Cryogen Supply System

Abstract

The invention relates to a cryogen supply system (1) for supplying a cryogen (H2) to a consumer (2), comprising a process pipe (4) through which the cryogen (H2) can be conducted, a protective barrier (5) in which the process pipe (4) is received, a gap (6) provided between the process pipe (4) and the protective barrier (5), a heat transfer device (13) arranged in the gap (6) and designed to transfer heat (Q) from the process pipe (4) to the protective barrier (5) or vice versa, and a temperature sensor (11) arranged outside the protective barrier (5) to detect the temperature of the cryogen (H2), the temperature sensor (11) being thermally coupled to the heat transfer device (13).

Description

[Technical field]

[0001] The present invention relates to a cryogen supply system for supplying cryogen to a consumer.

[0002] In cryogenic operation of liquefied media, it is often necessary to measure the process temperature of the respective medium, especially the cryogen, in the vessel or pipe. According to in-house knowledge, this temperature measurement can be performed using a temperature sensor mechanically and thermally connected directly to the process pipe. Direct measurement is difficult to achieve, especially at high pressure. If the process pipe is housed in a pressure-resistant insulated pipe for good insulation, piercing the insulated pipe with a feed-through for cable wiring or for a temperature sensor is undesirable from a safety and operational point of view. Piercing the insulating tube can result in loss of vacuum in the respective insulating pipe. This can in turn result in loss of the insulating effect and failure of the affected area. Finding leaks and repairing such systems is laborious and time-consuming. This must be improved.

[0003] Against this background, it is an object of the present invention to provide an improved cryogen delivery system.

[0004] Therefore, a cryogen supply system for supplying a cryogen to a consumer is proposed, comprising a process pipe through which a cryogen can be conducted, a protective barrier in which the process pipe is received, a gap provided between the process pipe and the protective barrier, a heat transfer device arranged in the gap and designed to transfer heat from the process pipe to the protective barrier or vice versa, and a temperature sensor arranged outside the protective barrier for detecting the temperature of the cryogen, the temperature sensor being thermally coupled to the heat transfer device.

[0005] Since the temperature sensor is located outside the protective barrier and the heat conduction device takes care of the heat transfer from the process pipe to the protective barrier and vice versa, it is advantageously possible to avoid having to penetrate the protective barrier to place the temperature sensor.

[0006] The cryogen is preferably hydrogen. The terms "cryogen" and "hydrogen" are therefore interchangeable as desired. In principle, however, the cryogen may be any other cryogen. Examples of cryogenic fluids or liquids, or cryogen for short, are liquid helium, liquid nitrogen or liquid oxygen, in addition to the aforementioned hydrogen. "Cryogen" should therefore be understood in particular as a liquid. The cryogen may therefore also be referred to as a cryogenic fluid. The cryogen may be vaporized and thus converted into the gas phase. After vaporization, the cryogen is a gas or may be referred to as a gaseous or vaporized cryogen. The term "cryogen" may therefore include both, i.e. the gas and liquid phases. As mentioned above, the liquid phase may also be referred to as a cryogenic fluid. Here, the term "vaporized cryogen" preferably refers only to the gas phase of the cryogen.

[0007] A gaseous region and an underlying liquid region are formed in the cryogen supply system after or during the cryogen filling operation. A phase boundary is created between the gaseous and liquid regions. It is therefore preferred that after the filling operation the cryogen has two phases of different coherence states, namely a liquid phase and a gaseous phase. The liquid state phase can transition to the gaseous phase and vice versa. The liquid phase can be referred to as the liquid phase. The gaseous phase can be referred to as the gaseous phase. A purely liquid filling of the cryogen supply system is also possible.

[0008] The consumer is preferably a fuel cell. In the present invention, "fuel cell" is understood to mean a galvanic cell that converts the energy of a chemical reaction of a continuously supplied fuel (in the present case, hydrogen) and of an oxidant (in the present case, oxygen) into electrical energy. The cryogen is supplied to the consumer itself, in particular in gaseous form, at a defined supply pressure. This means that the cryogen is completely vaporized before or upstream of the consumer. For example, the cryogen is supplied to the consumer at a supply pressure of 1 bar to 2.5 bar and at a temperature of +10°C to +25°C. However, the supply pressure can be up to 6 bar.

