Earphones

Abstract

An embodiment of the present specification provides an earphone, the earphone including: a sound generating unit including a transducer including a diaphragm that generates sound under the action of an excitation signal, and a housing forming a cavity to accommodate the transducer; and a hanging structure for mounting the sound generating unit in a position near the ear canal but not blocking the ear canal when worn; a sound emission hole is formed on an inner surface of the housing facing the auricle, which guides sound generated in front of the diaphragm out of the housing and transmits it to the ear canal; and a first decompression hole is formed on another side of the housing, which guides sound generated behind the diaphragm out of the housing, and the distance from the center of the sound emission hole to the midpoint of the upper boundary of the inner surface is greater than the distance from the center of the first decompression hole to the midpoint of the upper boundary of the inner surface.

Description

[Technical field]

[0001] The present application relates to the field of acoustics, and more particularly to earphones.

[0002] [Incorporated by reference] This application claims priority to a Chinese application having application number 202211336918.4 filed on October 28, 2022, priority to a Chinese application having application number 202223239628.6 filed on December 1, 2022, priority to an international application having application number PCT / CN2022 / 144339 filed on December 30, 2022, priority to an international application having application number PCT / CN2023 / 079411 filed on March 2, 2023, priority to an international application having application number PCT / CN2023 / 079404 filed on March 2, 2023, and priority to an international application having application number PCT / CN2023 / 079410 filed on March 2, 2023, the entire contents of which are incorporated herein by reference. [Background technology]

[0003] With the development of audio output technology, audio devices (e.g., earphones) are widely applied in people's daily life, and can provide users with an auditory feast when used in combination with electronic devices such as mobile phones and computers. According to the way in which the user wears the audio device, it can be generally divided into in-ear type, head-mounted type, ear-hook type, etc.

[0004] Therefore, it is necessary to provide an earphone that can improve the wearing comfort of the user and has excellent output performance. Summary of the Invention

[0005] The earphones according to the embodiments of the present application include a sound generating unit including a transducer including a diaphragm that generates sound under the action of an excitation signal, and a housing that forms a cavity to accommodate the transducer, and a hanging structure that mounts the sound generating unit near the ear canal in a position that does not block the ear canal when worn, and a sound emission hole is formed on the inner surface of the housing facing the auricle, which guides sound generated in front of the diaphragm out of the housing and transmits it to the ear canal, and a first decompression hole is formed on the other side of the housing, which guides sound generated behind the diaphragm out of the housing, and the distance from the center of the sound emission hole to the midpoint of the upper boundary of the inner surface is greater than the distance from the center of the first decompression hole to the midpoint of the upper boundary of the inner surface.

[0006] In some embodiments, the ratio of the distance from the center of the sound emission hole to the midpoint of the upper boundary of the inner surface to the distance from the center of the first decompression hole to the midpoint of the upper boundary of the inner surface is in the range of 1.3 to 2.1.

[0007] In some embodiments, the ratio of the area of ​​the sound emitting holes to the depth of the sound emitting holes to the area of ​​the first decompression holes to the depth of the first decompression holes is in the range of 1.10 to 1.75.

[0008] In some embodiments, the ratio of the area of ​​the sound emission hole to the area of ​​the first decompression hole is in the range of 0.5 to 1.5.

[0009] In some embodiments, when the earphone is worn, the ratio of the distance from the projection of the center of the sound emission hole onto the sagittal plane to the centroid of the projection of the ear canal opening onto the sagittal plane to the distance from the projection of the center of the first decompression hole onto the sagittal plane to the centroid of the projection of the ear canal opening onto the sagittal plane is within the range of 0.10 to 0.35.

[0010] In some embodiments, the suspension structure includes an ear hook, and in a worn state, a first portion of the ear hook is hung between the user's auricle and head, and a second portion of the ear hook extends on the side of the auricle facing away from the head and is connected to the sound generating unit, and the ratio of the distance from the center of the sound emission hole to the upper apex of the ear hook to the distance from the center of the first pressure reduction hole to the upper apex of the ear hook is in the range of 1.10 to 1.70.

[0011] In some embodiments, the transducer further includes a magnetic circuit assembly that provides a magnetic field, and an absolute value of the difference between the distance from the center of the sound emission hole to the longitudinal center plane of the magnetic circuit assembly and the distance from the center of the first decompression hole to the longitudinal center plane is within a range of 4.0 mm to 6.1 mm.

[0012] In some embodiments, the difference between the distance from the center of the sound emission hole to the bottom surface of the magnetic circuit assembly and the distance from the center of the first decompression hole to the bottom surface of the magnetic circuit assembly is within a range of 3.65 mm to 7.05 mm.

[0013] In some embodiments, a second decompression hole is further formed on another side of the housing, and an area of ​​the first decompression hole is larger than an area of ​​the second decompression hole.

[0014] In some embodiments, the distance from the center of the sound emission hole to the perpendicular bisector of the line connecting the center of the first decompression hole and the center of the second decompression hole is between 0 mm and 2 mm.

[0015] In some embodiments, the first vacuum hole is formed in an upper surface of the housing and the second vacuum hole is formed in a lower surface of the housing.

[0016] In some embodiments, when worn, the ratio of the distance from the projection of the center of the sound emission hole onto the sagittal plane to the projection of 1 / 3 of the lower boundary of the inner surface onto the sagittal plane to the distance from the projection of the center of the second decompression hole onto the sagittal plane to the projection of 1 / 3 of the lower boundary of the inner surface onto the sagittal plane is within the range of 0.65 to 1.05.

[0017] In some embodiments, the included angle between the line connecting the center of the sound emission hole to the center of the first decompression hole and the line connecting the center of the sound emission hole to the center of the second decompression hole is in the range of 46.40° to 114.04°.

[0018] In some embodiments, the ratio of the distance from the center of the sound emission hole to the center of the first decompression hole to the distance from the center of the sound emission hole to the center of the second decompression hole is in the range of 0.9 to 1.1.

[0019] In some embodiments, the ratio of the area of ​​the sound emission hole to the total area of ​​the first decompression hole and the second decompression hole is in the range of 0.1 to 0.99.

[0020] In some embodiments, the diaphragm divides the cavity into a front cavity and a rear cavity corresponding to the front side and rear side of the diaphragm respectively, and the ratio of the volume of the rear cavity to the volume of the front cavity is in the range of 0.1-10.

[0021] In some embodiments, the diaphragm divides the cavity into a front cavity and a rear cavity corresponding to the front and rear sides of the diaphragm, respectively, and the ratio of the resonant frequency of the front cavity to the resonant frequency of the rear cavity is in the range of 0.1-5.

[0022] In some embodiments, the ratio of the area of ​​the sound emission hole to the total area of ​​the first decompression hole and the second decompression hole is in the range of 1-10.

[0023] In some embodiments, the diaphragm divides the cavity into a front cavity and a rear cavity corresponding to the front side and rear side of the diaphragm respectively, and the ratio of the volume of the rear cavity to the volume of the front cavity is in the range of 0.1-10.

[0024] In some embodiments, the diaphragm divides the cavity into a front cavity and a rear cavity corresponding to the front and rear sides of the diaphragm, respectively, and the ratio of the resonant frequency of the front cavity to the resonant frequency of the rear cavity is in the range of 0.5-10.

[0025] In some embodiments, the ratio of the sound pressure at the sound output hole to the total sound pressure at the first and second decompression holes is in the range of 0.4 to 0.6.

[0026] In some embodiments, the ratio of the difference between the area of ​​the first decompression hole and the area of ​​the second decompression hole to the area of ​​the sound emission hole is in the range of 2.5 to 3.9.

[0027] In some embodiments, an acoustically resistive mesh is installed in at least one of the first and second decompression holes in the sound output hole, and the thickness of the acoustically resistive mesh is in the range of 40 μm to 150 μm.

[0028] In some embodiments, the acoustically resistive mesh in the sound outlet comprises a steel mesh, and the mesh number of the steel mesh is in the range of 60-100.

[0029] In some embodiments, the acoustically resistive mesh in the sound outlet comprises a steel mesh, and the mesh number of the steel mesh is in the range of 70-90.

[0030] The present application will be further illustrated by exemplary embodiments, which are not limiting and will be described in detail with reference to the drawings, in which like numbers refer to like structures. [Brief description of the drawings]

[0031] [Figure 1] 1 is a schematic diagram of an exemplary ear according to some embodiments of the present disclosure. [Diagram 2] FIG. 2 is an exemplary structural diagram of an earphone in accordance with some embodiments of the present disclosure. [Diagram 3] FIG. 2 is a schematic diagram of two point sound sources and listening positions according to some embodiments of the present disclosure. [Figure 4] FIG. 10 is a comparison diagram of sound leakage index at different frequencies for a single point sound source and dual point sound sources, in accordance with certain embodiments herein. [Diagram 5] FIG. 13 is an exemplary distribution diagram of a dipole sound source in which a baffle is placed between two sources, according to some embodiments herein. [Figure 6]FIG. 13 illustrates a sound leakage index with and without a baffle between two dipole sound sources, in accordance with some embodiments of the present disclosure. [Figure 7] FIG. 1 is an exemplary wearing schematic diagram of an open-type earphone in accordance with some embodiments of the present disclosure. [Figure 8] FIG. 8 is a schematic diagram of the open-type earphone shown in FIG. 7, showing the side facing the ear. [Figure 9] FIG. 8 is a schematic diagram of the housing of the open-type earphone shown in FIG. [Figure 10] FIG. 13 is an exemplary schematic distribution diagram of a cavity structure placed around one of the dipole sound sources, according to some embodiments herein. [Figure 11A] FIG. 2 is a schematic diagram of a dipole source structure and a listening principle when a cavity structure is configured around one of the dipole sources according to some embodiments of the present disclosure; [Figure 11B] FIG. 2 is a schematic diagram of a dipole sound source structure and the sound leakage principle when a cavity structure is configured around one of the dipole sound sources, according to some embodiments of the present disclosure; [Figure 12A] 1 is a schematic diagram of a cavity structure having two horizontal openings, according to some embodiments herein. FIG. [Figure 12B] 1 is a schematic diagram of a cavity structure having two vertical openings, according to some embodiments herein. FIG. [Figure 13] FIG. 10 is a comparison diagram of listening index curves for a two-opening cavity structure and a one-opening cavity structure, according to some embodiments herein. [Figure 14] FIG. 13 is an exemplary schematic diagram of an open-type earphone according to some other embodiments of the present application. [Figure 15] FIG. 15 is a schematic diagram of the open-type earphone shown in FIG. 14 from the ear side. [Figure 16] FIG. 1 is a schematic diagram of a sagittal plane projection of an open-type earphone in a worn state, in accordance with some embodiments of the present disclosure. [Figure 17]FIG. 1 is a schematic diagram of a housing of an open-type earphone according to some embodiments of the present disclosure. [Figure 18] 4 is a contour plot of the volume ratio of the front cavity to the rear cavity, and the ratio of the opening area of ​​the sound emission hole to the opening area of ​​the decompression hole according to some embodiments herein. [Figure 19] FIG. 11 illustrates frequency response curves corresponding to different sound volumes at the sound outlet, according to some embodiments of the present disclosure. [Figure 20] 11A-11C are frequency response curve diagrams corresponding to different volumes at the first decompression hole according to some embodiments herein. [Figure 21] 11A-11C are frequency response curve diagrams corresponding to different volumes at the second decompression hole according to certain embodiments herein. [Figure 22] FIG. 2 is an exemplary internal structural diagram of a sound generating unit according to some embodiments of the present disclosure. [Diagram 23] 1 is an exemplary internal structural diagram of a transducer in accordance with some embodiments of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0032] In order to more clearly describe the technical means of the embodiments of the present application, the drawings necessary for the description of the embodiments will be briefly described below. Obviously, the drawings described below are only examples or parts of the embodiments of the present application, and those skilled in the art can apply the present application to other similar scenarios based on these drawings without creative efforts. Unless otherwise clear from the context or described otherwise, the same symbols in the drawings represent the same structures or operations.

[0033] It should be understood that the terms "system," "apparatus," "unit," and / or "module" used herein are ways of distinguishing between different levels of assemblies, elements, components, parts, or structures, however, other terms may be used in place of the above terms if they achieve the same purpose.

[0034] As used herein and in the claims, unless the context clearly dictates otherwise, terms such as "a," "one," "one kind," and / or "the" do not specifically refer to the singular but may include the plural. In general, the terms "comprise" and "containing" are merely intended to indicate the inclusion of explicitly identified steps and elements, and these steps and elements are not intended to be an exclusive listing, and a method or apparatus may also include other steps or elements.

[0035] It should be noted that in the description of this specification, the terms "first", "second", "third", "fourth", etc. are used for descriptive purposes only and should not be understood to indicate or suggest relative importance or to implicitly indicate the quantity of the technical features indicated. Thus, a feature defined by "first", "second", "third", "fourth" may explicitly or implicitly indicate that it includes at least one of the feature. In the description of this specification, unless otherwise clearly and specifically limited, "plurality" means at least two, e.g., two, three, etc.

[0036] In this specification, unless otherwise clearly specified and limited, the terms "connected", "fixed", etc. should be understood in a broad sense. For example, unless otherwise clearly limited, the term "connected" may be a fixed connection, a removable connection, or an integral connection, may be a mechanical connection or an electrical connection, may be a direct connection, may be an indirect connection via an intermediate medium, may be an internal communication between two elements, or may be an interactive relationship between two elements. A person skilled in the art can understand the specific meaning of the above terms in this specification according to the specific situation.

[0037] In this specification, unless otherwise clearly specified or limited, the distance from a specific point to a line or surface may refer to the shortest distance from the specific point to the line or surface.

[0038] FIG. 1 is a schematic diagram of an exemplary ear according to some embodiments of the present application. As shown in FIG. 1, the ear 100 (also called the pinna) may include an ear canal 101, a concha cavity 102, a concha navicular 103, a triangular fossa 104, an antihelix 105, a scapha 106, a helix 107, an earlobe 108, a tragus 109, and a helical crus 1071. In some embodiments, the support of an acoustic device by one or more parts of the ear 100 can stably wear the acoustic device. In some embodiments, parts such as the ear canal 101, the concha cavity 102, the concha navicular 103, and the triangular fossa 104 have a certain depth and volume in three-dimensional space, and can meet the wearing needs of the acoustic device. For example, an acoustic device (e.g., a canal-type earphone) may be worn in the ear canal 101. In some embodiments, the wearing of the acoustic device can be realized by other parts of the ear 100 other than the ear canal 101. For example, the acoustic device can be attached by the concha 103, the triangular fossa 104, the antihelix 105, the scaphoid fossa 106, the helix 107, or a combination thereof. In some embodiments, the acoustic device can be attached by the user's earlobe 108 or other parts to improve comfort and reliability when worn. By attaching the acoustic device and transmitting sound by parts other than the ear canal 101 of the ear part 100, the user's ear canal 101 can be "opened". When the user wears the acoustic device, the acoustic device does not block the user's ear canal 101 (or the ear canal or ear canal opening), and the user can receive not only sound from the acoustic device but also sound from the environment (e.g., horn sounds, bicycle bell sounds, voices of people around, traffic control voices, etc.), thereby reducing the probability of traffic accidents. In this specification, an acoustic device that does not block the user's ear canal 101 (or the ear canal or ear canal opening) when worn by a user may be called an earphone. In some embodiments, based on the structure of the ear portion 100, the acoustic device can be designed with a structure that matches the ear portion 100 to realize the placement of the sound generating portion of the acoustic device at different positions on the ear portion.For example, when the acoustic device is an earphone, the earphone may include a suspension structure (e.g., an ear hook) and a sound generating unit, the sound generating unit and the suspension structure are physically connected, and the suspension structure may conform to the shape of the pinna so as to place the entire or a part of the structure of the sound generating unit in front of the tragus 109 (e.g., the area J surrounded by the dotted line in FIG. 1). Also, for example, when a user wears the earphone, the entire or a part of the structure of the sound generating unit may contact the upper part of the ear canal 101 (e.g., the location of one or more parts such as the concha navicular 103, the triangular fossa 104, the antihelix 105, the scaphoid fossa 106, the helix 107, and the crus helix 1071). Also, for example, when a user is wearing earphones, the entire or partial structure of the sound generating unit may be located within a cavity formed by one or more parts of the ear unit 100 (e.g., the concha cavity 102, the concha scapha 103, the triangular fossa 104, etc.) (e.g., region M1 surrounded by dotted lines in Figure 1, including at least the concha cavity 103 and the triangular fossa 104, and region M2 including at least the concha cavity 102).

[0039] Since there may be individual differences among different users, the ears have dimensional differences such as shapes and sizes. For ease of explanation and understanding, unless otherwise specified, the present specification will further describe the wearing method of the acoustic device in the ear model in different embodiments, mainly based on an ear model having a "standard" shape and size. For example, a simulator including a head and its (left and right) ears, such as GRAS 45BC KEMAR, manufactured based on ANSI: S3.36, S3.25 and IEC: 60318-7 standards, can be used as a reference for wearing the acoustic device, and can present a scenario in which most users normally wear the acoustic device. By way of example only, the reference ear may have the relevant features that the dimension of the projection of the pinna onto the sagittal plane in the vertical axis direction is within the range of 49.5 mm to 74.3 mm, and the dimension of the projection of the pinna onto the sagittal plane in the sagittal axis direction is within the range of 36.6 mm to 55 mm. Therefore, in the present application, the descriptions such as "worn by a user", "in a worn state" and "in a worn state" may refer to the acoustic device described in the present application being worn on the ear of the simulator described above. Naturally, considering that different users have individual differences, the structure, shape, size, thickness, etc. of one or more parts of the ear part 100 may have certain differences, and in order to meet the needs of different users, a differentiated design can be made for the acoustic device, and these differentiated designs may be adapted to different ear parts by having characteristic parameters of one or more parts of the acoustic device (e.g., the sound generating part, ear hook, etc. described below) having different ranges of values.

[0040] In addition, in the fields of medicine, anatomy, and the like, three basic cutting planes of the human body, the sagittal plane, the coronal plane, and the horizontal plane, and three basic axes, the sagittal axis, the coronal axis, and the vertical axis, can be defined. The sagittal plane refers to a cutting plane perpendicular to the ground along the front-back direction of the body, dividing the human body into two parts, the left and right, the coronal plane refers to a cutting plane perpendicular to the ground along the left-right direction of the body, dividing the human body into two parts, the front and the back, and the horizontal plane refers to a cutting plane parallel to the ground along the up-down direction perpendicular to the body, dividing the human body into two parts, the top and the bottom. Accordingly, the sagittal axis refers to an axis perpendicular to the coronal plane along the front-back direction of the body, the coronal axis refers to an axis perpendicular to the sagittal plane along the left-right direction of the body, and the vertical axis refers to an axis perpendicular to the horizontal plane along the up-down direction of the body. Furthermore, the "front side of the ear" described in this application is a concept opposite to the "rear side of the ear", the former referring to the side of the ear facing away from the head, and the latter referring to the side of the ear facing the head. When the ear of the simulator is observed along the direction of the coronal axis of the human body, a schematic diagram of the front profile of the ear is obtained as shown in FIG.

[0041] FIG. 2 is an exemplary structural diagram of an earphone according to some embodiments of the present disclosure.

[0042] In some embodiments, the earphone 10 may include, but is not limited to, an air conduction earphone, a combined bone conduction and air conduction earphone, etc. In some embodiments, the earphone 10 may be combined with a product such as glasses, headphones, a head mounted display, an AR / VR helmet, etc.

[0043] As shown in FIG. 2, the earphone 10 may include a sound generating unit 11 and an ear hook 12.

[0044] The sound generating unit 11 may be worn on the user's body, and the sound generating unit 11 may generate sound and input it to the user's ear canal. In some embodiments, the sound generating unit 11 may include a transducer (e.g., transducer 116 shown in FIG. 22) and a housing 111 that accommodates the transducer. The housing 111 may be connected to the ear hook 12. The transducer converts an excitation signal (e.g., an electrical signal) into a corresponding mechanical vibration to generate sound. In some embodiments, a sound emission hole 112 is formed on a side surface of the housing facing the auricle, and the sound emission hole 112 guides the sound generated by the transducer from the housing 111 to the ear canal so that the user can hear the sound. In some embodiments, the transducer (e.g., diaphragm) can divide the housing 111 into a front cavity (e.g., the front cavity 114 shown in FIG. 22) and a rear cavity of the earphone, and the sound output hole 112 communicates with the front cavity and can guide the sound generated in the front cavity from the housing 111 and transmit it to the ear canal. In some embodiments, a part of the sound output through the sound output hole 112 is transmitted to the ear canal so that the user can hear the sound, and another part can be transmitted to the outside of the earphone 10 and the ear unit through a gap between the sound generating unit 11 and the ear unit (e.g., a part of the concha cavity that is not covered by the sound generating unit 11), together with the sound reflected in the ear canal, thereby forming a first sound leakage in the far field. At the same time, one or more decompression holes 113 (e.g., a first decompression hole 1131) are usually formed on the other side of the housing 111 (e.g., a side away from the user's ear canal or a side facing away from the ear canal). The decompression hole 113 is farther from the ear canal than the sound emission hole 112, and the sound transmitted from the decompression hole 113 usually forms a second sound leakage in the far field, the intensity of the first sound leakage is equal to the intensity of the second sound leakage, and the phase of the first sound leakage is (substantially) inverse, so that the two are offset in the far field, which is advantageous for reducing sound leakage in the far field of the earphone 10.In some embodiments, in addition to the side of the housing 111 facing the auricle, at least two decompression holes 113 may be formed on the other side of the housing 111. By providing at least two decompression holes 113, not only can the sound generated in the rear cavity be guided out of the housing 111, but also the high-pressure area of ​​the sound field in the rear cavity can be destroyed, thereby shortening the wavelength of the standing wave in the rear cavity, and further, the resonance frequency of the sound guided out of the housing 111 from the decompression holes 113 can be as high as possible, for example, greater than 4 kHz. At this time, the sound guided out of the sound output hole 112 and the sound guided out of the decompression holes 113 can maintain good consistency over a wider frequency range, and the effect of canceling interference between the two in the far field is higher, resulting in a higher sound leakage reduction effect. For convenience of explanation, in this specification, an example in which two decompression holes are provided in the sound generating unit 11 is described as an example. As a mere example, the at least two decompression holes 113 may include a first decompression hole and a second decompression hole (e.g., the first decompression hole 1131 and the second decompression hole 1132 in FIG. 7 or FIG. 14), and the two decompression holes 113 may be located on opposite sides of the housing 111, respectively, to maximally destroy the high-pressure area of ​​the sound field in the rear cavity, and are, for example, installed so as to face each other in the short axis direction Y below. In simple terms, when a user wears the earphone 10, what is mainly heard is the sound transmitted to the ear canal through the sound emission hole 112, and the decompression hole 113 is installed mainly to balance the pressure of the rear cavity so that it can vibrate sufficiently at low frequency and large amplitude, so that the sound sounds as deep as possible in bass and clear in treble, and the sound leaking into the environment through the sound emission hole 112 is reduced. For more information on the sound generating unit 11, please refer to other parts of this specification, for example, FIG. 7, FIG. 14, FIG. 22, etc. and their descriptions.

