Low-resonance structure and electrical device

Abstract

This application discloses a low-resonance structure and an electric device, the low-resonance structure being disposed within a case (1) of the electric device and including at least one functional module (7) and a vibration-damping medium (4), the case (1) having a first vibration-damping cavity (31), the vibration-damping medium (4) being located within the first vibration-damping cavity (31), the case (1) having an intermediate frame (12) and a housing (11), an accommodating cavity (3) being formed between the intermediate frame (12) and the housing (11), a sealing cover (5) being disposed within the accommodating cavity (3), at least one functional module (7) being disposed within the intermediate frame (12), the first vibration-damping cavity (31) being formed between the functional module (7), the sealing cover (5) and the housing (11). This application solves the problem of irregular airflow inside the electric device causing resonance of the case (1), thereby reducing the impact of the airflow on the case (1) and reducing the resonance of the electric device, thereby optimizing the user experience.

Description

[Technical Field]

[0001] Related Applications This application claims priority to a Chinese patent application bearing patent application number 202211231927.7, filed on September 30, 2022, and entitled "Low Resonance Structure and Electrical Device."

[0002] The present application relates to the field of audio electrical technology, and more particularly to low-resonance structures and electrical devices having such low-resonance structures. [Background technology]

[0003] Currently, mainstream electronic devices often use an open-type sound cavity design to improve the sound quality of their speakers or receivers. That is, the rear cavity of the speaker module or receiver module is not sealed, and air flows through the sound cavity inside the device. However, the irregular airflow often causes resonance in the device case, resulting in a noticeable vibration when the user holds the device. The vibration becomes more intense as the sound level increases, resulting in a poor listening experience. Therefore, how to design the sound cavity structure of electronic devices to optimize the user's listening experience is an urgent issue that needs to be resolved.

[0004] The prior art electrical device uses a semi-open cavity design, but by installing a damper member in the leakage hole of the rear cavity, the compliance of the rear sound cavity itself can be increased and the amount of leakage can be controlled, thereby slightly reducing resonance. In the other prior art electrical device, a design is used in which an audio guidance channel is added to the rear cavity of the speaker module and then an open sound cavity is connected. The air vibration energy is absorbed by several changes in direction and reflection within the vibration-damping channel, thereby realizing the damping effect of airflow energy and slightly reducing case resonance. However, whether the semi-open cavity design or the cavity with the audio guidance channel is used, case resonance can only be reduced slightly in actual application, and case resonance due to the open sound cavity design of the electrical device still remains a problem to be solved. Summary of the Invention

[0005] This application solves the problem of resonance in the case of an electrical device caused by irregular airflow in current open sound cavity designs by filling the inside of the open sound cavity with a vibration-damping medium, thereby reducing the impact of airflow on the case and further reducing the resonance of the electrical device, thereby providing a low-resonance structure and electrical device that can optimize the user experience.

[0006] The above object of the present application is mainly achieved by the following technical means.

[0007] The present application provides a low-resonance structure that is provided in a case of an electrical device, the low-resonance structure comprising at least one functional module and a vibration-damping medium, the case having a first vibration-damping cavity, the vibration-damping medium being located in the first vibration-damping cavity, the case having an intermediate frame and a housing, an accommodating cavity being formed between the intermediate frame and the housing, a sealing cover being formed in the accommodating cavity, at least one functional module being provided in the intermediate frame, and the first vibration-damping cavity being formed between the functional module, the sealing cover and the housing.

[0008] The present application provides a low-resonance structure provided within a case of an electrical device, the low-resonance structure comprising at least one functional module and a vibration-damping medium, the case having a second vibration-damping cavity, the vibration-damping medium being located within the second vibration-damping cavity, the case having a screen module, an intermediate frame and a housing, the screen module being connected to the housing by the intermediate frame, at least one functional module being provided in the screen module, and the second vibration-damping cavity being formed between the screen module and the intermediate frame.

[0009] The present application provides an electric device comprising a case and the low-resonance structure mounted within the case.

