Film, display panel, display device, and household electrical appliance

Abstract

Embodiments of the present disclosure provide a film (10), a display panel (100), a display device (1000), and a household appliance. The film (10) includes a base material layer (11), a pattern layer (13), and a circuit layer (12). Both the pattern layer (13) and the circuit layer (12) are printed on the base material layer (11). Since the circuit layer (12) and the pattern layer (13) are integrally printed and integrated on the base material layer, there is no gap between the circuit layer (12) and the pattern layer (13), meeting the requirement for the sharpness of patterns and character displays after brightening. When the film (10) is affected by moisture, problems such as a decrease in touch sensitivity and malfunctions are improved. The position of the electronic device in the circuit layer (12) is matched with the corresponding pattern in the pattern layer (13), improving the accuracy of the matching position.

Description

Technical Field

[0001] (Cross - reference to related applications) This application claims the priority of a Chinese patent application with application number 202221550221.2 filed with the Chinese Patent Office on June 20, 2022, and a Chinese patent application with application number 202210701741.7 filed with the Chinese Patent Office on June 20, 2022, and all the contents of the Chinese patent application are incorporated herein by reference.

[0002] This disclosure relates to the technical field of mold interior decoration, and particularly relates to films, display panels, display devices, and household electrical appliances.

Background Art

[0003] Taking the display panel of a household electrical appliance as an example, the process adopted in the related art is to first attach a color film to the surface of the display board box, attach a touch film to the inner surface of the mold inner, and then attach the mold inner with the touch film attached to the outer surface of the display board box so that the touch film is aligned with the color film, and then defoam the gap between the color film and the touch film to meet the requirements of color display and touch. For this reason, the patterns and characters after brightening are not clearly displayed, and the touch film is affected by moisture, and it is easy to cause a decrease in touch sensitivity and failure.

Summary of the Invention

Problems to be Solved by the Invention

[0004] In view of the above, an embodiment of this disclosure aims to provide a film, a display panel, a display device, and a household electrical appliance that improve the display effect.

Means for Solving the Problems

[0005] An embodiment of this disclosure provides a film used for a display panel, and the film includes a base material layer, and The pattern layer printed on the base material layer, and the circuit layer printed on the base material layer.

[0006] In some embodiments, the pattern layer is provided outside the circuit layer.

[0007] In some embodiments, the base material layer includes an inner surface and an outer surface, the pattern layer is provided on the outer surface of the base material layer, and the circuit layer is provided on the inner surface of the base material layer.

[0008] In some embodiments, the base material layer includes an outer surface and an inner surface, both the pattern layer and the circuit layer are provided on the outer surface of the base material layer, and the circuit layer is provided between the pattern layer and the base material layer.

[0009] In some embodiments, the film includes a light homogenization layer for homogenizing light, and both the pattern layer and the circuit layer are located outside the light homogenization layer.

[0010] In some embodiments, the light homogenization layer is printed on the inner surface of the base material layer.

[0011] In some embodiments, in the direction from the inside to the outside, the light homogenization layer, the base material layer, the circuit layer, and the pattern layer are sequentially arranged.

[0012] In some embodiments, in the direction from the inside to the outside, the light homogenization layer, the circuit layer, the base material layer, and the pattern layer are sequentially arranged.

[0013] In some embodiments, the light homogenization layer is provided on the outermost surface inside the film.

[0014] In some embodiments, the light homogenization layer is an ink diffusion layer.

[0015] In some embodiments, the film includes an isolation sheet and a substrate connection band provided on a side edge of the substrate layer. A connection circuit electrically connected to a circuit in the circuit layer is provided on the substrate connection band, and the isolation sheet covers at least the connection circuit printed at one end of the substrate connection band close to the substrate layer.

[0016] Embodiments of the present disclosure provide a display panel, and the display panel includes an inner film which is the film described in any embodiment of the present disclosure, and an injection molding layer injection molded on an outer surface of the inner film.

[0017] In some embodiments, the display panel includes an outer film, and the injection molding layer is injection molded between an inner surface of the outer film and an outer surface of the inner film.

[0018] Embodiments of the present disclosure provide a display device, and the display device includes a display panel box provided with a light emitting source, and the display panel described in any embodiment of the present disclosure. The display panel box is provided inside the display panel, and the light emitting source is used to output light to the display panel.

[0019] In some embodiments, the display device includes a mounting frame. The mounting frame has a mounting space, the display panel box is fitted into the mounting space, the display panel is connected to the mounting frame and covers the mounting space.