[0045] The ear hook 12 may have one end connected to the sound generating unit 11 and the other end extending along the boundary between the user's ear and head. In some embodiments, the ear hook 12 may have an arc-shaped structure that fits the user's auricle so that it can be hung from the user's auricle. For example, the ear hook 12 may have an arc-shaped structure that fits the boundary between the user's head and ear so that it can be hung between the user's auricle and head. In some embodiments, the ear hook 12 may have a clamping structure that fits the user's auricle so that it can be clamped to the user's auricle. Exemplarily, the ear hook 12 may include a hook-shaped portion (first portion 121 shown in FIG. 7) and a connecting portion (second portion 122 shown in FIG. 7) that are connected in order. The connecting portion connects the hook-shaped portion and the sound generating unit 11 so that the earphone 10 is curved in three-dimensional space when in an unworn state (i.e., natural state). In other words, in three-dimensional space, the hook-shaped portion, the connection portion, and the sound generating unit 11 are not on the same plane. By installing in this manner, when the earphone 10 is in a worn state, the hook-shaped portion may be mainly hung between the rear side of the user's ear and the head, and the sound generating unit 11 may mainly contact the front side of the user's ear, so that the sound generating unit 11 and the hook-shaped portion can engage with each other to hold the ear. Exemplarily, the connection portion may extend from the head to the outside of the head and further engage with the hook-shaped portion to provide the sound generating unit 11 with a pressing force toward the front side of the ear. The sound generating unit 11 may be pressed against an area where the concha cavity 102, the concha navicularis 103, the triangular fossa 104, the antihelix 105, and other parts are located under the action of a pressing force so as not to block the external auditory canal 101 of the ear when the earphone 10 is in a worn state.

[0046] In some embodiments, in order to improve the stability of the earphone 10 in the worn state, the earphone 10 can use any one of the following methods or a combination thereof. In method 1, at least a part of the ear hook 12 is installed as a mimicking structure that fits at least one of the back side of the ear part 100 and the head to increase the contact area between the ear hook 12 and the ear part 100 and / or the head, thereby increasing the resistance of the earphone 10 to come off from the ear part 100. In method 2, at least a part of the ear hook 12 is installed in an elastic structure so that it has a certain amount of deformation in the worn state, and the resistance of the earphone 10 to come off from the ear part is increased by increasing the positive pressure of the ear hook 12 on the ear part and / or the head. In method 3, at least a part of the ear hook 12 is installed so that it abuts against the head in the worn state to form a reaction force that presses the ear part, and the resistance of the earphone 10 to come off from the ear part is increased by pressing the sound generating unit 11 to the front side of the ear part. In method 4, the sound generating unit 11 and the ear hook 12 are installed so as to clamp the area where the antihelix is ​​located and the area where the concha cavity is located from both the front and back of the ear part when worn, thereby increasing the resistance to the earphone 10 coming off from the ear part. In method 5, the sound generating unit 11 or the auxiliary structure connected thereto is installed so that at least a part of it enters a cavity such as the concha cavity, the concha navicular, the triangular fossa, and the navicular fossa, thereby increasing the resistance to the earphone 10 coming off from the ear part.

[0047] In some embodiments, the ear hook 12 may include, but is not limited to, an ear hook, an elastic band, etc., so as to better secure the earphone 10 to the user and prevent it from coming off during use by the user. In some embodiments, the earphone 10 may not include the ear hook 12, and the sound generating unit 11 may be fixed near the user's ear 100 in a hanging or clamping manner.

[0048] In some embodiments, the sound generating unit 11 may have a regular or irregular shape, such as a ring shape, an ellipse shape, a racetrack shape, a polygonal shape, a U-shape, a V-shape, a semicircle shape, etc., so that the sound generating unit 11 can be directly hung on the ear unit 100 of a user. In some embodiments, the sound generating unit 11 may have a long axis direction X and a short axis direction Y that are perpendicular to the thickness direction Z and perpendicular to each other. The long axis direction X can be defined as the direction in which the extension dimension is the largest in the shape of a two-dimensional projection surface of the sound generating unit 11 (e.g., the projection of the sound generating unit 11 onto a plane on which its outer surface is located, or the projection onto a sagittal plane) (e.g., when the projection shape is rectangular or approximately rectangular, the long axis direction is the length direction of the rectangle or approximately rectangle). The short axis direction Y can be defined as the direction perpendicular to the long axis direction X in the projection shape of the sound generating unit 11 onto the sagittal plane (e.g., when the projection shape is rectangular or approximately rectangular, the short axis direction is the width direction of the rectangle or approximately rectangle). The thickness direction Z can be defined as a direction perpendicular to the two-dimensional projection plane, and corresponds, for example, to the direction of the coronal axis, both of which are oriented in the left-right direction of the body.

[0049] In some embodiments, when the user wears the earphones 10, the sound generating unit 11 may be worn in a position near the user's ear canal 101 that does not block the ear canal. In some embodiments, the projection of the earphones 10 onto the sagittal plane may not cover the user's ear canal when worn. For example, the projection of the sound generating unit 11 onto the sagittal plane may be on both the left and right sides of the head, in front of the tragus on the sagittal axis of the human body (for example, the position indicated by the solid line frame A in FIG. 2). At this time, the sound generating unit 11 is in front of the user's tragus, the long axis of the sound generating unit 11 is in a vertical or nearly vertical state, the projection of the short axis direction Y onto the sagittal plane coincides with the direction of the sagittal axis, the projection of the long axis direction X onto the sagittal plane coincides with the direction of the vertical axis, and the thickness direction Z is perpendicular to the sagittal plane. Also, for example, the projection of the sound generating unit 11 onto the sagittal plane may be on the antihelix 105 (for example, the position indicated by the dotted line frame C in FIG. 2). At this time, at least a part of the sound generating unit 11 is in the antihelix 105, the long axis of the sound generating unit 11 is horizontal or nearly horizontal, the long axis direction X of the sound generating unit 11 projected onto the sagittal plane coincides with the direction of the sagittal axis, the short axis direction Y projected onto the sagittal plane coincides with the direction of the vertical axis, and the thickness direction Z is perpendicular to the sagittal plane. In this way, the sound generating unit 11 is prevented from blocking the ear canal, freeing both ears of the user, and the contact area between the sound generating unit 11 and the ear unit 100 is increased, improving the wearing comfort of the earphone 10.

[0050] In some embodiments, in the worn state, the projection of the earphone 10 onto the sagittal plane may cover the user's ear canal or at least partially cover the user's ear canal, for example, the projection of the sound generating unit 11 onto the sagittal plane may be in the cavity of the concha 102 (for example, the position shown by the dotted frame B in FIG. 2) and may contact the crus helix 1071 and / or the helix 107. At this time, the sound generating unit 11 is at least partially within the cavity of the concha 102 and in an inclined state, the projection of the short axis direction Y of the sound generating unit 11 onto the sagittal plane may have a certain included angle with the direction of the sagittal axis, that is, the short axis direction Y is also installed at an inclination, the projection of the long axis direction X onto the sagittal plane may have a certain included angle with the direction of the sagittal axis, that is, the long axis direction X is also installed at an inclination, and the thickness direction Z is perpendicular to the sagittal plane. At this time, since the cavity of the concha 102 has a certain volume and depth, there is a certain gap between the inner surface IS of the earphone 10 and the cavity of the concha, and the ear canal can communicate with the outside through the gap between the inner surface IS and the cavity of the concha to release both ears of the user. At the same time, the sound generating unit 11 can engage with the cavity of the concha to form an auxiliary cavity (e.g., a cavity structure described later) that communicates with the ear canal. In some embodiments, the sound emission hole 112 may be at least partially within the aforementioned auxiliary cavity, and the sound emitted from the sound emission hole 112 is restricted by the aforementioned auxiliary cavity, that is, the aforementioned auxiliary cavity can collect the sound and transmit more sound into the ear canal, thereby improving the volume and quality of the sound heard by the user in the near field and improving the acoustic effect of the earphone 10.

[0051] The above description of the earphone 10 is for illustrative purposes only and is not intended to limit the scope of the present application. Those skilled in the art can make various changes and modifications based on the description of the present application. For example, the earphone 10 may further include a battery assembly, a Bluetooth® assembly, etc., or a combination thereof. The battery assembly can provide power to the earphone 10. The Bluetooth® assembly can wirelessly connect the earphone 10 to other devices (e.g., mobile phones, computers, etc.). These changes and modifications are still within the scope of protection of the present application.

[0052] FIG. 3 is a schematic diagram of two point sound sources and a listening position according to some embodiments of the present specification. In some embodiments, as shown in FIG. 3, sound can be transmitted to the outside of the earphone 10 through a sound outlet 112, which can be regarded as a monopole sound source (or a point sound source) A generating a first sound, and sound can be transmitted to the outside of the earphone 10 through a decompression hole 113, which can be regarded as a monopole sound source (or a point sound source) B generating a second sound. The second sound and the first sound may be in opposite or nearly in opposite phase, so that they can be cancelled in opposite phase in the far field, i.e., form an "acoustic dipole" to reduce sound leakage. In some embodiments, a line connecting the two monopole sound sources may be directed toward the ear canal (denoted as "listening position") so that the user can hear a sufficiently loud sound when wearing the earphone. The magnitude of the sound pressure at the listening position (denoted as Pear) can represent the strength of the sound heard by the user (i.e., the listening sound pressure in the near field). Furthermore, the magnitude of the sound pressure (denoted as Pfar) on a sphere centered on the user's listening position (or on a sphere with a radius r and the center of the dipole sound source (A and B shown in FIG. 3) as the center) can be statistically calculated to represent the strength of the sound leakage radiated by the earphone 10 to the far field (i.e., the sound pressure of the far field sound leakage). Pfar can be obtained by various statistical methods, for example, by taking the average value of the sound pressure at each point on the sphere, or by performing a surface integral on the sound pressure distribution at each point on the sphere.

[0053] It should be noted that the measurement method of sound leakage in this specification is merely an illustrative explanation of the principle and effect, and is not limited thereto, and the measurement method and calculation method of sound leakage can be reasonably adjusted according to the actual situation. For example, the center of the dipole sound source is taken as the center of the circle, and the sound pressure amplitudes of two or more points are selected and averaged based on a certain spatial angle in the far field. In some embodiments, the measurement method of listening may be to select a position point near the point sound source as the listening position, and the sound pressure amplitude measured at the listening position is taken as the listening value. In some embodiments, the listening position may be on a line connecting two point sound sources, or may not be on a line connecting two point sound sources. The measurement method and calculation method of listening can be reasonably adjusted according to the actual situation, for example, to average the sound pressure amplitudes of other points or one or more points in the near field position. Also, for example, a certain point sound source is taken as the center of the circle, and the sound pressure amplitudes of two or more points are selected and averaged based on a certain spatial angle in the near field. In some embodiments, the distance between the near-field listening position and the point sound source is much smaller than the distance between the point sound source and the far-field sound leakage measurement sphere.

[0054] Naturally, the sound pressure Pear transmitted from the earphone 10 to the user's ear should be sufficiently large to improve the listening effect, and the far-field sound pressure Pfar should be sufficiently small to improve the sound leakage reduction effect. Therefore, the sound leakage index α can be used as an index to evaluate the sound leakage reduction ability of the earphone 10.

[0055]

number

[0056] As can be seen from equation (1), the smaller the sound leakage index, the higher the sound leakage reduction capability of the earphones, and the smaller the far-field sound leakage will be when the near-field listening volume at the listening position is the same.

[0057] FIG. 4 is a comparison diagram of sound leakage index at different frequencies of a single point sound source and a dual point sound source according to some embodiments of the present specification. The dual point sound source (also called dipole sound source) in FIG. 4 may be a typical dual point sound source, that is, the interval is constant, and the two point sound sources have the same amplitude and opposite phase. It should be noted that the use of a typical dual point sound source is only for the purpose of explaining the principle and effect, and the parameters of each point sound source can be adjusted according to actual needs to have a certain difference from the typical dual point sound source. As shown in FIG. 4, when the interval is constant, the sound leakage generated by the dual point sound source increases with increasing frequency, and the sound leakage reduction ability decreases with increasing frequency. When the frequency is greater than a certain frequency value (for example, about 8000Hz shown in FIG. 4), the generated sound leakage is greater than the sound leakage generated by a single point sound source, and this frequency (for example, 8000Hz) is the upper limit frequency at which the dual point sound source can reduce sound leakage.

[0058] In some embodiments, a baffle may be installed between the sound outlet 112 and the decompression outlet 113 to improve the acoustic output effect of the earphone 10, i.e., to increase the sound intensity at the near-field listening position and reduce the volume of far-field sound leakage.

[0059] FIG. 5 is an exemplary distribution schematic diagram when a baffle is installed between two dipole sound sources according to some embodiments of the present specification. As shown in FIG. 5, when a baffle is installed between a point sound source A1 and a point sound source A2, in the near field, the sound wave of the point sound source A2 can only interfere with the sound wave of the point sound source A1 at the listening position by bypassing the baffle, which corresponds to an increase in the acoustic distance from the point sound source A2 to the listening position. Therefore, assuming that the point sound source A1 and the point sound source A2 have the same amplitude, the amplitude difference between the sound waves of the point sound source A1 and the point sound source A2 at the listening position is larger than when the baffle is not installed, so that the degree to which the sounds of the two paths are offset at the listening position is reduced and the volume at the listening position is increased. In the far field, the sound waves generated by the point sound source A1 and the point sound source A2 can interfere with each other in a wide spatial range without bypassing the baffle (similar to when there is no baffle), so the far field sound leakage is not obviously increased compared to when there is no baffle. Therefore, by installing a baffle structure around one of the point sound sources A1 and A2, the sound volume at the near-field listening position can be significantly increased without significantly increasing the far-field sound leakage volume.

[0060] FIG. 6 is a diagram showing the sound leakage index when a baffle is installed between two sound sources of a dipole sound source and when a baffle is not installed, according to some embodiments of the present specification. After adding a baffle between the double point sound sources, the near field corresponds to an increase in the distance between the two point sound sources, and the sound volume at the listening position in the near field corresponds to that generated by the double point sound source with a large distance between the sound sources, so the listening volume in the near field is obviously increased compared to when there is no baffle. In the far field, the sound field of the two point sound sources is less affected by the baffle, and the sound leakage generated corresponds to that generated by the double point sound source with a small distance between the sound sources. Therefore, as shown in FIG. 6, after the baffle is added, the sound leakage index is much smaller than when there is no baffle, that is, when the listening volume is the same, the far field sound leakage is smaller than when there is no baffle, and the sound leakage reduction ability is obviously improved.

[0061] Fig. 7 is a schematic diagram of an example wearing of an earphone according to some embodiments of the present disclosure. Fig. 8 is a schematic diagram of the ear side of the earphone shown in Fig. 7. Fig. 9 is a schematic diagram of the housing of the earphone shown in Fig. 7.

[0062] As shown in Fig. 7, the ear hook 12 has an arc-shaped structure that fits the boundary between the user's head and the ear unit 100. The sound generating unit 11 (or the housing 111 of the sound generating unit 11) may have a connection end CE that is connected to the ear hook 12 and a free end FE that is not connected to the ear hook 12. When the earphone 10 is in a worn state, the first part 121 of the ear hook 12 (e.g., the hook-shaped part of the ear hook 12) is hooked between the user's auricle (e.g., the helix 107) and the head, and the second part 122 of the ear hook 12 (e.g., the connection part of the ear hook) extends to the side of the auricle facing away from the head and is connected to the connection end CE of the sound generating unit 11, so that the sound generating unit 11 is worn in a position near the ear canal without blocking the ear canal.

[0063] As shown in Fig. 7 and Fig. 8, the sound generating unit 11 may have an inner side surface IS (also called the inner side surface of the housing 111) facing the ear part along the thickness direction Z when worn, an outer side surface OS (also called the outer side surface of the housing 111) facing away from the ear part, and a connecting surface connecting the inner side surface IS and the outer side surface OS. When observed from the direction in which the coronal axis is located (i.e., the thickness direction Z) when worn, the sound generating unit 11 may be shaped as a circle, an ellipse, a square with rounded corners, a rectangle with rounded corners, or the like. When the sound generating unit 11 is shaped as a circle, an ellipse, or the like, the connecting surface may refer to an arc-shaped side surface of the sound generating unit 11, and when the sound generating unit 11 is shaped as a square with rounded corners, a rectangle with rounded corners, or the like, the connecting surface may include a lower side surface LS (also called the lower side surface of the housing 111), an upper side surface US (also called the upper side surface of the housing 111), and a rear side surface RS (also called the rear side surface of the housing 111) to be described later. The upper side surface US and the lower side surface LS may refer to a side surface facing away from the ear canal 101 along the short axis direction Y of the sound generating unit 11 in a worn state and a side surface close to the ear canal 101, respectively, and the rear side surface RS may refer to a side surface facing the back of the head along the length direction X of the sound generating unit 11 in a worn state. For convenience of explanation, in this specification, an example is given in which the sound generating unit 11 is shaped like a rounded rectangle. The length of the sound generating unit 11 in the long axis direction X may be greater than the width of the sound generating unit 11 in the short axis direction Y. In some embodiments, in order to improve the aesthetics and wearing comfort of the earphone, the rear side surface RS of the earphone may be a circular arc surface.

[0064] A transducer may be installed in the sound generating unit 11, which can convert an electrical signal into a corresponding mechanical vibration to generate sound. The transducer (e.g., a diaphragm) may divide the housing 111 into a front cavity and a rear cavity of the earphone. The sounds generated in the front cavity and the rear cavity are in opposite phase. The inner surface IS is formed with a sound output hole 112 communicating with the front cavity, so that the sound generated in the front cavity can be guided out of the housing 111 and transmitted to the ear canal so that the user can hear the sound. One or more decompression holes 113 communicating with the rear cavity may be formed on other sides of the housing 111 (e.g., the outer surface OS, the upper surface US, or the lower surface LS, etc.), so that the sound generated in the rear cavity is guided out of the housing 111 and then interferes with and cancels out the sound leaking through the sound output hole 112 in the far field. In some embodiments, the decompression hole 113 is farther away from the ear canal than the sound output hole 112, thereby reducing anti-phase cancellation at the listening position (e.g., in the ear canal) between the sound output through the decompression hole 113 and the sound output through the sound output hole 112, thereby increasing the volume of the sound at the listening position.

[0065] In some embodiments, in addition to the inner surface IS, at least two decompression holes 113 may be formed on other sides of the housing 111 (e.g., the outer surface OS, the upper surface US, or the lower surface LS, etc.), and by providing at least two decompression holes 113, the standing wave in the rear cavity can be destroyed to increase the resonance frequency of the sound emitted from the decompression holes 113 to the outside of the housing 111 as much as possible, so that the frequency response of the rear cavity has a wide flat region (e.g., the region before the resonance peak) and a higher sound leakage reduction effect is obtained in the mid-high frequency range (e.g., 2kHz to 6kHz). By way of example only, the decompression holes 113 may include a first decompression hole 1131 and a second decompression hole 1132. The second decompression hole 1132 may be closer to the sound emission hole 112 than the first decompression hole 1131. In some embodiments, the first decompression hole 1131 and the second decompression hole 1132 may be located on the same side of the housing 111, for example, both the first decompression hole 1131 and the second decompression hole 113 may be located on the outer side OS, the upper side US, or the lower side LS. In some embodiments, the first decompression hole 1131 and the second decompression hole 1132 may be located on two different sides of the housing 111, for example, the first decompression hole 1131 may be located on the outer side OS and the second decompression hole 1132 may be located on the upper side US, or the first decompression hole 1131 may be located on the outer side OS and the second decompression hole 1132 may be located on the lower side LS. In some embodiments, in order to maximally destroy standing waves in the rear cavity, the two decompression holes 113 may be located on opposite sides of the housing 111, for example, the first decompression hole 1131 may be located on the upper side US, and the second decompression hole 1132 may be located on the lower side LS. For convenience of explanation, this specification will exemplarily explain that the first decompression hole 1131 is located on the upper side US, and the second decompression hole 1132 is located on the lower side LS.

[0066] In some embodiments, in order to prevent the sound output from the first decompression hole 1131 and the second decompression hole 1132 from affecting the volume of the sound output from the sound output hole 112 at the listening position, the first decompression hole 1131 and the second decompression hole 1132 should be as far away from the sound output hole 112 as possible, and for example, the center of the sound output hole 112 may be set to be located on or near the perpendicular bisecting plane of the line connecting the center of the first decompression hole 1131 and the center of the second decompression hole 1132. In some embodiments, the center of the sound output hole 112 may be 0 mm to 2 mm away from the perpendicular bisecting plane of the line connecting the center of the first decompression hole 1131 and the center of the second decompression hole 1132. In some embodiments, further, in order to avoid the sound emitted from the second decompression hole 1132 and the sound emitted from the sound emission hole 112 being offset in antiphase in the ear canal (i.e., the listening position) and reducing the listening volume, the area of ​​the second decompression hole 1132 can be reduced to weaken the intensity of the sound derived from the second decompression hole 1132 and transmitted to the ear canal, and in this case, the area of ​​the second decompression hole 1132 may be smaller than the area of ​​the first decompression hole 1131 (as shown in FIG. 17 ).

[0067] In some embodiments, as shown in Fig. 7, when the earphone 10 is in a worn state, the long axis direction X of the sound generating unit 11 may be set horizontally or approximately horizontally (similar to position C shown in Fig. 2), in which the sound generating unit 11 is at least partially located in the antihelix 105, and the free end FE of the sound generating unit 11 may be directed toward the back of the head. When the sound generating unit 11 is in a horizontal or approximately horizontal state, the projection of the long axis direction X of the sound generating unit 11 onto the sagittal plane may coincide with the direction of the sagittal axis, the projection of the short axis direction Y onto the sagittal plane may coincide with the direction of the vertical axis, and the thickness direction Z is perpendicular to the sagittal plane.

[0068] In some embodiments, to improve the fit between the earphone 10 and the ear portion 100 and to improve the wearing stability of the earphone 10, the inner surface IS of the housing 111 may be pressed against a surface of the ear portion 100 (e.g., the antihelix 105) to increase the resistance of the earphone 10 to being removed from the ear portion 100.

[0069] In some embodiments, as shown in Fig. 7 and Fig. 8, when the earphone 10 is pressed against the ear part 100, the projection of the sound emission hole 112 on the inner surface IS may partially or entirely overlap with the projection of the inner concave structure of the ear part (e.g., the concha nave 103) on the sagittal plane so that the sound emission hole 112 on the inner surface IS is not blocked by the ear part tissue. In some embodiments, since the concha nave 103 communicates with the concha cavity 102 and the ear canal is located within the concha cavity 102, when at least a part of the projection of the sound emission hole 112 on the sagittal plane is located within the concha nave 103, the sound output from the sound emission hole 112 can reach the ear canal without hindrance, so that the volume of sound received in the ear canal is large. In some embodiments, the major axis dimension of the sound generating unit 11 should not be too long. If it is too long, the projection of the free end FE on the sagittal plane exceeds the projection of the ear part on the sagittal plane, which affects the fitting effect of the sound generating unit 11 and the ear part. Therefore, the major axis dimension of the sound generating unit 11 can be designed so that the projection of the free end FE onto the sagittal plane does not exceed the projection of the helix 107 onto the sagittal plane.

