Information processing apparatus, information processing method, and program

Abstract

To analyze a state of a substrate processing apparatus when a process is not executed.SOLUTION: There is provided an information processing apparatus including an acquisition unit configured to acquire sensor data including a first sensor value and a second sensor value measured in a substrate processing apparatus when the substrate processing apparatus does not execute a process, and a display unit configured to display information indicating a correlation between the first sensor value and the second sensor value.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present disclosure relates to an information processing device, an information processing method, and a program. [Background technology]

[0002] There are known techniques for analyzing time-series data of sensor values ​​measured in substrate processing equipment. For example, Patent Document 1 discloses an information processing device that calculates a monitoring band to be used in a waveform monitoring method from sensor waveform data measured in semiconductor manufacturing equipment that is executing a process according to the same recipe, monitors the sensor waveform data using the monitoring band, and detects signs of abnormality in the semiconductor manufacturing equipment. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2022-3664 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides a technique for analyzing the state of a substrate processing apparatus when no process is being performed. [Means for solving the problem]

[0005] According to one aspect of the present disclosure, there is provided an information processing device comprising: an acquisition unit that acquires sensor data including a first sensor value and a second sensor value measured in a substrate processing device when the substrate processing device is not performing a process; and a display unit that displays information indicating a correlation between the first sensor value and the second sensor value. [Effects of the Invention]

[0006] In one aspect, the state of the substrate processing apparatus can be analyzed when no process is being performed. [Brief explanation of the drawings]

[0007] [Figure 1] 1 is a block diagram showing an example of an overall configuration of a substrate processing system; [Figure 2] FIG. 1 is a cross-sectional view showing an example of a substrate processing apparatus. [Figure 3] FIG. 1 is a plan view showing an example of a substrate processing apparatus. [Figure 4] FIG. 2 is a block diagram illustrating an example of a hardware configuration of a computer. [Figure 5] FIG. 2 is a block diagram illustrating an example of a functional configuration of an analysis device. [Figure 6] FIG. 10 is a diagram showing a first example of an analysis screen. [Figure 7] FIG. 10 is a diagram showing a second example of an analysis screen. [Figure 8] FIG. 10 is a diagram showing a third example of an analysis screen. [Figure 9] 10 is a flowchart illustrating an example of an analysis method. DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In the drawings, the same components are denoted by the same reference numerals, and redundant explanations may be omitted.

[0009] [Embodiment] One embodiment of the present disclosure is a substrate processing system including a substrate processing apparatus that processes a substrate, which is an example of a process target object. In this embodiment, the substrate processing apparatus heat-treats a semiconductor wafer, which is an example of a substrate, in a processing chamber. The substrate processing system also includes an analyzer that analyzes sensor data indicating a sensor value measured by a sensor provided in the substrate processing apparatus.

[0010] A substrate processing apparatus is provided with one or more sensors for measuring the state of the substrate processing apparatus. When the substrate processing apparatus executes a process for processing a substrate, the sensors provided in the substrate processing apparatus measure predetermined sensor values ​​at predetermined time intervals. Time-series data of the sensor values ​​measured by each sensor is stored in a storage device provided in the substrate processing apparatus or in a storage device connected to the substrate processing apparatus via a network.

[0011] There are techniques for displaying sensor values ​​in a time series to analyze the status of a substrate processing apparatus. One known example is a technique for extracting sensor values ​​that satisfy predetermined monitoring conditions and displaying waveform data showing changes in the extracted sensor values ​​over time. This type of technique allows for analysis of long-term trends in sensor values. However, conventional techniques have difficulty analyzing the relationship between one sensor value and another.

[0012] On the other hand, there is a technology for displaying a correlation graph of multiple sensor values ​​in order to analyze the state of a substrate processing apparatus. As an example, a technology for displaying a correlation graph between a sensor value measured during execution of a process recipe and other sensor values ​​is known. A correlation graph is a graph showing the correlation between multiple sensor values ​​by plotting data including multiple sensor values ​​in a low-dimensional space with each of the multiple sensor values ​​as an axis. This type of technology makes it possible to analyze the relationship between multiple sensor values. However, because the conventional technology displays a correlation graph of sensor values ​​measured during process execution, it is not possible to analyze the relationship between multiple sensor values ​​when the process is not being executed.

[0013] The present embodiment aims to analyze the state of a substrate processing apparatus when no process is being performed, and to achieve this, sensor data including a first sensor value and a second sensor value measured in the substrate processing apparatus when no process is being performed is acquired, and information indicating the correlation between the first sensor value and the second sensor value is displayed.

[0014] In one aspect, according to this embodiment, information indicating the correlation between the first sensor value and the second sensor value measured when a process is not being performed is displayed, thereby making it possible to analyze the state of the substrate processing apparatus when a process is not being performed.

[0015] <System configuration> The overall configuration of a substrate processing system according to this embodiment will be described with reference to Fig. 1. Fig. 1 is a block diagram showing an example of the overall configuration of a substrate processing system.

