Optical functional multilayer structure suitable for illuminating a large area and related manufacturing method

Abstract

An integrated optical function multilayer structure (100, 200, 300, 400, 500, 600, 700, 800, 900, 1100, 1300, 1400, 1500) suitable for dynamic lighting of large areas, comprising a flexible, optionally 3D formable and thermoplastic substrate film (102, 102a) arranged together with a circuit design part (106) comprising at least some electrically conductive conductors additionally printed on the substrate film, and a plurality of top-emitting light sources (104a) and bottom-mounted light sources (104) provided on a first side of the substrate film so as to internally illuminate (104a) at least a part of the structure for external perception via associated output coupling regions (112, 112a, 112b, 112c), for each light source of the plurality of light sources, an optionally at least partially shared, optically transparent plastic layer (108) of an optionally thermoplastic material provided on the first side of the substrate film, the plastic layer surrounding or adjacent to the light source at least laterally and optionally at least partially covering it, the substrate film optionally comprising the same material or material layer as that of the plastic layer or having at least a similar or lower refractive index thereto, an optically transparent plastic layer (108), and a reflector design part (110) comprising at least one material layer provided at least to the light source (110b; 110c), the reflector design part (110) being configured to reflect the light emitted by the light source and incident on the reflector layer towards the plastic layer, optionally mainly specularly. A related manufacturing method is presented.

Description

Technical Field

[0001] The present invention generally relates to a functional and integrated structure incorporating various functional features such as electronic, mechanical, or optical elements. Specifically, but not exclusively, the present invention relates to the provision of such a structure comprising at least one optoelectronic light source.

Background Art

[0002] In the context of various functional assemblies, for example, in the field of electronic devices and products, there are various different stacked assemblies and multi-layer structures. For example, the motivation behind integrating functionality including electronic devices, mechanical features, or optical features can be as diverse as the associated usage scenarios. When the resulting solutions ultimately exhibit multi-layeredness, component size reduction, weight reduction, cost reduction, or simply efficient integration is relatively often required. The associated usage scenarios can then relate to product packages or casings, the visual design of device housings, wearable electronics, personal electronic devices, displays, detectors or sensors, vehicle interiors, antennas, labels, vehicle electronics, and the like.

[0003] Electronics such as electronic components, ICs (integrated circuits), and conductors can generally be provided on a substrate element by a plurality of different technologies. For example, off-the-shelf electronics such as various surface mount devices (SMDs) can be mounted on a substrate surface that ultimately forms an interface layer inside or outside a multi-layer structure. In addition, by applying techniques corresponding to the term "printed electronics", electronics can be directly and additionally actually generated on the relevant substrate. The term "printed" in this context refers to printing techniques capable of generating electronics / electrical elements from a printed matter, including but not limited to screen printing, flexographic printing, and inkjet printing, through a substantially additional printing process. The substrate used can be flexible, stretchable, and an organic printed material, but not necessarily so.

[0004] Furthermore, the concept of injection molded structural electronics (IMSE) involves building functional devices and their components in the form of a multi-layer structure, which serves to contain electronic functionality as seamlessly as possible. The characteristics of IMSE also include that electronics are generally manufactured in a true 3D (non-planar) form according to the 3D model of the product, component, or generally the entire design in question. To achieve the desired 3D layout of the electronics on the 3D substrate and within the associated final product, the electronics can still initially be provided on a planar substrate (e.g., a film) using two-dimensional (2D) methods of electronic device assembly, whereby the substrate that will already house the electronics is then formed and overmolded into the desired three-dimensional, i.e., 3D, shape by a suitable plastic material that covers and embeds, for example, underlying elements (e.g., electronic devices), thus protecting the elements from the environment and potentially hiding them. Naturally, additional layers and elements can be added to the construction.

[0005] The optical features and functionality provided in the aforementioned integrated structure can include, for example, several light sources intended to illuminate a selected interior of the structure or the environment of the structure. The illumination can itself have different motivations (e.g., decorative / aesthetic or functional (e.g., guiding or indicative) motivations).

[0006] For example, in some usage scenarios, it is necessary to illuminate the environment to improve visibility in dim or dark conditions, which may enable the performance of various human activities (such as walking, reading, or operating a device) that typically require high lighting comfort without problems. Alternatively, lighting can be applied to warn or notify different stakeholders about the state of a structure or a related receiving device, or a connected remote device, via different warning lights or indicator lights, and for example, related graphics. Nevertheless, lighting can give the structure or its host a desired appearance and visually emphasize its specific area or feature by the desired color or brightness. Thus, lighting can also be applied, for example, to indicate to the user of the structure or its receiving device the location of different functional features (such as keys, switches, touch detection areas, or other UI (user interface) features on the device surface), or the actual function underlying the illuminated feature.

[0007] However, various challenges can commonly arise in the described lighting applications and other lighting applications and usage scenarios.

[0008] For example, as will be readily understood by those skilled in the art, both functional and aesthetic problems can easily occur due to unwanted light outflow or light leakage from the structure or between its different internal volumes and regions, and the transmission loss from the perspective of the desired light path and the original lighting target should not be forgotten. However, the perceptibility of the light source itself is one of the potential further problems. In some applications, the light source should preferably remain hidden or only be discretely or occasionally exposed.

[0009] In addition, for example, in terms of the shape, size, or location of the illuminated surface area, achieving sufficient resolution, often dynamic or adaptive control, of the light transmitted internally and ultimately output can be at least sometimes difficult in a highly integrated structure. In various solutions, controlling or specifically improving the uniformity of that light, for example, which can span sometimes fairly large areas in relation to the overall dimensions of the structure or its selected surface, has been found to be burdensome in the past. More generally, the same applies to the spatial control of illumination and light output coupling. This can be an important issue, for example, when the surface includes an icon or symbol to be evenly illuminated to indicate to an external observer of the structure that the device functionality or status associated with the icon or symbol is active. Merely using multiple light sources to more effectively illuminate a common target area or feature (e.g., an icon) can still result in illumination hotspots and additional leakage, while at the same time requiring more, often precious, power and space. Obtaining an appropriate mixture of brightness or color can also be difficult, especially in lighting applications for large areas, which requires a relatively long distance between the light source(s) and the area or feature being illuminated thereby, which either increases the size of the structure required or decreases the area that can be illuminated with appropriate mixing performance.

[0010] Furthermore, some light sources (e.g., high-power LEDs), which are generally preferred in many respects, consume a somewhat significant amount of power (on the order of easily more than about 1 watt), and can ultimately become hot and deteriorate or break. They can also damage nearby heat-sensitive elements (e.g., plastic substrates).

[0011] Adding a plurality of potentially complex light guiding, input coupling, output coupling, limiting, or generally processing elements to a structure now has its own drawbacks (e.g., increased space consumption, weight, and other design constraints). For example, maintaining high optical performance of the structure with respect to low leakage, loss, and similar objectives may easily further limit the shape of the structure or the elements contained therein to those that are not optimal for their intended use cases.

[0012] However, when optical features (e.g., illumination features) are combined with other features within a structure, the other features may, for example, due to their shadowing or masking effects, have an adverse impact on the lighting performance. Also, occasionally, the optical features may, for example, due to the spatial constraints faced, prevent or complicate the implementation manner of other features.

[0013] From the perspective of the manufacturing process, the adoption of various optical features in a structure, in addition to the complexity of the overall process, may increase the amount of problems faced due to the (non)-compatibility of the added features with each other or with the remaining materials and features, and the associated process steps. For example, considering overmolding, it may result in an increase in failure rate / a decrease in yield. For example, when a material associated with a lower melting temperature (e.g., polymethyl methacrylate, PMMA) is utilized together with a molding material with a higher melting temperature (e.g., polycarbonate, PC), features printed or established on the lower melting temperature material may be deteriorated or washed away during molding. SUMMARY OF THE INVENTION

[0014] An object of the present invention is to at least mitigate one or more of the drawbacks associated with known solutions in the context of an optically integrated structure and related manufacturing methods.

[0015] This object is achieved by various embodiments of an integrated functional multi-layer structure and related manufacturing methods for providing the multi-layer structure.

[0016] According to one aspect, an integrated optical functional multilayer structure suitable for dynamic illumination of large areas is preferably a substrate film, preferably flexible, optionally 3D formable and thermoplastic, arranged together with a circuit design part comprising at least some electrically conductive conductors additionally printed on the substrate film, comprising a plurality of preferably top-emitting light sources and bottom-mounted light sources provided on a first side of the substrate film for internally illuminating at least a part of the structure for external perception via an associated output coupling region, for each light source of the plurality of light sources, optionally at least partially shared, a light-transmissive plastic layer of a thermoplastic material (e.g. polycarbonate), provided on the first side of the substrate film (e.g. laminated or produced), optionally, which plastic layer surrounds or is adjacent to the light source in the lateral direction and also optionally at least partially covers it, and the substrate film optionally comprises the same material or material layer as that of the plastic layer, or has at least a refractive index similar to or lower than that of the plastic layer, plastic layer, a reflector design part preferably comprising at least one material layer provided at least in the light source, which is configured to reflect the light emitted by the light source and incident on the reflector layer, preferably towards the plastic layer, optionally mainly specularly. There is a reflector design part.

[0017] In a further aspect, a method for manufacturing an integrated optical functional multilayer structure is obtaining a substrate film, preferably flexible, optionally 3D formable and thermoplastic, optionally a multilayer film, the substrate film being provided with a circuit design part preferably comprising at least some electrically conductive conductors (e.g. traces and / or contact pads) additionally produced, optionally printed, on the substrate film, obtaining the substrate film, Disposing a plurality of preferably top-emitting light sources and bottom-mounted light sources provided on a first side of a substrate film; For each of the plurality of light sources, optionally providing, on the first side of the substrate film, a light-transmissive plastic layer that is at least partially shared, optionally via lamination or generation (e.g., molding, or 3D printing), the plastic layer surrounding or adjacent to the light source at least laterally and optionally at least partially covering it; Optionally, a reflector design portion is provided that includes at least one material layer, which optionally includes a stack of material layers and / or a layer of an electrically conductive material and / or a metallic material, which optionally includes printing, coating, laminating, or molding, the reflector design portion being configured to reflect light emitted by the plurality of light sources and incident on the reflector design portion, preferably towards the plastic layer, optionally mainly specularly.

[0018] This solution provides different advantages over a variety of previously applied solutions, of course depending on each of their embodiments.

[0019] For example, the input coupling, transmission, and (output) coupling of light can be effectively controlled, for example, with respect to their relative positioning, orientation, dimensions, and other characteristics, by a clever connection configuration of the materials and elements (e.g., light sources) involved, and there can be associated optical efficiencies and various other characteristics of interest optimized in the associated optical structures (e.g., the achieved lighting uniformity). This solution is also particularly suitable for lighting applications in large areas, facilitating reducing or keeping low the number of light sources required, which has obvious advantages in terms of space savings, power consumption, structural and manufacturing complexity, weight, etc.

[0020] For example, an embedded mirror-type reflector can be arranged opposite to or adjacent to a light source, using, for example, a typical conductive metal material or a number of layers with varying refractive indices, to enable efficient transmission and control of light within the structure. However, a total internal reflection (TIR)-capable interface can complement the mirror reflector and can be additionally configured, for example, to be stacked with the mirror reflector, for more sophisticated and flexible control of light transmission.

[0021] A "hide until lit" effect can also be generated. For example, a structure, various components, or a graphical symbol provided, for example, within a conductive trace can be made invisible to external visual perception until the light source intended to illuminate and targeted them is activated.

[0022] From a manufacturing perspective, by skillfully applying printing and other cost-effective, flexible, and generally controllable methods (such as various molding and coating techniques), and in addition to using off-the-shelf elements (such as films, components, or modules), desired features can be manufactured.

[0023] By appropriately configuring the light source(s) and, for example, the proposed reflector design, the mixing of the light characteristics on the output coupling surface along the transmissive plastic layer and on the outer surface of the structure can generally be enhanced, thus reducing the so-called mixing distance required to achieve the desired mixing performance.

