Electronic component bracket, processing method thereof, and package product

Abstract

SOLUTION: The electronic component bracket includes a metal plate assembly, an inner filling resin layer, a bottom resin layer, and a top resin layer. The metal plate assembly includes a positive electrode metal plate and a negative electrode metal plate, and side surfaces of the two metal plates are respectively provided with connecting rib sections. The internal filling resin layer is filled in a gap between the positive electrode metallic plate and the negative electrode metallic plate. The metal plate assembly and the inner filling resin layer constitute an entire unit. The upper resin layer includes a tubular structure and a protrusion that are integrally connected, and the protrusion is disposed on an outer edge of a bottom surface of the tubular structure. The cylindrical structure covers the outer edge of the top surface of the entire unit, and the protrusion covers the cross section of the connecting rib. The bottom resin layer is annularly fitted to the outside of the whole unit, and a receiving groove capable of being fitted to the projection is provided on the upper surface of the bottom resin layer. On the side surface of the entire unit, a portion other than the cross section of the connection rib is covered with the inner surface of the bottom resin layer.EFFECT: Compared with the prior art, the technical solutions of the present invention can improve product reliability.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to the technical field of electronic components, and in particular to an electronic component bracket and its processing method and package product. [Background technology]

[0002] The structure of the packaged product before packaging can be called an electronic component bracket, which includes a positive metal plate, a negative metal plate, and a resin. In the prior art, the processing method for the electronic component bracket generally includes the following steps: First, a copper plate is etched and electroplated to obtain a lead frame. The lead frame includes a plurality of array units arranged in an array. Each array unit includes one positive metal plate and one negative metal plate. The positive and negative metal plates are of the same thickness. A hollow is formed between the positive and negative metal plates in the same array unit. The positive and negative metal plates of two adjacent array units are all connected by connecting ribs, the thickness of which is smaller than that of the positive and negative metal plates. In the second step, resin is molded on the lead frame, so that the cavities and grooves in the lead frame are filled with resin, and also a grid structure is formed on the top surface of the lead frame, and the edges of the grid cover the connecting ribs. In the third step, the connecting ribs and the central portion of the edge are simultaneously cut along the edge of the grid to obtain a plurality of electronic component brackets.

[0003] In the electronic component brackets processed using the above method, the ends of the connecting ribs are visible in cross section, meaning that the gap between the connecting ribs and the resin is exposed, which can allow light-sensitive or harmful substances to penetrate through the gap between the lead frame and the resin, causing discoloration of the lead frame coating and deterioration and decay of the package material. Summary of the Invention [Problem to be solved by the invention]

[0004] SUMMARY OF THE INVENTION The present invention aims to solve the above-mentioned problems of the prior art and to provide an electronic component bracket, a processing technique for the same, and a package product that improves the reliability of the product. [Means for solving the problem]

[0005] To achieve the above objectives, the present invention provides the following solutions:

[0006] The present invention discloses an electronic component bracket, which includes a metal plate assembly, an inner filling resin layer, a bottom resin layer and an upper resin layer, wherein the inner filling resin layer is integrally connected to the bottom resin layer; The metal plate assembly includes at least one positive metal plate and at least one negative metal plate, and a side surface of the positive metal plate and a side surface of the negative metal plate have cross sections of connecting ribs formed after the connecting ribs are removed, respectively; the internal filling resin layer is filled in a gap between the positive metal plate and the negative metal plate; The metal plate assembly and the internal filling resin layer constitute an entire unit, the upper resin layer includes a cylindrical structure and a protrusion that are integrally connected, the protrusion being disposed on the outer edge of the bottom surface of the cylindrical structure, the cylindrical structure covering the outer edge of the top surface of the entire unit, and the protrusion covering a cross section of the connecting rib; the bottom resin layer is fitted in an annular shape around the entire unit, and a receiving groove capable of fitting with the protrusion is provided on an upper surface of the bottom resin layer; The side surface of the entire unit is covered with the inner surface of the bottom resin layer except for the cross section of the connecting rib, and the top resin layer covers the top surface of the bottom resin layer.

