Device with M.2 assembly and assembly holder and corresponding manufacturing method

Abstract

The present invention relates to a device having an M.2 assembly, the M.2 assembly having an M.2 module and a heat sink, the device having a frame that holds the M.2 assembly, the heat sink being pressed against the M.2 assembly by the frame. The present invention also relates to an assembly method.

Description

[Technical Field]

[0001] M.2, also known as Next Generation Form Factor (NGFF), is a specification for internal computer expansion cards and corresponding ports.

[0002] M.2 modules are typically rectangular with a connector on one side and a semicircular recess in the center of the opposite side for screw mounting.

[0003] M.2 modules typically plug into matching ports on a computer system board and are secured there with screws. Components can be mounted on either side of the module. The module type determines whether components can be mounted on one or both sides and how tall the components can be on each side.

[0004] The M.2 specification was designed to replace mSATA. Due to its smaller and more flexible dimensions combined with enhanced features, M.2 has advantageous characteristics compared to mSATA. Therefore, M.2 is better suited for connecting SSDs than mSATA, for example.

[0005] The doubling of transfer speeds for upcoming SSDs with PCI Express (PCIe) 5.0 comes with significantly higher power consumption, which increases roughly linearly with transfer speed, resulting in a high-end SSD with PCIe 5.0 and 14-15 GB / s consuming approximately 14 watts of power. With a further doubling, the fastest SSDs approach a power consumption of approximately 30 watts.

[0006] Existing M.2 modules dissipate some of this waste heat through the motherboard: on the one hand, through the plug-in connection, and on the other hand, through the screws typically provided to secure the module, but this heat dissipation is not sufficient to adequately cool the module at increasing transfer rates.

[0007] Therefore, cooling ribs may be placed on the M.2 module and are typically snapped in place by springs, but the positioning and securing of the ribs by the springs tends to be weak and unreliable. Summary of the Invention

[0008] The present invention aims to solve at least some of the above problems.

[0009] The present invention relates to a device comprising an M.2 assembly and a frame for holding the M.2 assembly.

[0010] The M.2 assembly includes an M.2 module and a heat sink, and the heat sink is pressed against the M.2 module by a frame.

[0011] The M.2 module and the heat sink are preferably connected by an adhesive connection, for example by an adhesive layer or by adhesive glue spots between them.

[0012] The heat sink is preferably of one-piece design and comprises only the cooling plate, which is simple and cheap to manufacture.

[0013] The cooling plate is preferably made in one piece. The cooling plate is preferably made of a metal material. In a preferred embodiment, the thermal conductivity of the cooling plate is similar to that of the M.2 module, thereby promoting heat transfer from the M.2 module to the cooling plate. The thermal conductivity of the M.2 module is understood here as the thermal conductivity of the substrate body of the M.2 module.

[0014] The M.2 module preferably comprises an essentially rectangular plate. The thickness of the plate is significantly less than the length and width of the rectangular plate. The short sides of the rectangular plate are referred to as the ends, short ends, or short edges of the M.2 module. The corresponding sides or sides or edges of the M.2 assembly or heat sink are similarly designated.

[0015] The longer sides are referred to as the longer edges. In the following, the extent along the shorter sides is referred to as the width, and the extent along the longer sides is referred to as the length. The M.2 module has two substantially rectangular surfaces. The corresponding sides or edges of the M.2 assembly or heat sink are designated similarly.

[0016] The heat sink preferably has an essentially rectangular shape, short edges and long edges, similar to an M.2 module.

[0017] Preferably, the heat sink or the cooling plate of the heat sink is placed flat on the surface of the M.2 module, in particular the cooling plate is preferably placed directly on the surface of the M.2 module on which the electronic components are mounted.

[0018] In one embodiment, the heat sink or cooling plate has cooling fins. The cooling fins function to increase the surface area of ​​the cooling plate. The cooling fins may have a shape suitable for increasing the surface area. Preferably, the cooling fins are provided on the surface of the cooling plate facing away from the M.2 module.

[0019] The fins may be arranged in rows and columns on the cooling plate, for example, individual sections may be bent out of the cooling plate to form the fins, and the cooling fins preferably comprise separate components secured to the cooling plate by material bonding, for example by welding.

[0020] According to one embodiment, the frame includes a carrier plate on which the M.2 module is disposed, the carrier plate and the heat sink being disposed on opposite sides of the M.2 module.

[0021] The carrier plate preferably comprises a flat plate having an essentially rectangular shape, and preferably has an essentially rectangular shape and short and long edges, similar to an M.2 module.

