Audio Headset

JP2025504962APending Publication Date: 2025-02-19FREEDMAN ELECTRONICS PTY LTD
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Patent Information

Application Number
JP2024545020
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2022-02-04
Filing Date
2022-12-22
Publication Date
2025-02-19

AI Technical Summary

Benefits of technology

【0013】 また、イヤーパッドが1つ以上の層で形成されることも考えられる。1つの層は、残りの層を覆うように構成され、アルカンターラなどの音響吸収性材料で形成されても良い。別の層は、ユーザにさらなる快適さを提供するメモリフォーム層であっても良い。さらに別の層は、例えば耳の疲労や不快感を軽減する冷却ゲルなどの冷却層であっても良い。

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Abstract

The present invention relates generally to audio headsets, and more particularly to headsets that include improved comfort and functionality. The headset may be shaped to provide comfort and a proper seal, for example to block out ambient noise. Additionally, the headset may be configured to include various interchangeable components and may further include multiple input ports. Advantageously, the headset may be modular and facilitate coupling with one or more interfaces, such as audio sources and microphones.
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Description

[Technical field]

[0001] The present invention relates generally to the field of audio headsets, and more particularly to headsets that include improved comfort and functionality. [Background technology]

[0002] Headphones are often used to output sound to a user through a pair of ear cups. Like headphones, headsets also typically output sound to a user and also include a microphone, for example to facilitate communication with others.

[0003] Headsets are used for a variety of purposes, including video games, which have become increasingly complex and allow players to compete against one another over the Internet. In addition to the visual aspects of video games, audio plays an important role in delivering the gaming experience. Gamers typically wear a headset, which also contains a microphone that delivers game audio to the user's ears and allows gamers to communicate with each other.

[0004] Game audio typically refers to audio generated by a video game during gameplay. Such audio includes music soundtracks, sound effects, and other audio. The importance of game audio varies depending on the type of video game and the type of interaction. For example, in a puzzle game, audio may play a role in enhancing gameplay but may not be important for proper interaction with the video game. On the other hand, game audio may play an important or even pivotal role in achieving a favorable outcome in a particular video game. For example, in a first-person shooter game, the ability to hear the surrounding game environment may be important. Examples of audio that gamers rely on include game audio such as enemy footsteps approaching, doors opening, vehicles, etc. Based on the audio received, gamers may, for example, communicate with teammates, predict their next move, decide on their next reaction, or perform a certain action.

[0005] As video games become more deep and complex, users may wear headsets for extended periods or periods of time. However, users who wear traditional headphones for extended periods of time may experience fatigue or discomfort. One of the main discomforts is caused by the increase in temperature around the gamer's ears after a period of use. This discomfort increases with the duration of continuous use. In addition, most headphones often do not adequately filter out ambient noise.

[0006] Additionally, traditional headsets often contain fixed structures with little opportunity to easily upgrade or replace individual components. As a result, traditional headsets can be difficult to repair and may require replacement after a limited number of uses.

[0007] Therefore, there is a need for improved headsets. Summary of the Invention [Problem to be solved by the invention]

[0008] The present invention relates generally to the field of audio headsets, and more particularly to headsets that include improved comfort and functionality. [Means for solving the problem]

[0009] In one aspect, the headset may include one or more earcup assemblies and a headband assembly. The headband assembly may include a bracket having one or more slots. Each slot of the bracket may be configured to receive a locking mechanism. The locking mechanism may be operable to adjust a distance between the headband assembly and the one or more earcup assemblies. Additionally, the headset may include a post pivotally attached to the earcup assemblies and the locking mechanism to facilitate pivotal movement of the earcup assemblies relative to the headband assembly.

[0010] The headband assembly may further include a cushion assembly removably coupled to the bracket. Additionally, the cushion assembly may be configured to connect to one or more stops of the headband assembly. The cushion assembly may include a top portion removably coupled to the bottom portion, for example, via a hook-and-loop fastener. The top portion may include a channel for guiding the flat wire.

