Antenna Module and Communication Device

Abstract

The present application provides an antenna module and a communication device. The antenna module includes a radiating element, a ground element, and a feeding element. The feeding element is a transmission line structure formed on an insulating support. The feeding element includes a feeding transmission portion and a grounding portion. The feeding transmission portion and the grounding portion have unequal widths and are configured to achieve current balance of the antenna module.

Description

Technical Field

[0001] [Technical Field] The present invention relates to the field of network communication technologies, and in particular, to an antenna module and a communication device.

Background Art

[0002] In a MIMO system, that is, a multiple-input multiple-output system, a plurality of transmission antennas and reception antennas are arranged, and specific data processing is executed to increase the communication capacity, thereby satisfying the increasing communication service requirements. In a communication device, it is necessary to connect a plurality of antenna elements to a radio frequency chip on a main board via a power supply cable. The power supply cable is configured to supply power to the antenna element. The power supply cable not only makes the internal space of the communication device messy, but also requires high processing accuracy to assemble and fix the power supply cable. As a result, it is difficult to reduce the cost of the communication device.

[0003] Therefore, how to ensure the antenna radiation performance On the premise of realize a cable-free design in the building, and simplify the internal structure of the communication device Simplification and reduce the assembly cost of the antenna module is a direction that the industry has been continuously exploring.

Summary of the Invention

[0004] This application provides an antenna module and a communication device for ensuring the radiation performance of the antenna On the premise of and realizing a cable-free design, thereby simplifying the internal structure of the communication device Simplification and having the advantage of low cost.

[0005] According to a first aspect, this application provides an antenna module including a radiation element, a ground element, and a feeding element, and the radiation element and the ground element are stacked LayeredThe power supply element is a transmission line structure formed on an insulating support. In the first direction, the power supply element is located on the side of the ground element away from the radiation element. The power supply element includes a power supply transmission part and a ground part. The power supply transmission part is separated and insulated from the ground part. The width of the power supply transmission part includes a first width, and the width of the ground part includes a second width. The first width is not equal to the second width. The width of the power supply transmission part is the dimension of the power supply transmission part in a direction perpendicular to the extension path of the power supply transmission part, and the width of the ground part is the dimension of the ground part in a direction perpendicular to the extension path of the ground part.

[0006] In this application, the power supply element of the transmission line structure arranged on the insulating support supplies power to the radiation element, and the widths of the ground part and the power supply transmission part are not equal. Thereby, the current balance of the antenna module can be realized. The unequal-width design of the power supply transmission part and the ground part of the power supply element has a decoupling effect. In other words, this can remove or reduce the coupling effect to the radiation element generated by the power supply element, thereby improving the radiation performance of the antenna module. Specifically, the radiation element and the ground element in the antenna module provided in this application form an asymmetric architecture. The asymmetric architecture means that the radiation element and the ground element have different structures. In the resonance state, the radiation element and the ground element generate current imbalance. Specifically, the current on the radiation element and the current on the ground element have unequal amplitudes and different current directions. In this application, the unequal-width design of the power supply transmission part and the ground part is used to solve the problem of impedance mismatch caused by the current imbalance generated by the radiation element and the ground element. The unequal-width design of the power supply transmission part and the ground part achieves a current balance effect on the entire antenna module.

[0007] In a possible implementation form, in the extension path of the power supply transmission part, the electrical length of the power supply transmission part is between 0.3λ and 0.7λ, where λ is the wavelength of the electromagnetic wave of the radiation element in the resonance state. Specifically, the electrical length of the power supply transmission part can be 0.5λ. In this solution, by restricting the specific range (between 0.3λ and 0.7λ) and the specific value (0.5λ) of the electrical length of the power supply transmission part, the power supply transmission part is given a balun function, and the repetitive continuity of impedance matching in the antenna module is ensured. The repetitive continuity of impedance matching can be understood as the impedance matched at the two ends of the power supply transmission part being the same. In this way, there is no need to arrange another matching circuit on the power supply transmission part to adjust the matching impedance.

[0008] In a possible implementation form, the extension path of the power supply transmission part and the extension path of the grounding part form a double parallel line architecture. This can be understood as follows: the gap between the first power supply end of the power supply transmission part and the first grounding end of the grounding part is the same as the gap between the second power supply end of the power supply transmission part and the first grounding end of the grounding part. In addition, in the extension path of the first power supply end and the grounding part, the gap between the first power supply end and the grounding part remains unchanged. Since the power supply element is designed as a double parallel line architecture, when the antenna module is in the operating state, the power supply element can form an equal-amplitude reverse current to prevent the power supply element from affecting the resonance of the radiation element. Thereby, it is guaranteed that the antenna module is a vertically polarized wave antenna, and a good radiation pattern can be obtained.

[0009] In a possible implementation form, the total electrical length of the power feeding transmission part in the second direction is between 0.15λ and 0.35λ, where λ is the wavelength of the electromagnetic wave of the radiation element in the resonant state, and the second direction is perpendicular to the first direction. In a specific implementation form, the total electrical length of the power feeding transmission part in the second direction is 0.25λ. By restricting the electrical length of the power feeding transmission part in the second direction, the induced current can be suppressed. Thereby, the decoupling between the power feeding element and the radiation element can be realized, the coupling between the power feeding element and the radiation element can be reduced, and thereby the radiation efficiency of the radiation element can be improved.

[0010] In a possible implementation form, the power feeding transmission part Of extending in the second direction Some transmission lines is on the same straight line. This solution is a simple cable wiring solution for the power feeding transmission part. The electrical length of the power feeding transmission part is easily controlled, and the effect of suppressing the induced current becomes more prominent.

[0011] In a possible implementation form, the power feeding transmission part Of extending in the second direction Some transmission lines includes at least two transmission line segments, and the at least two transmission line segments are connected to each other via a transmission line extending in the first direction. The at least two transmission line segments may be parallel to each other. This solution is a specific cable wiring solution for the power feeding transmission part. In this application, different forms of power feeding transmission parts can be arranged based on different specific assembly environments and electromagnetic field environments of the antenna module, and the specific transmission form in the insulation setting can be adjusted to realize different designs. This is simple and easy to implement.

[0012] In a possible implementation form, the power supply transmission part and the grounding part are on the same plane. In other words, the power supply transmission part and the grounding part are on the same plane, that is, the planes of the insulating supports supporting the power supply transmission part and the grounding part are the same. For example, when the insulating support has a circuit board structure, the power supply transmission part and the grounding part are located on the same layer of the circuit board. The thicknesses of the power supply transmission part and the grounding part are not considered in this application. The thickness of the power supply transmission part and the thickness of the grounding part may be different. However, as long as the power supply transmission part and the grounding part are arranged on the same plane, it can be understood that the power supply transmission part and the grounding part are on the same plane. The manufacturing cost of the coplanar design is low, and the positional relationship between the power supply transmission part and the grounding part is easy to control.

[0013] In a possible implementation form, the plane where the power supply transmission part is located and the plane where the grounding part is located are not on the same plane. The power supply transmission part and the grounding part are arranged to face each other in a third direction (they may be in a directly facing relationship). The third direction is perpendicular to the second direction and is also perpendicular to the first direction. In this solution, the power supply transmission part and the grounding part form a non-coplanar transmission line architecture. For example, the power supply transmission part and the grounding part may be located on different layers of the circuit board. Compared with that in the coplanar design, the non-coplanar transmission architecture provided in this solution has the advantages of saving space and reducing the area occupied on the substrate. The thickness of the circuit board substrate is only used for insulation between the power supply transmission part and the grounding part, thereby reducing the manufacturing cost.

[0014] In a possible implementation form, in the resonant state, the currents on the power supply transmission part and the grounding part have equal amplitudes but opposite current directions.

[0015] In a possible implementation form, the power supply transmission part includes a first power supply terminal and a second power supply terminal. The first power supply terminal is electrically connected to the radiation element, and the second power supply terminal is configured to be electrically connected to a radio frequency chip on the main board of the communication device. From the first power supply terminal to the second power supply terminal, the power supply transmission part extends with equal width, and / or The grounding portion includes a first grounding terminal and a second grounding terminal. The first grounding terminal is electrically connected to the ground element, and the second grounding terminal is configured to be electrically connected to the ground on the main board of the communication device. From the first grounding terminal to the second grounding terminal, the grounding portion extends with a constant width.

[0016] In a possible implementation form, the power supply transmission portion includes a first power supply terminal and a second power supply terminal. The first power supply terminal is electrically connected to the radiating element, and the second power supply terminal is configured to be electrically connected to the radio frequency chip on the main board of the communication device. From the first power supply terminal to the second power supply terminal, a part of the power supply transmission portion extends with a constant width, a part of the power supply transmission portion extends with a non-constant width, and / or The grounding portion includes a first grounding terminal and a second grounding terminal. The first grounding terminal is electrically connected to the ground element, and the second grounding terminal is configured to be electrically connected to the ground on the main board of the communication device. From the first grounding terminal to the second grounding terminal, a part of the grounding portion extends with a constant width, and a part of the grounding portion extends with a non-constant width.

[0017] In a possible implementation form, the power supply transmission portion includes a first power supply terminal and a second power supply terminal. The first power supply terminal is electrically connected to the radiating element, and the second power supply terminal is configured to be electrically connected to the radio frequency chip on the main board of the communication device. From the first power supply terminal to the 2 second power supply terminal, the power supply transmission portion extends with a constant width, The grounding portion includes a first grounding terminal and a second grounding terminal. The first grounding terminal is electrically connected to the ground element, and the second grounding terminal is configured to be electrically connected to the ground on the main board of the communication device. From the first grounding terminal to the second grounding terminal, a part of the grounding portion extends with a constant width, and a part of the grounding portion extends with a non-constant width.

[0018] In a possible implementation form, the grounding portion includes a first grounding terminal and a second grounding terminal. The first grounding terminal is electrically connected to the ground element, and the second grounding terminal is configured to be electrically connected to the ground on the main board of the communication device. From the first grounding terminal to the second grounding terminal, the grounding portion extends with a constant width, The power supply transmission part includes a first power supply terminal and a second power supply terminal. The first power supply terminal is electrically connected to the radiation element, and the second power supply terminal is configured to be electrically connected to a radio frequency chip on the main board of the communication device. From the first power supply terminal to the 2 second power supply terminal, a part of the power supply transmission part extends with equal width, and a part of the power supply transmission part extends with unequal width.

[0019] This application provides several combination solutions for the power supply transmission part and the grounding part. The equal-width design of the power supply transmission part and the grounding part can be combined with the unequal-width design of the power supply transmission part and the grounding part. In a specific implementation form, the unequal-width design of the power supply transmission part can be a design with a gradually changing width. This is useful for impedance adjustment.

[0020] In a possible implementation form, the antenna module includes a first plate and a second plate. The first plate includes a stacked Layered first layer and a second layer. The radiation element is located in the first layer, and the ground element is located in the second layer. The second plate is an insulating support. The second plate includes a first edge and a second edge arranged opposite to each other, and a cable layer. The cable layer is located between the first edge and the second edge. The second plate is located on the side of the first plate. The first edge is connected to the first plate. The power supply element is arranged in the cable layer. An included angle is formed between the cable layer and the first layer.