[0070] In addition, the sound emission hole 112 and the decompression hole 113 (for example, the first decompression hole 1131 and the second decompression hole 1132) are installed in the housing 111, and since each side wall of the housing 111 has a constant thickness, the sound emission hole 112 and the decompression hole 113 are holes with a constant depth. In this case, the sound emission hole 112 and the decompression hole 113 may each have an inner opening and an outer opening. For convenience of explanation, in this application, the center O of the sound emission hole 112 above and below may refer to the centroid of the outer opening of the sound emission hole 112, and the center of the decompression hole 113 above and below may refer to the centroid of the outer opening of the decompression hole 113 (for example, the center O1 of the first decompression hole 1131 may refer to the centroid of the outer opening of the first decompression hole 1131, and the center O2 of the second decompression hole 1132 may refer to the centroid of the outer opening of the second decompression hole 1132). In this specification, for convenience of explanation, the area of ​​the sound emission hole 112 and the decompression hole 113 (for example, the first decompression hole 1131 and / or the second decompression hole 1132) may refer to the area of ​​the outer opening of the sound emission hole 112 and the decompression hole 113 (for example, the area of ​​the outer opening of the inner side IS of the sound emission hole 112, the area of ​​the outer opening of the upper side US of the first decompression hole 1131, and the area of ​​the outer opening of the lower side LS of the second decompression hole 1132). Note that, in some other embodiments, the area of ​​the sound emission hole 112 and the decompression hole 113 may refer to the area of ​​other cross sections of the sound emission hole 112 and the decompression hole 113, for example, the area of ​​the inner opening of the sound emission hole 112 and / or the decompression hole 113, or the average value of the area of ​​the inner opening and the area of ​​the outer opening of the sound emission hole 112 and / or the decompression hole 113.

[0071] In some embodiments, the sound emission hole 112 communicating with the front cavity can be regarded as a point sound source A1 shown in Fig. 5, the decompression hole 113 (e.g., the first decompression hole 1131 and / or the second decompression hole 1132) communicating with the rear cavity can be regarded as a point sound source A2 shown in Fig. 5, and the ear canal can be regarded as a listening position shown in Fig. 5. At least a part of the housing of the sound generating unit 11 and / or at least a part of the pinna can be regarded as a baffle shown in Fig. 5, thereby increasing the difference in acoustic distance to the ear canal between the sound emission hole 112 and the first decompression hole 1131 and / or the second decompression hole 1132, thereby increasing the intensity of the sound in the ear canal and maintaining the effect of reducing far-field sound leakage. When the earphone 10 uses the structure shown in FIG. 7, that is, when at least a part of the housing 111 is located on the antihelix 105, in terms of the listening effect, the sound waves of the sound output hole 112 can reach the ear canal directly, and in this case, the sound output hole 112 may be located close to the lower side surface LS of the inner side surface IS, and at least one decompression hole may be located away from the sound output hole 112, for example, the first decompression hole 1131 may be located away from the sound output hole 112 on the outer side surface OS or the upper side surface US. The sound waves of the first decompression hole 1131 can only interfere with the sound waves of the sound output hole 112 in the ear canal by bypassing the outside of the sound generating unit 11. In addition, the upwardly convex and downwardly concave structure of the pinna (for example, the antihelix, the tragus, etc. in the transmission path) also increases the acoustic distance over which the sound of the first decompression hole 1131 is transmitted to the ear canal. Therefore, the sound generating unit 11 itself and / or at least a part of the pinna corresponds to a baffle between the sound output hole 112 and the first decompression hole 1131, and the baffle increases the acoustic distance from the first decompression hole 1131 to the ear canal and increases the intensity of the sound wave of the first decompression hole 1131 in the ear canal, thereby decreasing the degree to which the sounds emitted from the sound output hole 112 and the first decompression hole 1131 are offset in the ear canal, and increasing the volume in the ear canal. Regarding the sound leakage reduction effect, the sound waves generated by the sound output hole 112, the first decompression hole 1131 and / or the second decompression hole 1132 can interfere in a wide spatial range without bypassing the sound generating unit 11 itself (similar to the case where there is no baffle), so that sound leakage does not obviously increase.Therefore, by placing the sound emission hole 112, the first decompression hole 1131 and the second decompression hole 1132 in appropriate positions, the volume in the ear canal can be significantly increased without significantly increasing the sound leakage volume.

[0072] In some embodiments, when the projection of the free end FE on the sagittal plane does not exceed the projection of the helix 107 on the sagittal plane, the first and second decompression holes 1131 and 1132 may be distributed approximately symmetrically with respect to the long axis central plane of the sound generating unit 11 (for example, the inward surface NN′ perpendicular to the paper surface as shown in FIG. 8 ) in order to facilitate production and manufacturing. In some embodiments, the difference between the distance a2 from the center O2 of the second decompression hole 1132 on the lower surface LS to the rear surface RS and the distance a1 from the center O1 of the first decompression hole 1131 on the upper surface US to the rear surface RS is less than 10%. In some embodiments, the difference between the distance a2 from the center O2 of the second decompression hole 1132 on the lower surface LS to the rear surface RS and the distance a1 from the center O1 of the first decompression hole 1131 on the upper surface US to the rear surface RS is less than 5%. In some embodiments, the difference between the distance a2 from the center O2 of the second decompression hole 1132 on the lower side surface LS to the rear side surface RS and the distance a1 from the center O1 of the first decompression hole 1131 on the upper side surface US to the rear side surface RS is less than 2%. Note that in some embodiments, in order to improve the aesthetics and wearing comfort of the earphone, the rear side surface RS of the earphone may be an arc surface. When the rear side surface RS is an arc surface, the distance from a specific position (for example, the center O1 of the first decompression hole 1131) to the rear side surface RS may refer to the distance from the position to a tangent plane parallel to the short axis of the rear side surface RS.

[0073] In some embodiments, since the sound output hole 112 is installed close to the ear canal, the second decompression hole 1132 of the lower side surface LS should be installed as far away from the sound output hole 112 as possible, so that the canceling effect between the sound emitted from the second decompression hole 1132 and the sound emitted from the sound output hole 112 at the listening position (i.e., the ear canal) is reduced, and the volume at the listening position is increased. Therefore, when the sound output hole 112 is installed close to the lower side surface LS and the connecting end CE, the second decompression hole 1132 can be installed close to the rear side surface RS to increase the distance between the sound output hole 112 and the second decompression hole 1132 as much as possible. In some embodiments, when the projection of the free end FE on the sagittal plane does not exceed the projection of the helix 107 on the sagittal plane, the distance a2 from the center O2 of the second decompression hole 1132 to the rear side surface RS may be in the range of 8.60 mm to 20.27 mm. In some embodiments, the distance a2 from the center O2 of the second decompression hole 1132 to the rear side surface RS may range from 8.60 mm to 12.92 mm. In some embodiments, the distance a2 from the center O2 of the second decompression hole 1132 to the rear side surface RS may range from 9.60 mm to 11.92 mm. In some embodiments, when the earphone 10 is in a worn state, the free end FE may come into contact with the ear part (e.g., the helix 107), so that a part of the upper side surface US and / or the lower side surface LS is blocked by the ear part, and at this time, the second decompression hole 1132 of the lower side surface LS (or the first decompression hole 1131 of the upper side surface US) is blocked by the ear part 100, so that the range of the distance a2 from the center O2 of the second decompression hole 1132 to the rear side surface RS may range from 10.10 mm to 11.42 mm to avoid affecting the acoustic performance of the earphone 10. More preferably, the distance a2 from the center O2 of the second decompression hole 1132 to the rear side surface RS may be in the range of 10.30 mm to 11.12 mm. More preferably, the distance a2 from the center O2 of the second decompression hole 1132 to the rear side surface RS may be in the range of 10.60 mm to 11.82 mm.

[0074] In some embodiments, when the difference between the distance a2 from the center O2 of the second decompression hole 1132 to the rear side surface RS and the distance a1 from the center O1 of the first decompression hole 1131 to the rear side surface RS is less than 10%, the distance a1 from the center O1 of the first decompression hole 1131 to the rear side surface RS may be in the range of 8.60 mm to 15.68 mm. In some embodiments, the distance a1 from the center O1 of the first decompression hole 1131 to the rear side surface RS may be in the range of 8.60 mm to 12.92 mm. In some embodiments, the distance a1 from the center O1 of the first decompression hole 1131 to the rear side surface RS may be in the range of 9.60 mm to 11.92 mm so that the majority of the projection of the first decompression hole 1131 onto the sagittal plane overlaps with the projection of the inner recess structure of the ear onto the sagittal plane. Preferably, the distance a1 from the center O1 of the first decompression hole 1131 to the rear side surface RS may be in the range of 10.10 mm to 11.42 mm. More preferably, the distance a1 from the center O1 of the first decompression hole 1131 to the rear side surface RS may be in the range of 10.30 mm to 11.12 mm. More preferably, the distance a1 from the center O1 of the first decompression hole 1131 to the rear side surface RS may be in the range of 10.60 mm to 11.82 mm.

[0075] In some embodiments, the first decompression hole 1131 may be farther from the sound output hole 112 than the second decompression hole 1132, and since the gap between the ear part 100 and the inner surface IS is small, the sound generated by the first decompression hole 1131 is less likely to be transmitted to the ear canal than the second decompression hole 1132. Therefore, in some embodiments, the distance from the center O1 of the first decompression hole 1131 to the rear side surface RS may be smaller than the distance from the center O2 of the second decompression hole 1132 to the rear side surface RS. For example, the range of the distance from the center O1 of the first decompression hole 1131 to the rear side surface RS is 10.44 mm to 15.68 mm, and the range of the distance from the center O2 of the second decompression hole 1132 to the rear side surface RS is 13.51 mm to 20.27 mm.

[0076] In some embodiments, as shown in FIG. 9, the sound generation efficiency of the earphone 10 (i.e., the listening volume at the listening position) can be improved by increasing the dimension in the thickness direction Z of the earphone 10 to increase the acoustic distance from the first decompression hole 1131 and / or the second decompression hole 1132 to the ear canal. Furthermore, by locating the first decompression hole 1131 and / or the second decompression hole 1132 away from the inner surface IS, the acoustic distance from the first decompression hole 1131 and / or the second decompression hole 1132 to the ear canal can be further increased, and the sound generation efficiency of the earphone 10 can be improved. In addition, the overall dimension of the sound generating unit 11 is limited not to be too large (e.g., the dimension of the sound generating unit 11 in the Z direction should not be too large), otherwise the overall mass of the earphone 10 will increase, affecting the wearing comfort of the user. In some embodiments, the range of the distance d1 from the center O1 of the first decompression hole 1131 to the inner surface IS is 4.24 mm to 7.96 mm. In some embodiments, the distance d1 from the center O1 of the first decompression hole 1131 to the inner surface IS ranges from 4.43 mm to 7.96 mm. In some embodiments, the distance d1 from the center O1 of the first decompression hole 1131 to the inner surface IS ranges from 5.43 mm to 6.96 mm. In some embodiments, the first decompression hole 1131 and / or the second decompression hole 1132 may be disposed away from the inner surface IS in order to achieve the purpose of transmitting the sound output from the first decompression hole 1131 and / or the second decompression hole 1132 to the ear canal or to radiate more sound to the outside without transmitting the sound to the ear canal by reflecting and refracting the sound through a part of the structure of the ear unit 100 (e.g., the pinna) in the worn state. Such an arrangement can further increase the acoustic distance from the first decompression hole 1131 and / or the second decompression hole 1132 to the ear canal, improving the sound generation efficiency of the earphone 10. In some embodiments, the distance d1 from the center O1 of the first decompression hole 1131 to the inner surface IS ranges from 5.63 mm to 7.96 mm.In some embodiments, the distance d1 from the center O1 of the first decompression hole 1131 to the inner surface IS is in the range of 6.25 mm to 7.56 mm.

[0077] In some embodiments, the distance d2 from the center O2 of the second decompression hole 1132 to the inner surface IS may be the same as the distance d1 from the center O1 of the first decompression hole 1131 to the inner surface IS. In some embodiments, the distance d2 from the center O2 of the second decompression hole 1132 to the inner surface IS ranges from 4.43 mm to 7.96 mm. In some embodiments, the distance d2 from the center O2 of the second decompression hole 1132 to the inner surface IS ranges from 5.43 mm to 6.96 mm. In some embodiments, the distance d2 from the center O2 of the second decompression hole 1132 to the inner surface IS ranges from 5.63 mm to 7.96 mm. In some embodiments, the distance d2 from the center O2 of the second decompression hole 1132 to the inner surface IS ranges from 6.25 mm to 7.56 mm.

[0078] In some embodiments, in order to increase the sound volume at the listening position by bringing the sound emission hole 112 closer to the ear canal, it is necessary to bring the sound emission hole 112 closer to the lower surface LS. In this case, the second decompression hole 1132 is closer to the inner surface IS than the first decompression hole 1131. In order to increase the sound volume at the listening position (i.e., the ear canal) by reducing the canceling effect between the sound emitted from the second decompression hole 1132 and the sound emitted from the sound emission hole 112, the second decompression hole 1132 may be farther from the inner surface IS than the first decompression hole 1131 in the Z direction, i.e., the distance d2 from the center O2 of the second decompression hole 1132 to the inner surface IS may be different from the distance d1 from the center O1 of the first decompression hole 1131 to the inner surface IS. For example, the range of the distance d1 from the center O1 of the first decompression hole 1131 to the inner side surface IS is 5.63 mm to 6.5 mm, and the range of the distance d2 from the center O2 of the second decompression hole 1132 to the inner side surface IS is 6.5 mm to 7.56 mm.

[0079] The above description of the earphone 10 is merely for illustration and is not intended to limit the scope of the present application. Those skilled in the art can make various changes and modifications based on the description of the present application. For example, when only one decompression hole is provided in the sound generating unit 11, the decompression hole may be either the first decompression hole 1131 or the second decompression hole 1132. For example, the decompression hole may be the first decompression hole 1131, that is, the decompression hole may be provided on the upper side surface US. The distance from the center of the decompression hole to the inner side surface IS may range from 4.24 mm to 7.96 mm, and the distance from the center of the decompression hole to the rear side surface RS may range from 8.60 mm to 15.68 mm. These changes and modifications are still within the scope of protection of the present application.

[0080] In some embodiments, a cavity structure can be configured around one of the dual point sound sources to increase the listening volume, especially the listening volume of the mid-low frequency, while maintaining the cancellation effect of the far-field sound leakage. Figure 10 is an exemplary distribution schematic diagram of a cavity structure installed around one of the dipole sound sources according to some embodiments of the present specification.

[0081] As shown in FIG. 10, when the cavity structure 41 is installed between the dipole sound sources, one of the dipole sound sources and the listening position are inside the cavity structure 41, and the other of the dipole sound sources is outside the cavity structure 41. The sound derived from the dipole sound source inside the cavity structure 41 is restricted by the cavity structure 41, that is, the cavity structure 41 can improve the volume and quality of the sound at the listening position by collecting the sound and transmitting more sound to the listening position. In the present application, the "cavity structure" may be understood as a semi-closed structure surrounded by the side wall of the sound generating unit 11 and the concha structure, and the semi-closed structure does not completely seal the inside and isolate it from the external environment, but has a leak structure 42 (e.g., an opening, a gap, a tube, etc.) that acoustically communicates with the external environment. Exemplary leak structures may include, but are not limited to, an opening, a gap, a tube, etc., or any combination thereof.

[0082] In some embodiments, the cavity structure 41 may include a listening position and at least one sound source. Here, "including" may indicate that at least one of the listening position and the sound source is inside the cavity, or at the edge of the inside of the cavity. In some embodiments, the listening position may be the opening of the ear canal or the acoustic reference point of the ear.

[0083] 11A is a schematic diagram of a dipole sound source structure according to some embodiments of the present specification, and a listening principle when a cavity structure is configured around one of the dipole sound sources. FIG. 11B is a schematic diagram of a dipole sound source structure according to some embodiments of the present specification, and a sound leakage principle when a cavity structure is configured around one of the dipole sound sources.

[0084] For near-field listening, as shown in FIG. 11A, in a dipole in which a cavity structure is constructed around one of the sound sources, the sound source A is surrounded by the cavity structure, so most of the radiated sound reaches the listening position by direct or reflected methods. In contrast, if there is no cavity structure, most of the sound radiated from the sound source does not reach the listening position. Therefore, by installing a cavity structure, the volume of the sound reaching the listening position is significantly increased. Also, only a small part of the anti-phase sound radiated from the anti-phase sound source B outside the cavity structure enters the cavity structure through the leakage structure of the cavity structure. This corresponds to the generation of a secondary sound source B' in the leakage structure, which has an intensity significantly smaller than that of the sound source B and significantly smaller than that of the sound source A. The sound generated by the secondary sound source B' has a low effect of anti-phase cancellation with the sound source A in the cavity, thereby significantly increasing the listening volume at the listening position.

[0085] Regarding sound leakage, as shown in Fig. 11B, sound source A radiating sound to the outside through the leaking structure of the cavity is equivalent to secondary sound source A' being generated in the leaking structure, and since most of the sounds radiated from sound source A are output from the leaking structure and the structural scale of the cavity is much smaller (at least one order of magnitude smaller) than the spatial scale for evaluating sound leakage, it is considered that the strength of secondary sound source A' is equivalent to the strength of sound source A. The canceling effect of the sounds generated by secondary sound source A' and sound source B in the external space is equivalent to the canceling effect of the sounds generated by sound source A and sound source B. That is, in the cavity structure, a certain degree of sound leakage reduction effect is still maintained.

[0086] It should be noted that the above leakage structure with one opening is merely exemplary, and the leakage structure of the cavity structure may include one or more openings and achieve a good listening index, and the listening index may refer to the inverse of the sound leakage index α, 1 / α. Taking a structure with two openings as an example, the cases of equal openings and equal opening ratios will be analyzed below. Compared with a structure with only one opening, "equal openings" here refers to the installation of two openings with the same dimensions as the structure with only one opening, and "equal opening ratio" refers to the sum of the opening areas of the two holes installed being the same as that of the structure with only one hole. The equal openings correspond to a doubling of the relative opening size of the structure with only one hole (i.e., the ratio between the opening area S of the leakage structure of the cavity structure and the area S0 directly affected by the sound source contained in the cavity structure), and as described above, the overall listening index is reduced. Even if the S / S0 ratio is the same as that of a structure with only one hole when the aperture ratio is equal, the listening index is different because the distances from the two openings to the external sound source are different.

[0087] FIG. 12A is a schematic diagram of a cavity structure with two horizontal openings according to some embodiments of the present specification. FIG. 12B is a schematic diagram of a cavity structure with two vertical openings according to some embodiments of the present specification. As shown in FIG. 12A, when the line connecting the two openings is parallel to the line connecting the two sound sources (i.e., two horizontal openings), the distances from the two openings to the external sound source are maximum and minimum, respectively, and as shown in FIG. 12B, when the line connecting the two openings is perpendicular (i.e., two vertical openings), the distances from the two openings to the external sound source are equal and take an intermediate value.

[0088] FIG. 13 is a comparison diagram of the listening index curves of a cavity structure with two openings and a cavity structure with one opening according to some embodiments of the present disclosure. As shown in FIG. 13, the cavity structure with equal openings has a lower overall listening index than the cavity structure with one opening. For the cavity structure with equal opening ratio, the listening index is different because the distances from the two openings to the external sound source are different. As can be seen from FIG. 12A, FIG. 12B and FIG. 13, the listening index of the leak structure with equal opening ratio is higher than that of the leak structure with equal opening ratio, whether it is a horizontal opening or a vertical opening. This is because the relative opening size S / S0 of the leak structure with equal opening ratio is reduced to 1 / 2 compared to the leak structure with equal opening ratio, resulting in a higher listening index. Also, as can be seen from FIG. 12A, FIG. 12B and FIG. 13, the listening index of the horizontal opening is higher whether it is a leak structure with equal opening ratio or a leak structure with equal opening ratio. This is because the distance from one opening of the horizontal opening leakage structure to the external sound source is smaller than the distance between the two sound sources, and the distance between the secondary sound source thus formed and the external sound source is closer than the distance between the original two sound sources, resulting in a higher listening index and improved sound leakage reduction effect. Therefore, in order to improve the sound leakage reduction effect, the distance from at least one opening to the external sound source may be made smaller than the distance between the two sound sources.

[0089] Also, as shown in FIG. 13, compared with a cavity structure using one opening, a cavity structure using two openings can better increase the resonance frequency of the air sound in the cavity structure, so that the whole device has a higher listening index in the high frequency band (e.g., sounds with frequencies close to 10,000 Hz) compared with a cavity structure with only one opening. The high frequency band is a frequency band in which the human ear is more sensitive, so there is a greater need for sound leakage reduction. Therefore, in order to improve the sound leakage reduction effect in the high frequency band, a cavity structure with the number of openings greater than one can be selected.

[0090] Fig. 14 is an exemplary schematic diagram of an earphone according to some other embodiments of the present application. Fig. 15 is a schematic diagram of the earphone shown in Fig. 14 from the side facing the ear.

[0091] The earphone 10 shown in FIG. 14 has a structure similar to that of the earphone 10 shown in FIG. 7, and for example, the ear hook 12 has an arc-shaped structure that fits the boundary between the user's head and the ear unit 100. The sound generating unit 11 (or the housing 111 of the sound generating unit 11) may have a connection end CE connected to the ear hook 12 and a free end FE that is not connected to the ear hook 12. When the earphone 10 is in a worn state, the first part 121 of the ear hook 12 (for example, the hook-shaped part of the ear hook 12) is hooked between the user's auricle (for example, the helix 107) and the head, and the second part 122 of the ear hook 12 (for example, the connection part of the ear hook) extends to the side of the auricle facing away from the head and is connected to the connection end CE of the sound generating unit 11, so that the sound generating unit 11 is worn in a position near the ear canal without blocking the ear canal. 14 has a similar structure to the earphone 10 shown in Fig. 7, but differs mainly in that the sound generating unit 11 is installed at an angle, and at least a portion of the housing 111 of the sound generating unit 11 is inserted into the cavity of the concha 102, and for example, the free end FE of the sound generating unit 11 is inserted into the cavity of the concha 102. The ear hook 12 and sound generating unit 11 having such a structure are highly compatible with the user's ear part 100, and by increasing the resistance of the earphone 10 to coming off the ear part 100, the wearing stability of the earphone 10 can be improved.

[0092] In some embodiments, when observed from the thickness direction Z in the worn state, the connection end CE of the sound generating unit 11 is closer to the top of the head than the free end FE so that the free end FE enters the cavity of the concha. Based on this, the included angle between the long axis direction X and the direction in which the sagittal axis of the human body is located may be 15° to 60°. If the included angle is too small, it is likely to cause the free end FE to be unable to enter the cavity of the concha and the sound output hole 112 of the sound generating unit 11 to be too far from the ear canal, and if the included angle is too large, it is likely to cause the sound generating unit 11 to be unable to enter the cavity of the concha and the ear canal to be blocked by the sound generating unit 11. In other words, by installing in this way, the sound generating unit 11 can enter the cavity of the concha and the distance between the sound output hole 112 of the sound generating unit 11 and the ear canal can be made appropriate, so that the ear canal is not blocked and the user can hear more of the sound generated by the sound generating unit 11.

[0093] In some embodiments, the sound generating unit 11 and the ear hook 12 may clamp the ear region corresponding to the cavity of the concha from both the front and rear sides of the ear region, thereby increasing the resistance of the earphone 10 to come off from the ear and improving the stability of the earphone 10 when worn. For example, the free end FE of the sound generating unit 11 is pressed into the cavity of the concha in the thickness direction Z. Also, for example, the free end FE abuts against the cavity of the concha in the long axis direction X and the short axis direction Y.