[0016] 1, the substrate processing system 100 includes substrate processing apparatuses 120a1 to 120a3 and controllers 121a1 to 121a3 in a factory a. The substrate processing apparatuses 120a1 to 120a3 and the controllers 121a1 to 121a3 are connected to each other by wire or wirelessly.

[0017] The substrate processing system 100 also includes substrate processing apparatuses 120b1 and 120b2 and controllers 121b1 and 121b2 in a factory b. The substrate processing apparatuses 120b1 and 120b2 and the controllers 121b1 and 121b2 are connected to each other by wire or wirelessly.

[0018] The substrate processing system 100 also includes substrate processing apparatuses 120c1 and 120c2 and controllers 121c1 and 121c2 in a factory c. The substrate processing apparatuses 120c1 and 120c2 and the controllers 121c1 and 121c2 are connected to each other by wire or wirelessly.

[0019] Substrate processing apparatuses 120a1-120a3, substrate processing apparatuses 120b1-120b2, and substrate processing apparatuses 120c1-120c2 are connected to host apparatuses 110a, 110b, and 110c, respectively, via networks N1-N3. Each substrate processing apparatus performs substrate processing under the control of each control device based on instructions from host apparatuses 110a, 110b, and 110c. Host apparatuses 110a, 110b, and 110c are connected to server apparatus 150 via network N4, such as the Internet.

[0020] In the following description, the substrate processing apparatuses 120a1 to 120a3, 120b1, 120b2, 120c1, and 120c2 are also collectively referred to as substrate processing apparatus 120. The control apparatuses 121a1 to 121a3, 121b1, 121b2, 121c1, and 121c2 are also collectively referred to as control apparatus 121. The host apparatuses 110a, 110b, and 110c are also collectively referred to as host apparatus 110.

[0021] It is assumed that the substrate processing apparatuses 120a1 to 120a3, the substrate processing apparatuses 120b1 and 120b2, and the substrate processing apparatuses 120c1 and 120c2 store various data that they manage within themselves.

[0022] The analysis device 140 is connected to the substrate processing apparatuses 120 including the substrate processing apparatus 120a1, and thereby continuously acquires accumulated data accumulated in each of the substrate processing apparatuses 120. The example in Fig. 2 shows the analysis device 140 connected to the substrate processing apparatus 120a1, but this is not limiting. In the present embodiment, the case where the analysis device 140 is connected to the substrate processing apparatus 120a1 will be described below in detail.

[0023] The substrate processing system 100 shown in Fig. 1 is one example, and it goes without saying that there are various system configuration examples depending on the application and purpose. The classification of devices such as the host device 110, substrate processing device 120, control device 121, analysis device 140, and server device 150 shown in Fig. 1 is one example. For example, the number of factories, the number of host devices 110, the number of substrate processing device 120, the number of control devices 121, the number of analysis devices 140, etc. are one example and are not limited to these.

[0024] For example, the substrate processing system 100 can have various configurations, such as a configuration in which at least two of the host device 110, substrate processing apparatus 120, control device 121, analysis device 140, and server device 150 are integrated together, or a configuration in which they are further divided. For example, the control device 121 may be configured to collectively control multiple substrate processing apparatuses 120, or may be provided in a one-to-one correspondence with the substrate processing apparatus 120, or may be integrated with the substrate processing apparatus 120.

[0025] Analysis device 140 may be realized by host device 110 or by server device 150. In this case, analysis device 140 is not necessary. Analysis device 140 may also be realized by control device 121. Analysis device 140 may also be realized by a control device that collectively controls multiple control devices 121.

[0026] <Substrate processing equipment> An example of a substrate processing apparatus according to this embodiment will be described with reference to Figures 2 and 3. Figure 2 is a cross-sectional view showing the example of the substrate processing apparatus. Figure 3 is a plan view showing the example of the substrate processing apparatus.

[0027] 2 and 3 show a vertical heat treatment apparatus 120, which is an example of a substrate treatment apparatus. The vertical heat treatment apparatus 120 is a substrate treatment apparatus that accommodates a large number of semiconductor wafers W, which are an example of objects to be treated, at one time and performs heat treatment such as oxidation, diffusion, and low-pressure CVD (Chemical Vapor Deposition).

[0028] The substrate processing apparatus 120 is housed in a housing 2 that forms the exterior of the apparatus. A carrier transfer region R1 and a wafer transfer region R2 are formed within the housing 2. The carrier transfer region R1 and the wafer transfer region R2 are separated by a partition wall 4. The partition wall 4 is provided with a transfer opening 6 that connects the carrier transfer region R1 and the wafer transfer region R2 and is used to transfer wafers W. The transfer opening 6 is opened and closed by a door mechanism 8 that complies with the FIMS (Front-Opening Interface Mechanical Standard) standard. A drive mechanism for a cover opening and closing device 7 is connected to the door mechanism 8, and the drive mechanism allows the door mechanism 8 to move freely in the front-back and up-down directions, thereby opening and closing the transfer opening 6.