[0021] In this solution, the antenna module is provided with a first plate and a second plate. The manufacturing process is simple and the manufacturing cost is low. In addition, the antenna module has the advantage of being lightweight. This facilitates the design of a slim and short communication device. The first plate and the second plate may be a printed circuit board architecture. The power feeding element and the radiating element of the antenna module are a transmission line architecture arranged on the printed circuit board. Since the antenna module does not include a power feeding cable and the communication device does not have a power feeding cable, the internal structure of the communication device is simple. In addition, the position and shape of the transmission line are fixed and designed before assembling the antenna module. Therefore, it does not adversely affect the antenna during the assembly process. In addition, a low-loss substrate-level interconnection can be implemented between the first plate and the second plate. Thus, the assembly cost is low, and for the antenna module, the loss generated by the connection between the first plate and the second plate is low.

[0022] In a possible implementation form, the grounding part is electrically connected to the ground element through the connection between the first edge part and the first plate. A connection structure is arranged at the joint between the first plate and the second plate. The connection structure is configured to realize the electrical connection between the power feeding transmission part and the radiating element. In this application, in the process of assembling and connecting the first plate and the second plate, the electrical connection between the power feeding element and the radiating element and the electrical connection between the power feeding element and the ground element can be implemented. Such electrical connections are highly reliable and have little loss.

[0023] In a possible implementation form, the first plate is provided with holes penetrating the first layer and the second layer. The second plate includes a plug structure protruding from the first edge. At least a part of the plug structure is located within the holes. The connection structure includes the holes and the plug structure. The connection structure further includes a conductive connection part. The conductive connection part is electrically connected between the radiation element and the power supply transmission part. This solution provides a specific design of the connection structure. The plug structure fits into the holes, realizing easy assembly and easy electrical connection.

[0024] In a possible implementation form, the holes are through holes. The holes include a first open end and a second open end. The plug structure is inserted into the holes from the first open end. The conductive connection part is welded to the radiation element from the side of the second open end. The power supply transmission part and the radiation element are electrically connected by welding on the side of the second open end, and there is sufficient working space for the operation. Thereby, the assembly cost of the antenna module is reduced, and the welding yield is ensured.

[0025] In a possible implementation form, the first layer is the upper surface of the first plate, and the second layer is the lower surface of the first plate. The first open end is located on the lower surface, and the second open end is located on the upper surface. In this solution, since the radiation element is arranged on the upper surface of the first plate and the ground element is arranged on the lower surface of the first plate, the volume of the antenna module becomes smaller, and the communication device becomes thinner.

[0026] In a possible implementation form, the second edge of the second plate is connected to the main board of the communication device. The grounding part of the power supply element is electrically connected to the grounding plane on the main board. The power supply transmission part is electrically connected to the radio frequency chip on the main board through a transmission line arranged on the main board. In this solution, the connection relationship between the position of the second edge of the second plate and the main board is restricted. An external cable is not required, and only the circuit board cable (transmission line structure) within the main board is needed to implement the grounding of the grounding part and the electrical connection between the power supply transmission part and the radio frequency chip.

[0027] In a possible implementation form, the first primary antenna is arranged on the second plate. The radiation element, the ground element, and the feeding element form the second primary antenna. The resonance frequency of the first primary antenna is the first frequency. The resonance frequency of the second primary antenna is the second frequency. The second frequency is higher than the first frequency.

[0028] In a possible implementation form, the first frequency is 2.4 GHz, and the second frequency is 5G Hz GHz.

[0029] In a possible implementation form, the antenna module includes a plurality of antenna elements. Each antenna element includes one first primary antenna and one second primary antenna. The antenna element further includes a first decoupling structure and a second decoupling structure. The first decoupling structure is located on the second plate. The antenna module further includes a third plate. The third plate and the second plate are arranged to intersect, and the second decoupling structure is located on the third plate. In this application, the distance between the two first primary antennas is shortened, and the first primary antenna and the second primary antenna are arranged on the same support, so that the space of the main board is saved and the small-size design of the antenna module is facilitated. The first decoupling structure and the second decoupling structure are Ensure isolation, thereby arranged to improve the radiation efficiency Rate between the two first primary antennas.

[0030] In this application, the distance between the two first primary antennas is set between 0.2 times the wavelength and 0.8 times the wavelength, and the isolation between the two first primary antennas is improved in combination with the first decoupling structure and the second decoupling structure. The distance between the two first primary antennas is between 0.2 times the wavelength and 0.8 times the wavelength. When the first decoupling structure is not arranged in each antenna element, when the two first primary antennas are in a resonant state, the two first primary antennas receive signals from each other, resulting in signal interference and insufficient isolation.

[0031] In a possible implementation form, the end of the second plate and the third plate Plate that is away from the first plate is connected to the main board of the communication device. In the direction perpendicular to the ground plane on the main board of the communication device, the longest distance between the first decoupling structure and the ground plane is the cross-sectional height of the first decoupling structure. The cross-sectional height of the first decoupling structure is between 0.01 times the wavelength and 0.16 times the wavelength. The distance between the first decoupling structure and the first primary antenna is the first distance. The distance between the first decoupling structure and the first primary antenna of the adjacent antenna element is the second distance. Both the first distance and the second distance are between 0.1 times the wavelength and 0.6 times the wavelength. The second decoupling structure is configured to reduce the amount of coupling between the first primary antenna and the first primary antenna of the adjacent antenna element. The resonance frequency of the second decoupling structure is higher than the first frequency or lower than the first frequency.

[0032] In the present application, the first decoupling structure is arranged to achieve a small size of the antenna. Thereby, the thin design of the communication device is facilitated, and the problem of isolation between adjacent first primary antennas can be further solved. By controlling the cross-sectional height of the first decoupling structure, the distance between the first decoupling structure and the first primary antenna, and the distance between the first decoupling structure and the adjacent first primary antenna, the isolation between adjacent first primary antennas in a limited space is improved, and the influence on the radiation efficiency of the first primary antenna is reduced. As a result, there is no obvious depression in the simulation diagram of the radiation efficiency of the first primary antenna.

[0033] In this application, the resonance frequency of the second decoupling structure is adjusted so that the resonance frequency of the second decoupling structure is not the same as the first frequency, but is slightly higher or lower. Thereby, decoupling between the first primary antennas is achieved, whereby isolation is improved and the influence on the radiation efficiency of the antennas is reduced. Specifically, when the second decoupling structure generates resonance, a drop in efficiency occurs with respect to the electromagnetic wave at the resonance frequency of the second decoupling structure. In the case of the first primary antenna, due to the drop in efficiency caused by the second decoupling structure, the in-band frequency of the resonance of the first primary antenna (i.e., the first frequency) is avoided, and the influence of the second decoupling structure on the radiation efficiency of the first primary antenna can be reduced.

[0034] In a possible implementation form, the radiation element, the ground element, and the feeding element form a vertically polarized antenna arranged horizontally.

[0035] According to a second aspect, this application provides a communication device including a radio frequency chip and an antenna module according to any one of the possible implementation forms of the first aspect. The radio frequency chip is configured to process electromagnetic wave signals received and transmitted by the antenna module.

Brief Description of the Drawings

[0036] To more clearly explain the technical solutions in the embodiments or background art of the present invention, the following describes the accompanying drawings for explaining the embodiments or background art of the present invention.

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Mode for Carrying Out the Invention

[0037] The terms in the present application are explained as follows.

[0038] A wireless AP, that is, an access point, is a wireless access point. Briefly speaking, a wireless AP is a wireless switch in a wireless network. A wireless AP is an access point for mobile terminal users to access a wired network, and is widely used for network coverage in various scenarios including enterprise-level scenarios such as education and healthcare. A wireless AP may be used for home broadband, enterprise internal network deployment, etc., and the wireless coverage range is from dozens of meters to hundreds of meters. Generally, a wireless AP further has an access point client mode. Specifically, in order to expand the coverage of a wireless network, a wireless link can be established between APs.

[0039] In MIMO, i.e., multiple-input multiple-output technology, multiple transmitting antennas and receiving antennas are used at the transmitting end and the receiving end, and signals are transmitted and received via the multiple antennas at the transmitting end and the receiving end, thereby improving communication quality. As a result, spatial resources can be fully utilized, multiple-input multiple-output can be realized via multiple antennas, and the channel capacity of the system can be increased without increasing spectral resources and antenna transmission power. This technology has obvious advantages and is therefore considered a core technology for next-generation communications.

[0040] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings in the embodiments of the present invention.

[0041] FIGS. 1 and 2 are Each assembly diagrams of a communication device according to an implementation form of the present application. FIG. 3 is a three-dimensional exploded view of a communication device according to an implementation form of the present application. FIG. 4 is a cross-sectional view of a communication device according to an implementation form of the present application. FIG. 5 is a view of the inside of a second housing 102 of a communication device according to an implementation form of the present application.

[0042] Please refer to FIGS. 1, 2, 3, and 4. In one implementation form, the communication device 100 is a wireless AP. The communication device 100 includes a first housing 101 and a second housing 102. The first housing 101 and the second housing 102 are fixed to each other and surrounded together to form an internal space G of the communication device 100. In the application environment of the communication device 100, the first housing 101 is a lower housing, and the second housing 102 is an upper housing. The first housing 101 is connected to a bearing material. For example, the first housing 101 is in contact with a desktop, a wall, or a support surface of another carrier. The periphery of the second housing 102 is usually , Shield not provided with a shielding object and is exposed to the air. In one implementation form, the first housing 101 is a housing having a conductor material and a shielding function (for example, a metal housing).

[0043] Please refer to FIG. 2. On the outer surface of the first housing 101, the first housing 101 includes an intermediate region R1 and an edge region R2 surrounding the periphery of the intermediate region. The intermediate region R1 houses a connector socket 1011 (for example, a socket corresponding to a network port or a socket corresponding to an optical fiber port) and is configured to accommodate an external cable. Lower part The block 1012 is disposed at the intersection of the intermediate region R1 and the edge region R2. Specifically, the intermediate region R1 is square, and four Lower part blocks 1012 are disposed at the four corners of the intermediate region R1. A heat sink 1013 is disposed in the edge region R2. The heat sink 1013 is configured to dissipate heat of a heat generating element in the communication device. The heat sink 1013 is disposed around the connector socket 1011, and the heat sink 1013 includes a plurality of fins. Each fin extends from the joint between the edge region R2 and the intermediate region R1 to the outer edge of the edge region R2. An opening 1014 is further provided in the edge region R2. The opening 1014 communicates the internal space G of the communication device 100 with the outside. The opening 1014 is Internet of Things ( Io T) arranged for mounting an IoT card module. The IoT card can be understood as an Internet of Things card, that is, a chip for the device's network access.

