Composition for preparing a release coating

The composition of RSiO3/2 and SiO4/2 organopolysiloxanes with a metal-ligand complex catalyst addresses compatibility issues in release liner compositions, enhancing stability and bath life.

JP2025523478APending Publication Date: 2025-07-23DOW SILICONES CORP
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Patent Information

Application Number
JP2024575061
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2022-06-30
Filing Date
2023-06-29
Publication Date
2025-07-23

AI Technical Summary

Technical Problem

Conventional release liner compositions face issues with compatibility between inhibitors and hydrosilylation reaction catalysts, affecting bath life and performance characteristics.

Method used

A composition comprising RSiO3/2 and SiO4/2 organopolysiloxanes with silicon-bonded ethylenically unsaturated groups, an organosilicon compound with silicon-bonded hydrogen atoms, and a hydrosilylation catalyst, specifically a metal-ligand complex, to enhance stability and extend bath life.

Benefits of technology

The composition provides excellent stability at room temperature, extending bath life and improving the performance of release coatings.

✦ Generated by Eureka AI based on patent content.

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Abstract

The composition for forming a release coating comprises (A) at least one RSiO 3 / 2 siloxy unit or at least one SiO 4 / 2 siloxy unit-containing organopolysiloxane (wherein R is a substituted or unsubstituted hydrocarbyl group). The (A) organopolysiloxane has on average at least two silicon-bonded ethylenically unsaturated groups per molecule. The composition further comprises (B) an organosilicon compound having on average at least two silicon-bonded hydrogen atoms per molecule. Finally, the composition comprises (C) a hydrosilylation catalyst, a metal-ligand complex having the formula ML x D y [wherein M is a metal, x is equal to the oxidation state of M, each D is independently a neutral coordination ligand, y is zero or an integer from 1 to 4, and each L is a monoanionic ligand having a specific formula], and comprises a hydrosilylation catalyst.
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Description

Technical Field

[0001] (Cross - Reference to Related Applications) This application claims the priority and all advantages of U.S. Provisional Patent Application No. 63 / 357,173, filed on June 30, 2022, the content of which is incorporated herein by reference.

[0002] (Field of the Invention) The disclosure of the subject matter generally relates to compositions, and more specifically, to compositions for preparing release coatings and related methods.

Background Art

[0003] Silicone compositions are known in the art and are used in countless industries and end - uses. One such end - use is to form a release coating or liner that can remove adhesives. For example, a silicone composition may be used to coat various substrates such as paper to obtain a release liner for laminating a pressure - sensitive adhesive (e.g., tape). Such silicone compositions are typically addition - curable.

[0004] Conventional release liners are typically formed by an addition reaction (or hydrosilylation) of an organopolysiloxane having an unsaturated hydrocarbon group and an organohydrogenpolysiloxane in the presence of a hydrosilylation reaction catalyst. Generally, it is desirable to extend the bath life of the composition for preparing the release liner to extend the pot life and minimize premature curing. Thus, conventional compositions for preparing release liners typically contain inhibitors. However, inhibitors and hydrosilylation reaction catalysts also have compatibility issues that affect the bath life and the performance characteristics of the resulting release coating.

Summary of the Invention

[0005] A composition for forming a release coating is disclosed. The composition comprises (A) at least one RSiO3 / 2 A siloxy unit or at least one SiO 4 / 2 An organopolysiloxane containing a siloxy unit (wherein R is a substituted or unsubstituted hydrocarbyl group). (A) The organopolysiloxane has an average of at least two silicon-bonded ethylenically unsaturated groups per molecule. The composition further comprises (B) an organosilicon compound having an average of at least two silicon-bonded hydrogen atoms per molecule. Finally, the composition comprises (C) a hydrosilylation catalyst of the formula ML x D y [wherein M is a metal, x is equal to the oxidation state of M, each D is independently a neutral coordination ligand, y is zero or an integer from 1 to 4, and each L is independently the following formula:

[0006] [Chemical formula] (wherein each R 1 and R 2 is independently a halide, or C1-C6 alkyl, C3-C8 cycloalkyl, C3-C8 heterocycloalkyl, C6-C 10 alkylaryl, C1-C6 alkoxy, C6-C 10 aryl, C6-C 10 heteroaryl, silyl, C2-C8 alkenyl, C2-C8 alkynyl, C1-C6 hydroxyl, C3-C 10 arylene, C3-C 10 heteroarylene, C2-C 10 alkenylene, C3-C 10 cycloalkenylene, and C2-C 10 alkynylene, which is a substituted or unsubstituted group selected therefrom, and each R 3 , R 4 , R 5 , R 6 , R 7 , R 8 , and R 9 is independently hydrogen, a halide, or C1-C6 alkyl, C3-C8 cycloalkyl, C3-C8 heterocycloalkyl, C6-C 10 alkylaryl, C1-C6 alkoxy, C6-C10 Aryl, C6-C 10 Heteroaryl, silyl, C2-C8 alkenyl, C2-C 10 Alkynyl, C1-C6 hydroxyl, C3-C 10 Arylene, C3-C 10 Heteroarylene, C2-C 10 Alkenylene, C3-C 10 Cycloalkenylene, and C2-C 10 A monoanionic ligand selected from substituted or unsubstituted groups selected from alkynylene), and E is C or Si], a metal-ligand complex having is a hydrosilylation catalyst.

[0007] A method for preparing the composition is also disclosed. In addition, a method for preparing a coated substrate including a release coating disposed on a substrate, and a coated substrate formed according to the method are disclosed.

BEST MODE FOR CARRYING OUT THE INVENTION

[0008] A composition for forming a release coating is disclosed. The composition has excellent stability at room temperature and thus provides an extended bath life for release coating applications.

[0009] The composition comprises (A) at least one RSiO 3 / 2 A siloxy unit or at least one SiO 4 / 2 An organopolysiloxane containing a siloxy unit [wherein R is a substituted or unsubstituted hydrocarbyl group]. As is known in the art, RSiO 3 / 2 The siloxy unit is a T siloxy unit, and SiO 4 / 2 The siloxy unit is a Q siloxy unit. The T and / or Q siloxy units are present in branched and resinous organopolysiloxanes. Thus, in one embodiment, (A) the organopolysiloxane is branched. In another embodiment, (A) the organopolysiloxane is resinous. Combinations of different organopolysiloxanes may be utilized as (A) the organopolysiloxane, and further, at least one RSiO3 / 2 Siloxy units or at least one SiO 4 / 2 A linear organopolysiloxane may be used together with those having siloxy units. (A) The organopolysiloxane has on average at least two silicon-bonded ethylenically unsaturated groups per molecule. The silicon-bonded ethylenically unsaturated groups may be terminal and / or pendant in the (A) organopolysiloxane. In certain embodiments, the (A) organopolysiloxane has on average at least two silicon-bonded groups having terminal aliphatic unsaturation per molecule.

[0010] Generally, hydrocarbyl groups suitable for R can independently be linear, branched, cyclic, or combinations thereof. Cyclic hydrocarbyl groups include aryl groups and saturated or non-conjugated cyclic groups. Cyclic hydrocarbyl groups can independently be monocyclic or polycyclic. Linear and branched hydrocarbyl groups can independently be saturated or unsaturated. An example of a combination of a linear and a cyclic hydrocarbyl group is an aralkyl group. General examples of hydrocarbyl groups include alkyl groups, aryl groups, alkenyl groups, halocarbon groups, etc., as well as derivatives, variants, and combinations thereof. Examples of suitable alkyl groups include methyl, ethyl, propyl (e.g., isopropyl and / or n-propyl), butyl (e.g., isobutyl, n-butyl, tert-butyl, and / or sec-butyl), pentyl (e.g., isopentyl, neopentyl, and / or tert-pentyl), hexyl, hexadecyl, octadecyl, and branched-chain saturated hydrocarbon groups having 6 to 18 carbon atoms. Examples of suitable non-conjugated cyclic groups include cyclobutyl group, cyclohexyl group, and cycyloheptyl group. Examples of suitable aryl groups include phenyl, tolyl, xylyl, naphthyl, benzyl, and dimethylphenyl. Examples of suitable alkenyl groups include vinyl group, allyl group, propenyl group, isopropenyl group, butenyl group, isobutenyl group, pentenyl group, heptenyl group, hexenyl group, octenyl group, hexadecenyl group, octadecenyl group, and cyclohexenyl group. Examples of suitable monovalent halogenated hydrocarbon groups (i.e., halo carbon groups) include halogenated alkyl groups, aryl groups, and combinations thereof. Examples of halogenated alkyl groups include the above-mentioned alkyl groups in which one or more hydrogen atoms are substituted with halogen atoms such as F or Cl.Specific examples of the alkyl halide group include fluoromethyl, 2-fluoropropyl, 3,3,3-trifluoropropyl, 4,4,4-trifluorobutyl, 4,4,4,3,3-pentafluorobutyl, 5,5,5,4,4,3,3-heptafluoropentyl, 6,6,6,5,5,4,4,3,3-nonafluorohexyl, and 8,8,8,7,7-pentafluorooctyl, 2,2-difluorocyclopropyl, 2,3-difluorocyclobutyl, 3,4-difluorocyclohexyl, and 3,4-difluoro-5-methylcycloheptyl, chloromethyl, chloropropyl, 2-dichlorocyclopropyl, and 2,3-dichlorocyclopentyl groups, and derivatives thereof. Examples of the aryl halide group include the above-described aryl groups in which one or more hydrogen atoms are substituted with a halogen atom such as F or Cl. Specific examples of the aryl halide group include the chlorobenzyl group and the fluorobenzyl group.

[0011] In certain embodiments, each R is independently selected from alkyl groups having 1 to 32, or 1 to 28, or 1 to 24, or 1 to 20, or 1 to 16, or 1 to 12, or 1 to 8, or 1 to 4, or 1 carbon atom, and ethylenically unsaturated groups having 2 to 32, or 2 to 28, or 2 to 24, or 2 to 20, or 2 to 16, or 2 to 12, or 2 to 8, or 2 to 4, or 2 carbon atoms (i.e., alkenyl and / or alkynyl groups). "Alkenyl" means an acyclic, branched or unbranched monovalent hydrocarbon group having one or more carbon-carbon double bonds. Specific examples thereof include vinyl, allyl, hexenyl, and octenyl groups. "Alkynyl" means an acyclic, branched or unbranched monovalent hydrocarbon group having one or more carbon-carbon triple bonds. Specific examples thereof include ethynyl, propynyl, and butynyl groups. Various examples of ethylenically unsaturated groups include CH2=CH-, CH2=CHCH2-, CH2=CH(CH2)4-, CH2=CH(CH2)6-, CH2=C(CH3)CH2-, H2C=C(CH3)-, H2C=C(CH3)-, H2C=C(CH3)CH2-, H2C=CHCH2CH2-, H2C=CHCH2CH2CH2-,

[0012] [Chemical formula] and the like. Typically, when R is an ethylenically unsaturated group, the aliphatic unsaturation is at the end of R. As understood in the art, ethylenically unsaturated may also be referred to as aliphatic unsaturated.

[0013] (A) The polyorganosiloxane may have the average formula: R m SiO (4-m) / 2 [wherein each R is independently selected and defined as above, provided that in each molecule, at least two of the Rs contain aliphatic unsaturation, and the subscript m is selected such that 0 < m ≦ 3.2]. Alternatively, the above average formula for (A) the organopolysiloxane is (R3SiO1 / 2 ) e (R2SiO 2 / 2 ) f (RSiO 3 / 2 ) g (SiO 4 / 2 ) h [wherein, R is as defined above, and the subscripts e, f, g, and h are each independently 0 or more and 1 or less, provided that the subscripts g and h do not both become 0 at the same time, and the quantity (e + f + g + h) = 1] may be described. A person skilled in the art will understand how such M, D, T, and Q units, and their molar fractions, affect the subscript m in the above average formula.

[0014] In one embodiment, the (A) organopolysiloxane may include a resinous polyorganosiloxane. The resinous polyorganosiloxane may have an average formula: R m’ SiO (4-m’) / 2 [wherein each R is independently selected as defined above, and the subscript m' is selected such that 0.5 ≦ m' ≦ 1.7].

[0015] The resinous polyorganosiloxane has a branched or three-dimensional network molecular structure. At 25 °C, the resinous polyorganosiloxane may be in a liquid form or a solid form. Alternatively, the resinous polyorganosiloxane can be exemplified by a polyorganosiloxane containing only T units, a polyorganosiloxane containing T units in combination with other siloxy units (e.g., M, D, and / or Q siloxy units), or a polyorganosiloxane containing Q units in combination with other siloxy units (i.e., M, D, and / or T siloxy units). Typically, the resinous polyorganosiloxane contains T units and / or Q units. Specific examples of the resinous polyorganosiloxane include vinyl-terminated silsesquioxane (i.e., T resin or silsesquioxane resin), vinyl-terminated MDQ resin, and / or vinyl-terminated MQ resin.

