Method for manufacturing ultra-high performance metal laminated components

Abstract

The present invention relates to a method for manufacturing components from materials consisting of metals, alloys, ceramics, and organic components (particularly suitable for the manufacture of components, composite parts, and / or parts). The method is particularly suitable for the manufacture of high-performance components by a cost-effective method. The method also enables the replication of biomimetic structures with optimized topology and other advanced structures.

Description

Technical Field

[0001] The present invention relates to a method particularly suitable for manufacturing components from materials composed of metals, alloys, ceramics, organic components and / or mixtures thereof. The present invention further relates to components manufactured by these methods.

Background Art

[0002] There are numerous inventions for manufacturing complex-shaped components from metallic materials, especially with the development of additive manufacturing (AM) technology. However, most of the existing manufacturing methods are very costly and cannot achieve the properties required for some of the manufactured components.

[0003] For example, WO2021165545A1 discloses several manufacturing methods, some of which are considered particularly suitable for manufacturing complex-shaped components. However, the method disclosed in the present invention can achieve excellent mechanical properties that not only often exceed those achievable by MAM but are also significantly higher than those achievable by any manufacturing method (including forging).

Summary of the Invention

[0004] The methods described in this document are particularly suitable for manufacturing components from materials composed of metals, alloys, ceramics, organic components, and / or mixtures thereof. Due to the specificity of the disclosed methods, it is possible to obtain components with excellent mechanical properties, improved quality, specific optimized design characteristics, and shapes. It is effective especially for components having internal characteristics that are substantially impossible to obtain by other methods. Further, according to the present invention, it is also possible to obtain parts or components (or parts of components) without defects. These methods also lead to, for example, a significant reduction in costs in component manufacturing. The inventor has found that under specific processing conditions, the disclosed methods also exhibit excellent cost efficiency. In many cases, it has also been found that due to the characteristics of the described methods, the present invention contributes to the reduction of the environmental footprint and environmental impact, particularly the improvement of sustainability and the reduction of emissions. Components can be manufactured, for example, by the methods defined in claims 1 and 32 - 35.

[0005] Aspects of the present disclosure provide methods for manufacturing components (also referred to throughout the present disclosure as "components" or "manufactured components") composed of high-performance metals. And include, but are not limited to, the following: components, large structural components (especially those with high requirements), power transmission elements, tools, power generation / transforming elements, components for the transportation industry, components for the aerospace industry, components for the railway transportation industry, components for the automotive industry, components for the maritime transportation industry, components for the food processing industry, components for the pharmaceutical industry, components for the packaging industry, components for the electronics industry, components for the household appliance industry, components for the material conversion industry, molds and / or dies, and in particular, methods including the following steps: A step of supplying a powder or a powder mixture; A step of applying a treatment to the powder or the powder mixture; and A step of shaping the treated powder or powder mixture using a metal additive manufacturing (MAM) method.

[0006] In some embodiments, the method includes one or more of the following steps, and may further include other additional steps not limited thereto. Application of pressure and / or temperature treatment; application of debinding treatment; application of a step of fixing for setting the %C, %O, %N, %H and / or %B levels in the metal part of the component; application of densification treatment; application of high density treatment; application of thermomechanical treatment, surface conditioning and / or machining. Additionally or alternatively, the method may also include other additional steps, some of which will be described later in this document.

[0007] The method for manufacturing a component containing a metal disclosed in this document can be used for manufacturing the whole or at least a part of the component. In this regard, in some applications of the method, it may be advantageous to manufacture the component from different parts that can be assembled together. In one embodiment, the method is used to manufacture at least a part of the component. In another embodiment, the method is used for manufacturing the whole component. The inventor has also found that in some applications, it is advantageous to manufacture components using different materials. In one embodiment, the manufactured component is made of at least two different materials. In another embodiment, the manufactured component is made of at least three different materials.

[0008] With respect to the supplied powder or powder mixture (also referred to herein throughout this aspect of the disclosure as "powder material" or "starting material"), a wide variety of particulate materials can be used to produce different types of components. Some examples of the types of powders that can be used include, but are not limited to, simple powders, elemental powders, pure metal powders, simple alloy powders, master alloy powders, pre-alloy powders, partially pre-alloy powders, alloyed powders and / or mixtures thereof. In one embodiment, the supplied powder or powder mixture comprises at least a metal or a metal-based alloy. In another embodiment, the supplied powder or powder mixture consists of a metal or a metal-based alloy. Some examples of metals and / or metal-based alloys that can be advantageously used include, but are not limited to, iron, iron-based alloys, carbonyl iron, steel, stainless steel, nickel, nickel-based alloys, copper, copper-based alloys, chromium, chromium-based alloys, cobalt, cobalt-based alloys, molybdenum, molybdenum-based alloys, manganese, manganese-based alloys, aluminum, aluminum-based alloys, tungsten, tungsten-based alloys, titanium, titanium-based alloys, lithium, lithium-based alloys, magnesium, magnesium-based alloys, niobium, niobium-based alloys, zirconium, zirconium-based alloys, silicon, silicon-based alloys, tin, tin-based alloys, tantalum, tantalum-based alloys, zinc, zinc-based alloys, lead, lead-based alloys, gold, gold-based alloys, silver, silver-based alloys, and / or mixtures thereof. However, the composition of the supplied powder or powder mixture is not limited to these materials. In one embodiment, the metal and / or metal-based alloy is in powder form. As described above, the starting material can be a single powder (e.g., a metal or metal-based alloy in powder form) or a powder mixture (e.g., a mixture of at least two powders having different compositions, sizes and / or morphologies). In one embodiment, the starting material is a powder consisting of a metal. In another embodiment, the starting material is a powder consisting of a metal-based alloy. In another embodiment, the starting material is a powder of a metal. In another embodiment, the starting material is a powder of a metal-based alloy. In another embodiment, the starting material comprises at least a powder of a metal or a metal-based alloy. In another embodiment, the starting material is a powder mixture comprising at least a metal or a metal-based alloy.In another embodiment, the starting material is a powder mixture comprising at least a powdered metal or a metal-based alloy. In another embodiment, the starting material is a powder mixture consisting of at least a metal. In another embodiment, the starting material is a powder mixture comprising at least a powdered metal. In another embodiment, the starting material is a powder mixture consisting of at least a metal-based alloy. In another embodiment, the starting material is a powder mixture comprising at least a powdered metal-based alloy. In another embodiment, the starting material is a powder mixture consisting of the entire composition of the metal-based alloy. In another embodiment, the starting material is a powder mixture having the entire composition of the metal-based alloy. In another embodiment, the starting material is a powder mixture comprising at least a critical powder of a metal or a metal-based alloy. In another embodiment, the starting material is a powder mixture comprising at least a critical powder of a metal. In another embodiment, the starting material is a powder mixture comprising at least a critical powder of a metal-based alloy. Some examples of the metals and metal-based alloys advantageously used are described above. The feature of "critical powder" is defined throughout this document in the form of different alternative means described in detail below. In one embodiment, the critical powder is at least 0.06% by weight of the total metal powder in the powder mixture. In an alternative embodiment, the critical powder is at least 0.6% by weight of the total metal powder in the powder mixture. In another alternative embodiment, the critical powder is at least 1.2% by weight of the total metal powder in the powder mixture. In another alternative embodiment, the critical powder is at least 2.6% by weight of the total metal powder in the powder mixture. In another alternative embodiment, the critical powder is at least 6% by weight of the total metal powder in the powder mixture. In another alternative embodiment, the critical powder is at least 11% by weight of the total metal powder in the powder mixture. In another alternative embodiment, the critical powder is at least 21% by weight of the total metal powder in the powder mixture. In another alternative embodiment, the critical powder is at least 36% by weight of the total metal powder in the powder mixture. In another alternative embodiment, the critical powder is at least 52% by weight of the total metal powder in the powder mixture.In another alternative embodiment, the percentages disclosed above are based on the total weight of the powder mixture (e.g., including the weight of reinforcing particles, polymers or polymeric materials, binders and / or resins, and other non-metallic components that may be present in the powder or powder mixture). All of the embodiments disclosed above may be combined with each other and with any other embodiments disclosed in this document regarding "critical powder", provided that they are not mutually exclusive. In one embodiment, the starting material comprises at least a major powder that is a metal or a metal-based alloy. In another embodiment, the starting material comprises at least a major powder that is a metal. In another embodiment, the starting material comprises at least a major powder that is a metal-based alloy. The feature of "major powder" is defined throughout this document in the form of different alternative means, which will be described in detail below. In one embodiment, a powder is considered a major powder if its weight percentage in the powder mixture is 2% by weight or more. In an alternative embodiment, a powder is considered a major powder if its weight percentage in the powder mixture is 5.5% by weight or more. In another alternative embodiment, a powder is considered a major powder if its weight percentage in the powder mixture is 10.5% by weight or more. In another alternative embodiment, a powder is considered a major powder if its weight percentage in the powder mixture is 15.5% by weight or more. In another alternative embodiment, a powder is considered a major powder if its weight percentage in the powder mixture is 25.5% by weight or more. In another alternative embodiment, a powder is considered a major powder if its weight percentage in the powder mixture is 55.5% by weight or more. In another alternative embodiment, there is only one major powder, which is the one with the highest weight percentage in the mixture. In another alternative embodiment, the major powder is any of the powders or powder mixtures disclosed throughout this document. All of the embodiments disclosed above may be combined with each other and with any other embodiments disclosed in this document regarding "major powder", provided that they are not mutually exclusive.In one embodiment, the supplied powder or powder mixture comprises at least a metal or metal-based alloy in a powder form selected from the following: iron, iron-based alloys, carbonyl iron, steel, stainless steel, nickel, nickel-based alloys, copper, copper-based alloys, chromium, chromium-based alloys, cobalt, cobalt-based alloys, molybdenum, molybdenum-based alloys, manganese, manganese-based alloys, aluminum, aluminum-based alloys, tungsten, tungsten-based alloys, titanium, titanium-based alloys, lithium, lithium-based alloys, magnesium, magnesium-based alloys, niobium, niobium-based alloys, zirconium, zirconium-based alloys, silicon, silicon-based alloys, tin, tin-based alloys, tantalum, tantalum-based alloys, zinc, zinc-based alloys, lead, lead-based alloys, gold, gold-based alloys, silver, silver-based alloys, and / or mixtures thereof. In another embodiment, the supplied powder or powder mixture comprises at least a metal or metal-based alloy selected from the following: iron, steel, nickel, nickel-based alloys, copper, copper-based alloys, aluminum, aluminum-based alloys, titanium, titanium-based alloys, lithium, lithium-based alloys, magnesium, magnesium-based alloys, and / or mixtures thereof. In another embodiment, the supplied powder or powder mixture comprises at least a metal or metal-based alloy selected from the following: iron, steel, nickel, nickel-based alloys, aluminum, aluminum-based alloys, titanium, titanium-based alloys and / or mixtures thereof. In one embodiment, the supplied powder or powder mixture comprises at least a metal or metal-based alloy in a powder form selected from the following: iron, iron-based alloys, carbonyl iron, steel, stainless steel, nickel, nickel-based alloys, copper, copper-based alloys, chromium, chromium-based alloys, cobalt, cobalt-based alloys, molybdenum, molybdenum-based alloys, manganese, manganese-based alloys, aluminum, aluminum-based alloys, tungsten, tungsten-based alloys, titanium, titanium-based alloys, lithium, lithium-based alloys, magnesium, magnesium-based alloys, niobium, niobium-based alloys, zirconium, zirconium-based alloys, silicon, silicon-based alloys, tin, tin-based alloys, tantalum, tantalum-based alloys, zinc, zinc-based alloys, lead, lead-based alloys, gold, gold-based alloys, silver, silver-based alloys, and / or mixtures thereof.In another embodiment, the supplied powder or powder mixture comprises at least a metal or metal-based alloy selected from the following: iron, steel, nickel, nickel-based alloys, copper, copper-based alloys, aluminum, aluminum-based alloys, titanium, titanium-based alloys, lithium, lithium-based alloys, magnesium, magnesium-based alloys, and / or mixtures thereof. In another embodiment, the supplied powder or powder mixture comprises at least a metal or metal-based alloy selected from the following: iron, steel, nickel, nickel-based alloys, aluminum, aluminum-based alloys, titanium, titanium-based alloys and / or mixtures thereof. For certain applications, the use of a powder or powder mixture having an overall composition corresponding to the composition of the metal-based alloy is preferred. In one embodiment, the supplied powder is a metal-based alloy powder. In another embodiment, the supplied powder mixture has an average composition corresponding to the composition of the metal-based alloy. In another embodiment, the supplied powder or powder mixture comprises the overall composition of a metal-based alloy in powder form selected from the following: iron-based alloys, steel, stainless steel, nickel-based alloys, copper-based alloys, chromium-based alloys, cobalt-based alloys, molybdenum-based alloys, manganese-based alloys, aluminum-based alloys, tungsten-based alloys, titanium-based alloys, lithium-based alloys, magnesium-based alloys, niobium-based alloys, zirconium-based alloys, silicon-based alloys, tin-based alloys, tantalum-based alloys, zinc-based alloys, lead-based alloys, gold-based alloys, silver-based alloys and / or mixtures thereof. In another embodiment, the supplied powder or powder mixture comprises the overall composition of a metal-based alloy selected from steel, nickel-based alloys, copper-based alloys, aluminum-based alloys, titanium-based alloys, lithium-based alloys, and / or mixtures thereof. In another embodiment, the supplied powder or powder mixture comprises the overall composition of a metal-based alloy selected from steel, nickel-based alloys, aluminum-based alloys, titanium-based alloys, and / or mixtures thereof.In another embodiment, the supplied powder or powder mixture comprises the overall composition of a metal-based alloy selected from: iron-based alloys, steels, stainless steels, nickel-based alloys, copper-based alloys, chromium-based alloys, cobalt-based alloys, molybdenum-based alloys, manganese-based alloys, aluminum-based alloys, tungsten-based alloys, titanium-based alloys, lithium-based alloys, magnesium-based alloys, niobium-based alloys, zirconium-based alloys, silicon-based alloys, tin-based alloys, tantalum-based alloys, zinc-based alloys, lead-based alloys, gold-based alloys, silver-based alloys and / or mixtures thereof. In another embodiment, the supplied powder or powder mixture comprises the overall composition of a metal-based alloy in powder form selected from steels, nickel-based alloys, copper-based alloys, aluminum-based alloys, titanium-based alloys, lithium-based alloys, and / or mixtures thereof. In another embodiment, the supplied powder or powder mixture comprises the overall composition of a metal-based alloy selected from steels, nickel-based alloys, copper-based alloys, aluminum-based alloys, titanium-based alloys, lithium-based alloys and / or mixtures thereof. In another embodiment, the supplied powder or powder mixture comprises the overall composition of a metal-based alloy selected from steels, nickel-based alloys, aluminum-based alloys, titanium-based alloys, and / or mixtures thereof. Additionally, in some embodiments, it may be advantageous to add other substances or materials to the powder or powder mixture before applying the treatment. Some examples of substances or materials that may be added to the powder or powder mixture include organic materials, polymers, polymeric materials. Binder, resin, flux, dry coater, fluidizing agent, surface-functionalized nanoparticles, lubricant, additive, nanoparticle additive, graphite, ceramic material, reinforcing particles, ceramic particles, whisker, graphene, nanotube, carbon nanotube and / or mixtures thereof, but not limited thereto. In some specific embodiments, the addition of at least one of the above substances or materials may be carried out after the application of the treatment and before the application of the shaping process. In one embodiment, an organic material is added to the powder or powder mixture. In another embodiment, a polymer or polymeric material is added to the powder or powder mixture. In another embodiment, a binder is added to the powder or powder mixture. In another embodiment, a flux, lubricant and / or additive is added to the powder or powder mixture. In another embodiment, graphite is added to the powder or powder mixture. In another embodiment, a ceramic material is added to the powder or powder mixture. In another embodiment, a whisker is added to the powder or powder mixture. In another embodiment, a nanotube is added to the powder or powder mixture. In another embodiment, a carbon nanotube is added to the powder or powder mixture. In another embodiment, reinforcing particles are added to the powder or powder mixture. In some specific embodiments, the addition of at least one of the above substances or materials is carried out after the treatment is applied to the powder or powder mixture and before the shaping process. Unless otherwise specified throughout this document, the term "ceramic" includes ceramic materials existing in nature in the form of minerals, processed ceramics, technical ceramics, etc. Throughout this document, the feature of "reinforcing particles" is defined in the form of different alternative means described in detail below. In one embodiment, the reinforcing particles refer to a material composed of inorganic fibers. In another embodiment, the reinforcing particles refer to a material composed of glass fibers. In another embodiment, the reinforcing particles refer to a material composed of carbon fibers. In another embodiment, the reinforcing particles refer to a material composed of basalt fibers. In another embodiment, the reinforcing particles refer to a material composed of asbestos fibers. In another embodiment, the reinforcing particles refer to a material composed of ceramic fibers.In another embodiment, the reinforcing particles refer to a material composed of at least one material selected from inorganic fibers, glass fibers, carbon fibers, basalt fibers, asbestos fibers, ceramic fibers and / or mixtures thereof. In another embodiment, the reinforcing particles refer to a material composed of at least one material selected from inorganic fibers, glass fibers, carbon fibers, basalt fibers, ceramic fibers and / or mixtures thereof. In one embodiment, the ceramic fibers are at least 50% by volume of oxides. In another embodiment, the ceramic fibers are at least 50% by volume of carbides. In another embodiment, the ceramic fibers are at least 50% by volume of borides. In another embodiment, the ceramic fibers are at least 50% by volume of nitrides. In an alternative embodiment, the percentages disclosed above are by weight (wt%). In one embodiment, the ceramic fibers are composed of silicon carbide. In another embodiment, the reinforcing particles refer to a material containing an inorganic filler. In another embodiment, the reinforcing particles refer to a material composed of a mineral filler. In another embodiment, the reinforcing particles refer to a material composed of organic fibers. In another embodiment, the reinforcing particles refer to a material composed of natural fibers. In another embodiment, the reinforcing particles refer to a material composed of at least one material selected from inorganic fillers, mineral fillers, organic fibers, natural fibers and / or mixtures thereof. The amount of reinforcing particles added can be important in the manufacture of some components. In one embodiment, a sufficient amount of reinforcing particles is added to the powder or powder mixture. The feature of "sufficient amount" is defined throughout this document in the form of different alternative means described in detail below. In one embodiment, the sufficient amount is 2.2% or more by volume. In an alternative embodiment, the sufficient amount is 6% or more by volume. In another alternative embodiment, the sufficient amount is 12% or more by volume. In another alternative embodiment, the sufficient amount is 22% or more by volume. In another alternative embodiment, the sufficient amount is 42% or more by volume. In another alternative embodiment, the sufficient amount is 52% or more by volume. In another alternative embodiment, the sufficient amount is 62% or more by volume. In another alternative embodiment, the sufficient amount is 78% or less by volume. In another alternative embodiment, the sufficient amount is 68% or less by volume. In another alternative embodiment, the sufficient amount is 48% or less by volume. In another alternative embodiment, the sufficient amount is 28% or less by volume.In another alternative embodiment, the percentages disclosed above are by weight (wt%). All of the embodiments disclosed above, provided that they are not mutually exclusive, may be combined with each other and with any other embodiment disclosed in this document related to "reinforcing particles". All of the embodiments disclosed above, provided that they are not mutually exclusive, may be combined with each other and with any other embodiment disclosed in this document. For example, in one embodiment, there is provided a method for manufacturing a component containing a metal, the method comprising the steps of: supplying a powder or a powder mixture; applying a treatment to the powder or the powder mixture, the treatment of the powder or the powder mixture including adding energy to the powder or the powder mixture by mechanical action; and using a metal additive manufacturing (MAM) method to shape the treated powder or powder mixture.

