Wireless data communication in plasma processing chambers through VI sensors and RF generators

Abstract

Embodiments disclosed herein include a diagnostic board. In one embodiment, the diagnostic board comprises a board and a sensor on the board. In one embodiment, the diagnostic board further comprises a communications module on the board communicatively coupled to the sensor. In one embodiment, the communications module comprises an output antenna, a switch coupled to the output antenna, and a signal source coupled to the switch.

Description

[Technical Field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application claims priority to U.S. Patent Application No. 18 / 220,020, filed July 10, 2023, which claims the benefit of U.S. Provisional Application No. 63 / 412,278, filed September 30, 2022, the entire contents of which are incorporated herein by reference.

[0002] Embodiments relate to the field of semiconductor manufacturing, and in particular to a wireless communication architecture for uploading and downloading information from sensors within semiconductor tools.

[0003] 2. Description of Related Art Instrumented substrates have been developed to monitor processing conditions within the chamber. For example, an instrumented substrate may include temperature sensors, pressure sensors, electrical sensors (e.g., plasma state sensors), etc. Data collected by the instrumented substrate is often stored in memory on the instrumented substrate. After processing, the instrumented substrate may be removed from the chamber, and the collected data may be downloaded to an external device for data processing, analysis, etc.

[0004] However, real-time data communication between the instrumentation board and external devices would be a better solution. Unfortunately, the strong electromagnetic fields present inside the chamber often induce radio interference and disrupt wireless communication links. Summary of the Invention

[0005] Embodiments disclosed herein include a diagnostic substrate. In one embodiment, the diagnostic substrate comprises a substrate and a sensor on the substrate. In one embodiment, the diagnostic substrate further comprises a communications module on the substrate communicatively coupled to the sensor. In one embodiment, the communications module comprises an output antenna, a switch coupled to the output antenna, and a signal source coupled to the switch.

[0006]

[0010] Embodiments disclosed herein may further include a diagnostics board comprising a substrate and a sensor on the substrate. In one embodiment, the diagnostics board further comprises a communications module on the substrate communicatively coupled to the sensor. In one embodiment, the communications module comprises an input antenna configured to collect modulated data, a demodulator coupled to the input antenna, and a controller configured to control the sensor.

[0007] Embodiments disclosed herein may also include a plasma processing tool. In one embodiment, the plasma processing tool includes a chamber configured to contain a plasma and an RF generator coupled to the chamber, where power from the RF generator is configured to couple with one or more gases in the chamber to generate the plasma. The plasma processing tool further includes a voltage-current (VI) sensor between the RF generator and the chamber and a diagnostics board within the chamber. In one embodiment, the diagnostics board includes a substrate, a sensor on the substrate, and a communications module coupled to the sensor, the communications module configured to wirelessly communicate with a device outside the chamber using a carrier signal at a carrier frequency that is an integer multiple of the frequency of the plasma. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a cross-sectional view of a plasma chamber having an RF generator and a VI sensor according to one embodiment. [Figure 2A]1 is a schematic diagram of an instrumentation board having a communications module configured to download data from the instrumentation board to an external device, according to one embodiment. [Figure 2B] FIG. 1 is a schematic diagram of an instrumentation board having a communications module with only an output antenna, according to one embodiment. [Figure 3] FIG. 1 is a cross-sectional view of a plasma chamber having a first RF generator coupled to a chuck and a second RF generator coupled to a showerhead, according to one embodiment. [Figure 4] FIG. 1 is a schematic diagram of an instrumentation board having a communication module configured to upload data from an external device, according to one embodiment. [Figure 5A] 1 is a schematic diagram of an instrumentation board having a communication module configured to transmit data between the instrumentation board and an external device, according to one embodiment. [Figure 5B] 10 is a schematic diagram of an instrumentation board having a communication module configured to transmit data between the instrumentation board and an external device, according to a further embodiment; [Figure 6] FIG. 1 illustrates a block diagram of an exemplary computer system that may be used with a processing tool, according to one embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] The systems described herein include wireless communication architectures for uploading and downloading information from sensors in semiconductor tools. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the embodiments. It will be apparent to those skilled in the art that the embodiments may be practiced without such specific details. In other instances, well-known aspects are not described in detail so as not to unnecessarily obscure the embodiments. Furthermore, it will be understood that the various embodiments illustrated in the accompanying drawings are illustrative representations and are not necessarily drawn to scale.