[0024] An optical element (e.g., an output coupling element) can be integrally and monolithically formed with another element (e.g., a material layer) by locally deforming the associated material, which not only provides a very efficient optical solution but also simplifies the structure and potentially simplifies the manufacturing process among other advantages, resulting in savings in space, material, and weight. For example, the mirror effect provided by a reflector design can be locally disrupted to establish an optical output coupling element from the deformed portion, or the material(s) at a TIR enabling interface can be similarly processed to locally modify the properties of the interface, e.g., for enhanced scattering and / or interfering TIR.

[0025] A circuit design including an electrical conductor for powering a light source can be cleverly positioned behind a reflector design from the perspective of light propagating within a transmissive plastic layer so as not to cause, or at least reduce, interference (e.g., scattering or absorption) to the propagation of light.

[0026] The adhesion between materials can be improved. For example, by using multiple layers or multi-layer elements such that materials adjacent to a typically formed transmissive layer are selected to better withstand forming and other processes and to be securely attached to each other or to the transmissive layer, the problem of washout can be reduced. For example, optionally co-extruded multi-layer films (e.g., PC / PMMA films) can be used in a stack structure above and / or below a transmissive layer containing a PC resin, and then injection molded or otherwise formed on the PC layer of the multi-layer film or between the PC layers of two multi-layer films. However, also, for example, a printed output coupling element can be provided on a PC surface with a standard and advantageous PC surface ink in many ways. In addition, using co-extruded multi-layer films reduces the adhesion problem between different material layers because of the excellent adhesion obtained from the film co-extrusion process. Combinations of different co-extruded materials with better refractive index differences can be utilized.

[0027] The proposed multi - layer can be modular and can be assembled using a plurality of different and / or similar modules that provide different features to the integrated structure. For example, preferably, IMSE pieces or cell - type modules shaped (e.g., hexagonal / honeycomb cells) so as to be simply fixed to each other like puzzle pieces can be used. Some modules (s) can include more features or functionality, more complex functionality, more difficult - to - implement functionality, or some types of functionality (e.g., general electronics and / or optoelectronics (e.g., light sources)), while some other modules (s) can be simpler and mainly include, for example, passive optics (transparent materials, reflectors, masks, etc.) or other features that can be conveniently manufactured and used, for example, to scale the size of the structure. Modules can support snap - fit connections or crimp fixes, for example, to facilitate mutual fixation. In addition to the modular single structure, some multi - layer structures can be connected together and optionally stacked to form an even larger assembly. Thus, modularity can be subtly provided at different levels and resolutions.

[0028] Different embodiments of the present invention can be generally utilized and included in different applications, for example, in electronic devices or devices including electronic devices such as computers, tablets, smartphones, other communication devices, wearables, AV equipment, optical devices, household appliances, vehicles, displays, panels, medical devices, smart clothing, furniture, artworks, etc., but not limited thereto.

[0029] Various other benefits provided by different embodiments of the present invention will become apparent to those skilled in the art based on the following detailed description.

[0030] The expression "some" can refer to any positive integer starting from one (1) herein.

[0031] The expression "a plurality of" can each refer to any positive integer starting from two (2).

[0032] The terms "first" and "second" are used in this specification to distinguish one element from other element(s), unless otherwise specified, and are not used to assign any particular priority or order to them.

[0033] The exemplary embodiments of the invention presented in this specification should not be construed as limiting the applicability of the appended claims. The verb "comprising" is used in this specification as an open limitation that does not exclude the presence of features not recited. The various embodiments, and the features recited, for example, in the dependent claims, are combinable with each other freely, unless otherwise specified.

[0034] Selected embodiments of the invention are illustrated, by way of example and not limitation, in the figures of the accompanying drawings.

Brief Description of the Drawings

[0035]

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DETAILED DESCRIPTION OF THE INVENTION

[0036] In FIG. 1, generally, an embodiment of a multilayer structure according to the present invention is illustrated at 100 via a cross-sectional sketch.

[0037] The multilayer structure includes at least one substrate film 102, which is preferably made of a flexible and 3D-formable (3D-moldable) material (e.g., a thermoformable (plastic) material). As will be understood by those skilled in the art, instead of a single, optional monolithic film 102, there can be a multilayer and / or multi-section structured type film 102a having at least layers that are different from each other in place, for example, also including a hosting layer for electronics. Such a multilayer film 102a can be manufactured, for example, by coextrusion as part of an embodiment of the method contemplated later herein.

[0038] Item 108 preferably refers to at least one, preferably thermoplastic, at least light-transmissive layer provided by molding onto the substrate film 102. Optionally, layer 108 can be produced between the substrate film 102 and any possible further element(s), or generally between material layer(s) (e.g., at least one further layer or film different from or similar to film 102). Alternatively, item 108 can refer to a plurality of stacked, preferably still thermoplastic and / or integrated layers that can be optionally produced by multi-shot molding. Layer 108 should be capable of transmitting light considering at least a part of the wavelength(s) emitted by a selected light source(s) (e.g., substantially all or selected wavelengths of visible light), or generally wavelengths typically including but not necessarily limited to visible wavelengths.

[0039] Depending on the application, layer 108 comprises a first side and associated first surface 108a that can be directed towards the use environment of the structure and, for example, the user 113 of the structure located in such an environment. Further, layer 108 comprises an opposing second side and associated second surface 108b that essentially faces at least one instance of film 102 and potentially a receiving device or structure. However, in an alternative embodiment, surface 108b can essentially face the user of this use environment instead of or in addition to surface 108a.

[0040] Thus, since layer 108 is precisely configured to transmit or guide light, it comprises a material that is optically at least translucent and optionally substantially transparent, and the light transmittance of the entire thermoplastic layer can, in some use scenarios, preferably be at least 50%, although the desired transmittance can, in fact, vary fundamentally between all possible use scenarios. In some embodiments, a transmittance of at least about 80% or 90% may be preferred to maximize the light output from the structure, but in some other scenarios, for example, when problems associated with light leakage should be minimized, lower values may be quite sufficient, even if not advantageous. The transmittance is typically defined or measured in a selected direction, for example, in the main direction of light propagation and / or in the transverse direction (i.e., the thickness direction) with respect to the surface of the substrate film 102, taking into account the wavelengths of interest, which typically include visible wavelengths as discussed heretofore.

[0041] In some embodiments, the appropriate translucency or optical attenuation of layer 108 can be achieved, for example, by using scattering elements (e.g., particles) in the materials used. When the amount of scattering elements increases, the scattering / diffusion and the half-value angle also increase as one possible measurable metric, while the light transmittance through the layer decreases substantially. Correspondingly, when the layer thickness increases substantially, the scattering / diffusion characteristics (e.g., the half-value angle) increase and the transmittance decreases.

[0042] In terms of applicable materials, layer 108 can generally comprise at least one material selected from the group consisting of, for example, polymers, organic materials, biocompatible materials, composite materials, thermoplastic materials, thermosetting materials, elastomeric resins, PC, PMMA, ABS, PET, copolyesters, copolyester resins, nylon (PA, polyamide), PP (polypropylene), TPU (thermoplastic polyurethane), polystyrene (PS or GPPS, general-purpose polystyrene), TPSiV (thermoplastic silicone vulcanizate), and MS resins.

[0043] The substrate film 102 may optionally include a material or material layer having the same, or a similar or lower refractive index than that of layer 108. Thus, the resulting interfaces 102, 108 may each be optically transparent or enable a total internal reflection (TIR) type function for light to reach the interface from layer 108.

[0044] In some embodiments, a colored or more strongly colored resin as the material of layer 108 provides a viable option to limit unwanted light leakage inside and outside the structure 100 to nearby elements or at a general distance, and can hide the interior (e.g., light source 104, or other circuit configurations) from external perception. An originally optically substantially transparent base material (e.g., PC or other plastic resin) can be doped with a colored masterbatch. In many use scenarios, the structure 100 should be, for example, only a few millimeters or centimeters thick in total, whereby the thermoplastic layer 108 must be even thinner, and a selected masterbatch (e.g., white or a desired selected wavelength resin, optionally also an IR (infrared) resin that may be used, for example, in IR remote control applications) is provided at a desired concentration (e.g., about 1% let-down ratio) to establish layer 108 in a plastic resin layer about 2 - 4 mm thick (e.g., 3 mm). Very satisfactory results can be obtained by using this. Generally, in many embodiments within the context of the present invention, the achievable let-down (administration or doping) ratio is actually about 5%, 4%, 3%, 2%, 1%, or less. For example, an industrial grade masterbatch suitable for the purpose is provided by Lifocolor (trademark). The so-called "hide until illuminated" effect can be achieved for the light source 104 or other features included in the structure 100, for example, by adding a masterbatch that is translucent, for example, exhibits a selected color, to the injection molded base resin constituting layer 108.

[0045] Item 124 refers to an overcoat that at least partially covers the light-emitting portion of a light source, and the overcoat layer optionally comprises a light-transmissive material having a refractive index higher than that of a plastic layer.

[0046] Overcoat 124 refers to, for example, an optional encapsulant, glove top, or other conformal coating (such as Illumabond™ or Triggerbond™) for optical shaping or other processing, protection and / or fixation purposes. The material used can be dispensed over a selected circuit configuration (such as light source 104 or other electronics included in the structure). The material can be, for example, substantially transparent. Alternatively, it can be colored and / or translucent. In some embodiments, a particular optical function or feature (such as a lens) may be provided by the encapsulant. The lens can be, for example, diffusive, Fresnel, or collimating, for example. Additionally or alternatively, off-the-shelf lenses or generally optical components can also be included in the structure, either on the surface or embedded.

[0047] The substrate film 102 and / or further film(s) or generally material layer(s) included in the multilayer structure can include at least one material selected from the group consisting of polymers, thermoplastics, electrical insulation materials, PMMA (polymethyl methacrylate), polycarbonate (PC), flame-retardant (FR) PC film, FR700 type PC, copolyesters, copolyester resins, polyimides, copolymers of methyl methacrylate and styrene (MS resin), glass, polyethylene terephthalate (PET), carbon fibers, organic materials, biomaterials, leather, wood, fabrics, cloth, metals, organic natural materials, solid woods, veneers, plywoods, barks, tree barks, birch barks, corks, natural leathers, natural fibers or cloth materials, natural cultivation materials, cotton, wool, linen, silk, and any combination thereof.

[0048] Depending on the embodiment of the problem, the substrate film 102 and / or any additional film(s) or layer(s) potentially included in the structure may comprise, or be, optically substantially transparent or at least translucent material(s), considering, for example, wavelengths of interest (e.g., visible light) having a relevant light transmittance of about 80%, 90%, 95%, or more. This may be applicable particularly when the substrate film 102 is configured within the structure 100 to effectively transmit or pass the light emitted by the light source 104. However, in some embodiments, the substrate film 102 used can be substantially opaque, black, and / or exhibit a dark color in other ways in order to block (mask function) the incident light from passing through it.

[0049] The thickness of the film 102 and optionally any additional film(s) or layer(s) included in the structure 100 can vary depending on the embodiment. For example, it can be on the order of just a few 10s or 100s of millimeters, or quite thick, on the order of 1 or several millimeters.

[0050] The thickness of the layer 108 can also be selected as appropriate, but a thickness on the order of several millimeters (e.g., about 3 - 5 millimeters) can be applied. In some embodiments, a thickness of just about 2 millimeters or less, potentially on the order of just a few 10s of millimeters, may be sufficient if not optimal, while in some other embodiments, the thickness can similarly be quite thick, for example, at least about 1 cm or more in some places. The thickness can actually vary locally. In addition to accommodating various elements (e.g., electronic or optical elements), the layer 108 may optionally include recesses or internal cavities, for example, for purposes of light guiding, processing, and / or thermal management.

[0051] The film 102, layer 108, and further layers of the structure (e.g., films, coatings) can be essentially planar (the width and length are greater than the thickness, e.g., of different orders of magnitude). The same generally applies to the entire structure as illustrated in the figures, although other non-planar shapes are generally fully realizable.