[0016] Alternatively, (A) the organopolysiloxane may contain or may consist of a branched siloxane, a silsesquioxane, or both a branched siloxane and a silsesquioxane.

[0017] When (A) the organopolysiloxane contains a blend of different organopolysiloxanes, the blend can be a physical blend or a mixture. For example, when (A) the organopolysiloxane contains a branched siloxane and a silsesquioxane, the branched siloxane and the silsesquioxane may be present in amounts such that, based on the total weight of all components present in the composition, the sum of the amount of the branched siloxane and the amount of the silsesquioxane is 100 parts by weight in total. The branched siloxane may be present in an amount of 50 to 100 parts by weight, and the silsesquioxane may be present in an amount of 0 to 50 parts by weight. Alternatively, the branched siloxane may be present in an amount of 50 to 90 parts by weight, and the silsesquioxane may be present in an amount of 10 to 50 parts by weight. Alternatively, the branched siloxane may be present in an amount of 50 to 80 parts by weight, and the silsesquioxane may be present in an amount of 20 to 50 parts by weight. Alternatively, the branched siloxane may be present in an amount of 50 to 76 parts by weight, and the silsesquioxane may be present in an amount of 24 to 50 parts by weight. Alternatively, the branched siloxane may be present in an amount of 50 to 70 parts by weight, and the silsesquioxane may be present in an amount of 30 to 50 parts by weight.

[0018] In certain embodiments, the branched siloxane of (A) the organopolysiloxane has the following average unit formula: (R3SiO 1 / 2 ) p (R2SiO 2 / 2 ) q (SiO 4 / 2 ) r , [wherein each R is independently selected and defined as above, provided that at least two, or at least three, of the Rs contain aliphatic unsaturation, 0 < p ≦ 0.3, 0.4 ≦ q ≦ 0.97, and 0 < r ≦ 0.3, provided that p + q + r = 1].

[0019] (A) The branched siloxanes of organopolysiloxanes generally contain M siloxy units (i.e., (R3SiO 1 / 2 ), D siloxy units (i.e., (R2SiO 2 / 2 ), and one or more Q siloxy units (i.e., (SiO 4 / 2 ), or consist of M, D, and Q siloxy units. The branched siloxanes of (A) organopolysiloxanes contain at least one Q siloxy unit, but the branched siloxanes of (A) organopolysiloxanes are considered by those skilled in the art to be branched silicone polymers rather than silicone resins, based on the degree of polymerization (DP) in the branched siloxanes of (A) organopolysiloxanes and the molar fraction of Q siloxy units present therein.

[0020] (A) The general formula of the branched siloxanes of organopolysiloxanes is a representative example of the average formula of M, D, and Q siloxy units. For example, the M siloxy units may be independently selected within the formula (R3SiO 1 / 2 ), and the D siloxy units may be independently selected within the formula (R2SiO 2 / 2 ). The subscripts or molar fractions of M, D, and Q siloxy units in the branched siloxanes of (A) organopolysiloxanes are collectively based on all M siloxy units, all D siloxy units, and all Q siloxy units present in the branched siloxanes of (A) organopolysiloxanes, respectively. As an example, the branched siloxanes of (A) organopolysiloxanes may contain M units having independently 0, 1, 2, or 3 silicon-bonded ethylenically unsaturated groups. Similarly, the branched siloxanes of (A) organopolysiloxanes may contain D units having independently 0, 1, or 2 silicon-bonded ethylenically unsaturated groups. Such silicon-bonded ethylenically unsaturated groups present in the M siloxy units are considered to be at the ends, while such silicon-bonded ethylenically unsaturated groups present in the D siloxy units are considered to be pendant.

[0021] In certain embodiments, the branched siloxane of the (A) organopolysiloxane has one Q siloxy unit. In other embodiments, the branched siloxane of the (A) organopolysiloxane has two Q siloxy units, or three Q siloxy units. The branched siloxane of the (A) organopolysiloxane can have a degree of polymerization (DP) of from 1 to 3000, or from 2 to 2000, or from 3 to 1000, or from 4 to 750, or from 5 to 400, or from 10 to 200, or from 14 to 180. The DP is generally the total number of D units present in the branched siloxane of the (A) organopolysiloxane, i.e., the DP can be based on more than one straight-chain in the branched siloxane of the (A) organopolysiloxane.

[0022] In certain embodiments, when the branched siloxane of the (A) organopolysiloxane contains one Q siloxy unit, the branched siloxane of the (A) organopolysiloxane has the following average unit formula: (R3SiO 1 / 2 ) x (R2SiO 2 / 2 ) z (SiO 4 / 2 ), [wherein each R is independently a substituted or unsubstituted hydrocarbyl group, provided that at least two of the Rs are independently selected ethylenically unsaturated groups, the subscript x is from 0.05 to 4, and the subscript z is from 1 to 3,000].

[0023] In certain embodiments, the silicon-bonded ethylenically unsaturated group is present in one or more M siloxy units (e.g., as vinyldimethylsiloxy units, divinylmethylsiloxy units, and / or trivinylsiloxy units). Alternatively, in other embodiments, the silicon-bonded ethylenically unsaturated group is present in one or more D siloxy units (e.g., as methylvinylsiloxy groups and / or divinylsiloxy groups). Alternatively still, the silicon-bonded ethylenically unsaturated group may be present in one or more of each of the M and D siloxy units. One of ordinary skill in the art will understand that these specific siloxy groups are merely illustrative and that the vinyl may be replaced with other ethylenically unsaturated groups and the methyl may be replaced with other hydrocarbyl groups.

[0024] (A) In certain embodiments where the branched siloxane of the organopolysiloxane contains a single Q siloxy unit, the branched siloxane of the (A) organopolysiloxane has the following general formula: Si-[[OSiR2] b’ [OSiR3]]4 [wherein each R is independently selected and defined as above, provided that at least two of the Rs contain aliphatic unsaturation, and each b’ is independently 0 to 200, or 1 to 100].

[0025] However, since the branched siloxane of the (A) organopolysiloxane contains D siloxy units, not all events of b’ (i.e., all four events) can be 0 simultaneously. The DP of the branched siloxane of the (A) organopolysiloxane in these embodiments is based on the total amount or sum of b’. The branched siloxane of the (A) organopolysiloxane contains at least one, or at least two, or at least three, or four substantially linear or linear chains extending from the silicon atom of the Q unit. These substantially linear or linear chains correspond to repeating D siloxy units when any repetition of b’ is greater than 0.

[0026] In these specific embodiments, (A) the branched siloxane of the organopolysiloxane contains a single Q siloxy unit and does not contain a T siloxy unit. The T siloxy unit can be represented by RSiO 3 / 2 as understood in the art, and contains one silicon-bonded substituent R. The branched siloxane of (A) the organopolysiloxane contains D siloxy units corresponding to each occurrence of the subscript b’. Since b’ is independently selected, each straight chain of the D siloxy units denoted by the subscript b’ can vary, i.e., each b’ can be the same or different from one another. One or more occurrences of b’ may be 0 such that the M siloxy unit is directly bonded to a single Q siloxy unit, but typically each M siloxy unit is separated from the Q siloxy unit by at least one D siloxy unit. The branched siloxane of (A) the organopolysiloxane can also generally be symmetric, i.e., this is the case where all occurrences of b’ are the same. The straight-chain chains of D siloxy units in the branched siloxane of (A) the organopolysiloxane each terminate with an M siloxy unit.

[0027] In certain embodiments, the branched siloxane of (A) the organopolysiloxane has the general formula: Si-[[OSiMe2] b’ [OSiMe2Vi]]4 [wherein b’ is independently selected and as defined above, Me represents methyl, and Vi represents vinyl].

[0028] In other certain embodiments, the branched siloxane of (A) the organopolysiloxane has the general formula: Si-[[OSiViMe] b’ [OSiMe3]]4 [wherein b’ is independently selected and as defined above].

[0029] In still other certain embodiments, the branched siloxane of (A) the organopolysiloxane has the general formula: Si-[[OSiViMe] b’ [OSiMe2Vi]]4 [wherein, b' is independently selected and has the definition given above]

[0030] Furthermore, each D and M siloxy unit in the branched siloxane of the (A) organopolysiloxane is independently selected. Therefore, any of the above specific examples may be modified. For example, in one embodiment, the branched siloxane of the (A) organopolysiloxane may include three dimethylvinylsiloxy units and one trimethylsiloxy unit.

[0031] Alternatively, the (A) organopolysiloxane has the formula:

[0032]

Chemical formula

[0033] (A) The organopolysiloxane has an average unit formula: (R 10 3SiO 1 / 2 ) i (R 11 R 10 2SiO 1 / 2 ) f (R 10 2SiO 2 / 2 ) g (R 10 SiO 3 / 2 ) [wherein each R 10 is an independently selected hydrocarbyl group having no aliphatic unsaturation, and each R 11is an ethylenically unsaturated group independently selected, with subscript i ≥ 0, subscript f > 0, subscript g being 15 - 995, and subscript h > 0], and can be a silsesquioxane having the same. Subscript i can be 0 - 10. Alternatively, for subscript i, 12 ≥ i ≥ 0, or 10 ≥ i ≥ 0, or 7 ≥ i ≥ 0, or 5 ≥ i ≥ 0, or 3 ≥ i ≥ 0.

[0034] Alternatively, subscript f ≥ 1. Alternatively, subscript f ≥ 3. Alternatively, for subscript f, 12 ≥ f > 0, or 12 ≥ f ≥ 3, or 10 ≥ f > 0, or 7 ≥ f > 1, or 5 ≥ f ≥ 2, or 7 ≥ f ≥ 3. Alternatively, for subscript g, 800 ≥ g ≥ 15, or 400 ≥ g ≥ 15. Alternatively, subscript h ≥ 1. Alternatively, subscript h is 1 - 10. Alternatively, for subscript h, 10 ≥ h > 0, or 5 ≥ h > 0, or h = 1. Alternatively, subscript h is 1 - 10, or subscript h is 1 or 2. Alternatively, when subscript h = 1, subscript f can be 3 and subscript i can be 0.

[0035] (A) The organopolysiloxane has the formula (R3SiO 1 / 2 ) x’ (R2SiO 2 / 2 ) z’ (SiO 4 / 2 ) 1.0 (ZO 1 / 2 ) w [wherein each R is independently selected and defined as above, provided that in each molecule, at least two of the Rs are independently selected ethylenically unsaturated groups, subscript x' is 1.5 - 4, Z is independently selected from H and alkyl groups having 1 - 4 carbon atoms, subscript w is 0 - 3, and subscript z' is 3 - 1,000]. (ZO 1 / 2) The portion represented by is typically essentially present when the (A) organopolysiloxane is prepared via hydrolysis and condensation of silanes. Depending on the preparation method, there may be no portion represented by (ZO 1 / 2 ) in the (A) organopolysiloxane.

[0036] Regardless of the selection of the branched siloxane of the (A) organopolysiloxane, the branched siloxane of the (A) organopolysiloxane has at least two, or at least three, silicon-bonded ethylenically unsaturated groups. In certain embodiments, the branched siloxane of the (A) organopolysiloxane has a content of ethylenically unsaturated groups of 2.0 to 7.0, or 2.0 to 6.0, or 2.0 to 5.5 weight percent, based on the total weight of the branched siloxane of the (A) organopolysiloxane. This is typically the case when each R group is methyl or vinyl. However, as understood in the art, when R is something other than methyl (e.g., ethyl, aryl) and / or R is something other than vinyl (e.g., hexenyl) (which affect the molecular weight of the branched siloxane of the (A) organopolysiloxane), the same number of R groups may constitute a lower weight percent overall. The content of R can be interpreted and calculated using Silicon 29 Nuclear Magnetic Resonance Spectroscopy ( 29 Si NMR) as understood in the art. In certain embodiments, the branched siloxane of the (A) organopolysiloxane has a viscosity of greater than 0 to less than 400, or greater than 0 to less than 300, or greater than 0 to less than 200 mPa·s at 25°C.

[0037] (A) The organopolysiloxane can include a combination of polyorganosiloxanes or two or more different polyorganosiloxanes that differ in at least one property such as structure, molecular weight, monovalent groups bonded to silicon atoms, and content of aliphatic unsaturated groups.

[0038] For example, as described above, (A) organopolysiloxane contains at least one T-siloxy unit and / or at least one Q-siloxy unit. However, (A) organopolysiloxane may be substantially linear or may further contain another linear organopolysiloxane. The substantially linear organopolysiloxane may have the average formula: R a’ SiO (4-a’) / 2 [wherein each R is as defined above, and the subscript a' is selected such that 1.9 ≦ a' ≦ 2.2].