[0020] Embodiments of the present disclosure provide a household appliance, and the household appliance includes a housing and the display device described in any embodiment of the present disclosure. The display device is provided on the housing.

[0021] In some embodiments, the home appliance product is a clothing treatment device, the clothing treatment device is provided with a knob for selecting a washing and care program, the display panel is provided with a mounting hole penetrating the display panel, and the knob is rotatably provided in the mounting hole.

[0022] According to the film of the embodiment of the present disclosure, the circuit layer and the pattern layer are integrally printed and integrated on the base material layer. In this way, the gap between the circuit layer and the pattern layer disappears, that is, the gap between the circuit layer and the pattern layer in the related art can be absolutely removed, and the requirements for the sharpness of the pattern and character display after brightening can be satisfied. Further, since air and vapor do not penetrate between the circuit layer and the pattern layer, the problem that the film is susceptible to moisture, resulting in a decrease in touch sensitivity and easy occurrence of failures, can be effectively improved.

[0023] According to the film of the embodiment of the present disclosure, the pattern layer may be formed first and then the circuit layer, or the circuit layer may be formed first and then the pattern layer. In any case, when the circuit layer or the pattern layer is formed later, the position of the electronic device in the circuit layer and the corresponding pattern in the pattern layer can be preferably matched to improve the accuracy of the matching position.

Brief Description of the Drawings

[0024]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Mode for Carrying Out the Invention

[0025] Hereinafter, embodiments of the present disclosure will be described in more detail with reference to the drawings and examples. The following examples are for explaining the present disclosure and are not for limiting the scope of the present disclosure.

[0026] In the description of the embodiments of the present disclosure, the orientation or positional relationship indicated by the terms "inside" and "outside" is based on the orientation or positional relationship shown in the drawings, and is only for facilitating the description of the embodiments of the present disclosure and simplifying the description. It does not indicate or imply that the specified device or element must have a specific orientation and must be configured and operated in a specific orientation. Therefore, it should not be understood as a limitation to the embodiments of the present disclosure. Also, terms such as "first", "second", "third", etc. are used only for the purpose of explanation and are not understood to indicate or imply their relative importance.

[0027] Embodiments of the present disclosure provide a film 10 used for a display panel.

[0028] For example, in the process of in-mold decoration (abbreviated as IMD), the injection molding material is injection molded onto the outer surface of the film to form a display panel. Of course, understandably, the film 10 may be applied to the display panel by other processes.

[0029] Referring to FIGS. 1 to 7, the film includes a base material layer 11, a pattern layer 13, and a circuit layer 12, and both the pattern layer 13 and the circuit layer 12 are printed on the base material layer 11.

[0030] The base material layer 11 is a sheet used as a carrier for printing and has a certain structural strength.

[0031] The raw material of the base material layer 11 may be a resin such as PET (Polyethylene terephthalate), PMMA (Polymethyl methacrylate), PC (Polycarbonate), PVC (Polyvinyl chloride), PP (Polypropylene), or an acrylic resin.

[0032] The specific type of the pattern in the pattern layer is not particularly limited. For example, it may include any one of any type of language characters (such as Chinese characters, English letters, French letters, etc.), numbers, color combinations, patterns, patterns displayed in regions with different grayscale values, or any combination thereof, but is not limited thereto.

[0033] The pattern in the pattern layer 13 may be in color or in black and white, and is not limited herein.

[0034] Since the circuit layer 12 has a printed circuit, the circuit layer 12 generally presents the form of a flexible circuit.

[0035] Note that the form of printing is not limited. For example, it includes, but is not limited to, spraying, laser printing, painting, etc. In short, each printed layer printed on the base material layer 11 itself has no film-like carrier. That is, the circuit layer 12 itself has no film-like carrier, the pattern layer 13 itself has no film-like carrier either, and each printed layer uses the base material layer 11 as a carrier, and each printed layer can be obtained by printing on the base material layer 11 layer by layer.

[0036] According to the film of the embodiment of the present disclosure, the circuit layer 12 and the pattern layer 13 are integrally printed on the base material layer. In this way, the gap between the circuit layer 12 and the pattern layer 13 is eliminated. That is, the gap between the circuit layer 12 and the pattern layer 13 in the related art can be absolutely removed, and the requirement for the sharpness of the pattern display after brightening can be satisfied. Furthermore, since air and vapor do not penetrate between the circuit layer 12 and the pattern layer 13, the problem that the film in the related art is affected by moisture and the touch sensitivity decreases or a failure occurs can be effectively improved.

