Infrastructure insulator for attenuating electromagnetic interference and / or high frequency

Abstract

The electromagnetic insulation device includes a main body member, a conductive EMI attenuation layer, and a plurality of conductive elements. The main body member is substantially planar and flexible. The EMI attenuation layer is disposed inside the main body member. The plurality of conductive elements are disposed within the main body member. The EMI attenuation layer and the plurality of conductive elements are configured to be electrically connected to an external ground connection portion.

Description

Background Art

[0001] Background and Related Art Electronic devices (such as computing devices, power supplies, data storage devices, etc.) are susceptible to the effects of electromagnetic interference (EMI) and radio frequency (RF) radiation, which may be detected by an antenna in the vicinity of the electronic device or by another electronic device including another communication device. Privacy and security concerns may require EMI and RF shielding when using some electronic devices.

Summary of the Invention

[0002] In some embodiments, an electromagnetic insulation device includes a body member, a conductive EMI attenuation layer, and a plurality of conductive elements. The body member is substantially planar and flexible. The EMI attenuation layer is disposed inside the body member. The plurality of conductive elements are disposed within the body member. The EMI attenuation layer and the plurality of conductive elements are configured to be electrically connected to an external ground connection.

[0003] In some embodiments, an electromagnetic attenuation system includes a first electromagnetic insulation device including a first EMI attenuation layer, a second electromagnetic insulation device including a second EMI attenuation layer, and a connection device for electrically connecting the first EMI attenuation layer to the second EMI attenuation layer. In some embodiments, the electromagnetic insulation device includes a body member, a first conductive EMI attenuation layer, a second conductive EMI attenuation layer, and a plurality of conductive elements. The body member is substantially planar and flexible. The first EMI attenuation layer is disposed inside the body member. The second EMI attenuation layer is disposed inside the body member. The plurality of conductive elements are disposed within the body member. The first EMI attenuation layer, the second EMI attenuation layer, and the plurality of conductive elements are configured to be electrically connected to an external ground connector.

[0004] This "Summary of the Invention" is presented to introduce a selected concept in a simplified form that will be further described in the "Detailed Description of the Invention" below. This "Summary of the Invention" is not intended to identify the key features or essential features of the subject matter recited in the claims, nor is it intended to be used as an aid in determining the scope of the subject matter recited in the claims.

[0005] Additional features and advantages will be described in the following description, will be partially apparent from the description, or may be known by practicing the teachings herein. The features and advantages of the present disclosure may be realized and attained by means of the instrumentalities and combinations particularly pointed out in the appended claims. The features of the present disclosure will become more fully apparent from the following description and appended claims, or may be learned by the practice of the present disclosure set forth hereinafter.

[0006] To explain the features listed above and other features of the present disclosure and the manner in which they can be obtained, a more specific description will be made with reference to specific embodiments of this method illustrated in the accompanying drawings. For a better understanding, like reference numerals have been assigned to like elements throughout the various accompanying drawings. Although some of the drawings may represent concepts schematically or exaggeratedly, at least some of the drawings may be drawn to scale. With the understanding that the drawings illustrate some exemplary embodiments, the embodiments will be described and clarified more specifically and in detail using the accompanying drawings.

Brief Description of the Drawings

[0007]

Figure 1

Figure 2

Figure 3

Figure 4-1

Figure 4-2

Figure 5

Figure 6

DETAILED DESCRIPTION OF THE INVENTION

[0008] The present disclosure generally relates to electromagnetic interference (EMI) and / or radio frequency (RF) shielding systems and methods. More particularly, the electromagnetic insulation devices described herein are configured to provide EMI or RF shielding for computing devices or other electronic devices within buildings such as data centers, office buildings, residences, research facilities, etc. The electromagnetic insulation devices according to the present disclosure are configured in some embodiments to provide waterproofing or other environmental insulation in addition to EMI and / or RF shielding.

[0009] FIG. 1 is an embodiment of a data center 100 that includes a server rack 102 for housing an electronic device such as a computing device 104, a power supply 106, a communication device 108 (such as a network switch), and other electronic devices. In some embodiments, the data center 100 includes other electronic devices within other server racks or stand-alone devices. The data center 100 houses the server rack 102 and / or other electronic devices and includes walls 110, a floor 112, a ceiling / roof 114, and other architectural components to protect against environmental effects such as rainfall, temperature, wind, dirt, debris, and other environmental effects that may negatively impact the performance and / or operating life of the electronic devices. In some embodiments, the walls 110, floor 112, ceiling / roof 114, and other architectural components of the data center 100 further attenuate EM radiation that otherwise enters and exits the data center through the walls 110, floor 112, ceiling / roof 114, and other architectural components.

[0010] Although the data center is described with respect to FIG. 1, in other embodiments, the embodiments of the electromagnetic insulation devices described herein are applicable to other buildings, including office buildings, residences, research facilities, and the like.

[0011] The electronic devices of the data center 100 may be susceptible to the effects of EMI 116. The electromagnetic insulation device 120 can attenuate the EMI 116 and / or prevent the EMI 116 from passing through the electromagnetic insulation device 120 and affecting the electronic devices. The electronic devices of the data center 100 may generate RF signals 118.

[0012] In some embodiments, the electromagnetic insulation device 120 is disposed inside or on (e.g., on an outer surface or an inner surface) the walls 110, floor 112, ceiling / roof 114, and other architectural components of the data center 100 to attenuate EM radiation passing through the walls 110, floor 112, ceiling / roof 114, and other architectural components and at least partially insulate the electronic devices of the data center 100 from the external environment.

[0013] By electromagnetic insulation of a data center or other building, in at least one embodiment described herein, electronic devices within the data center or other building are protected from external interference, and RF signals generated by the electronic devices are contained such that external electronic devices cannot receive and / or interpret the RF signals. Conventional EM insulators include conductive members that are hard, heavy, brittle, or prone to corrosion, such as copper plates or aluminum sheets. Conventional EM insulators can be difficult to install, modify, and remove, which limits the adaptability of the data center 100 as the requirements and / or equipment of the data center 100 change over time. Conventional EM insulators can also be difficult to retrofit into existing buildings. Conventional EM insulators can be difficult to maintain as well, as EM radiation attenuation performance can degrade when the EM insulator corrodes.

