Wafer rotation mechanism, wafer rotation clamping mechanism, and wafer cleaning and drying system

Abstract

The present invention discloses a wafer rotation mechanism, which includes a lower mechanism used to output rotational power and an upper mechanism connected to a wafer rotation pedestal. The upper mechanism and the lower mechanism have an operating state and a separated state. When in the operating state, the upper mechanism is driven by the lower mechanism to rotate. When in the separated state, the upper mechanism and the lower mechanism are separated. Under a power failure state, the upper mechanism and the lower mechanism are switched from the operating state to the separated state, and the upper mechanism rotates together with the wafer rotation pedestal until it stops under the inertia effect. The present invention further discloses a wafer rotation clamping mechanism. The present invention further discloses a wafer drying system and a wafer cleaning system. The wafer rotation clamping mechanism of the present invention has stable and reliable transmission under an energized state. When a sudden power failure occurs, the clutch mechanism can be immediately disconnected, and the upper body where the wafer clamping mechanism is located slowly decelerates and stops rotating under the inertia effect, ensuring the placement stability of the wafer and avoiding wafer fragments.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor integrated circuit chip manufacturing, and particularly relates to a wafer rotation mechanism, a wafer rotation clamping mechanism, and a wafer cleaning and drying system.

Background Art

[0002] With the development of the electronics industry and the semiconductor industry, the industry has an increasing demand for the quality and processing accuracy of the surfaces of semiconductor silicon chips, ceramics, and optical glasses. This prompts the corresponding wafer processing equipment to become more and more advanced. In the conventional semiconductor processing process, some equipment uses a wafer rotation mechanism. For example, a monolithic cleaner, a cleaning and drying system, etc. The wafer rotation mechanism of such equipment clamps the wafer by means of centrifugal force. The principle of this method is to fix the wafer on a pedestal that can rotate at high speed, use a motor to reach a higher rotation speed, and the clamping mechanism clamps the wafer under the action of centrifugal force. For example, in a wafer cleaning and drying system, the wafer shakes off the liquid adhering to it to the outside of the wafer by centrifugal force to achieve a drying effect. Furthermore, there is a method of directly driving the rotating pedestal by a servo motor, which has a simple structure and reliable transmission, but at the same time has an obvious drawback. That is, when the power supply of the pedestal fails, the motor stops and locks accordingly, or decelerates very quickly. At this time, the wafer has a risk of detaching from the clamping mechanism and causing fragments, which has a very large impact on the normal use of the equipment.

Summary of the Invention

[0003] In order to overcome the deficiencies of the prior art, the present invention enables the upper mechanism to maintain a rotating state with the wafer rotating pedestal in a power failure situation, allows the wafer to decelerate slowly and come to a stop, and provides a wafer rotation mechanism, a wafer rotation clamping mechanism, and a wafer cleaning and drying system that avoid wafer fragments.

[0004] The technical solutions adopted by the present invention to solve its technical problems are as follows. A wafer rotation mechanism, A lower mechanism used to output rotational power, and an upper mechanism that can be connected to a wafer rotating pedestal. The upper mechanism and the lower mechanism have an operating state and a separated state. When in the operating state, the upper mechanism is driven by the lower mechanism to rotate. When in the separated state, the upper mechanism and the lower mechanism are separated. Under a power outage state, the upper mechanism and the lower mechanism are switched from the operating state to the separated state, and the upper mechanism rotates together with the wafer rotating pedestal until it stops under the inertial action.

[0005] Furthermore, the lower mechanism is provided separately from the power source, and the lower mechanism can rotate according to the power source.

[0006] Furthermore, under a power outage state, the lower mechanism stops outputting rotational power.

[0007] Furthermore, there is a clutch structure between the upper mechanism and the lower mechanism. Under an energized state, the lower mechanism and the upper mechanism are connected through non-contact transmission via the clutch structure, and the lower mechanism drives the upper mechanism to rotate synchronously.

[0008] Furthermore, the clutch structure includes contact surfaces provided on the lower mechanism and the upper mechanism respectively, and an electromagnetic induction assembly. When the electromagnetic induction assembly is in an energized state, there is a repulsive force between the lower mechanism and the upper mechanism, realizing the non-contact transmission connection between the lower mechanism and the upper mechanism.