[0010] As mentioned above, instrumentation boards currently have limited capabilities for wireless communication with external devices. Therefore, instrumentation boards typically store data in on-board memory, from which it is retrieved after processing is completed and the instrumentation board is removed from the plasma chamber. However, wireless communication offers a superior data transfer mechanism, allowing for real-time data analysis and processing. Unfortunately, the strong electromagnetic fields within plasma chambers can induce interference that can render traditional wireless communication protocols (e.g., Wi-Fi and Bluetooth) inappropriate or inaccurate.

[0011] Accordingly, embodiments disclosed herein include wireless communication solutions that use the RF signal used to induce the plasma, or the plasma itself (finely modulated), as a carrier for data signals to and from the instrumentation board. In a first embodiment, data is downloaded wirelessly from the instrumentation board. In such an embodiment, a signal source (such as a clock or signal amplifier) ​​provides a signal at a frequency significantly different from the RF signal. For example, this signal may be an order of magnitude higher than the RF signal. This high-frequency signal is then modulated using a modulator and / or switch coupled to the output antenna. Switching the output antenna on and off changes the impedance. This change in impedance can be detected by a capacitive or inductive RF pickup sensor connected to the RF supply line. Demodulation of the signal can then be implemented to extract the data transmitted by the instrumentation board.

[0012] Embodiments may also allow for data uploading to the instrumentation board. Data uploading is implemented by mixing high frequency modulation into the RF generator. The high frequency modulation may be at least an order of magnitude higher in frequency than the RF signal. An input antenna on the instrumentation board may be configured to receive the high frequency modulation. A demodulator on the instrumentation board may then be used to extract the data for use by a controller on the instrumentation board.

[0013] As used herein, an instrumentation substrate may refer to a substrate that includes one or more sensors. The substrate may have a form factor of a typical substrate processed in a plasma chamber. For example, the substrate may have a wafer form factor (e.g., 150 mm, 200 mm, 300 mm, 450 mm, etc.). However, it will be appreciated that other form factors, including non-circular form factors, may also be used for the instrumentation substrate. One or more sensors may be distributed across the surface of the substrate to provide spatial data collection. In one embodiment, the sensor may include any type of sensor. For example, the sensor may include a pressure sensor, a temperature sensor, an electrical sensor (e.g., for detecting one or more plasma processing conditions), an optical sensor, etc.

[0014] 1, a cross-sectional view of a plasma processing tool 100 is shown, according to one embodiment. In one embodiment, the plasma processing tool 100 comprises a chamber 101. The chamber 101 may be suitable for containing a plasma 140. For example, the chamber 101 may be a vacuum chamber. Exhausts, pumps, etc. that allow for low-pressure operation have been omitted to more clearly illustrate certain portions of the embodiment.

[0015] In one embodiment, the chamber 101 may include a pedestal or chuck 120. The chuck 120 may include a mechanism for securing a substrate (such as the instrumentation substrate 150). For example, the chuck 120 may be an electrostatic chuck (ESC). To control the temperature of the instrumentation substrate 150, the chuck 120 may also include gas lines for providing backside gas flow and / or heating and cooling means. A showerhead 110 or the like may be provided opposite the chuck 120. The showerhead 110 may be configured to allow one or more process gases, inert gases, or the like to flow into the chamber.

[0016] In one embodiment, the chuck 120 may be coupled to an RF generator 121. The RF generator 121 provides power coupled into the chamber 101 to strike and maintain the plasma 140. Typically, the RF generator 121 operates at a frequency of approximately 13 MHz (e.g., 13.56 MHz). In one embodiment, a matching section (not shown) may be provided between the RF generator 121 and the chuck 120. In addition, a VI sensor 123 may be provided between the chuck 120 and the RF generator 121. The VI sensor 123 may be configured to detect a modulated signal generated by the instrumentation board 150. The process for generating the modulated signal is described in more detail below. A demodulator 124 may be coupled to the VI sensor to extract data from the modulated signal from the instrumentation board 150. In one embodiment, a high frequency (HF) modulator 122 may also be coupled to the RF generator 121. The HF modulator 122 may be used to upload data to the instrumentation board 150, as described in more detail below.

[0017] 2A and 2B, a pair of schematic diagrams of an instrumentation board 250 configured to download data from the instrumentation board 250 to an external source are shown, according to one embodiment.

