Capacitor module

Abstract

To provide a capacitor module which can be positioned easily while ensuring insulation.SOLUTION: The capacitor module 23 includes a metal case 30, capacitor elements 40, bus bars 50, and a lid member 70. The lid member 70 includes an electrically insulating material. The lid member 70 is fixed to the metal case 30 and is disposed in the opening of the metal case 30. The bus bar 50 is fixed to the lid member 70. The bus bar 50 and the capacitor element 40 are positioned at a predetermined position away from the metal case 30 via the lid member 70.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The disclosure herein relates to a capacitor module. [Background technology]

[0002] Patent Document 1 discloses a capacitor. The contents of the prior art documents are incorporated by reference as explanations of the technical elements in this specification. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2022 / 054729 Summary of the Invention [Problem to be solved by the invention]

[0004] In Patent Document 1, a protrusion is provided on the terminal of the bus bar, and a recess into which the protrusion is inserted is provided on the case. With this structure, it is not possible to position the bus bar relative to the metal case. In terms of the above and other aspects not mentioned, further improvements are required in capacitor modules.

[0005] One object of the present disclosure is to provide a capacitor module that can be easily positioned while ensuring insulation. [Means for solving the problem]

[0006] A capacitor module according to one embodiment of the present disclosure includes: A metal case (30) having an opening on one side; a capacitor element (40) housed in a metal case; a bus bar (50) electrically connected to the capacitor element; a cover member (70) including an electrically insulating material, fixed to the metal case, and disposed in the opening; Equipped with The bus bar is fixed to the cover member, The bus bar and the capacitor element are positioned at a predetermined position away from the metal case via the lid member.

[0007] According to the disclosed capacitor module, a lid member containing an electrically insulating material is fixed to the metal case so as to be positioned in the opening. The bus bar is fixed to the lid member and is positioned in the metal case via the lid member. The capacitor element is connected to the bus bar and is positioned in the metal case via the bus bar and the lid member. This makes it possible to provide a capacitor module that is easy to position while ensuring insulation.

[0008] The various aspects disclosed in this specification employ different technical means to achieve their respective objectives. The reference numerals in parentheses in the claims are intended to exemplarily indicate the corresponding parts of the embodiments described below, and are not intended to limit the technical scope. The objectives, features, and advantages disclosed in this specification will become more apparent by reference to the following detailed description and the accompanying drawings. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a diagram showing a power conversion circuit and a drive system to which a capacitor module is applied; [Figure 2] FIG. 2 is a plan view showing the power conversion device. [Figure 3] FIG. 1 is a plan view showing a capacitor module according to a first embodiment. [Figure 4] FIG. 10 is a plan view showing a configuration in which a sealing body is omitted. [Figure 5] FIG. 2 is a plan view showing the opposing surface side of the cover member. [Figure 6] FIG. 4 is a cross-sectional view taken along line VI-VI in FIG. [Figure 7] FIG. 7 is a cross-sectional view taken along line VII-VII in FIG. [Figure 8] FIG. 8 is a cross-sectional view taken along line VIII-VIII in FIG. [Figure 9] FIG. 4 is a cross-sectional view showing a capacitor module according to a second embodiment. [Figure 10] FIG. [Figure 11] FIG. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, several embodiments will be described with reference to the drawings. Note that in each embodiment, corresponding components are designated by the same reference numerals, and redundant description may be omitted. When only a portion of the configuration is described in each embodiment, the configuration of another embodiment previously described may be applied to the remaining portion of the configuration. Furthermore, in addition to the combinations of configurations explicitly stated in the description of each embodiment, configurations of several embodiments may be partially combined together even if not explicitly stated, provided that there is no particular problem with the combination.

[0011] (First embodiment) The capacitor module of this embodiment is applied to, for example, a mobile body that uses a rotating electric machine as a drive source. Examples of the mobile body include electric vehicles such as battery electric vehicles (BEVs), hybrid electric vehicles (HEVs), and plug-in hybrid electric vehicles (PHEVs), electric flying bodies such as drones and electric vertical take-off and landing aircraft (eVTOLs), ships, construction machinery, and agricultural machinery. The mobile body may be a manned mobile body or an unmanned mobile body. BEV is an abbreviation for Battery Electric Vehicle. HEV is an abbreviation for Hybrid Electric Vehicle. eVTOL is an abbreviation for electronic Vertical Take-Off and Landing aircraft. An example of application to a vehicle will be described below.

[0012] <Vehicle drive system> 1 shows an example of a vehicle drive system. The drive system 1 includes a DC power supply 2, a motor generator 3, and a power conversion circuit 4.

[0013] The DC power supply 2 is a DC voltage source composed of a rechargeable secondary battery. The secondary battery may be, for example, a lithium-ion battery or a nickel-metal hydride battery. The motor generator 3 is a three-phase AC rotating electric machine. The motor generator 3 functions as a drive source for the vehicle, that is, an electric motor. The motor generator 3 functions as a generator during regeneration. The power conversion circuit 4 converts power between the DC power supply 2 and the motor generator 3.

[0014] <Power conversion circuit> 1 shows an example of a power conversion circuit 4. The power conversion circuit 4 shown in FIG.

[0015] The smoothing capacitor 5 mainly smoothes the DC voltage supplied from the DC power supply 2. The smoothing capacitor 5 is connected to a P line 7, which is a power supply line on the high potential side, and an N line 8, which is a power supply line on the low potential side. The P line 7 is connected to the positive electrode of the DC power supply 2, and the N line 8 is connected to the negative electrode of the DC power supply 2. The positive electrode of the smoothing capacitor 5 is connected to the P line 7 between the DC power supply 2 and the inverter 6. The negative electrode of the smoothing capacitor 5 is connected to the N line 8 between the DC power supply 2 and the inverter 6. The smoothing capacitor 5 is connected in parallel to the DC power supply 2.

[0016] The inverter 6 is a DC-AC conversion circuit. In accordance with switching control by the control circuit, the inverter 6 converts a DC voltage into a three-phase AC voltage and outputs it to the motor generator 3. This drives the motor generator 3 to generate a predetermined torque. During regenerative braking of the vehicle, the inverter 6 converts the three-phase AC voltage generated by the motor generator 3 in response to rotational force from the wheels into a DC voltage in accordance with switching control by the control circuit and outputs it to the P line 7. In this way, the inverter 6 performs bidirectional power conversion between the DC power supply 2 and the motor generator 3.

[0017] The inverter 6 is configured to include upper and lower arm circuits 9 for three phases. The upper and lower arm circuits 9 are sometimes referred to as legs. Each upper and lower arm circuit 9 has an upper arm 9H and a lower arm 9L. The upper arm 9H and the lower arm 9L are connected in series between the P line 7 and the N line 8, with the upper arm 9H on the P line 7 side. Hereinafter, the upper arm 9H and the lower arm 9L may be simply referred to as arms 9H and 9L.

