Heat exchanger and refrigeration apparatus

Abstract

To provide a heat exchanger capable of suppressing an increase in manufacturing cost even if a heat transfer plate using etching is used.SOLUTION: The heat exchanger (100) is comprised of a plurality of layers. The plurality of layers includes a first layer (110). The first layer (110) includes a first heat transfer plate (110a) and a first frame plate (110b). In the first heat transfer plate, a recessed portion (114) serving as a flow path through which the first heat medium flows is formed by etching. The first frame plate is disposed around the first heat transfer plate.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] This invention relates to a heat exchanger and a refrigeration device. [Background technology]

[0002] Patent Document 1 (JP 2012-512382 A) discloses a plate heat exchanger in which a plurality of heat transfer plates are stacked at predetermined intervals to form channels for a first refrigerant and channels for a second refrigerant alternately in the stacking direction, thereby exchanging heat between the two refrigerants. In the field of plate heat exchangers, a method for manufacturing a heat transfer plate is known in which linear recesses (grooves) that serve as channels are formed on the surface by etching. Summary of the Invention [Problem to be solved by the invention]

[0003] The etching sheets used in etching are more expensive than regular metal plates, so heat exchangers using etched heat transfer plates tend to be expensive to manufacture.

[0004] The present disclosure provides a heat exchanger that can suppress an increase in manufacturing costs even when using etched heat transfer plates. [Means for solving the problem]

[0005] A heat exchanger according to a first aspect is composed of a plurality of layers. The plurality of layers includes a first layer. The first layer includes a first heat transfer plate and a first frame plate. The first heat transfer plate has recesses formed therein by etching, the recesses serving as flow paths for a first heat medium. The first frame plate is disposed around the first heat transfer plate.

[0006] In this heat exchanger, the first layer is composed of a first heat transfer plate in which recesses are formed by etching and a first frame plate arranged around the first heat transfer plate. Therefore, the area of ​​the etched sheet used to manufacture one first layer is smaller than when the entire first layer is made of an etched sheet. As a result, the number of first heat transfer plates manufactured from one etched sheet increases compared to conventional technology.

[0007] Therefore, according to this heat exchanger, an increase in manufacturing costs is suppressed.

[0008] A heat exchanger according to a second aspect is the heat exchanger according to the first aspect, wherein an edge of the first heat transfer plate overlaps with a bottom of the recess in plan view.

[0009] According to this heat exchanger, the gap formed between the wall portion adjacent to the recess on the edge and the inner surface of the first frame plate functions as a flow path for the first heat medium to flow.

[0010] A heat exchanger according to a third aspect is the heat exchanger according to the first aspect, wherein an edge of the first heat transfer plate overlaps with the wall portion adjacent to the recessed portion in a plan view.

[0011] This prevents a large gap including a recess from being formed between the first heat transfer plate and the inner surface of the first frame plate, thereby preventing a decrease in heat exchange efficiency due to a large amount of the first heat medium flowing through the gap.

[0012] A heat exchanger according to a fourth aspect is any one of the heat exchangers according to the first aspect to the third aspect, wherein the first heat transfer plate further has a through hole, a header, and a linear protrusion. The through hole penetrates in the thickness direction. The header is formed by etching and connects the through hole with the recess. The protrusion surrounds the header and the recess in a plan view.

[0013] As a result, the protrusions can prevent the first heat medium from flowing into the gap between the first heat transfer plate and the first frame plate, and this heat exchanger prevents a decrease in heat exchange efficiency due to the first heat medium flowing through the gap.

[0014] A heat exchanger according to a fifth aspect is the heat exchanger according to any one of the first to fourth aspects, wherein the gap between the first frame plate and the first heat transfer plate is equal to or smaller than twice the width of the recess in plan view.

[0015] This prevents a large gap from being formed between the edge of the first heat transfer plate and the inner surface of the first frame plate, and therefore, with this heat exchanger, a decrease in heat exchange efficiency caused by a large amount of the first heat medium flowing through the gap is prevented.

[0016] A heat exchanger according to a sixth aspect is the heat exchanger according to any one of the first to fifth aspects, wherein the plurality of layers further includes a second layer adjacent to the first layer, and the second layer includes a partition wall.

[0017] A seventh aspect of the present invention relates to the heat exchanger of the sixth aspect, wherein the plurality of layers further includes a third layer adjacent to the second layer on a surface opposite to the first layer, and the third layer includes a second heat transfer plate having recesses formed by etching to form flow paths for the second heat medium.

[0018] A heat exchanger according to an eighth aspect is the heat exchanger according to the seventh aspect, wherein the second heat transfer plate has an outer periphery that is the same in shape and size as the outer periphery of the partition wall in plan view.

[0019] A heat exchanger according to a ninth aspect is the heat exchanger according to the seventh aspect, wherein the third layer further includes a second frame plate disposed around the second heat transfer plate.

[0020] In this heat exchanger, the third layer is composed of the second heat transfer plate in which the recesses are formed by etching and the second frame plate arranged around the second heat transfer plate, which reduces manufacturing costs compared to when the entire third layer is made of an etched sheet.

[0021] A heat exchanger according to a tenth aspect is the heat exchanger according to any one of the first aspect to the ninth aspect, wherein the first frame plate is formed by press working.

[0022] According to this heat exchanger, the first frame plate is formed by press working, so that an increase in manufacturing costs is suppressed.

[0023] A heat exchanger according to an eleventh aspect is the heat exchanger according to the ninth aspect, wherein the second frame plate is formed by press working.

[0024] According to this heat exchanger, the second frame plate is formed by press working, so that an increase in manufacturing costs is suppressed.

[0025] A refrigeration device according to a twelfth aspect includes any one of the heat exchangers according to the first to eleventh aspects.