[0094] In some embodiments, both ends of the second portion 122 of the ear hook 12 may be connected to the first portion 121 of the ear hook 12 and the connection end CE of the sound generating unit 11, respectively (as shown in FIG. 15). In some embodiments, the second portion 122 of the ear hook 12 may have a lowest point P and a highest point Q along the short axis direction Y of the sound generating unit 11. When the earphone 10 is in a worn state, a distance h1 between the center of the first decompression hole 1131 and the lowest point P in the long axis direction X of the sound generating unit 11 may be 5.28 mm to 7.92 mm so that the first decompression hole 1131 is not blocked by an ear structure (e.g., the helix or the tragus). In some embodiments, when a user wears the earphone 10, a distance h2 between the center of the first decompression hole 1131 and the highest point Q in the long axis direction X of the sound generating unit 11 may be 8.68 mm to 13.02 mm so that the earphone can fit the user's ear. In some embodiments, when the user is wearing the earphones, the range of the distance between the center of the first decompression hole 1131 and any point on the second part 122 of the ear hook 12 in the long axis direction X of the sound generating unit 11 is 5.28 mm to 14 mm. In some embodiments, the range of the distance between the center of the first decompression hole 1131 and any point on the second part 122 of the ear hook in the long axis direction X of the sound generating unit 11 is 5.28 mm to 13.02 mm. In some embodiments, the range of the distance between the center of the first decompression hole 1131 and any point on the second part 122 of the ear hook in the long axis direction X of the sound generating unit 11 is 6.58 mm to 12.02 mm. In some embodiments, the range of the distance between the center of the first decompression hole 1131 and any point on the second part 122 of the ear hook in the long axis direction X of the sound generating unit 11 is 7.58 mm to 10.02 mm. In some embodiments, the range of the distance between the center of the first decompression hole 1131 and any point on the second earhook portion 122 in the long axis direction X of the sound generating unit 11 is 8.58 mm to 9.02 mm.

[0095] As shown in FIG. 14, when a user is wearing the earphone 10, by positioning the housing 111 of the sound generating unit 11 so that at least a portion of it is inserted into the cavity of the concha 102, the cavity surrounded by the inner surface IS of the sound generating unit 11 and the cavity of the concha 102 can be regarded as the cavity structure 41 shown in FIG. 10, and the gap formed between the inner surface IS and the cavity of the concha (for example, a first leakage structure UC formed between the inner surface IS and the cavity of the concha close to the top of the head, and a second leakage structure LC formed between the inner surface IS and the ear close to the ear canal) can be regarded as the leakage structure 42 shown in FIG. 10. The sound emission hole 112 provided on the inner surface IS can be regarded as a point sound source inside the cavity structure 41 shown in Fig. 10, and the decompression holes 113 (for example, the first decompression hole 1131 and the second decompression hole 1132) provided on the other side surfaces (for example, the upper surface US and / or the lower surface LS) of the sound generating unit 11 can be regarded as a point sound source outside the cavity structure 41 shown in Fig. 10. As a result, according to the related description of Figs. 10 to 13, when the earphone 10 is worn in a manner in which at least a part of it is inserted into the concha cavity, that is, when it is worn in the manner shown in Fig. 14, in terms of the listening effect, most of the sound radiated from the sound emission hole 112 can reach the ear canal in a manner of direct radiation or reflection, and the volume of the sound reaching the ear canal, especially the listening volume of the mid-low frequency can be significantly increased. Also, only a small portion of the antiphase sound radiated from the decompression holes 113 (e.g., the first decompression holes 1131 and the second decompression holes 1132) enters the cavity of the concha through the gaps (the first leakage structure UC and the second leakage structure LC), and the effect of antiphase cancellation with the sound output hole 112 is low, thereby significantly increasing the listening volume in the ear canal. Regarding the sound leakage reduction effect, the sound output hole 112 can output sound to the outside through the gap, and the output sound and the sound generated by the decompression holes 113 (e.g., the first decompression holes 1131 and the second decompression holes 1132) are cancelled out in the far field, thereby ensuring the sound leakage reduction effect.

[0096] In some embodiments, in order to prevent the sound output from the first decompression hole 1131 and the second decompression hole 1132 from affecting the volume of the sound output from the sound output hole 112 at the listening position, the first decompression hole 1131 and the second decompression hole 1132 should be as far away from the sound output hole 112 as possible. For example, the center of the sound output hole 112 may be set to be located on the perpendicular bisecting plane of the line connecting the center of the first decompression hole 1131 and the center of the second decompression hole 1132 or near the perpendicular bisecting plane. In some embodiments, the center of the sound output hole 112 may be 0 mm to 2 mm away from the perpendicular bisecting plane of the line connecting the center of the first decompression hole 1131 and the center of the second decompression hole 1132. In some embodiments, the center of the sound output hole 112 may be 0 mm to 1 mm away from the perpendicular bisecting plane of the line connecting the center of the first decompression hole 1131 and the center of the second decompression hole 1132. In some embodiments, the center of the sound emission hole 112 may be 0 mm to 0.5 mm away from the perpendicular bisector of the line connecting the center of the first decompression hole 1131 and the center of the second decompression hole 1132.

[0097] In some embodiments, by determining the relationship between the distance (also referred to as the first distance) between the center O1 of the first decompression hole 1131 and the center O of the sound emission hole 112 and the distance (also referred to as the second distance) between the center O2 of the second decompression hole 1132 and the center O of the sound emission hole 112, the center O of the sound emission hole 112 can be located approximately on the perpendicular bisecting plane of the connecting line O1O2. In some embodiments, the difference between the first distance and the second distance is less than 10%. In some embodiments, the difference between the first distance and the second distance is less than 8%. In some embodiments, the difference between the first distance and the second distance is less than 5%. In some embodiments, the difference between the first distance and the second distance is less than 2%.

[0098] In some embodiments, in order to avoid that sound waves emitted from the decompression holes (e.g., the first decompression hole 1131 and the second decompression hole 1132) and sound waves emitted from the sound emission hole 112 are offset in the near field and affect the listening quality of the user, the distance between the first decompression hole 1131 and the second decompression hole 1132 and the sound emission hole 112 should not be too close. In some embodiments, the distance between the center O1 of the first decompression hole 1131 and the center O of the sound emission hole 112 may be 4 mm to 15.11 mm. In some embodiments, the distance between the center O1 of the first decompression hole 1131 and the center O of the sound emission hole 112 may be 4 mm to 15 mm. In some embodiments, the distance between the center O1 of the first decompression hole 1131 and the center O of the sound emission hole 112 may be 5.12 mm to 15.11 mm. In some embodiments, the distance between the center O1 of the first decompression hole 1131 and the center O of the sound emission hole 112 may be 5 mm to 14 mm. In some embodiments, the distance between the center O1 of the first decompression hole 1131 and the center O of the sound emission hole 112 may be 6 mm to 13 mm. In some embodiments, the distance between the center O1 of the first decompression hole 1131 and the center O of the sound emission hole 112 may be 7 mm to 12 mm. In some embodiments, the distance between the center O1 of the first decompression hole 1131 and the center O of the sound emission hole 112 may be 8 mm to 10 mm.

[0099] In some embodiments, the distance between the center O2 of the second decompression hole 1132 and the center O of the sound emission hole 112 may be 4 mm to 16.1 mm. In some embodiments, the distance between the center O2 of the second decompression hole 1132 and the center O of the sound emission hole 112 may be 4 mm to 15 mm. In some embodiments, the distance between the center O2 of the second decompression hole 1132 and the center O of the sound emission hole 112 may be 5 mm to 14 mm. In some embodiments, the distance between the center O2 of the second decompression hole 1132 and the center O of the sound emission hole 112 may be 5.12 mm to 16.1 mm. In some embodiments, the distance between the center O2 of the second decompression hole 1132 and the center O of the sound emission hole 112 may be 6 mm to 13 mm. In some embodiments, the distance between the center O2 of the second decompression hole 1132 and the center O of the sound emission hole 112 may be 7 mm to 12 mm. In some embodiments, the distance between the center O2 of the second decompression hole 1132 and the center O of the sound emission hole 112 may be 8 mm to 10 mm.

[0100] In some embodiments, in order to reduce the influence of the decompression holes on the sound output from the sound output hole, both the first decompression hole 1131 and the second decompression hole 1132 are preferably located as far away from the sound output hole 112. Therefore, in order to make both the first decompression hole 1131 and the second decompression hole 1132 located away from the sound output hole 112, the ratio of the distance from the center O of the sound output hole 112 to the center O1 of the first decompression hole 1131 to the distance from the center O of the sound output hole 112 to the center O2 of the second decompression hole 1132 is within a range of 0.9 to 1.1. In some embodiments, the ratio of the distance from the center O of the sound output hole 112 to the center O1 of the first decompression hole 1131 to the distance from the center O of the sound output hole 112 to the center O2 of the second decompression hole 1132 is within a range of 0.92 to 1.08. In some embodiments, the ratio of the distance from the center O of the sound emission hole 112 to the center O1 of the first decompression hole 1131 to the distance from the center O of the sound emission hole 112 to the center O2 of the second decompression hole 1132 is in the range of 0.94 to 1.06. In some embodiments, the ratio of the distance from the center O of the sound emission hole 112 to the center O1 of the first decompression hole 1131 to the distance from the center O of the sound emission hole 112 to the center O2 of the second decompression hole 1132 is in the range of 0.96 to 1.04.

[0101] In some embodiments, to further prevent the sound emitted from the second decompression hole 1132 from cancelling out the sound emitted from the sound output hole 112 in the ear canal (i.e., the listening position) and lowering the listening volume, the area of ​​the second decompression hole 1132 can be reduced to weaken the intensity of the sound emitted from the second decompression hole 1132 and transmitted to the ear canal, and in this case, the area of ​​the second decompression hole 1132 may be smaller than the area of ​​the first decompression hole 1131 (shown in FIG. 17 ).

[0102] In some embodiments, in order to maximize the distance between the first decompression hole 1131 or the second decompression hole 1132 and the sound emission hole 112, the included angle between the line O1O connecting the center O1 of the first decompression hole 1131 and the center O of the sound emission hole 112 and the line O2O connecting the center O2 of the second decompression hole 1132 and the center O of the sound emission hole 112 can be reduced. In some embodiments, the angle between the connecting line O1O and the connecting line O2O is in the range of 46.40° to 114.04°. In some embodiments, the angle between the connecting line O1O and the connecting line O2O is in the range of 46.40° to 90.40°. In some embodiments, the angle between the connecting line O1O and the connecting line O2O is in the range of 46.40° to 70.04°. In some embodiments, the angle between the connecting line O1O and the connecting line O2O ranges from 46.40° to 60.04°.

[0103] In some embodiments, the angle between the line O1O2 connecting the center O1 of the first decompression hole 1131 and the center O2 of the second decompression hole 1132 and the connecting line O2O is in the range of 19.72° to 101.16°. In some embodiments, the angle between the connecting line O1O2 and the connecting line O2O is in the range of 19.71° to 97.75°.

[0104] FIG. 16 is a schematic diagram of a sagittal plane projection of an earphone in a worn position, according to some embodiments herein.

[0105] In some embodiments, as shown in Fig. 14 and Fig. 16, in order to stably attach the sound generating unit 11 to the user's ear, easily configure the cavity structure shown in Fig. 10, and provide the cavity structure with at least two leak structures, the free end FE may abut in the long axis direction X and the short axis direction Y, and at this time, the inner surface IS of the sound generating unit 11 is inclined with respect to the sagittal plane, and at this time, between the inner surface IS of the sound generating unit and the concha cavity, there are at least a first leak structure UC (i.e., a gap formed between the concha cavity and the upper boundary of the inner surface IS) close to the top of the head and a second leak structure LC (i.e., a gap formed between the concha cavity and the lower boundary of the inner surface IS) close to the ear canal. This can increase the listening volume, especially the listening volume of the mid-low frequency, while still maintaining the effect of canceling far-field sound leakage, thereby improving the acoustic output performance of the earphone 10.

[0106] In some embodiments, when the earphone 10 is worn in the wearing manner shown in FIG. 14, the first leakage structure UC and the second leakage structure LC formed between the inner surface IS of the sound generating unit 11 and the concha cavity have a certain scale in both the long axis direction X and the thickness direction Z. In some embodiments, in order to easily understand the positions of the first leakage structure UC and the second leakage structure LC, the midpoint of two points formed by intersecting the upper boundary / lower boundary of the inner surface IS of the earphone 10 in the worn state with the ear part (for example, the side wall of the concha cavity, the helical crus) can be set as the position reference point of the first leakage structure UC and the second leakage structure LC. In some embodiments, in order to easily understand the positions of the first leakage structure UC and the second leakage structure LC, when the earphone 10 is worn, the midpoint of the upper boundary of the inner surface IS can be set as the position reference point of the first leakage structure UC, and a trisection point close to the free end FE of the lower boundary of the inner surface IS (hereinafter, abbreviated as the 1 / 3 point of the lower boundary of the inner surface IS) can be set as the position reference point of the second leakage structure LC.

[0107] In addition, when the boundary between the inner surface IS and the upper surface US and / or the lower surface LS is arc-shaped, the midpoint of the upper boundary of the inner surface IS of the sound generating unit 11 may be selected by the following exemplary method: A projected contour along the thickness direction Z of the sound generating unit 11 may be determined, two first positioning points on the sound generating unit 11 that have the largest vertical distance from the short-axis central plane of a magnetic circuit assembly (e.g., a magnetic circuit assembly 1144 described later) of the transducer along the long axis direction X and are closest to the upper surface US may be determined, the projected contour of the sound generating unit 11 between the two first positioning points may be determined to be the projected line of the upper boundary of the inner surface IS, or a line segment on the sound generating unit 11 that is closest to the inner surface IS and whose projection completely overlaps with the projected line of the upper boundary of the inner surface IS may be determined as the upper boundary of the inner surface IS. In some alternative embodiments, when one or more side surfaces (e.g., inner surface IS, upper surface US, and / or lower surface LS) of the sound generating unit 11 are arc surfaces, the intersection line between a tangent plane parallel to the XY plane (plane formed by the major axis direction X and the minor axis direction Y) of the inner surface IS and a tangent plane parallel to the ZX plane (plane formed by the thickness direction Z and the major axis direction X) of the upper surface US may be determined to be the upper boundary of the inner surface IS. The midpoint of the upper boundary of the inner surface IS may be the intersection point of the upper boundary of the inner surface IS and the minor axis central plane of the magnetic circuit assembly. The minor axis central plane of the magnetic circuit assembly refers to a plane that is parallel to the minor axis direction Y and the thickness direction Z of the sound generating unit 11 and passes through the central axis of the magnetic circuit assembly.

[0108] Similarly, the 1 / 3 point of the lower boundary of the inner surface IS of the sound-generating unit 11 may be selected in the following exemplary manner: A projected contour along the thickness direction Z of the sound-generating unit 11 may be determined, two second positioning points on the sound-generating unit 11 that have the largest vertical distance from the short-axis central plane of the magnetic circuit assembly along the long axis direction X and are closest to the lower surface LS may be determined, the projected contour of the sound-generating unit 11 between the two second positioning points may be determined to be a projected line of the lower boundary of the inner surface IS, and a line segment on the sound-generating unit 11 that is closest to the inner surface IS and whose projection completely overlaps with the projected line of the lower boundary of the inner surface IS may be determined as the lower boundary of the inner surface IS. In some alternative embodiments, when one or more side surfaces (e.g., inner surface IS, upper surface US, and / or lower surface LS) of the sound generating unit 11 are arc surfaces, the intersection line between a tangent plane parallel to the YX plane (a plane formed by the short axis direction Y and the long axis direction X) of the inner surface IS and a tangent plane parallel to the ZX plane (a plane formed by the thickness direction Z and the long axis direction X) of the lower surface LS may be determined to be the lower boundary of the inner surface IS. The 1 / 3 point of the lower boundary of the inner surface IS may be the intersection point of the lower boundary of the inner surface IS and a trisection plane adjacent to the free end FE of the magnetic circuit assembly. The trisection plane adjacent to the free end FE of the magnetic circuit assembly refers to a plane that is parallel to the short axis direction Y and the thickness direction Z of the sound generating unit 11 and passes through the trisection point adjacent to the free end FE of the long axis of the magnetic circuit assembly.

[0109] As a mere example, in this specification, the midpoint of the upper boundary and 1 / 3 of the lower boundary of the inner surface IS are taken as the position reference points of the first leakage structure UC and the second leakage structure LC, respectively. Note that the selected midpoint of the upper boundary and 1 / 3 of the lower boundary of the inner surface IS are merely exemplary reference points for describing the positions of the first leakage structure UC and the second leakage structure LC. In some embodiments, other reference points may be selected to describe the positions of the first leakage structure UC and the second leakage structure LC. For example, since the ear parts of different users are different, the first leakage structure UC / second leakage structure LC formed when the earphone 10 is in a wearing state becomes a gap whose width gradually changes, and at this time, the reference position of the first leakage structure UC / second leakage structure LC may be a position of the upper boundary / lower boundary of the inner surface IS that is close to the area where the gap width is the largest. For example, the 1 / 3 point close to the free end FE of the upper boundary of the inner surface IS may be taken as the position of the first leakage structure UC, and the midpoint of the lower boundary of the inner surface IS may be taken as the position of the second leakage structure LC.

[0110] In some embodiments, as shown in Figs. 14 to 16, when the earphone 10 is worn, a part or all of the projection of the sound emitting hole 112 onto the sagittal plane is placed within the region of the cavity of the concha, and the sound emitting hole 112 can be placed as close to the ear canal as possible in order to increase the intensity of the sound in the ear canal (i.e., the listening position) of the sound emitting hole 112. In some embodiments, the range of the distance h from the center O of the sound emitting hole 112 to the lower side surface LS of the sound generating unit 11 along the Y direction is 4.05 mm to 6.05 mm. In some embodiments, the range of the distance h from the center O of the sound emitting hole 112 to the lower side surface LS of the sound generating unit 11 along the Y direction is 4.50 mm to 5.85 mm. In some embodiments, the range of the distance h from the center O of the sound emitting hole 112 to the lower side surface LS of the sound generating unit 11 along the Y direction is 4.80 mm to 5.50 mm. In some embodiments, the range of the distance h from the center O of the sound output hole 112 to the lower side surface LS of the sound generating unit 11 along the Y direction is 5.20 mm to 5.55 mm.

[0111] In some embodiments, in order to insert at least a part of the sound generating unit 11 into the cavity of the concha, the major axis dimension of the sound generating unit 11 must not be too long. On the premise that at least a part of the sound generating unit 11 is guaranteed to be inserted into the cavity of the concha, the distance from the center O of the sound emitting hole 112 to the rear side surface RS of the sound generating unit 11 along the X direction must not be too close, otherwise the area of ​​the sound emitting hole may be blocked by the abutment between the free end FE and the wall surface of the cavity of the concha, and the effective area of ​​the sound emitting hole may be reduced. Therefore, in some embodiments, the range of the distance from the center O of the sound emitting hole 112 to the rear side surface RS of the sound generating unit 11 along the X direction is 8.15 mm to 12.25 mm. In some embodiments, the range of the distance from the center O of the sound emitting hole 112 to the rear side surface RS of the sound generating unit 11 along the X direction is 8.50 mm to 12.00 mm. In some embodiments, the range of the distance from the center O of the sound emitting hole 112 to the rear side surface RS of the sound generating unit 11 along the X direction is 8.85 mm to 11.65 mm. In some embodiments, the range of the distance from the center O of the sound emitting hole 112 to the rear side surface RS of the sound generating unit 11 along the X direction is 9.25 mm to 11.15 mm. In some embodiments, the range of the distance from the center O of the sound emitting hole 112 to the rear side surface RS of the sound generating unit 11 along the X direction is 9.60 mm to 10.80 mm.

[0112] In some embodiments, as shown in Fig. 16, the projection of the upper boundary of the medial surface IS onto the sagittal plane may overlap with the projection of the upper surface US onto the sagittal plane, and the projection of the lower boundary of the medial surface IS onto the sagittal plane may overlap with the projection of the lower surface LS onto the sagittal plane. The projection of the position reference point of the first leak structure UC (i.e., the midpoint of the upper boundary of the medial surface IS) onto the sagittal plane is point A, the projection of the position reference point of the second leak structure LC (i.e., the 1 / 3 point of the lower boundary of the medial surface IS) onto the sagittal plane is point C, the projection of the center O of the sound emission hole 112 onto the sagittal plane is point O', the projection of the center O1 of the first decompression hole 1131 onto the sagittal plane is point O1', and the projection of the center O2 of the second decompression hole 1132 onto the sagittal plane is point O2'.

[0113] As shown in Fig. 16, in some embodiments, in the worn state, the projection of the sound generating unit 11 of the earphone 10 onto the sagittal plane may at least partially cover the user's ear canal, but the ear canal can be communicated with the outside via the cavity of the concha, thereby freeing both ears of the user. In some embodiments, the sound output hole 112 outputs sound to the outside via the first leak structure UC and the second leak structure LC, and is offset in the far field with the sound output from the first decompression hole 1131 and / or the second decompression hole 1132. Therefore, in order to ensure the sound leakage offset effect, it is necessary to rationally design the distance between the sound output hole 112 and the first decompression hole 1131 / second decompression hole 1132 and the first leak structure UC and the second leak structure LC. In some embodiments, in order to ensure the sound intensity in the ear canal, the sound output hole 112 needs to be closer to the ear canal when the earphone is in the worn state, so the sound output hole 112 can be located closer to the lower side surface LS than the upper side surface US, that is, the sound output hole 112 can be located away from the first leak structure UC. In addition, considering that the greater the distance from the sound output hole 112 to the first leak structure UC, the larger the required width dimension of the sound generating unit 11 may be, and at this time, the volume V of the cavity structure formed between the sound generating unit 11 and the concha cavity becomes larger, and the listening index of the entire earphone 10 (within the entire frequency band range) may become smaller accordingly. This is because, due to the influence of the air-sound resonance in the cavity structure, air-sound resonance occurs in the cavity structure at the resonant frequency of the cavity structure, which radiates a sound much louder outward than the decompression hole, and the sound leakage increases significantly, and the listening index becomes significantly smaller near the resonant frequency.

[0114] Therefore, in some embodiments, on the premise that at least a part of the sound generating unit 11 is inserted into the cavity of the concha, the sound emitting hole 112 is placed close to the ear canal, and the cavity structure is provided with an appropriate volume V to improve the sound collection effect of the ear canal. In some embodiments, the range of the distance from the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane to the projection point A of the midpoint of the upper boundary of the inner surface IS onto the sagittal plane may be 10.0 mm to 15.2 mm. In some embodiments, the range of the distance from the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane to the projection point A of the midpoint of the upper boundary of the inner surface IS onto the sagittal plane is 11.0 mm to 14.2 mm. In some embodiments, the range of the distance from the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane to the projection point A of the midpoint of the upper boundary of the inner surface IS onto the sagittal plane is 12.0 mm to 14.7 mm. In some embodiments, the range of the distance from the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane to the projection point A of the midpoint of the upper boundary of the inner surface IS onto the sagittal plane is 12.5 mm to 14.2 mm. In some embodiments, the range of the distance from the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane to the projection point A of the midpoint of the upper boundary of the inner surface IS onto the sagittal plane is 13.0 mm to 13.7 mm.