[0009] The cryogen supply system may also be referred to as a hydrogen supply system. The cryogen supply system is in particular a pipe for conveying or transporting a cryogen. Alternatively, the cryogen supply system may also be a storage container or a storage tank for storing a cryogen. Therefore, the cryogen supply system may also be referred to as a cryogen supply pipe or a cryogen storage container. In the following, it is assumed that the cryogen supply system is a pipe, in particular a cryogen supply pipe. The heat conducting device may also be referred to as a heat transferring device.

[0010] The process pipe is in particular in direct contact with the cryogen. In particular, this means that the cryogen is led through the process pipe. The cryogen supply system is assigned a central axis or an axis of symmetry, about which the process pipe and the protective barrier can be configured to be rotationally symmetric. The protective barrier completely surrounds the process pipe in the circumferential direction. This in particular means that the protective barrier completely surrounds the process pipe in the circumferential direction. The gap provided between the process pipe and the protective barrier can be filled at least partially with a damping or insulating element. The gap can also be exposed to negative pressure or vacuum. The gap can also be filled with a gas.

[0011] With the aid of the heat conducting device it is possible to transfer heat from the process pipe through which the cryogen flows to the protective barrier and vice versa. The temperature sensor itself is preferably in contact with the protective barrier. Thus, heat transferred from the process pipe via the heat conducting device to the protective barrier can be transferred to the temperature sensor and vice versa. Thus, it is possible to determine the temperature of the process pipe or the cryogen at least indirectly.

[0012] The fact that the temperature sensor is arranged "outside" the protective barrier means in particular that the temperature sensor is not arranged inside the gap. In particular, the temperature sensor is arranged outside the gap. The thermal coupling of the temperature sensor to the heat-conducting device is preferably performed indirectly via the protective barrier, which is arranged between the heat-conducting device and the temperature sensor. The heat-conducting device thus transfers heat to the protective barrier or vice versa, and the protective barrier in turn transfers heat to the temperature sensor or vice versa. The temperature sensor may be called a temperature recording device. A plurality of temperature sensors may be provided.

[0013] According to one embodiment, the heat transfer device is connected to the process pipe and / or the protective barrier in a press-fit, integral and / or form-fit manner.

[0014] Preferably, the heat transfer device comprises an annular base element having a cylindrical outside and a cylindrical inside. In particular, the inside is at least thermally conductively connected to the process pipe. The outside is therefore in particular at least thermally conductively connected to the protective barrier. A force-lock connection requires a normal force on the surfaces to be joined. A force-lock connection can be achieved by friction locking. Displacement of the surfaces relative to each other is prevented, as long as the reaction force caused by static friction is not exceeded. For example, the heat transfer device is pressed or contracted onto the process pipe. Thus, the heat transfer device can be pressed into the protective barrier. Assuming an integrally joined connection, the connection partners are held together by atomic or molecular forces. An integral connection is a non-releasable connection that can only be separated by destroying the connection means and / or the connection partners. For example, the base element is glued, soldered, in particular brazed and / or welded to the process pipe and / or the protective barrier. A form-fit connection is created by at least two connection partners engaging with each other or behind each other.

[0015] According to a further embodiment, the heat-conducting device comprises a slot extending along a radial direction of the heat-conducting device, completely passing through the heat-conducting device.

[0016] The heat-conducting device is preferably assigned an aforementioned axis of symmetry, with respect to which the heat-conducting device is designed to be essentially rotationally symmetric. The aforementioned base element of the heat-conducting device is also designed to be rotationally symmetric with respect to the axis of symmetry. The slots extend from the inside of the base element to the outside of the base element. The radial direction is oriented perpendicular to and away from the axis of symmetry. The heat-conducting device or the base element thus has an annular geometry, but the annular geometry is not closed but open. Providing slots allows the heat-conducting device to be elastically deformed and, for example, to expand or compress the heat-conducting device in the radial direction. This can be advantageous when installing the heat-conducting device.

[0017] According to further embodiments, the heat-conducting device is fluid-permeable or fluid-impermeable.

[0018] For example, the gap is filled with a gas. If the heat-conducting device is fluid-permeable, the gas can pass through the heat-conducting device. For this purpose, holes, openings or recesses can be provided. This avoids dividing the gap into separate gas or pressure chambers. If the heat-conducting device is fluid-impermeable, the gas cannot pass through the heat-conducting device. This allows dividing the gap into several gas or pressure chambers.