[0026] According to this refrigeration device, an increase in manufacturing costs is suppressed. [Brief explanation of the drawings]

[0027] [Figure 1] 1 is a schematic diagram showing a refrigeration device 1 equipped with a first heat exchanger 100. FIG. [Figure 2] FIG. 2 is an exploded view of the first heat exchanger 100. [Figure 3] FIG. 2 is an enlarged cross-sectional view of the first heat exchanger 100. [Figure 4] FIG. 2 is an exploded view of the first layer 110. [Figure 5] 2 is a schematic cross-sectional view of a first layer 110 and a second layer 120. FIG. [Figure 6] 1 is a schematic cross-sectional view of a first layer 110 and a second layer 120 of a first heat exchanger 100 according to a first modification. [Figure 7] FIG. 10 is a plan view of a first layer 110 of a first heat exchanger 100 according to a second modification. [Figure 8] 10 is a schematic cross-sectional view of a first layer 110 and a second layer 120 of a first heat exchanger 100 according to a second modification. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0028] First Embodiment (1) Refrigeration unit 1 First, a refrigeration system 1 including a first heat exchanger 100 according to a first embodiment of the present disclosure will be described. The refrigeration system 1 is a binary refrigerant cycle device that performs heating and cooling operations in an air-conditioned space (not shown), such as the interior of a building, by executing a vapor compression cycle.

[0029] The refrigeration system 1 heats or cools water and uses the water to perform heating and cooling operations in a space to be air-conditioned (not shown). The refrigeration system 1 has a first heat exchanger 100, a second heat exchanger 300, a first refrigerant circuit 10, a second refrigerant circuit 20, a water circuit 30, and a control unit 40. As will be described in detail later, the refrigeration system 1 is configured so that a first refrigerant circulates in the first refrigerant circuit 10, a second refrigerant circulates in the second refrigerant circuit 20, and water circulates in the water circuit 30. Although not limited thereto, in this embodiment, the water circuit 30 is installed indoors and the second refrigerant circuit 20 is installed outdoors. The first refrigerant circuit 10 may be installed either indoors or outdoors, or a portion of it may be installed either indoors or outdoors.

[0030] The first refrigerant is an example of a first heat medium, and the second refrigerant is an example of a second heat medium.

[0031] (1-1) 1st heat exchanger 100 The first heat exchanger 100 exchanges heat between a first refrigerant circulating through the first refrigerant circuit 10 and a second refrigerant circulating through the second refrigerant circuit 20. The first heat exchanger 100 has first flow ports 141a and 141b, second flow ports 142a and 142b, a first flow path 210, and a second flow path 220.

[0032] The first flow path 210 is a flow path through which the first refrigerant flows. The first flow path 210 is provided between the first flow port 141a and the first flow port 141b. The second flow path 220 is a flow path through which the second refrigerant flows. The second flow path 220 is formed between the second flow port 142a and the second flow port 142b. The first refrigerant flowing through the first flow path 210 exchanges heat with the second refrigerant passing through the second flow path 220. The detailed structure of the first heat exchanger 100 will be described later.

[0033] (1-2)Second heat exchanger 300 The second heat exchanger 300 exchanges heat between the first refrigerant circulating through the first refrigerant circuit 10 and the water circulating through the water circuit 30. The second heat exchanger 300 has first flow ports 341a and 341b, second flow ports 342a and 342b, a first flow path 410, and a second flow path 420.

[0034] First flow path 410 is a flow path through which the first refrigerant flows. First flow path 410 is provided between first flow port 341a and first flow port 341b. Second flow path 420 is a flow path through which water flows. Second flow path 420 is formed between second flow port 342a and second flow port 342b. The first refrigerant flowing through first flow path 410 exchanges heat with the water passing through second flow path 420.

[0035] (1-3) 1st refrigerant circuit 10 In the first refrigerant circuit 10, a first refrigerant is heated or cooled. The first refrigerant circuit 10 is composed of a compressor 11, a four-way switching valve 12, an expansion valve 13, a first flow path 210 of a first heat exchanger 100, and a first flow path 410 of a second heat exchanger 300. The compressor 11, the four-way switching valve 12, the expansion valve 13, the first flow path 210 of the first heat exchanger 100, and the first flow path 410 of the second heat exchanger 300 are connected by piping, and the first refrigerant circulates inside. In this embodiment, the first refrigerant is R1234ze.

[0036] The compressor 11 draws in the low-pressure first refrigerant in the first refrigerant circuit 10 through a suction port 11a, compresses it, and discharges it from a discharge port 11b as a high-pressure first refrigerant.

[0037] The four-way switching valve 12 has a first port 12a, a second port 12b, a third port 12c, and a fourth port 12d. Based on instructions from the control unit 40, the four-way switching valve 12 switches between a first state and a second state, in which the communication states of the first port 12a, the second port 12b, the third port 12c, and the fourth port 12d are different. In the first state, the first port 12a and the second port 12b are communicated with each other, and the third port 12c and the fourth port 12d are communicated with each other. In the second state, the first port 12a and the fourth port 12d are communicated with each other, and the second port 12b and the third port 12c are communicated with each other.

[0038] The first port 12a is connected to the discharge portion 11b of the compressor 11. The second port 12b is connected to the first flow port 341a of the second heat exchanger 300. The third port 12c is connected to the suction portion 11a of the compressor 11. The fourth port 12d is connected to the first flow port 141a of the first heat exchanger 100.

[0039] The expansion valve 13 adjusts the flow rate of the first refrigerant circulating through the first refrigerant circuit 10, and functions as a pressure reducing device that reduces the pressure of the first refrigerant.

[0040] One end of the expansion valve 13 is connected to the first flow port 141b of the first heat exchanger 100. The other end of the expansion valve 13 is connected to the first flow port 341b of the second heat exchanger 300.

[0041] (1-4)Second refrigerant circuit 20 In the second refrigerant circuit 20, a second refrigerant is heated or cooled. The second refrigerant circuit 20 is composed of a compressor 21, a four-way switching valve 22, an expansion valve 23, a heat source heat exchanger 24, and a second flow path 220 of the first heat exchanger 100. The compressor 21, the four-way switching valve 22, the expansion valve 23, the heat source heat exchanger 24, and the second flow path 220 of the first heat exchanger 100 are connected by piping, and the second refrigerant circulates inside. In this embodiment, the second refrigerant is carbon dioxide.