[0029] Hereinafter, the arrangement direction of the carrier transport region R1 and the wafer transport region R2 will be referred to as the front-to-back direction (corresponding to the second horizontal direction in Figure 3), and the horizontal direction perpendicular to the front-to-back direction will be referred to as the left-to-right direction (corresponding to the first horizontal direction in Figure 3).

[0030] The carrier transfer region R1 is an area under atmospheric conditions. The carrier transfer region R1 is an area where a carrier C storing a wafer W is transferred between elements (described later) within the substrate processing apparatus 120, where the carrier C is transferred into the substrate processing apparatus 120 from the outside, or where the carrier C is transferred out of the substrate processing apparatus 120 to the outside. The carrier C may be, for example, a front-opening unified pod (FOUP). By maintaining a predetermined level of cleanliness within the FOUP, it is possible to prevent adhesion of foreign matter and formation of a natural oxide film on the surface of the wafer W. The carrier transfer region R1 is composed of a first transfer region 10 and a second transfer region 12 located behind the first transfer region 10 (on the wafer transfer region R2 side).

[0031] The first transfer region 10 is provided with, for example, two load ports 14 arranged vertically (see FIG. 2 ), with two load ports 14 on each tier (see FIG. 3 ). The load ports 14 are loading platforms that receive carriers C when they are loaded into the substrate processing apparatus 120. The load ports 14 are provided in open areas of the walls of the housing 2, allowing access to the substrate processing apparatus 120 from the outside. Specifically, a transfer device (not shown) provided outside the substrate processing apparatus 120 can load and place carriers C onto the load ports 14 and unload carriers C from the load ports 14 to the outside. Since the load ports 14 are provided with, for example, two tiers, vertically, carriers C can be loaded and unloaded from both tiers. A stocker 16 may be provided in the lower tier of the load port 14 to store carriers C. Positioning pins 18 for positioning carriers C are provided, for example, at three locations, on the surface of the load port 14 where the carriers C are placed. Furthermore, the load port 14 may be configured to be movable in the front-rear direction when the carrier C is placed on the load port 14.

[0032] Two FIMS ports 24 (see FIG. 2) are arranged vertically below the second transfer region 12. The FIMS ports 24 are holders that hold the carriers C when the wafers W in the carriers C are loaded into and unloaded from a heat treatment furnace 80 (described later) in the wafer transfer region R2. The FIMS ports 24 are configured to be movable in the front-to-rear direction. Similar to the load port 14, the surface of the FIMS port 24 on which the carriers C are placed has positioning pins 18 at three locations for positioning the carriers C.

[0033] A stocker 16 for storing carriers C is provided above the second transport area 12. The stocker 16 is composed of, for example, three shelves, and each shelf can hold two or more carriers C in the left-right direction. The stocker 16 may also be arranged in an area below the second transport area 12 where no carrier placement table is located.

[0034] Between the first transfer area 10 and the second transfer area 12, a carrier transfer mechanism 30 is provided to transfer the carrier C between the load port 14, the stocker 16, and the FIMS port 24.

[0035] The carrier transport mechanism 30 includes a first guide 31, a second guide 32, a moving unit 33, an arm unit 34, and a hand unit 35. The first guide 31 is configured to extend in the vertical direction. The second guide 32 is connected to the first guide 31 and configured to extend in the left-right direction (first horizontal direction). The moving unit 33 is configured to move in the left-right direction while being guided by the second guide 32. The arm unit 34 has one joint and two arms, and is provided on the moving unit 33. The hand unit 35 is provided at the tip of the arm unit 34. The hand unit 35 has pins 18 at three locations for positioning the carrier C.

[0036] The wafer transfer region R2 is a region where wafers W are removed from the carrier C and subjected to various processes. The wafer transfer region R2 is filled with an inert gas atmosphere, such as a nitrogen (N2) gas atmosphere, to prevent an oxide film from being formed on the wafers W. A vertical heat treatment furnace 80 having an opening at the bottom as a furnace port is provided in the wafer transfer region R2.

[0037] The heat treatment furnace 80 has a cylindrical quartz processing vessel 82 capable of accommodating wafers W and for performing heat treatment on the wafers W. A cylindrical heater 81 is disposed around the processing vessel 82, and the wafers W are heat-treated by the heater 81. A shutter (not shown) is provided below the processing vessel 82. The shutter is a door for covering the bottom end of the heat treatment furnace 80 after a wafer boat 50 is unloaded from the heat treatment furnace 80 and until the next wafer boat 50 is loaded. Below the heat treatment furnace 80, the wafer boat 50, which is a substrate holder, is placed on a lid 54 via a heat-retaining cylinder 52. In other words, the lid 54 is provided below the wafer boat 50 as a single unit.

[0038] The wafer boat 50 is made of, for example, quartz, and is configured to hold large-diameter (for example, 300 mm or 450 mm diameter) wafers W substantially horizontally at a predetermined interval in the vertical direction. The number of wafers W accommodated in the wafer boat 50 is not particularly limited, but may be, for example, 50 to 200. The lid 54 is supported by an elevator mechanism (not shown), and the elevator mechanism loads the wafer boat 50 into and out of the heat treatment furnace 80. A wafer transfer device 60 is provided between the wafer boat 50 and the transfer port 6.

