Drilling control device, laser machining system, program, and hole distribution image display method

Abstract

To provide a control device for drilling capable of shortening the drawing time of an image showing the distribution of holes in a range designated by a user.SOLUTION: A storage unit stores data. A processing part has a function for generating image data showing the distribution of holes on the basis of hole position definition data for defining the respective coordinates of a plurality of holes to be formed on the surface of a workpiece, and for storing the image data in a storage part, and a function for displaying a hole distribution image in a designated display range on the basis of the image data.SELECTED DRAWING: Figure 7

Description

[Technical Field]

[0001] The present invention relates to a hole drilling control device, a laser processing system, a program, and a hole distribution image display method. [Background technology]

[0002] A laser processing device that drills holes in printed circuit boards is known (Patent Document 1). The coordinates of holes to be formed on the surface of the board are given as Gerber data or the like. In the laser processing, a control device controls the positioning of a laser beam based on the Gerber data or the like. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-142537 Summary of the Invention [Problem to be solved by the invention]

[0004] A user of a laser processing machine may want to check the distribution of holes to be formed before performing laser processing. When the user specifies the range in which they want to check the hole distribution, the control device that controls the drilling process generates image data for the specified range based on Gerber data, etc., and displays the hole distribution as an image on the display screen. When the user changes the position or size of the range they want to check, the control device generates image data for the changed range based on the Gerber data, etc., and redraws it.

[0005] As the number of holes to be formed increases, the processing time required to generate image data for display from Gerber data becomes longer, impairing operability. An object of the present invention is to provide a hole drilling control device and a laser processing system that can shorten the time required to draw an image representing the distribution of holes within a range specified by the user. [Means for solving the problem]

[0006] According to one aspect of the present invention, a storage unit for storing data; Processing section and Equipped with The processing unit a function of generating image data showing a distribution of holes based on hole position definition data that defines the coordinates of each of a plurality of holes to be formed on the surface of the workpiece, and storing the image data in the storage unit; a function of displaying a hole distribution image of a specified display range based on the image data; A control device is provided having:

[0007] According to another aspect of the present invention The above-mentioned control device and a laser processing machine that performs laser processing by sequentially irradiating a laser beam under specified processing conditions onto a plurality of positions on the surface of the object where holes are to be formed; Equipped with The laser processing machine is provided with a laser processing system that directs a laser beam at a hole position within a range specified by the range specification information stored in the control device under processing conditions specified by the processing condition specification information associated with the range specification information.

[0008] According to yet another aspect of the present invention, A program executed by a computer, a function of generating image data showing a distribution of holes based on hole position definition data that defines the coordinates of each of a plurality of holes to be formed on the surface of the workpiece, and storing the image data in a storage unit; When a display range is designated, a hole distribution image of the designated display range is displayed on the display unit based on the image data. A program to achieve this is provided.

[0009] According to yet another aspect of the present invention, a processing unit that generates image data showing a distribution of holes based on hole position definition data that defines the coordinates of each of a plurality of holes to be formed in the surface of the workpiece, and stores the image data in a storage unit; A hole distribution image display method is provided in which, when a display range is specified, the processing unit displays a hole distribution image of the specified display range on the display unit based on the image data stored in the memory unit. [Effects of the Invention]

[0010] Since the image showing the distribution of holes in the display range specified by the user is displayed based on raster image data, the drawing time can be reduced compared to drawing based on Gerber data, etc. [Brief explanation of the drawings]

[0011] [Figure 1] FIG. 1 is a schematic diagram of a laser processing machine 10 and a control device 20 according to the first embodiment. [Figure 2] FIG. 2A is a diagram showing an example of the distribution of a plurality of hole formation locations 41 defined on the surface of a substrate 40, and FIG. 2B is a diagram showing an example of the processing order of the plurality of hole formation locations 41. [Figure 3] FIG. 3 is a diagram showing an example of hole position definition data 50 that defines the positions (coordinates) of hole formation locations where holes should be formed. [Figure 4] FIG. 4 is a diagram showing raster image data 55 generated based on the hole position definition data 50 as an image. [Figure 5] FIG. 5 is a block diagram of the control device 20 (FIG. 1). [Figure 6] FIG. 6 is a flowchart showing the procedure executed by the processing unit 22. [Figure 7] FIG. 7A is a diagram showing an image displayed on the display unit 23 when the user specifies the range they want to display, and FIG. 7B is a diagram showing an example of a hole distribution image 60 displayed on the display unit 23. [Figure 8] FIG. 8A is a diagram showing an image displayed on the display unit 23 when the user specifies the range they want to display, and FIG. 8B is a diagram showing another example of a hole distribution image 60 displayed on the display unit 23. [Figure 9]FIG. 9 is a flowchart showing the procedure of the process performed by the processing unit 22 (FIG. 5) of the control device 20 according to the second embodiment to set laser processing conditions. [Figure 10] FIG. 10 is a diagram showing an example of a screen for specifying a condition setting range. [Figure 11] FIG. 11 is a diagram showing an example of a processing condition table 70 in which condition setting ranges A(1) to A(6) are associated with processing conditions PC(1) to PC(6). [Figure 12] FIG. 12 is a diagram showing an example of an image displayed on the display unit 23 (FIG. 5) by the control device 20 according to the third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0012] A laser processing machine and its control device according to a first embodiment will be described with reference to FIGS. 1 to 8B.