[0019] According to a further embodiment, the heat-conducting device has a recess designed as a through hole or as a blind hole.

[0020] The recesses are provided in particular in or on the base element. The base element thus comprises recesses. The number of recesses is freely selectable. The recesses can have any cross-sectional geometry. For example, the recesses are circular or polygonal in cross section. At the same time, recesses designed as through holes as well as recesses designed as blind holes can be provided. With the help of recesses, the thermal conductivity of the heat-conducting device can be varied, in particular reduced, from area to area. This is achieved by using recesses to locally reduce the material thickness of the heat-conducting device or the base element. This leads to a reduction in the heat conduction in the area of ​​the respective recess. The recesses act as a thermal insulator. In areas without recesses, the thermal conductivity remains unchanged. These areas without recesses can therefore be used for targeted local heat conduction. The heat-conducting device or the base element can therefore have a spoked wheel-like geometry. If the recesses are through holes, the gas in the gap can flow through them.

[0021] According to a further embodiment, the recess is at least partially filled with plastic material.

[0022] This further deteriorates the thermal conductivity of the heat-conducting device in some areas. For example, polytetrafluoroethylene (PTFE) can be used as a suitable plastic material. For example, the plastic material is provided in the form of a plug that is accommodated in the recess. If the recess is designed as a through hole, with the help of the plastic material the recess can be sealed liquid-tight.

[0023] According to a further embodiment, the recesses are unevenly spaced apart from one another in the circumferential direction of the heat conducting device such that at least one recess-free area is provided between two adjacent recesses.

[0024] In this case, "without recesses" means that no recesses are provided in the aforementioned area. This area is therefore solid. This means that the area without recesses has an increased or improved thermal conductivity compared to the recesses. This allows the transfer of heat, in particular from the process pipe to the protective barrier, preferably only in the area where the temperature sensor contacts the protective barrier.

[0025] According to a further embodiment, the gap is filled with a gas, in particular with helium.

[0026] In particular, the gas must be selected so that it does not condense during operation of the cryogen supply system. When using a cryogen supply system with hydrogen, helium is particularly suitable as a gas for filling the gaps. Helium does not condense at the temperatures that occur with liquid hydrogen. However, other suitable gases may also be used.

[0027] According to a further embodiment, the cryogen supply system further comprises a vacuum envelope in which the protective barrier is housed, and a gap provided between the protective barrier and the vacuum envelope.

[0028] The gap provided between the process pipe and the protective barrier may be referred to as the first gap. The gap provided between the protective barrier and the vacuum envelope may therefore be referred to as the second gap. The vacuum envelope is in particular tubular. The vacuum envelope may therefore also be referred to as the vacuum pipe. The vacuum envelope completely surrounds the protective barrier in the circumferential direction, which in turn completely surrounds the process pipe in the circumferential direction. In particular, this means that the cryogen supply system is three-layered, with the process pipe forming the innermost or first layer or the innermost or first envelope, the protective barrier forming the second layer or the second envelope, and the vacuum envelope forming the third layer or the third envelope. The process pipe, the protective barrier and / or the vacuum envelope may be made of a metallic material, such as an aluminum alloy or stainless steel.

[0029] According to a further embodiment, the temperature sensor is guided through the vacuum envelope and the gap to the protective barrier.

[0030] This allows the temperature sensor to be in direct contact with the protective barrier, and thus the temperature sensor is provided at least partially within the second gap provided between the vacuum envelope and the protective barrier.

[0031] According to a further embodiment, the cryogen supply system further comprises a protective tube in which the temperature sensor is housed, the protective tube being led through the vacuum envelope and the gap to the protective barrier.

[0032] In particular, the protective tube is arranged perpendicular to the axis of symmetry of the cryogen supply system. The protective tube may have a cover or closure at the end face that is in contact with the protective barrier. In this case, the temperature sensor is in contact with this cover or closure. Alternatively, the protective tube can be directly connected to the protective barrier, such that the temperature sensor housed in the protective tube is in direct contact with the protective barrier. In this case, the protective tube does not have a cover or closure.

[0033] According to a further embodiment, the protective tube is liquid-tightly connected to the vacuum envelope.

[0034] In particular, the protective tube is integrally connected to the vacuum envelope, for example by being soldered, in particular brazed or welded into the vacuum envelope, or the protective tube can also be integrally connected to the protective barrier.

