the stage 31θZ (and further, the workpiece W supported by the stage 31θZ) also rotates around a rotation axis along the Z-axis.2 and 3 has a double-supported structure in which the stage 31θX is supported from both sides by the support frame 323. However, the stage 31 may have a cantilevered structure in which the stage 31θX is supported from one side by the support frame 323.

[0031] When the stage drive system 32 moves the stage 31, the relative positions of the machining head 21 and the stage 31 and the workpiece W placed on the stage 31 change. That is, the relative positions of the irradiation optical system 211 and the material nozzle 212 (supply outlet 214) to the stage 31 and the workpiece W change. Therefore, the stage drive system 32 may function as a position changing device for changing the relative positional relationship between the irradiation optical system 211 and the material nozzle 212 (supply outlet 214) to the stage 31 and the workpiece W. Furthermore, when the relative positions of the machining head 21 and the stage 31 and the workpiece W change, the target irradiation area EA and the target supply area MA (and further, the molten pool MP) move relative to the workpiece W. Therefore, the stage drive system 32 may function as a moving device for moving the target irradiation area EA and the target supply area MA (and further, the molten pool MP) relative to the workpiece W.

[0032] The position measuring instrument 33 is capable of measuring (in other words, detecting) the position of the stage 31. In this embodiment, since the stage 31 is rotatable as described above, the position measuring instrument 33 may be capable of measuring the position of the stage 31 in the rotational direction. For example, the position measuring instrument 33 may include an angle detection device (angle detection unit) capable of measuring the rotation angle of the stage 31. More specifically, the position measuring instrument 33 may be capable of measuring the rotation angle of the stage 31 (particularly, stage 31θX) around a rotation axis along the X axis and the rotation angle of the stage 31 (particularly, stage 31θZ) around a rotation axis along the Z axis. An example of such a position measuring instrument 33 is an encoder. The position measuring instrument 33 may be incorporated into the stage drive system 32.

[0033] The measurement device 4 is a device capable of measuring at least a portion of a measurement object. For example, the measurement device 4 may be capable of measuring the shape of at least a portion of a measurement object. For example, the measurement device 4 may be capable of measuring the position of at least a portion of a measurement object. An example of such a measurement device is a three-dimensional measuring machine (in other words, a 3D scanner) that performs three-dimensional measurement of a measurement object. In this case, the measurement device 4 may measure the measurement object using a pattern projection method or a light section method, in which a light pattern is projected onto the surface of the measurement object by irradiating the surface with measurement light ML and measuring the shape of the projected pattern. Alternatively, the measurement device 4 may measure the measurement object using a time-of-flight method, in which measurement light ML is projected onto the surface of the measurement object and the distance to the object is measured from the time it takes for the projected measurement light ML to return, and this is performed at multiple positions on the object. Alternatively, the measurement device 4 may measure the measurement object using at least one of a moire topography method (specifically, a grating illumination method or a grating projection method), a holographic interferometry method, an autocollimation method, a stereo method, an astigmatism method, a critical angle method, and a knife-edge method. Note that examples of the measurement object include at least one of the workpiece W, the three-dimensional structure ST (i.e., the workpiece W integrated with the three-dimensional structure ST), a structural layer SL (described later) constituting the three-dimensional structure ST (i.e., the workpiece W integrated with the three-dimensional structure ST), and the stage 31.

[0034] The measurement device 4 may be fixed to, for example, the support frame 224. In this case, when the stage drive system 32 rotates the stage 31, the relative positional relationship between the measurement device 4, the stage 31, and the workpiece W supported by the stage 31 changes. In particular, when the stage drive system 32 rotates the stage 31, the angle of the rotation axis of the stage 31 and the workpiece W supported by the stage 31 (i.e., the rotation axis of the stage drive system 32) with respect to the measurement axis of the measurement device 4 (e.g., the optical axis of an optical system that the measurement device 4 is equipped with to emit the measurement light ML) changes. Therefore, the stage drive system 32 may function as an angle changing device that changes the angle of the rotation axis of the stage drive system 32 with respect to the measurement axis of the measurement device 4. Note that the measurement device 4 may be movable. For example, the measurement device 4 may be movable along at least one of the X-axis, Y-axis, Z-axis, θX direction, θY direction, and θZ direction. For example, the measurement device 4 may be rotatable about at least one of the rotation axis along the X-axis, the rotation axis along the Y-axis, and the rotation axis along the Z-axis. When the measuring device 4 rotates, the angle of the rotation axis of the stage driving system 32 changes with respect to the measurement axis of the measuring device 4. The measuring device 4 may be fixed to the housing 8.

[0035] The light source 5 emits, for example, at least one of infrared light, visible light, and ultraviolet light as the processing light EL. However, other types of light may be used as the processing light EL. The processing light EL may include multiple pulsed lights (i.e., multiple pulse beams). The processing light EL may be laser light. In this case, the light source 5 may include a laser light source (e.g., a semiconductor laser such as a laser diode (LD: Laser Diode). The laser light source may be a fiber laser, a CO2 laser, a YAG laser, an excimer laser, etc. However, the processing light EL does not have to be laser light. The light source 5 may include any light source (e.g., at least one of an LED (Light Emitting Diode), a discharge lamp, etc.).

[0036] The gas supply source 6 is a supply source of purge gas for purging the internal space of the housing 8. The purge gas includes an inert gas. Examples of the inert gas include nitrogen gas and argon gas. The gas supply source 6 supplies the purge gas to the internal space of the housing 8 via a supply pipe 61 connecting the gas supply source 6 and the housing 8. As a result, the internal space of the housing 8 becomes a space purged with the purge gas. The gas supply source 6 may be a cylinder containing an inert gas such as nitrogen gas or argon gas. When the inert gas is nitrogen gas, the gas supply source 6 may be a nitrogen gas generator that generates nitrogen gas using the air as a raw material.

[0037] As described above, when the material nozzle 212 supplies the modeling material M together with a purge gas, the gas supply source 6 may supply the purge gas to the mixer 12 to which the modeling material M from the material supply source 1 is supplied. Specifically, the gas supply source 6 may be connected to the mixer 12 via a supply pipe 62 connecting the gas supply source 6 and the mixer 12. As a result, the gas supply source 6 supplies the purge gas to the mixer 12 via the supply pipe 62. In this case, the modeling material M from the material supply source 1 may be supplied (specifically, pressure-fed) through the supply pipe 11 toward the material nozzle 212 by the purge gas supplied from the gas supply source 6 via the supply pipe 62. In other words, the gas supply source 6 may be connected to the material nozzle 212 via the supply pipe 62, the mixer 12, and the supply pipe 11. In this case, the material nozzle 212 supplies the modeling material M from the supply outlet 214 together with the purge gas for pressure-fed the modeling material M.

[0038] The control device 7 controls the operation of the machining system SYSa. The control device 7 may include, for example, an arithmetic device and a storage device. The arithmetic device may include, for example, at least one of a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit). The storage device may include, for example, a memory. The control device 7 functions as a device that controls the operation of the machining system SYSa when the arithmetic device executes a computer program. This computer program is a computer program that causes the arithmetic device to perform (i.e., execute) the operations to be performed by the control device 7, which will be described later. In other words, this computer program is a computer program that causes the control device 7 to function so as to cause the machining system SYS to perform the operations to be described later. The computer program executed by the arithmetic device may be recorded in a storage device (i.e., a recording medium) included in the control device 7, or may be recorded in any storage medium (e.g., a hard disk or semiconductor memory) built into or externally attachable to the control device 7. Alternatively, the arithmetic device may download the computer program to be executed from a device external to the control device 7 via a network interface.

[0039] For example, the control device 7 may control the emission mode of the processing light EL by the irradiation optical system 211. The emission mode may include, for example, at least one of the intensity of the processing light EL and the emission timing of the processing light EL. When the processing light EL includes multiple pulsed lights, the emission mode may include, for example, at least one of the emission duration of the pulsed light, the emission cycle of the pulsed light, and the ratio between the emission duration of the pulsed light and the emission cycle of the pulsed light (so-called duty ratio). Furthermore, the control device 7 may control the movement mode of the processing head 21 by the head drive system 22. The control device 7 may control the movement mode of the stage 31 by the stage drive system 32. The movement mode may include, for example, at least one of the movement amount, movement speed, movement direction, and movement timing (movement time). Furthermore, the control device 7 may control the supply mode of the modeling material M by the material nozzle 212. The supply mode may include, for example, at least one of the supply amount (particularly, the supply amount per unit time) and the supply timing (supply time).

[0040] The control device 7 does not have to be provided inside the machining system SYSa. For example, the control device 7 may be provided as a server or the like outside the machining system SYSa. In this case, the control device 7 and the machining system SYSa may be connected via a wired and / or wireless network (or a data bus and / or a communication line). The wired network may be a network using a serial bus interface, such as at least one of IEEE1394, RS-232x, RS-422, RS-423, RS-485, and USB. The wired network may be a network using a parallel bus interface. The wired network may be a network using an interface compliant with Ethernet (registered trademark), such as at least one of 10BASE-T, 100BASE-TX, and 1000BASE-T. The wireless network may be a network using radio waves. An example of a network using radio waves is a network compliant with IEEE802.1x (for example, at least one of wireless LAN and Bluetooth (registered trademark)). The wireless network may be a network using infrared rays. The wireless network may be a network using optical communication. In this case, the control device 7 and the processing system SYSa may be configured to be able to transmit and receive various information via the network. The control device 7 may also be able to transmit information such as commands and control parameters to the processing system SYSa via the network. The processing system SYSa may include a receiving device that receives information such as commands and control parameters from the control device 7 via the network. The processing system SYSa may also include a transmitting device that transmits information such as commands and control parameters to the control device 7 via the network (i.e., an output device that outputs information to the control device 7). Alternatively, a first control device that performs part of the processing performed by the control device 7 may be provided inside the processing system SYSa, while a second control device that performs another part of the processing performed by the control device 7 may be provided outside the processing system SYSa.

[0041] The recording medium for recording the computer program executed by the control device 7 may be at least one of a CD-ROM, CD-R, CD-RW, flexible disk, optical disk such as MO, DVD-ROM, DVD-RAM, DVD-R, DVD+R, DVD-RW, DVD+RW, and Blu-ray (registered trademark), magnetic medium such as magnetic tape, magneto-optical disk, semiconductor memory such as USB memory, and any other medium capable of storing a program. The recording medium may also include a device capable of recording a computer program (e.g., a general-purpose device or a dedicated device in which a computer program is implemented in an executable state in at least one of software and firmware). Furthermore, each process or function included in the computer program may be realized by a logical processing block realized within the control device 7 when the control device 7 (i.e., a computer) executes the computer program, or by hardware such as a predetermined gate array (FPGA, ASIC) included in the control device 7, or may be realized in a form in which the logical processing block and a partial hardware module that realizes some of the hardware elements are mixed.