[0039] The wafer transfer device 60 transfers wafers W between the carrier C held on the FIMS port 24 and the wafer boat 50. The wafer transfer device 60 includes a guide mechanism 61, a moving body 62, a fork 63, a lifting mechanism 64, and a rotation mechanism 65. The guide mechanism 61 is rectangular parallelepiped-shaped. The guide mechanism 61 is attached to a vertically extending lifting mechanism 64, and is configured to be movable vertically by the lifting mechanism 64 and to be rotatable by the rotation mechanism 65. The moving body 62 is mounted on the guide mechanism 61 so as to be movable back and forth along the longitudinal direction. The forks 63 are transfer devices attached via the moving body 62, and multiple forks 63 (e.g., five forks) are provided. By including multiple forks 63, multiple wafers W can be transferred simultaneously, thereby reducing the time required to transfer the wafers W. However, the number of forks 63 may be one.

[0040] A filter unit (not shown) may be provided on the ceiling or sidewall of the wafer transfer region R2. Examples of the filter unit include a HEPA (High Efficiency Particulate Air Filter) and a ULPA (Ultra-Low Penetration Air Filter). By providing the filter unit, clean air can be supplied to the wafer transfer region R2.

[0041] <Computer> The host device 110, the control device 121, the analysis device 140, and the server device 150 included in the substrate processing system 100 shown in Fig. 1 are realized by a computer having a hardware configuration such as that shown in Fig. 4. Fig. 4 is a block diagram showing an example of the hardware configuration of a computer.

[0042] 4, the computer 500 includes an input device 501, an output device 502, an external I / F (interface) 503, a RAM (random access memory) 504, a ROM (read only memory) 505, a CPU (central processing unit) 506, a communication I / F 507, and an HDD (hard disk drive) 508, all of which are interconnected by a bus B. The input device 501 and the output device 502 may be connected and used when necessary.

[0043] The input device 501 is a keyboard, mouse, touch panel, etc., and is used by an operator or the like to input various operation signals. The output device 502 is a display, etc., and displays the results of processing by the computer 500. The communication I / F 507 is an interface that connects the computer 500 to a network. The HDD 508 is an example of a non-volatile storage device that stores programs and data.

[0044] The external I / F 503 is an interface with an external device. The computer 500 can read and / or write data from and to a recording medium 503a such as an SD (Secure Digital) memory card via the external I / F 503. The ROM 505 is an example of a non-volatile semiconductor memory (storage device) that stores programs and data. The RAM 504 is an example of a volatile semiconductor memory (storage device) that temporarily stores programs and data.

[0045] The CPU 506 is a computing device that controls the entire computer 500 and realizes its functions by reading programs and data from storage devices such as the ROM 505 and HDD 508 onto the RAM 504 and executing the processes.

[0046] <Functional configuration> The functional configuration of analysis device 140 will be described with reference to Fig. 5. Fig. 5 is a block diagram showing an example of the functional configuration of the analysis device.

[0047] 5, analysis device 140 includes an acquisition unit 210, a selection unit 220, a generation unit 230, and a display unit 240. Analysis device 140 functions as acquisition unit 210, selection unit 220, generation unit 230, and display unit 240 by executing a pre-installed analysis program.

[0048] For example, the acquisition unit 210, the selection unit 220, the generation unit 230, and the display unit 240 are realized by the CPU 506 shown in FIG.

[0049] The acquiring unit 210 acquires sensor data generated in the substrate processing apparatus 120. The sensor data is time-series data indicating sensor values ​​measured by sensors provided in the substrate processing apparatus 120. In the present embodiment, the sensor data includes two or more time-series data measured by two or more sensors provided in the substrate processing apparatus 120.

[0050] The sensor data may include sensor values ​​measured during a process execution period and sensor values ​​measured outside the process execution period. The process execution period is a time period during which the substrate processing apparatus 120 executes a process for processing a workpiece. The period outside the process execution period is a time period during which the substrate processing apparatus 120 does not execute a process for processing a workpiece, i.e., a time period other than the process execution period.

[0051] The process may include at least one or more steps. The sensor data may include one piece of time-series data recorded through multiple processes for each sensor provided in the substrate processing apparatus 120, or may include multiple pieces of time-series data recorded for each process or step.

[0052] In this embodiment, the sensor data may include, for example, the power of the heater 81 that heats the processing vessel 82 and the temperature inside the processing vessel 82. The heater 81 heats the processing vessel 82 so that the temperature inside the processing vessel 82 remains constant even outside the process execution period in order to prevent liquefaction of the gas inside the processing vessel 82. The heater 81 may be attached or detached for maintenance of the substrate processing apparatus 120, for example. There is a certain relationship between the power of the heater 81 and the temperature inside the processing vessel 82. By analyzing the relationship between the power of the heater 81 and the temperature inside the processing vessel 82 outside the process execution period, it is possible to detect, for example, improper installation of the heater or deterioration of the heater.

