Method and apparatus for processing a solar module

Abstract

The present invention relates to a method for processing solar modules by a recycling facility, the method comprising the following steps: detecting a solar module by at least one sensor, as a result of which the at least one sensor transmits measurement data to an electrical controller, the measurement data including information about the solar module; evaluating the measurement data to determine operating parameters of the recycling facility; and processing the solar module in a recycling facility operating using the determined operating parameters.

Description

Technical Field

[0001] The present invention relates to a method for processing solar modules by recycling equipment and an apparatus for performing such a method.

Background Art

[0002] Solar modules have come to be widely used in various forms for generating electricity from sunlight. A small number of these solar modules are placed on the roofs of individuals such as residential buildings, and can at least partially cover the power demand of the houses where the solar modules are installed. Such distributed energy supply is also increasingly being used, for example, to enable distributed charging of electric vehicles. However, solar modules are also used in large facilities on land otherwise used for agriculture and are also used for commercial power generation and transmission to the public power grid.

[0003] The problem is that the service life of solar modules is limited. Expensive raw materials are used in the manufacture of solar modules. Most solar modules have, for example, electrical conductor paths made of silver. For this reason alone, there is a need for a method that allows these raw materials to be recycled and reused. Furthermore, the increase in the number of solar modules that reach the end of their service life and are thus selected results in a large amount of waste that must be recycled or reprocessed against the backdrop of the environmental friendliness of power generation boasted by solar power generation compared to other solar modules.

[0004] A very diverse variety of solar modules are known from the prior art. However, several elements are included in most of the known solar modules. Solar modules usually have a substrate on which electrical conductor paths or other metal components are arranged. This can be manufactured from silicon or glass. Furthermore, solar modules usually have an uppermost layer that defines the solar module outwardly and is usually made of glass or another material that is at least partially, but preferably completely, transparent to visible light.

[0005] Different solar modules need to be recycled in different ways in order to reach valuable raw materials and make them further utilizable. Therefore, various methods are known from various prior art documents. For solar modules with metal components arranged on a glass substrate, for example, in Japanese Patent Application Laid-Open No. 2014-54593, a method of mechanically removing these components is proposed.

Prior Art Documents

Patent Documents

[0006]

Patent Document 1

Summary of the Invention

[0007] The present invention is based on the problems of simplifying the method of processing solar modules and enabling the processing of more different-structured solar modules.

[0008] The present invention is a method of processing solar modules by a recycling facility, the method comprising the following steps, namely - detecting a solar module by at least one sensor, as a result of which the at least one sensor transmits measurement data to an electric controller, the measurement data including information about the solar module, - evaluating the measurement data to determine the operating parameters of the recycling facility, - processing the solar module in a recycling facility operating using the determined operating parameters and solving the above problems by the method including these steps.

Embodiments for Carrying Out the Invention

[0009] Accordingly, in the method according to the invention, the solar module to be processed is detected by a sensor. In that case, it is only important that the solar module can be detected completely or partially, and that the measurement data obtained in that case contains information about the solar module. The measurement data transmitted from the sensor to the electrical controller contains information about the solar module. This information includes, for example, the geometry and / or weight of the solar module or one or more parts of the solar module, for example individual layers. Information regarding the transmission characteristics and / or regarding the material or materials of which the solar module is at least partially formed may also be included in this information. In addition or alternatively, this information can include a model name, manufacturer name, logo, serial number and / or series, barcode or QR code (registered trademark), so that the model of the solar module can be identified to the extent that the operating parameters can be determined. Furthermore, it is advantageous if the solar module can be uniquely identified. However, in many cases it is sufficient to determine some parameters or characteristics of the solar module, or for example the series or type of the solar module.

[0010] Measurement data is understood to mean, in particular, all data that can be detected and transferred by a sensor, i.e. in particular also image data and the information contained therein.

[0011] The electrical controller is preferably an electronic data processing device that evaluates the measurement data transmitted from the sensor and determines the operating parameters used to operate the recycling facility when subsequently processing the solar module based on the evaluated measurement data and / or the information about the solar module extracted therefrom.