[0009] As described above, components containing metals can be produced from a wide variety of powders or powder mixtures. Some examples of the overall composition of powders or powder mixtures that can be advantageously used (in this context, the overall composition means the sum of the compositions of all metal powders, which means the elemental sum of the contributions of each content for all metal powders in the mixture) are described below. When referring to a composition in the sense of this document, the use of terms such as "less than", "more than", "at least", "from", "to", "reaching", "at least", "greater than", "less than", "at least" is subject to the condition that they are not mutually exclusive and can be broken down into sub-ranges later and combined with other upper and / or lower limits disclosed in any combination, referring to a composition range. In one embodiment, the overall composition of the supplied powder or powder mixture has the following elements and limitations, and all percentages are expressed in weight percent: %C: 0.25 - 0.8; Mn: 0 - 1.15; %Si: 0 - 0.35; %Cr: 0.1 max; %Mo: 1.5 - 6.5; %V: 0 - 0.6; %W: 0 - 4; Ni: 0 - 4; %Co: 0 - 3; the balance consists of iron and trace elements. Throughout this document, unless the context clearly indicates otherwise, the term "trace element" refers to a plurality of elements including but not limited to H, He, Xe, F, S, P, Cu, Pb, Co, Ta, Zr, Nb, Hf, Cs, Y, Sc, Mn, Ni, Mo, W, C, N, B, O, Cr, Fe, Ne, Na, Cl, Ar, K, Br, Kr, Sr, Tc, Ru, Rh, Ti, Pd, Ag, I, Ba, Re, Os, Ir, Pt, Au, Hg, Tl, Po, At, Rn, Fr, Ra, Ac, Th, Pa, U, Np, Pu, Am, Cm, Bk, Cf, Es, Fm, Md, No, Lr, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Rf, Db, Sg, Bh, Hs, Li, Be, Mg, Ca, Rb, Zn, Cd, Al, Ga, In, Ge, Sn, Bi, Sb, As, Se, Te, Ds, Rg, Cn, Nh, Fl, Mc, Lv, Ts, Og and Mt. In one embodiment, the trace elements include at least one of the above elements.In this document, for a given alloy, after excluding the elements described in their compositions, trace elements include all of the above elements. In different embodiments, the content of any trace element is preferably less than 1.8 wt%, less than 0.8 wt%, less than 0.3 wt%, less than 0.1 wt%, less than 0.09 wt%, and even less than 0.03 wt%. Trace elements may be intentionally added to achieve certain functionalities of the alloy, such as reducing manufacturing costs, and / or their presence may be unintentional and may be mainly related to the presence of alloying elements used in the manufacture of the alloy and impurities in the scrap. There are some applications where the presence of trace elements may be harmful to the overall properties of the steel. In different embodiments, the total of all trace elements is less than 2.0 wt%, less than 1.4 wt%, less than 0.8 wt%, less than 0.4 wt%, less than 0.2 wt%, less than 0.1 wt%, and even less than 0.06 wt%. There are even some embodiments for specific applications where it is preferred that no trace elements are included in the alloy. In contrast, there are also some applications where the presence of trace elements is preferred. In different embodiments, the total of all trace elements is more than 0.0012 wt%, more than 0.012 wt%, more than 0.06 wt%, more than 0.12 wt%, and even more than 0.55 wt%. In one embodiment, %C is more than 0.31 wt%. In another embodiment, %C is more than 0.36 wt%. In one embodiment, %C is less than 0.69 wt%. In another embodiment, %C is less than 0.48 wt%. In one embodiment, %Mn is more than 0.16 wt%. In another embodiment, %Mn is more than 0.21 wt%. In one embodiment, %Mn is less than 1.18 wt%. In another embodiment, %Mn is less than 0.94 wt%. In one embodiment, %Si is more than 0.01 wt%. In another embodiment, %Si is more than 0.12 wt%. In one embodiment, %Si is less than 0.52 wt%. In another embodiment, %Si is less than 0.27 wt%. In one embodiment, %Cr is more than 0.0016 wt%. In another embodiment, %Cr is more than 0.0021 wt%. In one embodiment, %Cr is less than 0.09 wt%. In another embodiment, %Cr is less than 0.04 wt%. In one embodiment, %Mo is more than 1.86 wt%.In another embodiment, %Mo is more than 2.1 wt%. In one embodiment, %Mo is less than 4.9 wt%. In another embodiment, %Mo is less than 3.4 wt%. In one embodiment, %V is more than 0.12 wt%. In another embodiment, %V is more than 0.21 wt%. In one embodiment, %V is less than 0.48 wt%. In another embodiment, %V is less than 0.23 wt%. In one embodiment, %W is more than 0.28 wt%. In another embodiment, %W is more than 0.66 wt%. In one embodiment, %W is less than 3.4 wt%. In another embodiment, %W is less than 2.9 wt%. In one embodiment, %Ni is more than 0.32 wt%. In another embodiment, %Ni is more than 0.56 wt%. In one embodiment, %Ni is less than 3.9 wt%. In another embodiment, %Ni is less than 3.4 wt%. In one embodiment, %Co is more than 0.08 wt%. In another embodiment, %Co is more than 0.16 wt%. In one embodiment, %Co is less than 2.4 wt%. In another embodiment, %Co is less than 1.9 wt%. In another embodiment, the overall composition of the supplied powder or powder mixture has the following elements and limitations, and all percentages are expressed in weight percent: %C: 0.25 - 0.55; %Mn: 0.10 - 1.2; %Si: 0.10 - 1.20; %Cr: 2.5 - 5.50; %Mo: 1.00 - 3.30; %V: 0.30 - 1.20; the balance consists of iron and trace elements (as defined in these documents). In one embodiment, %C is more than 0.31 wt%. In another embodiment, %C is more than 0.36 wt%. In one embodiment, %C is less than 0.49 wt%. In another embodiment, %C is less than 0.28 wt%. In one embodiment, %Mn is more than 0.16 wt%. In another embodiment, %Mn is more than 0.26 wt%. In one embodiment, %Mn is less than 0.96 wt%. In another embodiment, %Mn is less than 0.46 wt%. In one embodiment, %Si is more than 0.16 wt%. In another embodiment, %Si is more than 0.22 wt%. In one embodiment, %Si is less than 0.94 wt%. In another embodiment, %Si is less than 0.48 wt%. In one embodiment, %Cr is more than 2.86 wt%. In another embodiment, %Cr is more than 3.16 wt%.In one embodiment, %Cr is less than 4.9 wt%. In another embodiment, %Cr is less than 3.4 wt%. In one embodiment, %Mo is more than 1.16 wt%. In another embodiment, %Mo is more than 1.66 wt%. In one embodiment, %Mo is less than 2.9 wt%. In another embodiment, %Mo is less than 2.4 wt%. In one embodiment, %V is more than 0.42 wt%. In another embodiment, %V is more than 0.61 wt%. In one embodiment, %V is less than 0.98 wt%. In another embodiment, %V is less than 0.64 wt%. In another embodiment, the overall composition of the supplied powder or powder mixture has the following elements and limitations, with all percentages expressed as weight percentages: %C: 0.15 - 2.35; %Mn: 0.10 - 2.5; %Si: 0.10 - 1.0; %Cr: 0.2 - 17.50; %Mo: 0 - 1.4; %V: 0 - 1; %W: 0 - 2.2; %Ni: 0 - 4.3; the balance consists of iron and trace elements (as defined in these documents). In one embodiment, %C is more than 0.21 wt%. In another embodiment, %C is more than 0.42 wt%. In one embodiment, %C is less than 1.94 wt%. In another embodiment, %C is less than 1.48 wt%. In one embodiment, %Mn is more than 0.18 wt%. In another embodiment, %Mn is more than 0.26 wt%. In one embodiment, %Mn is less than 1.96 wt%. In another embodiment, %Mn is less than 1.46 wt%. In one embodiment, %Si is more than 0.16 wt%. In another embodiment, %Si is more than 0.22 wt%. In one embodiment, %Si is less than 0.94 wt%. In another embodiment, %Si is less than 0.48 wt%. In one embodiment, %Cr is more than 0.56 wt%. In another embodiment, %Cr is more than 1.12 wt%. In one embodiment, %Cr is less than 9.8 wt%. In another embodiment, %Cr is less than 6.4 wt%. In one embodiment, %Mo is more than 0.17 wt%. In another embodiment, %Mo is more than 0.56 wt%. In one embodiment, %Mo is less than 0.9 wt%. In another embodiment, %Mo is less than 0.68 wt%. In one embodiment, %V is more than 0.12 wt%. In another embodiment, %V is more than 0.21 wt%. In one embodiment, %V is less than 0.94 wt%.In another embodiment, %V is less than 0.59 wt%. In one embodiment, %W is more than 0.18 wt%. In another embodiment, %W is more than 0.56 wt%. In one embodiment, %W is less than 1.92 wt%. In another embodiment, %W is less than 1.44 wt%. In one embodiment, %Ni is more than 0.02 wt%. In another embodiment, %Ni is more than 0.26 wt%. In one embodiment, %Ni is less than 3.9 wt%. In another embodiment, %Ni is less than 3.4 wt%. In another embodiment, the overall composition of the supplied powder or powder mixture has the following elements and limitations, and all percentages are expressed in weight percent: %C: 0 to 0.4; %Mn: 0.1 to 1; %Si: 0 to 0.8; %Cr: 0 to 5.25; %Mo: 0 to 1.0; %V: 0 to 0.25; %Ni: 0 to 4.25; %Al: 0 to 1.25; the balance consists of iron and trace elements (as defined in these documents). In one embodiment, %C is more than 0.08 wt%. In another embodiment, %C is more than 0.12 wt%. In one embodiment, %C is less than 0.34 wt%. In another embodiment, %C is less than 0.29 wt%. In one embodiment, %Mn is more than 0.18 wt%. In another embodiment, %Mn is more than 0.26 wt%. In one embodiment, %Mn is less than 0.96 wt%. In another embodiment, %Mn is less than 0.46 wt%. In one embodiment, %Si is more than 0.006 wt%. In another embodiment, %Si is more than 0.02 wt%. In one embodiment, %Si is less than 0.64 wt%. In another embodiment, %Si is less than 0.44 wt%. In one embodiment, %Cr is more than 0.16 wt%. In another embodiment, %Cr is more than 0.62 wt%. In one embodiment, %Cr is less than 4.96 wt%. In another embodiment, %Cr is less than 3.94 wt%. In one embodiment, %Mo is more than 0.07 wt%. In another embodiment, %Mo is more than 0.16 wt%. In one embodiment, %Mo is less than 0.84 wt%. In another embodiment, %Mo is less than 0.64 wt%. In one embodiment, %V is more than 0.02 wt%. In another embodiment, %V is more than 0.09 wt%. In one embodiment, %V is less than 0.14 wt%. In another embodiment, %V is less than 0.09 wt%.In one embodiment, %Ni is more than 0.12 wt%. In another embodiment, %Ni is more than 0.16 wt%. In one embodiment, %Ni is less than 3.9 wt%. In another embodiment, %Ni is less than 3.4 wt%. In one embodiment, %Al is more than 0.02 wt%. In another embodiment, %Al is more than 0.16 wt%. In one embodiment, %Al is less than 0.94 wt%. In another embodiment, %Al is less than 0.46 wt%. In another embodiment, the overall composition of the supplied powder or powder mixture is the following elements. And having limitations, all percentages are expressed in weight percentages: %C: 0.77 to 1.40; %Si: 0 to 0.70; %Cr: 3.5 to 4.5; %Mo: 3.2 to 10; %V: 0.9 to 3.60; %W: 0 to 18.70; %Co: 0 to 10.50; the balance consists of iron and trace elements (as defined in this document). In one embodiment, %C is more than 0.91 wt%. In another embodiment, %C is more than 1.06 wt%. In one embodiment, %C is less than 1.24 wt%. In another embodiment, %C is less than 0.94 wt%. In one embodiment, %Si is more than 0.06 wt%. In another embodiment, %Si is more than 0.12 wt%. In one embodiment, %Si is less than 0.44 wt%. In another embodiment, %Si is less than 0.34 wt%. In one embodiment, %Cr is more than 3.86 wt%. In another embodiment, %Cr is more than 4.06 wt%. In one embodiment, %Cr is less than 4.34 wt%. In another embodiment, %Cr is less than 4.24 wt%. In one embodiment, %Mo is more than 3.6 wt%. In another embodiment, %Mo is more than 4.2 wt%. In one embodiment, %Mo is less than 8.4 wt%. In another embodiment, %Mo is less than 7.8 wt%. In one embodiment, %V is more than 1.08 wt%. In another embodiment, %V is more than 1.21 wt%. In one embodiment, %V is less than 2.94 wt%. In another embodiment, %V is less than 2.44 wt%. In one embodiment, %W is more than 0.31 wt%. In another embodiment, %W is more than 0.56 wt%. In one embodiment, %W is less than 14.4 wt%. In another embodiment, %W is less than 9.4 wt%. In one embodiment, %Co is more than 0.01 wt%. In another embodiment, %Co is more than 0.16 wt%. In one embodiment, %Co is less than 8.44 wt%. In another embodiment, %Co is less than 6.4 wt%. In another embodiment, the overall composition of the supplied powder or powder mixture has the following elements and limitations, and all percentages are expressed in weight percentages: %C: 0.03 max; %Mn: 0.1 max; %Si: 0.1 max; %Mo: 3.0 to 5.2; %Ni: 18 to 19; %Co: 0 to 12.5; %Ti: 0 to 2; the balance consists of iron and trace elements (as defined in this document).In one embodiment, %C is more than 0.0001 wt%. In another embodiment, %C is more than 0.0003 wt%. In one embodiment, %C is less than 0.01 wt%. In another embodiment, %C is less than 0.001 wt%. In one embodiment, %Mn is more than 0.00001 wt%. In another embodiment, %Mn is more than 0.0003 wt%. In one embodiment, %Mn is less than 0.01 wt%. In another embodiment, %Mn is less than 0.008 wt%. In one embodiment, %Si is more than 0.00002 wt%. In another embodiment, %Si is more than 0.0004 wt%. In one embodiment, %Si is less than 0.011 wt%. In another embodiment, %Si is less than 0.004 wt%. In one embodiment, %Mo is more than 3.52 wt%. In another embodiment, %Mo is more than 4.12 wt%. In one embodiment, %Mo is less than 4.94 wt%. In another embodiment, %Mo is less than 4.44 wt%. In one embodiment, %Ni is more than 18.26 wt%. In another embodiment, %Ni is more than 18.56 wt%. In one embodiment, %Ni is less than 18.87 wt%. In another embodiment, %Ni is less than 18.73 wt%. In one embodiment, %Co is more than 0.01 wt%. In another embodiment, %Co is more than 0.26 wt%. In one embodiment, %Co is less than 9.44 wt%. In another embodiment, %Co is less than 7.4 wt%. In one embodiment, %Ti is more than 0.08 wt%. In another embodiment, %Ti is more than 0.12 wt%. In one embodiment, %Ti is less than 1.84 wt%. In another embodiment, %Ti is less than 1.44 wt%. In another embodiment, the overall composition of the supplied powder or powder mixture has the following elements and limitations, and all percentages are expressed in weight percent: %C: 1.5 to 1.85; %Mn: 0.15 to 0.5; %Si: 0.15 to 0.45; %Cr: 3.5 to 5.0; %Mo: 0 to 6.75; %V: 4.5 to 5.25; %W: 11.5 to 13.00; %Co: 0 to 5.25; the balance consists of iron and trace elements (as defined in these documents). In one embodiment, %C is more than 1.56 wt%. In another embodiment, %C is more than 1.66 wt%. In one embodiment, %C is less than 1.78 wt%.In another embodiment, %C is less than 1.74 wt%. In one embodiment, %Mn is more than 0.21 wt%. In another embodiment, %Mn is more than 0.26 wt%. In one embodiment, %Mn is less than 0.41 wt%. In another embodiment, %Mn is less than 0.29 wt%. In one embodiment, %Si is more than 0.18 wt%. In another embodiment, %Si is more than 0.21 wt%. In one embodiment, %Si is less than 0.39 wt%. In another embodiment, %Si is less than 0.34 wt%. In one embodiment, %Cr is more than 3.66 wt%. In another embodiment, %Cr is more than 3.86 wt%. In one embodiment, %Cr is less than 4.92 wt%. In another embodiment, %Cr is less than 3.92 wt%. In one embodiment, %V is more than 4.62 wt%. In another embodiment, %V is more than 4.86 wt%. In one embodiment, %V is less than 5.18 wt%. In another embodiment, %V is less than 4.94 wt%. In one embodiment, %W is more than 11.61 wt%. In another embodiment, %W is more than 11.86 wt%. In one embodiment, %W is less than 12.94 wt%. In another embodiment, %W is less than 12.48 wt%. In one embodiment, %Co is more than 0.1 wt%. In another embodiment, %Co is more than 0.26 wt%. In one embodiment, %Co is less than 4.44 wt%. In another embodiment, %Co is less than 3.4 wt%. In another embodiment, the overall composition of the supplied powder or powder mixture has the following elements and limitations, and all percentages are expressed in weight percent: %C: 0 to 0.6; %Mn: 0 to 1.5; %Si: 0 to 1; %Cr: 11.5 to 17.5; %Mo: 0 to 1.5; %V: 0 to 0.2; %Ni: 0 to 6.0; the balance consists of iron and trace elements (as defined in these documents). In one embodiment, %C is more than 0.02 wt%. In another embodiment, %C is more than 0.12 wt%. In one embodiment, %C is less than 0.48 wt%. In another embodiment, %C is less than 0.44 wt%. In one embodiment, %Mn is more than 0.01 wt%. In another embodiment, %Mn is more than 0.16 wt%. In one embodiment, %Mn is less than 1.22 wt%. In another embodiment, %Mn is less than 0.93 wt%.In one embodiment, %Si is more than 0.08 wt%. In another embodiment, %Si is more than 0.11 wt%. In one embodiment, %Si is less than 0.89 wt%. In another embodiment, %Si is less than 0.46 wt%. In one embodiment, %Cr is more than 11.86 wt%. In another embodiment, %Cr is more than 12.56 wt%. In one embodiment, %Cr is less than 16.94 wt%. In another embodiment, %Cr is less than 14.96 wt%. In one embodiment, %Mo is more than 0.09 wt%. In another embodiment, %Mo is more than 0.28 wt%. In one embodiment, %Mo is less than 1.22 wt%. In another embodiment, %Mo is less than 0.94 wt%. In one embodiment, %V is more than 0.0018 wt%. In another embodiment, %V is more than 0.009 wt%. In one embodiment, %V is less than 0.14 wt%. In another embodiment, %V is less than 0.09 wt%. In one embodiment, %Ni is more than 0.09 wt%. In another embodiment, %Ni is more than 0.16 wt%. In one embodiment, %Ni is less than 4.48 wt%. In another embodiment, %Ni is less than 3.92 wt%. In another embodiment, the overall composition of the supplied powder or powder mixture has the following elements and limitations, and all percentages are expressed in weight percent: %C: 0.015 max; %Mn: 0.5 - 1.25; %Si: 0.2 - 1; %Cr: 11 - 18; %Mo: 0 - 3.25; %Ni: 3.0 - 9.5; %Ti: 0 - 1.40; %Al: 0 - 1.5; %Cu: 0 - 5; the balance consists of iron and trace elements (as defined in these documents). In one embodiment, %C is more than 0.002 wt%. In one embodiment, %C is more than 0.0036 wt%. In one embodiment, %C is less than 0.001 wt%. In one embodiment, %C is less than 0.003 wt%. In one embodiment, %Mn is more than 0.61 wt%. In one embodiment, %Mn is more than 0.77 wt%. In one embodiment, %Mn is less than 1.18 wt%. In one embodiment, %Mn is less than 0.96 wt%. In one embodiment, %Si is more than 0.28 wt%. In one embodiment, %Si is more than 0.31 wt%. In one embodiment, %Si is less than 0.89 wt%. In one embodiment, %Si is less than 0.46 wt%.In one embodiment, %Cr is more than 11.58 wt%. In one embodiment, %Cr is more than 12.62 wt%. In one embodiment, %Cr is less than 16.92 wt%. In one embodiment, %Cr is less than 14.92 wt%. In one embodiment, %Mo is more than 0.19 wt%. In one embodiment, %Mo is more than 0.28 wt%. In one embodiment, %Mo is less than 2.82 wt%. In one embodiment, %Mo is less than 1.88 wt%. In one embodiment, %Ni is more than 3.64 wt%. In one embodiment, %Ni is more than 5.62 wt%. In one embodiment, %Ni is less than 8.82 wt%. In one embodiment, %Ni is less than 8.21 wt%. In one embodiment, %Ti is more than 0.08 wt%. In one embodiment, %Ti is more than 0.12 wt%. In one embodiment, %Ti is less than 1.34 wt%. In one embodiment, %Ti is less than 1.22 wt%. In one embodiment, %Al is more than 0.06 wt%. In one embodiment, %Al is more than 0.14 wt%. In one embodiment, %Al is less than 1.24 wt%. In one embodiment, %Al is less than 1.12 wt%. In one embodiment, %Cu is more than 0.09 wt%. In one embodiment, %Cu is more than 0.12 wt%. In one embodiment, %Cu is less than 4.38 wt%. In another embodiment, %Cu is less than 3.82 wt%. In another embodiment, the overall composition of the supplied powder or powder mixture has the following elements and limitations, and all percentages are expressed in weight percent: %Cr: 10 - 14; %Ni: 5.6 - 12.5; %Ti: 0.4 - 2.8; %Mo: 0 - 4.4; %B: 0 - 4; %Co: 0 - 12; %Mn: 0 - 2; %Cu: 0 - 2; %Al: 0 - 1; %Nb: 0 - 0.5; %Ce: 0 - 0.3; %Si: 0 - 2; %C, %N, %P, %S, %O each 0.09% max; %C + %N + %P + %S + %O: 0 - 0.3; %La + %Cs + %Nd + %Gd + %Pr + %Ac + %Th + %Tb + %Dy + %Ho + %Er + %Tm + %Yb + %Y + %Lu + %Sc + %Zr + %Hf: 0 - 0.4; %V + %Ta + %W: 0 - 0.8; the balance consists of iron and trace elements (as defined in these documents). Depending on the application, the chromium content can be very important.If the %Cr is too high, the fracture toughness will be low. If the %Cr is too low, the corrosion resistance will decrease. Depending on the application, the influence of %Cr on stress corrosion cracking may also become significant, but this is in the context of its interaction with other alloying elements. In different embodiments, the %Cr is 10.6 wt% or more, 11.2 wt% or more, 11.6 wt% or more, 12.1 wt% or more, 12.6 wt% or more, and further 13.2 wt% or more. In different embodiments, the %Cr is 13.4 wt% or less, 12.9 wt% or less, 12.4 wt% or less. Lower, and further 11.9 wt% or less. Depending on the application, the boron content can be very important. If the %B is too high, the fracture toughness will be low, and if the %B is too low, the wear resistance will decrease. Depending on the application, the effect of %B on high-temperature yield may also become significant, but in the interaction with other alloying elements. In different embodiments, %B is 35 ppm or more, 120 ppm or more, 0.02 wt% or more, 0.12 wt% or more, 0.6 wt% or more, and further 1.2 wt% or more. In different embodiments, %B is 1.9 wt% or less, 0.9 wt% or less, 0.4 wt% or less, and further 0.09 wt% or less. Depending on the application, the titanium content can be very important. If the %Ti is too high, the fracture toughness will be low, and if the %Ti is too low, the yield strength will decrease. Depending on the application, the effect of %Ti on wear resistance may also become significant, but in the interaction with other alloying elements. In different embodiments, %Ti is 0.7 wt% or more, 1.6 wt% or more, 1.8 wt% or more, 2.1 wt% or more, and further 2.55 wt% or more. In different embodiments, %Ti is 2.4 wt% or less, 1.9 wt% or less, 1.4 wt% or less, and further 0.9 wt% or less. Depending on the application, the nickel content can be very important. If the %Ni is too high, the yield strength will be low, and if the %Ni is too low, the elongation at break will be poor. Depending on the application, the effect of %Ni on stress corrosion cracking may also become significant, but in the interaction with other alloying elements. In different embodiments, %Ni is 6.1 wt% or more, 7.1 wt% or more, 8.6 wt% or more, 10.6 wt% or more, 11.1 wt% or more, and further 11.5 wt% or more. In different embodiments, %Ni is 11.9 wt% or less, 11.4 wt% or less, 10.9 wt% or less, and further 9.9 wt% or less. Depending on the application, the molybdenum content can be very important. If the %Mo is too high, the fracture toughness will be low, and if the %Mo is too low, the yield strength will decrease. Depending on the application, the effect of %Mo on stress corrosion cracking may also become significant, but in the interaction with other alloying elements. In different embodiments, %Mo is 0.26 wt% or more, 0.76 wt% or more, 1.2 wt% or more, 1.6 wt% or more, 2.1 wt% or more, and further 3.2 wt% or more.In different embodiments, %Mo is 3.9 wt% or less, 2.9 wt% or less, 1.9 wt% or less, and even 0.9 wt% or less. In another embodiment, %Mo is not intentionally present or is present only as a trace element. In another embodiment, %Mo is not present. Depending on the application, the cobalt content can be very important. If %Co is too high, the yield strength will be low, and if %Co is too low, the combination of corrosion resistance and fracture toughness will be poor. Depending on the application, the effect of %Co on stress corrosion cracking may also become significant, but in the interaction with other alloying elements. In different embodiments, %Co is 0.6 wt% or more, 2.2 wt% or more, 3.6 wt% or more, 6.1 wt% or more, 7.6 wt% or more, and even 10.2 wt% or more. In another embodiment, %Co is 9.9 wt% or less, 8.9 wt% or less, 7.9 wt% or less, and even 3.9 wt% or less. In another embodiment, %Co is not intentionally present or is present only as a trace element. In another embodiment, %Co is not present. Depending on the application, a small amount of %Mn can improve certain mechanical properties, but if %Mn is too high, it may lead to deterioration of mechanical properties. In different embodiments, %Mn is 0.12 wt% or more, 0.31 wt% or more, 0.52 wt% or more, 0.61 wt% or more, 0.76 wt% or more, and even 1.2 wt% or more. In another embodiment, %Mn is 1.4 wt% or less, 0.9 wt% or less, 0.29 wt% or less, and even 0.09 wt% or less. In another embodiment, %Mn is not intentionally present or is present only as a trace element. In another embodiment, %Mn is not present. Depending on the application, a small amount of %Cu can improve the yield strength, but if %Cu is too high, the mechanical properties may deteriorate. In different embodiments, %Cu is 0.12 wt% or more, 0.31 wt% or more, 0.52 wt% or more, 0.61 wt% or more, 0.76 wt% or more, and even 1.2 wt% or more. In another embodiment, %Cu is 1.4 wt% or less, 0.9 wt% or less, 0.29 wt% or less, and even 0.09 wt% or less. In another embodiment, %Cu is not intentionally present or is present only as a trace element. In another embodiment, %Cu is not present.Depending on the application, a small amount of %Si can improve mechanical properties, but if %Si is too high, the mechanical properties may deteriorate. In different embodiments, %Si is 0.12 wt% or more, 0.31 wt% or more, 0.52 wt% or more, 0.61 wt% or more, 0.76 wt% or more, and even 1.2 wt% or more. In another embodiment, %Si is 1.4 wt% or less, 0.9 wt% or less, 0.29 wt% or less, and even 0.09 wt% or less. In another embodiment, %Si is either not intentionally present or present only as a trace element. In another embodiment, %Si is not present. Depending on the application, a small amount of %Al can improve the yield strength, but if %Al is too high, the fracture toughness may deteriorate. In different embodiments, %Al is 0.01 wt% or more, 0.06 wt% or more, 0.12 wt% or more, 0.22 wt% or more, 0.31 wt% or more, and even 0.51 wt% or more. In another embodiment, %Al is 0.4 wt% or less, 0.24 wt% or less, 0.09 wt% or less, and even 0.04 wt% or less. In another embodiment, %Al is either not intentionally present or present only as a trace element. In another embodiment, %Al is not present. Depending on the application, a small amount of %Nb can improve the yield strength, but if %Nb is too high, the fracture toughness may deteriorate. In different embodiments, %Nb is 0.01 wt% or more, 0.04 wt% or more, 0.06 wt% or more, 0.12 wt% or more, 0.22 wt% or more, and even 0.31 wt% or more. In different embodiments, %Nb is 0.29 wt% or less, 0.14 wt% or less, 0.09 wt% or less, and even 0.04 wt% or less. In another embodiment, %Nb is either not intentionally present or present only as a trace element. In another embodiment, %Nb is not present. Depending on the application, by reducing the content of harmful oxides, a small amount of %Ce can improve toughness-related properties, but if %Ce is too high, the exact opposite result may occur. In different embodiments, %Ce is 0.01 wt% or more, 0.0006 wt% or more, 0.001 wt% or more, 0.006 wt% or more, 0.01 wt% or more, and even 0.12 wt% or more.In different embodiments, %Ce is 0.09 wt% or less, 0.04 wt% or less, 0.009 wt% or less, 0.004 wt% or less, and even 0.0009 wt% or less. In another embodiment, %Ce is not intentionally present or is present only as a trace element. In another embodiment, %Ce is not present. Depending on the application, a certain total content of %La + %Cs + %Nd + %Gd + %Pr + %Ac + %Th + %Tb + %Dy + %Ho + %Er + %Tm + %Yb + %Y + %Lu + %Sc + %Zr + %Hf may be advantageous. In different embodiments, the total of %La + %Cs + %Nd + %Gd + %Pr + %Ac + %Th + %Tb + %Dy + %Ho + %Er + %Tm + %Yb + %Y + %Lu + %Sc + %Zr + %Hf is 0.01 wt% or more, 0.0006 wt% or more, 0.001 wt% or more, 0.006 wt% or more, 0.01 wt% or more, and even 0.12 wt% or more. Depending on the application, even a small total of %La + %Cs + %Nd + %Gd + %Pr + %Ac + %Th + %Tb + %Dy + %Ho + %Er + %Tm + %Yb + %Y + %Lu + %Sc + %Zr + %Hf can improve toughness-related properties by reducing the content of harmful oxides, but if the total of %La + %Cs + %Nd + %Gd + %Pr + %Ac + %Th + %Tb + %Dy + %Ho + %Er + %Tm + %Yb + %Y + %Lu + %Sc + %Zr + %Hf is too high, it may lead to the opposite result. In different embodiments, the total of %La + %Cs + %Nd + %Gd + %Pr + %Ac + %Th + %Tb + %Dy + %Ho + %Er + %Tm + %Yb + %Y + %Lu + %Sc + %Zr + %Hf is 0.09 wt% or less, 0.04 wt% or less, 0.009 wt% or less, 0.004 wt% or less, and even 0.0009 wt% or less. In another embodiment, the total of %La + %Cs + %Nd + %Gd + %Pr + %Ac + %Th + %Tb + %Dy + %Ho + %Er + %Tm + %Yb + %Y + %Lu + %Sc + %Zr + %Hf is not intentionally present or is present only as a trace element. In another embodiment, the total of %La + %Cs + %Nd + %Gd + %Pr + %Ac + %Th + %Tb + %Dy + %Ho + %Er + %Tm + %Yb + %Y + %Lu + %Sc + %Zr + %Hf is not present. Depending on the application, %C, %N, %P, %S, %O are very harmful and should be kept as low as possible.In different embodiments, at least one of %C, %N, %P, %S, %O is 0.04 wt% or less, 0.009 wt% or less, 0.004 wt% or less, 0.0019 wt% or less, 0.0009 wt% or less, and even 0.0004 wt% or less. In another embodiment, at least one of %C, %N, %P, %S, %O is not intentionally present or is present only as a trace element. In another embodiment, at least one of %C, %N, %P, %S, %O is absent. In one embodiment, %C is not present in the composition. In another embodiment, %C is a trace element. In one embodiment, %O is not present in the composition. In another embodiment, %O is a trace element. In one embodiment, %N is not present in the composition. In another embodiment, %N is a trace element. In one embodiment, %P is not present in the composition. In another embodiment, %P is a trace element. In one embodiment, %S is not present in the composition. In another embodiment, %S is a trace element. Depending on the application, the presence of %C, %N, %P, %S, %O can be very harmful and should be kept as low as possible. In different embodiments, each of %C, %N, %P, %S, %O is 0.04 wt% or less, 0.009 wt% or less, 0.004 wt% or less, 0.0019 wt% or less, 0.0009 wt% or less, and even 0.0004 wt% or less. In another embodiment, each of %C, %N, %P, %S, %O is not intentionally present or is present only as a trace element. In another embodiment, each of %C, %N, %P, %S, %O is absent. Depending on the application, the total of %C + %N + %P + %S + %O can be intentionally added. In different embodiments, the total of %C + %N + %P + %S + %O is 0.0006 wt% or more, 0.001 wt% or more, 0.006 wt% or more, 0.01 wt% or more, and even 0.12 wt% or more. Depending on the application, even a small amount of the total of %C + %N + %P + %S + %O can improve the mechanical strength-related properties, but if the total of %C + %N + %P + %S + %O is too much, the fracture toughness may deteriorate severely. In different embodiments, the total of %C + %N + %P + %S + %O is 0.09 wt% or less, 0.04 wt% or less, 0.009 wt% or less, 0.004 wt% or less, and even 0.0009 wt% or less.In another embodiment, the total of %C + %N + %P + %S + %O is either intentionally absent or present only as trace elements. In one embodiment, the total of %C + %N + %P + %S + %O is absent. Depending on the application, a certain total content of %V + %Ta + %W may be advantageous. In different embodiments, the total of %V + %Ta + %W is 0.06 wt% or more, 0.12 wt% or more, 0.32 wt% or more, 0.42 wt% or more, and even 0.52 wt% or more. Depending on the application, even a small amount of the total of %V + %Ta + %W can improve the wear resistance-related properties, but if the total of %V + %Ta + %W is too much, the toughness-related properties may deteriorate. In different embodiments, %V + %... The total of Ta + %W is 0.49 wt% or less, 0.24 wt% or less, 0.14 wt% or less, 0.09 wt% or less, and further 0.009 wt% or less. In another embodiment, the total of %V + %Ta + %W is intentionally absent or present only as trace elements. In another embodiment, the total of %V + %Ta + %W is absent. In one embodiment, %V is absent from the composition. In one embodiment, %V is a trace element. In one embodiment, %Ta is absent from the composition. In one embodiment, %Ta is a trace element. In one embodiment, %W is absent from the composition. In one embodiment, %W is a trace element. In another embodiment, the overall composition of the supplied powder or powder mixture has the following elements and limitations, and all percentages are given in weight percent: %Mo: 0 - 6.8; %W: 0 - 6.9; %Moeq: 0 - 6.8; %Ceq: 0.16 - 1.8; %C: 0 - 1.29; %N: 0.11 - 2.09; %B: 0 - 0.14; %Si: 0 - 1.5; %Mn: 0 - 24; %Ni: 0 - 18.9; %Cr: 12.1 - 38; %Ti: 0 - 2.4; %Al: 0 - 14; %V: 0 - 4; %Nb: 0 - 4; %Zr: 0 - 3; %Hf: 0 - 3; %Ta: 0 - 3; %S: 0 - 0.098; %P: 0 - 0.098; %Pb: 0 - 0.9; %Cu: 0 - 3.9; %Bi: 0 - 0.08; %Se: 0 - 0.08; %Co: 0 - 14; %REE: 0 - 4; %Y: 0 - 1.86; %Sc: 0 - 0.96; %Cs: 0 - 1.4; %O: 0.00012 - 0.899; %Y + %Sc + %REE: 0.0022 - 3.9%; the balance is iron and trace elements (as defined in these documents); where %Ceq = %C + 0.86 * %N + 1.2 * %B and %Moeq = %Mo + 0.5 * %W. Depending on the application, the presence of %Mo is desirable, but in other applications it is rather an impurity. In different embodiments, %Mo is 0.16 wt% or more, 0.51 wt% or more, 1.6 wt% or more, 2.1 wt% or more, 2.6 wt% or more, and further 4.1 wt% or more. On the other hand, in certain applications, excessive %Mo seems to deteriorate some mechanical properties. In different embodiments, %Mo is less than 5.9 wt%, less than 5.4 wt%, less than 4.4 wt%, and further less than 2.9 wt%.Obviously, for all optional elements in a particular application, there may be cases where the desired content in the display is 0 wt% or the element does not exist in the display. In one application, the presence of %W is desirable, while in other applications it is rather an impurity. In different embodiments, %W is more than 0.09 wt%, more than 0.21 wt%, more than 1.1 wt%, more than 1.56 wt%, more than 2.1 wt%, and even more than 2.56 wt%. On the other hand, depending on the application, excessive %W seems to deteriorate the mechanical properties. In different embodiments, %W is less than 5.8 wt%, less than 5.2 wt%, less than 4.2 wt%, less than 2.8 wt%, and even less than 1.4 wt%. Obviously, for all optional elements in a particular application, there may be cases where the desired content in the display is 0 wt% or the element does not exist in the display. Depending on the application, a part of %Mo can be replaced by %W. This replacement is carried out with respect to %Moeq. In one application, the presence of %Moeq is desirable, while in other applications it is rather an impurity. In different embodiments, %Moeq is more than 0.5 wt%, more than 1.6 wt%, more than 1.8 wt%, more than 2.1 wt%, and even more than 4.1 wt%. On the other hand, depending on the application, if %Moeq is too high, the required mechanical properties cannot be achieved. In different embodiments, %Moeq is less than 6.2 wt%, less than 5.7 wt%, less than 4.7 wt%, less than 3.8 wt%, less than 3.4 wt%, and even less than 2.9 wt%. Depending on the application, a higher %Ceq is preferred. In different embodiments, %Ceq is more than 0.26 wt%, more than 0.51 wt%, more than 0.89 wt%, more than 1.06 wt%, and even more than 1.26 wt%. On the other hand, in a particular application, excessive carbon equivalent (%Ceq) may have an adverse effect on the mechanical properties of some manufacturing components. In different embodiments, %Ceq is less than 1.4 wt%, less than 1.24 wt%, less than 0.94 wt%, less than 0.7 wt%, and even less than 0.47 wt%. In one application, the presence of %C is desirable, while in other applications it is rather an impurity. In different embodiments, %C is more than 0.12 wt%, more than 0.26 wt%, more than 0.36 wt%, more than 0.52 wt%, more than 0.72 wt%, more than 0.92 wt%, and even more than 1.06 wt%.On the one hand, for certain applications, excessive %C seems to deteriorate some mechanical properties. In different embodiments, %C is less than 1.1 wt%, less than 0.98 wt%, less than 0.64 wt%, less than 0.48 wt%, and even less than 0.01 wt%. Clearly, as may occur for all optional elements in certain applications, the desired nominal content may be 0 wt% or the element may not nominally exist. Depending on the application, more %N may be desired. In different embodiments, %N is more than 0.16 wt%, more than 0.21 wt%, more than 0.91 wt%, more than 1.26 wt%, and even more than 1.61 wt%. On the other hand, for certain applications, if the nitrogen (%N) content is too high, it may adversely affect some of the mechanical properties of the manufactured components. In different embodiments, %N is less than 1.9 wt%, less than 1.44 wt%, less than 0.9 wt%, less than 0.4 wt%, and even less than 0.24 wt%. The inventors have discovered that for certain applications, especially for certain %Mn and %C contents, a lower %N level may be advantageous. In one embodiment, %N < 0.11 wt%, %Mn > 16% - 48 wt%, and %C > 0.4 wt%. In another embodiment, %N < 0.0019 wt%, %Mn > 21% - 39 wt%, and %C > 0.52 wt%. Depending on the application, especially when %N > 0.4, the control of the content of 30*%C + %Ni + 2*%Mn / 3 + %Cu / 3 + 20*(%N - 0.4) may be important. In different embodiments, 30*%C + %Ni + 2*%Mn / 3 + %Cu / 3 + 20*(%N - 0.4) is greater than 7.2, greater than 11.6, greater than 12.2, and even greater than 16. On the other hand, for certain applications, if the content is too high, it may adversely affect the mechanical properties of the manufactured components. In different embodiments, 30*%C + %Ni + 2*%Mn / 3 + %Cu / 3 + 20*(%N - 0.4) is less than 99, less than 79, less than 64, less than 59, and even less than 44. Depending on the application, the presence of %B is desirable in some cases, while in other applications it is rather an impurity. In different embodiments, %B is more than 0.0002 wt%, more than 0.0006 wt%, more than 0.006 wt%, more than 0.02 wt%, more than 0.09 wt%, and even more than 0.1 wt%.On the one hand, if %B is excessive for a specific application, it seems to deteriorate some mechanical properties. In different embodiments, %B is less than 0.12 wt%, less than 0.09 wt%, less than 0.04 wt%, and even less than 0.009 wt%. Obviously, as may occur for all optional elements in a specific application, the desired indicated content may be 0 wt% or the element may not be indicated as present. On the other hand, if %Si is excessive for a specific application, it seems to deteriorate some mechanical properties. In different embodiments, %Si is less than 1.9 wt%, less than 0.96 wt%, less than 0.74 wt%, less than 0.48 wt%, and even less than 0.19 wt%. Depending on the application, particularly low levels are preferred. In different embodiments, %Si is less than 0.09 wt%, less than 0.03 wt%, less than 0.009 wt%, and even less than 0.003 wt%. Obviously, as may occur for all optional elements in a specific application, the desired indicated content may be 0 wt% or the element may not be indicated as present. Depending on the application, the presence of %Mn is desirable in some cases, but rather an impurity in other cases. In different embodiments, %Mn is more than 0.2 wt%, more than 0.6 wt%, more than 2.6 wt%, more than 5.1 wt%, more than 8.1 wt%, more than 10.6 wt%, and even more than 18.1 wt%. On the one hand, if %Mn is excessive for a specific application, it seems to deteriorate some mechanical properties. In different embodiments, %Mn is less than 17.9 wt%, less than 14 wt%, less than 9.4 wt%, and even less than 6.9 wt%. For a specific application, an even lower %Mn content is preferred. In different embodiments, %Mn is less than 4.9 wt%, less than 3.9 wt%, less than 2.4 wt%, and even less than 1.4 wt%. Obviously, as may occur for all optional elements in a specific application, the desired indicated content may be 0 wt% or the element may not be indicated as present. In one application, the presence of %Ni is desirable, but rather an impurity in other applications. In different embodiments, %Ni is more than 0.1 wt%, more than 0.6 wt%, more than 2.1 wt%, more than 3.6 wt%, more than 5.1 wt%, and even more than 10.1 wt%. On the other hand, if %Ni is excessive for a specific application, it seems to deteriorate some mechanical properties.In different embodiments, %Ni is less than 14 wt%, less than 11.9 wt%, less than 7.4 wt%, and even less than 5.9 wt%. For certain applications, a lower %Ni content is preferred. In different embodiments, %Ni is less than 4.9 wt%, less than 3.9 wt%, less than 2.2 wt%, and even less than 1.2 wt%. Clearly, depending on the specific application, the desired nominal content may be 0 wt% for all optional elements or the element may not nominally exist. Depending on the application, a certain content of %Ni + %Mn is desirable. In different embodiments, %Ni + %Mn is more than 1.2 wt%, more than 2.1 wt%, more than 3.2 wt%, and even more than 4.2 wt%. On the other hand, for certain applications, an excessive %Ni + %Mn seems to deteriorate some mechanical properties. In different embodiments, %Ni + %Mn is less than 29 wt%, less than 24 wt%, less than 19 wt%, less than 16 wt%, and even less than 14 wt%. Depending on the application, a higher level of %Cr is preferred. In different embodiments, %Cr is more than 12.5 wt%, more than 15.1 wt%, more than 18.6 wt%, more than 20.6 wt%, more than 26 wt%, and even more than 30.6 wt%. On the other hand, for certain applications, an excessive chromium (%Cr) content may have an adverse effect on some mechanical properties of the manufacturing components. In different embodiments, %Cr is less than 34 wt%, less than 29 wt%, less than 26 wt%, less than 24 wt%, and even