[0010] Compared with the prior art, the technical solution of this application has the following features and advantages:

[0011] By filling the interior of an electrical device with a vibration-damping medium, the impact of the internal airflow on the case of the electrical device can be reduced, and the resonance of the electrical device can be further reduced, thereby optimizing the user experience and increasing the market competitiveness of the electrical device. [Brief explanation of the drawings]

[0012] In the following, in order to more clearly explain the embodiments of the present application or the technical solutions of the prior art, the drawings used in the embodiments or the prior art will be briefly described. However, the following drawings are only some of the embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings from these drawings without any inventive efforts. [Figure 1] FIG. 1 is a structural schematic diagram according to one embodiment of the present application. [Figure 2] FIG. 2 is a structural schematic diagram according to another embodiment of the present application. [Figure 3] FIG. 3 is an exploded structural schematic diagram of the electrical device of the present application. [Figure 4] Figure 4 shows the frequency response curves of the sound pressure levels generated by four groups of different test samples at different vibration frequencies. [Figure 5] Figure 5 shows the impedance curves generated by three groups of different test samples under different vibration frequencies. DETAILED DESCRIPTION OF THE INVENTION

[0013] (Explanation of symbols) 1 case; 11 housing; 111 rear cover; 12 intermediate frame; 2 electro-acoustic conversion module; 21 speaker module; 211 speaker unit; 22 vibration sound generation module; 23 open rear cavity; 3 accommodating cavity; 31 first vibration damping cavity; 32 second vibration damping cavity; 4 vibration damping medium; 5 sealing cover; 6 screen module; 7 function module.

[0014] In order to more clearly explain the technical solution of the present application, the technical solution according to the embodiments of the present application will be more clearly and completely explained below with reference to the drawings used in the embodiments of the present application, but these embodiments are not all embodiments but only some embodiments of the present application. It should be understood that all other embodiments that can be obtained by those skilled in the art based on the embodiments of the present application without any inventive ideas fall within the scope of protection of the present application.

[0015] When an element is referred to as being "mounted" on another element, this includes being mounted directly on the other element or being mounted via the other element. When an element is referred to as being "connected" to another element, this includes being connected directly to the other element or being connected via the other element. As used herein, the terms "vertical," "horizontal," "left," "right," and similar descriptions are used for illustrative purposes and are not intended to be exclusive examples.

[0016] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art. Terms used in the specification of this application are only used to describe specific embodiments, and this application is not limited thereto. The term "and / or" used herein should be understood to include any one or all combinations of one or more of the associated items.

[0017] First embodiment The present application provides a low-resonance structure provided in a case 1 of an electrical device, the low-resonance structure comprising at least one functional module 7 and a vibration-damping medium 4, the case 1 having a first vibration-damping cavity 31, the vibration-damping medium 4 being located in the first vibration-damping cavity 31, the case 1 having an intermediate frame 12 and a housing 11, an accommodating cavity 3 being formed between the intermediate frame 12 and the housing 11, a sealing cover 5 being provided in the accommodating cavity 3, at least one functional module 7 being provided in the intermediate frame 12, the first vibration-damping cavity 31 being formed between the functional module 7, the sealing cover 5 and the housing 11.

[0018] According to the low-resonance structure of the present application, the vibration-damping medium 4 is located in the first vibration-damping cavity 31 formed between the functional module 7 and the case 1, which reduces the resonance effect on the case 1 when the functional module 7 is in operation. This low-resonance structure can greatly reduce the impact of irregular airflow on the case 1 when the functional module 7 is in operation, thereby reducing the resonance of the electrical device.

[0019] Specifically, at least one functional module 7 is fixed to the case 1 of the electrical device by the intermediate frame 12, and the sealing cover 5 is connected to the intermediate frame 12 and can support the fixing of the at least one functional module 7 on the intermediate frame 12. In this application, the functional module 7 may be a speaker module, a receiver module, a camera module, a processor chip, a battery module, etc., and the electrical device may be, but is not limited to, a mobile phone, a personal computer, a tablet PC, a wearable device, an AR / VR device, etc. In this application, as shown in Figure 1, the functional module 7 is an electro-acoustic transducer module 2 having an open rear cavity 23, the open rear cavity 23 of the electro-acoustic transducer module 2 is connected to a first vibration-damping cavity 31, and the vibration-damping medium 4 is located in the open rear cavity 23 and the first vibration-damping cavity 31.