[0044] Please refer to FIG. 3. In a specific implementation, a plurality of accommodation spaces G1 are formed on the inner surface of the first housing 101. Adjacent accommodation spaces G1 are separated by a lower partition plate 1015 Via, are partitioned from each other. The plurality of accommodation spaces G1 are independently arranged. The plurality of accommodation spaces G1 are configured to accommodate the electronic components of the communication device 100. Since the accommodation spaces G1 are independent of each other, the first housing 101 forms a shielding cover structure for the electronic components. Therefore, the first housing 101 of the communication device 100 provided in the present application integrates the functions of the housing and the shielding cover. The first housing 101 is coupled to the main board 103 of the communication device 100. In this way, the first housing 101 forms a plurality of shielding covers disposed on the main board 103 to shield different electronic components on the main board 103. Therefore, in the present application, there is no need to additionally arrange a shielding cover structure between the housing and the main board of the communication device 100. This facilitates the thin design of the communication device. The second housing 102 is made of a non-conductive material (e.g., plastic). The antenna module is disposed inside the second housing 102. The second housing 102 is designed as a non-conductive material. This does not affect the radiation efficiency of the antenna.

[0045] Please refer to FIGS. 3 and 4. The main board 103 is disposed inside the communication device 100. The main board 103 is fixed in the internal space G surrounded by the first housing 101 and the second housing 102. The main board 103 includes a lower surface S1 and an upper surface S2. The lower surface S1 faces the inner surface of the first housing 101, and the upper surface S2 faces the inner surface of the second housing 102. The electronic components on the main board 103 include a CPU, CPU peripheral circuits, a plurality of radio frequency chips, a baseband chip, an antenna module, and other functional modules (such as a power module, a Bluetooth module, a network port, and an optical fiber port). On the main board 103, the main heat-generating components and the components that require electromagnetic shielding are disposed on the lower surface S1, and the electronic components that require electromagnetic shielding correspondingly have the same function as the shielding cover and are disposed in the accommodation space G1 formed by the first housing 101. The main heat-generating components are the first housing 101 ViaIt dissipates heat. For example, electronic components such as a CPU, a baseband chip, a radio frequency chip, a power module, a Bluetooth module, a network port, an optical fiber port, and an IOT card module are arranged on the lower surface S1 of the main board 103. The antenna module 10 is arranged on the upper surface S2 of the main board 103. Since the second housing 102 is made of a non-conductive material, the side of the antenna module 10 away from the main board 103 is a clearance space. This helps to ensure the antenna performance. The antenna module 10 is arranged in the edge region of the main board 103, and the intermediate region surrounded by the antenna module 10 is configured to accommodate the CPU peripheral circuit.

[0046] Please refer to FIG. 5. In one implementation form, the second housing 102 includes a plate body 1021 and an upper partition plate 1022 protruding from the inner surface of the plate body 1021. The upper partition plate 1022 and the plate body 1021 can be of an integral structure. In one aspect, the upper partition plate 1022 is configured to improve the strength of the plate body 1021 and ensure the flatness of the plate body 1021. In another aspect, the upper partition plate 1022 surrounds a plurality of partitioned spaces G2 on the inner surface of the plate body 1021. In the assembled state, the antenna elements of the antenna module 10 are arranged corresponding to different partitioned spaces G2. In the direction perpendicular to the main board 103, the orthographic projection of the antenna elements of the antenna module 10 on the second housing 102 are separately located within the partitioned spaces G2.

[0047] Please refer to FIG. 6. In one implementation, the CPU located in the intermediate region is disposed on the lower surface S1 of the main board 103. The 2G and 5G radio frequency chips and the baseband chip are disposed on top of the CPU. The radio frequency chip and the baseband chip can be independent chips from each other. The plurality of 2G radio frequency antennas and the plurality of 5G radio frequency chips can be arranged based on the antenna arrangement requirements. Similarly, the plurality of baseband antennas can also be arranged based on the antenna frequency and arrangement requirements. The Bluetooth chip is disposed on the left side of the CPU. The IOT card module is disposed on the right side of the CPU. The 6G baseband chip, the 6G radio frequency chip, the network port, the optical fiber port, the DC power supply, and the power transformer module are disposed under the CPU. The radio frequency chips and the baseband chips within the 6G baseband chip and the 6G radio frequency chip P is can be independent chips from each other. In the case of the radio frequency chip, the plurality of 6G radio frequency antennas can be arranged based on the antenna arrangement requirements. Similarly, the plurality of baseband antennas can also be arranged based on the Frequency antenna and arrangement requirements. Other electronic components, such as other processors like CPLD logic chips or PHY chips, may be further arranged in the communication device provided in this application.

[0048] As shown in FIG. 3, in this application, the antenna module 10 is directly disposed on the upper surface S2 of the main board 103, and the power supply cable of the antenna within the antenna module 10 is directly disposed within the main board 103 (for example, the microstrip on the main board 103 forms a power supply system), and no additional power supply cable is required. The antenna module 10 is assumed to be independently fixed to the antenna substrate. For example, generally, the antenna substrate can be a metal substrate and is stacked with the main board LayeredIt is powered. The radio frequency chip powers the antenna module via a power supply cable. In this architecture, not only does the antenna substrate occupy the space of the communication device, but the power supply cable also needs to occupy the space of the communication device. In addition, the assembly of the antenna substrate and the assembly of the power supply cable complicate the internal structure of the communication device. Regarding the signal of the antenna module, the quality of the signal for power supply via the power supply cable is within the main board 103 and is lower than the quality of the signal for direct power supply via the cable used as the power supply structure in this application.

[0049] The antenna module 10 provided in this application is a MIMO antenna system. The antenna module 10 includes a plurality of antenna groups (a plurality of antenna elements). The antenna groups have different operating frequencies. Generally, the antenna module may include two or more antennas operating at a first frequency and two or more antennas operating at a second frequency. For example, in one implementation form, the antenna module includes three antenna groups. The first group is a first frequency antenna (for example, a 2.4G antenna with an operating band of 2.4 GHz to 2.5 GHz), the second group is a second frequency antenna (for example, a 5G antenna with an operating band of 5.15 GHz to 5.85 GHz), and the third group is a third frequency band antenna (for example, a 6G antenna with an operating band of 5.925 GHz to 7.125 GHz). Each antenna group includes a plurality of independent antennas. An independent antenna means that the antenna has an independent power supply and an independent radiator and can perform the antenna function independently. In a specific implementation form, the antenna module includes four 2.4G antennas, four 5G antennas, and four 6G antennas. One antenna element may be provided with one antenna of one frequency (for example, one antenna element includes only one 6G antenna), or one antenna element may be provided with two antennas of different frequencies. For example, one antenna element includes one 2.4G antenna and one 5G antenna.

[0050] In order to ensure the operating efficiency of all antennas, it is necessary to ensure the isolation between one antenna and another when the antennas are operating. The isolation between ports is used to quantify the influence between antennas. The higher the isolation between ports, the smaller the influence between the two antennas. Generally, it shows that the longer the distance between antennas, the better the isolation. However, when the distance between antennas increases, it affects the miniaturized design of the communication device. Therefore, in order to reduce the occupied substrate space and obtain a small communication device, it is necessary to shorten the distance between antennas. In the case of low-frequency antennas, the safety distance between two adjacent low-frequency antennas is long. Generally, multiple low-frequency antennas are distributed at different corners of the circuit board in order to achieve the isolation between antennas. However, this does not lead to the layout of the circuit board. In addition, in order to achieve better antenna performance, the radio frequency chips connected to the antennas also need to be distributed. When the radio frequency chips are arranged in the center and the antennas are distributed, some antennas are undoubtedly connected to the radio frequency chips via long cables, resulting in the loss of radio frequency signals.

[0051] Please refer to FIG. 3. In the present application, the antenna module 10 is disposed on the upper surface S2 of the main board 103, and the antenna module 10 includes a plurality of antenna elements. In a specific implementation, the antenna module 10 includes eight antenna elements. Four of the antenna elements integrate antennas at a first frequency and a second frequency. For example, there are four 2.4G antennas and four 5G antennas. In other words, each antenna element includes one antenna at the first frequency and one antenna at the second frequency (this can be understood as follows: one 2.4G antenna and one 5G antenna are disposed on one antenna support and are disposed corresponding to the same position on the main board 103). Specifically, in this implementation, the four 2.4G antennas are disposed adjacent to each other, and all the 2.4G antennas are disposed on the same side of the central region of the main board 103, and the corresponding positions of the four 2.4G antennas and the four 5G antennas on the main board 103 are the same. It can be understood that the first frequency is a low frequency and the second frequency is a high frequency. When the antenna performance and isolation are satisfied, the substrate space occupied by the high-frequency antenna is smaller than the substrate space occupied by the low-frequency antenna. In the present application, the antenna at the second frequency is used as a reference azimuth position for placement. When a plurality of antennas at the second frequency are disposed at appropriate positions, the antennas at the first frequency are disposed at the positions of the corresponding antennas at the second frequency, and then the isolation and performance of the antennas at the first frequency are adjusted by using decoupling techniques. Such a design can reduce the substrate space occupied by the antenna module, leading to a small, lightweight, and thin design of the communication device. Specifically, in the present application, the specific positions of the four 5G antennas on the main board 103 are first set, then the four 2.4G antennas are disposed on the power supply circuit board of the four 5G antennas, and then 2.4 G A decoupling structure for the antenna is disposed. Thereby, the isolation between adjacent 2.4 G A antennas is ensured, and the radiation efficiency of each 2.4 G A antenna is also ensured.

[0052] As shown in FIGS. 3 and 4, there is no power supply cable used to supply power to the antenna module 10 inside the communication device 100. The internal structure of the communication device 100 is simple, which improves the efficiency of the assembly process, reduces the assembly cost, and facilitates the maintenance of the communication device 100. The implementation form of this application provides a cable-free power supply antenna module 10. The antenna module 10 is connected to the upper surface S2 of the main board 103.

[0053] FIG. 7 is a dimensional decomposition diagram of the antenna module 10 in a certain direction according to an implementation form of this application. Of three FIG. 8 is a dimensional decomposition diagram of the antenna module 10 shown in FIG. 7 in another direction. Of three FIG. 9 is a cross-sectional view of the antenna module 10 shown in FIG. 7. Refer to FIGS. 7, 8, and 9. The antenna module 10 includes a radiating element 20, a ground element 30, and a feeding element 40. The radiating element 20 and the ground element 30 are stacked. Layered The ground element 30 is stacked between the main board 103 and the radiating element 20. The ground element 30 and the main board 103 face each other non-contactingly. Let the direction in which the radiating element 20 and the ground element 30 are stacked be the first direction A1. In the first direction A1, the feeding element 40 is located on the side of the radiating element 20 away from the ground element 30. The first direction A1 Is may be perpendicular to the direction of the main board 103. The radiating element 20, the ground element 30, and the feeding element 40 are all of a metal transmission line structure or a metal patch structure. In a specific implementation form of this application, the radiating element 20, the ground element 30, and the feeding element 40 are arranged on an insulating support, and the insulating support is assembled on the main board. The insulating support can be a circuit board composition or another form of structure.