[0014] The electromagnetic insulation device 120 according to the present disclosure, in some embodiments, comprises a modular, flexible, and durable panel configured to provide both EM insulation and environmental insulation. The electromagnetic insulation device 120, in some embodiments, comprises connectors for electrically coupling a series of electromagnetic insulation devices 120 to each other and covering or partially covering the walls 110, floors 112, ceilings / roofs 114, or other architectural components of the data center 100, whether indoors or outdoors, to attenuate EM radiation passing through the walls 110, floors 112, ceilings / roofs 114, and other architectural components and to at least partially insulate the electronic devices of the data center 100 from the external environment.

[0015] FIG. 2 is a top view of an embodiment of an electromagnetic insulation device 220 that can be used in a data center or other building as described with respect to FIG. 1. The electromagnetic insulation device 220 is substantially rectangular in some embodiments. The electromagnetic insulation device 220 has an outer peripheral shape in a plan view that enables tiling of the electromagnetic insulation device 220 in some embodiments. The electromagnetic insulation device 220 may be, for example, triangular, hexagonal, or other shapes that enable tiling of the electromagnetic insulation devices 220 without gaps between the electromagnetic insulation devices 220 along the edges 222 of the electromagnetic insulation device 220 on a substantially continuous plane. The electromagnetic insulation devices 220 are configured to overlap in some embodiments such that the electromagnetic insulation devices 220 provide a substantially continuous plane. The electromagnetic insulation device 220 may be, for example, circular, and circular electromagnetic insulation devices 220 create a substantially continuous plane when stacked in a hexagonal arrangement.

[0016] The electromagnetic insulation device 220 includes, in some embodiments, a plurality of connectors 224. The connectors 224 can facilitate the tiling of the electromagnetic insulation device 220 by connecting to the walls, floors, ceilings / roofs, or other architectural components of a data center or other building. The connectors can be arranged and / or disposed, for example, to align the connectors with one or more geometries of the building in which the electromagnetic insulation device 220 is installed. In some examples, the connectors 224 can be disposed at intervals of 45.72 cm (18 inches) or less to simplify installation on the walls of a building. The connectors 224 provide, in some embodiments, an electrical coupling from a conductive layer within or on the electromagnetic insulation device 220 to an external ground connection, such as a ground or earth ground wire. The electromagnetic insulation device 220 includes, within the electromagnetic insulation device 220, at least one conductive layer or conductive member that enables electrical conduction through the plane of the electromagnetic insulation device 220. The electromagnetic insulation device 220 enables, in some embodiments, electrical conduction in a first direction 226 within the plane of the electromagnetic insulation device 220. The electromagnetic insulation device 220 enables, in some embodiments, electrical conduction in a second direction 228 that is orthogonal to the first direction within the plane of the electromagnetic insulation device 220. The electromagnetic insulation device 220 enables, in some embodiments, electrical conduction in a first direction 226 and a second direction 228 that is orthogonal to the first direction within the plane of the electromagnetic insulation device 220.

[0017] Figure 3 is a side cross-sectional view of an embodiment of an electromagnetic insulation device 320. The electromagnetic insulation device 320 includes a body member 330. The body member 330 can be planar and / or flexible.

[0018] The body member 330 is, in some embodiments, waterproof and prevents water from passing from the first side 332 of the electromagnetic insulation device 320 to the second side 334 of the electromagnetic insulation device 320. The waterproof body member 330 can form a moisture-proof wall for the building in which the electromagnetic insulation device 320 is installed, allowing the electromagnetic insulation device 320 to be exposed to environmental humidity and / or rainfall. The waterproof body member 330 can, in some embodiments, cover and / or enclose the conductive EMI attenuation layers 336-1, 336-2 and limit or prevent corrosion of the conductive members of the EMI attenuation layers 336-1, 336-2.

[0019] The body member 330 is, in some embodiments, airtight and prevents air or at least some gas from passing from the first side 332 of the electromagnetic insulation device 320 to the second side 334 of the electromagnetic insulation device 320. The waterproof body member 330 can form a moisture-proof wall for the building in which the electromagnetic insulation device 320 is installed, allowing the electromagnetic insulation device 320 to be exposed to environmental humidity and / or rainfall. The waterproof body member 330 can, in some embodiments, cover and / or enclose the conductive EMI attenuation layers 336-1, 336-2 and limit or prevent corrosion of the conductive members of the EMI attenuation layers 336-1, 336-2.

[0020] The body member 330 is, in some embodiments, an electrical insulating member or includes an electrical insulating member. The body member 330 is, for example, a vinyl member, a rubber member (natural or synthetic), a polymer member, or other flexible non-conductive member, or includes these. The body member 330 is, in some embodiments, disposed on and / or attached to each of the EMI attenuation layers 336-1, 336-2. The EMI attenuation layers 336-1, 336-2 can be, for example, a continuous foil or sheet without channels or pores. The body member 330 can include a plurality of layers separated by the EMI attenuation layers 336-1, 336-2. The body member 330 is, in some embodiments, an integral structure passing through the mesh channels or pores of the EMI attenuation layers 336-1, 336-2. The body member 330 may be continuous, for example, from the first side of the mesh-like EMI attenuation layers 336-1, 336-2 to the second side of the EMI attenuation layers 336-1, 336-2.

[0021] The EMI attenuation layers 336-1, 336-2 have, in some embodiments, a resistance value of 5 ohms or less with respect to a connector (such as the connector 224 described with respect to FIG. 2). The EMI attenuation layers 336-1, 336-2 have, in some embodiments, a resistance value of 10 ohms or less with respect to a connector. The EMI attenuation layers 336-1, 336-2 have, in some embodiments, a resistance value of 15 ohms or less with respect to a connector.

[0022] In some embodiments, the conductive EMI attenuation layers 336-1, 336-2 of the electromagnetic insulation device 320 are meshes including a plurality of pores or channels passing from a first side surface to a second side surface. The pores or channels passing through the conductive EMI attenuation layers 336-1, 336-2 according to the present disclosure have a cross-section (i.e., shape) that is, in some embodiments, square, rectangular, triangular, other regular polygons, irregular polygons, circular, elliptical, other regular curved shapes, irregular curved shapes, or combinations thereof. The maximum lateral dimension of the pore or channel is the maximum lateral dimension regardless of the direction of rotation with respect to the vertical direction, which is perpendicular to the plane of the conductive EMI attenuation layers 336-1, 336-2.

[0023] For example, the EM shielding of a Faraday shield is based on the wavelength and the attenuation required at that wavelength. For example, the higher the frequency, the shorter the wavelength of the EM radiation. The shorter the wavelength, the smaller the aperture of the pores or channels required to attenuate the EM radiation.