[0020] A vibration-damping medium 4 is filled between the electroacoustic transducer module 2 with an open rear cavity 23 and the case 1, which can reduce the resonance effect on the case 1 when the electroacoustic transducer module 2 of the electrical device is in operation. This low-resonance structure can greatly improve the impact on the case 1 caused by irregular airflow when the electroacoustic transducer module 2 is in operation, thereby reducing the resonance of the electrical device.

[0021] Specifically, referring to Figures 1 and 3, an electroacoustic transducer module 2 is fixed inside the case 1 of the electrical device, and the electroacoustic transducer module 2 uses an open sound cavity design, that is, the rear cavity of the electroacoustic transducer module 2 is directly connected to the internal space of the electrical device. In this embodiment, the electroacoustic transducer module 2 may be a speaker module 21, which is fixed to the rear cover 111 by an intermediate frame 12, and a first vibration-damping cavity 31 is formed between the speaker module 21, the intermediate frame 12 and the rear cover 111, and the speaker unit 211 of the speaker module 21 extends into the first vibration-damping cavity 31.

[0022] Specifically, the volume of the receiving cavity 3 is defined by the combined structure of the rear cover 111 and the intermediate frame 12, and each module of the electrical device is attached to the intermediate frame 12, which may be, for example, a speaker module 21, a handset module, a camera module, a processor chip, a battery module, etc. In this embodiment, the speaker module 21 is fixedly connected to the intermediate frame 12, and the open rear cavity 23 of the speaker module 21 may be a fully open rear cavity, that is, the speaker unit 211 of the speaker module 21 may be exposed to the outside and extend into a first vibration-damping cavity 31 defined by the receiving cavity 3, and the vibration-damping medium 4 may be filled in the first vibration-damping cavity 31.

[0023] In order to verify that the vibration-damping medium 4 filled between the speaker module 21 and the rear cover 111 of the present application effectively reduces the impact on the rear cover 111 caused by irregular airflow when the speaker module 21 is in operation, sound vibration tests were conducted on the low-resonance structures of the speaker module 21 having four groups of different structures, as follows:

[0024] A sound vibration test was carried out on each of the low-resonance structures of the speaker modules 21 having different structures, and the maximum acceleration value of the rear cover 111 of the low-resonance structure of each group was measured in the same test environment.

[0025] Test group 1: Using the low-resonance structure of the speaker module 21 with the open rear cavity 23 according to the present application, the first vibration-damping cavity 31 was not filled with the vibration-damping medium 4 .

[0026] Test Group 2: A low-resonance structure of a speaker module with a semi-open rear cavity is used, in which a rear cover is connected to the speaker module, the rear cover has an opening, and a damper member is covered at the opening.

[0027] Test group 3: A low-resonance structure of a speaker module with a rear cavity is used, and a voice guidance channel is connected to the speaker module, and a damper member is filled in the voice guidance channel.

[0028] Test group 4: Using the low-resonance structure of the speaker module 21 with the open rear cavity 23 according to the present application, the first vibration-damping cavity 31 is filled with the vibration-damping medium 4 .

[0029] Test conditions: the effective radiation area of ​​the diaphragm of each of the speaker modules is 70 mm², the resonance frequency of each of the speaker modules is 800 Hz, the maximum amplitude of each of the speaker modules is 0.5 mm, and the rear cavity volume of each of the speaker modules is 4 cm². 3 (However, the length*width*height of the rear cavity is 150mm*60mm*0.45mm), and the thickness of the rear cover is 0.6mm.

[0030] The test results are shown in the table below.

[0031] [Table 1]

[0032] Referring to the maximum acceleration of the rear cover 111 of each test group obtained from the test, it can be seen that the maximum acceleration of test group 4 filled with vibration-damping medium 4 is significantly smaller than the maximum acceleration of the other three groups. Therefore, it can be seen that when vibration-damping medium 4 is filled between the speaker module 21 and the rear cover 111, the impact on the rear cover 111 caused by irregular airflow when the speaker module 21 is in operation can be effectively reduced, and further the resonance of the electrical device can be reduced.