[0053] In this embodiment, the sensor data may include, for example, the flow rate of purge gas into the wafer transfer region R2, which transfers wafers W to the processing vessel 82, and the pressure within the wafer transfer region R2. The transfer port 6, through which a carrier C containing wafers W is transferred to the wafer transfer region R2, is opened and closed by a door mechanism 8 conforming to the FIMS standard. There is a fixed relationship between the flow rate of purge gas into the wafer transfer region R2 and the pressure within the wafer transfer region R2. However, if the sealing of the transfer port 6 decreases, the pressure within the wafer transfer region R2 decreases. Because purge gas is introduced into the wafer transfer region R2 before and after a process is performed, the relationship between the gas flow rate and pressure within the wafer transfer region R2 cannot be accurately analyzed using sensor data measured during the process. By analyzing the relationship between the gas flow rate and pressure within the wafer transfer region R2 outside of the process, it is possible to detect, for example, the need for adjustment or repair of the door mechanism 8.

[0054] Selector 220 selects sensor data including a first sensor value and sensor data indicating a second sensor value from the sensor data acquired by acquirer 210. Selector 220 may select sensor data including the first sensor value or the second sensor value specified by a user of analysis device 140.

[0055] The selection unit 220 may select sensor data that satisfies predetermined monitoring conditions. The monitoring conditions may include conditions for the first sensor value. The monitoring conditions may include a method for aggregating the first sensor value. A plurality of monitoring conditions may be determined in advance. The monitoring condition may be specified by a user of the analysis device 140. The selection unit 220 may select sensor data that satisfies one monitoring condition selected by the user of the analysis device 140 from the plurality of monitoring conditions.

[0056] The selection unit 220 may select a method for aggregating the second sensor values. The selection unit 220 may select a aggregation method selected by a user of the analysis device 140 from a plurality of predetermined aggregation methods. The aggregation method may be a method for aggregating a representative value of a plurality of sensor values ​​included in a predetermined time unit. The aggregation method may include, for example, at least one of a start point, an end point, a maximum value, a minimum value, an average value, or a standard deviation. The start point is the first value of the time series data corresponding to each time unit. The end point is the last value of the time series data corresponding to each time unit. The average value may be, for example, an arithmetic mean. The standard deviation may be, for example, 3σ.

[0057] The generating unit 230 generates correlation data indicating the correlation between the first sensor value and the second sensor value selected by the selecting unit 220. The correlation data may include a correlation graph. The generating unit 230 may generate the correlation graph by plotting the sensor data on a plane (i.e., two-dimensional space) with the first sensor value and the second sensor value as axes.

[0058] The correlation data may include an evaluation index based on the correlation graph. The evaluation index may include an approximation line of the correlation graph. The evaluation index may include a correlation coefficient or a coefficient of determination of the correlation graph. The evaluation index may include any index that indicates the accuracy of the approximation line.

[0059] When plotting the sensor data, the generation unit 230 may calculate a representative value for each sensor value in a predetermined time unit. The predetermined time unit may be a time interval divided by a predetermined time length. For example, the predetermined time length may be determined in units of seconds, minutes, hours, days, etc. For example, within a process execution period, the predetermined time unit may be a time interval during which one process or step is executed.

[0060] The generating unit 230 may calculate a representative value of the first sensor values ​​using a counting method determined by the monitoring conditions. The generating unit 230 may calculate a representative value of the second sensor values ​​using a counting method selected by the selecting unit 220.

[0061] The display unit 240 displays the correlation data generated by the generation unit 230. The display unit 240 may display an analysis screen including the correlation data on a display, which is an example of the output device 502. The display unit 240 may transmit screen data including the correlation data to another information processing device such as the control device 121, a host device, or a server device, and display the analysis screen on a display of the other information processing device.

[0062] The analysis screen may display a correlation graph between the first sensor value and the second sensor value. The analysis screen may display an evaluation index of the correlation graph together with the correlation graph. The analysis screen may display at least one of the first sensor value or the second sensor value for each plot on the correlation graph. The analysis screen may display a time series graph showing the waveform of the first sensor value or the second sensor value. Note that the time series graph is a graph showing the change in the sensor value over time by plotting the sensor value in a low-dimensional space (for example, a plane) with the sensor value and time as axes.

[0063] The analysis screen may include a screen component for selecting at least one of the analysis conditions. The analysis conditions may include, for example, at least one of a monitoring item, a second sensor value, or a method for aggregating the second sensor values. The monitoring item is an item for selecting a first sensor value corresponding to a predetermined monitoring condition. For example, the analysis screen may include a display area for selectably displaying the monitoring item. For example, the analysis screen may include a display area for selectably displaying the second sensor value and its aggregation method. For example, the analysis screen may include a selection area for selecting a selectable second sensor value and its aggregation method.