[0039] The substantially linear organopolysiloxane of component (A) can be a fluid liquid at 25°C or can have the form of an uncured rubber. The substantially linear organopolysiloxane may have a viscosity of 10 mPa·s to 30,000,000 mPa·s, or 10 mPa·s to 10,000 mPa·s, or 100 mPa·s to 1,000,000 mPa·s, or 100 mPa·s to 100,000 mPa·s at 25°C. The viscosity can be measured at 25°C via a Brookfield LV DV-E viscometer equipped with a spindle appropriately selected for the viscosity of the substantially linear polyorganopolysiloxane, i.e., RV-1 to RV-7.

[0040] Alternatively, when (A) organopolysiloxane further contains another substantially linear organopolysiloxane, the substantially linear organopolysiloxane has the average unit formula: (R 11 R 10 2SiO 1 / 2 ) aa (R 11 R 10 SiO 2 / 2 ) bb (R 11 2SiO 2 / 2 ) cc (R 10 3SiO 1 / 2 ) dd [wherein each R 10is an independently selected hydrocarbyl group that does not contain aliphatic unsaturation, each R 11 is an independently selected ethylenically unsaturated group, the subscript aa is 0, 1, or 2, the subscript bb is 0 or more, the subscript cc is 1 or more, the subscript dd is 0, 1, or 2, provided that the quantity (aa + dd) ≥ 2, and the quantity (aa + dd) = 2, provided that the quantity (aa + bb + cc + dd) is from 3 to 2,000]. It may have. Alternatively, the subscript cc ≥ 0. Alternatively, the subscript bb ≥ 2. Alternatively, the quantity (aa + dd) is from 2 to 10, or from 2 to 8, or from 2 to 6. Alternatively, the subscript cc is from 0 to 1,000, or from 1 to 500, or from 1 to 200. Alternatively, the subscript bb is from 2 to 500, or from 2 to 200, or from 2 to 100.

[0041] R 10 's hydrocarbyl group that does not contain aliphatic unsaturation is exemplified by an alkyl group having 1 to 6 carbon atoms, an aryl group having 6 to 10 carbon atoms, a halogenated alkyl group having 1 to 6 carbon atoms, a halogenated aryl group having 6 to 10 carbon atoms, an aralkyl group having 7 to 12 carbon atoms, or a halogenated aralkyl group having 7 to 12 carbon atoms, and alkyl, aryl, and halogenated alkyl are as described herein. Alternatively, each R 10 is an alkyl group. Alternatively, each R 10 is independently methyl, ethyl, or propyl. Each instance of R 10 may be the same or different. Alternatively, each R 10 is a methyl group.

[0042] R 11 's aliphatic unsaturated monovalent hydrocarbon group can react in a hydrosilylation reaction. Suitable aliphatic unsaturated hydrocarbon groups for R 11 are defined herein and are exemplified by alkenyl groups such as vinyl, allyl, butenyl, and hexenyl, and alkynyl groups such as ethynyl and propynyl as defined herein. Alternatively, each R 11may be vinyl or hexenyl. Alternatively, each R 11 is a vinyl group. In certain embodiments, the alkenyl or alkynyl content of (A) organopolysiloxane may be 0.1% to 1%, or alternatively 0.2% to 0.5% based on the weight of (A) organopolysiloxane.

[0043] When (A) organopolysiloxane is substantially linear or further comprises a linear organopolysiloxane, at least two aliphatic unsaturated groups may be bonded to silicon atoms at pendant positions, terminal positions, or both pendant and terminal positions in the substantially linear or linear organopolysiloxane. As a specific example, (A) organopolysiloxane may further comprise a substantially linear or linear organopolysiloxane having the average unit formula: [(CH3)3SiO 1 / 2 2[(CH3)2SiO 2 / 2 cc [(CH3)ViSiO 2 / 2 bb [wherein the subscripts bb and cc are as defined above, and Vi represents a vinyl group], and may further comprise a substantially linear or linear organopolysiloxane. Regarding this average formula, any methyl group may be substituted with a different monovalent hydrocarbon group (such as alkyl or aryl), and any vinyl group may be substituted with a different aliphatic unsaturated monovalent hydrocarbon group (such as allyl or hexenyl). Alternatively, as a specific example of a polyorganosiloxane having an average of at least two silicon-bonded aliphatic unsaturated groups per molecule, (A) organopolysiloxane is substantially linear or linear and has the average formula: Vi(CH3)2SiO[(CH3)2SiO] cc ​​It may contain an organopolysiloxane having Si(CH3)2Vi [wherein the subscript cc and Vi are defined above]. The dimethylpolysiloxane terminated with a silicon-bonded vinyl group can be used alone or in combination with (A) the dimethyl, methyl-vinyl polysiloxane disclosed immediately above as a component of the organopolysiloxane. Regarding this average formula, any methyl group may be substituted with a different monovalent hydrocarbon group, and any vinyl group may be substituted with any terminal aliphatic unsaturated monovalent hydrocarbon group. Since at least two silicon-bonded aliphatic unsaturated groups can be present both pendent and terminal, (A) the organopolysiloxane may alternatively have an average unit formula: [Vi(CH3)2SiO 1 / 2 2[(CH3)2SiO 2 / 2 cc [(CH3)ViSiO 2 / 2 bb [wherein the subscripts bb and cc and Vi are defined above].

[0044] ​​When the organopolysiloxane (A) further contains a substantially linear polyorganosiloxane, the substantially linear polyorganopolysiloxane may be exemplified by dimethylpolysiloxane capped at both molecular ends with dimethylvinylsiloxy groups, methylphenylpolysiloxane capped at both molecular ends with dimethylvinylsiloxy groups, a copolymer of methylphenylsiloxane and dimethylsiloxane capped at both molecular ends with dimethylvinylsiloxy groups, a copolymer of methylvinylsiloxane and methylphenylsiloxane capped at both molecular ends with dimethylvinylsiloxy groups, a copolymer of methylvinylsiloxane and diphenylsiloxane capped at both molecular ends with dimethylvinylsiloxy groups, a copolymer of methylvinylsiloxane, methylphenylsiloxane and dimethylsiloxane capped at both molecular ends with dimethylvinylsiloxy groups, a copolymer of methylvinylsiloxane and methylphenylsiloxane capped at both molecular ends with trimethylsiloxy groups, a copolymer of methylvinylsiloxane and diphenylsiloxane capped at both molecular ends with trimethylsiloxy groups, and a copolymer of methylvinylsiloxane, methylphenylsiloxane and dimethylsiloxane capped at both molecular ends with trimethylsiloxy groups.

[0045] Alternatively, the organopolysiloxane (A) may further contain a substantially linear or linear polyorganosiloxane selected from the group consisting of: i) Dimethylvinylsiloxy-terminated polydimethylsiloxane, ii) Dimethylvinylsiloxy-terminated poly(dimethylsiloxane / methylvinylsiloxane), iii) Dimethylvinylsiloxy-terminated polymethylvinylsiloxane, iv) Trimethylsiloxy-terminated poly(dimethylsiloxane / methylvinylsiloxane), v) Trimethylsiloxy-terminated polymethylvinylsiloxane, vi) Dimethylvinylsiloxy-terminated poly(dimethylsiloxane / methylvinylsiloxane), vii) Dimethylvinylsiloxy-terminated poly(dimethylsiloxane / methylphenylsiloxane), viii) Dimethylvinylsiloxy-terminated poly(dimethylsiloxane / diphenylsiloxane), ix) Phenyl, methyl, vinyl-siloxy-terminated polydimethylsiloxane, x) Dimethylhexenylsiloxy-terminated polydimethylsiloxane, xi) Dimethylhexenylsiloxy-terminated poly(dimethylsiloxane / methylhexenylsiloxane), xii) Dimethylhexenylsiloxy-terminated polymethylhexenylsiloxane, xiii) Trimethylsiloxy-terminated poly(dimethylsiloxane / methylhexenylsiloxane), xiv) Trimethylsiloxy-terminated polymethylhexenylsiloxane xv) Dimethylhexenylsiloxy-terminated poly(dimethylsiloxane / methylhexenylsiloxane), xvi) Dimethylvinylsiloxy-terminated poly(dimethylsiloxane / methylhexenylsiloxane) and xvii) Combinations thereof.

[0046] The composition may contain (A) an organopolysiloxane in an amount of 60 to 99.5, or 60 to 98, or 60 to 95, or 70 to 95, or 75 to 95 weight percent based on the total weight of the composition. In one embodiment, (A) the organopolysiloxane consists of a branched organopolysiloxane. In other embodiments where (A) the organopolysiloxane contains two or more different organopolysiloxanes, for example, a branched organopolysiloxane and a substantially linear organopolysiloxane, (A) the organopolysiloxane generally contains at least 50, or at least 60, or at least 70, or at least 80, or at least 90 weight percent of the branched organopolysiloxane based on the total weight of (A) the organopolysiloxane.

[0047] The composition further comprises an organosilicon compound (B) having on average at least two silicon-bonded hydrogen atoms per molecule. The organosilicon compound (B) can be linear, branched, partially branched, cyclic, resinous (i.e., having a three-dimensional network), or can include a combination of different structures. The organosilicon compound (B) is typically a crosslinking agent and reacts with the ethylenically unsaturated groups of component (A) when forming a coating, such as a release coating. Typically, the organosilicon compound (B) includes organohydrogensiloxanes.

[0048] (B) The organosilicon compound can include any combination of M, D, T, and / or Q siloxy units as long as the organosilicon compound (B) contains at least two silicon-bonded hydrogen atoms per molecule. These siloxy units can be combined in various ways to form cyclic, linear, branched, and / or resinous (three-dimensional network) structures. Depending on the selection of M, D, T, and / or Q units, the organosilicon compound (B) can be a monomer, polymer, oligomer, linear, branched, cyclic, and / or resinous.

[0049] (B) Since the organosilicon compound contains on average at least two silicon-bonded hydrogen atoms per molecule with respect to the siloxy units described above, the organosilicon compound (B) may optionally be combined with siloxy units that contain no silicon-bonded hydrogen atoms at all, any of the following siloxy units containing silicon-bonded hydrogen atoms: (R 10 2HSiO 1 / 2 ), (R 10 H2SiO 1 / 2 ), (H3SiO 1 / 2 ), (R 10 HSiO 2 / 2 ), (H2SiO 2 / 2 ), and / or (HSiO 3 / 2 ) [wherein each R 10 is independently selected and defined as above].

[0050] In certain embodiments, (B) the organosilicon compound is substantially linear or a linear polyorganohydrogensiloxane. The substantially linear or linear polyorganohydrogensiloxane has an average unit formula: (HR 10 2SiO 1 / 2 ) v’ (HR 10 SiO 2 / 2 ) w’ (R 10 2SiO 2 / 2 ) z’ (R 10 3SiO 1 / 2 ) y’ [wherein each R 10 is independently selected and defined as above, the subscript v' is 0, 1, or 2, the subscript w' is 1 or more, the subscript z' is 0 or more, and the subscript y' is 0, 1, or 2, provided that the quantity (v' + y') = 2 and the quantity (v' + w') ≥ 3]. The quantity (v' + w' + z' + y') can be from 2 to 1,000. The polyorganohydrogensiloxane is i) a dimethylhydrogensiloxy-terminated poly(dimethyl / methylhydrogen) siloxane copolymer, ii) a dimethylhydrogensiloxy-terminated polymethylhydrogensiloxane, iii) a trimethylsiloxy-terminated poly(dimethyl / methylhydrogen) siloxane copolymer, iv) a trimethylsiloxy-terminated polymethylhydrogensiloxane, and / or v) exemplified by a combination of two or more of i), ii), iii), iv), and v). Suitable polyorganohydrogensiloxanes are commercially available from Dow Silicones Corporation (Midland, Michigan, USA).

[0051] (B) The organosilicon compound has the formula: H y’ R 10 3-y’ Si-(OSiR 10 2) m -(OSiR 10 H)m’ -OSiR 10 3-y’ H y’ [wherein each R 10 is an independently selected hydrocarbyl group that does not contain aliphatic unsaturation, each y’ is independently selected from 0 or 1, and the subscripts m and m’ are each independently from 0 to 1,000, provided that m and m’ do not both become 0 at the same time, and m + m’ is from 1 to 1,000]. In certain embodiments, each y’ is 0 and the subscript m’ is ≧2.

[0052] In a particular embodiment, the (B) organosilicon compound is linear and contains pendant silicon-bonded hydrogen atoms. In these embodiments, the (B) organosilicon compound has the average formula: (CH3)3SiO[(CH3)2SiO] z’ [(CH3)HSiO] w’ Si(CH3)3 [wherein z’ and w’ are as defined above] and can be a dimethyl, methyl-hydrogen polysiloxane. Those skilled in the art will understand that in the above exemplary formula, the dimethylsiloxy units and methylhydrogen siloxy units may be present in random or block form, and any methyl group may be substituted with any other hydrocarbon group that does not contain aliphatic unsaturation.