[0007] Preferably, the inner hole of the tubular structure is conical, and the end of the inner hole of the tubular structure with the smallest cross-sectional area is connected to the top surface of the entire unit.

[0008] Preferably, the electronic component bracket further includes an inner coating resin layer, which coats the upper surface of the inner filling resin layer.

[0009] Preferably, the upper resin layer partially covers the upper surface of the positive electrode metal plate and the upper surface of the negative electrode metal plate.

[0010] The present invention further discloses a method for manufacturing the electronic component bracket, which includes the following steps: The first step is to etch a metal plate to obtain a lead frame, the lead frame including a plurality of array units distributed in an array, each array unit including at least one positive metal plate and at least one negative metal plate, in one array unit, the space between the positive metal plate and the negative metal plate corresponding to the same electrical device is completely hollow, two adjacent array units are connected by a connecting rib, the thickness of the connecting rib is smaller than the thickness of the array unit, and both ends of the connecting rib are connected to the side bottom of the array unit. In the second step, resin is molded onto the lead frame, and the cavities and grooves in the lead frame are filled with resin to obtain the entire planar board. In the third step, the entire connecting rib or a central portion thereof is removed to disconnect the two adjacent array units, and at this time, the two adjacent array units are connected only by the resin filled in the second step. After the connecting rib is removed, a receiving groove is formed on the upper surface of the entire flat plate, and the cross section of the connecting rib is located within the receiving groove. In the fourth step, a resin is molded onto the structure obtained in the third step, and the molded resin not only fills the receiving grooves but also forms a grid on the top surface of the structure obtained in the third step. In the fifth step, cut out the center of the edge along the edge of the grid to obtain multiple independent electronic component brackets.

[0011] Preferably, in the third step, the method for removing the connecting ribs is cutting or etching.

[0012] Preferably, the method also includes a step of electroplating the lead frame between the first and second steps.

[0013] Preferably, the method further comprises, after the fifth step, a step of electroplating the positive electrode metal plate and the negative electrode metal plate.

[0014] The present invention also discloses a packaging product including the above-mentioned electronic component bracket, a chip, and a packaging layer, wherein the chip is electrically connected to the positive metal plate and the negative metal plate, respectively, the packaging layer is used to package the chip, and both the chip and the packaging layer are disposed inside the tubular structure. Preferably, the chip is any one of an LED chip, a laser chip, and an IC chip. [Effects of the Invention]

[0015] Compared with the prior art, the present invention achieves the following technical advantages: The present invention has an advantage that the protrusion structure on the bottom surface of the upper resin layer fills the receiving groove formed after the connecting rib is removed and covers the cross section of the connecting rib, preventing the cross section of the connecting rib from being exposed. Therefore, the present invention can completely cover the side surface of the metal plate assembly and prevent light-sensitive substances and harmful substances from entering through the gap between the connecting rib and the resin, thereby improving the reliability of the electronic component bracket. [Brief explanation of the drawings]

[0016] In order to more clearly describe the embodiments of the present invention or the technical solutions in the prior art, the following briefly describes the drawings that need to be used in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention, and those skilled in the art can obtain other drawings based on these drawings without any creative efforts.

[0017] [Figure 1] 1 shows a side structure of an electronic component bracket obtained using existing technology. [Figure 2] 1 is a schematic diagram of a packaged product according to an embodiment of the present invention as viewed from above; [Figure 3] 1 is a schematic view of a packaged product according to an embodiment of the present invention as viewed from the side; [Figure 4] FIG. 2 is a front view of the lead frame. [Figure 5] FIG. 2 is a side view of a lead frame. DETAILED DESCRIPTION OF THE INVENTION

[0018] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, any other embodiments obtained by those skilled in the art without any creative efforts fall within the scope of protection of the present invention.