[0037] According to the film 10 of the embodiment of the present disclosure, the pattern layer 13 may be formed first and then the circuit layer 12 may be formed, or the circuit layer 12 may be formed first and then the pattern layer 13 may be formed. In any case, when the circuit layer 12 or the pattern layer 13 is formed later, the position of the electronic device in the circuit layer 12 and the corresponding pattern in the pattern layer 13 can be preferably matched to improve the accuracy of the matching position.

[0038] Exemplarily, referring to FIGS. 8 and 9, the film 10 includes a base material connection band 15 provided on the side of the base material layer 11 and a connection circuit printed on the base material connection band 15, and the connection circuit is used to electrically connect the circuit in the printed circuit layer and the external circuit.

[0039] Note that the base material connection band 15 and the base material layer 11 are both cut into a desired shape in the cutting process. That is, the base material connection band 15 and the base material layer 11 have an integral structure.

[0040] In the process of printing each printing layer on the base material layer 11, only the connection circuit needs to be printed on the base material connection band 15. There is no need to print a pattern layer or other layers on the base material connection band 15.

[0041] Embodiments of the present disclosure further provide a display panel 100. Referring to FIGS. 8 and 12, the display panel 100 includes an inner film and an injection molding layer 20. Here, the inner film is the film 10 of any embodiment of the present disclosure.

[0042] The injection molding layer 20 is injection molded on the outer surface of the inner film. That is, the inner film is located inside the injection molding layer 20.

[0043] Taking the injection molding layer 20 as a reference, the outer side refers to the side facing the user, and the inner side refers to the side away from the user.

[0044] The circuit in the circuit layer 12 is used to respond to the touch of the display panel 100. In this embodiment, the display panel 100 is a touch panel.

[0045] The display panel 100 is formed by adopting an injection molding process in a mold. Before injection, first place the film 10 in the cavity of the mold and fix it. For example, by vacuum adsorption fixation, the outer surface of the inner film faces the inside of the cavity. Next, inject a liquid resin material into the mold. After cooling, open the mold. The resin material forms the injection molding layer 20 after cooling, and the film 10 is joined to the inner surface of the injection molding layer 20. It should be noted that in the molding process, the base material layer 11 of the film 10 does not peel off, and the film 10 is joined to the inner surface of the injection molding layer 20 as a whole.

[0046] In the display panel 100 according to an embodiment of the present disclosure, since the film 10 is integrally joined to the inner surface of the injection molding layer 20 as a whole, that is, since both the pattern layer 13 and the circuit layer 12 are firmly adhered to the inner surface of the injection molding layer 20, there is no need to manually attach the film layer by layer, which can improve efficiency and reduce manufacturing costs. Further, since there is no gap between the pattern layer 13 and the circuit layer 12, the moisture-proof and waterproof performance is suitable, and the touch sensitivity and reliability are improved. Further, by being able to preferably match the position of the electronic device in the circuit layer 12 and the corresponding pattern in the pattern layer 13, the appearance consistency of the display panel is increased.

[0047] Exemplarily, referring to FIGS. 3 and 12, the display panel 100 further includes an outer film 30, and the injection molding layer 20 is injection molded between the outer film 30 and the inner film.

[0048] Here, the specific configuration of the outer film 30 is not limited, and any one of the films in the prior art can be used.

[0049] In the in-mold injection molding process, a liquid resin material is injected onto the inner surface of the outer film 30 and the outer surface of the inner film. After being injection molded in the mold, the inner film, the injection molding layer 20, and the outer film 30 are integrated. The inner film is joined to the inner surface of the injection molding layer 20, and the outer film 30 is joined to the outer surface of the injection molding layer 20.

[0050] Both the outer film 30 and the injection molding layer 20 are made of a light-transmissive material so that the pattern in the pattern layer 13 can be seen from the outside when the display panel 100 is brightened.

[0051] The outer film 30 provides a good protective effect and reduces the probability that the surface of the display panel 100 is damaged.

[0052] In the display panel 100 according to an embodiment of the present disclosure, since the circuit layer 12 and the pattern layer 13 are provided on the inner film, when the display panel 100 is not bright, the pattern layer 13 and the circuit layer 12 are hardly visible in the external view of the display panel 100 due to the outer film 30 and the injection molding layer 20. That is, when it is not bright, the user can hardly see the pattern layer 13 and the circuit layer 12 from the outside, and the user can see the pattern on the pattern layer 13 only when the display panel 100 becomes bright.

[0053] In addition, after the inner film is formed, by covering both the inner and outer sides of the inner film with a layer of a protective film that can be easily peeled off, a protective effect can be achieved on the inner film.