[0115] In some embodiments, sound leaking from the sound output hole 112 through the first leak structure UC corresponds to the generation of a secondary sound source in the first leak structure UC. In order to ensure a cancellation effect in the far field between the sound output from the first decompression hole 1131 and the sound leaking from the sound output hole 112 through the first leak structure UC, the first decompression hole 1131 can be installed closer to the first leak structure UC. In some embodiments, the first decompression hole 1131 can be installed closer to the first leak structure UC than the sound output hole 112, that is, the distance from the center O of the sound output hole 112 to the midpoint of the upper boundary of the inner surface IS is made larger than the distance from the center O1 of the first decompression hole 1131 to the midpoint of the upper boundary of the inner surface IS, thereby improving the sound leakage cancellation effect when the intensity of the sound in the ear canal is guaranteed. In some embodiments, the ratio of the distance from the center O of the sound emitting hole 112 to the midpoint of the upper boundary of the inner surface IS to the distance from the center O1 of the first decompression hole 1131 to the midpoint of the upper boundary of the inner surface IS is in the range of 1.3 to 2.1. In some embodiments, the ratio of the distance from the center O of the sound emitting hole 112 to the midpoint of the upper boundary of the inner surface IS to the distance from the center O1 of the first decompression hole 1131 to the midpoint of the upper boundary of the inner surface IS is in the range of 1.4 to 2.0. In some embodiments, the ratio of the distance from the center O of the sound emitting hole 112 to the midpoint of the upper boundary of the inner surface IS to the distance from the center O1 of the first decompression hole 1131 to the midpoint of the upper boundary of the inner surface IS is in the range of 1.5 to 1.9. In some embodiments, the ratio of the distance from the center O of the sound emitting hole 112 to the midpoint of the upper boundary of the inner surface IS to the distance from the center O1 of the first decompression hole 1131 to the midpoint of the upper boundary of the inner surface IS is in the range of 1.6 to 1.8.

[0116] In some embodiments, the projection O1' of the center O1 of the first decompression hole 1131 onto the sagittal plane may substantially overlap with the projection A of the midpoint of the upper boundary of the medial surface IS onto the sagittal plane. In some embodiments, the range of the distance from the projection O1' of the center O1 of the first decompression hole 1131 onto the sagittal plane to the projection A of the midpoint of the upper boundary of the medial surface IS onto the sagittal plane is 2 mm or less. In some embodiments, the range of the distance from the projection O1' of the center O1 of the first decompression hole 1131 onto the sagittal plane to the projection A of the midpoint of the upper boundary of the medial surface IS onto the sagittal plane is 1 mm or less. In some embodiments, the range of the distance from the projection O1' of the center O1 of the first decompression hole 1131 onto the sagittal plane to the projection A of the midpoint of the upper boundary of the medial surface IS onto the sagittal plane is 0.5 mm or less.

[0117] In some embodiments, the greater the distance from the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane to the projection point C of the 1 / 3 point of the lower boundary of the inner surface IS onto the sagittal plane, the greater the volume V of the cavity structure. Therefore, on the premise that at least a part of the sound generating unit 11 is inserted into the cavity of the concha, the sound emitting hole 112 is placed close to the ear canal, the cavity structure is provided with an appropriate volume V, and in order to improve the sound collection effect of the ear canal, in some embodiments, the range of the distance from the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane to the projection point C of the 1 / 3 point of the lower boundary of the inner surface IS onto the sagittal plane is 3.5 mm to 5.6 mm. In some embodiments, the range of the distance from the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane to the projection point C of the 1 / 3 point of the lower boundary of the inner surface IS onto the sagittal plane is 3.9 mm to 5.2 mm. In some embodiments, the range of the distance from the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane to the projection point C of the 1 / 3 point of the lower boundary of the inner surface IS onto the sagittal plane is 4.3 mm to 4.8 mm. In some embodiments, the range of the distance from the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane to the projection point C of the 1 / 3 point of the lower boundary of the inner surface IS onto the sagittal plane is 4.5 mm to 4.6 mm.

[0118] In some embodiments, in order to reduce the sound of the second decompression hole 1132 being transmitted to the cavity structure through the second leakage structure LC and offsetting with the sound of the sound emission hole 112 by increasing the distance between the second decompression hole 1132 and the sound emission hole 112, the range of the distance from the projection point O2' of the center O2 of the second decompression hole 1132 onto the sagittal plane to the projection point C of the 1 / 3 point of the lower boundary of the inner surface IS onto the sagittal plane is 8.16 mm to 12.24 mm. In some embodiments, the range of the distance from the projection point O2' of the center O2 of the second decompression hole 1132 onto the sagittal plane to the projection point C of the 1 / 3 point of the lower boundary of the inner surface IS onto the sagittal plane is 9.16 mm to 11.24 mm. In some embodiments, the range of the distance from the projection point O2' of the center O2 of the second decompression hole 1132 onto the sagittal plane to the projection point C of the 1 / 3 point of the lower boundary of the medial surface IS onto the sagittal plane is 9.66 mm to 10.74 mm.

[0119] In some embodiments, the sound leaking from the sound output hole 112 through the second leak structure LC corresponds to the generation of a secondary sound source in the second leak structure LC. Considering that the second decompression hole 1132 is close to the ear canal opening, in order to reduce the degree to which the sound of the second decompression hole 1132 is transmitted to the cavity structure through the second leak structure LC and offsets with the sound of the sound output hole 112 in the ear canal, the distance from the second decompression hole 1132 to the 1 / 3 point of the lower boundary of the inner surface IS (i.e., the second leak structure LC) should not be too small. In addition, in order to ensure the offset effect in the far field between the sound output from the second decompression hole 1132 and the sound leaking from the sound output hole 112 through the second leak structure LC, the distance from the second decompression hole 1132 to the 1 / 3 point of the lower boundary of the inner surface IS (i.e., the second leak structure LC) should not be too large. In some embodiments, the ratio of the distance from the center O of the sound emitting hole 112 to the 1 / 3 point of the lower boundary of the inner surface IS (i.e., the second leakage structure LC) to the distance from the center O2 of the second decompression hole 1132 to the 1 / 3 point of the lower boundary of the inner surface IS (i.e., the second leakage structure LC) may be in the range of 0.65 to 1.05. In some embodiments, the ratio of the distance from the center O of the sound emitting hole 112 to the 1 / 3 point of the lower boundary of the inner surface IS to the distance from the center O2 of the second decompression hole 1132 to the 1 / 3 point of the lower boundary of the inner surface IS is in the range of 0.75 to 1. In some embodiments, the ratio of the distance from the center O of the sound emitting hole 112 to the 1 / 3 point of the lower boundary of the inner surface IS to the distance from the center O2 of the second decompression hole 1132 to the 1 / 3 point of the lower boundary of the inner surface IS is in the range of 0.8 to 0.9. In some embodiments, in order to reduce the degree to which the sound from the second decompression hole 1132 is transmitted to the cavity structure via the second leakage structure LC and offset with the sound from the sound output hole 112 in the ear canal, and to ensure an offset effect in the far field between the sound output from the second decompression hole 1132 and the sound leaking from the sound output hole 112 via the second leakage structure LC, the ratio of the distance from the center O of the sound output hole 112 to the 1 / 3 point of the lower boundary of the inner surface IS to the distance from the center O2 of the second decompression hole 1132 to the 1 / 3 point of the lower boundary of the inner surface IS is in the range of 0.82 to 0.88.

[0120] In some embodiments, the positional relationship between the center O of the sound emitting hole 112, the 1 / 3 point of the lower boundary of the inner surface IS, and the center O2 of the second decompression hole 1132 may be expressed by the ratio of the distance from the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane to the projection point C of the 1 / 3 point of the lower boundary of the inner surface onto the sagittal plane, and the distance from the projection point O2' of the center O2 of the second decompression hole 1132 onto the sagittal plane to the projection point C of the 1 / 3 point of the lower boundary of the inner surface onto the sagittal plane. In some embodiments, the ratio of the distance from the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane to the projection point C of the 1 / 3 point of the lower boundary of the inner surface onto the sagittal plane to the distance from the projection point O2' of the center O2 of the second decompression hole 1132 onto the sagittal plane to the projection point C of the 1 / 3 point of the lower boundary of the inner surface onto the sagittal plane is in the range of 0.28 to 0.68. In some embodiments, the ratio of the distance from the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane to the projection point C of the 1 / 3 point of the lower boundary of the inner surface onto the sagittal plane to the distance from the projection point O2' of the center O2 of the second decompression hole 1132 onto the sagittal plane to the projection point C of the 1 / 3 point of the lower boundary of the inner surface onto the sagittal plane is in the range of 0.33 to 0.59. In some embodiments, the ratio of the distance from the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane to the projection point C of the 1 / 3 point of the lower boundary of the inner surface onto the sagittal plane to the distance from the projection point O2' of the center O2 of the second decompression hole 1132 onto the sagittal plane to the projection point C of the 1 / 3 point of the lower boundary of the inner surface onto the sagittal plane is in the range of 0.38 to 0.51. In some embodiments, the ratio of the distance from the projection point O' of the center O of the sound emission hole 112 onto the sagittal plane to the projection point C of the 1 / 3 point of the lower boundary of the inner surface onto the sagittal plane to the distance from the projection point O2' of the center O2 of the second decompression hole 1132 onto the sagittal plane to the projection point C of the 1 / 3 point of the lower boundary of the inner surface onto the sagittal plane is in the range of 0.41 to 0.48.

[0121] In some embodiments, since the tragus is present near the ear canal opening, the sound output hole 112 is likely to be blocked by the tragus. In this case, the sound output hole 112 should be located as close to the ear canal as possible and should be kept as far away from the center of the ear canal opening as possible in order to avoid blocking the sound output hole 112. In some embodiments, for convenience of explanation, the positional relationship between a specific position (for example, the center O of the sound output hole 112) and the center of the ear canal opening may be expressed by the distance between the projection point of the position (for example, the center O of the sound output hole 112) onto the sagittal plane and the centroid of the projection of the ear canal opening onto the sagittal plane. For example, in some embodiments, the range of the distance from the projection point O' of the center O of the sound output hole 112 onto the sagittal plane to the centroid B of the projection of the ear canal opening onto the sagittal plane is 2.2 mm to 3.8 mm. In some embodiments, the range of the distance from the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane to the centroid B of the projection of the ear canal opening onto the sagittal plane is 2.4 mm to 3.6 mm. In some embodiments, the range of the distance from the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane to the centroid B of the projection of the ear canal opening onto the sagittal plane is 2.6 mm to 3.4 mm. In some embodiments, the range of the distance from the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane to the centroid B of the projection of the ear canal opening onto the sagittal plane is 2.8 mm to 3.2 mm. Note that the shape of the projection of the ear canal opening onto the sagittal plane can be considered to be approximately elliptical, and accordingly, the centroid of the projection of the ear canal opening onto the sagittal plane can be considered to be the geometric center of the ellipse.

[0122] In some embodiments, in order to ensure that the sound generating unit 11 enters the cavity of the concha and that there is an appropriate gap between the upper boundary of the medial surface IS and the cavity of the concha (forming an opening of the cavity structure), the range of the distance from the projection point A of the midpoint of the upper boundary of the medial surface IS onto the sagittal plane to the centroid B of the projection of the ear canal opening onto the sagittal plane is 12 mm to 18 mm, and the range of the distance from the projection point O2' of the center O2 of the second decompression hole onto the sagittal plane to the centroid B of the projection of the ear canal opening onto the sagittal plane is 6.88 mm to 10.32 mm. In some embodiments, the range of the distance from the projection point A of the midpoint of the upper boundary of the medial surface IS onto the sagittal plane to the centroid B of the projection of the ear canal opening onto the sagittal plane is 14 mm to 16 mm, and the range of the distance from the projection point O2' of the center O2 of the second decompression hole onto the sagittal plane to the centroid B of the projection of the ear canal opening onto the sagittal plane is 7.88 mm to 9.32 mm. In some embodiments, the range of the distance from the projection point A of the midpoint of the upper boundary of the medial surface IS onto the sagittal plane to the centroid B of the projection of the auditory canal opening onto the sagittal plane is 14.5 mm to 15.5 mm, and the range of the distance from the projection point O2' of the center O2 of the second decompression hole onto the sagittal plane to the centroid B of the projection of the auditory canal opening onto the sagittal plane is 7.88 mm to 8.32 mm.

[0123] In some embodiments, in order to ensure that the sound generating unit 11 enters the concha cavity and that there is an appropriate gap between the upper boundary of the medial surface IS and the concha cavity (forming an opening of the cavity structure), the range of the distance from the projection point O1' of the center O1 of the first decompression hole 1131 onto the sagittal plane to the centroid B of the projection of the ear canal opening onto the sagittal plane is 12 mm to 18 mm. In some embodiments, the range of the distance from the projection point O1' of the center O1 of the first decompression hole 1131 onto the sagittal plane to the centroid B of the projection of the ear canal opening onto the sagittal plane is 14 mm to 16 mm. In some embodiments, the range of the distance from the projection point O1' of the center O1 of the first decompression hole 1131 onto the sagittal plane to the centroid B of the projection of the ear canal opening onto the sagittal plane is 14.5 mm to 15.5 mm.

[0124] In some embodiments, in order to ensure that the sound generating unit 11 enters the cavity of the concha and that there is an appropriate gap between the upper boundary of the medial surface IS and the cavity of the concha (forming an opening of the cavity structure), the range of the distance from the projection point C of the 1 / 3 point of the lower boundary of the medial surface onto the sagittal plane to the centroid B of the projection of the ear canal opening onto the sagittal plane is 1.76 mm to 2.64 mm. In some embodiments, the range of the distance from the projection point C of the 1 / 3 point of the lower boundary of the medial surface onto the sagittal plane to the centroid B of the projection of the ear canal opening onto the sagittal plane is 1.96 mm to 2.44 mm. In some embodiments, the range of the distance from the projection point C of the 1 / 3 point of the lower boundary of the medial surface onto the sagittal plane to the centroid B of the projection of the ear canal opening onto the sagittal plane is 2.16 mm to 2.24 mm.

[0125] In some embodiments, in order to allow the sound generating unit 11 to enter the cavity of the concha, to prevent the first decompression hole 1131 from being blocked by the ear structure, and to place the sound emitting hole 112 as close as possible to the ear canal and not to block it, the ratio of the distance from the center O of the sound emitting hole 112 to the center of the ear canal opening and the distance from the center O1 of the first decompression hole 1131 to the center of the ear canal opening can be set within an appropriate range. Accordingly, the ratio of the distance from the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane to the centroid B of the projection of the ear canal opening onto the sagittal plane and the distance from the projection point O1' of the center O1 of the first decompression hole 1131 onto the sagittal plane to the centroid B of the projection of the ear canal opening onto the sagittal plane can be set within an appropriate range. In some embodiments, the ratio of the distance from the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane to the centroid B of the projection of the ear canal opening onto the sagittal plane to the distance from the projection point O1' of the center O1 of the first decompression hole 1131 onto the sagittal plane to the centroid B of the projection of the ear canal opening onto the sagittal plane may be within a range of 0.10 to 0.35. In some embodiments, the ratio of the distance from the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane to the centroid B of the projection of the ear canal opening onto the sagittal plane to the distance from the projection point O1' of the center O1 of the first decompression hole 1131 onto the sagittal plane to the centroid B of the projection of the ear canal opening onto the sagittal plane is within a range of 0.15 to 0.28. In some embodiments, the ratio of the distance from the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane to the centroid B of the projection of the ear canal opening onto the sagittal plane to the distance from the projection point O1' of the center O1 of the first decompression hole 1131 onto the sagittal plane to the centroid B of the projection of the ear canal opening onto the sagittal plane is in the range of 0.18 to 0.25. In some embodiments, the ratio of the distance from the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane to the centroid B of the projection of the ear canal opening onto the sagittal plane to the distance from the projection point O1' of the center O1 of the first decompression hole 1131 onto the sagittal plane to the centroid B of the projection of the ear canal opening onto the sagittal plane is in the range of 0.19 to 0.22.

[0126] As shown in Figs. 14 to 16, in some embodiments, on the premise that at least a part of the sound generating unit 11 is inserted into the concha cavity, in order to position a part or all of the projection of the sound emitting hole 112 onto the sagittal plane within the concha cavity region, when the user is wearing the earphone 10, the range of the distance between the center O of the sound emitting hole 112 and the upper apex M of the ear hook 12 is 22.5 mm to 34.5 mm. In some embodiments, when the user is wearing the open type earphone, the upper apex of the ear hook 12 may be the position on the outer contour of the ear hook where the distance in the vertical axis direction to a specific point on the user's neck is the largest, for example, the apex M shown in Fig. 14. In some embodiments, the upper apex of the ear hook 12 may be the highest point along the vertical axis of the user on the inner contour of the ear hook in the worn state. In some embodiments, when the user is wearing the earphone 10, the range of the distance between the center O of the sound emitting hole 112 and the upper apex M of the ear hook 12 is 25 mm to 32 mm. In some embodiments, when the user wears the earphone 10, the range of the distance between the center O of the sound emitting hole 112 and the upper apex M of the ear hook 12 is 27.5 mm to 29.5 mm. In some embodiments, when the user wears the earphone 10, the range of the distance between the center O of the sound emitting hole 112 and the upper apex M of the ear hook 12 is 28 mm to 29 mm. In some embodiments, when the user wears the earphone 10, the range of the distance between the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane and the projection point M' of the upper apex M of the ear hook 12 onto the sagittal plane is 18 mm to 30 mm. In some embodiments, when the user wears the earphone 10, the range of the distance between the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane and the projection point M' of the upper apex M of the ear hook 12 onto the sagittal plane is 20 mm to 25 mm. In this specification, when the earphones are worn, the distance between the projection point O' of the center O of the sound hole 112 onto the sagittal plane and a specific point (e.g., the projection point M' of the upper vertex M of the ear hook 12 onto the sagittal plane) can be determined by the following exemplary method.In the worn state, multiple components of the earphone 10 (e.g., the sound generating unit 11, the first ear hook part 121, and the second ear hook part 122) can be fixed to the stabilizing member using a fixing member or adhesive, and then the human head model and the pinna structure can be removed, and at this time, the earphone 10 fixed to the stabilizing member is shown facing the ear, and its posture is the same as that in the worn state. At this time, the position of the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane can be determined. Furthermore, the distance between the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane and the specific point can be determined.

[0127] In some embodiments, in order to prevent the sound generating unit 11 from blocking the first decompression hole 1131 when entering the concha, the distance from the center O1 of the first decompression hole 1131 to the upper apex M of the ear hook 12 must not be too small. Also, when at least a part of the sound generating unit 11 can enter the concha, the distance from the center O1 of the first decompression hole 1131 to the upper apex M of the ear hook 12 must not be too large. In some embodiments, the range of the distance from the center O1 of the first decompression hole 1131 to the upper apex M of the ear hook 12 is 16.15 mm to 24.25 mm. In some embodiments, the range of the distance from the center O1 of the first decompression hole 1131 to the upper apex M of the ear hook 12 is 17.55 mm to 23.25 mm. In some embodiments, the distance from the center O1 of the first decompression hole 1131 to the upper apex M of the ear hook 12 ranges from 19.55 mm to 20.55 mm. In some embodiments, the positional relationship between the center O1 of the first decompression hole 1131 and the upper apex M of the ear hook 12 may be represented by the distance between the projection point O1' of the center O1 of the first decompression hole 1131 onto the sagittal plane and the projection point M' of the upper apex M of the ear hook 12 onto the sagittal plane. For example, in some embodiments, the distance from the projection point O1' of the center O1 of the first decompression hole 1131 onto the sagittal plane to the projection point M' of the upper apex M of the ear hook 12 onto the sagittal plane ranges from 15.83 mm to 23.75 mm. In some embodiments, the distance from the projection point O1' of the center O1 of the first decompression hole 1131 onto the sagittal plane to the projection point M' of the upper apex M of the ear hook 12 onto the sagittal plane ranges from 18 mm to 20 mm.

[0128] In some embodiments, in the wearing method shown in FIG. 14, the ratio of the distance from the center O of the sound emitting hole 112 to the upper apex M of the ear hook 12 to the distance from the center O1 of the first decompression hole 1131 to the upper apex M of the ear hook 12 is in the range of 1.10 to 1.70. In some embodiments, when the user wears the earphone 10, the ratio of the distance from the center O of the sound emitting hole 112 to the upper apex M of the ear hook 12 to the distance from the center O of the first decompression hole 1131 to the upper apex M of the ear hook 12 is in the range of 1.25 to 1.65. Preferably, the ratio of the distance from the center O of the sound emitting hole 112 to the upper apex M of the ear hook 12 to the distance from the center O of the first decompression hole 1131 to the upper apex M of the ear hook 12 is in the range of 1.35 to 1.55. In some embodiments, the relative positional relationship between the center O of the sound emitting hole 112, the upper apex M of the ear hook 12, and the center O1 of the first decompression hole 1131 may be expressed by the ratio of the distance from the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane to the projection point M' of the upper apex M of the ear hook 12 onto the sagittal plane to the distance from the center O1 of the first decompression hole 1131 to the upper apex M of the ear hook 12. For example, in some embodiments, in the wearing method shown in FIG. 14, the ratio of the distance from the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane to the projection point M' of the upper apex M of the ear hook 12 onto the sagittal plane to the distance from the center O1 of the first decompression hole 1131 to the upper apex M of the ear hook 12 is in the range of 1.11 to 1.71. In some embodiments, the ratio of the distance from the projection point O' of the center O of the sound emission hole 112 onto the sagittal plane to the projection point M' of the upper vertex M of the earhook 12 onto the sagittal plane to the distance from the center O1 of the first decompression hole 1131 to the upper vertex M of the earhook 12 is in the range of 1.35 to 1.50.

[0129] The above description of the earphone 10 is merely for explanation and is not intended to limit the scope of the present application. Those skilled in the art can make various changes and modifications based on the description of the present application. For example, when only one decompression hole is installed in the sound generating unit 11, the decompression hole may be either the first decompression hole 1131 or the second decompression hole 1132. For example, the decompression hole may be the first decompression hole 1131, that is, the decompression hole may be installed on the upper side surface US. In this case, the decompression hole can be regarded as the only point sound source outside the cavity structure 41 shown in FIG. 10. The ratio of the distance from the center O of the sound emission hole 112 to the midpoint of the upper boundary of the inner side surface IS to the distance from the center of the decompression hole to the midpoint of the upper boundary of the inner side surface IS is in the range of 1.3 to 2.1. These changes and modifications are still within the scope of protection of the present application.

[0130] FIG. 17 is a schematic diagram of an earphone housing according to some embodiments of the present disclosure.