[0024] A Faraday shield operates by balancing the electric fields on both sides of the shield. A substantially continuous Faraday shield allows free conduction of charges within the wall of the Faraday shield and becomes a hollow conductor. The introduction of an opening into the Faraday shield allows leakage of EM radiation through the opening. For the Faraday cage to function as such, the size of the opening must be smaller than the wavelength of interest. By laminating the conductive EMI attenuation layers 336-1, 336-2 within the body of the electromagnetic insulation device, the positions of the pores or channels of the conductive layers of the conductive EMI attenuation layers 336-1, 336-2 may shift, and the substantial size of the channels passing through the electromagnetic insulation device may be further reduced.

[0025] In some embodiments, the EMI attenuation of the electromagnetic insulation device 320 may be further increased by the conductive element 338 disposed within, between, or around the conductive EMI attenuation layers 336-1 and 336-2 within the body member 330. The conductive element 338 is embedded in the body member 330 in some embodiments to enable electrical conduction within the plane of the electromagnetic insulation device 320. The conductive element 338 is embedded in the body member 330 and in contact with one or more of the conductive EMI attenuation layers 336-1 and 336-2 in some embodiments. The conductive element 338 is embedded in the body member 330 and in contact with at least two of the conductive EMI attenuation layers 336-1 and 336-2 to enable electrical conduction between the conductive EMI attenuation layers 336-1 and 336-2 in at least one embodiment.

[0026] The conductive element 338 includes conductive fibers in some embodiments. The conductive element 338 includes conductive rods in some embodiments. The conductive element 338 includes conductive threads in some embodiments.

[0027] In some embodiments, since the electromagnetic insulation device 320 requires that EM radiation pass through each of the aligned or misaligned channels of the mesh for the EM radiation to leak from the electromagnetic insulation device 320, the electromagnetic insulation device 320 provides further attenuation for EM radiation wavelengths shorter than the channel size as the number of conductive EMI attenuation layers 336-1 and 336-2 increases. The attenuation can be controlled by, for example, grounding the electromagnetic insulation device 320, the distance and / or position of the electronic device relative to the electromagnetic insulation device 320, the configuration of the electromagnetic insulation device, the maximum lateral and longitudinal dimensions of the channels, the number of channels, the frequency, other factors, or combinations thereof.

[0028] The electromagnetic insulation device 320 provides at least -60 dB of attenuation from 100 MHz to 18 GHz in some embodiments. The electromagnetic insulation device 320 according to the present disclosure attenuates EMI in the frequency range from 2.2 GHz to 2.6 GHz in some embodiments. The electromagnetic insulation device 320 attenuates EMI in the frequency range from 800 MHz to 900 MHz in other embodiments. The electromagnetic insulation device 320 attenuates EMI in the frequency range from 1.8 GHz to 2.0 GHz in another embodiment. The electromagnetic insulation device 320 attenuates EMI in the frequency range from 5.0 GHz to 6.0 GHz in still another embodiment.

[0029] The conductive EMI attenuation layers 336-1 and 336-2 provide at least -60 dB of RF attenuation from 9 kHz to 18 GHz in some embodiments. The conductive EMI attenuation layers 336-1 and 336-2 according to the present disclosure attenuate EMI in the frequency range from 2.2 GHz to 2.6 GHz in some embodiments. The conductive EMI attenuation layers 336-1 and 336-2 attenuate EMI in the frequency range from 800 MHz to 900 MHz in other embodiments. The conductive EMI attenuation layers 336-1 and 336-2 attenuate EMI in the frequency range from 1.8 GHz to 2.0 GHz in another embodiment. The conductive EMI attenuation layers 336-1 and 336-2 attenuate EMI in the frequency range from 5.0 GHz to 6.0 GHz in still another embodiment.

[0030] The electromagnetic insulation device 320 according to the present disclosure attenuates EMI within the frequency range by at least 20 dB across the entire frequency range in some embodiments. The electromagnetic insulation device 320 attenuates EMI within the frequency range by at least 30 dB across the entire frequency range in other embodiments. The electromagnetic insulation device 320 attenuates EMI within the frequency range by at least 60 dB across the entire frequency range in still other embodiments.

[0031] In some embodiments, the electromagnetic insulation device 320 according to the present disclosure attenuates EMI within a frequency range by at least 20 dB on average over the frequency range. In other embodiments, the electromagnetic insulation device 320 attenuates EMI within a frequency range by at least 30 dB on average over the frequency range. In still other embodiments, the electromagnetic insulation device 320 attenuates EMI within a frequency range by at least 60 dB on average over the frequency range.

[0032] In some embodiments, the conductive EMI attenuation layers 336-1, 336-2 include a conductive member. Examples of suitable members include, but are not limited to, copper, aluminum, iron, tin, magnesium, ferrite or ferrite alloy, graphite, and conductive polymers.

[0033] In at least one embodiment, the electromagnetic insulation device 320 includes copper and provides both electrical conductivity and flexibility. In another embodiment, the electromagnetic insulation device 320 includes aluminum and provides both electrical conductivity and flexibility. In yet another embodiment, the electromagnetic insulation device 320 includes a combination of copper in a first portion and aluminum in a second portion, providing different electrical conduction characteristics in different portions.

[0034] In some embodiments, the first EMI attenuation layer 336-1 and the second EMI attenuation layer 336-2 are the same. In some embodiments, the first EMI attenuation layer 336-1 and the second EMI attenuation layer 336-2 are different. The first EMI attenuation layer 336-1 and the second EMI attenuation layer 336-2 may include, for example, different members or may be made of different members. In another example, the first EMI attenuation layer 336-1 and the second EMI attenuation layer 336-2 may have different porosities, such as the first EMI attenuation layer 336-1 being a mesh and the second EMI attenuation layer 336-2 being a substantially continuous sheet. In yet another example, the first EMI attenuation layer 336-1 and the second EMI attenuation layer 336-2 may have different channel or pore geometries, such as different sizes, shapes, aspect ratios, etc.

[0035] The EMI attenuation layers 336-1 and 336-2 may be arranged at equal intervals between the first side surface 332 and the second side surface 334 within the electromagnetic insulation device 320. In some embodiments, the total thickness 340 of the electromagnetic insulation device 320 being at least 8 millimeters (mm) enables sufficient electrical separation between the first EMI attenuation layer 336-1 and the second EMI attenuation layer 336-2. The electromagnetic insulation device 320 has a total thickness 340 of at least 10 mm in some embodiments. The electromagnetic insulation device 320 has a total thickness 340 of at least 12.7 mm in some embodiments.

