Multilayer inductor component

Abstract

The magnetic flux passing through the element body easily flows smoothly.SOLUTION: The multilayer inductor component 10 includes an insulating body 11 containing a plurality of magnetic particles, an inductor wiring line 12 disposed inside the body 11, and extended electrodes. When the element body 11 is viewed in a cross-sectional view in a square observation range of 10 times the average particle diameter of the magnetic particles*10 times the average particle diameter, the magnetic particles include particles having a particle diameter of 2 times or more the average particle diameter.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a multilayer inductor component. [Background technology]

[0002] Patent Document 1 discloses a multilayer inductor component comprising an element body, an inductor wiring, and an extraction electrode. The element body contains magnetic particles. The inductor wiring extends spirally inside the element body. A first end of the extraction electrode is connected to an end of the inductor wiring. A second end of the extraction electrode is exposed on the outer surface of the element body. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2010-165964 Summary of the Invention [Problem to be solved by the invention]

[0004] In the multilayer inductor component described in Patent Document 1, the magnetic particles contained in the element body have magnetic moments oriented in different directions. If the magnetic moments of the magnetic particles are not aligned, the magnetic moments will interfere with each other. If the magnetic moments of the magnetic particles interfere with each other in this way, there is a risk that the magnetic flux passing through the element body will not flow smoothly. [Means for solving the problem]

[0005] In order to solve the above problem, the present invention provides a stacked inductor component comprising an insulating base body containing a plurality of magnetic particles, an inductor wiring provided inside the base body, and an extraction electrode having a first end connected to the inductor wiring and a second end exposed on the outer surface of the base body, wherein when the base body is viewed in cross section within a rectangular observation area 10 times the average particle size of the magnetic particles × 10 times the average particle size, the magnetic particles include particles with a particle size at least twice the average particle size.

[0006] The present invention also provides a stacked inductor component comprising an insulating base body containing a plurality of magnetic particles, inductor wiring provided inside the base body, and an extraction electrode having a first end connected to the inductor wiring and a second end exposed on the outer surface of the base body, wherein when the base body is viewed in cross section within a rectangular observation area 10 times the average particle size of the magnetic particles × 10 times the average particle size, the magnetic particles contain particles with particle sizes within a distribution range that is at least twice the standard deviation of the particle sizes of the magnetic particles relative to the average particle size. [Effects of the Invention]

[0007] This allows the magnetic flux to pass through the element body more smoothly. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view of the multilayer inductor component according to the first embodiment. [Figure 2] FIG. 2 is a top view of the multilayer inductor component in accordance with the first embodiment. [Figure 3] FIG. 3 is a cross-sectional view taken along line 3-3 in FIG. [Figure 4] FIG. 4 is an observation image of magnetic particles. [Figure 5] FIG. 5 is an explanatory diagram of a method for manufacturing the multilayer inductor component in accordance with the first embodiment. [Figure 6] FIG. 6 is an explanatory diagram of a method for manufacturing the multilayer inductor component in accordance with the first embodiment. [Figure 7] FIG. 7 is a perspective view of the multilayer inductor component according to the second embodiment. [Figure 8] FIG. 8 is a top view of the multilayer inductor component in accordance with the second embodiment. [Figure 9] FIG. 9 is a cross-sectional view taken along line 9-9 in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0009] <One embodiment of a multilayer inductor component> An embodiment of a multilayer inductor component will be described below. Note that the drawings are schematic diagrams for ease of understanding, and components may be enlarged or omitted. Therefore, the dimensional ratios of the components may differ from those of the actual components.

[0010] (Overall structure) As shown in FIG. 1, the multilayer inductor component 10 includes an element body 11 and an inductor wiring 12.

[0011] Although not shown in the drawings, the element body 11 has a structure in which multiple plate-like layers are stacked. These layers are generally rectangular in plan view. Therefore, the element body 11 as a whole has a generally rectangular parallelepiped shape. Furthermore, the outer edge shape of each outer surface of the element body 11 is rectangular in plan view. Of these outer surfaces, a surface facing a specific direction is referred to as the mounting surface 11A. A surface parallel to the mounting surface 11A is referred to as the top surface 11B. Of the outer surfaces perpendicular to the mounting surface 11A, a specific surface is referred to as the first end surface 11C. A surface parallel to the first end surface 11C is referred to as the second end surface 11D. Furthermore, two outer surfaces perpendicular to both the mounting surface 11A and the first end surface 11C are referred to as side surfaces 11E.