[0012] Preferably, at least one sensor has at least one optical sensor, in particular at least one optical camera and / or barcode scanner, and preferably the measurement data is digital image data. Instead of or in addition to this, at least one sensor has an acoustic sensor, for example an ultrasonic sensor, preferably an ultrasonic transmitter. Instead of or in addition to this, at least one sensor has at least one distance sensor, at least one scale (Waage), at least one layer thickness sensor, and / or a system for performing Laser Induced Breakdown Spectroscopy (LIBS).

[0013] Particularly preferably, the measurement data is evaluated by image recognition software. The image recognition software is executed in an electrical controller and evaluates the measurement data transmitted by at least one optical sensor. Advantageously, the measurement data is compared by the electrical controller with reference data stored in an electronic database.

[0014] Particularly preferably, the electrical controller can uniquely identify the type of the solar module from the measurement data. This is done, for example, when the image recognition software recognizes the type name and / or serial number in the measurement data, i.e., the digital image data. In that case, the type name and / or serial number do not necessarily have to be in the form of letters and / or numbers and can exist in a purely machine-readable form, for example in the form of a barcode or QR code and can also be recognized. The electrical controller is preferably set to access an electronic data storage device in which information about various types of solar modules is stored in an electronic form and can be read by the electrical controller. Preferably, the electronic data storage device includes a database in which the respective operating parameters of different types of solar modules that can be processed are stored. The electrical controller is preferably set to compare the recognized type of the solar module with that registered in the database and read the operating parameters optimal for this type of solar module stored in the database.

[0015] The electric controller sends a control command including operating parameters in a form understandable by the recycling facility to the recycling facility. As a result, the recycling facility operates using the determined operating parameters for the solar module to be processed.

[0016] The measurement data can also include information regarding the individual components and layers of the solar module in addition to the type of the solar module. This corresponds, for example, to the geometric dimensions of different layers, i.e., the spatial extent. For example, information regarding the size and / or thickness of a glass layer, e.g., the top layer, and / or information regarding the refractive index and / or reflection coefficient of the glass used, and / or information regarding the composition of the glass can be included in the measurement data and can be evaluated by the electric controller. In this case, the electric controller is preferably configured to access an electronic database in an electronic data storage device and determine the required operating parameters from the evaluated measurement data and the information extracted therefrom.

[0017] Advantageously, the solar module has a substrate including an upper surface on which metal conductor paths are arranged. The solar module further has a top layer arranged on the upper surface of the substrate via an adhesive layer. When processing the solar module, the adhesive layer is heated, and as a result, the adhesive layer at least partially, but preferably completely, loses its adhesive action. Subsequently, the top layer is removed from the substrate by a tool. Thereafter, the metal conductor paths are mechanically removed, and the removed material is collected.

[0018] Preferably, the operating parameters include information on how long, how, at what speed, and / or at what temperature the adhesive layer is heated, and / or whether the entire adhesive layer is heated, or which part of the adhesive layer is heated. Preferably, the adhesive layer is heated by infrared radiation and / or electromagnetic induction and / or microwave radiation. Preferably, the recycling facility has separate heat sources for some, preferably all, of these possibilities. In this case, which of these heat sources is used is included in the operating parameters. Preferably, the recycling facility has a plurality of heat sources. Each of these heat sources can enable different heating possibilities or the same heating possibilities. For example, there can be a plurality of heat sources of one type, such as a plurality of infrared sources. Preferably, the operating parameters include information on which heat source is used to heat the adhesive layer or a part of the adhesive layer. This is significant, for example, when the heat source is set to heat a spatial area larger than the upper surface of the solar module.

[0019] The heating is preferably carried out at a temperature exceeding 180°C, preferably exceeding 200°C, particularly preferably exceeding 230°C, and less than 400°C, preferably less than 350°C, particularly preferably less than 280°C. Preferably, which temperature is used is included in the operating parameters.