[0054] Hereinafter, first, the specific structures and positional relationships of the radiating element 20, the ground element 30, and the feeding element 40 will be described.

[0055] Please refer to FIGS. 7, 8, and 9. The radiation element 20 is located on top of the antenna module 10, which can be understood as a position where the antenna module 10 is separated from the main board 103. The radiation element 20 is adjacent to the second housing 102. The radiation element 20 includes an input interface 21, a power splitting element 22, and a plurality of radiation sub-elements 23. The plurality of radiation sub-elements 23 are arranged around the input interface 21. For example, the plurality of radiation sub-elements 23 are arranged in an annular region. The power splitting element 22 and the radiation sub-elements 23 can be arranged in a one-to-one correspondence, The power splitting element 22 is and are connected between the radiation sub-element 23 and the input interface 21. Individually The power splitting element 22 and the radiation sub-elements 23 may be arranged in a one-to-many correspondence. For example, in the implementation shown in FIG. 7, one power splitting element 22 is connected corresponding to two radiation sub-elements 23. The radiation element 20 includes four power splitting elements 22 and eight radiation sub-elements 23. The input interface 21 is the power feeding position of the radiation element 20, and the input interface 21 is configured to be electrically connected to the power feeding element 40, Input and the interface 21 is electrically connected to all the power splitting elements 22.

[0056] In a specific implementation, the input interface 21 is located at the central position of the radiation element 20, the power splitting element 22 surrounds the input interface 21, and the plurality of radiation sub-elements 23 surround the power splitting element 22 , See The radiation element 20 may have a rotationally symmetric structure centered on the input interface 21. The shape of each radiation sub-element 23 may be, but is not limited to, rod-shaped, arc-shaped, L-shaped, etc. In one implementation, the operating frequency of the radiation element 20 in the resonant state is 5G Hzand the electrical length of each radiating sub-element 23 is one-fourth of the electromagnetic wave wavelength of the operating frequency of the radiating element 20. In one implementation form, the power dividing element 22 and the plurality of radiating sub-elements 23 are on the same plane. For example, the power dividing element 22 and the plurality of radiating sub-elements 23 are a metal microstrip structure arranged on the same layer of the circuit board. In another implementation form, the surface where the power dividing element 22 is located is different from the surface where the plurality of radiating sub-elements 23 are located. For example, the power dividing element 22 and the plurality of radiating sub-elements 23 are arranged on different layers of the circuit board. The power dividing element 22 may be located in an intermediate layer of the circuit board, and the plurality of radiating sub-elements 23 may be arranged in a surface layer of the circuit board.

[0057] The ground element 30 is a metal layer structure. For example, in one implementation form, the ground element 30 is a copper foil arranged on a layer of the circuit board (which can be an intermediate layer or a surface layer of the circuit board). In another implementation form, the ground element 30 may alternatively be a metal sheet structure, and the ground element 30 can be fixed to the surface of the circuit board (by using an adhesive or by welding). In one implementation form, a notch 31 is formed in the central region of the ground element 30, and the position of the notch 31 is used to accommodate the connection structure between the radiating element 20 and the feeding element 40. The specific form of the ground element 30 can be a ring. The outer edge of the ground element 30 is circular, square, or polygonal, and the inner edge of the ground element 30 can also be circular, square, or polygonal.

[0058] FIG. 9A, FIG. 9B, and FIG. 9C show Each , according to a specific implementation form of the present application, the positional relationship between the radiating element 20 and the ground element 30. Please refer to Figure 9A. In one implementation form , Group the inner edge of the land element 30 is arranged corresponding to the periphery of the input interface 21. Specifically, the vertical projection of the inner edge of the ground element 30 on the plane where the radiating element 20 is located is located around the input interface 21. Please refer to Figure 9B. Alternatively , ReleaseThe vertical projection of the inner edge of the ground element 30 on the plane where the radiating element 20 is located may be located inside the input interface 21. Refer to FIGS. 9A, 9B, and 9C. The vertical projection of the ground element 30 on the plane where the radiating element 20 is located coincides with at least a part of the power dividing element 22. As shown in FIG. 9A, the outer edge of the ground element 30 is adjacent to the inner edge of the radiating sub-element 23, or the outer edge of the ground element 30 is located between the inner edge of the radiating sub-element 23 and the input interface 21. Refer to FIG. 9B. The outer edge of the ground element 30 may alternatively coincide with the inner edge of the radiating sub-element 23. Refer to FIG. 9C. In one implementation, a part of the projection of the ground element 30 on the plane where the radiating element 20 is located coincides with the power dividing element 22, and the other part coincides with a part of the radiating sub-element 23.

[0059] Refer to FIGS. 7, 8, and 9. The power feeding element 40 is located between the ground element 30 and the main board 103. Specifically, the power feeding element 40 is a transmission line structure formed on an insulating support. In the first direction, the power feeding element 40 is located on the side of the ground element away from the radiating element 20. The power feeding element 40 is electrically connected to a radio frequency chip on the main board 103 and is configured to supply power to the radiating element 20. The radio frequency chip is electrically connected to the power feeding element 40 via a transmission line arranged on the main board 103.

[0060] FIG. 10 shows a conventional solution in which a power feeding signal is transmitted between an antenna module and a main board via a radio frequency cable. Referring to FIG. 10, the antenna module is arranged above the main board. Power feeding to the antenna module is performed via a power feeding cable. The power feeding cable Is Ground on the main board Connected to The position is the first connection point P1, and the power feeding cable Is Radiating element 20 Connected toThe positions include a second connection point P2 and a third connection point P3. The specific position of the first connection point P1 on the main board, the specific position of the second connection point P2 on the antenna module, the specific position of the third connection point P3 on the antenna module, the length of the power supply cable between the first connection point P1 and the second connection point P2, the length of the power supply cable between the second connection point P2 and the third connection point P3, and the length of the power supply cable between the third connection point P3 and the power supply point of the radiating element 20 are all important factors affecting the radiation efficiency of the antenna module. In the design and assembly process, in order to accurately control a very large number of important factors affecting the radiation efficiency of the antenna module , Operation Business hours Is long Professional technical support is required. As a result, the manufacturing cost of the communication device becomes very high. Therefore, the conventional solution in which the power supply signal is transmitted via a radio frequency cable not only complicates the internal structure of the communication device but also complicates the assembly process of the radio frequency cable. It is necessary to consider the above-mentioned important factors affecting the radiation efficiency of the antenna, and it is difficult to ensure good radiation performance of the antenna. Generally, the Cable Wiring path, the length of the radio frequency cable, etc. have a great impact on the Of Consistency, board-level layout, antenna indicator, and link insertion loss.

[0061] The antenna module 10 provided in the present application does not require an external radio frequency cable for power supply Used necessary There is no . The radiating element 20 is excited by using a transmission line arranged in the main board 103 and a feeding element 40 (which is also a transmission line structure) arranged on an insulating support. Is This eliminates the influence of the conventional design of the radio frequency cable on the antenna performance. In the antenna module 10 provided in the present application, all carriers for transmitting electromagnetic wave signals between the radiating element 20 and the radio frequency chip are transmission line structures arranged on a circuit board or other insulating supports, so the internal structure of the communication device is simple. In addition, the position and shape of the transmission line are FixedIt is designed before assembling the antenna module 10. Therefore, it will not have an adverse effect on the antenna during the assembly process.

[0062] Regarding the specific structural form of the power feeding element 40, refer to the implementation forms shown in FIGS. 11, 12, 13, and 14.

[0063] Refer to FIG. 11. The power feeding element 40 has a power feeding transmission part 41 and a grounding part 42. A gap is provided between the power feeding transmission part 41 and the grounding part 42. The power feeding transmission part 41 is separated from the grounding part 42 by using an insulating medium 43. Separation The insulating medium 43 between the power feeding transmission part 41 and the grounding part 42 can be air, the insulating material of an insulating support, an insulating adhesive, etc. The width of the power feeding transmission part 41 includes a first width WS, and the width of the grounding part 42 includes a second width WG. In order to achieve the current balance of the antenna module 10, the first width WS is not equal to the second width WG. The unequal-width design of the power feeding transmission part 41 and the grounding part 42 of the power feeding element 40 has a decoupling function. The width of the power feeding transmission part 41 is the dimension in the direction perpendicular to the extension path of the power feeding transmission part 41, Of the power supply transmission part 41 and the width of the grounding part 42 is the dimension in the direction perpendicular to the extension path of the grounding part 42. Of the grounding part 42 Specifically, in one implementation form, the power feeding transmission part 41 extends with an equal width in the first direction A1, and the power feeding transmission part 41 also extends with an equal width in the second direction A2. , AndThe grounding portion 42 extends with a constant width in the first direction A1, and the grounding portion 42 also extends with a constant width in the second direction A2. As shown in FIG. 11, the first width WS includes the width WS1 of the transmission line of the power supply transmission portion 41 that extends in the first direction A1 and the width WS2 of the transmission line of the power supply transmission portion 41 that extends in the second direction A2. The second width WG includes the width WG1 of the transmission line of the grounding portion 42 that extends in the first direction A1 and the width WG2 of the transmission line of the grounding portion 42 that extends in the second direction A2. The width WS1 of the transmission line of the power supply transmission portion 41 that extends in the first direction A1 may be equal to or different from the width WS2 of the transmission line of the power supply transmission portion 41 that extends in the second direction A2. The width WG1 of the transmission line of the grounding portion 42 that extends in the first direction A1 may be equal to or different from the width WG2 of the transmission line of the grounding portion 42 that extends in the second direction A2. In this application, the fact that the first width WS and the second width WG are not equal means the following: the width WS1 of the transmission line of the power supply transmission portion 41 that extends in the first direction A1 is not equal to the width WG1 of the transmission line of the grounding portion 42 that extends in the first direction A1, and the width WS2 of the transmission line of the power supply transmission portion 41 that extends in the second direction A2 is not equal to the width WG2 of the transmission line of the grounding portion 42 that extends in the second direction A2.

[0064] In this solution , Power supply the widths of the power transmission portion 41 and the grounding portion 42 are different (that is, the first width WS and the second width WG are not equal). This Realize the current balance of the antenna module 10, can remove or reduce the coupling effect on the radiation element 20 generated by the power supply element 40, thereby improving the radiation performance of the antenna module 10. In this application Of the transmission line structure arranged on an insulating support For power supply the matching problem of the antenna module 10 can be solved by using the power element 40.

[0065] The radiation element 20 and the ground element 30 in the antenna module provided in this application form an asymmetric architecture. The asymmetric architecture means that the radiation sub-element 23 of the radiation element 20 and the ground element 30 have different structures. In the resonant state, the radiation element 20 and the ground element 30 generate current imbalance. Specifically, the current on the radiation element 20 and the current on the ground element 30 are not equal in amplitude and also have different current directions. In this application, the unequal-width design of the power supply transmission part 41 and the grounding part 42 is used to solve the problem of impedance mismatch caused by the current imbalance generated by the radiation element 20 and the ground element 30. Due to the unequal-width design of the power supply transmission part 41 and the grounding part 42, the antenna module Overall can achieve a current balance effect.