[0009] Furthermore, the electromagnetic induction assembly includes electromagnets arranged at intervals on the lower mechanism and permanent magnets arranged at intervals on the upper mechanism. The magnetism of the permanent magnets and the electromagnets is the same, and they are arranged crosswise.

[0010] Furthermore, there is a clutch structure between the upper mechanism and the lower mechanism. The lower mechanism and the upper mechanism are connected through contact transmission via the clutch structure, and the lower mechanism drives the upper mechanism to rotate synchronously.

[0011] Furthermore, the clutch structure includes a magnetic body, a metal member, and a reset member disposed in an upper mechanism and a lower mechanism, respectively. Under a power outage, the adsorption connection between the magnetic body and the metal member is disconnected.

[0012] Furthermore, the clutch structure includes an upper contact surface provided in the upper mechanism, a lower contact surface provided in the lower mechanism, an elastic member, and a push rod. The elastic member drives the lower contact surface and the upper contact surface to perform contact transmission. Under a power outage, the push rod drives the lower contact surface or the upper contact surface to compress the elastic member, separating the upper and lower contact surfaces.

[0013] Furthermore, the clutch structure includes an upper tooth disk provided in the upper mechanism and a lower tooth disk provided in the lower mechanism. The upper tooth disk and the lower tooth disk mesh and transmit power.

[0014] Furthermore, the clutch structure includes a push rod and a concave groove provided in the upper mechanism and the lower mechanism, respectively. Under a power outage, the push rod disengages from the concave groove to separate the upper mechanism and the lower mechanism.

[0015] Furthermore, when in the separated position, the distance between the upper mechanism and the lower mechanism is 0.1 - 5 mm.

[0016] The present invention also discloses a wafer rotation clamping mechanism, which includes the wafer rotation mechanism, a wafer rotation pedestal, a wafer support mechanism provided on the outer periphery of the wafer rotation pedestal, and a wafer clamping mechanism. Under a power outage, the upper mechanism and the lower mechanism switch from the operating state to the separated state. The upper mechanism rotates with the wafer rotation pedestal under the inertial action. The wafer clamping mechanism maintains a state of receiving a centrifugal force, and its bottom is held to move outward. Its end presses against the wafer and cooperates with the wafer support mechanism to fix the wafer. Until the rotation of the wafer rotation pedestal stops, the wafer clamping mechanism relaxes the pressing force on the wafer.

[0017] The present invention further discloses a wafer drying system, which includes the above-mentioned wafer rotation clamping mechanism.

[0018] The present invention further discloses a wafer cleaning system, which includes the above wafer rotation and clamping mechanism.

[0019] The beneficial effects of the present invention are as follows. 1) When the wafer rotation and clamping mechanism is in an energized state, the clutch mechanism ensures a rigid connection between the lower mechanism connected to the power source and the upper mechanism where the wafer clamping mechanism is located, and the transmission is stable and reliable. 2) In the event of a sudden power outage, the clutch mechanism can be disconnected immediately. At this time, the upper body where the wafer clamping mechanism is located is not subject to the braking action of the motor, and it decelerates slowly under the inertial action and stops rotating, ensuring the stability of wafer placement and avoiding wafer fragmentation. 3) There is no friction or impact between the actuator parts of the non-contact clutch mechanism, reducing the generation of impurity particles and lowering the risk of damage to the clutch mechanism. 4) A clutch mechanism driven by an electromagnetic induction module is adopted. The response of the electromagnet is fast (the fastest is 14 ms), it loses magnetism instantly at the moment of power outage, and the braking force of the motor received by the upper body where the wafer clamping mechanism is located is small. 5) The clutch mechanism adopting the friction disk type has a fast disengagement speed. When the bonding force decreases, the moment when the instantaneous frictional force can be conducted decreases instantaneously, and the upper body where the wafer clamping mechanism is located immediately enters the inertial rotation state. 6) The upper and lower toothed disks or the top pin type clutch mechanism is adopted. The clutch surface is in contact in the form of an inclined plane. When engaging, the inclined plane can smoothly connect the upper and lower clutch surfaces as a guide. When separating, the clutch surface on the clamp jaw side slides along the inclined plane with the clutch surface on the motor side, and the interlock can be released.

Brief Description of the Drawings

[0020]

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Modes for Carrying Out the Invention

[0021] In order to enable those skilled in the art to better understand the solution of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative labor should belong to the protection scope of the present invention.

