Systems and methods for thermal energy management

Abstract

Described herein are devices, systems, and methods for the capture, transfer, and management of thermal energy. Phase change materials are used because of their characteristics of high thermal inertia and high energy per volume when operating near their solid-liquid transition points. Additionally, the systems, devices, and methods utilize one or more thermoelectric modules thermally coupled to a first side of the phase change material and one or more thermoelectric modules thermally coupled to a second side of the phase change material opposite the first side. Through the use of the thermoelectric modules, thermal energy may be stored in, transferred within, or captured from the phase change material to which the thermoelectric modules are coupled.

Description

[Technical field]

[0001] (CROSS REFERENCE TO RELATED APPLICATIONS) This application claims priority to U.S. Provisional Patent Application No. 63 / 309,459, filed February 11, 2022, and U.S. Provisional Patent Application No. 63 / 478,301, filed January 3, 2023, the contents of each of which are incorporated by reference in their entirety herein.

[0002] All publications and patent applications mentioned in this specification are herein incorporated by reference in their entirety, as if each individual publication or patent application was specifically and individually indicated to be incorporated by reference in its entirety.

[0003] The present disclosure relates generally to the field of thermal energy management, and more specifically to the field of heating and air conditioning and temperature management of variable volume enclosures. Described herein are systems and methods for managing thermal energy to regulate temperature. [Background technology]

[0004] Heating and cooling of enclosures and objects has been practiced for many years. Many of the fundamental principles and challenges remain today, including efficiency limitations, non-uniform temperature profiles, and other inherent issues. For example, the inefficiencies of heating and cooling in buildings are mostly related to the static insulation of the building envelope. Static insulation, traditionally used in most heating and cooling applications, only slows the transfer of thermal energy through the building envelope. Whether it is the ingress of thermal energy into the envelope (e.g., in summer) or the loss of thermal energy (e.g., in winter), most static insulation functions to slow down these processes. Additionally, static insulation does not function to capture, convert, or transfer any portion of the thermal energy that passes through the building envelope. Summary of the Invention [Problem to be solved by the invention]

[0005] Conventional heating, ventilation and air conditioning (HVAC) systems have efficiency shortcomings that are difficult to address economically, including loss of thermal energy during winter months, wasted energy during summer months due to thermal energy infiltration, non-uniform temperature profiles, lack of independent temperature control within the enclosure, diurnal losses, and other shortcomings inherent in the enclosure envelope. HVAC systems are a major contributor to large amounts of greenhouse gases each year, and inefficient systems are responsible for unjustifiable emissions. Thus, a need exists to develop new devices and systems that address these long-known problems while maintaining or improving affordability, comfort, performance, space utilization, and ease of retrofitting. [Means for solving the problem]

[0006] In some aspects, the technology described herein relates to a system for managing thermal energy, the system including a temperature energy storage medium having a first surface opposite a second surface, a first thermocouple disposed on the first surface of the temperature energy storage medium, a first thermal interface material between the first thermocouple and the first surface of the temperature energy storage medium, a second thermocouple disposed on a second surface of the temperature energy storage medium, and a second thermal interface material between the second thermocouple and the second surface of the temperature energy storage medium.

[0007] In some aspects, the technology described herein relates to a system for managing thermal energy including a temperature energy storage medium having a first surface opposite a second surface, a front-end array including a plurality of first thermoelectric modules disposed on the first surface of the temperature energy storage medium, and a back-end array including a plurality of second thermoelectric modules disposed on the second surface of the temperature energy storage medium.

[0008] In some aspects, the technology described herein relates to a method of managing thermal energy, the method including coupling a front-end array to a first surface of a thermal energy storage medium, the front-end array including one or more first thermoelectric modules, coupling a back-end array to a second surface of the thermal energy storage medium, the first surface being opposite the second surface and the back-end array including one or more second thermoelectric modules, and adjusting a temperature of at least a portion of the thermal energy storage medium using the front array or the back-end array, or both.

[0009] In some aspects, the technology described herein relates to a computer-implemented method of controlling a temperature within an enclosure, the method including receiving by a processor a first air temperature input from one or more first locations of the enclosure, receiving by the processor a first wall temperature input from the one or more first locations of the enclosure, receiving by the processor a first set point air temperature input for the one or more first locations of the enclosure, and adjusting the first air temperature within the one or more first locations of the enclosure when the first air temperature corresponding to the first air temperature input differs from the first set point air temperature input. and outputting a first control signal to one or both of a first system for adjusting a first wall temperature of at least a portion of an interior wall of the enclosure at one or more first locations to adjust a first air temperature, the second system including a plurality of first thermoelectric modules coupled to a first surface of the thermal energy storage medium and a plurality of second thermoelectric modules coupled to a second surface of the thermal energy storage medium, the second surface of the thermal energy storage medium opposite the first surface of the thermal energy storage medium, the first surface defining an interior surface and the second surface defining an exterior surface.

[0010] In some aspects, the technology described herein relates to a system for controlling air temperature within an enclosure, the system including a first system configured to adjust the air temperature within one or more compartments, a second system configured to adjust a temperature of at least a portion of an interior wall of the enclosure, and a processor coupled in fluid communication with the first and second systems, the first system including a first plurality of thermoelectric modules coupled to a first surface of a thermal energy storage medium, and the second system including a second plurality of thermoelectric modules coupled to a second surface of the thermal energy storage medium, the first surface defining an interior surface being opposite the second surface defining an exterior surface.

[0011] In some aspects, the technology described herein relates to a computer-implemented method of controlling temperature within an enclosure, the method including receiving by a processor predetermined parameters for the enclosure, the predetermined parameters being determined from sensor data or a model of the enclosure or a similar enclosure, receiving by the processor a predetermined set point temperature input for the enclosure, receiving by the processor a central air temperature input for the enclosure, determining whether the central air temperature input is within a tolerance range of the predetermined set point temperature input, and adjusting the air temperature of the enclosure using a temperature adjustment system when the central air temperature input in a particular region is outside the tolerance range of the predetermined set point temperature input for the region, the degree of adjustment being based on the predetermined parameters for the enclosure.

[0012] The above is a summary and thus is not necessarily limited in detail. The above-mentioned aspects, together with other aspects, features, and advantages of the present technology, are described below in connection with various embodiments with reference to the accompanying drawings. [Brief description of the drawings]

[0013] [Figure 1] FIG. 1 is a schematic diagram of an embodiment of a system for thermal energy management. [Diagram 2] 1 illustrates an embodiment of two sets of multiple thermoelectric modules. [Figure 3A]1 illustrates an embodiment of series wiring of thermoelectric modules. [Figure 3B] 1 illustrates an embodiment of parallel wiring of thermoelectric modules. [Figure 4] 1 illustrates an embodiment of a thermal energy storage medium between two sets of multiple thermoelectric modules. [Diagram 5] 1 illustrates an embodiment of one or more temperature sensors coupled to a thermoelectric module. [Figure 6] 1 illustrates an embodiment of a thermal energy storage medium between two sets of multiple thermoelectric modules that divide an interior space or enclosure and the environment. [Figure 7] 1 illustrates an embodiment of a system for regulating and maintaining temperature within an enclosure. [Figure 8] 1 illustrates an embodiment of a system for regulating and maintaining temperature within an enclosure. [Figure 9] 1 illustrates an embodiment of a method for maintaining one or more temperatures within an enclosure. [Figure 10] 1 illustrates an embodiment of a method for maintaining temperature within two or more sub-enclosures of an enclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] The depicted embodiments are merely examples and are not intended to limit the disclosure. The schematic drawings are drawn to illustrate features and concepts and are not necessarily to scale.

[0015] The above is a summary and thus is not necessarily limited in detail. The above-mentioned aspects, along with other aspects, features, and advantages of the present technology, will now be described in connection with various embodiments. The inclusion of the following embodiments is not intended to limit the disclosure to these embodiments, but rather to enable one of ordinary skill in the art to make and use the contemplated invention. Other embodiments may be utilized, and improvements may be made without departing from the spirit or scope of the subject matter presented herein. The aspects of the disclosure described and illustrated herein can be configured, combined, improved, and designed in various ways, all of which are expressly contemplated and form part of this disclosure.

[0016] Prior or conventional systems attempt to address both the energy efficiency and thermal management concerns associated with temperature or heat management within an enclosure, however, these prior or conventional systems suffer from several shortcomings or technical problems.

[0017] For example, thermal management systems for semi-infinite enclosures (e.g., building enclosures) have relied on the use of Peltier modules combined with photovoltaics to provide an active building envelope (ABE) or wall facade. However, these systems are limited because, like traditional HVAC systems, they require static insulation to operate efficiently. Furthermore, traditional heat sinks (typically with fins) and air gap channels are typically required to dissipate heat. Other thermal management systems for semi-infinite enclosures (e.g., buildings) combine Peltier modules to provide air conditioners with thermal storage capabilities enabled by thermal energy storage or phase change materials (PCMs). However, these systems are stand-alone units that occupy living space and require static insulation to operate efficiently. Finally, there have been recent attempts to address both energy efficiency and dynamic insulation of enclosure envelopes using thermal energy storage materials (broadly classified as dynamic insulation material systems (DIMS)) and non-thermoelectric devices. However, the particular methods used to accomplish heat transfer in PCM materials rely on the use of thermal switches (mechanical devices with moving parts) and / or thermal diodes (passive devices that cannot be operated on demand).

[0018] The various embodiments described herein solve the technical problems of the prior systems by providing several technical solutions / capabilities. The technical solutions / capabilities provided by the embodiments described herein include: (i) smart (intelligent) load control via optional temperature, humidity, and atmosphere control based on sensors; (ii) zone and micro-zone temperature control via thermoelectric modules (e.g., Peltier modules); (iii) dynamic insulation and heat storage; (iv) waste heat recovery; and (v) envelope diagnostics and monitoring via spatial mapping of the thermal envelope. Not all capabilities are necessarily feasible with the various or each of the embodiments described herein. These capabilities are achieved without occupying living space and in many cases without the need for void channels to dissipate heat. Additionally, unlike the PCM-embedded DIMS described above, the embodiments described herein are primarily non-mechanical (i.e., maintenance-free) and active (i.e., electrically operated) and can be implemented with thermoelectric modules (e.g., Peltier modules) that provide primary, supplemental, or extended heating and / or cooling while also enabling heat transfer to and from the PCM material.

[0019] As shown in FIG. 1, described herein is a system 200 for managing thermal energy in an enclosure. The system described herein includes one or more processors 280 communicatively coupled to a memory 210 having an application 270 stored therein. The processor 280 may read information from and write information to the memory 210 to perform any of the methods described elsewhere herein. The processor 280 is communicatively coupled to a thermal energy management module, array, system, or thermoelectric module 230. The processor 280 may optionally be communicatively coupled to a remote computing device 220 (e.g., a server) for additional computing capability and / or power and / or for a distributed network of connected systems.

[0020] Optionally, some embodiments include the use of a conventional heating, ventilation, and air conditioning system 260. The conventional heating, ventilation, and air conditioning system 260 may include a radiant heating system, an electric heat pump, a fan, and / or a radiant cooling system. A conventional heating, ventilation, and air conditioning system may also be referred to as an HVAC system. Additionally, as described elsewhere herein, system 200 may optionally include electrical or wireless communication with external circuitry 250. Each of these components is described in more detail below.

[0021] The definition of an enclosure is as follows: any closed system containing a space limited by a physical boundary (e.g., a wall, a membrane, etc.), and may include systems in which such spatial limit is achieved by one or more physical boundaries (e.g., surfaces) and an environment (e.g., atmosphere). For example, an open or closed building may be an enclosure. Also, the surface of a road and its surrounding environment may be an enclosure in relation to the inflow and back-radiation of heat to and from the Earth's atmosphere.

[0022] The term "manage" or any form of this term may be used herein. For example, "manage" when used in relation to thermal energy may be used interchangeably with, or any form of, monitoring, operating, regulating, managing, or storing. Additionally, the terms monitoring, operating, regulating, managing, or storing, or any form of this term may also be used interchangeably with one another.

[0023] The term "harvest" or any form of this word may be used herein. For example, when used with respect to thermal energy, "harvest" may be defined as the conversion of thermal energy by one or more thermoelectric modules into electrical energy based on a temperature difference across those modules.

[0024] The term "electrical energy" may be used interchangeably with current, voltage, or power.

[0025] The term "communicatively coupled" may be defined as either wireless communication between the components (ie, wireless coupling) or a wired connection between the components.

[0026] Some of the embodiments below may include one or more thermoelectric modules that are bonded to a phase change material, sometimes referred to as being "thermally coupled" to the phase change material. It is contemplated herein that the bonding or thermal coupling of the thermoelectric module to the phase change material or to any type of thermal energy storage medium may be accomplished by direct contact of the thermoelectric module to the phase change material, or indirectly by use of a thermal interface material or narrow air gap between the thermoelectric module and the phase change material. The thermal interface material may include a material with high thermal conductivity, such as a thermally conductive alloy, thermal grease, thermal epoxy, elastomer, or any other material known in the art for enhancing thermal energy transfer. The thermal interface material may be in sheet or paste form, and it is contemplated that the thermal interface material may be disposed between the thermoelectric module and the phase change material. For example, as shown in FIG. 6, the thermal interface material may be disposed between the thermoelectric modules 2c, 2f, 2i and the phase change material 8. Additionally, a thermal interface material may be disposed between the thermoelectric modules 4c, 4f, 4i and the phase change material 8.

[0027] The phase change materials described herein may be referred to as "PCMs." A phase change material is defined herein as a material that absorbs and releases thermal energy when it changes phase. Additionally, a phase change material may absorb thermal energy during its solid-liquid transition and release thermal energy during its liquid-solid transition. The phase change materials described in the embodiments may be used because of the large amount of thermal energy that may be stored during its solid-liquid transition and because of the large amount of thermal energy that may be released during its liquid-solid transition. A phase change material with a solid-solid transition may be selected for some desired effect. For example, some embodiments may include a phase change material with morphological characteristics, such as a solid-solid transition between two different crystalline forms (i.e., polymorphs). An embodiment including a polymorphic phase change material may operate at or near a solid-solid transition temperature, thus avoiding the need for a host material to encapsulate the liquid phase change material. A phase change material has high thermal inertia properties when operating near its liquid-solid transition temperature (liquid-solid transition as used herein may be interchangeable with solid-solid transition). Embodiments herein may include encapsulated phase change materials, microencapsulated phase change materials, pure phase change materials, and composite phase change materials. Additionally, phase change materials may be encapsulated by encapsulating materials having properties ranging from thermally insulating to thermally conductive to restrict or promote, respectively, heat flow through and / or across the plane of the phase change material. Additionally, some phase change materials may have a wide temperature range over which the phase change occurs, as compared to other phase change materials. Some embodiments may include phase change materials with a wide transition temperature range. The composition of the phase change material may be modified to include a solid-liquid transition temperature suitable for a particular application. For example, modified waxes with desired solid-liquid transition temperatures may be produced or tailored. Tuning of the solid-liquid transition temperature may be achieved through the use of ions and their effect on the concentration gradient due to their movement. Phase change materials may be paraffin wax, non-paraffin organics, hydrated salts, fatty acids, and metals. The embodiments described herein that operate near human comfort temperature levels or human comfort temperature specifications may have multiple phase transition temperatures to accommodate various climate zones (e.g., the eight climate zones in the United States, climate zones around the world, etc.), human comfort temperature specifications, or specifications for the operation of man-made facilities.It is contemplated that embodiments may include phase change materials with a wide range of flexibility. Contemplated phase change materials may be rigid, flexible, elastic, or have any other mechanical properties suitable for the application.

