Substrate processing apparatus, substrate processing method, substrate manufacturing method, program, and recording medium

Abstract

To provide a substrate processing apparatus for irradiating a substrate with light while moving the substrate by using a robot arm, capable of reducing variation in light irradiation amount to each part of the substrate without complicating the structure of a hand.SOLUTION: A robot arm that holds and conveys a substrate, a light source that irradiates an irradiated portion of the substrate with light, a first distance measurement unit, a second distance measurement unit, and a control unit, wherein the first distance measurement unit and the second distance measurement unit are disposed at positions different from each other with respect to the light source in a conveyance direction of the substrate, wherein the first distance measuring unit and the second distance measuring unit are configured to measure a distance to the substrate held by the robot arm, and the controller is configured to acquire a distance from the light source to the irradiation target based on a measurement value of the first distance measuring unit and a measurement value of the second distance measuring unit, and control a light amount of the light irradiated from the light source to the irradiation target based on the distance from the light source to the irradiation target.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a substrate processing apparatus that irradiates a substrate with light, and the like. [Background technology]

[0002] In the manufacturing process of various devices such as flat panel displays, a process of irradiating light onto a substrate is sometimes included. For example, when dry cleaning contaminants (e.g., organic substances) on the surface of a display substrate, a substrate cleaning process is known in which ultraviolet light (hereinafter referred to as UV light) is irradiated onto the surface of the substrate.

[0003] Patent Document 1 describes a substrate cleaning device equipped with a distance detection sensor that detects the distance between the irradiation surface of the light irradiation unit and the substrate surface at multiple points on the substrate, and an irradiation distance variable means that changes the distance between the irradiation surface of the light irradiation unit and the substrate surface at multiple points on the substrate. The irradiation distance variable means includes multiple lifting shafts that raise and lower a stage on which the substrate is placed and adjust the height of the stage at multiple points. Each lifting shaft is independently driven by a separate motor. To uniformly irradiate each portion of the substrate with UV light, the drive of each lifting shaft is controlled using the detection results of the distance detection sensor. The stage is connected to a guide rail and moves along the guide rail. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2002-43203 Summary of the Invention [Problem to be solved by the invention]

[0005] In the substrate cleaning apparatus described in Patent Document 1, it is necessary to provide elevating axes, whose heights can be adjusted independently, at multiple points on the stage as an irradiation distance varying means, which results in complicated stage mechanisms and controls, leading to problems such as an increase in the size and cost of the substrate cleaning apparatus.

[0006] In order to flexibly accommodate various substrate processing processes in a substrate processing system, there is known an apparatus that transports substrates using a robot arm, rather than transporting substrates using a stage connected to a guide rail as in Patent Document 1. For example, when a robot arm with a fixed base is extended and retracted horizontally to transport a substrate, the extension and retraction of the arm changes the gravitational moment acting on the connection between the arm and the base, causing the arm to bend differently. Changes in the arm's bending can cause the vertical position of a hand holding a substrate at the tip of the arm to change, or the hand to tilt relative to the horizontal. If such changes occur while UV light is being sequentially applied to various portions of a substrate as it is being transported, the distance between the UV light source and the substrate changes depending on the substrate's transport position, resulting in uneven UV light irradiation intensity (irradiation amount).

[0007] Thus, when a substrate is transported using a robot arm, the distance between the substrate and the UV light source is likely to fluctuate, which can lead to uneven irradiation intensity (amount of irradiation) of UV light. Meanwhile, the irradiation distance varying means described in Patent Document 1 has a complex structure and control, and therefore is difficult to implement on the hand at the tip of the robot arm, unlike the stage connected to a guide rail as in Patent Document 1.

[0008] Therefore, in substrate processing apparatuses that irradiate light onto substrates while moving them using a robot arm, there was a need for technology that could reduce the variation in the amount of light irradiated onto each part of the substrate without complicating the hand structure. [Means for solving the problem]

[0009] A first aspect of the present invention is a substrate processing apparatus comprising: a robot arm that holds and transports a substrate; a light source that irradiates light onto an irradiated portion of the substrate held by the robot arm; a first distance measurement unit; a second distance measurement unit; and a control unit, wherein the first distance measurement unit and the second distance measurement unit are arranged at different positions relative to the light source in the transport direction of the substrate, and each of the first distance measurement unit and the second distance measurement unit is configured to be able to measure the distance to the substrate held by the robot arm, and the control unit acquires the distance from the light source to the irradiated portion based on a measurement value measured by the first distance measurement unit and a measurement value measured by the second distance measurement unit, and controls the amount of light irradiated from the light source to the irradiated portion based on the distance from the light source to the irradiated portion.

[0010] In addition, a second aspect of the present invention is a substrate processing method using a substrate processing apparatus comprising: a robot arm that holds and transports a substrate; a light source that irradiates light onto an irradiated portion of the substrate held by the robot arm; a first distance measurement unit; a second distance measurement unit; and a control unit, wherein the first distance measurement unit and the second distance measurement unit are arranged at different positions relative to the light source in the transport direction of the substrate, and each of the first distance measurement unit and the second distance measurement unit is configured to be able to measure the distance to the substrate held by the robot arm, and the control unit acquires the distance from the light source to the irradiated portion based on a measurement value measured by the first distance measurement unit and a measurement value measured by the second distance measurement unit, and controls the amount of light irradiated from the light source to the irradiated portion based on the distance from the light source to the irradiated portion. [Effects of the Invention]

[0011] According to the present invention, in a substrate processing apparatus that irradiates a substrate with light while moving the substrate using a robot arm, a technology can be provided that can reduce the variation in the amount of light irradiated on each part of the substrate without complicating the structure of the hand. [Brief explanation of the drawings]