[0035] According to a further embodiment, the heat-conducting device comprises a heat-conducting element for transferring heat from the process pipe to the protective barrier or vice versa.

[0036] The heat conducting elements offer the possibility of localizing the heat transfer. They can be cylindrical or rod-shaped. They can also be called heat transferring ribs. They can also be called heat transferring elements.

[0037] According to a further embodiment, the heat-conducting device comprises a base element carrying the heat-conducting element, the thermal conductivity of the material from which the heat-conducting element is made being greater than the thermal conductivity of the material from which the base element is made.

[0038] For example, the base element may be made of rust-resistant steel or stainless steel. In this case, the heat conducting element may be made of, for example, a copper alloy or an aluminum alloy. A plurality of heat conducting elements may be provided. The number of heat conducting elements is essentially freely selectable. For example, exactly one heat conducting element may be provided. However, two, three or more than three heat conducting elements may also be provided.

[0039] According to a further embodiment, the base element has a bore in which the heat conducting element is received, the axis of symmetry of the bore being oriented perpendicular to the axis of symmetry of the heat conducting device.

[0040] For example, the heat conducting element is press-fitted into a bore in the base element, the bore extending from the outside to the inside of the base element, the bore therefore passing completely through the base element when viewed along a radial direction.

[0041] In the present invention, "a" should not necessarily be understood as limiting to exactly one element. Rather, several elements, such as two, three, or more, may be provided. Any other number words used herein should also not be understood as limiting to the exact number of elements referred to. Rather, unless otherwise indicated, the number may deviate upwards or downwards.

[0042] Further possible implementations of the cryogen supply system include not explicitly mentioned combinations of the above or below features or embodiments, in which case the person skilled in the art will also add individual aspects as improvements or additions to the respective basic form of the cryogen supply system. [Brief description of the drawings]

[0043] Further advantageous embodiments and aspects of the cryogen supply system are the subject of the dependent claims and of embodiments of the invention described below. The cryogen supply system is explained in more detail below on the basis of preferred embodiments and with reference to the attached drawings. [Figure 1] 1 is a schematic cross-sectional view of an embodiment of a cryogen supply system. [Diagram 2] FIG. 2 is a schematic plan view of a heat-conducting device for the cryogen supply system according to FIG. 1; [Diagram 3] 3 is a schematic cross-sectional view of the heat-conducting device according to section line III-III in FIG. 2; [Figure 4] 4 is a further schematic cross-sectional view of the heat conducting device according to section line IV-IV of FIG. 2;

[0044] In the figures, unless stated otherwise, identical or functionally equivalent elements are provided with the same reference numbers.

[0045] 1 is a schematic cross-sectional view of an embodiment of a cryogen supply system 1. The cryogen supply system 1 can be a pipe or a container. The cryogen supply system 1 is suitable for supplying a cryogen, in particular hydrogen H2, to a consumer 2, for example a fuel cell. The cryogen supply system 1 can therefore also be referred to as a hydrogen supply system.

[0046] Furthermore, the cryogen supply system 1 may also be suitable for storing hydrogen H2. The cryogen supply system 1 may be a storage container for storing hydrogen H2. However, the cryogen supply system 1 may also be a pipe for conveying or transporting hydrogen H2. In the following, it is assumed that the cryogen supply system 1 is a pipe or a transport line.

[0047] The cryogen supply system 1 is suitable for receiving and / or delivering liquid hydrogen H2 (boiling point at 1 bar: 20.268 K = -252.882 ° C). However, the cryogen supply system 1 can also be used for other cryogenic liquids or cryogens. Examples of cryogenic fluids or liquids, or cryogens for short, are liquid helium He in addition to the aforementioned liquid hydrogen H2 (boiling point at 1 bar: 4.222 K = -268.928 ° C), liquid nitrogen N2 (boiling point at 1 bar: 77.35 K = -195.80 ° C) or liquid oxygen O2 (boiling point at 1 bar: 90.18 K = -182.97 ° C).

[0048] The cryogen supply system 1 is suitable for use in or on a vehicle (not shown). The vehicle may for example be a seagoing vessel, in particular a ship. The vehicle may be referred to as a marine vehicle. In particular, the vehicle may be a seagoing passenger ferry. Alternatively, the vehicle may also be a land vehicle. However, in the following it is assumed that the vehicle is a ship.