[0042] (1-2) Operation of the machining system SYSa Next, the operation of the machining system SYSa will be described. In the first embodiment, the machining system SYSa performs an additional machining operation to form a three-dimensional structure ST on the workpiece W. Furthermore, before performing the additional machining operation (or while performing the additional machining operation or after completing the additional machining operation), the machining system SYSa performs a coordinate matching operation to associate a machining coordinate system used when the head drive system 22 moves the machining head 21 with a stage coordinate system used when the stage drive system 32 moves the stage 31. Furthermore, before performing the additional machining operation (or while performing the additional machining operation or after completing the additional machining operation), the machining system SYSa performs an eccentricity acquisition operation to acquire the amount of deviation (typically, the eccentricity δ) between the rotation axis of the stage 31 (i.e., the rotation axis of the stage drive system 32 functioning as a rotation device) and the ideal rotation axis of the workpiece W supported on the stage 31. Therefore, the additional machining operation, the coordinate matching operation, and the eccentricity acquisition operation will be described in order below.

[0043] (1-2-1) Additional processing operations First, the additional processing operation will be described. As described above, the processing system SYSa forms the three-dimensional structure ST by the laser build-up welding method. For this reason, the processing system SYSa may form the three-dimensional structure ST by performing an existing additional processing operation (in this case, a molding operation) that complies with the laser build-up welding method. Below, an example of the additional processing operation for forming the three-dimensional structure ST using the laser build-up welding method will be briefly described.

[0044] The processing system SYSa forms a three-dimensional structure ST on a workpiece W based on three-dimensional model data (e.g., CAD (Computer Aided Design) data) of the three-dimensional structure ST to be formed. Measurement data of a three-dimensional object measured by at least one of a measuring device (not shown) provided in the processing system SYSa and a three-dimensional shape measuring device provided separately from the processing system SYSa may be used as the three-dimensional model data. To form the three-dimensional structure ST, the processing system SYSa sequentially forms, for example, multiple layered substructures (hereinafter referred to as "structural layers") SL aligned along the Z-axis direction. For example, the processing system SYSa sequentially forms multiple structural layers SL obtained by slicing the three-dimensional structure ST along the Z-axis direction. As a result, the three-dimensional structure ST is formed as a layered structure in which multiple structural layers SL are stacked. The following describes the flow of operations for forming the three-dimensional structure ST by sequentially forming multiple structural layers SL one by one.

[0045] First, the operation of forming each structure layer SL will be described with reference to FIGS. 4(a) to 4(e). Under the control of the control device 7, the processing system SYSa moves at least one of the processing head 21 and the stage 31 so that a target irradiation area EA is set in a desired area on the printing surface MS corresponding to the surface of the workpiece W or the surface of the formed structure layer SL. The processing system SYSa uses the results of the coordinate matching operation and the eccentricity amount acquisition operation when moving at least one of the processing head 21 and the stage 31. That is, the processing system SYSa moves at least one of the processing head 21 and the stage 31 based on the results of the coordinate matching operation and the eccentricity amount acquisition operation so that a target irradiation area EA is set in a desired area on the printing surface MS. Then, the processing system SYSa irradiates the target irradiation area EA with processing light EL from the irradiation optical system 211. At this time, the focus position (i.e., the light collection position) of the processing light EL may coincide with the printing surface MS. As a result, as shown in FIG. 4(a), a molten pool (i.e., a pool of metal melted by the processing light EL) MP is formed on the printing surface MS irradiated with the processing light EL. Furthermore, under the control of the control device 7, the processing system SYSa supplies the printing material M from the material nozzle 212. Here, as described above, the target supply area MA to which the printing material M is supplied coincides with the target irradiation area EA, so the target supply area MA includes at least a portion of the area where the molten pool MP is formed. Therefore, as shown in FIG. 4(b), the processing system SYSa supplies the printing material M from the material nozzle 212 to the molten pool MP. As a result, the printing material M supplied to the molten pool MP melts. Thereafter, when the processing light EL is no longer irradiated onto the molten pool MP as the processing head 21 moves, the molten printing material M in the molten pool MP cools and solidifies (i.e., solidifies). As a result, the solidified printing material M is deposited on the printing surface MS, as shown in FIG. 4(c). That is, a molded object is formed from the deposit of the solidified printing material M.

[0046] As shown in FIG. 4(d), the processing system SYSa repeats a series of printing processes, including forming a molten pool MP by irradiating the processing light EL, supplying the printing material M to the molten pool MP, melting the supplied printing material M, and solidifying the molten printing material M, while changing the relative positional relationship between the processing head 21 and the workpiece W (i.e., the relative positional relationship between the processing head 21 and the printing surface MS). In the example shown in FIG. 4(d), a series of printing processes is repeated while rotating a cylindrical workpiece W whose longitudinal direction is in the X-axis direction around a rotation axis along the X-axis. During this process, the processing system SYSa irradiates the printing surface MS with the processing light EL in an area where a printing object is to be formed, while not irradiating the printing surface MS with the processing light EL in an area where a printing object is not to be formed. In other words, the processing system SYSa moves the target irradiation area EA along a predetermined movement trajectory on the printing surface MS, and irradiates the printing surface MS with the processing light EL at a timing appropriate for the distribution of the area where a printing object is to be formed. As a result, the molten pool MP also moves on the build surface MS along a movement trajectory corresponding to the movement trajectory of the target irradiation area EA. Specifically, the molten pool MP is sequentially formed on the build surface MS in the area along the movement trajectory of the target irradiation area EA that is irradiated with the processing light EL. Furthermore, since the target irradiation area EA and the target supply area MA coincide with each other as described above, the target supply area MA also moves on the build surface MS along a movement trajectory corresponding to the movement trajectory of the target irradiation area EA. As a result, as shown in FIG. 4( e), a structure layer SL corresponding to an assembly of objects formed from the melted and then solidified build material M is formed on the build surface MS. That is, a structure layer SL corresponding to an assembly of objects formed on the build surface MS in a pattern corresponding to the movement trajectory of the molten pool MP (i.e., a structure layer SL having a shape corresponding to the movement trajectory of the molten pool MP in a planar view) is formed. Note that if the target irradiation area EA is set in an area where no object is desired to be formed, the processing system SYSa may irradiate the target irradiation area EA with the processing light EL and stop supplying the build material M. In addition, when a target irradiation area EA is set in an area where it is not desired to form a molded object, the processing system SYSa may supply the molding material M to the target irradiation area EA and irradiate the target irradiation area EA with processing light EL of an intensity that will not create a molten pool MP.

[0047] The machining system SYSa repeatedly performs the operation for forming such a structure layer SL based on the three-dimensional model data under the control of the control device 7. Specifically, the control device 7 first slices the three-dimensional model data at the layer pitch to create slice data. Note that this slice data may be partially modified depending on the characteristics of the machining system SYSa. The machining system SYSa performs the operation for forming the first structure layer SL#1 on the printing surface MS corresponding to the surface of the workpiece W based on the three-dimensional model data corresponding to the structure layer SL#1 (i.e., the slice data corresponding to the structure layer SL#1). As a result, the structure layer SL#1 is formed on the printing surface MS as shown in FIG. 5(a). Thereafter, the machining system SYSa sets the surface (i.e., the upper surface) of the structure layer SL#1 as a new printing surface MS and forms the second structure layer SL#2 on the new printing surface MS. To form the structure layer SL#2, the control device 7 moves at least one of the processing head 21 and the stage 31 so that the target irradiation area EA and the target supply area MA are set on the surface of the structure layer SL#1 (i.e., the new printing surface MS). This causes the focus position of the processing light EL to coincide with the new printing surface MS. Thereafter, under the control of the control device 7, the processing system SYSa forms the structure layer SL#2 on the structure layer SL#1 based on the slice data corresponding to the structure layer SL#2, in the same manner as the operation for forming the structure layer SL#1. As a result, the structure layer SL#2 is formed as shown in FIG. 5(b). Thereafter, the same operation is repeated until all the structure layers SL constituting the three-dimensional structure ST to be formed on the workpiece W are formed. As a result, as shown in FIG. 5(c), the three-dimensional structure ST is formed by a stacked structure in which multiple structure layers SL are stacked.

[0048] (1-2-2) Coordinate matching operation Next, the coordinate matching operation will be described with reference to Fig. 6. Fig. 6 is a flowchart showing the flow of the coordinate matching operation.

[0049] As shown in FIG. 6 , first, the calibration plate 34 is placed on the stage 31 (step S11). In particular, the calibration plate 34 is placed on the stage 31 so that the calibration plate 34 and the stage 31 have a desired positional relationship. In the first embodiment, in order to place the calibration plate 34 on the stage 31 so that the calibration plate 34 and the stage 31 have a desired positional relationship, alignment marks are formed on both the calibration plate 34 and the stage 31. Hereinafter, with reference to FIGS. 7 to 11 , an example of the stage 31 and the calibration plate 34 on which alignment marks are formed will be described. FIG. 7 is a plan view showing the stage 31 on which alignment marks are formed. FIG. 8 is a cross-sectional view of the stage 31 shown in FIG. 7 taken along line VII-VII′. FIG. 9 is a plan view showing the calibration plate 34 on which alignment marks are formed. FIG. 10 is a cross-sectional view of the calibration plate 34 shown in FIG. 9 taken along line IX-IX′. FIG. 11 is a plan view showing the calibration plate 34 placed on the stage 31.

[0050] As shown in Figures 7 and 8, the stage 31 has a plurality of pins 319 formed thereon as alignment marks. In the example shown in Figures 7 and 8, two pins 319 are formed on the upper surface of the stage 31θX that constitutes the stage 31 (particularly, on an upper surface that is higher than or at the same height as the upper surface of the stage 31θZ). However, the positions and number of the pins 319 are not limited to those shown in Figures 7 and 8. The pins 319 are members that protrude along the Z-axis direction from the upper surface of the stage 31 (in the example shown in Figures 7 and 8, the upper surface of the stage 31θX). Note that information regarding the position of the pins 319 in the stage coordinate system is known to the control device 7.

[0051] 9 and 10, the calibration plate 34 includes a base member 341. The base member 341 is a plate-shaped member. The base member 341 has a shape and size that allows it to be placed on the stage 31. The base member 341 has a plurality of through holes 342 formed therein as markers for alignment. In the example shown in FIGS. 9 and 10, two through holes 342 are formed in the base member 341. The through holes 342 pass through the base member 341 along the Z-axis direction.

[0052] In the first embodiment, as shown in FIG. 11 , the calibration plate 34 is placed on the stage 31 so that the pins 319 are inserted into the through-holes 342. The calibration plate 34 is placed on the stage 31 (i.e., on the stage 31θX and stage 31θZ) with the pins 319 inserted into the through-holes 322. The stage 31 supports (e.g., holds) the calibration plate 34 with the pins 319 inserted into the through-holes 322. Therefore, the arrangement of the through-holes 342 is the same as the arrangement of the pins 319. Furthermore, the number of through-holes 342 is the same as (or may be greater than) the number of pins 319. As a result, the calibration plate 34 is placed on the stage 31 so as to have a desired positional relationship with respect to the stage 31. Specifically, the calibration plate 34 is placed on the stage 31 so as to have a desired positional relationship with respect to the pins 319 on the stage 31. The position where the pins 319 are formed may be used as a reference position on the stage 31 when placing the calibration plate 34 on the stage 31. In this case, the calibration plate 34 is placed on the stage 31 in a state where it is aligned so as to have a desired positional relationship with the reference position on the stage 31.