[0028] The list of phase change materials that may be used is: LiClO3, K2HPO4.6H2O, KF.4H20, Na2CrO4.10H2O, Cu(NO3)2.6H2O, FENH4(SO4)2.12H2O, Mn(NO3|2.6H20, LINO3.3H20, CaBr2.6H20, Zn(NO3)2.6H20, Na2HPO4.12H20, FeCl3.6H20, Na2C03.10H20, CaCi2.6H20, Na2504.10H20, Ca(NO32.4H20, Fe(NO313.9H20, Na2503H20, Phase change materials include, but are not limited to, Na2P04.7H20, Cd(NO3)2.4H20, Cr / NO3)3.9H20, Mg(CH3CO2)2.4H20, MnCI2.4H20, Co(NO3)2.6H20, Al(NO3)13.9H20, CH3COONA.3H20, Na4P207.10H20, Na2B407.10H20, BalOH12.8H20, Na3P04.12H2O, NAOH.H20, NaHSO4.H20, or any other phase change material substitute known in the art.

[0029] In some applications, phase change materials may be the preferred temperature energy storage medium due to their high energy storage capabilities when near the transition temperature, however, any material capable of storing thermal energy and removing thermal energy may be used as a temperature energy storage medium. Although phase change materials are used herein with embodiments, it is believed that phase change materials may be interchangeable with any material from which thermal energy may be stored or removed. Additionally, it is believed that PCM materials that are engineered in other ways (e.g., non-thermally or optically) for long-term temperature energy storage and release may be used with embodiments.

[0030] Thermoelectric modules 230 are described throughout this disclosure and are illustrated in FIG. 1. Thermoelectric modules 230 described herein may include Peltier modules, solid-state electric heat pumps, solid-state electric engines, thermoelectric generators, solid-state refrigerators, heat flux sensors, modules utilizing the Peltier effect, modules utilizing the Seebeck effect, modules utilizing the thermoelectric effect, or modules utilizing the Thomson effect. Some embodiments utilize thermoelectric modules with through-plane thermoelectric generation, in-plane thermoelectric generation, or a combination of both. Additionally, the thermoelectric module 230 may be as simple as a single thermocouple. Another example of a thermoelectric module 230 may include multiple thermocouples wired in series, but thermally arranged in parallel. Embodiments comprising a thermoelectric module including one or more thermocouples may include thermocouples constructed of polymers, inorganic perovskites, composites, homogeneous materials, heterogeneous materials, amorphous, crystalline semiconductors, or any other suitable thermocouple material known in the art. Some embodiments include a thermoelectric module 230 with a first side opposite a second side, where the first side is heated, and when a current polarity in a first orientation is applied, the second side is cooled. When the opposite current is applied, the second side is heated while the first side is cooled. In the embodiments described herein, the thermoelectric module 230 is thermally coupled to a thermal energy storage medium by either the first side or the second side of the thermoelectric module. Some embodiments utilize a thermoelectric module 230 in a film or thin film form. For example, a film or thin film thermoelectric module may be used when coupled to a phase change material in a sheet form. Additionally, the thermoelectric modules of the embodiments described herein may vary in flexibility. Contemplated thermoelectric modules may be rigid, flexible, elastic, or have any other mechanical properties suitable for the application. For example, a flexible and / or elastic thermoelectric module may be coupled to a flexible and / or elastic phase change material, resulting in an embodiment with flexible and / or elastic performance.

[0031] With its ability to generate electrical energy from thermal energy (i.e., functioning as a thermoelectric generator) and generate thermal energy from electrical energy, the thermoelectric module 230 offers considerable advantages when thermally coupled to a phase change material. A phase change material at or near its transition temperature can store a significant amount of thermal energy relative to its volume. Thermal energy can be transferred to the phase change material by one or more thermoelectric modules thermally coupled to the phase change material. Thermal energy transferred to or absorbed by the phase change material can also occur through radiation, convection, conduction, or a combination of the above heat transfer types. The phase change material can also store thermal energy absorbed by radiation from sunlight, absorbed by convection from air (either inside an enclosure or from the surrounding environment), absorbed by convection from gas streams (e.g., exhaust from an internal combustion engine), and from other heat sources. Additionally, a significant amount of thermal energy can be harvested from a phase change material at or near its transition temperature, and the thermal energy can be harvested by one or more thermoelectric modules thermally coupled to the phase change material. Thermal energy can be harvested from the phase change material above the phase transition temperature, although in some instances it may not be as efficient as harvesting energy at or near the phase change material transition temperature. A further capability of embodiments employing two or more thermoelectric modules is to transfer thermal energy from one portion of the phase change material to another. For example, a first thermoelectric module can harvest thermal energy from the phase change material proximate where the first thermoelectric module is thermally coupled to the electrical energy, which can be transferred to a second thermoelectric module that is thermally coupled to another portion of the phase change material. When the second thermoelectric module receives the electrical energy, the electrical energy is converted to thermal energy that can either be absorbed by the phase change material proximate where the second thermoelectric module is thermally coupled, or can be used for another purpose such as enhancing space heating or cooling. In another example, the first thermoelectric module can send or move thermal energy from the phase change material proximate where the first thermoelectric module is thermally coupled to another portion of the phase change material that has not yet reached its temperature energy storage capacity.

[0032] The embodiments described herein may further include non-thermoelectric modules that may be used in conjunction with a thermoelectric module to further facilitate harvesting of thermal energy from the phase change material or the environment. For example, a thermophotovoltaic cell or module may be used to harvest energy by radiation. The thermophotovoltaic module may receive the thermal energy transferred from the phase change material in the form of radiation. The radiated thermal energy may be converted to electrical energy by the thermophotovoltaic module and transferred and / or stored as described herein for the electrical energy generated by the thermoelectric module. Other examples of non-thermoelectric modules may include thermal diodes, thermal switches, and the like.

[0033] The embodiments described herein may further include non-thermal electric modules that may be used in conjunction with a thermoelectric module to facilitate harvesting of non-thermal (e.g., optical) and temperature (e.g., thermal) energy from a phase change material or environment. For example, a photovoltaic cell or module may be used to harvest solar radiation and a thermoelectric module may be used to harvest thermal energy. A photovoltaic module may receive solar energy transferred from the environment in the form of radiation. The radiant solar energy may be converted to electrical energy by the photovoltaic module and transferred and / or stored as described herein for electrical energy generated by a thermoelectric module.

[0034] Some embodiments may utilize phase change material in the form of a sheet. As shown in FIG. 6, the thickness 21 of a suitable sheet of phase change material 8 depends on the application and may vary considerably from application to application. Some embodiments include a phase change material 8 for use within a building enclosure having a thickness 21, for example, from about 0.00001 cm to about 100 cm, from about 0.0001 cm to about 50 cm, from about 0.1 cm to about 10 cm, etc. As shown in FIG. 4, the sheet of phase change material 8 may include a first side 9 having a first surface area and a second side 11 having a second surface area, the first side 9 being opposite the second side 11. The first surface area and / or the second surface area may be greater than an adjacent surface area of ​​the sheet of phase change material, for example, an edge or perimeter of the phase change material. The first surface area and the second surface area may be substantially equal. Some embodiments include a first set of one or more thermoelectric modules thermally coupled to the first side and a second set of one or more thermoelectric modules coupled to the second side. An embodiment including a plurality of thermoelectric modules in a first set of thermoelectric modules and a plurality of thermoelectric modules in a second set of thermoelectric modules may include envelope thermal management capabilities. For example, these embodiments may be used to transfer thermal energy in a sheet of phase change material. Additionally, in some instances, thermal energy may be present or absorbed at high levels in certain portions of the phase change material 8, and therefore at low levels in other portions of the phase change material 8. In these instances, the embodiment may operate a first set of one or more thermoelectric modules from the front-end array 5 and back-end array 6 in close proximity to one or more portions of the phase change material 8 that have higher thermal energy. Operation of the first set of one or more thermoelectric modules may capture thermal energy from the phase change material portions with higher thermal energy. Additionally, this embodiment may operate a second set of one or more thermoelectric modules in close proximity to one or more portions of the phase change material that have lower thermal energy. Operation of the second set of one or more thermoelectric modules may transfer thermal energy to the portions of the phase change material that have lower thermal energy. The envelope thermal management described herein may also be referred to as or in relation to dynamic insulation.Embodiments described herein may include transparent phase change materials and / or transparent thermoelectric modules.Embodiments comprising at least a portion constructed of transparent phase change material and / or transparent thermoelectric modules may be suitable for window or sight glass applications.

[0035] Referring to FIG. 6, the combined width 14 of the phase change material 8, thermoelectric module, and in some embodiments, the temperature sensor on the thermoelectric module may be from about 0.3 cm to about 5 cm, from about 1 cm to about 4 cm, from about 1.5 cm to about 3 cm, etc. Some embodiments include the ability to transfer thermal energy to different portions of the phase change material as described herein, and also include the ability for thermal energy to be acquired from the phase change material or stored in the phase change material from one or both of the first and second sides. Managing thermal energy from the first and second sides may greatly increase the efficiency of managing thermal energy in the phase change material. When a portion of the phase change material has one or more first thermoelectric modules on a first side opposite a second side that includes one or more second thermoelectric modules, the rate of transferring thermal energy to and from the phase change material portion may be significantly higher than transferring thermal energy to and from the phase change material portion from only one side. Both the one or more thermoelectric modules located on a first side of the phase change material (e.g., sometimes referred to as a front-end array) and the one or more thermoelectric modules on a second side of the phase change material (e.g., sometimes referred to as a back-end array) can be controlled independently of each other or in coordination with each other.

[0036] Some embodiments include a sheet of phase change material forming one or more walls of an enclosure or wall portions of an enclosure. Looking at a cross-sectional perspective view of an enclosure wall, these embodiments may be used to form any layer of the enclosure wall, such as the innermost layer, the outermost layer, or any layer between the layers mentioned above. Additionally, the layer may include a coating applied to the wall. The enclosure may contain air having an average temperature that is different from the temperature of the environment that at least partially surrounds the enclosure (which in some embodiments may be partially regulated by an HVAC system). At least for the period during which the phase transition occurs, the high thermal inertia of the phase change material optimizes the temperature difference across the thermoelectric module inside the enclosure and optimizes the temperature difference across the thermoelectric module outside the enclosure. For example, if the enclosure is a heated building, the phase transition temperature of the phase change material may be lower than the temperature of the air inside the building, but higher than the temperature of the air in the outside environment. Therefore, with interior referring to the inside of the enclosure and exterior referring to the outside of the enclosure, the thermoelectric module thermally coupled to the phase change material inside the phase change material and the thermoelectric module thermally coupled to the phase change material outside the phase change material are exposed to a temperature difference between them. Electrical energy generation by the thermoelectric module requires a temperature difference, and therefore the described examples can be used to optimize thermal energy capture from both sides of the phase change material. Additionally, the heat stored in the phase change material and the heat transferred from the thermoelectric module can be used to offset the energy demands of the central HVAC system while optimizing thermal comfort. Although an example is given of a building with heating, the reverse is true for cooling. The temperature of the phase change material may be higher than the temperature of the air inside the building, but lower than the temperature of the air in the external environment. Therefore, the thermoelectric module thermally coupled to the phase change material inside the building and the thermoelectric module thermally coupled to the phase change material outside the building are exposed to a temperature difference between them. Some embodiments can be used to manage thermal energy in any enclosure where thermal energy management is beneficial. Examples may include, but are not limited to, canisters storing sub-ambient temperature materials (eg, dry ice), electrochemical batteries, or air ducts and pipes.

[0037] In further detailing at least a portion of one or more walls that provide air temperature control and comprise phase change material or are constructed with phase change material and comprise thermoelectric modules, thermal inertia balancing can be extremely beneficial. The embodiments with thermal energy transfer and management capabilities described herein can include dynamic insulation capabilities. Dynamic insulation is the process of shifting or adjusting the thermal inertia of an enclosure envelope to change the rate at which the temperature balances with the environment. From the perspective of the enclosure thermal envelope, thermal energy can move from a hot spot to a cold spot, thereby substantially moderate the temperature inside the enclosure. In embodiments with multiple enclosures (e.g., rooms in a building, compartments in a refrigerated truck, compartments in a railroad, compartments in a ship, compartments in an aircraft, or rooms in commercial and residential buildings), thermal energy can be transferred to or from portions of phase change material to moderate the temperature of the thermal envelope. Additionally, thermal energy may be transferred to and from the phase change material portions in individual compartments, or independent air comfort temperature control or local air temperature control may be provided for thermal management of individual compartments. Some embodiments may include the ability to autonomously perform thermal energy transfer from portions of the phase change material that have reached a solid-liquid transition temperature to avoid full transition of the phase change material (e.g., full transition to liquid). The harvested energy from these portions of the phase change material (i.e., thermal energy converted to electrical energy) may be transferred to another portion of the phase change material, or converted to electrical energy and stored in an electrical energy storage device.

[0038] During the winter months, conventional HVAC systems are known to have problems with heat energy loss. In other words, conventional HVAC loses a significant amount of heat energy, defined herein as waste heat energy, at the walls of the enclosure where the HVAC heats the interior air to a level that is comfortable for humans. During the summer months, conventional HVAC systems actively remove heat energy from the interior air as it cools it to a level that is comfortable for humans, and the frequency with which the HVAC system is on is primarily based on the rate at which heat energy is transferred from the environment surrounding the enclosure through the walls to the interior air by convection (transferred to the exterior of the enclosure by convection or radiation). Thus, the amount of energy consumed by the HVAC system depends at least in part on the rate at which heat energy enters the enclosure. Other factors that affect the energy consumed by the HVAC system may include ventilation levels, enclosure volume, insulation, humidity conditions, daily and seasonal solar loads, etc. The enclosure can utilize embodiments described herein to reduce thermal energy loss, for example during the winter months, and to reduce energy usage, for example during the summer months, by the HVAC system 260. One or more walls of the enclosure can include portions constructed of phase change material in sheet form.