[0042] The compressor 21 draws in the low-pressure second refrigerant in the second refrigerant circuit 20 through the suction port 21a, compresses it, and discharges it from the discharge port 21b as the high-pressure second refrigerant.

[0043] The four-way switching valve 22 has a first port 22a, a second port 22b, a third port 22c, and a fourth port 22d. Based on instructions from the control unit 40, the four-way switching valve 22 switches between a first state and a second state, in which the communication states of the first port 22a, the second port 22b, the third port 22c, and the fourth port 22d are different. In the first state, the first port 22a and the second port 22b are communicated with each other, and the third port 22c and the fourth port 22d are communicated with each other. In the second state, the first port 22a and the fourth port 22d are communicated with each other, and the second port 22b and the third port 22c are communicated with each other.

[0044] The first port 22a is connected to the discharge portion 21b of the compressor 21. The second port 22b is connected to the second flow port 142a of the first heat exchanger 100. The third port 22c is connected to the suction portion 21a of the compressor 21. The fourth port 22d is connected to one end of the heat source heat exchanger 24.

[0045] The expansion valve 23 adjusts the flow rate of the second refrigerant circulating through the second refrigerant circuit 20, and functions as a pressure reducing device that reduces the pressure of the second refrigerant.

[0046] One end of the expansion valve is connected to the second flow port 142b of the first heat exchanger 100. The other end of the expansion valve is connected to the other end of the heat source heat exchanger .

[0047] The heat source heat exchanger 24 exchanges heat between the second refrigerant circulating in the second refrigerant circuit 20 and a heat source (for example, outdoor air).

[0048] (1-5) Water circuit 30 Water that has exchanged heat with the first refrigerant circulates in the water circuit 30. The water circuit 30 is composed of a water circulation pump 31, a water storage tank 32, a second flow path 420 of the second heat exchanger 300, and a utilization heat exchanger 33. The water circulation pump 31, the water storage tank 32, the second flow path 420 of the second heat exchanger 300, and the utilization heat exchanger 33 are connected by piping, and water circulates inside them.

[0049] The water circulation pump 31 circulates water inside the water circuit 30. The water circulation pump 31 draws water from the inside of the water circuit 30 through an intake port 31a and discharges the water from an outlet port 31b.

[0050] The intake section 31 a is connected to the second flow port 342 b of the second heat exchanger 300 .

[0051] The water storage tank 32 stores water heated or cooled by the second heat exchanger 300 to heat or cool (in other words, provide heating or cooling) the air in the space to be air-conditioned. The water storage tank 32 has a water intake section 32a that takes in water circulating through the water circuit 30, and a drainage section 32b that discharges the stored water.

[0052] The water intake portion 32a is connected to the discharge portion 31b of the water circulation pump 31. The water discharge portion 32b is connected to the second flow port 342a of the second heat exchanger 300.

[0053] The utilization heat exchanger 33 exchanges heat between the water circulating through the water circuit 30 and the air in the space to be air-conditioned (not shown). The utilization heat exchanger 33 is disposed inside the space to be air-conditioned so that the water passing through it can exchange heat with the air in the space to be air-conditioned. One end of the utilization heat exchanger 33 is connected to the discharge portion 31b of the water circulation pump 31. The other end of the utilization heat exchanger 33 is connected to the second flow port 342a of the second heat exchanger 300. The number of utilization heat exchangers 33 included in the water circuit 30 may be one, or, as shown in FIG. 1, may be two or more.

[0054] (1-6) Control unit 40 The control unit 40 controls the compressors 11, 21, the four-way switching valves 12, 22, the expansion valves 13, 23, and the water circulation pump 31. Although not shown in the figure, the control unit 40 is electrically connected to the compressors 11, 21, the four-way switching valves 12, 22, the expansion valves 13, 23, and the water circulation pump 31 so as to be able to send and receive control signals.

[0055] (1-7) Operation of Refrigeration Device 1 The refrigeration device 1 performs heating operation and cooling operation.

[0056] (1-7-1) Heating operation The heating operation is an operation in which the refrigeration device 1 heats the water in the water circuit 30. In the heating operation, the control unit 40 sets the four-way switching valves 12, 22 to the first state, drives the compressors 11, 21 and the water circulation pump 31, and controls the opening degrees of the expansion valves 13, 23.

[0057] (1-7-1-1) Second refrigerant circuit 20 Compressor 21 draws low-pressure gas-phase second refrigerant from second refrigerant circuit 20 through suction port 21a and discharges it as high-pressure gas-phase second refrigerant from discharge port 21b. The high-pressure gas-phase second refrigerant passes through four-way selector valve 22, first through first port 22a and then second port 22b, and reaches second flow path 220 through second outlet 142a of first heat exchanger 100. In second flow path 220 of first heat exchanger 100, the high-pressure gas-phase second refrigerant condenses into high-pressure liquid-phase second refrigerant. At this time, the second refrigerant releases heat to the first refrigerant passing through first flow path 210. The high-pressure liquid-phase second refrigerant reaches expansion valve 23. Expansion valve 23, set to an appropriate opening, reduces the pressure of the high-pressure liquid-phase second refrigerant to form a low-pressure two-phase gas-liquid second refrigerant. The low-pressure two-phase gas-liquid second refrigerant evaporates in heat source heat exchanger 24 to form a low-pressure gas-phase second refrigerant. At this time, the second refrigerant absorbs heat from the heat source. The low-pressure gas-phase second refrigerant passes through four-way selector valve 22 in this order, via fourth port 22d and third port 22c, and is then drawn into compressor 21 via suction port 21a.