[0053] A calibration pattern CP that can be measured by the measurement device 4 is formed on the calibration plate 34. In the example shown in FIG. 9, the calibration pattern CP is a measurement pattern made up of a plurality of calibration markers CM arranged in a matrix. The formation position of the calibration pattern CP on the calibration plate 34 (the formation positions of the plurality of calibration markers CM in the example shown in FIG. 9) is known information to the control device 7. In this case, the calibration plate 34 is placed on the stage 31 so as to have a desired positional relationship with the pins 319 that are arranged at known positions in the stage coordinate system, and therefore the formation position of the calibration pattern CP in the stage coordinate system is also known information to the control device 7.

[0054] A thermosensitive film 343 that is thermosensitive (i.e., sensitive) to the processing light EL is formed on the calibration plate 34. Note that in addition to or instead of the thermosensitive film 343, a photosensitive film that is photosensitive (i.e., sensitive) to the processing light EL may be formed on the calibration plate 34. The thermosensitive film 343 is formed on the calibration plate 34 so as to cover the calibration pattern CP. The thermosensitive film 343 is transparent to the measurement light ML (e.g., visible light) used by the measurement device 4. Therefore, the measurement device 4 can measure the calibration pattern CP covered with the thermosensitive film 343.

[0055] 6 again, after the calibration plate 34 is placed on the stage 31, the control device 7 controls the processing unit 2 and the stage unit 3 to irradiate at least a portion of the calibration plate 34 with the processing light EL (step S12). Specifically, the control device 7 changes the relative positional relationship between the processing head 21 and the stage 31 so that the target irradiation area EA moves over at least a portion of the thermosensitive film 343 of the calibration plate 34 in a predetermined movement pattern. Specifically, the control device 7 moves the processing head 21 so that the target irradiation area EA moves over at least a portion of the thermosensitive film 343 of the calibration plate 34 along a predetermined movement trajectory. At this time, the control device 7 does not need to move the stage 31. Furthermore, the control device 7 irradiates the processing light EL to the target irradiation area EA moving over at least a portion of the thermosensitive film 343 along a predetermined movement trajectory. As a result, as shown in Fig. 12, which is a plan view showing the calibration plate 34 irradiated with the processing light EL, a heat-sensitive pattern PP corresponding to the movement trajectory of the target irradiation area EA is formed on at least a part of the heat-sensitive film 343. In the example shown in Fig. 12, the target irradiation area EA moves along a lattice-shaped movement trajectory including movement trajectories extending along both the X-axis and Y-axis directions between the multiple calibration markers CM.

[0056] Thereafter, the measurement device 4 measures at least a portion of the calibration plate 34 (step S13). Specifically, the measurement device 4 measures the thermosensitive pattern PP formed on the thermosensitive film 343 of the calibration plate 34. That is, the measurement device 4 measures the portion of the thermosensitive film 343 that is sensitive to the processing light EL. Furthermore, because the thermosensitive film 343 is transparent to the measurement light ML, the measurement device 4 measures the calibration pattern CP along with the thermosensitive pattern PP. Therefore, the measurement result of the measurement device 4 in step S13 includes information related to the measurement result of the thermosensitive pattern PP and information related to the measurement result of the calibration pattern CP.

[0057] Thereafter, the control device 7 associates the processing coordinate system with the stage coordinate system based on the measurement results of the measuring device 4 in step S13 (step S14). Specifically, the control device 7 calculates the positions of the thermal pattern PP and the calibration pattern CP based on the measurement results of the measuring device 4. As described above, the calibration plate 34 on which the calibration pattern CP is formed has a predetermined positional relationship with the stage θZ of the stage 31, and the position at which the calibration pattern CP is formed is known to the control device 7. Therefore, the calculated position of the calibration pattern CP essentially corresponds to the position of the calibration pattern CP in the stage coordinate system. Therefore, the control device 7 can calculate the position of the thermal pattern PP in the stage coordinate system by comparing the position of the calibration pattern CP with the position of the thermal pattern PP in the stage coordinate system. Furthermore, because the thermal pattern PP is formed by the processing light EL from the processing head 21, the position of the thermal pattern PP indirectly indicates the position of the processing head 21. In other words, the position of the thermal pattern PP indirectly indicates the position of the processing head 21 in the processing coordinate system. Therefore, the control device 7 can associate the position of the processing head 21 in the processing coordinate system with the position of the calibration pattern CP in the stage coordinate system based on the positions of the thermal pattern PP and the calibration pattern CP. As a result, the control device 7 can associate the processing coordinate system with the stage coordinate system. Note that the positions of the thermal pattern PP and the calibration pattern CP may be measured by a measurement device different from the measurement device 4 (for example, an external measurement device).

[0058] Once the machining coordinate system and the stage coordinate system are associated, the deviation of the machining coordinate system relative to the stage coordinate system is determined. The deviation of the machining coordinate system relative to the stage coordinate system corresponds to the deviation between the ideal (i.e., designed) position of the thermal pattern PP and the actually measured position of the thermal pattern PP. Such deviation of the machining coordinate system relative to the stage coordinate system may include, for example, the deviation between the origin of the stage coordinate system and the origin of the machining coordinate system. The deviation of the machining coordinate system relative to the stage coordinate system may include, for example, the deviation of the running plane of the machining head 21 (e.g., at least one of the running planes when the machining head 21 moves along the X-axis and the Y-axis) relative to the axes constituting the stage coordinate system (e.g., the rotation axis of the stage 31 described above). In this case, the control device 7 may calculate a movement correction value for moving the machining head 21 to offset (in other words, correct) such deviation. For example, the control device 7 may calculate at least one of a movement correction value for correcting the movement direction when moving the machining head 21 along the X-axis direction, a movement correction value for correcting the movement amount when moving the machining head 21 along the X-axis direction, a movement correction value for correcting the movement direction when moving the machining head 21 along the Y-axis direction, and a movement correction value for correcting the movement amount when moving the machining head 21 along the Y-axis direction. When performing the additional machining operation described above, the control device 7 may move the machining head 21 using the movement correction value calculated in the coordinate matching operation. That is, when performing the additional machining operation described above, the control device 7 may move the machining head 21 based on the measurement results of the calibration plate 34 in the coordinate matching operation. As a result, even if the machining coordinate system is misaligned with the stage coordinate system, the control device 7 can move the machining head 21 in the same way as when the machining coordinate system is not misaligned with the stage coordinate system. That is, as a result, even if the machining coordinate system is misaligned with the stage coordinate system, the control device 7 can move the machining head 21 so that the desired position on the workpiece W is irradiated with the machining light EL.

[0059] Furthermore, once the machining coordinate system and the stage coordinate system are associated with each other, the control device 7 can convert a certain coordinate position in either the machining coordinate system or the stage coordinate system into a coordinate position in the other of the machining coordinate system or the stage coordinate system. Therefore, the operation of "associating the machining coordinate system with the stage coordinate system" may be considered to be substantially equivalent to the operation of calculating information (for example, a transformation matrix) used to convert a certain coordinate position in either the machining coordinate system or the stage coordinate system into a coordinate position in the other of the machining coordinate system or the stage coordinate system.

[0060] In the above example, the calibration plate 34 is attached to the stage 31θX, but it may be attached to the stage 31θZ.

[0061] (1-2-3) Eccentricity acquisition operation Next, the eccentricity amount obtaining operation will be described. First, the technical reasons for performing the eccentricity amount obtaining operation will be described, and then the flow of the eccentricity amount obtaining operation will be described.

[0062] First, FIG. 13 shows a workpiece W supported by the stage 31 so that the eccentricity δ, which is the amount of deviation between the rotation axis of the stage 31 and the ideal rotation axis of the workpiece W, is zero. Note that, for simplicity of the drawings, FIGS. 13 to 17 omit illustration of a holding fixture for fixing the workpiece W to the stage 31. In the first embodiment, since the stage 31θZ supports the workpiece W, the eccentricity δ refers to the amount of deviation between the rotation axis of the stage 31θZ (hereinafter referred to as the "rotation axis φZ") and the ideal rotation axis of the workpiece W (hereinafter referred to as the "rotation axis φW"). In particular, the eccentricity δ refers to the amount of deviation between the rotation axis φZ and the rotation axis φW in a direction intersecting the rotation axis φZ. Note that the rotation axis φW may typically be an axis passing through the center of mass (i.e., the center of gravity) of the workpiece W. In the example shown in FIG. 13 , the rotation axis φW of the cylindrical workpiece W extending in a direction along the rotation axis φZ is an axis passing through the center of the cylinder. In this case, the eccentricity δ may refer to the amount of deviation between the rotation axis φZ and the center of mass of the workpiece W.

[0063] As shown in FIG. 13, when the eccentricity δ is zero, the relative positional relationship between the machining head 21 and the workpiece W does not change when the stage 31θZ rotates around the rotation axis φZ while the machining head 21 is stationary. Specifically, FIG. 14(a) shows the relative positional relationship between the machining head 21 and the workpiece W supported by the stage 31θZ rotating around the rotation axis φZ parallel to the Z axis when the eccentricity δ is zero. FIG. 14(b) shows the relative positional relationship between the machining head 21 and the workpiece W supported by the stage 31θZ rotating around the rotation axis φZ inclined with respect to the Z axis when the eccentricity δ is zero. FIG. 14(c) shows the relative positional relationship between the machining head 21 and the workpiece W supported by the stage 31θZ rotating around the rotation axis φZ perpendicular to the Z axis when the eccentricity δ is zero. Note that the state of the rotation axis φZ relative to the Z axis can be changed by rotating the stage 31θX. 14(a) to 14(c), when the eccentricity δ is zero, the rotation axis φZ and the rotation axis φW overlap (i.e., coincide). Therefore, when the stage 31θZ rotates around the rotation axis φZ, the workpiece W rotates around the rotation axis φW. As a result, the relative positional relationship between the machining head 21 and the workpiece W does not change.

[0064] 15 shows the workpiece W supported by the stage 31 so that the eccentricity δ is not zero. If the eccentricity δ is not zero, when the stage 31θZ rotates around the rotation axis φZ, the relative positional relationship between the machining head 21 and the workpiece W may change even though the machining head 21 is stationary. In other words, the relative positional relationship between the machining coordinate system and the workpiece W may change.