[0052] Item 104 preferably refers to a light source of optoelectronic type. The light source 104 can be or include a semiconductor, a packaged semiconductor, a chip-on-board semiconductor, a bare chip, an electroluminescent and / or printed type light source, preferably an LED (light emitting diode) or an OLED (organic LED). The light source 104 can be of the top shoot and bottom mount, or side shoot type. Still, a multi-side shooter or bottom shooter can be utilized depending on the characteristics of each specific use case.

[0053] Furthermore, from a packaging perspective, the light source 104 can optionally be of the flip-chip type. In some embodiments, the light source can include a plurality (two, three, four, or more) of light emitting units (e.g., LEDs) that are packaged or at least grouped together. For example, a multi-color or specifically an RGB LED consisting of a plurality of LED emitters can be provided within a single package.

[0054] The light source 104 is provided (e.g., processed) or, in the case of at least partially off-the-shelf components, optionally printed (e.g., with reference to an OLED), and mounted on the substrate film 102, preferably on the first side 102f and its associated surface, which is provided to face the transmissive layer 108 instead of the opposite second side 102s and the surface of the film 102. Further, additional host layer(s) (e.g., film) can be included in the structure to accommodate further elements (e.g., light sources or other electronic devices). For mounting, for example, an adhesive (conductive or non-conductive) can generally be applied.

[0055] The light source 104 can be at least partially embedded in the material of the layer 108 during overmolding or otherwise during the preparation of the layer 108 thereabove.

[0056] The layer 108 can include one or more light output coupling regions 112 on either side of the layer 108 (e.g., the first 108a side or the second 108b side), and the light that is first emitted by the light source 104, input coupled into the layer 108, and propagated within the layer 108 is output coupled to the surrounding layer(s) and / or environment. The light source 104 can be positioned as desired in view of each output coupling region(s) 112. The source 104 can be positioned proximate to the region 112 such that it is available from the emission surface(s) of the source 104 without reflection, even in the associated direct optical path. Alternatively, and perhaps more generally, the source 104 is located further away, away from the associated output coupling region(s) (e.g., out of line-of-sight, from the region, or in the outer environment near the region) for various reasons, which can include, for example, better hiding or masking the source 104 from external perception, or enhancing the uniformity of illumination (e.g., brightness and / or color(s)) on the region(s) 112, by propagating the light emitted by the source 104 within the layer 108 and in adjacent layers or material interfaces over longer distances and durations, for example, to favor improved mixing. FIG. 1 shows only a single light source 104 for clarity, and in many embodiments, one source 104 may be sufficient, although not advantageous in some cases, and as will be readily understood by those skilled in the art, in the field of illumination of large areas where it may be possible to benefit, for example, from including several sources 114 on the same or different substrates (and using shared or separate transmissive layer(s) 108 and / or reflector design(s) 110), there are numerous embodiments having at least partially connected or separate output coupling region(s) 112 associated with and affecting the positioning and orientation of the light source 104.

[0057] Item 106 refers to a circuit design portion in the form of one or more at least electrically conductive conductors (e.g., traces, electrodes, and / or contact pads), which can optionally further act as a heat conductor and which are optionally additionally generated (e.g., screen printed or printed by other means). The conductors can be used, for example, for power and data transfer purposes between elements of the structure 100 and / or with external elements. The circuit design portion 106 can, among other things in use, provide control signals and / or power from a controller and a power circuit (s) to the light source 104 respectively. The circuit design portion 106 can be connected to an external device, for example, via an outer surface or an edge including wiring or connectors of the structure 100. Additionally or alternatively, wireless connectivity can be applied, among other options, for example, based on electromagnetic coupling or in particular inductive coupling. The circuit design portion(s) 106 can be arranged on top of or inside the substrate film 102 and / or other host (ing) elements (e.g., a material layer of the entire multilayer structure). In the structure, there can be, for example, several local or partial circuit design portions 106 on different layers or on its host, which can be selectively connected together operably at least even if not physically, and can establish a larger circuit design portion spanning several elements (e.g., layers of the structure). Some elements (e.g., conductors (e.g., traces)) can be physically positioned so as to be distributed or shared between two or more layers of the structure (e.g., a first portion present on / within one layer and a second portion on / within another layer). Thus, such an element can be regarded as part of several local circuit design portions or a larger circuit design portion (e.g., on different layers).

[0058] The light source 104 can be emissive as indicated by the dotted lines 104a (top shooting), 104b (side shooting) extending from the source 104 to the transmissive layer 108.

[0059] Item 110 and sub-items 110a, 110b, 110c (see Figure 2) refer to the reflector design portion, which can also be of a single-component or multi-component (multi-part) structure. Two or more parts of a multi-component structure solution do not need to be physically directly connected because they can be present, for example, on opposite sides 108a, 108b of layer 108 or separated from each other in other ways by a distance. However, any of the components or parts can include one or more material layers, for example, as stacked ones, as their components.

[0060] Accordingly, the reflector design portion 110 includes at least one material layer. The reflector design portion 110 is configured to reflect, optionally mainly specularly, the light initially emitted by at least one light source 104 and incident on the reflector design portion 110.

[0061] One or more parts of the reflector design portion 110, or the entire design portion 100, can be located on the side facing (see reflector / reflector part 110a for illustration), opposite (see reflector / reflector part 110b for illustration), and / or transverse to (see especially reflector / reflector part 110c for illustration) the side of the plastic layer that faces the first side 102f of the substrate film 102 that receives the light source 104.

[0062] In some embodiments, at least a portion of conductor 106a that establishes circuit design portion 106, as illustrated by the scenario depicted in 150 (sub - sketch of FIG. 1), may be configured to be located external to light - transmissive plastic layer 108, reflector design portion 110, and any possible additional intermediate layer(s) (e.g., layer 114), such that, for example, instead of facing the side of light - transmissive plastic layer 108, the side of reflector design portion 110 that faces away from light - transmissive (light - permeable) plastic layer 108 and optionally the surface are positioned. Generally, at least a portion of the conductor is configured to transfer data or energy between conductor 106a and, for example, an electronic device (e.g., light source 104) that is optionally at least essentially or partially present within the volume, and can be located away from layer 108 and the volume spanning the possible intermediate space to reflector design portion 110 even when so configured.

[0063] Similarly, at least a portion of substrate film 102 itself can be positioned to be on the side opposite to the side that actually faces and potentially contacts the light - transmissive layer 108 of at least a portion of reflector design portion 110e. Thus, the stack order of reflector design portion 110e and substrate film 102 can be at least locally reversed, for example, from the stack order of the main drawing provided in FIG. 1. For example, one or more conductors of design portion 106 can be provided on substrate film 102, parallel to its surface (e.g., near or under an electronic component (e.g., light source 104)), as also depicted in the sketch. For example, instead of directly generating layer 108 on substrate film 102 (and potentially on one or more conductors of circuit design portion 106 and / or light source 104 already provided on film 102) by molding, layer 108 can be pre - manufactured with, for example, feature 103 (e.g., holes for accommodating light sources and / or at least a portion of reflector design portion 110e) prior to its attachment to substrate film 102 as indicated by the two arrow symbols in the figure. For that purpose, suitable lamination techniques based on, for example, adhesives, heat, and / or pressure can be utilized.

[0064] Thus, when the conductor is mostly not at a distance from the transmissive layer 108, it is at least partially or substantially completely positioned and does not interfere with, or at least has little interference with, the optical path of the light emitted by the light source 104, such that the light propagates within the transmissive layer 108 and reaches the reflector design portion 110 only occasionally and is reflected therefrom, so that the optical efficiency of the arrangement and, indirectly, the electrical efficiency can be enhanced. Otherwise, the conductor may cause excessive undesirable phenomena to the incident light, including, for example, diffusion and absorption. However, in certain embodiments, the effect of the conductor on the incident light can be utilized for useful purposes, such as additional or alternative optical effects (such as diffusion, attenuation, or shadowing).

[0065] In a preferred embodiment, the reflector design portion 110 or at least a part thereof is typically configured to at least roughly reflect the previously propagated incident light inside the (transmissive) layer 108, typically towards the layer 108 or back to the layer, in order to prevent undesirable optical output coupling or light leakage from the structure 100. In some embodiments, the reflector design portion 110 may comprise at least a part that is configured to direct the incident light in an alternative direction (such as outside the layer 108 or the entire structure 100).

[0066] Furthermore, the reflector design portion 110 can be configured on or within the layer 108 to reflect and direct the light emitted by the light source 104 and incident on the reflector design portion 110 to propagate towards the output coupling regions 112, 112a, 112b, 112c. In some embodiments, which will also be described below, the reflector design portion 110 can be configured to direct the incident light towards the surface normal of the layer 108 in order to output couple light from at least the layer 108 or the entire structure.

[0067] In fact, referring, for example, to the sketches of FIGS. 2 and 3, the reflector design portion 110 can be configured at least in relation to the light input coupled from the light source 104.

[0068] The reflector design portion 110 or at least a part thereof may be located on the direct optical emission path from the light source 104 (110a), 110b, 110c. Further, the reflector design portion 110 may be located laterally and / or below the light source 104 such that the design portion 110 receives and reflects at least a portion of the light emitted by the light source 104, or may comprise a portion 110b on and / or opposite the light source 104 (e.g., on the opposing side 108a of the layer 108 with respect to the light source 104).

[0069] As illustrated, by way of example only, in 300 of FIG. 3, the reflector design portion or a part thereof 110b may be configured to be input-coupled from the light source 104 into the layer 108 and to reflect the light incident on the reflector design portion 110 so as to be further aligned with the side surface of the layer 108 substantially transverse to the surface normal of the layer 108.

[0070] Generally, a portion of the reflector design portions 110, 110a, 110b, 110c may be at least partially embedded in the layer 108 and located on its surfaces 108a, 108b.

[0071] And, as well illustrated, by way of example, in 200 of FIG. 2, the light source 104 may be located between at least a portion of the reflector design portion 110c, which is preferably aligned substantially perpendicular to the light output coupling region, and the light output coupling region 112. The light source 104 may then be aligned at the point of its primary emission direction so as to point at least partially towards the reflector design portion 110c. For example, a light source, e.g., a side-emitting LED or other source, may be aligned to point away from, for example, the direction of the output coupling regions 112, 112a, 112b, 112c (shortest path) by approximately 180 degrees.

[0072] Thus, in a typical scenario of some light sources being utilized, the distance between the light source 104, or multiple light sources 104, and the associated output coupling regions 112, 112a, 112b, 112c is kept short and can be reduced from more conventional solutions because each optical distance defined by the path that the light emitted by the light source(s) 104 actually takes before the output coupling 112 increases by approximately twice the distance D illustrated in the figure, i.e., the distance between the reflector design part 110c and each associated light source 104. This translates to a smaller applicable multilayer structure and / or a larger output coupling region 112, 112a, 112b, 112c with appropriate light mixing characteristics achievable according to the set of preferences for the application, as understood by those skilled in the art.

[0073] The reflectivity of the reflector design part 110 is selected to be at least a portion of the wavelengths emitted by the light source(s) 104, and optionally, preferably at least locally about 75%, more preferably at least about 90%, and most preferably at least about 95% for essentially all visible wavelengths of light.

[0074] For example, to achieve sufficient reflectivity, some other optical functional elements included in the reflector design part 110 or the structure preferably include at least locally at least one element selected from the group consisting of: - Electrically conductive materials (e.g., aluminum, silver, gold, zinc, copper, or beryllium) - Metals, optionally metal particles, and further optionally provided on top of or inside a substrate film or a further film or layer included in the structure, or a further film or layer included in the structure - A plurality of stacked and superposed material layers with at least two mutually different refractive indices, optionally defining a Bragg mirror - Thin film coatings, optionally PVD (physical vapor deposition) coatings, and - (Reflective) preferably printable inks or paints.