[0012] [Figure 1] FIG. 1 is a schematic side view for explaining a substrate processing apparatus according to a first embodiment. [Figure 2] (a) A schematic side view showing the arm length when it is L1. (b) A schematic top view showing the arm length when it is L1. [Figure 3] (a) A schematic side view showing the arm length at L2. (b) A schematic top view showing the arm length at L2. [Figure 4] (a) A schematic side view showing the arm length at L3. (b) A schematic top view showing the arm length at L3. [Figure 5] (a) A schematic side view showing the arm length at L4. (b) A schematic top view showing the arm length at L4. [Figure 6] 1 is a graph showing the relationship between arm length L and substrate tilt angle θ. [Figure 7] 5 is a flowchart for explaining the operation of the substrate processing apparatus according to the first embodiment. [Figure 8] 10 is an example of a graph showing the relationship between the distance between a UV light source and a substrate and the transport speed. [Figure 9] 10 is a flowchart illustrating the operation of the substrate processing apparatus according to the second embodiment. [Figure 10] FIG. 10 is a schematic side view for explaining a substrate processing apparatus according to a third embodiment. [Figure 11] FIG. 10 is a schematic plan view for explaining a substrate processing apparatus according to a fourth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0013] The present invention will be described in detail with reference to the accompanying drawings, in which: FIG. 1 is a schematic diagram of a substrate processing apparatus according to an embodiment of the present invention; FIG. 2 is a schematic diagram of a substrate processing apparatus according to an embodiment of the present invention; FIG. 3 is a schematic diagram of a substrate processing apparatus according to an embodiment of the present invention; FIG. 4 is a schematic diagram of a substrate processing apparatus according to an embodiment of the present invention;

[0014] In the drawings referred to in the following description of the embodiments, elements denoted by the same reference numerals have the same functions unless otherwise specified. When a plurality of identical elements are arranged in a drawing, the reference numerals and their descriptions may be omitted.

[0015] Furthermore, the drawings may be represented schematically for the convenience of illustration and explanation, and the shape, size, arrangement, etc. of the elements depicted in the drawings may not necessarily be strictly identical to the actual objects.

[0016] In the following description, for example, when "X plus direction" is written, it refers to the same direction as the X axis arrow in the coordinate system shown, and when "X minus direction" is written, it refers to the direction 180 degrees opposite to the direction of the X axis arrow in the coordinate system shown. Also, when simply written as "X direction," it refers to the direction parallel to the X axis, regardless of whether it is different from the direction of the X axis arrow in the drawings. The same applies to directions other than X.

[0017] [Embodiment 1] (Basic configuration) 1 is a schematic side view illustrating a substrate cleaning apparatus 7, which is a substrate processing apparatus according to embodiment 1. The substrate cleaning apparatus 7 includes a transfer robot for transferring a substrate 1, a UV light source 3 for irradiating the substrate 1 with UV light (ultraviolet light), a shutter 6 capable of opening and closing the optical path of the UV light, a control unit 8 for controlling the operation of each unit of the apparatus, distance measurement units 2 and 9.

[0018] The control unit 8 is a computer for controlling the operation of the substrate processing apparatus and includes a CPU, ROM, RAM, I / O ports, etc. The ROM stores an operation program for the substrate processing apparatus. The program for executing various processes related to the substrate processing method of this embodiment may be stored in the ROM like other operation programs, or may be loaded into the RAM from an external source via a network. Alternatively, the program may be loaded into the RAM via a computer-readable recording medium on which the program is recorded. The control unit 8 may also include a display device and an input device used as a user interface. The display device may be a display device such as a liquid crystal display or an organic EL display, and the input device may be an input device such as a keyboard, a jog dial, a mouse, a pointing device, or a voice input device.

[0019] The transfer robot includes a base 4, an arm 10 supported by the base 4 and extendable in the X direction, and a hand 5 attached to the tip of the arm 10 for holding the substrate 1.

[0020] The transfer robot extends arm 10 to a position not shown in the negative X direction to receive substrate 1 with hand 5, and then reduces the length of arm 10 to move substrate 1 in the positive X direction. For ease of explanation, the length from base 4 to the tip of hand 5 will be referred to as the arm length L of the robot arm. In this example, the transfer direction of substrate 1 during cleaning processing corresponds to the X direction.

[0021] FIG. 1 shows the state in which, after the transfer robot receives substrate 1 with hand 5, it retracts the arm until arm length L becomes L0, and substrate 1 is positioned directly below distance measurement unit 2 and distance measurement unit 9. The weight of substrate 1 being held and the weight of hand 5 and arm 10 act on arm 10, so the longer arm length L is made, that is, the more arm 10 is extended in the negative X direction, the greater the counterclockwise moment that acts on the arm fixed to base 4. As shown schematically in the figure, when a counterclockwise moment is applied, the tip of hand 5 hangs down in the vertical direction (negative Z direction), and substrate 1 tilts relative to the horizontal.

[0022] The distance measurement units 2 and 9 are disposed at different positions in the X direction, and are disposed at the same height in the Z direction (vertical direction) as the light emission surface of the UV light source 3. In other words, the distance measurement units 2 and 9 are disposed behind the UV light source 3 (on the negative side in the X direction) in the substrate transport direction. The method of the distance measurement units 2 and 9 is not particularly limited as long as they can measure the distance to the substrate 1 with a predetermined accuracy, but they can be configured using distance sensors such as a laser distance meter or an ultrasonic distance meter, for example.

[0023] In the state shown in FIG. 1, the tip of substrate 1 in the positive X direction reaches directly below distance measurement unit 9. Therefore, substrate 1 is located directly below both distance measurement unit 2 and distance measurement unit 9, and both distance measurement units can measure the distance to substrate 1. When arm length L = L0, substrate 1 is tilted with respect to the horizontal direction, so the measurement value B0 by distance measurement unit 2 and the measurement value C0 by distance measurement unit 9 are different values ​​(B0 > C0). Control unit 8 acquires the measurement results from distance measurement unit 2 and distance measurement unit 9, and can calculate the tilt angle θ0 of substrate 1 with respect to the horizontal direction when arm length L = L0 based on measurement values ​​B0 and C0.