[0054] After the outer film 30 is formed, by covering both the inner and outer sides of the outer film 30 with a layer of a protective film that can be easily peeled off, a protective effect can be achieved on the outer film 30.

[0055] Exemplarily, the above display panel 100 can be formed by adopting the following steps.

[0056] First, after each of the inner film and the outer film 30 is printed and formed, the protective films on both surfaces of the inner film are peeled off, and the protective films on both surfaces of the outer film 30 are peeled off. Dust removal is performed on the surfaces of the inner film and the outer film 30. For example, dust removal is performed by a combination means of manual dust removal and electrostatic dust removal.

[0057] Next, the inner film after dust removal is placed on one side of the mold cavity of the mold and fixed by vacuum suction, and the outer film 30 after dust removal is placed on the other side of the mold cavity of the mold and fixed by vacuum suction. For example, the inner film is placed in the mold cavity of the fixed mold, and the outer film 30 is placed in the mold cavity of the movable mold, or the inner film is placed in the mold cavity of the movable mold, and the outer film 30 is placed in the mold cavity of the fixed mold.

[0058] Thereafter, the mold is closed, a resin material is injected into the mold, and the inner film and the outer film 30 are simultaneously adhered to the injected resin material and molded into a predetermined shape.

[0059] After the resin is cooled, the mold is opened to obtain an injection molded product.

[0060] Note that in some embodiments, the injection molded product may be the final finished product, that is, there is no need to additionally employ other processes.

[0061] In another part of the embodiments, the injection molded product is a semi-finished product, and further processing such as irradiating the injection molded product with ultraviolet light is required.

[0062] Exemplarily, referring to FIGS. 1, 3, 5, and 6, the film includes a light homogenization layer 14 for homogenizing light, and both the circuit layer 12 and the pattern layer 13 are provided outside the light homogenization layer 14. When the display panel 100 becomes bright, light passes through the display panel 100 in the direction from the inside to the outside of the display panel 100, and the light first passes through the light homogenization layer 14 and then passes through the circuit layer 12 and the pattern layer 13. Here, the order of the circuit layer 12 and the pattern layer 13 is not limited. For example, the light may first pass through the circuit layer 12 and then pass through the pattern layer 13, or may first pass through the pattern layer 13 and then pass through the circuit layer 12. In the process of the light passing through the light homogenization layer 14, the light homogenization layer 14 brings about a good light homogenization effect, so that the brightness presented by the display panel 100 is uniform and soft, and the user cannot easily see the light source behind the display panel.

[0063] Note that the light homogenization layer plays a role in homogenizing light, and the printing material employed for the light homogenization layer is not limited. For example, in some embodiments, the light homogenization layer is an ink diffusion layer, that is, the printing material of the light homogenization layer is ink, and the ink is diffusion printed by printing means. Note that the ink diffusion layer can transmit light.

[0064] The light homogenization layer 14 may be provided on the outer surface of the base material layer 11 (see FIG. 5) or on the inner surface of the base material layer 11.

[0065] Exemplarily, referring to FIGS. 1, 3 and 6, the light homogenization layer 14 is provided on the inner surface of the base material layer 11.

[0066] The ink of the light homogenization layer 14 has powdery particles, and the bonding force between the particles and the base material layer 11 or other adjacent layers is relatively weak. Note that the base material layer 11 serves as a carrier for the inner film. If the bonding force between the base material layer 11 and the injection molding layer 20 is insufficient, the base material layer 11 is likely to peel off, and as a result, the product becomes a defective product.

[0067] In this embodiment, since the light homogenization layer 14 is provided on the inner surface of the injection molding layer 20, after the inner film is joined to the injection molding layer 20, the weak bonding force of the light homogenization layer 14 does not affect the bonding force between the base material layer 11 and the injection molding layer 20, and the bonding force between the base material layer 11 and the injection molding layer 20 becomes suitable. In the stage of performing an environmental test after molding the display panel 100, etc., the base material layer 11 can be ensured to have reliability of the display panel 100 without being easily peeled off from the injection molding layer 20.

[0068] In this embodiment, since the light homogenization layer 14 is provided inside the base material layer 11, even if the bonding force between the light homogenization layer 14 and the base material layer 11 is still weak, the base material layer 11 serves as a structural carrier and is itself not easily peeled off from the injection molding layer 20. Since the light homogenization layer 14 itself is a thin coating layer and there is no sheet like the base material layer 11 on the light homogenization layer 14 itself, the light homogenization layer 14 itself will not float or peel off from the base material layer 11.