[0022] As shown in FIGS. 1 and 2, the wafer rotation mechanism includes a power source 1, a lower mechanism 2 connected to the power source 1, and an upper mechanism 3 connected to the wafer rotation pedestal 4. The lower mechanism 2 can rotate according to the power source 1, and in actual applications, it often rotates at a high speed exceeding 1000 revolutions per minute. The power source 1 may specifically be a motor output shaft. The lower mechanism 2 and the power source 1 are installed separately. Of course, in other embodiments, the power source 1 and the lower mechanism 2 may have an integrated structure, as long as the function of outputting rotational power is achieved.

[0023] The upper mechanism 3 and the lower mechanism 2 have an operating state and a separated state. When in the operating state, the upper mechanism 3 rotates driven by the lower mechanism 2 and may rotate at the same high speed. When in the separated state, the upper mechanism 3 and the lower mechanism 2 are separated, that is, the upper mechanism 3 loses the power output of the lower mechanism 2.

[0024] Under a power failure state, the upper mechanism 3 and the lower mechanism 2 are switched from the operating state to the separated state. At this time, the lower mechanism 2 stops outputting rotational power, that is, the power source 1 and the lower mechanism 2 stop rotating, or the rotational speed of the power source 1 and the lower mechanism 2 drops rapidly. However, the upper mechanism 3 still rotates with the wafer rotation pedestal 4 until it stops under the action of inertia. In other words, since the upper mechanism 3 and the lower mechanism 2 are not connected, when the rotation of the lower mechanism 2 stops slowly, the upper mechanism 3 does not stop immediately accordingly. On the contrary, when no external force is acting, the upper mechanism 3 continues to maintain its rotational state due to inertia.

[0025] As shown in FIG. 3, the wafer rotation clamp mechanism includes the above-mentioned wafer rotation mechanism, a wafer rotation pedestal, a wafer support mechanism provided on the outer periphery of the wafer rotation pedestal, and a wafer clamp mechanism 41. The wafer support mechanism and the wafer clamp mechanism 41 may both have conventional structures. The characteristics of the wafer clamp mechanism 41 are as follows. Since its center of gravity position is close to the bottom, when the wafer clamp mechanism 41 rotates in the circumferential direction following the wafer rotation pedestal, the bottom is lifted upward, approaching the wafer clamp mechanism 41 from the original vertical state to a horizontal horizontal state, thereby pressing the wafer 42 downward with its upper end.

[0026] In the power-off state, the upper mechanism 3 and the lower mechanism 2 are switched from the operating state to the separated state. The upper mechanism 3 rotates under the inertial action with the wafer rotating pedestal 4. The wafer clamping mechanism 41 maintains the state of being under the action of centrifugal force, that is, its bottom moves outward and rises upward, and its end abuts downward against the wafer 42. With the cooperation of the wafer support mechanism and the wafer clamping mechanism 41, the wafer 42 is firmly clamped until the wafer rotating pedestal 4 stops rotating. The wafer clamping mechanism 41 relaxes the pressing force on the wafer 42. At this time, the wafer 42 also stops rotating. Even if the wafer clamping mechanism 41 does not generate a pressing-down action on the wafer 42, the wafer 42 does not rotate and detach from the wafer rotating pedestal 4.

[0027] Example 1 As shown in FIG. 4, there is a clutch structure between the upper mechanism 3 and the lower mechanism 2. In the energized state, the lower mechanism 2 and the upper mechanism 3 are in non-contact transmission connection through the clutch structure, and the lower mechanism 2 drives the upper mechanism 3 to rotate synchronously.

[0028] Specifically, the clutch structure includes contact surfaces 51, 52 provided on the lower mechanism 2 and the upper mechanism 3 respectively, and an electromagnetic induction assembly 53. The electromagnetic induction assembly 53 includes an electromagnet 531 arranged at an interval on the lower mechanism 2 and a permanent magnet 532 arranged at an interval on the upper mechanism 3. The magnetisms of the permanent magnet 532 and the electromagnet 531 are the same, and the permanent magnet 532 and the electromagnet 531 are arranged in a cross pattern. In the energized state of the electromagnetic induction assembly 53, there is a repulsive force between the lower mechanism 2 and the upper mechanism 3. Specifically, there is a repulsive force between the intersecting permanent magnet 532 and the electromagnet 531, which relatively rotates the lower mechanism 2 and the upper mechanism 3 in the circumferential direction, thereby realizing the non-contact transmission connection between the lower mechanism 2 and the upper mechanism 3. Of course, the positions of the permanent magnet 532 and the electromagnet 531 can also be interchanged.