[0075] Thus, by utilizing a conductive material (e.g., metal) within one or more layers of the reflector design section 110, the so-called skin depth of the reflector design section 110 and the underlying structure as a whole are kept small, thereby increasing the reflection efficiency. The conductive material and the metal can be provided, for example, in the form of a film, paint, ink, or an extrusion (e.g., metal particles in a host material (e.g., plastic)) process. In principle, any practical metallization procedure can be applied to provide the metal(s).

[0076] Alternatively or additionally, a plurality of stacked layers (potentially tens or hundreds of layers) can be applied to establish a connected and effective, preferably integral, reflective structure such as a Bragg mirror. In such a structure, layers of different refractive indices can be alternating in sequence. For example, two materials of different refractive indices can be configured to alternate within a multilayer reflector stack that constitutes at least a portion of the reflector design section 110. At each interface between two material layers, a Fresnel reflection is advantageously created. When the optical path length difference between subsequent layers is half of the wavelength (i.e., each layer is a quarter-wavelength thick), the reflections interfere constructively (zero / 360-degree phase shift between the reflections). For example, plastic polymer materials can be utilized in the multilayer reflector stack, such as, for example, PMMA and PC or PS. The stacked integral multilayer elements can also, in some embodiments, include a substrate film 102 and / or other film(s), or generally layers(s) or feature(s) (e.g., item 114, 116), and the subject will be further described in more detail below.

[0077] The stack included in the reflector design section 110 can optionally be realized as an off-the-shelf multilayer film. Alternatively, some of the optionally stacked material layers of the reflector design section 110 can be generated by a selected coating technique (e.g., PVD or electroplating on plastic) on a substrate (e.g., substrate film 102). Alternatively or additionally, for example, a (multiple) coextrusion process can be applied.

[0078] Item 114 briefly refers to at least one additional one that is optionally stacked and further optionally in contact with the reflector design part 110 and is optionally additionally generated, for example, by printing a material layer. The at least one additional material layer 114 preferably has a refractive index lower than that of layer 108. For example, when layer 108 is made of PC, layer 114 can include PMMA.

[0079] The at least one additional material layer 114 and layer 108 are optionally connected and optionally also physically close to each other, and a part of the light emitted by the light source, propagated in the plastic layer 108, and incident on the at least one additional material layer 114 is redirected by total internal reflection (TIR) at their interface to be directed towards and back to the plastic layer. Generally, and for example, when the reflector design part 110 is stacked and arranged, for example, behind the interface of layers 108, 114 on the optical path, the reflector design part 110 effectively cooperates with the interface, for example, reflects the remaining light passing through the interface at an angle lower than the relevant critical angle, and thus can be incident behind the reflector design part 110.

[0080] Therefore, at least one layer or other part of the reflector design part 110, the layer of the at least one additional material layer 114, and layer 108 can be at least locally superimposed in terms of their materials such that the material of the layer of the at least one additional material layer 114 is stacked between the material of the reflector design part 110 and layer 108.

[0081] Generally, at least parts of the reflector design parts 110, 110a, 110b, 110c and the at least one additional material layer 114 can exist relative to each other on the same side, the opposite side, or both / plural sides 108a, 108b of the sides 108a, 108b of layer 108.

[0082] At least one additional material layer 114 may optionally comprise, or consist of, for example, an optically transparent adhesive (OCA) or a primer.

[0083] In general, for example, within layer 114 or elsewhere, for example, using patterned selectively (more) low refractive index materials, light propagation within the structure can be effectively controlled both from a technical and cost perspective. For example, in a large structure having one or more light sources 104, it may be advantageous to selectively create light guiding and light guiding enhancement (e.g., reflection (boundary)) structures. Light guiding structures such as items 108, 110, 114, 116 can be constructed, for example, for each sector having different optical properties and, for example, lengths or generally dimensions.

[0084] In some embodiments, an integrated multilayer structure such as multilayer film 102a can be included in structure 100 as a prefabricated or on-site fabricated element.

[0085] Multilayer film 102a can include, for example, a plurality of, for example, two stacked, attached, optionally coextruded layers, one of which can be, among other options, a substrate film 102 or similar layer for receiving, for example, light source 104, as well as circuit design section 106, and potential additional electronics or other elements, or can establish, but at least one other layer can be at least one layer of item 114 and / or reflector design section 110, 110a (which itself can be a multilayer material stack as discussed earlier herein).

[0086] In some embodiments, intermediate layer 116 can be provided within the structure, for example, between layer 108 and (if present) a layer of at least one additional material layer 114, and / or between layer 108 and reflector design sections 110, 110b on the first side 108a of layer 108 and layer 108.

[0087] For example, the intermediate layer 116 embodied as a film can also act as a substrate (surface) for various elements (such as electronic components including a light source, for example). The intermediate layer 116 can optionally comprise the same light-transmissive material as layer 108 or can have at least a similar refractive index thereto. The previous considerations provided herein with respect to the substrate film 102 can generally be applied to the intermediate layer 116, as will be understood by those skilled in the art.

[0088] The intermediate layer 116 and at least one of said at least one further material layer 114 and / or at least one layer of the reflector design portions 110, 110b can further be components of a multilayer structure (such as a multilayer film 116a), optionally a coextruded multilayer film.

[0089] Articles 120, 122 optionally refer to one or more elements (such as material layers) which are either on (preferably within one or two material layers) or at least near (preferably within one or two material layers) the outer surface of the structure on one or both sides 108a, 108b of layer 108. They can include films, coatings, prints, plastic materials, natural materials (such as leather as listed in connection with the previously applicable substrate films / film materials herein). Articles 120, 122 can receive other features (such as electronic components) or layers and can thus also be regarded as substrates (plural as appropriate) depending on the embodiment. Preferably, articles 120, 122 are at least somewhat translucent and optionally contain (through) holes filled (with at least a translucent material) or cover only limited areas (plural as appropriate) to enable light output coupling from the structure. For example, different lamination, printing, coating, molding, or extrusion methods can be utilized to provide either of articles 120, 122.

[0090] Article 118 refers to one or more output coupling elements that the structure can comprise, for example, which are originally separate or, if not monolithic, are integral with the remaining elements (such as the reflector design portion 110 or various (other) material layers).

[0091] For example, the reflector design section 110 (e.g., a layer or other portion of the reflector design section), or further elements or specifically layers of the structure on which the light emitted by the source 104 is incident, can receive, be part of, or define a locally processed, preferably mechanically, chemically, or electrically processed, optionally deformed (e.g., stretched) portion (e.g., a material stack portion or a material layer portion (where locally two or more, optionally all layers of the stack are deformed)), and the respective reflection characteristics for light redirection and output coupling are changed (e.g., changed implies that reflection is reduced), optionally via layer 108 or more directly without passing through layer 108 (any further). As a practical example, such an output coupling element 118 can be provided on one side of layer 108, e.g., side 108b, to the reflector design section 110 (one or more associated material layers), such that at least a portion of the light incident on element 118 is output coupled via the surface 108a of layer 108 after passing through layer 108 or potentially via the bottom surface of the structure (as shown in the figure) without entering layer 108 any further.

[0092] As previously mentioned herein, instead of or in addition to the reflector design section 110, other elements of the structure (e.g., layer 108) can locally host or define surface features or surface patterns that, for example, constitute at least a portion of the output coupling element 118, and optionally include regions that are roughened or otherwise deformed for output coupling of internally incident light.

[0093] Any of the elements 118 can be, for example, scattering / diffusing or collimating.

[0094] In the cross-sectional sketch of FIG. 5, a plurality of output coupling elements 118 are illustrated at 500, preferably comprising some preferably printed, optionally scattering elements on layer 108 having spatially varying incident densities and / or preferably dimensions including at least thickness.

[0095] Thus, in the illustrated and other usage scenarios and embodiments, the incident density, thickness, and / or one or more other dimensions of the output coupling element 118 are configured to increase with the distance from the light source(s) 104 to respectively enhance the output coupling performance with distance (e.g., at least relatively, as contrasted with the output coupling performance of closer element 118), and one or more of such output coupling elements may optionally include a fluorescent, phosphorescent, thermochromic, or photochromic material.

[0096] For completeness and to facilitate understanding of the different configurations that embodiments of the present invention may adopt in each application, FIG. 13 illustrates an alternative arrangement of the material layers included in the structure at 1300. Specifically, at least a portion of the reflector design portion 110 (e.g., one or more layers of that reflector design portion), if not as an entirety of the design portion, may be at least locally adjacent to layer 108 and / or stacked between layer 108 and, for example, film 102. However, in the sketch of FIG. 1, for example, the reflector design portion 110 is illustrated behind film 102 from the perspective of layer 108, i.e., near the outer or outside surface of the structure.

[0097] However, in some embodiments, at least a portion of the reflector design portion 110 is positioned near the substrate film 102 such that light input couples from the light source 104 into the substrate film 102 and subsequently propagates within the substrate film 102 by reflection (mirror, TIR, etc. depending on the adjacent element or specifically layer) and impinges on the output coupling region 112 or element 118, enabling the light to proceed outside the substrate film 102 and optionally through the plastic layer 108 into either a further layer(s) and / or the environment. The associated output coupling region 112 or element 118 may also, in this scenario, comprise or consist of, for example, a deformed substrate or generally a material portion, coating, or printed portion.

[0098] FIG. 4 illustrates, via a cross-sectional sketch, an embodiment 400 in which, still of course depending on the light transmission characteristics of subsequent upper (in the figure) layer(s) and element(s) in the optical path, several holes 410 are configured within the reflector design portion 110 so as to optionally enable or facilitate light output coupling out of the entire structure through the reflector design portion 110. Thus, the figure also depicts potential configurations of several further layers within the optical path for light output coupling from the structure, and at least in some places holes may also be provided in one or more of the further layers or elements 412, 414, 416, and these holes may be configured to stack with the holes of other layers (e.g., holes 410 within the reflector design portion 110) or to be laterally aligned. As shown in the figure for illustrative purposes, on the left side, the holes 410 penetrate all the layers above layer 108, while the holes 410 on the right side are present only in items 110, 412.

[0099] One or more of the holes 410 in any of items 110, 412, 414, 416 may be left unfilled (and thus, for example, may accommodate air during the manufacturing process of a multi-layer structure) or may be filled with a suitable material (e.g., if not transparent, an optically at least semi-transparent material, optionally, for example, a glass or plastic (e.g., thermoplastic) material). The filling material may, for example, be optically diffusive.

[0100] The configuration of the holes 410 within the reflector design portion 110 and optionally further layers 412, 414, 416 may be performed regularly or irregularly with respect to selected characteristics (e.g., incident density, shape, or size (e.g., diameter)). The incident density and / or the size of the holes preferably increase with the distance from the light source 104, for example, when the distance from the source-induced loss is to be compensated by the light output-coupled for more uniform illumination. At 420, a top / plan view of the reflector design portion 110 and its potential further layer(s) of the reflector design portion is depicted to visualize how the configuration of the associated holes 410 may be adapted spatially, for example, in response to the distance from the source(s) 104.

[0101] Any of the holes 410 can be created in any of the items 110, 412, 414, 416 by subtracting, including the removal of material from the item through the perforation or otherwise for the created holes 410. Also, for example, referring to molding and printing techniques, additional processes can be applied to generate a layer with several holes. The holes can have, for example, a diameter of 50 to 200 μm and / or a round shape, although other sizes and shapes are also technically feasible.

[0102] The hole 410 can be a through-hole, but in any case, as can be easily understood by those skilled in the art, the remaining material at the position of the hole, which may need to adhere to a somewhat lower material thickness locally, for example, when implementing a semi-transparent transmissive layer, the use of one or more non-through-holes is also feasible.

[0103] The hole or holes 410 can also be generally considered in many usage scenarios, for example, in relation to the description of FIG. 14 and other parts of this specification, as an embodiment of the output coupling element 118, or at least a part of the embodiment. Therefore, instead of adding holes, other features that destroy / deform the target element (for example, the target layer) or otherwise locally modify it can still be optionally utilized with the necessary modifications made according to the principles described above regarding the holes.