[0039] With respect to the enclosure, the sheet of phase change material may include a plurality of thermoelectric modules 230 thermally coupled to an interior 17 surface of the phase change material (shown in FIG. 6) and a plurality of thermoelectric modules 230 thermally coupled to an exterior 19 surface of the phase change material (shown in FIG. 6). For example, during winter months when the HVAC system 260 heats the interior air, at least a portion of the thermal energy that would traditionally be lost at the walls of the enclosure may instead be captured, transferred, or repurposed. The phase change material, having some thermal energy storage capability relative to the temperature of the application requiring thermal management, absorbs thermal energy that would otherwise be lost. In some embodiments, upon activation by the temperature threshold of the phase change material, the phase change material may transfer or capture thermal energy to another portion of the phase change material and transfer it to an external circuit 250, such as an electrical energy battery bank or an electrical grid. Thermal energy may also be transferred directly to or from a thermal battery bank. To further illustrate, during summer months when the HVAC system 260 consumes energy removing thermal energy from the interior air, at least a portion of the thermal energy that would traditionally be transferred from the environment through the enclosure walls and ultimately to the interior air may instead be captured by the thermoelectric modules of the front-end array and / or back-end array and transferred to the external circuit 250. Changes in temperature and temperature differences lead to moisture accumulation. Therefore, embodiments described herein may include utilizing moisture reducing or barrier layers on one or both sides 17, 19 to contain one or more thermoelectric modules (as shown in FIG. 6). Covering the thermoelectric modules and phase change material with moisture reducing or barrier layers may prevent moisture from contacting the thermoelectric modules and / or phase change material. Embodiments described herein may further include a forced convection system (e.g., a fan or jet impingement device) to move airflow on one or both sides 17, 19 (as shown in FIG. 6). Moving airflow on one side of the phase change material may mitigate moisture accumulation. This may also enhance the transfer of convective heat through the air of the space 16 on the inside 17 (shown in FIG. 6) or through the air of the environment 18 on the outside 19 .

[0040] Although many examples of embodiments are described herein with respect to enclosures, it is believed that the embodiments may be used in vehicle enclosures, aircraft enclosures, marine enclosures, spacecraft enclosures, or any other small, medium, large, or semi-infinite enclosures where precise or precise temperature control of the enclosure (e.g., cabin temperature) is desired for the purpose of maintaining thermal comfort, storing temperature energy, or harvesting temperature energy. When used in buildings, vehicles, aircraft, marine, spacecraft, or any other application with an enclosure that includes occupants, the embodiments may attenuate pressure shock waves from external inputs (e.g., rattles, snaps, crackles, pops). A further advantage of applications with an enclosure that includes occupants may be temperature shock absorption, for example, of an explosion. The embodiments may absorb at least a portion of the temperature shock that would otherwise affect the occupants. Some embodiments may be well suited for electric or hybrid vehicles. Any of the embodiments described herein may provide basic, supplemental, or augmented heating and / or cooling for semi-infinite enclosures such as those described herein, as well as other enclosure systems ranging from small enclosures (e.g., calorimeter compartments for fruit flies, space thermal suits for humans and animals, etc.), to medium-sized enclosures (e.g., cabins of automobiles, helicopters, yachts, etc.), to large enclosures (e.g., refrigerated trucks, trains, passenger aircraft, etc.), to semi-infinite size enclosures (e.g., cold chain, indoor agriculture, prefabricated housing, etc.). Some contemplated embodiments may include specialty packaging, such as pharmaceutical packaging, where it may be desirable to maintain the enclosure (e.g., pharmaceutical delivery packaging) within a predefined temperature range relative to the outside environment. Additionally, contemplated embodiments include the use of augmented reality. For example, during the use of augmented reality technology, embodiments of the present invention may be used to generate temperature effects on the user, for example, for an added "dimension" during use. Biomedical uses of some embodiments are also contemplated, such as heating and / or cooling wraps and thermoregulating body suits.

[0041] As described herein, some embodiments may operate in conjunction with a conventional HVAC system 260, however, it is further contemplated that some embodiments may operate in conjunction with other devices and systems in place of a conventional HVAC system. For example, various embodiments described herein may operate in conjunction with body thermoregulation, cooling packs inside an enclosure, heating packs inside an enclosure, home appliances, exhaust streams carrying thermal energy, etc.

[0042] Some embodiments described herein may be coupled in communication with an external circuit 250, such as an electric battery bank, an electric grid, a solar array, one or more wind turbines, one or more generators, or any combination thereof (otherwise known as DC distributed resources). The external circuit 250 may, in some variations, act as an energy reservoir. Some embodiments may be coupled to an external thermal energy reservoir (e.g., a thermal battery bank) such that they are capable of transferring thermal energy to or from one or more external energy reservoirs.

[0043] An electrical grid is defined herein as an interconnection network for the distribution of energy to consumers. An external circuit may be communicatively coupled to the thermoelectric module of the embodiments described herein. An embodiment communicatively coupled to an electrical storage device, such as an electrical battery bank, an electrical grid, or any other electrical energy storage device, may transfer electrical energy captured by the thermoelectric module to the electrical storage device or may receive electrical energy at the thermoelectric module from the electrical storage device. Any embodiment communicatively coupled to an external circuit is contemplated to include any hardware necessary for proper electrical communication. For example, the necessary hardware may include inverters, amplifiers, or any other electrical hardware used to change the characteristics of electricity. Additionally, an embodiment used in a building may be communicatively coupled to the building's electrical system (i.e., function as a power distribution or storage device). For example, the embodiments described herein may be wired to a building's main panel or sub-panel and may include a circuit breaker in the electrical circuit. The introduction of a circuit breaker may add a layer of protection against electrical energy overloads not foreseen in the embodiments. Additionally, the embodiments described herein may be plugged into an electrical outlet or hardwired into a fixture box, both of which may include a circuit breaker in the electrical circuit.

[0044] As shown and described elsewhere herein, one or more sensors 240, such as one or more temperature sensors, may be used in various systems and methods. A temperature sensor is defined herein as a temperature sensor having one or more temperature measurement devices therein. Thus, some temperature sensors described herein have the capability of measuring two temperatures simultaneously. Suitable temperature sensors may include thermocouples, resistance temperature detectors, semiconductor-based integrated circuits, or any other temperature sensor known in the art. Additionally, some embodiments described herein may be capable of measuring temperature with the thermoelectric module 230. Thus, and where appropriate, temperature sensing described as being performed by a temperature sensor may be performed by the thermoelectric module 230. Additionally, embodiments may include one or more sensors 240, such as a humidity sensor, a pressure sensor, or any other weather sensor for measuring weather conditions.

[0045] 1, the controller of some embodiments described herein may include one or more processors (e.g., local processor 280 or a remote processor in remote computing device 220), and / or one or more analog thermostats (not shown). The processor and thermostat may receive a measured temperature (e.g., from sensor 240) and output one or more control signals based on a predefined setpoint temperature that cause one or more system components (e.g., a heating and cooling system, also referred to herein as thermoelectric module 230, HVAC system 260, etc.) to make changes to the air temperature, wall temperature, or enclosure temperature based on the control signals.

[0046] Additionally, various computer-implemented applications 270 stored in memory 210 (e.g., using one or more local processors 280 or a remote processor of remote computing device 220) may control various aspects of some of the embodiments described herein using methods incorporating the Internet of Things (IoT). Additionally, the processor may be a multiple input / output (MIMO) processor. The MIMO processor receives an input (e.g., a temperature measurement from a temperature sensor) and outputs a respective control signal based on this input. The MIMO processor may be used with an estimator protocol (e.g., a Kalman filter), thus reducing the amount of temperature sensors used. The MIMO processor used with the estimator protocol estimates (e.g., interpolates) the temperature of areas without temperature sensors based on measurements received from existing temperature sensors. Other types of processors may include data-driven calibration processors, also known as agents (e.g., reinforcement learning or machine learning). The data-driven calibration processor continuously receives input (i.e., online) and adapts the system during operation. A data-driven calibration processor is different from a non-data-driven calibration processor (i.e., a MIMO processor) that receives inputs that are known, set, or default calibration setpoints. It should be inferred that the embodiments described herein as receiving temperature measurements from a temperature sensor may instead predict the temperature with a data-driven calibration protocol. For example, the controller of some embodiments described herein may further include one or more sensors 240 communicatively coupled to one or more processors 280. A sensor signal received by the one or more processors 280 may cause the one or more processors 280 to output a control signal based on the sensor signal. For example, a motion sensor, a proximity sensor, or an infrared sensor may be used to indicate the presence of a person in the enclosure. Thus, an autonomous adjustment to the default temperature setpoint (output by the one or more processors) may be made. For example, if no person is present in the enclosure, the set air temperature may be lowered to reduce energy usage.Additionally, motion or other proximity sensors may be used to indicate which portion or portions of the enclosure may have one or more people present. By identifying occupied portions of the enclosure, various embodiments may be used to adjust the thermal comfort level of those portions. For example, if no people are present in a portion of the enclosure, less thermal energy may be allocated to that portion of the enclosure to maintain a comfort temperature level, or thermal energy may be transferred away from that portion. One or more processors may control electrical energy to and from the thermoelectric modules (e.g., wired individually or as a subset) through the use of electrical control devices. For example, one or more processors may use solid-state or mechanical relays to control the flow of electrical energy generated by the thermoelectric modules that capture thermal energy from a portion of the phase change material. Furthermore, one or more processors may use solid-state or mechanical relays to control the flow of electrical energy consumed by the thermoelectric modules that transfer thermal energy to a portion of the phase change material. One or more processors may control an array of solid-state or mechanical relays that combine multiple circuits to accomplish the electrical energy transfer of some embodiments. To further illustrate, thermoelectric modules wired as subsets may be connected to different thermoelectric subsets on different portions of the phase change material by activating solid state relays to effect transfer of thermal energy between portions of the phase change material. Some embodiments may be connected to a single thermoelectric module on a different portion of the phase change material by activating solid state relays to effect transfer of thermal energy between portions of the phase change material. Additionally, one or more processors may operate relays to connect individual thermoelectric modules or subsets thereof to an external circuit to effect transfer of electrical energy to or from one or more thermoelectric modules depending on the orientation. Some embodiments may use pulse width modulated controls and protocols in place of or in conjunction with relays or switches. The use of pulse width modulated controls and protocols may control the voltage level of the electrical energy transfer.Controlling the voltage level of the electrical energy to the thermoelectric module can affect the rate of heat transfer of the thermoelectric module to the phase change material or the temperature of the air surrounding the module.

[0047] Additionally, conventional HVAC systems 260 are typically accompanied by noises, such as furnace rumble or fan sounds. Thus, users of HVAC systems associate these noises with an impending temperature change. In some embodiments, an imitation noise or sound may be generated by and received by one or more speakers 290 (communicatively coupled to one or more processors 280) based on a control output from one or more processors 280. The imitation noise may inform persons within the enclosure that temperature adjustment or maintenance is occurring.

[0048] Systems and Devices The systems and devices described herein function to manage thermal energy. In some embodiments, the systems and devices function to regulate and / or maintain an internal temperature within an enclosure. The systems and devices are used to manage thermal energy in an enclosure, but may additionally or alternatively be used in clinical, logistical, military, marine, aerospace, aviation, or any other suitable application. The systems and devices may be configured and / or adapted to function with any suitable device or system designed for or that would benefit from temperature regulation, thermal energy capture, and / or thermal energy management.

[0049] As shown in Figures 4, 5, and 6, an embodiment of a system for managing thermal energy may include a first thermoelectric module 2c, a phase change material 8, and a second thermoelectric module 4c. The first thermoelectric module 2c and the second thermoelectric module 4c may be used to transfer thermal energy to the phase change material 8 to increase the temperature of the phase change material, or from the phase change material 8 to decrease the temperature of the phase change material 8. With reference to Figure 6, the described embodiment may be implemented as part of an enclosure that encloses a space 16 and at least partially insulates the space 16 from an environment 18. The first thermoelectric module 2c may be disposed inside the enclosure adjacent to the space 16 (i.e., thermally coupled to an interior 17 surface of the phase change material 8), and the second thermoelectric module 4c may be disposed outside the enclosure in adjacent contact with the environment 18 (i.e., thermally coupled to an exterior 19 surface of the phase change material 8). If it is desired to keep the temperature of the space 16 lower than the temperature of the environment 18, a phase change material 8 can be selected that has a solid-liquid transition temperature close to the set temperature of the space 16. Thermal energy can be transferred from the phase change material 8 by the second thermoelectric module 4c, which experiences a temperature difference as it is absorbed from the environment 18 into the phase change material 8. There can be a temperature difference between a first surface 70 of the second thermoelectric module 4c that is thermally coupled to the phase change material 8 and a surface of a second surface 72 adjacent to the environment 18. Additionally, the first thermoelectric module can transfer thermal energy from the phase change material 8 due to a temperature difference at the first thermoelectric module 2c, which is caused by a first face 74 of the thermoelectric module 2c that is thermally coupled to the phase change material 8 and a second face 76 adjacent to the space 16 of the enclosure. By managing the temperature energy of the phase change material 8 in this way, the system can maintain the temperature of the phase change material 8 and the temperature of the air in the space 16 of the enclosure. Vice versa can also be implemented according to this embodiment. For example, when a desired or set temperature of the enclosure space 16 is higher than the temperature of the environment 18, a phase change material 8 may be selected that has a solid-liquid transition temperature close to the desired temperature of the space 16. When the temperature of the space 16 is maintained higher than the temperature of the environment 18, thermal energy is transferred by the first thermoelectric module 2c and the second thermoelectric module 4c to the phase change material 8. The transfer of thermal energy to the phase change material 8 enables heat transfer by radiation and / or convection to the space 16 to maintain the target or set temperature of the space 16.

[0050] A cross-sectional view of an embodiment is shown in FIG. 6, with the thermoelectric modules of the front-end array 5 and back-end array 6 shown as protruding from the phase change material. Some embodiments include thermoelectric modules with the front-end array 5 and back-end array 6 recessed at least partially within the phase change material. Additionally, various embodiments may also include one or more temperature sensors. For example, various embodiments may utilize a temperature sensor 10b on the first thermoelectric module 2c (shown in FIG. 6), a temperature sensor on the second thermoelectric module 4c, a temperature sensor on the interior 17 side of the phase change material 8, a temperature sensor on the exterior 19 side of the phase change material 8, a temperature sensor within the phase change material 8 (i.e., between the interior 17 side of the phase change material and the exterior 19 side of the phase change material), or some combination thereof. The temperature sensor 10b on the first thermoelectric module 2c may be used to measure the temperature of the space 16, the temperature of the thermoelectric module, or both. The temperature sensor on the second thermoelectric module 4c may be used to measure the temperature of the second thermoelectric module 4c, the temperature of the environment 18, or both. The environment 18 may include any wall layer on the exterior 19 side of the phase change material. A temperature sensor on the interior 17 side of the phase change material 8 may be used to measure the temperature of the phase change material 8, the temperature of the space 16, or both. A temperature sensor on the exterior 19 side of the phase change material 8 may be used to measure the temperature of the phase change material 8, the temperature of the environment 16, or both. As shown in FIG. 1, the temperature sensor 240 may be in communication with a thermostat or processor 280. An embodiment utilizing a thermostat may use the thermostat to regulate the electrical energy output from the thermostat to the first thermoelectric module 2c, the second thermoelectric module 4c, or both. The electrical energy output from the thermostat to the first thermoelectric module 2c and / or the second thermoelectric module 4c may manage the thermal energy in the phase change material 8, thereby managing the heat transfer to and from the thermal envelope, or enclosure. Similarly, embodiments utilizing a processor 280 may receive one or more temperature measurements (eg, from one or more temperature sensors 240) and adjust the electrical energy output to the first thermoelectric module 2c, the second thermoelectric module 4c, or both.Electrical energy output from the processor 280 to the first thermoelectric module 2c and / or the second thermoelectric module 4c may manage the thermal envelope, or heat transfer to and from the enclosure, by managing the thermal energy within the phase change material 8. Some embodiments, whether a thermostat or a processor, manage the thermal energy of the phase change material 8 to achieve a desired temperature, thermal comfort temperature, or set point temperature in the space 16.