[0018] 2A , a schematic diagram of an instrumentation board 250 having a communications module 260 is shown, according to one embodiment. In one embodiment, the communications module 260 may be communicatively coupled to a sensor 252. While a single sensor 252 is shown, it will be appreciated that any number of sensors 252 may be provided on the instrumentation board 250 and communicatively coupled to the communications module 260. The sensors 252 may be temperature sensors, pressure sensors, plasma property sensors, optical sensors, etc. In one embodiment, data from the sensors 252 is wirelessly communicated to an external device through use of the communications module 260.

[0019] In one embodiment, communication module 260 may include input antenna 253. Input antenna 253 may be configured to detect the frequency and phase of the RF used to generate plasma 140. For example, input antenna 253 may be configured to detect frequencies around 13 MHz. Input antenna 253 may be any antenna configuration. For example, input antenna 253 may be a coil antenna, etc.

[0020] The input antenna 253 may be coupled to a frequency generator 254. If the frequency generator 254 is a multiplier, it amplifies the frequency of the signal detected by the input antenna 253. For example, the amplifier may multiply the frequency by an integer. In some embodiments, the amplifier may increase the frequency by an order of magnitude or more. The amplifier may be implemented by any suitable circuits and components, such as diodes, varactors, microelectromechanical systems (MEMS), phase-locked loops (PLLs), etc.

[0021] In one embodiment, frequency generator 254 may be coupled to modulator / switch 255. That is, a signal from frequency generator 254 is provided to modulator / switch 255. The signal from frequency generator 254 is used as a carrier signal, and modulator / switch 255 modulates the carrier signal to mix data from sensor 252 onto the carrier signal. Modulator / switch 255 may use any suitable modulation protocol. For example, the modulation may include ASK modulation, PSK modulation, BPSK modulation, or FSK modulation. In some embodiments, a single modulation channel is used. In other embodiments, two or more modulation channels may be used to increase the bandwidth of the data transfer.

[0022] In one embodiment, the modulator / switch 255 is coupled to the output antenna 256. The output antenna 256 is switched on and off by the modulator / switch 255. When the output antenna 256 is on, a first impedance is present, and when the output antenna 256 is off, a second impedance different from the first impedance is present. This impedance switching can be detected by the VI sensor 123 of the plasma processing tool 100 when switching. The demodulator 124 can then demodulate the signal to extract the data. The output antenna 256 can be any antenna topology. For example, the antenna can be a coil antenna.

[0023] Referring now to FIG. 2B, a schematic diagram of an instrumentation board 250 according to a further embodiment is shown. In one embodiment, the instrumentation board 250 of FIG. 2B may be substantially similar to the instrumentation board 250 of FIG. 2A, except for the communications module 260. The communications module 260 of FIG. 2B includes only the output antenna 256, rather than both the input antenna 253 and the output antenna 256. If the RF frequency is a known value, the input antenna 253 may be omitted. For example, RF plasmas typically operate at 13.56 MHz. In such an embodiment, the source 254 may be set to a frequency significantly higher than the known frequency. For example, the source 254 may be a clock having a frequency set above 100 MHz. The signal from the source 254 may then be used as a carrier signal modulated by the modulator / switch 255. The output antenna 256 may be switched on and off, inducing an impedance change that may be detected by the VI sensor 123 of the plasma processing tool.

[0024] 3, a cross-sectional view of a plasma processing tool 300 is shown, according to one embodiment. In one embodiment, the plasma processing tool 300 may be substantially similar to the plasma processing tool 100 described above, except that another RF generator 321B may be coupled to the showerhead 310. That is, the plasma processing tool 300 may include a chamber 301, a chuck 320, a plasma 340, and a showerhead 310. A first RF generator 321A, a first VI sensor and chamber matching unit 323A, a first demodulator 324A, and a first HF modulator 322A may be coupled to the chuck 320. Similarly, a second RF generator 321B, a second VI sensor 323B, a second demodulator 324B, and a second HF modulator 322B may be coupled to the showerhead.

[0025] That is, embodiments are not limited to a single RF frequency. In some embodiments, separate RF frequencies may be used by the first RF generator 321A and the second RF generator 321B. Both of these separate frequencies may be used as communication paths for downloading (or uploading) data from (or to) the instrumentation board 350.

[0026] 4, a schematic diagram of an instrumentation board 450 is shown, according to one embodiment. In one embodiment, the instrumentation board 450 includes a sensor 452 coupled to a communications module 460. While a single sensor 452 is shown, it will be appreciated that any number of sensors 452 may be coupled to the communications module 460. The sensor 452 may include a temperature sensor, a pressure sensor, a plasma property sensor, an optical sensor, or any other sensor type.