[0064] The functional configuration of the analysis device 140 shown in Fig. 5 is one example, and it goes without saying that there are various examples of functional configurations depending on the application and purpose. The division of processing units such as the acquisition unit 210, selection unit 220, generation unit 230, and display unit 240 shown in Fig. 5 is one example. For example, at least two of the acquisition unit 210, selection unit 220, generation unit 230, and display unit 240 may be integrated into one processing unit. Furthermore, for example, at least one of the acquisition unit 210, selection unit 220, generation unit 230, and display unit 240 may be divided into multiple processing units.

[0065] <Analysis screen> The analysis screen displayed by analysis device 140 will be described with reference to FIGS.

[0066] Fig. 6 is a diagram showing a first example of an analysis screen. Fig. 6 shows an example of an analysis screen 600 that displays a time series graph of a first sensor value corresponding to a monitoring item. As shown in Fig. 6, the analysis screen 600 has a monitoring item selection section 601, a graph display section 602, a data display section 603, and a correlation display button 604.

[0067] The monitor item selection unit 601 displays a list of selectable monitor items. The monitor item selection unit 601 may display the monitor items in a hierarchical structure based on the type of first sensor value. The monitor item selection unit 601 accepts a selection of monitor items by the user. The monitor item selection unit 601 may accept the selection of only one monitor item. Note that FIG. 6 shows the monitor items selected by the monitor item selection unit 601 in a shaded area. FIG. 6 shows an example of the monitor item selection unit 601 in which the monitor item "Heater Power: In Deposition: Z1 - BTM Temperature Power mean [%]" has been selected.

[0068] The graph display unit 602 displays a time series graph of the first sensor value. The graph display unit 602 may display a time series graph of the first sensor value corresponding to the monitoring item selected in the monitoring item selection unit 601. Fig. 6 shows an example of the graph display unit 602 displaying a time series graph of the monitoring item selected in the monitoring item selection unit 601.

[0069] The graph display unit 602 may have a range setting unit 605 that sets the time range to be displayed in the time series graph. The graph display unit 602 may be a screen component (for example, a slider bar) that allows setting the start time and end time of the sensor value to be displayed.

[0070] The data display unit 603 displays information related to the sensor data. When a point of sensor data is selected in the graph display unit 602, the data display unit 603 may display information related to the selected sensor data. The data display unit 603 may display items such as the device, start time, end time, start recipe, start step, end recipe, and end step, for example.

[0071] The correlation display button 604 is a button for starting the display of correlation data. When the user presses the correlation display button 604, an analysis screen for selecting the second sensor value and its aggregation method is launched.

[0072] Fig. 7 is a diagram showing a second example of the analysis screen. Fig. 7 shows an example of an analysis screen 610 for selecting a second sensor value and a counting method. As shown in Fig. 7, the analysis screen 610 has a monitoring item display section 611, a sensor selection section 612, an OK button 613, and a cancel button 614.

[0073] The monitoring items are displayed in the monitoring item display section 611. The monitoring item display section 611 may display the monitoring items selected in the monitoring item selection section 601 on the analysis screen 600.

[0074] The sensor selection unit 612 displays a list of selectable second sensor values. The sensor selection unit 612 accepts a selection of a second sensor value by the user. The sensor selection unit 612 may accept a selection of multiple second sensor values. Note that FIG. 7 shows the selected second sensor values ​​in a shaded area. FIG. 7 shows an example of the sensor selection unit 612 in which seven second sensor values ​​have been selected.

[0075] The sensor selection unit 612 may display a selectable aggregation method for each second sensor value to be displayed. The sensor selection unit 612 may accept a selection of multiple aggregation methods for each second sensor value. For example, FIG. 7 shows that maximum value (Max), minimum value (Min), and average value (Ave) have been selected as aggregation methods for "CTR-4 Temperature (Set)."

[0076] The OK button 613 is a button for displaying correlation data. When the user presses the OK button 613, an analysis screen for displaying correlation data based on the second sensor value and aggregation method selected on the analysis screen 610 is launched.

[0077] The cancel button 614 is a button for interrupting the display of the correlation data. When the user presses the cancel button 614, the analysis screen 610 closes and the screen returns to the analysis screen 600.

[0078] Fig. 8 is a diagram showing a third example of the analysis screen. Fig. 8 shows an example of an analysis screen 620 that displays correlation data between a first sensor value and a second sensor value. As shown in Fig. 8, the analysis screen 620 has an X-axis selection section 621, a Y-axis selection section 622, a graph display section 623, a data display section 624, and an export button 625.

[0079] The X-axis selection unit 621 accepts the selection of the X-axis of the correlation graph. The Y-axis selection unit 622 accepts the selection of the Y-axis of the correlation graph. The X-axis selection unit 621 may display a list of the monitoring items displayed in the monitoring item selection unit 601 of the analysis screen 600 as options for the X-axis. The Y-axis selection unit 622 may display a list of the second sensor values ​​and aggregation methods selected on the analysis screen 610 as options for the Y-axis. The X-axis selection unit 621 and the Y-axis selection unit 622 may display the monitoring items and the selected second sensor values ​​together as options for each axis. In this case, the X-axis selection unit 621 and the Y-axis selection unit 622 may be controlled so that the same option cannot be selected.