[0018] The connection point between the upper arm 9H and the lower arm 9L, i.e., the midpoint of the upper and lower arm circuits 9, is connected to the corresponding phase winding 3a of the motor generator 3 via an output line 10. Of the upper and lower arm circuits 9, the U-phase upper and lower arm circuit 9U is connected to the U-phase winding 3a via the output line 10. The V-phase upper and lower arm circuit 9V is connected to the V-phase winding 3a via the output line 10. The W-phase upper and lower arm circuit 9W is connected to the W-phase winding 3a via the output line 10.

[0019] The number of switching elements constituting each arm 9H, 9L is not particularly limited. It may be one or more. In the illustrated upper arm 9H, three switching elements are connected in parallel. In the lower arm 9L, three switching elements are connected in parallel. In other words, each of the six arms 9H, 9L of the three-phase upper and lower arm circuit 9 is composed of three switching elements connected in parallel to each other.

[0020] The illustrated switching element is an n-channel MOSFET 11. MOSFET is an abbreviation for Metal Oxide Semiconductor Field Effect Transistor. The three MOSFETs 11 on the high side connected in parallel are turned on and off at the same timing by a common gate drive signal (drive voltage). The three MOSFETs 11 on the low side connected in parallel are turned on and off at the same timing by a common gate drive signal (drive voltage).

[0021] A freewheeling diode 12 is connected in anti-parallel to each MOSFET 11. The diode 12 may be a parasitic diode (body diode) or an external diode. In the upper arm 9H, the drain of the MOSFET 11 is connected to the P line 7. In the lower arm 9L, the source of the MOSFET 11 is connected to the N line 8. The source of the MOSFET 11 in the upper arm 9H and the drain of the MOSFET 11 in the lower arm 9L are connected to each other. The anode of the diode 12 is connected to the source of the corresponding MOSFET 11, and the cathode is connected to the drain.

[0022] The switching element is not limited to the MOSFET 11. For example, an IGBT may be used. IGBT is an abbreviation for Insulated Gate Bipolar Transistor. In the case of an IGBT, a freewheeling diode is also connected in anti-parallel.

[0023] The power conversion circuit 4 may include a converter. The converter is a DC-DC conversion circuit configured to be able to convert DC voltage. The converter is provided between the DC power supply 2 and the smoothing capacitor 5. The converter is configured to include, for example, a reactor and the above-mentioned upper and lower arm circuits 9. This configuration allows for voltage step-up and step-down. The power conversion circuit 4 may also include a filter capacitor. The filter capacitor is provided between the DC power supply 2 and the converter.

[0024] The power conversion circuit 4 may include a snubber circuit. The snubber circuit is connected in parallel to the upper and lower arm circuits 9. The snubber circuit reduces the inductance of the upper and lower arm circuits 9. The snubber circuit absorbs a transient high voltage, known as a switching surge, that occurs when switching elements (MOSFETs 11) that constitute the upper and lower arm circuits 9. This enables the inverter 6 to perform high-speed switching.

[0025] The power conversion circuit 4 may include a drive circuit for a switching element constituting the inverter 6 or the like. The drive circuit supplies a drive voltage to the gate of the MOSFET 11 of the corresponding arm based on a drive command from the control circuit. The drive circuit drives the corresponding MOSFET 11, i.e., turns it on and off, by applying the drive voltage. The drive circuit is sometimes referred to as a driver.

[0026] The power conversion circuit 4 may include a control circuit for the switching element. The control circuit generates a drive command for operating the MOSFET 11 and outputs it to the drive circuit. The control circuit generates the drive command based on, for example, a torque request input from a higher-level ECU (not shown) and signals detected by various sensors. ECU is an abbreviation for Electronic Control Unit.

[0027] The power conversion circuit 4 may include sensors. The sensors may include, for example, a current sensor 13, a rotation angle sensor, and a voltage sensor. The current sensor 13 detects the phase current flowing through the winding 3a of each phase. The rotation angle sensor detects the rotation angle of the rotor of the motor generator 3. The voltage sensor detects the voltage across the smoothing capacitor 5. The control circuit described above outputs a drive command, for example, a PWM signal, based on the signals detected by the sensors. The control circuit may include, for example, a processor and a memory. PWM is an abbreviation for Pulse Width Modulation.

[0028] <Power conversion device> FIG. 2 shows an example of a power conversion device including a capacitor module.

[0029] 2 provides the above-described power conversion circuit 4. The power conversion device 20 includes a cooler 21, a semiconductor module 22, a capacitor module 23, and a current sensor 24. The illustrated power conversion device 20 includes a plurality of semiconductor modules 22. First, the elements of the power conversion device 20 other than the capacitor module 23 will be described.

[0030] In the following, the depth direction of the case of the capacitor module 23 is referred to as the Z direction. The direction perpendicular to the Z direction is referred to as the X direction, and the direction perpendicular to both the X and Z directions is referred to as the Y direction. The X, Y, and Z directions are mutually perpendicular. Unless otherwise specified, the shape viewed from the Z direction, in other words, the shape along the XY plane defined by the X and Y directions, is referred to as the planar shape. The planar view from the Z direction may sometimes be simply referred to as the planar view.

[0031] The cooler 21 cools other elements constituting the power conversion device 20, which are arranged on the cooler 21. The cooler 21 may be, for example, a heat sink. The heat sink may have fins on the back side. The cooler 21 may have a flow path through which a refrigerant flows. The refrigerant may be, for example, a phase-change refrigerant such as water or ammonia, or a phase-non-change refrigerant such as an ethylene glycol-based refrigerant. The refrigerant may be, for example, LLC. LLC is an abbreviation for long life coolant.

[0032] The cooler 21 may be part of a housing that houses the semiconductor module 22, the capacitor module 23, and the current sensor 24, or may be provided separately from the housing. The cooler 21 and the components arranged on the cooler 21 may be thermally connected via a bonding material such as solder, or may be thermally connected via a thermally conductive member. The thermally conductive member may be referred to as TIM, GF, or the like. TIM is an abbreviation for Thermal Interface Material. GF is an abbreviation for Gap Filler.

[0033] The semiconductor modules 22 constitute the upper and lower arm circuits 9, i.e., the inverter 6. The semiconductor modules 22 may also be referred to as power modules, semiconductor devices, etc. The illustrated power conversion device 20 includes three semiconductor modules 22. The multiple semiconductor modules 22 include a semiconductor module 22U that constitutes the upper and lower arm circuits 9U, a semiconductor module 22V that constitutes the upper and lower arm circuits 9V, and a semiconductor module 22W that constitutes the upper and lower arm circuits 9W.