[0024] (Substrate processing method) The operation of substrate cleaning apparatus 7 and the substrate cleaning method will be described with reference to the flowchart in Figure 7. When substrate cleaning starts, first, in step S10, control unit 8 instructs the transfer robot to extend the robot arm and have hand 5 hold substrate 1.

[0025] Next, in step S11, the control unit 8 instructs the transfer robot to gradually decrease the length L of the arm 10, and starts moving the substrate 1 along the positive X direction.

[0026] 1, once substrate 1 has been moved to a position where arm length L is L0, control unit 8 causes distance measurement unit 2 and distance measurement unit 9 to start measurement and acquire measured values. Upon acquiring the measured values ​​from distance measurement unit 2 and distance measurement unit 9, control unit 8 calculates substrate inclination angle θ at which substrate 1 is inclined with respect to the horizontal direction, and stores arm length L and substrate inclination angle θ in association with each other.

[0027] 6 is a graph showing the relationship between arm length L and substrate tilt angle θ, and control unit 8 calculates substrate tilt angle θ based on the measurements of distance measurement unit 2 and distance measurement unit 9 when arm length L is in the range of L0≧L≧L3. In FIG. 6, the calculated substrate tilt angle θ is shown as Rθ in the solid line graph.

[0028] In step S13, the control unit 8 sends an instruction to the shutter 6 to "open" before the arm length L reaches L1 as shown in Figure 2(a), that is, before the substrate 1 reaches directly below the UV light source 3. This makes it possible to irradiate the substrate 1 with UV light once the substrate 1 reaches directly below the UV light source.

[0029] In step S14, the control unit 8 calculates the substrate tilt angle θ based on the measurements of the distance measurement unit 2 and the distance measurement unit 9 when the arm length L is in the range of L1≧L≧L3, and stores the calculated value as Rθ (FIG. 6). For example, as shown in FIGS. 2(a) and 2(b), when the arm length L is L1, the leading edge of the substrate 1 in the substrate transport direction (positive X direction) reaches directly below the UV light source 3. Based on the measurement value B1 of the distance measurement unit 2 and the measurement value C1 of the distance measurement unit 9 at this position, the control unit 8 calculates the substrate tilt angle θ1 and stores the substrate tilt angle θ1 in association with the arm length L1. Because the X-coordinate positions of the distance measurement unit 2, the distance measurement unit 9, and the UV light source 3 are preset, the control unit 8 can calculate the distance A1 between the UV light source 3 and the irradiated portion of the substrate 1 based on the substrate tilt angle θ1.

[0030] In step S15, the control unit 8 controls the substrate transport speed, i.e., the speed at which the arm 10 is retracted in the positive X direction, based on the calculated distance A1 between the substrate 1 and the UV light source 3 so that the substrate is irradiated with a predetermined amount of UV light suitable for cleaning. To achieve an appropriate cleaning effect, it is necessary for the substrate to be uniformly irradiated with the predetermined amount of UV light suitable for cleaning regardless of its position. On the other hand, as the distance A between the irradiated portion of the substrate 1 and the UV light source 3 decreases, the power per unit area of ​​the UV light irradiated from the UV light source 3 increases, and conversely, as the distance A increases, the power per unit area of ​​the UV light irradiated to the irradiated portion of the substrate 1 decreases.

[0031] In this embodiment, when the distance between the substrate 1 and the UV light source 3 is smaller than a predetermined value, the transport speed of the substrate 1 is increased to shorten the time that the irradiated portion of the substrate 1 stays directly under the UV light source 3, i.e., the time that it is irradiated with UV light. Conversely, when the distance between the irradiated portion of the substrate 1 and the UV light source 3 is larger than a predetermined value, the transport speed of the substrate 1 is decreased to lengthen the time that the substrate 1 stays directly under the UV light source 3, i.e., the time that it is irradiated with UV light.

[0032] FIG. 8 is an example of a graph showing the conditions necessary to irradiate the irradiated portion of the substrate 1 with UV light of a predetermined light amount at a position directly below the UV light source 3. Specifically, it shows the relationship between the distance between the UV light source 3 and the irradiated portion of the substrate 1 and the conveyance speed. In this example, it can be seen that in order to irradiate the irradiated portion of the substrate with UV light of a predetermined light amount, the substrate conveyance speed may be linearly decreased as the distance between the substrate 1 and the UV light source 3 increases. The control unit 8 stores in advance a mathematical formula or a data table showing such a relationship, and based on the distance between the irradiated portion of the substrate 1 and the UV light source 3 calculated in step S14, determines the substrate conveyance speed for irradiating a predetermined light amount. Then, a conveyance command based on the determined substrate conveyance speed is sent to the conveyance robot, and the substrate 1 is conveyed by the robot arm at the determined substrate conveyance speed.

[0033] Incidentally, the graph of FIG. 8 can also be approximated by, for example, the following mathematical formula. V = -α×C + β However, V is the conveyance speed of the substrate, -α is a coefficient representing the slope of the graph, C is the distance between the UV light source 3 and the irradiated portion of the substrate 1, and β is a positive constant.

[0034] In the flowchart of FIG. 7, for the sake of illustration, steps S14 and S15 are shown in series, but these two steps are continuously executed in parallel in the range where the arm length L satisfies L1≧L≧L3.

[0035] FIGS. 3(a) and 3(b) show a state in which the substrate 1 is conveyed in the X plus direction by about 1 / 4 of the substrate length from the states of FIGS. 2(a) and 2(b). When the arm length L is L2, based on the measured value B2 of the distance measurement unit 2 and the measured value C2 of the distance measurement unit 9, the control unit 8 calculates the substrate tilt angle θ2 (L2 < L1 and θ2 < θ1). The control unit 8 calculates the distance A2 between the irradiated portion of the substrate 1 and the UV light source 3 based on the substrate tilt angle θ2, and determines the substrate conveyance speed for irradiating a predetermined light amount based on FIG. 8. Then, a conveyance command based on the determined substrate conveyance speed is sent to the conveyance robot, and the substrate 1 is conveyed by the robot arm at the determined substrate conveyance speed. At that time, the control unit 8 stores the substrate tilt angle θ2 in association with the arm length L2.