[0013] 1 is a schematic diagram of a laser processing machine 10 and a control device 20 according to a first embodiment. The laser processing machine 10 and the control device 20 constitute a laser processing system.

[0014] First, the configuration of the laser processing machine 10 will be described. A laser oscillator 11 outputs a pulsed laser beam in response to a command from a control device 20. The pulsed laser beam output from the laser oscillator 11 passes through a light-guiding optical system 12 and an aperture 13, and is incident on an acousto-optical device (AOD) 14. The light-guiding optical system 12 includes, for example, a beam expander. In response to a command from the control device 20, the acousto-optical device 14 directs the incident pulsed laser beam to one of a first path 15A, a second path 15B, and a path toward a beam damper 19.

[0015] The pulsed laser beam directed to the first path 15A passes through a beam scanner 16A and a condenser lens 17A and is incident on a substrate 40, which is the workpiece. The pulsed laser beam directed to the second path 15B is reflected by a folding mirror 18, passes through a beam scanner 16B and a condenser lens 17B and is incident on another substrate 40, which is the workpiece. The pulsed laser beams are incident on each of the two substrates 40, thereby performing drilling. The two substrates 40 are, for example, printed wiring boards.

[0016] As the beam scanners 16A and 16B, for example, galvanometer scanners including a pair of oscillating mirrors are used. The beam scanners 16A and 16B scan the laser beams in response to commands from the control device 20, and move the incidence positions of the pulsed laser beams on the surfaces of the two substrates 40, respectively. As the condenser lenses 17A and 17B, for example, fθ lenses are used.

[0017] The two substrates 40 are supported on a horizontal support surface of a movable table 31 of the movement mechanism 30. In response to a command from the control device 20, the movement mechanism 30 moves the two substrates 40 in two-dimensional directions parallel to the support surface relative to the beam path of the pulsed laser beam that has passed through the beam scanners 16A and 16B.

[0018] 2A is a diagram showing an example of the distribution of a plurality of hole formation locations 41 defined on the surface of a substrate 40. FIG. 2A shows only a portion of the plurality of hole formation locations 41. The distribution of the plurality of hole formation locations 41 defined on the two substrates 40 supported by the movement mechanism 30 (FIG. 1) is the same. The outer shape of the substrate 40 is, for example, rectangular.

[0019] Alignment marks 42 are provided at each of the four corners of rectangular substrate 40. A plurality of hole formation locations 41 are defined on the surface of substrate 40. In Fig. 2A, the hole formation locations 41 are indicated by circular symbols, but in reality, no marks are provided on the surface of substrate 40, and hole position definition data that defines the positions of the plurality of hole formation locations 41 is stored in control device 20.

[0020] A plurality of scan areas 45 are defined on the surface of the substrate 40. The shape of each of the scan areas 45 is, for example, a square. The size of the scan area 45 is determined by the range in which the pulsed laser beam can be incident by scanning the pulsed laser beam by operating each of the beam scanners 16A and 16B (FIG. 1), the distortion characteristics of the condenser lenses 17A and 17B, and the like. The plurality of scan areas 45 are arranged so that all hole formation locations 41 on the substrate 40 are each included within at least one scan area 45. The plurality of scan areas 45 may partially overlap, and a scan area 45 may not be arranged in an area where no hole formation locations 41 are distributed.