less than 19.6 wt%. On the other hand, for some applications, a lower level may be preferred. In different embodiments, %Cr is less than 18.4 wt%, less than 16.9 wt%, less than 16.2 wt%, less than 15.4 wt%, and even less than 14.9 wt%. Depending on the application, when specific levels of %Mn and %C are present in the composition, %Cr and %N can be partially replaced. In one embodiment, %Cr < 9.9 wt%, and %Mn > 22 wt%, and %N < 0.4 wt%, and %C > 0.52 wt%. Depending on the application, the presence of %Ti is desirable, while in other applications it is rather an impurity. In different embodiments, %Ti is more than 0.12 wt%, more than 0.51 wt%, more than 0.81 wt%, more than 1.1 wt%, more than 1.6 wt%, and even more than 1.8 wt%.On the one hand, in certain applications, an excess of %Ti appears to deteriorate some mechanical properties. In different embodiments, %Ti is less than 1.9 wt%, less than 1.4 wt%, less than 0.9 wt%, less than 0.5 wt%, and even less than 0.14 wt%. Clearly, depending on the particular application, the desired nominal content may be 0 wt% for all optional elements or an element may not nominally exist. In one application, the presence of %Al is desirable, while in other applications it is rather an impurity. In different embodiments, %Al is more than 0.001 wt%, more than 0.16 wt%, 1.1 wt%. Greater than, greater than 2.6 wt%, greater than 5.1 wt%, and even greater than 10.6 wt%. On the other hand, if the aluminum (%Al) content is excessive for a particular application, it may adversely affect some mechanical properties of the manufactured components. In different embodiments, %Al is less than 12 wt%, less than 9.4 wt%, less than 7.4 wt%, less than 5.9 wt%, and even less than 4.9 wt%. Depending on the application, a lower %Al content may be preferred. In different embodiments, %Al is less than 3.4 wt%, less than 2.9 wt%, less than 2.2 wt%, less than 1.5 wt%, and even less than 0.9 wt%. Clearly, as may occur for all optional elements in a particular application, there may be cases where the desired nominal content is 0 wt% or the element does not nominally exist. On the other hand, if %V is excessive for a particular application, it appears to deteriorate some mechanical properties. In different embodiments, %V is less than 2.94 wt%, less than 1.48 wt%, less than 0.94 wt%, less than 0.4 wt%, and even less than 0.19 wt%. Clearly, as may occur for all optional elements in a particular application, there may be cases where the desired nominal content is 0 wt% or the element does not nominally exist. Depending on the application, it is desirable for the %Al + %Ti + %V content to be constant. In different embodiments, %Al + %Ti + %V is greater than 0.001 wt%, greater than 0.52 wt%, and even greater than 1.6 wt%. On the other hand, if %Al + %Ti + %V is excessive for a particular application, it appears to deteriorate some mechanical properties. In different embodiments, %Al + %Ti + %V is less than 5.9 wt%, less than 4 wt%, and even less than 2.4 wt%. The presence of %Nb is desirable in one application but rather an impurity in other applications. In different embodiments, %Nb is greater than 0.06 wt%, greater than 0.1 wt%, greater than 0.26 wt%, greater than 0.6 wt%, greater than 1.6 wt%, and even greater than 2.1 wt%. On the other hand, if the niobium (%Nb) content is excessive for a particular application, it may adversely affect some mechanical properties of the manufactured components. In different embodiments, %Nb is less than 2.9 wt%, less than 1.4 wt%, less than 0.9 wt%, less than 0.4 wt%, and even less than 0.1 wt%.Obviously, for all optional elements in a specific application, there may be cases where the desired content in the display is 0 wt% or the element does not exist in the display. Depending on the application, in order to improve the properties related to mechanical strength, it is desirable that the content of %Cr + %Mo + 1.5 * %Si + 0.5 * %Nb + 5 * %V + 3 * %Al is constant. In different embodiments, %Cr + %Mo + 1.5 * %Si + 0.5 * %Nb + 5 * %V + 3 * %Al is more than 11.6 wt%, more than 13.1 wt%, more than 16 wt%, and even more than 21 wt%. On the other hand, if %Cr + %Mo + 1.5 * %Si + 0.5 * %Nb + 5 * %V + 3 * %Al is excessive, it may lead to a significant deterioration in toughness. In different embodiments, %Cr + %Mo + 1.5 * %Si + 0.5 * %Nb + 5 * %V + 3 * %Al is less than 99 wt%, less than 69 wt%, less than 59 wt%, less than 49 wt%, and even less than 34 wt%. Depending on the application, the presence of %Zr is desirable, but in other applications, it is rather an impurity. In different embodiments, %Zr is more than 0.09 wt%, more than 0.12 wt%, more than 0.36 wt%, more than 0.6 wt%, and even more than 1.6 wt%. On the other hand, in a specific application, if %Zr is excessive, it seems to deteriorate some mechanical properties. In different embodiments, %Zr is less than 2.4 wt%, less than 1.8 wt%, less than 0.9 wt%, less than 0.4 wt%, and even less than 0.08 wt%. Obviously, for all optional elements in a specific application, there may be cases where the desired content in the display is 0 wt% or the element does not exist in the display. On the other hand, in a specific application, if %Hf is excessive, it seems to deteriorate some mechanical properties. In different embodiments, %Hf is less than 2.2 wt%, less than 1.8 wt%, less than 0.9 wt%, less than 0.4 wt%, and even less than 0.08 wt%. Obviously, for all optional elements in a specific application, there may be cases where the desired content in the display is 0 wt% or the element does not exist in the display. On the other hand, in a specific application, if %Ta is excessive, it seems to deteriorate some mechanical properties. In different embodiments, %Ta is less than 2.2 wt%, less than 1.8 wt%, less than 0.9 wt%, less than 0.4 wt%, and even less than 0.08 wt%.Obviously, for all optional elements in a particular application, there may be cases where the desired content in the display is 0 wt% or the element does not exist in the display. Depending on the application, it is desirable that the content of %Zr + %Hf + %Ta be constant. In different embodiments, %Zr + %Hf + %Ta is more than 0.001 wt%, more than 0.16 wt%, and even more than 1.26 wt%. On the other hand, in certain applications, if %Zr + %Hf + %Ta is excessive, it seems to deteriorate some mechanical properties. In different embodiments, %Zr + %Hf + %Ta is less than 5.4 wt%, less than 4 wt%, and even less than 2.4 wt%. Depending on the application, the presence of %Cu is desirable, while in other applications it is rather an impurity. In different embodiments, %Cu is more than 0.1 wt%, more than 0.29 wt%, more than 0.6 wt%, more than 1.2 wt%, and even more than 1.6 wt%. On the other hand, in certain applications, if the copper (%Cu) content is excessive, it may have an adverse effect on some mechanical properties of the manufactured component. In different embodiments, %Cu is less than 2.8 wt%, less than 1.9 wt%, less than 1.2 wt%, less than 0.9 wt%, and even less than 0.39 wt%. Obviously, for all optional elements in a particular application, there may be cases where the desired content in the display is 0 wt% or the element does not exist in the display. Depending on the application, it is desirable that the content of %Ni + %Co + %Cu be constant. In different embodiments, %Ni + %Co + %Cu is more than 1.2 wt%, more than 2.1 wt%, more than 3.2 wt%, and even more than 4.2 wt%. On the other hand, in certain applications, if the content is excessive, it may have an adverse effect on some mechanical properties of the manufactured component. In different embodiments, %Ni + %Co + %Cu is less than 24 wt%, less than 16 wt%, less than 14 wt%, and even less than 9 wt%. On the other hand, in certain applications, if %Bi is excessive, it seems to deteriorate some mechanical properties. In different embodiments, %Bi is less than 0.05 wt%, less than 0.02 wt%, less than 0.009 wt%, less than 0.005 wt%, and even less than 0.0009 wt%. Obviously, for all optional elements in a particular application, there may be cases where the desired content in the display is 0 wt% or the element does not exist in the display.On the one hand, in certain applications, if the %Se is excessive, it seems to deteriorate some mechanical properties. In different embodiments, %Se is less than 0.04 wt%, less than 0.01 wt%, less than 0.009 wt%, less than 0.004 wt%, and even less than 0.0008 wt%. Obviously, as may occur for all optional elements in certain applications, the desired nominal content may be 0 wt% or the element may not nominally exist. Depending on the application, %Se can be at least partially replaced by %Te. Depending on the application, the presence of %Pb is desirable in some cases, but in other applications it is rather an impurity. In different embodiments, %Pb is more than 0.001 wt%, more than 0.009 wt%, more than 0.06 wt%, more than 0.1 wt%, and even more than 0.26 wt%. On the one hand, in certain applications, if the lead (%Pb) content is excessive, it may have an adverse effect on some mechanical properties of the manufacturing components. In different embodiments, %Pb is less than 0.6 wt%, less than 0.4 wt%, less than 0.19 wt%, less than 0.09 wt%, and even less than 0.009 wt%. Obviously, as may occur for all optional elements in certain applications, the desired nominal content may be 0 wt% or the element may not nominally exist. Depending on the application, it is desirable that the content of %Pb + %Bi + %Se is constant. In different embodiments, %Pb + %Bi + %Se is more than 0.0001 wt%, more than 0.001 wt%, and even more than 0.06 wt%. On the one hand, in certain applications, if the content is excessive, it may have an adverse effect on some mechanical properties of the manufacturing components. In different embodiments, %Pb + %Bi + %Se is less than 0.44 wt%, less than 0.19 wt%, and even less than 0.15 wt%. On the one hand, in certain applications, if the %P is excessive, it seems to deteriorate some mechanical properties. In different embodiments, %P is less than 0.02 wt%, less than 0.008 wt%, less than 0.005 wt%, less than 0.0004 wt%, and even less than 0.00008 wt%. Obviously, as may occur for all optional elements in certain applications, the desired nominal content may be 0 wt% or the element may not nominally exist. Depending on the application, it is desirable that the content of %Pb + %Bi + %Se + %Cu + %P is constant.In different embodiments, %Pb + %Bi + %Se + %Cu + %P is more than 0.0001 wt%, more than 0.09 wt%, and even more than 0.12 wt%. On the other hand, in certain applications, if the content is excessive, it may have an adverse effect on some mechanical properties of the manufacturing components. In different embodiments, %Pb + %Bi + %Se + %Cu + %P is 0.94 wt%, less than 0.4 wt%, and even less than 0.3 wt%. On the other hand, in certain applications, if %S is excessive, it seems to deteriorate some mechanical properties. In different embodiments, %S is less than 0.04 wt%, less than 0.009 wt%, less than 0.004 wt%, less than 0.0008 wt%, and even less than 0.00009 wt%. Obviously, for all optional elements in certain applications, there may be cases where the desired content shown is 0 wt% or the element does not exist in the display. Depending on the application, it is desirable that the content of %P + %S is constant. In different embodiments, %P + %S is more than 0.0001 wt%, more than 0.001 wt%, and even more than 0.009 wt%. On the other hand, in certain applications, if the content is excessive, it may have an adverse effect on some mechanical properties of the manufacturing components. In different embodiments, %P + %S is 0.1 wt%, less than 0.04 wt%, and even less than 0.015 wt%. Depending on the application, the presence of %Co is desirable, but in other applications, it is rather an impurity. In different embodiments, %Co is more than 0.1 wt%, more than 0.6 wt%, more than 2.1 wt%, more than 4.1 wt%, more than 5.6 wt%, and even more than 10.6 wt%. On the other hand, in certain applications, if %Co is excessive, it seems to deteriorate some mechanical properties. In different embodiments, %Co is less than 11.4 wt%, less than 9.9 wt%, less than 4.9 wt%, less than 3.4 wt%, and even less than 2.9 wt%. Depending on the application, it is preferable that the %Co content is less. In different embodiments, %Co is less than 2.4 wt%, less than 1.9 wt%, less than 1.2 wt%, less than 0.8 wt%, and even less than 0.38 wt%. Obviously, for all optional elements in certain applications, there may be cases where the desired content shown is 0 wt% or the element does not exist in the display.Depending on the application, it is desirable for the content of %Ni + %Co + %Cu + %Mn to be constant in order to improve certain mechanical properties. In different embodiments, %Ni + %Co + %Cu + %Mn is more than 1.2 wt%, more than 2.1 wt%, more than 3.2 wt%, and even more than 4.2 wt%. On the other hand, in certain applications, an excessive content may have an adverse effect on some mechanical properties of the manufacturing components. In different embodiments, %Ni + %Co + %Cu + %Mn is less than 29 wt%, less than 24 wt%, less than 19 wt%, less than 16 wt%, and even less than 14 wt%. The presence of %Y is desirable in some applications but rather an impurity in other applications. In different embodiments, %Y is more than 0.009 wt%, more than 0.02 wt%, 0. Greater than 0.16 wt%, greater than 0.26 wt%, greater than 0.6 wt%, and even greater than 1.26 wt%. On the other hand, in certain applications, an excess of %Y seems to deteriorate some mechanical properties. In different embodiments, %Y is less than 1.4 wt%, less than 1.2 wt%, less than 0.8 wt%, less than 0.2 wt%, and even less than 0.09 wt%. Clearly, as may occur for all optional elements in a particular application, there may be cases where the desired indicated content is 0 wt% or the element does not appear indicated. Depending on the application, the presence of %Sc is desirable, while in other applications it is rather an impurity. In different embodiments, %Sc is greater than 0.001 wt%, greater than 0.04 wt%, greater than 0.12 wt%, greater than 0.21 wt%, and even greater than 0.6 wt%. On the other hand, in certain applications, an excess of %Sc seems to deteriorate some mechanical properties. In different embodiments, %Sc is less than 0.74 wt%, less than 0.4 wt%, less than 0.18 wt%, less than 0.02 wt%, and even less than 0.04 wt%. Clearly, as may occur for all optional elements in a particular application, there may be cases where the desired indicated content is 0 wt% or the element does not appear indicated. On the other hand, in certain applications, an excess of %Cs seems to deteriorate some mechanical properties. In different embodiments, %Cs is less than 0.94 wt%, less than 0.44 wt%, less than 0.19 wt%, less than 0.09 wt%, and even less than 0.004 wt%. Clearly, as may occur for all optional elements in a particular application, there may be cases where the desired indicated content is 0 wt% or the element does not appear indicated. Depending on the application, a higher %O content is preferred. In different embodiments, %O is greater than 0.006 wt%, greater than 0.01 wt%, greater than 0.09 wt%, greater than 0.26 wt%, and even greater than 0.41 wt%. On the other hand, in certain applications, an excessive oxygen (%O) content may adversely affect some mechanical properties of the manufactured components. In different embodiments, %O is less than 0.49 wt%, less than 0.24 wt%, less than 0.09 wt%, less than 0.04 wt%, and even less than 0.0024 wt%. Depending on the application, the presence of %REE (as defined in this document) is desirable, while in other applications it is rather an impurity.In different embodiments, %REE is more than 0.09 wt%, more than 0.16 wt%, more than 0.21 wt%, more than 1.1 wt%, and even more than 1.6 wt%. On the other hand, if %REE is excessive for a particular application, it may have an adverse effect on the mechanical properties of the manufacturing components. In different embodiments, %REE is less than 2.9 wt%, less than 1.4 wt%, less than 0.9 wt%, less than 0.4 wt%, less than 0.2 wt%, and even less than 0.09 wt%. Obviously, as may occur for all optional elements in a particular application, the desired nominal content may be 0 wt% or the element may not be nominally present. Depending on the application, it may be desirable for the content of %Sc + %Y + %REE to be constant. In different embodiments, %Y + %Sc + %REE is more than 0.21 wt%, more than 0.56 wt%, more than 1.26 wt%, more than 2.1 wt%, and even more than 2.56 wt%. On the other hand, if %Y + %Sc + %REE is excessive for a particular application, it seems to deteriorate some mechanical properties. In different embodiments, %Y + %Sc + %REE is less than 2.9 wt%, less than 1.9 wt%, less than 1.4 wt%, and even less than 0.4 wt%. For a particular application, a lower level of %Y + %Sc + %REE is preferred. In one embodiment, %Y + %Sc + %REE < 0.0022 wt%. Also, note that the "<" in this document includes the case where the element is not present. Depending on the application, it may be important to control the following parameter PARD-1 = (%Ni + %Mn) / (%Y + %Sc + %REE). In different embodiments, PARD-1 is greater than 0.6, greater than 2, greater than 6, greater than 13, greater than 22, greater than 52, greater than 102, and even greater than 502. Depending on the application, it is preferred that PARD-1 is less than a certain value. In different embodiments, PARD-1 is less than 4900, less than 2900, less than 1998, less than 1490, less than 990, and even less than 590. When PARD-1 is important, if %Y, %Sc, and %REE are not present or are present in very small amounts and their values are outside the preferred ranges of PARD-1 disclosed above, this parameter can take very large values.For example, in a material consisting of %Ni = 8.1 wt%; %Mn = 6.7 wt% and without the presence of %Y, %Sc, %REE, PARD-1 = (8.1 + 6.7) / 0, which is clearly outside the preferred range of PARD-1. The same applies to other parameters including division defined in this document, where the denominator of the division may be a very small value or zero. Depending on the application, it may be important to control the following parameter PARD-2 = (%Ni + %Mn) / %N. In different embodiments, PARD-2 is greater than 1.2, greater than 2.6, greater than 4.1, greater than 5.2, greater than 6.2, and even greater than 8.2. Depending on the application, it is preferred that PARD-2 is below a certain value. In different embodiments, PARD-2 is less than 199, less than 99, less than 49, less than 39, less than 24, and even less than 19. Depending on the application, it may be important to control the following parameter PARD-3 = %Cr / %N. In different embodiments, PARD-3 is greater than 2.1, greater than 5.2, greater than 8.6, greater than 12.5, greater than 16.2, and even greater than 20.2. Depending on the application, it is preferred that PARD-3 is below a certain value. In different embodiments, PARD-3 is less than 249, less than 149, less than 99, less than 89, less than 74, less than 64, and even less than 48. Depending on the application, it may be important to control the following parameter PARD-4 = %Cr / (%Y + %Sc + %REE). In different embodiments, PARD-4 is greater than 0.2, greater than 1.2, greater than 3.1, greater than 3.3, greater than 4.1, greater than 22, greater than 41, and even greater than 56. Depending on the application, it is preferred that PARD-4 is below a certain value. In different embodiments, PARD-4 is less than 7900, less than 4900, less than 2990, less than 1400, and even less than 990. Depending on the application, it may be important to control the following parameter PARD-5 = (%Ni + %Mn) / (%N + %Y + %Sc + %REE). In different embodiments, PARD-5 is greater than 0.1, greater than 0.6, greater than 0.9, greater than 1.2, greater than 2.2, greater than 3.2, and even greater than 5.2. Depending on the application, it is preferred that PARD-5 is below a certain value.In different embodiments, PARD-5 is less than 199, less than 99, less than 74, less than 59, less than 49, less than 38, and even less than 24. Depending on the application, it may be important to control the following parameter PARD-6 = %Cr / (%N + %Y + %Sc + %REE). In different embodiments, PARD-6 is greater than 0.7, greater than 1.2, greater than 2.6, greater than 3.6, greater than 9.6, greater than 12, and even greater than 16. Depending on the application, it is preferable that PARD-6 is below a certain value. In different embodiments, PARD-6 is less than 199, less than 99, less than 74, less than 59, less than 49, less than 38, and even less than 24. Depending on the application, it may be important to control the following parameter PARD-7 = ABS(%Cr / %N - (%Ni + %Mn) / (%Y + %Sc + %REE)). In different embodiments, PARD-7 is greater than 2, greater than 4.6, greater than 7.6, greater than 10.5, greater than 12, and even greater than 18. Depending on the application, it is preferable that PARD-7 is below a certain value. In different embodiments, PARD-7 is less than 199, less than 99, less than 74, less than 59, less than 49, less than 38, and even less than 24. The feature "%REE" is defined throughout this document in different alternative forms, which will be described in detail below. In one embodiment, %REE is at least one element selected from actinide elements and lanthanide elements. In an alternative embodiment, %REE is any actinide element. In another alternative embodiment, %REE is any lanthanide element. In another alternative embodiment, %REE is %La + %Ce + %Pr + %Nd + %Pm + %Sm + %Eu + %Gd + %Tb + %Dy + %Ho + %Er + %Tm + %Yb + %Lu. In another alternative embodiment, %REE is the sum of %Ac + %Th + %Pa + %U + %Np + %Pu + %Am + %Cm + %Bk + %Cf + %Es + %Fm + %Md + %No + %Lr. In another alternative embodiment, %REE is the sum of lanthanides and actinides. In another alternative embodiment, %REE is %La. In another alternative embodiment, %REE is %Ac. In another alternative embodiment, %REE is %Ce. In another alternative embodiment, %REE is %Nd. In another alternative embodiment, %REE is %Gd. In another alternative embodiment, %REE is %Sm.In another alternative embodiment, %REE is %Pr. In another alternative embodiment, %REE is %Pm. In another alternative embodiment, %REE is %Eu. In another alternative embodiment, %REE is %Tb. In another alternative embodiment, %REE is %Dy. In another alternative embodiment, %REE is %Ho. In another alternative embodiment, %REE is %Er. In another alternative embodiment, %REE is %Tm. In another alternative embodiment, %REE is %Yb. In another alternative embodiment, %REE is %Lu. In another alternative embodiment, %REE is partially or wholly replaced by %Cs. All the embodiments disclosed above, provided they are not mutually exclusive, can be combined arbitrarily among themselves and with any other embodiment disclosed in this document regarding "%REE". In another embodiment, the overall composition of the supplied powder or powder mixture has the following elements and limitations, and all percentages are given in weight percent: %Mg: 0.006 - 10.6; %Si: 0.006 - 23; %Ti: 0.002 - 0.35; %Cr: 0.01 - 0.40; %Mn - 0.002 - 1.8; %Fe: 0.006 - 1.5; %Ni: 0 - 3.0; %Cu: 0.006 - 10.7; %Zn: 0.006 - 7.8; %Sn: 0 - 7; %Zr: 0 - 0.5; the balance consists of aluminum and trace elements (as defined in this document). In one embodiment, %Mg is more than 0.009 wt%. In another embodiment, %Mg is more than 1.62 wt%. In one embodiment, %Mg is less than 8.38 wt%. In one embodiment, %Mg is less than 4.82 wt%. In another embodiment, %Si is more than 0.02 wt%. In another embodiment, %Si is more than 1.64 wt%. In one embodiment, %Si is less than 19.8 wt%. In another embodiment, %Si is less than 9.8 wt%. In one embodiment, %Ti is more than 0.008 wt%. In another embodiment, %Ti is more than 0.12 wt%. In one embodiment, %Ti is less than 0.29 wt%. In another embodiment, %Ti is less than 0.24 wt%. In one embodiment, %Cr is more than 0.03 wt%. In another embodiment, %Cr is more than 0.12 wt%. In one embodiment, %Cr is less than 0.34 wt%. In another embodiment, %Cr is less than 0.23 wt%.In one embodiment, %Mn is more than 0.01 wt%. In another embodiment, %Mn is more than 0.21 wt%. In one embodiment, %Mn is less than 1.38 wt%. In another embodiment, %Mn is less than 0.96 wt%. In one embodiment, %Fe is more than 0.01 wt%. In another embodiment, %Fe is more than 0.57 wt%. In one embodiment, %Fe is less than 1.38 wt%. In another embodiment, %Fe is less than 0.96 wt%. In one embodiment. , %Ni is more than 0.01 wt%. In another embodiment, %Ni is more than 0.41 wt%. In one embodiment, %Ni is less than 2.46 wt%. In another embodiment, %Ni is less than 1.92 wt%. In one embodiment, %Cu is more than 0.08 wt%. In another embodiment, %Cu is more than 0.16 wt%. In one embodiment, %Cu is less than 8.38 wt%. In another embodiment, %Cu is less than 4.82 wt%. In one embodiment, %Zn is more than 0.09 wt%. In another embodiment, %Zn is more than 0.16 wt%. In one embodiment, %Zn is less than 6.38 wt%. In another embodiment, %Zn is less than 3.82 wt%. In one embodiment, %Sn is more than 0.001 wt%. In another embodiment, %Sn is more than 0.12 wt%. In one embodiment, %Sn is less than 4.38 wt%. In another embodiment, %Sn is less than 3.42 wt%. In one embodiment, %Zr is more than 0.009 wt%. In another embodiment, %Zr is more than 0.06 wt%. In one embodiment, %Zr is less than 0.38 wt%. In another embodiment, %Zr is less than 0.24 wt%. In another embodiment, the overall composition of the supplied powder or powder mixture has the following elements and limitations, and all percentages are expressed in weight percent: %Zn: 0 - 40; %Ni: 0 - 31; %Al: 0 - 13; %Sn: 0 - 10; %Fe: 0 - 5.5; %Si: 0 - 4; %Pb: 0 - 4; %Mn: 0 - 3; %Co: 0 - 2.7; %Be: 0 - 2.75; %Cr: 0 - 1; the balance consists of copper and trace elements (as defined in these documents). In one embodiment, %Zn is more than 0.29 wt%. In another embodiment, %Zn is more than 1.26 wt%. In one embodiment, %Zn is less than 26.38 wt%. In another embodiment, %Zn is less than 13.42 wt%. In one embodiment, %Ni is more than 0.1 wt%. In another embodiment, %Ni is more than 2.61 wt%. In one embodiment, %Ni is less than 24.46 wt%. In another embodiment, %Ni is less than 16.92 wt%. In one embodiment, %Al is more than 0.6 wt%. In another embodiment, %Al is more than 2.14 wt%. In one embodiment, %Al is less than 8.24 wt%. In another embodiment, %Al is less than 5.12 wt%.In one embodiment, %Sn is more than 0.01 wt%. In another embodiment, %Sn is more than 0.32 wt%. In one embodiment, %Sn is less than 6.38 wt%. In another embodiment, %Sn is less than 4.42 wt%. In one embodiment, %Fe is more than 0.1 wt%. In another embodiment, %Fe is more than 0.67 wt%. In one embodiment, %Fe is less than 3.38 wt%. In another embodiment, %Fe is less than 2.96 wt%. In one embodiment, %Si is more than 0.2 wt%. In another embodiment, %Si is more than 0.64 wt%. In one embodiment, %Si is less than 2.8 wt%. In another embodiment, %Si is less than 1.8 wt%. In one embodiment, %Pb is more than 0.002 wt%. In another embodiment, %Pb is more than 0.4 wt%. In one embodiment, %Pb is less than 2.8 wt%. In another embodiment, %Pb is less than 1.4 wt%. In one embodiment, %Mn is more than 0.001 wt%. In another embodiment, %Mn is more than 0.26 wt%. In one embodiment, %Mn is less than 2.38 wt%. In another embodiment, %Mn is less than 0.94 wt%. In one embodiment, %Co is more than 0.0001 wt%. In another embodiment, %Co is more than 0.16 wt%. In one embodiment, %Co is less than 2.18 wt%. In another embodiment, %Co is less than 0.84 wt%. In one embodiment, %Be is more than 0.0006 wt%. In another embodiment, %Be is more than 0.12 wt%. In one embodiment, %Be is less than 1.84 wt%. In another embodiment, %Be is less than 0.44 wt%. In another embodiment, %Cr is more than 0.003 wt%. In one embodiment, %Cr is more than 0.22 wt%. In another embodiment, %Cr is less than 0.44 wt%. In another embodiment, %Cr is less than 0.19 wt%. In another embodiment, the overall composition of the supplied powder or powder mixture has the following elements and limitations, and all percentages are expressed in weight percent: %Be: 0.15 - 3.0; %Co: 0 - 3; %Ni: 0 - 2.2; %Pb: 0 - 0.6; %Fe: 0 - 0.25; %Si: 0 - 0.35; %Sn: 0 - 0.25, %Zr 0 - 0.5; the balance consists of copper and trace elements (as defined in these documents).In one embodiment, %Be is more than 0.21 wt%. In another embodiment, %Be is more than 0.52 wt%. In one embodiment, %Be is less than 2.44 wt%. In another embodiment, %Be is less than 1.44 wt%. In one embodiment, %Co is more than 0.001 wt%. In another embodiment, %Co is more than 0.12 wt%. In one embodiment, %Co is less than 2.18 wt%. In another embodiment, %Co is less than 0.84 wt%. In one embodiment, %Ni is more than 0.001 wt%. In another embodiment, %Ni is more than 0.61 wt%. In one embodiment, %Ni is less than 1.46 wt%. In another embodiment, %Ni is less than 0.92 wt%. In one embodiment, %Pb is more than 0.009 wt%. In another embodiment, %Pb is more than 0.26 wt%. In one embodiment, %Pb is less than 0.48 wt%. In another embodiment, %Pb is less than 0.29 wt%. In one embodiment, %Fe is more than 0.001 wt%. In another embodiment, %Fe is more than 0.09 wt%. In one embodiment, %Fe is less than 0.19 wt%. In another embodiment, %Fe is less than 0.14 wt%. In one embodiment, %Si is more than 0.002 wt%. In another embodiment, %Si is more than 0.04 wt%. In one embodiment, %Si is less than 0.24 wt%. In another embodiment, %Si is less than 0.09 wt%. In one embodiment, %Sn is more than 0.001 wt%. In another embodiment, %Sn is more than 0.03 wt%. In an embodiment, %Sn is less than 0.23 wt%. In another embodiment, %Sn is less than 0.08 wt%. In one embodiment, %Zr is more than 0.009 wt%. In another embodiment, %Zr is more than 0.08 wt%. In one embodiment, %Zr is less than 0.38 wt%. In another embodiment, %Zr is less than 0.19 wt%. In another embodiment, the overall composition of the supplied powder or powder mixture has the following elements and limitations, and all percentages are expressed in weight percent: %Cr: 9 - 33; %W: 0 - 26; %Mo: 0 - 29; %C: 0 - 3.5; %Fe: 0 - 9; %Ni: 0 - 35; %Si: 0 - 3.9; Mn: 0 - 2.5; %B: 0 - 1; %V: 0 - 4.2; %Nb / %Ta: 0 - 5.5; the balance consists of cobalt and trace elements (as defined herein).In one embodiment, %Cr is more than 12.6 wt%. In another embodiment, %Cr is more than 16.6 wt%. In one embodiment, %Cr is less than 24.8 wt%. In another embodiment, %Cr is less than 14.9 wt%. In one embodiment, %W is more than 2.64 wt%. In another embodiment, %W is more than 8.6 wt%. In one embodiment, %W is less than 19.8 wt%. In another embodiment, %W is less than 12.9 wt%. In one embodiment, %Mo is more than 3.16 wt%. In another embodiment, %Mo is more than 10.6 wt%. In one embodiment, %Mo is less than 19.8 wt%. In another embodiment, %Mo is less than 13.9 wt%. In one embodiment, %C is more than 0.001 wt%. In another embodiment, %C is more than 0.02 wt%. In one embodiment, %C is less than 1.88 wt%. In another embodiment, %C is less than 0.88 wt%. In one embodiment, %Fe is more than 0.1 wt%. In another embodiment, %Fe is more than 0.59 wt%. In one embodiment, %Fe is less than 6.8 wt%. In another embodiment, %Fe is less than 4.42 wt%. In one embodiment, %Ni is more than 0.01 wt%. In another embodiment, %Ni is more than 1.26 wt%. In one embodiment, %Ni is less than 18.8 wt%. In another embodiment, %Ni is less than 9.8 wt%. In one embodiment, %Si is more than 0.02 wt%. In another embodiment, %Si is more than 0.09 wt%. In one embodiment, %Si is less than 1.94 wt%. In another embodiment, %Si is less than 0.94 wt%. In one embodiment, %Mn is more than 0.0001 wt%. In another embodiment, %Mn is more than 0.16 wt%. In one embodiment, %Mn is less than 2.18 wt%. In another embodiment, %Mn is less than 0.88 wt%. In one embodiment, %B is more than 0.0001 wt%. In another embodiment, %B is more than 0.006 wt%. In one embodiment, %B is less than 0.42 wt%. In another embodiment, %B is less than 0.18 wt%. In one embodiment, %V is more than 0.01 wt%. In another embodiment, %V is more than 0.26 wt%. In one embodiment, %V is less than 2.42 wt%. In another embodiment, %V is less than 1.48 wt%.In one embodiment, %Nb / %Ta is more than 0.01 wt%. In another embodiment, %Nb / %Ta is more than 0.26 wt%. In one embodiment, %Nb / %Ta is less than 1.42 wt%. In another embodiment, %Nb / %Ta is less than 0.88 wt%. In another embodiment, the overall composition of the supplied powder or powder mixture has the following elements and limitations, and all percentages are given in weight percent: %Fe: 0 - 42; %Cu: 0 - 34; %Cr: 0 - 31; %Mo: 0 - 24; %Co: 0 - 18; %W: 0 - 14; %Nb: 0 - 5.5; %Mn: 0 - 5.25; %Al: 0 - 5; Ti: 0 - 3; %Zn: 0 - 1; %Si: 0 - 1; %C: 0 - 0.3; %S: 0.01 max; the balance consists of nickel and trace elements (as defined herein). In one embodiment, %Fe is more than 1.64 wt%. In another embodiment, %Fe is more than 4.58 wt%. In one embodiment, %Fe is less than 26.8 wt%. In another embodiment, %Fe is less than 14.42 wt%. In one embodiment, %Cu is more than 1.14 wt%. In another embodiment, %Cu is more than 2.58 wt%. In one embodiment, %Cu is less than 16.8 wt%. In another embodiment, %Cu is less than 9.42 wt%. In one embodiment, %Cr is more than 0.64 wt%. In another embodiment, %Cr is more than 3.58 wt%. In one embodiment, %Cr is less than 14.8 wt%. In another embodiment, %Cr is less than 6.42 wt%. In one embodiment, %Mo is more than 1.12 wt%. In another embodiment, %Mo is more than 4.58 wt%. In one embodiment, %Mo is less than 12.8 wt%. In another embodiment, %Mo is less than 4.42 wt%. In one embodiment, %Co is more than 0.12 wt%. In another embodiment, %Co is more than 1.58 wt%. In one embodiment, %Co is less than 9.8 wt%. In another embodiment, %Co is less than 3.42 wt%. In an embodiment, %W is more than 0.22 wt%. In another embodiment, %W is more than 1.58 wt%. In one embodiment, %W is less than 9.8 wt%. In another embodiment, %W is less than 4.42 wt%. In one embodiment, %Nb is more than 0.002 wt%. In another embodiment, %Nb is more than 0.58 wt%.In one embodiment, %Nb is less than 3.8 wt%. In another embodiment, %Nb is less than 1.42 wt%. In one embodiment, %Al is more than 0.002 wt%. In another embodiment, %Al is more than 0.28 wt%. In one embodiment, %Al is less than 3.4 wt%. In another embodiment, %Al is less than 1.42 wt%. In one embodiment, %Ti is more than 0.006 wt%. In another embodiment. , %Ti is more than 0.18 wt%. In one embodiment, %Ti is less than 3.8 wt%. In another embodiment, %Ti is less than 1.22 wt%. In one embodiment, %Zn is more than 0.009 wt%. In another embodiment, %Zn is more than 0.08 wt%. In one embodiment, %Zn is less than 0.68 wt%. In another embodiment, %Zn is less than 0.19 wt%. In one embodiment, %Si is more than 0.09 wt%. In another embodiment, %Si is more than 0.14 wt%. In one embodiment, %Si is less than 0.48 wt%. In another embodiment, %Si is less than 0.19 wt%. In one embodiment, %C is more than 0.02 wt%. In another embodiment, %C is more than 0.09 wt%. In one embodiment, %C is less than 0.19 wt%. In another embodiment, %C is less than 0.12 wt%. In one embodiment, %S is more than 0.0002 wt%. In another embodiment, %S is more than 0.0004 wt%. In one embodiment, %S is less than 0.009 wt%. In another embodiment, %S is less than 0.0009 wt%. In another embodiment, the overall composition of the supplied powder or powder mixture has the following elements and limitations, and all percentages are expressed in weight percent: %V: 0 - 14.5; %Mo: 0 - 13; %Cr: 0 - 12; %Sn: 0 - 11.5; %Al: 0 - 8; %Mn: 0 - 8; %Zr: 0 - 7.5; %Cu: 0 - 3; %Nb: 0 - 2.5; %Fe: 0 - 2.5; %Ta: 0 - 1.5; %Si: 0 - 0.5; %C: 0.1 max; %N: 0.05 max; %O: 0.2 max; %H: 0.03 max; the balance consists of titanium and trace elements (as defined in these documents). In one embodiment, %V is more than 0.02 wt%. In another embodiment, %V is more than 0.68 wt%. In one embodiment, %V is less than 9.8 wt%. In another embodiment, %V is less than 4.42 wt%. In one embodiment, %Mo is more than 0.36 wt%. In another embodiment, %Mo is more than 2.68 wt%. In one embodiment, %Mo is less than 8.8 wt%. In another embodiment, %Mo is less than 6.42 wt%. In one embodiment, %Cr is more than 0.16 wt%. In another embodiment, %Cr is more than 3.68 wt%. In one embodiment, %Cr is less than 9.8 wt%.In another embodiment, %Cr is less than 4.42 wt%. In one embodiment, %Sn is more than 0.06 wt%. In another embodiment, %Sn is more than 0.62 wt%. In one embodiment, %Sn is less than 6.8 wt%. In another embodiment, %Sn is less than 2.42 wt%. In one embodiment, %Al is more than 0.006 wt%. In another embodiment, %Al is more than 0.42 wt%. In one embodiment, %Al is less than 4.8 wt%. In another embodiment, %Al is less than 2.42 wt%. In one embodiment, %Mn is more than 0.02 wt%. In another embodiment, %Mn is more than 0.12 wt%. In one embodiment, %Mn is less than 6.8 wt%. In another embodiment, %Mn is less than 4.42 wt%. In one embodiment, %Zr is more than 0.008 wt%. In another embodiment, %Zr is more than 0.02 wt%. In one embodiment, %Zr is less than 4.8 wt%. In another embodiment, %Zr is less than 2.42 wt%. In one embodiment, %Cu is more than 0.0008 wt%. In another embodiment, %Cu is more than 0.06 wt%. In one embodiment, %Cu is less than 1.8 wt%. In another embodiment, %Cu is less than 0.42 wt%. In one embodiment, %Nb is more than 0.0009 wt%. In another embodiment, %Nb is more than 0.02 wt%. In one embodiment, %Nb is less than 0.64 wt%. In another embodiment, %Nb is less than 0.42 wt%. In one embodiment, %Fe is more than 0.009 wt%. In another embodiment, %Fe is more than 0.04 wt%. In one embodiment, %Fe is less than 1.64 wt%. In another embodiment, %Fe is less than 0.92 wt%. In one embodiment, %Ta is more than 0.0007 wt%. In another embodiment, %Ta is more than 0.002 wt%. In one embodiment, %Ta is less than 0.44 wt%. In another embodiment, %Ta is less than 0.19 wt%. In one embodiment, %Si is more than 0.0001 wt%. In another embodiment, %Si is more than 0.02 wt%. In one embodiment, %Si is less than 0.34 wt%. In another embodiment, %Si is less than 0.09 wt%. In one embodiment, %C is more than 0.00001 wt%. In another embodiment, %C is more than 0.002 wt%.In one embodiment, %C is less than 0.03 wt%. In another embodiment, %C is less than 0.09 wt%. In one embodiment, %N is more than 0.000001 wt%. In another embodiment, %N is more than 0.0002 wt%. In one embodiment, %N is less than 0.003 wt%. In another embodiment, %N is less than 0.008 wt%. In one embodiment, %O is more than 0.00002 wt%. In another embodiment, %O is more than 0.001 wt%. In one embodiment, %O is less than 0.04 wt%. In another embodiment, %O is less than 0.09 wt%. In one embodiment, %H is more than 0.000001 wt%. In another embodiment, %H is more than 0.0002 wt%. In one embodiment, %H is less than 0.003 wt%. In another embodiment, %H is less than 0.008 wt%. In another embodiment, the overall composition of the supplied powder or powder mixture has the following elements and limitations, and all percentages are given in weight percentages: %Al: 0 to 10; %Zn: 0 to 6; %Y: 0 to 5.2; %Cu: 0 to 3; %Ag: 0 to 2.5, %Th: 0 to 3.3; Si: 0 to 1.1; %Mn: 0 to 0.75; the balance consists of magnesium and trace elements (as defined in these documents). In one embodiment, %Al is more than 0.2 wt%. In another embodiment, %Al is more than 1.68 wt%. In one embodiment, %Al is less than 7.8 wt%. In another embodiment, %Al is less than 4.42 wt%. In one embodiment, %Zn is more than 0.04 wt%. In another embodiment, %Zn is more than 0.16 wt%. In one embodiment, %Zn is less than 4.8 wt%. In another embodiment, %Zn is less than 2.34 wt%. In one embodiment, %Y is more than 0.26 wt%. In another embodiment, %Y is more than 0.56 wt%. In one embodiment, %Y is less than 3.8 wt%. In another embodiment, %Y is less than 2.44 wt%. In one embodiment, %Cu is more than 0.06 wt%. In another embodiment, %Cu is more than 0.12 wt%. In one embodiment, %Cu is less than 1.8 wt%. In another embodiment, %Cu is less than 1.44 wt%. In one embodiment, %Ag is more than 0.008 wt%. In another embodiment, %Ag is more than 0.009 wt%. In one embodiment, %Ag is less than 0.8 wt%.In another embodiment, %Ag is less than 0.44 wt%. In one embodiment, %Th is more than 0.006 wt%. In another embodiment, %Th is more than 0.02 wt%. In one embodiment, %Th is less than 0.84 wt%. In another embodiment, %Th is less than 0.44 wt%. In one embodiment, %Si is more than 0.06 wt%. In another embodiment, %Si is more than 0.2 wt%. In one embodiment, %Si is less than 0.44 wt%. In another embodiment, %Si is less than 0.24 wt%. In one embodiment, %Mn is more than 0.004 wt%. In another embodiment, %Mn is more than 0.02 wt%. In one embodiment, %Mn is less than 0.44 wt%. In another embodiment, %Mn is less than 0.14 wt%. However, the overall composition of the supplied powder or powder mixture is not limited to the materials described above. In an alternative embodiment, the compositions disclosed in this paragraph refer to the composition of at least one of the powders included in the powder mixture. All of the embodiments disclosed above are combinable with each other and with any other embodiment disclosed in this document, provided that they are not mutually exclusive. In one embodiment, throughout this disclosure, the use of terms such as "less than", "more than", "at least", "from", "up to", "at least", "greater than", "higher than", "exceeding", "less than" includes the recited numerical values.