[0034] The semiconductor modules 22 have, for example, a common structure. The illustrated semiconductor module 22 includes a main body 221 and external connection terminals protruding from the main body 221. The main body 221 includes semiconductor elements 222H and 222L, a sealing body 223, and the like.

[0035] The semiconductor elements 222H and 222L are formed by forming switching elements on semiconductor substrates made of materials such as silicon (Si) or wide-bandgap semiconductors with a wider bandgap than silicon. The switching elements have a vertical structure so that the main current flows in the thickness direction of the semiconductor substrate. Examples of wide-bandgap semiconductors include silicon carbide (SiC), gallium nitride (GaN), gallium oxide (Ga2O3), and diamond.

[0036] The illustrated semiconductor elements 222H, 222L are formed by forming the above-described n-channel MOSFET 11 and diode 12 on a semiconductor substrate made of SiC. The MOSFET 11 has a vertical structure so that a main current flows in the thickness direction of the semiconductor elements 222H, 222L (semiconductor substrate). The semiconductor elements 222H, 222L have main electrodes (not shown) on both sides in the thickness direction. The semiconductor elements 222H, 222L have a source electrode on the front surface and a drain electrode on the back surface as main electrodes. The source electrode is formed on a portion of the front surface. The drain electrode is formed on almost the entire back surface.

[0037] The main current flows between the drain electrode and the source electrode. The semiconductor elements 222H, 222L have a pad (not shown) that is a signal electrode on the surface where the source electrode is formed. The semiconductor elements 222H, 222L are arranged so that their plate thickness direction is approximately parallel to the Z direction. One semiconductor module 22 includes three semiconductor elements 222H that form the upper arm 9H and three semiconductor elements 222L that form the lower arm 9L. The three semiconductor elements 222H that form one arm are lined up in the X direction. Similarly, the three semiconductor elements 222L are lined up in the X direction. The semiconductor elements 222H and semiconductor elements 222L that form one arm are lined up in the Y direction.

[0038] The sealing body 223 seals some of the other elements that make up the semiconductor module 22. The remaining parts of the other elements are exposed to the outside of the sealing body 223. The sealing body 223 seals the semiconductor elements 222H, 222L, and parts of the external connection terminals. Other parts of the external connection terminals protrude outside the sealing body 223. The sealing body 223 is made of, for example, resin. The illustrated sealing body 223 is molded by transfer molding using epoxy resin-based resin. The sealing body 223 has a generally rectangular shape when viewed from above. The sealing body 223 forms the outer periphery of the main body 221.

[0039] The sealing body 223 may be formed by potting. The sealing body 223 is filled into the accommodation space formed by the housing (not shown) and the cooler 21, and seals the semiconductor elements 222H, 222L, etc., arranged in the accommodation space.

[0040] The external connection terminals are terminals for electrically connecting the semiconductor module 22 to an external device. The external connection terminals include a P-terminal 224P, an N-terminal 224N, and an O-terminal 224O as main terminals electrically connected to the main electrodes of the semiconductor elements 222H and 222L. The P-terminal 224P is electrically connected to the drain electrode of the semiconductor element 222H. The N-terminal 224N is electrically connected to the source electrode of the semiconductor element 222L. The O-terminal 224O is electrically connected to the connection point (midpoint) between the source electrode of the semiconductor element 222H and the drain electrode of the semiconductor element 222L.

[0041] The P terminal 224P and the N terminal 224N extend from the main body 221 toward the capacitor module 23. The illustrated semiconductor module 22 has one P terminal 224P and two N terminals 224N. The P terminal 224P and the N terminal 224N protrude to the outside from the surface of the main body 221 facing the capacitor module 23. In the X direction, the P terminal 224P is arranged between the N terminals 224N. The O terminal 224O extends from the main body 221 toward the current sensor 24. The O terminal 224O protrudes to the outside from the side surface opposite the surface facing the capacitor module 23. In addition to the terminals described above, the external connection terminals also include signal terminals (not shown).

[0042] In addition to the above-mentioned elements, the semiconductor module 22 also includes wiring members (not shown). The wiring members provide a wiring function that electrically connects the main electrodes and main terminals of the semiconductor elements 222H, 222L. The wiring members provide a heat dissipation function that dissipates heat from the semiconductor elements 222H, 222L. The wiring members may be, for example, a substrate with metal bodies arranged on both sides of an insulating base material, or may be a heat sink that is a metal member. The heat sink may be provided as part of the lead frame. The entire wiring member may be sealed with the sealing body 223, or a portion may be exposed from the main body portion 221. Exposing the wiring member can improve heat dissipation.

[0043] The semiconductor module 22 is disposed on the cooler 21. As described above, the main body 221 of the semiconductor module 22 may be fixed to the cooler 21 via a bonding material, or may be thermally connected to the cooler 21 via a heat conductive member. As shown in FIG. 2, the three semiconductor modules 22 are lined up in the X direction. The three semiconductor modules 22 are lined up in the order of semiconductor module 22U, semiconductor module 22V, and semiconductor module 22W. In addition, the side surfaces of adjacent semiconductor modules 22 face each other in the X direction with a predetermined gap therebetween.

[0044] The current sensor 24 provides the current sensor 13 described above. The current sensor 24 is configured to detect phase currents individually. The current sensor 24 may be a magnetic detection type sensor equipped with a magnetoelectric conversion element, or a resistance detection type sensor equipped with a shunt resistor. The illustrated current sensor 24 is a magnetic detection type. The current sensor 24 includes a bus bar 241 provided corresponding to each phase, and a main body 242. The bus bar 241 has its thickness in the Z direction and extends in the Y direction.

[0045] The illustrated main body 242 has a Hall element (magnetoelectric conversion element), a resin member, a core, and a substrate (not shown). For convenience, FIG. 2 shows the outer shell of the resin member as the main body 242. The main body 242 has three Hall elements and three cores corresponding to the busbars 241. The Hall elements are disposed in the gaps of the corresponding cores when mounted on the substrate. The cores and busbars 241 are held by the resin member. The busbars 241 pass through the annular regions of the corresponding cores. The substrate is fixed to the resin member.

[0046] In the illustrated power conversion device 20, the semiconductor module 22, the capacitor module 23, and the current sensor 24 are aligned in the Y direction. The semiconductor module 22 is disposed between the capacitor module 23 and the current sensor 24 in the Y direction.

[0047] <Capacitor module> Fig. 3 is a plan view showing an example of a capacitor module. Fig. 4 is a plan view showing a configuration in which the sealing body is omitted from Fig. 3. Fig. 5 is a plan view showing the opposing surface side of the lid member. Fig. 6 is a cross-sectional view taken along line VI-VI in Fig. 3. Fig. 7 is a cross-sectional view taken along line VII-VII in Fig. 3. Fig. 8 is a cross-sectional view taken along line VIII-VIII in Fig. 3.