[0027] In one embodiment, the communications module 460 may be configured to upload data to the instrumentation board 450. For example, an external device may provide instructions to the instrumentation board 450 for controlling one or more sensors 452. In one particular embodiment, the communications module 460 includes an input antenna 459, a demodulator 458, and a controller 457 (e.g., a microcontroller unit (MCU)).

[0028] In one embodiment, the input antenna 459 is configured to pick up the modulated EM field generated by the RF generator through the chuck. The carrier signal may be at the RF frequency of the plasma (or a multiple of this RF frequency), and the modulating signal may be at a higher or lower frequency. For example, the carrier signal may be an order of magnitude higher or lower than the RF frequency. Providing the modulating signal at a frequency significantly different from the RF frequency allows the signal to propagate into the chamber without adversely affecting plasma performance. In one embodiment, the modulating signal may be added to the RF frequency by an HF modulator similar to the HF modulators 122 and 322 detailed above. The modulating signal may be provided into the chamber at a power less than that of the RF frequency of the plasma. The input antenna 459 may be any antenna architecture (e.g., a coil, etc.).

[0029] After input antenna 459 receives the modulated signal, the modulated signal is transmitted to demodulator 458. Demodulator 458 is configured to extract data from the modulated signal. In one embodiment, the data may then be provided to controller 457. Controller 457 may store the data in a memory (not shown) or use the data as instructions to control one or more of sensors 452 on instrumentation board 450.

[0030] 5A and 5B, there is shown a schematic diagram of an instrumentation board 550 having a communications module 560, according to one embodiment. As will be appreciated by those skilled in the art, the instrumentation board 550 may include a communications module 560 that allows for bidirectional communication between the instrumentation board 550 and an external device.

[0031] 5A, a schematic diagram of an instrumentation board 550 is shown, according to one embodiment. In one embodiment, the instrumentation board 550 may include a sensor 552 coupled to a communications module 560. In one embodiment, the sensor 552 may be a single sensor 552 or there may be multiple sensors 552 coupled to the communications module 560. The sensor 552 may include a temperature sensor, a pressure sensor, a plasma property sensor, an optical sensor, etc.

[0032] In one embodiment, the communications module 560 may include a transmit line and a receive line. In one embodiment, the receive line includes an input antenna 559, a demodulator 558, and a controller 557. The input antenna 559 is configured to receive a modulated signal that has been mixed with an RF frequency. The modulated signal may be at a frequency that is at least an order of magnitude higher or lower than the RF frequency. The modulated signal may contain data that is used by the controller 557 to control one or more sensors 552 on the instrumentation board 550. After the modulated signal is received by the input antenna 559, the demodulator 558 demodulates the signal and provides the extracted data to the controller 557.

[0033] In one embodiment, the transmission line may include an input antenna 553, a signal source 554, a modulator / switch 555, and an output antenna 556. In some embodiments, the input antenna 553 picks up the RF frequency of the plasma. The RF frequency is then used by the signal source 554 to generate a carrier frequency. For example, the signal source 554 may be an amplifier that multiplies the RF frequency by an integer. In some embodiments, the signal source 554 may amplify the RF frequency to be at least an order of magnitude higher.

[0034] The carrier signal is then sent to modulator / switch 555. Modulator / switch 555 adds a data stream (e.g., data from one or more sensors 552) to the carrier signal using one or more modulation schemes / channels. Modulator / switch 555 may result in either switching output antenna 556 on or off, or directly switching input antenna 553 on or off, making 553 the output antenna. Output antenna 556 (or 553) presents a first impedance when on and a second (different) impedance when off. This change in impedance can be detected by a VI sensor (such as VI sensor 123 or 323) of the plasma processing tool, and the signal can be demodulated by a demodulator (such as demodulator 124 or 324) to extract the data for use by an external source.

[0035] Referring now to FIG. 5B, a schematic diagram of an instrumentation board 550 according to a further embodiment is shown. As shown, the instrumentation board 550 is substantially similar to the instrumentation board 550 of FIG. 5A, except for the transmission line. The transmission line does not have an input antenna 553 and begins with a signal source 554. For example, the signal source 554 can be a clock. The signal source 554 can be set to a frequency known to be different from the RF frequency. For example, because RF plasmas typically operate at 13.56 MHz, the clock of the signal source 554 can be set to generate a carrier signal of 100 MHz or higher.