[0104] The item 412 preferably refers to an opaque masking element or layer, which can be printed (for example, a white print), prepared jointly (for example, co-extruded), coated, or otherwise prepared or laminated (for example, a film is laminated optionally using pressure, an adhesive, etc.) on other elements or layers (for example, the reflector design part 110).

[0105] Item 414 refers to a diffuser element or diffuser layer, which can be printed, for example, on top of other elements or layers (such as the reflector design 110), prepared jointly (such as co-extruded), coated, or prepared or laminated in some other way (such as a film being laminated optionally using pressure, adhesives, etc.).

[0106] Item 416 refers to at least one element or layer that is not transparent, or at least locally translucent, which can be printed, for example, on top of other elements or layers (such as the reflector design 110), prepared jointly (such as co-extruded), coated, or prepared or laminated in some other way (such as a film being laminated optionally using pressure, adhesives, etc.).

[0107] In addition to its aesthetic or look-and-feel type role, item 416 can have a protective function and / or an indicative function (which can include graphical indicators (such as symbols) optionally generated by printing).

[0108] As will be understood by those skilled in the art, any of the foregoing items 412, 414, 416 can be provided within the structure as a ready-made element, prepared on-site thereon, or installed together with one or more of the other added items 412, 414, 416. Items 412, 414, and / or 416 can further establish at least a portion of the items 120 or 122 discussed previously.

[0109] FIG. 6 illustrates at 600 an embodiment incorporating an embedded circuit board 602 for receiving the light source 104 and potentially further electronics, and a reflector design 110 including a parabolic reflector surface 610. In some embodiments, the circuit board 602 can be omitted and the light source 104 is provided on the substrate film 102 directly or via some other intermediate entity such as a material layer.

[0110] By providing at least a light source 104 on the circuit board 602, a lighting module including at least these two is conveniently provided on the base film 102 and attached, for example, using a conductive and / or non-conductive adhesive(s), and preferably electrically connected to the circuit design portion 106 thereon using, for example, a conductive ink or adhesive. The circuit configuration on the board 602 includes at least a local circuit design portion or sub-design portion having conductive traces or pads for connecting components (e.g., light source(s) 104) to other components or elements (e.g., control or communication circuits) in a desired pattern at least locally on the board 602.

[0111] By utilizing the circuit board 602, heat management of the remaining structure can be facilitated, and the wattage of one or more light sources 104 and / or some other high-power components included can be, for example, about 1 W or more, and even much larger. Optionally, a plurality of light sources having similar or different characteristics (wavelength / color, power, radiation direction, beam width, technology, etc.) from each other can be on the board 602.

[0112] The circuit board 602 can include at least one element selected from the group consisting of a flexible film or sheet, a rigid sheet, a rectangular sheet or film, a rounded or essentially circular sheet or film, an FR4-based circuit board, a metal core circuit board, a plastic substrate, a molded product such as an injection-molded plastic substrate, a metal substrate such as a sheet metal substrate optionally provided with at least a selectively provided electrical insulation layer, and a ceramic circuit board.

[0113] In various embodiments, circuit board 602 or, for example, substrate film 102 or some other substrate layer within a structure may receive various electrical and / or other elements (e.g., series resistors, thermistors, white solder masks, traces, antennas, sensors, electrodes (e.g., capacitive sensing electrodes), contact pads, integrated circuits, controllers, processors, memories, transceivers, driver circuits, optionally an optically transparent glove top, or other conformal coating, as well as vias (e.g., electrical vias, fluid vias, and / or thermal vias)).

[0114] Generally, circuit board 602 may be planar and preferably round, even if not essentially circular or elliptical in its general shape. The dimensions, shape, and thickness of the circuit may vary depending on the use case. Thus, for example, a rectangular shape is also possible. The thickness may be, for example, a fraction or portion of a millimeter (e.g., about 0.2 to about 0.6 mm), a millimeter, several millimeters, or more. However, the diameter may be, among other options, several millimeters, about 1 centimeter, or several centimeters. Castellations may be provided at the edges for convenient edge connections.

[0115] For example, if the circuit board 602 itself is not made of a translucent or transparent material, the circuit board 602 may be provided with at least some holes 603, and the light emitted by the light source(s) 104 and reflected from the parabolic reflector 610 can conveniently pass towards the environment and, for example, potential user(s) 113 in that environment without undesirable problems (such as shadows in the resulting light distribution). Of course, the concept of using a circuit board preferably provided with holes to house the light source 104 and / or other electronic device(s) or element(s) is also realizable in embodiments without a parabolic reflector 610. The holes 603 can be filled with a light-transmissive, non-transparent but at least translucent material, for example, by the material of that layer when forming the layer 108 by molding. In the scenario shown, for example, this material can optionally further secure the substrate 602. Of course, the base film 102 and the potential layer(s) or other element(s) thereon are preferably at least somewhat at least translucent so as to allow light transmission.

[0116] In either case, the reflector design portion 110 preferably defines, at least locally, a collimating reflector surface 610, optionally an essentially parabolic reflector, on side 108a of layer 108 that faces side 108b of the substrate film 102 that receives the light source(s) 104. The surface 610 or the reflector design portion 110 can generally be obtained, for example, by a selected coating method applied to the receiving surface, as discussed elsewhere in this specification. The parabolic receiving protrusions or "bump" surface shape on surface 108a within layer 108 can be obtained during the molding and / or printing of layer 108 by utilizing a suitable mold shape or, later, for example, by a selected subtractive or additive process. The opposing surface 108b can be kept smooth, which can be beneficial, for example, in applications that require a flat film 102 surface or, for example, the overall outer surface facing the (use) environment of the structure. The associated motivations can vary, but can include, for example, obtaining or requiring a surface treatment, functionality (e.g., touch sensing), or aesthetics that benefits from or requires a substantially flat target.

[0117] FIG. 7 illustrates another potential embodiment 700 with a parabolic reflector surface and shape. The light source(s) 104 is (are) at this time offset from the optical axis or axis of symmetry of the reflector shape and thus located laterally of the associated light aperture, and, repeating, for example, undesirable shadowing can be avoided or at least reduced on the illuminated surface on film 102. Optionally, the circuit board(s) 602 can also be utilized in this scenario (not illustrated).

[0118] FIG. 8 illustrates, at 800, an embodiment of an illumination assembly that includes a plurality of mutually different multilayer structures generally discussed herein. Two or more of such structures 801a, 801b may also be prepared together, stacked, and preferably attached (adhesives, mechanical fixing elements, or other bonding methods may be used herein) to establish a functional assembly. Alternatively, the assembly 800 may otherwise be constructed, for example, layer by layer. The assembly 800 may be configured to output couple light from each of the structures 801a, 801b to one or more surfaces of the assembly and / or onto illuminated output coupling elements 812a, 812b within and / or on the surface of the assembly via non-overlapping output coupling regions 112a, 112b, optionally at least partially. The output coupling regions 112a, 112b may be associated with characterizing a visual (e.g., printed or mask-based graphic) provided in any of the illuminated surface layer(s) 120, whereby, when one or more of the structures 801a, 801b includes several independently controllable sources 104, selectively controlling the light output from the structures 801a, 801b and optionally further included light sources 104 may be utilized to selectively illuminate the visual and generally make them visible for external perception. Thus, functionally complex illuminated / lighting structures may be constructed from combinable structural assemblies that are mutually different or similarly simpler in terms of structure, dimensions, and / or included features or associated functionality.

[0119] FIG. 9 illustrates, at 900 (cross-sectional view, see cutting line A-A) and 901 (top / planar extraction view), embodiments in which a lighting or illumination module is included in a structure and includes at least one light source 104 (six in the example shown) on a circuit board 602 (on a substrate film 102) and potentially further accepts additional electronics or optics.

[0120] The circuit board 602 may further receive one or more optical elements (e.g., light guides 908) that optionally cover one or more light sources 104 and include a light transmissive (transparent or at least translucent) material (e.g., a thermoplastic material(s)) discussed elsewhere herein. However, preferably, a wall structure 902 that is optically transmissive and optionally includes a transparent material at least in places is advantageously disposed around the circuit board 602. Further, there may preferably be an air gap or filling 909 (again, preferably including a transparent or at least translucent material) between the wall structure 902 and the light guide 908. The circuit board 602 may further include several optionally filled (semi-transparent / transparent filling) holes 603 to allow light transmission through the holes, as detailed earlier herein.

[0121] FIG. 11 illustrates, at 1100, an embodiment in which a structure includes a plurality of light sources 104 and other circuitry 105 (e.g., associated control circuit configurations).

[0122] The control circuit configuration 105 (e.g., a driver circuit, a controller chip (e.g., a microcontroller), a microprocessor, (other) integrated circuits, etc.) may optionally be at least partially integrated with one of the light sources 104 while still being electrically connected thereto, for example, via a circuit design portion 106, instead of or in addition to being separated. Preferably, the circuit configuration 105 is configured to dynamically and / or independently adjust, for example, the intensity and / or other characteristics (e.g., color distribution when applicable) of the emission of each of at least two of the light sources 104. However, also, connection control may be enabled, additionally or alternatively, for two or more light sources 104. However, the circuit configuration 105 may be functionally connected to an external circuit configuration, at least via wiring and connectors(s), e.g., for power data and / or power transmission.

[0123] In the case of a light source 104 such as an LED, for example, PWM (pulse width modulation) or current control can be utilized for that purpose. The control circuit configuration 105 can be included in the structure even when only a single light source 104 is present.

[0124] FIG. 12 illustrates an embodiment including a bent portion in layer 108 (at 1200 through a cross-sectional top view, at 1202 a skeletal view in the A-A direction, and at 1204 a cross-sectional view along B-B).

[0125] At least layer 108 actually optionally defines a bent portion having a bending angle of about 10 degrees or more, potentially about 30 degrees or 45 degrees or more, and at least a portion of the reflector design portion 110 is essentially located on layer 108 at its outer and / or inner periphery. Accordingly, the reflective portions 110a, 110b, 110c, 110d are illustrated in the figure accordingly.

[0126] By utilizing the reflector design portion 110, bent portions and other similar, more complex shapes can be implemented in layer 108 and the general structure without essentially losing optical efficiency. In addition to the reflector design portion 110, a TIR-type interface and associated activating elements or layers (e.g., layer 114) can be included in the structure to maximize light guiding efficiency as will be discussed more thoroughly elsewhere in this specification.

[0127] FIG. 14 further illustrates at 1400 different options and configurations for light output coupling in connection with various embodiments of the present invention, some of which are also contemplated in connection with the descriptions of other figures attached hereto.

[0128] Accordingly, some output coupling elements 118, such as specific shapes and / or material layers for controlling or enhancing output coupling, can be provided, for example, on the surface of layer 108 as if embedded, or subsequent to layer 108 (from the perspective of the optical path), in the optical path from the light source 104 out of the structure.

[0129] Item 1412 refers to a type of output coupling element 118 that includes features for enhancing optical output coupling, for example, being part of the reflector design section 110 or having adjacent material layers and / or other output coupling features within the structure.

[0130] Accordingly, the output coupling element 118 including 1412 Optionally, a locally recessed or protruding surface (e.g., the surface of layer 108) that defines one or more, for example, prism-shaped recesses or protrusion shapes 1418, and an element, or specifically, a layer 1412a of an optically at least translucent material if not transparent, having a refractive index lower than that of an optically subsequent adjacent material such as air, and / or a perforated, open, or otherwise locally thinned or through-cut layer of an opaque material, and an element, or specifically, a layer 1412b having holes (without filler or with a translucent / transparent filler) in a carrier material (which may be opaque), and an element, or specifically, an alternating layer 1412c of a higher refractive index material 1414 and a lower refractive index material 1416, and an adhesive or adhesion promoting primer, preferably of a type that is substantially optically transparent or at least translucent (which can act as a cladding material).

[0131] FIG. 15 illustrates, in addition to illumination, an embodiment 1500 of a multilayer structure (or an assembly of structures) that further incorporates complementary functionality (e.g., touch or gesture sensing (optionally non-contact)). The complementary functionality can be provided, for example, by additional layers and other elements disposed on the multilayer structure including the light source(s) 104 and further optical features, either as an integrated structure or layer by layer.