[0033] According to one embodiment of the present application, the vibration-damping medium 4 is filled into the cavity of the first vibration-damping cavity 31 and the open rear cavity 23, or the vibration-damping medium 4 is a vibration-damping coating layer formed on the cavity wall of the first vibration-damping cavity 31 by deposition, coating or bonding.

[0034] Specifically, in one possible embodiment, the vibration-damping medium 4 is directly filled into the first vibration-damping cavity 31 and the open rear cavity 23; in another possible embodiment, the vibration-damping medium 4 is formed on the cavity wall of the first vibration-damping cavity 31 as a vibration-damping coating layer by deposition, coating, bonding, etc.

[0035] According to one embodiment of the present application, the damping medium 4 may be a granular or flaked structure consisting of zeolite particles and a matrix medium.

[0036] Specifically, the matrix medium and the zeolite particles may be bonded by methods such as deposition, spray coating, etc. For example, when the matrix medium has a granular or flake structure, the zeolite particles, adhesive, and solvent are first mixed to obtain a uniformly dispersed suspension, and then the suspension is mixed with the granular matrix medium by deposition or spray coating, etc. Alternatively, the suspension may be spray coated and deposited on the surface of the flake matrix medium, followed by a drying and curing process to obtain the finished seismic damping medium 4.

[0037] In order to verify the seismic reduction effect of the seismic reduction media 4 with different structures, vibration tests were carried out on three groups of seismic reduction media 4 with different structures, as follows.

[0038] Vibration tests were carried out on the rear covers 111 of the electrical devices filled with the vibration-damping media 4 of different structures, and the sound pressure levels and impedance values ​​generated by the rear covers 111 of each group at different vibration frequencies were measured.

[0039] Test conditions: A microphone was placed facing the vibrating membrane of the speaker module, and a voltage of 1.5 V and a 0.05 m free field (i.e., the microphone was 5 cm away from the speaker) were applied to the speaker module to perform a vocal vibration test.

[0040] Test quantity: Divide into three groups: Group A, Group B, and Group C.

[0041] Group A: the first vibration-damping cavity 31 is not filled with vibration-damping medium 4; Group B: The first vibration-damping cavity 31 is filled with a piece of vibration-damping medium 4; Group C: The first vibration-damping cavity 31 is filled with a granular vibration-damping medium 4;

[0042] Test results: As shown in Figures 4 and 5, Figure 4 shows the frequency response curves formed by three groups of different test samples under different vibration frequencies. The fact that the curves are not flat means that the samples resonate at the vibration frequencies corresponding to the peaks / valleys. Figure 5 shows the impedance curves formed by three groups of different samples under different vibration frequencies. The fact that the curves are not flat means that the samples resonate at the vibration frequencies corresponding to the peaks / valleys.

[0043] As can be seen from the peaks of the curves in Figure 5, the low-frequency formants of Group A samples (not filled with seismic damping material 4) resonate significantly at 400, 600, and 800 Hz. The resonant frequency of Group B samples (filled with flaked seismic damping material 4) is approximately 1200 Hz. The resonant frequency of Group C samples (filled with particulate seismic damping material 4) is 800 Hz, and the sound pressure level around the resonant frequency is low. As can be seen from the impedance curves in Figure 5, the impedance curves of Groups B and C are relatively flat, indicating that the device's resonance is significantly controlled after the addition of the seismic damping material 4. In short, the particulate seismic damping material 4 has a good vibration damping effect, while the flaked seismic damping material 4 can achieve vibration reduction for the device.

[0044] According to one embodiment of the present application, the material of the matrix medium may be sound-absorbing cotton, foam, carbon skeleton or organic skeleton.

[0045] Specifically, the sound-absorbing cotton may be made of centrifugal glass wool, rock wool, mineral wool, etc., or glass fiber, polyester fiber, plant fiber, etc. may be used as the material for the sound-absorbing cotton, and polyurethane may be used as the material for the foam, but is not limited to these.