[0069] Exemplarily, referring to FIGS. 1 to 7, the pattern layer 13 is provided on the outer surface of the circuit layer 12. In this embodiment, the pattern layer 13 serves as a shielding action for the circuit layer 12, and the user cannot easily see the circuit in the circuit layer 12.

[0070] In addition, the pattern layer 13 can completely shield the circuit layer 12, or the pattern region in the pattern layer 13 can shield the electronic devices in the circuit layer 12.

[0071] In some embodiments, the pattern layer 13 is provided on the outer surface of the base material layer 11, and the circuit layer 12 is provided on the inner surface of the base material layer 11. That is, the pattern layer 13 and the circuit layer 12 are located on the opposite surfaces of both sides of the base material layer 11.

[0072] In this embodiment, the base material layer 11 adopts a manufacturing process of double-sided printing, and on the one hand, it can reduce the defective product rate caused by all printing layers concentrating on the same side of the base material layer 11. Furthermore, the pattern layer 13 is outside the circuit layer 12 and provides a shielding effect on the circuit layer 12.

[0073] In the related art, each printing layer is arranged outside the base material layer 11 and is arranged layer by layer. Therefore, the errors generated in each printing layer are likely to accumulate and amplify, resulting in a high defective product rate.

[0074] In this embodiment, the base material layer 11 adopts double-sided printing. When the total number of printing layers is the same, double-sided printing can reduce the number of printing layers on one side, and reduce the defective rate caused by excessive number of printing layers on one side.

[0075] In some embodiments, referring to FIG. 3, the pattern layer 13 is provided on the outer surface of the base material layer 11, the circuit layer 12 is provided on the inner surface of the base material layer 11, and the circuit layer 12 is provided between the light homogenization layer 14 and the base material layer 11. In this embodiment, the light homogenization layer 14 does not affect the bonding force between the circuit layer 12 and the base material layer 11, and can also play a role in homogenizing light. In addition, the pattern layer 13 is on the outer surface of the base material layer 11, and the ink on the pattern layer 13 can adhere better by the injection molding layer 20, presenting a clearer appearance.

[0076] In some other embodiments, referring to FIGS. 1 and 2, both the pattern layer 13 and the circuit layer 12 are provided on the outer surface of the base material layer 11, and the circuit layer 12 is provided between the pattern layer 13 and the base material layer 11.

[0077] In this embodiment, both the circuit layer 12 and the pattern layer 13 can be well adhered by the injection molding layer 20. Further, the base material layer 11 is inside the circuit layer 12 and can also play a good protective role for the circuit layer 12.

[0078] In some embodiments, the light homogenization layer 14 is provided on the outermost layer inside the film.

[0079] Here, in the embodiments of the present disclosure, the outermost layer refers to the outermost surface layer, and there is no other printing layer on the side away from the base material layer 11 of the outermost layer.

[0080] In this embodiment, the light homogenization layer 14 plays a role in homogenizing light. Since there are no scratches on the surface of the light homogenization layer 14 caused by the user or the external environment, there is no need to apply another layer on the surface of the light homogenization layer 14. In this way, the cost can also be reduced on the premise of meeting the use performance.

[0081] Exemplarily, referring to FIGS. 8 and 12, the film includes an isolation sheet 16. The isolation sheet 16 is provided on the outer surface of the base material connection strip 15 and covers at least the connection circuit printed at one end of the base material connection strip 15 close to the base material layer 11.

[0082] The isolation sheet 16 plays a role in protecting the circuit and preventing the resin material injected during injection molding from burning.

[0083] Specifically, during injection molding, the inner film is placed in the mold cavity. One end of the substrate connection band 15 close to the substrate layer 11 is located within the cavity, and the other end away from the substrate layer 11 is located outside the cavity. The part located within the cavity comes into contact with the injected resin. Therefore, the isolation sheet 16 needs to at least cover the part of the substrate connection band 15 located within the cavity, thereby isolating the circuit from the resin material and preventing the resin material from burning out the circuit during injection.

[0084] Note that the part of the substrate connection band 15 located outside the cavity may or may not be covered by the isolation sheet 16.

[0085] Exemplarily, the main manufacturing steps of the inner film according to one embodiment will be briefly described below.