[0021] One scan area 45 is moved directly below one of the condenser lenses 17A, 17B (FIG. 1), and the pulsed laser beam is sequentially incident on multiple hole formation locations 41 within that scan area 45, thereby processing that scan area 45. When processing of one scan area 45 is completed, the movement mechanism 30 (FIG. 1) is operated to move the next scan area 45 to be processed directly below one of the condenser lenses 17A, 17B. In FIG. 2A, the processing order of the scan areas 45 is indicated by arrows. The scan areas 45 are arranged, for example, so as to minimize the processing time for the entire substrate. The arrangement of the multiple scan areas 45 is determined by the control device 20 based on the distribution of the hole formation locations 41.

[0022] FIG. 2B is a diagram showing an example of the processing order of multiple hole formation locations 41. The multiple hole formation locations 41 are assigned serial numbers. Beam scanners 16A and 16B (FIG. 1) are operated to irradiate the multiple hole formation locations 41 with a pulsed laser beam in the order of the serial numbers, thereby processing one scan area 45. In FIG. 2B, the processing order of the multiple hole formation locations 41 is indicated by arrows. The processing order of the hole formation locations 41 is determined, for example, so that the movement path of the incident position of the pulsed laser beam is the shortest. To determine the processing order, for example, an algorithm for solving the traveling salesman problem can be applied.

[0023] 3 is a diagram showing an example of hole position definition data 50 that defines the positions (coordinates) of hole formation locations 41 where holes should be formed. The origin of the x and y coordinates is defined on the surface of the substrate 40 (FIG. 2A), and the positions of the hole formation locations 41 (FIG. 2A) are defined by the x and y coordinates. The hole position definition data 50 includes information 51 indicating the substrate type, x and y coordinates 52 of each of the four alignment marks 42, and x and y coordinates 53 of each of the multiple hole formation locations 41.

[0024] 4 is a diagram showing, as an image, raster-format image data 55 generated based on hole position definition data 50. Four alignment marks 42 and multiple hole formation locations 41 are distributed in a two-dimensional plane. The size of the circle symbols displayed at the hole formation locations 41 reflects, for example, the hole size determined from the set laser processing conditions.

[0025] 5 is a block diagram of the control device 20 (FIG. 1). The control device 20 includes an input unit 21, a processing unit 22, a display unit 23, and a storage unit 24.

[0026] Information necessary for drilling and commands for instructing the operation of the control device 20 are input to the input unit 21. The input unit 21 includes, for example, any of a keyboard, a touch panel, a pointing device, a removable media reader, a communication device, etc. The display unit 23 includes, for example, a display for displaying images, and displays various images under the control of the processing unit 22. The memory unit 24 stores programs executed by the processing unit 22, various data, etc. The processing unit 22 includes a computer, and various functions are realized by executing programs stored in the memory unit 24.

[0027] 6 is a flowchart showing the procedure executed by the processing unit 22. The processing unit 22 acquires the hole position definition data 50 (FIG. 3) input to the input unit 21 (step SA1). After acquiring the hole position definition data 50, the processing unit 22 generates raster format image data based on the hole position definition data 50 for the entire area in which all hole formation locations 41 and all alignment marks 42 are distributed, and stores the image data in the storage unit 24 (FIG. 5) (step SA2).

[0028] The processing unit 22 waits for a command to be input from the user (step SA3). When a command specifying a display range is input, the processing unit 22 extracts the display range specified by the user from the image data 55 (FIG. 4) stored in the storage unit 24, and displays a hole distribution image on the display unit 23 (step SA4). Thereafter, the processing unit 22 waits for a command to be input. Next, when a command specifying a different display range is input, the processing unit 22 extracts the newly specified display range from the image data 55 (FIG. 4) stored in the storage unit 24, and redisplays the hole distribution image on the display unit 23 (step SA4). When a command to end image display is input, the processing unit 22 ends the image display process.

[0029] Next, a method for the user to specify the display range they wish to display and examples of the displayed images will be described with reference to Figures 7A to 8B. Figures 7A and 8A are diagrams showing images displayed on display unit 23 when the display range is specified, and Figures 7B and 8B are diagrams showing an example of a hole distribution image 60 displayed on display unit 23.

[0030] As shown in Figures 7A and 8A, an image of the entire range in which alignment marks 42 and hole formation locations 41 are distributed is displayed on display unit 23. A rough outline of substrate 40 (Figure 2A) is also displayed. The user operates a pointing device or the like to specify a display range 61. Figure 8A shows an example in which the specified display range 61 is wider than that shown in Figure 7A.