[0132] For example, a diffuser element 414 (e.g., a film or coating) can be provided.

[0133] Preferably, at least a translucent or substantially transparent, substantially planar electrode 418 can be provided, optionally printed on the diffuser 414 or other adjacent element or layer, such as 416b. The electrode 418 can be electrically or electromagnetically connected to other circuit configurations 105, such as drive or sensing circuit configurations, positioned within and / or external to the structure. For that purpose, electrical wiring or wireless connectivity can be applied.

[0134] As previously mentioned herein, item 416 refers to at least one element or layer that is non-transparent or at least locally translucent, which can be printed, for example, on other elements or layers (such as reflector design 110), prepared jointly (such as co-extruded), coated, or otherwise prepared or laminated (such as a film can be laminated, optionally using pressure, adhesives, etc.). For example, item 416 can thereby include, for example, printed graphic 416a, optionally laterally adjacent to electrode 418, and / or optionally translucent, non-transparent type protective outer surface element 416b, which still preferably allows an externally perceivable backlight (i.e., not completely opaque). Item 416 can include plastics, metals or woods, leather, or other biocompatible materials, inks, fabrics, etc. (perforated, thinned, or otherwise processed, configured, or selected to allow at least local translucency / transparency).

[0135] FIG. 10 shows at 1000 a flow diagram of an embodiment of a method for manufacturing an integrated optical functional multi-layer structure according to the present invention. Applicable manufacturing processes and related characteristics regarding the components and materials possible in various embodiments of the structure have already been discussed earlier herein, and these discussions will not be unnecessarily repeated herein to clarify the overall, already lengthy method description. However, one of ordinary skill in the art can return to the previous paragraph to also find valuable details regarding applicable manufacturing methods and considerations, but will understand the fact that the same also applies in the reverse direction regarding the structural or functional details potentially included in the multi-layer structure.

[0136] At the start of the method for manufacturing the multi-layer structure, a startup stage 1002 can be executed. During startup, necessary preparation tasks (e.g., selection, acquisition, calibration, and other configuration tasks of materials, components, and tools) can occur. Special attention must be paid to the individual elements and material selection working together to withstand the selected manufacturing and installation processes, which will of course preferably be pre-checked, for example, based on the specifications of the manufacturing process and the data sheets of the components, or by examining and testing the manufactured prototypes in detail. Thus, among other things, the equipment used (e.g., equipment providing molding, IMD (in-mold decoration), lamination, connection, (thermal) forming, electronic device assembly, cutting, perforation, printing, and / or measurement (e.g., desired optical measurement)) can be brought up to an operating state at this stage.

[0137] In 1004, for example, obtain at least one, preferably flexible, substrate film of plastic or other material for housing a light source(s) and potentially other electronic devices. The substrate film can initially be substantially planar or can be curved, for example. The substrate film can be at least mainly of electrically substantially insulating material(s). Off-the-shelf elements (e.g., rolls or sheets of plastic film) can be obtained for use as the substrate material. In some embodiments, the substrate film itself can initially be manufactured in-house by molding from selected starting material(s) using a mold or forming device or other method. Optionally, the substrate film can be further processed at this stage. For example, holes, notches, indentations, cutouts, etc. can be provided.

[0138] Item 1014 generally refers to the provision of a reflector design portion. As will be understood by those skilled in the art based on the prior intentions of this specification, the reflector design portion or a part thereof (s) can be provided in different method steps of the structure, or by on-site manufacturing, depending not only on the configuration of the reflector design portion itself, but also on other elements within the structure and their configurations. However, since the reflector design portion or a part thereof can be provided to be immediately integrated with further elements (e.g., films or generally material layers), in some embodiments, item 1014 can be integrated with other items. For example, a substrate for an electronic device and a reflective structure or layer(s) for mounting, for example, a multi-layer type of combined element can already be obtained in 1004. In some embodiments, at least a part of the reflector design portion can be manufactured or at least attached to a light-transmissive plastic layer (or an assembly including a transmissive layer and potentially further layer(s)), which itself can optionally be of a pre-fabricated or separately fabricated type, instead of being molded directly on-site, for example, on a substrate film. When providing a pre-fabricated plastic layer on the substrate film, the plastic layer can already include at least a part of the reflector design portion configured thereon (e.g., refer to item 110e in 150 of FIG. 1 for illustration).

[0139] Thus, the curved arrows indicate, by way of non-exhaustive example, that the order of the indicated method items may be reversed and / or items may be combined or further divided, depending on the particular embodiment at issue.

[0140] The reflector design and associated material layer(s) may generally be provided by, for example, printing, coating, lamination or molding. Furthermore, the process may include the formation of various features (e.g., holes in the reflector material) and potentially filling them with other materials or providing output coupling elements as discussed in more detail herein above. The reflector design may, for example, optionally comprise one or more material layers, optionally comprising a stack of material layers and / or layers of electrically conductive and / or metallic materials. Furthermore, the reflector design (e.g., its layer(s)) may include or be arranged with further elements (e.g., openings (holes)). The reflector design is optionally, and in the most common use case, configured to reflect light emitted by at least one light source included in the structure to be manufactured and incident on the reflector design, towards the plastic layer 108 provided in item 1012, optionally mainly specularly.

[0141] At least a portion of the reflector design (e.g., one or more layers) may be provided on the substrate film(s) prior to providing the plastic layer. See item 1014A. Alternatively or additionally, at least a portion of the reflector design may be provided after or upon disposing the plastic layer on the substrate film or between the substrate film and another film, potentially a further substrate film on the other side of the established intermediate plastic layer 108. See item 1014B.

[0142] However, the two unidirectional dotted arrows shown further indicate additional or alternative process options for providing a reflector design portion 1014 essentially between items 1008 and 1010, and / or between items 1010 and 1012, or in conjunction with any of the three aforementioned items.

[0143] In 1006, for example, several electrically conductive and / or optionally thermally conductive elements that define various conductor lines (traces), sensing elements (e.g., electrodes), and / or contact areas (e.g., pads) to construct a circuit design section are provided on one or more of the substrate film(s), preferably by one or more additional techniques such as printed electronics technology or 3D printing. Thus, the circuit design section may include several circuits or circuit sub-design sections on different layers of the overall structure and is optionally connected, for example, via the edges of the structure or via conductive wiring around the edges. For example, screen, inkjet, flexographic, gravure, or offset lithographic printing can be applied by a suitable printing device or a device for generating at least a portion of the circuit design section. In some cases, subtractive or semi-additive processes may be utilized. For example, further actions to modify the substrate film(s) involving printing or generally providing graphics, visual indicators, optical elements (e.g., masks or output coupling elements), holes / fills, etc. may occur here, for example, if not performed at 1004.

[0144] In various embodiments, the electrically conductive and optionally thermally conductive elements (traces, pads, connection elements, electrodes, etc.) may include at least one material selected from the group consisting of conductive ink, conductive nanoparticle ink, copper, steel, iron, tin, aluminum, silver, gold, platinum, conductive adhesive, carbon fiber, graphene, alloys, silver alloys, zinc, brass, titanium, solder, and any of their components. The conductive material used can be optically opaque, translucent, and / or transparent at a desired wavelength (e.g., at least a portion of visible light) to, for example, mask, reflect from, absorb in, or pass through radiation (e.g., visible light). This aspect is also described elsewhere in this specification. As an actual example of a realizable conductive material, for example, Dupont (trademark) ME602 or ME603 conductive ink can be utilized.

[0145] At 1008, additional circuit components (e.g., one or more typically off-the-shelf components including electronic components (e.g., various SMDs)) are attached to the contact areas on the film(s), e.g., by solder and / or an adhesive. For example, as previously contemplated herein, selected technology and packaged light source(s) (e.g., LED) may be provided here, and, e.g., depending on the embodiment, different elements of control and / or drive electronics, communication, sensing, connection (e.g., connector), reception (circuit board(s), carrier(s), etc.), and / or power supply (e.g., battery) may be provided.

[0146] For example, a suitable pick-and-place or other mounting device may be utilized for this purpose. Alternatively or additionally, printed electronics technology may be applied to actually fabricate at least a portion of the components (e.g., OLED (organic LED)) directly on the film(s) in situ. Thus, as will be understood by those skilled in the art, the execution of items 1006 and 1008 to provide the desired circuit configuration in the multilayer structure may overlap in time. However, the components prepared or installed herein may also include various optical elements such as lenses, reflectors, diffusers, masks, filters, etc.

[0147] Non-conductive and / or conductive adhesives may be utilized to fix the components onto the carrier. In some embodiments, mechanical fixation is implemented or at least enhanced by a non-conductive adhesive material, while solder or other highly electrically conductive (but not so much in the adhesive type) materials are used for electrical connection.

[0148] The selected elements may be subjected to further processing such as encapsulation (see, e.g., the comments related to the overcoat provided previously herein).

[0149] Item 1009 refers, in particular, to the preparation and attachment of one or more at least partially pre-prepared modules (e.g., the aforementioned lighting module incorporating at least one light source 104 and, for example, a circuit board 602) or other "sub-assemblies". A "sub-assembly" can incorporate what was initially provided on a separate secondary substrate (e.g., a circuit board) with the following. A circuit design section and electronic devices, e.g., several light sources (plural), ICs (plural), and / or various other elements or components, e.g., optical or structural ones (e.g., wall structures, diffusers, lenses, carrier elements, etc.). This is also contemplated in detail earlier in this specification.

[0150] Accordingly, at least some of the electronic devices and / or other elements of the final multilayer structure may be conveniently provided to the substrate film(s) via fully or partially pre-manufactured module(s) or sub-assemblies. Optionally, the relevant module or sub-assembly may be at least partially overmolded or generally covered with a protective material such as a plastic layer before attachment to the primary substrate.

[0151] For example, adhesives, pressure, and / or heat can be used for the mechanical bonding of the module or sub-assembly to the primary (receiving) substrate. Solder, wiring, and conductive inks are examples of applicable options for providing electrical and / or thermal connections between the elements of the module or sub-assembly and the remaining electrical and / or thermal elements on the primary substrate. Item 1205 can also be performed, for example, on Item 1204 or 1208. Accordingly, the illustrated positions are only mainly typical.

[0152] Furthermore, the circuit configuration generally included in the multilayer structure, for example, on a substrate film, may include at least one component or element selected from the group consisting of electronic components, electromechanical components, electro-optical components, radiation-emitting components, light-emitting components, LEDs (light-emitting diodes), OLEDs (organic LEDs), side-shooting LEDs or other light sources, top-shooting LEDs or other light sources, bottom-shooting LEDs or other light sources, radiation-detecting components, light-detecting or photosensitive components, photodiodes, phototransistors, photovoltaic devices, sensors, micro-mechanical components, switches, touch switches, touch panels, proximity switches, touch sensors, air sensors, temperature sensors, pressure sensors, moisture sensors, gas sensors, proximity sensors, capacitive switches, capacitance sensors, projected capacitance sensors or switches, single-electrode capacitive switches or sensors, capacitive buttons, multi-electrode capacitive switches or sensors, self-capacitance sensors, mutual-capacitance sensors, inductive sensors, sensor electrodes, micro-mechanical components, UI elements, user input elements, vibration elements, acoustic generating elements, communication elements, transmitters, receivers, transceivers, antennas, infrared (IR) receivers or transmitters, wireless communication elements, wireless tags, radio tags, tag readers, data processing elements, microprocessors, microcontrollers, digital signal processors, signal processors, programmable logic chips, ASICs (application-specific integrated circuits), data storage device elements, and electronic sub-assemblies.

[0153] In some embodiments, prior to item 1012, or if item 1012 is present, the substrate film(s) that optionally already contain an electronic device (e.g., at least a portion of a circuit design section and / or a light source or other circuit configuration) may optionally be formed (1010) using, for example, thermoforming or cold forming to exhibit a desired shape (e.g., at least locally a three-dimensional (substantially non-planar) shape). An applicable forming device (e.g., a thermoforming machine) may be utilized for this purpose. Additionally or alternatively, if the already established multilayer stack is designed to withstand such processing, at least some of the forming may occur after the shaping.