[0048] The capacitor module 23 provides the above-mentioned smoothing capacitor 5. The capacitor module 23 includes a metal case 30, a capacitor element 40, a bus bar 50, a sealing body 60, and a cover member 70.

[0049] The metal case 30 is formed using a metal material such as aluminum. The metal case 30 has a cylindrical shape with a bottom. The metal case 30 has a bottom wall 31 and side walls 32. The metal case 30 is disposed on the cooler 21 so that the outer surface of the bottom wall 31 faces the cooler 21 in the Z direction. The illustrated bottom wall 31 has a generally rectangular planar shape with the X direction as its longitudinal direction, and the side wall 32 has a generally rectangular ring shape in plan. The side wall 32 includes four side walls 321, 322, 323, and 324. The side wall 321 is the side wall 32 on the semiconductor module 22 side in the Y direction. The side wall 322 is the side wall 32 opposite the side wall 321 in the Y direction. The side wall 324 is the side wall 32 opposite the side wall 323 in the X direction. The side wall 32 has an upper end 33. The upper end 33 is the end opposite to the end continuing to the bottom wall 31. The metal case 30 may be configured as a part of the cooler 21 described above. In other words, the cooler 21 may also serve as the metal case 30.

[0050] The capacitor element 40 is, for example, a film capacitor element. The capacitor element 40 has a generally rectangular shape in plan view. The capacitor element 40 has electrodes 41 on one surface and on the opposite surface. The electrodes 41 are sometimes referred to as metallikon electrodes. One of the electrodes 41 is a P-electrode 41P, and the other is an N-electrode 41N.

[0051] The one surface and the back surface, which are the electrode formation surfaces, may be surfaces in the Z direction or surfaces in a direction perpendicular to the Z direction. The exemplary capacitor element 40 is formed by winding a film around an axis approximately parallel to the Z direction. In capacitor element 40, the one surface and the back surface are surfaces in the Z direction. In other words, the back surface is the surface opposite to the one surface in the Z direction. The back surface is the lower surface facing the bottom wall 31 in the Z direction, and the one surface is the upper surface. Capacitor element 40 has a negative N electrode 41N on one surface and a positive P electrode 41P on the back surface.

[0052] The capacitor module 23 may include only one capacitor element 40, or may include multiple capacitor elements 40. In a configuration including multiple capacitor elements 40, the capacitor elements 40 are aligned in at least one direction perpendicular to the Z direction. The illustrated capacitor module 23 includes four capacitor elements 40. The capacitor elements 40 are aligned in the X direction.

[0053] The busbars 50 include a P busbar 50P connected to the P electrode 41P and an N busbar 50N connected to the N electrode 41N. The P busbar 50P and the N busbar 50N each have an electrode connection portion 51, a terminal portion 52, and a linking portion 53. The electrode connection portion 51 is a connection portion of the busbar 50 with the corresponding electrode 41. The terminal portion 52 is a portion of the busbar 50 that protrudes outside the sealing body 60. The terminal portion 52 is a portion for connecting to other devices such as the semiconductor module 22. The terminal portion 52 of the P busbar 50P is connected to the P terminal 224P of the semiconductor module 22 as shown in FIG. 2. Similarly, the terminal portion 52 of the N busbar 50N is connected to the N terminal 224N. The linking portion 53 is a portion of the busbar 50 that connects the electrode connection portion 51 and the terminal portion 52.

[0054] The electrode connection portions 51 and the connecting portions 53 are covered by the sealing body 60. The electrode connection portions 51 and the connecting portions 53 are disposed within the sealing body 60. The terminal portions 52 are disposed outside the sealing body 60. The illustrated P bus bar 50P and N bus bar 50N are drawn from the corresponding electrodes 41 toward the side wall 321. The P bus bar 50P and the N bus bar 50N protrude from the sealing body 60 near the side wall 321. The plate thickness direction of the electrode connection portions 51 is approximately parallel to the Z direction. The connecting portions 53 are continuous with the electrode connection portions 51 and include a portion extending in the Y direction and a portion extending in the Z direction. The connecting portions 53 are approximately L-shaped in the YZ plane. The terminal portions 52 extend from the connecting portions 53 toward the semiconductor module 22. The P bus bar 50P and the N bus bar 50N are disposed parallel to each other so that their plate surfaces face each other over most of the entire length of the terminal portions 52. An insulating member may be disposed between the terminal portions 52 of the P bus bar 50P and the N bus bar 50N.

[0055] Of the bus bars 50, the bus bar 50 connected to the electrode 41 on one surface (top surface) of the capacitor element 40 is fixed to the lid member 70. Of the illustrated bus bars 50, the N bus bar 50N is fixed to the lid member 70. The P bus bar 50P is not directly fixed to the lid member 70. By fixing the N bus bar 50N to the lid member 70, the capacitor element 40 and the P bus bar 50P are positioned and fixed to the lid member 70, and ultimately to the metal case 30.

[0056] The N bus bar 50N has an extension portion 54. The extension portion 54 is continuous with the electrode connection portion 51 and extends from the electrode connection portion 51 toward the cover member 70. The extension portion 54 includes a first extension portion 541 and a second extension portion 542. The thickness direction of the first extension portion 541 is a first direction different from the Z direction. The thickness direction of the second extension portion 542 is a second direction different from both the Z direction and the first direction.

[0057] The illustrated extension portion 54 is a bent portion bent relative to the electrode connection portion 51. The extension portion 54 is continuous with an end of the electrode connection portion 51 and is bent at an angle of approximately 90 degrees relative to the electrode connection portion 51. The thickness direction of the first extension portion 541 is approximately parallel to the Y direction. The thickness direction of the second extension portion 542 is approximately parallel to the X direction. The bus bar 50 has two electrode connection portions 51 arranged side by side in the X direction. One of the electrode connection portions 51 is disposed so as to straddle the first capacitor element 40 and the second capacitor element 40, and the first extension portion 541 is continuous with the end of the electrode connection portion 51 on the side wall 322 side. The other electrode connection portion 51 is disposed so as to straddle the third capacitor element 40 and the fourth capacitor element 40, and the second extension portion 542 is continuous with each of the end portions of the electrode connection portion 51 on the side walls 323 and 324 side. The first extension portion 541 and the second extension portion 542 are spaced apart in the X direction in which the plurality of capacitor elements 40 are arranged.

[0058] The first extension portion 541 and the second extension portion 542 may be provided for one electrode connection portion 51 extending in the X direction. For example, the second extension portion 542 may be provided at both ends of the electrode connection portion 51 in the X direction, and the first extension portion 541 may be provided near the center of the electrode connection portion 51 in the X direction. The first extension portion 541 and the second extension portion 542 may be provided for each of two electrode connection portions 51 aligned in the X direction.