[0036] The EMI attenuation layers 336-1 and 336-2 have an EMI attenuation layer thickness 342-1 and 342-2 of at least 0.015 mm in some embodiments. The EMI attenuation layers 336-1 and 336-2 may be, for example, a mesh with a wire diameter of 0.015 mm. The mesh has an EMI attenuation layer thickness 342-1 and 342-2 of 0.015 mm in a single layer of the EMI attenuation layers 336-1 and 336-2. The EMI attenuation layers 336-1 and 336-2 have an EMI attenuation layer thickness 342-1 and 342-2 of at least 0.10 mm in other embodiments. In some examples, increasing the EMI attenuation layer thickness 342-1 and 342-2 can provide EMI attenuation layers 336-1 and 336-2 with higher electrical conductivity, but the EMI attenuation layer thickness 342-1 and 342-2 may cause a greater reduction in flexibility.

[0037] In some embodiments, the body layer thicknesses 344-1, 344-2, 344-3 of the body member 330 between or around the EMI attenuation layers 336-1, 336-2 enable the electromagnetic insulation device 320 to be flexible. The second body layer thickness 344-2, such as between the first EMI attenuation layer 336-1 and the second EMI attenuation layer 336-2, provides separation between the EMI attenuation layers and further promotes the attenuation of EMI. The body layer thicknesses 344-1, 344-2, 344-3 are, in some embodiments, at least 2.5 mm. At least the thickness 344-2 of the second body layer is, in some embodiments, 2.5 mm or more in order to provide a 2.5 mm gap between the first EMI attenuation layer 336-1 and the second EMI attenuation layer 336-2.

[0038] In some embodiments, one or more of the EMI attenuation layers 336-1, 336-2 can be substantially parallel to the plane of the body member 330 (e.g., across the major dimensions).

[0039] Figures 4-1 and 4-2 are, respectively, a top view and a side view of the connection device 446. The connection device 446 can enable an electromagnetic insulation device, such as any of the embodiments described herein, to be connected to a building element (e.g., wall, floor, ceiling, roof, etc.) of a building and / or another electromagnetic insulation device. The connection device 446 includes, for example, a conductive fastener 448 that provides a conductive path from the EMI attenuation layer of the electromagnetic insulation device to an external electrical ground connection. The external electrical ground connection is, in some embodiments, provided using a wire that provides a conductive path from the connection device to the earth ground. The external electrical ground connection is, in some embodiments, provided through a second electromagnetic insulation device coupled to the earth ground or another electrical ground connection.

[0040] In some embodiments, the connection device 446 includes braces 450-1 and 450-2. In some embodiments, the braces 450-1 and 450-2 distribute the compressive force from the conductive fastener 448 across at least a portion of the electromagnetic insulation device, preventing and / or limiting damage to the electromagnetic insulation device being pushed by the braces 450-1 and 450-2. In some embodiments, the first brace 450-1 and the second brace 450-2 push one or more electromagnetic insulation devices between the braces 450-1 and 450-2. In some embodiments, the connection device 446 includes a first brace 450-1 for pushing an electromagnetic insulation device against a building element such as a stud or a concrete wall of a building.

[0041] In some embodiments, the conductive fastener 448 includes a penetrating tip 452 that enables the conductive fastener 448 to penetrate a building element of a building or the second brace 450-2. In some embodiments, the threaded connection 454 of the conductive fastener 448 allows the torque of the conductive fastener to apply a compressive force to the braces 450-1 and 450-2 by pushing the first brace 450-1 towards the second brace 450-2 or by pushing the first brace 450-1 against a building element.

[0042] FIG. 5 is a side cross-sectional view of another embodiment of a connection device 546 having a non-penetrating tip. The connection device 546 includes, in some embodiments, outer braces 550-1, 550-2 disposed on both sides of the electromagnetic insulation devices 520-1, 520-2 to connect the electromagnetic insulation devices 520-1, 520-2 to each other. The conductive fasteners 548 of the connection device 546 can enable electrical conduction between the EMI attenuation layer 536 of the first electromagnetic insulation device 520-1 and the EMI attenuation layer 536 of the second electromagnetic insulation device 520-2, as described herein. The braces 550-1, 550-2 are conductive in some embodiments and provide a conductive path between a first conductive fastener 548-1 coupled to the first electromagnetic insulation device 520-1 and a second conductive fastener 548-2 coupled to the second electromagnetic insulation device 520-2.

[0043] FIG. 6 is a side cross-sectional view of another embodiment of a connection device 646. The connection device 646 includes, in some embodiments, a brace 650 that provides a conductive path between a first conductive fastener 648-1 connected to a first electromagnetic insulation device 620-1 and a second conductive fastener 648-2 connected to a second electromagnetic insulation device 620. The conductive fasteners 648-1, 648-2 push the brace 650 (and the electromagnetic insulation devices 620-1, 620-2) against a building element such as a wall 610 in some embodiments.

[0044] The electromagnetic insulation device according to the present disclosure enables, in some embodiments, the use of a modular system that electromagnetically insulates a building such as a data center from EMI and RF communication, makes more sites available, and simplifies the modification of existing sites.

Industrial Applicability

[0045] The present disclosure generally relates to electromagnetic interference (EMI) or radio frequency (RF) shielding systems and methods. The electromagnetic insulation devices described herein are more particularly configured to provide EMI or RF shielding for computing devices or other electronic devices within buildings such as data centers, office buildings, residences, research facilities, and the like. The electromagnetic insulation devices according to the present disclosure are configured in some embodiments to provide waterproofing or other environmental insulation in addition to EMI and RF shielding.

[0046] A data center, in some embodiments, includes server racks that house electronic devices such as computing devices, power supplies, communication devices (such as network switches), and other electronic devices. A data center, in some embodiments, includes other electronic devices within other server racks or stand-alone devices. A data center includes walls, floors, ceilings / roofs, and other architectural components to house the server racks and / or other electronic devices and to protect them from environmental effects such as rainfall, temperature, wind, dirt, debris, and other environmental effects that may adversely affect the performance and / or operating life of the electronic devices. The walls, floors, ceilings / roofs, and other architectural components of the data center further attenuate EM radiation that would otherwise enter and exit the data center through the walls, floors, ceilings / roofs, and other architectural components in some embodiments.