[0154] In 1012, at least one light transmissive plastic layer, or generally layer 108, is provided on or preferably over a light source on a first side of a substrate film, or is directly generated, and the plastic layer at least laterally surrounds the light source(s) or is near the light source(s) (see, e.g., FIG. 9), and optionally at least partially covers the light source(s) (see, e.g., FIG. 1). In some embodiments, layer 108, which is at least partially prefabricated (e.g., preformed), can be utilized in addition to or instead of the in-situ generation of layer 108 from raw material(s) on the first side of the substrate, and layer 108 can optionally (pre) be configured with several features 103 (e.g., holes (blind and / or through holes)) for conveniently accommodating at least a part of the light source(s) and / or other elements (e.g., (other) electronic components). The features (e.g., indentations or holes) can be configured in layer 108 by subtractive techniques (plural) such as cutting (curving, milling, drilling, or other machining processes). Alternatively or additionally, the features can be prepared directly or essentially within layer 108 during its (in-situ) manufacture, e.g., its shaping, without the need to utilize subtractive techniques (plural) for later removing layer 108 material to provide the features. However, as previously mentioned herein, pre-hub embodiments of layer 108 can be provided, e.g., by lamination, printing, or coating, of at least a part of a reflector design (see also item 110e of 150 in FIG. 1 for example), before connecting layer 108 with the remainder of a future overall multi-layer structure such as substrate film 102.

[0155] Preferably, the plurality of layers provided, which preferably include a plastic layer or, in some embodiments, preferably a thermoplastic or optionally a thermosetting layer(s) in some embodiments, are thus laminated onto a substrate(s) or manufactured in-situ through molding such as injection molding. Desired portions may be left transparent, for example, considering a cover portion of a writing module or other module intended to receive an exchangeable or generally accessible (e.g., inspectable or reprogrammable) component, or the material may be made transparent later by mechanical or chemical treatment. Such a module may also include a (removable) movable cover portion to provide access to its interior.

[0156] The molding material(s) may be provided using multiple molding steps or shots or via a single step. The molding material may optionally flow, for example, through a substrate film, from one side to the opposite side thereof, through holes provided therein, or through the substrate material itself (e.g., a thinned portion / thinner portion). The molding material(s) may be at least mainly electrically insulating, and in many embodiments is preferably at least mainly electrically insulating. An adhesion promoting material may be utilized on a film near the molded plastic.

[0157] In practice, at least one substrate film on which some features (e.g., a circuit configuration including light source(s), module(s), further optical features, etc.) are already provided can be used as an insert in an injection molding process applying at least one molding machine. When two films are used, both of them can be inserted into their respective molding die halves such that a plastic layer is injected at least between them. Alternatively, a second film can be attached later to the assembly of the first film and the plastic layer, for example, by a suitable lamination technique using an adhesive between them.

[0158] Some of the optical elements (e.g., lens structures, optical output coupling elements or diffusers) contemplated earlier in this specification can be established at least partially during molding from either the thermoplastic material used and / or the film inserts with suitable molds.

[0159] Instead of or in addition to molding, for example (3D) printing can be utilized for the production of plastic layers.

[0160] Regarding the overall thickness resulting from the obtained and stacked multi-layer structure, the thickness depends on the materials used and the associated minimum material thickness that provides, for example, the required strength considering manufacturing and subsequent use. These aspects should be considered on a case-by-case basis. For example, the overall thickness of the structure can be on the order of a few millimeters as discussed elsewhere in this specification, but considerably thicker or thinner embodiments are also feasible.

[0161] In some embodiments, materials other than plastic(s) can be utilized within layer 108, for example, with reference to glass.

[0162] Item 1016 refers to some potential additional tasks (e.g., post-processing and installation work). Further layers, single-layer or multi-layer films, or generally additional features can be added to the multi-layer structure by, for example, heat, adhesives, or pressure, or suitable coating (e.g., deposition) procedures, without forgetting molding, printing, lamination, other possible positioning or fixing techniques, and subtractive techniques (e.g., laser machining). The layers can also be of a protective, indicative, and / or aesthetic value (graphic, color, figure, text, numerical data, etc.) and can include, instead of or in addition to plastic, for example, textile, leather, or rubber materials.

[0163] Additional elements (e.g., electronic devices, modules, components inside or parts of modules, and / or optical components) can be installed and fixed, for example, on the outer surface(s) of an existing structure (e.g., the outer surface of a film or a formed layer included according to an embodiment). For example, an optical feature (e.g., a lens structure or a diffuser) can be constructed or completed here by treating a thermoplastic layer or any additional layer or element thereon by adding material thereto or removing material therefrom (laser processing being one option).

[0164] Features potentially present in the multilayer structure can actually include various features discussed previously (e.g., diffusers, output coupling elements, optical masks, holes, graphics, protective and / or aesthetic (and / or tactilely preferred) films or layers). Such features can be provided at this stage or between items of any of the methods previously mentioned, depending on their location and the general configuration in the resulting structure as well as other features included, as understood by those skilled in the art.

[0165] As discussed previously herein, some features, such as output coupling elements integrally or monolithically formed within a target material, can be provided by modifying the target material (e.g., the material of a substrate film, additional films (e.g., 114, 116, 120, or 122), and / or a reflector design part) through a deformation optionally involving material stretching. For example, mechanical pressure introduced by pressing can be used for that purpose. Mechanical pressure-induced deformations (e.g., stretching, breaking, and / or undulating of materials) occurring inside the structure or on a previously defined back side of the structure (e.g., not visible during use) do not have to have any visually perceptible effect from outside the structure.

[0166] Furthermore, as discussed previously herein, the features potentially provided to the structure by the method, optionally as a coextruded film layer or through coating, printing, or molding, are at least one additional material layer having a lower refractive index than the plastic layer or include it, and the at least one additional material layer and the plastic layer are optionally physically adjacent and optically connected. Thus, at least a portion of the light emitted by at least one light source, propagated within the plastic layer, and incident on at least one additional material layer is reflected (returned) within the plastic layer or is essentially retained therein by total internal reflection, provided that it exceeds the relevant critical angle. The at least one additional material layer may optionally include a thermoplastic material or an optically transparent adhesive material or, for example, a primer.

[0167] Still further, the method - laminating two or more layers included in the multilayer structure together by a pressure-sensitive adhesive, an optically transparent adhesive, a solvent, ink, heat, pressure, or hot melt; - additionally generating (e.g., printing or 3D printing) at least one layer (e.g., a plastic layer, a layer of at least one reflective layer, an additional material layer, an optical waveguide, an optical output coupling element, a diffuser, and / or other optical functional elements); - optionally providing a top-emitting light source, which is an LED, on the side of the substrate film where the top-emitting light source is disposed such that its contact pads face in a direction transverse to the surface of the substrate film and are in contact with a conductive adhesive also provided (e.g., dispensed) on the substrate film, and the contact pads are electrically connected to a circuit design portion, the conductive adhesive being at least partially surrounded on the substrate film by a structural adhesive provided on the substrate film (this is a realizable way to operably convert the top-emitting source to a side-emitting one).

[0168] Furthermore, the method may include interconnecting a plurality of modules together to construct a structure, and optionally or each module advantageously - one or more light sources, and - at least a portion of a substrate film, and - optionally, at least one of a circuit design portion including a light source driving circuit and / or capacitive sensing electrodes, or comprises at least a portion of a layer of a reflector design portion and / or at least a portion of a plastic layer.

[0169] For example, an electronic device and / or a lighting module (including, for example, a light source, a circuit design portion, and optionally additional circuits such as a control circuit) may be manufactured, and for example, there may be no electronic device, but some simpler modules including, for example, a light transmissive and / or reflective material or structure may be produced and then connected together.

[0170] Any of the modules may span several layers of a multilayer structure. In addition to being able to construct a multilayer structure at least partially from modules of different characteristics, as contemplated earlier elsewhere in this specification, several optionally mutually different or similar multilayer structures may be connected to establish a larger, more functionally versatile assembly.

[0171] Optionally, when complementary functionality for the structure (e.g., the aforementioned capacitive sensing of touch or touchless gestures) is implemented, the sensing electrodes of the circuit configuration can be configured (sized, positioned, etc.) with additional elements and layers, for example, with reference to FIG. 15 and the related text, such that their sensing regions or volumes defined by the relevant electric or electromagnetic fields are positioned as required, thereby covering, for example, regions on the upper surface of the structure, and / or other regions that should be sensitive to touch (and / or in some embodiments touchless gestures) or other sensing targets. This type of configuration can be achieved or implemented, for example, by utilizing simulation or measurement activities. The necessary features can be built, for example, layer by layer onto an existing structure, or installed at least in part as a prefabricated stack.

[0172] If a connector is provided, the connector of the multilayer structure or assembly can be connected to a desired external connection element (e.g., an external device, system, or structure, such as the external connector of a receiving device). For example, these two connectors can together form a plug and socket type of connection and interface. In this specification, the multilayer structure can also generally be positioned and attached to a larger assembly (e.g., an electronic receiving device, optionally a personal communication device, a computer, a household device, an industrial device, or a vehicle in embodiments where the multilayer structure establishes a part of the exterior or interior of a vehicle, such as a dashboard or panel).

[0173] In 1018, the execution of the method ends.

[0174] The scope of the present invention is determined by the appended claims and their equivalents. Those skilled in the art will understand that the disclosed embodiments are constructed for illustrative purposes only and that other configurations applying many of the above principles can be readily prepared to best suit each potential use scenario.

Claims

1. An integrated optical function multilayer structure (100, 200, 300, 400, 500, 600, 700, 800, 900, 1100, 1300, 1400, 1500) suitable for dynamic lighting of large areas, comprising: A flexible, optionally 3D formable and thermoplastic substrate film (102, 102a) arranged together with a circuit design part (106) having at least some electrical conductors; A plurality of top emission light sources (104a), bottom-mounted light sources (104) provided on the first side of the substrate film so as to internally illuminate at least a part of the structure (104a) for external perception via associated output coupling regions (112, 112a, 112b, 112c); For each light source of the plurality of light sources, optionally at least partially shared; An optically transparent plastic layer (108), optionally of a thermoplastic material, provided on the first side of the substrate film, the plastic layer surrounding or adjacent to the light source at least laterally and optionally at least partially covering it, and the substrate film optionally comprising the same material or material layer as that of the plastic layer, or having at least the same or lower refractive index as that of the plastic layer, an optically transparent plastic layer (108); A reflector design part (110) having at least one material layer (110b; 110c) provided at least on the light source, configured to reflect light emitted by the light source and incident on the reflector layer towards the plastic layer, optionally mainly specularly, a structure in which a reflector design part (110) exists.

2. The structure according to claim 1, wherein the reflectivity of the reflector design part is at least locally about 75%, more preferably at least about 90%, and most preferably at least about 95% at the selected, optionally essentially all visible wavelengths of light.

3. (300, 900) The reflector design part (110, 110a, 110b) is preferably configured on a direct optical emission path from the light source so as to be more aligned with the side surface of the plastic layer that substantially crosses the surface normal of the plastic layer, and to reflect the light that is input-coupled into the plastic layer from at least one of the plurality of light sources and incident on the reflector design part. The structure according to claim 1 or claim 2.

4. The reflector design part reflects and guides the light emitted by at least one of the plurality of light sources and incident on the reflector design part, and outputs and couples the light from at least the plastic layer or the entire structure. The structure according to any one of claims 1 to 3, which is configured in the plastic layer so as to propagate toward the output coupling region (112, 112a, 112b, 112c) and optionally toward the associated surface normal of the plastic layer.

5. The reflector design part (110, 110a, 110b, 110c) at least locally includes a material stack of a plurality of superposed material layers having at least two mutually different refractive indexes, which optionally defines a Bragg mirror. The structure according to any one of claims 1 to 4.