[0012] In the following description, the axis perpendicular to the first end face 11C and the second end face 11D is referred to as the first axis X. The axis perpendicular to the two side faces 11E is referred to as the second axis Y. That is, the first axis X and the second axis Y are perpendicular to each other. The axis perpendicular to the mounting surface 11A, i.e., the axis perpendicular to both the first axis X and the second axis Y, is referred to as the third axis Z. The direction along the first axis X in which the first end face 11C faces is referred to as the first positive direction X1, and the direction opposite to the first positive direction X1 is referred to as the first negative direction X2. The direction along the second axis Y in which one side face 11E faces is referred to as the second negative direction Y2, and the direction opposite to the second negative direction Y2 is referred to as the second positive direction Y1. The direction along the third axis Z in which the top face 11B faces is referred to as the third positive direction Z1, and the direction opposite to the third positive direction Z1 is referred to as the third negative direction Z2.

[0013] The element body 11 is made of an insulating material. As shown in FIG. 4, the element body 11 includes a plurality of magnetic particles P. Specifically, the magnetic particles P are particles such as ferrite particles. The grain boundaries of the ferrite particles contain Bi2O3 (bismuth oxide) as a component. In addition to the magnetic particles P, the element body 11 also includes an insulator such as glass, a dielectric material, and alumina. Details of the magnetic particles P included in the element body 11 will be described later.

[0014] 1 and 2, the inductor wiring 12 is provided inside the element body 11. Specifically, the inductor wiring 12 extends in a spiral shape inside the element body 11 with a central axis CA that is parallel to the third axis Z. The inductor wiring 12 has five wiring portions 13 and four vias 14. The material of the inductor wiring 12 is, for example, silver.

[0015] 1, the five wiring portions 13 are a first wiring portion 13A, a second wiring portion 13B, a third wiring portion 13C, a fourth wiring portion 13D, and a fifth wiring portion 13E. The first wiring portion 13A and the fifth wiring portion 13E are generally L-shaped and extend parallel to the mounting surface 11A. The second wiring portion 13B to the fourth wiring portion 13D are generally U-shaped and extend parallel to the mounting surface 11A.

[0016] As shown in FIG. 2, in a plan view facing the third negative direction Z2, the first wiring portion 13A is located closest to the third positive direction Z1. In the plan view, the first wiring portion 13A has a generally L-shape that is bent so as to be convex toward the first negative direction X2 and the second positive direction Y1 with respect to the central axis CA. A first end of the first wiring portion 13A is located on the first positive direction X1 and second positive direction Y1 sides with respect to the central axis CA. A second end of the first wiring portion 13A is located on the first negative direction X2 and second negative direction Y2 sides with respect to the central axis CA.

[0017] The second wiring portion 13B is adjacent to the first wiring portion 13A with a gap in the third negative direction Z2. The second wiring portion 13B has a generally U-shape that is bent so as to convex toward the first positive direction X1. A first end of the second wiring portion 13B is located on the first negative direction X2 side and the second negative direction Y2 side with respect to the central axis CA. A second end of the second wiring portion 13B is located on the first negative direction X2 side and the second positive direction Y1 side with respect to the central axis CA.

[0018] 1, one of the four vias 14 is interposed between the second end of the first wiring portion 13A and the first end of the second wiring portion 13B in the direction along the third axis Z. In other words, the via 14 connects the first wiring portion 13A and the second wiring portion 13B.

[0019] The third wiring portion 13C is adjacent to the second wiring portion 13B with a gap in the third negative direction Z2. The third wiring portion 13C is generally U-shaped and bent so as to convex toward the second negative direction Y2. That is, the convex direction of the third wiring portion 13C is shifted by 270° about the central axis CA from the convex direction of the second wiring portion 13B. A first end of the third wiring portion 13C is located on the first negative direction X2 side and the second positive direction Y1 side with respect to the central axis CA. A second end of the third wiring portion 13C is located on the first positive direction X1 side and the second positive direction Y1 side with respect to the central axis CA.

[0020] One of the four vias 14 is interposed between the second end of the second wiring portion 13B and the first end of the third wiring portion 13C in the direction along the third axis Z. That is, the via 14 connects the second wiring portion 13B and the third wiring portion 13C.