[0086] The manufacturing process of the inner film includes the following steps. Material cutting step: Cut the roll-shaped film into a designed shape such as a square for the substrate sheet. Note that the sheet corresponding to the substrate layer 11 and the substrate connection band 15 are cut together. Pre-shrinkage step: Before printing, put the cut substrate sheet into an oven and heat it to reduce the probability of shrinkage. Printing process step: Apply gloss oil, circuit layer 12, pattern layer 13, light homogenization layer 14, etc. to the cut substrate sheet, put the printed substrate sheet into a high-temperature oven to dry, cure the ink, and evaporate the solvent in the ink. Protective film pasting step: Paste protective films on both sides of the substrate sheet to prevent the surface of the printed substrate sheet from being damaged when punching the positioning holes. Punching of positioning holes step: Punch positioning holes for punching and positioning holes for thermo-press forming on the substrate sheet. The positioning holes for punching and the positioning holes for thermo-press forming should be punched accurately. Thermo-press forming step: Use a thermo-press forming mold to thermo-press form the substrate sheet and form the substrate sheet into the outer shape of the product. Punching step: Cut the waste material of the heat-pressed base material sheet to obtain the inner film.

[0087] Hereinafter, some embodiments of the inner film of the present disclosure will be described with reference to the drawings.

[0088] Regarding the first embodiment Referring to FIG. 1, the inner film includes a base material layer 11, a pattern layer 13, a circuit layer 12, and a light homogenization layer 14.

[0089] In the direction from the inside to the outside, the light homogenization layer 14, the base material layer 11, the circuit layer 12, and the pattern layer 13 are sequentially arranged.

[0090] In the manufacturing process of the inner film, before applying the circuit layer 12, a layer of gloss oil may be first applied to the base material layer 11. The gloss oil has an isolation effect and can isolate the printing media between two adjacent layers. After applying a layer of gloss oil, the circuit layer 12 is applied. After applying a layer of gloss oil to the circuit layer 12, the pattern layer 13 is applied. It is not necessary to apply gloss oil outside the pattern layer 13. Of course, another layer of gloss oil may also be applied.

[0091] Note that the sequential arrangement of the above-mentioned light homogenization layer 14, base material layer 11, circuit layer 12, and pattern layer 13 refers to the arrangement order of such four printing layers. Other layers may be selectively added or not added between the light homogenization layer 14 and the base material layer 11, between the base material layer 11 and the circuit layer 12, and between the circuit layer 12 and the pattern layer 13.

[0092] Regarding the second embodiment Referring to FIG. 2, the main structure in the second embodiment is almost the same as the structure of the first embodiment. The main difference is that in this embodiment, the light homogenization layer 14 is not provided.

[0093] In the direction from the inside to the outside, the base material layer 11, the circuit layer 12, and the pattern layer 13 are sequentially arranged.

[0094] For example, a member such as a film or ground glass for homogenizing light may be added between the light-emitting source and the display panel 100 to realize the light homogenizing effect.

[0095] Note that arranging the above-described base material layer 11, circuit layer 12, and pattern layer 13 in sequence refers to the arrangement order of such three printed layers. Other layers may or may not be selectively added between the base material layer 11 and the circuit layer 12, and between the circuit layer 12 and the pattern layer 13.

[0096] Regarding the third embodiment Referring to FIG. 3, the inner film includes a base material layer 11, a pattern layer 13, a circuit layer 12, and a light homogenizing layer 14.

[0097] In the direction from the inside to the outside, the light homogenizing layer 14, the circuit layer 12, the base material layer 11, and the pattern layer 13 are sequentially arranged.

[0098] It is understandable that the above-described gloss oil may be applied between any two layers.

[0099] Note that arranging the above-described light homogenizing layer 14, circuit layer 12, base material layer 11, and pattern layer 13 in sequence refers to the arrangement order of such four printed layers. Other layers may or may not be selectively added between the light homogenizing layer 14 and the circuit layer 12, between the circuit layer 12 and the base material layer 11, and between the base material layer 11 and the pattern layer 13.

[0100] Regarding the fourth embodiment Referring to FIG. 4, the main structure in the fourth embodiment is almost the same as the structure in the third embodiment. The main difference is that in this embodiment, the light homogenizing layer 14 is not provided.

[0101] In the direction from the inside to the outside, the circuit layer 12, the base material layer 11, and the pattern layer 13 are sequentially arranged.

[0102] For example, a member such as a film or ground glass for homogenizing light may be added between the light source and the display panel 100 to realize the light homogenizing effect.

[0103] Note that arranging the circuit layer 12, the base material layer 11, and the pattern layer 13 in this order refers to the arrangement order of such three printed layers. Other layers may or may not be selectively added between the circuit layer 12 and the base material layer 11 and between the base material layer 11 and the pattern layer 13.

[0104] Regarding the fifth embodiment Referring to FIG. 5, the inner film includes a base material layer 11, a pattern layer 13, a circuit layer 12, and a light homogenizing layer 14.