[0036] Furthermore, as shown in FIGS. 4(a) and 4(b), at the position where the rear end of the substrate 1 reaches directly below the distance measurement unit 2 (arm length L = L3), based on the measurement value B3 of the distance measurement unit 2 and the measurement value C3 of the distance measurement unit 9, the control unit 8 calculates the substrate tilt angle θ3. Note that L3 < L2 and θ3 < θ2. Based on the substrate tilt angle θ3, the control unit 8 calculates the distance A3 between the irradiated portion of the substrate 1 and the UV light source 3, and determines the substrate conveyance speed for irradiating a predetermined light amount based on FIG. 8. Then, a conveyance command based on the determined substrate conveyance speed is sent to the conveyance robot, and the substrate 1 is conveyed by the robot arm at the determined substrate conveyance speed. At that time, the control unit 8 stores the substrate tilt angle θ3 in association with the arm length L3.

[0037] When the arm length L becomes smaller than L3, the process of the control unit 8 shifts to step S16. When the arm length L is smaller than L3, the substrate 1 does not exist directly below the distance measurement unit 2, so the substrate tilt angle θ cannot be calculated based on the measurement value B of the distance measurement unit 2 and the measurement value C of the distance measurement unit 9. Therefore, the control unit 8 obtains the substrate tilt angle Eθ (dotted line graph in FIG. 6) in the range of L < L3 by estimation based on the stored substrate tilt angle Rθ (solid line graph in FIG. 6). For example, a function of the substrate tilt angle Rθ is obtained by the method of polynomial approximation, and the substrate tilt angle Eθ is extrapolated for the range of L < L3 by fitting it. Based on the obtained substrate tilt angle Eθ, the control unit 8 calculates the relationship between the distance A between the irradiated portion of the substrate 1 and the UV light source 3 with respect to the arm length L for each position in the range of L < L3.

[0038] Then, the operation of the control unit 8 shifts to step S17, and based on the calculated distance A and FIG. 8, the substrate conveyance speed at each position for irradiating a predetermined light amount is determined. That is, the substrate conveyance speed is determined in correspondence with the arm length. Then, a conveyance command based on the determined substrate conveyance speed is sent to the conveyance robot, and the substrate 1 is conveyed by the robot arm at the determined substrate conveyance speed.

[0039] For example, as shown in Figures 5(a) and 5(b), when the rear end of the substrate 1 is located directly below the UV light source 3, the control unit 8 calculates the distance A4 between the UV light source 3 and the irradiated portion of the substrate 1 based on the substrate tilt angle Eθ when the arm length L is L4. Then, based on the distance A4 and Figure 8, it determines the substrate transport speed for irradiating a predetermined amount of light. Then, based on the determined substrate transport speed, it sends a command to the transport robot to operate the robot arm and transport the substrate.

[0040] When the substrate length L becomes smaller than L4, the substrate 1 is no longer directly below the UV light source 3, so the operation of the control unit 8 proceeds to step S18 and sends an instruction to "close" the shutter 6. This completes the series of operations for cleaning the substrate.

[0041] According to this embodiment, when the robot arm is extended and retracted to move the substrate and irradiate the substrate with light, even if the deflection of the robot arm in the gravity direction changes and the distance between the irradiated portion of the substrate and the light source changes, the substrate transport speed can be adjusted in accordance with the distance from the light source. That is, the speed at which the robot arm is extended and retracted can be controlled in accordance with the length of the robot arm. Therefore, it is possible to reduce the variation in the amount of light irradiated on each portion of the substrate without complicating the substrate holding mechanism.

[0042] [Embodiment 2] A substrate processing apparatus and a substrate processing method according to embodiment 2 will be described. Descriptions of matters common to embodiment 1 will be simplified or omitted. In embodiment 1, when the distance between the irradiated portion of the substrate and the light source changes in response to changes in the bending of the robot arm when it is extended or retracted, the robot arm is controlled to adjust the substrate transport speed, thereby making the amount of UV light irradiated onto the substrate uniform. In contrast, embodiment 2 is similar to embodiment 1 in that a distance measurement unit is used to determine the distance between the irradiated portion of the substrate and the UV light source, but instead of adjusting the substrate transport speed in response to the distance, the emission intensity of the UV light source is adjusted in response to the distance between the irradiated portion of the substrate and the UV light source.

[0043] The basic configuration of the substrate processing apparatus is the same as that of embodiment 1 described with reference to Figure 1 etc., but in embodiment 2, the UV light source 3 is configured so that the emission intensity can be adjusted by control of the control unit 8.

[0044] 9 shows a flowchart of the operation of the substrate cleaning apparatus 7 and the substrate cleaning method according to this embodiment. The same steps as those in the first embodiment described with reference to FIG. 7 are denoted by the same reference numerals. Steps S15A and S17A in this embodiment are controlled in a different manner from steps S15 and S17 in the first embodiment.

[0045] In this embodiment, the control unit 8 pre-stores data indicating the relationship between the distance between the UV light source 3 and the substrate 1 and the emission intensity as a condition necessary for irradiating a predetermined amount of UV light onto a position directly below the UV light source 3 (the irradiated portion of the substrate 1) when the transport speed is constant. In steps S15A and S17A, the control unit 8 changes the emission intensity of the UV light source 3 based on the calculated distance between the irradiated portion and the UV light source 3 and the pre-stored data. For example, when the distance between the UV light source 3 and the irradiated portion of the substrate 1 is relatively large, as shown in FIG. 2(a), the control unit 8 relatively increases the emission intensity of the UV light source 3. On the other hand, when the distance between the UV light source 3 and the irradiated portion of the substrate 1 is relatively small, as shown in FIG. 5(a), the control unit 8 relatively decreases the emission intensity of the UV light source 3.

