Low thermal resistance phase change thermal interface material

Abstract

The phase change thermal interface material includes a non-silicone resin and a plasticizer that is compatible with the phase change material and capable of wetting a thermally conductive particulate filler. The filler has a thermal conductivity of 0.1°C·cm. 2 The thermal interface material is incorporated into the resin to a sufficient extent to provide a material having a thermal impedance of less than 10 / W. 5 It exhibits a melt viscosity of less than Pa·s.

Description

[Technical field]

[0001] The present invention relates generally to thermal interface materials, and more particularly to phase change thermal interface materials with low thermal impedance and thin bond lines. [Background technology]

[0002] Thermally conductive materials are widely used, for example, as interfaces between heat-generating electronic components and heat sinks, allowing the transfer of excess thermal energy from the electronic components to the thermally coupled heat sink. Numerous designs and materials have been implemented for such thermal interfaces, with the best performance being achieved when gaps between the thermal interface and the respective heat transfer surfaces are substantially avoided, promoting conductive heat transfer from the electronic components to the heat sink. Thus, it is preferred that the thermal interface material mechanically conforms to the somewhat uneven heat transfer surfaces of the respective components. Furthermore, it is preferred that the thermal interface material wets the heat transfer surfaces to provide low contact resistance.

[0003] Electronic components such as semiconductors, microprocessors, resistors, and circuit boards generate large amounts of heat that must be removed for the devices to function properly. High performance computing and telecommunications applications generate large amounts of heat, and therefore require thermal interface materials with very low thermal impedance to maximize heat transfer from sensitive electronic components. Thermal interface materials that can be compressed into very thin bondlines can enhance heat transfer. Mixtures of rubber, liquid, and wax matrices with metal and metal oxide powder fillers have been used as thermal interface materials. However, conventional compositions often cannot provide the very low thermal impedance required for high performance applications, nor can they be compressed into thin bondlines that would reduce thermal impedance.

[0004] Conventional thermal interface materials are also prone to drying and cracking over extended periods of use, especially at the elevated temperatures frequently encountered in high performance electronic applications. This aging adversely affects thermal performance. Summary of the Invention [Means for solving the problem]

[0005] The present invention may provide for efficient transfer of thermal energy from heat-generating electronic devices, such as integrated circuits, computer chips, etc., to a heat dissipation structure, such as a heat sink or heat spreader. The thermal interface materials of the present invention are effective in transferring heat generated by electronic devices and may include a non-silicone polymeric resin with a phase change material, a plasticizer, and a thermally conductive particulate filler. The thermal interface materials of the present invention exhibit low thermal impedance, desirable rheological properties, and thin bond lines.

[0006] In one embodiment, the thermal interface material includes a non-silicone resin that includes a phase change material and a plasticizer material that includes an amine-functional polyester component present in a concentration of 25-50% by weight of the non-silicone resin. 2 Thermal impedance less than / W, melting point of 40 to 80°C, and 10 5 It further includes an elastomer and a thermally conductive particulate filler having a particle size of less than 25 μm so as to exhibit a melt viscosity of less than Pa·s.

[0007] In some embodiments, the thermally conductive filler is selected from aluminum, aluminum nitride, zinc oxide, and combinations thereof. The thermally conductive filler may have a particle size distribution that includes a multimodal distribution having two or more peaks of particle size. In some embodiments, a first peak of the multimodal distribution is between 0.1 and 3 μm in particle size, and a second peak of the multimodal distribution is between 8 and 12 μm in particle size.

[0008] The thermal interface material is preferably extrudable into a film form of 200 μm to 400 μm and may reflow to a bondline of less than 50 μm, more preferably less than 40 μm.

[0009] The tackifier may include a styrenic copolymer selected from styrene-butadiene-styrene (STS), styrene-ethylene / butylene-styrene (SEBS), styrene-isoprene-styrene (SIS), styrene-ethylene / propylene-styrene (SEPS), and combinations thereof.

[0010] The phase change material may be a hydrocarbon such as a wax, in some embodiments the wax is a paraffin wax having a melting point between 40 and 80°C.