[0022] The frame is preferably bent perpendicular to the flat plate, but has an additional bent section which is preferably integral with the carrier plate.

[0023] The two longitudinal bending sections are preferably provided along the two longitudinal edges and the transverse bending section is preferably provided along one of the transverse edges of the carrier plate.

[0024] The flexed section may also be connected by a cover section of the frame that is parallel to the non-flexed section of the carrier plate. In such an embodiment, the M.2 assembly is disposed between the carrier plate and the cover section of the frame. The frame may include two or more cover sections.

[0025] The M.2 module includes a plurality of electrical components disposed substantially on the top surface of a rectangular plate, the top surface being the surface facing away from the carrier plate.

[0026] In this specification, the upper direction is the direction away from the carrier plate, and the lower direction is the direction toward the carrier plate. The upper side of the carrier plate is the side toward the M.2 assembly, and the lower side of the carrier plate is the opposite side of the carrier plate.

[0027] Additional electrical components can be placed on the surface of the rectangular plate opposite the top surface, hereinafter referred to as the bottom surface.

[0028] According to one embodiment, the carrier plate includes knockouts or recesses on the underside of the M.2 module facing the carrier plate that provide space for electrical components.

[0029] According to an embodiment, the frame includes a first rib or a first latch lug against which the first section of the M.2 assembly abuts.

[0030] In particular, the bending section of the frame that bends perpendicular to the carrier plate is provided with ribs or latch lugs.

[0031] According to one embodiment, the first short bent section comprises a rib or latch lug, and the first short edge of the M.2 assembly abuts against or is snapped into place by the rib or latch lug.

[0032] The first rib or latch lug defines the position of the M.2 assembly relative to the frame and secures the M.2 assembly in this position.

[0033] According to one embodiment, the frame includes a second rib or a second latch lug that abuts against a second section of the M.2 assembly, and the first rib, the second rib and / or the first latch lug, the second latch lug hold the M.2 assembly in place in the frame.

[0034] Preferably, the second rib or latch lug is provided on the long bent section, preferably on a section closer to a second short edge opposite the first short edge of the M.2 assembly.

[0035] According to one embodiment, the second rib or latch lug presses the heat sink against the M.2 module, and preferably also the entire M.2 assembly, against the carrier plate.

[0036] With this configuration, the heat sink and M.2 assembly are firmly positioned and secured within the frame.

[0037] The second rib or latch lug may be connected by a cover section of the frame. In such an embodiment, the M.2 assembly is disposed between the carrier plate and the cover section of the frame. The frame may include two or more cover sections connecting the ribs or latch lugs, or a flex section providing the ribs or latch lugs.

[0038] According to an embodiment, the frame includes a screw that secures the M.2 assembly to the second latch lug and presses the heat sink against the M.2 module. This configuration ensures that the M.2 assembly is firmly fixed. The position of the M.2 assembly, which is predefined by the rib or latch lug, cannot be further shifted or displaced.

[0039] According to one embodiment, screws protrude into the heat sink to secure the heat sink and the entire M.2 assembly to the frame.

[0040] The screw may preferably be inserted through the longitudinal bend section or the cover section and may preferably be located near the second latch lug or rib.

[0041] The heat sink may be provided with a suitable recess.

[0042] According to one embodiment, the M.2 assembly includes a thermal pad disposed between the M.2 module and the heat sink.

[0043] The thermal pad is a thermally conductive layer.

[0044] The thermal pad functions to improve heat transfer from the M.2 module to the cooling plate of the heat sink. The thermal conductivity of the thermal pad is preferably similar to that of the M.2 module, and preferably also similar to that of the cooling plate of the heat sink. Thus, the heat transfer from the M.2 module to the heat sink is improved by the thermal pad.

[0045] According to one embodiment, engravings on the surface of the heat sink define the location of thermal pads on the heat sink.

[0046] The engravings are preferably arranged parallel to the outer edge of the cooling plate of the heat sink. Instead of the engravings, protrusions can be provided which provide the same function.

[0047] Preferably, there may be one engraved portion parallel to the first short edge and a second engraved portion parallel to the first long edge.

[0048] The two carvings may be separate from each other or may be connected.

[0049] According to one embodiment, the heat sink, thermal pad, and M.2 module are adhesively secured to one another, with their exact positions predefined by the frame.

[0050] The present invention relates to a method for assembling a device, the device comprising an M.2 assembly having an M.2 module and a heat sink, the device comprising a frame holding the M.2 assembly.