[0046] According to this embodiment, when light is irradiated onto a substrate while the robot arm is extended and retracted to move the substrate, even if the bending of the robot arm in the direction of gravity changes and the distance between the irradiated portion of the substrate and the light source changes, the light emission intensity of the light source can be adjusted according to the distance to the light source. That is, the irradiation intensity (power) of the light irradiating the substrate per unit time can be controlled according to the length of the arm. Therefore, it is possible to reduce the variation in the amount of light irradiated onto each portion of the substrate without complicating the substrate holding mechanism.

[0047] [Embodiment 3] A substrate processing apparatus and a substrate processing method according to embodiment 3 will be described. Descriptions of matters common to embodiment 1 will be simplified or omitted. In embodiment 1, as shown in Fig. 1, both the distance measurement unit 2 and the distance measurement unit 9 are arranged on one side of the UV light source 3 in the substrate transport direction, i.e., on the negative X-direction side of the UV light source 3. In contrast, in embodiment 3, the distance measurement units are arranged to sandwich the UV light source 3 from the front and back in the substrate transport direction.

[0048] 10, the distance measurement unit 2 is disposed at a position a predetermined distance away from the UV light source 3 in the negative X direction, and the distance measurement unit 9 is disposed at a position a predetermined distance away from the UV light source 3 in the positive X direction. The distance measurement unit 2 and the distance measurement unit 9 may be disposed symmetrically across the UV light source 3 in the substrate transport direction.

[0049] In this embodiment, the control unit 8 uses the distance measurement units 2 and 9 arranged as described above to acquire the distance A between the irradiated portion of the substrate 1 and the UV light source 3 on the outward path in which the substrate 1 is moved in the positive X direction. Next, on the return path in which the substrate 1 is moved in the negative X direction, the control unit 8 controls the transport speed of the substrate 1 in accordance with the distance A measured on the outward path while irradiating the irradiated portion of the substrate 1 with UV light from the UV light source 3.

[0050] On the way there, while moving the substrate 1 in the positive X direction, the distance measurement units 2 and 9 acquire measurement values ​​B and C. Based on measurement values ​​B and C, the substrate tilt angle θ of the substrate 1 relative to the horizontal direction is calculated. The substrate tilt angle θ is then stored in association with the arm length L. If the rear end of the substrate 1 advances beyond the position directly below the distance measurement unit 2 in the positive X direction, even if a portion of the substrate 1 is located directly below the UV light source 3, a measurement value from the distance measurement unit 2 cannot be obtained, making it impossible to directly measure the substrate tilt angle θ. In this case, as described with reference to FIG. 6 in the first embodiment, a function of the substrate tilt angle Rθ within the range measurable by the two distance measurement units can be calculated, and the function can be used to extrapolate the substrate tilt angle Eθ within the range not measurable by the two distance measurement units. The control unit 8 calculates the distance A between the position directly below the UV light source 3 (the irradiated portion of the substrate 1) and the UV light source 3 based on the substrate tilt angle Rθ and the substrate tilt angle Eθ, and stores the calculated distance A in association with the arm length L.

[0051] Next, on the return path, while moving the substrate 1 in the minus X direction, the UV light source 3 irradiates the irradiated portion of the substrate 1 with UV light. At this time, the control unit 8 changes the transport speed of the robot arm based on the distance A stored in association with the arm length L and the pre-stored data shown in FIG.

[0052] According to this embodiment, when the robot arm is extended and retracted to move the substrate and irradiate the substrate with light, even if the deflection of the robot arm in the gravity direction changes and the distance between the irradiated portion of the substrate and the light source changes, the substrate transport speed can be adjusted in accordance with the distance from the light source. That is, the speed at which the robot arm is extended and retracted can be controlled in accordance with the length of the robot arm. Therefore, it is possible to reduce the variation in the amount of light irradiated on each portion of the substrate without complicating the substrate holding mechanism.

[0053] [Embodiment 4] A substrate processing apparatus and a substrate processing method according to embodiment 4 will be described. Explanations of matters common to embodiment 3 will be simplified or omitted. Embodiment 4 is common to embodiment 3 in that distance measurement units are arranged to sandwich the UV light source 3 from the front and rear in the substrate transport direction.

[0054] In the fourth embodiment, as shown in the plan view of FIG. 11 , each of the distance measurement units 2 and 9 includes a plurality of distance sensors arranged along a direction intersecting the transport direction of the substrate 1. In the illustrated example, each of the distance measurement units 2 and 9 includes four distance sensors arranged along the Y direction perpendicular to the transport direction, but this is merely an example, and the number of distance sensors included in each distance measurement unit is not limited to four. The control unit 8 can acquire the measurement value of the distance measurement unit 2 using the measurement results of the plurality of sensors included in the distance measurement unit 2. That is, the average value of the measurement results of the four distance sensors can be acquired as measurement value B ( FIG. 10 ). Similarly, the control unit 8 can calculate the average value of the measurement results of the four distance sensors included in the distance measurement unit 9 and acquire this as measurement value C ( FIG. 10 ). In this way, by acquiring the measurement values ​​using a plurality of distance sensors arranged along a direction intersecting the transport direction, it is possible to prevent the measured distance values ​​from being significantly affected even if the substrate 1 is locally undulating. It should be noted that only one of the distance measurement unit 2 and the distance measurement unit 9 may be configured to include a plurality of distance sensors arranged along a direction intersecting the conveying direction.