[0011] In another embodiment, the electronic device includes an electronic component and a phase change thermally conductive material thermally coupled to the electronic component. The phase change thermally conductive material may include a non-silicone resin including a phase change material and a plasticizer material including an amine functional polyester copolymer present at a concentration of 25-50% by weight of the non-silicone resin. The thermal interface material further includes an elastomer or elastomeric agent and a thermally conductive particulate filler having a particle size of less than 25 μm, the material having a thermal conductivity of less than 0.1 °C·cm 2 Thermal impedance less than / W, melting point of 40 to 80°C, 10 5 Less than Pa s, preferably 10 3 ~10 4 The melt viscosity in Pa·s is shown. The phase change thermally conductive material may be coated onto electronic components.

[0012] The electronic package includes a substrate, an electronic component secured to the substrate, a thermally conductive material thermally connected to the electronic component, and a heat sink thermally connected to the thermally conductive material. The thermally conductive material includes a non-silicone resin including a phase change material and a plasticizer material including an amine-functional polyester copolymer present in a concentration of 25-50% by weight of the non-silicone resin. The thermal interface material further includes an elastomer and a thermally conductive particulate filler having a particle size of less than 25 μm, the material having a thermal conductivity of 0.1°C·cm. 2 Thermal impedance less than / W, melting point of 40 to 80°C, and 10 3 ~10 4 The melt viscosity is shown in Pa·s. [Brief description of the drawings]

[0013] [Figure 1] FIG. 1 is a schematic diagram of an electronics assembly of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] Referring to the drawings, and initially to FIG. 1 , an electronic package 10 includes a substrate 12 and an electronic component array 14 including a plurality of electronic components 16 secured to the substrate 12. The electronic package 10 further includes a heat sink 18 and a thermal interface 20 disposed in a thermal path (indicated by dashed arrow 22) between the electronic component array 14 and the heat sink 18. The electronic package 10 is disposed to dissipate thermal energy generated by the electronic components 16 by providing a highly thermally conductive path from the electronic component array 14 to a heat absorbing fluid medium 24 in contact with the heat sink 18. In a typical application, the fluid medium 24 may be a gas, such as air, and is moved by an air moving device to absorb thermal energy from the heat sink 18. The electronic package 10 is an example of an arrangement that may be modified to accommodate various electronic applications, such as data processors, data memories, communication boards, antennas, and the like. Such devices may be used in computing devices, communication devices, and their peripherals. In certain exemplary embodiments, the electronic package 10 may be used to support various functions of a cellular communication device.

[0015] In addition to being a support for the electronic component array 14, the substrate 12 may serve one or more of a variety of functions. To simplify the description of the electronic package 10 of the present invention, the substrate 12 may be a circuit board, such as a printed circuit board, with conductive traces on a mounting surface 13 for electrically connecting the electronic components 16 as needed during assembly. The components 16 may be electrically connected to the wiring traces by soldering or other known techniques. During operation, the electronic components 16 generate significant excess heat energy that must be dissipated to maintain optimal performance. The electronic components 16 may be any of a variety of elements useful in electronic processes and may include, for example, integrated circuits, resistors, transistors, capacitors, inductors, and diodes.

[0016] The thermal interface 20 provides a thermally conductive bridge between the electronic component array 14 and the heat sink 18, generally along a thermal path 22. The heat sink 18 may be thermally coupled to the thermal interface 20 in a manner that most efficiently transfers thermal energy to the heat sink 18. As shown diagrammatically, the heat sink 18 may have a configuration incorporating a relatively high surface area, such as through fins 28. The use of heat sinks is well understood, and it is contemplated that conventional and custom designs may be utilized in the configurations of the present invention.

[0017] resin The thermal interface 20 is a material that may include one or more of a non-silicone hydrocarbon resin composition of rubber, liquid, and wax. The resin provides a matrix for incorporating thermally conductive fillers. The hydrocarbon resin composition may include, for example, saturated and unsaturated rubber compounds. Examples of saturated rubber compounds include ethylene-propylene rubber, polyethylene / butylene, polyethylene-butylene-styrene, polyethylene-propylene-styrene, hydrogenated polyalkyldiene monol, hydrogenated polyalkyldiene diol, hydrogenated polyisoprene, and polyolefin elastomers.

[0018] Other examples of non-silicone resins include various thermoplastic materials that may or may not be naturally tacky. In some embodiments, the resin may have a softening temperature, such as a melting point, phase transition temperature, or phase change temperature, that is lower than or within the normal operating temperature of the electronic component 16. However, in other embodiments, the resin may have a softening temperature that is higher than the normal operating temperature of the electronic component 16. The softening temperature of the resin may be, for example, within the range of 40°C to 175°C, more preferably within the range of 40°C to 125°C, and even more preferably within the range of 40°C to 85°C.