[0058] (1-7-1-2) 1st refrigerant circuit 10 Compressor 11 draws low-pressure gas-phase first refrigerant from first refrigerant circuit 10 through suction port 11a and discharges it as high-pressure gas-phase first refrigerant from discharge port 11b. The high-pressure gas-phase first refrigerant passes through four-way selector valve 12, first port 12a and then second port 12b, and reaches first flow path 410 from first outlet 341a of second heat exchanger 300. In first flow path 410 of second heat exchanger 300, the high-pressure gas-phase first refrigerant condenses into high-pressure liquid-phase first refrigerant. At this time, the first refrigerant releases heat to water passing through second flow path 420. The high-pressure liquid-phase first refrigerant reaches expansion valve 13. Expansion valve 13, set to an appropriate opening, reduces the pressure of the high-pressure liquid-phase first refrigerant to a low-pressure gas-liquid two-phase first refrigerant. The low-pressure gas-liquid two-phase first refrigerant passes through first flow port 141b of first heat exchanger 100, and then evaporates in first flow path 210 to become low-pressure gas-phase first refrigerant. At this time, the first refrigerant absorbs heat from the second refrigerant passing through second flow path 220. The low-pressure gas-phase first refrigerant passes through four-way selector valve 12 via fourth port 12d and third port 12c in this order, and is then drawn into compressor 11 from suction port 11a.

[0059] (1-7-1-3) Water circuit 30 The water circulation pump 31 draws water circulating through the water circuit 30 through the intake section 31a and discharges it from the discharge section 31b. A portion of the discharged water passes through the water intake section 32a and is stored in the water storage tank 32, while the remainder passes through the utilization heat exchanger 33. Both the water stored in the water storage tank 32 and the water passing through the utilization heat exchanger 33 release heat to the air in the space to be air-conditioned. In other words, the water stored in the water storage tank 32 and the water passing through the utilization heat exchanger 33 heat the air in the space to be air-conditioned. After passing through the discharge section 32b, the water stored in the water storage tank 32 passes through the second flow port 342a of the second heat exchanger 300 and reaches the second flow path 420. The water that has passed through the utilization heat exchanger 33 passes through the second flow port 342a of the second heat exchanger 300 and reaches the second flow path 420. The water that reaches second flow path 420 of second heat exchanger 300 absorbs heat from the first refrigerant passing through first flow path 410. The water that has absorbed the heat is drawn into water circulation pump 31 from suction port 31a.

[0060] (1-7-2) Cooling operation The cooling operation is an operation in which the refrigeration device 1 cools the water in the water circuit 30. In the cooling operation, the control unit 40 sets the four-way switching valves 12, 22 to the second state, drives the compressors 11, 21 and the water circulation pump 31, and controls the opening degrees of the expansion valves 13, 23.

[0061] (1-7-2-1) Second refrigerant circuit 20 Compressor 21 draws low-pressure gas-phase second refrigerant from second refrigerant circuit 20 through suction port 21a and discharges it as high-pressure gas-phase second refrigerant from discharge port 21b. The high-pressure gas-phase second refrigerant passes through four-way selector valve 22, first through first port 22a and then through fourth port 22d, to reach heat-source heat exchanger 24. In heat-source heat exchanger 24, the high-pressure gas-phase second refrigerant condenses into high-pressure liquid-phase second refrigerant. At this time, the second refrigerant releases heat to the heat source. The high-pressure liquid-phase second refrigerant reaches expansion valve 23. Expansion valve 23, with an appropriate opening, reduces the pressure of the high-pressure liquid-phase second refrigerant to form a low-pressure two-phase gas-liquid second refrigerant. The low-pressure two-phase gas-liquid second refrigerant passes through second flow port 142b of first heat exchanger 100 and then evaporates in second flow path 220 to form a low-pressure gas-phase second refrigerant. At this time, the second refrigerant absorbs heat from the first refrigerant passing through second flow path 220. The low-pressure gas-phase second refrigerant passes through four-way switching valve 22 via second port 22b and third port 22c in this order, and is then drawn into compressor 21 via suction port 21a.

[0062] (1-7-2-2) 1st refrigerant circuit 10 Compressor 11 draws low-pressure gas-phase first refrigerant from first refrigerant circuit 10 through suction port 11a and discharges it as high-pressure gas-phase first refrigerant from discharge port 11b. The high-pressure gas-phase first refrigerant passes through four-way selector valve 12, first port 12a and then fourth port 12d, and reaches first flow path 210 from first outlet 141a of first heat exchanger 100. In first flow path 210 of first heat exchanger 100, the high-pressure gas-phase first refrigerant condenses into high-pressure liquid-phase first refrigerant. At this time, the first refrigerant releases heat to the second refrigerant passing through second flow path 220. The high-pressure liquid-phase first refrigerant reaches expansion valve 13. Expansion valve 13, with an appropriate opening, reduces the pressure of the high-pressure liquid-phase first refrigerant to a low-pressure gas-liquid two-phase first refrigerant. The low-pressure gas-liquid two-phase first refrigerant passes through first flow port 341b of second heat exchanger 300, and then evaporates in first flow path 410 to become low-pressure gas-phase first refrigerant. At this time, the first refrigerant absorbs heat from the second refrigerant passing through second flow path 420. The low-pressure gas-phase first refrigerant passes through four-way selector valve 12 via second port 12b and third port 12c in this order, and is then drawn into compressor 11 from suction port 11a.

[0063] (1-7-2-3) Water circuit 30 The water circulation pump 31 draws water circulating through the water circuit 30 through the intake section 31a and discharges it from the discharge section 31b. A portion of the discharged water passes through the water intake section 32a and is stored in the water storage tank 32, while the remainder passes through the utilization heat exchanger 33. Both the water stored in the water storage tank 32 and the water passing through the utilization heat exchanger 33 absorb heat from the air in the air-conditioned space. In other words, the water stored in the water storage tank 32 and the water passing through the utilization heat exchanger 33 cool the air in the air-conditioned space. After passing through the discharge section 32b, the water stored in the water storage tank 32 passes through the second flow port 342a of the second heat exchanger 300 and reaches the second flow path 420. The water that has passed through the utilization heat exchanger 33 passes through the second flow port 342a of the second heat exchanger 300 and reaches the second flow path 420. The water that reaches second flow path 420 of second heat exchanger 300 releases heat to the first refrigerant passing through first flow path 410. The water that has released the heat is drawn into water circulation pump 31 from suction port 31a.