[0066] The power supply transmission part 41 and the grounding part 42 of the power supply element 40 form a double parallel line Power supply architecture. The microstrip-shaped power splitting element 22 is combined with the double parallel line power supply architecture of the power supply element 40. When the widths of the power supply transmission part 41 and the grounding part 42 are equal, impedance mismatch occurs due to current imbalance. In addition, the power supply element 40 and the radiation element 20 generate a mutual coupling effect, and as a result, Antenna pattern Of change Is brought about , which affects the radiation performance of the antenna. In this application, by arranging the power supply transmission part 41 and the grounding part 42 with unequal widths, the power supply element 40 has a balun function and a decoupling function. Thereby, the current balance of the antenna module 10 is realized and the radiation efficiency is improved.

[0067] Refer to FIG. 11 Is desired. The power supply transmission unit 41 includes a first power supply terminal 411 and a second power supply terminal 412. The first power supply terminal 411 is electrically connected to the radiating element 20, and the second power supply terminal 412 is configured to be electrically connected to a radio frequency chip on the main board 103 in the communication device. The extension path of the power supply transmission unit 41 is a path for transmitting a radio frequency signal or a path through which current flows between the first power supply terminal 411 and the second power supply terminal 412. The grounding unit 42 includes a first grounding terminal 421 and a second grounding terminal 422. The first grounding terminal 421 is electrically connected to the ground element 30, and the second grounding terminal 422 is electrically connected to the ground (i.e., the ground plane on the main board) on the main board 103. The extension path of the grounding unit 42 is a path through which current flows between the first grounding Terminal 4 21 and the second grounding Terminal 4 22. In the first direction, the first power supply terminal 411 is located between the second power supply terminal 412 and the radiating element 20, and the first grounding terminal 421 is located between the second grounding terminal 422 and the radiating element 20.

[0068] In one implementation form, in the extension path of the power supply transmission unit 41, the electrical length of the power supply transmission unit 41 is between 0.3λ and 0.7λ. Specifically, the electrical length of the power supply transmission unit 41 can be 0.5λ, where λ is the wavelength of the electromagnetic wave of the radiation element 20 in the resonant state. By restricting the specific range (between 0.3λ and 0.7λ) and the specific value (0.5λ) of the electrical length of the power supply transmission unit 41, the power supply transmission unit 41 is provided with a balun function, and the repetitive continuity of impedance matching in the antenna module is ensured. The repetitive continuity of impedance matching can be understood as the impedance matched at the two ends of the power supply transmission unit 41, that is, the first power supply end 411 and the second power supply end 412, being the same. In this way, there is no need to arrange another matching circuit on the power supply transmission unit 41 to adjust the matching impedance. As shown in FIG. 11, in the extension path of the power supply transmission unit 41, the electrical length of the power supply transmission unit 41 can be the sum of the electrical length H1 of the power supply transmission unit 41 in the first direction A1 and the electrical length L1 of the power supply transmission unit 41 in the second direction A2. The electrical length H1 of the power supply transmission unit 41 in the first direction A1 can be between 0.1λ and 0.35λ (for example, 0.25λ), and the electrical length L1 of the power supply transmission unit 41 in the second direction A2 can be between 0.1λ and 0.35λ (for example, 0.25λ).

[0069] In one implementation form, the extension path of the power supply transmission unit 41 and the extension path of the grounding unit 42 form a double parallel line architecture. This can be understood as follows: The gap between the first power supply end 411 of the power supply transmission unit 41 and the first grounding end 421 of the grounding unit 42 is the same as the gap between the second power supply end 412 of the power supply transmission unit 41 and the first grounding end 421 of the grounding unit 42. In addition, in the extension path of the first power supply end 411 and the grounding unit 42, since the gap between the first power supply end 411 and the grounding unit 42 remains unchanged, the power supply element 40 forms a double parallel line architecture. In this way, when the antenna module is in an operating state, the power supply element 40 can form an equal-amplitude reverse current to prevent the power supply element 40 from affecting the resonance of the radiation element 20. Thereby, it is ensured that the antenna module is a vertical polarization antenna, and a good radiation pattern can be obtained. The equal-amplitude reverse current can be understood as follows: The direction of the current on the power supply transmission unit 41 is opposite to the direction of the current on the grounding unit 42, but the amplitude of the current on the power supply transmission unit 41 is equal to the amplitude of the current on the grounding unit 42. The amplitude of the current is the maximum value of the alternating current in one cycle.

[0070] The extension path of the power supply transmission unit 41 and the extension path of the grounding unit 42 include an extension path in the first direction A1 and an extension path in the second direction A2. The second direction A2 is perpendicular to the first direction A1. The extension path of the power supply transmission unit 41 in the first direction A1 can be understood as follows: In one implementation form, a part of the transmission line of the power supply transmission unit 41 extends in the first direction A1; in another implementation form, a part of the transmission line of the power supply transmission unit 41 has a component perpendicular to the first direction A1. In other words, a part of the transmission line of the power supply transmission unit 41 extends obliquely with respect to the first direction A1, that is, it tends to extend in either the first direction A1 or the second direction A2. In one implementation form of the present application, the total electrical length L1 of the power supply transmission unit 41 in the second direction A2 is between 0.1λ and 0.35λ. In a specific implementation form, the total electrical length L1 of the power supply transmission unit 41 in the second direction A2 is 0.25λ, where λ is the wavelength of the electromagnetic wave of the radiation element 20 in the resonant state. By limiting the electrical length of the power supply transmission unit 41 in the second direction A2, the induced current can be suppressed. Thereby, the decoupling between the power supply element 40 and the radiation element 20 can be realized, and the coupling between the power supply element 40 and the radiation element 20 can be reduced, thereby improving the radiation efficiency of the radiation element 20.

[0071] The specific forms of the power supply transmission part 41 and the grounding part 42 may be a simple L-shaped transmission line architecture, may be formed by combining a plurality of L-shaped transmission lines, or may include an arc-shaped transmission line, a sawtooth-shaped transmission line, a sine-wave transmission line, etc. In one implementation form, as shown in FIG. 11, some transmission lines of the power supply transmission part 41 extending in the second direction A2 are on the same line. This solution is a simple cable wiring solution for the power supply transmission part 41. The electrical length of the power supply transmission part 41 is easily controlled, and the effect of suppressing the induced current is more remarkable. In a specific implementation form, the power supply transmission part 41 includes a first segment 413, a second segment 414, and a third segment 415. The first segment 413 extends in the second direction A2. The second segment 414 and the third segment 415 are respectively connected to two ends of the first segment 413, and both extend in the first direction A1. The second segment 414 is connected between the first segment 413 and the radiating element 20. The third segment 415 is connected between the first segment 413 and a transmission line on the main board 103 and used to connect a radio frequency chip. The electrical length of the first segment 413 is between 0.1λ and 0.35λ (for example, it may be 0.25λ). The sum of the electrical length of the second segment 414 and the electrical length of the third segment 415 is between 0.1λ and 0.35λ (for example, it may be 0.25λ). The first segment 41 3The sum of the electrical lengths of the first segment 413, the second segment 414, and the third segment 415 is the electrical length (0.5λ) on the extension path of the power supply transmission unit 41. In another implementation form, there may be an included angle between the extending direction of the first segment 413 and the second direction A2. For example, the first segment 413 is inclined at 15 degrees with respect to the second direction A2 (this angle value is only an example for explanation and is not limited in this solution, and other angle values may be used). The electrical length of the components of the first segment 413 in the second direction A2 is 0.25λ. Similarly, there may be an included angle between the second segment 414 and the first direction A1, and between the third segment 415 and the first direction A1. The sum of the electrical length of the components of the second segment 414 in the first direction A1 and the electrical length of the components of the third segment 415 in the first direction A1 is between 0.1λ and 0.35λ (for example, it may be 0.25λ).

[0072] In this implementation form, as shown in FIG. 11, the grounding part 42 has a two-segment structure. The grounding part 42 includes a fourth segment 423 and a fifth segment 424. The fourth segment 423 and the first segment 413 may extend in parallel. The fourth segment 423 and the first segment 413 may be parallel to each other. The fifth segment 424 and the third segment 415 extend in parallel. The fifth segment 424 and the third segment 415 may be parallel to each other. The electrical length of the fourth segment 423 may be between 0.1λ and 0.35λ (for example, it may be 0.25λ), and the electrical length of the fifth segment 424 may be between 0.1λ and 0.35λ (for example, it may be 0.25λ). The fourth segment 423 is directly connected to the ground element 30 of the antenna module 10, and may be directly connected by welding or fixed by using a conductive adhesive.

[0073] In another implementation form, please refer to FIG. 12. The main difference between the implementation form shown in FIG. 12 and the implementation form shown in FIG. 11 is that the grounding portion 42 has a three-segment structure. The grounding portion 42 further includes a sixth segment 425 in addition to the fourth segment 423 and the fifth segment 424. The sixth segment 425 and the second segment 414 extend in parallel. The L-shaped transmission line architecture can be formed between the sixth segment 425 and the fourth segment 423. The end of the sixth segment 425 away from the fourth segment 423 is connected to the ground element 30 of the feeding element 40. The extending directions of both the sixth segment 425 and the fifth segment 424 can be the first direction A1. The total electrical length of the sixth segment 425 and the fifth segment 424 is between 0.1λ and 0.35λ (for example, it may be 0.25λ). In this implementation form, the fourth segment 423 is separated from the ground element 30 of the antenna module 10 by using an insulating medium.

[0074] In one implementation form, as shown in the implementation forms of FIGS. 11 and 12, the fourth segment 423 and the fifth segment 424 are perpendicular to each other, forming an L-shaped transmission line architecture, and the first segment 413 and the third segment 415 form an L-shaped transmission line architecture. The first segment 413 and the second segment 414 also form an L-shaped transmission line architecture. In another implementation form, the included angle between the fourth segment 423 and the fifth segment 424 may be greater than 90 degrees or less than 90 degrees. Similarly, the included angles between the first segment 413 and the third segment 415 and between the first segment 413 and the second segment 414 may also be greater than 90 degrees or less than 90 degrees.

[0075] In one implementation form, please refer to FIG. 13. The feeding transmission portion 41 Of extends in the second direction A2 Transmission lineIt includes at least two transmission line segments. The at least two transmission line segments are parallel to each other but not on the same line. The vertical distance from the segment of the transmission line extending in the second direction A2 to the ground element 30 of the antenna module 10 is different. This solution is a specific cable wiring solution for the power supply transmission unit 41. In this application, different forms of the power supply transmission unit 41 can be arranged based on different specific assembly environments and electromagnetic field environments of the antenna module, and the specific transmission form in the insulation setting can be adjusted to realize different designs. This is simple and easy to implement. The at least two transmission line segments are connected via a transmission line extending in the first direction A1. In this implementation form, extending in the first direction A1 and extending in the second direction A2 can be understood as follows: it can coincide with the first direction A1, or form an included angle with the first direction A1, but have a vertical component in the first direction A1; or it can coincide with the second direction A2, or form an included angle with the second direction A 2 2, but have a vertical component in the second direction A2. In a specific implementation form, the power supply transmission unit 41 has two transmission lines extending in the second direction A2, and the power supply transmission unit 41 has a five-segment structure. In other words, the power supply transmission unit 41 includes two transmission line segments extending in the second direction and three transmission line segments extending in the first direction A1. The total electrical length of the two transmission line segments extending in the second direction A2 is between 0.1λ and 0.35λ (for example, it may be 0.25λ), and the total electrical length of the three transmission line segments in the first direction A1 is between 0.1λ and 0.35λ (for example, it may be 0.25λ).