[0055] According to this embodiment, when the robot arm is extended and retracted to move the substrate and irradiate the substrate with light, even if the deflection of the robot arm in the gravity direction changes and the distance between the irradiated portion of the substrate and the light source changes, the substrate transport speed can be adjusted in accordance with the distance from the light source. That is, the speed at which the robot arm is extended and retracted can be changed in accordance with the length of the robot arm. Therefore, it is possible to reduce the variation in the amount of light irradiated on each portion of the substrate without complicating the substrate holding mechanism.

[0056] [Other embodiments] The present invention is not limited to the above-described embodiments, and many modifications are possible within the technical spirit of the present invention. For example, the above-described different embodiments may be combined in whole or in part.

[0057] For example, in the first to third embodiments, a plurality of distance sensors may be arranged in a direction intersecting the substrate transport direction as in the fourth embodiment.

[0058] In the second embodiment, the light emission intensity of the light source is adjusted according to the distance between the light source and the irradiated portion of the substrate. However, for example, the light emission intensity of the UV lamp may be constant, and the opening area of ​​the shutter 6 may be adjusted according to the distance between the light source and the irradiated portion of the substrate. Alternatively, the light transmittance of the window member may be adjusted according to the distance between the light source and the irradiated portion of the substrate. In this way, the irradiation intensity (power) of the light irradiating the irradiated portion of the substrate per unit time can be adjusted by various methods.

[0059] In the third and fourth embodiments, the transport speed of the substrate is adjusted according to the distance between the light source and the irradiated portion of the substrate, but the irradiation intensity of the light irradiating the substrate per unit time may also be adjusted as described above.

[0060] In addition, in each embodiment, the conveying speed of the substrate and the irradiation intensity of the light irradiating the irradiated portion of the substrate per unit time may be adjusted depending on the distance between the light source and the irradiated portion of the substrate.

[0061] Although an example has been shown in which two distance measurement units are arranged at different positions in the substrate transport direction, the number of distance measurement units is not limited to two, and distance measurement units may be arranged at three or more different positions in the substrate transport direction. By arranging distance measurement units at three or more positions, the measurement accuracy of the tilt angle θ of the substrate can be improved, and further, warpage or waviness of the substrate in the transport direction can also be measured and fed back to adjust the transport speed or light irradiation intensity.

[0062] The robot for transporting the substrate may be configured to be capable of performing movements such as extension, contraction, bending, vertical movement, horizontal movement, or rotation, or a combination of these movements. The robot may be of various types, such as a vertical multi-joint type, a parallel link type, or a linear joint type.

[0063] The present invention also includes a control program for causing a computer of a control unit to execute the control method relating to the substrate cleaning method described above, and a computer-readable recording medium on which the control program is recorded.

[0064] In the embodiments, a preferred process is a substrate cleaning process using UV light irradiation. However, the present invention can be applied to any substrate processing, not just a cleaning process using UV light, as long as the distance between the processing device and the processed portion of the substrate can vary depending on the operation of the robot transporting the substrate. For example, the present invention may be applied to a UV light exposure process for purposes other than cleaning, or a process in which the substrate is irradiated with light of a wavelength other than UV (e.g., a heating process or drying process in which infrared light is irradiated).

[0065] In a manufacturing process of a component constituting an article, irradiating a substrate with light using the substrate processing apparatus according to the embodiment is also included in the embodiments of the present invention as a method for manufacturing an article or a substrate. For example, irradiating a glass substrate for a display with light using the substrate processing apparatus according to the embodiment is also included in the embodiments of the present invention as a method for manufacturing a display or a substrate for a display.

[0066] The present invention can also be realized by supplying a program that realizes one or more functions of the embodiments to a system or device via a network or a storage medium, and having one or more processors in the computer of the system or device read and execute the program.The present invention can also be realized by a circuit (e.g., ASIC) that realizes one or more functions.