[0065] Specifically, Figures 16(a) and 16(b) show the relative positional relationship between the machining head 21 and the workpiece W supported by the stage 31θZ, which rotates around a rotation axis φZ parallel to the Z axis while the eccentricity δ is not zero. As shown in Figures 16(a) and 16(b), when the eccentricity δ is not zero, the rotation axis φZ and the rotation axis φW do not overlap (i.e., do not coincide). Therefore, when the stage 31θZ rotates around the rotation axis φZ, the workpiece W rotates around a rotation axis φZ that is different from the rotation axis φW. As a result, the workpiece W is displaced relative to the machining head 21 (with respect to the machining coordinate system) in a direction corresponding to the rotation angle of the stage 31θZ around the rotation axis φZ by an amount corresponding to the rotation angle of the stage 31θZ around the rotation axis φZ. Specifically, the workpiece W is displaced relative to the machining head 21 (with respect to the machining coordinate system) within a plane perpendicular to the rotation axis φZ (the XY plane in the example shown in FIGS. 16(a) and 16(b)).

[0066] 17(a) and 17(b) show the relative positional relationship between the workpiece W supported by a stage 31θZ rotating around a rotation axis φZ inclined with respect to the Z axis with the eccentricity δ not being zero, and the machining head 21. In this case as well, the workpiece W is displaced relative to the machining head 21 (with respect to the machining coordinate system) within a plane perpendicular to the rotation axis φZ (in the example shown in FIGS. 17(a) and 17(b), a plane intersecting the X-axis, Y-axis, and Z-axis).

[0067] 18(a) and 18(b) show the relative positional relationship between the workpiece W supported by the stage 31θZ rotating around the rotation axis φZ perpendicular to the Z axis with the eccentricity δ not being zero, and the machining head 21. In this case as well, the workpiece W is displaced relative to the machining head 21 (relative to the machining coordinate system) within a plane perpendicular to the rotation axis φZ (in the example shown in FIGS. 18(a) and 18(b) , the XZ plane).

[0068] Such displacement of the workpiece W relative to the machining head 21 due to the rotation of the stage 31θZ (i.e., a change in the relative positional relationship between the machining head 21 and the workpiece W) may lead to an unintended change in the irradiation position of the machining light EL on the workpiece W. As a result, the machining head 21 may not be able to irradiate the desired position on the workpiece W with the machining light EL. Therefore, in the first embodiment, the machining system SYSa acquires the eccentricity δ through the eccentricity acquisition operation, and machines the workpiece W based on the acquired eccentricity δ when performing the additional machining operation (i.e., during machining of the workpiece W, during irradiation of the machining light EL). Specifically, the machining system SYSa rotates the stage 31 (e.g., at least one of the stages 31θX and 31θZ) and moves the machining head 21 based on the acquired eccentricity δ. That is, the machining system SYSa moves the machining head 21 in parallel with the rotation of the stage 31 based on the acquired eccentricity δ.

[0069] More specifically, the machining system SYSa rotates the stage 31 based on the amount of eccentricity δ, and also moves the machining head 21 based on the amount of eccentricity δ so as to reduce (typically, cancel out; the same applies below) the effect of displacement of the workpiece W relative to the machining head 21 caused by the rotation of the stage 31. Here, as described above, as the stage 31 rotates, the workpiece W is displaced in a plane perpendicular to the rotation axis φZ relative to the machining head 21 (with respect to the machining coordinate system). For this reason, the machining system SYSa may move the machining head 21 in a plane perpendicular to the rotation axis φZ based on the amount of eccentricity δ so that the desired position on the workpiece W is irradiated with the machining light EL, even if the workpiece W is displaced relative to the machining head 21 caused by the rotation of the stage 31θZ. For example, as shown in Figures 16(a) and 16(b), when the workpiece W is displaced relative to the machining head 21 (relative to the machining coordinate system) in the XY plane, the machining system SYSa may move the machining head 21 in the XY plane so that the desired position on the workpiece W is irradiated with the machining light EL, even if the workpiece W is displaced relative to the machining head 21 as the stage 31 rotates. In this case, the machining system SYSa may move the machining head 21 along at least one of the X-axis direction and the Y-axis direction. For example, as shown in Figures 17(a) and 17(b), when the workpiece W is displaced relative to the machining head 21 in a plane intersecting the X-axis, Y-axis, and Z-axis (i.e., a plane inclined with respect to the movement direction of the machining head 21), the machining system SYSa may move the machining head 21 in a plane intersecting the X-axis, Y-axis, and Z-axis so that the desired position on the workpiece W is irradiated with the machining light EL, even if the workpiece W is displaced relative to the machining head 21 as the stage 31 rotates. In this case, the processing system SYSa may move the processing head 21 along the Z-axis direction (i.e., move it up and down) and also move the processing head 21 along at least one of the X-axis direction and the Y-axis direction. For example, when the workpiece W is displaced relative to the processing head 21 (relative to the processing coordinate system) in the XZ plane as shown in Figures 18(a) and 18(b), the processing system SYSa may move the processing head 21 in the XZ plane so that the processing light EL is irradiated onto a desired position on the workpiece W, even if the workpiece W is displaced relative to the processing head 21 as the stage 31 rotates.In this case, the machining system SYSa may move the machining head 21 along the Z-axis direction (that is, may move it up and down).

[0070] Even if the workpiece W is displaced relative to the machining head 21 (relative to the machining coordinate system) as the stage 31θZ rotates, the machining system SYSa can move the machining head 21 and irradiate the machining light EL at a desired position on the workpiece W. As a result, the machining system SYSa can irradiate the machining light EL at a desired position on the workpiece W without having to precisely position the workpiece W on the rotating stage 31.

[0071] To move the machining head 21, the machining system SYSa may use the measurement results of the position measuring instrument 33 that measures the position of the stage 31. For example, the machining system SYSa may calculate the rotation angle of the stage 31θZ around the rotation axis φZ based on the measurement results of the position measuring instrument 33, and move the machining head 21 based on the calculated rotation angle.

[0072] In addition, when the stage 31 is movable along at least one of the X-axis, Y-axis, and Z-axis, the processing system SYSa may move the stage 31 in addition to or instead of the processing head 21 so that the processing light EL is irradiated onto a desired position on the workpiece W even if the workpiece W is displaced relative to the processing head 21 as the stage 31 rotates. In other words, the processing system SYSa may move the workpiece W in addition to or instead of the processing head 21, taking into account the displacement of the workpiece W relative to the processing head 21 as the stage 31 rotates.

[0073] Furthermore, if the irradiation optical system 211 is equipped with an irradiation position changing optical member that is movable to change the irradiation position of the processing light EL on the workpiece W, the processing system SYSa may move the irradiation position changing optical member in addition to or instead of the processing head 21, taking into account the displacement of the workpiece W relative to the processing head 21 accompanying the rotation of the stage 31. An example of the irradiation position changing optical member is a galvanometer mirror 2111, as shown in FIG. 19 showing the configuration of the irradiation optical system 211. In this case, the processing system SYSa may move the galvanometer mirror 2111 (specifically, may control the movement of the galvanometer mirror 2111) taking into account the displacement of the workpiece W relative to the processing head 21 accompanying the rotation of the stage 31. Another example of the irradiation position changing optical member is a polygon mirror.

[0074] Next, the flow of the eccentricity amount obtaining operation for obtaining the eccentricity amount δ will be described with reference to Fig. 20. Fig. 20 is a flowchart showing the flow of the eccentricity amount obtaining operation.

[0075] As shown in FIG. 20, the control device 7 calculates the rotation axis φZ of the stage 31 (in the first embodiment, the rotation axis φZ of the stage 31θZ) using the measurement results of the stage 31 by the measuring device 4 (step S21). Note that specific details of the operation of calculating the rotation axis φZ will be described in detail later with reference to FIG. 21. Furthermore, the control device 7 calculates the rotation axis φW of the workpiece W before or after step S21 (step S22) using the measurement results of the workpiece W by the measuring device 4. Note that specific details of the operation of calculating the rotation axis φW will be described in detail later with reference to FIG. 22. Thereafter, the control device 7 calculates the amount of eccentricity δ based on the rotation axis φZ calculated in step S21 and the rotation axis φW calculated in step S22 (step S23).

[0076] The rotation axis φZ calculated in step S21 is information specific to the position of the stage 31. For this reason, the rotation axis φZ calculated in step S21 can also be said to be a specific example of stage position information related to the position of the stage 31. In this case, the control device 7 may calculate any stage position information related to the position of the stage 31 using the measurement results of the stage 31 by the measurement device 4 in addition to or instead of the rotation axis φZ. Thereafter, the control device 7 may calculate the amount of eccentricity δ based on the stage position information.

[0077] If the position of the rotation axis φZ and the position of the stage 31 are known, this step S21 does not need to be executed.

[0078] The rotation axis φ calculated in step S22 is information specific to the position of the workpiece W. For this reason, it can be said that the rotation axis φ calculated in step S22 is one specific example of workpiece position information related to the position of the workpiece W. In this case, the control device 7 may calculate any workpiece position information related to the position of the workpiece W using the measurement results of the workpiece W by the measuring device 4 in addition to or instead of the rotation axis φ. Thereafter, the control device 7 may calculate the eccentricity δ based on the workpiece position information.

[0079] The eccentricity δ calculated in step S23 can be said to be a specific example of positional relationship information regarding the positional relationship between the rotation axis φZ of the stage 31θZ and the workpiece W. In other words, the eccentricity δ calculated in step S23 can be said to be a specific example of positional relationship information regarding the positional relationship between the stage 31 and the workpiece W. In this case, the control device 7 may calculate any positional relationship information regarding the positional relationship between the rotation axis φZ of the stage 31θZ and the workpiece W, in addition to or instead of the eccentricity δ. Thereafter, in the additional machining operation, the machining system SYSa may move the machining head 21 based on the any positional relationship information, taking into account the displacement of the workpiece W relative to the machining head 21 that accompanies the rotation of the stage 31.

[0080] Next, the flow of the operation for calculating the rotation axis φZ of the stage 31θZ in step S21 of Fig. 20 will be described with reference to Fig. 21. Fig. 21 is a flowchart showing the flow of the operation for calculating the rotation axis φZ of the stage 31θZ in step S21 of Fig. 20.

[0081] As described above, the control device 7 calculates the rotation axis φZ of the stage 31θZ using the measurement results of the stage 31 by the measuring device 4. However, in the first embodiment, in order to make it easier to calculate the rotation axis φZ from the measurement results of the measuring device 4, the measuring device 4 measures at least a portion of the calibration plate 34 placed on the stage 31 instead of directly measuring at least a portion of the stage 31. In other words, the measuring device 4 indirectly measures at least a portion of the stage 31 by measuring at least a portion of the calibration plate 34 placed on the stage 31. However, the measuring device 4 may also directly measure at least a portion of the stage 31. For example, as will be described later, if a calibration pattern CP is formed on the stage 31, the measuring device 4 may directly measure at least a portion of the stage 31 (for example, the portion on which the calibration pattern CP is formed).

[0082] 21 , first, the calibration plate 34 is placed on the stage 31θZ of the stage 31 (step S210). In the eccentricity acquisition operation, as in the coordinate matching operation, the calibration plate 34 may be placed on the stage 31 so that the positional relationship between the calibration plate 34 and the stage 31θZ of the stage 31 is a desired positional relationship. However, the calibration plate 34 placed on the stage 31 in the eccentricity acquisition operation does not need to have the thermosensitive film 343 formed on it. Note that instead of the calibration plate 34, another calibration plate on which the desired calibration pattern CP is formed may be placed on the stage 31.