[0047] Although a data center is described herein, in other embodiments, the embodiments of the electromagnetic insulation devices described herein are applicable to other buildings including office buildings, residences, research facilities, and the like.

[0048] The electronic devices of a data center may be susceptible to the effects of EMI. An electromagnetic insulation device can attenuate EMI and / or prevent EMI from passing through the electromagnetic insulation device and affecting the electronic devices. The electronic devices of a data center may generate RF signals.

[0049] In some embodiments, the electromagnetic insulation device is disposed inside or on the walls, floors, ceilings / roofs, and other architectural components of a data center, attenuating EM radiation passing through the walls, floors, ceilings / roofs, and other architectural components, and at least partially insulating the electronic devices of the data center from the external environment.

[0050] By electromagnetically insulating a data center or other building, the electronic devices within the data center or other building are protected from external interference, and the RF signals generated by the electronic devices are contained such that external electronic devices cannot receive and / or interpret the RF signals. Conventional EM insulators include conductive members that are hard, heavy, brittle, or prone to corrosion, such as copper plates or aluminum sheets. Conventional EM insulators can be difficult to install, modify, and remove, which limits the adaptability of the data center as the needs and equipment of the data center change over time. Conventional EM insulators can also be difficult to retrofit into existing buildings. Conventional EM insulators may experience a decrease in EM radiation attenuation performance when the EM insulator corrodes, and can be similarly difficult to maintain.

[0051] In some embodiments, the electromagnetic insulation device according to the present disclosure comprises a modular, flexible, and durable panel configured to provide both EM insulation and environmental insulation. In some embodiments, the electromagnetic insulation device comprises connectors for electrically coupling a series of electromagnetic insulation devices to each other to cover or partially cover the walls, floors, ceilings / roofs, or other architectural components of a data center, attenuating EM radiation passing through the walls, floors, ceilings / roofs, and other architectural components, and at least partially insulating the electronic devices of the data center from the external environment.

[0052] The electromagnetic insulation device is, in some embodiments, used in a data center or other building as described herein. The electromagnetic insulation device is, in some embodiments, substantially rectangular. The electromagnetic insulation device has, in some embodiments, an outer peripheral shape in a plan view that enables tiling of the electromagnetic insulation device. The electromagnetic insulation device may be, for example, triangular, hexagonal, or other shapes that enable tiling of the electromagnetic insulation devices without gaps between the electromagnetic insulation devices along the edges of the electromagnetic insulation device on a substantially continuous plane. The electromagnetic insulation devices are, in some embodiments, configured to overlap such that the electromagnetic insulation devices provide a substantially continuous plane. The electromagnetic insulation device 220 may be, for example, circular, and circular electromagnetic insulation devices create a substantially continuous plane when stacked in a hexagonal arrangement.

[0053] The electromagnetic insulation device, in some embodiments, comprises a plurality of connectors. The connectors can facilitate the tiling of the electromagnetic insulation device by connecting to the walls, floors, ceilings / roofs of a data center or other buildings, or other architectural components. The connectors can be arranged and / or disposed, for example, to align with one or more configurations of the building in which the electromagnetic insulation device is installed. The connectors can be disposed at intervals of 45.72 cm (18 inches) or less in some examples to simplify installation on the walls of a building. The connectors, in some embodiments, provide an electrical coupling from a conductive layer within or on the electromagnetic insulation device to an external ground connection, such as a ground or ground wire. The electromagnetic insulation device comprises at least one conductive layer or conductive member within the electromagnetic insulation device that enables electrical conduction through the plane of the electromagnetic insulation device. The electromagnetic insulation device, in some embodiments, enables electrical conduction in a first direction within the plane of the electromagnetic insulation device. The electromagnetic insulation device, in some embodiments, enables electrical conduction in a second direction orthogonal to the first direction within the plane of the electromagnetic insulation device. The electromagnetic insulation device, in some embodiments, enables electrical conduction in a first direction and a second direction orthogonal to the first direction within the plane of the electromagnetic insulation device.

[0054] The electromagnetic insulation device, in some embodiments, comprises a flexible body member. The body member, in some embodiments, is waterproof and prevents water from passing from a first side of the electromagnetic insulation device to a second side of the electromagnetic insulation device. The waterproof body member can form a moisture-proof wall for the building in which the electromagnetic insulation device is installed and enable the electromagnetic insulation device to be exposed to environmental humidity and / or rainfall. The waterproof body member, in some embodiments, can cover and / or encapsulate a conductive EMI attenuation layer and limit or prevent corrosion of the conductive members of the EMI attenuation layer.

[0055] The body member, in some embodiments, is airtight and prevents air or at least some gas from passing from the first side of the electromagnetic insulation device to the second side of the electromagnetic insulation device. The waterproof body member can form a moisture-proof wall for the building in which the electromagnetic insulation device is installed, allowing the electromagnetic insulation device to be exposed to environmental humidity and / or rainfall. The waterproof body member, in some embodiments, can cover and / or enclose a conductive EMI attenuation layer and limit or prevent corrosion of the conductive members of the EMI attenuation layer.

[0056] The body member, in some embodiments, is an electrical insulating member or includes an electrical insulating member. The body member can be, for example, a vinyl member, a rubber member (natural or synthetic), a polymer member, or other flexible non-conductive member, or include these. The body member, in some embodiments, is disposed on and / or adhered to each EMI attenuation layer. The EMI attenuation layer can be, for example, a continuous foil or sheet without channels or pores. The body member can include a plurality of layers separated by the EMI attenuation layer. The body member, in some embodiments, has an integral structure through the channels or pores of the mesh of the EMI attenuation layer. The body member can be continuous, for example, from the first side of the mesh-shaped EMI attenuation layer to the second side of the EMI attenuation layer.

[0057] The EMI attenuation layer, in some embodiments, has a resistance value of 5 ohms or less with respect to a connector (such as the connectors described herein). The EMI attenuation layer, in some embodiments, has a resistance value of 10 ohms or less with respect to a connector. The EMI attenuation layer, in some embodiments, has a resistance value of 15 ohms or less with respect to a connector.

[0058] In some embodiments, the conductive EMI attenuation layer of the electromagnetic insulation device is a mesh including a plurality of pores or channels passing from a first side to a second side. The pores or channels passing through the conductive EMI attenuation layer according to the present disclosure have a cross-section (i.e., shape) that is, in some embodiments, square, rectangular, triangular, other regular polygons, irregular polygons, circular, elliptical, other regular curved shapes, irregular curved shapes, or combinations thereof. The maximum lateral dimension of the pore or channel is the maximum lateral dimension regardless of the direction of rotation with respect to the vertical direction perpendicular to the plane of the conductive EMI attenuation layer.