[0051] The device may be any of the devices described above, and the following description may apply to embodiments of the device described above.

[0052] The method includes the following steps.

[0053] In a step, a heat sink is mounted on the M.2 module to provide an M.2 assembly. Preferably, the heat sink is glued to the M.2 module.

[0054] In a step, the M.2 assembly is inserted into the frame until a first section of the M.2 assembly abuts a stop element on the frame.

[0055] Preferably, the first section of the M.2 assembly is the first end or first short edge of the M.2 assembly.

[0056] Preferably, the first stop element of the frame comprises or consists of a first rib or a latch lug.

[0057] In step 2, the M.2 assembly is moved by sliding or pivoting until the second stop element of the frame abuts the M.2 assembly;

[0058] Preferably, the second stop element comprises or consists of a second rib or a latch lug.

[0059] Preferably, the second stop element abuts a second section of the M.2 assembly, which may include a longitudinal edge of the M.2 assembly.

[0060] A plurality of second stopping elements may be provided.

[0061] In step 1, the heat sink is pressed against the M.2 module by fixing the M.2 assembly to the frame.

[0062] According to one embodiment, the M.2 assembly is secured by sliding or pivoting until a second stop element on the frame abuts the M.2 assembly. For example, the second stop element may include a latch lug that snaps the M.2 assembly into place.

[0063] Alternatively or additionally, a screw inserted through the second stop element secures the M.2 assembly.

[0064] According to one embodiment, a thermal pad is disposed between the M.2 module and the heat sink by adhesively adhering the thermal pad onto the surface of the heat sink. Preferably, an engraving or protrusion is provided on the surface of the heat sink that defines the location of the thermal pad.

[0065] Hereinafter, embodiments of the present invention will be described in more detail with reference to the drawings. The present invention is not limited to the described embodiments and drawings. The features described below are illustratively combined and may exist in other combinations. [Brief explanation of the drawings]

[0066] [Figure 1] FIG. 1 illustrates a first embodiment of a device including an M.2 module assembly and a frame. [Figure 2] FIG. 2 illustrates a second embodiment of a device including an M.2 module assembly and a frame. [Figure 3a] FIG. 3a is a top view of an embodiment of an M.2 module. [Figure 3b] FIG. 3b is a bottom view of an embodiment of an M.2 module. [Figure 4] FIG. 4 shows an embodiment of a frame with knockouts. [Figure 5a] 5a to 5d are diagrams illustrating a first assembly method for the first embodiment. [Figure 5b] 5a to 5d are diagrams illustrating a first assembly method for the first embodiment. [Figure 5c] 5a to 5d are diagrams illustrating a first assembly method for the first embodiment. [Figure 5d] 5a to 5d are diagrams illustrating a first assembly method for the first embodiment. [Figure 6a]6a to 6d are diagrams illustrating a second assembly method for the second embodiment. [Figure 6b] 6a to 6d are diagrams illustrating a second assembly method for the second embodiment. [Figure 6c] 6a to 6d are diagrams illustrating a second assembly method for the second embodiment. [Figure 6d] 6a to 6d are diagrams illustrating a second assembly method for the second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0067] 1 shows an example of a first embodiment of a device 1 comprising an M.2 assembly 2 and a frame 3. The M.2 assembly 2 comprises an M.2 module 4 and a heat sink 5.

[0068] The heat sink 5 includes a cooling plate and cooling ribs 6, and the cooling ribs 6 protrude from the surface of the cooling plate opposite the M.2 module 4.

[0069] The M.2 module 4 essentially comprises a rectangular plate. The thickness of the plate is significantly smaller than the length and width of the rectangular plate. The short sides of the rectangular plate are referred to as the ends or short edges of the M.2 module 4. The long sides are referred to as the long edges.

[0070] The heat sink 5 preferably has an essentially rectangular shape and short and long edges, similar to the M.2 module 4 .

[0071] The heat sink 5 or the cooling plate of the heat sink is placed flat on the surface of the M.2 module 4. In particular, the cooling plate is placed directly on the surface of the M.2 module on which the electronic components are mounted.

[0072] The frame 3 comprises a carrier plate 7 and bent sections 8a and 8b which are bent perpendicular to the carrier plate 7 but are integrally formed with the carrier plate 7. The carrier plate and the heat sink are located on opposite sides of the M.2 module.

[0073] The M.2 assembly 2, in particular the M.2 module 4, is placed on a flat surface of the carrier plate 7.