[0049] In the present case, a "fuel cell" is understood to mean a galvanic cell that converts the energy of a chemical reaction of a continuously supplied fuel, in this case hydrogen, and an oxidant, in this case oxygen, into electrical energy. The electrical energy obtained can, for example, power an electric motor (not shown), which in turn drives a ship's screw for propelling the ship. The cryogen supply system 1 is intended to supply hydrogen H2 to a consumer 2.

[0050] The cryogen supply system 1 is suitable for supplying gaseous hydrogen H2 at a defined supply pressure and a defined supply temperature to a consumer 2, which in the present case is preferably a fuel cell. For example, hydrogen H2 is supplied to the consumer 2 at a supply pressure of 1 to 2.5 bar and at a temperature of +10 to +25° C. However, the supply pressure may be up to 6 bar.

[0051] The cryogen supply system 1 is a pipe and may therefore also be referred to as a cryogen supply pipe. The cryogen supply system 1 is rotationally symmetrical with respect to a central axis or axis of symmetry 3. A longitudinal direction L of the cryogen supply system 1 is oriented along the axis of symmetry 3. The cryogen supply system 1 comprises a main or process pipe 4 through which the liquid hydrogen H2 is conducted. The process pipe 4 is in direct contact with the liquid hydrogen H2. The process pipe 4 may be made of a metallic material, in particular stainless steel.

[0052] The process pipe 4 is received in a tubular protective barrier 5 that circumferentially surrounds the process pipe 4. An intermediate space or gap 6 is provided between the process pipe 4 and the protective barrier 5. The gap 6 can be filled with an inert gas, for example nitrogen or helium He. The gap 6 can also be subjected to negative pressure or vacuum. In a vacuum, a negative pressure exists compared to the environment 7 of the cryogen supply system 1. Damping or insulating elements can be provided in the gap 6, which at least partially or completely fill the gap 6. The insulating elements can have or be designed as a multilayer insulation (MLI). The protective barrier 5 can be made of a metallic material, for example an aluminum alloy or stainless steel.

[0053] A tubular vacuum envelope 8 surrounds the protective barrier 5. An intermediate space or gap 9 is provided between the protective barrier 5 and the vacuum envelope 8. The gap 9 may be subjected to negative pressure or vacuum. Damping or insulating elements may be provided in the gap 9, which at least partially or completely fill the gap 9. The insulating elements may comprise or be designed as multi-layer insulation layers as described above. The vacuum envelope 8 may be made of a metallic material, for example an aluminum alloy or stainless steel. The vacuum envelope 8 separates the cryogen supply system 1 from the environment 7.

[0054] The cryogen supply system 1 further comprises a temperature measuring device 10 having a temperature sensor 11, with the help of which the temperature of the liquid hydrogen H2 in the process pipe 4 can be acquired. In addition to the temperature sensor 11, the temperature measuring device 10 comprises a protective tube 12 arranged perpendicular to the axis of symmetry 3. The temperature sensor 11 is housed in the protective tube 12.

[0055] The protective tube 12 is guided through the vacuum envelope 8 to the protective barrier 5 such that the protective tube 12 abuts against the protective barrier 5. The protective tube 12 therefore extends through the gap 9. The protective tube 12 can be soldered or welded into the vacuum envelope 8. The protective tube 12 does not penetrate the protective barrier 5. However, the protective tube 12 can be connected to the protective barrier 5 at the end face, for example soldered or welded to the protective barrier 5. The protective tube 12 is therefore closed at the end face by the protective barrier 5. Alternatively, the protective tube 12 can be closed fluid-tight towards the protective barrier 5, such as with a cover. In the latter case, the cover can for example abut against the protective barrier 5. Viewed with respect to the direction of gravity g, the protective tube 12 is arranged at the lowest point or area of ​​the protective barrier 5.

[0056] The temperature measuring device 10 further comprises a heat transfer or conduction device 13 for transferring or conducting heat Q from the process pipe 4 to the protective barrier 5 and vice versa. The heat conduction device 13 is therefore also suitable for transporting heat Q from the liquid hydrogen H2 flowing through the process pipe 4 to the temperature sensor 11 and vice versa. The heat conduction device 13 is envelope-shaped or ring-shaped and surrounds the process tube 4. The heat conduction device 13 may also be referred to as a heat conduction envelope or a heat conduction ring. The heat conduction device 13 is arranged in the gap 6. For example, the heat conduction device 13 is integrally connected to the process pipe 4 and to the protective barrier 5.