[0059] The sealing body 60 is formed using an electrically insulating resin material. The sealing body 60 is filled into the metal case 30. The sealing body 60 is formed, for example, by potting. The sealing body 60 seals the capacitor element 40. The sealing body 60 seals a portion of the bus bar 50. The sealing body 60 contacts a surface 73 of the lid portion 71 that faces the bottom wall 31. The illustrated sealing body 60 also contacts a side surface 75 of the lid portion 71. The sealing body 60 is filled into the metal case 30 so as to contact the side surface 75. The sealing body 60 also fills and seals the gap between the metal case 30 and the lid member 70. The sealing body 60 also fills and seals the gap between the lid portion 71 and the terminal portion 52 of the bus bar 50. The top surface of the sealing body 60 is, for example, approximately flush with a back surface 74 of the lid portion 71.

[0060] The lid member 70 is made of an electrically insulating material. The lid member 70 is made of, for example, a resin material. The lid member 70 is fixed to the metal case 30 and placed in the opening of the metal case 30. The lid member 70 closes at least part of the opening of the metal case 30. The lid member 70 may be fixed to the metal case 30 so as to completely close the opening of the metal case 30, and together with the metal case 30, provide a storage space that is airtight and liquidtight sealed. In other words, the seal 60 may not be provided. The lid member 70 and the metal case 30 ensure moisture resistance of the capacitor element 40.

[0061] The illustrated lid member 70 has a lid portion 71 and a fixing portion 72. The lid portion 71 is disposed in the opening of the metal case 30, which is cylindrical and has a bottom. The lid portion 71 is disposed within a predetermined range from the upper end of the side wall 32 in the depth direction (Z direction). The lid portion 71 is disposed so as to cover (block) most of the opening. The lid portion 71 has an opposing surface 73, a back surface 74, and a side surface 75. The opposing surface 73 is a surface that faces the bottom wall 31. The back surface 74 is a surface opposite to the opposing surface 73. The side surface 75 is a surface that is continuous with the opposing surface 73 and the back surface 74. The side surface 75 is a surface that faces the side wall 32.

[0062] The lid portion 71 has a generally rectangular shape in plan view. The sealing body 60 is in contact with an opposing surface 73 of the lid portion 71. The lid portion 71 is disposed on the sealing body 60. The sealing body 60 is also in contact with a side surface 75 of the lid portion 71. The lid portion 71 may be made of the same material as the sealing body 60, or may be made of a material that is more moisture-resistant than the sealing body 60. The lid portion 71 of the lid member 70, the metal case 30, and the sealing body 60 ensure the moisture resistance of the capacitor element 40.

[0063] The fixing portions 72 are continuous with the lid portion 71 and extend from the lid portion 71. The fixing portions 72 hold the lid portion 71 in the predetermined position. The illustrated lid member 70 has a plurality of fixing portions 72 distributed in a dispersed manner. The illustrated fixing portions 72 are provided on the side walls 322, 323, and 324 of the four rectangular annular side walls 32. The fixing portions 72 are provided on the side walls 32 excluding the side wall 321 from which the bus bar 50 is drawn out.

[0064] At least a portion of the fixing portion 72 is fixed to the side wall 32 of the metal case 30 and / or the cooler 21. The fixing portion 72 may be formed using the same material as the lid portion 71. The fixing portion 72 may be inserted into the lid portion 71. The fixing portion 72 may include an insert part, such as an insert collar for fastening, at the portion where it is fixed to the cooler 21 or the like.

[0065] The cover member 70 has a recess 76 as a portion for fixing the extension portion 54. The recess 76 is provided on the opposing surface 73 of the cover member 71. The recess 76 is recessed relative to the surrounding portion of the opposing surface 73. The extension portion 54 of the bus bar 50 is fitted into the recess 76. The cover member 70 has three recesses 76. The first extension portion 541 is fitted into the recess 76 whose longitudinal direction is the X direction. The second extension portion 542 is fitted into two recesses 76 whose longitudinal direction is the Y direction and which are arranged side by side in the X direction.

[0066] <Summary of the First Embodiment> Capacitor module 23 of this embodiment includes metal case 30, capacitor element 40, bus bar 50, and lid member 70. Lid member 70 is made of an electrically insulating material and is fixed to metal case 30 and placed in an opening of metal case 30. Bus bar 50 is fixed to lid member 70. Bus bar 50 and capacitor element 40 are positioned at predetermined positions separated from metal case 30 via lid member 70.

[0067] In this manner, lid member 70 containing an electrically insulating material is fixed to metal case 30 so as to be positioned in the opening. Bus bar 50 is fixed to lid member 70, and is positioned in metal case 30 via lid member 70. Capacitor element 40 is connected to bus bar 50, and is positioned in metal case 30 via bus bar 50 and lid member 70. It is therefore possible to provide capacitor module 23 that is easy to position while ensuring insulation.

[0068] As illustrated, capacitor element 40 may have a first electrode facing bottom wall 31 of metal case 30 and a second electrode provided on the surface opposite to the first electrode, and bus bar 50 may include a first bus bar connected to the first electrode and a second bus bar connected to the second electrode. In addition, a configuration may be adopted in which only the second bus bar is fixed to cover member 70. In the illustrated capacitor module 23, P electrode 41P corresponds to the first electrode, and N electrode 41N corresponds to the second electrode. P bus bar 50P corresponds to the first bus bar, and N bus bar 50N corresponds to the second bus bar.

[0069] According to this, by fixing only the second bus bar of the first and second bus bars to the cover member 70, all of the bus bars 50 and capacitor elements 40 can be arranged in predetermined positions relative to the metal case 30. In other words, positioning can be achieved with a simple configuration. Since the second bus bar, which is arranged close to the cover member 70, is fixed to the cover member 70, the structure of the bus bars 50 can also be simplified.

[0070] As illustrated, the second bus bar may be provided with an extension portion 54 extending from the connection portion with the second electrode toward the lid member 70, and the lid member 70 may be provided with a recess 76 into which the extension portion 54 fits. In the illustrated capacitor module 23, the electrode connection portion 51 corresponds to the connection portion. In this manner, by fitting only the second bus bar into the lid member 70, all bus bars 50 and capacitor elements 40 can be arranged in predetermined positions relative to the metal case 30. This simple configuration allows positioning while ensuring insulation. Furthermore, because the extension portion 54 extending from the connection portion is fitted into the lid member 70 located above the connection portion, it is possible to improve positioning accuracy, particularly in the depth direction (Z direction) of the metal case 30.