[0021] The fourth wiring portion 13D is adjacent to the third wiring portion 13C with a gap in the third negative direction Z2. The fourth wiring portion 13D is generally U-shaped and bent so as to convex toward the first negative direction X2. That is, the convex direction of the fourth wiring portion 13D is shifted by 270° about the central axis CA from the convex direction of the third wiring portion 13C. A first end of the fourth wiring portion 13D is located on the first positive direction X1 side and the second positive direction Y1 side with respect to the central axis CA. A second end of the fourth wiring portion 13D is located on the first positive direction X1 side and the second negative direction Y2 side with respect to the central axis CA.

[0022] One of the four vias 14 is interposed between the second end of the third wiring portion 13C and the first end of the fourth wiring portion 13D in the direction along the third axis Z. That is, the via 14 connects the third wiring portion 13C and the fourth wiring portion 13D. Note that the via 14 is not shown in FIG. 1 because it is hidden by the wiring portion 13.

[0023] The fifth wiring portion 13E has a generally L-shape that is bent so as to convex in the first positive direction X1 and the second positive direction Y1 with respect to the central axis CA. A first end of the fifth wiring portion 13E is located on the first positive direction X1 side and the second negative direction Y2 side with respect to the central axis CA. A second end of the fifth wiring portion 13E is located on the first negative direction X2 side and the second positive direction Y1 side with respect to the central axis CA.

[0024] One of the four vias 14 is interposed between the second end of the fourth wiring portion 13D and the first end of the fifth wiring portion 13E in the direction along the third axis Z. That is, the via 14 connects the fourth wiring portion 13D and the fifth wiring portion 13E.

[0025] 1, the multilayer inductor component 10 includes a first lead electrode 21 and a second lead electrode 22. Each lead electrode has a substantially rectangular plate shape. The first extraction electrode 21 is located in the same layer as the first wiring portion 13A. A portion of one long side of the first extraction electrode 21 is connected to a first end of the first wiring portion 13A. The other long side of the first extraction electrode 21 is exposed at the first end surface 11C of the element body 11.

[0026] The second extraction electrode 22 is located in the same layer as the fifth wiring portion 13E. A portion of one long side of the second extraction electrode 22 is connected to the second end of the fifth wiring portion 13E. The other long side of the second extraction electrode 22 is exposed at the second end face 11D of the element body 11. Therefore, the first extraction electrode 21 and the second extraction electrode 22 are electrically connected via the inductor wiring 12. Note that although the boundaries between the wiring portion 13 and the via 14 and the boundaries between each extraction electrode and the wiring portion 13 are indicated by dashed lines in FIGS. 1 to 3, in reality, these boundaries may not be clear.

[0027] As shown in FIG. 1, the multilayer inductor component 10 includes a first external electrode 31 and a second external electrode 32. The first external electrode 31 covers part of the outer surface of the element body 11. In this embodiment, the first external electrode 31 is a so-called five-sided electrode. Specifically, the first external electrode 31 covers the first end face 11C of the element body 11 and parts of the four faces adjacent to the first end face 11C. Therefore, the first external electrode 31 is electrically connected to the first extraction electrode 21.

[0028] The second external electrode 32 covers part of the outer surface of the element body 11. The second external electrode 32 is a five-sided electrode, like the first external electrode 31. Specifically, the second external electrode 32 covers the second end face 11D of the element body 11 and parts of the four faces adjacent to the second end face 11D. Therefore, the second external electrode 32 is electrically connected to the second extraction electrode 22. Furthermore, the second external electrode 32 is separated from the first external electrode 31 in the direction along the first axis X. Therefore, the second external electrode 32 is not in direct contact with the first external electrode 31.

[0029] (Magnetic particles) As shown in FIG. 3 , the layer of the element body 11 on which the inductor wiring 12 is located in the direction along the central axis CA of the inductor wiring 12 is defined as the wiring layer 40. As described above, in this embodiment, the inductor wiring 12 is composed of wiring portions 13 and vias 14. Therefore, the range of the element body 11 from the same position as the end of the first wiring portion 13A on the third positive direction Z1 side to the same position as the end of the fifth wiring portion 13E on the third negative direction Z2 side corresponds to the wiring layer 40. The layer of the element body 11 on the third positive direction Z1 side, i.e., the top surface 11B side, of the wiring layer 40 is defined as the upper layer 51. The layer of the element body 11 on the third negative direction Z2 side, i.e., the mounting surface 11A side, of the wiring layer 40 is defined as the lower layer 52. Furthermore, the portion of the wiring layer 40 surrounded by the inductor wiring 12 when viewed in a see-through manner in the direction along the central axis CA is defined as the internal region 41. The area of ​​the wiring layer 40 excluding the inner area 41 when viewed in a direction along the central axis CA is referred to as an outer area 42 .