[0076] In the implementation forms shown in FIGS. 11, 12, and 13, the power supply transmission part 41 and the grounding part 42 can be on the same plane, which means that the power supply transmission part 41 and the grounding part 42 are located on the same plane. In other words, the planes of the insulating supports supporting the power supply transmission part 41 and the grounding part 42 are the same. For example, when the insulating support has a circuit board structure, the power supply transmission part 41 and the grounding part 42 are located on the same layer of the circuit board. The thicknesses of the power supply transmission part 41 and the grounding part 42 are not considered in this application. The thickness of the power supply transmission part 41 and the thickness of the grounding part 42 may be different. However, if the power supply transmission part 41 and the grounding part 42 are arranged on the same plane, the power supply transmission part 41 and the grounding part 42 can be understood to be on the same plane. The manufacturing cost of the coplanar design is low, and the positional relationship between the power supply transmission part and the grounding part is easy to control.

[0077] When the insulating support has another type of structure, the power supply transmission part 41 and the grounding part 42 are located on the same surface of the insulating support. In this implementation form, from the first power supply end 411 to the second power supply end 412, the power supply transmission part 41 extends with a constant width. From the first grounding end 421 to the second grounding end 422, the grounding part 42 also extends with a constant width. The width of the grounding part 42 is larger than the width of the power supply transmission part 41.

[0078] Alternatively, the power supply transmission part 41 and the grounding part 42 of the power supply element 40 in the implementation forms shown in FIGS. 11, 12, and 13 do not have to be on the same plane. For example, when the power supply element 40 is arranged on a circuit board, the power supply transmission part 41 and the grounding part 42 can be separately located on different layers of the circuit board, but the structure and positional relationship of the projections of the power supply transmission part 41 and the grounding part 42 on the same surface of the circuit board are the architecture shown in FIGS. 11, 12, and 13.

[0079] In another implementation form, please refer to FIGS. 14, 15, 16, and 17. The plane where the power supply transmission part 41 is located and the plane where the grounding part 42 is located are not on the same plane. In other words, the power supply transmission part 41 and the grounding part 42 form a non-coplanar transmission line architecture. In FIGS. 14 and 15, the power supply transmission part 41 and the grounding part 42 are arranged on two surfaces of the circuit board. The power supply transmission part 41 is represented by solid lines and internal cross-section lines in order to indicate that the surface of the circuit board where the power supply transmission part 41 is located is the visible surface. The grounding part 42 is represented by dashed lines and blanks (without cross-section lines). The surface of the circuit board where the grounding part 42 is located is the invisible surface. Specifically, the implementation forms shown in FIGS. 14, 15, 16, and 17 indicate that the power supply transmission part 41 and the grounding part 42 are located on different layers of the circuit board 43, but the projections of the power supply transmission part 41 and the grounding part 42 on the same surface of the circuit board 43 overlap at least partially. Compared with that in the coplanar design, the non-coplanar transmission architecture provided in this solution has the advantages of saving space and reducing the area occupied on the substrate. The thickness of the circuit board substrate is only used for insulation between the power supply transmission part and the grounding part, thereby reducing the manufacturing cost. The circuit board 43 includes a first surface 431, a second surface 432, an upper edge 433, and a lower edge 434. The first surface 431 and the second surface 432 are arranged opposite to each other in a third direction A3. The power supply transmission part 41 is located on the first surface 431, the grounding part 42 is located on the second surface 432, and both the power supply transmission part 41 and the grounding part 42 extend from the lower edge 434 to the upper edge 433. The circuit board 43 includes a plug structure 435. The plug structure 435 protrudes from the upper edge 433. The plug structure 435 is configured to be electrically connected to the radiating element 20. Specifically, a conductive connection part 436 is arranged on the plug structure 435, and the conductive connection part 436 is electrically connected to the power supply transmission part 41. The first grounding end 421 of the grounding part 42 extends to the upper edge 433 and is configured to be electrically connected to the ground element 30. A clamp groove 437 is provided at the lower edge 434, and the clamp groove 437 is used for fixing to another circuit board or support.In the third direction A3 (for example, the third direction A3 may be the thickness direction of the circuit board), the power supply transmission unit 41 directly faces the grounding unit 42. The third direction A3 is perpendicular to the second direction A2, and the third direction A3 is also perpendicular to the first direction A1. The expansion solution and specific form of the power supply transmission unit 41 in the first direction A1 and the second direction A2 are the same as those in the implementation form shown in FIG. 11, and the expansion solution and specific form of the grounding unit 42 in the first direction A1 and the second direction A2 are the same as those of the power supply transmission unit 41. In one implementation form, the power supply transmission unit 41 and the grounding unit 42 of the antenna module provided by this solution can be arranged on two surfaces (for example, the front surface and the rear surface) of the circuit board.

[0080] In the implementation form shown in FIG. 14, for the power supply transmission unit 41, from the first power supply terminal 411 to the second power supply terminal 412, the power supply transmission unit 41 extends with a constant width. For the grounding unit 42, the first grounding terminal 421 From The second grounding terminal 422 To , the grounding unit 42 also extends with a constant width. However, the width of the power supply transmission unit 41 is different from the width of the grounding unit 42.

[0081] In the implementation form shown in FIG. 15, for the power supply transmission unit 41 (having the same structural form as the power supply transmission unit 41 in the implementation form shown in FIG. 14), from the first power supply terminal 411 to the second power supply terminal 412, the power supply transmission unit 41 extends with a constant width. For the grounding unit 42, the first grounding terminal 421 From The second grounding terminal 422 To , a part of the grounding unit 42 extends with a constant width, and a part of the grounding unit 42 extends with a non-constant width. Specifically, the part of the grounding unit 42 extending in the second direction extends with a constant width, the upper half of the part of the grounding unit 42 extending in the first direction extends with a constant width, and the lower half of the part of the grounding unit 42 extending in the first direction extends with a non-constant width. The part of the grounding unit 42 extending with a non-constant width has a trapezoidal structure with a narrow upper part and a wide lower part. In another implementation form, the part of the grounding unit 42 extending with a non-constant width may alternatively be arranged in another form (for example, a square or a circle), or at another position (for example, at the part extending in the second direction or at the upper half of the part extending in the first direction).

[0082] The power supply transmission part and the grounding part that extend with uneven widths may extend with gradually changing widths in order to facilitate impedance adjustment.

[0083] In the mounting form shown in FIG. 16, for the power supply transmission part 41, from the first power supply terminal 411 to the second power supply terminal 412, a part of the power supply transmission part 41 extends with a uniform width, and a part of the power supply transmission part 41 extends with an uneven width. For the grounding part 42, the first grounding terminal 421 From the second grounding terminal 422 To , the grounding part 42 extends with a uniform width.

[0084] In the mounting form shown in FIG. 17, for the power supply transmission part 41, from the first power supply terminal 411 to the second power supply terminal 412, a part of the power supply transmission part 41 extends with a uniform width, and a part of the power supply transmission part 41 extends with an uneven width. For the grounding part 42, the first grounding terminal 421 From the second grounding terminal 422 To , a part of the grounding part 42 extends with a uniform width, and a part of the grounding part 42 extends with an uneven width.

[0085] Please refer to FIGS. 7, 8, and 9. In one implementation form, the antenna module 10 includes a support 15 including a printed circuit board. The antenna module 10 is formed by a radiation element 20, a ground element 30, and a feeding element 40 formed on the support 15. This has advantages such as easy manufacturing and low manufacturing cost. The support part 15 has a first plate 151, a second plate 152, and a third plate 153. The radiation element 20 and the ground element 30 are formed on the first plate 151. The second plate 152 is an insulating support for arranging the feeding element 40. The second plate 152 and the third plate 153 are arranged to intersect, and both are located between the first plate 151 and the main board 103. The specific structure of the second plate 152 may be the same as the structure of the circuit board 43 in the mounting form shown in FIG. 14.

[0086] Please refer to FIGS. 18 and 19. The first plate 151 is laminated LayeredIt has a first layer 1511 and a second layer 1512. In one implementation form, the first layer 1511 is the upper surface of the first plate 151, and the second layer 1512 is the lower surface of the first plate 151. The radiation element 20 is located in the first layer 1511, and the ground element 30 is located in the second layer 1512. The second plate 152 includes a first edge 1522 and a second edge 1523 arranged opposite to each other, and a cable layer 1521. The cable layer 1521 is located between the first edge 1522 and the second edge 1523. The second plate 152 is located on the side of the first plate 151. The first edge 1522 is connected to the first plate 151. The power supply element 40 is arranged in the cable layer 1521. An included angle is formed between the cable layer 1521 and the first layer 1511. Specifically, the cable layer 1521 can be perpendicular to the first layer 1511. The main board 103, the ground element 30, and the radiation element 20 are stacked in the first direction A1 in sequence. Layered The main board 103, the second plate 152, and the first plate 151 are connected in sequence in the first direction A1. The main board 103 and the first plate 151 can be arranged parallel to each other. For example, the main board 103 and the first plate 151 are in a horizontal arrangement state, and the second plate 152 is in a vertical Direct distribution arrangement state. Both the first plate 151 and the second plate 152 have a flat plate structure, and the second plate 152 can be vertically connected between the main board 103 and the first plate 151. In this solution, the antenna module 10 is provided with the first plate 151 and the second plate 152. The manufacturing process is simple, and the manufacturing cost is low. In addition, the antenna module 10 has the advantage of being lightweight. Thereby, it is easy to design a slim and short communication device.

[0087] In another implementation form, the radiation element 20, the ground element 30, and the power feeding element 40 may alternatively be arranged on another type of insulating support, for example, on an integrated plastic support formed by injection molding. One part of the plastic support is configured to arrange the radiation element 20 and the ground element, and the other part of the plastic support is configured to arrange the power feeding element 40. The plastic support may be in a cylindrical shape, a square shape, etc. suitable for supporting the radiation element 20, the ground element, and the power feeding element 40.

[0088] Please refer to FIGS. 18 and 19. In this solution, the grounding portion 42 is electrically connected to the ground element 30 through the connection between the first edge portion 1522 and the first plate 151. Specifically, in one implementation form, the first edge portion 1522 is in contact with the first plate 151. The grounding portion 42 may be electrically connected to the ground element 30 through the contact between the grounding portion 42 in the cable layer 1521 and the ground element 30 on the first plate 151, or the grounding portion 42 may be stably connected to the ground element 30 by welding. In one implementation form, the ground element 30 is located on the surface of the first plate 151, and the grounding portion 42 is located on the surface of the second plate 152. When the first plate 151 is in contact with the second plate 152, the ground element may be fixed to the grounding portion 42 by welding. The black region similar to a semi - circle in FIG. 19 is the welding position. The implementation form shown in FIG. 19 only schematically shows the welding relationship between the grounding portion 42 and the ground element 30, and does not constitute a limitation on a specific welding position or welding structure.