[0057] Assuming an integrally bonded connection, the connection partners are held together by atomic or molecular forces. A bonded connection is a non-releasable connection that can only be separated by destroying the connection means and / or the connection partners. An integrally bonded connection can be brought about for example by adhesive bonding, brazing, soldering or welding. This means that the heat transfer device 13 is adhesively bonded, soldered, in particular brazed and / or welded to the process pipe 4 and / or to the protective barrier 5. Optionally or additionally, force-lock and / or form-lock connections can also be provided.

[0058] Fig. 2 is a schematic cross-sectional view of an embodiment of the above-mentioned heat-conducting device 13. Fig. 3 is a further schematic cross-sectional view of the heat-conducting device 13 taken along line III-III in Fig. 2. Fig. 4 is a further schematic cross-sectional view of the heat-conducting device 13 taken along line IV-IV in Fig. 2. In the following, Figs. 2 to 4 will be simultaneously referred to.

[0059] The heat-conducting device 13 comprises a base body or base element 14. The base element 14 is ring-shaped or envelope-shaped and is designed to be rotationally symmetrical with respect to a central axis or axis of symmetry 15. A cylindrical exterior 16 of the base element 14 is thermally conductively coupled to the protective barrier 5. For example, the exterior 16 is integrally connected to the protective barrier 5. The exterior 16 is rotationally symmetrical with respect to the axis of symmetry 15. The axes of symmetry 3, 15 may be arranged coaxially with each other.

[0060] Facing away from the outer side 16, the base element 14 has a cylindrical inner side 17 which defines in its center an opening 18 through the heat-conducting device 13. The process pipe 4 is passed through the opening 18. The inner side 17 is thermally conductively coupled to the process pipe 4. For example, the inner side 17 is integrally connected to the process pipe 4. The inner side 17 is designed to be rotationally symmetrical with respect to the axis of symmetry 15.

[0061] When viewed along the circumferential direction U oriented along the outer side 16 or along the inner side 17, the heat conduction device 13 or base element 14 is not annularly closed, but rather open, and has a gap or slot 19 oriented perpendicular to the axis of symmetry 15 and extending from the inner side 17 to the outer side 16 when viewed along the radial direction R away from the axis of symmetry 15, thus passing completely through the base element 14.

[0062] The heat-conducting device 13 or base element 14 comprises a first end face 20 and a second end face 21 facing away from the first end face 20. A number of recesses 22-29 extend from at least one end face 20, 21 into or through the base element 14. The recesses 22-29 can be designed as blind holes, as shown in FIG. 4 for the recess 22. Alternatively, the recesses 22-29 can be through holes, as shown in FIG. 4 for the recess 27. Each recess 22-29 is assigned a central or symmetry axis 30, 31 arranged parallel to the axis of symmetry 15 and spaced apart from the axis of symmetry 15 along the radial direction R.

[0063] With the help of the recesses 22-29 it is possible to design the heat conducting device 13 in such a way that as little material as possible is arranged between the inside 17 and the outside 16. The recesses 22-29 impede the transport of heat Q from the inside 17 to the outside 16 and vice versa. The area 32 between the recesses 22 and 29 is free of bores or recesses, i.e. solid. This means that the area 32 is not provided with the recesses 22-29. As a result, the heat conduction in the area 32 is improved compared to the recesses 22-29.

[0064] If the recesses 22-29 are formed as through holes, it is possible that a gas, for example helium He, received in the gap 6 can flow through the heat-conducting device 13. The heat-conducting device 13 is therefore fluid-permeable. The heat-conducting device 13 can be designed, for example, as a fluid-permeable spoked wheel. However, this is not necessary. This means that the heat-conducting device 13 can also be liquid-tight.

[0065] The recesses 22-29 can be filled with a material that is a poor thermal conductor, such as a plastic material. Polytetrafluoroethylene (PTFE) can be used as the plastic material. The plastic material can be in the form of a plug that closes the recesses 22-29. If the recesses 22-29 are filled with a plastic material, it is possible to prevent the gas contained in the gap 6, in particular the helium He, from flowing through the heat-conducting device 13. Alternatively, the recesses 22-29 are designed as blind holes. Due to the liquid-tightness of the heat-conducting device 13, local convective transfer of heat Q via the gas contained in the gap 6, in particular the helium He, can be avoided or at least reduced.