[0053] In another particular embodiment, the (B) organosilicon compound is linear and contains terminal silicon-bonded hydrogen atoms. In these embodiments, the (B) organosilicon compound has the average formula: H(CH3)2SiO[(CH3)2SiO] z’ Si(CH3)2H It can be a SiH-terminated dimethylpolysiloxane having [[wherein, z' is as defined above]]. The SiH-terminated dimethylpolysiloxane can be used alone or in combination with the dimethyl, methylhydrogenpolysiloxane disclosed above. When a mixture is used, the relative amounts of each organohydridosiloxane in the mixture can vary. One skilled in the art will understand that any methyl group in the above exemplary formula may be replaced with any other hydrocarbon group that does not contain aliphatic unsaturation.

[0054] Alternatively, the (B) organosilicon compound can contain both pendant and terminal silicon-bonded hydrogen atoms.

[0055] In certain embodiments, the (B) organosilicon compound can include an alkylhydrogencyclosiloxane or an alkylhydrogendialkylcyclosiloxane copolymer. Specific examples of suitable organohydridosiloxanes of this type include (OSiMeH)4, (OSiMeH)3(OSiMeC6H 13 ), (OSiMeH)2(OSiMeC6H 13 )2, and (OSiMeH)(OSiMeC6H 13 )3 [wherein, Me represents methyl (-CH3)].

[0056] (B) Another example of an organohydrogensiloxane suitable for an organosilicon compound is one having at least two SiH-containing cyclosiloxane rings in one molecule. Such an organohydrogensiloxane may be any organopolysiloxane having at least two cyclosiloxane rings, each having at least one silicon-bonded hydrogen (SiH) atom on each cyclosiloxane ring. The cyclosiloxane ring contains at least three siloxy units (i.e., the minimum number required to form a cyclosiloxane ring) and may be any combination of M siloxy units, D siloxy units, T siloxy units, and / or Q siloxy units that form a cyclic structure, provided that at least one of the cyclic siloxy units, which may be M siloxy units, D siloxy units, and / or T siloxy units, in each cyclosiloxane ring contains one SiH unit. These siloxy units can be represented as MH, DH, and TH siloxy units, respectively, when the other substituents are methyl.

[0057] In another specific embodiment, the (B) organosilicon compound has the formula: [(HR 10 SiO 2 / 2 ) a (-R 10 SiO 3 / 2 ) b c [(R 10 2SiO 2 / 2 ) w d [wherein each R 10 is independently selected and defined above, the subscript a is from 0 to 10, the subscript b is from 1 to 4, provided that (a + b) = 3 to 12, 0 < c < 100, 2 ≤ w ≤ 2000, 0 < d < 100, provided that c > d]. Such an organosilicon compound is sometimes referred to as a branched cyclic polyorganohydrogensiloxane compound having cyclic SiH-functional branched groups interconnected by linear polydiorganosiloxane segments. Exemplary structures related to such branched cyclic polyorganohydrogensiloxane compounds are as follows:​​

[0058]

Chem.

[0059] Such branched cyclic polyorganohydrogensiloxane compounds are known in the art and can be prepared, for example, by combining (A) a hydroxyl-terminated polydiorganosiloxane and (B) a cyclic polyorganohydrogensiloxane together in the presence of (C) a boron-containing Lewis acid.

[0060] (B) The organosilicon compound may comprise a combination of organosilicon compounds having at least one different property such as structure, molecular weight, monovalent groups bonded to silicon atoms, and content of silicon-bonded hydrogen atoms, or two or more different organosilicon compounds. The composition may contain (B) the organosilicon compound in an amount that provides a molar ratio of silicon-bonded hydrogen atoms in component (B) to silicon-bonded ethylenically unsaturated groups in component (A) of 1:1 to 5:1, or 1.1:1 to 3.1.

[0061] The composition further comprises (C) a hydrosilylation reaction catalyst. (C) The hydrosilylation reaction catalyst comprises a metal-ligand complex having the formula ML x D y [wherein M is a metal, x is equal to the oxidation state of M, each D is independently a neutral coordination ligand, y is zero or an integer from 1 to 4, and each L is independently of the formula:

[0062]

Chem.

[0063] In certain embodiments, R 1 and R 2At least one of them is neither fluoride (F-) nor trifluoromethyl (CF3-). In some embodiments of these metal-ligand complexes, R 1 and R 2 At least one of them is neither fluoride nor C1-C6 fluoroalkyl. In some embodiments of these metal-ligand complexes, each R 1 and R 2 is neither fluoride nor trifluoromethyl group. In some embodiments, each R 1 and R 2 is neither fluoride nor C1-C6 fluoroalkyl.

[0064] In certain embodiments, M is selected from the group consisting of Li, Be, Mg, Ca, Sr, Ba, Al, Sc, Ga, Sn, Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn, Re, Fe, Ru, Os, Co, Rh, Ir, Ni, Pd, Pt, Cu, Ag, Au, Zn, lanthanide metals, and actinide metals. In some embodiments of the metal-ligand complexes disclosed herein, M is selected from the group consisting of Li, Be, Mg, Ca, Sr, Ba, Al, Sc, Ga, Sn, Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn, Re, Fe, Ru, Os, Rh, Ir, Ni, Pd, Pt, Cu, Ag, Au, Zn, lanthanide metals, and actinide metals. In other embodiments of the metal-ligand complexes disclosed herein, M is selected from the group consisting of Li, Mg, Rh, Ir, Pt, Ru, and Os. In certain embodiments of the metal-ligand complexes disclosed herein, M is selected from the group consisting of Pt, Li, Rh, and Ir. In other embodiments, M is selected from the platinum group metals selected from Ru, Rh, Pd, Os, Ir, and Pt. In an exemplary embodiment of the metal-ligand complexes disclosed herein, M is Pt. In some embodiments of the metal-ligand complexes disclosed herein, the coordination number of M is 4 or 6. In some embodiments of the metal-ligand complexes disclosed herein, the coordination number of M is 4. In these or other embodiments, M has an oxidation number (also called oxidation state) of at least +2.

[0065] In some embodiments of the metal-ligand complexes disclosed herein, L is an η 1 ,η 2 -β,β-disubstituted-ω-alkenyl ligand. In some embodiments of the metal-ligand complexes disclosed herein, when x is greater than 1, each L is the same. In some embodiments of the metal-ligand complexes disclosed herein, when x is greater than 1, each L is different from the other Ls. In some embodiments of the metal-ligand complexes disclosed herein, the total number of carbon atoms in each L excluding R 1 , R 2 , R 3 , R 4 , R 5 , R 6 , R 7 , R 8 , and R 9 is independently 4 or 5. In some embodiments of the metal-ligand complexes disclosed herein, n is 0 or 1. In some embodiments of the metal-ligand complexes disclosed herein, the total number of carbon atoms in each L excluding the functional groups R 1 , R 2 , R 3 , R 4 , R 5 , R 6 , R 7 , R 8 , and R 9 is 5. In some embodiments of the metal-ligand complexes disclosed herein, n is 1. In some embodiments of the metal-ligand complexes disclosed herein, M is bonded to each L via a metal-carbon σ bond and a metal-olefin π bond. In some embodiments of the metal-ligand complexes disclosed herein, when x is greater than 1, the metal-carbon σ bonds in the metal-ligand complex are cis to each other. In some embodiments of the metal-ligand complexes disclosed herein, each R 1 and R 2 is independently a halide, and C1-C6 alkyl, C3-C8 cycloalkyl, C3-C8 heterocycloalkyl, C6-C 10 alkylaryl, C1-C6 alkoxy, C6-C 10 aryl, C6-C10 It is selected from the group consisting of substituted or unsubstituted groups selected from heteroaryl, silyl, C2-C8 alkenyl, C2-C8 alkynyl, or any combination thereof. In some embodiments of the metal-ligand complexes disclosed herein, each R 3 , R 4 , R 5 , R 6 , R 7 , R 8 , and R 9 is independently selected from hydrogen, halide, and C1-C6 alkyl, C3-C8 cycloalkyl, C3-C8 heterocycloalkyl, C6-C 10 alkylaryl, C1-C6 alkoxy, C6-C 10 aryl, C6-C 10 heteroaryl, silyl, C2-C8 alkenyl, C2-C8 alkynyl, or any combination thereof of substituted or unsubstituted groups selected from the group. In some embodiments of the metal-ligand complexes disclosed herein, R 1 , R 2 , R 3 , R 4 , R 5 , R 6 , R 7 , R 8 , and R 9 are directly or indirectly connected to each other via an alkyl group and / or a fluoroalkyl group. In some embodiments of the metal-ligand complexes disclosed herein, R 1 , R 2 , R 3 , R 4 , R 5 , R 6 , R 7 , R 8 , and R 9 are indirectly connected to each other via an alkyl group and / or a fluoroalkyl group. In some embodiments of the metal-ligand complexes disclosed herein, L is a bidentate ligand.

[0066] In some embodiments of the metal-ligand complexes disclosed herein, E is Si. In other embodiments, E is C.

[0067] In some embodiments of the metal-ligand complexes disclosed herein, each D is independently an ether group (R 12 2O), an amine group (R 12 3N), a nitrile group (R 12 CN), an isonitrile group (R 12 NC), a phosphine group (R 12 3P), a phosphite group ((R 12 O)3P), an arsine group (R 12 3As), a stibene group (R 12 3Sb), a sulfide group (CS), a linear, branched, or cyclic monoalkene, a linear, branched, or cyclic diene, a linear, branched, or cyclic triene, a bicyclic alkene, a bicyclic diene, a bicyclic triene, a tricyclic diene, a tricyclic triene, an alkyne, and any combination thereof, wherein each R 12 is independently C1-C6 alkyl, C3-C8 cycloalkyl, C3-C8 heterocycloalkyl, C6-C 10 alkylaryl, C1-C6 alkoxy, C6-C 10 aryl 、 C6-C 10 heteroaryl, silyl, C2-C8 alkenyl, C2-C8 alkynyl, C1-C6 hydroxyl, C3-C 10 arylene, C3-C 10 heteroarylene, C2-C 10 alkenylene, C3-C 10 cycloalkenylene, C2-C 10It is selected from the group consisting of alkynylene and substituted or unsubstituted groups selected from any combination thereof. In some embodiments of the metal-ligand complexes disclosed herein, each D is independently selected from the group consisting of linear monoethers, linear polyethers, cyclic monoethers, cyclic polyethers, monoamines, linear polyamines, cyclic monoamines, cyclic polyamines, and any combination thereof. In certain embodiments, each D is independently selected from the group consisting of 1,5-cyclooctadiene, bicyclo[2.2.1]hepta-2,5-diene, 1,5-hexadiene, ethylene, dibenzo[a,e]cyclooctene, N,N,N',N'-tetramethylethylenediamine, norbornadiene, cyclooctatriene, and cyclooctene. In an exemplary embodiment, each D is 1,5-cyclooctadiene. In other embodiments, D may, in other cases, be a molecule present in the composition for another purpose. By way of example, D may be a solvent molecule such as acetonitrile, THF, polyether, etc. As another example, D may be an inhibitor molecule such as 1-ethynylcyclohexanol. Those skilled in the art can readily understand which optional components can be used as D based on the description herein for any components of the composition as described below.

[0068] In some embodiments of the metal-ligand complexes disclosed herein, the metal-ligand complex is a neutral metal-ligand complex. In some embodiments of the metal-ligand complexes disclosed herein, y is 0. In some embodiments of the metal-ligand complexes disclosed herein, the metal-ligand complex is (2,2-dimethylpent-4-en-1-yl)lithium, cis-bis(η 1 ,η 2 -2,2-dimethylbut-3-en-1-yl)platinum, cis-bis(η 1 ,η 2 -2,2-dimethylpent-4-en-1-yl)platinum, cis-bis(η 1 ,η 2 -2,2-dimethylhex-5-en-1-yl)platinum, [(1,2,5,6-η)-1,5-cyclooctadiene](η 1 ,η2 -2,2-dimethylpenta-4-en-1-yl)iridium, [(1,2,5,6-η)-1,5-cyclooctadiene](η 1 ,η 2 -2,2-dimethylpenta-4-en-1-yl)rhodium, and [(2,3,5,6-η)-bicyclo[2.2.1]hepta-2,5-diene](η 1 ,η 2 -2,2-dimethyl-penta-4-en-1-yl)rhodium selected from the group consisting of.