[0089] Please refer to FIGS. 18 and 19. A connection structure 50 is disposed at the joint between the first plate 151 and the second plate 152, and the connection structure 50 can be understood as having a structure similar to a connector or a structure where a plug matches a jack. The connection structure 50 is configured to realize an electrical connection between the power supply transmission unit 41 and the radiation element 20. In the present application, in the process of assembling and connecting the first plate 151 and the second plate 152, an electrical connection between the power supply element 40 and the radiation element 20 and an electrical connection between the power supply element 40 and the ground element 30 can be made. Such electrical connections are highly reliable and have low losses. In one implementation form, in the present application, the electrical connection between the power supply transmission unit 41 and the radiation element 20 is realized through the alignment between a structure protruding from the edge of the second plate 152 and a hole structure on the first plate 151. Specifically, the first plate 151 is provided with a hole 1513 penetrating through the first layer 1511 and the second layer 1512. The second plate 152 includes a plug structure 435 protruding from the first edge 1522. At least a part of the plug structure 435 is located within the hole 1513. The connection structure 50 includes the hole 1513 and the plug structure 435, and the connection structure 50 further includes a conductive connection portion 436. As shown in FIG. 19, the conductive connection portion 436 is electrically connected between the radiation element 20 and the power supply transmission unit 41. The conductive connection portion 436 may include a conductive layer, a conductive sheet, a conductive adhesive, or solder that is electrically connected between the radiation element 20 and the power supply transmission unit 41.

[0090] As shown in FIGS. 18 and 19, in one implementation form, the hole 1513 on the first plate 151 is a through hole. The hole 1513 has a first open end E1 and a second open end E2. The plug structure 435 is inserted into the hole 1513 from the first open end E1. The conductive connection portion 436 is welded to the radiation element 20 from the side of the second open end E2. The first layer 1511 is the upper surface of the first plate 151, and the second layer 1512 is the lower surface of the first plate 151. The first open end E1 is located on the lower surface, and the second open end E2 is located on the upper surface.

[0091] As shown in FIG. 19, the second edge portion 1523 of the second plate 152 is connected to the main board 103 of the communication device. A ground plane 103G is disposed inside the main board 103, and a radio frequency chip 103F is further disposed on the main board 103. The power feeding transmission portion 41 of the power feeding element 40 is electrically connected to the radio frequency chip 103F via a transmission line in the main board 103, and the ground portion 42 of the power feeding element 40 is electrically connected to the ground plane 103G in the main board 103. FIG. 19 schematically shows the connection method between the ground portion 42 and the ground plane 103G on the main board 103, and the connection method between the power feeding transmission portion 41 and the radio frequency chip 103F via the transmission line. The specific position of the ground plane 103G, the specific position of the radio frequency chip 103F, and the specific form of the transmission line are not limited. It can be understood that the main board 103 has a multilayer circuit board structure. The ground plane 103G can be one of the layers, the transmission line can be located in one of the layers, and the radio frequency chip 103F can be disposed on the surface of the main board 103. In one implementation form, the radio frequency chip 103F is disposed on the surface of the main board 103 away from the antenna module 10, and an electromagnetic shielding space (shown in FIG. 3) is formed by the structure of the first housing 101 of the communication device 100 and the main board 103.

[0092] Please refer to FIGS. 20 and 21. The difference between the implementation forms shown in FIGS. 20 and 21 and the implementation forms shown in FIGS. 18 and 19 is that the inner wall of the hole 1513 on the first plate 151 in the implementation forms shown in FIGS. 18 and 19 is made of the insulating material of the first plate 151. In other words, the inner wall of the hole 1513 has no conductive structure. The conductive connection portion 436 is welded to the radiation element 20 from the second open end E2. In the implementation forms shown in FIGS. 20 and 21, a conductive layer 1514 is disposed on the inner wall of the hole 1513 of the first plate 151, and the conductive layer 1514 is electrically connected to the radiation element 20. The plug structure 435 is inserted into the hole 1513 of the first plate 151, and the electrical connection between the conductive connection portion 436 and the conductive layer 1514 can be realized inside the hole 1513 by using a conductive adhesive or solder. In this solution, the strength and stability of the electrical connection of the connection structure 50 between the power supply transmission portion 41 and the radiation element 20 are better.

[0093] Please refer to FIGS. 7, 8, and 9. In addition to the plug structure 435 for the connection between the first edge portion 1522 of the second plate 152 and the first plate 151, the second plate 152 further includes a positioning rod 1524 protruding from the first edge portion 1522. In one implementation form, there are two positioning rods 1524, and the positioning rods 1524 are symmetrically arranged on both sides of the plug structure 435. Correspondingly, the first plate 151 is provided with positioning holes 1515 arranged in a one-to-one correspondence with the positioning rods 1524. Specifically, there are two positioning holes 1515, and the positioning holes 1515 are symmetrically arranged on both sides of the hole 1513. The positioning rods 1524 are respectively inserted into the positioning holes 1515 for fixing the first plate 151 to the second plate 152. The third plate 153 is also fixed to the first plate 151 through the alignment between the positioning rod and the positioning hole.

[0094] In a specific implementation form, please refer to FIG. 8. The antenna module further includes a reflecting element 60 and a lumped element 70. The lumped element 70 is mounted on the reflecting element 60, and whether the reflecting element 60 operates is controlled by controlling the lumped element 70. The switching between the high-density state and the isotropic state of the antenna module is realized by the function of the reflecting element 60.

[0095] In a specific implementation form, the first primary antenna 10A1 is arranged on the second plate 152. The radiation element 20, the ground element 30, and the feeding element 40 form the second primary antenna 10A2. The resonance frequency of the first primary antenna 10A1 is the first frequency, and the resonance frequency of the second primary antenna 10A2 is the second frequency. The second frequency is higher than the first frequency. The first frequency is 2.4 GHz, and the second frequency is 5G Hz It is. The antenna module 10 includes a plurality of antenna elements 10A. Each antenna element 10A includes one first primary antenna 10A1 and one second primary antenna 10A2.

[0096] Referring to FIGS. 22 and 23, FIG. 23 is a diagram of the marked distance and marked height of the antenna module according to the implementation form shown in FIG. 22. The distance D3 between the first primary antenna 10A1 and the first primary antenna 10A1 of the adjacent antenna element 10A is between 0.2 times the wavelength and 0.8 times the wavelength.

[0097] The antenna element 10A further includes a first decoupling structure 13 and a second decoupling structure 14. The first decoupling structure 13 is located on the second plate 152, and the second decoupling structure 14 is located on the third plate 153. The ends of the second plate 152 and the third plate 153 that are away from the first plate 151 are connected to the main board 103 of the communication device. In the direction perpendicular to the ground plane of the main board 103 of the communication device, the longest distance between the first decoupling structure 13 and the ground plane 103G of the main board 103 is the cross-sectional height H1 of the first decoupling structure 13. The cross-sectional height H1 of the first decoupling structure 13 is between 0.01 times the wavelength and 0.16 times the wavelength. The distance between the first decoupling structure 13 and the first primary antenna 10A1 is the first distance D1. The distance between the first decoupling structure 13 and the first primary antenna 10A1 of an adjacent antenna element 10A is the second distance D2. Both the first distance D1 and the second distance D2 are between 0.1 times the wavelength and 0.6 times the wavelength.

[0098] The first distance D1 is the distance between the phase center of the first decoupling structure 13 and the phase center of the first primary antenna 10A1. The second distance D2 is the distance between the phase center of the first decoupling structure 13 and the phase center of the first primary antenna 10A1 of an adjacent antenna element 10A. In the present application, the first decoupling structure 13 is arranged to achieve a small size of the entire antenna module. Thereby, the thin design of the communication device is facilitated, and the problem of isolation between the first primary antennas 10A1 of adjacent antenna elements can be further solved. By controlling the cross-sectional height of the first decoupling structure 13, the distance between the first decoupling structure 13 and the first primary antenna 10A1, and the distance between the first decoupling structure 13 and the first primary antenna 10A1 of an adjacent antenna element, the isolation between adjacent first primary antennas 10A1 in a limited space can be improved, and the influence on the radiation efficiency of the first primary antenna 10A1 can be reduced. There is no obvious depression in the simulation diagram of the radiation efficiency of adjacent first primary antennas 10A1.

[0099] In the antenna module 10 provided in the present application, the antenna elements 10A are designed to have the same architecture. In the process of assembling a plurality of antenna elements 10A on the main board 103, since the structures of all the antenna elements 10A are the same, there is no need to consider the specific structure of each antenna element 10A. The antenna elements 10A need to be arranged based only on the position of the radio frequency chip. Therefore, this implementation form helps to simplify the assembly process of the communication device, reduce the assembly cost, and improve the manufacturing efficiency.

[0100] The second decoupling structure 14 is configured to reduce the amount of coupling between the first primary antenna 10A1 and the antenna element 10A adjacent to the first primary antenna 10A1, and the resonance frequency of the second decoupling structure 14 is higher than the first frequency or lower than the first frequency. The frequency difference between the resonance frequency of the second decoupling structure 14 and the first frequency is between 0.03 GHz and 0.33 GHz. By limiting the resonance frequency of the second decoupling structure 14 to the range of (fL - 0.33 GHz) to (fL - 0.03 GHz) or (fH + 0.03 GHz) to (fH + 0.33 GHz), the isolation can be improved and no efficiency drop is introduced into the band. Here, fL to fH is the frequency range of the first primary antenna 10A1 (i.e., the first frequency). For example, fL to fH is 2.4 GHz to 2.5 GHz.

[0101] The distances D4 and D5 between the second decoupling structure 14 and the first primary antenna 10A1 are between 0.05 times the wavelength and 0.6 times the wavelength. The distances D4 and D5 between the second decoupling structure 14 and the first primary antenna 10A1 may be shorter than the distance between the first decoupling structure 13 and the first primary antenna 10A1 (the first distance D1), or may be shorter than the distance between the first decoupling structure 13 and the first primary antenna 10A1 of the adjacent antenna element 10A (the second distance D2).

[0102] In the present application, the resonance frequency of the second decoupling structure 14 is adjusted so that the resonance frequency of the second decoupling structure 14 is not the same as the first frequency, but is slightly higher or lower. Thereby, decoupling between the first primary antennas 10A1 of adjacent antenna elements 10A is realized, whereby isolation is improved and the influence on the radiation efficiency of the antenna is reduced. Specifically, when the second decoupling structure 14 generates resonance, a drop in efficiency occurs with respect to the electromagnetic wave at the resonance frequency of the second decoupling structure 14. In the case of the first primary antenna 10A1 of adjacent antenna elements 10A, due to the drop in efficiency caused by the second decoupling structure 14, the in-band frequency of the resonance of the first primary antenna 10A1 of the adjacent antenna element 10A (i.e., the first frequency) is avoided, and the influence of the second decoupling structure 14 on the radiation efficiency of the first primary antenna 10A1 of the adjacent antenna element 10A can be reduced.