6. The reflector design part is - an electrically conductive material, - a metal, optionally metal particles, and further optionally a metal provided on the upper part or inside of the base film or a further film or layer included in the structure. - a thin film coating, optionally a PVD (physical vapor deposition) coating, and - The structure according to any one of claims 1 to 5, including at least one element selected from the group consisting of ink or paint.

7. One or more parts of the reflector design part (110) are equal to (110a), oppose (110b), and / or cross (110c) the side facing the first side of the base film that receives at least one of the plurality of light sources (104). The structure according to any one of claims 1 to 6, which is located on the side of the plastic layer.

8. Comprising at least one additional, optionally printed material layer (114) that is optionally stacked and preferably in contact with the reflector design part (110, 110a, 110b, 110c), the at least one additional material layer having a lower refractive index than the plastic layer, the at least one additional material layer and the plastic layer being optically connected, and optionally physically adjacent, so as to redirect at least a part of the light emitted by at least one of the plurality of light sources, propagated within the plastic layer, and incident on the at least one additional material layer back into the plastic layer by total internal reflection, the at least one additional material layer optionally comprising or consisting of an optically clear adhesive or primer, the structure according to any one of claims 1 to 7.

9. The layer of the at least one additional material layer (114) is a layer of the optionally coextruded multilayer type of the substrate film (102a) that also comprises a receiving layer (102) for the light source (104), the structure according to claim 8.

10. Comprising an intermediate layer (116) between the plastic layer (108) and the layer of the at least one additional material layer (114), the intermediate layer preferably comprising the same light-transmissive material as the light-transmissive material of the plastic layer or having a refractive index at least similar to that of the plastic layer, the layer of the intermediate layer and the at least one additional material layer optionally being a composition of a multilayer film (116a), and further optionally, preferably a coextruded multilayer film and / or a substrate-type multilayer film, for receiving some elements such as an optical element, a circuit design part, or one or more electronic components, laminated on the plastic layer, the structure according to claim 8 or 9.

11. At least a part of the reflector design part (110, 110a, 110b) and the at least one additional material layer (114) are on the same side, opposite sides, or both sides of the plastic layer (108) with respect to each other, the structure according to any one of claims 8 to 10.

12. The layer of the reflector design part (110), the layer of the at least one further material layer (114), and the plastic layer (108) are at least locally superposed with respect to their materials such that the material of the layer of the at least one further material layer is stacked between the material of the layer of the reflector design part and the plastic layer. The structure according to any one of claims 8 to 11.

13. (1200) The plastic layer defines a bent portion having an optionally bent angle of about 10 degrees or more, and at least a part of the reflector design part is essentially located on the plastic layer at its outer circumference and / or inner circumference. The structure according to any one of claims 1 to 12.

14. (400, 420, 1400, 1412, 1412b) At least a part of the reflector design part is light transmissive to allow the incident light to propagate through for output coupling, and further optionally has some holes (410) such as perforations, optionally provided with a diffusive filling, and the incident density and / or size of the holes preferably increase with the distance from at least one of the plurality of light sources. The structure according to any one of claims 1 to 13.

15. Preferably along the optical path from one or more of the plurality of light sources out of the structure, ・Diffuser (414), ・Optionally printed on the diffuser, preferably at least translucent or substantially transparent, essentially planar electrode (418), ・Optionally printed graphics (416, 416a) laterally adjacent to the electrode, ・Comprising at least one element selected from the group consisting of optionally translucent, non - transparent type protective outer surface elements (416, 416b) (1500). The structure according to any one of claims 1 to 14.

16. (600, 700) The reflector design part preferably has at least one collimating reflector surface (610) on the side of the plastic layer facing the side facing the first side of the base film that receives at least one of the plurality of light sources, and optionally at least locally defines an essentially parabolic reflector. The structure according to any one of claims 1 to 15, wherein at least one of the plurality of light sources (104) is preferably centered (600) or off-center (700) with respect to the axis of symmetry of the collimating reflector surface.

17. The structure according to any one of claims 1 to 16, wherein the reflector design part is locally treated, preferably mechanically, chemically or electrically, and has modified reflection characteristics for redirecting and output-coupling (118) light, optionally through the plastic layer, and includes an optionally deformed (e.g., stretched) part, such as a material stack part or a material layer part.

18. The structure according to any one of claims 1 to 17, wherein the plastic layer optionally comprises a roughened or deformed region for output-coupling (118) light incident therein, and locally defines a surface feature or a surface pattern.

19. On the plastic layer, there are provided (500) several preferably printed, optionally scattering output-coupling elements (118) having spatially varying incident densities and / or dimensions preferably including at least thickness, The structure according to any one of claims 1 to 18, wherein the incident density, thickness, and / or one or more other dimensions of the output-coupling elements preferably increase with the distance from at least one of the plurality of light sources so as to enhance output-coupling with the distance, and one or more of the several output-coupling elements optionally contain a fluorescent, phosphorescent, thermochromic, or photochromic material.

20. The structure according to any one of claims 1 to 19, comprising an overcoat (124) at least partially covering the light-emitting part of at least one of the plurality of light sources, and the overcoat layer optionally includes a light-transmissive material having a higher refractive index than the plastic layer.

21. Comprising a light output coupling region (112, 112a, 112b, 112c) on the plastic layer (200), at least one light source of the plurality of light sources being preferably located between at least a part (110c) of the reflector design portion aligned substantially perpendicular to the light output coupling region and the light output coupling region, and the at least one light source of the plurality of light sources being aligned towards the at least a part (110c) of the reflector design portion with respect to its primary emission direction, the structure according to any one of claims 1 to 20.

22. Comprising a circuit board (602) provided on the substrate film for receiving at least one light source of the plurality of light sources (600, 900), the circuit board optionally further receiving a light guide (908) of a light transmissive material covering the at least one light source, a wall structure (902) of a light transmissive and optionally clear material disposed around the circuit board, and / or an air gap or filling (909) preferably between the wall structure and the light guide, and / or the circuit board optionally further comprising several holes (603) for enabling light transmission therethrough, the structure according to any one of claims 1 to 21.

23. In the optical path from at least one light source of the plurality of light sources towards the outside of the structure, and on the surface or subsequent surface of the plastic layer, an optical print layer, a coating or film comprising a material (416, 416a, 416b) opaque or translucent to light emitted by at least one light source of several of the light sources, an optical mask (412), optionally a recessed surface such as the surface of the plastic layer defining one or more prism recessed shapes (118; 1418), a layer of an optically at least translucent material if not a transparent material having a refractive index lower than that of an optically subsequent adjacent material such as air, a layer (1412, 1412c) in which a high refractive index material (1414) and a low refractive index material (1416) alternate, a layer of an opaque material perforated, holed, or locally thinned or through-cut in some other way, and at least one element selected from the group consisting of an adhesion promoting primer, the structure according to any one of claims 1 to 22.

24. The structure according to any one of claims 1 to 23, wherein at least one of the plurality of light sources is a semiconductor, a packaged semiconductor, a chip-on-board semiconductor, a bare chip, an electroluminescent or a printed type light source, preferably an LED, optionally including a multicolor LED such as RGB (red - green - blue).

25. The structure according to any one of claims 1 to 24, optionally comprising a control circuit configuration (105) that is at least partially integral with any one of the plurality of light sources (104) for dynamically and independently adjusting the emission intensity of at least two of the plurality of light sources.

26. The structure according to any one of claims 1 to 25, wherein the light - transmissive plastic layer (108) defines internal holes (103), optionally a plurality of holes, for accommodating at least a portion of at least one of the plurality of light sources, and each of the holes is configured to accommodate one or more light sources.

27. The structure according to any one of claims 1 to 26, wherein at least one of the several electrical conductors (106a) of the circuit design part (106) faces away from the light - transmissive plastic layer (108) and is preferably at least electrically, optionally physically, connected to the light source (104) and is positioned partially or essentially on the side of the reflector design part.

28. The structure according to any one of claims 1 to 27, wherein at least a portion (110e) of the reflector design part (110) is located between the light - transmissive plastic layer (108) and the substrate film (102) and is optionally formed or laminated on the light - transmissive plastic layer (108).

29. A multi - source multi - target illumination assembly (800) comprising two or more structures (801a, 801b) according to any one of the preceding claims, stacked together, preferably attached, and configured to output - couple the light from each of the two or more structures through their respective at least partially non - overlapping output coupling regions (112a, 112b) onto one or more surfaces of the assembly and / or onto illuminated output coupling elements (118; 812a, 812b) within or on the assembly.

30. A method (1000) for manufacturing an integrated optical functional multilayer structure, comprising: obtaining a substrate film (102) that is flexible, optionally 3D formable, and thermoplastic, and optionally a multilayer film, wherein the substrate film is preferably provided with a circuit design part comprising at least some electrically conductive conductors that are additionally generated and optionally printed on the substrate film (1006) (1004); arranging a plurality of top-emitting light sources (104a) and bottom-mounted light sources (104) on a first side of the substrate film (1008, 1009); for each of the plurality of light sources, providing, optionally, a light-transmissive plastic layer that is at least partially shared on the first side of the substrate film, optionally via shaping, lamination, or 3D printing (1012), wherein the plastic layer surrounds or is adjacent to the light source at least laterally and also optionally at least partially covers it; optionally, a reflector design part is provided (1014, 1014A, 1014B) that comprises a stack of material layers and / or at least one material layer comprising a layer of an electrically conductive material and / or a metallic material, which optionally includes printing, coating, lamination, or shaping, and the reflector design part is configured to reflect the light emitted by the plurality of light sources and incident on the reflector design part, preferably towards the plastic layer, optionally mainly specularly.

31. Optionally, providing at least one additional material layer as a co-extruded film layer or through coating, printing, or molding, wherein the at least one additional material layer has a lower refractive index than the plastic layer, such that the at least one additional material layer and the plastic layer are optically connected so as to redirect at least a portion of the light emitted by at least one of the plurality of light sources, propagated within the plastic layer, and incident on the at least one additional material layer back into the plastic layer by total internal reflection, and optionally physically adjacent, and wherein the at least one additional material layer optionally comprises a thermoplastic material or an optically clear adhesive material or primer, the method of claim 30.

32. Laminating together two or more layers comprised in the multilayer structure by means of a pressure-sensitive adhesive, an optically clear adhesive, a solvent, an ink, heat, pressure, or a hot melt. Additionally generating (e.g., printing or 3D printing) at least one layer such as the plastic layer, at least one layer of a reflective layer, an additional material layer, a light guide, a light output coupling element, a diffuser, and / or other optical functional elements, and Providing on the top-emitting light source side of the substrate film at least one step selected from the group consisting of providing a top-emitting light source of the plurality of light sources, optionally an LED, the contact pads of which face in a direction transverse to the surface of the substrate film and contact a conductive adhesive provided on the substrate film, and electrically connecting the contact pads to the circuit design portion, wherein the conductive adhesive is at least partially surrounded on the substrate film by a structural adhesive provided on the substrate film, the method of claim 30 or 31.

33. Including interconnecting a plurality of modules together, each module comprising One or more light sources of the plurality of light sources, At least a portion of the substrate film, and Optionally, at least one of a light source driving circuit and / or the circuit design portion comprising capacitive sensing electrodes, Or Comprising at least a portion of a layer of the reflector design portion and / or at least a portion of the plastic layer, the method of any one of claims 27-29.

34. The method according to any one of claims 30 to 33, wherein the light-transmissive plastic layer is configured to have at least one hole, optionally a plurality of holes, for accommodating at least one of the plurality of light sources, and each of the plurality of holes is configured to accommodate one or more of the plurality of light sources.

35. The method according to any one of claims 30 to 34, wherein the light-transmissive plastic layer is provided at least in part as a pre-manufactured element that is initially separated from the first side of the substrate film, and is preferably arranged together with at least a part of the reflector design before attaching the light-transmissive plastic layer and the substrate film together, either directly or via one or more intermediate layers.

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