[0071] The extension portion 54 may have any configuration as long as it extends from the connection portion toward the lid member 70. For example, the extension portion 54 may be joined to the connection portion by bonding and extend toward the lid member 70. As illustrated, the extension portion 54 may be a bent portion that is bent toward the connection portion. This bent structure allows for positioning while ensuring insulation with a simpler configuration. Furthermore, the extension portion 54 can alleviate stress during mating.

[0072] The second bus bar may have at least one extension portion 54. As illustrated, the second bus bar may have, as extension portion 54, a first extension portion 541 whose thickness direction is a first direction different from the depth direction of metal case 30, and a second extension portion 542 whose thickness direction is a second direction different from both the depth direction and the first direction. In the illustrated capacitor module 23, the Z direction corresponds to the depth direction. This allows the two extension portions 541, 542 whose thickness directions are different to improve the positional accuracy of capacitor element 40 and bus bar 50 relative to metal case 30 in a plane perpendicular to the depth direction.

[0073] As illustrated, the first direction may be a direction perpendicular to the depth direction, and the second direction may be a direction perpendicular to both the depth direction and the first direction. In the illustrated capacitor module 23, the Y direction corresponds to the first direction, and the X direction corresponds to the second direction. This can improve the positional accuracy of the capacitor element 40 and the bus bar 50 relative to the metal case 30 within the XY plane.

[0074] For example, by tightly sealing the lid member 70 and the metal case 30 to prevent moisture from entering, it is possible to configure the capacitor module 23 without the sealant 60. However, in a configuration without the sealant 60, a creepage distance along the surfaces of the lid portion 71 and the fixing portion 72 of the lid member 70 must be ensured between the electrode on one side (e.g., the N electrode 41N) and the upper end 33 of the side wall 32 of the metal case 30. As illustrated, if the capacitor module 23 is configured with the sealant 60 and the sealant 60 is in contact with the opposing surface 73 of the lid member 70, the sealant 60 fills the gap between the electrode on one side and the opposing surface 73 of the lid portion 71, providing solid insulation. This ensures insulation between the electrode 41 and / or the bus bar 50 and the metal case 30 while suppressing an increase in size.

[0075] <Modification> Although the example in which the bus bar 50 is fixed to the cover member 70 by fitting has been shown, this is not limiting. For example, the cover member 70 may be molded using the bus bar 50 as an insert part (insert molding). The bus bar 50 may be press-fitted into the cover member 70 and fixed. The bus bar 50 may also be fixed to the cover member 70 by adhesive bonding, caulking, screw fastening, or the like.

[0076] Although an example has been shown in which the P electrode 41P is provided on the bottom wall 31 side, this is not limiting. The N electrode 41N may also be provided on the bottom wall 31 side. In this case, the N electrode 41N corresponds to the first electrode, and the P electrode 41P corresponds to the second electrode. The N bus bar 50N corresponds to the first bus bar, and the P bus bar 50P corresponds to the second bus bar. In other words, only the P bus bar 50P may be fixed to the cover member 70.

[0077] (Second embodiment) This embodiment is a modification based on the preceding embodiment, and the description of the preceding embodiment can be used. In the preceding embodiment, only a seal is disposed between the metal case and the capacitor element. Instead, a member other than the seal may be disposed between the metal case and the capacitor element, particularly between the bottom wall and the capacitor element.

[0078] FIG. 9 is a cross-sectional view showing an example of a capacitor module according to this embodiment. FIG. 9 corresponds to FIG. 6. As shown in FIG. 9, capacitor module 23 includes an insulating member 80. Insulating member 80 is interposed at least between capacitor element 40 and bottom wall 31. Insulating member 80 is configured to include an electrically insulating material such as resin. Insulating member 80 may have a function of alleviating stress in the depth direction of metal case 30 by deformation of insulating member 80. Insulating member 80 is, for example, a resin plate. Insulating member 80 is elastically deformable in the Z direction. The other configurations are similar to those described in the preceding embodiment.

[0079] <Summary of the second embodiment> As illustrated, capacitor module 23 may include insulating member 80 that contains an electrically insulating material and is interposed between capacitor element 40 connected to bus bar 50 and bottom wall 31. This prevents electrodes 41 of capacitor element 40 and / or bus bar 50 from coming into contact with metal bottom wall 31 when capacitor element 40 connected to bus bar 50 is placed in metal case 30, lid member 70 is then placed on metal case 30, and extension portion 54 is fitted into recess 76. In this way, interference between electrodes 41 of capacitor element 40 and / or bus bar 50 and bottom wall 31 can be prevented.

[0080] As illustrated, insulating member 80 may be provided with a function of alleviating stress in the depth direction of metal case 30 through deformation. When extending portion 54 is fitted into recess 76, insulating member 80 deforms, which can prevent stress from concentrating on electrode 41 of capacitor element 40 and / or bus bar 50.

[0081] <Modification> The configuration of the insulating member 80 is not limited to the above example. The insulating member 80 may be configured to be spring deformable. The insulating member 80 may be interposed not only between the capacitor element 40 and the bottom wall 31, but also between the capacitor element 40 and the side wall 32. For example, as shown in FIGS. 10 and 11, a frame may be used as the insulating member 80. FIG. 10 is a perspective view showing a modified example of the insulating member. FIG. 11 is a plan view showing the state in which the insulating member shown in FIG. 10 is arranged in a metal case. In FIG. 11, the bus bars and the sealing body are omitted.

[0082] The insulating member 80 shown in FIGS. 10 and 11 is formed using an electrically insulating material such as resin. The insulating member 80 is, for example, a resin molded body. The insulating member 80 has a main body portion 81 and an extension portion 82. At least a portion of the main body portion 81 is disposed within the sealing body 60. The main body portion 81 is interposed between the metal case 30 and the capacitor element 40. The main body portion 81 has a frame 83 and a hole 84 formed between the frame 83. Although not shown, the sealing body 60 is disposed (filled) in the hole 84. The capacitor element 40 and the bus bar 50 are thermally connected to the metal case 30 through the sealing body 60 disposed in the hole 84.

[0083] The frame 83 includes a first frame 831, a second frame 832, and an annular frame 833. The first frame 831 extends in the Y direction in a plan view. The first frame 831 extends from the side wall 321 toward the side wall 322. The second frame 832 extends in the X direction in a plan view. The second frame 832 extends from the side wall 323 toward the side wall 324. The illustrated frame 83 includes four first frames 831 and two second frames 832. The four first frames 831 are aligned in the X direction at a predetermined interval. The first frames 831 are arranged so as to individually overlap the four capacitor elements 40 in a plan view. The two second frames 832 are aligned in the Y direction at a predetermined interval.