[0083] Thereafter, the control device 7 controls the stage driving system 32 so that the stage 31 is positioned at the origin position (step S211). The origin position may be a position where the rotation angle measured by the position measuring device 33 is zero.

[0084] Thereafter, the measurement device 4 measures at least a part of the calibration plate (step S212). Specifically, the measurement device 4 measures the calibration pattern CP formed on the calibration plate .

[0085] Thereafter, the control device 7 determines whether or not to end the measurement of the calibration plate 34 (step S213). For example, the control device 7 may determine to end the measurement of the calibration plate 34 when the measurement device 4 has measured the calibration plate 34 a first desired number of times. The first desired number of times is preferably at least two times.

[0086] As a result of the determination in step S213, if it is determined that the measurement of the calibration plate 34 should not be ended (step S213: No), the control device 7 rotates the stage 31θZ by a first desired angle around the rotation axis φZ (step S214). The first desired angle may be any angle less than 360 degrees. The first desired angle may be any angle that is not a multiple of 360 degrees. Thereafter, the measurement device 4 measures the calibration plate 34 again (step S211). That is, in the first embodiment, the measurement device 4 measures the calibration plate 34 each time the stage 31 rotates. The measurement device 4 measures the calibration plate 34 multiple times from different directions. The measurement device 4 measures the calibration plate 34 in different rotational orientations multiple times.

[0087] On the other hand, if it is determined in step S213 that the measurement of the calibration plate 34 is to be ended (step S213: Yes), the control device 7 calculates the rotation axis φZ of the stage 31θZ using the measurement result of the calibration plate 34 by the measurement device 4 in step S212 (step S215). Specifically, the control device 7 can calculate the position of the calibration pattern CP based on the measurement result of the calibration plate 34. The position of the calibration pattern CP essentially corresponds to the position of the stage 31 that supports the calibration plate 34. Therefore, the control device 7 may be considered to indirectly calculate the position of the stage 31 by calculating the position of the calibration pattern CP. The measurement device 4 may be considered to indirectly measure the position of the stage 31 by measuring the position of the calibration pattern CP. The control device 7 calculates the position of the calibration pattern CP the number of times the stage 31θZ has rotated. In other words, the control device 7 calculates the position of the calibration pattern CP for each rotation angle of the stage 31θZ during measurement of the calibration plate 34. The control device 7 then fits a circle to the position of the calibration pattern CP calculated for each rotation angle of the stage 31θZ. The control device 7 then calculates an axis that passes through the center of the circle obtained by fitting and is perpendicular to the circle as the rotation axis φZ of the stage 31θZ.

[0088] The control device 7 may calculate the rotation axis of the stage 31θX by performing the same operation as that shown in FIG.

[0089] Next, the flow of the operation for calculating the rotation axis φW of the workpiece W in step S22 of Fig. 20 will be described with reference to Fig. 22. Fig. 22 is a flowchart showing the flow of the operation for calculating the rotation axis φW of the workpiece W in step S22 of Fig. 20.

[0090] 22, first, the workpiece W is placed on the stage 31 (step S221). After that, the measuring device 4 measures at least a part of the workpiece W (step S222).

[0091] Thereafter, the control device 7 determines whether or not to end the measurement of the workpiece W (step S223). For example, the control device 7 may determine to end the measurement of the workpiece W when the measuring device 4 has measured the workpiece W a second desired number of times. The second desired number of times is preferably at least two times.

[0092] If it is determined in step S223 that the measurement of the workpiece W should not be ended (step S223: No), the control device 7 rotates the stage 31θZ by a second desired angle around the rotation axis φZ (step S224). The second desired angle may be an angle less than 360 degrees. The second desired angle may be an angle other than a multiple of 360 degrees. Thereafter, the measuring device 4 measures the workpiece W again (step S211). That is, in the first embodiment, the measuring device 4 measures the workpiece W each time the stage 31 rotates. The measuring device 4 measures the workpiece W multiple times from different directions. The measuring device 4 measures the workpiece W in different rotational orientations multiple times.

[0093] On the other hand, if it is determined in step S223 that the measurement of the workpiece W is to be terminated (step S223: Yes), the control device 7 calculates the rotation axis φW of the workpiece W using the measurement results of the workpiece W by the measuring device 4 in step S222 (step S225). Specifically, the control device 7 generates information regarding the position and / or shape of a portion of the workpiece W in a certain rotational orientation that is included in the measurement range of the measuring device 4, based on the measurement results of the workpiece W in a certain rotational orientation. As an example, the control device 7 may generate point cloud information regarding a plurality of points that constitute a portion of the surface of the workpiece W in a certain rotational orientation that is included in the measurement range of the measuring device 4, based on the measurement results of the workpiece W in a certain rotational orientation. The control device 7 repeats the operation of generating information regarding the position and / or shape of at least a portion of the workpiece W the number of times the workpiece W is measured. Thereafter, the information regarding the position and / or shape of at least a portion of the workpiece W is merged according to the rotational orientation of the workpiece W. For example, the control device 7 may generate first point cloud information from the measurement results of the workpiece W in a first rotational orientation, generate second point cloud information from the measurement results of the workpiece W in a second rotational orientation, and merge the first and second point cloud information based on the first and second rotational orientations. As a result, compared to when the measurement device 4 measures the workpiece W from only one direction, a larger area of ​​the surface of the workpiece W is occupied by the point cloud information. In other words, the control device 7 is more likely to grasp the entire image of the workpiece W. If it is determined that there is a portion of the workpiece W whose existence is not indicated by the merged point cloud information, the control device 7 may control the measurement device 4 to newly measure that portion and further merge the measurement results of this measurement device 4 into the merged point cloud information. The control device 7 then calculates the rotation axis φW of the workpiece W based on the merged point cloud information. For example, if a three-dimensional model of the workpiece W (e.g., design information) can be acquired, the control device 7 may fit the three-dimensional model of the workpiece W to the merged point cloud information and calculate the rotation axis φW of the workpiece W based on the fitted three-dimensional model.Alternatively, if a three-dimensional model of the workpiece W cannot be obtained, the control device 7 may generate a surface model (or a solid model) of the workpiece W based on the merged point cloud information, and calculate the rotation axis φW of the workpiece W based on the generated surface model (or solid model).

[0094] To summarize the control device 7 described above, in step S21 of FIG. 20, the control device 7 acquires multiple measurement results obtained by measuring the calibration plate 34 multiple times from different directions, and calculates the rotation axis φZ of the stage 31 based on the multiple measurement results. Furthermore, in step S22 of FIG. 20, the control device 7 acquires multiple measurement results obtained by measuring the workpiece W multiple times from different directions, and calculates the rotation axis φW of the workpiece W based on the multiple measurement results. Furthermore, the control device 7 calculates the eccentricity δ based on the calculated rotation axes φZ and φW. Therefore, the control device 7 may be considered to function as a measurement device or a calculation device including a measurement unit that acquires a first measurement result of the workpiece W measured from a first direction (i.e., the workpiece W in a first rotational orientation) and a second measurement result of the workpiece W measured from a second direction (i.e., the workpiece W in a second rotational orientation), and a relationship acquisition unit that acquires the eccentricity δ (i.e., information regarding the relationship between the rotation axis φZ and the workpiece W) based on the first and second measurement results. Furthermore, the eccentricity δ corresponds to a translation component excluding the rotational movement component among the movement components of one point of the workpiece W when the stage 31θZ is rotated (i.e., the workpiece W is rotated) in the eccentricity amount acquisition operation. For this reason, the control device 7 may be considered to function as a measurement device or a calculation device that includes a measurement unit that obtains a first measurement result of the workpiece W measured from a first direction (i.e., the workpiece W in a first rotational orientation) and a second measurement result of the workpiece W measured from a second direction (i.e., the workpiece W in a second rotational orientation), and a deviation acquisition unit that obtains, based on the first and second measurement results, a translation component excluding the rotational movement component among the movement components of one point of the workpiece W when the stage 31θZ is rotated (i.e., the workpiece W is rotated) in the eccentricity amount acquisition operation.

[0095] Here, the control device 7 obtains the rotation axis φW of the workpiece W from the point cloud information, but as described above, the control device 7 may obtain any information related to the position of the workpiece W from the point cloud information.

[0096] (1-3) Technical effects As described above, the machining system SYSa of the first embodiment can rotate the stage 31 based on the eccentricity δ obtained from the measurement results of the measuring device 4, and can move the machining head 21 in consideration of the displacement of the workpiece W relative to the machining head 21 that accompanies the rotation of the stage 31. Therefore, even if the workpiece W is displaced relative to the machining head 21 as the stage 31 rotates, the machining system SYSa can irradiate the machining light EL onto a desired position on the workpiece W. As a result, the machining system SYSa can properly machine the workpiece W. As an example, the machining system SYSa can machine the workpiece W with little machining error.

[0097] (2) Machining system SYS of the second embodiment Next, a processing system SYS of a second embodiment (hereinafter, the processing system SYS of the second embodiment will be referred to as "processing system SYSb") will be described. The processing system SYSb of the second embodiment differs from the processing system SYSa of the first embodiment described above in that it may perform removal processing to remove a portion of the workpiece W by irradiating the workpiece W with processing light EL. For example, the processing system SYSb may perform removal processing so that the shape of the workpiece W becomes a desired shape. For example, the processing system SYSb may perform removal processing so that a desired structure is formed in the workpiece W. For example, the processing system SYSb may perform removal processing so that a desired structure is formed on the surface of the workpiece W. For example, the processing system SYSb may perform removal processing so that the surface of the workpiece W is polished.

[0098] When performing removal processing, the processing system SYSb may form a riblet structure on the workpiece W. The riblet structure may be a structure that can reduce the resistance of the surface of the workpiece W to the fluid (particularly, at least one of frictional resistance and turbulent frictional resistance). The riblet structure may include a structure that can reduce noise generated when the fluid and the surface of the workpiece W move relative to each other. The riblet structure may include, for example, a structure in which grooves extending in a first direction (e.g., the Y-axis direction) along the surface of the workpiece W are arranged in a plurality of rows along a second direction (e.g., the X-axis direction) that is along the surface of the workpiece W and intersects the first direction.