[0059] For example, the EM shielding of a Faraday shield is based on the wavelength and the attenuation required at that wavelength. For example, the higher the frequency, the shorter the wavelength of the EM radiation. The shorter the wavelength, the smaller the aperture of the pores or channels required to attenuate the EM radiation.

[0060] A Faraday shield operates by balancing the electric fields on both sides of the shield. A substantially continuous Faraday shield allows free conduction of charges within the walls of the Faraday shield and becomes a hollow conductor. The introduction of an opening into the Faraday shield allows leakage of EM radiation through the opening. For the Faraday cage to function as such, the size of the opening must be smaller than the wavelength of interest. By laminating the conductive EMI attenuation layer within the body of the electromagnetic insulation device, the positions of the pores or channels of the conductive layer of the conductive EMI attenuation layer may shift, and the substantial size of the channels passing through the electromagnetic insulation device may further decrease.

[0061] In some embodiments, the EMI attenuation of the electromagnetic insulation device may be further increased by conductive elements disposed between or around the conductive EMI attenuation layers within the body member. The conductive elements are, in some embodiments, embedded in the body member to enable electrical conduction within the plane of the electromagnetic insulation device. The conductive elements are, in some embodiments, embedded in the body member and in contact with one or more of the conductive EMI attenuation layers. The conductive elements are, in at least one embodiment, embedded in the body member and in contact with at least two of the conductive EMI attenuation layers to enable electrical conduction between the conductive EMI attenuation layers.

[0062] The conductive elements include, in some embodiments, conductive fibers. The conductive elements include, in some embodiments, conductive rods. The conductive elements include, in some embodiments, conductive threads.

[0063] In some embodiments, for EMI radiation to leak from the electromagnetic insulation device, it must pass through each of the meshed channels or the misaligned channels, so the electromagnetic insulation device provides further attenuation for EMI radiation wavelengths shorter than the channel size as the number of conductive EMI attenuation layers increases. The attenuation can be controlled, for example, by grounding of the electromagnetic insulation device, the distance and / or position of the electronic device relative to the electromagnetic insulation device, the configuration of the electromagnetic insulation device, the maximum lateral and longitudinal dimensions of the channels, the number of channels, the frequency, other factors, or combinations thereof.

[0064] The electromagnetic insulation device provides at least -60 dB of attenuation in some embodiments from 9 kHz to 18 GHz. The electromagnetic insulation device according to the present disclosure attenuates EMI in the frequency range of 2.2 GHz to 2.6 GHz in some embodiments. The electromagnetic insulation device attenuates EMI in the frequency range of 800 MHz to 900 MHz in other embodiments. The electromagnetic insulation device attenuates EMI in the frequency range of 1.8 GHz to 2.0 GHz in another embodiment. The electromagnetic insulation device attenuates EMI in the frequency range of 5.0 GHz to 6.0 GHz in yet another embodiment.

[0065] The conductive EMI attenuation layer provides at least -60 dB of attenuation in some embodiments from 9 kHz to 18 GHz. The conductive EMI attenuation layer according to the present disclosure attenuates EMI in the frequency range of 2.2 GHz to 2.6 GHz in some embodiments. The conductive EMI attenuation layer attenuates EMI in the frequency range of 800 MHz to 900 MHz in other embodiments. The conductive EMI attenuation layer attenuates EMI in the frequency range of 1.8 GHz to 2.0 GHz in another embodiment. The conductive EMI attenuation layer attenuates EMI in the frequency range of 5.0 GHz to 6.0 GHz in yet another embodiment.

[0066] The electromagnetic insulation device according to the present disclosure attenuates EMI within the frequency range by at least 20 dB of attenuation across the entire frequency range in some embodiments. The electromagnetic insulation device attenuates EMI within the frequency range by at least 30 dB across the entire frequency range in other embodiments. The electromagnetic insulation device attenuates EMI within the frequency range by at least 60 dB across the entire frequency range in still other embodiments.

[0067] In some embodiments, the electromagnetic insulation device according to the present disclosure attenuates EMI within a frequency range by at least 20 dB on average over the frequency range. In other embodiments, the electromagnetic insulation device attenuates EMI within a frequency range by at least 30 dB on average over the frequency range. In still other embodiments, the electromagnetic insulation device attenuates EMI within a frequency range by at least 60 dB of attenuation on average over the frequency range.

[0068] In some embodiments, the conductive EMI attenuation layer includes a conductive member. Examples of suitable members include, but are not limited to, copper, aluminum, iron, tin, magnesium, ferrite or ferrite alloy, graphite, and conductive polymers.

[0069] In at least one embodiment, the electromagnetic insulation device includes copper and provides both electrical conductivity and flexibility. In another embodiment, the electromagnetic insulation device includes aluminum and provides both electrical conductivity and flexibility. In yet another embodiment, the electromagnetic insulation device includes a combination of copper in a first portion and aluminum in a second portion, providing different electrical conduction characteristics in different portions.

[0070] In some embodiments, the first EMI attenuation layer and the second EMI attenuation layer are the same. In some embodiments, the first EMI attenuation layer and the second EMI attenuation layer are different. The first EMI attenuation layer and the second EMI attenuation layer may, for example, include different members or be made of different members. In another example, the first EMI attenuation layer and the second EMI attenuation layer may have different porosities, such as the first EMI attenuation layer being a mesh and the second EMI attenuation layer being a substantially continuous sheet. In yet another example, the first EMI attenuation layer and the second EMI attenuation layer may have different channel or pore geometries, such as different sizes, shapes, aspect ratios, etc.

[0071] The arrangement of the EMI attenuation layers may have equal intervals between the first side and the second side within the electromagnetic insulation device. In some embodiments, the total thickness of the electromagnetic insulation device being at least 8 millimeters (mm) enables sufficient electrical separation between the first EMI attenuation layer and the second EMI attenuation layer. The electromagnetic insulation device has a total thickness of at least 10 mm in some embodiments. The electromagnetic insulation device has a total thickness of at least 12.7 mm in some embodiments.