[0031] As shown in Figures 7B and 8B, a hole distribution image 60 showing the distribution of multiple hole formation locations 41 within a display range 61 specified by the user is displayed as an image on the display unit 23 together with the outline of the display range 61.

[0032] Next, the excellent effects of the first embodiment will be described. In the first embodiment, as shown in FIGS. 7A to 8B, the distribution of the hole formation locations 41 is displayed as an image, so that the user can visually check the distribution of the hole formation locations 41 before processing.

[0033] For example, the user selects one of a plurality of hole position definition data 50 depending on the type of substrate 40 to be processed. This selection is made, for example, by selecting the file name of the file in which the hole position definition data 50 is stored. If one file is selected from a large number of files based solely on the file name, a wrong selection may occur. By checking the distribution of hole formation locations 41 in an image before actually performing processing, it is possible to easily notice a wrong file selection. This makes it possible to avoid performing processing using the wrong hole position definition data 50.

[0034] In actual drilling of printed circuit boards, several hundred thousand to ten million holes are formed per board. When such a huge number of holes are formed, if an image of the entire area where hole formation locations 41 are distributed is displayed, it is difficult for the user to visually confirm the distribution of hole formation locations 41. As shown in Figures 7B and 8B, by enlarging and displaying only a portion of the area where hole formation locations 41 are distributed, the user can visually confirm the distribution of hole formation locations 41.

[0035] Furthermore, by selecting a range with a characteristic distribution of hole formation locations 41 for each board type as the display range 61 (Figures 7A and 8A), it is possible to easily determine whether the selected hole position definition data 50 is correct.

[0036] Furthermore, in the first embodiment, in step SA4 (FIG. 6), the hole distribution image 60 (FIGS. 7B and 8B) is displayed by cutting out the image data in the raster format generated in step SA2 (FIG. 6). Therefore, the hole distribution image 60 can be displayed in a shorter time than in a method in which image data is generated from the hole position definition data 50 each time redrawing is performed.

[0037] Next, a laser processing machine and its control device according to a second embodiment will be described with reference to Figures 9 to 11. Hereinafter, a description of the components common to the laser processing machine and its control device according to the first embodiment described with reference to Figures 1 to 8B will be omitted. The control device 20 according to the second embodiment can divide the area in which the hole formation locations 41 are distributed and set laser processing conditions for each division.

[0038] FIG. 9 is a flowchart showing the procedure of the process performed by the processing unit 22 (FIG. 5) of the control device 20 according to the second embodiment to set laser processing conditions.

[0039] Processing unit 22 first displays a screen on display unit 23 for specifying the range for setting laser processing conditions (hereinafter referred to as the condition setting range) (step SB1). The user specifies the condition setting range by operating a pointing device or the like, and inputs information indicating the processing conditions for holes within the condition setting range (step SB3). The user can specify multiple condition setting ranges and set different processing conditions for each condition setting range. Processing unit 22 then associates the information specifying the condition setting range with information indicating the processing conditions to be set, and stores them in memory unit 24 (step SB3).

[0040] 10 is a diagram showing an example of a screen for specifying a condition setting range. A distribution of a plurality of hole formation locations 41 and alignment marks 42 is displayed as an image on the display unit 23. The user operates a pointing device or the like to specify a plurality of condition setting ranges A(1) to A(6). Furthermore, the user inputs information specifying the processing conditions (processing condition specification information) for each of the information specifying the condition setting ranges A(1) to A(6) (range specification information).

[0041] 11 is a diagram showing an example of a processing condition table 70 in which condition setting ranges A(1) to A(6) are associated with processing conditions PC(1) to PC(6). In the example shown in FIG. 11, processing condition PC(1) is associated with condition setting range A(1). The processing conditions include, for example, pulse energy density, the number of incident pulses, etc.

[0042] Next, a method for deriving optimal machining conditions using the machining condition table 70 will be described. Before actually performing laser processing, it is necessary to determine the optimal processing conditions for forming holes of the desired size and shape. The process of determining the optimal processing conditions is called "condition determination." To determine the optimal processing conditions, evaluation experiments are conducted in which actual hole drilling is performed under various processing conditions and the size and shape of the formed holes are evaluated.

[0043] In the evaluation experiment, the control device 20 uses the processing condition table 70 (FIG. 11) to perform drilling processing under processing conditions PC(1) to PC(6) at the hole formation locations 41 within the condition setting ranges A(1) to A(6). Because processing is performed under multiple processing conditions for one substrate, it is possible to reduce the number of substrates used and shorten the time required for the evaluation experiment compared to when drilling is performed under different processing conditions for each substrate.