[0074] Furthermore, two longitudinal bending sections 8a are provided along the two longitudinal edges and a lateral bending section 8b is provided along one of the lateral edges of the carrier plate.

[0075] In this embodiment, the longitudinal bending sections are connected by one, two or more cover sections 9 of the frame 3 which are parallel to the non-bending sections of the carrier plate 7 .

[0076] The M.2 assembly 2 is rigidly positioned between the carrier plate 7 and the cover section 9 of the frame 3 .

[0077] In the deployed device 1, the M.2 assembly 2 abuts against a first end rib 10 provided on the inner surface of the short bent section 8a of the frame 3.

[0078] Furthermore, two parts of the M.2 module, including the longitudinal end faces and the top face of the heat sink 5 opposite the carrier plate 7, abut against a second stop element, including the cover part 9.

[0079] Furthermore, the frame 3 includes screws 11 for fixing the M.2 assembly 2 to the cover section 9, and the cover section 9 presses against the upper surface of the heat sink 5, thereby pressing the heat sink 5 against the M.2 module 4 and pressing the entire M.2 assembly 2 against the frame 3. This firmly fixes the M.2 assembly 2.

[0080] A second alternative embodiment is shown in Figure 2. The second embodiment is similar to the first embodiment except for the following features.

[0081] According to a second embodiment shown in FIG. 2, the screws are inserted through the longitudinal bent section 8a.

[0082] Furthermore, the longitudinal bending section 8a is not connected by the cover section 9 but is provided on its inner surface with protruding latch lugs 13 onto which the M.2 assembly 4 is snapped.

[0083] Furthermore, the M.2 module 4 includes a plurality of electrical components 12 disposed on its upper or lower surface, as shown in Figures 3a and 3b. Figure 3a shows the upper surface of the M.2 module 4, and Figure 3b shows the lower surface of the M.2 module 4.

[0084] Therefore, as shown in FIG. 4, the carrier plate 7 is provided with knockouts 14 or recesses on the underside of the M.2 module 4 facing the carrier plate 7, which provide space for electrical components.

[0085] The following figures illustrate a first exemplary method of assembly of a first embodiment of the device.

[0086] In a first step, shown in FIG. 5 a , a thermal pad 15 is adhesively attached to the underside of the heat sink 5 .

[0087] Engravings 16 or protrusions are provided on the surface of the heat sink 5 to define the location of the thermal pad. The engravings 16 predefine the location of the thermal pad 15. The thermal pad 15 is a flat pad that is placed flat on the heat sink 5.

[0088] Due to the precise alignment, heat transfer between the thermal pad 15 and the heat sink 5 is increased, requiring a smaller thermal pad 15. The smaller size of the thermal pad also reduces manufacturing costs.

[0089] In a second step, shown in Figure 5b, the heat sink 5 with the thermal pad 15 attached thereto is placed on top of the M.2 module 4 and adhesively secured to form the M.2 assembly 2. The edges of the heat sink 5 are aligned with the short and long edges of the M.2 module 4. Precise alignment improves heat transfer from the electronic component 12 to the heat sink 5.

[0090] In the third step shown in FIG. 5c, the fixed M.2 assembly 2 is inserted into the frame 3 and slid into the empty space between the carrier plate 7, the bending sections 8a, 8b and the cover section 9, with the M.2 module facing the carrier plate 7 and the upper cooling ribs 6 of the heat sink 5 facing the cover section 9.

[0091] The M.2 assembly 2 is inserted from the short side of the frame that does not have a bent section.

[0092] The M.2 assembly 2 is inserted until it abuts against the rib 10 at the short bent section 8b of the frame 3.

[0093] In this embodiment, the heat sink 5 provides two protruding tabs 17 that abut against the ribs 10 .

[0094] The position of the M.2 assembly within the frame 3 is precisely defined by the ribs 10, the bent edges 8a, 8b, and the cover portion 9. Additionally, the longitudinal bent section 8a may provide latch lugs 13 that snap the M.2 assembly 2 towards the carrier plate 7.

[0095] Also in this embodiment, screws 11 are inserted through the cover sections 9 of the frame 3. The screws press against corresponding sections above the heat sink 5. These corresponding sections may not be provided with cooling ribs 6.

[0096] The screws 11 further press the heat sink 5 against the M.2 module 4, and the entire M.2 assembly 2 against the carrier plate 7 of the frame 3. Thus, the entire assembly is firmly fixed in the frame 3, and the relative positions between the single elements of the device 1 can no longer be changed.