[0019] Examples of thermoplastic resin materials include thermoplastic / elastomeric blends and alloys, such as thermoplastic non-crosslinked polyolefins and thermoplastic vulcanizates (also known as thermoplastic rubbers).Non-silicone resin materials may be used in the compositions of the present invention to function as a carrier or network for phase change materials, thermally conductive particulate fillers, and other additives that may be used in the compositions.

[0020] In some embodiments, the matrix of the present invention may use silyl-modified resin. The resin is preferably non-silicone, and the composition contains no more than trace amounts of silicone. In some embodiments, the composition does not contain silicone. The silyl-modified polymer may have a flexible backbone to reduce the modulus and glass transition temperature, such as a polyether, polyester, polyurethane, polyacrylate, polyisoprene, polybutadiene, polystyrene butadiene, or polybutylene isoprene backbone.

[0021] The resin component of the composition may preferably include a phase change material having a softening temperature (including melting point, phase transition temperature, or phase change temperature) or temperature range at or below the operating temperature or temperature range of the electronic component 16, particularly the electronic component 16 to which the thermal interface 20 is thermally coupled. The temperature activated phase change material preferably changes from a solid state to a liquid state, and from a liquid state to a solid state, within a temperature range of about 30° C. to about 90° C., more preferably 40° C. to 80° C. The phase change material may be any suitable material, such as natural waxes such as beeswax or carnauba wax, petroleum-based waxes such as paraffin wax, or synthetic waxes such as polyethylene glycols, polyethylenes, polyhydric alcohols, or chlorinated naphthalenes.

[0022] An example of a phase change material is a wax, such as paraffin wax, which has the general formula C n H 2n+2and a mixture of solid hydrocarbons having a melting point in the range of about 40° C. to about 140° C., more preferably in the range of 40° C. to about 80° C. Polymer waxes include polyethylene wax and polypropylene wax, and typically have a melting point in the range of about 40° C. to about 160° C. Other examples of phase change materials include low melting point alloys having a melting point of about 40° C. to about 80° C.

[0023] The resin including the phase change material may be present in a range of about 0.1 to about 50% by weight of the total composition. In some embodiments, the resin including the phase change material may be present in a range of about 0.3 to about 20% by weight of the total composition. In some embodiments, the resin including the phase change material may be present in a range of about 0.5 to about 10% by weight of the total composition. In some embodiments, the resin including the phase change material may be present in a range of about 1 to about 5% by weight of the total composition. In some embodiments, the resin including the phase change material may be present in a range of 1 to 3% by weight of the total composition. Here, "total composition" may refer to the thermal interface 20.

[0024] Complementary Plasticizer Materials Applicants have discovered that a unique blend of ingredients, including a blend of a phase change material and a complementary plasticizer material, can provide high performance thermal interface materials. The unique compositions of the present invention exhibit low thermal resistance and reliable thermal performance even at elevated temperatures of over 125° C. for extended periods of time. The compositions of the present invention use a blend of ingredients in general, and specifically a blend of a phase change material and a plasticizer material, to provide resistance to aging (performance degradation) at elevated temperatures.

[0025] The plasticizer material useful in the composition of the present invention is preferably compatible with the phase change material, as described above. The plasticizer material acts as a rheology modifier that reduces the viscosity of the composition as the temperature increases. However, the plasticizer material does not have to have the same softening temperature characteristics as the phase change material. Preferably, the plasticizer material is or includes an amine-functional polyester copolymer that is capable of wetting the thermally conductive particulate filler. Wetting the thermally conductive particulate filler by the plasticizer increases the affinity of the filler for the resin. Such affinity helps to reduce the viscosity of the composition.

[0026] The use of the second phase change material within a particular concentration range relative to the resin has been found to be important for the beneficial functional properties described herein. In particular, the complementary plasticizer material is preferably present in a range of about 20 to about 60% by weight of the resin. In some embodiments, the complementary plasticizer material is present in a range of 25 to 50% by weight of the resin. In some embodiments, the complementary plasticizer material is present in a range of 25 to 40% by weight of the resin. A complementary plasticizer loading level below 20% by weight of the resin results in insufficient temperature stability of the composition, and a complementary plasticizer loading level above 60% by weight of the resin inhibits the phase change properties of the composition. Preferably, the thermal interface material includes an amine-functional polyester copolymer in a concentration range of 25 to 50% by weight of the resin.