[0010] Regarding the composition of the supplied powder or powder mixture, the levels of certain elements in the supplied powder or powder mixture can be particularly important for the properties of some components. The inventors have surprisingly found that in some applications of this method, starting from a powder material having an appropriate %C, %O, %N, %H and / or %B content, it is possible to produce components with improved mechanical properties such as mechanical strength, elongation and / or toughness.

[0011] As described above, in some applications of this method, the use of a powder or powder mixture having an appropriate carbon (%C) content may be advantageous. In one embodiment, the supplied powder or powder mixture includes an appropriate %C content. The feature of "appropriate %C content" is defined throughout this document in the form of different options, which will be described in detail below. In different embodiments, the appropriate %C content is a carbon content of 0.0001 wt% or more, 0.1 wt% or more, 0.21 wt% or more, 0.41 wt% or more, 1.16 wt% or more, 1.56 wt% or more, and even 2.1 wt% or more. On the other hand, if the carbon content is excessive, it may be harmful depending on the application. In different embodiments, the appropriate %C content is a carbon content of 3.9 wt% or less, 2.4 wt% or less, 1.9 wt% or less, 1.4 wt% or less, 0.9 wt% or less, 0.49 wt% or less, and even 0.08 wt% or less. In another embodiment, at least one of the powders of the mixture includes an appropriate %C content (as defined in this document). All the embodiments disclosed above are combinable with each other and with any other embodiment disclosed in this document related to "appropriate %C content", provided that they are not mutually exclusive. All the values and ranges of the different embodiments disclosed above are combinable with each other and with any other embodiment disclosed in this document, provided that they are not mutually exclusive. For example, in one embodiment, the supplied powder or powder mixture includes an appropriate %C content, and the appropriate %C content is a carbon content of 0.0001 to 3.9 wt%. Also, for example, in another embodiment, it is 0.1 wt% to 2.4 wt%. Also, for example, in another embodiment, it is 0.21 to 1.9 wt%.

[0012] Additionally, or alternatively, in some applications of the method, it may be advantageous to use a powder or powder mixture having an appropriate oxygen (%O) content. In one embodiment, the powder or powder mixture supplied contains an appropriate %O content. The feature of "appropriate %O content" is defined throughout this document in the form of different options, which will be described in detail below. In different embodiments, the appropriate %O content is an oxygen content of 0.01 ppm or more, 0.6 ppm or more, 20 ppm or more, 110 ppm or more, 210 ppm or more, 410 ppm or more, 1100 ppm or more, 2600 ppm or more, and even 5100 ppm or more. On the other hand, if the oxygen content is excessive, it may be harmful depending on the application. In different embodiments, the appropriate %O content is an oxygen content of 49000 ppm or less, 29000 ppm or less, 9000 ppm or less, 5900 ppm or less, 3400 ppm or less, 900 ppm or less, and even 590 ppm or less. In another embodiment, at least one of the powders of the mixture contains an appropriate %O content (as defined in this document). All of the embodiments disclosed above are combinable with each other and with any other embodiment related to the "appropriate %O content" disclosed in this document, provided that they are not mutually exclusive. All of the values and ranges of the different embodiments disclosed above are combinable with each other and with any other embodiment disclosed in this document, provided that they are not mutually exclusive. For example, in one embodiment, the powder or powder mixture supplied contains an appropriate %O content, and the appropriate %O content is an oxygen content of 0.01 - 49000 ppm. Also, for example, in another embodiment, it is between 0.6 - 29000 ppm. Also, for example, in another embodiment, it is between 20 - 9000 ppm.

[0013] Additionally, or alternatively, in some applications of the present method, the use of a powder or powder mixture having an appropriate nitrogen (%N) content may be advantageous. In one embodiment, the powder or powder mixture supplied has an appropriate %N content. The feature of "appropriate %N content" is defined throughout this document in the form of different alternatives, which will be described in detail below. In different embodiments, the appropriate nitrogen content is a nitrogen content of 0.01 ppm or more, 0.6 ppm or more, 1.2 ppm or more, 56 ppm or more, 110 ppm or more, 260 ppm or more, 560 ppm or more, 1100 ppm or more, and even 2600 ppm or more. On the other hand, if the nitrogen content is excessive, it may be harmful depending on the application. In different embodiments, the appropriate %N content is a nitrogen content of 2.9 wt% or less, 0.8 wt% or less, 0.29 wt% or less, 0.12 wt% or less, 19400 ppm or less, 3900 ppm or less, 940 ppm or less, 440 ppm or less, 190 ppm or less, and even 49 ppm or less. In another embodiment, at least one of the powders of the mixture contains an appropriate %N content (as defined in this document). All of the embodiments disclosed above are combinable with each other and with any other embodiment disclosed in this document related to "appropriate %N content", provided that they are not mutually exclusive. All values and ranges of the different embodiments disclosed above are combinable with each other and with any other embodiment disclosed in this document, provided that they are not mutually exclusive. For example, in one embodiment, the powder or powder mixture supplied contains an appropriate %N content, and the appropriate %N content is a nitrogen content of 0.01 ppm to 2.9 wt%. Also, for example, in another embodiment, it is a nitrogen content of 0.6 to 19400 ppm.

[0014] Additionally, or alternatively, in some applications of the present method, the use of a powder or powder mixture having an appropriate hydrogen (%H) content may be advantageous. In one embodiment, the powder or powder mixture supplied has an appropriate %H content. The feature of "appropriate %H content" is defined throughout this document in the form of different options, which will be described in detail below. In different embodiments, the appropriate %H content is a hydrogen content of 0.01 ppm or more, 0.1 ppm or more, 2 ppm or more, 16 ppm or more, 110 ppm or more, 310 ppm or more, and even 510 ppm or more. On the other hand, if the hydrogen content is excessive, it may be harmful depending on the application. In different embodiments, the appropriate %H content is a hydrogen content of 8400 ppm or less, 790 ppm or less, 390 ppm or less, 9 ppm or less, and even 4 ppm or less. In another embodiment, at least one of the powders of the mixture contains an appropriate %H content (as defined in this document). All the embodiments disclosed above are combinable with each other and with any other embodiment disclosed in this document related to "appropriate %H content", provided that they are not mutually exclusive. All the values and ranges of the different embodiments disclosed above are combinable with each other and with any other embodiment disclosed in this document, provided that they are not mutually exclusive. For example, in one embodiment, the powder or powder mixture supplied contains an appropriate %H content, and the appropriate %H content is a hydrogen content of 0.01 to 8400 ppm. Also, for example, in another embodiment, it is 0.1 to 4900 ppm. Also, for example, in another embodiment, it is 2 to 1900 ppm.

[0015] Additionally, or alternatively, in some applications of the present method, it may be advantageous to use a powder or powder mixture having an appropriate boron (%B) content. In one embodiment, the powder or powder mixture supplied has an appropriate %B content. In another embodiment, at least one of the powders of the mixture has an appropriate %B content. The feature of "appropriate %B content" is defined throughout this document in the form of different alternatives, which will be described in detail below. In different embodiments, the appropriate %B content is a boron content of 0.01 ppm or more, 0.2 ppm or more, 6 ppm or more, 21 ppm or more, 61 ppm or more, 160 ppm or more, 660 ppm or more, 1600 ppm or more, and even 3600 ppm or more. On the other hand, if the boron content is excessive, it may be harmful depending on the application. In different embodiments, the appropriate %B content is a boron content of 0.9 wt% or less, 0.39 wt% or less, 44000 ppm or less, 24000 ppm or less, 14000 ppm or less, 7900 ppm or less, 3400 ppm or less, 490 ppm or less, and even 89 ppm or less. In another embodiment, at least one of the powders of the mixture contains an appropriate %B content (as defined in this document). All of the embodiments disclosed above are combinable with each other and with any other embodiment disclosed in this document related to "appropriate %B content", provided that they are not mutually exclusive. All of the values and ranges of the different embodiments disclosed above are combinable with each other and with any other embodiment disclosed in this document, provided that they are not mutually exclusive. For example, in one embodiment, the powder or powder mixture supplied contains an appropriate %B content, and the appropriate %B content is a boron content of 0.01 - 44000 ppm. Also, for example, in another embodiment, it is 0.2 - 24000 ppm, and in another embodiment, it is 6 - 7900 ppm. All of the embodiments disclosed above are combinable with each other and with any other embodiment disclosed in this document, provided that they are not mutually exclusive.

[0016] Additionally, or alternatively, in certain applications, such as those requiring improved hardness and strength, enhanced wear and corrosion resistance, and grain refinement, it may be advantageous to mix a nitrogen-containing material into a powder or powder mixture. In one embodiment, the amount of the nitrogen-containing material is selected in terms of the total weight percentage of nitrogen in the manufactured component. In an alternative embodiment, the amount of the nitrogen-containing material is selected in terms of the total weight percentage of nitrogen in at least one of the materials constituting the manufactured component. In another alternative embodiment, the amount of the nitrogen-containing material is selected in terms of the total weight percentage of nitrogen in the material after mixing. In another embodiment, the amount of the nitrogen-containing material is selected such that it contains nitrogen at 0.02 wt% or more, 0.12 wt% or more, 0.22 wt% or more, 0.41 wt% or more, 0.52 wt% or more, 0.76 wt% or more, 1.1 wt% or more, and even 2.1 wt% or more. In certain applications, overly high levels should be avoided. In different embodiments, the amount of the nitrogen-containing material is selected such that it contains nitrogen at 3.9 wt% or less, 2.9 wt% or less, 1.9 wt% or less, 1.4 wt% or less, 0.9 wt% or less, 0.69 wt% or less, and even 0.49 wt% or less. On the other hand, depending on the application, the use of higher levels of nitrogen may be desirable. In different embodiments, a higher nitrogen content means a content that is at least 10% or more, at least 15% or more, at least 20% or more, at least 50% or more, and even 200% or more higher than the amounts indicated above. In one embodiment, the nitrogen-containing material is a nitride and / or a mixture of nitrides. Depending on the application, the use of carbonitrides, chromium nitrides, iron nitrides, molybdenum nitrides, tungsten nitrides, vanadium nitrides, niobium nitrides, tantalum nitrides, titanium nitrides, and / or mixtures thereof may be particularly advantageous, for example, when wear resistance is a decisive performance factor. By incorporating nitrogen, hard nitride-type precipitates can be formed within the microstructure, which act as a barrier against wear mechanisms such as abrasive wear and adhesive wear. In very special applications, processing in this way can result in an unexpectedly high combination of strength and ductility. In one embodiment, the nitrogen-containing material is a carbonitride. In one embodiment, the nitrogen-containing material includes boron oxynitride carbide.In one embodiment, the nitrogen-containing material includes carbonitride. In one embodiment, the nitrogen-containing material includes boron carbon oxynitride in which carbon, boron, and / or oxygen may be deficient. In one embodiment, the nitrogen-containing material consists of boron carbon oxynitride in which carbon, boron, and / or oxygen may be deficient, and this is stable under standard conditions. In one embodiment, the nitrogen-containing material includes boron carbon oxynitride in which carbon, boron, and / or oxygen may be deficient and is stable at 800 °C under standard pressure in an argon atmosphere with an oxygen concentration of 0.5 ppm. In one embodiment, the nitrogen-containing material includes boron carbon oxynitride in which carbon, boron, and / or oxygen may be deficient and is stable at 900 °C under standard pressure in an argon atmosphere with 0.5 ppm of oxygen. In one embodiment, the nitrogen-containing material includes boron carbon oxynitride in which carbon, boron, and / or oxygen may be deficient and is stable at 1000 °C under standard pressure in an argon atmosphere with 0.5 ppm of oxygen. In one embodiment, the nitrogen-containing material includes boron carbon oxynitride in which carbon, boron, and / or oxygen may be deficient and is stable at 1100 °C under standard pressure in an argon atmosphere with 0.5 ppm of oxygen. In one embodiment, the nitrogen-containing material includes boron carbon oxynitride in which carbon, boron, and / or oxygen may be deficient and further includes %Cr. In one embodiment, the nitrogen-containing material includes chromium nitride that is stable under standard conditions. In one embodiment, the nitrogen-containing material includes chromium nitride that is stable at 800 °C under standard pressure in an argon atmosphere with 0.5 ppm of oxygen. In one embodiment, the nitrogen-containing material includes chromium nitride that is stable at 900 °C under standard pressure in an argon atmosphere with 0.5 ppm of oxygen. In one embodiment, the nitrogen-containing material includes chromium nitride that is stable at 1000 °C under standard pressure in an argon atmosphere with 0.5 ppm of oxygen. In one embodiment, the nitrogen-containing material includes chromium nitride that is stable at 1100 °C under standard pressure in an argon atmosphere with 0.5 ppm of oxygen. In one embodiment, the nitrogen-containing material includes an appropriate chromium nitride content. In another embodiment, the appropriate chromium nitride content is a chromium nitride content of 0.094 wt% or more, 0.94 wt% or more, 1.4 wt% or more, 1.9 wt% or more, 2.9 wt% or more, 4.3 wt% or more, and further 5.6% or more.For certain applications, an excessive chromium nitride content may be harmful. In different embodiments, a suitable chromium nitride content is a chromium nitride content of 18.3 wt% or less, 13.6 wt% or less, 8.9 wt% or less, 6.6 wt% or less, and even 4.2 wt% or less. In one embodiment, the nitrogen-containing material includes boron carbon oxynitride which may lack carbon, boron, and / or oxygen, and further includes %Fe. In one embodiment, the nitrogen-containing material includes iron nitride that is stable under standard conditions. In one embodiment, the nitrogen-containing material includes boron carbon oxynitride which may lack carbon, boron, and / or oxygen, and further includes %Mo. In one embodiment, the nitrogen-containing material consists of molybdenum nitride that is stable under standard conditions. In one embodiment, the nitrogen-containing material includes boron carbon oxynitride which may lack carbon, boron, and / or oxygen, and further includes %W. In one embodiment, the nitrogen-containing material includes tungsten nitride that is stable under standard conditions. In one embodiment, the nitrogen-containing material includes boron carbon oxynitride which may lack carbon, boron, and / or oxygen, and further includes %V. In one embodiment, the nitrogen-containing material includes vanadium nitride that is stable under standard conditions. In one embodiment, the nitrogen-containing material includes boron carbon oxynitride which may lack carbon, boron, and / or oxygen, and further includes %Nb. In one embodiment, the nitrogen-containing material includes niobium nitride that is stable under standard conditions. In one embodiment, the nitrogen-containing material includes boron carbon oxynitride which may lack carbon, boron, and / or oxygen, and further includes %Ti. In one embodiment, the nitrogen-containing material includes titanium nitride that is stable under standard conditions. All the embodiments disclosed above, provided that they are not mutually exclusive, can be combined arbitrarily among themselves and with any other embodiment disclosed in this document.

[0017] In the manufacture of certain components, certain properties of the powder material may be important. In this regard, the inventors have found that the use of powders or powder mixtures of appropriate size is particularly advantageous for the achievable component density, surface roughness, and / or dimensional accuracy in the manufacture of certain components. The use of powders or powder mixtures of appropriate size may also be advantageous in reducing or minimizing the occurrence of internal structural defects. In one embodiment, the powder material is a powder or powder mixture of appropriate size. In another embodiment, the powder material is a powder of appropriate size. In another embodiment, the powder material includes at least one powder of appropriate size. In another alternative embodiment, the powder material has an appropriate size. In different embodiments, an appropriate size means 0.8 microns or more, 2.1 microns or more, 26 microns or more, 56 microns or more, 106 microns or more, and even 156 microns or more. For certain applications, larger powders may be preferred. In different embodiments, an appropriate size means 210 microns or more, 410 microns or more, 610 microns or more, 810 microns or more, and even 1100 microns or more. On the other hand, the use of powders with overly large particle sizes may have an adverse effect on the manufacture of certain components. In different embodiments, an appropriate size means 9900 microns or less, 1990 microns or less, 1390 microns or less, 940 microns or less, 440 microns or less, and even 240 microns or less. For the manufacture of certain components, smaller particles may be preferred. In different embodiments, an appropriate size means 180 microns or less, 80 microns or less, 40 microns or less, 24 microns or less, 9 microns or less, and even 0.6 microns or less. Depending on the application, even smaller powders may be preferred. In different embodiments, an appropriate size means 890 nanometers or less, 640 nanometers or less, 490 nanometers or less, 390 nanometers or less, and even 340 nanometers or less. On the other hand, in some applications of the method, particles that are too small should be avoided.In different embodiments, an appropriate size means 0.01 nanometers or more, 0.1 nanometers or more, 6 nanometers or more, 21 nanometers or more, 61 nanometers or more, and further 151 nanometers or more. The feature of "size" of the particulate material is defined throughout this document in different alternative forms, which will be described in detail below. In one embodiment, the size refers to D50. In an alternative embodiment, the size refers to D10. In another alternative embodiment, the size refers to D90. In another alternative embodiment, the size refers to the moment ratio diameter D[3,2]. In another alternative embodiment, the size refers to the moment ratio diameter D[4,3]. In another alternative embodiment, the size refers to the smallest mesh through which only 10% of the material is retained. In another alternative embodiment, the size refers to the smallest mesh through which 50% of the material can pass. In another alternative embodiment, the size refers to the average size. In another alternative embodiment, the size refers to the size of the smallest powder. In another alternative embodiment, the size refers to the size of the largest powder. Throughout this document, unless otherwise specified, the average value refers to the arithmetic mean. All of the embodiments disclosed above, unless mutually exclusive, are combinable with each other and with any other embodiment disclosed in this document related to the "size of the particulate material" in any combination. The feature of "D50" is defined throughout this document in different alternative forms, which will be described in detail below. In one embodiment, D50 refers to the particle size in the cumulative distribution of particle sizes, in which 50% of the volume of the sample is composed of particles smaller than that size. In an alternative embodiment, D50 refers to the particle size in the cumulative distribution of particle sizes, in which 50% of the mass of the sample is composed of particles smaller than that size. All of the embodiments disclosed above, unless mutually exclusive, are combinable with each other and with any other embodiment disclosed in this document related to "D50" in any combination. The feature of "D10" is defined throughout this document in different alternative forms, which will be described in detail below. In one embodiment, D10 refers to the particle size in the cumulative distribution of particle sizes, in which 10% of the volume of the sample is composed of particles smaller than that size. In an alternative embodiment, D10 refers to the particle size in the cumulative distribution of particle sizes, in which 10% of the mass of the sample is composed of particles smaller than that size.All of the embodiments disclosed above, unless mutually exclusive, can be combined arbitrarily among themselves and with any other embodiment disclosed in this document related to "D10". The feature "D90" is defined throughout this document in different alternative forms, which will be described in detail below. In one embodiment, D90 refers to the particle size in the cumulative particle size distribution where 90% of the volume of the sample is composed of particles smaller than that size. In an alternative embodiment, D90 refers to the particle size in the cumulative particle size distribution where 90% of the mass of the sample is composed of particles smaller than that size. All of the embodiments disclosed above, unless mutually exclusive, can be combined arbitrarily among themselves and with any other embodiment disclosed in this document related to "D90". In one embodiment, the particle size values disclosed above are measured by the laser diffraction method. The feature "D[3,2]" is defined throughout this document as the surface weighted average diameter, also called the Sauter mean particle diameter, and is represented as the diameter of a sphere having the same volume / surface area ratio as the target particles. The feature "D[4,3]" is defined throughout this document as the volume weighted average diameter, also called the de Brouckere mean diameter, and is represented as the average of the particle size distribution weighted by volume. In one embodiment, the particle size values disclosed above are measured by the laser diffraction method in accordance with ISO 13320-2020. In an alternative embodiment, the particle size is measured by the dynamic light scattering method in accordance with ISO 22412:2017. In another alternative embodiment, the particle size is measured by the dynamic light scattering method (DLS). In another alternative embodiment, the particle size is measured by the dynamic image analysis method (DIA). In another alternative embodiment, the size is measured by sieving. In one embodiment, the moment ratio diameters D[3,2] and D[4,3] are calculated in accordance with ISO 9276-2:2014. All of the values and ranges of the different embodiments disclosed above can be combined arbitrarily among themselves and with any other embodiment disclosed in this document, provided that they are not mutually exclusive. For example, in one embodiment, the D50 of the supplied powder or powder mixture has an appropriate size, and the appropriate size is from 0.01 nanometers to 9990 microns. Also, for example, in another embodiment, it is from 0.8 to 1990 microns.Also, for example, in another embodiment, it is 210 to 1990 microns, and D50 is the particle size at which 50% of the sample volume is composed of particles smaller in the cumulative distribution of particle sizes measured by the laser diffraction method. Depending on the application, it may be particularly advantageous to use a mixed powder composed of at least two types of powders with different particle sizes. Additionally, or alternatively, the shape of the powder may be important in the manufacture of some components. In this regard, the inventors have discovered that in some applications of this method, components with surprisingly high dimensional accuracy can be manufactured at low cost from irregular powders or mixed powders composed of at least one irregular powder. In one embodiment, the powder material is an irregular powder or a powder mixture. In another embodiment, the powder material includes at least one irregular powder. The term "irregular powder" is defined throughout this document in the form of different options that will be described in detail below. In one embodiment, the irregular powder refers to a powder with a sphericity of 0.79 or less. In an alternative embodiment, the irregular powder refers to a powder with a sphericity of 0.74 or less. In another alternative embodiment, the irregular powder refers to a powder with a sphericity of 0.69 or less. In another alternative embodiment, the irregular powder refers to a powder with a sphericity of 0.59 or less. In another alternative embodiment, the irregular powder refers to a powder with a sphericity of 0.44 or less. All of the embodiments disclosed above, unless mutually exclusive, can be combined arbitrarily among themselves and with any other embodiment disclosed in this document related to "irregular powder". On the other hand, the inventors have also discovered that depending on the application, the use of spherical powders or a powder mixture composed of at least one spherical powder may be particularly useful for the tolerances of some manufacturing components. In one embodiment, the powder material is a spherical powder or a powder mixture. In another embodiment, the powder material includes at least one spherical powder. The feature of "spherical powder" is defined throughout this document in the form of different options that will be described in detail below. In one embodiment, the spherical powder refers to a powder with a sphericity of 0.66 or more. In an alternative embodiment, the spherical powder refers to a powder with a sphericity of 0.81 or more. In another embodiment, the spherical powder refers to a powder with a sphericity of 0.86 or more. In another embodiment, the spherical powder refers to a powder with a sphericity of 0.96 or more. In another embodiment, the spherical powder refers to a powder with a sphericity of 1.All of the embodiments disclosed above, unless mutually exclusive, may be combined with each other and with any other embodiments disclosed in this book related to "spherical powder". Depending on the application, it may be advantageous to ensure that spherical particles are present in the supplied powder or powder mixture. In different embodiments, the proportion of spherical particles is 21% or more, 36% or more, 51% or more, 81% or more, 91% or more, and even 98% or more. On the other hand, if the proportion of spherical particles is excessive, it may be disadvantageous for the production of certain components. In different embodiments, the proportion of spherical particles is 89% or less, 74% or less, 59% or less, and even 44% or less. The characteristic of "sphericity" of the powder is defined throughout this book in the form of different options described in detail below. In one embodiment, sphericity refers to a dimensionless parameter defined as the ratio of the surface area of a sphere having the same volume as the particle to the surface area of the particle. In an alternative embodiment, the sphericity (ψ) is calculated using the following formula: Ψ = [π. 1 / 3 *(6*Vp) 2 / 3 / Ap. In this formula, π generally refers to the mathematical constant defined as the ratio of a circle's circumference to its diameter, Vp is the volume of the particle, and Ap is the surface area of the particle. In one embodiment, sphericity is measured by light scattering diffraction. In an alternative embodiment, sphericity is measured by dynamic image analysis (DIA). In another alternative embodiment, sphericity is measured using static image analysis by microscopy and image processing. In one embodiment, the diameter of a quasi-sphere refers to the equivalent diameter. All the embodiments disclosed above can be combined arbitrarily among themselves and with any other embodiment disclosed in this book related to "spherical", as long as they are not mutually exclusive. The feature of "equivalent diameter" is defined throughout this book in different alternative forms, which will be described in detail below. In one embodiment, the equivalent diameter is the diameter of a circle with an equivalent area. In an alternative embodiment, the equivalent diameter is the diameter of a sphere with an equivalent area. In another alternative embodiment, the equivalent diameter is the diameter of a circle having the same area as the projection of the particle. In another alternative embodiment, the equivalent diameter is the diameter of a sphere with an equivalent volume. In another alternative embodiment, the equivalent diameter is the diameter of a sphere having the same sedimentation rate as the particle under the conditions of Stokes' law. In another alternative embodiment, the equivalent diameter is the diameter of a sphere with an equivalent area / volume ratio. In another alternative embodiment, the equivalent diameter is the diameter of a cylinder with an equivalent volume. All the embodiments disclosed above can be combined arbitrarily among themselves and with any other embodiment disclosed in this book related to "equivalent diameter", as long as they are not mutually exclusive. Examples of techniques that can be used to obtain powders include, but are not limited to, atomization (e.g., centrifugal atomization, water atomization, gas atomization, etc.), droplet atomization (e.g., ultrasonic, piezoelectric, plasma gun, etc.), redox, mechanical action, grinding, milling, crushing, abrasion, milling (e.g., ball milling, etc.), energy crushing, and / or combinations thereof. In one embodiment, the powder material is at least one powder obtained by atomization The body is included. In another embodiment, the powder material includes at least one powder obtained by water atomization. In another embodiment, the powder material includes at least one powder obtained by gas atomization. In another embodiment, the powder material includes at least one powder obtained by droplet atomization. In another embodiment, the powder material includes at least one powder obtained by redox. In another embodiment, the powder material includes at least one powder obtained by mechanical action. In another embodiment, the powder material includes at least one powder mechanically pulverized. In another embodiment, the powder material includes at least one powder obtained by grinding. In another embodiment, the powder material includes at least one powder obtained by a ball mill. In another embodiment, the powder material includes at least one powder obtained by kinetic energy crushing. In another embodiment, the powder material includes at least one powder obtained by controlled grinding. In another embodiment, the powder material includes at least one powder obtained by pulverization. In another embodiment, the powder material includes at least one powder rounded by plasma treatment. Alternatively, in some applications of the method, the content disclosed above for at least one powder can be extended in different embodiments to at least two powders, at least four powders, at least six powders, and even to all powders of the powder material. All the embodiments disclosed above can be combined arbitrarily among themselves and with any other embodiment disclosed in this document, unless they are mutually exclusive.

[0018] According to the method of the present aspect of the disclosure, the supplied powder or powder mixture may be processed prior to the shaping step. In one embodiment, the method includes an energy addition step to the powder or powder mixture by mechanical action. Surprisingly, the inventors have found that by combining this treatment with the metal additive manufacturing (MAM) method and the consolidation treatment disclosed in this document, very often, amazing microstructures with excellent properties that can be utilized for various applications can be obtained. Also, part of the method developed for the treatment of the powder or powder mixture disclosed in this document is very interesting for other particulate materials and may also be used in other applications and / or manufacturing methods, and the inventors have also discovered that it can itself be an invention. The treatment of particulate materials such as powder or powder mixture is disclosed, and the treatment includes the application of energy to the powder or powder mixture by mechanical action (also referred to as "treatment of powder or powder mixture" or "treatment").

[0019] Next, the supplied powder or powder mixture can be introduced into a container containing a processing material such that the powder or powder mixture to be processed (also referred to as the "material to be processed") is at least partially in direct contact with the container and / or the processing material. In one embodiment, the treatment including the application of energy via mechanical action to the powder or powder mixture is performed within a container containing the processing material. The treatment includes the introduction of the material to be processed into the container containing the processing material and the application of motion (e.g., rotational motion, vibrational motion,... applicable to the processing material, the material to be processed, and / or the container) such that at least a portion of the impact energy is effectively transmitted to at least a portion of the particles of the material to be processed. In one embodiment, the treatment of the powder or powder mixture includes the introduction of the powder or powder mixture into a container containing the processing material and the application of rotational motion and / or vibration. Thereby, collisions can occur, among other things, between at least a portion of the material to be processed, the processing material, and / or the container. In one embodiment, the treatment of the powder or powder mixture includes the introduction of energy into the powder by collisions between the material to be processed, the processing material, and / or the container. This treatment can cause, inter alia, structural changes, physical changes, chemical reactions, and / or phase transitions, including but not limited to mixing of at least a portion of the particles of the powder or powder mixture, interparticle diffusion, welding, cold welding, crushing, and / or rewelding. In one embodiment, the treatment of the powder or powder mixture is applied such that welding of at least a portion of the particles occurs. In another embodiment, the treatment of the powder or powder mixture consists of interparticle diffusion. In another embodiment, the treatment of the powder or powder mixture consists of interparticle diffusion and / or welding. In this regard, the inventors have discovered that in some applications of this method, it can be particularly important to ensure that the manufactured component contains a specific number of atoms from the material being treated. In different embodiments, the manufactured component contains at least 16%, at least 26%, at least 46%, and even at least 66% of the atoms of the powder or powder mixture being treated. All of the embodiments disclosed above can be combined in any combination with each other and with any other embodiment disclosed in this document, provided they are not mutually exclusive.For example, in one embodiment, a component made of metal comprises at least 16% of the atoms of the powder to be processed or the powder mixture. In alternative embodiments, and for special applications, the inventors have also discovered that this solid-state processing is particularly suitable for, among other things, high melting point materials, materials that are prone to chemical reactions or segregation in the liquid state, and / or alloys that are not easily obtained by conventional methods.