[0011] The locking mechanism of the headset may be a cam assembly including a housing and a thumb pad. The housing may include a cam and a locking pad. The thumb pad may include a rod having a pin configured to interface with the cam. In operation, when the thumb pad is rotated, the locking mechanism may be configured to compress and lock into the bracket. When unlocked, a user may adjust the distance between the headband assembly and the earcup assembly.

[0012] The ear cup assembly of the headset may include a frame, a driver assembly, and ear pads. The driver assembly may be removably connected to the frame. The ear pads may be removably connected to the driver assembly. As a result, a user may easily replace various components of each ear cup assembly.

[0013] It is also contemplated that the ear pads may be formed of one or more layers. One layer may be configured to cover the remaining layers and may be formed of an acoustically absorbing material such as Alcantara. Another layer may be a memory foam layer to provide additional comfort to the user. Yet another layer may be a cooling layer, for example a cooling gel, to reduce ear fatigue and discomfort.

[0014] The ear cup assemblies may further include a bayonet mount configured to connect to a corresponding bayonet fastener. Additionally, the ear cup assemblies may include an input port. For example, one ear cup assembly may include a first input port configured to couple to an audio source, and the other ear cup assembly may include a second input port configured to couple to a microphone.

[0015] While the invention is susceptible to various modifications and alternative forms, specific exemplary embodiments thereof have been shown by way of example in the drawings and are herein described in detail, It is to be understood, however, that it is not the intention to limit the invention to the particular embodiments disclosed, but on the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the scope of the invention as defined by the appended claims. [Brief description of the drawings]

[0016] Embodiments are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings, in which like reference numbers indicate similar elements and in which:

[0017] [Figure 1]FIG. 2 is a perspective view of a headset.

[0018] [Figure 2A] FIG. 2 is a front view of the headset of FIG. 1.

[0019] [Figure 2B] 2 is a cross-sectional view of an exemplary headband assembly of the headset of FIG. 1.

[0020] [Diagram 3] FIG. 2 is a side view of the headset of FIG. 1.

[0021] [Figure 4] FIG. 2 is a bottom view of the headset of FIG. 1.

[0022] [Diagram 5] FIG. 2 is an exploded view of an exemplary locking mechanism.

[0023] [Figure 6] FIG. 6 is a diagram showing the locking mechanism of FIG. 5.

[0024] [Figure 7] 6 illustrates an exemplary headband assembly including the locking mechanism of FIG. 5.

[0025] [Figure 8] 1 illustrates a locking pad and cam of an exemplary locking mechanism.

[0026] [Figure 9A] FIG. 1 is a perspective view of the locking mechanism in an unlocked position.

[0027] [Figure 9B] FIG. 1 is a perspective view of the locking mechanism in a locked position.

[0028] [Figure 10A] FIG. 13 is a cross-sectional view of the locking mechanism in an unlocked position.

[0029] [Figure 10B] FIG. 13 is a rear view of the locking mechanism in the unlocked position.

[0030] [Figure 10C] FIG. 2 is a cross-sectional view of the locking mechanism in a locked position.

[0031] [Figure 10D] FIG. 13 is a bottom view of the locking mechanism in the locked position.

[0032] [Figure 11] FIG. 2 is an exploded view of the ear cup assembly.

[0033] [Figure 12A] FIG. 12 shows a frame of the earcup assembly of FIG.

[0034] [Figure 12B] 11 is a cross-sectional view showing an exemplary connection of an earcup frame to a bracket.

[0035] [Figure 13A] 1A-1C illustrate an exemplary connection between a frame and a driver assembly.

[0036] [Figure 13B] 13B is a cross-sectional view illustrating an exemplary connection of a frame to the driver assembly of FIG. 13A.

[0037] [Figure 14A] 1A-1C illustrate an exemplary connection between an ear pad assembly and a driver assembly.

[0038] [Figure 14B] FIG. 14B is a rear view of the ear pad of FIG. 14A.

[0039] [Figure 14C] 14B is a cross-sectional view showing an example connection of a driver assembly to the ear pad of FIG. 14A. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0040] The present invention relates generally to audio headsets, and more particularly to headsets that include improved comfort and functionality. The headset may be shaped to provide comfort and a proper seal, for example to reduce ambient noise. Additionally, the headset may be configured to include various interchangeable components and may further include multiple input ports. Advantageously, the headset may be modular and facilitate coupling with one or more interfaces, such as an audio source and a microphone.