[0044] Next, a laser processing machine and a control device according to a third embodiment will be described with reference to Fig. 12. Hereinafter, a description of the components common to the laser processing machine and its control device according to the first embodiment described with reference to Figs. 1 to 8B will be omitted. The control device 20 (Fig. 5) according to the third embodiment has a function of displaying the hole formation location 41 and the scan area 45 as an image.

[0045] 12 is a diagram showing an example of an image displayed on the display unit 23 (FIG. 5) by the control device 20 according to the third embodiment. A plurality of scan areas 45 are displayed together with a plurality of hole formation locations 41. All of the hole formation locations 41 are located within at least one scan area 45.

[0046] Next, the excellent effects of the third embodiment will be described. In the third embodiment, the hole formation location 41 and the scan area 45 are displayed on the display unit 23, so that the user can easily understand the relative positional relationship between the hole formation location 41 and the scan area 45.

[0047] The above-described embodiments are merely examples, and it goes without saying that partial substitution or combination of the configurations shown in different embodiments is possible. Similar effects resulting from similar configurations of multiple embodiments will not be mentioned sequentially for each embodiment. Furthermore, the present invention is not limited to the above-described embodiments. For example, it will be obvious to those skilled in the art that various modifications, improvements, combinations, etc. are possible. [Explanation of symbols]

[0048] 10 Laser processing machine 11 Laser oscillator 12 Light guiding optical system 13 Aperture 14 Acousto-optic device (AOD) 15A Route 1 15B Route 2 16A, 16B Beam Scanner 17A, 17B Condenser lenses 18 Folding Mirror 19 Beam damper 20 Control device 21 Input section 22 Processing section 23 Display section 24 Memory section 30 Moving mechanism 31 Movable Table 40 boards 41 Hole formation location 42 Alignment Mark 45 scan area 50 Hole position definition data 51 Information indicating the type of board 52 Alignment mark x and y coordinates 53 xy coordinates of hole formation location 55 Raster format image data 60 Hole distribution image 61 Display Range 70 Processing condition table

Claims

1. a storage unit for storing data; Processing section and Equipped with The processing unit a function of generating image data showing a distribution of holes based on hole position definition data that defines the coordinates of each of a plurality of holes to be formed on the surface of the workpiece, and storing the image data in the storage unit; When a display range is specified, a function of displaying a hole distribution image of the specified display range based on the image data. A control device having:

2. The control device according to claim 1 , further comprising a display unit that displays the hole distribution image under the control of the processing unit.

3. 3. The control device according to claim 1, further comprising an input unit to which the hole position definition data and commands to the processing unit are input.

4. The processing unit a function of inputting range designation information that designates a condition setting range for setting machining conditions on the surface of the workpiece, and machining condition designation information that designates machining conditions for machining a plurality of holes within the range designated by the range designation information; a function of storing the input range designation information and the processing condition designation information in the storage unit in association with each other; The control device according to claim 3 , further comprising:

5. The processing unit a function of determining the positions of a plurality of scan areas of the same size based on the distribution of the plurality of holes to be formed so that each of the plurality of holes is included in at least one of the scan areas; a function of displaying the outline of the scanned area superimposed on the hole distribution image; 3. The control device according to claim 1, further comprising:

6. The control device according to claim 4; a laser processing machine that performs laser processing by sequentially irradiating a laser beam under specified processing conditions onto a plurality of positions on the surface of the workpiece where holes are to be formed; Equipped with The laser processing system includes a laser processing machine that directs a laser beam at a hole position within a range specified by the range specification information stored in the control device under processing conditions specified by the processing condition specification information associated with the range specification information.

7. A program executed by a computer, a function of generating image data showing a distribution of holes based on hole position definition data that defines the coordinates of each of a plurality of holes to be formed on the surface of the workpiece, and storing the image data in a storage unit; When a display range is designated, a hole distribution image of the designated display range is displayed on the display unit based on the image data. A program to make this happen.

8. a processing unit that generates image data showing a distribution of holes based on hole position definition data that defines the coordinates of each of a plurality of holes to be formed in the surface of the workpiece, and stores the image data in a storage unit; A hole distribution image display method in which, when a display range is specified, the processing unit displays a hole distribution image of the specified display range on the display unit based on the image data stored in the memory unit.

Images