[0020] Processes involving the introduction of energy by mechanical action on the powder or powder mixture can be advantageously carried out in different types of containers (e.g., containers, vials, bottles, bowls, mills, attritors, etc.). In this regard, containers with different geometries can be used. As non-limiting examples, the geometry of the container can be selected from cylindrical, spherical, and / or conical. In some embodiments, it is also possible to use containers having other geometries including, but not limited to, polygonal, cubic, cuboid, pyramidal, pentagonal, hexagonal, octahedral, and / or ellipsoidal. Depending on the process, the internal shape of the container may be important, such as to optimize the energy incorporated into the powder or powder mixture. As an example of the types of internal shapes that can be used, but not particularly limited thereto, are flat-end type, round-end type, and concave-end type. Regarding the constituent materials, the above-mentioned containers can be manufactured from a variety of materials including, but not limited to, composite materials, metallic materials (e.g., steel, stainless steel, tempered steel, etc.), metal-based composite materials (e.g., hard metals, tungsten carbide, etc.), ceramic materials (e.g., silicon nitride (Si3N4), zirconium oxide (Zr02), corundum, gemstone, etc.), ceramic-based composite materials, organic materials (e.g., polymer materials, polymer-based composite materials, etc.), and / or mixtures thereof. In one embodiment, the container is made of a material consisting of a metal or a metal alloy. In another embodiment, the container is made of a material consisting of a ceramic material. In another embodiment, the container is made of a material consisting of an organic material. In another embodiment, the container is made of a material consisting of a composite material. However, the shape and / or composition of the container are not limited to the above-mentioned shapes and / or compositions.

[0021] Depending on the process, the rotational speed of the container is particularly important and can be particularly advantageous for applications where diffusion is required to promote homogenization and / or alloying with a powder or powder mixture. In this regard, the inventors have found that the selection of an appropriate speed particularly improves processability and, in some processes, can even shorten the manufacturing time. In different embodiments, the speed is 46 rpm or more, 81 rpm or more, 106 rpm or more, 160 rpm or more, 310 rpm or more, 460 rpm or more, and even 610 rpm or more. On the other hand, depending on the process, excessive speed can be disadvantageous. Increasing the value of the maximum speed may cause an increase in temperature that accelerates the transformation process, or decomposition of the supersaturated solid solution or other metastable phases formed during the process. In addition, the high temperature generated may also contaminate the powder. In different embodiments, the speed is 11900 rpm or less, 1490 rpm or less, 990 rpm or less, 790 rpm or less, 690 rpm or less, 340 rpm or less, and even 240 rpm or less. All values and ranges of the different embodiments disclosed above are combinable with each other and with any other embodiment disclosed in this document, unless they are mutually exclusive. For example, in one embodiment, the rotational speed of the container is 46 to 11900 rpm. Also, for example, in another embodiment, it is 46 to 1490 rpm. Also, for example, in another embodiment, it is 81 to 1490 rpm.

[0022] Depending on the process, the number of rotations of the particles of the powder or powder mixture per rotation of the container is defined as the circulation rate, which may be an important parameter for process control. In different embodiments, the circulation rate is 0.1 or more, 0.6 or more, 1.1 or more, 2.1 or more, 6 or more, and even 11 or more. On the other hand, an excessive circulation rate can be disadvantageous for some processes. In different embodiments, the circulation rate is 290 or less, 90 or less, 29 or less, 19 or less, and even 9 or less. All values and ranges of the different embodiments disclosed above are combinable with each other and with any other embodiment disclosed herein, unless they are mutually exclusive. For example, in one embodiment, the circulation rate is from 0.1 to 290. Also, for example, in another embodiment, it is from 0.1 to 90. Also, for example, in another embodiment, it is from 0.6 to 90.

[0023] Depending on the process, the speed of the processing material may be particularly important. In this regard, the inventors have found that an appropriate selection of the speed can particularly affect the average dislocation density in some processes. In different embodiments, the speed of the processing material is 0.001 m / s or more, 0.01 m / s or more, 0.1 m / s or more, 0.16 m / s or more, 0.51 m / s or more, 3.1 m / s or more, 5.1 m / s or more, and even 21 m / s or more. On the other hand, excessive speed can be disadvantageous for some processes. In different embodiments, the speed of the processing material is 290 m / s or less, 89 m / s or less, 49 m / s or less, 19 m / s or less, 9 m / s or less, and even 2.9 m / s or less. All of the values and ranges of the different embodiments disclosed above can be combined arbitrarily among themselves and with any of the other embodiments disclosed in this document, unless they are mutually exclusive. For example, in one embodiment, the speed of the processing material is 0.001 to 49 m / s. Also for example, in another embodiment, it is 0.01 to 49 m / s. Also for example, in another embodiment, it is 0.1 to 19 m / s. The speed of the processing material values disclosed above can be calculated using, for example, any of the different alternatives detailed below. In one embodiment, the speed of the processing material is calculated as described in Lai MO, Lu L. Mechanical alloying. Boston MA: Kluwer Academic. In an alternative embodiment, the speed of the processing material is calculated as described in Abdellaouni M, Gaffet E. Acta Mater 1996, 44:725-34. In another alternative embodiment, the speed of the processing material is calculated as described in Mrty BS. Ranganathan S. Internat. Mater Rev 1998, 43:101-41. The average impact frequency, which defines the average number of impacts of each element of the processing material (e.g., balls, barrels, rods, cylinders, shilpebs, beads, satellites, pellets, etc.), can also be important for a particular process. In different embodiments, the average impact frequency is 0.01 Hz or more, 0.1 Hz or more, 6 Hz or more, 51 Hz or more, 301 Hz or more, 1100 Hz or more, and even 3100 Hz or more.On the one hand, if the impact frequency is excessive, it can be disadvantageous for certain processes. In different embodiments, the average impact frequency is 39000 Hz or less, 19000 Hz or less, 9000 Hz or less, 900 Hz or less, 490 Hz or less, 190 Hz or less, and even 90 Hz or less. The values of the average impact frequency disclosed above can be calculated using any of the different alternatives detailed below, for example. In one embodiment, the average impact frequency is calculated as described in Lai MO, Lu L. Mechanical alloying. Boston MA: Kluwer Academic. In an alternative embodiment, the average impact frequency is calculated as described in Abdellaouni M, Gaffet E. Acta Mater 1996, 44:725-34. In another alternative embodiment, the average impact frequency is calculated as described in Mrty BS. Ranganathan S. Internat. Mater Rev 1998, 43:101-41. All values and ranges of the different embodiments disclosed above are combinable with each other and with any other embodiment disclosed in this document, provided they are not mutually exclusive. For example, in one embodiment, the average impact frequency is 0.01 to 39000 Hz. Also, for example, in another embodiment, it is 0.1 to 19000 Hz. Also, for example, in another embodiment, it is 0.1 to 9000 Hz. Also, for example, in another embodiment, it is 6 to 900 Hz. As described above, when performing a specific process, the speed of the processing material and / or the average impact frequency may be important parameters. In this regard, the inventors have discovered that, depending on the application, a particularly appropriate selection of the speed of the processing material and the average impact frequency can result in, among other things, a surprising sphericity ratio of the particles and an appropriate level of the PAD1 parameter. All values and ranges of the different embodiments disclosed above are combinable with each other and with any other embodiment disclosed in this document, provided they are not mutually exclusive. For example, in one embodiment, the speed of the processing material is 0.001 to 290 m / s and the average impact frequency is 0.01 to 39000 Hz.For example, in another embodiment, the speed of the processing material is 0.01 to 49 m / s, and the average impact frequency is 0.1 to 19000 Hz.

[0024] The inventors have discovered that, depending on the process, by appropriately selecting the processing material, the energy incorporated into the powder can be surprisingly increased without disproportionately increasing the processing cost. The processing material composed of various shaped elements includes, but is not limited to, balls, barrels, rods, cylinders, shilpebs, beads, satellites, pellets, and / or combinations thereof. In one embodiment, the processing material includes milling elements. In another embodiment, the processing material consists of balls. In another embodiment, the processing material includes beads. In another embodiment, the processing material includes satellites. In another embodiment, the processing material includes rods. In another embodiment, the processing material includes barrels. In another embodiment, the processing material includes pellets. However, the processing material is not limited to the above-described shapes. Depending on the process, the composition of the processing material can be very important for processing performance. Examples of materials that can be used for manufacturing the processing material include metal materials (e.g., metal-based alloys, steel, carbon steel, stainless steel, chromium steel, quenched and tempered steel, etc.), metal-based composite materials (e.g., hard metal, tungsten carbide, etc.), ceramic materials (e.g., alumina (Al2O3), silicon nitride (Si3N4), zirconium oxide (ZrO2), burn dam TM , steatite, quartz, fused zirconium silicate, corundum, sintered corundum, etc.), ceramic-based composite materials, glass, organic materials (such as nylon), polymer-based composite materials, and / or combinations thereof. The different embodiments disclosed above can be combined arbitrarily among themselves and with any other embodiment disclosed in this document, unless they are mutually exclusive. For example, in one embodiment, at least a part of the processing material is composed of ceramic and / or metal balls, cylinders, shilpebs, rods, and / or combinations thereof.

[0025] Surprisingly, the inventors have found that depending on the process, the size of the processing material can have a significant impact on the processing performance. In particular, from the perspective of the energy incorporated into the powder or powder mixture. As described above, depending on the process, a processing material having spherical or quasi-spherical shaped elements (e.g., balls, beads, satellites, etc.) can be beneficial. In one embodiment, the processing material or at least a portion of the processing material is spherical. The feature of "spherical" is defined throughout this document in different alternative forms, which will be described in detail below. In one embodiment, spherical means having a sphericity of 0.66 or more. In an alternative embodiment, spherical means having a sphericity of 0.81 or more. In another alternative embodiment, spherical means having a sphericity of 0.86 or more. In another alternative embodiment, spherical means having a sphericity of 0.96 or more. In another alternative embodiment, spherical means having a sphericity of 1. Depending on the process, the diameter of the spherical processing material can be particularly important for the processing efficiency. In different embodiments, the diameter of the processing material is 1.2 mm or more, 3.1 mm or more, 5.1 mm or more, 6.6 mm or more, 7.6 mm or more, 8.1 mm or more, 10.1 mm or more, and even 31 mm or more. On the other hand, large processing materials can be particularly harmful to some processing efficiencies. In different embodiments, the diameter of the processing material is 89 mm or less, 29 mm or less, 14 mm or less, 9 mm or less, and even 3.9 mm or less. All values and ranges of the different embodiments disclosed above are combinable with each other and with any other embodiment disclosed in this document, unless they are mutually exclusive. For example, in one embodiment, the processing material is spherical with an average diameter of 1.2 mm to 89 mm. Also, for example, in another embodiment, it is 1.2 mm to 29 mm. Also, for example, in another embodiment, it is 3.1 mm to 29 mm, etc. The feature of "the diameter of the processing material" is defined throughout this document in different alternative forms, which will be described in detail below. In one embodiment, the diameter of the processing material refers to the average diameter. In an alternative embodiment, the diameter of the processing material refers to the equivalent diameter of the processing material. In another alternative embodiment, the diameter of the processing material refers to the diameter of the processing material having the maximum diameter. In another alternative embodiment, the diameter of the processing material refers to the diameter of the processing material having the minimum diameter.All values and ranges of the different embodiments disclosed above, unless mutually exclusive, can be combined with each other and with any other embodiment disclosed in this document related to the "diameter of the processing material". For example, in one embodiment, at least a part of the processing material is spherical with a sphericity of 0.66 or more, a diameter of 1.2 mm to 89 mm, and a rotational speed of the container of 46 to 11,900 rpm. Depending on the process, it may be advantageous to use a processing material having a cylindrical element (e.g., rod, cylinder, silpeb, pellet, etc.). In one embodiment, the processing material or at least a part of the processing material is cylindrical. Depending on the process, the length and / or diameter of the cylindrical processing material can be particularly important for processing efficiency. In different embodiments, the length and / or diameter of the processing material is 149 mm or less, 119 mm or less, 99 mm or less, 89 mm or less, 74 mm or less, 49 mm or less, and further 34 mm or less. On the other hand, a processing material that is too small may reduce some processing efficiency. In different embodiments, the length and / or diameter of the processing material is 0.1 mm or more, 6.1 mm or more, 12.1 mm or more, 16.1 mm or more, 21 mm or more, 56 mm or more, and further 66 mm or more. The feature of "length of the processing material" is defined throughout this document in the form of different alternatives described in detail below. In one embodiment, the length of the processing material refers to the average length. In an alternative embodiment, the length of the processing material refers to the length of the longest processing material. In another alternative embodiment, the length of the processing material refers to the length of the shortest processing material. All values and ranges of the different embodiments disclosed above, unless mutually exclusive, can be combined with each other and with any other embodiment disclosed in this document. For example, it is a process according to an embodiment in which the processing material has a cylindrical shape with an average diameter and / or length of 0.1 to 149 mm. Also for example, in another embodiment it is 0.1 to 119 mm. Also for example, in another embodiment it is 6.1 to 119 mm. In some embodiments, it may be advantageous to use processing materials made of materials of different sizes, shapes and / or compositions.

[0026] The inventors have found that, depending on the process, the ratio of the volume of the processing material to the volume of the container, i.e., the value obtained by dividing the volume occupied by the processing material by the volume of the container (all volumes are measured in m 3 ), can be important for the processing performance. In particular, it is important with respect to the time required to reach a specific stage in the powder or powder mixture during processing, and especially with respect to the quality of the powder to be processed. In different embodiments, the ratio of the volume of the processing material to the volume of the container is 1:190 or more, 1:51 or more, 1:21 or more, 1:16 or more, 1:9 or more, 1:6 or more, 1:2 or more, and even 1:1.5 or more. On the other hand, if the ratio is too large, it seems to be disadvantageous for some processes. In different embodiments, the ratio of the volume of the processing material to the volume of the container is 1:1.2 or less, 1:3 or less, 1:14 or less, 1:26 or less, and even 1:61 or less. All values and ranges of the different embodiments disclosed above can be combined arbitrarily among themselves and with any other embodiment disclosed in this document, unless they are mutually exclusive. For example, in one embodiment, the ratio of the volume of the processing material to the volume of the container is 1:190 to 1:61. Also, for example, in another embodiment, it is 1:51 to 1:161. Also, for example, in another embodiment, it is 1:51 to 1:26. Depending on the process, it may be important to determine the percentage of the volume of the container occupied by the processing material, which is calculated as follows. It is the value obtained by dividing the volume occupied by the processing material by the volume of the container and multiplying by 100, and all volumes are measured in m 3It is measured by. In different embodiments, the proportion of the volume of the container occupied by the processing material is 6% or more, 11% or more, 16% or more, 26% or more, 36% or more, 46% or more, and even 66% or more. On the other hand, if the occupancy rate is excessive, it may lead to a decrease in the energy taken in by the powder or powder mixture depending on the process. In different embodiments, the proportion of the volume of the container occupied by the processing material is 84% or less, 69% or less, 54% or less, 49% or less, 34% or less, and even 24% or less. All values and ranges of the different embodiments disclosed above are combinable with each other and with any other embodiment disclosed in this document, provided they are not mutually exclusive. For example, in one embodiment, the proportion of the volume of the container occupied by the processing material is 6% to 84%. Also for example, in another embodiment it is 6% to 69%. Also for example, in another embodiment it is 11% to 69%. Depending on the process, it may be more important to determine the proportion of the volume of the container occupied by the material to be processed, which is calculated as follows. It is the value obtained by dividing the volume occupied by the powder or powder mixture by the volume of the container and multiplying by 100, and all volumes are m 3It is measured by. In different embodiments, the proportion of the volume of the container occupied by the material to be processed is 3% or more, 8% or more, 12% or more, 21% or more, 31% or more, 41% or more, and even 56% or more. On the other hand, if the occupancy rate is excessive, it may lead to a decrease in the energy incorporated into the powder or powder mixture depending on the process. In different embodiments, the proportion of the volume of the container occupied by the material to be processed is 81% or less, 64% or less, 48% or less, 44% or less, 29% or less, and even 19% or less. All values and ranges of the different embodiments disclosed above are combinable with each other and with any other embodiment disclosed in this document, as long as they are not mutually exclusive. For example, in one embodiment, the proportion of the volume of the container occupied by the material to be processed is 3% - 81%. Also, for example, in another embodiment, it is 3% - 64%. Also, for example, in another embodiment, it is 8% - 64%. Depending on the process, the volume ratio of the processing material to the material to be processed may be important for the processing performance. This volume ratio is calculated as the value obtained by dividing the volume occupied by the powder or powder mixture by the volume occupied by the processing material, and all volumes are m 3 It is measured by. In different embodiments, the volume ratio of the processing material to the material to be processed is 0.29 or more, 0.41 or more, 0.56 or more, 0.81 or more, and even 1.1 or more. On the other hand, if the ratio is excessive, it may reduce the efficiency of some processes. In different embodiments, the volume ratio of the processing material to the material to be processed is 2.4 or less, 1.4 or less, 0.94 or less, 0.79 or less, 0.49 or less, and even 0.34 or less. All values and ranges of the different embodiments disclosed above are combinable with each other and with any other embodiment disclosed in this document, as long as they are not mutually exclusive. For example, in one embodiment, the volume ratio of the processing material to the material to be processed is 0.29 - 2.4. Also, for example, in another embodiment, it is 0.29 - 1.4. Also, for example, in another embodiment, it is 0.41 - 1.4.

[0027] The inventor has discovered that, depending on the process, the efficiency can be surprisingly improved by appropriately selecting the ratio of the volume occupied by the processing material and the material to be processed to the container. It is calculated as the value obtained by dividing the volume occupied by the processing material and the powder or powder mixture by the volume of the container and multiplying by 100. (All volumes are measured in m 3 ). In different embodiments, the ratio of the volume occupied by the processing material and the material to be processed to the container is 31% or more, 36% or more, 41% or more, 46% or more, 51% or more, 56% or more, and even 61% or more. On the other hand, if the ratio is excessive, it can be disadvantageous for some processes. In different embodiments, the ratio of the volume occupied by the processing material and the material to be processed to the container is 74% or less, 64% or less, 59% or less, 49% or less, and even 44% or less. All values and ranges of the different embodiments disclosed above can be combined arbitrarily among themselves and with any other embodiment disclosed in this document, unless they are mutually exclusive. For example, in one embodiment, the ratio of the volume occupied by the processing material and the material to be processed to the container is 31% - 74%. Also, for example, in another embodiment, it is 36% - 74%. Also, for example, in another embodiment, it is 41% - 64%.

[0028] Depending on the application, the weight of the processing material can be important for the processing performance, especially when controlling the number of collisions per unit time and thus the energy transmitted to the powder or powder mixture. In different embodiments, the weight of the processing material is 0.6 g or more, 3.1 g or more, 4.6 g or more, 16 g or more, 26 g or more, 36 g or more, 51 g or more, and even 76 g or more. On the other hand, the use of an excessive weight of the processing material may result in a disproportionate increase in processing costs depending on the process. In different embodiments, the weight of the processing material is 4900 g or less, 248 g or less, 179 g or less, 119 g or less, 89 g or less, 49 g or less, 39 g or less, 29 g or less, 14 g or less, and even 9 g or less. The feature of "the weight of the processing material" is defined throughout this document in the form of different alternatives that will be described in detail below. In one embodiment, the weight of the processing material refers to the weight of each element of the processing material (e.g., balls, cylinders, shilpebs, rods, beads, satellites, pellets, etc.) individually. In an alternative embodiment, the weight of the processing material refers to the average weight. In another alternative embodiment, the weight of the processing material refers to the weight of the processing material with the most weight. In another alternative embodiment, the weight of the processing material refers to the weight of the processing material with the least weight. All values and ranges of the different embodiments disclosed above are combinable with each other and with any other embodiment disclosed in this document, unless they are mutually exclusive. For example, in one embodiment, the average weight of the processing material is 0.6 to 4900 g. Also, for example, in another embodiment, the average weight of the processing material is 3.1 to 248 g. Also, for example, in another embodiment, the average weight of the processing material is 3.1 to 89 g. Also, for example, in another embodiment, the weight of each element of the processing material is individually 0.6 to 4900 g. Also, for example, in another embodiment, the weight of each element of the processing material is individually 3.1 to 248 g. Also, for example, in another embodiment, the weight of each element of the processing material is individually 3.1 to 89 g.

[0029] Depending on the process, the specific weight ratio of the processing material to the material being processed may be more important. The weight ratio is calculated as the value obtained by dividing the weight of the processing material by the weight of the powder or powder mixture, and all weights are in grams (g). In different embodiments, the weight ratio of the processing material to the material being processed is 7:1 or more, 11:1 or more, 14:1 or more, 16:1 or more, 21:1 or more, 41:1 or more, 61:1 or more, 101:1 or more, and even 201:1 or more. On the other hand, if the ratio is excessive, it may lead to a decrease in efficiency in some processes. In different embodiments, the weight ratio of the processing material to the material being processed is 490:1 or less, 340:1 or less, 190:1 or less, 99:1 or less, and even 49:1 or less. All values and ranges of the different embodiments disclosed above are combinable with each other and with any other embodiment disclosed herein, unless they are mutually exclusive. For example, in one embodiment, the weight ratio of the processing material to the material being processed is 7:1 to 490:1. Also, for example, in another embodiment, it is 7:1 to 340:1. Also, for example, in another embodiment, it is 11:1 to 340:1.

[0030] All the embodiments disclosed above are combinable with each other and with any other embodiment disclosed herein, unless they are mutually exclusive. For example, in one embodiment, the ratio of the volume of the container occupied by the processing material is the value obtained by dividing the volume occupied by the processing material by the volume of the container and multiplying by 100 (all volumes are measured in m 3 ), and is 6% to 84%. Here, the ratio of the volume occupied by the powder or powder mixture in the container is the value obtained by dividing the volume occupied by the powder or powder mixture by the volume of the container and multiplying by 100 (all volumes are measured in m 3 ), and is 3% to 81%. Here, the weight ratio of the processing material to the material being processed is the value obtained by dividing the weight of the processing material by the weight of the powder or powder mixture plus (all weights are in grams), and is 490:1 to 7:1.

[0031] Regarding the processing time, the inventors have found that, depending on the process, by appropriately selecting the processing time, the processing efficiency can be surprisingly improved without excessively increasing the cost. The required processing time varies depending on factors such as the rotation speed, the ratio of the material to be processed and the processing material, and the processing temperature. In different embodiments, the processing time is 1.2 minutes or more, 16 minutes or more, 1.2 hours or more, 11 hours or more, 36 hours or more, 61 hours or more, 121 hours or more, 210 hours or more, and even 610 hours or more. On the other hand, if the processing time is too long, the cost may increase disproportionately. In different embodiments, the processing time is 2590 hours or less, 980 hours or less, 440 hours or less, 140 hours or less, 90 hours or less, 47 hours or less, and even 29 hours or less. All values and ranges of the different embodiments disclosed above are combinable with each other and with any other embodiment disclosed herein, provided they are not mutually exclusive. For example, in one embodiment, the duration of the process is from 1.2 minutes to 2590 hours. Also for example, in another embodiment, it is from 16 minutes to 980 hours. Also for example, in another embodiment, it is from 1.2 minutes to 980 hours.

[0032] Depending on the process, the atmosphere inside the container is important, especially when the contamination of the material to be processed plays an important role. Various types of atmospheres can be advantageously used, such as a normal atmosphere (air), an inert atmosphere (helium, argon, etc.), a reactive atmosphere (reductive atmosphere, etc.), and / or a mixture thereof. In this regard, the inventors have discovered that the use of an appropriately designed atmosphere (as defined herein) may be particularly advantageous for the processing of certain particulate materials. In one embodiment, the atmosphere inside the container is an appropriately designed atmosphere (as defined herein). Depending on the process, it may be advantageous to use a specific vacuum during at least a part of the process, especially when reducing the presence or generation of an amorphous phase during processing. In different embodiments, the vacuum applied inside the container is 510 mbar or more, 106 mbar or more, 11 mbar or more, 0.96 mbar or more, 1.1*10 -2 mbar or more, 1.1*10 -3 mbar or more, 1.1*10 -4 mbar or more, and even 1.1*10 -5It is above mbar. On the other hand, if the vacuum level is excessive, it may lead to a disproportionate increase in cost depending on the process. In different embodiments, the vacuum applied to the container is 1.6*10 -10 mbar or less, 1.6*10 -8 mbar or less, 1.6*10 -6 mbar or less, and even 1.6*10 -4It is below mbar. Throughout this book, unless otherwise specified, pressure values expressed in mbar are absolute pressure values, and pressure values expressed in bar and / or MPa are relative pressure values. Depending on the process, applying a certain pressure to the container in at least a part of the process can enhance efficiency, for example, by promoting plastic deformation, accelerating the diffusion rate, reducing aggregation, promoting effective mixing, and reducing the formation of local regions with non-uniform composition. In one embodiment, the process includes the application of pressure. In different embodiments, the pressure (as defined in this book) applied within the container is 0.12 MPa or more, 0.6 MPa or more, 1.6 MPa or more, and even 4.1 MPa or more. On the other hand, if the pressure is excessive, it can be disadvantageous for certain processes, resulting in particularly undesirable effects such as high friction, heat generation, and increased energy consumption. On the other hand, if the pressure is excessive, it can be disadvantageous for some processes. In different embodiments, the pressure (as defined in this book) applied to the container is 9.8 MPa or less, 4.9 MPa or less, and even 1.8 MPa or less. The feature of "pressure" is defined throughout this book in different alternative forms, which will be described in detail below. In one embodiment, the pressure refers to the average pressure applied. In an alternative embodiment, the pressure refers to the minimum pressure applied. In another alternative embodiment, the pressure refers to the minimum pressure applied, and the minimum pressure is calculated excluding the pressure applied for less than the critical time (as defined in this book). In another alternative embodiment, the pressure refers to the maximum pressure applied. In another alternative embodiment, the pressure refers to the maximum pressure applied, and the maximum pressure is calculated excluding the pressure applied for less than the critical time (as defined in this book). In another alternative embodiment, the pressure refers to the average pressure applied, and the average pressure is calculated excluding the pressure applied for less than the critical time (as defined in this book). In one embodiment, the pressure is applied for at least the critical time (as defined in this book). In another embodiment, the pressure is applied for the main time. In one embodiment, the pressure is applied continuously. In another embodiment, the pressure is applied continuously for the main time (as defined in this book). In another embodiment, the pressure is applied stepwise (as defined in this book). In another embodiment, the pressure is increased and / or removed multiple times during the process.All of the embodiments disclosed above, unless mutually exclusive, may be combined with each other and with any other embodiment disclosed in this document related to "pressurization" in any combination. The feature of "critical time" is defined throughout this document in the form of different alternatives, which will be described in detail below. In one embodiment, the critical time is 1 second. In an alternative embodiment, the critical time is 3 seconds. In another alternative embodiment, the critical time is 11 seconds. In another alternative embodiment, the critical time is 16 seconds. In another alternative embodiment, the critical time is 26 seconds. In another alternative embodiment, the critical time is 56 seconds. All of the embodiments disclosed above, unless mutually exclusive, may be combined with each other and with any other embodiment disclosed in this document related to "critical time" in any combination. The feature of "main time" is defined throughout this document in the form of different alternatives, which will be described in detail below. In one embodiment, the main time is at least 1 second. In an alternative embodiment, the main time is at least 4 seconds. In another alternative embodiment, the main time is at least 12 seconds. In another alternative embodiment, the main time is at least 19 seconds. In another alternative embodiment, the main time is at least 56 seconds. In another alternative embodiment, the main time is at least 4 minutes. In another alternative embodiment, the main time is at least 6 minutes. All of the embodiments disclosed above, unless mutually exclusive, may be combined with each other and with any other embodiment disclosed in this document related to "main time" in any combination.

[0033] The inventors have discovered that, depending on the process, the application of a significantly low temperature in at least a part of the treatment of powders or powder mixtures is particularly advantageous for improving the quality of the material being treated. In one embodiment, the treatment includes the application of temperature. In another embodiment, the temperature applied (as defined herein) is -20°C or lower, -50°C or lower, -80°C or lower, -150°C or lower, -190°C or lower, and even -220°C or lower. On the other hand, an overly low temperature may reduce the efficiency of some treatments. In another embodiment, the temperature applied (as defined herein) is -270°C or higher, -240°C or higher, -199°C or higher, and even -140°C or higher. Depending on the process, it is advantageous to have a certain relationship between the composition and the temperature applied (as defined herein), particularly advantageous for increasing the energy incorporated into the powder or powder mixture. In different embodiments, the temperature applied (as defined herein) is 0.06*Tm or higher, 0.16*Tm or higher, 0.21*Tm or higher, and even 0.26*Tm or higher, where Tm is the melting point in Kelvin of the powder or powder mixture supplied (as defined herein). On the other hand, an excessive high temperature can be disadvantageous for some treatments. In another embodiment, the temperature applied (as defined herein) is 0.74*Tm or lower, 0.64*Tm or lower, 0.54*Tm or lower, 0.49*Tm or lower, 0.39*Tm or lower, and even 0.29*Tm or lower, where Tm is the melting point in Kelvin of the powder or powder mixture supplied (as defined herein). In one embodiment, the temperature is applied continuously. In another embodiment, the temperature is applied continuously for a main time (as defined herein). In another embodiment, the temperature is applied stepwise. In another embodiment, the temperature is increased and / or removed one or more times during the treatment. The feature of "the temperature applied" is defined throughout this document in the form of different alternatives described in detail below. In one embodiment, "the temperature applied" refers to the average temperature. In an alternative embodiment, "the temperature applied" refers to the minimum temperature, and the minimum temperature is calculated excluding the temperature applied for less than a critical time (as defined herein). In another alternative embodiment, "the temperature applied" refers to the maximum temperature, and the maximum temperature is calculated excluding the temperature applied for less than a critical time (as defined herein).In another alternative embodiment, the applied temperature refers to the average temperature, which is calculated by excluding the temperature applied for less than the critical time (defined herein). In one embodiment, the temperature is applied for at least the critical time (defined herein). In another embodiment, the temperature is applied for the main time (defined herein). All the embodiments disclosed above, unless mutually exclusive, can be combined arbitrarily among themselves and with any other embodiment disclosed herein related to the "applied temperature". The feature of "the melting point of the powder mixture" is defined throughout this document in different alternative forms, which will be described in detail below. In one embodiment, the melting point of the powder mixture refers to the melting point of the metal powder with the lowest melting point in the powder mixture. In another embodiment, the melting point of the powder mixture refers to the melting point of the metal main powder (the metal powder defined as the main powder herein) with the lowest melting point in the powder mixture. In another alternative embodiment, the melting point of the powder mixture refers to the melting point of the metal critical powder (the metal powder defined as the critical powder herein) with the lowest melting point in the powder mixture. In another alternative embodiment, the melting point of the powder mixture refers to the melting point of the metal powder with the highest volume fraction in the powder mixture. In another alternative embodiment, the melting point of the powder mixture refers to the melting point of the metal powder with the highest weight fraction in the powder mixture. In another alternative embodiment, the melting point of the powder mixture refers to the melting point of the metal powder with the lowest volume fraction in the powder mixture. In another alternative embodiment, the melting point of the powder mixture refers to the melting point of the metal powder with the lowest weight fraction in the powder mixture. In another alternative embodiment, the melting point of the powder mixture refers to the melting point of the metal powder with the highest melting point in the powder mixture. In another alternative embodiment, the melting point of the powder mixture refers to the melting point of the metal main powder (the metal powder defined as the main powder herein) with the highest melting point in the powder mixture. In another alternative embodiment, the melting point of the powder mixture refers to the melting point of the metal critical powder (the metal powder defined as the critical powder herein) with the highest melting point in the powder mixture. In another alternative embodiment, the melting point of the powder mixture refers to the arithmetic mean melting point of all the metal powders in the powder mixture. In another alternative embodiment, the melting point of the powder mixture refers to the weighted arithmetic mean melting point (mass weighted arithmetic mean, the weight being the weight fraction) of all the metal powders in the powder mixture. In another alternative embodiment, the melting point of the powder mixture refers to the volume weighted arithmetic mean melting point (volume weighted arithmetic mean where the weight is the volume fraction) of all the metal powders in the powder mixture.Throughout this book, unless otherwise specified, the melting point Tm of the metal powder (particles having the same composition on the same indication) refers to the temperature at which the first metal liquid is formed under equilibrium conditions. All the embodiments disclosed above, unless mutually exclusive, can be combined with each other and with any other embodiment disclosed in this book related to the "melting point of the powder mixture". For example, in one embodiment, Tm is the melting point in Kelvin of the metal powder with the lowest melting point. Also, for example, in another embodiment, Tm is the melting point in Kelvin of the metal powder with the lowest melting point that occupies at least 2.6% by weight of all the metal powders in the powder mixture. Here, the melting point of such a metal powder is the temperature at which the first metal liquid is formed under equilibrium conditions. Also, for example, in another embodiment, Tm is at least 6% of all the metal powders in the powder mixture, and the melting point of the metal powder with the lowest melting point is the temperature at which the first metal liquid is formed under equilibrium conditions. Also, for example, in another embodiment, Tm is the melting point in Kelvin of the metal powder with the highest melting point, and the melting point of such a metal powder is the temperature at which the first metal liquid is formed under equilibrium conditions. Also, for example, in another embodiment, Tm is the melting point in Kelvin of the metal powder with the highest melting point that occupies at least 2.6% by weight of all the metal powders in the powder mixture, and the melting point of such a metal powder is the temperature at which the first metal liquid is formed under equilibrium conditions. Also, for example, in another embodiment, Tm is the melting point in Kelvin of the metal powder with the highest melting point that occupies at least 6% by weight of all the metal powders in the powder mixture, and the melting point of such a metal powder is the temperature at which the first metal liquid is formed under equilibrium conditions. All the embodiments disclosed above, unless mutually exclusive, can be combined with each other and with any other embodiment disclosed in this book. For example, in one embodiment, the treatment of the powder or powder mixture includes the following. During at least a part of the treatment, the application of a vacuum at 510 to 1.6×10. -10 the application of a pressure at 0.12 to 9.8 MPa, and / or the application of a temperature at 0.16×Tm to 0.74×Tm, where Tm is the melting point in Kelvin of the supplied powder or powder mixture.