[0131] In some embodiments, as shown in FIG. 17, the sound emitting hole 112, the first decompression hole 1131, and the second decompression hole 1132 may be racetrack-shaped, and both ends of the racetrack shape may be minor arc-shaped or semicircular. In some embodiments, the sound emitting hole 112, the first decompression hole 1131, and the second decompression hole 1132 all use a straight cylindrical structure. In some embodiments, in order to facilitate processing and manufacturing and reduce the difficulty of the process, the sound emitting hole 112, the first decompression hole 1131, and the second decompression hole 1132 all use a trumpet-shaped structure, for example, the area of ​​the inner opening is smaller than the area of ​​the corresponding outer opening, or the area of ​​the outer opening is smaller than the area of ​​the corresponding inner opening. In addition, the shapes of the sound emitting hole 112, the first decompression hole 1131, and the second decompression hole 1132 may include, but are not limited to, a circle, an ellipse, a racetrack shape, etc. For convenience of explanation, the following will be described by taking as an example an example in which the sound emission hole 112, the first decompression hole 1131, and the second decompression hole 1132 are formed into a racetrack-shaped straight cylindrical structure. At this time, the maximum dimension of the sound emission hole 112 in the width direction Y is defined as the corresponding short axis dimension (width), the maximum dimension of the first decompression hole 1131 and the second decompression hole 1132 in the thickness direction Z is defined as the corresponding short axis dimension (width), the maximum dimension of the sound emission hole 112, the first decompression hole 1131, and the second decompression hole 1132 in the major axis direction X is defined as the corresponding major axis dimension (length), the dimension of the sound emission hole 112 in the thickness direction Z is defined as the corresponding depth, and the dimension of the first decompression hole 1131 and the second decompression hole 1132 in the width direction Y is defined as the corresponding depth.

[0132] In some embodiments, when the area S3 (hereinafter, abbreviated as area) of the outer opening of the sound output hole 112 is increased or the depth D3 of the sound output hole 112 is decreased, the resonant frequency f1 of the front cavity of the earphone moves to a higher frequency. During the vibration of the diaphragm, the air in the front cavity is compressed or expanded with the vibration of the diaphragm, and the compressed or expanded air moves back and forth through the air column at the sound output hole, so that the air column radiates sound to the outside. In some embodiments, the air column at the sound output hole 112 has a mass, and the mass can correspond to the acoustic mass of the sound output hole 112. The acoustic mass affects the acoustic output of the sound generating unit 11 as part of the acoustic resistance. As a result, the dimensions of the sound output hole 112 also affect the acoustic mass Ma of the sound output hole 112, specifically, when the area S3 of the sound output hole 112 is increased or the depth D3 is decreased, the acoustic mass Ma of the sound output hole 112 is reduced.

[0133] In some embodiments, in order to increase the resonance frequency f1 of the front cavity and ensure the acoustic mass Ma of the sound emitting hole 112, it is necessary to set the area S3 of the sound emitting hole 112 to have a suitable range of values. In addition, if the area S3 of the sound emitting hole 112 is too large, it may have a certain impact on other aspects such as the appearance and structural strength of the earphone 10. Therefore, in some embodiments, the value range of the area S3 of the sound emitting hole 112 is 2.87 mm 2 ~46.10mm 2 In some embodiments, the range of values ​​for the area S3 of the sound emission hole 112 is 2.875 mm 2 ~46mm 2 In some embodiments, the value range of the area S3 of the sound emission hole 112 is 8 mm 2 ~30mm 2 In some embodiments, the value range of the area S3 of the sound emission hole 112 is 10 mm 2 ~26mm 2 By way of example only, the value of the area S3 of the sound emission hole 112 may be 11 mm 2 ~15mm 2 (For example, 11.49 mm 2) For example, the value of the area S3 of the sound emission hole 112 may be 25 mm 2 ~26mm 2 (For example, 25.29 mm 2 ) may also be used.

[0134] In order to ensure that the front cavity has a sufficiently large resonance frequency, the value of the depth D3 of the sound emitting hole 112 is the smaller the better. However, since the sound emitting hole 112 is installed in the housing 111, the depth D3 of the sound emitting hole 112 is the thickness of the housing 111. If the thickness of the housing 111 is too small, it may affect the structural strength of the earphone 10, and the corresponding processing process is difficult. In some embodiments, the value range of the depth D3 of the sound emitting hole 112 may be 0.3 mm to 3 mm. In some embodiments, the value range of the depth D3 of the sound emitting hole 112 may be 0.3 mm to 2 mm. In some embodiments, the value of the depth D3 of the sound emitting hole 112 may be 0.3 mm to 1 mm.

[0135] In some embodiments, the area of ​​the sound emission hole 112 may range from 2.875 mm 2 ~46mm 2 The range of the depth D3 of the sound emitting hole 112 may be 0.3 mm to 3 mm. In this case, the ratio S3 / D3 of the area S3 of the corresponding sound emitting hole 112 to the square of the depth D3 is 2 The value of may range from 0.31 to 512.2. In some embodiments, the ratio S3 / D3 of the area S3 of the sound output hole 112 to the square of the depth D3 2 The value of may range from 1 to 400. In some embodiments, the ratio S3 / D3 of the area S3 of the sound emission hole 112 to the square of the depth D3 2 The value of may range from 3 to 300. In some embodiments, the ratio S3 / D3 of the area S3 of the sound emission hole 112 to the square of the depth D3 2 The value of may range from 5 to 200. In some embodiments, the ratio S3 / D3 of the area S3 of the sound emission hole 112 to the square of the depth D3 2 The value may range from 10 to 50.

[0136] In some embodiments, when other structures (such as the sound emission hole 112) are fixed, as the area of ​​the decompression hole 113 (such as the first decompression hole 1131 and / or the second decompression hole 1132) gradually increases, the resonance frequency corresponding to the rear cavity of the earphone 10 gradually moves to a higher frequency, and the flat area of ​​the frequency response curve becomes wider. In addition, in practical applications, if the area of ​​the first decompression hole 1131 and / or the area of ​​the second decompression hole 1132 is too large, it will have a certain impact on other aspects such as the appearance, structural strength, waterproofing and dustproofing of the earphone 10, so the area S1 of the first decompression hole 1131 and / or the area S2 of the second decompression hole 1132 should not be too large. In some embodiments, the area range of the first decompression hole 1131 is 3.78 mm 2 ~86.21mm 2 and the area of ​​the second decompression hole 1132 is 2.78 mm 2 ~54.68mm 2 In some embodiments, the area of ​​the first decompression hole 1131 is 3.78 mm 2 ~22.07mm 2 and the area of ​​the second decompression hole 1132 is 2.78 mm 2 ~16.07mm 2 In some embodiments, the area of ​​the first decompression hole 1131 is 6.78 mm 2 ~20.07mm 2 and the area of ​​the second decompression hole 1132 is 4.78 mm 2 ~13.07mm 2 It is.

[0137] In some embodiments, since the first decompression hole 1131, the second decompression hole 1132, and the sound emission hole 112 are installed in the housing 111, the depth D1 of the first decompression hole 1131 and the depth D2 of the second decompression hole 1132 may be made to match the depth D3 of the sound emission hole 112 in order to facilitate processing and design. In some embodiments, the value range of the depth D1 of the first decompression hole 1131 (or the depth D2 of the second decompression hole 1132) may be 0.3 mm to 3 mm. In some embodiments, the value range of the depth D1 of the first decompression hole 1131 (or the depth D2 of the second decompression hole 1132) may be 0.3 mm to 2 mm. In some embodiments, the value range of the depth D1 of the first decompression hole 1131 (or the depth D2 of the second decompression hole 1132) may be 0.3 mm to 1 mm.

[0138] In some embodiments, in order to better cancel the second sound leakage formed by the decompression holes 113 and the first sound leakage formed in the far field by the sound emission holes 112, the resonant frequency f2 of the rear cavity may be close to or equal to the resonant frequency f1 of the front cavity 114. Based on equation (2), the ratio of the resonant frequency f1 of the front cavity 114 to the resonant frequency f2 of the rear cavity,

[0139]

number

[0140] is as follows:

[0141]

number

[0142] Based on formula (2), the ratio of the resonance frequency f1 of the front cavity 114 to the resonance frequency f2 of the rear cavity may be related to the volume ratio of the front cavity to the rear cavity, the ratio of the opening area of ​​the sound emission hole 112 to the opening area of ​​the decompression hole 113, and the ratio of the depth of the sound emission hole 112 to the depth of the decompression hole 113. By setting the range of other parameters (for example, the volume ratio of the front cavity to the rear cavity) based on some of the parameters (for example, the ratio of the opening area of ​​the sound emission hole 112 to the opening area of ​​the decompression hole 113), the second sound leakage formed by the decompression hole 113 and the first sound leakage formed in the far field by the sound emission hole 112 can be better offset, and the output effect of the earphone 10 can be improved.

[0143] In some embodiments, the ratio of the area S3 and depth D3 of the sound emitting hole 112 to the ratio of the total area of ​​the decompression hole 113 to its corresponding depth is set to a range of 1.10 to 1.75 in order to set the resonance frequency ratio between the front cavity and the rear cavity in a range of 0.5 to 1.5. In some embodiments, the ratio of the area S3 and depth D3 of the sound emitting hole 112 to the ratio of the total area of ​​the decompression hole 113 to its corresponding depth is set to a range of 1.25 to 1.65 in order to set the resonance frequency ratio between the front cavity and the rear cavity in a range of 0.7 to 1.3. In some embodiments, the ratio of the area S3 and depth D3 of the sound emitting hole 112 to the ratio of the total area of ​​the decompression hole 113 to its corresponding depth is set to a range of 1.35 to 1.55 in order to set the resonance frequency ratio between the front cavity and the rear cavity in a range of 0.8 to 1.2.

[0144] In some embodiments, the shape of the sound output hole 112 also affects the acoustic resistance of the sound output hole 112. For example, the more elongated the sound output hole 112 is, the larger the acoustic resistance of the sound output hole 112 is, which is detrimental to the acoustic output of the front cavity. Therefore, in order to ensure good low-frequency output of the sound output hole 112 and to increase the volume of the sound output from the sound output hole 112, the ratio of the major axis dimension L3 to the minor axis dimension W3 of the sound output hole 112 (also called the aspect ratio of the sound output hole 112) needs to be within a predetermined suitable value range. In some embodiments, when the area of ​​the sound output hole 112 is constant, the aspect ratio of the sound output hole 112 may be within a range of 1 to 10 to ensure that the frequency response at low frequencies of the frequency response curve of the front cavity is strong. In some embodiments, the aspect ratio of the sound output hole 112 may be 2 to 7. In some embodiments, the aspect ratio of the sound output hole 112 may be 2 to 3. In some embodiments, the aspect ratio of the sound emitting hole 112 may be 2. In some embodiments, in order to increase the resonant frequency of the resonant peak of the front cavity as much as possible, the length L3 of the sound emitting hole 112 may be set to a large value. However, in order not to reduce the high frequency output corresponding to the resonant peak of the front cavity and in consideration of the structural stability of the sound generating unit 11, the length L3 of the sound emitting hole 112 may be set to 17 mm or less, and the width W3 of the sound emitting hole 112 may be set to 10 mm or less. In some embodiments, the length L3 of the sound emitting hole 112 may be 2 mm to 11 mm. In some embodiments, the length L3 of the sound emitting hole 112 may be 3 mm to 11 mm. In some embodiments, the length L3 of the sound emitting hole 112 may be 3 mm to 16 mm. In some embodiments, the length L3 of the sound emitting hole 112 may be 5 mm to 13 mm. In some embodiments, the length L3 of the sound emitting hole 112 may be 6 mm to 9 mm.

[0145] In some embodiments, the width W3 of the sound emitting hole 112 can be determined based on the length L3 and the aspect ratio. For example, if the aspect ratio of the sound emitting hole 112 is 2, the width W3 of the sound emitting hole 112 is 1.5 mm to 5.5 mm. The area of ​​the corresponding racetrack-shaped sound emitting hole 112 is 4.02 mm. 2 ~54mm 2 By setting the range of the length L3 of the sound emission hole 112, the flat region of the frequency response curve can be increased to improve the sound quality of the earphone 10, while also achieving a structural design of the sound generating unit 11. As a mere example, the area of ​​the racetrack-shaped sound emission hole 112 is about 11.5 mm 2 Accordingly, it can be determined that the length L3 of the sound emitting hole 112 is 5mm to 6mm, and the width W3 of the sound emitting hole 112 is 2.5mm to 3mm. In the above size range, the earphone 10 can have a flat frequency response curve in a wide frequency range and a sufficient high frequency output. In addition, a small value of the area is also advantageous for the stability of the structure.

[0146] In some embodiments, as shown in FIGS. 14 to 16 and their descriptions, the center of the sound emission hole 112 is located on or near the perpendicular bisecting plane of the line connecting the center of the first decompression hole 1131 and the center of the second decompression hole 1132, and the sound emission hole 112 is located on the side of the housing 111 close to the second decompression hole 1132 in the Y direction, not at the middle position. Since the sound emission hole 112 is installed close to the ear canal, the second decompression hole 1132 is close to the ear canal, and the first decompression hole 1131 is far from the ear canal. Compared to the first decompression hole 1131, the sound waves emitted from the second decompression hole 1132 are more likely to be offset in the near field by the sound waves emitted from the sound emission hole 112. Therefore, the sound pressure amplitude at the second decompression hole 1132 may be smaller than the sound pressure amplitude at the first decompression hole 1131, thereby increasing the listening volume in the ear canal. In some embodiments, the second decompression hole 1132 may have a larger acoustic resistance than the first decompression hole 1131. For example, the dimensions of the second decompression hole 1132 may be smaller than the dimensions of the first decompression hole 1131, such that the second decompression hole 1132 can have a larger acoustic resistance. For example, the area of ​​the first decompression hole 1131 may be larger than the area of ​​the second decompression hole 1132.

[0147] In some embodiments, when it is ensured that the sound generating efficiency of the sound generating unit 11 is sufficiently high and at least a part of the sound generating unit 11 can be inserted into the cavity of the concha, the volumes of the front and rear cavities of the sound generating unit 11 should not be too large or too small, and the ratio of the area of ​​the sound emitting hole 112 to the total area of ​​the decompression holes 113 (for example, the sum of the areas of the first decompression hole 1131 and the second decompression hole 1132) is set to 0.3 to 0.9 so that the resonance frequency ratio between the front and rear cavities is within a range of 0.3 to 1.7. In some embodiments, the ratio of the area of ​​the sound emitting hole 112 to the total area of ​​the decompression holes 113 is set to 0.5 to 0.85 so that the resonance frequency ratio between the front and rear cavities is within a range of 0.5 to 1.5. In some embodiments, the ratio of the area of ​​the sound emitting holes 112 to the total area of ​​the decompression holes 113 is set to 0.6 to 0.8 in order to set the resonance frequency ratio between the front cavity and the rear cavity in the range of 0.7 to 1.3. In some embodiments, the ratio of the area of ​​the sound emitting holes 112 to the total area of ​​the decompression holes 113 is set to 0.65 to 0.75 in order to set the resonance frequency ratio between the front cavity and the rear cavity in the range of 0.8 to 1.2.

[0148] In some embodiments, when the earphone 10 includes only one decompression hole, the ratio of the area S3 of the sound emitting hole 112 to the area of ​​the decompression hole is 0.5 to 1.5. In some embodiments, when the earphone 10 includes only one decompression hole, the ratio of the area S3 of the sound emitting hole 112 to the area of ​​the decompression hole is 0.6 to 1.3. In some embodiments, when the earphone 10 includes only one decompression hole, the ratio of the area S3 of the sound emitting hole 112 to the area of ​​the decompression hole is 0.65 to 1.25. In some embodiments, when the earphone 10 includes only one decompression hole, the ratio of the area S3 of the sound emitting hole 112 to the area of ​​the decompression hole is 0.7 to 1.2.

[0149] FIG. 18 is a contour map of the volume ratio of the front cavity to the rear cavity and the ratio of the opening area of ​​the sound emission hole to the opening area of ​​the decompression hole according to some embodiments of the present specification. In some embodiments, as shown in FIG. 18, the range of the resonance frequency ratio of the front cavity to the rear cavity may be related to the ratio of the area of ​​the sound emission hole to the area of ​​the decompression hole and the volume ratio of the front cavity to the rear cavity. Thus, by setting the ratio of the area of ​​the sound emission hole to the area of ​​the decompression hole and the volume ratio of the front cavity to the rear cavity, the resonance frequency ratio of the front cavity to the rear cavity can be set within a target range. For example, as shown in FIG. 18, if the value range of the ratio f1 / f2 of the resonance frequency f1 of the front cavity to the resonance frequency f2 of the rear cavity is 0.1 to 5, the opening area S3 of the sound emission hole 112 is 0.1 to 5.5 times the total opening area S of the first decompression hole 1131 and the second decompression hole 1132. 1+2 For example, the opening area S3 of the sound emission hole 112 and the total opening area S of the first decompression hole 1131 and the second decompression hole 1132 may be smaller than the opening area S3 of the sound emission hole 112. 1+2 Ratio of S3 / S 1+2 may be in the range of 0.1 to 0.99, and the value of the ratio V2 / V1 of the volume V2 of the rear cavity to the volume V1 of the front cavity may be in the range of 0.1 to 10. Also, for example, if the value of the ratio f1 / f2 of the resonance frequency f1 of the front cavity to the resonance frequency f2 of the rear cavity is in the range of 0.5 to 2, the opening area S3 of the sound release hole 112 and the total opening area S of the first decompression hole 1131 and the second decompression hole 1132 will be 1+2 Ratio of S3 / S 1+2 may be in the range of 0.2 to 0.7, and the ratio V2 / V1 of the volume V2 of the rear cavity to the volume V1 of the front cavity may be in the range of 1 to 7.

[0150] In some embodiments, the opening area S3 of the sound emission hole 112 is a total opening area S of the first decompression hole 1131 and the second decompression hole 1132. 1+2 For example, the opening area S3 of the sound emission hole 112 and the total opening area S of the first decompression hole 1131 and the second decompression hole 1132 may be larger than the above. 1+2 Ratio of S3 / S 1+2may be in the range of 1 to 10, and the value of the ratio V2 / V1 of the volume V2 of the rear cavity 116 to the volume V1 of the front cavity 114 may be in the range of 0.1 to 10. As shown in Fig. 18, the value of the ratio f1 / f2 of the corresponding resonance frequency f1 of the front cavity 114 to the resonance frequency f2 of the rear cavity 116 may be in the range of 0.5 to 10. In addition, for example, the ratio of the opening area S3 of the sound emission hole 112 to the total opening area S of the first decompression hole 1131 and the second decompression hole 1132 may be in the range of 0.5 to 10. 1+2 Ratio of S3 / S 1+2 18, the ratio V2 / V1 of the volume V2 of the rear cavity 116 to the volume V1 of the front cavity 114 may be in the range of 3 to 9, and the ratio f1 / f2 of the resonance frequency f1 of the front cavity 114 to the resonance frequency f2 of the rear cavity 116 may be in the range of 1 to 8.

[0151] In some embodiments, S3 / S is calculated based on V2 / V1 with reference to the contour lines shown in FIG. 1+2 Determine the range of values ​​of S3 / S 1+2 By determining the value range of V2 / V1 based on the above, the resonant frequency f2 of the rear cavity is close to or equal to the resonant frequency f1 of the front cavity, and further, the second sound leakage formed by the decompression hole 113 and the first sound leakage formed in the far field by the sound emission hole 112 are better offset, and the output effect of the earphone 10 is improved. For example, as can be seen from the formula (2), in order to ensure that the rear cavity has a sufficiently large resonant frequency f2, the volume V2 of the rear cavity may be small, for example, V2 / V1 may be smaller than 1. As shown in FIG. 18, if the resonant frequency f2 of the rear cavity is close to or equal to the resonant frequency f1 of the front cavity (for example, the value of f1 / f2 is about 1), the S3 / S 1+2 The value may range from 1 to 2.5.

[0152] As an example only, the volume V1 of the front cavity is 190 mm 3 ~220mm 3The volume V2 of the rear cavity may be within the range of 60 mm 3 ~80mm 3 In some embodiments, the value of V2 / V1 may be in the range of 0.2 to 0.4. In some embodiments, the value of V2 / V1 may be in the range of 0.25 to 0.45.

[0153] In some embodiments, by combining the above-mentioned related contents, the opening area S3 of the sound emission hole 112 and the total opening area S of the first decompression hole 1131 and the second decompression hole 1132 can be calculated as follows: 1+2 Ratio of S3 / S 1+2 By adjusting the range, the earphone can have a good output effect. For example, the length L3 of the sound hole 112 can be 3mm to 11mm, the ratio of the length L3 to the width W3 of the cross section of the sound hole 112 is 2, and the area of ​​the corresponding racetrack-shaped sound hole 112 is 4.02mm. 2 ~54mm 2 The first decompression hole 1131 may have a length L1 of 6 mm and a width W1 of 1.5 mm, and accordingly, the area of ​​the first decompression hole 1131 may be 8.51 mm. 2 The second decompression hole 1132 may have a length L2 of 3 mm and a width W2 of 1.5 mm, and accordingly, the area of ​​the second decompression hole 1132 may be 4.02 mm 2 As a result, the opening area S3 of the sound emission hole 112 and the total opening area S of the first decompression hole 1131 and the second decompression hole 1132 may be 1+2 Ratio of S3 / S 1+2 For example, the first decompression hole 1131 may have a length L1 of 2 mm to 8 mm and a width W1 of 1.5 mm, and the area of ​​the first decompression hole 1131 may be 2.517 mm 2 ~11.5171mm 2 The second decompression hole 1132 may have a length L2 of 3 mm to 6 mm and a width W2 of 1.5 mm. The area of ​​the second decompression hole 1132 is 4.017 mm. 2 ~8.5171mm 2The sound emission hole 112 may have a length L3 of 5 mm and a width W3 of 2.5 mm, and accordingly, the area S3 is 11.16 mm 2 As a result, the opening area S3 of the sound emission hole 112 and the total opening area S of the first decompression hole 1131 and the second decompression hole 1132 are 1+2 Ratio of S3 / S 1+2 is 0.56 to 1.71.

[0154] As shown in FIG. 18, V2 / V1 is in the range of 0.25 to 0.45, and S3 / S 1+2 When V2 / V1 is in the range of 0.25 to 0.45, and S3 / S 1+2 is in the range of 0.56 to 1.71, f1 / f2 is in the range of 0.5 to 0.9. As can be seen from the above, by determining the volume ratio and / or area ratio based on the above range, the resonant frequency f2 of the rear cavity is close to or equal to the resonant frequency f1 of the front cavity.

[0155] Fig. 19 is a frequency response curve diagram corresponding to different sound volumes at the sound output hole according to some embodiments of the present specification, Fig. 20 is a frequency response curve diagram corresponding to different sound volumes at the first decompression hole according to some embodiments of the present specification, and Fig. 21 is a frequency response curve diagram corresponding to different sound volumes at the second decompression hole according to some embodiments of the present specification. As shown in Fig. 19 to Fig. 21, as the sound volume gradually decreases from the maximum sound volume, the sound pressure at the sound output hole 112, the sound pressure at the first decompression hole 1131, and the sound pressure at the second decompression hole 1132 all gradually decrease.

[0156] The sound pressure at the sound emission hole 112, the sound pressure at the first decompression hole 1131, and the sound pressure at the second decompression hole 1132 refer to the sound pressures at a location 4 mm away from the sound emission hole 112, a location 4 mm away from the first decompression hole 1131, and a location 4 mm away from the second decompression hole 1132, respectively. In the process of measuring the sound pressure at each hole, the other holes are not blocked. For example, when measuring the sound pressure at the sound emission hole 112, the first decompression hole 1131 and the second decompression hole 1132 are not blocked or blocked.