[0020] Particularly when using infrared radiation or microwave radiation, it is advantageous to provide the radiation through a top layer that is preferably at least partially, but preferably completely transparent to each type of radiation. The infrared radiation used for this purpose preferably has a wavelength of 1000 - 4000 nm, preferably 1000 - 2000 nm. Preferably, which wavelength is used is included in the operating parameters. When microwave radiation is used, this preferably has a frequency of 2.4 GHz - 2.5 GHz, preferably 2.45 GHz. Alternatively, the microwave radiation has a frequency of 5.8 GHz.

[0021] In the case of heating by electromagnetic induction, an alternating magnetic field with a frequency preferably in the range of 1 kHz to 500 kHz is used. The usable frequency range is called the low-frequency range and includes frequencies from 1 kHz to 7 kHz. Another frequency range is called the medium-frequency range and includes frequencies from 8 kHz to 40 kHz. The high-frequency range includes frequencies from 60 kHz to 500 kHz. Preferably, the frequency used is from 25 kHz to 300 kHz, particularly preferably from 25 kHz to 100 kHz.

[0022] Preferably, the operating parameters include which tool is used to remove the top layer, preferably a spatula, trowel, knife, blade, and / or wire, and / or other tools. Particularly preferably, the operating parameters include which working parameters should be used. The working parameters include information regarding, for example, the contact angle (Anstellwinkel) and / or the pressing pressure (Anpressdruck) of the tool.

[0023] In a preferred embodiment, the operating parameters include the removal method by which the metal conductor path is removed. In particular, the operating parameters include whether this is done by brushing, milling, planing, vertical milling, end milling, slot milling, broaching, radiused cutting, and / or grinding. Particularly preferably, the operating parameters include the process parameters for the removal. The method parameters include information regarding, for example, the contact angle of the tool and / or the pressing pressure, the rotational speed of the brush and / or the grinding element, or the force or impact frequency used.

[0024] Preferably, the operating parameters include whether the top layer is damaged before removal. If this is the case, the operating parameters further preferably include whether the top layer is damaged by a spatula, trowel, knife, and / or wire, and / or other tools.

[0025] Preferably, in the method, the adhesive layer is heated to an adhesive layer temperature and the underside of the substrate is cooled to an underside temperature. By heating the adhesive layer, it is possible to remove the top layer from the remaining layer elements. The top layer is preferably a glass layer, which is particularly preferably formed completely transparent to visible light. By heating the adhesive layer, the adhesive strength of the adhesive layer is reduced and the top layer can be removed. The heat introduced into the adhesive layer is transferred in the layer elements and gradually heats the other layers and elements of the layer elements as well. In many cases, a plastic layer, for example made from polyvinyl fluoride (PVF), is arranged on the underside of the substrate. The material of this plastic layer is usually less heat-resistant than the substrate, the top layer and especially the adhesive layer. The heat introduced to heat the adhesive layer can also heat and decompose the plastic layer, which can lead to the release of harmful and health-damaging gases. According to the invention, this is prevented by cooling the underside of the substrate to an underside temperature.

[0026] In the sense of the present invention, treating a layer element includes, for example, that the layer element is at least partially decomposed. In a preferred embodiment, this is done by completely or partially removing the top layer from the substrate. This is preferably done without damaging or destroying the top layer in the process. However, this does not necessarily have to be the case. It is also "treating" in the sense of the present invention when the top layer is completely or partially removed from the substrate and / or when it is damaged or destroyed before being completely or partially removed from the substrate.

[0027] This does not mean that the underside is cooled during the method, for example to a temperature below room temperature. The underside of the substrate of the layer element is at a temperature well below the underside temperature aimed for in the method before the start of the method. It merely means that heat is conducted from the underside of the substrate to achieve and preferably maintain the underside temperature, which is lower than the adhesive layer temperature.

[0028] A cooling device is present for cooling the underside of the substrate to an underside temperature, and heat is conducted away from the underside of the substrate by the cooling device.

[0029] The difficult problems solved by these embodiments by this method are, for example, that the conductor paths of the layer elements of a solar module made from precious raw materials are not externally accessible. These are located on the upper surface of the substrate, but are covered by an uppermost layer attached via at least one adhesive layer. When the adhesive layer is heated, its adhesive action decreases, and as a result, the uppermost layer and the substrate can then be separated from each other. Thereafter, access can be obtained to the conductor paths arranged on the upper surface of the substrate. Next, these are removed from the substrate by mechanical removal, and the further removed material is collected.