[0105] In the direction from the inside to the outside, the base material layer 11, the light homogenizing layer 14, the circuit layer 12, and the pattern layer 13 are sequentially arranged.

[0106] Note that arranging the base material layer 11, the light homogenizing layer 14, the circuit layer 12, and the pattern layer 13 in this order refers to the arrangement order of such four printed layers. Other layers may or may not be selectively added between the base material layer 11 and the light homogenizing layer 14, between the light homogenizing layer 14 and the circuit layer 12, and between the circuit layer 12 and the pattern layer 13.

[0107] Regarding the sixth embodiment Referring to FIG. 6, the inner film includes a base material layer 11, a pattern layer 13, a circuit layer 12, and a light homogenizing layer 14.

[0108] In the direction from the inside to the outside, the light homogenizing layer 14, the circuit layer 12, the pattern layer 13, and the base material layer 11 are sequentially arranged.

[0109] Note that arranging the light homogenizing layer 14, the circuit layer 12, the pattern layer 13, and the base material layer 11 in this order refers to the arrangement order of such four printed layers. Other layers may or may not be selectively added between the light homogenizing layer 14 and the circuit layer 12, between the circuit layer 12 and the pattern layer 13, and between the pattern layer 13 and the base material layer 11.

[0110] For the 7th embodiment Referring to FIG. 7, the main structure in the 7th embodiment is almost the same as that in the 6th embodiment. The main difference is that in this embodiment, the light homogenization layer 14 is not provided.

[0111] In the direction from the inside to the outside, the circuit layer 12, the pattern layer 13, and the base material layer 11 are sequentially arranged.

[0112] For example, between the light emitting source and the display panel 100, members such as a film for homogenizing light, ground glass, etc. may be added to realize the light homogenization effect.

[0113] Note that the sequential arrangement of the above-mentioned circuit layer 12, pattern layer 13, and base material layer 11 refers to the arrangement order of such three printing layers. Other layers may or may not be selectively added between the circuit layer 12 and the pattern layer 13, and between the pattern layer 13 and the base material layer 11.

[0114] In each embodiment of the present disclosure, it may only have the circuit layer 12, the pattern layer 13, the base material layer 11, the ink layer, and each gloss oil layer, and may not have other printing layers. Of course, other printing layers may be added as needed.

[0115] The embodiments of the present disclosure provide a display device 1000. Referring to FIGS. 10, 11, and 12, the display device 1000 includes a display panel box 300 and a display panel 100 according to any embodiment of the present disclosure.

[0116] The display panel box 300 integrates a PCB board and a light emitting source.

[0117] The type of the light emitting source is not limited. For example, it can be light beads, light strips, etc.

[0118] The circuit in the circuit layer 12 is electrically connected to the PCB board.

[0119] The PCB board is used to control the light source to output light to the display panel 100. When the light source emits light, the display panel 100 becomes bright. In this way, the display panel 100 can be made to exhibit a certain brightness so that the user can view the pattern layer 13.

[0120] When the light source is off, the user can hardly view the pattern layer 13.

[0121] Exemplarily, the display device 1000 further includes a mounting frame 200, and both the display board box 300 and the display panel 100 are mounted on the mounting frame 200.

[0122] The mounting frame 200 provides mounting support for the display board box 300 and the display panel 100.

[0123] Exemplarily, the mounting frame 200 is basically a frame-type structure. The mounting frame 200 has a mounting space 200a, and the display board box 300 is fitted into the mounting space 200a. During assembly, the display board box 300 is fitted into the mounting space 200a from the back side of the mounting frame 200 and is fixed to the mounting frame 200 by, for example, screws, snaps, etc.

[0124] The display panel 100 is connected to the mounting frame 200 and covers the mounting space 200a. The display panel 100 is mounted on the mounting space 200a from the front side of the mounting frame 200.

[0125] The application field of the display panel 100 of the embodiments of the present disclosure is not limited and can be used in any suitable product. For example, industries such as household appliances, communication terminals, automobiles, and medical treatment can be mentioned.

[0126] The embodiments of the present disclosure provide a household appliance, and the household appliance includes a housing and a display device 1000 according to any embodiment of the present disclosure, and the display device 1000 is provided in the housing.

[0127] The display panel 100 of the display device 1000 is used as a part of the appearance surface of the household appliance, and the user can realize human interaction by operating the display panel 100.

[0128] The types of household appliances are not limited. For example, they can be a refrigerator, an air conditioner, an electric rice cooker, a clothing treatment device, etc.

[0129] Here, the specific types of the clothing treatment device are not limited. For example, it may be any one of a washing machine, a clothes dryer, a washing and drying machine, or a set device formed by stacking a washing machine and a clothes dryer vertically.