[0069] In some embodiments of the metal-ligand complexes disclosed herein, M is a platinum group metal selected from Ru, Rh, Pd, Os, Ir, and Pt, and E is Si. In these or other embodiments, R 1 and R 2 are independently selected alkyl groups, and each of R 3 , R 4 , R 5 , R 6 , R 7 , R 8 , and R 9 is hydrogen. In these or other embodiments, each D is independently 1,5-cyclooctadiene, bicyclo[2.2.1]hepta-2,5-diene, 1,5-hexadiene, ethylene, dibenzo[a,e]cyclooctene, N,N,N’,N’-tetramethylethylenediamine, or acetonitrile.

[0070] In certain embodiments, the metal-ligand complex of component (C) undergoes two separate activation steps to hydrosilylate components (A) and (B) and cure the composition to provide a release coating. For example, in certain embodiments, component (C) may be an initial catalyst when incorporated into the composition. In these embodiments, subscript y is generally greater than 0 and D is present in the metal-ligand complex. D may be selected to inhibit the catalytic activity of M in the metal-ligand complex. During the first activation step, D can dissociate from M in the metal-ligand complex, giving a pre-catalyst where subscript y is 0 and D is absent. In certain embodiments, each L can bind to M via ethylenic unsaturation present in each L after dissociation of D. The second activation step results in a catalytically active form of M in the composition. In certain embodiments, each activation step is carried out without any specific initiation. In other embodiments, each activation step is carried out upon exposure to a high temperature, such as 50 - 200 °C.

[0071] In certain embodiments, component (C) includes an initial catalyst when incorporated into the composition, where subscript y is 1, D is 1,5-cyclooctadiene, x is 2, in each L, M is Pt, E is Si, R 1 and R 2 are independently selected alkyl groups, and each of R 3 , R 4 , R 5 , R 6 , R 7 , R 8 , and R 9 is hydrogen. In this embodiment, when R 1 and R 2 are methyl groups, the initial catalyst has the formula:

[0072] [Chemical formula] [where each subscript n is from 0 to 2].

[0073] In these or other embodiments, after D dissociates to obtain the precatalyst, i.e., when the subscript y is 0, the precatalyst has the formula:

[0074] [Chemical formula] [wherein each subscript n is independently from 0 to 2].

[0075] (C) The hydrosilylation reaction catalyst is present in the composition in a catalytic amount, i.e., an amount or quantity sufficient to promote curing under the desired conditions. The hydrosilylation reaction catalyst can be a single hydrosilylation reaction catalyst or a mixture containing two or more different hydrosilylation reaction catalysts.

[0076] (C) The catalytic amount of the hydrosilylation reaction catalyst can be more than 0.01 ppm to 10,000 ppm, or alternatively, more than 1,000 ppm to 5,000 ppm. Alternatively, a typical catalytic amount of (C) the hydrosilylation reaction catalyst is 0.1 ppm to 5,000 ppm, or 1 ppm to 2,000 ppm, or more than 0 to 1,000 ppm. Alternatively, the catalytic amount of (C) the hydrosilylation reaction catalyst can be 0.01 ppm to 1,000 ppm, or 0.01 ppm to 100 ppm, or 20 ppm to 200 ppm, or 0.01 ppm to 50 ppm of M based on the total weight of the composition.

[0077] The composition may further comprise one or more of (D) inhibitor, (E) anchorage additive, (F) anti-mist additive, (G) release modifier, and (H) vehicle.

[0078] In certain embodiments, the composition further comprises an inhibitor of (D). The inhibitor of (D) can be used to change the reaction rate or curing rate of the composition as compared to a composition comprising the same starting materials except that the inhibitor of (D) is omitted. The inhibitor of (D) is exemplified by acetylenic alcohols such as methylbutynol, ethynylcyclohexanol, dimethylhexynol, and 3,5-dimethyl-1-hexyn-3-ol, 1-butyn-3-ol, 1-propyn-3-ol, 2-methyl-3-butyn-2-ol, 3-methyl-1-butyn-3-ol, 3-methyl-1-pentyn-3-ol, 3-phenyl-1-butyn-3-ol, 4-ethyl-1-octyn-3-ol, and 1-ethynyl-1-cyclohexanol, and combinations thereof; cycloalkenyl siloxanes such as 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane, 1,3,5,7-tetramethyl-1,3,5,7-tetrahexenylcyclotetrasiloxane, and combinations thereof exemplified by methylvinylcyclosiloxane; enyne compounds such as 3-methyl-3-penten-1-yne, 3,5-dimethyl-3-hexen-1-yne; triazoles such as benzotriazole; phosphines; mercaptans; hydrazines; amines such as tetramethylethylenediamine; dialkyl fumarates, diallyl fumarates, dialkoxyalkyl fumarates, maleates such as diallyl maleate; nitriles; ethers; carbon monoxide; alkenes such as cyclooctadiene, divinyltetramethyldisiloxane; alcohols such as benzyl alcohol; and combinations thereof. Alternatively, the inhibitor of (D) may be selected from the group consisting of acetylenic alcohols (e.g., 1-ethynyl-1-cyclohexanol) and maleates (e.g., diallyl maleate, bismaleate, or n-propyl maleate), and combinations of two or more thereof.

[0079] Alternatively, the (D) inhibitor may be a silylated acetylene compound. Without being bound by theory, when a silylated acetylene compound is added, the yellowing of the reaction product prepared from the hydrosilylation of the composition is considered to be reduced when compared with the reaction product from the hydrosilylation of a composition not containing the silylated acetylene compound or a composition containing an organic acetylene alcohol inhibitor such as those described above.

[0080] The silylated acetylene compounds are exemplified by (3-methyl-1-butyn-3-oxy)trimethylsilane, ((1,1-dimethyl-2-propynyl)oxy)trimethylsilane, bis(3-methyl-1-butyn-3-oxy)dimethylsilane, bis(3-methyl-1-butyn-3-oxy)silane methylvinylsilane, bis((1,1-dimethyl-2-propynyl)oxy)dimethylsilane, methyl(tris(1,1-dimethyl-2-propynyloxy))silane, methyl(tris(3-methyl-1-butyn-3-oxy))silane, (3-methyl-1-butyn-3-oxy)dimethylphenylsilane, (3-methyl-1-butyn-3-oxy)dimethylhexenylsilane, (3-methyl-1-butyn-3-oxy)triethylsilane, bis(3-methyl-1-butyn-3-oxy)methyltrifluoropropylsilane, (3,5-dimethyl-1-hexyn-3-oxy)trimethylsilane, (3-phenyl-1-butyn-3-oxy)diphenylmethylsilane, (3-phenyl-1-butyn-3-oxy)dimethylphenylsilane, (3-phenyl-1-butyn-3-oxy)dimethylvinylsilane, (3-phenyl-1-butyn-3-oxy)dimethylhexenylsilane, (cyclohexyl-1-ethyn-1-oxy)dimethylhexenylsilane, (cyclohexyl-1-ethyn-1-oxy)dimethylvinylsilane, (cyclohexyl-1-ethyn-1-oxy)diphenylmethylsilane, (cyclohexyl-1-ethyn-1-oxy)trimethylsilane, and combinations thereof. Alternatively, the (D) inhibitor is exemplified by methyl(tris(1,1-dimethyl-2-propynyloxy))silane, ((1,1-dimethyl-2-propynyl)oxy)trimethylsilane, or combinations thereof. The silylated acetylene compounds useful as (D) inhibitors can be prepared by known methods in the art, such as silylating the above-mentioned acetylene alcohols with chlorosilane in the presence of an acid acceptor.

[0081] The amount of inhibitor (D) present in the composition depends on various factors including the desired bath life of the composition, whether the composition is a one - part or multi - part composition, the specific inhibitor used, and the selection and amounts of components (A) - (C). However, when present, the amount of inhibitor (D) may be 0% - 1%, or 0% - 5%, or 0.001% - 1%, or 0.01% - 0.5%, or 0.0025% - 0.025% based on the total weight of the composition.

[0082] Conventional compositions for preparing release coatings generally include a Karstedt catalyst (a platinum complex well - known in the art) in combination with an inhibitor to extend bath life and prevent premature curing. However, the combination of Karstedt catalyst and inhibitor in conventional compositions is known to cause undesirable precipitation and color changes over time, which is undesirable and a problem throughout the release coating industry. Precipitation negatively affects the performance characteristics of the release coating and shortens the bath life. In contrast, component (C) generally does not cause any precipitation or color change in the presence of inhibitor (D) (when utilized). Importantly, an inhibitor is always required with a conventional catalyst such as a Karstedt catalyst in conventional compositions for preparing release coatings, but considering the performance characteristics resulting from component (C), the inhibitor is optional.

[0083] In certain embodiments, the composition does not contain component (D). In other embodiments, component (D) is present. In certain embodiments, the composition contains component (D) in an amount giving a molar ratio of (D) / M in component (C) of 0 - 20:1, or 0 - 15:1, or greater than 0 to 15:1, or greater than 0 to 12:1, or greater than 0 to 9:1, or greater than 0 to 6:1, or greater than 0 to 3:1, or greater than 0 to 2:1, or greater than 1:1 to 10:1, or greater than 1:1 to 8:1, or greater than 1:1 to 6:1, or greater than 1:1 to 4:1, or greater than 1:1 to 2:1.

[0084] In certain embodiments, the composition further comprises (E) a fixing additive. Suitable fixing additives are exemplified by the reaction product of a vinylalkoxysilane and an epoxy-functional alkoxysilane; the reaction product of a vinylalkoxysilane and an epoxy-functional alkoxysilane; and a combination (e.g., a physical blend and / or reaction product) of a polyorganosiloxane having at least one aliphatic unsaturated hydrocarbon group and at least one hydrolyzable group per molecule and an epoxy-functional alkoxysilane (e.g., a combination of a hydroxy-terminated vinyl-functional polydimethylsiloxane and glycidoxypropyltrimethoxysilane). Alternatively, the fixing additive may comprise a polyorganosilicate resin. Suitable fixing additives and methods for their preparation are disclosed, for example, in U.S. Patent No. 9,562,149, U.S. Patent Application Publication Nos. 2003 / 0088042, 2004 / 0254274, and 2005 / 0038188, and European Patent No. 0 556 023.

[0085] Further examples of suitable fixing additives include transition metal chelates, hydrocarbonoxysilanes such as alkoxysilanes, combinations of alkoxysilanes and hydroxy-functional polyorganosiloxanes, or combinations thereof. The (E) fixing additive can be a silane having at least one substituent with an adhesion promoting group such as an epoxy, acetoxy, or acrylate group. The adhesion promoting group can additionally or alternatively be any hydrolyzable group that does not affect the (C) hydrosilylation reaction catalyst. Alternatively, the (E) fixing additive may comprise a partial condensate of such a silane, e.g., an organopolysiloxane having an adhesion promoting group. Or, alternatively, the (E) fixing additive may comprise a combination of an alkoxysilane and a hydroxy-functional polyorganosiloxane.

[0086] Alternatively, the (E) fixing additive may contain an unsaturated or epoxy-functional compound. The (E) fixing additive may contain an unsaturated or epoxy-functional alkoxysilane. For example, the functional alkoxysilane may contain at least one unsaturated organic group or an epoxy-functional organic group. The epoxy-functional organic group is exemplified by 3-glycidoxypropyl and (epoxycyclohexyl)ethyl. The unsaturated organic group is exemplified by 3-methacryloyloxypropyl, 3-acryloyloxypropyl, and unsaturated monovalent hydrocarbon groups such as vinyl, allyl, hexenyl, and undecylenyl. One specific example of the unsaturated compound is vinyltriacetoxysilane.

[0087] Specific examples of suitable epoxy-functional alkoxysilanes include 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, (epoxycyclohexyl)ethyldimethoxysilane, (epoxycyclohexyl)ethyldiethoxysilane, and combinations thereof. Examples of suitable unsaturated alkoxysilanes include vinyltrimethoxysilane, allyltrimethoxysilane, allyltriethoxysilane, hexenyltrimethoxysilane, undecylenyltrimethoxysilane, 3-methacryloyloxypropyltrimethoxysilane, 3-methacryloyloxypropyltriethoxysilane, 3-acryloyloxypropyltrimethoxysilane, 3-acryloyloxypropyltriethoxysilane, and combinations thereof.

[0088] (E) The fixing additive may also contain one or more reaction products or partial reaction products of these compounds. For example, in certain embodiments, the (E) fixing additive may contain a reaction product or partial reaction product of vinyltriacetoxysilane and 3-glycidoxypropyltrimethoxysilane. Alternatively or in addition thereto, the (E) fixing additive may contain an alkoxy or alkenyl-functional siloxane.