[0051] As shown in FIG. 2, one embodiment for managing thermal energy includes a plurality of first thermoelectric modules 2a, 2b, 2c, 2d, 2e, 2f, 2g, 2h, 2i and a plurality of second thermoelectric modules 4a, 4b, 4c, 4d, 4e, 4f, 4g, 4h, 4i that function to manage thermal energy. The schematic diagram of FIG. 2 does not include phase change material to better illustrate the plurality of second thermoelectric modules 4a, 4b, 4c, 4d, 4e, 4f, 4g, 4h, 4i. The plurality of first thermoelectric modules 2a, 2b, 2c, 2d, 2e, 2f, 2g, 2h, 2i define a front-end array 5, and the plurality of second thermoelectric modules 4a, 4b, 4c, 4d, 4e, 4f, 4g, 4h, 4i define a back-end array 6. Although nine modules are shown for each array, one skilled in the art will understand that any number of modules is contemplated herein. For example, 1 module, 1 module to 10 modules, 1 module to 100 modules, 1 module to 1,000 modules, etc. Additionally, although one array is shown for the front-end array and one array is shown for the back-end array, any number of arrays may be constructed from any number of modules.

[0052] FIG. 2 illustrates a plane 3 that divides the front-end array 5 and the back-end array 6. The locations of the thermoelectric modules 2a, 2b, 2c, 2d, 2e, 2f, 2g, 2h, 2i of the front-end array 5 relative to the plane 3 may be a mirror image of the thermoelectric modules 4a, 4b, 4c, 4d, 4e, 4f, 4g, 4h, 4i of the back-end array 6. The thermoelectric modules of the front-end array 5 may match and be matched in quantity to the thermoelectric modules of the back-end array 6 that are mirror images in location relative to the plane 3. Alternatively, the thermoelectric modules 2a, 2b, 2c, 2d, 2e, 2f, 2g, 2h, 2i of the front-end array 5 may be offset from the thermoelectric modules 4a, 4b, 4c, 4d, 4e, 4f, 4g, 4h, 4i of the back-end array 6 relative to the plane 3. Additionally, the quantity of thermoelectric modules of the front-end array 5 may not match the quantity of thermoelectric modules of the back-end array 6. The spacing 7, 13 between the thermoelectric modules may vary between embodiments and applications. The spacing 7, 13 will depend primarily on the relative size and performance of the thermoelectric modules used, the volume of the enclosure under consideration, the thickness of the PCM material used, the ambient conditions of the enclosure, and the overall heat transfer performance of the embodiment. For example, if modular thermoelectric modules having a width 27 of about 4 cm and a length 15 of about 4 cm are used in the front-end array 5 and the back-end array 6, the first spacing 7 between the thermoelectric modules may be about 0 cm to about 400 cm, about 1 cm to about 100 cm, about 2 cm to about 50 cm, about 3 cm to about 20 cm, etc. Additionally, if modular thermoelectric modules having a width 27 of about 4 cm and a length 15 of about 4 cm are used in the front-end array 5 and the back-end array 6, the second spacing 13 between the thermoelectric modules may be about 0 cm to about 400 cm, about 1 cm to about 100 cm, about 2 cm to about 50 cm, about 3 cm to about 20 cm, etc. With respect to a plane dividing the front-end array 5 and the back-end array 6 , the thermoelectric modules of the front-end array 5 may be offset from the thermoelectric modules of the back-end array 6 along the vertical axis 31 by less than or equal to one-half the first spacing 7 .With respect to the plane 3 dividing the front-end array 5 and the back-end array 6, the thermoelectric modules of the front-end array 5 may be offset from the thermoelectric modules of the back-end array 6 along the horizontal axis 33 by less than or equal to one-half the second spacing 13. Additionally, some embodiments of the present invention may include a front-end array 5 comprising a single thermoelectric module and a back-end array 6 comprising a single thermoelectric module.

[0053] 3A illustrates an embodiment of a front-end array 5 of the present invention. The front-end array 5 includes thermoelectric modules 2a, 2b, 2c, 2d, 2e, 2f, 2g, 2h, 2i for managing thermal energy. The thermoelectric modules 2a, 2b, 2c, 2d, 2e, 2f, 2g, 2h, 2i are wired together in series (i.e., the positive side of one thermoelectric module is wired to the negative side of another thermoelectric module). Although the thermoelectric modules 2a, 2b, 2c, 2d, 2e, 2f, 2g, 2h, 2i of the front-end array 5 have been described, the thermoelectric modules 4a, 4b, 4c, 4d, 4e, 4f, 4g, 4h, 4i of the back-end array 6 (shown in FIGS. 2, 4, 5, and 6) may be wired in series as well.

[0054] 3B illustrates an embodiment of a front-end array 5 of the present invention. The front-end array 5 includes thermoelectric modules 2a, 2b, 2c, 2d, 2e, 2f, 2g, 2h, 2i for thermal energy management. The thermoelectric modules 2a, 2b, 2c, 2d, 2e, 2f, 2g, 2h, 2i are wired together in parallel (i.e., the positive poles of the thermoelectric modules are wired together and the negative poles of the thermoelectric modules are wired together). Although the thermoelectric modules 2a, 2b, 2c, 2d, 2e, 2f, 2g, 2h, 2i of the front-end array 5 have been described, the thermoelectric modules 4a, 4b, 4c, 4d, 4e, 4f, 4g, 4h, 4i of the back-end array 6 (shown in FIGS. 2, 4, 5, and 6) can be wired in this same manner as well.

[0055] FIG. 3A illustrates a front-end array 5 wired in series, and FIG. 3B illustrates a front-end array 5 wired in parallel. It is further contemplated that the thermoelectric modules of the front-end array 5 and back-end array 6 may be wired in series and parallel, although both the front-end array 5 and back-end array 6 (shown in FIGS. 2, 4, and 5) may be wired in either parallel or series. Activation of the series and parallel wiring grids may be independent. In other words, electrical communication of the series or parallel grids may be performed for the desired effect to or from the thermoelectric modules wired in each grid. Redundant and / or alternative wiring for the thermoelectric modules of the front-end array 5 and back-end array 6 may eliminate the primary malfunction of the embodiment in the event of a thermoelectric module failing or being damaged. For example, if an array of thermoelectric modules or a subset of the thermoelectric modules of the array are wired together only in series, a damaged or failed thermoelectric module would disable all the thermoelectric modules of the array or subset. In other words, a failed or damaged thermoelectric module in an array or subset wired only in series will interrupt the flow of electrical current to all of the thermoelectric modules by breaking the continuity of the electrical circuit.

[0056] FIG. 4 illustrates one embodiment of a system for managing thermal energy. The embodiment includes a front-end array 5, a back-end array 6, and a phase change material 8, which may be in sheet form as shown. The front-end array 5 includes thermoelectric modules 2a, 2b, 2c, 2d, 2e, 2f, 2g, 2h, 2i, which may be wired together in series, parallel, both in series and parallel, or wired independently. The thermoelectric modules 2a, 2b, 2c, 2d, 2e, 2f, 2g, 2h, 2i are thermally coupled to a first surface 9 (which may be an inner surface) of the phase change material 8. The back-end array 6 includes thermoelectric modules 4a, 4b, 4c, 4d, 4e, 4f, 4g, 4h, 4i, which may be arranged together in series, parallel, both in series and parallel, or wired independently (thermoelectric modules 4d, 4e, 4g, 4h are not shown). Thermoelectric modules 4a, 4b, 4c, 4d, 4e, 4f, 4g, 4h, 4i are thermally coupled to a second surface 11 (which may be an outer surface) of the phase change material 8. As described, the thermoelectric modules of the front-end array 5 can heat, cool, and / or harvest thermal energy from the phase change material 8 from an interface at the first surface 9 (or at least a portion of the phase change material 8 proximate to each thermoelectric module). The thermoelectric modules of the back-end array 6 can heat and / or cool the phase change material 8 from an interface at the second surface 11 (or at least a portion of the phase change material 8 proximate to each thermoelectric module). A possible embodiment includes a controller that activates all or at least a subset of the thermoelectric modules of the front-end array 5 with the same current polarity. Activating all or at least a subset of the thermoelectric modules of the front-end array 5 with the same current polarity aligns the cold and hot surfaces. For example, all or at least a subset of the thermoelectric modules in the front-end array 5 may transfer thermal energy to the phase change material 8, or all or at least a subset of the thermoelectric modules in the back-end array 6 may transfer thermal energy from the phase change material 8. Contemplated embodiments that include a controller that activates all or at least a subset of the thermoelectric modules in the front-end array 5 with the same current polarity may perform this function in the back-end array 6.For example, all or at least a subset of the thermoelectric modules in the front-end array 5 may transfer thermal energy to the phase change material 8, or all or at least a subset of the thermoelectric modules in the back-end array 6 may transfer thermal energy from the phase change material 8. Some embodiments may circulate thermal energy back and forth in at least a portion of the phase change material 8. Circulating thermal energy from one or more thermoelectric modules in the front-end array 5 to one or more corresponding thermoelectric modules in the back-end array 6, and also in the phase change material 8 in one or more thermoelectric modules in the front-end array 5, may prevent heat loss to the environment while improving the heating and cooling performance of the thermoelectric modules.

[0057] 5 illustrates an embodiment for managing thermal energy including temperature sensors 10a, 10b, 10c, 10d, 10e, a front-end array 5, a back-end array 6, and a phase change material 8. The temperature sensors 10a, 10b, 10c, 10d, 10e may be coupled to the thermoelectric modules 2a, 2c, 2e, 2g, 2i, respectively. The temperature sensors 10a, 10b, 10c, 10d, 10e may be thermally coupled to the thermoelectric modules 2a, 2c, 2e, 2g, 2i and may measure the temperatures of the thermoelectric modules 2a, 2c, 2e, 2g, 2i. These measured temperatures of the thermoelectric modules 2a, 2c, 2e, 2g, 2i may be received by one or more processors and used as feedback for controlling the electrical energy to the front-end array 5. Alternatively or additionally, the temperature sensors 10a, 10b, 10c, 10d, 10e may measure the air temperature proximate to each temperature sensor 10a, 10b, 10c, 10d, 10e. The temperature sensors 10a, 10b, 10c, 10d, 10e may include the capability to read both the thermoelectric module temperature and the air temperature. The temperature sensors may be disposed in one or more thermoelectric modules of the back-end array 6 and may perform similar functions as the temperature sensors 10a, 10b, 10c, 10d, 10e. An exemplary, non-limiting embodiment of a temperature sensor 12c coupled to a thermoelectric module 4f of the back-end array is shown in FIG. 6.

[0058] As shown in FIG. 6, embodiments including a front-end array 5 and a back-end array 6 may function to measure the temperature of a space 16. These embodiments include an enclosure defining the space 16, at least a portion of which is constructed of a phase change material 8 with a corresponding front-end array 5 and a corresponding back-end array 6. Thus, thermal energy may be removed from the phase change material 8 by the thermoelectric modules of the front-end array 5 and / or the back-end array 6. The process of removing thermal energy from a properly selected phase change material 8 (e.g., one with a suitable solid-liquid transition temperature for the intended purpose) may maintain a set temperature of the space 16 lower relative to the temperature of the environment 18. Additionally, by transferring thermal energy from the front-end array 5 and the back-end array 6 to a properly selected phase change material 8 (e.g., one with a suitable solid-liquid transition temperature), a set temperature of the space 16 higher than the temperature of the environment 18 may be maintained. Temperature measurements from the temperature sensors 10a, 10b, 10c, 10d, 10e (e.g., as shown in FIG. 5) may be transmitted to and / or received by one or more processors. The temperature measurements of the temperature sensors 10a, 10b, 10c, 10d, 10e may indicate the temperature of the respective thermoelectric module 2a, 2c, 2e, 2g, 2i. When the temperature measurements are received by the one or more processors, the one or more processors output a signal to adjust the temperature of the respective thermoelectric module, so that the temperature measurements can be used as feedback for control by the one or more processors. Additionally, the temperature sensors 10a, 10b, 10c, 10d, 10e may be used to measure the air temperature of the space 16 proximate to each temperature sensor 10a, 10b, 10c, 10d, 10e. When the air temperature measurements proximate to each temperature sensor 10a, 10b, 10c, 10d, 10e are received by the one or more processors, the one or more processors output a signal to adjust the temperature of the respective thermoelectric module, so that the temperature measurements can be used as feedback for control by the one or more processors.A temperature sensor, such as temperature sensor 12c, may be coupled to one or more thermoelectric modules of the back-end array 6 and may perform the same functions as described for temperature sensors 10a, 10b, 10c, 10d, 10e (i.e., measuring the temperature of one or more thermoelectric modules of the back-end array 6 or measuring the air temperature of the environment 18 proximate to the temperature sensor). Additionally, the temperature sensor may be thermally coupled to or at least partially recessed into the interior 17 side of the phase change material 8, the exterior 19 side of the phase change material 8, or both. The temperature sensor thermally coupled to the phase change material 8 may be used to measure the temperature of the phase change material 8, which may be used as control feedback when received by one or more processors. The measured temperature of the phase change material 8 received by one or more processors may cause the one or more processors to output a signal to regulate the electrical energy to the respective thermoelectric module.

[0059] Large scale embodiments of the embodiments shown in Figures 4, 5, and 6 have been discussed. Examples of large scale embodiments may include embodiments that at least partially form an enclosure such as a building, aircraft, vehicle, etc. For example, embodiments that include a large number of thermoelectric modules in both the front-end array 5 and / or back-end array 6 and are coupled to a vast sheet of phase change material 8. The amount of thermoelectric modules in the front-end array and back-end array 6 may range from about 1 to about 10, about 10 to about 100, about 100 to about 1000, about 1000 to about 10,000, about 10,000 to about 100,000, etc. Additionally, embodiments that include a large number of thermoelectric modules may include a large number of temperature sensors coupled to the front-end array 5, as described with respect to Figure 5 for temperature sensors 10a, 10b, 10c, 10d, 10e. As shown in FIG. 5, temperature sensors 10a, 10b, 10c, 10d, 10e are coupled to approximately 55% of the thermoelectric modules of the front-end array 5 in a uniformly distributed pattern. Alternatively or additionally, embodiments including temperature sensors coupled to the thermoelectric modules of the front-end array 5 may include temperature sensors coupled to the thermoelectric modules of the back-end array 6 in the same manner as described for the front-end array 5 of FIG. 5. The temperature sensors may be coupled to the thermoelectric modules in a uniformly distributed pattern or a non-uniformly distributed pattern. Some possible embodiments may include a ratio of temperature sensors to thermoelectric modules in the range of about 0% to about 10%, about 10% to about 20%, about 20% to about 30%, about 30% to about 40%, about 40% to about 50%, about 50% to about 60%, about 60% to about 70%, about 70% to about 80%, about 80% to about 90%, or about 90% to about 100%. Larger scale embodiments may include front-end arrays 5 and back-end arrays 6 with each thermoelectric module individually wired, or with subsets arranged in series, parallel, or both, or with the entirety arranged in series, parallel, or both. When each thermoelectric module of the front-end array 5 and / or back-end array 6 is wired individually or in subsets, independent control of thermal energy within portions of phase change material 8 may be implemented by one or more processors.For example, at any one time, thermal energy may be added to a first portion of the phase change material 8, thermal energy may be transferred from a second portion of the phase change material 8, thermal energy may be obtained from a third portion of the phase change material, and / or thermal energy may be added to or transferred from a fourth portion of the phase change material 8 through the use of individually wired thermoelectric modules or wired subsets of thermoelectric modules in the front-end array 5 and / or back-end array 6.