[0130] Exemplarily, take the case where the household appliance is a clothing treatment device as an example.

[0131] The clothing treatment device is provided with a knob, and the user can select washing and care programs such as standard washing, quick washing, wool washing, and drum automatic cleaning by rotating this knob.

[0132] Referring to FIGS. 8 and 12, the display panel 100 is provided with a mounting hole 10a penetrating therethrough, and the knob is rotatably provided in the mounting hole 10a.

[0133] In this embodiment, the user can select parameters corresponding to respective washing and care programs, such as temperature and water volume, by touching the display panel 100.

[0134] In the description of this specification, the description of reference terms such as "one embodiment", "some embodiments", "exemplary", "specific embodiment", or "some examples" means that the specific features, configurations, materials, or characteristics described in this embodiment or example are included in at least one embodiment or example of the embodiments of the present disclosure. In the present disclosure, the exemplary expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, configurations, materials, or characteristics described can be combined in any one or more embodiments or examples in an appropriate manner. Also, without contradiction, those skilled in the art can combine different embodiments or examples described in the present disclosure and the features of different embodiments or examples.

[0135] The above description is only a preferred embodiment of the present disclosure and is not intended to limit the present disclosure. For those skilled in the art, the present disclosure can be subject to various modifications and changes. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present disclosure are included in the protection scope of the present disclosure.

Description of Reference Signs

[0136] 10 Film, 10a Mounting Hole, 11 Substrate Layer, 12 Circuit Layer, 13 Pattern Layer, 14 Light Homogenization Layer, 15 Substrate Connection Band, 16 Isolation Sheet, 20 Injection Molding Layer, 30 Outer Film, 100 Display Panel, 200 Mounting Frame, 200a Mounting Space, 300 Display Board Box, 1000 Display Device

Claims

1. A film used for a display panel, comprising a base material layer, a pattern layer printed on the base material layer, and a circuit layer printed on the base material layer. Film.

2. The pattern layer is provided outside the circuit layer. The film according to claim 1.

3. The base material layer includes an inner surface and an outer surface. The pattern layer is provided on the outer surface of the base material layer, and the circuit layer is provided on the inner surface of the base material layer. The film according to claim 1.

4. The base material layer includes an outer surface and an inner surface. Both the pattern layer and the circuit layer are provided on the outer surface of the base material layer, and the circuit layer is provided between the pattern layer and the base material layer. The film according to claim 1.

5. The film includes a light homogenization layer for homogenizing light, and both the pattern layer and the circuit layer are located outside the light homogenization layer. The film according to claim 1.

6. The light homogenization layer is printed on the inner surface of the base material layer. The film according to claim 5.

7. In the direction from the inside to the outside, the light homogenization layer, the base material layer, the circuit layer, and the pattern layer are sequentially arranged. The film according to claim 6.

8. In the direction from the inside to the outside, the light homogenization layer, the circuit layer, the base material layer, and the pattern layer are sequentially arranged. The film according to claim 6.

9. The light homogenization layer is provided on the outermost surface inside the film. The film according to any one of claims 5 to 8.

10. The light homogenizing layer is an ink diffusion layer. The film according to any one of claims 5 to 8.

11. The film includes a separation sheet and a base material connection band provided on a side edge of the base material layer. A connection circuit electrically connected to a circuit in the circuit layer is provided on the base material connection band. The separation sheet covers at least the connection circuit printed at one end of the base material connection band close to the base material layer. The film according to claim 1.

12. A display panel, an inner film which is the film according to any one of claims 1 to 11, and an injection molding layer injection molded on an outer surface of the inner film. The display panel.

13. The display panel includes an outer film, and the injection molding layer is injection molded between an inner surface of the outer film and an outer surface of the inner film. The display panel according to claim 12.

14. A display device, a display panel box provided with a light emitting source, and the display panel according to claim 12 or 13, comprising: The display panel box is provided inside the display panel, and the light emitting source is used to output light to the display panel. The display device.

15. The display device includes a mounting frame. The mounting frame has a mounting space. The display panel box is fitted into the mounting space. The display panel is connected to the mounting frame and covers the mounting space. The display device according to claim 14.

16. A household appliance, A housing, the display device according to claim 14 or 15, and is provided with, the display device is provided in the housing, a household appliance.

17. the household appliance is a clothing treatment device, the clothing treatment device includes a knob for selecting a washing and care program, the display panel is provided with a mounting hole penetrating the display panel, and the knob is rotatably provided in the mounting hole, the household appliance according to claim 16.

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