[0080] The graph display section 623 displays a correlation graph between the sensor value selected in the X-axis selection section 621 and the sensor value selected in the Y-axis selection section 622. For example, Fig. 8 shows a correlation graph with "Heater Power: In Deposition: Z1 - BTM Temperature Power mean [%]", an example of a monitoring item, on the X-axis and "Top Temperature (Act): Start 1 Point", an example of a second sensor value, on the Y-axis.

[0081] The graph display section 623 may display an approximate line 626. The graph display section 623 displays a coefficient of determination 627 (R 2 ) may be displayed. The graph display unit 623 may display detailed data 628 of each plot. The detailed data 628 may be displayed as a tooltip, for example. That is, the detailed data 628 may be displayed as a pop-up near a plot when the plot is selected or when a cursor is superimposed on the plot.

[0082] The data display section 624 displays information about the sensor data. When a point of sensor data is selected in the graph display section 623, the data display section 624 may display information about the selected sensor data. The display items of the data display section 624 may be the same as those of the data display section 603 of the analysis screen 600.

[0083] The export button 625 is a button for exporting correlation data. When the user presses the export button 625, the correlation data is output in a predetermined file format. The file format for exporting the correlation data may be, for example, a CSV (Comma Separated Value) format, an Excel (registered trademark) format, an XML (Extensible Markup Language) format, or a JSON (JavaScript Object Notation) format. The export button 625 may display a dialog box for selecting a save location and a file format before exporting the correlation data.

[0084] <Processing Procedure> The analysis method executed by the substrate processing system 100 will be described with reference to Fig. 9. Fig. 9 is a flowchart showing an example of the analysis method.

[0085] In step S1, the acquisition unit 210 of the analysis device 140 acquires sensor data generated by the substrate processing apparatus 120. The sensor data includes multiple time-series data indicating multiple sensor values ​​measured by multiple sensors provided in the substrate processing apparatus 120. The sensor data includes sensor values ​​measured during a process execution period and sensor values ​​measured outside the process execution period. The acquisition unit 210 sends the acquired sensor data to the selection unit 220.

[0086] In step S2, the selection unit 220 of the analysis device 140 receives the sensor data from the acquisition unit 210. The selection unit 220 requests the display unit 240 to display an analysis screen. The display unit 240 displays the analysis screen on a display. The analysis screen displays a list of monitoring items in a selectable manner. In response to a user operation on the analysis screen, the selection unit 220 selects sensor data including a first sensor value corresponding to the monitoring item specified by the user. The selection unit 220 sends the sensor data including the first sensor value to the generation unit 230.

[0087] In step S3, the selection unit 220 of the analysis device 140 selects sensor data including the second sensor value specified by the user in response to the user's operation on the analysis screen. The selection unit 220 also selects a method for aggregating the second sensor value specified by the user in response to the user's operation on the analysis screen. The selection unit 220 sends the sensor data including the second sensor value and information indicating the method for aggregating the second sensor value to the generation unit 230.

[0088] In step S4, generation unit 230 of analysis device 140 receives sensor data including the first sensor value, sensor data including the second sensor value, and information indicating a method for aggregating the second sensor value from selection unit 220. Generation unit 230 calculates a representative value of the second sensor value based on the sensor data indicating the second sensor value and the method for aggregating the second sensor value. Generation unit 230 generates correlation data between the first sensor value and the second sensor value based on the sensor data including the first sensor value and the representative value of the second sensor value. Generation unit 230 sends the generated correlation data to display unit 240.

[0089] In step S5, the display unit 240 of the analysis device 140 receives the correlation data from the generation unit 230. The display unit 240 displays the correlation data on the analysis screen. The display unit 240 may display a correlation graph between the first sensor value and the second sensor value on the analysis screen. The display unit 240 may display an evaluation index based on the correlation graph together with the correlation graph.

[0090] In step S6, the display unit 240 of the analysis device 140 determines whether or not to change the analysis conditions. Specifically, the display unit 240 determines whether or not an operation to reselect at least one of the monitoring item, the second sensor value, or the aggregation method has been performed on the analysis screen. If an operation to reselect at least one of the monitoring item, the second sensor value, or the aggregation method has been performed, the display unit 240 determines that the analysis conditions should be changed. On the other hand, if an operation to reselect the sensor data, the second sensor value, or the aggregation method has not been performed, the display unit 240 determines that the analysis conditions should not be changed.

[0091] If the display unit 240 determines that the analysis conditions are to be changed (YES), the process returns to step S2. On the other hand, if the display unit 240 determines that the analysis conditions are not to be changed (NO), the process of the analysis method ends.

[0092] When the process returns to step S2, analysis device 140 executes the processes from step S2 to step S6 again based on the monitoring item, second sensor value, and aggregation method selected on the analysis screen. As a result, the analysis screen repeatedly displays the correlation data between the first sensor value and the second sensor value every time at least one of the monitoring item, second sensor value, and aggregation method is reselected.