[0066] The base element 14 has a bore 33 having a central axis or axis of symmetry 34 oriented perpendicular to the axis of symmetry 15. The bore 33 extends from the outer side 16 towards the inner side 17. The bore 33 penetrates both the outer side 16 and the inner side 17. A heat conducting element 35 is housed within the bore 33. The heat conducting element 35 may also be referred to as a heat conducting rib.

[0067] The heat conducting element 35 is cylindrical. The heat conducting element 35 may be press-fitted into the bore 33. The heat conducting element 35 contacts both the process pipe 4 and the protective barrier 5 and thus serves to transfer heat Q from the process pipe 4 to the protective barrier 5 and vice versa. Two or more heat conducting elements 35 may be provided. The heat conducting element 35 is disposed within the region 32.

[0068] The heat conducting element 35 may also be referred to as a heat transfer element, a heat conductor, a heat conducting insert, or a conductor insert. The heat conducting element 35 is made of a material that has a better thermal conductivity than the material from which the base element 14 is made. For example, the heat conducting element 35 is made of a copper alloy or an aluminum alloy. The base element 14 itself may be made of, for example, stainless steel, which has a lower thermal conductivity than the material used for the base element 14. The base element 14 may also be made of a plastic material, particularly a plastic material that does not have to worry about outgassing.

[0069] As a result, heat transfer occurs from the hydrogen H2 to the process tube 4, from the process tube 4 to the heat transfer element 35, from the heat transfer element 35 to the protective barrier 5 and from the protective barrier 5 (optionally with the interposition of the protective tube 12) to the temperature sensor 11, or vice versa. If the heat transfer device 13 does not have a heat transfer element 35, the base element 14 itself takes care of the heat transfer.

[0070] With the help of the heat-conducting device 13 it is therefore possible to carry out a temperature measurement which reacts quickly enough from a process engineering point of view and at the same time allows as little heat transfer as possible. Advantageously, the protective barrier 5 is not penetrated or damaged for the temperature measurement. Advantageously, the heat-conducting device 13 does not result in a segmentation of the gap 6. This can be achieved by the fluid-permeability of the heat-conducting device 13.

[0071] The heat-conducting device 13 is designed so that the process temperature of the hydrogen H2 is conducted to the temperature measurement in a directed manner.

[0072] The heat-conducting device 13 is thus an envelope that is inserted in a form-fitting manner between the protective barrier 5 and the vacuum envelope 8. The heat-conducting device 13 is connected to the protective barrier 5 and / or the vacuum envelope 8 in a form-fitting and / or integral manner.

[0073] To mount the heat-conducting device 13, it is fitted into the protective barrier 5 and / or the vacuum envelope 8 and connected in a form-fitting manner. For ease of installation, the base element 14 is designed as a single-piece slotted element or as a multi-part structure of several segments. In this case, "one-piece" or "single-piece" means that the base element 14 is not composed of different components but forms a single component. In this case, "integral" means that the base element 14 is made entirely from the same material.

[0074] The base element 14 or the heat conducting device 13 is slotted. This is particularly advantageous if the gap 6 is filled with gas, to make it possible to detect leaks between the individual passages. The position of the heat conducting element 35 can be freely selected. For example, the coldest temperature measurement (FIG. 1) can be made at the 6 o'clock position (bottom ±90°) and the warmest temperature measurement at the 12 o'clock position (top ±45°).

[0075] Due to possible temperature differences between the process pipe 4 and the protective barrier 5, the material of the base element 14 is preferably selected so that it achieves a thermal expansion coefficient less than or equal to the smaller of the thermal expansion coefficient of the process pipe 4 or the protective barrier 5.

[0076] The temperature sensor 11 can be installed without a protective envelope. In the three-envelope design of the cryogen supply system 1, one envelope can be designed as vacuum insulated or super-insulated, and the inner envelope can be filled with gas. When liquid hydrogen H2 is used, this gas is helium He. Only helium He does not condense at the temperatures that occur in the case of liquid hydrogen H2.

[0077] By filling the gap 6 with an inert gas, leaks between all passages can be detected. The temperature sensor 11 is placed on the vacuum envelope 8, which is therefore not breached. In order to place several temperature sensors 11 in close spatial proximity, it is possible to provide several heat conducting elements 35.