[0036] The carrier signal is then sent to modulator / switch 555, which adds a data stream (e.g., data from one or more sensors 552) to the carrier signal using one or more modulation schemes / channels. Modulator / switch 555 may result in switching output antenna 556 on and off. Output antenna 556 presents a first impedance when on and a second (different) impedance when off. This change in impedance can be detected by a VI sensor (such as VI sensor 123 or 323) of the plasma processing tool, and the signal can be demodulated by a demodulator (such as demodulator 124 or 324) to extract the data for use by an external source.

[0037] Referring now to FIG. 6 , a block diagram of an exemplary computer system 600 of a processing tool is shown, according to one embodiment. In one embodiment, the computer system 600 is coupled to the processing tool and controls processing in the processing tool. The computer system 600 may be connected to (e.g., networked with) other machines in a local area network (LAN), an intranet, an extranet, or the Internet. The computer system 600 may operate in the role of a server or a client machine in a client-server network environment, or as a peer machine in a peer-to-peer (or distributed) network environment. The computer system 600 may be a personal computer (PC), a tablet PC, a set-top box (STB), a personal digital assistant (PDA), a mobile phone, a web appliance, a server, a network router, switch, or bridge, or any machine capable of executing a set of instructions (sequential or otherwise) that specify actions to be performed by the machine. Furthermore, although only a single machine is shown as computer system 600, the term "machine" should also be interpreted to include any collection of machines (e.g., computers) that individually or jointly execute an instruction set (or multiple instruction sets) to perform any one or more of the methods described herein.

[0038] Computer system 600 may include computer program product or software 622 having a non-transitory machine-readable medium having instructions stored thereon, which may be used to program computer system 600 (or other electronic devices) to perform processes in accordance with embodiments. A machine-readable medium includes any mechanism for storing or transmitting information in a form readable by a machine (e.g., a computer). For example, machine-readable media (such as computer-readable media) include machine- (e.g., computer) readable storage media (e.g., read-only memory (ROM), random-access memory (RAM), magnetic disk storage media, optical storage media, flash memory devices, etc.) and machine- (e.g., computer) readable transmission media (electrical, optical, acoustic, or other forms of propagated signals, such as infrared signals or digital signals).

[0039] In one embodiment, computer system 600 includes a system processor 602, a main memory 604 (e.g., read only memory (ROM), flash memory, dynamic random access memory (DRAM) such as synchronous DRAM (SDRAM) or Rambus DRAM (RDRAM)), a static memory 606 (e.g., flash memory or static random access memory (SRAM)), and a secondary memory 618 (e.g., a data storage device), which communicate with each other via a bus 630.

[0040] System processor 602 represents one or more general-purpose processing devices (e.g., microsystem processors, central processing units, etc.). More specifically, the system processor may be a complex instruction set computing (CISC) microsystem processor, a reduced instruction set computing (RISC) microsystem processor, a very long instruction word (VLIW) microsystem processor, a system processor implementing other instruction sets, or a system processor implementing a combination of instruction sets. System processor 602 may also be one or more special-purpose processing devices, such as an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), a digital signal system processor (DSP), a network system processor, etc. System processor 602 is configured to execute processing logic 626 to perform the operations described herein.

[0041] The computer system 600 may further include a system network interface device 608 for communicating with other devices or machines. The computer system 600 may also include a video display unit 610 (e.g., a liquid crystal display (LCD), a light emitting diode display (LED), or a cathode ray tube (CRT)), an alphanumeric input device 612 (such as a keyboard), a cursor control device 614 (such as a mouse), and a signal generating device 616 (such as a speaker).

[0042] The secondary memory 618 may include a machine-accessible storage medium 632 (or, more specifically, a computer-readable storage medium) having stored thereon one or more sets of instructions (e.g., software 622) that embody any one or more of the methods or functions described herein. This software 622 may reside, completely or at least partially, within the main memory 604 and / or the system processor 602 while being executed by the computer system 600, with the main memory 604 and the system processor 602 also constituting machine-readable storage media. The software 622 may also be transmitted or received over the network 620 via the system network interface device 608. In one embodiment, the network interface device 608 may operate using RF, optical, acoustic, or inductive coupling.

[0043] While in an exemplary embodiment, machine-accessible storage medium 632 is illustrated as a single medium, the term "machine-readable storage medium" should be interpreted to include a single medium or multiple media (e.g., a centralized or distributed database, and / or associated caches and servers) on which one or more sets of instructions are stored. The term "machine-readable storage medium" should also be interpreted to include any medium capable of storing or encoding a set of instructions for execution by a machine and causing the machine to perform any one or more of the methods. Thus, the term "machine-readable storage medium" should be interpreted to include, but not limited to, solid-state memory, and optical and magnetic media.