[0034] Depending on the process, quantification of the energy incorporated into the powder or powder mixture can be important, for example, for measuring the processing efficiency. The amount of energy incorporated into the powder or powder mixture can also be important in achieving properties achievable with some components and in improving the processability of certain materials. The energy incorporated into the powder can be calculated in the same way as described, for example, in Magini et al; (Energy transfer in Mechanical alloying, overview, Materials Transactions, JIM, Vo. 36, No 2, 1995, pp 123 to 133) or for other systems. In different embodiments, the energy incorporated into the powder or powder mixture is 11 J / (g*hit) or more, 26 J / (g*hit) or more, 52 J / (g*hit) or more, 76 J / (g*hit) or more, and even 102 J / (g*hit) or more. On the other hand, excessive energy levels can affect, among other things, the efficiency and / or cost associated with the implementation of some processes. In different embodiments, the energy incorporated into the powder or powder mixture is 490 J / (g*hit) or less, 290 J / (g*hit) or less, 190 J / (g*hit) or less, and even 90 J / (g*hit) or less. All values and ranges of the different embodiments disclosed above can be combined arbitrarily among themselves and with any other embodiment disclosed in this document, as long as they are not mutually exclusive. For example, in one embodiment, the energy incorporated into the powder or powder mixture is 11 - 490 J / (g*hit). Also, for example, in another embodiment it is 11 - 290 J / (g*hit). Also, for example, in another embodiment it is 26 - 290 J / (g*hit). The inventors have discovered that depending on the process, quantification of the raw energy incorporated into the powder or powder mixture can be important, for example, especially for measuring the processing efficiency. In different embodiments, the raw energy incorporated is 1.1·10 -5 J / hit or more, 1.1·10 -4 J / hit or more, 1.1·10 -3 J / hit or more, 1.1·10 -2Above J / hit, and further 1.1·10 -1 Above J / hit. On the other hand, an overly high value may be harmful depending on the process. In different embodiments, the raw energy taken in is 20 J / hit or less, 9 J / hit or less, 0.9 J / hit or less, and further 0.39 J / hit or less. All values and ranges of the different embodiments disclosed above are combinable with each other and with any other embodiment disclosed herein, as long as they are not mutually exclusive. For example, in one embodiment, the raw energy taken in by the powder or powder mixture is 1.1·10 -5 ~20 J / hit. Also for example, in another embodiment, it is 1.1·10 -4 ~20 J / hit. Also for example, in another embodiment, it is 1.1·10 -4 ~9 J / hit. The values of the raw energy taken in disclosed above can be calculated using, for example, any of the different alternatives detailed below. In one embodiment, the raw energy taken in is calculated as described in Lai MO, Lu L. Mechanical alloying. Boston MA: Kluwer Academic. In an alternative embodiment, the raw energy taken in is calculated as described in Abdellaouni M, Gaffet E. Acta Mater 1996, 44:725-34. In another alternative embodiment, the raw energy taken in is calculated as described in Mrty BS. Ranganathan S. Internat. Mater Rev 1998, 43:101-41. Depending on the process, quantification of the energy taken in by the powder or powder mixture through the KA1 and / or KA2 parameters may be advantageous. In one embodiment, the step of applying a process to the powder or powder mixture includes an appropriate value of the parameter KA1 (the value disclosed below). The inventors have found that depending on the process, the parameter KA1 is KA1 = EEC / (V 粉体 *ρ 粉体)It has been found that it is particularly advantageous to make it a suitable value. Here, EEC is the electrical energy consumed during the processing of the powder, and the unit is MJ. V 粉体 is the volume of the powder in the container (for example, a mill, an attritor, etc.), and the unit is dm 3 . ρ 粉体 is the average density of the powder in the container (for example, a mill, an attritor, etc.), and the unit is kg / dm 3 . In different embodiments, suitable values of KA1 are 2.88 or more, 26 or more, 42 or more, 82 or more, 210 or more, 410 or more, 1200 or more, and even 2800 or more. On the other hand, depending on the treatment, KA1 should not be too high. In different embodiments, suitable values of KA1 are 4900 or less, 2880 or less, 2400 or less, 1200 or less, 480 or less, 190 or less, and even 39 or less. All values and ranges of the different embodiments disclosed above are combinable with each other and with any other embodiment disclosed herein, as long as they are not mutually exclusive. For example, in one embodiment, the step of applying treatment to the powder or powder mixture includes a value of the parameter KA1 of 2.88 to 4900. Also for example, in another embodiment it is 2.8 to 2880. Also for example, in another embodiment it is 26 to 2880. Also for example, in another embodiment it is 26 to 1200. In one embodiment, the electrical energy consumption is measured by an electricity meter. In an alternative embodiment, the power consumption is obtained indirectly by measuring the flow of the circulating current and the applied voltage. In one embodiment, ρ 粉体 is the average density of the powder or powder mixture obtained by Archimedes' principle. In an alternative embodiment, ρ 粉体 is the average density of the powder or powder mixture obtained by Archimedes' principle in accordance with ASTM B311-17. Throughout this document, measurements are performed under standard conditions unless the context clearly indicates otherwise. All embodiments disclosed above are combinable with each other and with any other embodiment disclosed herein, as long as they are not mutually exclusive. For example, in one embodiment, the step of applying treatment to the powder or powder mixture includes a value of the parameter KA1 of 2.88 to 4900, where KA1 = EEC / (V粉体 *ρ 粉体 ) where EEC is the electrical energy consumed when processing the powder or powder mixture (unit: MJ), V 粉体 is the volume of the powder or powder mixture in the container (unit: dm 3 ), and ρ 粉体 is the average density of the powder or powder mixture in the container (unit: kg / dm 3 ). In one embodiment, the step of applying treatment to the powder or powder mixture includes an appropriate value of parameter KA2 (the values disclosed below). Depending on the treatment, ensuring an appropriate value of parameter KA2 may be particularly advantageous, and the value is KA2 = Coeff * 1 / (V 粉体 * ρ 粉体 + V 加工材料* ρ 加工材料 ) * EEC. Here, EEC is the electrical energy consumed during the processing of the powder, expressed in MJ. V 粉体 is the volume of the powder in the container (e.g., mill, attritor, etc.), expressed in dm 3 . ρ 粉体 is the average density of the powder in the container (e.g., mill, attritor, etc.), expressed in kg / dm 3 . V 加工材料 is the volume of the processing material (e.g., balls, etc.) in the container (e.g., mill, attritor, etc.), expressed in dm 3 . ρ 加工材料 is the average density of the processing material (e.g., balls, etc.) in the container (e.g., mill, attritor, etc.), expressed in kg / dm 3It is represented by. Coeff is a parameter selected from 0.89, 0.84, 0.79, 0.64, and further 0.52 in different embodiments. In different embodiments, appropriate values of KA2 are 0.3 or more, 2.6 or more, 4.2 or more, 8.2 or more, 41 or more, 410 or more, and further 2880 or more. On the other hand, depending on the process, KA2 must not be too high. In different embodiments, appropriate values of KA2 are 4900 or less, 1900 or less, 490 or less, 290 or less, 120 or less, 48 or less, and further 4 or less. All values and ranges of the different embodiments disclosed above are combinable with each other and with any other embodiment disclosed in this document, as long as they are not mutually exclusive. For example, in one embodiment, the step of applying a process to a powder or powder mixture has a value of parameter KA2 of 0.3 to 4900, 0.3 to 1900, where Coeff is 0.89. Also, for example, in another embodiment, it is 2.6 to 4900, where Coeff is 0.84. Also, for example, in another embodiment, it is 2.6 to 1900, where Coeff is 0.79. In one embodiment, the electrical energy consumption is measured by an electricity meter. In an alternative embodiment, the power consumption is obtained indirectly through the measurement of the flow of the circulating current and the applied voltage. In one embodiment, ρ 粉体 is the average density of the powder or powder mixture obtained by Archimedes' principle. In an alternative embodiment, ρ 粉体 is the average density of the powder or powder mixture obtained by Archimedes' principle according to ASTM B311-17. In one embodiment, V 加工材料 and ρ 加工材料 are measured by Archimedes' principle according to ASTM B311-17. Throughout this document, measurements are performed under standard conditions unless the context clearly indicates otherwise. All embodiments disclosed above are combinable with each other and with any other embodiment disclosed in this document, as long as they are not mutually exclusive. For example, in one embodiment, the step of applying a process to a powder or powder mixture includes a value of parameter KA2 of 0.3 to 4900, where KA2 = Coeff * 1 / (V 粉体 *ρ 粉体 +V 加工材料 *ρ加工材料 ) * It is EEC. Here, EEC is the electrical energy consumed when processing powders or powder mixtures (unit: MJ), and V 粉体 is the volume of the powder or powder mixture in the container (unit: dm 3 ), ρ 粉体 is the average density of the powder or powder mixture in the container (unit: Kg / dm 3 ), V 加工材料 is the volume of the processing material in the container (unit: dm 3 ), ρ 加工材料 is the average density of the processing material in the container (unit: Kg / dm 3 ), and Coeff is 0.89.

[0035] The average dislocation density (MDD) can be particularly important for the performance of certain components. Depending on the application, rather than setting processing parameters based on the energy incorporated into the powder, it can be particularly advantageous to ensure a specific dislocation density level during the application of this method. In this regard, the inventors have surprisingly discovered that by setting the average dislocation density to a specific value shown below, in many cases, manufacturing components with excellent properties that can be utilized in particularly demanding applications can be obtained. The correlation between the processing parameters and the dislocation density level varies depending on the specific material being processed. After the material to be processed is selected, for example, when high mechanical strength and a pure microstructure (grain refinement) are required, this conversion (setting the processing parameters to ensure a certain level of dislocation density) is routine work for a skilled person. In different embodiments, the average dislocation density is 1.2 * 10 12 m -2 or more, 1.2 * 10 13 m -2 or more, 1.2 * 10 14 m -2 or more, 5.5 * 10 14 m -2 or more, 1.2 * 10 15 m -2 or more, 5.5 * 10 15 m -2 or more, and further 1.2 * 10 16 m -2The above is the case. On the other hand, depending on the process, the average dislocation density should not be set to an excessively high value. In different embodiments, the average dislocation density is 9.8*10 18 m -2 or less, 9.8*10 17 m -2 or less, 9.8*10 16 m -2 or more, 4.8*10 16 m -2 or less, and further 9.8*10 15 m -2 or less. In one embodiment, the average dislocation density value disclosed above refers to the average dislocation density of the particles of the powder or powder mixture to be processed, and before, during, and / or after the application of any process steps of the method carried out after the processing of the powder or powder mixture, the particles are included in the component (in many cases, at a specific stage of the whole method, the particles of the powder or powder mixture to be processed are combined with each other in a way that it is difficult or impossible to distinguish them, but for the measurement of the average dislocation density, which can be measured for individual powder particles and the components resulting from the compaction of such powder particles, it does not pose a major problem). In an alternative embodiment, the average dislocation density value disclosed above refers to the average dislocation density in at least a partial region of the component surface. For specific applications, it is also beneficial to keep the average dislocation density of the particles of the powder or powder mixture constant during and / or at the end of the processing step of the powder or powder mixture. In another alternative embodiment, the above-disclosed average dislocation density value refers to the average dislocation density of the particles of the powder or powder mixture during and / or at the end of the processing step of the powder or powder mixture. In any case, those skilled in the art know how to set the desired value of the above-mentioned average dislocation density by modifying the parameters of the process steps of the method. All values and ranges of the different embodiments disclosed above can be combined with each other and with any other embodiment disclosed in this document, provided they are not mutually exclusive. For example, in one embodiment, the average dislocation density (MDD) of the powder or powder mixture after processing is 1.2*10 12 ~9.8*10 18 m -2is. Further, for example, in another embodiment, in any step of the method after the treatment of the powder or powder mixture, the average dislocation density (MDD) of the particles of the powder or powder mixture to be treated contained in the component is 1.2*10 12 ~9.8*10 18 m -2 is. Further, for example, in another embodiment, the average dislocation density (MDD) in at least a partial region of the component surface is 1.2*10 12 ~9.8*10 18 m -2This is the case. On the other hand, depending on the application, in addition to setting the average dislocation density to the above value, the inventor has found the advantage of quantifying the energy incorporated into the powder, as described in the previous section of this document. The inventor has found that depending on the treatment, it is advantageous to perform the treatment of the powder or powder mixture such that the average dislocation density is significantly increased. This means that the average dislocation density after such treatment is higher. In one embodiment, the average dislocation density significantly increases during the treatment of the powder or powder mixture. In certain applications, a significant increase in the average dislocation density (as defined in this document) of the particles of the powder or powder mixture to be treated contained in the component throughout the treatment can be surprisingly advantageous (in many cases, at a specific stage throughout the treatment, the particles of the powder or powder mixture to be treated bond to each other and their distinction becomes difficult or impossible, but it does not pose a great difficulty for measuring the average dislocation density, which can be measured for individual powder particles and the components resulting from the compaction of such powder particles). In one embodiment, the average dislocation density (as defined in this document) significantly increases during the application of the steps of the method. In certain applications, a significant increase in the average dislocation density (as defined in this document) can be particularly advantageous in occurring in at least a partial region of the component surface. In one embodiment, in at least a partial region of the component surface, the average dislocation density (as defined in this document) significantly increases. The feature of "significant increase in average dislocation density" is defined throughout this document in the form of different alternatives, which will be described in detail below. In one embodiment, a significant increase in average dislocation density refers to an increase of 1.5 times or more. In an alternative embodiment, a significant increase in average dislocation density refers to an increase of 2.1 times or more. In another alternative embodiment, a significant increase in average dislocation density refers to an increase of 5.1 times or more. In another alternative embodiment, a significant increase in average dislocation density refers to an increase of 7.7 times or more. In another alternative embodiment, a significant increase in average dislocation density refers to an increase of 10.2 times or more. In another alternative embodiment, a significant increase in average dislocation density refers to an increase of 15.2 times or more. In another alternative embodiment, a significant increase in average dislocation density refers to an increase of 26 times or more.All of the embodiments disclosed above, unless mutually exclusive, may be combined with each other and with any other embodiments related to the "substantial increase in average dislocation density" disclosed herein. For example, in one embodiment, in at least a partial region of the component surface, the average dislocation density increases substantially by a factor of 1.5 or more. Also for example, in another embodiment, during the application of the steps of the method, the average dislocation density increases substantially by a factor of 1.5 or more. Also for example, in another embodiment, during the processing of the powder or powder mixture, the average dislocation density increases substantially by a factor of 1.5 or more. The inventors have discovered that, depending on the application, a substantial increase in the average dislocation density (as defined herein) throughout the method, followed by a substantial decrease in the average dislocation density (as defined herein) of the particles of the processed powder or powder mixture contained in the component, is surprisingly advantageous. (In many cases, at a particular stage throughout the processing, the particles of the processed powder or powder mixture may bond to each other and their distinction may become difficult or impossible, but the measurement of the average dislocation density, which can be measured for individual powder particles and the components resulting from the compaction of such powder particles, does not pose a major difficulty.) In one embodiment, during the application of the steps of the method, the average dislocation density (as defined herein) increases substantially and then the average dislocation density (as defined herein) decreases substantially. For certain applications, it is particularly advantageous for a substantial increase and subsequent substantial decrease in the average dislocation density (as defined herein) to occur in at least a partial region of the component surface. In one embodiment, there is a substantial increase in the average dislocation density (as defined herein), followed by a substantial decrease in the average dislocation density (as defined herein) in at least a partial region of the component surface. For certain applications, it may be particularly advantageous for the average dislocation density (as defined herein) of the particles of the powder or powder mixture to increase substantially during the step of applying the treatment to the powder or powder mixture and then to decrease substantially. In one embodiment, during the step of applying the treatment to the powder or powder mixture, the average dislocation density (as defined herein) increases substantially and then the average dislocation density (as defined herein) decreases substantially. The feature of "substantial decrease in average dislocation density" is defined throughout this document in the form of different alternatives detailed below. In one embodiment, the substantial decrease refers to a decrease by a factor of 0.67 or more.In an alternative embodiment, a substantial decrease refers to a decrease of 0.48 times or more. In another alternative embodiment, a substantial decrease refers to a decrease of 0.19 times or more. In another alternative embodiment, a substantial decrease refers to a decrease of 0.13 times or more. In another alternative embodiment, a substantial decrease refers to a decrease of 0.098 times or more. In another alternative embodiment, a substantial decrease refers to a decrease of 0.066 times or more. In another alternative embodiment, a substantial decrease refers to a decrease of 0.038 times or more. All of the embodiments disclosed above, unless mutually exclusive, can be combined arbitrarily among themselves and with any other embodiment related to the "substantial decrease in average dislocation density" disclosed in this document. All of the embodiments disclosed above, unless mutually exclusive, can be combined arbitrarily among themselves and with any other embodiment disclosed in this document. For example, in one embodiment, during the application of the steps of the method, the average dislocation density increases significantly by 1.5 times or more and then decreases significantly by 0.038 times or more. Also, for example, in another embodiment, in at least a partial region of the component surface, the average dislocation density increases significantly by 1.5 times or more and then decreases significantly by 0.038 times or more. Also, for example, in another embodiment, during the processing of the powder or powder mixture, the average dislocation density increases significantly by 1.5 times or more and then the average dislocation density decreases significantly by 0.038 times or more. The inventors have discovered that, depending on the application, it is surprisingly advantageous for the average dislocation density (as defined in this document) to increase significantly throughout the method and then the average dislocation density (as defined in this document) to decrease significantly, and finally the average dislocation density (as defined in this document) of the particles of the processed powder or powder mixture contained in the component to increase significantly (in many cases, at a specific stage throughout the method, the particles of the processed powder or powder mixture may bond to each other and their distinction may become difficult or impossible, but the measurement of the average dislocation density, which can be measured for individual powder particles and the components resulting from the compaction of such powder particles, does not pose a great difficulty.). In one embodiment, during the application of the steps of the method, the average dislocation density (as defined in this document) increases significantly, then the average dislocation density (as defined in this document) decreases significantly, and finally the average dislocation density (as defined in this document) increases significantly.For certain applications, it can be particularly advantageous for a significant increase, followed by a significant decrease, and finally a significant increase in the average dislocation density (as defined herein) to occur in at least some regions of the component surface. In one embodiment, in at least some regions of the component surface, the average dislocation density (as defined herein) significantly increases, then the average dislocation density (as defined herein) significantly decreases, and finally the average dislocation density (as defined herein) significantly increases. For certain applications, it can be particularly advantageous for the average dislocation density (as defined herein) to significantly increase, then significantly decrease, and finally significantly increase in the process of applying a treatment to a powder or powder mixture. In one embodiment, in the process of applying a treatment to a powder or powder mixture, the average dislocation density (as defined herein) significantly increases, then the average dislocation density (as defined herein) significantly decreases, and finally the average dislocation density (as defined herein) significantly increases. The indicated values of the dislocation density, and its increase and decrease, can be calculated using, for example, any of the various alternatives detailed below. In one embodiment, the dislocation density is measured by the Williamson-Hall method. In an alternative embodiment, the dislocation density is measured by the Williamson-Hall method modified by the Ungar and Borbely method. In another alternative embodiment. The dislocation density is measured by the Warren - Averbach method. In another alternative embodiment, the dislocation density is measured by the Warren - Averbach method modified by Ungar. Both models can be run in a similar way to doi:10.3390 / ma13235355 (Muiruri et al.). The value of the mean dislocation density (MDD) disclosed above can alternatively be obtained by techniques including a destructive test (DT) of the component (or at least a part of the component). In another embodiment, the mean dislocation density (MDD) can also be measured by transmission electron microscopy (TEM) or scanning electron microscopy (SEM) using electron backscatter diffraction (EBSD) technique or X - ray diffraction (XRD) or high - resolution X - ray diffraction (HRXRD) or neutron diffraction technique or micro - hardness test or atomic force microscopy (AFM) or neutron diffraction or ultrasonic measurement. Throughout this document, unless otherwise stated, the dislocation density refers to the mean dislocation density. All the embodiments disclosed above, unless mutually exclusive, can be combined with each other and with any other embodiment disclosed in this document in any combination. For example, in one embodiment, during the application of the steps of the method, the mean dislocation density increases significantly by a factor of 1.5 or more, then decreases significantly by a factor of 0.038 or more, and finally increases significantly by a factor of 1.5 or more. Also for example, in another embodiment, in at least a partial region of the component surface, the mean dislocation density increases significantly by a factor of 1.5 or more, then decreases significantly by a factor of 0.038 or more, and finally increases significantly by a factor of 1.5 or more. Also for example, in another embodiment, during the processing of the powder or powder mixture, the mean dislocation density increases significantly by a factor of 1.5 or more, then decreases significantly by a factor of 0.038 or more, and finally increases significantly by a factor of 1.5 or more.

[0036] Depending on the application, it has been found advantageous to control the parameter PAD1 during the processing of the powder or powder mixture. Here, PAD1 = 1*10 -6 *√MDD, where MDD is in units of m -2is the average dislocation density. In different embodiments, PAD1 is 11 or more, 20 or more, 30 or more, 35 or more, 40 or more, 50 or more, 70 or more, and even 105 or more. On the other hand, excessive values are disadvantageous. In different embodiments, PDA1 is 390 or less, 280 or less, 190 or less, 140 or less, 98 or less, and even 84 or less. In one embodiment, the value of the parameter PDA1 disclosed above refers to the value of the parameter PDA1 before, during, and / or after the application of any process of the method after the treatment of the powder or powder mixture. In an alternative embodiment, the value of the parameter PDA1 disclosed above refers to the value of the parameter PDA1 in at least a partial region of the component surface. In certain applications, it may be advantageous to ensure the value of the parameter PDA1 during and / or at the end of the process of applying treatment to the powder or powder mixture. In another alternative embodiment, the value of the parameter PDA1 disclosed above refers to the value of the parameter PDA1 during and / or at the end of the process of applying treatment to the powder or powder mixture. In any case, those skilled in the art are familiar with the method of setting the desired value of the above-mentioned parameter PDA1 by modifying the process parameters in this method. All the embodiments disclosed above are combinable with each other and with any other embodiment disclosed in this document, as long as they are not mutually exclusive. For example, in one embodiment, the value of the parameter PAD1 during the application of the process of the method is 11 to 390, and PAD1 = 1 * 10 -6 * √MDD, where MDD is the average dislocation density in units of m -2 . Also, for example, in another embodiment, the value of the parameter PAD1 in at least a partial region of the component surface is 11 to 390, and PAD1 = 1 * 10 -6 * √MDD, where MDD is the average dislocation density in units of m -2 . Also, for example, in another embodiment, the value of the parameter PAD1 after the application of the treatment is 11 to 390, and PAD1 = 1 * 10 -6 * √MDD, where MDD is the average dislocation density in units of m -2is the average dislocation density. The inventors have found that it is advantageous to process powders or powder mixtures, as in some applications there is a significant increase in PAD1 (as defined herein). This means that the PAD1 value is high after such processing. In one embodiment, during the processing of a powder or powder mixture, PAD1 (as defined herein) significantly increases. In certain applications, a significant increase in PAD1 (as defined herein) throughout the method can be surprisingly advantageous. In one embodiment, PAD1 (as defined herein) significantly increases during the application of the steps of the method. In a particular application, a significant increase in PAD1 (as defined herein) in at least a partial region of the component surface is particularly advantageous. In one embodiment, a significant increase in PAD1 (as defined herein) occurs in a partial region of the component surface. The feature of "a significant increase in PAD1" is defined throughout this document in different alternative forms, which will be described in detail below. In one embodiment, a significant increase in PAD1 means adding 2 to the value of PAD1. In another embodiment, a significant increase in PAD1 means adding 5 to the value of PAD1. In another alternative embodiment, a significant increase in PAD1 means adding 8 to the value of PAD1. In another alternative embodiment, a significant increase in PAD1 means adding 10 to the value of PAD1. In another alternative embodiment, a significant increase in PAD1 means adding 20 to the value of PAD1. In another alternative embodiment, a significant increase in PAD1 means adding 30 to the value of PAD1. All of the embodiments disclosed above can be combined in any combination with any other embodiment disclosed in this document regarding "a significant increase in PAD1", unless they are mutually exclusive. The inventors have discovered that in some applications, a significant increase in PAD1 (as defined herein) throughout the method, followed by a significant decrease in PAD1 (as defined herein), can be surprisingly advantageous. In one embodiment, during the application of the steps of the method, there is a significant increase in PAD1 (as defined herein), followed by a significant decrease in PAD1 (as defined herein). In a particular application, a significant increase and subsequent significant decrease in PAD1 (as defined herein) occurring in at least a partial region of the component surface can be particularly advantageous.In one embodiment, there is a significant increase in PAD1 (as defined in this document) in at least a partial region of the component surface, followed by a significant decrease in PAD1 (as defined in this document). In certain special applications, it can be particularly advantageous that during the process of applying treatment to a powder or a powder mixture, there is a significant increase in PAD1 (as defined in this document), followed by a significant decrease in PAD1 (as defined in this document). In one embodiment, during the process of applying treatment to a powder or a powder mixture, PAD1 (as defined in this document) significantly increases and then significantly decreases. The feature of "significant decrease in PAD1" is defined throughout this document in the form of different alternatives, which will be described in detail below. In one embodiment, a significant decrease in PAD1 means subtracting 2 from the value of PAD1. In an alternative embodiment, a significant decrease in PAD1 means subtracting 5 from the value of PAD1. In another alternative embodiment, a significant decrease in PAD1 means subtracting 8 from the value of PAD1. In another alternative embodiment, a significant decrease in PAD1 means subtracting 10 from the value of PAD1. In another alternative embodiment, a significant decrease in PAD1 means subtracting 20 from the value of PAD1. In another alternative embodiment, a significant decrease in PAD1 means subtracting 30 from the value of PAD1. All the embodiments disclosed above can be combined arbitrarily with any other embodiment disclosed in this document regarding "significant decrease in PAD1", unless they are mutually exclusive. The inventors have discovered that depending on the application, it can be surprisingly advantageous that PAD1 (as defined in this document) significantly increases throughout the method, then significantly decreases, and finally significantly increases. In one embodiment, during the application of the method steps, there is a significant increase in PAD1 (as defined in this document), followed by a significant decrease in PAD1 (as defined in this document), and finally a significant increase in PAD1 (as defined in this document). Depending on the application, it can be particularly advantageous that the significant increase in PAD1, followed by the significant decrease, and the final significant increase occur in at least a partial region of the component surface.In one embodiment, in at least a partial region of the component surface, there is a significant increase in PAD1 (as defined in this document), followed by a significant decrease in PAD1 (as defined in this document), and finally a significant increase in PAD1 (as defined in this document). For a particular application, in the process of treating a powder or a powder mixture, it can be particularly advantageous for PAD1 (as defined in this document) to increase significantly, then decrease significantly, and finally increase significantly. In one embodiment, during the process of treating a powder or a powder mixture, there is a significant increase in PAD1 (as defined in this document), followed by a significant decrease in PAD1 (as defined in this document), and finally a significant increase in PAD1 (as defined in this document). All the embodiments disclosed above, unless mutually exclusive, can be combined arbitrarily among themselves and with any other embodiment disclosed in this document. For example, in one embodiment, during the application of the steps of the method, the value of PAD1 increases significantly. Here, a significant increase in PAD1 means adding 2 to the value of PAD1, and PAD1 = 1 * 10. -6 *√MDD, where MDD is in units of m -2 is the average dislocation density. Also, for example, in another embodiment, during the application of the steps of the method, there is a significant increase in the value of PAD1, followed by a significant decrease, and PAD1 = 1 * 10 -6 *√MDD, and MDD is in units of m -2 is the average dislocation density. Here, a significant increase in PAD1 means adding 2 to the value of PAD1, and a significant decrease in PAD1 means subtracting 2 from the value of PAD1.

[0037] The inventors have discovered that there are numerous applications, such as (but not limited to) the development of specific materials, that can benefit from the treatments disclosed in the previous section. Some of the specific materials are disclosed later in this document.

[0038] In a particular application of this method, the treatment of the powder or powder mixture is optional and can thus be avoided. In one embodiment, the step of applying energy to the powder or powder mixture by mechanical action is omitted.

[0039] All of the embodiments disclosed above, unless mutually exclusive, can be combined with each other and with any other embodiment disclosed in this document in any combination. For example, in one embodiment, a method for manufacturing a component made of metal includes the following steps: supplying a powder or a powder mixture made of at least a metal or a metal-based alloy; optionally applying a treatment to the powder or the powder mixture, where the treatment of the powder or the powder mixture includes applying energy to the powder or the powder mixture by mechanical action such that welding occurs; and shaping the powder or the powder mixture treated using the metal additive manufacturing (MAM) method.

[0040] Quite unexpectedly, the inventors have discovered that, contrary to what is normally considered in some applications of this method, for the elements %C, %O, %N, %H and / or %B, it is not only the final values of these elements that are important, but also the control of their levels in different steps of the method. In this regard, depending on the application, the use of powders having appropriate contents (as defined in this document) of %C, %O, %N, %H and / or %B during and / or after treatment may be particularly useful for controlling the yield strength of some manufactured components. In one embodiment, at any time during the treatment of the powder or the powder mixture, the powder or the powder mixture has appropriate contents of %C, %O, %N, %H and / or %B. In any case, a person skilled in the art knows how to set the desired values of the contents of %C, %O, %N, %H and / or %B as shown below.

[0041] Depending on the application, it may be preferable to have a powder to be treated with an appropriate carbon (%C) content. In one embodiment, the powder or powder mixture to be treated contains an appropriate %C content. The feature of "appropriate carbon content" is defined throughout this document in the form of different alternatives described in detail below. In different embodiments, the appropriate carbon content is a carbon content of 0.1 wt% or more, 0.19 wt% or more, 0.36 wt% or more, 1.06 wt% or more, 1.36 wt% or more, and even 2.1 wt% or more. On the other hand, if the carbon content is excessive, it may be harmful depending on the application. In different embodiments, the appropriate %C content is a carbon content of 3.9 wt% or less, 2.19 wt% or less, 1.69 wt% or less, 1.19 wt% or less, 0.79 wt% or less, and even 0.39 wt% or less. Depending on the application, at least one of the powders having an appropriate carbon content (as defined in this document) may be preferable. In another embodiment, at least one of the powders of the mixture to be treated contains an appropriate %C content. All the embodiments disclosed above are combinable with each other and with any other embodiment disclosed in this document regarding "appropriate %C content" as long as they are not mutually exclusive. All the values and ranges of the different embodiments disclosed above are combinable with each other and with any other embodiment disclosed in this document as long as they are not mutually exclusive. For example, in one embodiment, the powder or powder mixture to be treated contains an appropriate %C content, where the appropriate %C content is a carbon content of 0.1 wt% to 3.9 wt%. Also, for example, in another embodiment, it is 0.1 wt% to 2.19 wt%. Also, for example, in another embodiment, it is 0.19 wt% to 2.19 wt%.

[0042] Additionally or alternatively, depending on the application, it may be preferable to have the powder to be processed with an appropriate oxygen (%O) content. In one embodiment, the powder or powder mixture to be processed contains an appropriate %O content. The feature of "appropriate %O content" is defined throughout this document in the form of various alternatives described in detail below. In different embodiments, the appropriate %O content is an oxygen content of 160 ppm or more, 310 ppm or more, 910 ppm or more, 2100 ppm or more, and even 5100 ppm or more. On the other hand, if the oxygen content is excessive, it may be harmful depending on the application. In different embodiments, the appropriate %O content is an oxygen content of 49000 ppm or less, 24000 ppm or less, 6000 ppm or less, 3900 ppm or less, 1400 ppm or less, 600 ppm or less, and even 390 ppm or less. Depending on the application, at least one of the powders having an appropriate oxygen content (as defined in this document) may be preferable. In another embodiment, at least one of the powders to be processed in the mixture contains an appropriate %O content. All of the embodiments disclosed above are combinable with each other and with any other embodiment disclosed in this document regarding "appropriate %O content", as long as they are not mutually exclusive. All values and ranges of the different embodiments disclosed above are combinable with each other and with any other embodiment disclosed in this document, as long as they are not mutually exclusive. For example, in one embodiment, the powder or powder mixture to be processed contains an appropriate %O content, where the appropriate %O content is an oxygen content of 160 to 49000 ppm. Also for example, in another embodiment, it is 160 to 24000 ppm.