[0089] Alternatively, the (E) fixing additive may contain an epoxy-functional siloxane such as a reaction product of a hydroxy-terminated polyorganosiloxane and the above epoxy-functional alkoxysilane, or a physical blend of a hydroxy-terminated polyorganosiloxane and an epoxy-functional alkoxysilane. The (E) fixing additive may contain a combination of an epoxy-functional alkoxysilane and an epoxy-functional siloxane. For example, the (E) fixing additive is exemplified by a mixture of 3-glycidoxypropyltrimethoxysilane and a reaction product of hydroxy-terminated methylvinylsiloxane and 3-glycidoxypropyltrimethoxysilane, or a mixture of 3-glycidoxypropyltrimethoxysilane and hydroxy-terminated methylvinylsiloxane, or a mixture of 3-glycidoxypropyltrimethoxysilane and a hydroxy-terminated methylvinyl / dimethylsiloxane copolymer.

[0090] Alternatively, the (E) fixing additive may contain a transition metal chelate. Suitable transition metal chelates include titanates, zirconates such as zirconium acetylacetonate, aluminum chelates such as aluminum acetylacetonate, and combinations thereof. Alternatively, the (E) fixing additive may contain a combination of a transition metal chelate and an alkoxysilane, such as a combination of 3-glycidoxypropyltrimethoxysilane and an aluminum chelate or a zirconium chelate.

[0091] When used, the specific amount of the (E) fixing additive present in the composition depends on various factors including the type of substrate and whether a primer is used. In certain embodiments, the (E) fixing additive is present in the composition in an amount of 0 to 2 parts by weight per 100 parts by weight of component (B). Alternatively, the (E) fixing additive is present in the composition in an amount of 0.01 to 2 parts by weight per 100 parts by weight of component (B).

[0092] In certain embodiments, the composition further comprises a (F) anti-mist additive. The (F) anti-mist additive can be used in the composition to reduce or suppress silicone mist formation, particularly in coating processes using high-speed coating equipment. The (F) anti-mist additive may be a reaction product of an organohydrogen silicon compound, an oxyalkylene compound, or an organoalkenyl siloxane having at least three silicon-bonded alkenyl groups per molecule, and a suitable catalyst. Suitable anti-mist additives are disclosed, for example, in U.S. Patent Application Publication No. 2011 / 0287267, U.S. Patent Nos. 8,722,153, 6,586,535, and 5,625,023.

[0093] The amount of the (F) anti-mist additive utilized in the composition depends on various factors including the amounts and types of other starting materials selected for the composition. However, the (F) anti-mist additive is typically used in an amount of 0% to 10%, or 0.1% to 3%, based on the total weight of the composition.

[0094] In certain embodiments, the composition further comprises a (G) release modifier that can be used in the composition to control (reduce) the level of the release force (the adhesion force between the release coating formed from the composition and its adherend, such as a label containing a pressure-sensitive adhesive). By adjusting the level or concentration of the (G) release modifier, a release coating having the required or desired release force can be formulated from a composition that does not contain the modifier. Examples of suitable release modifiers for component (G) include trimethylsiloxy-terminated dimethyl, phenylmethyl siloxane. Alternatively, the (G) release modifier may be a condensation reaction product of an organopolysiloxane resin having a hydroxyl group or an alkoxy group and a diorganopolysiloxane having at least one hydroxyl group or a hydrolyzable group. Examples of suitable release modifiers are disclosed, for example, in U.S. Patent No. 8,933,177 and U.S. Patent Application Publication No. 2016 / 0053056. When utilized, the (G) release modifier may be present in the composition in an amount of 0 to 85 parts by weight, or 25 to 85 parts, per 100 parts of component (A).

[0095] In certain embodiments, the composition further comprises a (H) vehicle. The (H) vehicle typically solubilizes the components of the composition, and when the components are solubilized, the (H) vehicle may also be referred to as a solvent. Suitable vehicles include both linear and cyclic silicones, organic oils, organic solvents, and mixtures thereof.

[0096] Typically, the (H) vehicle, when present in the composition, is an organic liquid. Organic liquids include those considered to be oils or solvents. Organic liquids are exemplified by, but not limited to, aromatic hydrocarbons, aliphatic hydrocarbons, alcohols having more than three carbon atoms, aldehydes, ketones, amines, esters, ethers, glycols, glycol ethers, alkyl halides, and halogenated aromatics. Hydrocarbons include isododecane, isohexadecane, Isopar L (C11 - C13), Isopar H (C11 - C12), hydrogenated polydecene, aromatic hydrocarbons, and halogenated hydrocarbons. Ethers and esters include isodecyl neopentanoate, neopentyl glycol heptanoate, glycol distearate, dicaprylyl carbonate, diethylhexyl carbonate, propylene glycol n-butyl ether, ethyl-3 ethoxypropionate, propylene glycol methyl ether acetate, tridecyl neopentanoate, propylene glycol methyl ether acetate (PGMEA), propylene glycol methyl ether (PGME), octyldodecyl neopentanoate, diisobutyl adipate, diisopropyl adipate, propylene glycol dicaprylate / dicaprate, octyl ether, and octyl palmitate. Additional organic fluids suitable as ingredients for the independent compound or the (H) vehicle include fats, oils, fatty acids, and fatty alcohols. The (H) vehicle also has a viscosity of 1 - 1,000 mm at 25°C 2A low-viscosity organopolysiloxane or a volatile methylsiloxane or a volatile ethylsiloxane or a volatile methyl ethylsiloxane having a viscosity in the range of / second, for example, hexamethylcyclotrisiloxane, octamethylcyclotetrasiloxane, decamethylcyclopentasiloxane, dodecamethylcyclohexasiloxane, octamethyltrisiloxane, decamethyltetrasiloxane, dodecamethylpentasiloxane, tetradecamethylhexasiloxane, hexadecamethylheptasiloxane, heptamethyl-3-{ (trimethylsilyl)oxy)}trisiloxane, hexamethyl-3,3,bis{(trimethylsilyl)oxy}trisiloxane pentamethyl{(trimethylsilyl)oxy}cyclotrisiloxane, and polydimethylsiloxane, polyethylsiloxane, polymethyl ethylsiloxane, polymethylphenylsiloxane, polydiphenylsiloxane, caprylyl methicone, and any mixture thereof may be used.

[0097] In certain embodiments, the (H) vehicle is selected from polyalkylsiloxane; tetrahydrofuran; mineral spirit; naphtha; alcohols such as methanol, ethanol, isopropanol, butanol, or n-propanol; ketones such as acetone, methyl ethyl ketone, or methyl isobutyl ketone; aromatic hydrocarbons such as benzene, toluene, or xylene; aliphatic hydrocarbons such as heptane, hexane or octane; glycol ethers such as propylene glycol methyl ether, dipropylene glycol methyl ether, propylene glycol n-butyl ether, propylene glycol n-propyl ether, or ethylene glycol n-butyl ether; or combinations thereof.

[0098] (H) The amount of the vehicle depends on various factors including the selected type of vehicle and the amounts and types of other components present in the composition. However, the amount of the (H) vehicle in the composition can be from 0% to 99% or from 2% to 50% based on the total weight of the composition. The (H) vehicle can be added during the preparation of the composition, for example, to assist in mixing and delivery. Optionally, all or part of the (H) vehicle may be removed after the composition has been prepared, including before and / or simultaneously with the preparation of the release coating from the composition. In certain embodiments, the composition does not contain the (H) vehicle, the composition is solvent-free, and does not contain a solvent and vehicle such as an organic solvent.

[0099] Other optional components may be present in the composition, including, for example, reactive diluents, fragrances, preservatives, colorants, dyes, pigments, antioxidants, heat stabilizers, flame retardants, flow control additives, biocides, fillers (including extender and reinforcing fillers), surfactants, thixotropic agents, pH buffers, etc. The composition may be in any form and may be incorporated into a further composition.

[0100] Alternatively, the composition and the release coating formed therefrom may contain no particulates or only a limited amount of particulates, such as from 0 to 30% by weight of the composition (e.g., fillers and / or pigments). The particulates may agglomerate or otherwise stick to the coating equipment used to form the release coating. Further, if optical transparency is desired, the particulates may interfere with the optical properties of the release coating and the release liner formed using it, e.g., transparency. The particulates may be disadvantageous for adhesion to the adherend.

[0101] In certain embodiments, the composition does not contain a fluoroorganosilicon compound. During curing, due to its low surface tension, the fluorine compound can rapidly migrate to the interface of the composition, or the release coating formed using the composition, and the substrate to which the composition is applied and the release coating is formed, such as the composition / PET film interface. Such migration may prevent the adhesion of the release coating (prepared by curing the composition) to the substrate by creating a fluorine-containing barrier. By creating the barrier, the fluoroorganosilicon compound can prevent the components of the composition from reacting at the interface and affecting curing and related properties. Further, fluoroorganosilicon compounds are usually expensive.

[0102] The curable form of the composition can be prepared by combining components (A)-(C), and any of the above optional components, in any order of addition, optionally with a masterbatch, and optionally under shear. As described in more detail below, the composition can be a one-component composition, a two-component composition or 2K composition, or a multi-component composition. For example, components (A), (B), and (C) may be present in the same part or in different parts up to the formation of a bath for preparing the release coating.

[0103] In certain embodiments, the composition has a bath life of 10 minutes, or 20 minutes, or 30 minutes, or 40 minutes at 40°C. In certain embodiments, the composition has such a bath life even in the absence of any (D) inhibitor. The bath life is the time it takes for the viscosity of the composition to double at 40°C and thus serves as an indicator of stability. A longer bath life indicates better coating performance. As is understood in the art, the viscosity can be continuously measured at 40°C using a suitable viscometer, such as a Brookfield DV2TLV viscometer. Conventional compositions for preparing release coatings can generally achieve such a bath life only by using a significant concentration of inhibitors.

[0104] A method of preparing a coated substrate with a composition involves applying, i.e., disposing, the composition onto the substrate. The method further includes curing the composition on the substrate, resulting in the formation of a release coating on the substrate to obtain a coated substrate. Curing can be carried out by heating at a high temperature, for example, 50 °C to 200 °C, or 50 °C to 180 °C, or 50 °C to 160 °C to obtain a coated substrate. One skilled in the art will be able to select an appropriate temperature depending on various factors including the components of the composition and the choice of materials for the substrate composition or structure.

[0105] The composition can be disposed or dispensed onto the substrate in any suitable manner. Typically, the composition is applied in a wet form by wet coating techniques. The composition can be applied by i) spin coating, ii) brush coating, iii) drop coating, iv) spray coating, v) dip coating, vi) roll coating, vii) flow coating, viii) slot coating, ix) gravure coating, x) Meyer bar coating, or xi) any combination of two or more of i) - x). Typically, by disposing the composition onto the substrate, a wet deposit is formed on the substrate, which is then cured to obtain a coated substrate including a cured film, i.e., a release coating formed from the composition on the substrate.

[0106] The substrate is not limited and can be any substrate. The release coating may be separable from the substrate or, depending on its selection, may be physically and / or chemically bonded to the substrate. The substrate may have an integrated hot plate or an integrated or standalone furnace for curing the wet deposit. The substrate may optionally have continuous or discontinuous shapes, sizes, dimensions, surface roughness, and other properties. Alternatively, the substrate may have a high softening point temperature. However, the composition and method are not so limited.

[0107] Alternatively, the substrate may comprise a plastic that may be thermosetting and / or thermoplastic. However, the substrate may alternatively be or comprise glass, metal, cellulose (e.g., paper), wood, cardboard, paperboard, silicone, or a polymeric material, or combinations thereof.

[0108] Specific examples of suitable base materials include paper base materials such as kraft paper, polyethylene-coated kraft paper (PEK-coated paper), thermal paper, and plain paper; polymer base materials such as polyamide (PA); polyesters such as polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polytrimethylene terephthalate (PTT), polyethylene naphthalate (PEN), and liquid crystal polyester; polyolefins such as polyethylene (PE), polypropylene (PP), and polybutylene; styrene resin; polyoxymethylene (POM); polycarbonate (PC); polymethylenemethacrylate (PMMA); polyvinyl chloride (PVC); polyphenylene sulfide (PPS); polyphenylene ether (PPE); polyimide (PI); polyamideimide (PAI); polyetherimide (PEI); polysulfone (PSU); polyethersulfone; polyketone (PK); polyetherketone; polyvinyl alcohol (PVA); polyetheretherketone (PEEK); polyetherketoneketone (PEKK); polyarylate (PAR); polyethernitrile (PEN); phenol resin; phenoxy resin; cellulose such as triacetyl cellulose, diacetyl cellulose, and cellophane; fluorinated resins such as polytetrafluoroethylene;Thermoplastic elastomers such as polystyrene type, polyolefin type, polyurethane type, polyester type, polyamide type, polybutadiene type, polyisoprene type, fluoro type; and their copolymers and combinations are included.