[0029] When in a power outage state, the electromagnet 531 loses its magnetism, the repulsive force between the permanent magnet 532 and the electromagnet 531 disappears, the repulsive force existing between the contact surface 51 of the lower mechanism 2 and the contact surface 52 of the upper mechanism 3 disappears, and the lower mechanism 2 and the upper mechanism 3 cannot be transmission-connected. At this time, the lower mechanism 2 stops rotating or rotates slowly, and the upper mechanism 3 continues to rotate until it stops rotating under the action of inertia.

[0030] Embodiment 2 As shown in FIGS. 3, 5, and 6, a clutch structure is provided between the upper mechanism 3 and the lower mechanism 2. Under the energized state, the lower mechanism 2 and the upper mechanism 3 are connected by contact transmission of the clutch structure, and the lower mechanism 2 drives the upper mechanism 3 to rotate synchronously.

[0031] Specifically, the clutch structure includes contact surfaces 51 and 52 provided on the lower mechanism 2 and the upper mechanism 3 respectively, magnetic bodies 542 and metal members 543 provided on the lower mechanism 2 and the upper mechanism 3 respectively, and a reset member 541. In this embodiment, the magnetic body 542 is located on the lower mechanism 2 and is an electromagnetic coil, the metal member 543 is located on the upper mechanism 3, and the reset member 541 is connected between the upper mechanism 3 and the metal member 543. Of course, in other embodiments, the positions of the magnetic body 542 and the metal member 543 can be exchanged.

[0032] Under the energized state, the magnetic body 542 overcomes the elastic force of the reset member 541 under the action of magnetic force and adsorbs to the metal member 543. The magnetic force generates a sufficiently large static friction to transmit the motor torque, and transmits the motor rotation speed to the wafer turntable 4 to drive the wafer 42 to rotate according to the power source 1.

[0033] When a power outage occurs, the magnetic body 542 instantaneously loses its magnetic force, and the metal member 543 moves upward under the action of the reset member 541. The magnetic body 542 that has lost its magnetism and the metal member 543 release their adsorption connection. As shown in FIG. 6, the contact surface 51 of the lower mechanism 2 and the contact surface 52 of the upper mechanism 3 are separated, and the two maintain a separation gap of 0.1 to 1 mm, that is, H1 = 0.1 to 1 mm in the figure, and the lower mechanism 2 and the upper mechanism 3 cannot be in transmission connection. At this time, the lower mechanism 2 stops rotating or rotates slowly, and the upper mechanism 3 continues to rotate under the inertia action until it stops rotating.

[0034] Embodiment 3 As shown in FIGS. 7 to 10, in the embodiment, the clutch structure may be a contact type transmission connection. Specifically, the clutch structure includes a lower contact surface 552 provided on the lower mechanism 2, an upper contact surface 551 provided on the upper mechanism 3, an elastic member 56, and a push rod 57. The elastic member 56 drives the lower contact surface 552 to move upward and makes it in contact transmission with the upper contact surface 551. In this embodiment, both the upper contact surface 551 and the lower contact surface 552 are of a friction disk structure, and there is no relative sliding between the two during transmission connection, that is, it approximates a rigid body. The push rod 57 may be installed to drive the lower contact surface 552 to move downward, or may be installed to drive the upper contact surface 551 to move upward. In this case, the elastic member 56 cooperates with the upper contact surface 551. In this embodiment, it is installed to drive the lower contact surface 552 to move.

[0035] In the energized operating state, the push rod 57 is in a retracted state under the action of the cylinder, that is, there is a distance between the push rod 57 and the lower contact surface 552, that is, there is no force acting between the two, as shown in FIGS. 9 and 10.

[0036] In the power outage state, the push rod 57 drives the lower contact surface 552 under the action of the cylinder to move downward, compresses the elastic member 56, and separates the upper contact surface 551 from the lower contact surface 552. That is, no transmission occurs between the two, and the two maintain a separation gap of 0.1 to 5 mm, that is, H2 = 0.1 to 5 mm in FIG. 8. At this time, the lower mechanism 2 stops rotating or rotates slowly, and the upper mechanism 3 continues to rotate under the inertia action until it stops rotating.