[0046] According to one embodiment of the present application, the vibration-damping medium 4 is a schist structure formed by adhering glass fibers and zeolite particles, wherein the thickness of the schist structure may be 0.15 mm to 0.05 mm, the porosity of the schist structure may be 60% or more, and the particle size of the zeolite particles may be 5 μm to 200 μm.

[0047] Second embodiment The present application provides a low-resonance structure that is installed in a case 1 of an electrical device, and as shown in Figure 2, the low-resonance structure comprises at least one functional module 7 and a vibration-damping medium 4, the case 1 comprises a second vibration-damping cavity 32, the vibration-damping medium 4 is located in the second vibration-damping cavity 32, the case 1 comprises a screen module 6, an intermediate frame 12 and a housing 11, the screen module 6 is connected to the housing 11 by the intermediate frame 12, at least one functional module 7 is installed in the screen module 6, and the second vibration-damping cavity 32 is formed between the screen module 6 and the intermediate frame 12.

[0048] In this application, the functional module 7 is a vibration-sound generating module 22, which can be a magnetodynamic exciter, a piezoelectric exciter or a mixed type exciter.

[0049] According to the low-resonance structure of the present application, the vibration-damping medium 4 is located in the second vibration-damping cavity 32 formed between the screen module 6 and the intermediate frame 12, which can reduce the resonance impact on the intermediate frame 12 and the housing 11 when the vibration-producing module 22 of the electrical device is operating. The low-resonance structure of this embodiment can greatly reduce the impact on the intermediate frame 12 and the housing 11 caused by irregular airflow, mechanical vibration, etc. when the vibration-producing module 22 is operating, and can further reduce the resonance of the electrical device.

[0050] Specifically, the vibration sound-generating module 22 and the screen module 6 are interdigitated and connected to each other to drive the sound generation of the screen module 6. In the present application, other modules may be provided between the screen module 6 and the intermediate frame 12, and the remaining space between them forms the second vibration-reducing cavity 32. To solve the problem of irregular airflow in the second vibration-reducing cavity 32 caused by the vibration of the screen module 6, which causes vibration of the intermediate frame 12 and the housing 11, the second vibration-reducing cavity 32 is filled with a vibration-reducing medium 4, thereby reducing the impact of irregular airflow caused by the operation of the vibration sound-generating module 22 on the intermediate frame 12 and the housing 11, and thereby reducing the resonance of the electrical device.

[0051] According to one embodiment of the present application, the damping medium 4 may be a granular or schistose structure consisting of zeolite particles and a matrix medium.

[0052] Specifically, the matrix medium and the zeolite particles may be bonded by methods such as deposition, spray coating, etc. For example, when the matrix medium has a granular or flake structure, the zeolite particles, adhesive, and solvent are first mixed to obtain a uniformly dispersed suspension, and then the suspension is mixed with the granular matrix medium by deposition or spray coating, etc. Alternatively, the suspension may be spray coated and deposited on the surface of the flake matrix medium, followed by a drying and curing process to obtain the finished seismic damping medium 4.

[0053] The vibration damping effect test of the vibration damping medium 4 with different structures has already been explained in detail in the first embodiment through test data, so the overlapping explanation will be omitted.

[0054] According to one embodiment of the present application, the material of the matrix medium may be sound absorbing cotton, foam, carbon skeleton or organic skeleton.

[0055] Specifically, the sound-absorbing cotton may be made of centrifugal glass wool, rock wool, mineral wool, etc., or glass fiber, polyester, plant fiber, etc. may be used as the material for the sound-absorbing cotton, and polyurethane may be used as the material for the foam, but is not limited to these.

[0056] According to one embodiment of the present application, the vibration-damping medium 4 is a schist structure formed by adhering glass fibers and zeolite particles, wherein the thickness of the schist structure may be 0.15 mm to 0.05 mm, the porosity of the schist structure may be 60% or more, and the particle size of the zeolite particles may be 5 μm to 200 μm.