[0109] The composition, or wet deposit, is typically cured at an elevated temperature for a period of time. The time is typically sufficient to effect curing of the composition, i.e., crosslinking. The period can be greater than 0 hours to 8 hours, or greater than 0 hours to 2 hours, or greater than 0 hours to 1 hour, or greater than 0 minutes to 30 minutes, or greater than 0 minutes to 15 minutes, or greater than 0 minutes to 10 minutes, or greater than 0 minutes to 5 minutes, or greater than 0 minutes to 2 minutes, or greater than 0 minutes to 1 minute, or greater than 0 seconds to 50 seconds, or greater than 0 seconds to 40 seconds, or greater than 0 seconds to 30 seconds, or greater than 0 seconds to 20 seconds, or greater than 0 seconds to 10 seconds, or greater than 0 seconds to 5 seconds. The period depends on various factors including the elevated temperature utilized, the temperature selected, the desired peel coating thickness, and the presence or absence of any vehicle in the composition.

[0110] Curing of the composition typically has a dwell time of 0.1 seconds to 50 seconds, or 0.5 seconds to 30 seconds, or 1 second to 10 seconds. The dwell time selected can vary depending on the substrate selected, the temperature selected, and the line speed. As used herein, dwell time refers to the time the composition or wet deposit is exposed to the elevated temperature. Dwell time is distinguished from cure time because there can be ongoing curing even after the composition, wet deposit, or its partially cured reaction intermediate is no longer exposed to the elevated temperature at which curing typically begins. Alternatively, the coated substrate can be prepared on a conveyor belt in an oven, and the dwell time can be calculated by dividing the length of the oven (e.g., in meters) by the line speed of the conveyor belt (e.g., in meters / second). In some embodiments, the dwell time can be equal to the period during which the composition or wet deposit cures.

[0111] The period can be subdivided into cycles of curing, for example, a first curing and a post-curing. The first curing is, for example, 1 hour and the post-curing is, for example, 3 hours. The high temperature may be independently selected from any temperature above room temperature in such cycles and may be the same in each cycle.

[0112] (H) Depending on the optional presence and selection of the vehicle, the curing of the composition may also include a drying step. For example, when the composition contains a (H) vehicle, the curing step typically also excludes the drying, evaporation, or removal of the (H) vehicle from the composition. Drying may be carried out simultaneously with curing or separately from curing.

[0113] Depending on the thickness and other dimensions of the release coating and the coating substrate, the coating substrate can be formed via a repetitive process. For example, a first deposit can be formed and exposed to a first high temperature for a first period to obtain a partially cured deposit. Then, a second deposit is placed on the partially cured deposit and exposed to a second high temperature for a second period to obtain a second partially cured deposit. This partially cured deposit also further cures while being exposed to the second high temperature for the second period. A third deposit is placed on the second partially cured deposit and exposed to a third high temperature for a third period to obtain a third partially cured deposit. The second partially cured deposit also further cures while being exposed to the second high temperature for the second period. To construct the coating substrate as desired, for example, this process can be repeated 1 to 50 times. The composite of the partially cured layers can be exposed to a final post-curing, for example, the high temperature and period described above. Each high temperature and period can be independently selected and may be the same as or different from each other. When the coating substrate is formed via a repetitive process, each deposit can be independently selected and may differ in terms of the components selected in the composition, their amounts, or both. Alternatively, further, each repeating layer can be fully cured as well as only partially cured in such a repetitive process.

[0114] Alternatively, each deposit may include a wet film or may be a wet film. Alternatively, the iterative process may be wet-on-wet, depending on the cured state of the partially cured layer. Alternatively, the iterative process may be wet-on-dry.

[0115] A coated substrate comprising a release coating formed from a composition on a substrate can have various dimensions including the relative thicknesses of the release coating and the substrate. The release coating can have a thickness that varies depending on its end-use application. The release coating can have a thickness greater than 0 to 4,000 μm, or greater than 0 to 3,000 μm, or greater than 0 to 2,000 μm, or greater than 0 to 1,000 μm, or greater than 0 to 500 μm, or greater than 0 to 250 μm. However, other thicknesses are also contemplated, for example, 0.1 to 200 μm. For example, the thickness of the release coating can be 0.2 μm to 175 μm, or 0.5 to 150 μm, or 0.75 to 100 μm, or 1 to 75 μm, or 2 to 60 μm, or 3 to 50 μm, or 4 to 40 μm. Alternatively, when the substrate is plastic, the release coating can have a thickness greater than 0 to 200, or greater than 0 to 150 μm, or greater than 0 to 100 μm.

[0116] If desired, the release coating may be subjected to further processing depending on its end use. For example, the release coating may be subjected to oxide deposition (e.g., SiO2 deposition), resist deposition and patterning; etching; chemical, corona, or plasma stripping, metal coating, or metal deposition. Such further processing techniques are generally known. Such deposition may be chemical vapor deposition (such as low-pressure chemical vapor deposition, plasma-enhanced chemical vapor deposition, and plasma-assisted chemical vapor deposition), physical vapor deposition, or other vacuum deposition techniques. Many such further processing techniques involve high temperatures, especially vacuum deposition, and considering the excellent thermal stability, the release coating is well-suited thereto. However, depending on the end use of the release coating, a release coating that has been subjected to such further processing can be utilized.

[0117] The coating substrate can be used for various end uses. For example, the coating substrate can be used for coating applications, packaging applications, adhesive applications, fiber applications, fabric or textile applications, architectural applications, transportation applications, electronics applications, or electrical applications. However, the composition can be used for end uses other than preparing the coating substrate, for example, preparing articles such as silicone rubber.

[0118] Alternatively, the coating substrate can be used as a release liner for tapes or adhesives, including, for example, acrylic resin-based pressure-sensitive adhesives, rubber-based pressure-sensitive adhesives, and silicone-based pressure-sensitive adhesives, as well as any pressure-sensitive adhesives such as acrylic resin-based adhesives, synthetic rubber-based adhesives, silicone-based adhesives, epoxy resin-based adhesives, and polyurethane-based adhesives. Each major surface of the substrate can have a release coating disposed thereon for double-sided tapes or adhesives.

[0119] Alternatively, when formulating the composition to prepare the release coating, the composition can be prepared, for example, by mixing the components together to prepare a one-component composition. However, it may be desirable to prepare the composition as a multi-component composition in which components having SiH functional groups (e.g., (B) organosilicon compounds) and (C) hydrosilylation reaction catalysts are stored in separate parts until they are combined at the time of use (e.g., immediately before coating on the substrate).

[0120] For example, the multi-component curable composition a base part containing (A), an organopolysiloxane containing on average at least two silicon-bonded ethylenically unsaturated groups per molecule, and (C) a hydrosilylation reaction catalyst, and, if present optionally, one or more of the optional components (E) to (H), and a curing agent part containing (B), an organosilicon compound having on average at least two silicon-bonded hydrogen atoms per molecule, and, if present optionally, one or more of the optional components (E) to (H), It may include. The (A) part and the (B) part may be provided in a kit together with instructions for, for example, a method of combining the parts to prepare the composition, a method of applying the composition to a substrate, and a method of curing the composition.

[0121] As described above, the composition can be applied to a substrate by any convenient means such as spraying, doctor blading, dipping, screen printing, etc., or by a roll coater, for example, an offset web coater, a kiss coater, or an etched cylinder coater.

[0122] The composition of the present invention can be applied to any substrate such as those described above. Alternatively, the composition can also be applied to a polymer film substrate, such as a polyester film, particularly a polyethylene terephthalate (PET) film, a polyethylene film, a polypropylene film, or a polystyrene film. The composition can also be applied to a paper substrate, for example, plastic-coated paper such as paper coated with polyethylene, glassine, supercalendered paper, or clay-coated kraft. The composition can also be applied to a metal foil substrate, for example, an aluminum foil.

[0123] In certain embodiments, the method of preparing the coated substrate may further include treating the substrate before applying or disposing the composition on the substrate. The treatment of the substrate can be carried out by any convenient means such as plasma treatment or corona discharge treatment. Alternatively, the substrate can be treated by applying a primer. In a specific example, when the substrate is treated before forming a release coating on the substrate from the composition, the adhesion of the release coating can be improved.

[0124] When the composition contains a (H) vehicle, the method may further include removing the (H) vehicle, and the removal can be carried out by any conventional means such as heating at 50 °C to 100 °C for a time sufficient to remove all or part of the (H) vehicle. The method may further include curing the composition to form a release coating on the surface of the substrate. The curing can be carried out by any conventional means such as heating at 100 °C to 200 °C.

[0125] Under the conditions of the production coater, the curing can be carried out at an air temperature of 120 °C to 150 °C with a residence time of 1 second to 6 seconds, or 1.5 seconds to 3 seconds. The heating can be carried out in an oven, for example, an air circulation oven or a tunnel furnace, or by passing the substrate with a wet deposit on top around a heated cylinder.

[0126] The following examples are intended to illustrate the present invention and should in no way be regarded as limiting the scope of the present invention.

[0127] Certain specific components used in the examples are listed in Table 1 below.

[0128]

Table 1

[0129] Basic Procedure 1: Examples 1 - 4 and Comparative Examples 1 - 4 Compositions for preparing release coatings were prepared according to Basic Procedure 1 for Examples 1 - 4 and Comparative Examples 1 - 4. The specific amounts of each component used in the compositions of Examples 1 - 4 and Comparative Examples 1 - 4 are detailed in Tables 2 and 3 below.

[0130] In Basic Procedure 1, in some cases, all of the respective components of Examples 1 to 4 and Comparative Examples 1 to 4, excluding the catalyst blend of the present invention or the conventional catalyst blend, were mixed by a dental mixer at 3500 revolutions per minute (rpm) for 1 minute to obtain a mixture. Then, in some cases, the catalyst blend of the present invention or the conventional catalyst blend was placed in the mixture to obtain a composition, and the composition was mixed by a dental mixer at 3500 rpm for 1 minute. In all of the compositions of Examples 1 to 4 and Comparative Examples 1 to 4, the platinum content was the same at 93 ppm, and the total ratio of silicon-bonded hydrogen atoms to silicon-bonded vinyl groups was the same at 2 / 1 mol / mol (SiH to SiVi). In Table 3, C.E. indicates a comparative example. In these examples, references to platinum or metal content relate to the platinum or metal itself and not to any ligands present in the complex.

[0131]

Table 2

[0132]

Table 3

[0133] The compositions of Examples 1 to 4 and Comparative Examples 1 to 4 were analyzed for bath life. Compositions for stripping coatings are generally formulated in baths, and it is desirable to maximize bath life to prevent premature hardening of the composition during the working process. Bath life can be extended by conventional means such as incorporating inhibitors into the composition, but such conventional means also inhibit curing at the same time. However, while it is desirable to maximize bath life, it is also desirable to minimize the curing time and the temperature at which the composition cures, as described below. In general, it is difficult to extend bath life while providing a desirable (low) curing temperature and a related shorter curing time.

[0134] Bulk bath life test: Each composition was continuously tested with a Brookfield DV2TLV viscometer at a specified temperature (either 23°C or 40°C). The bulk bath life is the time it takes for the viscosity of the composition to double at the specified temperature. A longer bulk bath life indicates better coating performance.

[0135] Thin film bath life: Each composition was applied via a 2-mil Bird Bar onto a 2-mil polyethylene terephthalate (PET) film on a flat platform to obtain a wet coating on the PET film. The thin film bath life is the time required for the wet coating to gel at room temperature. Gelation was measured by the finger test method to check the wet coating on the PET film every 1 minute for the first 5 minutes and then every 5 minutes thereafter. The time it takes for the wet coating to change from a smear (where the wet coating is completely liquid and can level itself after being rubbed with a finger) to a smudge (where the wet coating cannot level itself after being rubbed with a finger) or hardening (where the wet coating becomes completely solid) was reported as the thin film bath life. A longer thin film bath life indicates better coating performance.

[0136] Tables 4 and 5 show the bulk bath life and thin film bath life of the compositions of Examples 1 to 4 and Comparative Examples 1 to 4. In Table 5, TSTT means "too short to be tested", indicating that the bulk bath life or thin film bath life was less than 1 minute, which is particularly undesirable in the industrial liner production process due to gelation that has an undesirable effect on the coater and coater roll and is completely unacceptable.

[0137]

Table 4

[0138]

Table 5

[0139] As shown by the above examples, when conventional catalyst blends and compositions based on catalysts have the same inhibitor / Pt molar ratio, for example, in Example 2 versus Comparative Example 2, the catalyst gave Example 2 a thin film bath life of 240 minutes and a 40°C / 23°C bulk bath life of 98 / 731 minutes. In contrast, the conventional catalyst blend gave Comparative Example 2 a thin film bath life and a 40°C / 23°C bulk bath life that were too short to be tested. Comparative Example 1 had a thin film bath life and a bulk bath life that could be tested, but Comparative Example 1 had an inhibitor / Pt molar ratio that was 700% higher than that of Comparative Example 2, while the inhibitor is not required in the composition containing the catalyst (e.g., as in Examples 1 and 4).