[0103] In the present application, the distance between the two first primary antennas is shortened, and the first primary antenna 10A1 and the second primary antenna 10A2 are arranged on the same support, thereby saving the space of the main board 103 and facilitating the small-size design of the antenna module. The distance between the two first primary antennas 10A1 is between 0.2 times the wavelength and 0.8 times the wavelength. When the first decoupling structure is not arranged in each antenna element, when the two first primary antennas 10A1 are in a resonant state, the two first primary antennas receive signals from each other, resulting in signal interference and insufficient isolation. Therefore, in the present application, the distance between the two first primary antennas 10A1 is set between 0.2 times the wavelength and 0.8 times the wavelength, and the first decoupling structure 13 and the second decoupling structure 14 are Ensure isolation, thereby two first primary ant Between nanometers of the radiation eff Rate arranged to be improved.

[0104] In this application, the first decoupling structure 13 is arranged to achieve a small size of the antenna. This facilitates the thin design of the communication device and can further solve the isolation problem between adjacent first primary antennas 10A1. By controlling the cross-sectional height of the first decoupling structure 13, the distance between the first decoupling structure 13 and the first primary antenna 10A1, and the distance between the first decoupling structure 13 and the adjacent first primary antenna 10A1, the isolation between adjacent first primary antennas 10A1 in a limited space can be improved, and the influence on the radiation efficiency of the first primary antenna 10A1 can be reduced. As a result, there is no obvious depression in the simulation diagram of the radiation efficiency of the first primary antenna 10A1.

[0105] In this application, the resonance frequency of the second decoupling structure 14 is adjusted so that the resonance frequency of the second decoupling structure is not the same as the first frequency but is slightly higher or lower. Thereby, decoupling between the first primary antennas 10A1 is realized, whereby isolation is improved and the influence on the radiation efficiency of the antenna is reduced. Specifically, when the second decoupling structure 14 generates resonance, a drop in efficiency occurs for the electromagnetic wave at the resonance frequency of the second decoupling structure 14. In the case of the first primary antenna 10A1, due to the drop in efficiency caused by the second decoupling structure 14, the in-band frequency of the resonance of the first primary antenna 10A1 (i.e., the first frequency) is avoided, and the influence of the second decoupling structure 14 on the radiation efficiency of the first primary antenna 10A1 can be reduced.

[0106] Finally, it should be noted that the foregoing embodiments are only for explaining the technical solutions of this application and are not for limiting this application. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still make modifications to the technical solutions described in the foregoing embodiments or perform equivalent substitutions for some of their technical features without departing from the scope of the technical solutions of the embodiments of this application.

Claims

1. An antenna module, comprising: A radiation element and a ground element arranged in a stacked manner; A feeding element, which is a transmission line structure formed on an insulating support. In a first direction, the feeding element is located on a side of the ground element away from the radiation element. The feeding element includes a feeding transmission part and a grounding part. The feeding transmission part is insulated from the grounding part. The width of the feeding transmission part includes a first width, and the width of the grounding part includes a second width. The first width is not equal to the second width. The width of the feeding transmission part is a dimension in a direction perpendicular to an extension path of the feeding transmission part, and the width of the grounding part is a dimension in a direction perpendicular to an extension path of the grounding part. The feeding element; An antenna module comprising the above.

2. In the extension path of the feeding transmission part, the electrical length of the feeding transmission part is between 0.3λ and 0.7λ, where λ is the wavelength of the electromagnetic wave of the radiation element in a resonance state. The antenna module according to claim 1.

3. The extension path of the feeding transmission part and the extension path of the grounding part form a double parallel line architecture. The antenna module according to claim 2.

4. The total electrical length of the feeding transmission part in a second direction is between 0.15λ and 0.35λ, where λ is the wavelength of the electromagnetic wave of the radiation element in the resonance state, and the second direction is perpendicular to the first direction. The antenna module according to any one of claims 1 to 3.

5. The portion of the transmission line of the feeding transmission part extending in the second direction is on the same straight line. The antenna module according to claim 4.

6. The portion of the transmission line of the power supply transmission unit that extends in the second direction includes at least two transmission line segments, and the at least two transmission line segments are connected to each other via a transmission line that extends in the first direction. The antenna module according to claim 4.

7. The power supply transmission unit and the grounding unit are on the same plane. The antenna module according to any one of claims 1 to 6.

8. The plane on which the power supply transmission unit is located and the plane on which the grounding unit is located are not on the same plane. The power supply transmission unit and the grounding unit are arranged to face each other in a third direction. The third direction is perpendicular to the second direction, and the third direction is also perpendicular to the first direction. The antenna module according to any one of claims 1 to 6.

9. The power supply transmission unit includes a first power supply terminal and a second power supply terminal. The first power supply terminal is electrically connected to the radiating element. The second power supply terminal is configured to be electrically connected to a radio frequency chip on the main board of the communication device. From the first power supply terminal to the second power supply terminal, the power supply transmission unit extends with equal width, and / or The grounding unit includes a first grounding terminal and a second grounding terminal. The first grounding terminal is electrically connected to the ground element. The second grounding terminal is configured to be electrically connected to the ground on the main board of the communication device. From the first grounding terminal to the second grounding terminal, the grounding unit extends with equal width. The antenna module according to any one of claims 1 to 8.

10. The power supply transmission unit includes a first power supply terminal and a second power supply terminal. The first power supply terminal is electrically connected to the radiating element. The second power supply terminal is configured to be electrically connected to a radio frequency chip on the main board of the communication device. From the first power supply terminal to the second power supply terminal, a part of the power supply transmission unit extends with equal width, and a part of the power supply transmission unit extends with unequal width, and / or The grounding portion includes a first grounding end and a second grounding end. The first grounding end is electrically connected to the ground, and the second grounding end is configured to be electrically connected to the ground on the main board of the communication device. From the first grounding end to the second grounding end, a part of the grounding portion extends with equal width, and a part of the grounding portion extends with unequal width. The antenna module according to any one of claims 1 to 8.

11. The power feeding transmission portion includes a first power feeding end and a second power feeding end. The first power feeding end is electrically connected to the radiating element, and the second power feeding end is configured to be electrically connected to a radio frequency chip on the main board of the communication device. From the first power feeding end to the first power feeding end, the power feeding transmission portion extends with equal width. The grounding portion includes a first grounding end and a second grounding end. The first grounding end is electrically connected to the ground element, and the second grounding end is configured to be electrically connected to the ground on the main board of the communication device. From the first grounding end to the second grounding end, a part of the grounding portion extends with equal width, and a part of the grounding portion extends with unequal width. The antenna module according to any one of claims 1 to 8.

12. The grounding portion includes a first grounding end and a second grounding end. The first grounding end is electrically connected to the ground element, and the second grounding end is configured to be electrically connected to the ground on the main board of the communication device. From the first grounding end to the second grounding end, the grounding portion extends with equal width. The power feeding transmission portion includes a first power feeding end and a second power feeding end. The first power feeding end is electrically connected to the radiating element, and the second power feeding end is configured to be electrically connected to a radio frequency chip on the main board of the communication device. From the first power feeding end to the first power feeding end, a part of the power feeding transmission portion extends with equal width, and a part of the power feeding transmission portion extends with unequal width. The antenna module according to any one of claims 1 to 8.

13. The antenna module includes a first plate and a second plate. The first plate includes a first layer and a second layer arranged in a stacked manner. The radiating element is located in the first layer, and the ground element is located in the second layer. The second plate is the insulating support. The second plate includes a first edge and a second edge arranged opposite to each other, and a cable layer. The cable layer is located between the first edge and the second edge. The second plate is located on the side of the first plate. The first edge is connected to the first plate. The feeding element is arranged in the cable layer. The cable layer and the first layer are arranged at an included angle. The antenna module according to any one of claims 1 to 12.

14. The grounding portion is electrically connected to the ground element through the connection between the first edge and the first plate. A connection structure is arranged at the joint between the first plate and the second plate. The connection structure is configured to realize the electrical connection between the feeding transmission portion and the radiating element. The antenna module according to claim 13.

15. The first plate is provided with a hole penetrating the first layer and the second layer. The second plate includes a plug structure protruding from the first edge. At least a part of the plug structure is located in the hole. The connection structure includes the hole and the plug structure. The connection structure further includes a conductive connection portion. The conductive connection portion is electrically connected between the radiating element and the feeding transmission portion. The antenna module according to claim 14.

16. The hole is a through hole. The hole includes a first opening end and a second opening end. The plug structure is inserted into the hole from the first opening end. The conductive connection portion is welded to the radiating element from the side of the second opening end. The antenna module according to claim 15.

17. The first layer is the upper surface of the first plate, the second layer is the lower surface of the first plate, the first opening end is located on the lower surface, and the second opening end is located on the upper surface. The antenna module according to claim 16.

18. The second edge of the second plate is connected to the main board of the communication device, the grounding portion of the power feeding element is electrically connected to the ground plane on the main board, and the power feeding transmission portion is electrically connected to the radio frequency chip on the main board through a transmission line arranged on the main board. The antenna module according to any one of claims 13 to 17.

19. The first primary antenna is arranged on the second plate, the radiation element, the ground element, and the power feeding element form a second primary antenna, the resonance frequency of the first primary antenna is a first frequency, the resonance frequency of the second primary antenna is a second frequency, and the second frequency is higher than the first frequency. The antenna module according to any one of claims 13 to 18.

20. The antenna module includes a plurality of antenna elements, each antenna element includes one first primary antenna and one second primary antenna, the antenna element further includes a first decoupling structure and a second decoupling structure, the first decoupling structure is located on the second plate, the antenna module further includes a third plate, the third plate and the second plate are arranged to intersect, and the second decoupling structure is located on the third plate. The antenna module according to claim 19.

21. The end portions of the second plate and the third substrate, which are away from the first plate, are connected to the main board of the communication device. In a direction perpendicular to the ground plane on the main board of the communication device, the longest distance between the first decoupling structure and the ground plane is the cross-sectional height of the first decoupling structure. The cross-sectional height of the first decoupling structure is between 0.01 times the wavelength and 0.16 times the wavelength. The distance between the first decoupling structure and the first primary antenna is a first distance, and the distance between the first decoupling structure and the first primary antenna of an adjacent antenna element is a second distance. Both the first distance and the second distance are between 0.1 times the wavelength and 0.6 times the wavelength. The second decoupling structure is configured to reduce the amount of coupling between the first primary antenna and the first primary antenna of the adjacent antenna element. The resonant frequency of the second decoupling structure is higher than the first frequency or lower than the first frequency. The antenna module according to claim 20.

22. A communication device comprising a radio frequency chip and the antenna module according to any one of claims 1 to 21, wherein the antenna module is electrically connected to the radio frequency chip.

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