[0093] <Effects of the embodiment> The analysis device 140 according to this embodiment acquires sensor data including a first sensor value and a second sensor value measured by the substrate processing apparatus 120 when the substrate processing apparatus 120 is not executing a process, and displays information indicating a correlation between the first sensor value and the second sensor value. In one aspect, according to this embodiment, the correlation between the multiple sensor values ​​measured when the process is not being executed is displayed, so that the state of the substrate processing apparatus when the process is not being executed can be analyzed.

[0094] The information indicating the correlation may include a correlation graph between the first sensor value and the second sensor value. The information indicating the correlation may include an approximation line of the correlation graph. According to one aspect, the present embodiment makes it possible to display the correlation between the first sensor value and the second sensor value in an easy-to-understand manner.

[0095] The analysis device 140 may select sensor data including a first sensor value that satisfies a predetermined condition. The analysis device 140 may select sensor data including a second sensor value specified by a user. The analysis device 140 may display information regarding the correlation between the first sensor value and the second sensor value aggregated using an aggregation method specified by the user. In one aspect, according to this embodiment, the correlation of sensor values ​​desired by the user can be analyzed using any aggregation method.

[0096] The first sensor value may be a heater power for heating the processing vessel. The second sensor value may be an internal temperature of the processing vessel. According to one aspect, the present embodiment can analyze the relationship between the heater power and the internal temperature of the processing vessel outside of the process execution period.

[0097] The first sensor value may be a gas flow rate to a transfer region that transfers the workpiece to the processing vessel. The second sensor value may be a pressure inside the transfer region. In one aspect, according to this embodiment, the relationship between the gas flow rate and pressure in the transfer region outside of the process execution period can be analyzed.

[0098] [Other embodiments] The substrate processing apparatus for performing processes including the substrate processing method of the present disclosure is not limited to thermal processing apparatuses, and any type of apparatus such as atomic layer deposition (ALD) apparatus, capacitively coupled plasma (CCP), inductively coupled plasma (ICP), radial line slot antenna (RLSA), electron cyclotron resonance plasma (ECR), or helicon wave plasma (HWP) can be used as the substrate processing apparatus.

[0099] Furthermore, the substrate processing apparatus of the present disclosure can be applied to both plasma-using and non-plasma-using apparatuses that perform predetermined processing on substrates (e.g., film formation processing, etching processing, etc.). The substrate processing apparatus of the present disclosure can be applied to any of single-wafer apparatuses that process substrates one by one, batch apparatuses that process multiple substrates at once, and semi-batch apparatuses that process a smaller number of substrates at once than the number processed at once by a batch apparatus.

[0100] The information processing apparatus and substrate processing apparatus according to the presently disclosed embodiments are illustrative in all respects and are not limiting. The embodiments may be modified and improved in various ways without departing from the spirit and scope of the appended claims. The matters described in the above-described embodiments may be configured differently within a consistent range, and may be combined within a consistent range. [Explanation of symbols]

[0101] 100: Substrate processing system 110: Host device 120: Substrate processing equipment 121: Control device 140:Analysis equipment 150: Server device 210: Acquisition Department 220: Selection section 230: Generation part 240: Display section

Claims

1. an acquiring unit configured to acquire sensor data including a first sensor value and a second sensor value measured in the substrate processing apparatus when the substrate processing apparatus is not performing a process; a display unit configured to display information indicating a correlation between the first sensor value and the second sensor value; An information processing device comprising:

2. the information indicating the correlation includes a correlation graph between the first sensor value and the second sensor value; The information processing device according to claim 1 .

3. the information indicating the correlation includes an approximation line of the correlation graph or a coefficient of determination of the correlation graph; The information processing device according to claim 2 .

4. a selection unit configured to select the sensor data including the first sensor value that satisfies a predetermined condition; The information processing device according to claim 1 .

5. the selection unit is configured to select the sensor data including the second sensor value specified by a user. The information processing device according to claim 4 .

6. the display unit is configured to display information regarding a correlation between the second sensor value aggregated by the aggregation method designated by the user and the first sensor value. The information processing device according to claim 5 .

7. the first sensor value is power of a heater that heats a processing vessel; the second sensor value is a temperature inside the processing vessel; 7. The information processing device according to claim 1.

8. the first sensor value is a gas flow rate to a transfer region that transfers a workpiece to a processing vessel; the second sensor value is a pressure within the transport region; 7. The information processing device according to claim 1.

9. The computer acquiring sensor data including a first sensor value and a second sensor value measured in the substrate processing apparatus when the substrate processing apparatus is not performing a process; displaying information indicating a correlation between the first sensor value and the second sensor value; An information processing method that performs the above.

10. On the computer, acquiring sensor data including a first sensor value and a second sensor value measured in the substrate processing apparatus when the substrate processing apparatus is not performing a process; displaying information indicating a correlation between the first sensor value and the second sensor value; A program to execute.

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