[0030] Here, a predetermined portion of the element body 11 is defined as the specific location. As shown in FIG. 4, when viewed in a rectangular observation area 10 times the average particle size of the magnetic particles P by 10 times the average particle size, the magnetic particles P include particles having a particle size at least twice the average particle size. Hereinafter, these particles will be referred to as "specific particles SP." As will be described later, Bi2O3 is present at the grain boundary between the specific particles SP and the magnetic particles P adjacent to the specific particles SP, i.e., near the surface of the specific particles SP.

[0031] In the first embodiment, the internal region 41, the external region 42, the upper layer 51, and the lower layer 52 are all specific locations. In other words, in the first embodiment, the entire element body 11 is a specific location. Therefore, for example, assume that an arbitrary location in the internal region 41 is viewed in cross section in a rectangular observation range that is 10 times the average particle diameter × 10 times the average particle diameter. In this case, the observation range includes the specific particle SP.

[0032] The "average particle size" refers to the average particle size of the magnetic particles P in a specific location. Specifically, a cross section of any location on the element body 11 is photographed, and the average value of any 100 magnetic particles P present in each cross section is calculated as the average particle size. The "particle size" is calculated as the diameter of a perfect circle having the same cross-sectional area as the particle in the cross-sectional view. Therefore, for example, if the average particle size is 0.8 μm, 10 times the average particle size in the observed range x 10 times the average particle size is 8 μm x 8 μm. Therefore, for example, when the above-mentioned observed range is viewed in cross section at any location in the internal region 41, specific particles SP with particle sizes of 1.6 μm or more are present.

[0033] Furthermore, when the element body 11 is viewed in cross section in the observation range, the magnetic particles P include particles having particle sizes in a distribution range that is at least twice the standard deviation of the particle sizes of the magnetic particles P relative to the average particle size of the magnetic particles P. For example, if the average particle size is 0.8 μm and the standard deviation is 0.3 μm, particles having particle sizes of 1.4 μm or more are present in the observation range at a specific location.

[0034] The multilayer inductor component 10 can be manufactured by a so-called printing lamination method. For example, as shown in FIG. 5, a lower layer 52 and a portion of the wiring layer 40 are laminated, and an inductor wiring 12 is printed on the surface of the wiring layer 40 facing the third positive direction Z1. At this time, as shown in FIG. 6, an insulator serving as the element body 11 is printed at the same position as the inductor wiring 12 in the direction along the third axis Z. At this time, magnetic particles P containing Bi2O3 as an additive are laminated in a portion corresponding to a specific location of the element body 11. Because Bi2O3 promotes sintering of the magnetic particles P, the particle size of some of the magnetic particles P present in the specific location increases. In other words, after sintering, the specific location of the element body 11 contains specific particles SP. In the multilayer inductor component 10 of the first embodiment, the entire element body 11 is the specific location.

[0035] (Effects of this embodiment) (1-1) In the above embodiment, when the element body 11 is viewed in cross section in a rectangular observation area 10 times the average particle size of the magnetic particles P by 10 times the average particle size, the magnetic particles P contain particles with a particle size at least twice the average particle size. Furthermore, the magnetic particles P contain particles with a particle size at least twice the standard deviation of the particle size of the magnetic particles P relative to the average particle size of the magnetic particles P. The presence of such large-sized magnetic particles P is likely to result in uniform magnetic moments at least in the area where the large-sized magnetic particles P are present. Therefore, interference between the magnetic moments of the small-sized magnetic particles P can be suppressed. As a result, magnetic flux passing through the element body 11 is more likely to flow smoothly in areas containing large-sized particles, thereby facilitating smooth magnetic flux flow throughout the element body 11 as a whole. Thus, the multilayer inductor component 10 of the above embodiment is expected to improve impedance characteristics.