[0041] Turning now to the drawings, in which like numerals represent like components, Figures 1-4 show an exemplary headset 100 shaped to fit comfortably on the top of a user's head. As shown, headset 100 can include a headband assembly 102 and an earcup assembly 104. A locking mechanism 110 may be configured to adjust the distance between headband assembly 102 and earcup assembly 104, as described in more detail below.

[0042] As shown, the headset 100 can also include a bracket 140 (post) that pivotally couples the earcup assembly 104 to the locking mechanism 110. The bracket 140 (post) may be curved to conform to the shape of the earcup assembly 104. The bracket 140 (post) is configured to facilitate pivotal movement of the earcup assembly 104 relative to the headband assembly 102 and can ensure that forces on the user's head are evenly distributed around the ears.

[0043] Exemplary Headband Assembly 102

[0044] 1-4, the headband assembly 102 may include a headband 106 having one or more preferably longitudinal slots 108. The slots 108 may be formed on either end of the headband 106 and configured to receive a locking mechanism 110. The headband 106 may be made of a suitable material, such as plastic, metal, or other lightweight material.

[0045] 2A, the cushion assembly 112 may be removably attached to the headband 106. The cushion assembly 112 may include a top portion 116 and a bottom portion 118. The bottom portion 118 may include a pad 120 formed on a brace 119. The pad 120 may be, for example, a gel, foam, or other suitable material.

[0046] 2B, each segment 116, 118 of the cushion assembly 112 may be removably attached to the headband 106 via one or more stops 114. The stops 114 may be slidably engaged with the headband 106. The bulge 107 of the headband 106 is configured to press against a rim 115 of the stopper 114 to secure the cushion assembly 112 to the headband 106.

[0047] In addition to coupling to the headband 106 via the stopper 114, the top 116 of the cushion assembly 112 may include a knob (not shown) configured to be inserted into an opening 160 (FIG. 6) in the headband 106. Additionally, excess fabric on the top 116 may be wrapped around and encircled by the headband 106.

[0048] The bottom segment 118 of the cushion assembly 112 may be removably coupled to the top segment 116 by a hook-and-loop type fastener. It is further contemplated that the segments 116, 118 of the pad 120 may be removably coupled to one another via, for example, buttons, hooks, clasps, pins, or other known fasteners.

[0049] As shown in FIGS. 1 and 2A, a conductive cable or wire 122 can be configured to interconnect each earcup assembly 104 and transmit audio signals. The wire 122 can be substantially flat and flexible and can extend along the headband 106 through the locking mechanism 110, the cushion assembly 112, and the stopper 114. Specifically, the locking mechanism 110 can include a cable slit 150 (FIG. 5) configured to receive the wire 122. Similarly, the upper segment 116 of the cushion assembly 112 can include a channel 121 (FIG. 2B) through which the wire 122 is disposed substantially flush with a surface of the upper segment 116 such that the wire 122 does not interfere with the coupling of the cushion assembly 112 to the headband 106.

[0050] Exemplary Locking Mechanism 110

[0051] 5-10D illustrate an exemplary locking mechanism 110 operable to adjust the distance between the headband assembly 102 and the earcup assembly 104. As illustrated, the locking mechanism 110 can include a housing 138. The housing 138 is configured to include one or more actuating components. Although a variety of actuating components are contemplated, as shown in FIG. 5, the housing 138 can include, for example, a cam assembly including a locking pad 142, a cam 144, and a retainer 146.

[0052] 5-7, the housing 138 can also include a substantially circular opening 147 for receiving the thumb pad 136, a substantially semicircular lip 149 for limiting rotation of the thumb pad 136, a bracket slit 148 for receiving the headband 106, and, as described above, a cable slit 150 for receiving the wire 122. The thumb pad 136 can include an indicator 158, such as a symbol or word, to facilitate operation of the locking mechanism 110 by a user, as described in more detail below.