[0099] When performing removal processing, the processing system SYSb may form an arbitrary structure having an arbitrary shape on the surface of the workpiece W. One example of the arbitrary structure is a structure that generates vortices in the flow of a fluid on the surface of the workpiece W. Another example of the arbitrary structure is a structure that imparts hydrophobicity to the surface of the workpiece W. Another example of the arbitrary structure is a regularly or irregularly formed fine texture structure (typically an uneven structure) on the order of micrometers or nanometers. Such a fine texture structure may include at least one of a shark skin structure and a dimple structure that have the function of reducing resistance caused by a fluid (gas and / or liquid). The fine texture structure may also include a lotus leaf surface structure that has at least one of a liquid-repellent function and a self-cleaning function (e.g., having the lotus effect). The fine texture structure may include at least one of a micro-protrusion structure having a liquid transport function (see U.S. Patent Publication No. 2017 / 0044002), a concave-convex structure having a lyophilic function, a concave-convex structure having an anti-fouling function, a moth-eye structure having at least one of a reflectance reducing function and a liquid repellent function, a concave-convex structure that exhibits a structural color by intensifying only light of a specific wavelength through interference, a pillar array structure having an adhesive function using van der Waals forces, a concave-convex structure having an aerodynamic noise reducing function, and a honeycomb structure having a droplet collecting function.

[0100] Such a processing system SYSb is shown in FIGS. 23 and 24. FIG. 23 is a block diagram showing the system configuration of the processing system SYSb. FIG. 24 is a cross-sectional view showing the structure of the processing system SYSb. As shown in FIGS. 23 and 24, the processing system SYSb differs from the processing system SYSa in that it may not include a material supply source 1 and a mixer 12. Furthermore, the processing system SYSb differs from the processing system SYSa in that it may not include a material nozzle 212. Specifically, the processing system SYSb differs from the processing system SYSa in that it includes a processing unit 2b including a processing head 21b not including a material nozzle 212, instead of the processing unit 2 including a processing head 21 including a material nozzle 212. In other words, the processing system SYSb differs from the processing system SYSa in that it may not include components for supplying the modeling material M. Other features of the processing system SYSb may be similar to other features of the processing system SYSa.

[0101] Like the machining system SYSa, the machining system SYSb described above may also move at least one of the machining head 21b and the stage 31 based on the results of the coordinate matching operation and the eccentricity amount acquisition operation when machining (i.e., removing) the workpiece W. For example, the machining system SYSb may rotate the stage 31 and move the machining head 21b (and further the stage 31) based on the results of the eccentricity amount acquisition operation while irradiating the workpiece W with the machining light EL. As a result, the machining system SYSb can enjoy the same effects as those that can be enjoyed by the machining system SYSa.

[0102] 19, the processing system SYSb may change the irradiation position of the processing light EL by the irradiation position changing optical member instead of or in addition to moving the processing head 21. In this case, the processing system SYSb may change the irradiation position of the processing light EL based on the amount of eccentricity δ obtained from the measurement result by the measuring device 4.

[0103] When performing removal processing, the processing system SYSb may irradiate the workpiece W with processing light EL including a plurality of pulsed lights. For example, the processing system SYSb may irradiate the workpiece W with processing light EL including a plurality of pulsed lights having an emission time of nanoseconds or less.

[0104] (3) Machining system SYS of the third embodiment Next, a processing system SYS of a third embodiment (hereinafter, the processing system SYS of the third embodiment will be referred to as the "processing system SYSc") will be described. The processing system SYSc of the third embodiment differs from the processing system SYSa of the first embodiment described above in that the workpiece W may be machined using a tool 215c (see FIGS. 25 and 21 described later) for machining the workpiece W in addition to or instead of the processing light EL. That is, the processing system SYSc differs from the processing system SYSa in that the workpiece W may be machined. For example, the processing system SYSc may cut, grind, polish, or cut the workpiece W by bringing a tool into contact with the workpiece W. For example, the processing system SYSc may machine the workpiece W so that the shape of the workpiece W has a desired shape. For example, the processing system SYSc may machine the workpiece W so that a desired structure is formed in the workpiece W. For example, the processing system SYSc may machine the workpiece W so that a desired structure is formed on the surface of the workpiece W. For example, the processing system SYSc may machine the workpiece W so that the surface of the workpiece W is polished.

[0105] Such a processing system SYSc is shown in FIGS. 25 and 26. FIG. 25 is a block diagram showing the system configuration of the processing system SYSc. FIG. 26 is a cross-sectional view showing the structure of the processing system SYSc. As shown in FIGS. 25 and 26, the processing system SYSc differs from the processing system SYSa in that it does not necessarily include a light source 5. Furthermore, the processing system SYSc differs from the processing system SYSa in that it does not necessarily include an irradiation optical system 211. Specifically, the processing system SYSc differs from the processing system SYSa in that it includes a processing unit 2c including a processing head 21c without an irradiation optical system 211, instead of a processing unit 2 including a processing head 21 including an irradiation optical system 211. In other words, the processing system SYSb differs from the processing system SYSa in that it does not necessarily include the components for irradiating the workpiece W with processing light EL. Furthermore, the processing system SYSc differs from the processing system SYSa in that it does not necessarily include the components for supplying the modeling material M, like the processing system SYSb. Furthermore, the machining system SYSc differs from the machining system SYSa in that it includes a machining head 21c equipped with a tool 215c instead of the machining head 21. Other features of the machining system SYSc may be similar to other features of the machining system SYSa.

[0106] Like the machining system SYSa, the machining system SYSc described above may also move at least one of the machining head 21c and the stage 31 based on the results of the coordinate matching operation and the eccentricity amount acquisition operation when machining (i.e., removing) the workpiece W. For example, the machining system SYSc may rotate the stage 31 and move the machining head 21c (and further the stage 31) based on the results of the eccentricity amount acquisition operation while the tool 215c is in contact with the workpiece W. As a result, the machining system SYSc can enjoy the same effects as those that can be enjoyed by the machining system SYSa.

[0107] (4) Machining system SYS of the fourth embodiment Next, a machining system SYS of a fourth embodiment (hereinafter, the machining system SYS of the fourth embodiment will be referred to as a "machining system SYSd") will be described with reference to Fig. 27. Fig. 27 is a block diagram showing the system configuration of the machining system SYSd of the fourth embodiment.

[0108] 27, the processing system SYSd of the fourth embodiment differs from the processing system SYSa in that it further includes a cooling device 9d. Other features of the processing system SYSd may be similar to other features of the processing system SYSa.

[0109] The cooling device 9d is a device for cooling the stage 31 (stage 31θZ in the fourth embodiment) on which the workpiece W is placed. Specifically, the workpiece W placed on the stage 31θZ is irradiated with processing light EL. When the processing light EL is irradiated onto the workpiece W, heat is transferred from the processing light EL to the workpiece W. When heat is transferred to the workpiece W, heat is transferred from the workpiece W to the stage 31θZ on which the workpiece W is placed. As a result, the temperature of the stage 31θZ may become relatively high. The cooling device 9d cools the stage 31θZ, the temperature of which may become relatively high in this way. Since the stage 31θZ is housed in the internal space of the housing 8, the cooling device 9d is also housed in the internal space of the housing 8.

[0110] The cooling device 9d may include an air-cooling type cooling device. For example, the cooling device 9d may cool the stage 31θZ by supplying gas to the stage 31θZ. That is, the cooling device 9d may cool the stage 31θZ by supplying gas to a space facing the stage 31θZ. The cooling device 9d may cool the stage 31θZ by forming a gas flow in the space facing the stage 31θZ. Hereinafter, with reference to FIG. 28, an example of a cooling device 9d that cools the stage 31θZ by supplying gas to a space facing the stage 31θZ will be described. FIG. 28 is a cross-sectional view showing an example of the structure of the cooling device 9d.

[0111] As shown in FIG. 28, the cooling device 9d may cool the stage 31θZ by supplying gas to the lower surface 312 of the stage 31θZ (i.e., the surface opposite to the upper surface 311) on which the workpiece W is placed. That is, the cooling device 9d may cool the stage 31θZ by supplying gas to a space SP1 facing the lower surface 312 of the stage 31θZ. The lower surface 312 of the stage 31θZ faces the stage 31θX. Therefore, the space SP1 may include at least a portion of the space between the lower surface 312 of the stage 31θZ and the stage 31θX. However, the cooling device 9d may cool the stage 31θZ by supplying gas to a space facing a surface other than the lower surface 312 of the stage 31θZ.

[0112] The cooling device 9d may supply gas to the space SP1 from below the stage 31θZ. When gas is supplied from below the stage 31θZ to the space SP1 facing the lower surface 312 of the stage 31θZ, the possibility of a gas flow being formed in the space facing the upper surface 311 of the stage 31θZ (i.e., the space facing the workpiece W) is reduced. Therefore, the modeling material M supplied to the workpiece W placed on the upper surface 311 is less likely to be blown away by the gas for cooling the stage 31θZ. Therefore, the material nozzle 212 can supply the modeling material M to the workpiece W without being affected by the gas for cooling the stage 31θZ.

[0113] Since the lower surface 312 of the stage 31θZ faces the stage 31θX, the cooling device 9d may supply gas to the space SP1 via the interior of the stage 31θX. The cooling device 9d may supply gas to the space SP1 via a gas supply path formed inside the stage 31θX. Specifically, as shown in FIG. 28, a supply path (in other words, a supply space) SP2 for supplying gas to the space SP1 may be formed inside the housing 313d of the stage 31θX. The supply path SP2 is connected to an opening 314d formed in the housing 313d to take gas from the outside of the housing 313d into the inside of the housing 313d (particularly, the supply path SP2). In this case, the cooling device 9d may include a fan 91d arranged in the opening 314d. The fan 91d is drivable to take gas from the outside of the housing 313d into the inside of the housing 313d (particularly, the supply path SP2). Furthermore, the supply path SP2 is connected to an opening 315d formed in the housing 313d to supply gas from the supply path SP2 inside the housing 313d to the space SP1 outside the housing 313d. The opening 315d is formed in a portion of the housing 8 facing the space SP1 (for example, a portion located below the stage 31θZ). In this case, the cooling device 9d takes in gas from outside the housing 313d into the supply path SP2 via a fan 91d arranged in the opening 314d, and supplies the taken-in gas to the space SP1 via the supply path SP2 and the opening 315d. As a result, a gas flow is formed in the space SP1, and the stage 31θZ is cooled by this gas flow. In this case, the gas supplied to the space SP1 may include at least a portion of the purge gas supplied from the gas supply source 6 to the inside of the housing 8.

[0114] A storage space SP3 may be formed inside the housing 313 of the stage 31θX to accommodate a motor 322θZ that can function as a rotation mechanism (movement mechanism) for rotating the stage 31θZ. The force generated by the motor 322θZ is transmitted to the stage 31θZ via a rotating shaft 321θZ, which is a power transmission mechanism (movement mechanism) connected to the stage 31θZ, and a belt 323θZ, which is a power transmission mechanism (movement mechanism) connecting the rotation axis of the motor 322θZ to the rotating shaft 321θZ. In this case, at least a portion of the rotating shaft 321θZ and the belt 323θZ may also be accommodated in the storage space SP3. The storage space SP3 may be spatially separated from the supply path SP2 by a partition member 36d. When the storage space SP3 is spatially separated from the supply path SP2 by the partition member 36d, the intrusion of the modeling material M into the storage space SP3 (resulting in contamination of the motor 322θZ and the like by the modeling material M) is suppressed. The rotation axis of the motor 322θZ and the rotation shaft 321θZ may be directly connected without the belt 323θZ.