[0072] The EMI attenuation layer has an EMI attenuation layer thickness of at least 0.015 mm in some embodiments. The EMI attenuation layer may be, for example, a mesh with a wire diameter of 0.015 mm. The mesh has an EMI attenuation layer thickness of 0.015 mm in a single layer of the EMI attenuation layer. The EMI attenuation layer has an EMI attenuation layer thickness of at least 0.10 mm in other embodiments. In some examples, increasing the EMI attenuation layer thickness can provide an EMI attenuation layer with higher electrical conductivity, but the EMI attenuation layer thickness may further reduce flexibility.

[0073] In some embodiments, the body layer thickness of the body member between or around the EMI attenuation layers enables the electromagnetic insulation device to be flexible. The second body layer thickness between the EMI attenuation layers, such as between the first EMI attenuation layer and the second EMI attenuation layer, provides separation between the EMI attenuation layers and further promotes the attenuation of EMI. The body layer thickness is at least 2.5 mm in some embodiments. The thickness of at least the second body layer is 2.5 mm or more in some embodiments to provide a 2.5 mm interval between the first EMI attenuation layer and the second EMI attenuation layer.

[0074] In some embodiments, the connection device enables connecting an electromagnetic insulation device, such as any of the embodiments described herein, to building elements of a building (e.g., walls, floors, ceilings, roofs, etc.) and / or to another electromagnetic insulation device. The connection device 446 includes, for example, a conductive fastener that provides a conductive path from the EMI attenuation layer of the electromagnetic insulation device to an external electrical ground connection. In some embodiments, the external electrical ground connection is provided using a wire that provides a conductive path from the connection device to the ground. In some embodiments, the external electrical ground connection is provided through a second electromagnetic insulation device coupled to the ground or to another electrical ground.

[0075] In some embodiments, the connection device includes a brace. In some embodiments, the brace disperses the pressure from the conductive fastener over at least a portion of the electromagnetic insulation device, preventing and / or limiting damage to the electromagnetic insulation device being pushed by the brace. In some embodiments, a first brace and a second brace push one or more electromagnetic insulation devices between the braces. In some embodiments, the connection device includes a first brace for pushing an electromagnetic insulation device against a building element, such as a stud, or a concrete wall of a building.

[0076] In some embodiments, the conductive fastener includes a penetrating tip that enables the conductive fastener to penetrate into a building element of a building or a second brace. In some embodiments, the threaded connection of the conductive fastener enables the torque of the conductive fastener to apply pressure to the brace by pushing the first brace towards the second brace or by pushing the first brace against a building element.

[0077] In some embodiments, the connection device includes outer braces disposed on both sides of the electromagnetic insulation device to connect the electromagnetic insulation devices to each other. The conductive fasteners of the connection device can enable electrical conduction between the EMI attenuation layer of the first electromagnetic insulation device and the EMI attenuation layer of the second electromagnetic insulation device, as described herein. The brace is conductive in some embodiments and provides a conductive path between a first conductive fastener coupled to the first electromagnetic insulation device and a second conductive fastener coupled to the second electromagnetic insulation device.

[0078] In some embodiments, the connection device includes a brace that provides a conductive path between a first conductive fastener connected to a first electromagnetic insulation device and a second conductive fastener connected to a second electromagnetic insulation device. In some embodiments, the conductive fasteners press the brace (and the electromagnetic insulation device) against a building element such as a wall.

[0079] In some embodiments, the electromagnetic insulation device according to the present disclosure enables the use of a modular system that electromagnetically insulates a building such as a data center from EMI and RF communication, makes more sites available, and makes it easier to modify existing sites.

[0080] The present disclosure relates to systems and methods for shielding electromagnetic interference (EMI) or radio frequency (RF), at least according to the examples presented in the following paragraphs. [A1] In some embodiments, the electromagnetic insulation device includes a body member, a conductive EMI attenuation layer, and a plurality of conductive elements. The body member is substantially planar and flexible. The EMI attenuation layer is disposed inside the body member. The plurality of conductive elements are disposed within the body member. The EMI attenuation layer and the plurality of conductive elements are configured to be electrically connected to an external ground connection.

[0081] [A2] In some embodiments, the EMI attenuation layer of [A1] is substantially parallel to the plane of the body member. [A3] The body member of [A1] or [A2] is waterproof in some embodiments.

[0082] [A4] The body member of [A1] or [A2] is airtight in some embodiments. [A5] The EMI attenuation layer of any one of [A1] to [A4] is a mesh in some embodiments.

[0083] [A6] The plurality of conductive elements of any one of [A1] to [A5] include a plurality of conductive rods in some embodiments. [A7] The plurality of conductive elements of any one of [A1] to [A5] include a plurality of conductive fibers in some embodiments.

[0084] [A8] The EMI attenuation layer of any one of [A1] to [A7] has a resistance value of 5 ohms or less in some embodiments. [A9] Any electromagnetic insulation device of [A1] to [A8] provides at least -60 dB of attenuation from 9 kHz to 18 GHz in some embodiments.

[0085] [A10] The EMI attenuation layer of any one of [A1] to [A9] provides at least -60 dB of attenuation from 9 kHz to 18 GHz in some embodiments. [A11] Any electromagnetic insulation device of [A1] to [A10] includes a first external ground connector and a second external ground connector disposed at a distance of 45.72 cm (18 inches) or less from each other in some embodiments.

[0086] [A12] The body member of any one of [A1] to [A11] includes vinyl in some embodiments. [A13] The plurality of conductive elements within the body member of any one of [A1] to [A12] provide electrical conduction from the EMI attenuation layer to the external ground connector in some embodiments.

[0087] [A14] In some embodiments, the plurality of conductive elements within any of the body members from [A1] to [A13] provide electrical conduction between the EMI attenuation layer and the second EMI attenuation layer.

[0088] [B1] In some embodiments, the electromagnetic attenuation system comprises a first electromagnetic insulation device having a first EMI attenuation layer, a second electromagnetic insulation device having a second EMI attenuation layer, and a connection device for electrically connecting the first EMI attenuation layer to the second EMI attenuation layer.

[0089] [B2] In some embodiments, the connection device of [B1] comprises a first conductive fastener passing through the first EMI attenuation layer and a second conductive fastener passing through the second EMI attenuation layer. [B3] In some embodiments, the connection device of [B2] comprises a first brace configured to provide an electrically conductive path from the first conductive fastener to the second conductive fastener.

[0090] [B4] In some embodiments, the connection device of [B3] comprises a second brace configured to provide an electrically conductive path from the first conductive fastener to the second conductive fastener.