[0044] In the foregoing specification, specific and exemplary embodiments have been described. It will be apparent that various modifications may be made to such embodiments without departing from the scope of the following claims. The specification and drawings are, therefore, to be regarded in an illustrative rather than a restrictive sense.

Claims

1. 1. A diagnostic board comprising: A substrate; a sensor on the substrate; a communication module on the substrate communicatively coupled to the sensor; wherein the communication module comprises: An output antenna; a switch coupled to the output antenna; a signal source coupled to the switch; Diagnostic board.

2. The communication module:

10. The diagnostic board of claim 1, further comprising an input antenna coupled to the signal source, the input antenna configured to acquire the frequency of the plasma by detecting changes in an electromagnetic field around the substrate, and the signal source being a signal amplifier that multiplies the frequency of the plasma by an integer.

3. The diagnostic board of claim 2 , wherein the signal amplifier comprises one or more of a diode, a varactor, a micro-electromechanical system (MEMS) device, and a phase-locked loop (PLL).

4. 2. The diagnostic board of claim 1, wherein the signal source is a clock that generates a frequency different from a plasma frequency.

5. 10. The diagnostic board of claim 1, wherein the sensor is a temperature sensor, a pressure sensor, a voltage / bias sensor, an optical sensor, or a plasma sensor for detecting one or more of electrons, ions, and radicals.

6. The diagnostic board of claim 5 , wherein the sensor is one of a plurality of sensors.

7. 2. The diagnostic board of claim 1, wherein the communications module has a first impedance when the switch is open and a second impedance when the switch is closed.

8. 8. The diagnostic board of claim 7, wherein the switch operates at a frequency correlated with the signal source.

9. 9. The diagnostic board of claim 8, wherein the switching frequency is modulated using ASK modulation, PSK modulation, BPSK modulation, or FSK modulation.

10. The diagnostic board of claim 1 , wherein the communication module is configured to download information from the diagnostic board to an external device through modulation of impedance by switching the switch.

11. 1. A diagnostic board comprising: A substrate; a sensor on the substrate; a communication module on the substrate communicatively coupled to the sensor; wherein the communication module comprises: an input antenna configured to collect the modulated data; a demodulator coupled to the input antenna; a controller configured to control the sensor; Diagnostic board.

12. 12. The diagnostic board of claim 11, wherein the input antenna is a radio frequency antenna configured to pick up a frequency different from a plasma frequency.

13. The diagnostic board of claim 11 , wherein the modulated data is transmitted at a power level lower than the plasma power.

14. 12. The diagnostic board of claim 11, wherein the modulated data is provided at a carrier frequency supplied by a chamber RF generator, the carrier frequency being at least an order of magnitude higher or at least an order of magnitude lower than a plasma frequency.

15. The diagnostic board of claim 11 , wherein the carrier frequency is the frequency of a plasma used to process the diagnostic board.

16. The diagnostic board of claim 11 , wherein the communications module is configured to read data from an external RF generating device by demodulating a signal from the input antenna.

17. 1. A plasma processing tool comprising: a chamber configured to contain the plasma; an RF generator coupled to the chamber, wherein power from the RF generator is configured to couple to one or more gases in the chamber to generate the plasma; a voltage-current (VI) sensor between the RF generator and the chamber; a diagnostic substrate within the chamber; wherein the diagnostic board comprises: A substrate; a sensor on the substrate; a communication module coupled to the sensor, the communication module configured to wirelessly communicate with a device external to the chamber using a carrier signal at a carrier frequency that is an integer multiple of a frequency of the plasma. Plasma processing tools.

18. The communication module includes: an input antenna configured to detect a frequency of the plasma; a signal amplifier coupled to the input antenna; a switch coupled to the signal amplifier; 20. The plasma processing tool of claim 17, further comprising: an output antenna coupled to the switch, wherein switching the switch on and off results in an impedance change that can be detected by the VI sensor.

19. The communication module includes: an input antenna configured to collect data modulated from an RF signal used to generate the plasma; a demodulator coupled to the input antenna; 20. The plasma processing tool of claim 17, comprising: a controller configured to control the sensor.

20. 20. The plasma processing tool of claim 17, wherein the communication module is configured to upload data from an external device to the substrate and / or download data from the substrate to the external device.

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