[0036] In the above embodiment, most of the magnetic particles P have a relatively small particle size. Therefore, even if magnetic particles P with large particle sizes are scattered as described above, the advantages of the small size of the magnetic particles P can still be enjoyed.

[0037] (1-2) In the above embodiment, the internal region 41 is a specific location. Specific particles SP are present in this specific location. Because the internal region 41 is a region surrounded by the inductor wiring 12, the magnetic flux generated in this region is larger than in other regions. The properties of the internal region 41, such as the magnetic permeability, significantly affect the impedance characteristics of the multilayer inductor component 10. According to this configuration, the presence of specific particles SP in the internal region 41 can increase the magnetic permeability in this location. In other words, even more magnetic flux can be generated, thereby improving the impedance characteristics of the multilayer inductor component 10.

[0038] (1-3) In the above embodiment, the outer region 42 is a specific location. This allows the magnetic flux that passes through the central axis CA side of the inductor wiring 12 to pass through the outer region 42 without stagnation. In other words, magnetic flux saturation is less likely to occur in the outer region 42, which improves the impedance characteristics of the multilayer inductor component 10.

[0039] (1-4) In the above embodiment, the upper layer 51 and the lower layer 52 are specific locations. This allows magnetic flux that passes through the central axis CA side of the inductor wiring 12 to pass through the upper layer 51 and the lower layer 52 without stagnation. That is, by increasing the magnetic permeability of the upper layer 51 and the lower layer 52, the impedance characteristics of the multilayer inductor component 10 can be improved. Furthermore, the upper layer 51 and the lower layer 52 have a smaller area of ​​contact with the inductor wiring 12 than the wiring layer 40. Therefore, it is easy to include the specific particles SP in the inductor wiring 12 regardless of the shape, properties, etc., of the inductor wiring 12.

[0040] (1-5) In the above embodiment, Bi2O3 is present at the grain boundary between the specific particle SP and the adjacent magnetic particle P, i.e., on the surface of the specific particle SP. Bi2O3 has the effect of increasing the grain size of the magnetic particle P during the manufacturing process of the element body 11. Therefore, the presence of Bi2O3 at the grain boundary of the specific particle SP makes it easier for the specific particle SP to grow to more than twice the average grain size. In other words, Bi2O3 is suitable as a component for scattering specific particles SP with grain sizes more than twice the average grain size within the element body 11.

[0041] <Second embodiment of multilayer inductor component> Next, a second embodiment of the multilayer inductor component will be described. The multilayer inductor component 100 according to the second embodiment differs from the multilayer inductor component 10 according to the first embodiment in the winding direction of the inductor wiring 12. That is, the multilayer inductor component 10 according to the first embodiment has a so-called vertical winding structure, whereas the multilayer inductor component 100 according to the second embodiment has a horizontal winding structure. In the following, among the configuration of the multilayer inductor component 100 according to the second embodiment, the same components as those in the first embodiment are denoted by the same reference numerals and will not be described again.

[0042] 7, the inductor wiring 112 according to the second embodiment is provided inside the element body 11. Specifically, the inductor wiring 112 extends in a spiral shape with a central axis CA that is parallel to the second axis Y inside the element body 11. The inductor wiring 112 has seven wiring portions 113 and six vias 114.

[0043] 8, the seven wiring portions 113 are an eleventh wiring portion 113A to a seventeenth wiring portion 113G. The eleventh wiring portion 113A to the seventeenth wiring portion 113G each have a substantially L-shape and extend parallel to the first end face 11C and the second end face 11D.

[0044] The eleventh wiring portion 113A is located closest to the first positive direction X1. A first end of the eleventh wiring portion 113A is located on the second positive direction Y1 side and the third positive direction Z1 side with respect to the central axis CA. A second end of the eleventh wiring portion 113A is located on the second negative direction Y2 side and the third negative direction Z2 side with respect to the central axis CA. The eleventh wiring portion 113A has a substantially L-shape that is bent convexly toward the second negative direction Y2 side and the third positive direction Z1 side with respect to the central axis CA.

[0045] The twelfth wiring portion 113B is adjacent to the eleventh wiring portion 113A with a gap in the first negative direction X2. A first end of the twelfth wiring portion 113B is located on the second negative direction Y2 side and the third negative direction Z2 side with respect to the central axis CA. A second end of the twelfth wiring portion 113B is located on the second positive direction Y1 side and the third positive direction Z1 side with respect to the central axis CA. The twelfth wiring portion 113B has a substantially L-shape that is bent convexly toward the second positive direction Y1 side and the third negative direction Z2 side with respect to the central axis CA. In other words, the convex direction of the twelfth wiring portion 113B is opposite to the convex direction of the eleventh wiring portion 113A.