[0027] Thermally Conductive Particles To achieve the desired low thermal impedance of the thermally conductive interface, the composition of the present invention includes thermally conductive particles dispersed therein. The particles may be both thermally conductive and electrically conductive. Alternatively, the particles may be thermally conductive and electrically insulating. Importantly, the particles are preferably wettable by the complementary plasticizer material described above. A variety of thermally conductive particles may be useful in the composition of the present invention. However, it has been found that thermally conductive particles selected from aluminum, aluminum nitride, zinc oxide, and combinations thereof may be most useful in the composition of the present invention.

[0028] The particulate filler may be a granular powder, whiskers, fibers, or other suitable shape. The particles may be substantially spherical, platelet-like, rod-like, or combinations thereof. In some embodiments, the thermally conductive particles may have a particle size of less than 25 μm. Here, the term "particle size" refers to particle diameter or effective particle diameter. In some embodiments, the thermally conductive particles may have a particle size of 0.01 to 25 μm. In some embodiments, the thermally conductive particles may be monodisperse. In some embodiments, the thermally conductive particles, which may include one or more material types, may have a particle size distribution of particles having particle sizes of 0.01 to 25 μm.

[0029] In some embodiments, the particle size distribution may be multimodal having multiple concentration peaks with particle sizes between 0.01 and 25 μm. In some embodiments, a first concentration peak of the multimodal distribution has a particle size between 0.1 and 3 μm, and a second concentration peak of the multimodal distribution has a particle size between 8 and 12 μm. The first concentration peak of the multimodal distribution may comprise 10 to 90% by weight of the total thermally conductive filler. In some embodiments, the first concentration peak of the multimodal distribution may comprise 15 to 80% by weight of the total thermally conductive filler. In some embodiments, the first concentration peak of the multimodal distribution may comprise 15 to 50% by weight of the total thermally conductive filler. In some embodiments, the first concentration peak of the multimodal distribution may comprise 15 to 30% by weight of the total thermally conductive filler. The second concentration peak of the multimodal distribution may comprise 10 to 90% by weight of the total thermally conductive filler. In some embodiments, the second concentration peak of the multimodal distribution may comprise 15-80% by weight of the total thermally conductive filler. In some embodiments, the second concentration peak of the multimodal distribution may comprise 25-60% by weight of the total thermally conductive filler. The multimodal distribution may include two or more particle size concentration peaks.

[0030] In some embodiments, the thermally conductive particulate filler may comprise a trimodal particle size distribution with particle sizes between 0.01 and 25 μm. A first concentration peak of the trimodal distribution is an aluminum nitride particle size between 0.1 and 3 μm, a second concentration peak of the trimodal distribution is an aluminum particle size between 8 and 12 μm, and a third concentration peak of the trimodal distribution is a zinc oxide particle size between 0.01 and 0.5 μm. The first concentration peak of the trimodal distribution comprises 15-35% by weight of the total thermally conductive filler. The second concentration peak comprises 25-60% by weight of the total thermally conductive filler. The third concentration peak comprises 15-35% by weight of the total thermally conductive filler.

[0031] The thermally conductive particulate filler may comprise at least 25% by weight aluminium particles, preferably at least 35% by weight aluminium particles, more preferably at least 40% by weight aluminium particles.

[0032] In some embodiments, the particle size is the average particle diameter (d 50 ) may be represented.

[0033] The thermally conductive particulate filler may be dispersed in the resin and may be present in the composition at a loading level of 20-98% by weight of the total composition. In some embodiments, the thermally conductive particulate filler comprises 40-97% by weight of the total composition. In some embodiments, the thermally conductive particulate filler comprises 50-95% by weight of the total composition. Desirably, sufficient thermally conductive particles are provided such that a thermally conductive interface formed from the composition exhibits a thermal conductivity of at least 0.5 W / m·K, preferably at least 1 W / m·K, and more preferably at least 2 W / m·K.

[0034] Secondary Plasticizer The compositions of the present invention may include a secondary plasticizer in addition to the complementary plasticizers described herein. A secondary plasticizer may be used to adjust the viscosity of the dispensable mass, particularly under shear, and to maintain the solid state and melt viscosity within a desired range. Secondary plasticizers useful in the compositions of the present invention are those that are effective in promoting the flowability of the agglomerates that make up the composition. The secondary plasticizers of the present invention are preferably low volatility liquids that reduce the viscosity of the composition. In some embodiments, the secondary plasticizer may exhibit a viscosity of less than 1000 cP at 25° C. In another embodiment, the secondary plasticizer may exhibit a viscosity of less than 500 cP at 25° C. In yet another embodiment, the secondary plasticizer may exhibit a viscosity of less than 100 cP at 25° C.