[0060] An example of a larger scale embodiment of the embodiment shown in Figures 4, 5, and 6 may include an enclosure in which at least a portion of the barrier defining the enclosure is fabricated from phase change material 8. Additionally, the phase change material 8 may include a corresponding front-end array 5 and a corresponding back-end array 6. The enclosure may insulate the interior space 16 from an external environment 18 (e.g., as shown in Figure 6). The front-end array 5 and the back-end array 6 may include the ability to maintain the temperature of the space 16 above or below the temperature of the environment 18 by collectively adding or removing thermal energy from the phase change material 8. Alternatively, an embodiment with thermoelectric modules of the front-end array 5 and the back-end array 6 wired individually or in subsets may include the ability to transfer thermal energy from a first portion of the phase change material 8 to a second portion of the phase change material 8 with less thermal energy. Additionally, embodiments with thermoelectric modules of the front-end array 5 and back-end array 6 wired individually or in subsets may include the ability to transfer electrical energy from an external circuit to the thermoelectric modules or a subset of the thermoelectric modules to convert the electrical energy to thermal energy transferred to a portion of the phase change material 8. For example, the processor may receive an air temperature measurement for a portion of the space 16 proximate a temperature sensor of the front-end array 5 that is lower than a set temperature of the space 16. The processor may transfer electrical energy obtained from thermal energy from a first portion of the phase change material or drawn from an external circuit to the thermoelectric modules of the front-end array 5 and / or back-end array 6 proximate a second portion of the phase change material 8. Additionally, the processor may transfer electrical energy from an external circuit to the thermoelectric modules of the front-end array 5 and / or back-end array 6 proximate the second portion of the phase change material 8. When the thermoelectric modules of the front-end array 5 and back-end array 6 proximate the second portion of the phase change material 8 receive electrical energy, the thermoelectric modules transfer thermal energy to the second portion of the phase change material.

[0061] As described above, at least a portion of the enclosure may be constructed with phase change material 8 and corresponding front-end arrays 5 and back-end arrays 6, but in some applications it may be preferable to enclose the interior space 16 of the enclosure with a large scale implementation of the embodiments described herein. For example, an embodiment may be disposed within the interior 16 of the enclosure wall. Examples of enclosures in which the large scale embodiments may be used include containers (e.g., shipping containers), vehicles, watercraft, aircraft fuselages, commercial and residential buildings, or any other enclosure where it is desirable to control the interior temperature and / or where it is desirable to capture and / or store thermal energy. These large scale embodiments work particularly well with enclosures that employ conventional HVAC systems for control of the interior temperature.

[0062] Currently, there are many applications for conventional HVAC systems, including buildings (both commercial and residential), vehicles, ships, aircraft fuselages, and other locations where a temperature or temperature specification is maintained at a level that is comfortable for humans. Conventional HVAC systems have several shortcomings that are addressed when combined with the large-scale embodiments of the various embodiments described herein. These shortcomings can include a significant amount of heat energy lost at the walls or sides of the enclosure as listed, static insulation failures, non-uniform thermal envelopes, and for enclosures that include sub-enclosures (e.g., rooms within a building), a lack of independent air temperature control within the sub-enclosures. The various embodiments described herein can address at least some of all of these shortcomings. For example, referring to Figures 5 and 6, when any of the systems described herein are constructed or installed as the most interior portion of the walls, floors, windows, and / or roof of the enclosure with conventional HVAC, the systems described herein (e.g., any of the systems shown and / or described in Figures 1-6) can be used for individualized heating and / or cooling in the rooms of the enclosure, for waste heat energy capture, for transactive load control, for monitoring the thermal envelope (and / or humidity temperature performance) and structural performance of the building envelope, and for providing dynamic insulation performance to the enclosure. When thermal energy is provided to the air inside the enclosure (e.g., space 16 in Figure 6), a portion of it is absorbed by the system (e.g., any of the systems shown and / or described in Figures 1-6) forming the most interior wall portion. For example, as shown in Figure 6, with a properly selected phase change material 8 (i.e., a phase change material 8 with a solid-liquid transition temperature near the set or target temperature of space 16), the phase change material 8 absorbs a large amount of thermal energy with a relatively small amount of temperature gain. This unique property slows the loss of thermal energy by introducing a small thermal differential between the exterior 19 of the phase change material 8 and the adjacent air, which in this example is influenced by a cold environment 18, allowing a relatively large amount of thermal energy to be captured from the phase change material 8 (by the thermoelectric module) without dramatically affecting the temperature of the phase change material 8.A system (eg, any of the systems shown and / or described in FIGS. 1-6) can harvest thermal energy from the phase change material 8 without dramatically matching the temperature of the phase change material 8 with the air temperature of the space 16.

[0063] Although individualized heating and cooling in individual rooms can be achieved in an enclosure with or without a conventional HVAC system for controlling the air within the enclosure, performance improvements can be added when combined with an HVAC system. With reference to FIG. 6 and space 16 as the interior of the enclosure, a conventional HVAC system heats the air by pumping warm air into space 16 (shown in FIG. 6) to raise or maintain the air temperature in space 16. A conventional HVAC system cools the air by drawing air from space 16 to remove thermal energy and pumps the now cool air back into space 16 to lower or maintain the air temperature in space 16. In many scenarios, the enclosure utilizes one HVAC system controlled by a central thermostat. Therefore, the HVAC system maintains the air temperature proximate to the thermostat, and the resulting temperature in the secondary rooms can vary considerably based on the enclosure design and the insulating envelope. When the described enclosure is implemented in a large-scale embodiment of the present invention, a much more uniform heating and cooling profile can be achieved throughout the enclosure. For example, if the secondary compartment is consistently hotter in the summer and cooler in the winter compared to the compartment in which the thermostat is located, the large-scale system may transfer electrical energy to the thermoelectric modules in the front end 5 and back end 6 of the secondary compartment in the winter or capture thermal energy from the phase change material 8 in the secondary compartment in the summer. The electrical energy sent to the thermoelectric modules in the summer may be captured from the phase change material 8 in an area of ​​the enclosure other than the secondary compartment, for example the primary compartment with the thermostat therein. If transferring thermal energy from the phase change material 8 in the primary compartment reduces the air temperature due to a reduction in the temperature 8 of the phase change material adjacent to the air in the primary compartment, the thermostat will detect this and the HVAC system will adjust for this imbalance. Conversely, the secondary compartment will be hotter than the primary compartment in the summer. The secondary compartment may be cooled by transferring thermal energy from the phase change material in the secondary compartment. The captured thermal energy can then be used to perform heat transfer to portions of the phase change material 8 other than the portion within the secondary chamber, or can be transferred to an electrical energy storage device, such as a battery, for later use, or bought back to the electrical grid.Heating and cooling of secondary compartments can be done for multiple secondary compartments. Heating and cooling described for one or more secondary compartments can be used to moderate the temperature throughout the enclosure according to a reference calibration set point or can be used for independent air temperature control for each secondary compartment.

[0064] Any of the large scale embodiments described above (e.g., where module 230 is a large scale array) may be communicatively coupled to and controlled by one or more processors 280. The one or more processors 280 may be communicatively coupled to temperature sensors 240 in the front end array 5, back end array 6, coupled to the phase change material, or a combination thereof. Additionally, the one or more processors 280 may be communicatively coupled to one or more devices (e.g., input devices, computing devices, remotes, fobs, etc., not shown) for selecting a desired temperature for each of the one or more secondary chambers. Based on the measured possible temperatures and possibly a temperature input setting, the one or more processors may achieve a set air temperature by transfer of thermal energy while preventing heat loss to the enclosure envelope.

[0065] Conventional HVAC operating in an enclosure with static insulation operates at its maximum capacity based on the design of the enclosure and the insulating envelope implemented during the construction of the enclosure. Therefore, during heating operation, the enclosure envelope may have areas of rapid heat transfer relative to areas of slow heat transfer. Imbalances in the enclosure envelope may result in insufficient and uneven heating within the enclosure. Any of the embodiments described herein, such as the large-scale embodiment, may at least partially alleviate this problem by capturing thermal energy from portions of phase change material 8 (as shown in FIG. 6) adjacent to areas of slow heat transfer in the enclosure envelope (where thermal energy is most likely to accumulate) and transferring this thermal energy to portions of phase change material 8 adjacent to areas of rapid heat transfer in the enclosure envelope. By transferring thermal energy to phase change material 8 adjacent to areas of rapid heat transfer, the thermal inertia of phase change material 8 increases near areas of rapid heat transfer, slowing down the rate of heat transfer in these areas. The resulting thermal envelope of the enclosure will be more uniform when viewed from a thermal perspective from the exterior of the enclosure. Control of the transfer of thermal energy between areas of slow heat transfer and areas of fast heat transfer can be accomplished with one or more processors coupled in communication with temperature sensors described for the front end array 5, back end array 6, or combinations thereof coupled to the phase change material. For example, multiple temperature sensors thermally coupled to the phase change material 8 can measure the temperature of the phase change material 8 to determine areas of thermal energy accumulation and areas of thermal energy deficiency. Based on these temperature measurements, the one or more processors can direct the transfer of thermal energy in an efficient manner.

[0066] Further contemplated embodiments may not include a temperature sensor intended to measure the temperature of the phase change material 8 to indicate thermal energy accumulation or thermal energy deficiency. Alternative embodiments may include data-driven calibration capabilities to eliminate the need for a temperature measurement of the phase change material. Contemplated embodiments may not include a temperature sensor for the phase change material, but may utilize historical data from the enclosure, or data from a simulated thermal model of the enclosure. For example, the simulated thermal model (e.g., finite element analysis) may generate control data for where fast and slow heat transfer may occur in the enclosure envelope, and one or more processors may then utilize this data to control which parts of the phase change material 8 from which thermal energy is gained, and to which parts of the phase change material 8 the thermal energy should be transferred. Although heating of the enclosure has been described, the reverse may be achieved in the summer as well (all seasonal variations are considered). In the example enclosure, the same heat transfer rate may occur in the problem area in the summer, but the problem area may gain thermal energy too quickly, unlike the area where the loss of thermal energy is too rapid. Portions of phase change material 8 adjacent to these areas may then have thermal energy captured therefrom by one or more thermoelectric modules. The thermal energy captured from phase change material 8 adjacent to these problem areas may be transferred to thermoelectric modules in other areas of phase change material 8 that have less thermal energy, or to one or more electrical energy storage devices.

[0067] Although illustrated with an enclosure utilizing an HVAC system, the advantages of the larger scale embodiments may be used in vehicles, watercraft, aircraft, spacecraft, or any other enclosure where control of the interior temperature and / or capture and / or storage of thermal energy is desired. Additionally, embodiments are contemplated in which the front-end and back-end arrays of thermoelectric modules and the phase change material are the outermost layers on the interior of the enclosure.

[0068] FIG. 7 illustrates an embodiment of a system 150 for managing thermal energy. The system includes a heating, ventilation, and air conditioning system A 108 (HVAC A), a heating and cooling system 102 (HC B), and an indoor temperature air input 106. HVAC A 108 can be a conventional HVAC system. HC B 102 can be any embodiment described herein (e.g., any of FIGS. 1-6) that includes a phase change material, a front-end array of thermoelectric modules, and / or a back-end array of thermoelectric modules. As shown and described above, the thermoelectric modules of the front-end array and the back-end array can be thermally coupled to a phase change material 110. The HC B 102 system coupled with the phase change material 110 can be responsible for thermal management of the enclosure envelope 104 as described herein. The wall temperature measured or predicted by the HC B 102 system can at least partially indicate which wall portion the HC B 102 system will obtain thermal energy from or transfer thermal energy to. The HVAC A 108 system cooperates with the HC B 102 system to form a heating and cooling subsystem 100 for the enclosure. The system 150 may function to collectively or independently measure, regulate, manage, and maintain the temperature of one or more spaces, rooms (i.e., compartments), etc., of the enclosure. A setpoint temperature may be input at the indoor air temperature input 106. The processor may receive one or more air temperatures in the primary room and one or more wall temperatures in the primary room and output corresponding control signals to the HVAC A 108 and HC B 102 systems to regulate the air temperature in the primary room to the setpoint temperature or within a threshold range of the setpoint temperature. The HVAC A 108 may adjust the air temperature based on the desired air temperature set at the indoor air temperature input 106. The HC B 102 may manage the thermal energy in the phase change material 110 based on one or more setpoint temperatures, one or more wall temperatures, and one or more air temperatures. In some embodiments, the thermal energy of the portion of the phase change material 110 in the secondary chamber (the primary chamber is where the thermostat of the HVAC A 108 system is located) is managed to moderate temperature standards or provide independent temperature control to the secondary chamber (i.e., compartment or space).The phase change material 110 can also be used as a thermal reservoir or battery for temperature energy, and can be used to store thermal energy converted from electrical energy from an external circuit. For example, when a solar array or a wind turbine is electrically connected to the HCB 102 system, electrical energy can be transferred to a thermoelectric module, converted to thermal energy, and transferred to the phase change material 110 by a front-end array and a back-end array. One or more processors can control where the temperature energy is stored based on wall temperature measurements, the temperature of the phase change material 110, or the envelope temperature.