[0037] The actuating cylinder of the push rod 57 may be a single-acting cylinder. At this time, the connected solenoid valve is normally open. In the operating state, the cylinder is not ventilated, and the push rod 57 is pulled back under the action of the internal spring. When a power outage occurs, the solenoid valve is ventilated, and the push rod 57 extends under the action of air pressure to perform separation. The actuating cylinder of the push rod 57 may also be a double-acting cylinder. In this case, the connected solenoid valve is of the single electronic control 5-way 2-position type. In the operating state, the push rod 57 is retracted by air pressure control. When a power outage occurs, the solenoid valve changes the air flow direction, protrudes the push rod 57, and performs the separation operation.

[0038] Embodiment 4 As shown in FIGS. 11 to 14, in this embodiment, the clutch structure may be a contact-type transmission connection. Specifically, the clutch structure includes an upper tooth plate 581 provided on the upper mechanism 3 and a lower tooth plate 582 provided on the lower mechanism 2. The upper tooth plate 581 and the lower tooth plate 582 mesh and transmit power. At this time, there is a thrust between the tooth surfaces of the upper tooth plate 581 and the lower tooth plate 582.

[0039] When the rotation of the lower tooth plate 582 stops, the upper tooth plate 581 continues to rotate counterclockwise along the left inclined surface. In the operating state, the lower dental plate 582 meshes with the upper dental plate 581 under the action of the bottom support force, and the power source 1 rotates the lower dental plate 582. At this time, the lower dental plate 582 forms a driving force for the co-directional rotation of the upper dental plate 581 with respect to the resultant force of the thrust and frictional force between the planes generated by the upper dental plate 581 on the right inclined plane. During a power outage, the lower dental plate 582 and the upper dental plate 581 disengage along the inclined plane to avoid the upper mechanism 3 being affected by the braking force of the motor.

[0040] Example 5 As shown in FIG. 15, in this embodiment, the clutch structure may be a contact type transmission connection. Specifically, the clutch structure includes a push rod 591 and a concave groove 592 provided in the upper mechanism 3 and the lower mechanism 2 respectively. In the operating state, the push rod 591 is inserted into the concave groove 592, and the rotational torque of the power source 1 is transmitted by the matching surface between the side surface of the push rod 591 and the concave groove 592 to rotate the upper mechanism 3. During a power outage, the push rod 591 is extracted from the concave groove 592 so that the upper mechanism 3 is not affected by the braking force of the motor.

[0041] Chamfers are provided at the opening of the concave groove 592, and chamfers or arc surfaces are also designed at the top of the push rod 591 to ensure smooth insertion.

[0042] Example 6 The wafer drying system includes the wafer rotation and clamping mechanism with any of the above structures. Other structures are conventional technologies and do not need to be described again.

[0043] Example 7 The wafer cleaning system includes the wafer rotation and clamping mechanism with any of the above structures. Other structures are conventional technologies and do not need to be described again.

[0044] Example 8 A single-wafer cleaning machine integrating wafer cleaning and wafer drying functions, including the wafer rotation and clamping mechanism with any of the above structures. Other structures are conventional technologies and do not need to be described again.

[0045] The above specific embodiments are for the purpose of explaining the present invention and are not intended to limit the present invention. Any modifications and alterations made to the present invention within the spirit of the present invention and the scope of protection of the claims are included in the scope of protection of the present invention.

Claims

1. A wafer rotation mechanism, comprising: a lower mechanism (2) used for outputting rotational power; and an upper mechanism (3) that can be connected to a wafer rotation pedestal (4), wherein the upper mechanism (3) and the lower mechanism (2) have an operating state and a separated state. When in the operating state, the upper mechanism (3) is driven by the lower mechanism (2) to rotate. When in the separated state, the upper mechanism (3) and the lower mechanism (2) are separated. In the power failure state, the upper mechanism (3) and the lower mechanism (2) are switched from the operating state to the separated state, and the upper mechanism (3) rotates together with the wafer rotation pedestal (4) under the inertia action until it stops. A wafer rotation mechanism characterized by this.

2. The lower mechanism (2) is provided separately from the power source (1), and the lower mechanism (2) can rotate according to the power source (1). The wafer rotation mechanism according to claim 1, characterized by this.