[0084] The first frame 831 and the second frame 832 each have a bottom wall side frame portion 834 and a side wall side frame portion 835. The bottom wall side frame portion 834 is a portion disposed to face the bottom wall 31 of the metal case 30. The side wall side frame portion 835 is a portion connected to the bottom wall side frame portion 834 and disposed to face the side wall 32. In the illustrated frame 83, the bottom wall side frame portion 834 is disposed between each of the capacitor elements 40 and the bottom wall 31. The side wall side frame portion 835 is disposed between each of the capacitor elements 40 and the side wall 32. The capacitor elements 40 connected to the bus bars 50 may be in contact with the bottom wall side frame portion 834. The capacitor elements 40 connected to the bus bars 50 may be in contact with a portion of the side wall side frame portion 835.

[0085] The first frame 831 has a bottom wall-side frame portion 834 extending in the Y direction and a side wall-side frame portion 835 that is connected to an end of the bottom wall-side frame portion 834 and extends in the Z direction. The first frame 831 has side wall-side frame portions 835 at both ends. The second frame 832 has a bottom wall-side frame portion 834 that extends in the X direction and a side wall-side frame portion 835 that is connected to an end of the bottom wall-side frame portion 834 and extends in the Z direction. The second frame 832 has side wall-side frame portions 835 at both ends. The first frame 831 and the second frame 832 are connected to each other. The bottom wall-side frame portion 834 of the first frame 831 and the bottom wall-side frame portion 834 of the second frame 832 are connected to each other. The illustrated main body 81 has eight connecting portions, which are portions where the first frame 831 and the second frame 832 intersect and are connected.

[0086] The annular frame 833 has an annular shape in a plan view. All of the first frames 831 and second frames 832 are connected to the annular frame 833. The side wall side frame portions 835 of the first frames 831 and second frames 832 are connected to the annular frame 833. The shape of the frame 83 is maintained by the annular frame 833. The annular frame 833 has the side wall side frame portions 835.

[0087] Due to the structure of the main body 81 described above, a frame 83 is interposed between the opposing surfaces of all of the capacitor elements 40 and the metal case 30. In addition, holes 84 are located between the opposing surfaces of all of the capacitor elements 40 and the metal case 30. A frame 83 (bottom wall-side frame portion 834) is interposed between the opposing surfaces of all of the capacitor elements 40 and the bottom wall 31. A hole 84 is located between the opposing surfaces of all of the capacitor elements 40 and the bottom wall 31. A frame 83 (side wall-side frame portion 835) is interposed between the opposing surfaces of all of the capacitor elements 40 and the side wall 32. A hole 84 is located between the opposing surfaces of all of the capacitor elements 40 and the side wall 32.

[0088] The extension portion 82 is continuous with the main body portion 81. The extension portion 82 extends from the main body portion 81 and is disposed outside the sealing body 60. The extension portion 82 is disposed between the terminal portion 52 of the bus bar 50 and the upper end 33 of the side wall 32 of the metal case 30. The extension portion 82 is continuous with the annular frame 833. The extension portion 82 is disposed so as to cross the overlapping region between the upper end 33 of the side wall 321 on the semiconductor module 22 side and the terminal portion 52 in a plan view. The extension portion 82 is disposed so as to encompass the entire overlapping region between the upper end 33 and the terminal portion 52 in a plan view. The extension portion 82 includes a portion overlapping the bottom wall 31 in a plan view, a portion overlapping the upper end 33, and a portion extending to the outside of the metal case 30, i.e., a portion not overlapping the metal case 30.

[0089] The extension portion 82 extends in the X direction. The extension portion 82 extends so as to overlap the upper ends 33 of the side walls 323, 324 in a plan view. The extension portion 82 includes a portion that overlaps the terminal portion 52 and portions that do not overlap the terminal portion 52, which are provided on both sides of the portion that overlaps the terminal portion 52. The illustrated extension portion 82 has a substantially rectangular shape with the longitudinal direction aligned with the X direction in a plan view. The extension portion 82 is arranged so that one end portion in the longitudinal direction overlaps the upper end 33 of the side wall 323 and the other end portion overlaps the upper end 33 of the side wall 324.

[0090] 10 and 11 is interposed between the capacitor element 40 and the bottom wall 31. This makes it possible to suppress interference between the electrodes 41 and / or bus bar 50 of the capacitor element 40 and the bottom wall 31. Furthermore, when the extension portion 54 is fitted into the recess 76, the bottom wall-side frame portion 834 is deformed (spring deformation), which prevents stress from concentrating on the electrodes 41 and / or bus bar 50 of the capacitor element 40. Even if the bus bar 50 and the capacitor element 40 are displaced from their predetermined positions in the XY plane, the insulating member 80 interposed between the capacitor element 40 and the side wall 32 can suppress interference between the electrodes 41 and / or bus bar 50 of the capacitor element 40 and the side wall 32.

[0091] (Other embodiments) The disclosure in this specification and drawings, etc. is not limited to the exemplified embodiments. The disclosure encompasses the exemplified embodiments and modifications thereto by those skilled in the art. For example, the disclosure is not limited to the combinations of parts and / or elements shown in the embodiments. The disclosure can be implemented in various combinations. The disclosure can have additional parts that can be added to the embodiments. The disclosure encompasses the omission of parts and / or elements from the embodiments. The disclosure encompasses the substitution or combination of parts and / or elements between one embodiment and another embodiment. The disclosed technical scope is not limited to the description of the embodiments. Some disclosed technical scopes are defined by the claims, and should be interpreted as including all modifications within the meaning and scope equivalent to the claims.

[0092] The disclosure in the specification, drawings, etc. is not limited by the claims. The disclosure in the specification, drawings, etc. encompasses the technical ideas described in the claims, and extends to more diverse and broader technical ideas than the technical ideas described in the claims. Therefore, various technical ideas can be extracted from the disclosure in the specification, drawings, etc. without being bound by the claims.

[0093] When an element or layer is referred to as being "on," "coupled," "connected," or "bonded," it may be directly on, coupled, connected, or bonded to another element or layer, and intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on," "directly coupled," "directly connected," or "directly bonded" to another element or layer, no intervening elements or layers are present. Other terms used to describe relationships between elements should be construed in a similar manner (e.g., "between" vs. "directly between," "adjacent" vs. "directly adjacent," etc.). As used in this specification, the term "and / or" includes any and all combinations of one or more of the associated listed items. That is, reference to A and / or B means at least one of A and B.

[0094] Spatially relative terms such as "inside," "outside," "back," "below," "low," "top," "top," and the like are used herein to facilitate the description of one element or feature's relationship to other elements or features, as illustrated. Spatially relative terms may be intended to encompass different orientations of the device during use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures were turned over, elements described as "below" or "directly below" other elements or features would then be oriented "above" the other elements or features. Thus, the term "bottom" can encompass both an orientation of top and bottom. The device may be otherwise oriented (rotated 90 degrees or at other orientations), and the spatially relative descriptors used in this specification would be interpreted accordingly.