[0069] FIG. 8 illustrates an embodiment of a system 160 for managing thermal energy. The system includes a processor 22, an HVAC A 24 system, an HC B 26 system, one or more indoor temperatures 28, and one or more wall temperatures 30. The HC B 102 can be any embodiment described herein (e.g., any of FIGS. 1-7) including phase change materials, a front-end array of thermoelectric modules, and / or a back-end array of thermoelectric modules. The processor 22 can be capable of receiving multiple inputs and generating multiple outputs. Alternatively, the processor 22 can have a data-driven calibration capability in which the wall temperatures are predicted rather than measured. The system 160 functions to regulate or maintain a temperature 28 in one or more rooms or spaces or enclosures that are configured with a human-machine interface communicatively coupled to the processor 22. The processor 22, which can be a network of processors, regulates the outputs of the HVAC A 24 system and the HC B 26 system to regulate or maintain the primary indoor temperature 28. For example, thermal energy may be transferred to or from a phase change material in a primary room while the HVAC A 24 system inputs hot or cold air into the primary room. The air temperature in the primary room may be measured by one or more temperature sensors and provided or sent to the processor 22 as feedback. One or more wall temperatures in the primary room may be measured by one or more temperature sensors or may be predicted with data-driven calibration and provided or sent to the processor 22 as feedback. Some embodiments include personalized heating and cooling in one or more secondary rooms (the primary room is where the HVAC A 24 and the HVAC B 26 work together to regulate or maintain the air temperature). In embodiments including personalized heating and cooling in one or more secondary rooms, the air temperature and wall temperature of one or more secondary rooms may be measured by temperature sensors or may be predicted with data-driven calibration and received by the processor 22. If the set or desired air temperature in the secondary chamber is lower than the actual air temperature, the HCB 26 system transfers thermal energy from the phase change material in the walls of the secondary chamber and the adjusted secondary chamber air temperature is received by the processor 22 as feedback.If the desired air temperature in the secondary compartment is higher than the actual air temperature, thermal energy is transferred by the HCB 26 system to the phase change material in the wall of the secondary compartment, and the adjusted secondary compartment air temperature is received as feedback by the processor 22. The HCB 26 system may manage thermal energy in at least a portion of the phase change material based on one or more setpoint temperatures, one or more air temperatures, and / or one or more wall temperatures. The HCB 102 system may manage thermal energy in at least a portion of the phase change material for heating and cooling the enclosure, and for envelope temperature management of the enclosure.

[0070] A coefficient of performance, as known in the art, is the ratio of the amount of useful heating or cooling provided by a system (e.g., HVAC A 24 or HC B 102) to the work (e.g., watts) required to operate the system. The HC B 102 system described in Figures 7 and 8 can perform on-demand heating and cooling with a coefficient of performance (COP) higher than that of the HVAC A 24. Furthermore, the HC B 102 system can perform on-demand heating and cooling over the full range of COPs known in the art. Additionally, the HC B 102 system can perform on-demand heating and cooling over a temperature differential range where the COP of the HC B 102 system is higher than that of the HVAC A 24 system. Furthermore, the HC B 102 system can perform on-demand heating and cooling over a temperature differential range where the full range of COPs is possible, regardless of the COP of the HVAC A 24 system.

[0071] The embodiments described herein involving independently wired or independently coupled thermoelectric modules or subsets of thermoelectric modules may include the ability to deliver heating and / or cooling patterns to different portions of a phase change material or environment, such that different waveforms and / or heating and cooling profiles can be introduced to portions of a phase change material or environment.

[0072] The embodiments described herein may include a microfluidic system or a heat exchange tube system or flow path within or near the phase change material, which may further facilitate heat transfer within portions of the phase change material by directing liquid through portions of the phase change material with higher thermal energy levels and to portions of the phase change material with lower thermal energy levels.

[0073] The embodiments described herein may include a microfluidic system or a heat exchange tube system or flow path in place of the phase change material, which may therefore facilitate heat transfer from the thermoelectric modules described herein for thermal energy to be transferred and stored by the phase change material.

[0074] Any of the embodiments shown and / or described above, for example with respect to Figures 1-8, may be referred to herein as a heating and cooling system, an envelope temperature control system, or an HC system, as illustrated below in conjunction with the following methods (e.g., the method of Figures 9-10).

[0075] method As shown in FIG. 9, a method 170 for managing thermal energy is shown. The method 170 may be a computer-implemented method. For example, the method 170 may be performed by one or more processors. The method 170 includes receiving an air temperature from a first enclosure in block S40, receiving a wall temperature from the first enclosure in block S42, and receiving a setpoint temperature for the first enclosure in block S44. In a first process beginning in block S46, the method 170 includes doing nothing (e.g., not outputting a control signal) or outputting a stop signal to stop an active heating, ventilation, and air conditioning (HVAC) system or an active heating and cooling (HC) system when the air temperature and the setpoint temperature are approximately equal in block S50, and returning to the start of the method 170 in block S56. In a second process beginning at block S48, method 170 includes outputting an activation signal to activate HVAC A at block S52 and / or outputting an activation signal to activate HC B when the air temperature and the set temperature are not approximately equal, and returning to the beginning of method 170 at block S56. Method 170 functions to manage the temperature of an enclosure by operating a first HVAC system, which may be a conventional HVAC system, and a second HC (heating and cooling) system, which may be an embodiment of the present invention. The method is used to heat and cool an enclosure, but may additionally or alternatively be used for any suitable application, such as those described elsewhere herein. Method 170 may be configured and / or adapted to function for any suitable device or system designed for or that would benefit from temperature regulation and / or thermal energy management.

[0076] 9, one embodiment of a method 170 for managing thermal energy includes block S40, which depicts receiving an air temperature from a first enclosure. Block S40 is a step in which the system receives the air temperature from the first enclosure. As described above with respect to FIG. 7, the one or more processors may receive a temperature measurement from a temperature sensor that measures the air temperature of the first enclosure.

[0077] As shown in Figure 9, one embodiment of a method 170 for managing thermal energy includes block S42, which is marked with receiving a wall temperature from a first enclosure. Block S42 is a step in which the system receives a wall temperature for the primary enclosure. As described above with respect to Figure 7, the wall temperature measured by the temperature sensor is received by one or more processors. Alternatively, the one or more processors may obtain the wall temperature from a data-driven calibration.

[0078] As shown in FIG. 9, one embodiment of a method 170 for managing thermal energy includes a block S44 marked with receiving a setpoint air temperature for a first enclosure. Block S44 is a step in which the system receives a desired or set air temperature setpoint for the first enclosure, for example, through the use of a human machine interface or based on model data. As described above with respect to FIG. 7, the setpoint temperature is received at an enclosure air temperature input 106. The enclosure air temperature input 106 may be an analog thermostat or a thermostat with one or more processors. The air temperature input 106 may be configured to receive both a measured air temperature and a setpoint temperature for the first enclosure. Based on the measured air temperature and the setpoint temperature for the first enclosure, the system (e.g., any of the systems described in FIGS. 1-8) may perform one or more processes illustrated in FIG. 9.

[0079] As shown in Figure 9, the first process includes blocks S46 and S50, which state that when the air temperature and the set temperature are approximately equal, the system outputs no control signal or outputs a stop signal to stop the operating HVAC or HC B. When the enclosure temperature is approximately equal to the set temperature, the system shuts down the operating HVAC A or HC B, or does nothing when HVAC A and HC B are not operating. As shown in Figure 7, HVAC A 108 and HC B 102 adjust the air temperature based on the set temperature when the actual air temperature is approximately equal to the set temperature, and HVAC A 108 and HC B 102 may possibly be out of operation.

[0080] As shown in FIG. 9, the second process includes blocks S48 and S54, which state that when the air temperature and the set temperature are not approximately equal, output an activation signal to activate HVAC A and / or output an activation signal to activate HC B. As shown in FIG. 7, HVAC A 108 may adjust the air temperature based on the set temperature, and HC B 102 may manage the thermal energy in the phase change material based on the set air temperature. When HVAC A 108 adjusts the air temperature and HC B 102 manages the thermal energy in the phase change material (ultimately adjusting the wall temperature), the air temperature in the enclosure may ultimately be adjusted to the set temperature or within a threshold range of the set temperature. In block S56, the first process and / or the second process returns to block S40 of the method 170 to adjust and / or maintain the air temperature at the set temperature.

[0081] The method 170 of FIG. 9 may use one or more identifiers. For example, one or more identifiers generated by one or more processors may index wall portions within an enclosure or an enclosure of multiple enclosures (e.g., an apartment building). Additionally, one or more identifiers may be used to index each thermoelectric module. Using these identifiers and the resulting index, the HCB 102 system may identify which portion of a particular wall requires temperature regulation. Additionally, these identifiers may be used to identify which thermoelectric module should be operated to regulate the temperature of the wall. In some embodiments, the operation of the HCB 102 and / or HVAC A 108 is controlled by two transactive coefficients that represent the relative importance of a particular component of the HVAC A 108 or HVAC B 102 system in heating or cooling or temperature management of the enclosure envelope.

[0082] As shown in FIG. 10, a method 180 for managing thermal energy is shown. The method 180 may be a computer-implemented method. For example, the method 180 may be performed by one or more processors. The method 180 includes receiving air temperatures from the primary and secondary enclosures in block S60, receiving wall temperatures from the primary and secondary enclosures in block S62, and receiving air temperature set points for the primary and secondary enclosures. In block S66, a first process is started, which includes receiving a primary enclosure temperature approximately equal to the set air temperature, receiving a secondary enclosure temperature approximately equal to the set air temperature in block S66, and outputting no control signal or outputting a stop signal to stop an operating HVAC A or HC B. Then, the method 180 is repeated in block S80.

[0083] An alternative second process may begin at block S68 with receiving a primary enclosure temperature and a setpoint temperature including a difference between the temperatures and outputting an activation signal to activate HVAC A at block S74 and / or outputting an activation signal to activate the appropriate HVAC B zone at block S76. The alternative second process proceeds to block S60 to repeat at least a portion of method 180.

[0084] An alternative third process may be initiated which includes receiving a secondary enclosure temperature including a difference between the temperatures and a set point temperature in block S70 and outputting an activation signal to activate the HCB in block S78. The alternative third process proceeds to block S60 to repeat at least a portion of method 180.

[0085] The method 180 functions to control the air temperature in one or more secondary enclosures (i.e., compartments) along with the primary enclosure. In some embodiments, the method 180 functions to achieve a more uniform temperature standard in an enclosure, or multiple enclosures in thermal communication. In some embodiments, the method 180 functions to achieve independent temperature control of one or more secondary enclosures (i.e., compartments) relative to the air temperature of the primary enclosure. The method 180 is used for heating and cooling an enclosure, but may additionally or alternatively be used for any suitable application, as described elsewhere herein. The method 180 may be configured and / or adapted to function for any suitable device or system designed for or that would benefit from temperature management and / or thermal energy management.

[0086] As shown in Figure 10, one embodiment of a method 180 for managing thermal energy includes block S60, which depicts receiving air temperatures from a primary enclosure and a secondary enclosure. Block S60 is a step in which the system, via one or more processors, receives air temperatures from the primary enclosure and one or more secondary enclosures. As described above with respect to Figure 8, measured air temperatures are received from the primary enclosure and air temperatures are received from one or more secondary enclosures.

[0087] As shown in FIG. 10, one embodiment of a method 180 for managing thermal energy includes block S62, which depicts receiving wall temperatures from a primary enclosure and a secondary enclosure. Block S62 is a step in which the system receives wall temperatures from the primary enclosure and one or more secondary enclosures via one or more processors. As described above with respect to FIG. 8, a measured wall temperature is received from the primary enclosure and an air temperature is received from one or more secondary enclosures. The wall temperatures of the primary enclosure and the secondary enclosure may be received by one or more processors as measurements from temperature sensors or may be achieved by data-driven calibration.

[0088] As shown in FIG. 10, one embodiment of a method 180 for managing thermal energy includes block S64, which depicts receiving air temperature setpoints for a primary enclosure and a secondary enclosure. Block S62 depicts a step in which the system receives, via one or more processors, setpoint temperatures for the primary enclosure and one or more secondary enclosures. As described above with respect to FIG. 8, the processor 22 receives one or more setpoint temperatures for the primary enclosure (e.g., a central air temperature input) and the secondary enclosure. Some embodiments receive a setpoint temperature that represents a reference temperature to be achieved in the enclosure or multiple enclosures in thermal communication (e.g., a building). Other possible embodiments receive a setpoint temperature for the primary enclosure and one or more independent setpoint temperatures for each of the one or more secondary enclosures.

[0089] As shown in FIG. 10, the first process begins with block S66, which is described as receiving a primary enclosure temperature approximately equal to an air temperature setpoint and receiving a secondary enclosure temperature approximately equal to an air temperature setpoint. As described with respect to FIG. 8, the processor 22 receives temperature measurements for the primary enclosure and one or more secondary enclosures. If the measured temperatures for the primary enclosure and one or more secondary enclosures approximately match (or are within a tolerance range) the setpoints for the respective enclosures, the system should output no control signal or output a control signal to shut down the HVAC system and HC B. Outputting no control signal or outputting a stop signal to shut down the running HVAC A or HC B is reflected in block S72, which is described as doing nothing or shutting down the HVAC and HC B. The method 180 then repeats at block S80.

[0090] As shown in FIG. 10, the second procedure may be entered at block S68, which describes receiving a primary enclosure temperature and an air temperature set point with a difference. As described with respect to FIG. 8, the processor 22 receives a primary enclosure temperature measurement that differs from the primary enclosure set point air temperature. If the measured primary enclosure temperature and the primary enclosure set point air temperature do not substantially match, the system may output control signals to activate the HVAC A 108 and HC B 102 systems to change the primary enclosure air temperature. As shown in FIG. 10, blocks S74 and S76 reflect this. Block S74 describes activating HVAC A and block S76 describes activating the appropriate HC B zone. The alternative second process proceeds to block S60 and repeats at least a portion of the method 180.

[0091] As shown in FIG. 10, the third procedure may be entered at block S70, which is described as receiving the differential secondary enclosure temperature and the air temperature set point. As described with respect to FIG. 8, the processor 22 receives temperature measurements for one or more secondary enclosures that differ from the set point air temperature of the one or more secondary enclosures. If the measured temperature of the one or more secondary enclosures and the set point air temperature of the one or more secondary enclosures do not substantially match, the system may output a control signal that activates the HCB 102 system to change the air temperature of the one or more secondary enclosures. Some embodiments output a control signal that changes the air temperature of the one or more secondary enclosures to match a reference temperature for that enclosure. Other embodiments may output a control signal that changes the air temperature of the one or more secondary enclosures independent of the HCB 102 system to achieve independent temperature control at the one or more secondary enclosures. Block S78 (shown in FIG. 10) reflects this, and is described as activating the HCB. An alternative third process proceeds to block S60, which repeats at least a portion of the method 180.

[0092] The method 170 of FIG. 10 may use one or more identifiers. For example, one or more identifiers generated by one or more processors may index wall sections within an enclosure or various enclosures of multiple enclosures (e.g., in a multi-chamber complex). Additionally, one or more identifiers may be used to index each thermoelectric module. Additionally, one or more identifiers may be used to index each chamber or area within an enclosure. Using these identifiers and the resulting indexes, the HCB 102 system can identify which chambers or areas require temperature adjustment, which wall sections require temperature adjustment, and which thermoelectric modules should be operated to adjust the temperature of each wall section. Additionally, these identifiers may be used to index each measured and / or data-driven calibration temperature and each set point temperature. In some embodiments, operation with HC B 102 and / or HVAC A 108 is controlled by three or more transactional coefficients that represent the relative importance of particular components of the HVAC A 108 or HC B 102 system in heating or cooling or temperature control of the enclosure envelope.