3. In the power failure state, the lower mechanism (2) stops outputting rotational power. The wafer rotation mechanism according to claim 1 or 2, characterized by this.

4. There is a clutch structure between the upper mechanism (3) and the lower mechanism (2). In the energized state, the lower mechanism (2) and the upper mechanism (3) are connected by non-contact transmission through the clutch structure, and the lower mechanism (2) drives the upper mechanism (3) to rotate synchronously. The wafer rotation mechanism according to claim 1, characterized by this.

5. The clutch structure includes contact surfaces (51, 52) provided on the lower mechanism (2) and the upper mechanism (3) respectively, and an electromagnetic induction assembly (53). When the electromagnetic induction assembly (53) is in the energized state, there is a repulsive force between the lower mechanism (2) and the upper mechanism (3), and non-contact transmission connection between the lower mechanism (2) and the upper mechanism (3) is realized. The wafer rotation mechanism according to claim 4, characterized by this.

6. The electromagnetic induction assembly (53) includes an electromagnet (531) arranged at an interval on the lower mechanism (2) and a permanent magnet (532) arranged at an interval on the upper mechanism (3). The magnetism of the permanent magnet (532) and the electromagnet (531) is the same and they are installed crosswise. The wafer rotation mechanism according to claim 5, characterized by this.

7. It has a clutch structure between the upper mechanism (3) and the lower mechanism (2), and the lower mechanism (2) and the upper mechanism (3) are connected by contact transmission via the clutch structure, and the lower mechanism (2) drives the upper mechanism (3) to rotate synchronously. The wafer rotation mechanism according to claim 1, characterized by this.

8. The clutch structure includes a magnetic body (542), a metal member (543), and a reset member (541) respectively arranged on the upper mechanism (3) and the lower mechanism (2). In a power failure state, the magnetic body (542) and the metal member (543) cut off the adsorption connection. The wafer rotation mechanism according to claim 7, characterized by this.

9. The clutch structure includes an upper contact surface (551) provided on the upper mechanism (3), a lower contact surface (552) provided on the lower mechanism (2), an elastic member (56), and a push rod (57). The elastic member (56) drives the lower contact surface (552) and the upper contact surface (551) to perform contact transmission. In a power failure state, the push rod (57) drives the lower contact surface (552) or the upper contact surface (551) to compress the elastic member (56) and separate the upper and lower contact surfaces. The wafer rotation mechanism according to claim 7, characterized by this.

10. The clutch structure includes an upper tooth disk (581) provided on the upper mechanism (3) and a lower tooth disk (582) provided on the lower mechanism (2). The upper tooth disk (581) and the lower tooth disk (582) mesh and transmit power. The wafer rotation mechanism according to claim 7, characterized by this.

11. The clutch structure includes a push rod (591) and a concave groove (592) respectively provided on the upper mechanism (3) and the lower mechanism (2). In a power failure state, the push rod (591) disengages from the concave groove (592) to separate the upper mechanism (3) and the lower mechanism (2). The wafer rotation mechanism according to claim 7, characterized by this.

12. When located at the separation position, the distance between the upper mechanism (3) and the lower mechanism (2) is 0.1 - 5 mm. The wafer rotation mechanism according to claim 1, characterized by this.

13. A wafer rotation clamp mechanism, Including the wafer rotation mechanism according to any one of claims 1 to 12, comprising a wafer rotation pedestal (4), a wafer support mechanism provided on the outer periphery of the wafer rotation pedestal, and a wafer clamp mechanism (41), in a power outage state, the upper mechanism (3) and the lower mechanism (2) are switched from an operating state to a separated state, the upper mechanism (3) rotates under inertial action with the wafer rotation pedestal (4), the wafer clamp mechanism (41) maintains a state of receiving centrifugal force, its bottom is held to move outward, its end presses against the wafer (42), and in cooperation with the wafer support mechanism, the wafer (42) is fixed, and until the rotation of the wafer rotation pedestal (4) stops, the wafer clamp mechanism (41) releases the pressing force on the wafer (42). A wafer rotation clamp mechanism characterized by the above.

14. A wafer drying system, characterized by including the wafer rotation clamp mechanism according to claim 12.

15. A wafer cleaning system, characterized by including the wafer rotation clamp mechanism according to claim 12.

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