[0035] In some embodiments, the secondary plasticizer may comprise from about 0.1 to about 25% by weight of the composition. In some embodiments, the secondary plasticizer may comprise from about 0.5 to about 10% by weight of the composition. In some embodiments, the secondary plasticizer may comprise from about 1 to about 5% by weight of the composition. The secondary plasticizer may preferably be present at less than 20% by weight of the composition.

[0036] Examples of secondary plasticizers include sebacates, adipates, terephthalates, dibenzoates, gluterates, phthalates, azelates, benzoates, sulfonamides, organic phosphates, glycols, polyethers, trimellitates, polybutadienes, epoxies, amines, acrylates, thiols, polyols, and isocyanates. A preferred secondary plasticizer is trimellitate.

[0037] Elastomer Agent The composition of the present invention preferably includes an elastomeric agent. Examples of elastomers include styrene-based copolymers selected from styrene-butadiene-styrene (STS), styrene-ethylene / butylene-styrene (SEBS), styrene-isoprene-styrene (SIS), styrene-ethylene / propylene-styrene (SEPS), and combinations thereof. The elastomeric agent may comprise 0.1 to about 25% by weight of the composition. In some embodiments, the elastomeric agent may comprise 0.5 to 10% by weight of the composition. In some embodiments, the elastomeric agent may comprise 0.8 to 5% by weight of the composition. In some embodiments, the elastomeric agent may comprise 1 to 3% by weight of the composition.

[0038] Optional Additives According to some embodiments of the present invention, the compositions described herein may further comprise one or more additives, such as antioxidants, stabilizers, dispersants, colorants, adhesives, wetting agents, flame retardants, extenders, and corrosion inhibitors.

[0039] Thermal Interface Material Properties In a preferred embodiment, the thermal interface material has a thermal conductivity of 0.1°C·cm 2 / W, preferably less than 0.05°C cm 2 / W. In some embodiments, the thermal interface material exhibits a thermal impedance of 0.01 to 0.1 °C cm 2 The thermal impedance is shown in W / W.

[0040] The final thickness of the thermal interface material applied between the heat generating component and the heat dissipating component is called the bondline thickness. The value of the bondline thickness is determined in part by the flowability of the thermal interface material when heated by the heat generating component. The bondline thickness (BLT) is related to the thermal impedance (TI) and thermal conductivity (TC) by the formula TI=BLT / TC, where the lower the BLT, the lower the thermal impedance for the same thermal conductivity. In some embodiments, the bondline thickness of the thermal interface material of the present invention is less than 50 μm, preferably less than 40 μm, and more preferably less than 25 μm when subjected to a pressure of 40 psi and heated to 80° C. In some embodiments, the bondline thickness is between 5 and 50 μm.

[0041] The thermal interface material is preferably 10 5 Less than Pa s, preferably 10 4 In some embodiments, the thermal interface material has a melt viscosity of less than 10 Pa·s. 3 ~10 4 The melt viscosity is measured in Pa·s at a temperature above the melting point of the phase change material in the thermal interface. The melting point of the phase change material is considered to be the melting point of the thermal interface material and is preferably between 40 and 160°C, more preferably between 40 and 125°C, and even more preferably between 40 and 80°C.

[0042] Goods The thermally conductive composition of the present invention may be used to manufacture articles of various shapes. The article may be used as an interface between a heat generating device and a heat dissipating device. The heat generating device transfers heat to the interface article, causing the interface article to melt at an operating temperature below 120°C, often below 80°C. As the phase change material melts, a liquid film forms at the interface surface of the interface article, the electronic component, and the heat dissipator. The film containing the phase change material reduces the thermal resistance of the interface surface. The resin matrix of the thermally conductive interface provides a network to contain the liquid phase change material and prevents it from flowing out of the interface.