[0053] 8 illustrates an example lock pad 142 and cam 144 of the lock mechanism 110. As shown, the lock pad 142 can include a front surface 170 and an opposing back surface 171. The front surface 170 can be substantially flat or can include a slight curve with a large radius that corresponds to the curvature and radius of the headband 106. The back surface 171 can include a protrusion 172 and a recess 173. The lock pad 142 can further include a core portion 174 having appendages 176 on either end. The core portion 174 can include an opening 178. As shown, the rear surface 171 of the core portion 174 may be adapted to receive the cam 144 such that the opening 178 in the locking pad 142 aligns with the rounded cavity 180 in the cam 144 .

[0054] The cam 144 may be substantially circular and may include a front surface 162 and a substantially flat rear surface 164. As shown, the front surface 162 of the cam 144 may also include a protrusion 166 and a recess 168, each of which is configured to align with a protrusion 172 and / or a recess 173 of the lock pad 142, as described in more detail below.

[0055] 9A-9B and 10A-10D show an exemplary connection of thumb pad 136 to housing 138 via rod 137 having pin 139. Rod 137 may be configured to pass through slot 108 of headband 106 and aperture 155 of extension member 154 of bracket 140 (FIG. 6). Pin 139 may be configured to pass through aperture 178 of locking pad 142. Pin 139 may also be shaped to interface with rounded cavity 180 to rotate cam 144. As shown, pin 139 includes a threaded interior configured to receive a corresponding fastener 156, thereby allowing locking mechanism 110 to be secured to headband 106 and bracket 140.

[0056] In an exemplary operation, rotation of the thumb pad 136 results in a corresponding rotation of the cam 144. The thumb pad 136 is shown to rotate approximately 90 degrees, although other rotations are contemplated including, for example, 180 degrees and 360 degrees.

[0057] As shown, rotation of the thumb pad 136 corresponds to an unlocked position 182 or a locked position 184 of the locking mechanism 110. More specifically, when the thumb pad 136 is rotated to the unlocked position 182, the pin 139 can interface with the cavity 180 to rotate the cam 144 such that the protrusion 172 of the lock pad 142 aligns with the recess 168 of the cam 144. When the thumb pad 136 is rotated to the locked position 184, the pin 139 can interface with the cavity 180 to rotate the cam 144 such that the protrusion 172 of the lock pad 142 aligns with the protrusion 166 of the cam 144. In other words, when the thumb pad 136 is rotated, the recess 168 of the cam 144 corresponds to the unlocked position 182 and the protrusion 166 of the cam 144 corresponds to the locked position 184.

[0058] 10A-10D , when the locking mechanism 110 is in the locked position 184, the front surface 170 of the locking pad 142 is configured to compress the headband 106 between the housing 138 and the thumb pad 136. When the locking mechanism 110 is in the unlocked position 182, the front surface 170 of the locking pad 142 is configured to decompress the headband 106, thereby facilitating adjustment of the distance between the headband assembly 102 and the corresponding earcup assembly 104.

[0059] Exemplary Ear Cup Assembly 104

[0060] 1-4, headset 100 may further include one or more ear cup assemblies 104 of replaceable components, as described in more detail below. Ear cup assembly 104 may be D-shaped to mimic the anatomy of a user's ear and head. Other shapes for ear cup assembly 104 include, for example, cup, cone, or other shapes that may comfortably contact and potentially seal against a user's head.

[0061] The height of the earcup assembly 104 is between about 80 mm and about 120 mm, preferably between about 90 mm and about 100 mm. In one embodiment, the earcup assembly 104 has an approximate height of about 95 mm.

[0062] The width of the earcup assembly 104 is between about 60 mm and about 90 mm, preferably between about 70 mm and 80 mm. In one embodiment, the earcup assembly 104 has an approximate height of about 75 mm.

[0063] 1-4 and 11, the ear cup assembly 104 may include a frame 124 and ear pads 126. Between the frame 124 and the ear pads 126, the ear cup assembly 104 may include a driver assembly 186 and a seal 188.

[0064] Frame 124 can be formed of a plastic material or the like that can be curved (such as by molding) to a desired shape and size. As shown, frame 124 can include an inner surface 123 and an outer surface 125. Inner surface 123 can include ribs 196 and connectors 198. Ribs 196 can be configured to reinforce the structure of frame 124. Connectors 198 of frame 124 can facilitate attachment to driver assembly 186, for example, having a corresponding connector 204 (FIGS. 13A-13B).