[0019] As shown in Figures 2 and 3, this embodiment provides an electronic component bracket, which includes a metal plate assembly, an inner filling resin layer 4, a bottom resin layer 5, and an upper resin layer 7, and the inner filling resin layer 4 is integrally connected to the bottom resin layer 5.

[0020] The metal plate assembly includes at least one positive metal plate 2 and at least one negative metal plate 3, and the side surfaces of the positive metal plate 2 and the negative metal plate 3 each have a cross section 1 of the connecting rib formed after the connecting rib 14 is removed. An internal filling resin layer 4 is filled in the gap between the positive metal plate 2 and the negative metal plate 3.

[0021] The entire structure consisting of the metal plate assembly and the inner filling resin layer 4 is called the entire unit. The upper resin layer 7 includes a cylindrical structure and a protrusion that are integrally connected, and the protrusion is located on the outer edge of the bottom surface of the cylindrical structure. The cylindrical structure covers the outer edge of the top surface of the entire unit, and the protrusion covers the cross section 1 of the connecting rib.

[0022] The bottom resin layer 5 is fitted in an annular shape around the outside of the entire unit, and the top surface of the bottom resin layer 5 is provided with receiving grooves into which the protrusions can be fitted.

[0023] The side surface of the entire unit is covered with the inner surface of the bottom resin layer 5 except for the cross section 1 of the connecting rib. The top resin layer 7 covers the top surface of the bottom resin layer 5. The operating principle of the electronic component bracket of this embodiment is as follows.

[0024] As shown in Figure 1, in the conventional electronic component bracket, cross section 1 of the connecting rib is exposed on the side of the electronic component bracket and is in direct contact with the outside air. As the resin deteriorates over time and the metal on the surface of the connecting rib corrodes, the joint between the connecting rib 14 and the resin becomes prone to expansion, making it easier for external impurities to enter through the joint.

[0025] In this embodiment, the protrusion structure on the bottom surface of the upper resin layer 7 fills the receiving groove formed after removing the connecting rib 14, and the protrusion structure covers the cross section 1 of the connecting rib, thereby preventing the cross section 1 of the connecting rib from being exposed, i.e., preventing the pins of the independent electronic component bracket from being exposed. Therefore, this embodiment can completely cover the side surface of the metal plate assembly, preventing light-sensitive substances and harmful substances from entering through the gap between the connecting rib 14 and the resin, and improving the reliability of the electronic component bracket.

[0026] As a possible example, in this embodiment, the upper resin layer 7 partially covers the upper surface of the positive electrode metal plate 2 and the upper surface of the negative electrode metal plate 3, leaving an area for mounting the chip 9.

[0027] As a possible example, in this embodiment, the inner hole of the cylindrical structure is conical, and the end of the inner hole of the cylindrical structure with the smallest cross-sectional area is connected to the top surface of the entire unit. Since the surface of the conical inner hole can reflect light, when a light emitting element is installed inside the cylindrical structure, more light is emitted toward the side away from the metal plate assembly, thereby improving brightness.

[0028] In order to further strengthen the bond between the bottom resin layer 5 and the top resin layer 7, they are preferably made of the same material.

[0029] As a possible example, in this embodiment, the electronic component bracket further includes an inner coating resin layer 6, which covers the upper surface of the inner filling resin layer 4. The material of the inner coating resin layer 6 and the material of the upper resin layer 7 may be the same or different.

[0030] As a possible example, in this embodiment, the metal plate assembly is made of copper material. According to different practical needs, those skilled in the art can also select other types of conductive metals, such as iron or other alloys (copper alloy, iron alloy).