[0043] The composition can be melt extruded into a thin film. In contrast, conventional films made from silicone-based filler compositions are generally much thicker. In certain applications, non-silicone resin films have been found to be more advantageous than silicone versions. For example, thin silicone films tend to have poor handling properties and may require a support structure to maintain their integrity. In addition, silicone resins and particulate filler materials may be incompatible due to the different densities and low viscosity of silicone resins. Therefore, it is preferred that the compositions of the present invention are non-silicone. EXAMPLES

[0044] The following composition was used to prepare the thermal interface material: Material Weight (g) Paraffin wax 25~40 Amine-functional polyester copolymer 8~12 Styrene-Butadiene-Styrene PSA 10~40 Trimellitate plasticizer 20~45 Antioxidants 3~7 Wetting agent 10~15 Zinc oxide 100~500 Aluminum (1μm) 300~500 Aluminum (9μm) 600~1000

[0045] The composition is 0.1°C·cm 2 It showed a thermal impedance of 10000 kcal / W and a melting point range of 40 to 55°C. [Explanation of symbols]

[0046] 10 Electronic Package 12 Base material 13 Mounting surface 14 Electronic Components Layout 16 Electronic Components 18 Heat sink 20 Thermal Interface 22 Heat Path 24 Heat absorbing fluid medium 28 Finn

Claims

1. A non-silicone resin containing a phase change material; a plasticizer comprising an amine functional polyester copolymer present in the material at 25-50% by weight of said non-silicone resin; Elastomeric agents; a thermally conductive particulate filler capable of being wetted by said plasticizer and having a particle size of less than 25 μm; A thermal interface material comprising: Thermal impedance is 0.5°C cm ２ / W or less, melting point is 40°C to 80°C, and melt viscosity is 10 ５ A thermal interface material having a viscosity of less than 1 Pa·s.

2. 2. The thermal interface material of claim 1 comprising 50-95% by weight of the thermally conductive particulate filler, 1-5% by weight of the non-silicone resin comprising the phase change material, and 1-3% by weight of the elastomeric agent.

3. 10. The thermal interface material of claim 1, wherein the thermally conductive particulate filler is selected from aluminum, aluminum nitride, zinc oxide, and combinations thereof.

4. 4. The thermal interface material of claim 3, wherein aluminum comprises at least 40% by weight of the thermally conductive particulate filler.

5. 4. The thermal interface material of claim 3, wherein the thermally conductive filler is aluminum.

6. 10. The thermal interface material of claim 1, wherein the thermally conductive particulate filler is present in a multimodal particle size distribution comprising a first concentration peak between 0.1 and 3 μm and a second concentration peak between 8 and 12 μm.

7. 7. The thermal interface material of claim 6, wherein the first concentration peak comprises 15-35% by weight of the thermally conductive particulate filler and the second concentration peak comprises 40-60% by weight of the thermally conductive particulate filler.

8. 8. The thermal interface material of claim 7 including a third concentration peak comprising 15-35% by weight of the thermally conductive particulate filler.

9. 8. The thermal interface material of claim 7, wherein the first concentration peak comprises aluminum nitride particles and the second concentration peak comprises aluminum particles.

10. 9. The thermal interface material of claim 8, wherein the third concentration peak comprises zinc oxide particles.

11. 10. The thermal interface material of claim 1, which is extrudable into a film that is reflowable to a bondline of less than 50 μm.

12. 2. The thermal interface material of claim 1, wherein the elastomeric agent is a styrenic copolymer selected from styrene-butadiene-styrene (SBS), styrene-ethylene / butylene-styrene (SEBS), styrene-isoprene-styrene (SIS), styrene-ethylene / propylene-styrene (SEPS), and combinations thereof.

13. 10. The thermal interface material of claim 1, wherein the non-silicone resin has a melting point of less than 150°C.

14. 14. The thermal interface material of claim 13, wherein the non-silicone resin comprises paraffin wax.

15. Electronic components; The thermal interface of claim 1 thermally coupled to the electronic component; Including electronic devices.

16. The electronic device of claim 15 , wherein the thermal interface is coated on the electronic component.

17. A substrate; an electronic component fixed on the substrate; a thermally conductive material thermally connected to the electronic component; The thermally conductive material comprises a non-silicone resin including a phase change material, an amine functional polyester copolymer present at 25-50% by weight of the non-silicone resin, an elastomeric agent, and a thermally conductive particulate filler having a particle size of less than 25 μm, and the thermal interface material has a thermal impedance of 0.1° C. cm ２ / W, melting point is 40°C to 80°C, and melt viscosity is 10 ５ Less than Pa·s; a heat sink thermally connected to the thermally conductive material; , an electronic package.

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