[0097] Furthermore, due to the tight fixation, contact and heat transfer between the single elements is improved.

[0098] A top view of the fully assembled device 1 is shown in Figure 5d.

[0099] In the following figures, an alternative assembly method for the second embodiment is shown: The assembly of the M.2 assembly 4 is similar to the first method.

[0100] 6a, the first end of the M.2 assembly, on whose first side the tab 17 of the heat sink 5 is provided, is inserted into the first latch lug 13 on the short bent edge 8b of the frame 3. This causes the tab 17 to be hinged to the latch lug 13.

[0101] The entire M.2 assembly 2 is then pivoted into the frame 3 and placed therein as before.

[0102] Unlike the previous method, in the second embodiment, no cover section 9 is provided.

[0103] In the second embodiment, the longitudinal edge 8a is provided with a latch lug 13 which snaps the M.2 assembly 4 into place and presses it towards the carrier plate 7 after pivoting into the frame 3.

[0104] Furthermore, in the next step, screws are inserted through the longitudinal latch lugs 13 into the heat sink 5 to firmly secure the M.2 assembly 2 to the frame 3. This step is shown in Figure 6c.

[0105] By rigidly fixed it is meant that the single elements of the device 1 cannot move relative to each other.

[0106] The swivel or slide insertion technique can be easily performed by any operator. The assembly of the device is precisely predefined. After assembly, the relative positions can no longer be changed. [Explanation of symbols]

[0107] 1 device 2 M.2 Assembly 3 frames 4 M.2 modules 5 Heatsink 6 Cooling Ribs 7 Carrier Plate 8a Longitudinal bending section 8b Short bent section 9 Cover Section 10. Ribs 11 screws 12 Electrical Components 13 Latch Lug 14 Knockout 15 Thermal Pad 16 Sculpture Club 17 tabs

Claims

1. A device having an M.2 assembly, The M.2 assembly includes an M.2 module and a heat sink; the device comprises a frame that holds the M.2 assembly; The heat sink is pressed against the M.2 assembly by the frame. device.

2. the frame includes a carrier plate, the M.2 module is disposed on the carrier plate; The carrier plate and the heat sink are disposed on opposite sides of the M.2 module. The device of claim 1.

3. the carrier plate includes knockouts that provide space for electrical components on a surface of the M.2 module opposite the carrier plate; 3. A device according to claim 1 or 2.

4. the frame includes a first rib or a first latch lug against which the first section of the M.2 assembly abuts; 4. A device according to any one of claims 1 to 3.

5. the frame includes a second rib or second latch lug that abuts against a second section of the M.2 assembly; the first and second ribs and / or the first and second latch lugs hold the M.2 assembly in place on the frame; The device of claim 4.

6. the second rib or the second latch lug presses the heat sink against the M.2 module; The device of claim 5.

7. the frame includes a screw that secures the M.2 assembly to the second latch lug and presses the heat sink against the M.2 module; 7. A device according to claim 5 or 6.

8. The screw protrudes into the heat sink. The device of claim 7.

9. The M.2 assembly includes a thermal pad disposed between the M.2 module and the heat sink.

9. A device according to any one of claims 1 to 8.

10. Engravings on the surface of the heat sink define the location of the thermal pad on the heat sink. The device of claim 9.

11. The heat sink, the thermal pad, and the M.2 are adhesively secured together.

11. A device according to claim 9 or 10.

12. 1. A method of assembling a device, comprising: The device includes an M.2 assembly having an M.2 module and a heat sink, and a frame for holding the M.2 assembly, and the method includes: - adhesively securing a heat sink onto the M.2 module to provide an M.2 assembly; - inserting the M.2 assembly into the frame until a first section of the M.2 assembly abuts a first stop element of the frame; - sliding or pivoting the M.2 assembly until a second stop element of the frame abuts the M.2 assembly; - pressing the heat sink against the M.2 module by fixing the M.2 assembly in the frame; A method comprising:

13. The M.2 assembly is secured by sliding or pivoting until a second stop element on the frame abuts the M.2 assembly.

13. The method of claim 12.

14. The M.2 assembly is secured by a screw inserted through the second stop element.

14. The method according to claim 12 or 13.

15. disposing a thermal pad between the M.2 module and the heat sink by adhesively securing the thermal pad on a surface of the heat sink; Engravings on the surface of the heat sink define the location of the thermal pad.

15. The method of any one of claims 12 to 14.

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