[0093] The computer-implemented method may include receiving, at one or more processors, predefined parameters for the enclosure. The predefined parameters received by the one or more processors may be determined (e.g., by one or more data-driven calibration processors) from sensor data or a model of the enclosure or a similar enclosure. The computer-implemented method may further include receiving, at one or more processors, a predefined set point temperature input for the enclosure and receiving, at one or more processors, a center air input for the enclosure. The computer-implemented method may include determining whether the center air input is within a tolerance range of the predefined set point temperature input. The computer-implemented method may include determining when the center air temperature input in a particular region is outside a tolerance range of the predefined set point temperature input for the region. The computer-implemented method may include adjusting an air temperature of the enclosure using a temperature adjustment system. Additionally, the computer-implemented method may include determining an extent of the adjustment based on the predefined parameters for the enclosure. The computer-implemented method may include operating a first system to adjust an air temperature within the enclosure and / or a second system to adjust a wall temperature of at least a portion of an interior wall of the enclosure to adjust the air temperature. The second system includes a plurality of first thermoelectric modules coupled to a first surface of the thermal energy storage medium and a plurality of second thermoelectric modules coupled to a second surface of the thermal energy storage medium. The computer-implemented methods may obtain a default set temperature input based on a default comfort specification. Further, the methods may utilize data from a simulated thermal model of the enclosure or similar enclosure, collected sensor data, or enclosure energy usage data to determine default parameters for control. The processor may use data from the default parameters to determine which system (e.g., any of the systems of FIGS. 1-8) to transfer thermal energy to and from the phase change material.

[0094] The methods described herein may include, in embodiments, recognizing a thermal bridge. One or more processors described herein may read instructions from a memory that identify when a thermal bridge occurs. For example, in embodiments, when a nail is inserted, a thermal bridge effect may occur due to the rapid influx of thermal energy in the high thermal conductivity path created by the nail. The one or more processors may recognize this occurrence by receiving a change in temperature measurements near the defect site. Once a thermal bridge is recognized, thermal energy may be selectively transferred to or from the defect site to manage heat flow through the enclosure envelope at the defect site.

[0095] The systems and methods of the preferred embodiment and variations thereof may be embodied and / or implemented at least in part as a machine configured to receive a computer readable medium that stores computer readable instructions. The instructions are executed by a computer executable component preferably integrated with one or more portions of the processor of the system and thermostat, building automation system, server, IoT device, and / or computing device. The computer readable medium may be stored in any suitable computer readable medium, such as RAM, ROM, flash memory, EEPROM, optical device (e.g., CD or DVD), hard drive, floppy drive, or any suitable device. The computer executable component is preferably a general-purpose or application-specific processor, although any suitable dedicated hardware or hardware / firmware combination may alternatively or additionally execute the instructions.

[0096] References in the specification to "one embodiment," "an embodiment," "illustrative embodiment," "some embodiments," and the like indicate that the described embodiment may include a particular feature, structure, or characteristic, but every embodiment may or may not include the particular feature, structure, or characteristic. Moreover, such phrases do not necessarily refer to the same embodiment. Moreover, when a particular feature, structure, or characteristic is described in connection with an embodiment, it is believed to be within the knowledge of one of ordinary skill in the art to apply such feature, structure, or characteristic in connection with other embodiments, whether or not expressly described.

[0097] As used in the description and claims, the singular forms "a," "an," and "the" include both singular and plural references unless the context dictates otherwise. For example, the term "thermocouple" can and is considered to include a plurality of thermocouples. At times, the claims and disclosures may include terms such as "a plurality," "one or more," or "at least one." However, the absence of such terms is not intended and should not be construed to imply that a plurality is not in mind.

[0098] The terms "about" or "approximately," when used before a numerical designation or range (e.g., to define a length), refer to approximations that may vary by (+) or (-) 5%, 1%, or 0.1%. All numerical ranges provided herein are inclusive of the beginning and ending numbers stated. The term "substantially" refers to most (i.e., greater than 50%) or essentially all of a device, material, or composition.

[0099] As used herein, the terms "comprising" or "comprises" are intended to mean that the devices, systems, and methods include the recited elements and may additionally include some other elements. "Consisting essentially of" shall mean that the devices, systems, and methods include the recited elements and exclude other elements that are essential to the combination for the purposes of the recited elements. Thus, a system or method consisting essentially of the elements defined herein will not exclude other materials, features, or steps that do not materially affect the basic novel nature of the claimed disclosure. "Consisting of" shall mean that the devices, systems, and methods include the recited elements and exclude only insignificant or insignificant elements or steps. Embodiments defined by each of these transition terms are within the scope of this disclosure.

[0100] The examples and figures contained herein illustrate, by way of illustration, not limitation, specific embodiments in which the subject matter may be practiced. Structural and logical substitutions and changes may be made without departing from the scope of the present disclosure, since other embodiments may be utilized and derived therefrom. Such embodiments of the subject matter of the present invention may be individually or collectively referred to herein by the term "invention" merely for convenience, and without any intention of arbitrarily limiting the scope of the present application to any single invention or inventive concept when more than one is in effect disclosed. Thus, although specific embodiments have been shown and described herein, any mechanism that is expected to achieve the same purpose may be substituted for the specific embodiment shown. The present disclosure is intended to include any and all modifications or variations of the various embodiments. Combinations of the above embodiments with other embodiments not expressly described herein will be apparent to one of ordinary skill in the art upon reviewing the above description.

[0101] Working Example Example 1 A system for managing thermal energy, the system comprising: a temperature energy storage medium having a first surface opposite a second surface; a first thermocouple disposed on the first surface of the temperature energy storage medium; a first thermal interface material between the first thermocouple and the first surface of the temperature energy storage medium; a second thermocouple disposed on a second surface of the temperature energy storage medium; and a second thermal interface material between the second thermocouple and the second surface of the temperature energy storage medium.

[0102] Example 2. The system of any one of the preceding examples, particularly example 1, wherein the first thermocouple comprises more than one thermocouple such that the first thermocouple is a first thermoelectric module, and the second thermocouple comprises more than one thermocouple such that the second thermocouple is a second thermoelectric module.

[0103] Example 3. The system of any one of the preceding examples, particularly example 1, further comprising one or more temperature sensors coupled to the first surface of the thermal energy storage medium.

[0104] Example 4. The system of any one of the preceding examples, particularly example 1, further comprising one or more temperature sensors coupled to the second surface of the thermal energy storage medium.

[0105] Example 5. The system of any one of the preceding examples, particularly example 1, wherein the first thermoelectric module operates as a Peltier module.

[0106] Example 6. The system of any one of the preceding examples, particularly example 1, wherein the second thermoelectric module operates as a thermoelectric generator.

[0107] Example 7. The system of any one of the preceding examples, particularly example 2, further comprising one or more temperature sensors coupled to the first thermoelectric module.

[0108] Example 8. The system of any one of the preceding examples, particularly example 2, further comprising one or more temperature sensors coupled to the second thermoelectric module.

[0109] Example 9. The system of any one of the preceding examples, particularly example 1, wherein the second thermoelectric module operates as a Peltier module.

[0110] Example 10. The system of any one of the preceding examples, particularly example 1, wherein the thermal energy storage medium comprises a phase change material.

[0111] Example 11 The system of any one of the preceding examples, particularly example 10, wherein the phase change material at least partially comprises a hydrated salt.

[0112] Example 12. The system of any one of the preceding examples, particularly example 1, wherein the system is communicatively coupled to an external electrical circuit.

[0113] Example 13. The system of any one of the preceding examples, particularly example 1, wherein the system is in fluid communication with one or more electrochemical batteries.

[0114] Example 14. A system for managing thermal energy comprising: a temperature energy storage medium having a first surface opposite a second surface; a front-end array comprising a plurality of first thermoelectric modules, the front-end array being disposed on the first surface of the temperature energy storage medium; and a back-end array comprising a plurality of second thermoelectric modules, the back-end array being disposed on the second surface of the temperature energy storage medium.

[0115] Example 15. The system of any one of the preceding examples, particularly example 14, further comprising a first thermal interface material between the front-end array and the first surface of the thermal energy storage medium.

[0116] Example 16. The system of any one of the preceding examples, particularly example 14, further comprising a second thermal interface material between the back-end array and the second surface of the thermal energy storage medium.

[0117] Example 17. The system of any one of the preceding examples, particularly example 14, wherein the plurality of first thermoelectric modules are configured as membranes.

[0118] Example 18. The system of any one of the preceding examples, particularly example 14, wherein the plurality of second thermoelectric modules are configured as membranes.

[0119] Example 19. The system of any one of the preceding examples, particularly example 14, wherein at least a subset of the plurality of first thermoelectric modules are wired in series to form a front-end array.

[0120] Example 20. The system of any one of the preceding examples, particularly example 19, wherein at least a subset of the first plurality of thermoelectric modules is further wired in a series and parallel combination.

[0121] Example 21. The system of any one of the preceding examples, particularly example 14, wherein at least a subset of the plurality of second thermoelectric modules are wired in series to form a back-end array.

[0122] Example 22. The system of any one of the preceding examples, particularly example 21, wherein at least a subset of the plurality of second thermoelectric modules is further wired in a series and parallel combination.

[0123] Example 23. The system of any one of the preceding examples, particularly example 14, wherein at least a subset of the plurality of first thermoelectric modules are wired in parallel to form a front-end array.

[0124] Example 24. The system of any one of the preceding examples, particularly example 14, wherein at least a subset of the plurality of second thermoelectric modules are wired in parallel to form a back-end array.

[0125] Example 25. The system of any one of the preceding examples, particularly example 14, further comprising one or more temperature sensors coupled to the first surface of the thermal energy storage medium.

[0126] Example 26. The system of any one of the preceding examples, particularly example 14, further comprising one or more temperature sensors coupled to the second surface of the thermal energy storage medium.

[0127] Example 27. The system of any one of the preceding examples, particularly example 14, further comprising one or more temperature sensors coupled to the plurality of first thermoelectric modules.

[0128] Example 28. The system of any one of the preceding examples, particularly example 14, further comprising one or more temperature sensors coupled to the plurality of second thermoelectric modules.

[0129] Example 29. The system of any one of the preceding examples, particularly example 14, wherein each of the plurality of first thermoelectric modules operates as a Peltier module.

[0130] Example 30. The system of any one of the preceding examples, particularly example 14, wherein each of the plurality of second thermoelectric modules operates as a Peltier module.

[0131] Example 31. The system of any one of the preceding examples, particularly example 14, wherein each of the plurality of first thermoelectric modules operates as a thermoelectric generator.

[0132] Example 32. The system of any one of the preceding examples, particularly example 14, wherein each of the plurality of second thermoelectric modules operates as a thermoelectric generator.

[0133] Example 33. The system of any one of the preceding examples, particularly example 14, wherein the thermal energy storage medium comprises a phase change material.

[0134] Example 34. The system of any one of the preceding examples, particularly example 33, wherein the phase change material at least partially comprises a hydrated salt.

[0135] Example 35. The system of any one of the preceding examples, particularly example 14, wherein the system is in fluid communication with an external electrical circuit.

[0136] Example 36. The system of any one of the preceding examples, particularly example 14, wherein the system is in electrical communication with one or more electrochemical batteries.

[0137] Example 37 A method of managing thermal energy comprising coupling a front-end array to a first surface of a thermal energy storage medium, the front-end array comprising one or more first thermoelectric modules, coupling a back-end array to a second surface of the thermal energy storage medium, the first surface being opposite the second surface and the back-end array comprising one or more second thermoelectric modules, and adjusting a temperature of at least a portion of the thermal energy storage medium using the front-end array, or the back-end array, or both.

[0138] Example 38. The method of any one of the preceding examples, particularly example 37, further comprising disposing a first thermal interface material between the front-end array and the first surface of the thermal energy storage medium.

[0139] Example 39. The method of any one of the preceding examples, particularly example 37, further comprising disposing a second thermal interface material between the backend array and the second surface of the thermal energy storage medium.

[0140] Example 40. The method of any one of the preceding examples, particularly example 37, further comprising electrically coupling one or more electrochemical batteries to the front-end array and the back-end array.

[0141] Example 41. The method of any one of the preceding examples, particularly example 40, further comprising transmitting the generated electrical energy from either the front-end array or the back-end array or both to one or more electrochemical batteries.

[0142] Example 42. The method of any one of the preceding examples, particularly example 40, further comprising receiving electrical energy from one or more electrochemical batteries by either the front-end array or the back-end array, or both.

[0143] Example 43. The method of any one of the preceding examples, particularly example 37, further comprising electrically coupling the front-end array and the back-end array to an external electrical circuit.

[0144] Example 44. The method of any one of the preceding examples, particularly example 43, further comprising transmitting the generated electrical energy from either the front-end array or the back-end array or both to an external electrical circuit.

[0145] Example 45. The method of any one of the preceding examples, particularly example 43, further comprising receiving electrical energy from an external electrical circuit by either the front-end array or the back-end array, or both.

[0146] Example 46. The method of any one of the preceding examples, particularly example 37, further comprising transferring thermal energy generated from one portion of the thermal energy storage medium to another portion of the thermal energy storage medium.

[0147] Example 47. The method of any one of the preceding examples, particularly example 46, wherein the thermal energy storage medium is configured to act as a reservoir or battery for thermal energy.

[0148] Example 48. The method of any one of the preceding examples, particularly example 47, further comprising transferring generated electrical energy from one or both of the front-end array or the back-end array to a thermal energy storage medium.

[0149] Example 49. The method of any one of the preceding examples, particularly example 48, wherein the transferring is performed over a temperature range at or near one or more phase transition temperatures of the thermal energy storage medium.

[0150] Example 50. The method of any one of the preceding examples, particularly example 48, further comprising transferring thermal energy stored in the first portion of the temperature energy storage medium to another portion of the temperature energy storage medium.

[0151] Example 51 The method of any one of the preceding examples, particularly example 50, wherein the transfer is performed when a phase transition temperature of the thermal energy storage medium is reached or when the phase transition temperature of the thermal energy storage medium is within a predetermined range.

[0152] Example 52. The method of any one of the preceding examples, particularly example 46, further comprising acquiring thermal energy from a thermal energy storage medium by one or both of the front end array or the back end array.

[0153] Example 53. The method of any one of the preceding examples, particularly example 52, wherein the transferring is performed based on a phase transition temperature range of the thermal energy storage medium.

[0154] Example 54. A computer-implemented method of controlling temperature within an enclosure, the method including receiving at a processor a first air temperature input from one or more first locations of the enclosure, receiving at the processor a first wall temperature input from the one or more first locations of the enclosure, receiving at the processor a first setpoint air temperature input for the one or more first locations of the enclosure, and adjusting the first air temperature at the one or more first locations of the enclosure when a first air temperature corresponding to the first air temperature input differs from the first setpoint air temperature input. and outputting a first control signal to one or both of a second system that adjusts a first wall temperature of at least a portion of an interior wall at a first location above to adjust a first air temperature, the second system comprising a plurality of first thermoelectric modules coupled to a first surface of the thermal energy storage medium and a plurality of second thermoelectric modules coupled to a second surface of the thermal energy storage medium, the second surface of the thermal energy storage medium being opposite the first surface of the thermal energy storage medium, the first surface defining an interior surface and the second surface defining an exterior surface.