[0157] In some embodiments, by combining Figures 10 to 13 and their descriptions, the cavity structure can be set up to offset the sound waves emitted from the decompression holes (the first decompression holes 1131 or the second decompression holes 1132) and the sound leakage generated by the sound emission holes 112 in the far field, which is advantageous for reducing the far field sound leakage and reduces the impact of the sound waves emitted from the decompression holes on near field listening. As a result, in some embodiments, the sound pressure amplitude at the decompression holes 113 (the first decompression holes 1131 or the second decompression holes 1132) is made close to the sound pressure amplitude at the sound emission holes 112, thereby effectively reducing the far field sound leakage and not affecting the near field listening. In some embodiments, in order to effectively reduce the far field sound leakage, the ratio of the sound pressure at the sound emission holes 112 to the sound pressure at the first decompression holes 1131 may be set to a range of 0.8 to 1.2 within a specific frequency range (for example, within a range of 3.5 kHz to 4.5 kHz). In some embodiments, the ratio of the sound pressure at the sound output hole 112 to the sound pressure at the first decompression hole 1131 may be in the range of 0.9 to 1.1. In some embodiments, the ratio of the sound pressure at the sound output hole 112 to the sound pressure at the first decompression hole 1131 may be in the range of 0.95 to 1.05. In some embodiments, in order to effectively reduce the far-field sound leakage, the ratio of the sound pressure at the sound output hole 112 to the sound pressure at the second decompression hole 1132 may be in the range of 0.8 to 1.2. In some embodiments, the ratio of the sound pressure at the sound output hole 112 to the sound pressure at the second decompression hole 1132 may be in the range of 0.9 to 1.1. In some embodiments, the ratio of the sound pressure at the sound output hole 112 to the sound pressure at the second decompression hole 1132 may be in the range of 0.95 to 1.05. In some embodiments, in order to effectively reduce far-field sound leakage, the ratio of the sound pressure at the sound output hole 112 to the total sound pressure at the first decompression hole 1131 and the second decompression hole 1132 may be in the range of 0.4 to 0.6. In some embodiments, the ratio of the sound pressure at the sound output hole 112 to the total sound pressure at the first decompression hole 1131 and the second decompression hole 1132 may be in the range of 0.45 to 0.55. Note that the sound pressure at the sound output hole 112, the sound pressure at the first decompression hole 1131, and the sound pressure at the second decompression hole 1132 refer to sound pressures that correspond to the same volume and corresponding frequencies, respectively.

[0158] 19 to 21, in the case of maximum volume and 4000 Hz, the sound pressure at sound emission hole 112 is 103.54 dB, the sound pressure at first decompression hole 1131 is 104.5 dB, and the sound pressure at second decompression hole 1132 is 100.74 dB. At this time, since the sound pressure at sound emission hole 112 is close to the sound pressure at first decompression hole 1131 and the sound pressure at second decompression hole 1132, respectively, far-field sound leakage can be effectively reduced.

[0159] In some embodiments, when reducing the sound pressure at the second decompression hole 1132 (to reduce the degree to which the sound generated by the second decompression hole 1132 cancels out the sound generated by the sound output hole 112 in the ear canal) and ensuring the cancellation effect in the far field between the sound output from the second decompression hole 1132 and the sound leaking from the sound output hole 112 through the second leakage structure LC, the difference (S1-S2) between the area S1 of the first decompression hole 1131 and the area S2 of the second decompression hole 1132 must not be too small. Also, in order to avoid the difference between the acoustic resistance at the first decompression hole 1131 and the acoustic resistance at the second decompression hole 1132 affecting the effect of destroying the standing wave in the rear cavity, the difference (S1-S2) between the area S1 of the first decompression hole 1131 and the area S2 of the second decompression hole 1132 must not be too large. In some embodiments, in order to set the ratio of the sound pressure at the sound emitting hole 112 to the total sound pressure at the first decompression hole 1131 and the second decompression hole 1132 within an appropriate range (e.g., 0.4 to 0.6), the ratio of the difference (S1-S2) between the area S1 of the first decompression hole 1131 and the area S2 of the second decompression hole 1132 to the area S3 of the sound emitting hole 112 can be set within a range of 2.5 to 3.9. In some embodiments, the ratio of the difference (S1-S2) between the area S1 of the first decompression hole 1131 and the area S2 of the second decompression hole 1132 to the area S3 of the sound emitting hole 112 may be within a range of 2.7 to 3.7. In some embodiments, the ratio of the difference (S1-S2) between the area S1 of the first decompression hole 1131 and the area S2 of the second decompression hole 1132 to the area S3 of the sound emission hole 112 may be within a range of 2.85 to 3.45. In some embodiments, the ratio of the difference (S1-S2) between the area S1 of the first decompression hole 1131 and the area S2 of the second decompression hole 1132 to the area S3 of the sound emission hole 112 may be within a range of 2.9 to 3.4. In some embodiments, the ratio of the difference (S1-S2) between the area S1 of the first decompression hole 1131 and the area S2 of the second decompression hole 1132 to the area S3 of the sound emission hole 112 may be within a range of 3.1 to 3.3.

[0160] FIG. 22 is an example internal structural diagram of a sound generating unit according to some embodiments of the present disclosure.

[0161] 22, the sound generating unit 11 may include a housing 111 connected to the ear hook 12 and a transducer 116 disposed within the housing 111. In some embodiments, the sound generating unit 11 may further include a main control circuit board 13 disposed within the housing 111 and a battery (not shown) disposed at an end of the ear hook 12 remote from the sound generating unit 11, and the battery and the transducer 116 are each electrically connected to the main control circuit board 13 such that the battery can supply power to the transducer 116 under the control of the main control circuit board 13. Of course, both the battery and the transducer 116 may be disposed within the sound generating unit 11, and the battery may be closer to the connection end CE, while the transducer 116 may be closer to the free end FE.

[0162] In some embodiments, the earphone 10 may include an adjustment mechanism connecting the sound generating unit 11 and the ear hook 12, and different users can adjust the relative position of the sound generating unit 11 in the ear by the adjustment mechanism while wearing the earphone, and position the sound generating unit 11 in an appropriate position, so that the sound generating unit 11 and the concha cavity form a cavity structure. In addition, the presence of the adjustment mechanism allows the user to adjust the earphone 10 to wear it in a more stable and comfortable position.

[0163] Since the cavity of the concha has a certain volume and depth, after the free end FE enters the cavity of the concha, a certain distance can be provided between the inner surface IS of the sound generating unit 11 and the cavity of the concha. In other words, the sound generating unit 11 can form a cavity structure communicating with the ear canal in combination with the cavity of the concha in a worn state, and the sound emitting hole 112 can be provided in the sound generating unit 11 (e.g., the inner surface IS), and at least a part of the sound emitting hole 112 can be located in the cavity structure. In this way, in a worn state, the sound waves transmitted through the sound emitting hole 112 are restricted by the cavity structure, that is, the cavity structure can collect the sound waves and transmit the sound waves better into the ear canal, thereby improving the volume and quality of the sound heard by the user in the near field, and thus favorable to improving the acoustic effect of the earphone 10. Furthermore, since the sound generating unit 11 may be provided so as not to block the ear canal in a worn state, the cavity structure may be provided as a semi-open type. In this way, a part of the sound waves transmitted from the sound emission hole 112 is transmitted to the ear canal, allowing the user to hear the sound, and the other part is transmitted to the outside of the earphone 10 and the ear through the gap between the sound generating unit 11 and the ear unit (for example, the part of the concha not covered by the sound generating unit 11), together with the sound reflected in the ear canal, thereby forming a first sound leakage in the far field. At the same time, the sound waves transmitted through the decompression holes 113 (for example, the first decompression holes 1131 and the second decompression holes 1132) formed in the sound generating unit 11 usually form a second sound leakage in the far field, where the intensity of the first sound leakage and the intensity of the second sound leakage are equal, and the phase of the first sound leakage and the phase of the second sound leakage are (substantially) inverse phase, thereby canceling out the two in the far field. In this way, it is advantageous to reduce sound leakage in the far field of the earphone 10.

[0164] In some embodiments, a front cavity 114 may be formed between the transducer 116 and the housing 111, and the sound emission hole 112 is disposed in an area surrounding and forming the front cavity 114 of the housing 111, and the front cavity 114 is in communication with the outside through the sound emission hole 112.

[0165] In some embodiments, the front cavity 114 is disposed between the diaphragm of the transducer 116 and the housing 111, and the front cavity 114 may have a large depth dimension (i.e., the distance dimension between the diaphragm of the transducer 116 and the housing 111 facing it) to ensure that the diaphragm has a sufficient vibration space. In some embodiments, as shown in FIG. 22, the sound emission hole 112 is disposed on the inner surface IS in the thickness direction Z, and in this case, the depth of the front cavity 114 may refer to the dimension of the front cavity 114 in the Z direction. However, if the depth of the front cavity 114 is too large, the dimension of the sound generating unit 11 becomes large, which affects the wearing comfort of the earphone 10. In some embodiments, the depth of the front cavity 114 may be 0.55 mm to 1.00 mm. In some embodiments, the depth of the front cavity 114 may be 0.66 mm to 0.99 mm. In some embodiments, the depth of the front cavity 114 may be between 0.76 mm and 0.99 mm. In some embodiments, the depth of the front cavity 114 may be between 0.96 mm and 0.99 mm. In some embodiments, the depth of the front cavity 114 may be 0.97 mm.

[0166] In order to improve the sound emission effect of the earphone 10, the resonance frequency of the structure similar to a Helmholtz resonator formed by the front cavity 114 and the sound emission hole 112 is made as high as possible, so that the overall frequency response curve of the sound generating part has a wide flat region. In some embodiments, the resonance frequency f1 of the front cavity 114 may be 3 kHz or more. In some embodiments, the resonance frequency f1 of the front cavity 114 may be 4 kHz or more. In some embodiments, the resonance frequency of the front cavity 114 may be 6 kHz or more. In some embodiments, the resonance frequency of the front cavity 114 may be 7 kHz or more. In some embodiments, the resonance frequency of the front cavity 114 may be 8 kHz or more.

[0167] 22, in some embodiments, an acoustic resistance mesh 118 may be installed at a position corresponding to the first decompression hole 1131 and / or the second decompression hole 1132, and the acoustic resistance mesh 118 may adjust the amplitude at the resonance frequency of the rear cavity and also play a role of dustproof and waterproof. In some embodiments, an acoustic resistance mesh 118 may be installed at the position of the sound emission hole 112, and may adjust the amplitude at the corresponding resonance peak of the front cavity 114 and also play a role of dustproof and waterproof.

[0168] In some embodiments, the acoustically resistive mesh 118 may include gauze, steel mesh, or a combination thereof. In some embodiments, the acoustic impedance set for the front cavity 114 and the acoustic impedance set for the rear cavity 116 may be the same, i.e., the acoustically resistive mesh 118 installed at the sound output hole 112 and the acoustically resistive mesh 118 installed at at least one decompression hole (e.g., the first decompression hole 1131 and / or the second decompression hole 1132) may have the same acoustic impedance. For example, the same acoustically resistive mesh 118 may be installed at the sound output hole 112 and at least one decompression hole in order to easily assemble the structure (e.g., to reduce the number of materials and / or to avoid mixing of materials) and to improve the consistency of the appearance. In some embodiments, the acoustic resistance mesh 118 installed in the front cavity 114 and the acoustic resistance mesh 118 installed in the rear cavity 116 may have different acoustic impedances, i.e., the acoustic resistance mesh 118 installed in the sound output hole 112 and the acoustic resistance mesh 118 installed in at least one decompression hole may have different acoustic impedances. For example, based on other parameters of the front cavity 114 and the rear cavity 116 (e.g., the area (or area ratio) of the sound output hole 112 and / or the decompression hole, the depth of each hole, the aspect ratio, etc.), the acoustic resistance meshes 118 with different acoustic impedances are installed in the front cavity 114 and the rear cavity 116 to achieve a predetermined output effect (e.g., by installing the acoustic resistance meshes 118 with different acoustic impedances, the sound pressure output from the sound output hole 112 is close to the sound pressure output from the decompression hole, thereby effectively reducing the far-field sound leakage).

[0169] When other parameters of the acoustic resistance mesh 118 are constant, the magnitude of its acoustic resistance is related to its thickness, and acoustic resistance meshes with different thicknesses have a certain effect on the acoustic output performance of the corresponding acoustic hole. Therefore, the thickness of the acoustic resistance mesh 118 has a certain limit. In some embodiments, the thickness range of the acoustic resistance mesh 118 installed in the first decompression hole 1131 and / or the second decompression hole 1132 may be 35 μm to 300 μm. In some embodiments, the thickness range of the acoustic resistance mesh 118 installed in the first decompression hole 1131 and the second decompression hole 1132 may be 40 μm to 150 μm. In some embodiments, the thickness range of the acoustic resistance mesh 118 installed in the first decompression hole 1131 and the second decompression hole 1132 may be 50 μm to 65 μm. In some embodiments, the thickness range of the acoustic resistance mesh 118 installed in the first decompression hole 1131 and the second decompression hole 1132 may be 55 μm to 62 μm. On the other hand, the greater the distance between the end of the acoustic resistive mesh 118 facing the outside of the housing 111 (i.e., the upper surface of the acoustic resistive mesh 118) and the outer surface of the housing 111, the closer the installation position of the corresponding acoustic resistive mesh 118 is to the rear cavity, and the smaller the volume of the rear cavity becomes. In some embodiments, the distance between the upper surface of the acoustic resistive mesh 118 installed in the first decompression hole 1131 and the outer surface of the housing 111 may be 0.8 mm to 0.9 mm, and the distance between the upper surface of the acoustic resistive mesh 118 installed in the second decompression hole 1132 and the outer surface of the housing 111 may be 0.7 mm to 0.8 mm. In some embodiments, the distance between the upper surface of the acoustically resistive mesh 118 installed in the first decompression hole 1131 and the outer surface of the housing 111 may be 0.82 mm to 0.88 mm, and the distance between the upper surface of the acoustically resistive mesh 118 installed in the second decompression hole 1132 and the outer surface of the housing 111 may be 0.72 mm to 0.76 mm.In some embodiments, the distance between the top surface of the acoustically resistive mesh 118 installed in the first vacuum hole 1131 and the outer surface of the housing 111 may be 0.86 mm, and the distance between the top surface of the acoustically resistive mesh 118 installed in the second vacuum hole 1132 and the outer surface of the housing 111 may be 0.73 mm.

[0170] In some embodiments, the mesh density of different types of acoustic resistance meshes 118 may be different, so that the acoustic resistance of the corresponding acoustic holes is different, which affects the output of the corresponding acoustic cavity. Therefore, it is necessary to design the configuration and type of the acoustic resistance mesh 118. In some embodiments, in order to realize waterproofing and dustproofing and improve structural stability, the first decompression hole 1131 and / or the second decompression hole 1132 and / or the sound emission hole 112 may use a steel mesh, or a combination of gauze and steel mesh. In some embodiments, in order to improve the smoothness of the frequency response curve of the sound generating unit 11 and provide the sound generating unit 11 with a large output sound pressure, the acoustic resistance mesh 118 installed in the front cavity 114 may include a steel mesh (e.g., an etched steel mesh), and the mesh number of the steel mesh may be in the range of 60 to 100. In some embodiments, in order to further reduce the acoustic impedance of the acoustic resistive mesh 118 and increase the output sound pressure of the sound generating unit 11, the acoustic resistive mesh 118 installed in the front cavity 114 may include a steel mesh, and the mesh number of the steel mesh may be in the range of 70 to 90. In some embodiments, in order to improve the smoothness of the frequency response curve of the sound generating unit 11 and provide the sound generating unit 11 with a large output sound pressure, the acoustic resistive mesh 118 installed in the front cavity 114 may include a gauze and a steel mesh (e.g., an etched steel mesh), and the acoustic impedance of the gauze may be in the range of 2 MKS rayls to 50 MKS rayls, and the mesh number of the steel mesh may be in the range of 60 to 100.In some embodiments, in order to improve the smoothness of the frequency response curve of the sound generating unit 11 and provide the sound generating unit 11 with a large output sound pressure, the acoustic resistance mesh 118 installed in the front cavity 114 may include gauze and steel mesh, the acoustic impedance of the gauze may be in the range of 5MKS rayls to 20MKS rayls, and the mesh number of the steel mesh may be in the range of 70 to 90. In some embodiments, in order to improve the smoothness of the frequency response curve of the sound generating unit 11 and provide the sound generating unit 11 with a large output sound pressure, the acoustic resistance mesh 118 installed in the front cavity 114 may include gauze and steel mesh, the acoustic impedance of the gauze may be in the range of 6MKS rayls to 10MKS rayls, and the mesh number of the steel mesh may be in the range of 75 to 85. In some embodiments, when the acoustically resistive mesh 118 disposed in the front cavity 114 comprises a steel mesh (e.g., etched steel mesh) or a combination of gauze and steel mesh, the acoustic impedance of the steel mesh may be in the range of 0.1 MKS rayls to 10 MKS rayls. In some embodiments, the acoustic impedance of the steel mesh may be in the range of 0.1 MKS rayls to 5 MKS rayls. In some embodiments, the acoustic impedance of the steel mesh may be in the range of 0.1 MKS rayls to 3 MKS rayls.

[0171] FIG. 23 is an example internal structural diagram of a transducer according to some embodiments of the present disclosure.

[0172] As shown in FIG. 23, the housing 111 accommodates the transducer 116, which includes a diaphragm 1161, a voice coil 1162, a frame 1163, and a magnetic circuit assembly 1164. The frame 1163 is installed to surround the diaphragm 1161, the voice coil 1162, and the magnetic circuit assembly 1164, and provides a mounting and fixing platform. The transducer 116 may be connected to the housing 111 through the frame 1163, the diaphragm 1161 covers the voice coil 1162 and the magnetic circuit assembly 1164 in the Z direction, the voice coil 1162 enters the magnetic circuit assembly 1164 and is connected to the diaphragm 1161, and the magnetic field generated after the voice coil 1162 is energized interacts with the magnetic field formed by the magnetic circuit assembly 1164 to drive the diaphragm 1161 to generate mechanical vibration, and further generates sound by transmission through a medium such as air, and the sound is output through the sound output hole 112.

[0173] In some embodiments, the magnetic circuit assembly 1164 includes a magnetic flux conducting plate 11641, a magnet 11642, and a housing member 11643, where the magnetic flux conducting plate 11641 and the magnet 11642 are connected to each other, the side of the magnet 11642 away from the magnetic flux conducting plate 11641 is attached to a bottom wall of the housing member 11643, and there is a gap between the peripheral side of the magnet 11642 and the inner peripheral wall of the housing member 11643. In some embodiments, the outer peripheral wall of the housing member 11643 is connected and fixed to the frame 1163. In some embodiments, both the housing member 11643 and the magnetic flux conducting plate 11641 may use a magnetically permeable material (e.g., iron, etc.).

[0174] In some embodiments, the periphery of the diaphragm 1161 may be connected to the frame 1163 via a fixing ring 1165. In some embodiments, the material of the fixing ring 1165 may include stainless steel or other metal materials to accommodate the manufacturing process of the diaphragm 1161.

[0175] 22 and 23, in some embodiments, in order to improve the acoustic output (especially low frequency output) effect of the sound generating unit 11 and improve the ability of the diaphragm 1161 to push air, the larger the projected area of ​​the diaphragm 1161 along the Z direction, the better. However, if the area of ​​the diaphragm 1161 is too large, the dimensions of the transducer 116 will be too large, and the housing 111 will be too large, which will easily cause collision friction between the housing 111 and the auricle, affecting the wearing comfort of the sound generating unit 11. For this reason, it is necessary to design the dimensions of the housing 111. For example, the short axis dimension (also called width dimension) of the housing 111 in the Y direction (e.g., 17 mm) can be determined based on the dimension of the concha cavity along the Y direction, and the long axis dimension (also called length dimension) of the housing 111 in the X direction (e.g., 21.49 mm) can be determined to fit the dimension of the concha cavity along the X direction by selecting an appropriate aspect ratio (i.e., the ratio of the dimension of the housing 111 in the X direction to the dimension of the housing 111 in the Y direction) based on wearing comfort.

[0176] In some embodiments, a value within a predetermined range can be used as the dimension of the housing 111 to facilitate wearing by most users (e.g., most users can insert the sound generating unit 11 into the concha or abut against the antihelix region when wearing the earphone 10), form a cavity structure with high acoustic effect, and, for example, form a first leakage structure UC and a second leakage structure LC between the earphone 10 and the user's ear when wearing the earphone 10, thereby improving the acoustic performance of the earphone. In some embodiments, based on the range of the width dimension of the concha along the Y direction, the width dimension of the housing 111 along the Y direction may be within a range of 11 mm to 16 mm. In some embodiments, the width dimension of the housing 111 along the Y direction may be 11 mm to 15 mm. In some embodiments, the width dimension of the housing 111 along the Y direction may be 14 mm to 15 mm. In some embodiments, the value of the ratio between the dimension of the housing 111 in the X direction and the dimension of the housing 111 in the Y direction may be 1.2 to 5. In some embodiments, the ratio of the size of the housing 111 in the X direction to the size of the housing 111 in the Y direction may be 1.4 to 4. In some embodiments, the ratio of the size of the housing 111 in the X direction to the size of the housing 111 in the Y direction may be 1.5 to 2. In some embodiments, the length dimension of the housing 111 along the X direction may be in the range of 15 mm to 30 mm. In some embodiments, the length dimension of the housing 111 along the X direction may be 16 mm to 28 mm. In some embodiments, the length dimension of the housing 111 along the X direction may be 19 mm to 24 mm. In some embodiments, in order to avoid the housing 111 being too large in volume and affecting the wearing comfort of the earphone 10, the thickness dimension of the housing 111 along the Z direction may be in the range of 5 mm to 20 mm. In some embodiments, the thickness dimension of the housing 111 along the Z direction may be 5.1 mm to 18 mm. In some embodiments, the thickness dimension of the housing 111 along the Z direction may be 6 mm to 15 mm. In some embodiments, the thickness dimension of the housing 111 along the Z direction may be between 7 mm and 10 mm.In some embodiments, the area of ​​the inner surface IS of the housing 111 (equal to the product of the length and width dimensions of the housing 111 when the inner surface IS is rectangular) is 90 mm. 2 ~560mm 2 In some embodiments, the area of ​​the inner surface IS may be considered to be approximately equal to the projected area of ​​the diaphragm 1161 along the Z direction. For example, the difference between the area of ​​the inner surface IS and the projected area of ​​the diaphragm 1161 along the Z direction is 10%. In some embodiments, the area of ​​the inner surface IS may be 150 mm 2 ~360mm 2 In some embodiments, the area of ​​the inner surface IS is 160 mm 2 ~240mm 2 In some embodiments, the area of ​​the inner surface IS is 180 mm 2 ~200mm 2 10 to 13, the earphone 10 is worn in the manner shown in Fig. 14, and the dimensions of the earphone 10 may be smaller than those of a conventional earphone, on the premise that the dimensional design satisfies wearing comfort and the acoustic performance is superior to that of a conventional earphone, that is, the earphone 10 achieves equivalent excellent acoustic performance.