[0064] (2) 1st heat exchanger 100 (2-1) Overall structure The first heat exchanger 100 is a plate-type heat exchanger composed of multiple layers. Fig. 2 is an exploded view of the first heat exchanger 100. Fig. 3 is an enlarged cross-sectional view of the first heat exchanger 100. Specifically, Fig. 3 is an enlarged cross-sectional view of the periphery of upper inner holes 112, 122, and 132 and outer holes 111, 121, and 131 (all of which will be described later). In Fig. 3, the flow directions of the first refrigerant and the second refrigerant during heating operation are indicated by arrows.

[0065] The multiple layers that make up the first heat exchanger 100 include multiple first layers 110, multiple second layers 120, multiple third layers 130, a first end frame 140, and a second end frame 150. The first heat exchanger 100 has a first flow path 210 and a second flow path 220 therein.

[0066] The first layer 110, the second layer 120, and the third layer 130 have the same outer periphery shape and size. In this embodiment, as shown in Fig. 2, the first layer 110, the second layer 120, the third layer 130, the first end frame 140, and the second end frame 150 have a strip-like outer shape.

[0067] The multiple first layers 110 and the multiple third layers 130 are alternately stacked between the first end frame 140 and the second end frame 150, with the second layer 120 sandwiched between them. The number of the multiple first layers 110 and the multiple third layers 130 is not particularly limited and is set appropriately depending on the required performance. The first end frame 140, the first layer 110, the second layer 120, the third layer 130, and the second end frame 150 are integrally bonded by, for example, but not limited to, diffusion bonding.

[0068] In the following description, for convenience, the longitudinal direction of the first layer 110, the second layer 120, and the third layer 130 may be referred to as the longitudinal direction DL. Also, the width direction of the first layer 110, the second layer 120, and the third layer 130 may be referred to as the width direction DW. Furthermore, the thickness direction of the first layer 110, the second layer 120, and the third layer 130 (in other words, the stacking direction) may be referred to as the thickness direction DT (see arrows shown in some drawings for both). Also, the up and down directions referred to in the following description correspond to the "up" and "down" shown in some drawings.

[0069] The first heat exchanger 100 is an example of a heat exchanger.

[0070] (2-2) Detailed configuration (2-2-1) 1st layer 110 The first layer 110 forms a first flow path 210 together with the adjacently stacked second layer 120. The first layer 110 includes a heat transfer plate 110a and a first frame plate 110b. FIG. 4 is an exploded view of the first layer 110. FIG. 5 is a schematic cross-sectional view showing cross sections of the first layer 110 and the second layer 120. As shown in FIG. 4, the heat transfer plate 110a is housed in a central hole 110c (described below) of the first frame plate 110b.

[0071] (2-2-1-1) Heat transfer plate 110a The heat transfer plate 110a has two inner holes 112, two headers 113, and a plurality of recesses 114. In this embodiment, the heat transfer plate 110a has a strip shape that is long in the first direction. The heat transfer plate 110a is an example of a first heat transfer plate.

[0072] The inner holes 112 are holes through which the first refrigerant flows. The inner holes 112 penetrate the heat transfer plate 110a along the thickness direction DT. The inner holes 112 are circular in a plan view of the heat transfer plate 110a. The inner holes 112 are an example of through holes.

[0073] The header 113 connects the inner hole 112 and the recess 114, and diverts a portion of the first refrigerant flowing through a first communication passage 161 (described later) to the recess 114. The surface of the header 113 is flush with the bottom 114b of the recess 114. The header 113 overlaps with the inner hole 112 in a plan view of the heat transfer plate 110a.

[0074] One of the two headers 113 is a rectangular region surrounded by the upper edge 110eu of the heat transfer plate 110a, parts of both edge portions 110es in the width direction DW, and a plurality of recesses 114 in a plan view of the heat transfer plate 110a. The other of the two headers 113 is a rectangular region surrounded by the lower edge 110eb of the heat transfer plate 110a, parts of both edge portions 110es in the width direction DW, and a plurality of recesses 114 in a plan view of the heat transfer plate 110a. The two headers 113 have the same outer periphery shape and size. Furthermore, the header 113 has a plurality of protrusions 113i on its surface (see FIG. 3).

[0075] The recesses 114 are grooves through which the first refrigerant diverted by the header 113 flows. The recesses 114 are formed in the center of the heat transfer plate 110a in the longitudinal direction DL. The recesses 114 are linear along the longitudinal direction DL. A plurality of recesses 114 (approximately 130 in this embodiment, but not limited to) are formed at predetermined intervals along the width direction DW. Adjacent recesses 114 are separated by wall portions 114a. One end of each recess 114 contacts the upper header 113, and the other end contacts the lower header 113.

[0076] As shown in FIG. 5, the edge 110es of the heat transfer plate 110a overlaps with the bottom 114b of the recess 114 in a plan view of the heat transfer plate 110a.

[0077] The heat transfer plate 110a is a metal plate. The header 113 and the recess 114 are formed by etching. The inner hole 112 is formed by pressing.

[0078] (2-2-1-2) First frame board 110b The first frame plate 110b is a plate-like member that is disposed around the heat transfer plate 110a. The first frame plate 110b has two outer holes 111 and one central hole 110c formed therein.

[0079] The outer holes 111 are holes through which the second refrigerant flows. The outer holes 111 penetrate the first frame plate 110b along the thickness direction DT. The outer holes 111 are circular in a plan view of the heat transfer plate 110a. One of the two outer holes 111 is formed above the central hole 110c. The other of the two outer holes 111 is formed below the central hole 110c.

[0080] The central hole 110c is a through-hole that accommodates the heat transfer plate 110a. The central hole 110c is formed in the center of the first frame plate 110b in a rectangular shape so that the heat transfer plate 110a can be accommodated therein.