[0030] Preferably, the operating parameters include how long, how, at what speed, and / or at what temperature the lower surface is cooled, and / or whether the entire lower surface is heated, or which part of the lower surface is heated.

[0031] Preferably, the layer element is a solar module, and the layer element particularly preferably has a metal conductor path arranged on the upper surface of the substrate and covered by an uppermost layer.

[0032] Preferably, the adhesive layer temperature is at least 180 °C, preferably at least 200 °C, particularly preferably at least 230 °C, and at most 400 °C, preferably at most 350 °C, particularly preferably at most 280 °C. This is particularly advantageous when the adhesive layer consists of or contains ethylene vinyl acetate (EVA). The adhesive layer temperature is preferably selected such that thermal decomposition of the adhesive layer, which may release gases that are partially toxic and harmful to the environment, has not yet occurred. This is avoided at temperatures below 400 °C. When the temperature exceeds 180 °C, preferably exceeds 200 °C, acetic acid is released in the EVA adhesive layer, which forms a lubricating film between the layers bonded by the adhesive layer. Thereby, the adhesive force provided by the adhesive layer decreases, and the two elements bonded to each other can be separated from each other. Therefore, preferably, a film made at least from EVA is also used as the adhesive layer.

[0033] Preferably, the bottom surface temperature is at most 150°C, preferably at most 110°C, and particularly preferably at most 100°C. The lower this temperature, the smaller the influence of heat on the layer disposed on the bottom surface of the substrate.

[0034] Preferably, the substrate has a structure composed of a plurality of layers arranged adjacent to each other. The bottom surface of the substrate forms the bottom surface of the layer element to be processed by the method described in this specification. The substrate has, for example, a substrate preferably made of silicon, particularly preferably consisting of silicon, and including a charge-doped zone and a vacancy-doped zone. A metal conductor path is disposed on the upper surface of this substrate that forms the upper surface of the substrate. The bottom surface of the substrate does not necessarily have to form the bottom surface of the layer element. Another layer, for example, the plastic layer already mentioned, can be disposed on the bottom surface of the substrate. The bottom surface of the substrate preferably forms the bottom surface of the layer element.

[0035] The present invention further solves the above problems by an apparatus for processing a solar module, the apparatus comprising at least one sensor for detecting the solar module, a recycling facility, and an electric controller configured to execute the method described in this specification.

[0036] Preferably, the apparatus has a heating device for heating the adhesive layer of the layer element to the adhesive layer temperature and a cooling device for cooling the bottom surface of the substrate of the layer element to the bottom surface temperature.

[0037] Preferably, the apparatus has a holding device for holding the layer elements processed by the apparatus. Preferably, the apparatus has a working table for supporting the layer elements, and the cooling device is preferably arranged within the working table. In a particularly preferred embodiment, the working table has a placement surface (Auflageflaeche), and during the execution of the method, the layer elements are placed on this placement surface. This placement surface is preferably coolable by the cooling device. The holding device for holding the layer elements is, for example, a tensioning device for applying a tensile force. This can have, for example, at least one negative pressure element, for example a suction element. The layer element is positioned, for example, over an opening within the placement surface closed by the layer element. By applying a negative pressure or suction force to the closed opening, a suction force, and thus a tensile force, is applied to the layer element, and this force holds the layer element to the placement surface.

[0038] Alternatively, or in addition to this, the holding device has a pressing device for applying a pressing force. The layer element is pressed against the placement surface by this pressing force. The pressing device preferably has at least one, preferably a plurality of, holding members (Niederhalter). These can preferably be moved relative to the placement surface. The holding members are preferably moved away from the placement surface in order to place the layer element to be processed on the placement surface. Thereafter, the holding members are lowered until they can contact the layer element and apply a pressing force to the layer element.