[0031] This embodiment also provides a method for manufacturing the electronic component bracket, which includes the following steps: Step S1 (first step), as shown in Figures 4 and 5, is a step of etching a metal plate to obtain a lead frame 12, where the lead frame 12 includes a plurality of array units 13 distributed in an array, and each array unit 13 includes at least one positive metal plate 2 and at least one negative metal plate 3. In one array unit 13, the positive metal plate 2 and the negative metal plate 3 corresponding to the same electrical device (e.g., the next chip 9) are completely hollowed out (to avoid short circuits), and two adjacent array units 13 are connected by a connecting rib 14. The thickness of the connecting rib 14 is smaller than the thickness of the array unit 13, and both ends of the connecting rib 14 are connected to the side bottom of the array unit 13. In step S2 (second step), resin is molded onto the lead frame 12, and the cavities and grooves in the lead frame 12 are filled with the resin, thereby obtaining the entire flat plate. In step S3 (third step), all or a central portion of the connecting rib 14 is removed to disconnect the two adjacent array units 13. At this time, the two adjacent array units 13 are connected only by the resin filled in step S2. After removing the connecting rib 14, a receiving groove is formed on the upper surface of the entire flat plate, and the cross section 1 of the connecting rib is positioned within the receiving groove. In step S4 (fourth step), a resin is molded on the structure obtained in step S3, and the molded resin not only fills the receiving grooves but also forms a grid on the top surface of the structure obtained in step S3. In step S5 (fifth step), the center of the edge is cut along the edge of the grid to obtain a plurality of independent electronic component brackets, and none of the pins of the plurality of electronic component brackets are exposed.

[0032] As a possible example, in this embodiment, the method for removing the connecting rib 14 in step S3 is cutting or etching.

[0033] As a possible example, in this embodiment, a step of electroplating the lead frame 12 is also included between step S1 and step S2.

[0034] As a possible example, this embodiment further includes a step of electroplating the positive electrode metal plate 2 and the negative electrode metal plate 3 after step S5.

[0035] As shown in Figures 2 and 3, this embodiment further provides a packaged product including the electronic component bracket, a chip 9, and a packaging layer 10. The chip 9 is electrically connected to the positive electrode metal plate 2 and the negative electrode metal plate 3, respectively, and the packaging layer 10 is used to package the chip 9. Both the chip 9 and the packaging layer 10 are disposed inside a cylindrical structure.

[0036] There are many electrical connection methods for the chip 9, and those skilled in the art can select one according to their actual needs. If the chip 9 has a horizontal wire bond structure or a vertical structure, the chip 9 is electrically connected to the positive electrode metal plate 2 and the negative electrode metal plate 3 by welding a bonding wire 11. If the chip 9 has a flip chip structure, there is no need to weld the bonding wire 11, and the positive electrode of the chip 9 is directly connected to the positive electrode metal plate 2 and the negative electrode of the chip 9 is directly connected to the negative electrode metal plate 3.

[0037] The packaged product includes the electronic component bracket, and therefore also has the advantages of the electronic component bracket, which will not be described in detail here.

[0038] According to different practical needs, those skilled in the art can flexibly select the type of chip 9. As a possible example, in this embodiment, the chip 9 is any one of an LED chip, a laser chip, an IC chip, and an FC flip chip.

[0039] For example, in this embodiment, the material of the packaging layer 10 is any one of silicone, epoxy resin, silicon dioxide, and glass. Other materials may be mixed and added into the packaging layer 10 according to different practical needs. For example, the packaging layer 10 may further be mixed with a light conversion material, a light diffusion material, or a light reflection material. Specifically, the mixed material may be at least one of phosphor, silica particles, and titanium dioxide particles.