[0140] Coated substrates were prepared using the compositions of Examples 2 - 3 and Comparative Example 1. The physical properties were measured as follows.

[0141] Curing performance: percentage of extractable matter The curing performance of a specific composition was evaluated by determining the percentage value of extractable matter (extractable matter %). Specifically, to measure the extractable matter %, each composition was coated and cured on a substrate (glassine paper) to form a coated substrate. This coated substrate was cut into three sample disks (die cutter, 1.375 inches (3.49 cm)) and handled only with tweezers to minimize contamination and / or damage. The coated substrate includes a release coating formed by curing each composition on the substrate. Each sample disk was analyzed by X-ray fluorescence (XRF) to determine the initial coating weight (W i sAfter determining [[ID=]], it was placed in individual bottles (100 mL, covered with lids) containing a solvent (methyl isobutyl ketone, 40 mL) and left standing on the laboratory bench for 30 minutes for immersion. XRF was performed using a Rigaku NEX QC+QC1499 XRF analyzer. Subsequently, each sample disk was taken out of the bottle, placed on a clean surface (tissue paper) with the coated side up, and the residual solvent was allowed to evaporate (without sucking / wiping), and analyzed by XRF to obtain the final coating weight (W f s ). The extractable percentage of each peelable coating is the change rate of the coating weight from solvent immersion, that is, the formula: [(W i s -W f s ) / Wi×100%). The extractable percentage indicates the amount of non-cured components (e.g., uncrosslinked silicone) of the composition extractable from the peelable coating of the coating substrate. A lower extractable percentage indicates higher / better curing performance.

[0142] Curing performance: Fixation (ROR%) The fixation of a specific composition was evaluated through the fixation index, that is, by determining the percent rub-off resistance (ROR%) value. Specifically, each composition was coated and cured on a substrate (glassine paper) to form a coated substrate. Immediately after curing, the coated substrate was cut into two sample disks (using a cutter, 1.375 inches (3.49 cm)), and each sample disk was analyzed by XRF to obtain the initial coating weight (W i a ). Next, each sample disk was abraded with a felt under load (1.9 kg) using an automatic abrasion device in a manner similar to a Taber-type abrasion test (e.g., ASTM D4060-19, "Standard Test Method for Abrasion Resistance of Organic Coatings by the Taber Abraser"), and then analyzed by XRF to determine the final coating weight (W f a ). The ROR% of each sample was calculated using the formula: [W f s / W is It is calculated using (×100%). ROR% indicates the strength with which a specific release coating adheres to the substrate, and the higher the ROR%, the higher / better the adhesion. The ROR% was also measured after aging each coated substrate at room temperature (RT) for 1 month.

[0143] Table 6 below shows the extractable content %, ROR%, and ROR% after aging for 1 month at RT for the release coatings formed using the compositions of Comparative Example 1 and Examples 2 and 3. In the first column, the curing conditions relate to the oven temperature (either 180°C or 160°C) and the residence time (either 6 seconds or 3 seconds).

[0144]

Table 6

[0145] In addition to the extractable content % and ROR%, the peel strength of the release coatings formed with the compositions of Comparative Example 1 and Examples 2 and 3 was measured. The coated substrates were laminated with Tesa 7475 tape and aged at room temperature and 50% RH for 7 days and 1 month under a 40-pound weight. Then, the coated substrates were peeled from the tape at 180 degrees at various speeds, namely 0.3 m / min (MPM), 10 m / min (MPM), 100 m / min (MPM), and 300 m / min (MPM). The peel strength was measured using an Imass SP-2100 and ZPE-1100W peel test system. The peel strength for the release coatings cured under different curing conditions was measured. The curing conditions relate to the oven temperature (either 180°C or 160°C) and the residence time (either 6 seconds or 3 seconds). The values of the peel strength after 7 days of aging and after 1 month of aging are shown in Tables 7 - 10 below.

[0146]

Table 7

[0147]

Table 8

[0148]

Table 9

[0149]

Table 10

[0150] Example 5 and Comparative Example 5: Example 5 and Comparative Example 5 prepared compositions for preparing the release coating. The specific amounts of each component used in the compositions of Example 5 and Comparative Example 5 are detailed in Table 11 below.

[0151]

Table 11

[0152] To prepare the compositions of Example 5 and Comparative Example 5, in some cases, Base Composition 3 and a conventional catalyst blend or the catalyst blend of the present invention were combined and mixed to obtain a mixture. Each mixture was aged at room temperature under air in a capped vial. The color change of each mixture was monitored over time. Then, an organosilicon compound (B2) was added to each mixture to obtain a composition, and this composition was mixed with a dental mixer at 3500 RPM for 30 seconds. Then, each composition was analyzed by differential scanning calorimetry (DSC) and visually inspected for its appearance over time. DSC was measured by heating each composition from 40°C to 200°C under N2 via a TA DSC-2500 DSC. In each composition, the platinum content was the same at 93 ppm, and the total ratio of silicon-bonded hydrogen atoms to silicon-bonded vinyl groups was the same at 2 / 1 mol / mol (SiH vs. SiVi). Tables 12 and 13 below describe the DSC data for the compositions of Example 5 and Comparative Example 5 at various time intervals, respectively. In Tables 12 and 13, the appearance is reported for both the mixture without the organosilicon compound (B2) and the composition containing the organosilicon compound (B2) based on visual inspection.

[0153]

Table 12

[0154]

Table 13

[0155] As demonstrated by Table 13, the combination of a conventional catalyst blend and an inhibitor caused undesirable precipitation and color change over time for the composition of Comparative Example 5, which is undesirable and problematic in the overall release coating industry. Similarly, as shown in Table 13, when the composition of Comparative Example 5 containing a conventional catalyst blend and an inhibitor was aged, the curing performance gradually deteriorated, T ピーク 、T 95and the viscosity doubling time at 80 °C increased dramatically over time. Furthermore, in the composition of Comparative Example 5, color change and precipitation also increased over time. In contrast, the catalyst of the present invention has no problem of compatibility with the inhibitor, as demonstrated by the composition of Example 5 in which the curing performance does not change over time (T ピーク , T 95 , and the viscosity doubling time at 80 °C remains almost unchanged). Furthermore, with respect to Example 5, neither color change nor precipitation was observed.

[0156] The present invention has been described in an illustrative manner, and it is to be understood that the terminology used is intended to be of a descriptive nature rather than of a limiting nature. Clearly, many modifications and variations of the present invention are possible from the above teachings. The present invention can be practiced otherwise than as specifically described herein.

Claims

1. A composition for preparing a release coating, comprising: (A) at least one RSiO 3/2 siloxy unit or at least one SiO 4/2 an organopolysiloxane containing a siloxy unit [wherein, R is a substituted or unsubstituted hydrocarbyl group], and having on average at least two silicon-bonded ethylenically unsaturated groups per molecule, (A) an organopolysiloxane, and (B) an organosilicon compound having on average at least two silicon-bonded hydrogen atoms per molecule; (C) A hydrosilylation catalyst having the formula ML x D y [wherein M is a metal, x is equal to the oxidation state of M, each D is independently a neutral coordination ligand, y is zero or an integer from 1 to 4, and Each L is independently of the formula: 【Chemical 1】 (wherein each R 1 and R 2 is independently a halide, or C 1 to C 6 alkyl, C 3 to C 8 cycloalkyl, C 3 to C 8 heterocycloalkyl, C 6 to C 10 alkylaryl, C 1 to C 6 alkoxy, C 6 to C 10 aryl, C 6 to C 10 heteroaryl, silyl, C 2 to C 8 alkenyl, C 2 to C 8 alkynyl, C 1 to C 6 hydroxyl, C 3 to C 10 arylene, C 3 to C 10 heteroarylene, C 2 to C 10 alkenylene, C 3 to C 10 cycloalkenylene, and C 2 to C 10 is a substituted or unsubstituted group selected from alkynylene, R 3 、R 4 、R 5 、R 6 、R 7 、R 8 、and R 9 are each independently a monoanionic ligand having a substituent or unsubstituted group selected from hydrogen, halide, or C 1 - C 6 alkyl, C 3 - C 8 cycloalkyl, C 3 - C 8 heterocycloalkyl, C 6 - C 10 alkylaryl, C 1 - C 6 alkoxy, C 6 - C 10 aryl, C 6 - C 10 heteroaryl, silyl, C 2 - C 8 alkenyl, C 2 - C 10 alkynyl, C 1 - C 6 hydroxyl, C 3 - C 10 arylene, C 3 - C 10 heteroarylene, C 2 - C 10 alkenylene, C 3 - C 10 cycloalkenylene, and C 2 - C 10 alkynylene). E is C or Si] a hydrosilylation catalyst comprising a metal-ligand complex having; A composition comprising.

2. In the metal-ligand complex of component (C), (i) M is a platinum group metal selected from Ru, Rh, Pd, Os, Ir, and Pt, (ii) E is Si, (iii) R 1 and R 2 is an independently selected alkyl group, (iv) each of R 3 , R 4 , R 5 , R 6 , R 7 , R 8 , and R 9 is hydrogen, or (v) is any combination of (i) to (iv), The composition according to claim 1.

3. (i) each D is independently 1,5-cyclooctadiene, bicyclo[2.2.1]hepta-2,5-diene, 1,5-hexadiene, ethylene, dibenzo[a,e]cyclooctene, N,N,N',N'-tetramethylethylenediamine, cyclooctatriene, norbornadiene, or cyclooctene; (ii) the composition does not contain an organic polyol; or (iii) both (i) and (ii). The composition according to claim 1 or 2.

4. The metal-ligand complex of component (C) has one of the following formulas: [Chemical Formula 2] [wherein each n is independently 0 to 2]. The composition according to any one of claims 1 to 3.

5. wherein the (A) organopolysiloxane has the formula (R 3 SiO 1/2 )( x (R 2 SiO 2/2 )( z (SiO 4/2 ), wherein each R is independently a substituted or unsubstituted hydrocarbyl group, provided that at least two of the Rs are independently selected ethylenically unsaturated groups, the subscript x is from 0.05 to 4, and the subscript z is from 1 to 3,000); a composition according to any one of claims 1 to 4.

6. wherein the (B) organosilicon compound is of the formula: H y’ R 10 3-y’ Si-(OSiR 10 2 ) m -(OSiR 10 H) m’ -OSiR 10 3-y’ H y’ [wherein each R 10 is an independently selected hydrocarbyl group that does not contain aliphatic unsaturation, each y' is independently selected from 0 or 1, and the subscripts m and m' are each independently from 0 to 1,000, provided that m and m' are not simultaneously 0, and m + m' is from 1 to 1,000] or the (B) organosilicon compound is of the formula: [(HR 10 SiO 2/2 ) a (-R 10 SiO 3/2 ) b c [(R 10 2 SiO 2/2 ) w d [wherein each R 10 is independently selected and as defined above, the subscript a is from 0 to 10, the subscript b is from 1 to 4, provided that (a + b) = 3 to 12, 0 < c < 100, 2 ≤ w ≤ 2,000, 0 < d < 100, provided that c > d], the composition according to any one of claims 1 to 5.​​

7. (i) the (B) organosilicon compound comprises an organohydridosiloxane containing on average at least two pendant silicon-bonded hydrogen atoms per molecule; (ii) the molar ratio of SiH to silicon-bonded ethylenically unsaturated groups in components (A) and (B) is from 1:1 to 5:1; or (iii) both (i) and (ii). The composition according to any one of claims 1 to 6.

8. When components (A) to (C) are combined in the absence of any inhibitor, the composition has a bath life of at least 20 minutes at 40°C. The composition according to any one of claims 1 to 7.

9. Further comprising at least one of (D) an inhibitor, (E) an anchoring additive, (F) an anti-mist additive, and / or (G) a release modifier. The composition according to any one of claims 1 to 7.

10. A method for preparing a composition according to any one of claims 1 to 9, comprising combining the (A) organopolysiloxane, the (B) organopolysiloxane, and the (C) hydrosilylation catalyst to obtain a composition.

11. The method according to claim 10, further comprising preparing the (C) hydrosilylation catalyst.

12. A method for forming a coated substrate, the method comprising: applying the composition onto a substrate; Curing the composition to provide a release coating on the substrate, thereby forming the coated substrate, and The method, wherein the composition is the composition according to any one of claims 1 to 9.

13. The method according to claim 12, wherein the substrate comprises cellulose and / or a polymer.

14. A coated substrate comprising a release coating disposed on a substrate formed according to the method of claim 12 or 13.