[0067] This specification discloses at least the following: [Item 1] a robot arm that holds and transports the substrate; a light source that irradiates light onto an irradiation portion of the substrate held by the robot arm; a first distance measurement unit; a second distance measurement unit; a control unit, the first distance measurement unit and the second distance measurement unit are disposed at different positions relative to the light source in a transport direction of the substrate, each of the first distance measurement unit and the second distance measurement unit is configured to be able to measure a distance to the substrate held by the robot arm; The control unit acquiring a distance from the light source to the irradiated portion based on a measurement value measured by the first distance measurement unit and a measurement value measured by the second distance measurement unit; controlling the amount of light irradiated from the light source to the irradiated portion based on the distance from the light source to the irradiated portion; A substrate processing apparatus comprising: [Matter 2] The control unit acquiring a first measurement value measured by the first distance measurement unit and a second measurement value measured by the second distance measurement unit when the substrate is at a first position; acquiring a first distance from the light source to the irradiated portion when the substrate is at the first position based on the first measurement value and the second measurement value; acquiring a third measurement value measured by the first distance measurement unit and a fourth measurement value measured by the second distance measurement unit when the substrate is at a second position; acquiring a second distance from the light source to the irradiated portion when the substrate is at the second position based on the third measurement value and the fourth measurement value; controlling the amount of light irradiated from the light source to the irradiated portion at each position based on the first distance and the second distance; 2. The substrate processing apparatus according to item 1. [Matter 3] the control unit acquires a third distance from the light source to the irradiated portion when the board is in a third position based on the first distance and the second distance; controlling the amount of light irradiated from the light source at the third position to the irradiated portion based on the third distance; 3. The substrate processing apparatus according to item 2. [Matter 4] the control unit controls the amount of light irradiated from the light source to the irradiation target portion by controlling the transport speed of the substrate by the robot arm. 4. The substrate processing apparatus according to any one of items 1 to 3, [Matter 5] The control unit controls the light source to control the amount of light irradiated from the light source to the irradiated unit. 4. The substrate processing apparatus according to any one of items 1 to 3, [Matter 6] the control unit controls the light source and the transport speed of the substrate by the robot arm, thereby controlling the amount of light irradiated from the light source to the irradiation portion. 4. The substrate processing apparatus according to any one of items 1 to 3, [Matter 7] In the transport direction of the substrate, the first distance measurement unit and the second distance measurement unit are disposed on one side with respect to the light source. 7. The substrate processing apparatus according to any one of items 1 to 6, [Matter 8] In a transport direction of the substrate, the first distance measurement unit is disposed on one side relative to the light source, and the second distance measurement unit is disposed on the other side relative to the light source. 7. The substrate processing apparatus according to any one of items 1 to 6, [Matter 9] At least one of the first distance measurement unit and the second distance measurement unit includes a plurality of distance sensors arranged along a direction intersecting a transport direction of the substrate. 9. The substrate processing apparatus according to any one of items 1 to 8, [Matter 10] The control unit obtaining a tilt angle of the substrate with respect to a horizontal direction using the measurement value measured by the first distance measurement unit and the measurement value measured by the second distance measurement unit; obtaining a distance from the light source to the irradiated portion based on the tilt angle; 10. The substrate processing apparatus according to any one of items 1 to 9, [Matter 11] The light source is a UV light source. 11. The substrate processing apparatus according to any one of items 1 to 10, [Matter 12] In a substrate manufacturing process, the substrate is irradiated with light using the substrate processing apparatus described in any one of items 1 to 11. A method for manufacturing a substrate comprising: [Matter 13] a robot arm that holds and transports the substrate; a light source that irradiates light onto an irradiation portion of the substrate held by the robot arm; a first distance measurement unit; a second distance measurement unit; A substrate processing method using a substrate processing apparatus including a control unit, the first distance measurement unit and the second distance measurement unit are disposed at different positions relative to the light source in a transport direction of the substrate, each of the first distance measurement unit and the second distance measurement unit is configured to be able to measure a distance to the substrate held by the robot arm; The control unit acquiring a distance from the light source to the irradiated portion based on a measurement value measured by the first distance measurement unit and a measurement value measured by the second distance measurement unit; controlling the amount of light irradiated from the light source to the irradiated portion based on the distance from the light source to the irradiated portion; A substrate processing method comprising: [Matter 14] The control unit acquiring a first measurement value measured by the first distance measurement unit and a second measurement value measured by the second distance measurement unit when the substrate is at a first position; acquiring a first distance from the light source to the irradiated portion when the substrate is at the first position based on the first measurement value and the second measurement value; acquiring a third measurement value measured by the first distance measurement unit and a fourth measurement value measured by the second distance measurement unit when the substrate is at a second position; acquiring a second distance from the light source to the irradiated portion when the substrate is at the second position based on the third measurement value and the fourth measurement value; controlling the amount of light irradiated from the light source to the irradiated portion at each position based on the first distance and the second distance; Item 14. The substrate processing method according to item 13. [Matter 15] the control unit acquires a third distance from the light source to the irradiated portion when the substrate is in a third position based on the first distance and the second distance; controlling the amount of light irradiated from the light source at the third position to the irradiated portion based on the third distance; 15. The substrate processing method according to item 14. [Matter 16] the control unit controls the amount of light irradiated from the light source to the irradiation target portion by controlling the transport speed of the substrate by the robot arm. 16. The substrate processing method according to any one of items 13 to 15. [Matter 17] The control unit controls the light source to control the amount of light irradiated from the light source to the irradiated unit. 16. The substrate processing method according to any one of items 13 to 15. [Matter 18] the control unit controls the light source and the transport speed of the substrate by the robot arm, thereby controlling the amount of light irradiated from the light source to the irradiation portion. 16. The substrate processing method according to any one of items 13 to 15. [Matter 19] In the transport direction of the substrate, the first distance measurement unit and the second distance measurement unit are disposed on one side with respect to the light source. 19. A substrate processing method according to any one of items 13 to 18. [Matter 20] In a transport direction of the substrate, the first distance measurement unit is disposed on one side relative to the light source, and the second distance measurement unit is disposed on the other side relative to the light source. 19. A substrate processing method according to any one of items 13 to 18. [Matter 21] At least one of the first distance measurement unit and the second distance measurement unit includes a plurality of distance sensors arranged along a direction intersecting a transport direction of the substrate. 21. A substrate processing method according to any one of items 13 to 20. [Matter 22] The control unit obtaining a tilt angle of the substrate with respect to a horizontal direction using the measurement value measured by the first distance measurement unit and the measurement value measured by the second distance measurement unit; obtaining a distance from the light source to the irradiated portion based on the tilt angle; 22. The substrate processing method according to any one of items 13 to 21. [Matter 23] The light source is a UV light source. 23. A substrate processing method according to any one of items 13 to 22. [Matter 24] 24. A program for causing the control unit to execute the substrate processing method according to any one of items 13 to 23. [Matter 25] A computer-readable recording medium having the program described in item 24 recorded thereon. [Explanation of symbols]

[0068] 1···Substrate / 2···Distance measurement unit / 3···UV light source / 4···Base / 5···Hand / 6···Shutter / 7···Substrate cleaning device / 8···Control unit / 9···Distance measurement unit / 10···Arm

Claims

1. a robot arm that holds and transports the substrate; a light source that irradiates light onto an irradiation portion of the substrate held by the robot arm; a first distance measurement unit; a second distance measurement unit; a control unit, the first distance measurement unit and the second distance measurement unit are disposed at different positions relative to the light source in a transport direction of the substrate, each of the first distance measurement unit and the second distance measurement unit is configured to be able to measure a distance to the substrate held by the robot arm; The control unit acquiring a distance from the light source to the irradiated portion based on the measurement value measured by the first distance measurement unit and the measurement value measured by the second distance measurement unit; controlling the amount of light irradiated from the light source to the irradiated portion based on the distance from the light source to the irradiated portion; A substrate processing apparatus comprising:

2. The control unit acquiring a first measurement value measured by the first distance measurement unit and a second measurement value measured by the second distance measurement unit when the substrate is at a first position; acquiring a first distance from the light source to the irradiated portion when the substrate is at the first position based on the first measurement value and the second measurement value; acquiring a third measurement value measured by the first distance measurement unit and a fourth measurement value measured by the second distance measurement unit when the substrate is in a second position; acquiring a second distance from the light source to the irradiated portion when the substrate is at the second position based on the third measurement value and the fourth measurement value; controlling the amount of light irradiated from the light source to the irradiated portion at each position based on the first distance and the second distance; The substrate processing apparatus according to claim 1 .