[0081] When the first layer 110 is viewed in plan, the gap g2 between the first frame plate 110b and the first heat transfer plate 110a (more specifically, the gap between the inner surface of the first frame plate 110b and the edge 110es of the heat transfer plate 110a; see Figure 5) may be 3 times or less the width of the recess 114, preferably 2.5 times or less, and more preferably 2 times or less.

[0082] The first frame plate 110b is a metal plate, and the outer holes 111 and the central hole 110c are formed by press working.

[0083] (2-2-2) 2nd layer 120 The second layer 120 is a partition wall that separates the first layer 110 and the third layer 130 in the thickness direction DT. The second layer 120 is a flat plate in which two outer holes 121 and two inner holes 122 are formed.

[0084] The outer holes 121 are holes through which the second refrigerant flows. The outer holes 121 penetrate the second layer 120 along the thickness direction DT. The outer holes 121 have the same shape and size as the outer holes 111 of the first layer 110. Furthermore, the outer holes 121 are formed at positions that overlap with the outer holes 111 of the heat transfer plate 110a when the second layer 120 is stacked on the first layer 110.

[0085] The inner holes 122 are holes through which the first refrigerant flows. The inner holes 122 penetrate the second layer 120 along the thickness direction DT. The inner holes 122 have the same shape and size as the inner holes 112 of the heat transfer plate 110a. Furthermore, the inner holes 122 are formed at positions that overlap with the inner holes 112 of the heat transfer plate 110a when the second layer 120 is stacked on the first layer 110.

[0086] The second layer 120 is a metal plate. The outer hole 121 and the inner hole 122 are formed by press working.

[0087] (2-2-3) Third layer 130 The third layer 130 is a heat transfer plate adjacent to the second layer 120 on the surface opposite to the first layer 110. The third layer 130 forms a second flow path 220 together with the adjacent second layer 120 stacked thereon. The third layer 130 has two outer holes 131, two inner holes 132, two headers 133, and a plurality of recesses 134 formed therein. The third layer 130 is an example of a second heat transfer plate.

[0088] The outer holes 131 are holes through which the second refrigerant flows. The outer holes 131 penetrate the third layer 130 along the thickness direction DT. The outer holes 131 have the same shape and size as the outer holes 111 of the first layer 110 and the outer holes 121 of the second layer 120. Furthermore, the outer holes 131 are formed at positions that overlap with the outer holes 121 of the second layer 120 when the second layer 120 is laminated on the third layer 130.

[0089] The inner hole 132 is a hole through which the first refrigerant flows. The inner hole 132 penetrates the third layer 130 along the thickness direction DT. The inner hole 132 has the same shape and size as the inner hole 112 of the first layer 110 and the inner hole 122 of the second layer 120. Furthermore, the inner hole 132 is formed at a position that overlaps with the inner hole 122 of the second layer 120 when the second layer 120 is laminated on the third layer 130.

[0090] The header 133 connects the outer hole 131 with the recess 134, and diverts a portion of the second refrigerant flowing through a second communication passage 162 (described later) to the recess 134. The surface of the header 133 is flush with the bottom 134b of the recess 134. The header 133 overlaps with the outer hole 131 and the inner hole 132 in a plan view of the third layer 130.

[0091] One of the two headers 133 is a rectangular area surrounded by the upper edge 130eu of the third layer 130, parts of both edge portions 130es in the width direction DW, and the upper ends of the multiple recesses 134 in a plan view of the third layer 130. The other of the two headers 133 is a rectangular area surrounded by the lower edge 130eb of the third layer 130, parts of both edge portions 130es in the width direction DW, and the lower ends of the multiple recesses 134 in a plan view of the third layer 130. The two headers 133 have the same outer periphery shape and size. Furthermore, the header 133 has multiple protrusions 133i provided on its surface (see FIG. 3).

[0092] The header 133 has a seal portion 133s. The seal portion 133s prevents the first refrigerant flowing through the inner hole 132 from flowing into the header 133. The seal portion 133s is a protrusion formed to surround the inner hole 132 in a plan view of the third layer 130. The seal portion 133s protrudes from the surface of the header 133 to the same height as the wall portion 134a.

[0093] The recesses 134 are grooves through which the second refrigerant diverted by the header 133 flows. The recesses 134 are linear along the longitudinal direction. A plurality of recesses 134 (approximately 130 in this embodiment, although this is not limited thereto) are formed at predetermined intervals along the width direction DW. Adjacent recesses 134 are separated by wall portions 134a. One end of each recess 134 contacts the upper header 133, and the other end contacts the lower header 133.

[0094] The third layer 130 is a metal plate. The outer hole 131, the inner hole 132, the header 133, and the recess 134 are formed by press working.

[0095] (2-2-4) First End Frame 140 and Second End Frame 150 The first end frame 140 is a plate-like member having first flow ports 141a and 141b and second flow ports 142a and 142b.

[0096] The first flow ports 141a and 141b are through holes formed in the first end frame 140. The first refrigerant flows into the first heat exchanger 100 from the first flow ports 141a and 141b. The first flow port 141a is disposed at a position communicating with the inner holes 112, 122, and 132 formed above. The first flow port 141b is disposed at a position communicating with the inner holes 112, 122, and 132 formed below.

[0097] The second flow ports 142a and 142b are through holes formed in the first end frame 140. The second refrigerant flows into the first heat exchanger 100 from the second flow ports 142a and 142b. The second flow port 142a is disposed at a position communicating with the outer holes 111, 121, and 131 formed above. The second flow port 142b is disposed at a position communicating with the outer holes 111, 121, and 131 formed below.

[0098] The first end frame 140 is a metal plate. The first flow ports 141a, 141b and the second flow ports 142a, 142b are formed by press working.

[0099] The second end frame 150 is a plate-like member with no holes formed therein. The second end frame 150 is a metal plate.

[0100] (2-2-5) Assembly of the first heat exchanger 100 The first flow path 210 is formed by laminating the second layer 120 on the first layer 110 and closing the opening of the recess 114 with the surface of the second layer 120. The second flow path 220 is formed by laminating the second layer 120 on the third layer 130 and closing the opening of the recess 134 with the surface of the second layer 120.