[0065] 11, the exterior surface 125 of the frame 124 may include indicators 194, such as letters, symbols, Braille, etc. Additionally, the exterior surface 125 may include an extension 128 configured to form a space for the seal 188.

[0066] The frame 124 may also include several openings, such as a wire opening 129, an interface opening 130, and a post opening 131. The wire opening 129 is configured to receive the wire 122. As shown in FIG. 12, the wire 122 may include a mass 152 configured to block the wire opening 129. The interface opening 130 is configured to receive an interface that may mate with an input port 132 of the driver assembly 186.

[0067] Returning to FIG. 4 , the seal 188 may abut the interface opening 130. The seal 188 operates in conjunction with a connector or bayonet mount 134 of the ear cup assembly 104. For example, the bayonet mount 134 may include one or more radial pins. Each radial pin may have an L-shaped slot adapted to receive a corresponding female receptacle. In operation, the female slots are inserted into the bayonet mount 134 and rotated so that the radial pins engage the slots.

[0068] 12A-12B illustrate an exemplary attachment of the frame 124 to the bracket 140. In particular, the inner surface 123 of the frame 124 may be configured to sandwich the support plate 190 via a long branch 193 and a short branch 191 at either end of the post opening 131. The post opening 131 may receive an insert 200 of the bracket 140. The insert 200 may include a threaded interior configured to receive a corresponding fastener 202 disposed through the support plate 190. The fastener 202 may be inserted through the support plate 190. In this manner, the bracket 140 is pivotally attached to the earcup assembly 104 to facilitate pivotal movement relative to the headband assembly 102. In particular, the bracket 140 may facilitate rotation of the earcup assembly 104 in at least two axes relative to the headband assembly 102.

[0069] 13A-13B, driver assembly 186 is removably attached to frame 124. Driver assembly 186 can include a front side 185 and a rear side 187. As mentioned above, rear side 187 can include a connector 204 that corresponds to connector 198 of frame 124. A variety of connectors are contemplated for securing driver assembly 186 to frame 124, including, for example, clips, clasps, snaps, buttons, hook-and-loop fasteners, and the like.

[0070] The driver assembly 186 can facilitate converting electrical signals into sound waves and outputting the converted sound waves to a user. The driver assembly 186 can include an input port 132 (FIG. 11) configured to receive, for example, a Tip-Sleeve (TS) interface, a Tip-Ring-Sleeve (TSR) interface, a Tip-Ring-Ring-Sleeve (TRRS) interface, an RCA interface, an XLR interface, or the like. In an embodiment, one earcup assembly 104 of the headset 100 includes a first interface and another earcup assembly 104 includes a second interface. Having multiple input ports can allow the headset 100 to facilitate coupling with various devices. For example, the first input port is configured to couple with an audio source and the second input port is configured to couple with a microphone.

[0071] As shown in FIGS. 14A-14C, ear pads 126 are removably attached to driver assembly 186. As shown, ear pads 126 can include a front surface 203 and a rear surface 205. Front surface 203 can include, for example, an indicator to show a user how to place headset 100 on their head. Rear surface 205 can include a connector 206 that corresponds to connector 207 on front surface 185 of driver assembly 186. As described above, a variety of connectors are contemplated for securing ear pads 126 to driver assembly 186, including, for example, clips, clasps, snaps, buttons, hook-and-loop fasteners, and the like.

[0072] Further, the ear pad 126 may include one or more layers, for example, to reduce ear fatigue and discomfort of the user. As shown in FIG. 14C, the ear pad 126 may include a first layer 208, a second layer 209, and a third layer 210. The first layer 208 may be formed of a flexible polyurethane foam, for example, a memory foam (memory foam layer), having properties measured according to JIS K 6400. The thickness of the first layer 208 may be between about 10 mm and about 20 mm, preferably between about 12 mm and about 16 mm. In one embodiment, the thickness of the first layer 208 may be about 14 mm.