[0039] Preferably, the cooling device has at least one fluid passage through which a cooling medium can be conducted. The cooling medium is, for example, a coolant such as water, for example. Preferably, the cooling device has a pump for moving the cooling medium through the fluid passage. If the fluid passage is located within the working table, it is advantageous if it is made of a material with high thermal conductivity, for example metal, for example aluminum or steel.

[0040] Preferably, at least one cooling passage is located as close as possible to the original placement surface of the workbench, for example, at most 15 cm away from the placement surface, preferably at most 10 cm, and particularly preferably at most 5 cm. Preferably, the material of the workbench, at least the material of the workbench located between at least one cooling passage and the placement surface, has a high thermal conductivity. The material is preferably a metal, such as aluminum or steel.

[0041] Alternatively or in addition to this, the cooling device has at least one blower capable of sending air to the lower surface of the layer element. The blower can be designed, for example, in the form of one or more ventilators arranged and aligned to move air in the direction of the lower surface of the layer element.

[0042] Preferably, the device has a first temperature sensor for detecting the adhesive layer temperature and / or a second temperature sensor for detecting the lower surface temperature. Preferably, the first temperature sensor and / or the second temperature sensor has a pyrometer capable of preferably detecting the generated temperature non - contact.

[0043] Preferably, the device has an electric controller, particularly preferably an electronic data processing device set to control the heating device and / or the cooling device according to the detected adhesive layer temperature and / or the detected lower surface temperature. For this purpose, the respectively detected temperature is compared with the target temperature stored in the electronic data storage device. The target temperature can also be the temperature range in which the detected temperature should be. The electric controller is set to increase the output of the heating device and / or increase the heating duration when the detected adhesive layer temperature is considered too low compared to the stored target temperature. Preferably, the electric controller is alternatively or additionally set to increase the output of the cooling device and / or increase the cooling duration when the detected lower surface temperature is considered too high compared to the stored target temperature.

Claims

1. A method for processing solar modules by a recycling facility, comprising: the method comprising the following steps, namely: detecting the solar module by at least one sensor, as a result of which the at least one sensor transmits measurement data to an electrical controller, the measurement data comprising information about the solar module; evaluating the measurement data to determine operating parameters of the recycling facility; processing the solar module in the recycling facility operating using the determined operating parameters; A method comprising the above steps.

2. The method according to claim 1, characterized in that the at least one sensor comprises at least one optical sensor, in particular at least one optical camera, and the measurement data is preferably digital image data.

3. The method according to claim 2, characterized in that the measurement data is evaluated by image recognition software that compares the measurement data with reference data stored in an electronic database.

4. The solar module has a substrate with an upper surface on which metal conductor paths are arranged, and a top layer arranged on the upper surface of the substrate via an adhesive layer. When processing the solar module, the adhesive layer is heated, then the top layer is removed from the substrate by a tool, then the metal conductor paths are mechanically removed, and the removed materials are collected. The method according to any one of claims 1 to 3.

5. The method according to claim 4, characterized in that the operating parameters include how long, how, at what speed, and / or at what temperature the adhesive layer is heated, and / or whether the entire adhesive layer is heated, or which part of the adhesive layer is heated.

6. The method according to claim 4 or 5, characterized in that the operating parameters include which tool is used to remove the top layer, preferably a spatula, a trowel, a knife, a blade, and / or a wire, and / or whether other tools are used.

7. The method according to claim 6, characterized in that the operating parameters include working parameters for the tool.

8. The operation parameters include a removal method by which the metal conductor path is removed, in particular, whether the removal is performed by brushing, milling, planing, vertical milling, end milling, face milling, broaching, radiation cutting, and / or grinding, and the method according to any one of claims 4 to 7 is characterized in that it includes this.

9. The method according to claim 8 is characterized in that the operation parameters include process parameters for the removal method.

10. The operation parameters include whether to damage the uppermost layer before removal, preferably, whether the damage is caused by a spatula, a trowel, a knife, and / or a wire, and / or other tools, and the method according to any one of claims 4 to 9 is characterized in that it includes this.

11. An apparatus for processing a solar module, the apparatus having at least one sensor for detecting the solar module, a recycling facility, and an electric controller configured to execute the method according to any one of claims 1 to 10.

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