[0177] As shown in Fig. 22 and Fig. 23, in some embodiments, the distance from the center O of the sound emission hole 112 to the bottom surface of the magnetic circuit assembly 1164 along the Z direction may be related to the vibration range of the diaphragm 1161 and the thickness of the magnetic circuit assembly 1164. The vibration range of the diaphragm 1161 may affect the amount of air pushed by the transducer of the sound generating unit 11. The larger the vibration range of the diaphragm 1161, the larger the amount of air pushed by the transducer of the sound generating unit 11, and the higher the sound generating efficiency of the sound generating unit. The larger the thickness of the magnetic circuit assembly 1164, the larger the total weight of the sound generating unit 11, which affects the wearing comfort of the user. In addition, when the thickness of the sound generating unit in the Z direction is constant, the smaller the distance from the center O of the sound emitting hole 112 to the bottom surface of the magnetic circuit assembly 1164 along the Z direction, the larger the volume of the rear cavity may be, and in this case, the smaller the resonance frequency of the rear cavity, the lower the resonance peak of the rear cavity moves to, and the smaller the range of the flat region of the frequency response curve becomes. In order to ensure that the sound generating efficiency of the sound generating unit is sufficiently high, the resonance frequency of the rear cavity is within an appropriate frequency range (e.g., 1000Hz to 5000Hz), and the user's wearing comfort is sufficient, the range of the distance from the center O of the sound emitting hole 112 to the bottom surface of the magnetic circuit assembly 1164 along the Z direction (i.e., the side of the housing member 11643 away from the sound emitting hole 112 along the Z direction) is 5.65mm to 8.35mm, taking into consideration the structural strength, the difficulty of realizing the process, and the overall thickness of the housing 111. In some embodiments, the range of the distance from the center of the sound emitting hole 112 to the bottom surface of the magnetic circuit assembly 1164 along the Z direction is 6.00 mm to 8.00 mm. In some embodiments, the range of the distance from the center of the sound emitting hole 112 to the bottom surface of the magnetic circuit assembly 1164 along the Z direction is 6.35 mm to 7.65 mm. In some embodiments, the range of the distance from the center of the sound emitting hole 112 to the bottom surface of the magnetic circuit assembly 1164 along the Z direction is 6.70 mm to 7.30 mm. In some embodiments, the range of the distance from the center of the sound emitting hole 112 to the bottom surface of the magnetic circuit assembly 1164 along the Z direction is 6.95 mm to 7.05 mm.

[0178] In some embodiments, in order to increase the resonant frequency of the rear cavity and increase the acoustic capacitance Ca of the rear cavity, the volume V value of the rear cavity needs to be in an appropriate range. In some embodiments, in order to set the volume value of the rear cavity in an appropriate range, the distance from the center O1 of the first decompression hole 1131 to the bottom surface of the magnetic circuit assembly 1164 can be reasonably designed. As shown in FIG. 22 and FIG. 23, when the thickness of the sound generating unit 11 in the Z direction is constant, the smaller the distance from the center O1 of the first decompression hole 1131 to the bottom surface of the magnetic circuit assembly 1164 along the Z direction, the larger the volume of the rear cavity may be, and in this case, the acoustic capacitance Ca of the rear cavity increases, but the corresponding resonance frequency of the rear cavity decreases. In order to ensure that the sound generating efficiency of the sound generating unit 11 is sufficiently high, the resonant frequency of the rear cavity is within an appropriate frequency range (e.g., 2000 Hz to 6000 Hz), and the user's wearing comfort is sufficient, the structural strength, the difficulty of process realization, and the overall thickness of the housing 111 are taken into consideration comprehensively, and the distance d5 from the center O1 of the first decompression hole 1131 to the bottom surface of the magnetic circuit assembly 1164 (i.e., the side of the housing member 11643 that is away from the sound emission hole 112 along the Z direction) is in the range of 1.31 mm to 1.98 mm. In some embodiments, the distance d5 from the center O1 of the first decompression hole 1131 to the bottom surface of the magnetic circuit assembly 1164 along the Z direction is in the range of 1.31 mm to 1.98 mm. In some embodiments, the range of the distance d5 from the center O1 of the first decompression hole 1131 to the bottom surface of the magnetic circuit assembly 1164 along the Z direction is 1.41 mm to 1.88 mm. In some embodiments, the range of the distance d5 from the center O1 of the first decompression hole 1131 to the bottom surface of the magnetic circuit assembly 1164 along the Z direction is 1.51 mm to 1.78 mm. In some embodiments, the range of the distance d5 from the center O1 of the first decompression hole 1131 to the bottom surface of the magnetic circuit assembly 1164 along the Z direction is 1.56 mm to 1.72 mm.Similarly, in some embodiments, the range of the distance d6 from the center O2 of the second decompression hole 1132 to the bottom surface of the magnetic circuit assembly 1164 along the Z direction is 1.31 mm to 1.98 mm. In some embodiments, the range of the distance d6 from the center O2 of the second decompression hole 1132 to the bottom surface of the magnetic circuit assembly 1164 along the Z direction is 1.41 mm to 1.88 mm. In some embodiments, the range of the distance d6 from the center O2 of the second decompression hole 1132 to the bottom surface of the magnetic circuit assembly 1164 along the Z direction is 1.51 mm to 1.78 mm. In some embodiments, the range of the distance d6 from the center O2 of the second decompression hole 1132 to the bottom surface of the magnetic circuit assembly 1164 along the Z direction is 1.56 mm to 1.72 mm.

[0179] In some embodiments, when the thickness of the sound generating unit is constant, the difference between the distance along the Z direction from the center O of the sound emission hole 112 to the bottom surface of the magnetic circuit assembly 1164 and the distance along the Z direction from the center O1 of the first decompression hole 1131 to the bottom surface of the magnetic circuit assembly 1164 should not be too large or too small. If it is too large, the volume of the front cavity will be too large, which is likely to cause the resonant frequency of the front cavity to be small, and if it is too small, the volume of the front cavity will be too small, which is likely to cause the vibration range of the diaphragm 1161 to be small, which affects the amount of air pushed by the transducer of the sound generating unit 11 and affects the sound generation efficiency of the sound generating unit 11. In some embodiments, in order to ensure that the sound generating efficiency of the sound generating unit 11 is sufficiently high, the resonance frequency of the rear cavity is within an appropriate frequency range (e.g., 2000 Hz to 6000 Hz), and the user's wearing comfort is sufficient, the distance between the first decompression hole 1131 and the second decompression hole 1132 and the sound emission hole 112 in the Z direction is limited to increase the sound collection effect of the sound emission hole 112 in the ear canal and increase the sound leakage cancellation effect. In some embodiments, the difference between the distance from the center O of the sound emission hole 112 to the bottom surface of the magnetic circuit assembly 1164 along the Z direction and the distance from the center O1 of the first decompression hole 1131 to the bottom surface of the magnetic circuit assembly 1164 along the Z direction is within a range of 3.65 mm to 7.05 mm. In some embodiments, the difference between the distance along the Z direction from the center O of the sound emitting hole 112 to the bottom surface of the magnetic circuit assembly 1164 and the distance along the Z direction from the center O1 of the first decompression hole 1131 to the bottom surface of the magnetic circuit assembly 1164 is within a range of 4.00 mm to 6.85 mm. In some embodiments, the difference between the distance along the Z direction from the center O of the sound emitting hole 112 to the bottom surface of the magnetic circuit assembly 1164 and the distance along the Z direction from the center O1 of the first decompression hole 1131 to the bottom surface of the magnetic circuit assembly 1164 is within a range of 4.80 mm to 5.50 mm.In some embodiments, the difference between the distance along the Z direction from the center O of the sound emission hole 112 to the bottom surface of the magnetic circuit assembly 1164 and the distance along the Z direction from the center O1 of the first decompression hole 1131 to the bottom surface of the magnetic circuit assembly 1164 is within the range of 5.20 mm to 5.55 mm.

[0180] In some embodiments, the distance along the Z direction from the center O1 of the first decompression hole 1131 to the bottom surface of the magnetic circuit assembly 1164 may be the same as the distance along the Z direction from the center O2 of the second decompression hole 1132 to the bottom surface of the magnetic circuit assembly 1164. In some embodiments, in order to increase the listening volume by reducing the effect of sound emanating from the second decompression hole 1132 canceling out sound emanating from the sound emission hole 112 in the ear canal (i.e., the listening position), the second decompression hole 1132 may be farther away from the sound emission hole 112 in the Z direction than the first decompression hole 1131. For example, when the difference between the distance from the center O of the sound emission hole 112 to the bottom surface of the magnetic circuit assembly 1164 along the Z direction and the distance from the center O1 of the first decompression hole 1131 to the bottom surface of the magnetic circuit assembly 1164 along the Z direction is within a range of 3.67 mm to 5.57 mm, the difference between the distance from the center O of the sound emission hole 112 to the bottom surface of the magnetic circuit assembly 1164 along the Z direction and the distance from the center O2 of the second decompression hole 1132 to the bottom surface of the magnetic circuit assembly 1164 along the Z direction is within a range of 5.57 mm to 7.04 mm.

[0181] In some embodiments, the range of the distance from the center O of the sound emitting hole 112 to the long axis central plane of the magnetic circuit assembly 1164 (for example, the surface NN' facing inward perpendicular to the paper surface as shown in FIG. 23) is 1.45 mm to 2.15 mm. In this specification, the long axis central plane of the magnetic circuit assembly 1164 refers to a plane that is parallel to the lower side surface LS of the sound generating unit 11 and passes through the geometric center of the magnetic circuit assembly 1164. In other words, the long axis central plane of the magnetic circuit assembly 1164 can divide the magnetic circuit assembly 1164 into two equal parts along the direction X. The distance between the center O of the sound emitting hole 112 and the long axis central plane of the magnetic circuit assembly 1164 is the distance from the center O of the sound emitting hole 112 to the long axis central plane along the short axis direction Y. In some embodiments, the range of the distance from the center O of the sound emitting hole 112 to the long axis central plane is 1.55 mm to 2.05 mm. In some embodiments, the range of the distance from the center O of the sound emitting hole 112 to the long axis central plane is 1.65 mm to 1.95 mm. In some embodiments, the range of the distance from the center O of the sound emitting hole 112 to the long axis central plane is 1.75 mm to 1.85 mm.

[0182] In some embodiments, the dimension of the sound generating unit 11 along the Y direction may be limited in order to match the dimension of the sound generating unit 11 with the dimension of the cavity of the concha. In some embodiments, the dimension of the sound generating unit 11 along the Y direction may be determined by the distance from the center O1 of the first decompression hole 1131 to the long axis central surface of the magnetic circuit assembly 1164 (for example, the surface NN' facing inward perpendicular to the paper surface shown in FIG. 23). In some embodiments, in order to facilitate design, the distance from the center O1 of the first decompression hole 1131 to the long axis central surface of the magnetic circuit assembly 1164 (for example, the surface NN' facing inward perpendicular to the paper surface shown in FIG. 23) may be limited. In some embodiments, the range of the distance from the center O1 of the first decompression hole 1131 to the long axis central surface of the magnetic circuit assembly 1164 is 5.45 mm to 8.19 mm. In the present application, the long axis central plane of the magnetic circuit assembly 1164 refers to a plane that is parallel to the lower side surface LS of the sound generating unit 11 and passes through the center of mass of the magnetic circuit assembly 1164. That is, the long axis central plane of the magnetic circuit assembly 1164 can divide the magnetic circuit assembly 1164 into two equal parts along the direction X. The distance between the center O1 of the first decompression hole 1131 and the long axis central plane of the magnetic circuit assembly 1164 is the distance from the center O1 of the first decompression hole 1131 to the long axis central plane along the short axis direction Y. In some embodiments, the range of the distance from the center O1 of the first decompression hole 1131 to the long axis central plane of the magnetic circuit assembly 1164 is 5.95 mm to 8.69 mm. In some embodiments, the range of the distance from the center O1 of the first decompression hole 1131 to the long axis central plane of the magnetic circuit assembly 1164 is 6.45 mm to 7.19 mm. In some embodiments, the range of the distance from the center O1 of the first decompression hole 1131 to the longitudinal central plane of the magnetic circuit assembly 1164 is 6.65 mm to 6.99 mm. Similarly, in some embodiments, the range of the distance from the center O2 of the second decompression hole 1132 to the longitudinal central plane of the magnetic circuit assembly 1164 is 5.46 mm to 8.20 mm. In some embodiments, the range of the distance from the center O2 of the second decompression hole 1132 to the longitudinal central plane of the magnetic circuit assembly 1164 is 5.96 mm to 8.70 mm.In some embodiments, the range of the distance from the center O2 of the second decompression hole 1132 to the longitudinal central plane of the magnetic circuit assembly 1164 is 6.46 mm to 7.20 mm. In some embodiments, the range of the distance from the center O2 of the second decompression hole 1132 to the longitudinal central plane of the magnetic circuit assembly 1164 is 6.66 mm to 7.00 mm.

[0183] In some embodiments, in order to bring the sound emitting hole 112 closer to the ear canal, the sound emitting hole 112 can be arranged closer to the second decompression hole 1132 than to the first decompression hole 1131 in the Y direction. By limiting the distance between the first decompression hole 1131 and the second decompression hole 1132 and the sound emitting hole 112 in the Y direction, the sound collection effect of the sound emitting hole 112 in the ear canal can be increased and the far-field sound leakage cancellation effect can be increased. In some embodiments, the absolute value of the difference between the distance from the center O of the sound emitting hole 112 to the long axis central plane of the magnetic circuit assembly 1164 along the Y direction and the distance from the center O1 of the first decompression hole 1131 to the long axis central plane along the Y direction is within a range of 4.0 mm to 6.1 mm. In some embodiments, the absolute value of the difference between the distance from the center O of the sound emitting hole 112 to the long axis central plane and the distance from the center O1 of the first decompression hole 1131 to the long axis central plane is within a range of 4.5 mm to 5.5 mm. In some embodiments, the absolute value of the difference between the distance from the center O of the sound emission hole 112 to the long axis central surface and the distance from the center O1 of the first decompression hole 1131 to the long axis central surface is within a range of 4.8 mm to 5.2 mm.

[0184] In some embodiments, due to the presence of the decompression holes 113 (e.g., the first decompression hole 1131 and the second decompression hole 1132), the air pressure in the rear cavity at a position close to the decompression hole 113 is close to the outside air pressure, and the air pressure in the rear cavity away from the decompression hole 113 is higher than the outside air pressure. Since the frame 1163 is provided with a sound vent hole (not shown) that communicates the rear side of the diaphragm 1161 with the cavity 115, the sound vent hole of the frame can be provided asymmetrically to balance the airflow between the rear side of the diaphragm 1161 and the cavity 115. Specifically, the size of the sound vent hole may be large at a position away from the first decompression hole 1131 and / or the second decompression hole 1132 because the air pressure is high, and the size of the sound vent hole may be small at a position close to the first decompression hole 1131 and / or the second decompression hole 1132 because the air pressure is low. In some embodiments, the vibration of the earphone 10 at low frequencies can be made more stable by adjusting the dimensions (e.g., area size) of the first decompression hole 1131, the second decompression hole 1132, and / or the sound vent hole. In some embodiments, in order to make the air pressure in the rear cavity more stable and the vibration of the diaphragm more stable, the first decompression hole 1131 and the second decompression hole 1132 can be installed with a shift in the X direction. At this time, the first decompression hole 1131 and the second decompression hole 1132 are installed so that their projections onto the long axis central plane partially overlap or do not overlap. In some embodiments, the overlapping area of ​​the projections of the first decompression hole 1131 and the second decompression hole 1132 onto the long axis central plane is 10.77 mm 2 In some embodiments, the overlap area of ​​the first decompression hole 1131 and the second decompression hole 1132 projected onto the long axis central plane is 6.77 mm 2 In some embodiments, the overlap area of ​​the first decompression hole 1131 and the second decompression hole 1132 projected onto the long axis central plane is 4.77 mm 2 In some embodiments, the overlap area of ​​the first decompression hole 1131 and the second decompression hole 1132 projected onto the long axis central plane is 2.77 mm 2 The following is the result.

[0185] Although the basic concept has been described above, it is clear to those skilled in the art that the detailed disclosure above is merely presented as an example and does not limit the present application. Although not explicitly described in this specification, those skilled in the art can make various changes, improvements and modifications to the present application. These changes, improvements and modifications are intended to be suggested by the present application and therefore are within the spirit and scope of the exemplary embodiments of the present application.

[0186] The specific embodiments described in this application are merely illustrative, and one or more technical features in the specific embodiments are optional or optional, and are not required technical features constituting the inventive concept of this application. In other words, the scope of protection of this application covers the specific embodiments and is much larger than them. [Explanation of symbols]

[0187] 10. Earphones 11 Sound generation section 111 Housing 112 Sound emission hole 113 Pressure reduction hole 1131 First decompression hole 1132 Second decompression hole 12 Ear hooks 116 Transducer 1161 Vibration plate 114 Front Cavity 116 Rear cavity 1164 Magnetic Circuit Assembly 118 Acoustic Resistance Mesh

Claims

1. a sound generating portion including a transducer including a diaphragm for generating sound under the action of an excitation signal, and a housing defining a cavity for receiving said transducer; a suspension structure for mounting the sound generating unit in a position near the ear canal but not blocking the ear canal when the sound generating unit is mounted in the ear canal; A sound output hole is formed on an inner surface of the housing facing the auricle, through which sound generated in front of the diaphragm is guided out of the housing and transmitted to the ear canal, The earphone has a first decompression hole formed on another side of the housing for guiding sound generated behind the diaphragm out of the housing, and the distance from the center of the sound emission hole to the midpoint of the upper boundary of the inner side is greater than the distance from the center of the first decompression hole to the midpoint of the upper boundary of the inner side.

2. The earphone according to claim 1, wherein a ratio of a distance from a center of the sound emission hole to a midpoint of an upper boundary of the inner surface and a distance from a center of the first decompression hole to a midpoint of an upper boundary of the inner surface is within a range of 1.3 to 2.

1.

3. The earphone according to claim 1 or 2, wherein the ratio of the area of ​​the sound emission hole to the depth of the sound emission hole and the ratio of the area of ​​the first decompression hole to the depth of the first decompression hole is in the range of 1.10 to 1.

75.

4. The earphone according to any one of claims 1 to 3, wherein a ratio of an area of ​​the sound emission hole to an area of ​​the first decompression hole is within a range of 0.5 to 1.

5.

5. The earphone according to any one of claims 1 to 4, wherein, when the earphone is worn, the ratio of the distance from the projection point of the center of the sound emission hole onto the sagittal plane to the centroid of the projection of the ear canal opening of the ear canal onto the sagittal plane to the distance from the projection point of the center of the first decompression hole onto the sagittal plane to the centroid of the projection of the ear canal opening onto the sagittal plane is within a range of 0.10 to 0.

35.

6. The earphone described in any one of claims 1 to 5, wherein the suspension structure includes an ear hook, and in a worn state, a first portion of the ear hook is hung between a user's auricle and head, and a second portion of the ear hook extends on the side of the auricle facing away from the head and is connected to the sound generating unit, and a ratio of the distance from the center of the sound emission hole to the upper vertex of the ear hook and the distance from the center of the first pressure reduction hole to the upper vertex of the ear hook is within a range of 1.10 to 1.

70.

7. The earphone according to any one of claims 1 to 6, wherein the transducer further includes a magnetic circuit assembly that provides a magnetic field, and an absolute value of a difference between a distance from a center of the sound emission hole to a longitudinal central plane of the magnetic circuit assembly and a distance from a center of the first decompression hole to the longitudinal central plane is within a range of 4.0 mm to 6.1 mm.

8. The earphone according to claim 7, wherein a difference between a distance from a center of the sound emission hole to a bottom surface of the magnetic circuit assembly and a distance from a center of the first decompression hole to the bottom surface of the magnetic circuit assembly is within a range of 3.65 mm to 7.05 mm.

9. The earphone according to claim 1 , wherein a second decompression hole is further formed on another side surface of the housing, and an area of ​​the first decompression hole is larger than an area of ​​the second decompression hole.

10. The earphone according to claim 9, wherein a distance from a center of the sound emission hole to a perpendicular bisector of a line connecting the center of the first decompression hole and the center of the second decompression hole is 0 mm to 2 mm.

11. The earphone according to claim 10 , wherein the first decompression hole is formed in an upper surface of the housing, and the second decompression hole is formed in a lower surface of the housing.

12. The earphone according to any one of claims 9 to 11, wherein, when the earphone is worn, the ratio of the distance from the projection point of the center of the sound emission hole onto the sagittal plane to the projection point of 1 / 3 of the lower boundary of the inner surface onto the sagittal plane to the distance from the projection point of the center of the second decompression hole onto the sagittal plane to the projection point of 1 / 3 of the lower boundary of the inner surface onto the sagittal plane is within a range of 0.65 to 1.

05.

13. The earphone according to any one of claims 9 to 12, wherein an included angle between a line connecting the center of the sound emitting hole and the center of the first decompression hole and a line connecting the center of the sound emitting hole and the center of the second decompression hole is within a range of 46.40° to 114.04°.

14. The earphone according to any one of claims 9 to 13, wherein a ratio of a distance from the center of the sound emission hole to the center of the first decompression hole to a distance from the center of the sound emission hole to the center of the second decompression hole is within a range of 0.9 to 1.

1.

15. The earphone according to any one of claims 9 to 14, wherein a ratio of an area of ​​the sound emission hole to a total area of ​​the first decompression hole and the second decompression hole is within a range of 0.1 to 0.

99.

16. The earphone according to claim 15, wherein the diaphragm divides the cavity into a front cavity and a rear cavity corresponding to a front side and a rear side of the diaphragm, respectively, and a ratio of a volume of the rear cavity to a volume of the front cavity is in a range of 0.1 to 10.

17. The earphone according to claim 15, wherein the diaphragm divides the cavity into a front cavity and a rear cavity corresponding to the front and rear sides of the diaphragm, respectively, and a ratio of a resonant frequency of the front cavity to a resonant frequency of the rear cavity is within a range of 0.1 to 5.

18. The earphone according to any one of claims 9 to 14, wherein a ratio of an area of ​​the sound emission hole to a total area of ​​the first decompression hole and the second decompression hole is in a range of 1 to 10.

19. The earphone according to claim 18, wherein the diaphragm divides the cavity into a front cavity and a rear cavity corresponding to the front side and rear side of the diaphragm, respectively, and a ratio of the volume of the rear cavity to the volume of the front cavity is in the range of 0.1 to 10.

20. The earphone according to claim 18, wherein the diaphragm divides the cavity into a front cavity and a rear cavity corresponding to the front side and the rear side of the diaphragm, respectively, and a ratio of a resonant frequency of the front cavity to a resonant frequency of the rear cavity is within a range of 0.5 to 10.

21. The earphone according to any one of claims 9 to 20, wherein a ratio of the sound pressure at the sound output hole to a total sound pressure at the first decompression hole and the second decompression hole is within a range of 0.4 to 0.

6.

22. The earphone according to any one of claims 9 to 21, wherein a ratio of a difference between an area of ​​the first decompression hole and an area of ​​the second decompression hole to an area of ​​the sound emission hole is within a range of 2.5 to 3.

9.

23. The earphone according to any one of claims 9 to 22, wherein an acoustic resistance mesh is installed in at least one of the first decompression hole and the second decompression hole in the sound emission hole, and the thickness of the acoustic resistance mesh is in the range of 40 μm to 150 μm.

24. The earphone according to claim 23, wherein the acoustic resistance mesh in the sound emission hole includes a steel mesh, and the mesh number of the steel mesh is in the range of 60 to 100.

25. The earphone according to claim 23, wherein the acoustic resistance mesh in the sound emission hole includes a steel mesh, and the mesh number of the steel mesh is in the range of 70 to 90.

Images