[0046] 9, one of the vias 114 is interposed between the second end of the eleventh wiring portion 113A and the first end of the twelfth wiring portion 113B. That is, the via 114 connects the eleventh wiring portion 113A and the twelfth wiring portion 113B.

[0047] The thirteenth to seventeenth wiring portions 113C to 113G are arranged in this order at intervals along the first axis X. The thirteenth to seventeenth wiring portions 113C to 113G are convex in the opposite direction to the adjacent wiring portions 113. Each via 114 connects a first end of a wiring portion 113 to a second end of the adjacent wiring portion 113 on the first negative direction X2 side of the wiring portion 113. In this way, the inductor wiring 12 as a whole has a spiral shape with a central axis CA that is parallel to the first axis X. The first end of the eleventh wiring portion 113A and the second end of the seventeenth wiring portion 113G are electrically connected via the thirteenth to sixteenth wiring portions 113C to 113F and the six vias 114.

[0048] The inductor wiring 112 includes a first extraction electrode 121 and a second extraction electrode 122. The first extraction electrode 121 and the second extraction electrode 122 are both cylindrical and extend along the first axis X. A first end of the first extraction electrode 121 is connected to a first end of the eleventh wiring portion 113A. A second end of the first extraction electrode 121 is exposed at the first end surface 11C. A first end of the second extraction electrode 122 is connected to a second end of the seventeenth wiring portion 113G. A second end of the second extraction electrode 122 is exposed at the second end surface 11D. Therefore, the first extraction electrode 121 and the second extraction electrode 122 are electrically connected to each other via the inductor wiring 112. Note that in FIGS. 7 to 9, the boundaries between the wiring portion 113 and the via 114 and the boundaries between each extraction electrode and the wiring portion 113 are indicated by dashed lines, but in reality, these boundaries may not be clear.

[0049] (Magnetic particles) As shown in FIG. 9 , the layer of the element body 11 on which the inductor wiring 112 is located in the direction along the central axis CA of the inductor wiring 112 is defined as the wiring layer 140. As described above, in this embodiment, the inductor wiring 112 is composed of wiring portions 113 and vias 114. Therefore, the range of the element body 11 from the same position as the end of the eleventh wiring portion 113A on the first positive direction X1 side to the same position as the end of the seventeenth wiring portion 113G on the first negative direction X2 side corresponds to the wiring layer 140. The layer of the element body 11 on the first positive direction X1 side of the wiring layer 140, i.e., on the first end face 11C side, is defined as the first end layer 151. The layer of the element body 11 on the first negative direction X2 side of the wiring layer 140, i.e., on the second end face 11D side, is defined as the second end layer 152. Furthermore, a portion of the wiring layer 140 that is surrounded by the inductor wiring 112 when viewed in a direction along the central axis CA is defined as an inner region 141. A region of the wiring layer 140 excluding the inner region 141 when viewed in a direction along the central axis CA is defined as an outer region 142.

[0050] Here, a predetermined portion of the element body 11 is defined as a specific location. When viewed in a rectangular observation area of ​​10 times the average particle size of the magnetic particles P by 10 times the average particle size at the specific location, the magnetic particles P include particles with a particle size of at least twice the average particle size. In other words, these particles are conceptually the same as the "specific particles SP" of the first embodiment. On the surface of the specific particles SP, for example, Bi2O3 is present in greater amounts than at the grain boundaries of other ferrite particles.

[0051] In the second embodiment, the internal region 141, the external region 142, the first end layer 151, and the second end layer 152 are all specific locations. In other words, in the second embodiment, the entire element body 11 is a specific location. Therefore, for example, assume that an arbitrary location in the internal region 141 is viewed in cross section in a rectangular observation range 10 times the average particle diameter × 10 times the average particle diameter. In this case, the observation range includes specific particles SP.

[0052] Also, in the second embodiment, when the base body 11 is viewed in a rectangular observation range that is 10 times the average particle size of the magnetic particles P x 10 times the average particle size, the magnetic particles P include particles with particle sizes in a distribution range that is more than twice the standard deviation of the particle sizes of the magnetic particles P relative to the average particle size of the magnetic particles P.