[0078] Although the invention has been described with reference to exemplary embodiments, the invention can be varied in many ways within the scope of the appended claims. [Explanation of symbols]

[0079] 1. Cryogen supply system 2 Consumers 3 Axis of symmetry 4. Process Pipes 5. Protective Barriers 6 Gap 7 Environment 8 Vacuum envelope 9 Gap 10 Temperature measuring device 11 Temperature Sensor 12 Protective tube 13 Heat Conduction Devices 14 Base Elements 15 Axis of Symmetry 16 outside 17 Inside 18 Aperture 19 Slots 20 End face 21 End face 22 Recess 23 Recess 24 Recess 25 Recess 26 Recess 27 Recess 28 Recess 29 Recess 30 Axis of Symmetry 31 Axis of Symmetry 32 areas 33 Boa 34 Axis of Symmetry 35 Heat Transfer Elements g direction of gravity He Helium / gas H2 Hydrogen / Cryogen L Longitudinal Q Fever R Radial direction U circumferential direction

Claims

1. 1. A cryogen supply system (1) for supplying a cryogen (H2) to a consumer (2), comprising: a process pipe (4) through which the cryogen (H2) can be conducted; a protective barrier (5) in which the process pipe (4) is received; a gap (6) provided between the process pipe (4) and the protective barrier (5); a heat-conducting device (13) arranged in the gap (6) and designed to transfer heat (Q) from the process pipe (4) to the protective barrier (5) or vice versa; and a temperature sensor (11) arranged outside the protective barrier (5) to detect the temperature of the cryogen (H2), the temperature sensor (11) being thermally coupled to the heat-conducting device (13).

2. 2. The cryogen supply system of claim 1, wherein the heat-conducting device (13) is connected to the process pipe (4) and / or the protective barrier (5) in a press-fit, integral, and / or form-fit manner.

3. 3. The cryogen supply system according to claim 1, wherein the heat-conducting device (13) has a slot (19) extending along a radial direction (R) of the heat-conducting device (13) and completely penetrating the heat-conducting device (13).

4. 2. The cryogen supply system of claim 1, wherein the heat-conducting device (13) is fluid-permeable or fluid-impermeable.

5. 2. The cryogen supply system according to claim 1, wherein the heat-conducting device (13) has recesses (22-29) designed as through holes or as blind holes.

6. A cryogen supply system according to claim 5, wherein said recesses (22-29) are at least partially filled with a plastic material.

7. 6. The cryogen supply system of claim 5, wherein the recesses (22-29) are unevenly spaced apart from one another in a circumferential direction (U) of the heat conducting device (13) such that at least one recess-free area (32) is provided between two adjacent recesses (22, 29).

8. 2. A cryogen supply system according to claim 1, wherein the gap (6) is gas-filled, in particular filled with helium (He).

9. 2. The cryogen supply system of claim 1, further comprising a vacuum envelope (8) in which the protective barrier (5) is housed, and a gap (9) provided between the protective barrier (5) and the vacuum envelope (8).

10. 10. The cryogen supply system according to claim 9, wherein the temperature sensor (11) is guided through the vacuum envelope (8) and the gap (9) to the protective barrier (5).

11. 11. The cryogen supply system of claim 10, further comprising a protective tube (12) in which the temperature sensor (11) is housed, the protective tube (12) being led through the vacuum envelope (8) and the gap (9) to the protective barrier (5).

12. 12. The cryogen supply system according to claim 11, wherein the protective tube (12) is connected to the vacuum envelope (8) in a liquid-tight manner.

13. 2. The cryogen supply system of claim 1, wherein the heat-conducting device (13) comprises a heat-conducting element (35) for transferring heat (Q) from the process tube (4) to the protective barrier (5) or vice versa.

14. 14. The cryogen supply system of claim 13, wherein the heat-conducting device (13) comprises a base element (14) carrying the heat-conducting element (35), and the heat-conducting element (35) is made of a material having a thermal conductivity greater than the thermal conductivity of the material of the base element (14).

15. 15. The cryogen supply system of claim 14, wherein the base element (14) has a bore (33) in which the heat-conducting element (35) is received, the axis of symmetry (34) of the bore (33) being oriented perpendicular to the axis of symmetry (15) of the heat-conducting device (13).

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