[0115] The stage 31θX and the rotating shaft 321θX may be connected via a reducer 324d. For example, the reducer 324d may connect the lower surface of the stage 31θX and the rotating shaft 321θX. In this case, the reducer 324d may generate heat, but the reducer 324d may also be cooled by the flow of gas for cooling the stage 31θZ.

[0116] The cooling device 9d may further include an air guide member 92d. The air guide member 92d may function to return gas flowing from the space SP1 to the outside of the space SP1 back to the space SP1. As a result, the cooling efficiency of the stage 31θZ is increased compared to when the cooling device 9d does not include the air guide member 92d.

[0117] As described above, the machining system SYSd can cool the stage 31 (for example, the stage 31θZ) on which the workpiece W is placed, while enjoying the same effects as those enjoyed by the machining system SYSa.

[0118] At least one of the machining system SYSb of the second embodiment and the machining system SYSc of the third embodiment may include the cooling device 9d.

[0119] (5) Variations Next, a modified example of the machining system SYS will be described.

[0120] (5-1) Modified Examples of the Calibration Plate 34 In the above description, the thermosensitive film 343 formed on the calibration plate 34 is transparent to the measurement light ML of the measurement device 4. However, at least a part of the thermosensitive film 343 may be opaque to the measurement light ML of the measurement device 4.

[0121] 29 is a plan view showing an example of the calibration plate 34. In this case, the processing system SYS may irradiate the processing light EL onto the thermosensitive film 343 in the above-described calibration operation (step S12 in FIG. 6), then measure the calibration plate 34 on which the thermosensitive film 343 is formed to measure the thermosensitive pattern PP (step S13 in FIG. 6), and then, after the thermosensitive film 343 is removed, measure the calibration plate 34 from which the thermosensitive film 343 has been removed to measure the calibration pattern CP (step S13 in FIG. 6), and then associate the processing coordinate system with the stage coordinate system by merging the measurement results of the thermosensitive pattern PP and the measurement results of the calibration pattern CP.

[0122] 30, which is a plan view showing an example of the calibration plate 34, the thermosensitive film 343 may cover a portion of the calibration pattern CP. That is, other portions of the calibration pattern CP may not be covered by the thermosensitive film 343. In this case, in the calibration operation described above, the processing system SYS may irradiate the thermosensitive film 343 with the processing light EL (step S12 in FIG. 6), then measure the calibration plate 34 on which the thermosensitive film 343 is formed to measure the thermosensitive pattern PP and a portion of the calibration pattern CP (step S13 in FIG. 6), and then, after the thermosensitive film 343 is removed, measure the calibration plate 34 from which the thermosensitive film 343 has been removed to measure the calibration pattern CP (step S13 in FIG. 6), and then associate the processing coordinate system with the stage coordinate system by merging the measurement results of the thermosensitive pattern PP and the calibration pattern CP. In this case, the processing system SYS can merge the measurement results of the thermal pattern PP and the measurement results of the calibration pattern CP with relatively high accuracy by using the measurement results of a part of the calibration pattern CP included in both the measurement results of the thermal pattern PP and the measurement results of the calibration pattern CP (i.e., the part of the calibration pattern CP that was not covered by the thermal film 343). Note that even when the thermal film 343 is transparent, the thermal film 343 may cover a part of the calibration pattern CP while not covering another part of the calibration pattern CP.

[0123] 31, which is a plan view showing an example of the calibration plate 34, the thermosensitive film 343 may not cover the calibration pattern CP. That is, the thermosensitive film 343 may be formed on a first portion of the base member 341, and the calibration pattern CP may be formed on the first portion of the base member 341. Note that even when the thermosensitive film 343 is transparent, the thermosensitive film 343 may not cover the calibration pattern CP.

[0124] (5-2) Modified Examples of Calibration Pattern CP In the above description, the calibration pattern CP is formed on the calibration plate 34. However, the calibration pattern CP may be formed on a member other than the calibration plate 34. For example, the calibration pattern CP may be formed on a member (e.g., a reference member) other than the workpiece W placed on the stage 31. For example, as shown in FIGS. 32 to 34, the calibration pattern CP may be formed on the stage 31. Although FIGS. 32 to 34 show an example in which the calibration pattern CP is formed on the stage 31θZ, the calibration pattern CP may also be formed on the stage 31θX. FIG. 32 shows an example in which the calibration pattern CP is formed on the upper surface 311 of the stage 31θZ (i.e., the surface on which the workpiece W is placed). FIG. 33 shows an example in which the calibration pattern CP is formed on a surface of the upper surface 311 of the stage 31θZ that faces the workpiece W and is different from the holding surface 3111 that actually holds the workpiece W (e.g., the outer peripheral surface 3112 located outside the holding surface 3111). FIG. 34 shows an example in which the calibration pattern CP is formed on the side surface 316 of the stage 31θZ.

[0125] As shown in FIGS. 33 and 34 , when the calibration pattern CP is formed on a surface other than the holding surface 3111 of the stage 31θZ, the machining system SYS can perform the coordinate matching operation and the eccentricity acquisition operation described above with the workpiece W placed on the stage 31θZ. Furthermore, when the calibration pattern CP is formed on a surface other than the holding surface 3111 of the stage 31θZ, the machining system SYS can simultaneously measure at least a portion of the calibration pattern CP and at least a portion of the workpiece W in the eccentricity acquisition operation. In other words, the machining system SYS can measure at least a portion of the calibration pattern CP of the stage 31θZ together with at least a portion of the workpiece W. This eliminates the need to separately measure the calibration pattern CP by the measuring device 4 to calculate the rotation axis φZ of the stage 31θZ and the workpiece W by the measuring device 4 to calculate the rotation axis φW of the workpiece W. This reduces the time required for the eccentricity acquisition operation.

[0126] Since the stages 31θX and 31θZ each rotate, the calibration pattern CP may include a pattern that can identify the position of at least one of the rotating stages 31θX and 31θZ. For example, as shown in Figures 33 and 34, the calibration pattern CP may include an encoder pattern (e.g., a grating pattern). This encoder pattern may be an absolute pattern.

[0127] When the calibration pattern CP is formed on the stage 31, the measuring device 4 may measure the calibration pattern CP on the stage 31 while the workpiece W is placed on the stage 31.

[0128] In addition to or instead of a dedicated calibration pattern CP, an existing structure formed on the stage 31 may be used as at least a part of the calibration pattern CP. For example, a recess (e.g., an opening such as a screw hole) formed on the stage 31 may be used as at least a part of the calibration pattern CP. For example, a convex portion (e.g., a protrusion) formed on the stage 31 may be used as at least a part of the calibration pattern CP. In this case, the measuring device 4 may measure the existing structure used as at least a part of the calibration pattern CP while the workpiece W is placed on the stage 31.

[0129] (5-3) Other Modifications In the above description, the machining system SYS measures the calibration pattern CP to determine (i.e., calculate) the rotation axis φZ. However, the machining system SYS may measure at least a part of the calibration pattern CP to determine the rotation axis φX.

[0130] In the above description, the machining system SYS measures the calibration pattern CP to determine the rotation axis φZ (φX). However, the machining system SYS may measure at least a portion of the stage 31 (stage 31θZ) to measure the rotation axis φZ. For example, the machining system SYS may coordinate-match the three-dimensional shape measurement results of the stage 31 (stage 31θZ) with a previously prepared design model of the stage 31 (stage 31θZ) on the measurement coordinate system, and determine the rotation axis of the design model on the measurement coordinate system as the rotation axis to be obtained (e.g., the rotation axis φZ).

[0131] In the above description, the machining system SYS determines the rotation axis φZ (φX). However, the machining system SYS does not have to determine the rotation axis φZ (φX). For example, the machining system SYS may measure the three-dimensional shapes of at least a part of the stage 31 and at least a part of the workpiece W while holding the workpiece W on the stage 31, and match the measured point cloud information of the stage 31 and the measured point cloud information of the workpiece W with a design model of the stage 31 and a model of the workpiece W in a virtual coordinate system. The machining system SYS may then calculate the displacement of the workpiece W when the stage 31 is rotated in the virtual coordinate system, and use the calculation result to control the movement of the machining head 21.

[0132] In the above description, the workpiece W is cylindrical, but the shape of the workpiece W is not limited to a rotationally symmetric shape such as a cylindrical shape.

[0133] In the above explanation, detailed explanation of the holding method on the stage 31θZ has been omitted, but for example, as shown in Figures 35(a) and 35(b), the workpiece W may be fixed via one or more holding fittings 317 to a screw hole 31θZtp (see Figure 35(a)) provided in the stage 31θZ.

[0134] In the above description, the processing system SYS processes the workpiece W by irradiating the workpiece W with the processing light EL. However, the processing system SYS may also process the workpiece W by irradiating the workpiece W with an arbitrary energy beam. In this case, the processing system SYS may be equipped with a beam irradiation device capable of irradiating the arbitrary energy beam in addition to or instead of the light source 5 and the irradiation optical system 211. Examples of the arbitrary energy beam include at least one of a charged particle beam and an electromagnetic wave. Examples of the charged particle beam include at least one of an electron beam and an ion beam.