[0101] By stacking the first layer 110, the second layer 120, and the third layer 130, the inner holes 112, 122, and 132 communicate with each other to form a first communication passage 161 through which the first refrigerant flowing in from the first flow ports 141a and 141b flows along the thickness direction DT. Furthermore, by stacking the first layer 110, the second layer 120, and the third layer, the outer holes 111, 121, and 131 communicate with each other to form a second communication passage 162 through which the second refrigerant flowing in from the second flow ports 142a and 142b flows along the thickness direction DT.

[0102] When the first end frame 140 is stacked on the stacked first layer 110, second layer 120, and third layer, the first flow ports 141a, 141b communicate with the first communication passage 161, and the second flow ports 142a, 142b communicate with the second communication passage 162.

[0103] The second layer 120 is stacked on the third layer 130, and the surface of the second layer 120 comes into contact with the surface of the sealing portion 133s, so that the sealing portion 133s prevents the first refrigerant flowing through the inner hole 132 from flowing into the header 133 (see Figure 3).

[0104] (2-3) Flow of the first and second refrigerants (2-3-1) Flow of the first refrigerant In cooling operation, the first refrigerant that flows into first flow port 141a of first heat exchanger 100 flows through upper first communication passage 161. A portion of the first refrigerant flowing through first communication passage 161 passes through upper header 113 and flows into first flow path 210 (recess 114). The first refrigerant that flows into first flow path 210 flows along the longitudinal direction DL, and then passes through lower header 113 and flows into lower first communication passage 161. The first refrigerant that flows into first communication passage 161 flows out of first heat exchanger 100 through first flow port 141b.

[0105] In heating operation, the first refrigerant flows in the opposite direction to that in cooling operation. Specifically, the first refrigerant that flows into first circulation port 141b of first heat exchanger 100 flows through lower first communication passage 161. A portion of the first refrigerant flowing through first communication passage 161 passes through lower header 113 and flows into first flow path 210 (recess 114). The first refrigerant that flows into first flow path 210 flows along the longitudinal direction DL, and then passes through upper header 113 and flows into upper first communication passage 161. The first refrigerant that flows into first communication passage 161 flows out of first heat exchanger 100 through first circulation port 141a (see arrow A in FIG. 3 ).

[0106] (2-3-2) Flow of the second refrigerant In cooling operation, the second refrigerant that flows into second flow port 142b of first heat exchanger 100 flows through lower second communication passage 162. A portion of the second refrigerant flowing through second communication passage 162 passes through lower header 133 and flows into second flow passage 220 (recess 134). The second refrigerant that flows into second flow passage 220 flows along the longitudinal direction DL, and then passes through upper header 133 and flows into upper second communication passage 162. The second refrigerant that flows into second communication passage 162 flows out of first heat exchanger 100 through second flow port 142a.

[0107] In heating operation, the second refrigerant flows in the opposite direction to that in cooling operation. Specifically, the second refrigerant that flows into second flow port 142a of first heat exchanger 100 flows through upper second communication passage 162 (see arrow B in FIG. 3). A portion of the second refrigerant flowing through second communication passage 162 passes through upper header 133 and flows into second flow passage 220 (recess 134). The second refrigerant that flows into second flow passage 220 flows along the longitudinal direction DL, and then passes through lower header 133 and flows into lower second communication passage 162. The second refrigerant that flows into second communication passage 162 flows out of first heat exchanger 100 through second flow port 142b.

[0108] (3) Features (3-1) The first heat exchanger 100 is composed of multiple layers. The multiple layers include a first layer 110. The first layer 110 includes a heat transfer plate 110a and a first frame plate 110b. The heat transfer plate 110a has recesses 114 formed by etching to serve as flow paths for the first refrigerant. The first frame plate 110b is disposed around the heat transfer plate 110a.

[0109] In the first heat exchanger 100, the first layer 110 is composed of a heat transfer plate 110a in which recesses 114 are formed by etching, and a first frame plate 110b arranged around the heat transfer plate 110a. Therefore, the area of ​​the etched sheet used to manufacture one first layer 110 is smaller than when the entire first layer 110 is formed from an etched sheet. As a result, the number of heat transfer plates 110a manufactured from one etched sheet increases compared to the prior art.

[0110] Therefore, the first heat exchanger 100 prevents an increase in manufacturing costs.

[0111] (3-2) The heat transfer plate 110a has an edge 110es that overlaps with the bottom 114b of the recess 114 in a plan view.

[0112] By forming the edge 110es to overlap the bottom portion 114b, a gap g1 is formed between the wall portion 114a adjacent to the recess 114 on the edge 110es and the inner surface of the first frame plate 110b (see FIG. 5). In the first heat exchanger 100, the gap g1 functions as a flow path for the first refrigerant.

[0113] (3-3) When the first layer 110 is seen in plan view, the gap g2 between the first frame plate 110b and the first heat transfer plate 110a is equal to or smaller than twice the width of the recess 114.

[0114] If the gap g2 is formed wide, the flow rate of the first refrigerant in the recess 114 decreases as the flow rate of the first refrigerant in the gap g2 increases, which may reduce the heat exchange efficiency of the first heat exchanger 100. The first heat exchanger 100 prevents the gap g2 from being formed wide. Therefore, the first heat exchanger 100 prevents a decrease in heat exchange efficiency caused by a large amount of the first heat medium flowing through the gap g2.

[0115] (3-4) The plurality of layers further includes a second layer 120 adjacent to the first layer 110. The second layer 120 includes a partition wall.

[0116] (3-5) The first frame plate 110b is formed by press working.

[0117] According to the first heat exchanger 100, the first frame plate 110b is formed by press working, which prevents an increase in manufacturing costs.

[0118] (3-6) The refrigeration device 1 includes a first heat exchanger 100 .

[0119] According to the refrigeration device 1, since the first heat exchanger 100 is provided, an increase in manufacturing costs is suppressed.