[0095] (Disclosure of technical ideas) This specification discloses multiple technical ideas described in the following multiple clauses. Some clauses may be written in a multiple dependent form, with the subsequent clause referring to the preceding clause as an alternative. Furthermore, some clauses may be written in a multiple dependent form, referring to another multiple dependent clause. These multiple dependent clauses define multiple technical ideas.

[0096] <Technical philosophy 1> A metal case (30) having an opening on one side; a capacitor element (40) housed in the metal case; a bus bar (50) electrically connected to the capacitor element; a cover member (70) including an electrically insulating material, fixed to the metal case, and disposed in the opening; Equipped with the bus bar is fixed to the cover member, The bus bar and the capacitor element are positioned at a predetermined position away from the metal case via the lid member.

[0097] <Technical philosophy 2> The metal case has a bottom wall (31) and a side wall (32) continuous with the bottom wall, The capacitor element has a first electrode (41P) facing the bottom wall and a second electrode (41N) provided on a surface opposite to the first electrode, the bus bars include a first bus bar (50P) connected to the first electrode and a second bus bar (50N) connected to the second electrode, The capacitor module according to Technical Idea 1, wherein only the second bus bar is fixed to the cover member.

[0098] <Technical philosophy 3> the second bus bar has a connection portion (51) with the second electrode and an extension portion (54) extending from the connection portion toward the lid member, The capacitor module according to Technical Concept 2, wherein the cover member has a recess (76) into which the extension portion fits.

[0099] <Technical philosophy 4> The capacitor module according to Technical Idea 3, wherein the extension portion is a bent portion bent relative to the connection portion.

[0100] <Technical philosophy 5> The capacitor module according to Technical Idea 3 or Technical Idea 4, further comprising an insulating member (80) including an electrically insulating material and interposed between the capacitor element and the bottom wall when the bus bar is connected.

[0101] <Technical philosophy 6> The capacitor module according to Technical Idea 5, wherein the insulating member relieves stress in the depth direction of the metal case by deformation.

[0102] <Technical philosophy 7> A capacitor module described in any one of Technical Ideas 3 to 6, wherein the second bus bar has, as the extension portion, a first extension portion (541) whose thickness direction is a first direction different from the depth direction of the metal case, and a second extension portion (542) whose thickness direction is a second direction different from both the depth direction and the first direction.

[0103] <Technical philosophy 8> the first direction is a direction perpendicular to the depth direction, The capacitor module according to Technical Idea 7, wherein the second direction is a direction perpendicular to both the depth direction and the first direction.

[0104] <Technical philosophy 9> The metal case has a bottom wall (31) and a side wall (32) continuous with the bottom wall, a seal (60) disposed in the metal case and sealing the capacitor element and a portion of the bus bar; The capacitor module according to any one of Technical Concepts 1 to 8, wherein the sealing body is in contact with a surface (73) of the lid member that faces the bottom wall. [Explanation of symbols]

[0105] 1... drive system, 2... DC power supply, 3... motor generator, 3a... winding, 4... power conversion circuit, 5... smoothing capacitor, 6... inverter, 7... P line, 8... N line, 9, 9U, 9V, 9W... upper and lower arm circuits, 9H... upper arm, 9L... lower arm, 10... output line, 11... MOSFET, 12... diode, 13... current sensor, 20... power conversion device, 21... cooler, 22, 22U, 22V, 22W... semiconductor module, 221... main body, 222H, 222L... semiconductor element, 223... sealing body, 224N... N terminal, 224O... O terminal, 224P... P terminal, 224S... signal terminal, 23... capacitor module, 24... current sensor, 241... bus bar, 242... main body, 3 0...metal case, 31...bottom wall, 32, 321, 322, 323, 324...side wall, 33...upper end, 40...capacitor element, 41...electrode, 41N...N electrode, 41P...P electrode, 50...bus bar, 50N...N bus bar, 50P...P bus bar, 51...electrode connection portion, 52...terminal portion, 53...connection portion, 54...extension portion, 541...first extension portion, 542...second extension portion Extension portion, 60...sealing body, 70...lid member, 71...lid portion, 72...fixing portion, 73...opposing surface, 74...rear surface, 75...side surface, 76...recess, 80...insulating member, 81...main body portion, 82...extension portion, 83...frame, 831...first frame, 832...second frame, 833...annular frame, 834...bottom wall side frame portion, 835...side wall side frame portion, 84...hole

Claims

1. A metal case (30) having an opening on one side; a capacitor element (40) housed in the metal case; a bus bar (50) electrically connected to the capacitor element; a cover member (70) including an electrically insulating material, fixed to the metal case, and disposed in the opening; Equipped with the bus bar is fixed to the cover member, The bus bar and the capacitor element are positioned at a predetermined position away from the metal case via the lid member.

2. The metal case has a bottom wall (31) and a side wall (32) continuous with the bottom wall, The capacitor element has a first electrode (41P) facing the bottom wall and a second electrode (41N) provided on a surface opposite to the first electrode, The bus bars include a first bus bar (50P) connected to the first electrode and a second bus bar (50N) connected to the second electrode, The capacitor module according to claim 1 , wherein only the second bus bar is fixed to the cover member.

3. the second bus bar has a connection portion (51) with the second electrode and an extension portion (54) extending from the connection portion toward the lid member, The capacitor module according to claim 2, wherein the cover member has a recess (76) into which the extension portion fits.

4. The capacitor module according to claim 3 , wherein the extension portion is a bent portion bent relative to the connection portion.

5. The capacitor module according to claim 3 , further comprising an insulating member (80) that is made of an electrically insulating material and is interposed between the capacitor element and the bottom wall in a state in which the bus bar is connected.

6. The capacitor module according to claim 5 , wherein the insulating member relieves stress in the depth direction of the metal case by deformation.

7. The capacitor module according to any one of claims 3 to 6, wherein the second bus bar has, as the extension portion, a first extension portion (541) whose plate thickness direction is a first direction different from the depth direction of the metal case, and a second extension portion (542) whose plate thickness direction is a second direction different from both the depth direction and the first direction.

8. the first direction is a direction perpendicular to the depth direction, The capacitor module according to claim 7 , wherein the second direction is a direction perpendicular to both the depth direction and the first direction.

9. The metal case has a bottom wall (31) and a side wall (32) continuous with the bottom wall, a seal (60) disposed in the metal case and sealing the capacitor element and a portion of the bus bar; The capacitor module according to any one of claims 1 to 6, wherein the sealing body is in contact with a surface (73) of the lid member that faces the bottom wall.

Images