[0043] Additionally or alternatively, depending on the application, it may be preferable to have a treated powder with an appropriate nitrogen (%N) content. In one embodiment, the treated powder or powder mixture includes an appropriate %N content. In another embodiment, at least one of the powders to be treated in the mixture includes an appropriate %N content. The feature of "appropriate %N content" is defined throughout this document in the form of various alternatives described in detail below. In different embodiments, the appropriate %N content is a nitrogen content of 16 ppm or more, 56 ppm or more, 160 ppm or more, 360 ppm or more, 560 ppm or more, and even 2600 ppm or more. On the other hand, if the nitrogen content is excessive, it can be harmful depending on the application. In different embodiments, the appropriate %N content is a nitrogen content of 19400 ppm or less, 4900 ppm or less, 1900 ppm or less, 840 ppm or less, 390 ppm or less, and even 190 ppm or less. Depending on the application, it may be preferable to have at least one of the powders with an appropriate nitrogen content (as defined in this document). In another embodiment, at least one of the powders to be treated in the mixture includes an appropriate %N content. All of the embodiments disclosed above are combinable with each other and with any other embodiment disclosed in this document regarding "appropriate %N content", unless they are mutually exclusive. All of the values and ranges of the different embodiments disclosed above are combinable with each other and with any other embodiment disclosed in this document, unless they are mutually exclusive. For example, in one embodiment, the treated powder or powder mixture includes an appropriate %N content, where the appropriate %N content is a nitrogen content of 16 to 19400 ppm. Also, for example, in another embodiment, it is 16 to 4900 ppm.

[0044] Additionally or alternatively, depending on the application, a processed powder having an appropriate hydrogen (%H) content may be preferred. In one embodiment, the processed powder or powder mixture includes an appropriate %H content. In another embodiment, at least one of the processed powders of the mixture includes an appropriate %H content. The feature of "appropriate %H content" is defined throughout this document in the form of different alternatives described in detail below. In different embodiments, the appropriate %H content is a hydrogen content of 0.01 ppm or more, 0.6 ppm or more, 1 ppm or more, 12 ppm or more, 61 ppm or more, 210 ppm or more, and even 510 ppm or more. On the other hand, if the hydrogen content is excessive, it can be harmful depending on the application. In different embodiments, the appropriate %H content is a hydrogen content of 8400 ppm or less, 3400 ppm or less, 1400 ppm or less, 590 ppm or less, and even 290 ppm or less. Depending on the application, at least one of the powders having an appropriate hydrogen content (as defined in this document) may be preferred. In another embodiment, at least one of the processed powders of the mixture includes an appropriate %H content. All of the embodiments disclosed above, unless mutually exclusive, can be combined arbitrarily among themselves and with any other embodiment disclosed in this document regarding "appropriate %H content". All of the values and ranges of the different embodiments disclosed above, unless mutually exclusive, can be combined arbitrarily among themselves and with any other embodiment disclosed in this document. For example, in one embodiment, the processed powder or powder mixture includes an appropriate %H content, where the appropriate %H content is a hydrogen content of 0.01 to 8400 ppm. Also, for example, in another embodiment, it is 6 to 3400 ppm.

[0045] Additionally or alternatively, depending on the application, it may be preferable to have a powder to be treated with an appropriate boron (%B) content. In one embodiment, the powder or powder mixture to be treated contains an appropriate %B content. In another embodiment, at least one of the powders to be treated in the mixture contains an appropriate %B content. The feature of "appropriate %B content" is defined throughout this document in the form of different alternatives described in detail below. In different embodiments, the appropriate %B content is a boron content of 0.01 ppm or more, 0.6 ppm or more, 3 ppm or more, 31 ppm or more, 126 ppm or more, 560 ppm or more, 1100 ppm or more, and even 3600 ppm or more. On the other hand, if the boron content is excessive, it can be harmful depending on the application. In different embodiments, the appropriate %B content is a boron content of 44000 ppm or less, 19000 ppm or less, 9000 ppm or less, 1900 ppm or less, 790 ppm or less, 390 ppm or less, and even 89 ppm or less. Depending on the application, it may be preferable to have at least one of the powders with an appropriate boron content (as defined in this document). In another embodiment, at least one of the powders to be treated in the mixture contains an appropriate %B content. All of the embodiments disclosed above are combinable with each other and with any other embodiment disclosed in this document regarding "appropriate %B content", as long as they are not mutually exclusive. All of the values and ranges of the different embodiments disclosed above are combinable with each other and with any other embodiment disclosed in this document, as long as they are not mutually exclusive. For example, in one embodiment, the powder or powder mixture to be treated contains an appropriate %B content, where the appropriate boron content is a boron content of 0.01 to 44000 ppm. Also, for example, in another embodiment, it is 0.6 to 19000 ppm.

[0046] All of the embodiments disclosed above are combinable with each other and with any other embodiment disclosed in this document regarding "appropriate %B content", as long as they are not mutually exclusive.

[0047] Optionally, the method may also include the step of adding at least one additional powder to the powder or powder mixture to be processed. In one embodiment, the method further includes the step of adding at least one powder to the powder or powder mixture to be processed. In this regard, the inventors have discovered that the amount of energy used to mix these materials should be controlled. In one embodiment, the amount of energy used to mix the powder or powder mixture to be processed and the added powder or powders is less than the amount of energy used to process the powder or powder mixture. In such a case, optionally, the method may also include the step of adding a treatment including the application of energy via mechanical action (as described above) to the mixture of the powder or powder mixture to be processed and the added powder or powders. In one embodiment, the method also includes the step of adding a treatment to the mixture of the powder or powder mixture to be processed and the added powder.

[0048] All of the embodiments disclosed above, unless mutually exclusive, can be combined with each other and with any other embodiment disclosed in this document in any combination. For example, in one embodiment, a method for manufacturing a component containing a metal includes the following steps: supplying a powder or powder mixture composed of at least a metal or a metal-based alloy; applying a treatment to the powder or powder mixture, which includes adding energy to the powder or powder mixture by mechanical action; adding at least one more powder to the powder or powder mixture to be treated; forming the powder or powder mixture to be treated using a metal additive manufacturing (MAM) method. Also, for example, in another embodiment, a method for manufacturing a component containing a metal includes the following steps: supplying a powder or powder mixture containing at least a metal or a metal-based alloy; applying a treatment to the powder or powder mixture, which includes adding energy to the powder or powder mixture by mechanical action; adding at least one more powder to the powder or powder mixture to be treated; applying an energy addition treatment by mechanical action to the mixture of the powder or powder mixture to be treated and the at least one added powder; forming the powder or powder mixture to be treated using a metal additive manufacturing (MAM) method.

[0049] Optionally, the method may also include a step of pre-adjusting the powder or powder mixture to be treated in order to ensure a certain %C, %O, %N, %H and / or %B content before adding the forming step. In one embodiment, the method also includes a step of pre-adjusting the powder or powder mixture to be treated. The inventors have discovered that the pre-adjustment step may be particularly important for some mechanical properties of a specific manufactured component, such as, for example, mechanical strength, elongation and / or toughness. In any case, a person skilled in the art knows how to set the desired values of the %C, %O, %N, %H and / or %B element contents as shown below. This pre-treatment step can advantageously be carried out at any time before the forming step (for example, after the treatment of the powder or powder mixture).

[0050] As described above, in some applications of the present method, ensuring a specific carbon (%C) content after the pre-adjustment step can be important. In one embodiment, prior to the application of the metal additive manufacturing (MAM) method, the powder or powder mixture to be processed contains a specific %C content. The feature of "specific %C content" is defined throughout this document in the form of different alternatives, which will be described in detail below. In different embodiments, the specific %C content is a carbon content of 0.01 ppm or more, 0.6 ppm or more, 60 ppm or more, 260 ppm or more, 0.096 wt% or more, 0.16 wt% or more, 0.31 wt% or more, 1.06 wt% or more, 1.26 wt% or more, and even 2.1 wt% or more. On the other hand, depending on the application of the method, an excessive carbon content can be harmful. In different embodiments, the specific %C content is a carbon content of 3.9 wt% or less, 2.19 wt% or less, 1.49 wt% or less, 1.09 wt% or less, 0.69 wt% or less, and even 0.38 wt% or less. Depending on the application, at least one of the powders having a specific carbon content (as defined in this document) may be preferred. In another embodiment, at least one of the powders to be processed in the mixture contains a specific %C content. All of the embodiments disclosed above, unless mutually exclusive, can be combined with each other and with any other embodiment disclosed in this document regarding the "specific %C content". All values and ranges of the different embodiments disclosed above, unless mutually exclusive, can be combined with each other and with any other embodiment disclosed in this document. For example, in one embodiment, the powder or powder mixture to be processed contains a specific %C content. Here, the specific %C content is a carbon content of 0.01 ppm to 3.9 wt%. Also, for example, in another embodiment, it is 0.6 ppm to 2.19 wt%. Also, for example, in another embodiment, it is 60 ppm to 2.19 wt% after the pre-adjustment step.

[0051] Additionally or alternatively, in some applications of the present method, ensuring a specific oxygen (%O) content after the pre-adjustment step may be important. In one embodiment, prior to the application of the metal additive manufacturing (MAM) method, the powder or powder mixture to be processed contains a specific %O content. The feature of "specific %O content" is defined throughout this document in the form of different alternatives, which will be described in detail below. In different embodiments, the specific %O content is an oxygen content of 0.01 ppm or more, 0.6 ppm or more, 56 ppm or more, 210 ppm or more, 610 ppm or more, 1600 ppm or more, and even 5100 ppm or more. On the other hand, if the oxygen content is excessive, it may be harmful in some applications of the present method. In different embodiments, the specific %O content is an oxygen content of 23900 ppm or less, 11900 ppm or less, 4900 ppm or less, 1200 ppm or less, 790 ppm or less, 490 ppm or less, and even 340 ppm or less. Depending on the application, at least one of the powders having a specific oxygen content (as defined in this document) may be preferred. In another embodiment, at least one of the powders to be processed in the mixture contains a specific %O content. All of the embodiments disclosed above are combinable with each other and with any other embodiment disclosed in this document regarding the "specific %O content", unless they are mutually exclusive. All values and ranges of the different embodiments disclosed above are combinable with each other and with any other embodiment disclosed in this document, unless they are mutually exclusive. For example, in one embodiment, the powder or powder mixture to be processed contains a specific %O content, where the specific %O content is an oxygen content of 0.01 - 23900 ppm. Also, for example, in another embodiment, it is 0.6 - 11900 ppm. Also, for example, in another embodiment, it is 56 - 4900 ppm.

[0052] Additionally or alternatively, in some applications of the present method, ensuring a specific nitrogen (%N) content after the pre-adjustment step may be important. In one embodiment, prior to applying the metal additive manufacturing (MAM) method, the powder or powder mixture to be processed contains a specific %N content. The feature of "specific %N content" is defined throughout this document in the form of different alternatives, which will be described in detail below. In different embodiments, the specific %N content is a nitrogen content of 0.01 ppm or more, 0.6 ppm or more, 6 ppm or more, 36 ppm or more, 110 ppm or more, 310 ppm or more, 510 ppm or more, and even 2600 ppm or more. On the other hand, if the nitrogen content is excessive, it may be harmful depending on the application of the method. In different embodiments, the specific %N content is a nitrogen content of 0.44 wt% or less, 0.19 wt% or less, 11900 ppm or less, 3900 ppm or less, 1200 ppm or less, 740 ppm or less, 340 ppm or less, and even 140 ppm or less. Depending on the application, at least one of the powders having a specific nitrogen content (as defined in this document) may be preferred. In another embodiment, at least one of the powders to be processed in the mixture contains a specific %N content. All of the embodiments disclosed above are combinable with each other and with any other embodiment disclosed in this document regarding the "specific %N content", unless they are mutually exclusive. All values and ranges of the different embodiments disclosed above are combinable with each other and with any other embodiment disclosed in this document, unless they are mutually exclusive. For example, in one embodiment, the powder or powder mixture to be processed contains a specific %N content, where the specific %N content is a nitrogen content of 0.01 ppm to 0.44 wt%. Also, for example, in another embodiment, it is 0.6 ppm to 0.19 wt%. Also, for example, in another embodiment, it is 6 to 11900 ppm.

[0053] Additionally or alternatively, in some applications of the present method, ensuring a specific hydrogen (%H) content after the pre-adjustment step may be important. In one embodiment, prior to applying the metal additive manufacturing (MAM) method, the powder or powder mixture to be processed contains a specific %H content. The feature of "specific %H content" is defined throughout this document in the form of different alternatives, which will be described in detail below. In different embodiments, the specific %H content is a hydrogen content of 0.01 ppm or more, 0.6 ppm or more, 1 ppm or more, 6 ppm or more, 51 ppm or more, 110 ppm or more, and even 510 ppm or more. On the other hand, if the hydrogen content is excessive, it may be harmful depending on the application of the method. In different embodiments, the specific %H content is a hydrogen content of 29000 ppm or less, 6400 ppm or less, 1900 ppm or less, 890 ppm or less, 390 ppm or less, and even 140 ppm or less. Depending on the application, at least one of the powders having a specific hydrogen content (as defined in this document) may be preferred. In another embodiment, at least one of the powders of the mixture to be processed contains a specific %H content. All of the embodiments disclosed above are combinable with each other and with any other embodiment disclosed in this document regarding the "specific %H content", unless they are mutually exclusive. All values and ranges of the different embodiments disclosed above are combinable with each other and with any other embodiment disclosed in this document, unless they are mutually exclusive. For example, in one embodiment, the powder or powder mixture to be processed contains a specific %H content, where the specific %H content is a hydrogen content of 0.01 to 29000 ppm. Also, for example, in another embodiment, it is 0.6 to 6400 ppm. Also, for example, in another embodiment, it is 1 to 1900 ppm.

[0054] Additionally or alternatively, in some applications of the present method, ensuring a specific boron (%B) content after the pre-adjustment step may be important. In one embodiment, prior to applying the metal additive manufacturing (MAM) method, the powder or powder mixture to be processed contains a specific %B content. The feature of "specific %B content" is defined throughout this document in the form of different alternatives, which will be described in detail below. In different embodiments, the specific %B content is a boron content of 0.01 ppm or more, 0.6 ppm or more, 1 ppm or more, 21 ppm or more, 106 ppm or more, 360 ppm or more, 810 ppm or more, and even 3600 ppm or more. On the other hand, if the boron content is excessive, it may be harmful depending on the application of the method. In different embodiments, the specific %B content is a boron content of 0.9 wt% or less, 0.14 wt% or less, 340000 ppm or less, 14000 ppm or less, 4900 ppm or less, 1200 ppm or less, 690 ppm or less, 290 ppm or less, and even 84 ppm or less. Depending on the application, at least one of the powders having a specific boron content (as defined in this document) may be preferred. In another embodiment, at least one of the powders to be processed in the mixture contains a specific %B content. All of the embodiments disclosed above are combinable with each other and with any other embodiment disclosed in this document regarding the "specific %B content", as long as they are not mutually exclusive. All values and ranges of the different embodiments disclosed above are combinable with each other and with any other embodiment disclosed in this document, as long as they are not mutually exclusive. For example, in one embodiment, the powder or powder mixture to be processed contains a specific %B content, where the specific %B content is a boron content of 0.01 ppm to 0.9 wt%. Also, for example, in another embodiment, it is 0.6 ppm to 0.14 wt%. Also, for example, in another embodiment, it is 1 to 34000 ppm.

[0055] Optionally, the method may also include a step of changing the sphericity of the powder (or at least a part of the powder), also called spheroidization treatment, before the application of the shaping process. In one embodiment, the method also includes a step of applying spheroidization treatment. In this regard, the inventors have surprisingly found that the introduction of mechanical spheroidization treatment brings great advantages to the ultimately achievable mechanical properties of some components, particularly properties related to toughness, fatigue life, elastic limit, surface roughness and / or dimensional accuracy. The spheroidization treatment can be advantageously carried out at any time between the treatment of the powder or powder mixture and the shaping process. In many cases, it is advantageous to carry out the spheroidization treatment simultaneously (continuously) with the steps of other methods (for example, in different embodiments, the spheroidization treatment can be carried out during the treatment of the powder or powder mixture and / or integrated with the preconditioning treatment). In one embodiment, the spheroidization step is carried out simultaneously (continuously) with the steps of other methods. In another embodiment, the increase in sphericity after the application of the spheroidization step is at least 6%, at least 12%, at least 26%, at least 41%, and even at least 52%. In this regard, the inventors have also found that in some applications of the method, it is particularly advantageous to start from a powder with a low sphericity (as defined in this document) and obtain a powder with an appropriate sphericity (as defined in this document) after the spheroidization step. In different embodiments, the low sphericity is a sphericity of 69% or less, 59% or less, 49% or less, and even 29% or less. In another embodiment, the appropriate sphericity after the spheroidization step is 71% or more, 82% or more, 92% or more, and even 96% or more. Depending on the application, the spheroidization of the powder can be advantageously carried out by mechanical action without significantly increasing the temperature of the powder. In different embodiments, the temperature in the spheroidization step is 0.75*Tm or less, 0.49*Tm or less, 0.34*Tm or less, 0.24*Tm or less, and even 0.14*Tm or less, where Tm is the melting point of the powder to be treated in Kelvin. As a non-limiting example, the action of placing the powder between two parallel plates (performing relative movement between them in a parallel plane) can be mentioned. The movement of the plates is often a circular movement (helical movement, complex repetitive movement, each plate performing a different movement, etc.).In an alternative embodiment, to promote surface modification of the powder, a system for performing mixing and impact treatment by a high-speed mixer can be used to process the powder or powder mixture. Other examples can include the use of a vibratory mechanical grinder, the application of chemical treatment or technology, or the use of coatings. In many cases, each powder is individually spheroidized, but in certain special embodiments, two or more powders can be processed simultaneously, in which case Tm refers to the melting point in Kelvin of the powder mixture (as defined in this document) being processed. In one embodiment, at least one of the powders in the mixture should meet the temperature value in the above-described spheroidization process. In an alternative embodiment, at least two of the powders in the mixture should meet the temperature value in the above-described spheroidization process. In another alternative embodiment, all of the powders in the mixture should meet the temperature value in the above-described spheroidization process. In one embodiment, the temperature of the spheroidization process means the highest temperature reached in the spheroidization process. In an alternative embodiment, the temperature of the spheroidization process means the highest temperature reached in the spheroidization process, and that highest temperature is calculated excluding the temperature applied for less than the critical time (as defined in this document). In another alternative embodiment, the temperature of the spheroidization process means the average temperature reached in the spheroidization process. In another alternative embodiment, the temperature in the spheroidization step means the lowest temperature reached in the spheroidization step. In another alternative embodiment, the temperature in the spheroidization step means the lowest temperature reached in the spheroidization step, and that lowest temperature is calculated excluding the temperature applied for less than the critical time (as defined in this document). In an alternative embodiment, the temperature is applied to the main time. Depending on the application, spheroidization of the powder can also be carried out at a high temperature (higher than the temperature disclosed above). In such cases, for example, plasma, inductively coupled plasma, inductively coupled plasma, DC plasma jet, high-temperature remelting spheroidization technology, or fluidized bed spheroidization technology may also be used. However, the spheroidization process is not limited to the technologies described above. All of the embodiments disclosed above can be combined arbitrarily among themselves and with any other embodiment disclosed in this document, as long as they are not mutually exclusive.For example, in one embodiment, the method further includes a step of applying a spheroidization treatment to the powder or powder mixture to be further processed, and this spheroidization treatment is carried out at any point between the treatment of the powder or powder mixture and the shaping of the powder or powder mixture to be processed using the metal additive manufacturing (MAM) method. Here, the temperature of the spheroidization treatment is 0.75*Tm or less, where Tm is the melting point of the powder to be processed in Kelvin units.

[0056] In some embodiments, it may be advantageous to add other substances or materials to the powder or powder mixture to be processed before applying the metal additive manufacturing (MAM) method. Examples of substances or materials that can be added to the powder or powder mixture include, but are not limited to, metal materials, metals, metal-based alloys, organic materials, polymers, polymer materials, binders, resins, fluxes, lubricants, additives, dry coatings, fluidizing agents, nanoparticle additives, surface-functionalized nanoparticles, graphite, ceramic materials, reinforcing particles, ceramic particles, whiskers, graphene, nanotubes, carbon nanotubes, and / or mixtures thereof. These substances or materials can be added at any time before and / or after the application of the spheroidization treatment.

[0057] As described above, then, a component, or at least a part of a component, can be formed using the metal additive manufacturing (MAM) method (this step is also referred to as the "forming step"). In this document, the definition of the metal additive manufacturing (MAM) method includes the near-net shape manufacturing method described throughout this document. In particular, the definition of the metal additive manufacturing (MAM) method includes methods in which a component or at least a part of a component is manufactured using a mold or capsule, or a part thereof, and then filled and subjected to pressure and / or temperature. Also included are methods in which a component is manufactured by additive manufacturing (AM) technology. In one embodiment, the powder or powder mixture to be processed is formed into a component or a part of a component using the metal additive manufacturing (MAM) method.

[0058] Regarding this forming process, the inventors have found that depending on the application of the method, using the metal additive manufacturing (MAM) method at an appropriate temperature, such as in certain embodiments where the manufacturing component is a metal mold or die, leads to a very surprising improvement in efficiency, and the durability of the manufacturing component increases disproportionately to the increase in cost. Furthermore, it has also been found that using the metal additive manufacturing (MAM) method at an appropriate temperature can result in a very small crystal grain size for some components. In one embodiment, the temperature used in the metal additive manufacturing (MAM) method is an appropriate temperature. The feature of "appropriate temperature" is defined throughout this document in the form of different alternatives, which will be described in detail below. In different embodiments, the appropriate temperature is a temperature of 0.08*Tm or higher, 0.13*Tm or higher, and even 0.26*Tm or higher, where Tm is the melting point (as defined in this document) in Kelvin of the supplied powder or powder mixture. On the other hand, an excessive temperature may cause an undesirable cost increase depending on the application of the method. In different embodiments, the appropriate temperature is a temperature of 0.74*Tm or lower, 0.69*Tm or lower, 0.59*Tm or lower, 0.54*Tm or lower, 0.48*Tm or lower, and even 0.39*Tm or lower, where Tm is the melting point (as defined in this document) in Kelvin of the supplied powder or powder mixture. All the values and ranges of the different embodiments disclosed above are combinable with each other and with any other embodiment disclosed in this document, provided they are not mutually exclusive. For example, in one embodiment, the metal additive manufacturing (MAM) method is performed at an appropriate temperature, and the appropriate temperature is a temperature in the range of 0.08*Tm to 0.74*Tm, where Tm is the melting point in Kelvin of the supplied powder or powder mixture. Also, for example, in another embodiment, the metal additive manufacturing (MAM) method is performed at an appropriate temperature, and the appropriate temperature is a temperature in the range of 0.08*Tm to 0.69*Tm, where Tm is the melting point in Kelvin of the supplied powder or powder mixture. Also, for example, in another embodiment, the metal additive manufacturing (MAM) method is performed at an appropriate temperature, and the appropriate temperature is a temperature in the range of 0.13*Tm to 0.69*Tm, where Tm is the melting point in Kelvin of the supplied powder or powder mixture.Also, for example, in another embodiment, the metal additive manufacturing (MAM) method is performed at an appropriate temperature, and the appropriate temperature is a temperature of 0.08*Tm to 0.74*Tm, where Tm is the melting point in Kelvin of the metal powder with the lowest melting point among the powders of the supplied powder mixture. Also, for example, in another embodiment, the metal additive manufacturing (MAM) method is performed at an appropriate temperature, and the appropriate temperature is a temperature of 0.08*Tm to 0.69Tm, where Tm is the melting point in Kelvin of the metal powder with the lowest melting point among the powders of the supplied powder mixture. Also, for example, in another embodiment, the metal additive manufacturing (MAM) method is performed at an appropriate temperature, and the appropriate temperature is a temperature of 0.13*Tm to 0.69*Tm, where Tm is the melting point in Kelvin of the metal powder with the lowest melting point in the powders of the supplied powder mixture. Also, for example, in another embodiment, the metal additive manufacturing (MAM) method is performed at an appropriate temperature, and the appropriate temperature is a temperature of 0.08*Tm to 0.74*Tm, where Tm is the melting point in Kelvin of the metal powder with the lowest melting point in the powders of the supplied powder mixture. The melting point of such a metal powder is the temperature at which the first metal liquid is formed under equilibrium conditions. Also, for example, in another embodiment, the metal additive manufacturing (MAM) method is performed at an appropriate temperature, and the appropriate temperature is a temperature of 0.08*Tm to 0.69*Tm, where Tm is the melting point in Kelvin of the metal powder with the lowest melting point in the powders of the supplied powder mixture. The melting point of such a metal powder is the temperature at which the first metal liquid is formed under equilibrium conditions. Also, for example, in another embodiment, the metal additive manufacturing (MAM) method is performed at an appropriate temperature, and the appropriate temperature is a temperature of 0.13*Tm to 0.69*Tm, where Tm is the melting point in Kelvin of the metal powder with the lowest melting point in the powders of the supplied powder mixture. The melting point of such a metal powder is the temperature at which the first metal liquid is formed under equilibrium conditions. In some embodiments, it may be advantageous to determine the lower limit of the appropriate temperature using the following formula.

[0059]

Number

[0060] Here, Tm(Fe) represents the melting point of iron (under equilibrium conditions) in Kelvin, and A is a parameter selected from 3 / 23, 5 / 42, and further 4 / 29 in different embodiments. All the embodiments disclosed above, unless mutually exclusive, can be combined arbitrarily among themselves and with any other embodiment disclosed in this book regarding "appropriate temperature".

[0061] All the embodiments disclosed above, unless mutually exclusive, can be combined arbitrarily among themselves and with any other embodiment disclosed in this book. For example, in one embodiment, a method for manufacturing a component containing a metal includes the following steps: supplying a powder or a powder mixture composed of at least a metal or a metal-based alloy; applying a treatment to the powder or the powder mixture (where the treatment of the powder or the powder mixture includes the addition of energy to the powder or the powder mixture by mechanical action); shaping the powder or the powder mixture treated using a metal additive manufacturing (MAM) method at an appropriate temperature (where the appropriate temperature is a temperature of 0.74*Tm or less, and Tm is the melting point of the powder or the powder mixture in Kelvin).

[0062] As described above, different metal additive manufacturing (MAM) methods can be used to form a component or at least a part thereof. In one aspect of the present disclosure, the metal additive manufacturing (MAM) method includes the use of a mold or a capsule having the desired shape of the manufactured component (considering the shrinkage that occurs during the manufacturing process and the fact that the final shape is often achieved by some subtractive manufacturing such as machining, and / or other additive manufacturing processes), filling the powder or the powder mixture to be treated, and including the addition of pressure and / or temperature to the filled mold. In one embodiment according to this aspect of the present disclosure, the method includes the following steps: supplying the powder or the powder mixture; applying a treatment to the powder or the powder mixture, where the treatment of the powder or the powder mixture includes the addition of energy to the powder or the powder mixture through mechanical action; supplying the mold; filling the mold with the powder or the powder mixture to be treated; and applying pressure and / or temperature treatment to the filled mold.