[0091] [C1] In some embodiments, the electromagnetic insulation device comprises a body member, a first conductive EMI attenuation layer, a second conductive EMI attenuation layer, and a plurality of conductive elements. The body member is substantially planar and flexible. The first EMI attenuation layer is disposed inside the body member. The second EMI attenuation layer is disposed inside the body member. The plurality of conductive elements are disposed within the body member. The first EMI attenuation layer, the second EMI attenuation layer, and the plurality of conductive elements are configured to be electrically connected to an external ground connector.

[0092] The articles "a", "an", and "the" are intended to mean the presence of one or more of the elements in the foregoing description. The terms "comprising", "including", and "having" are intended to be inclusive and mean that there may be additional elements other than the listed elements. Further, it should be understood that it is not intended that references to "an embodiment" or "embodiments" of the present disclosure be construed to exclude the existence of additional embodiments that also incorporate the recited features. For example, elements described in connection with an embodiment herein may be combinable with elements of other embodiments described herein. Numerical values, percentages, ratios, or other values recited herein include that value and, further, are intended to include other values described as "about" or "substantially" that would be understood by one of ordinary skill in the art and are included within the embodiments of the present disclosure. The recited values should, therefore, be construed in a sufficiently broad manner to include values that are at least reasonably close to the recited values in order to perform the desired function or achieve the desired result. The recited values include at least the variations that would be expected in a suitable manufacturing or production process and may include values within 5%, 1%, 0.1%, or 0.01% of the recited value.

[0093] One of ordinary skill in the art, in view of the present disclosure, should recognize that equivalent configurations do not depart from the spirit and scope of the present disclosure and that various changes, substitutions, and alternatives can be made to the embodiments disclosed herein without departing from the spirit and scope of the present disclosure. Equivalent constructions that include functional "means plus function" clauses are intended to cover both structures that perform the recited function in the same way as the structures described herein and equivalent structures that provide the same function, including structural equivalents. It is the express intention of the applicant that no means-plus-function or other functional claim be asserted for any claim, except claims in which the word "means for" appears in conjunction with a related function. Each addition, deletion, and modification to an embodiment that is within the meaning and scope of the claims is to be considered to be included within the claims.

[0094] It should be understood that the directions or reference systems in the foregoing description are merely relative directions or movements. For example, references to "front" and "rear", "top" and "bottom", or "left" and "right" merely represent the relative positions or movements of the elements involved.

[0095] The present disclosure may be embodied in other specific forms without departing from the spirit or characteristics thereof. The described embodiments should be considered as illustrative and not restrictive. The scope of the present disclosure is, therefore, indicated by the appended claims rather than the foregoing description. Changes within the meaning and range of equivalence of the claims are to be embraced within the scope of the claims.

Claims

1. An electromagnetic attenuation system, A first electromagnetic isolation device comprising a first EMI attenuation layer, wherein the first electromagnetic isolation device comprises a main body member and a plurality of conductive elements within the main body member, the plurality of conductive elements within the main body member providing electrical conduction from the EMI attenuation layer to an external ground connector, or between the EMI attenuation layer and a second EMI attenuation layer. A second electromagnetic isolation device including a second EMI attenuation layer, A system including a connection device that electrically connects the first EMI attenuation layer to the second EMI attenuation layer.

2. A system according to claim 1, wherein the connecting device includes a first conductive fastener passing through the first EMI attenuation layer and a second conductive fastener passing through the second EMI attenuation layer.

3. The system according to claim 2, wherein the connecting device includes a first brace configured to provide a conductive path from the first conductive fastener to the second conductive fastener.

4. The system according to claim 3, wherein the connecting device includes a second brace configured to provide a conductive path from the first conductive fastener to the second conductive fastener.

5. The system according to claim 1, wherein the first EMI attenuation layer is substantially parallel to the plane of the main body member of the first electromagnetic isolation device.

6. The system according to claim 5, wherein the main body member is waterproof.

7. The system according to claim 5, wherein the main body member is airtight.

8. The system according to claim 1, wherein the first EMI attenuation layer is a mesh.

9. A system according to claim 1, wherein the first EMI attenuation layer and the plurality of conductive elements are configured to be electrically connected to an external earth connector.

10. A system according to claim 9, wherein the plurality of conductive elements include a plurality of conductive rods.

11. A system according to claim 9, wherein the plurality of conductive elements include a plurality of conductive fibers.

12. A system according to claim 9, wherein the main body member includes vinyl.

13. The system according to claim 1, wherein the first EMI attenuation layer has a resistance value of 5 ohms or less.

14. A system according to claim 1, wherein the first electromagnetic isolation device provides at least -60 dB of attenuation from 9 kHz to 18 GHz.

15. The system according to claim 14, wherein the first EMI attenuation layer provides at least -60 dB of attenuation from 9 kHz to 18 GHz.

16. The system according to claim 1, wherein one or more of the first electromagnetic isolation devices or the second electromagnetic isolation devices include a first external earth connector and a second external earth connector, the first and second electromagnetic isolation devices being disposed at a distance of 18 inches or less from each other.

17. An electromagnetic isolation device, The main body is essentially flat and flexible, A first electromagnetic interference (EMI) attenuation layer is disposed inside the main body member, A second EMI attenuation layer is disposed inside the main body member and separated from the first EMI attenuation layer by the main body member, The main body member includes a plurality of conductive elements, An electromagnetic isolation device configured such that the first EMI attenuation layer, the second EMI attenuation layer, and the plurality of conductive elements are electrically connected to an external grounding connector.

18. An electromagnetic insulation device according to claim 17, An electromagnetic isolation device in which the first conductive EMI attenuation layer and the second conductive EMI attenuation layer are the same.

19. An electromagnetic interference (EMI) attenuation enclosure, Multiple electromagnetic insulation devices, where each electromagnetic insulation device is Main body components, A first EMI attenuation layer is disposed inside the main body member, A second EMI attenuation layer is disposed inside the main body member and separated from the first EMI attenuation layer by the main body member, The main body member includes a plurality of conductive elements, A plurality of electromagnetic isolation devices are configured such that the first EMI attenuation layer, the second EMI attenuation layer, and the plurality of conductive elements are electrically connected to an external grounding connector. An EMI attenuation enclosure, comprising a plurality of connection devices, wherein a plurality of connection devices electrically connect a plurality of electromagnetic isolation devices to the external grounding connector.

20. The EMI attenuation enclosure according to claim 19, The plurality of electromagnetic isolation devices are fixed to at least one of the walls, ceiling, and floor, forming an EMI attenuation enclosure.

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