[0053] The manufacturing method of the multilayer inductor element 100 according to the second embodiment is the same as that of the first embodiment. That is, the element can be manufactured by a printing lamination method in which layers are laminated in the direction along the first axis X.

[0054] (Effects of the second embodiment) According to the second embodiment, the same effects as those (1-1) to (1-5) of the first embodiment can be obtained.

[0055] <Example of change> The first and second embodiments can be modified as follows: The above-described embodiments and the following modifications can be combined with each other within the scope of technical compatibility.

[0056] The specific location is not limited to the examples in the first and second embodiments. For example, in the first embodiment, the specific location may be one or more of the inner region 41, the outer region 42, the upper layer 51, and the lower layer 52. Also, for example, the specific location may be a portion of the inner region 41.

[0057] The material of the magnetic particles P is not limited to the examples given in the above embodiment. Any material may be used as long as it is a particle having so-called magnetism. The material of the specific particles SP is not limited to those containing Bi, as long as they are magnetic particles P. For example, the specific particles SP may be particles made of only ferrite.

[0058] The shape of the inductor wiring 12 does not have to be spiral, but may be straight or meandering, etc. Furthermore, the stacking direction of the multilayer inductor component 10 is not limited to the example of the above embodiment, and the components may be stacked in a direction parallel to or perpendicular to the mounting surface 11A.

[0059] The magnetic particles P preferably include specific particles SP with a diameter at least three times the average diameter when viewed in cross section over an observation range of 10 times the average diameter × 10 times the average diameter. Similarly, the magnetic particles P preferably include particles with a diameter greater than the average diameter and a deviation of at least three times the standard deviation when viewed in cross section over an observation range of 10 times the average diameter × 10 times the average diameter. As such, the larger the diameter of the specific particles SP, the smaller the region where magnetic moments interfere, which is preferable in terms of ensuring a smooth flow of magnetic flux within the element body 11.

[0060] The shape of the lead electrodes is not limited to the examples in each embodiment. For example, in the first embodiment, the shape of each lead electrode does not have to be a substantially rectangular plate, and may be, for example, a straight shape in which the inductor wiring 12 is extended.

[0061] The manufacturing method of the multilayer inductor component 10 is not limited to the example of the above embodiment. For example, the element body 11 may be formed by mixing magnetic particles P with a large particle size and magnetic particles P with a smaller particle size than the magnetic particles P. Also, for example, when the magnetic particles P are compressed to form the element body 11, a particularly high pressure may be applied to a portion of the element body 11. In this case, the magnetic particles P are more likely to grow as the pressure applied increases, and therefore the portion of the element body 11 to which the high pressure is applied becomes the specific location.

[0062] <Additional Notes> The technical concepts that can be understood from the above-described embodiments and modifications will be described below. [1] A laminated inductor component comprising an insulating element body containing a plurality of magnetic particles, an inductor wiring provided inside the element body, and an extraction electrode having a first end connected to the inductor wiring and a second end exposed on the outer surface of the element body, wherein when the element body is viewed in cross section within a rectangular observation area 10 times the average particle size of the magnetic particles by 10 times the average particle size, the magnetic particles contain particles having a particle size at least twice the average particle size.

[0063] [2] The multilayer inductor component according to [1], wherein the inductor wiring extends in a spiral shape inside the element body. [3] A stacked inductor component according to [2], wherein the layer of the element body in which the inductor wiring is located in a direction along the central axis of the spiral of the inductor wiring is defined as a wiring layer, and the portion of the wiring layer that is surrounded by the inductor wiring when viewed in a perspective direction along the central axis is defined as a specific location, and when the specific location is viewed in cross section within a rectangular observation range that is 10 times the average particle size of the magnetic particles by 10 times the average particle size, the magnetic particles include particles with a particle size that is at least twice the average particle size.

[0064] [4] A stacked inductor component according to [2] or [3], wherein the layer of the element body in which the inductor wiring is located in a direction along the central axis of the spiral of the inductor wiring is defined as a wiring layer, and the portion of the wiring layer excluding the area surrounded by the inductor wiring when viewed in a perspective direction along the central axis is defined as a specific location, and when the specific location is viewed in cross section within a rectangular observation range 10 times the average particle size of the magnetic particles by 10 times the average particle size, the magnetic particles include particles with a particle size at least twice the average particle size.