3. the control unit acquires a third distance from the light source to the irradiated portion when the board is in a third position based on the first distance and the second distance; and controlling the amount of light irradiated from the light source to the irradiated portion at the third position based on the third distance. The substrate processing apparatus according to claim 2 .

4. the control unit controls the amount of light irradiated from the light source to the irradiation target portion by controlling the transport speed of the substrate by the robot arm.

4. The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus is a processing chamber.

5. The control unit controls the light source to control the amount of light irradiated from the light source to the irradiated unit.

4. The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus is a processing chamber.

6. the control unit controls the light source and the transport speed of the substrate by the robot arm, thereby controlling the amount of light irradiated from the light source to the irradiation portion.

4. The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus is a processing chamber.

7. In a transport direction of the substrate, the first distance measurement unit and the second distance measurement unit are disposed on one side with respect to the light source.

4. The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus is a processing chamber.

8. the first distance measurement unit is disposed on one side relative to the light source in a transport direction of the substrate, and the second distance measurement unit is disposed on the other side relative to the light source.

4. The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus is a processing chamber.

9. At least one of the first distance measurement unit and the second distance measurement unit includes a plurality of distance sensors arranged along a direction intersecting a transport direction of the substrate.

4. The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus is a processing chamber.

10. The control unit obtaining a tilt angle of the substrate with respect to a horizontal direction using the measurement value measured by the first distance measurement unit and the measurement value measured by the second distance measurement unit; obtaining a distance from the light source to the irradiated portion based on the tilt angle; 4. The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus is a processing chamber.

11. The light source is a UV light source.

4. The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus is a processing chamber.

12. In a substrate manufacturing process, the substrate is irradiated with light using the substrate processing apparatus according to any one of claims 1 to 3. A method for manufacturing a substrate comprising:

13. a robot arm that holds and transports the substrate; a light source that irradiates light onto an irradiation portion of the substrate held by the robot arm; a first distance measurement unit; a second distance measurement unit; A substrate processing method using a substrate processing apparatus including a control unit, the first distance measurement unit and the second distance measurement unit are disposed at different positions relative to the light source in a transport direction of the substrate, each of the first distance measurement unit and the second distance measurement unit is configured to be able to measure a distance to the substrate held by the robot arm; The control unit acquiring a distance from the light source to the irradiated portion based on the measurement value measured by the first distance measurement unit and the measurement value measured by the second distance measurement unit; controlling the amount of light irradiated from the light source to the irradiated portion based on the distance from the light source to the irradiated portion; A substrate processing method comprising:

14. The control unit acquiring a first measurement value measured by the first distance measurement unit and a second measurement value measured by the second distance measurement unit when the substrate is at a first position; acquiring a first distance from the light source to the irradiated portion when the substrate is at the first position based on the first measurement value and the second measurement value; acquiring a third measurement value measured by the first distance measurement unit and a fourth measurement value measured by the second distance measurement unit when the substrate is in a second position; acquiring a second distance from the light source to the irradiated portion when the substrate is at the second position based on the third measurement value and the fourth measurement value; controlling the amount of light irradiated from the light source to the irradiated portion at each position based on the first distance and the second distance; The substrate processing method according to claim 13 .

15. the control unit acquires a third distance from the light source to the irradiated portion when the board is in a third position based on the first distance and the second distance; and controlling the amount of light irradiated from the light source to the irradiated portion at the third position based on the third distance.

15. The substrate processing method according to claim 14.

16. the control unit controls the amount of light irradiated from the light source to the irradiation target portion by controlling the transport speed of the substrate by the robot arm.

16. The substrate processing method according to claim 13, wherein the substrate is processed by a process using a nozzle.

17. The control unit controls the light source to control the amount of light irradiated from the light source to the irradiated unit.

16. The substrate processing method according to claim 13, wherein the substrate is processed by a process using a nozzle.

18. the control unit controls the light source and the transport speed of the substrate by the robot arm, thereby controlling the amount of light irradiated from the light source to the irradiation portion.

16. The substrate processing method according to claim 13, wherein the substrate is processed by a process using a nozzle.

19. In a transport direction of the substrate, the first distance measurement unit and the second distance measurement unit are disposed on one side with respect to the light source.

16. The substrate processing method according to claim 13, wherein the substrate is processed by a process using a nozzle.

20. the first distance measurement unit is disposed on one side relative to the light source in a transport direction of the substrate, and the second distance measurement unit is disposed on the other side relative to the light source.

16. The substrate processing method according to claim 13, wherein the substrate is processed by a process using a nozzle.

21. At least one of the first distance measurement unit and the second distance measurement unit includes a plurality of distance sensors arranged along a direction intersecting a transport direction of the substrate.

16. The substrate processing method according to claim 13, wherein the substrate is processed by a process using a nozzle.

22. The control unit obtaining a tilt angle of the substrate with respect to a horizontal direction using the measurement value measured by the first distance measurement unit and the measurement value measured by the second distance measurement unit; obtaining a distance from the light source to the irradiated portion based on the tilt angle; 16. The substrate processing method according to claim 13, wherein the substrate is processed by a process using a nozzle.

23. The light source is a UV light source.

16. The substrate processing method according to claim 13, wherein the substrate is processed by a process using a nozzle.

24. A program for causing the control unit to execute the substrate processing method according to any one of claims 13 to 15.

25. A computer-readable recording medium having the program according to claim 24 recorded thereon.

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