[0155] Example 55. The computer implementation of any one of the preceding examples, particularly example 54, wherein the first system is one of a heating ventilation and air conditioning system, a radiant heating system, a fan, or a radiant cooling system.

[0156] Example 56. The computer implementation of any one of the preceding examples, particularly example 54, receiving at a processor a second set point air temperature input for one or more second locations of the enclosure.

[0157] Example 57. The computer implementation of any one of the preceding examples, particularly example 56, further comprising: receiving at the processor a second air temperature input from one or more second locations on the enclosure; receiving at the processor a second wall temperature input from one or more second locations on the enclosure; and outputting a second control signal to the second system to adjust a second wall temperature of at least a portion of an interior wall of the one or more second locations on the enclosure to adjust the second air temperature when the second air temperature corresponding to the second air temperature input differs from a second set air temperature input.

[0158] Example 58. The computer implementation of any one of the preceding examples, particularly example 56, wherein the output of a first control signal regulating a first air temperature at the one or more first locations is independent of the output of a second control signal regulating a second air temperature at the one or more second locations, such that the one or more first locations are controlled independently from the one or more second locations.

[0159] Example 59. The computer implementation of any one of the preceding examples, particularly example 54, further comprising: independently varying a thermal energy storage medium temperature of a thermal energy storage medium proximate each thermoelectric module of the plurality of first thermoelectric modules by outputting one or more internal control signals that independently control each thermoelectric module of the plurality of first thermoelectric modules.

[0160] Example 60. The computer implementation of any one of the preceding examples, particularly example 54, further comprising independently controlling a thermal energy storage medium temperature of a thermal energy storage medium proximate each thermoelectric module of the plurality of second thermoelectric modules by outputting one or more external control signals that independently control each thermoelectric module of the plurality of second thermoelectric modules.

[0161] Example 61. A computer implementation of any one of the preceding examples, particularly example 54, further including independently controlling a thermal energy storage medium temperature of a thermal energy storage medium proximate each of the two or more first module subsets by outputting two or more first internal control signals that independently control the two or more first module subsets, the two or more first module subsets including two or more thermoelectric modules of a plurality of first thermoelectric modules communicatively coupled together in circuit.

[0162] Example 62. The computer implementation of any one of the preceding examples, particularly example 54, further including independently controlling a thermal energy storage medium temperature of a thermal energy storage medium proximate each of the two or more second module subsets by outputting two or more first external control signals that independently control two or more second module subsets, the two or more second module subsets including two or more thermoelectric modules of a plurality of second thermoelectric modules coupled together in circuit.

[0163] Example 63. The computer implementation of any one of the preceding examples, particularly example 54, wherein the second system is in communication with one or more electrochemical batteries.

[0164] Example 64. The computer implementation of any one of the preceding examples, particularly example 54, wherein the second system is in communication with an inverter configured to derive electrical energy from a DC distributed energy source.

[0165] Example 65. The computer implementation of any one of the preceding examples, particularly example 63, further including using a plurality of first thermoelectric modules to transfer at least a portion of the electrical energy generated by the temperature difference between the air temperature at the inner surface of the thermal energy storage medium and the thermal energy storage medium temperature of at least a portion of the thermal energy storage medium to one or more electrochemical batteries or to another portion of the thermal energy storage medium.

[0166] Example 66. The computer implementation of any one of the preceding examples, particularly example 63, further including using a plurality of second thermoelectric modules to transfer at least a portion of the electrical energy generated by the temperature difference between at least a portion of the thermal energy storage medium and a temperature at an outer surface of the thermal energy storage medium to one or more electrochemical batteries or to another portion of the thermal energy storage medium.

[0167] Example 67. The computer implementation of any one of the preceding examples, particularly example 54, wherein the second system is in communication with an external electrical circuit.

[0168] Example 68. The computer implementation of any one of the preceding examples, particularly example 67, further including using a plurality of first thermoelectric modules to transfer at least a portion of electrical energy generated by a temperature difference between an air temperature at an inner surface of the thermal energy storage medium and a thermal energy storage medium temperature of at least a portion of the thermal energy storage medium to an external electrical circuit or to another portion of the thermal energy storage medium.

[0169] Example 69. The computer implementation of any one of the preceding examples, particularly example 67, further including using a plurality of second thermoelectric modules to transfer at least a portion of the electrical energy generated by a temperature difference between a portion of the thermal energy storage medium and an external temperature at an outer surface of the thermal energy storage medium to an external electrical circuit or to another portion of the thermal energy storage medium.

[0170] Example 70. The computer implementation of any one of the preceding examples, particularly example 54, further comprising outputting a signal to one or more speakers to cause the one or more speakers to produce an imitation sound of a heating ventilation and air conditioning system when the second system is operational and the first system is not operational.

[0171] Example 71 A system for controlling air temperature within an enclosure, the system comprising: a first system configured to adjust the air temperature within one or more compartments; a second system configured to adjust the temperature of at least a portion of an interior wall of the enclosure; and a processor coupled in communication with the first and second systems, the first system comprising a plurality of first thermoelectric modules coupled to a first surface of a temperature energy storage medium, the second system comprising a plurality of second thermoelectric modules coupled to a second surface of the temperature energy storage medium, and the first surface defining an interior surface is opposite the second surface defining an exterior surface.

[0172] Example 72. The system of any one of the preceding examples, particularly example 71, wherein the first system is a heating ventilation and air conditioning system.

[0173] Example 73. The system of any one of the preceding examples, particularly example 71, wherein the processor is configured to receive a set point air temperature input for one or more compartments of the enclosure.

[0174] Example 74. The system of any one of the preceding examples, particularly example 73, wherein the processor is configured to receive a plurality of setpoint air temperatures, each setpoint air temperature corresponding to an indoor air temperature.

[0175] Example 75. The system of any one of the preceding examples, particularly example 74, wherein the processor is configured to adjust the temperature of at least a portion of an interior wall of each of the compartments having desired set air temperatures independent of one another according to the instructions.

[0176] Example 76. The system of any one of the preceding examples, particularly example 71, wherein the processor is configured to independently vary a thermal energy storage medium temperature of a thermal energy storage medium proximate each thermoelectric module by independently controlling each thermoelectric module of the plurality of first thermoelectric modules.

[0177] Example 77. The system of any one of the preceding examples, particularly example 71, wherein the processor is configured to independently vary a thermal energy storage medium temperature of a thermal energy storage medium proximate each thermoelectric module by independently controlling each thermoelectric module of the plurality of second thermoelectric modules.

[0178] Example 78. The system of any one of the preceding examples, particularly example 71, wherein the processor is configured to independently vary a thermal energy storage medium temperature of a thermal energy storage medium proximate each of the plurality of first thermoelectric modules by independently controlling two or more first module subsets having two or more thermoelectric modules of the plurality of first thermoelectric modules coupled together in circuit.

[0179] Example 79. The system of any one of the preceding examples, particularly example 71, wherein the processor is configured to independently vary a temperature of a thermal energy storage medium proximate each of the plurality of second thermoelectric modules by independently controlling two or more second module subsets having two or more thermoelectric modules of the plurality of second thermoelectric modules coupled together in circuit.

[0180] Example 80. The system of any one of the preceding examples, particularly example 71, wherein the second system is in communication with one or more electrochemical batteries.

[0181] Example 81. The system of any one of the preceding examples, particularly example 80, wherein the second system is configured to use a plurality of first thermoelectric modules to transfer at least a portion of the electrical energy generated by a temperature difference between an air temperature inside the thermal energy storage medium and a thermal energy storage medium temperature of at least a portion of the thermal energy storage medium to one or more electrochemical batteries or to another portion of the thermal energy storage medium.

[0182] Example 82. The system of any one of the preceding examples, particularly example 80, wherein the second system is configured to use a plurality of second thermoelectric modules to transfer at least a portion of the electrical energy generated by a temperature difference between at least a portion of the temperature energy storage medium and a temperature outside the temperature energy storage medium to one or more electrochemical batteries or to another portion of the temperature energy storage medium.

[0183] Example 83. The system of any one of the preceding examples, particularly example 71, wherein the second system is in fluid communication with an external electrical circuit.

[0184] Example 84. The system of any one of the preceding examples, particularly example 83, wherein the second system is configured to use a plurality of first thermoelectric modules to transfer at least a portion of the electrical energy generated by a temperature difference between a temperature inside the thermal energy storage medium and a thermal energy storage medium temperature of at least a portion of the thermal energy storage medium to an external electrical circuit or to another portion of the thermal energy storage medium.

[0185] Example 85. Any one of the preceding examples, particularly the system of Example 83, wherein the second system is configured to use a plurality of second thermoelectric modules to transfer at least a portion of the electrical energy generated by a temperature difference between at least a portion of the thermal energy storage medium and a temperature outside the thermal energy storage medium to an external electrical circuit or to another portion of the thermal energy storage medium.

[0186] Example 86. The system of any one of the preceding examples, particularly example 71, further comprising one or more speakers configured to generate sounds that mimic a heating, ventilation, and air conditioning system when the second system is in operation and the first system is not in operation.

[0187] Example 87. The system of any one of the preceding examples, particularly example 71, wherein the communicative coupling includes a wireless coupling.

[0188] Example 88. The system of any one of the preceding examples, particularly example 71, wherein the communicative coupling comprises a wired connection.

[0189] Example 89. A computer-implemented method for controlling temperature within an enclosure, comprising: receiving by a processor predetermined parameters for the enclosure, the predetermined parameters being determined from sensor data or a model of the enclosure or a similar enclosure; receiving by the processor a predetermined set point temperature input for the enclosure; receiving by the processor a central air temperature input for the enclosure; determining whether the central air temperature input is within a tolerance range of the predetermined set point temperature input; and adjusting the air temperature of the enclosure using a temperature adjustment system when the central air temperature input in a particular region is outside the tolerance range of the predetermined set point temperature input for the region, the degree of adjustment being based on the predetermined parameters for the enclosure.

[0190] Example 90. The computer-implemented method of any one of the preceding examples, particularly example 89, wherein the temperature regulating system includes one or both of a first system for regulating an air temperature within the enclosure or a second system for regulating the air temperature by regulating a wall temperature of at least a portion of an interior wall of the enclosure, the second system including a plurality of first thermoelectric modules coupled to a first surface of the temperature energy storage medium and a plurality of second thermoelectric modules coupled to a second surface of the temperature energy storage medium, the second surface of the temperature energy storage medium being opposite the first surface of the temperature energy storage medium, the first surface defining an inner surface and the second surface defining an outer surface.

[0191] Example 91. The computer-implemented method of any one of the preceding examples, particularly example 89, wherein the default set point temperature input is based on a default comfort specification. [Explanation of symbols]

[0192] 2a~2i First thermoelectric module 3 planes 4a~4i Second thermoelectric module 5 Front-end array 6 Backend Arrays 7 First Interval 8 Phase change materials 9 Page 1 10a~10e Temperature sensors 11 Side 2 12c Temperature Sensor 13 Second Interval 14 Total width 15 Length 16 Space 17 Inside 18 Environment 19 External 21 Thickness 22 processors 24 Heating, ventilation and air conditioning system A (HVAC A) 26 Heating and cooling system B (HC B) 27 Width 28 Indoor temperature 30 Wall temperature 31 Vertical axis 33 horizontal axis 70 1st surface 72 Second surface 74 Page 1 76 2nd page 100 Heating and Cooling Subsystem 102 Heating and cooling system B (HC B) 104 Enclosure Envelope 106 Indoor temperature air input 108 Heating, ventilation and air conditioning system A (HVAC A) 110 Phase change materials 150 Systems 160 Systems 170 method 180 method 200 Systems 210 Memory 220 Remote Computing Devices 230 Thermoelectric Module 240 Sensors 250 External circuit 260 Heating, ventilation and air conditioning (HVAC) systems 270 Applications 280 processor 290 Speaker

Claims

1. A thermal energy management system, comprising: a front-end array coupled to a first surface of a thermal energy storage medium, the front-end array configured to act as a reservoir or battery for thermal energy, the front-end array comprising one or more first thermoelectric modules configured to generate thermal energy from the thermal energy storage medium and transfer the thermal energy to the thermal energy storage medium, the first surface defining an interior surface; a back-end array coupled to a second surface of the thermal energy storage medium opposite the first surface, the back-end array comprising one or more second thermoelectric modules configured to generate thermal energy from the thermal energy storage medium and transfer the thermal energy to the thermal energy storage medium, the second surface defining an exterior surface; and a processor configured to adjust the front-end array, the back-end array, or both to transfer thermal energy between regions of the thermal energy storage medium or to an ambient environment; When a set temperature of the thermal energy storage medium is near or reaches a phase transition temperature, and when the phase transition temperature of the thermal energy storage medium is within a predetermined range of the set temperature, thermal energy generated in one region of the thermal energy storage medium is transferred to another region of the thermal energy storage medium or to the surrounding environment; adjusting the temperature of at least one region of the thermal energy storage medium using the front-end array, the back-end array, or both; the processor; A system comprising:

2. The system described in claim 1, wherein the front-end array comprises one or more first thermoelectric modules and the back-end array comprises one or more second thermoelectric modules.

3. The system described in claim 1, wherein the first surface defines the inner surface of at least one wall or barrier of the enclosure, and the second surface defines the outer surface of the at least one wall or barrier.

4. The system described in claim 3, wherein the temperature energy storage medium forms a layer of the enclosure.

5. The system of claim 1, wherein the processor is configured to adjust the temperature of at least a portion of the thermal energy storage medium to thermally regulate the enclosure in response to a grid signal, climatic conditions, or a desired temperature.

6. The system described in claim 1, wherein the transmission is performed over a temperature range at or near the phase transition temperature of the thermal energy storage medium.

7. The system described in claim 1, wherein the temperature energy storage medium is configured to be positioned between the front-end array and the back-end array, and the spacing between the temperature energy storage medium and the front-end array and other spacing between the temperature energy storage medium and the back-end array can be determined based on one or more of the relative sizes and performance of the thermoelectric modules of the front-end array and the back-end array, the volume of the enclosure, the thickness of the temperature energy storage medium, the atmospheric conditions of the enclosure, and the overall heat transfer performance.

8. A method for operating the thermal energy management system of claim 1, comprising: sensing the temperature of the thermal energy storage medium; performing a transfer of thermal energy from the front-end array or the back-end array when the sensed temperature is within a predetermined range of the phase transition temperature; A method comprising:

9. The system described in claim 1, wherein the front-end array and the back-end array circulate thermal energy from one or more modules of the front-end array to one or more modules of the back-end array and / or from one or more modules of the back-end array to one or more modules of the front-end array via the thermal energy storage medium.

10. The system described in claim 1, wherein the temperature energy storage medium is configured to function as a thermal reservoir.

11. The system described in claim 1, wherein the processor is configured to independently operate the one or more first thermoelectric modules and the one or more second thermoelectric modules to generate a temperature gradient in the temperature energy storage medium.

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