[0040] The present invention uses specific examples to explain the principles and embodiments of the present invention, and the above description of the examples is only used to help understand the method of the present invention and its core concept, and at the same time, for those skilled in the art, specific embodiments and application scope may change according to the concept of the present invention. In summary, the contents of this specification should not be understood as limiting the present invention. [Explanation of symbols]

[0041] 1 Cross section of connecting rib 2 Positive metal plate 3 Negative metal plate 4. Internal filling resin layer 5 Bottom resin layer 6 Internal coating resin layer 7 Upper resin layer 8 Metal plating layer 9 chips 10 Packaging Layer 11 Bonding wire 12 Lead Frame 13 Array Unit 14 Connecting rib

Claims

1. An electronic component bracket, comprising: a metal plate assembly, an inner filling resin layer, a bottom resin layer, and an upper resin layer, the inner filling resin layer being integrally connected to the bottom resin layer; The metal plate assembly includes at least one positive metal plate and at least one negative metal plate, and a side surface of the positive metal plate and a side surface of the negative metal plate have cross sections of connecting ribs formed after the connecting ribs are removed, respectively; the internal filling resin layer is filled in a gap between the positive metal plate and the negative metal plate; the metal plate assembly and the internal filling resin layer constitute an entire unit; the upper resin layer includes a cylindrical structure and a protrusion that are integrally connected, the protrusion being disposed on the outer edge of the bottom surface of the cylindrical structure, the cylindrical structure covering the outer edge of the top surface of the entire unit, and the protrusion covering a cross section of the connecting rib; the bottom resin layer is fitted in an annular shape around the entire unit, and a receiving groove capable of fitting with the protrusion is provided on an upper surface of the bottom resin layer; a portion of the side surface of the entire unit other than the cross section of the connecting rib is covered by the inner surface of the bottom resin layer; The electronic component bracket is characterized in that the upper resin layer covers an upper surface of the bottom resin layer.

2. 2. The electronic component bracket according to claim 1, wherein the inner hole of the cylindrical structure is conical, and the end of the inner hole of the cylindrical structure with the smallest cross-sectional area is connected to the top surface of the entire unit.

3. 2. The electronic component bracket according to claim 1, further comprising an inner coating resin layer, the inner coating resin layer covering an upper surface of the inner filling resin layer.

4. The electronic component bracket according to claim 1 , wherein the upper resin layer partially covers the upper surface of the positive electrode metal plate and the upper surface of the negative electrode metal plate.

5. A method for manufacturing an electronic component bracket according to any one of claims 1 to 4, comprising: a first step of etching a metal plate to obtain a lead frame, the lead frame including a plurality of array units distributed in an array, each array unit including at least one positive metal plate and at least one negative metal plate, in which the positive metal plate and the negative metal plate corresponding to the same electrical device in one array unit are completely hollowed out, and two adjacent array units are connected by a connecting rib, the thickness of the connecting rib is smaller than the thickness of the array unit, and both ends of the connecting rib are connected to the side bottom of the array unit; a second step of molding the resin onto the lead frame and filling the cavities and grooves in the lead frame with the resin to obtain an entire planar board; a third step of removing the entire connecting rib or a central portion thereof to disconnect the two adjacent array units, so that the two adjacent array units are connected only by the resin filled in the second step; and after removing the connecting rib, forming a receiving groove on the entire upper surface of the flat plate, with the cross section of the connecting rib positioned within the receiving groove; a fourth step of molding a resin onto the structure obtained in the third step, the molded resin not only filling the receiving groove but also forming a grid on the top surface of the structure obtained in the third step; and a fifth step of cutting out the center portion of the edge along the edge of the grid to obtain a plurality of independent electronic component brackets.

6. 6. The method for processing an electronic component bracket according to claim 5, wherein in the third step, the connecting ribs are removed by cutting or etching.

7. 6. The method for manufacturing an electronic component bracket according to claim 5, further comprising the step of electroplating the lead frame between the first step and the second step.

8. 6. The method for manufacturing an electronic component bracket according to claim 5, further comprising the step of electroplating the positive and negative metal plates after the fifth step.

9. A packaging product, comprising the electronic component bracket according to any one of claims 1 to 4, further comprising a chip and a packaging layer, the chip being electrically connected to the positive metal plate and the negative metal plate, respectively, the packaging layer being used to package the chip, and both the chip and the packaging layer being disposed inside the tubular structure.

10. The package product according to claim 9, wherein the chip is any one of an LED chip, a laser chip, and an IC chip.

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