[0063] A variety of materials can be used in the manufacture of a mold or at least a part thereof. Examples of materials that can be used in the manufacture of a mold, or at least a part thereof, include, but are not limited to, organic materials, polymers, polymer materials, elastomers, thermosetting polymers, thermoplastic polymers, amorphous polymers, amorphous thermoplastic polymers, non-polar polymers, crystalline polymers, semi-crystalline polymers, semi-crystalline thermoplastic polymers, and / or mixtures thereof. In one embodiment, at least a part of the mold is made of an organic material. In another embodiment, at least a part of the mold is made of a material containing a polymer and / or a polymer material. In another embodiment, the mold is made of a material containing a polymer and / or a polymer material. In another embodiment, at least a part of the mold is made of a material containing a polymer. In another embodiment, the mold is made of a material containing a polymer. In another embodiment, at least a part of the mold is made of a material containing a polymer material. In another embodiment, the mold is made of a material containing a polymer material. Throughout this document, unless otherwise specified, polymers include their copolymers. Examples of polymers or polymer materials that can be used in the manufacture of a mold, or at least a part thereof, include, but are not limited to, the following: Buton, phenol resin (PF), urea resin (UF), melamine resin (MF), polyester resin (UP), epoxy resin (EP), polyethylene sulfide (PPS), ether ketone (EK), polyimide (PI), polystyrene (PS), high impact polystyrene (HIPS), polystyrene copolymer, acrylonitrile copolymer, styrene copolymer, acrylonitrile-butadiene-styrene (ABS), styrene-acrylonitrile (SAN), polycarbonate (PC), polyphenylene oxide (PPO), vinyl polymer (vinyl and related polymers), polyvinyl chloride (PVC), acrylic polymer, polymethyl methacrylate (PMMA), polycaprolactone (PCL), porous polycaprolactone (PCL), polyvinyl acetate (PVA), Kollidon VA64, Kollidon 12PF, polybutylene terephthalate (PBT), polyoxymethylene (POM), polyethylene terephthalate (PET), polyolefin polymer,Polymers containing ethylene monomer, polyethylene (PE), high-density polyethylene (HDPE), low-density polyethylene (LDPE), polymers containing propylene monomer, polypropylene (PP), polymers containing monomers linked by amide bonds, polyamide (PA), PA11, PA11 family materials, PA12, PA12 family materials, PA6, PA6 family materials, PA6-3-T, PA46, polyamideimide (PAI), polyethersulfone (PES), polyphenylsulfone (PPSU), polyetherimide (PEI), polysulfone (PSU), polyparaphenylene (PPP), polyetheretherketone (PEEK), polyetherketone (PEK), liquid crystal polymer (LCP), perfluoroalkoxyalkane (PFA), ethylene tetrafluoroethylene (ETFE), polychlorotrifluoroethylene (PCTFE), polyvinylidene fluoride (PVDF), polymethylpentene (PMP), polyphenylene ether (PPE), nylon, biodegradable polymers, polar polymers, non-polar polymers, agricultural polymers (e.g., biomass from agricultural resources), biodegradable polymers derived from microorganisms (e.g., PHA, PHB, etc.), biodegradable polymers derived from biotechnology (e.g., polylactic acid, polyactide, etc.), biodegradable polymers derived from petrochemical products (e.g., polycaprolactone, PEA, aromatic polyesters, etc.), and / or mixtures thereof. In one embodiment, the mold is made of an organic material. In another embodiment, the mold is made of a polymer. In another embodiment, the mold is made of a polymeric material. In another embodiment, the mold is made of at least two different polymers. In another embodiment, the mold is made of an elastomer. In another embodiment, the mold is made of a thermosetting polymer. In another embodiment, the mold is made of a thermoplastic polymer. Depending on the application, the excellent dimensional accuracy of amorphous polymers (both thermosetting and thermoplastic) can be beneficial. In another embodiment, the mold is made of an amorphous polymer. In this regard, depending on the application, it may be beneficial to combine the excellent dimensional accuracy and reshaping of amorphous thermoplastic resins. In one embodiment, the mold is made of an amorphous thermoplastic polymer. In another embodiment, the mold is made of a crystalline polymer. In another embodiment,The mold is made of a semi-crystalline polymer. In another embodiment, the mold is made of a semi-crystalline thermoplastic polymer. In another embodiment, the mold is made of PF. In another embodiment, the mold is made of UF. In another embodiment, the mold is made of MF. In another embodiment, the mold is made of UP. In another embodiment, the mold is made of EP. In another embodiment, the mold is made of Bayton. In another embodiment, the mold is made of PPS. In another embodiment, the mold is made of EK. In another embodiment, the mold is made of PI. In another embodiment, the mold is made of PS. In another embodiment, the mold is made of high impact polystyrene (HIPS). In another embodiment, the mold is made of a copolymer of polystyrene. In another embodiment, the mold is made of PCL. In another embodiment, the mold is made of porous PCL. In another embodiment, the mold is made of PVA. In another embodiment, the mold is made of Kollidon VA64. In another embodiment, the mold is made of Kollidon 12PF. In another embodiment, the mold is made of a polymer containing an aromatic group. In another embodiment, the mold is made of polymethyl methacrylate. In another embodiment, the mold is made of a copolymer containing acrylonitrile. In another embodiment, the mold is made of a copolymer containing styrene. In another embodiment, the mold is made of ABS. In another embodiment, the mold is made of SAN. In another embodiment, the mold is made of PC. In another embodiment, the mold is made of PPO. In another embodiment, the mold is made of a vinyl polymer (vinyl and related polymers). In another embodiment, the mold is made of PVC. In another embodiment, the mold is made of an acrylic polymer. In another embodiment, the mold is made of PMMA. In another embodiment, the mold is made of amorphous PP. In another embodiment, the mold is made of polybutylene PBT. In another embodiment, the mold is made of POM. In another embodiment, the mold is made of PET. In another embodiment, the mold is made of a thermoplastic polymer resin of the polyester family. In another embodiment, the mold is made of a polyolefin polymer. In another embodiment, the mold is made of a polymer composed of ethylene monomers. In another embodiment,The mold is made of PE. In another embodiment, the mold is made of HDPE. In another embodiment, the mold is made of LDPE. In another embodiment, the mold is made of a polymer containing propylene monomers. In another embodiment, the mold is made of PP. In another embodiment, the mold is made of a polymer containing monomers bonded by amide bonds. In another embodiment, the mold is made of PA. In another embodiment, the mold is made of aliphatic polyamide. In another embodiment, the mold is made of nylon. In another embodiment, the mold is made of a material of the PA11 family. In another embodiment, the mold is made of a material of the PA12 family. In another embodiment, the mold is made of PA12. In another embodiment, the mold is made of PA6. In another embodiment, the mold is made of a material of the PA6 family. In another embodiment, the mold is made of PA6-3-T. In another embodiment, the mold is made of PA46. In another embodiment, the mold is made of PAI. In another embodiment, the mold is made of PES. In another embodiment, the mold is made of PPSU. In another embodiment, the mold is made of PEI. In another embodiment, the mold is made of PSU. In another embodiment, the mold is made of PPP. In another embodiment, the mold is made of PEEK. In another embodiment, the mold is made of PEK. In another embodiment, the mold is made of LCP. In another embodiment, the mold is made of PFA. In another embodiment, the mold is made of ETFE. In another embodiment, the mold is made of PCTFE. In another embodiment, the mold is made of PVDF. In another embodiment, the mold is made of PMP. In another embodiment, the mold is made of PPE. In another embodiment, the mold is made of a biodegradable polymer. In another embodiment, the mold is made of a polar polymer. In another embodiment, the mold is made of a non-polar polymer. In another embodiment, the mold is made of an agricultural polymer. In another embodiment, the mold is made of a biodegradable polymer derived from microorganisms. In another embodiment, the mold is made of a biodegradable polymer derived from biotechnology. In another embodiment, the mold is made of a biodegradable polymer derived from petrochemical products. In one embodiment, when the mold is made of a specific type of polymer,It means that the main amount of the polymer material of the mold is made of the said material. As another alternative, when the mold is made of a specific type of polymer, it means that the main amount of the polymer material of the mold is made of the said material or a related material. In different embodiments, the main amount of the polymer material means 6% or more by volume, 26% or more by volume, 56% or more by volume, 76% or more by volume, 96% or more by volume, and even 100% by volume. In alternative embodiments, the percentages disclosed above are in weight (wt%). For certain applications, it may be beneficial to use materials with a corresponding difference in viscosity when measured at 20°C and 250°C. In one embodiment, the material used to manufacture the mold is a material with a corresponding difference in viscosity when measured at 20°C and 250°C. In another embodiment, the material used to manufacture the mold is a material with different viscosities at 20°C and 250°C. In another embodiment, the material used to manufacture the mold is a material with a viscosity at 250°C that is less than half of that at 20°C. In another embodiment, the viscosity is one-tenth. In another embodiment, the viscosity is one-hundredth. As disclosed previously, depending on the application, the use of semi-crystalline thermoplastic polymers may be advantageous for manufacturing the mold or at least a part of the mold. However, depending on the application, in addition to the fact that the mold is made of semi-crystalline thermoplastic polymers, it may be important to select semi-crystalline thermoplastic polymers with an appropriate melting point. Of course, throughout the rest of this book, unless otherwise specified, the same applies when the aforementioned types of materials (in this case semi-crystalline thermoplastic resins) are the main materials of the mold, or when the entire mold is manufactured with such materials. In different embodiments, the appropriate melting point is lower than 290°C, lower than 190°C, lower than 168°C, lower than 144°C, lower than 119°C, and even lower than 98°C. Depending on the application, semi-crystalline thermoplastic polymers with too low a melting point may not be practical without the risk of distortion. In different embodiments, the appropriate melting point is higher than 28°C, higher than 55°C, higher than 105°C, higher than 122°C, higher than 155°C, and even higher than 175°C. Throughout this book, unless otherwise specified,The melting point of any polymer is measured in accordance with ISO 11357-1 / -3:2016. In one embodiment, the melting point of the polymer is measured applying a heating rate of 20 °C / min. Depending on the application, the selection at an appropriate crystallinity level of the semi-crystalline thermoplastic polymer may be important. In different embodiments, the appropriate crystallinity level is higher than 12%, higher than 32%, higher than 52%, higher than 76%, higher than 82%, and even higher than 96% crystallinity. It means crystallinity. In one embodiment, the crystallinity value disclosed above is measured using X-ray diffraction (XRD) technology. In an alternative embodiment, the crystallinity value disclosed above is obtained using differential scanning calorimetry (DSC). In one embodiment, the crystallinity is measured by applying a heat release rate of 10 °C / min. Depending on the application, in addition to the fact that the mold is made of a polymer, it may be important to select the polymer to have an appropriate molecular weight. In one embodiment, the material of the mold consists of a polymer material, and its main part (as defined in this document) has a sufficient molecular weight. The feature of "main part" is defined throughout this document in different alternative forms, which will be described in detail below. In one embodiment, the main part is 16% or more by volume. In an alternative embodiment, the main part is 36% vol or more. In another alternative embodiment, the main part is 56% vol or more. In another alternative embodiment, the main part is 76% vol or more. In another alternative embodiment, the main part is 86% vol or more. In another alternative embodiment, the main part is 96% vol or more. In another alternative embodiment, the main part is 100% vol. In another alternative embodiment, the percentages disclosed above are in weight (wt%). All the embodiments disclosed above are combinable with each other and with any other embodiment disclosed in this document related to the "main part", unless they are mutually exclusive. In different embodiments, the sufficient molecular weight is 8500 or more, 12000 or more, 45000 or more, 65000 or more, 85000 or more, 105000 or more, and even 285000 or more. Depending on the application, contrary to the results obtained sensually, there may be no merit in having a high molecular weight. In another embodiment, the molecular weight of most of the polymer phase (as defined in this document) of the mold material is maintained at a sufficiently low molecular weight. The feature of "most" is defined throughout this document in different alternative forms, which will be described in detail below. In one embodiment, "most" refers to 55% or more by volume. In an alternative embodiment, "most" refers to 66% or more by volume. In another alternative embodiment, "most" refers to 55% or more by volume. In another alternative embodiment, "most" refers to 78% or more by volume. In another alternative embodiment, "most" refers to 86% or more by volume. In another alternative embodiment, "most" refers to 96% or more by volume.In another alternative embodiment, "substantially" refers to 100% by volume. In another alternative embodiment, the percentages disclosed above are by weight (wt%). All of the embodiments disclosed above, unless mutually exclusive, can be combined with each other and with any other embodiment disclosed herein related to "substantially" in any combination. In different embodiments, the sufficiently low molecular weight is 4,900,000 or less, 900,000 or less, 190,000 or less, 90,000 or less, and even 74,000 or less. Depending on the application, in addition to the fact that the mold is made of a polymer, the selection of the polymer at an appropriate heat deflection temperature (HDT) can be advantageous. In one embodiment, the material of the mold is made of a polymer material, and a major portion (as defined herein) has a sufficiently low heat deflection temperature measured at a load of 1.82 MPa (also referred to as "1.82 MPa HDT"). In different embodiments, "sufficiently low" means 380 °C or less, 280 °C or less, 190 °C or less, 148 °C or less. Depending on the application, a lower temperature may be desirable. In different embodiments, "sufficiently low" means 118 °C or less, 98 °C or less, and even 58 °C or less. In another embodiment, the material of the mold is made of a polymer material, and a major portion (as defined herein) has a sufficiently low heat deflection temperature measured at a load of 0.455 MPa (also referred to as "0.455 MPa HDT"). In different embodiments, "sufficiently low" means 440 °C or less, 340 °C or less, 240 °C or less, 190 °C or less, 159 °C or less, 119 °C or less, and even 98 °C or less. An overly low heat deflection temperature may not be suitable for some applications. In another embodiment, the material of the mold is made of a polymer material, and a major portion (as defined herein) has a sufficiently high 1.82 MPa HDT. In another embodiment, "sufficiently high" means 32 °C or more, 52 °C or more, 72 °C or more, 106 °C or more, 132 °C or more, 152 °C or more, 204 °C or more, and even 250 °C or more. In another embodiment, the material of the mold is made of a polymer material, and a major portion (as defined herein) has a sufficiently high 0.455 MPa HDT. In another embodiment, "sufficiently high" means 32 °C or more, 52 °C or more, 72 °C or more, 106 °C or more, 132 °C or more, 152 °C or more, 204 °C or more, and even 250 °C or more.In one embodiment, the HDT value is determined according to the ASTM D648-07 standard test method. In an alternative embodiment, the HDT is determined according to the ISO 75-1:2013 standard. In one embodiment, the HDT is measured at a heating rate of 50°C / h. In another alternative embodiment, the HDT reported as the closest material in the UL IDES Prospector Plastic Database on January 29, 2018 is used. As with all other aspects, there are applications where the HDT of the material used in mold manufacturing is not a problem, unless otherwise specified. Depending on the application, in addition to the fact that the mold is made of polymer, it may be important that the polymer is selected to have an appropriate Vicat softening point. In different embodiments, the appropriate Vicat softening point is 314°C or less, 248°C or less, 166°C or less, 123°C or less, 106°C or less, 74°C or less, and even 56°C or less. Depending on the application, a mold made of a material with a specific Vicat softening point is preferred. In different embodiments, the appropriate Vicat softening point is 36°C or more, 56°C or more, 76°C or more, 86°C or more, 106°C or more, 126°C or more, 156°C or more, and even 216°C or more. In one embodiment, the Vicat softening point is determined according to the ISO 306 standard. In one embodiment, the Vicat softening point is determined at a heating rate of 50°C / h. In one embodiment, the Vicat softening point is measured under a load of 50N. In an alternative embodiment, the Vicat softening point is measured according to the ASTM D1525 standard. In another alternative embodiment, the Vicat softening point is measured by the B50 method. In another alternative embodiment, the Vicat softening point is measured by the A120 method, and 18°C is subtracted from the measured value. In another alternative embodiment, the Vicat softening point is determined according to the ISO 10350-1 standard using the B50 method. In another alternative embodiment, the Vicat hardness reported as the closest material in the UL IDES Prospector plastic database on January 29, 2018 is used. Depending on the application, in addition to the fact that the mold is made of polymer, it may be advantageous to confirm that the polymer has an appropriate classification in the Ensinger Manual of Engineering Plastics. In one embodiment, the latest available version as of January 21, 2018 is used.In another embodiment, version 10 / 12 E9911075A011GB is used. In another embodiment, a polymer classified as a high-performance plastic is used. In another embodiment, a polymer classified as an engineering plastic is used. In one embodiment, a polymer classified as a standard plastic is used. Depending on the application, the use of a polymer material having a particularly low softening point may be particularly advantageous, especially in at least certain parts of the mold. In different embodiments, a particularly low softening point means a melting point lower than 190°C, lower than 130°C, lower than 98°C, lower than 79°C, lower than 69°C, and even lower than 49°C. On the other hand, if the melting point is too low, it can be disadvantageous. In different embodiments, the melting point is higher than -20°C, higher than 28°C, higher than 42°C, higher than 52°C, and even higher than 62°C. Depending on the application, in addition to the fact that the mold is made of a polymer, it may be advantageous to select the polymer to have an appropriate glass transition temperature (Tg). The feature of "appropriate glass transition temperature" is defined throughout this document in the form of different alternatives that will be described in detail below. In different embodiments, the appropriate glass transition temperature is higher than -260°C, higher than -230°C, higher than -190°C, and even higher than -90°C. If the value is excessive, it can be disadvantageous depending on the application. In different embodiments, the appropriate glass transition temperature is lower than 169°C, lower than 109°C, lower than 69°C, lower than 49°C, lower than 9°C, lower than -11°C, lower than -32°C, and even lower than -51°C. All of the embodiments disclosed above can be combined arbitrarily among themselves and with any other embodiment disclosed in this document related to the "appropriate glass transition temperature", unless they are mutually exclusive. Throughout this document, unless otherwise specified, the glass transition temperature (Tg) of any polymer is measured by differential scanning calorimetry (DSC) in accordance with ASTM D3418-12. All of the values and ranges of the different embodiments disclosed above can be combined arbitrarily among themselves and with any other embodiment disclosed in this document, unless they are mutually exclusive.In certain embodiments, it may be advantageous to use the polymers and polymer materials described in patent application number WO2021165545A1, the content of which is incorporated herein by reference in its entirety. The inventors have discovered that the presence of other materials can also be advantageous for some mold manufacturing. In some embodiments, the mold may include, but is not limited to, other materials such as metal particles, ceramic particles, reinforcing particles (as defined herein), and / or combinations thereof. Also, in a particular embodiment, the mold can be made of a polymer-free material. Depending on the application, manufacturing the mold from different materials can be advantageous. In one embodiment, the mold is made of at least two different materials. In another embodiment, the mold is made of at least three different materials. All of the embodiments disclosed above are combinable with each other and with any of the other embodiments disclosed herein, unless mutually exclusive. For example, in one embodiment, the molding process by the metal additive manufacturing (MAM) method of the powder or powder mixture to be processed includes the following steps: supplying a mold formed of a material made of a polymer material; filling the mold with the powder or powder mixture to be processed; applying pressure and / or temperature treatment to the filled mold.

[0064] A variety of techniques can be used to manufacture a mold or at least a part thereof. This includes, for example, conventional polymer molding techniques such as blow molding, extrusion molding, injection molding, drawing molding, rotational molding, filament winding molding, thermoforming, compression molding, and / or combinations thereof, as well as additive manufacturing (AM) techniques, but is not limited thereto. When manufacturing a mold or at least a part thereof, the use of additive manufacturing (AM) techniques can be particularly advantageous, especially for reasons such as design flexibility. In one embodiment, the mold or at least a part thereof is manufactured by additive manufacturing (AM) techniques. Examples of additive manufacturing (AM) techniques that can be used to manufacture a mold or at least a part thereof include extrusion-based additive manufacturing techniques such as fused deposition modeling (FDM) or fused filament fabrication (FFF), vat photopolymerization-based additive manufacturing techniques such as stereolithography (SLA), digital light processing (DLP), continuous digital light processing (CDLP), digital light synthesis (DLS), or techniques based on continuous liquid interface production (CLIP), material jetting-based additive manufacturing techniques such as material jetting (MJ) or drop-on-demand (DOD), binder jetting-based additive manufacturing techniques such as multi-jet fusion (MJF) or binder jetting (BJ) (but not limited thereto), powder bed fusion-based additive manufacturing techniques such as selective laser sintering (SLS) or selective heat sintering (SHS) and / or combinations thereof. In one embodiment, at least a part of the mold is manufactured by an additive manufacturing technique selected from FDM, FFF, SLA, SHS, DLP, CDLP, DLS, CLIP-based techniques, MJ, DOD, MJF, BJ, SLS, and / or combinations thereof. In another embodiment, at least a part of the mold is manufactured by an additive manufacturing technique selected from FDM, SLA, MJ, MJF, BJ, SLS, and / or combinations thereof. Depending on the application, the use of multiple techniques is preferred for mold manufacturing. Depending on the application of the method, the manufacture of molds in different parts that can be assembled can be advantageous. In one embodiment, the mold consists of at least two assembled parts.Alternatively or additionally, it may be advantageous to manufacture the mold by using different manufacturing techniques. In one embodiment, the mold is manufactured using at least two different manufacturing techniques. All of the embodiments disclosed above are combinable with each other and with any other embodiment disclosed herein, unless mutually exclusive. For example, in one embodiment, the step of shaping a powder or powder mixture to be processed by using a metal additive manufacturing (MAM) method includes: supplying a mold at least partially manufactured by using an additive manufacturing (AM) technique, where the mold is made of a polymeric material; filling the mold with the powder or powder mixture to be processed; applying a pressure and / or temperature treatment to the filled mold.

[0065] Depending on the application, it may be advantageous to use a mold that includes elements that do not need to impart a shape to the powder or powder mixture, such as a support element. In one embodiment, the mold consists of elements that do not need to impart a shape to the powder or powder mixture to be processed. In this regard, the inventors have found that in certain embodiments, it may be particularly advantageous to manufacture from different materials for the mold and the support element (such as materials having different solubilities in a solvent).

[0066] The manufactured mold can be filled with the powder or powder mixture to be processed. In this regard, the inventors have discovered that the filling density of the mold is important depending on the application of this method. For example, this is to avoid internal defects and ensure uniform density and dimensional accuracy. This is particularly important in the application of components with internal characteristics. In certain applications, the inventors have discovered the advantages of using particularly low filling densities, such as a porous structure. In different embodiments, the filling density of the mold is 12% or more, 21% or more, 31% or more, and even 42% or more. In these applications, it may be important to ensure that the filling density does not become excessively high. In different embodiments, the filling density of the mold is 84% or less, 74% or less, 69% or less, 64% or less, and even 59% or less. All values and ranges of the different embodiments disclosed above are combinable with each other and with any other embodiment disclosed in this document, as long as they are not mutually exclusive. For example, in one embodiment, the filling density is 12% to 84%. Also, for example, in another embodiment, it is 21% to 84%. Also, for example, in another embodiment, it is 21% to 74% or less. In many cases, depending on the application, it may be desirable to have a higher filling density. In different embodiments, the filling density of the mold is 51% or more, 56% or more, 61% or more, 71% or more, and even 81% or more. On the other hand, if the filling density is excessive, it can be particularly harmful to certain components with complex shapes that require control of, for example, warping, distortion, loss of dimensional control, and partial cracking. In different embodiments, the filling density of the mold is 96% or less, 93% or less, 88% or less, 84% or less, and even 78% or less. All values and ranges of the different embodiments disclosed above are combinable with each other and with any other embodiment disclosed in this document, as long as they are not mutually exclusive. For example, in one embodiment, the filling density is 51% to 96%. Also, for example, in another embodiment, it is 56% to 96%. Also, for example, in another embodiment, it is 61% to 93%. Depending on the application, how the mold is filled can be important.To properly sediment the powder or powders within the mold, various methods can be advantageously used, including but not limited to vibrating the mold. In one embodiment, the mold is vibrated during at least a portion of the filling of the powder or powder mixture being processed. In certain embodiments, it may be advantageous to use the filling method described in patent application number WO2021165545A1. The entire content thereof is incorporated herein by reference in its entirety.

[0067] For certain applications, it may be important to seal the filled mold to prevent fluid from penetrating the mold. In one embodiment, the filled mold is sealed. The mold can be sealed in various ways, such as with glue, adhesive, caulking, sealing material, use of a heat source, fusing of the mold and lid, application of additional polymer material, and / or sealing of the mold around extensions (e.g., tubes used in some embodiments to fill the mold and / or evacuate the mold), and / or combinations thereof. In some embodiments, the sealing of the mold is simplified and may be simplified for closing the mold. In some embodiments, the sealing of the mold is highly simplified and may be simplified for closing the mold. Depending on the application, the use of a cover-type mold (e.g., pressure transfer container, polymer film, bag, vacuum bag, coating, conformal coating, etc.) that can be placed over the filled mold may be advantageous. In different embodiments, the cover-type mold is used as a vacuum container and a vacuum of 790 mbar or more, 490 mbar or more, 90 mbar or more, 40 mbar or more, and even 9 mbar or more is created. Depending on the application, maintaining a controlled high vacuum level within the mold is advantageous. In one embodiment, the cover-type mold is used as a vacuum-tight container and a controlled high vacuum is applied to the filled mold. In another embodiment, the controlled high vacuum level is 0.9 mbar or less, 0.09 mbar or less, 0.04 mbar or less, 0.009 mbar or less, 0.0009 mbar or less, and even 0.00009 mbar or less. For certain applications, excessive vacuum can be harmful. In different embodiments, the controlled high vacuum level is 10 -10 mbar or more, 10 -8 mbar or more, 10 -6 mbar or more, and even 10 -4It is above mbar. In certain embodiments, it may be advantageous to use the mold sealing method described in patent application number WO2021165545A1. The content thereof is incorporated herein by reference in its entirety. All values and ranges of the different embodiments disclosed above are combinable with each other and with any other embodiments disclosed herein, provided they are not mutually exclusive.

[0068] As described above, components can be formed by applying pressure and / or temperature treatment to the filled mold. Depending on the application, the atmosphere used in the pressure and / or temperature treatment can be important. In one embodiment, the pressure and / or temperature treatment consists of using a properly designed atmosphere (as defined herein). Depending on the application, it may also be advantageous to change the atmosphere inside the furnace or pressure vessel during the treatment. In one embodiment, the pressure and / or temperature treatment includes the use of at least two different atmospheres. The applied pressure and / or temperature can parti...

Claims

1. A method for manufacturing a component made of metal, comprising the following steps: - A step of supplying a powder or a powder mixture; - A step of applying a treatment to the powder or the powder mixture, the treatment including applying energy to the powder or the powder mixture by mechanical action; and - A step of shaping the treated powder or powder mixture using a metal additive manufacturing (MAM) method.

2. The method according to claim 1, wherein the supplied powder or powder mixture consists of at least a metal or a metal-based alloy.

3. The method according to claim 1 or 2, wherein the metal or metal-based alloy is selected from the following: iron, iron-based alloy, carbonyl iron, steel, stainless steel, nickel, nickel-based alloy, copper, copper-based alloy, chromium, chromium-based alloy, cobalt, cobalt-based alloy, molybdenum, molybdenum-based alloy, manganese, manganese-based alloy, aluminum, aluminum-based alloy, tungsten, tungsten-based alloy, titanium, titanium-based alloy, lithium, lithium-based alloy, magnesium, magnesium-based alloy, niobium, niobium-based alloy, zirconium, zirconium-based alloy, silicon, silicon-based alloy, tin, tin-based alloy, tantalum, tantalum-based alloy, zinc, zinc-based alloy, lead, lead-based alloy, gold, gold-based alloy, silver, silver-based alloy and / or a mixture thereof.

4. The method according to any one of claims 1 to 3, wherein the metal additive manufacturing (MAM) method is carried out at an appropriate temperature, and the appropriate temperature is a temperature of 0.08*Tm to 0.74*Tm, where Tm is the melting point of the supplied powder or powder mixture in Kelvin.

5. The method according to any one of claims 1 to 4, wherein the treatment of the powder or the powder mixture comprises introducing the powder or the powder mixture into a container containing a processing material and applying a rotational movement and / or vibration.

6. The method according to any one of claims 1 to 5, wherein the treatment of the powder or the powder mixture consists of interparticle diffusion and / or welding.

7. The method according to claim 5 or 6, wherein at least a part of the processing material is spherical with a sphericity of 0.66 or more, a diameter of 1.2 mm to 89 mm, and a rotational speed of the container of 46 to 11900 rpm.

8. The method according to any one of claims 5 to 7, wherein the speed of the processing material is 0.001 to 290 m / s and the average impact frequency is 0.01 to 39000 Hz.

9. The ratio of the volume of the processing material in the container is calculated by dividing the volume occupied by the processing material by the volume of the container and multiplying by 100, and all volumes are measured in m ３ and the ratio is 6% to 84%. Here, the ratio of the powder or powder mixture in the container is the value obtained by dividing the volume occupied by the powder or powder mixture by the volume of the container and multiplying by 100, and all volumes are measured in m ３ and the ratio is 3% to 81%. Here, the weight ratio of the processing material to the material to be processed is the value obtained by dividing the weight of the processing material by the weight of the powder or powder mixture, and all weights are in grams and are between 490:1 and 7:

1. The method according to any one of claims 5 to 8.

10. The treatment of the powder or powder mixture consists of the application of a vacuum of 510 to 1.6*10 －１０ mbar, and / or pressurization of 0.12 to 9.8 MPa during at least part of the treatment, and / or the application of a temperature of 0.16*Tm to 0.74*Tm, where Tm is the melting point in Kelvin of the supplied powder or powder mixture, according to any of claims 1 to 9.

11. The method according to any one of claims 1 to 10, wherein the energy introduced into the powder or powder mixture in the process is 11 to 490 J / (g*hit).

12. In the step of applying a treatment to the powder or powder mixture, the value of parameter KA1 is 2.88 to 4900, and KA1 = EEC / (V 粉体 *ρ 粉体 ); where EEC is the electrical energy consumed during the treatment of the powder or powder mixture, expressed in units of MJ, V 粉体 is the volume of the powder or powder mixture in the container, expressed in units of dm ３ , ρ 粉体 is the average density of the powder or powder mixture in the container, expressed in units of kg / dm ３ . The method according to any one of claims 1 to 11.

13. In the step of applying a treatment to the powder or powder mixture, the value of the parameter KA2 is from 0.3 to 4900, and KA2 = Coeff * 1 / (V 粉体 * ρ 粉体 + V 加工材料 * ρ 加工材料 ) * EEC, where EEC is the electrical energy consumed during the treatment of the powder or powder mixture, expressed in units of MJ, V 粉体 is the volume of the powder or powder mixture in the container, expressed in units of dm ３ ρ 粉体 is the average density of the powder or powder mixture in the container, expressed in units of kg / dm ３ V 加工材料 is the volume of the processing material in the container, expressed in units of dm ３ ρ 加工材料 is the average density of the processing material in the container, expressed in units of kg / dm ３ and Coeff is 0.

89. The method according to any one of claims 1 to 12.

14. The average dislocation density (MDD) of the powder or powder mixture after the treatment is 1.2 * 10 １２ ~9.8 * 10 １８ m －２ , and the method according to any one of claims 1 to 13.

15. The method according to any one of claims 1 to 14, wherein the average dislocation density significantly increases by 1.5 times or more during the application of the method steps and then significantly decreases by 0.038 times or more.

16. During the application of the method engineering, there is a significant increase in the value of PAD1, where a significant increase in PAD1 means adding 2 to the value of PAD1, and PAD1 = 1 * 10 －６ *√MDD, where MDD is the average dislocation density in m －２ The method according to any one of claims 1 to 15, which is the average dislocation density in.

17. During the application of the method engineering, there is a significant increase and then a significant decrease in the value of PAD1, and PAD1 = 1 * 10 －６ *√MDD, where MDD is in units of m －２ is the average dislocation density expressed in, where a significant increase in PAD1 means adding 2 to the value of PAD1, and a significant decrease in PAD1 means subtracting 2 from the value of PAD1, the method according to any one of claims 1 to 16.

18. The method according to any one of claims 1 to 17, further comprising the following step: subjecting the powder or powder mixture to be treated to a pretreatment step.

19. The method according to any one of claims 1 to 18, further comprising the following step: applying a spheroidization treatment to the powder or powder mixture to be treated, and the spheroidization treatment is carried out at any time between the treatment of the powder or powder mixture and the shaping of the powder or powder mixture treated using the metal additive manufacturing (MAM) method, where the temperature of the spheroidization treatment is 0.75*Tm or less, and Tm is the melting point of the powder to be treated in Kelvin units.

20. The step of shaping the powder or powder mixture treated using the metal additive manufacturing (MAM) method comprises the following, for the method according to any one of claims 1 to 19: supplying a mold made of a material composed of a polymer material; filling the mold with the powder or powder mixture to be treated; and applying a pressure and / or temperature treatment to the filled mold.

21. The step of shaping the powder or powder mixture treated using the metal additive manufacturing (MAM) method comprises the following, for the method according to any one of claims 1 to 20: supplying a mold at least partially manufactured using additive manufacturing (AM) technology, and the mold is made of a material composed of a polymer material; filling the mold with the powder or powder mixture to be treated; and applying a pressure and / or temperature treatment to the filled mold.

22. The method according to any one of claims 1 to 21, wherein the pressure and / or temperature treatment consists of the application of a temperature of 0.16*Tm to 0.94*Tm, where Tm is the melting point of the supplied powder or powder mixture in Kelvin units, and a pressurization of 6 to 2100 MPa.

23. The step of shaping a powder or powder mixture processed using the metal additive manufacturing (MAM) method consists of forming a component or at least a part thereof by additive manufacturing (AM) technology, where the additive manufacturing (AM) technology further includes the use of organic materials and further includes a step of applying pressure and / or temperature treatment, the treatment consisting of pressurization from 6 to 2100 MPa, where the pressure and / or temperature treatment is applied before and / or during the application of the debinding treatment, the method according to any one of claims 1 to 22.

24. The method according to any one of claims 1 to 23, further comprising the following step: applying a fixing step for setting the levels of %C, %O, %N, %H and / or %B in the metal part of the component.

25. The method according to any one of claims 1 to 24, further comprising the following step: performing a densification treatment, where the densification treatment consists of applying a pressure from 1 mbar to 4900 bar and a temperature from 0.36*Tm to 0.88*Tm, where Tm is the melting point in Kelvin of the supplied powder or powder mixture.

26. The method according to any one of claims 1 to 25, further comprising the following step: joining different parts to create a larger component.

27. The method according to any one of claims 1 to 26, further comprising the following step: performing a densification treatment, where the densification treatment consists of applying a pressure from 160 to 4900 bar and a temperature from 0.45*Tm to 0.92*Tm, where Tm is the melting point in Kelvin of the supplied powder or powder mixture.

28. The method according to any one of claims 1 to 27, further comprising the following step: infiltrating at least a part of the component with an infiltrant.

29. The method according to any one of claims 1 to 28, further comprising the following step: performing thermo-mechanical treatment, surface conditioning, machining, and / or a combination thereof.

30. The method according to any one of claims 1 to 29, wherein the component made of metal comprises at least 16% of the atoms of the powder or powder mixture being processed.

31. The method according to any one of claims 1 to 30, wherein the component made of metal comprises at least one material selected from the following: An RAFM material having the following composition, where all percentages are by weight percent: %C: 0.01 to 0.29 (preferably 0.089 to 0.15, more preferably around 0.11); %Cr: 6.6 to 10.9 (preferably 8.5 to 9.5), %V: 0.01 to 0.49 (preferably 0.15 to 0.25), %Ta: 0.001 to 0.8 (preferably 0.05 to 0.09), %W: 0.1 to 4.9 (preferably 1 to 2), %Ti: 0.0001 to 0.9 (preferably 0.0001 to 0.09), %Mn: 0.06 to 1.3 (preferably 0.3 to 0.6), %P and / or %S: 0.0001 to 0.05 (preferably 0.0005 to 0.007), %Ni, %Mo, %Cu, %Nb, %Al, %B, %Co < 0.09 (preferably < 0.009, more preferably < 0.004, even more preferably < 0.0009), %Si: 0.0001 to 0.29 (preferably 0.001 to 0.08), %As + %Sn + %Sb + %Zr: 0.0001 to 0.09 (preferably 0.005 to 0.05), %N: 0.001 to 0.12 (preferably 0.015 to 0.045), %O: 0.0001 to 1.2 (preferably 0.0005 to 0.01); %REE + %Sc + %Y: 0 to 2.9 (preferably 0 to 0.2); the balance consists of iron and trace elements, and the total of all trace elements is less than 1.4; or An ODS-RAFM material having the following composition, where all percentages are given in weight percent: %C: 0.01 to 0.29 (preferably 0.089 to 0.015, more preferably around 0.11); %Cr: 6.6 to 10.9 (preferably 8.5 to 9.5), %V: 0.01 to 0.49 (preferably 0.15 to 0.25), %Ta: 0.001 to 0.8 (preferably 0.05 to 0.09), %W: 0.1 to 4.9 (preferably 1 to 2), %Ti: 0.0001 to 0.9 (preferably 0.01 to 0.4), %Mn: 0.06 to 1.3 (preferably 0.3 to 0.6), %P and / or %S: 0.0001 to 0.05 (preferably 0.0005 to 0.007), %Ni, %Mo, %Cu, %Nb, %Al, %B, %Co < 0.09 (preferably < 0.009, more preferably < 0.004, even more preferably < 0.0009), %Si: 0.0001 to 0.29 (preferably 0.001 to 0.08), %As + %Sn + %Sb + %Zr: 0.0001 to 0.09 (preferably 0.005 to 0.05), %N: 0.001 to 0.12 (preferably 0.015 to 0.045), %O: 0.0001 to 1.2 (preferably 0.03 to 0.4); %REE + %Sc + %Y: 0 to 2.9 (preferably 0.12 to 1.4); the balance consists of iron and trace elements, with the total of the trace elements being less than 1.4; or An austenitic steel mainly containing at least 22% by volume of austenite, with %Cr being as low as 0.001 wt% to 11.5 wt% and %N being as high as 0.003 wt% to 4.9 wt%.

32. A method for manufacturing a ceramic component, comprising the following steps: - Supplying a powder or powder mixture containing at least a ceramic material; - Supplying a mold at least partially manufactured by additive manufacturing (AM); - Filling the powder or powder mixture into the mold; - Applying a pressure and / or temperature treatment; - Optionally, applying a debinding treatment; - Optionally, applying a pressure and / or temperature treatment; - Optionally, applying a densification treatment; - Optionally, infiltrating an infiltration material into at least a part of the component; - Optionally, applying a densification treatment for high density.

33. A method for manufacturing a ceramic component, comprising the following steps: - Supplying a powder or powder mixture containing at least a ceramic material; - Shaping the powder or powder mixture using additive manufacturing (AM) technology; - Applying a pressure and / or temperature treatment; - Applying a debinding treatment; - Optionally, applying a pressure and / or temperature treatment; - Optionally, applying a densification treatment; - Optionally, applying a high-density treatment; - Optionally, infiltrating a permeating material into at least a part of the component; - Optionally, applying a high-density treatment.

34. A method for manufacturing a component made of a polymer, comprising the following steps: - Supplying a material consisting of at least a polymer or a polymer-based composite material; - Supplying a mold at least partially manufactured by additive manufacturing (AM); - Filling the mold with the material; - Applying a pressure and / or temperature treatment; - Optionally, applying a debinding treatment; - Optionally, applying a pressure and / or temperature treatment; - Optionally, applying a densification treatment; - Optionally, infiltrating an infiltrant into at least a part of the component; - Optionally, applying a high-density treatment.

35. A method for manufacturing a component made of a polymer, comprising the following steps: - Supplying a material consisting of at least a polymer or a polymer-based composite material; - Shaping the material using additive manufacturing (AM) technology; - Applying a debinding treatment; - Applying a pressure and / or temperature treatment; - Optionally, applying a densification treatment; - Optionally, infiltrating a permeating material into at least a part of the component; - Optionally, applying a high-density treatment.

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