[0120] (4) Variations (4-1) Variation 1 In a plan view of the heat transfer plate 110a, an edge 110es of the heat transfer plate 110a may overlap with a wall portion 114a adjacent to the recess 114. Fig. 6 is a schematic cross-sectional view of the first layer 110 and the second layer 120 of the first heat exchanger 100 according to the first modification.

[0121] In the first heat exchanger 100 according to the first modification, the edge 110es overlaps the wall portion 114a in a plan view of the heat transfer plate 110a, thereby preventing a wide gap g1 including the recess 114 from being formed between the heat transfer plate 110a and the inner surface of the first frame plate 110b. This prevents a decrease in the flow rate of the first refrigerant in the recess 114 due to an increase in the flow rate of the first refrigerant in the gap g1. Therefore, the first heat exchanger 100 according to the first modification prevents a decrease in heat exchange efficiency caused by a large amount of the first refrigerant flowing through the gap g3 (see FIG. 6 ) between the heat transfer plate 110a and the inner surface of the first frame plate 110b.

[0122] (4-2) Variation 2 The heat transfer plate 110a may further have linear protrusions 115 surrounding the headers 113 and the recesses 114 in a plan view of the heat transfer plate 110a. The protrusions 115 are formed along the edges 110eu, eb, and es of the heat transfer plate 110a. Fig. 7 is a plan view of the first layer 110 of the first heat exchanger 100 according to Modification 2. Fig. 8 is a schematic cross-sectional view of the first layer 110 and the second layer 120 of the first heat exchanger 100 according to Modification 2.

[0123] The first layer 110 of the first heat exchanger 100 according to the second modification has the protrusions 115, which can prevent the first refrigerant from flowing into the gaps g4 (see FIG. 8 ) between the edge 110es of the heat transfer plate 110a and the inner surface of the first frame plate 110b. This prevents a decrease in the flow rate of the first refrigerant in the recesses 114 due to an increase in the flow rate of the first refrigerant in the gaps g4. Therefore, the first heat exchanger 100 according to the second modification prevents a decrease in heat exchange efficiency caused by the first refrigerant flowing through the gaps g4.

[0124] (4-3) Variation 3 In the above embodiment, the third layer 130 is formed by pressing, but the recesses 134 that become the second flow paths 220 through which the second refrigerant flows may be formed by etching in the third layer 130. In this case, the shape and size of the periphery of the third layer 130 are the same as those of the second layer 120 in a plan view.

[0125] (4-4) Variation 4 Similar to the first layer 110, the third layer 130 may include a heat transfer plate in which recesses 134 are formed by etching, and a second frame plate arranged around the heat transfer plate (both not shown).

[0126] In the first heat exchanger 100 according to the fourth modification, the third layer 130 is made up of a heat transfer plate in which the recesses 134 are formed by etching and a second frame plate disposed around the heat transfer plate. This reduces the manufacturing cost compared to when the entire third layer 130 is made of an etched sheet.

[0127] In this case, the second frame plate may be formed by press working. Since the second frame is formed by press working, an increase in manufacturing costs is suppressed.

[0128] (4-5) Variation 5 The second heat exchanger 300 of the refrigeration device 1 may also be configured with the first heat exchanger 100. In this case, the first heat exchanger 100 is arranged so that the first refrigerant passes through the first flow path 210 and water passes through the second flow path 220. <Conclusion> Although the embodiments of the present disclosure have been described above, it will be understood that various changes in form and details can be made without departing from the spirit and scope of the present disclosure as defined in the claims. [Explanation of symbols]

[0129] 1: Refrigeration equipment 100: 1st heat exchanger (heat exchanger) 110: 1st layer 110a: Heat transfer plate (first heat transfer plate) 110b: 1st frame board 110es:Edge 110eu: edge 112: Inner hole (through hole) 113: Header 114: Recess 114a: Wall part 114b: Bottom 115: Convex part 120: 2nd layer (partition wall) 130: Third layer (second heat transfer plate) 133: Header 134: Recess DT: Thickness direction g1, g2: gap [Prior art documents] [Patent documents]

[0130] [Patent Document 1] Special Publication No. 2012-512382

Claims

1. A heat exchanger (100) consisting of multiple layers, The plurality of layers are a first layer (110), The first layer is a first heat transfer plate (110a) having a recess (114) formed by etching to serve as a flow path for a first heat medium; a first frame plate (110b) arranged around the first heat transfer plate; Including, heat exchanger.

2. The first heat transfer plate is In a plan view, the edge (110es) overlaps with the bottom (114b) of the recess. The heat exchanger of claim 1 .

3. The first heat transfer plate is In a plan view, the edge (110es) overlaps with the wall portion (114a) adjacent to the recess. The heat exchanger of claim 1 .

4. The first heat transfer plate is A through hole (112) formed to penetrate in the thickness direction (DT), a header (113) formed by etching and communicating with the through hole and the recess; In a plan view, a linear protrusion (115) surrounding the header and the recess; further comprising The heat exchanger of claim 1 .

5. The first frame plate is In a plan view, the gap (g2) between the first heat transfer plate is equal to or less than twice the width of the recess. The heat exchanger of claim 1 .

6. The plurality of layers are further comprising a second layer (120) adjacent to said first layer; The second layer is including bulkheads, The heat exchanger of claim 1 .

7. The plurality of layers are The second layer further includes a third layer (130) adjacent to the first layer on the opposite side thereof; The third layer is a second heat transfer plate (130) having a recess (134) formed by etching to serve as a flow path for a second heat medium; 7. The heat exchanger of claim 6.

8. The second heat transfer plate is In a plan view, the shape and size of the outer periphery are the same as the shape and size of the outer periphery of the partition wall.

8. The heat exchanger of claim 7.

9. The third layer is Further comprising a second frame plate disposed around the second heat transfer plate.

8. The heat exchanger of claim 7.

10. The first frame plate is It is formed by pressing, The heat exchanger of claim 1 .

11. The second frame plate is It is formed by pressing, 10. The heat exchanger of claim 9.

12. A refrigeration system (1) comprising a heat exchanger according to any one of claims 1 to 11.

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