[0065] [5] A stacked inductor component according to any one of [2] to [4], wherein one of the directions along the central axis of the spiral of the inductor wiring in the element body is defined as a positive direction, the layer in which the inductor wiring is located in the direction along the central axis of the inductor wiring is defined as a wiring layer, and the layer located on the positive side of the wiring layer is defined as a specific location, when the specific location is viewed in cross section within a rectangular observation range 10 times the average particle size of the magnetic particles by 10 times the average particle size, the magnetic particles include particles having a particle size at least twice the average particle size.

[0066] [6] The multilayer inductor component according to any one of [1] to [5], wherein the grain boundaries between particles having a grain size at least twice the average grain size and particles adjacent to the particles contain Bi. [7] A laminated inductor component comprising an insulating base body containing a plurality of magnetic particles, an inductor wiring provided inside the base body, and an extraction electrode having a first end connected to the inductor wiring and a second end exposed on the outer surface of the base body, wherein when the base body is viewed in cross section within a rectangular observation area 10 times the average particle size of the magnetic particles × 10 times the average particle size, the magnetic particles contain particles with particle sizes within a distribution range that is at least twice the standard deviation of the particle sizes of the magnetic particles relative to the average particle size. [Explanation of symbols]

[0067] 10...Multilayer inductor components 11...Base body 12...Inductor wiring 13...Wiring section 14...Beer CA…Central axis line 21...First extraction electrode 22…Second extraction electrode 40...Wiring layer SP…specific particles P...Magnetic particles 41…Inner area 42...External area 51…upper layer 52...Lower layer

Claims

1. an insulating element including a plurality of magnetic particles; an inductor wiring provided inside the element body; a lead electrode having a first end connected to the inductor wiring and a second end exposed on the outer surface of the element body; Equipped with When the element body is viewed in cross section in a rectangular observation range 10 times the average particle size of the magnetic particles × 10 times the average particle size, the magnetic particles include particles having a particle size at least twice the average particle size. Multilayer inductor components.

2. The inductor wiring extends in a spiral shape inside the element body. The multilayer inductor component according to claim 1 .

3. When a layer of the element body in which the inductor wiring is located in a direction along the central axis of the spiral of the inductor wiring is defined as a wiring layer, and a portion of the wiring layer that is surrounded by the inductor wiring when viewed in a direction along the central axis is defined as a specific location, When the specific portion is viewed in cross section in a rectangular observation range that is 10 times the average particle size of the magnetic particles by 10 times the average particle size, the magnetic particles include particles having a particle size that is at least twice the average particle size. The multilayer inductor component according to claim 2 .

4. When a layer of the element body in which the inductor wiring is located in a direction along the central axis of the spiral of the inductor wiring is defined as a wiring layer, and a portion of the wiring layer excluding a region surrounded by the inductor wiring when viewed in a direction along the central axis is defined as a specific location, When the specific portion is viewed in cross section in a rectangular observation range that is 10 times the average particle size of the magnetic particles by 10 times the average particle size, the magnetic particles include particles having a particle size that is at least twice the average particle size. The multilayer inductor component according to claim 2 .

5. one of the directions along the central axis of the spiral of the inductor wiring in the element body is defined as a positive direction; When a layer in which the inductor wiring is located in a direction along the central axis of the inductor wiring is defined as a wiring layer, and a layer located on the positive side of the wiring layer is defined as a specific location, When the specific portion is viewed in cross section in a rectangular observation range that is 10 times the average particle size of the magnetic particles by 10 times the average particle size, the magnetic particles include particles having a particle size that is at least twice the average particle size. The multilayer inductor component according to claim 2 .

6. The grain boundary between a particle having a particle size twice or more of the average particle size and a particle adjacent to the particle contains Bi. The multilayer inductor component according to claim 1 .

7. an insulating element including a plurality of magnetic particles; an inductor wiring provided inside the element body; a lead electrode having a first end connected to the inductor wiring and a second end exposed on the outer surface of the element body; Equipped with When the element body is viewed in cross section in a rectangular observation range that is 10 times the average particle size of the magnetic particles by 10 times the average particle size, the magnetic particles include particles having particle sizes in a distribution range that is at least twice the standard deviation of the particle sizes of the magnetic particles relative to the average particle size. Multilayer inductor components.

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