[0057] Third embodiment This application provides an electric device including a case 1 and the above-described low-resonance structure mounted within the case 1. The specific structure, operating principle, and beneficial effects of the low-resonance structure are the same as those of the low-resonance structures described in the first and second embodiments, so redundant description will be omitted. The low-resonance structure within the electric device can significantly reduce resonance generated during use of the electric device, optimizing the user experience.

[0058] Specifically, the electrical device may be, but is not limited to, a mobile phone, audio equipment, a personal computer, a tablet PC, a teleconferencing device, a wearable device or an AR / VR device, an automobile, a smart home, etc., which have a low-resonance structure.

[0059] The above specific examples have described in detail the objectives, technical solutions and beneficial effects of the present application, but these are merely specific examples of the present application, and the protection scope of the present application is not limited thereto. It should be understood that all amendments, equivalent replacements, improvements, etc. made within the scope of the spirit and principles of the present application fall within the protection scope of the present application.

Claims

1. A low-resonance structure provided within a case of an electrical device, the low-resonance structure comprising at least one functional module and a vibration-damping medium, the case having a first vibration-damping cavity, the vibration-damping medium being located within the first vibration-damping cavity, the case having an intermediate frame and a housing, an accommodating cavity being formed between the intermediate frame and the housing, a sealing cover being formed within the accommodating cavity, at least one functional module being provided on the intermediate frame, the first vibration-damping cavity being formed between the functional module, the sealing cover and the housing.

2. 2. The low-resonance structure of claim 1, wherein the functional module is an electroacoustic transducer module having an open rear cavity, the open rear cavity of the electroacoustic transducer module is connected to the first vibration-damping cavity, and the vibration-damping medium is positioned within the first vibration-damping cavity and the open rear cavity.

3. The low-resonance structure according to claim 2, wherein the electro-acoustic transducer module is a speaker module, the housing is a rear cover of the electrical device, and the speaker unit of the speaker module extends into the first vibration-damping cavity.

4. The low-resonance structure according to claim 2, wherein the vibration-damping medium is filled in the cavity of the first vibration-damping cavity and the cavity of the open rear cavity, or the vibration-damping medium is a vibration-damping coating layer formed on the cavity wall of the first vibration-damping cavity by deposition, coating or bonding.

5. 5. The low resonance structure according to claim 4, wherein the vibration damping medium has a granular or schistular structure made of zeolite particles and a matrix medium.

6. The low resonance structure of claim 5, wherein the material of the matrix medium is sound-absorbing cotton, foam, carbon skeleton, or organic skeleton.

7. The vibration-damping medium is a schist structure formed by adhering glass fibers and zeolite particles, the thickness of the schist structure is 0.15 mm to 0.05 mm, the porosity of the schist structure is 60% or more, and the particle size of the zeolite particles is 5 μm to 200 μm.

8. A low-resonance structure provided within a case of an electrical device, the low-resonance structure comprising at least one functional module and a vibration-damping medium, the case comprising a second vibration-damping cavity, the vibration-damping medium being positioned within the second vibration-damping cavity, the case comprising a screen module, an intermediate frame and a housing, the screen module being connected to the housing by the intermediate frame, at least one functional module being provided in the screen module, and the second vibration-damping cavity being formed between the screen module and the intermediate frame.

9. The low resonance structure according to claim 8, wherein the functional module is a vibration-sound generating module, and the vibration-sound generating module is a magnetodynamic exciter, a piezoelectric exciter or a hybrid exciter.

10. The low resonance structure according to claim 9, wherein the vibration damping medium has a granular or schistose structure made of zeolite particles and a matrix medium.

11. The low resonance structure of claim 10, wherein the material of the matrix medium is sound-absorbing cotton, foam, carbon skeleton, or organic skeleton.

12. The vibration-damping medium is a schist structure formed by adhering glass fibers and zeolite particles, the thickness of the schist structure is 0.15 mm to 0.05 mm, the porosity of the schist structure is 60% or more, and the particle size of the zeolite particles is 5 μm to 200 μm.

13. An electric device comprising a case and a low resonance structure according to any one of claims 1 to 12 mounted within the case.

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