[0135] (6) Supplementary notes The following additional notes are provided regarding the above-described embodiment. [Appendix 1] 1. A processing system for processing an object using an energy beam, comprising: a holding unit capable of holding the object and a measuring member on which a sensitive film sensitive to the energy beam is formed; an irradiation device capable of irradiating the object and the measuring member with the energy beam; a position changing device that changes the relative positional relationship between the irradiation device and the holding unit; a measuring device that measures at least a portion of the measuring member; a control device for controlling the position changing device; Equipped with during at least a part of a first period in which the holding unit holds the measurement member, the position changing device changes a relative positional relationship between the irradiation device and the holding unit, and the irradiation device irradiates the energy beam onto at least a part of the sensitive film of the measurement member; The control device controls the position changing device based on a measurement result of the measurement member irradiated with the energy beam during at least a part of a second period in which the holding unit holds the object. Processing system. [Appendix 2] The measurement result of the measurement member irradiated with the energy beam includes a measurement result of a portion of the sensitive film that is sensitive to the energy beam. 10. The processing system of claim 1. [Appendix 3] a predetermined measurement pattern is formed on the measurement member, The sensitive film is transparent to measurement light used by the measurement device to measure the measurement member, and is formed so as to cover at least a part of the measurement pattern. 3. The processing system of claim 1 or 2. [Appendix 4] a predetermined measurement pattern is formed on the measurement member, the sensitive film is opaque to measurement light used by the measurement device to measure the measurement member and is formed so as to cover at least a part of the measurement pattern; During at least a part of the first period, the measuring device measures the sensitive member irradiated with the energy beam, and then measures the measuring member from which the sensitive film has been removed. 4. The processing system of any one of claims 1 to 3. [Appendix 5] During at least a portion of the second period, the control device controls the position changing device so that the irradiation device irradiates the energy beam at a desired position on the object. 5. The processing system of any one of claims 1 to 4. [Appendix 6] A measurement device that measures an object placed on a rotation device that can rotate a placed object, a measurement unit that obtains a first measurement result of the object on the rotation device and a second measurement result when measuring the object in a rotational orientation different from the rotational orientation of the object when the first measurement result is obtained; a relationship acquisition unit that acquires a relationship between the object and the rotation axis of the rotating device based on the first and second measurement results; A measuring device comprising: [Appendix 7] A measurement device that measures an object placed on a rotation device that can rotate a placed object, a measurement unit that obtains a first measurement result of the object on the rotation device and a second measurement result when measuring the object in a rotational orientation different from the rotational orientation of the object when the first measurement result is obtained; a deviation acquisition unit that calculates a translation component excluding a rotational component from translation components for a point on the object when the object is rotated, based on the first and second measurement results; A measuring device comprising: [Appendix 8] A calculation device connected to a measurement device that measures an object placed on a rotation device that can rotate a placed object, a measurement unit that obtains a first measurement result of the object on the rotation device and a second measurement result when measuring the object in a rotational orientation different from the rotational orientation of the object when the first measurement result is obtained; a relationship acquisition unit that acquires a relationship between the object and the rotation axis of the rotating device based on the first and second measurement results; A computing device comprising: [Appendix 9] A calculation device connected to a measurement device that measures an object placed on a rotation device that can rotate a placed object, a measurement unit that obtains a first measurement result of the object on the rotation device and a second measurement result when measuring the object in a rotational orientation different from the rotational orientation of the object when the first measurement result is obtained; a deviation acquisition unit that calculates a translation component excluding a rotational component from translation components for a point on the object when the object is rotated, based on the first and second measurement results; A computing device comprising: [Appendix 10] In a processing system for processing an object, a processing device for processing the object; a rotation device that rotates a holding portion that holds the object; a measuring device that measures at least a portion of the object held by the holding unit; a control device that controls the rotation device and the measurement device to rotate the holding unit after measuring the object and to measure the object after rotating the holding unit; A processing system comprising: [Appendix 11] The control device acquires position information of the object held by the holding unit based on a first measurement result obtained by measuring the object before rotating the holding unit and a second measurement result obtained by measuring the object after rotating the holding unit. 11. The processing system of claim 10. [Appendix 12] The processing device processes the object based on the position information of the object obtained by the control device. 12. The processing system of claim 11. [Appendix 13] The control device controls the rotation device and the measurement device so that, after obtaining the first measurement result, the object is rotated by a rotation angle less than 360 degrees, the object is measured, and a second measurement result is obtained. 13. The processing system of claim 11 or 12. [Appendix 14] The measuring device further includes an angle changing device for changing the angle of the rotation axis of the rotating device relative to the measurement axis of the measuring device. 14. The processing system of any one of appendixes 11 to 13.

[0136] At least some of the constituent elements of each of the above-described embodiments can be appropriately combined with at least some of the other constituent elements of each of the above-described embodiments. Some of the constituent elements of each of the above-described embodiments may not be used. Furthermore, to the extent permitted by law, the disclosures of all publications and U.S. patents cited in each of the above-described embodiments are incorporated herein by reference.

[0137] The present invention is not limited to the above-described embodiments, but can be modified as appropriate within the scope of the claims and the gist or idea of ​​the invention as can be read from the entire specification, and processing systems involving such modifications are also included in the technical scope of the present invention. [Explanation of symbols]

[0138] 2 Processing Unit 21 Processing head 22 Head drive system 3 Stage Unit 31, 31θX, 31θZ stage 32 Stage drive system 34 Calibration Plate 343 Heat-sensitive film 4. Measuring equipment 7 Control Device 9d cooling device 91d Fan 92d Air guide member double work EL processing light CP calibration pattern CM Calibration Marker

Claims

1. In a processing system for processing an object, a processing device for processing the object; a rotation device that rotates a holding portion that holds the object; a moving device that moves at least one of the processing device and the holding unit; a measuring device that measures at least a portion of the object held by the holding unit; a control device that controls the moving device and the rotating device based on the measurement result of the measuring device to rotate the holding unit and move at least one of the processing device and the holding unit; A processing system comprising:

2. While the object is being processed by the processing device, the holding unit is rotated and at least one of the processing device and the object is moved. The processing system of claim 1 .

3. Based on the measurement result of the measuring device, the moving device and the rotating device are controlled to move at least one of the processing device and the object in parallel with the rotation of the holding unit. The processing system according to claim 1 or 2.

4. The moving device moves at least one of the processing device and the holding unit in a plane perpendicular to the rotation axis of the rotating device. The processing system according to any one of claims 1 to 3.

5. The rotation axis of the rotation device is inclined with respect to the direction of movement of the movement device. The processing system according to any one of claims 1 to 4.

6. a rotation axis of the rotation device is inclined with respect to a direction of movement of the movement device, The moving device moves at least one of the processing device and the object up and down. The processing system according to any one of claims 1 to 5.

7. The processing device has an irradiation device, The object is processed by irradiating the object with an energy beam from the irradiation device. The processing system according to any one of claims 1 to 6.

8. the moving device moves the processing device, The irradiation position of the energy beam is moved by moving the processing device. The processing system according to claim 7 .

9. The movement of the processing device includes moving at least one optical member of the irradiation device. The processing system according to claim 7 or 8.

10. The processing device includes a material supply device that supplies a material toward an irradiation position of the energy beam. The processing system according to any one of claims 7 to 9.

11. The processing device irradiates the object with the energy beam to remove a part of the object. The processing system according to any one of claims 7 to 10.

12. The processing device machines the object. The processing system according to any one of claims 1 to 11.

13. the processing device comprises a tool for machining the object; The moving device moves the tool. The processing system of claim 12.

14. The measuring device measures the position of the object. The processing system according to any one of claims 1 to 13.

15. The control device generates positional relationship information regarding a positional relationship between the rotation axis of the rotation device and the object based on the measurement result.

15. The processing system according to any one of claims 1 to 14.

16. The control device generates object position information relating to the position of the object based on the measurement result, and generates the positional relationship information based on the object position information. The processing system of claim 15.

17. The control device generates the object position information using the measurement result and design information of the object. The processing system of claim 16.

18. The holding unit includes a stage on which the object is placed and which is rotated by the rotation device.

18. The processing system according to any one of claims 1 to 17.

19. The measuring device measures at least a portion of the holding portion together with the object.

19. The processing system of any one of claims 1 to 18.

20. The measuring device includes a three-dimensional measuring device that measures the object in three dimensions.

20. The processing system of any one of claims 1 to 19.

21. In a processing system for processing an object, a processing device that processes the object by irradiating the object with an energy beam; a moving device that moves at least one of the irradiation position of the energy beam and the object; a rotation device that rotates a holding portion that holds the object; a measurement device that measures at least a portion of the object; a control device that controls the moving device and the rotating device based on the measurement result of the measuring device to rotate the object and move at least one of the irradiation position and the object; A processing system comprising:

22. The moving device moves the processing device.

22. The processing system of claim 21.

23. In a processing system for processing an object, a processing device for processing the object; a rotation device that rotates a holding portion that holds the object; a moving device that moves at least one of the processing device and the holding unit; a measuring device that measures at least a portion of the object held by the holding unit; a control device that acquires a relationship between the object held by the holding unit and the rotation axis of the rotation device based on a measurement result of the measurement device; A processing system comprising:

24. The measurement device measures the object multiple times from different directions.

24. The processing system of any one of claims 1 to 23.

25. The rotation device rotates the holding unit during at least a portion of a period during which the measurement device measures at least a portion of the object.

25. The processing system of any one of claims 1 to 24.

26. The measuring device measures at least a portion of the object each time the rotation device rotates the holding unit.

26. The processing system of any one of claims 23 to 25.

27. the rotation device includes an angle detection unit that detects a rotation angle of the holding unit, The control device controls the moving device and the rotating device based on the output from the angle detection unit and the measurement result.

27. The processing system of any one of claims 23 to 26.

28. The measuring device measures at least a portion of the holding portion.

28. The processing system of any one of claims 1 to 27.

29. The measuring device measures the position of at least a part of the holding portion.

29. The processing system of claim 28.

30. the holding unit holds a measurement member on which a predetermined measurement pattern is formed, The measuring device measures at least a part of the holding portion by measuring at least a part of the measuring member.

30. The processing system according to claim 28 or 29.

31. A predetermined measurement pattern is formed on the holding portion.

31. The processing system of any one of claims 28 to 30.

32. the holding portion includes a holding surface that holds the object and another surface different from the holding surface, The measurement pattern is formed on the other surface.

32. The processing system of claim 31.

33. The rotation device rotates the holding unit during at least a portion of a period during which the measurement device measures at least a portion of the holding unit.

33. The processing system of any one of claims 28 to 32.

34. The measuring device measures at least a portion of the holding portion each time the rotating device rotates the holding portion.

34. The processing system of any one of claims 28 to 33.

35. The control device generates member position information regarding the position of the holding unit based on the measurement result of the holding unit by the measurement device, and generates positional relationship information regarding the relationship between the object held by the holding unit and the rotation axis of the rotation device based on the member position information.

35. The processing system of any one of claims 28 to 34.

36. The member position information includes information about the position of the rotation axis of the rotation device, which is the rotation center of the holding part.

36. The processing system of claim 35.

37. The measurement device includes a 3D scanner.

37. The processing system of any one of claims 1 to 36.

38. the holder includes a first surface on which the object is placed and a second surface different from the first surface, a cooling device for cooling the second surface 38. The processing system of any one of claims 1 to 37.

39. In a processing system for processing an object, a processing device for processing the object; a holder having a first surface on which the object is placed and a second surface different from the first surface; a cooling device that cools the second surface; A processing system comprising:

40. The cooling device includes a gas supply device that supplies gas to a space facing the second surface.

40. The processing system of claim 38 or 39.

41. In a processing system for processing an object, a processing device for processing the object; a holder having a first surface on which the object is placed and a second surface different from the first surface; a gas supply device that supplies gas to a space facing the second surface; A processing system comprising:

42. The gas supply device cools the second surface by supplying the gas to the space.

42. The processing system according to claim 40 or 41.

43. Further provided is a moving device that moves the holding portion, The gas supply device supplies the gas to the space through a supply path formed inside the moving device.

43. The processing system of any one of claims 40 to 42.

44. The gas supply device supplies the gas taken into the moving device from the outside to the inside of the moving device through the supply path to the space.

44. The processing system of claim 43.

45. The moving device includes a moving mechanism that moves the holding portion, a housing member in which the supply path and a housing portion that houses the moving mechanism are formed, and a partition member that separates the housing portion from the supply path.

45. The processing system of claim 43 or 44.

46. The air conditioner further includes a ventilation member for returning gas flowing from the space to the outside of the space back to the space.

46. ​​The processing system of any one of claims 40 to 45.

47. The second surface includes a surface opposite to the first surface.

47. The processing system of any one of claims 38 to 46.

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