[0073] The second layer 209 may be a gel layer and may be defined by an encapsulation of a cooling gel (cooling gel layer). The second layer 209 may be adapted to absorb and retain low temperatures and not absorb heat imparted by the wearer's head. It is also contemplated that the second layer 209 may be configured to provide additional cushioning from impacts resulting from normal use of the ear pads 126. The thickness of the second layer 209 is between about 4 mm and about 8 mm, preferably between about 5 mm and about 7 mm. In one embodiment, the thickness of the second layer 209 may be about 6 mm.

[0074] The third layer 210 may be a membrane formed from an acoustically absorbing material and / or perforated leather such as Alcantara. The third layer 210 may encase or cover other layers such as the first layer 208 and the second layer 209. The thickness of the third layer 210 may be between about 1 / 4 mm and about 3 / 4 mm, preferably between about 1 / 3 mm and about 1 / 2 mm. In one embodiment, the thickness of the third layer 210 may be about 4 / 10 mm.

[0075] In summary, headset 100 may be shaped to provide a comfortable and proper seal for the user. Additionally, headset 100 may be configured to include various replaceable parts and may further include multiple input ports. Advantageously, headset 100 may be modular and facilitate docking with one or more interfaces, such as an audio source, a microphone, etc.

[0076] Further modifications and alternative embodiments of various aspects of the invention will be apparent to those skilled in the art in view of this specification. This specification is therefore to be construed as illustrative only, and is for the purpose of teaching those skilled in the art the general manner of carrying out the invention. It should be understood that the forms of the invention shown and described herein are to be taken as examples of embodiments. Components may be substituted for those shown and described in this application, parts and steps may be reversed, and certain features of the invention may be utilized independently, all of which will become apparent to those skilled in the art after having the benefit of this specification of the invention. Changes may be made in the elements described herein without departing from the spirit and scope of the invention as set forth in the following claims.

Claims

1. an ear cup assembly; a headband assembly including a bracket; one or more slots formed in the bracket; Equipped with Each slot is configured to receive a locking mechanism; the locking mechanism is operable to adjust a distance between the headband assembly and the earcup assembly; a post pivotally coupling the ear cup assembly to the locking mechanism; the post is configured to facilitate pivotal movement of the earcup assembly relative to the headband assembly. Headset.

2. The headband assembly further includes a cushion assembly removably coupled to the bracket. The headset of claim 1 .

3. The cushion assembly includes a top portion removably coupled to a bottom portion via a hook-and-loop fastener. The headset of claim 2.

4. The cushion assembly is configured to be connected to one or more stoppers of the headband assembly. The headset of claim 2.

5. the top portion includes a channel for guiding a flat wire; The headset of claim 3.

6. the locking mechanism is a cam assembly having a housing containing a cam and a locking pad; The locking mechanism is configured to compress a periphery of the bracket. The headset of claim 1 .

7. The cam assembly includes: a thumb pad including a pin extending through the one or more slots and coupled to the housing; A rod rotatably connected to the cam; having The headset of claim 6.

8. The pin is operable to rotate the cam between a locked position and an unlocked position. The headset of claim 7.

9. the cam has a front surface having one or more recesses and one or more protrusions; the recess corresponds to the unlocked position; The protrusion corresponds to the locked position. The headset of claim 8.

10. The post is curved to conform to the shape of the ear cup assembly. The headset of claim 1 .

11. The ear cup assembly is D-shaped. The headset of claim 1 .

12. The ear cup assembly includes a frame, a driver assembly, and an ear pad. The headset of claim 1 .

13. the driver assembly is removably connected to the frame; The headset of claim 12.

14. the ear pads are removably connected to the driver assembly; The headset of claim 12.

15. The ear pad is formed of one or more layers. The headset of claim 12.

16. At least one layer is made of Alcantara.

16. The headset of claim 15.

17. the one or more layers include at least one of a memory foam layer and a cooling gel layer; 16. The headset of claim 15.

18. the ear cup assembly includes a bayonet mount configured to connect to a corresponding bayonet fastener; The headset of claim 1 .

19. further comprising a first input port and a second input port; The headset of claim 1 .

20. the first input port is configured to couple to an audio source; the second input port is configured to couple to a microphone; 20. The headset of claim 19.