Display device

Abstract

To provide a high-quality large-area multi-module display device and a method of manufacturing the same.SOLUTION: According to an aspect of the present invention, there is provided a display device including: a plurality of display modules each including a module substrate and a plurality of light emitting devices mounted on the module substrate; and a support substrate on which the plurality of display modules are disposed. At least one end of each of the module substrates may be provided with a recess recessed from the end of the module substrate and connection electrodes provided in the recess, and the light emitting devices may be electrically connected to the wirings on the support substrate through the connection electrodes.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to displays, and more particularly to large area, multi-module displays. [Background technology]

[0002] Recently, display devices using light emitting diodes (LEDs) have been developed. Display devices using LEDs are obtained by forming red (R), green (G), and blue (B) light emitting diode (LED) structures that are individually grown on a final substrate.

[0003] However, in addition to the demand for high-resolution, full-color display devices, the demand for display devices with various areas, especially large areas, is also continuously increasing. Summary of the Invention [Problem to be solved by the invention]

[0004] The present invention provides a high quality large area multi-module display and a method for manufacturing the same. [Means for solving the problem]

[0005] A display device according to an embodiment of the present invention includes a plurality of display modules, each including a module substrate and a plurality of light-emitting elements mounted on the module substrate, and a support substrate on which the plurality of display modules are disposed, wherein at least one end of each of the module substrates is provided with a recess recessed from an end of the module substrate and connection electrodes provided in the recess, and each of the light-emitting elements is electrically connected to a corresponding wiring on the support substrate via each of the connection electrodes.

[0006] In one embodiment of the present invention, when two adjacent module substrates among the module substrates are defined as first and second module substrates, at least one of the first and second module substrates may have a plurality of recesses at at least one end, and at least one of the first and second module substrates may have protrusions at at least one end thereof that protrude toward the recesses at positions corresponding to the plurality of recesses.

[0007] In one embodiment of the present invention, the recessed portion may have a triangular, semicircular, or semi-elliptical shape when viewed in a plane.

[0008] In one embodiment of the present invention, each of the first and second module substrates may have the recess and the protrusion at at least one end.

[0009] In one embodiment of the present invention, each of the connection electrodes may fill the recess.

[0010] In one embodiment of the present invention, the display device may further include a protective material for protecting recesses at one end of the first and second module substrates, and the connecting electrodes may be provided between the recessed portion surfaces and the protective material.

[0011] In one embodiment of the present invention, the module may further include connection wires provided on an upper surface of the module substrate and connected to the connection electrodes, and back connection wires provided on a lower surface of the module substrate and connected to the connection electrodes, and the back connection wires may be connected to the support substrate in a ball grid array (BGA) manner or by a conductive adhesive member.

[0012] In one embodiment of the present invention, the support substrate may have a conductive electrode portion provided on a surface facing the module substrate, and the connection electrode may contact the conductive electrode portion through the rear connection wiring.

[0013] In one embodiment of the present invention, the number of the connection electrodes may correspond to the number of the light emitting devices so as to drive the light emitting devices.

[0014] In one embodiment of the present invention, the module substrate may include a pixel region where the light emitting elements are provided and an image is displayed, and a non-pixel region surrounding the pixel region, and some or all of the connecting wires may be provided in the pixel region. The recesses may be provided in the non-pixel region. In one embodiment of the present invention, the recesses may be disposed along an edge of the module substrate.

[0015] A display device according to an embodiment of the present invention may be manufactured by manufacturing a plurality of display modules and providing the plurality of display modules on a support substrate, wherein manufacturing each of the plurality of display modules may include forming a recess in at least one end of a module substrate, forming connection electrodes in the recess, forming light emitting elements on the module substrate, and forming a driving circuit unit on a lower surface of the module substrate and electrically connecting the light emitting elements to the driving circuit unit via the connection electrodes.

[0016] In one embodiment of the present invention, the recessed portion may be formed by using a laser or by cutting using a tool such as a saw.

[0017] In one embodiment of the present invention, the step of forming each connecting electrode may include the steps of: forming a conductive film on a side surface of at least one end of the module substrate in which the recess is formed; and polishing the side surface of at least one end of the module substrate to remove the conductive film formed on the side surface of the one end excluding the recess.

[0018] In one embodiment of the present invention, the steps of forming a recess in at least one end of the module substrate and forming each connecting electrode in the recess may be performed simultaneously on a plurality of module substrates after arranging the plurality of module substrates adjacent to each other.

[0019] In an embodiment of the present invention, the method for manufacturing a display device may further include forming connection wires and rear connection wires on the upper and lower surfaces of the module substrate, respectively.

[0020] In an embodiment of the present invention, the method for manufacturing a display device may further include forming a protrusion on at least one end of the module substrate.

[0021] In an embodiment of the present invention, when the plurality of display modules are provided on the support substrate, the protrusions may be disposed to correspond to positions corresponding to the recesses. [Effects of the Invention]

[0022] According to an embodiment of the present invention, it is possible to provide a large-area display device in which problems such as image separation and dark lines appearing in an image are minimized. [Brief explanation of the drawings]

[0023] [Figure 1] FIG. 1 is a perspective view schematically showing a display device according to an embodiment of the present invention. [Figure 2] FIG. 2 is a plan view showing a portion corresponding to P1 in FIG. [Figure 3] FIG. 3 is a perspective view conceptually showing one corner of a display module of a display device according to an embodiment of the present invention. [Figure 4a] FIG. 4a is a cross-sectional view taken along line AA' in FIG. 3, showing examples according to an embodiment of the present invention. [Figure 4b] FIG. 4b is a cross-sectional view taken along line AA' in FIG. 3, illustrating each embodiment according to an embodiment of the present invention. [Figure 5] FIG. 5 is a cross-sectional view showing a simplified light emitting device according to an embodiment of the present invention. [Figure 6]FIG. 6 is a diagram illustrating a connection relationship on the rear surface of a display device according to an embodiment of the present invention when a driving circuit unit is separately provided on the lower surface of a module substrate. [Figure 7a] 7a to 7d are plan views sequentially illustrating a method of manufacturing a display device according to an embodiment of the present invention. [Figure 7b] 7a to 7d are plan views sequentially illustrating a method of manufacturing a display device according to an embodiment of the present invention. [Figure 7c] 7a to 7d are plan views sequentially illustrating a method of manufacturing a display device according to an embodiment of the present invention. [Figure 7d] 7a to 7d are plan views sequentially illustrating a method of manufacturing a display device according to an embodiment of the present invention. [Figure 8] FIG. 8 is a perspective view conceptually showing how the display module is assembled onto the support substrate. [Figure 9] FIG. 9 is a perspective view conceptually showing how recesses are simultaneously formed in a plurality of module substrates. [Figure 10] FIG. 10 is a plan view showing the shape of the recessed portion according to an embodiment of the present invention. [Figure 11] FIG. 11 is a plan view showing the shape of each of the connecting electrodes according to one embodiment of the present invention. [Figure 12a] FIG. 12a is a plan view illustrating the relationship between two adjacent display modules in one embodiment of the present invention. [Figure 12b] FIG. 12b is a plan view illustrating the relationship between two adjacent display modules in one embodiment of the present invention. [Figure 12c] FIG. 12c is a plan view illustrating the relationship between two adjacent display modules in one embodiment of the present invention. [Figure 13] FIG. 13 is a structural diagram showing a display device according to an embodiment of the present invention. [Figure 14]FIG. 14 is a plan view showing that light emitting elements are arranged in a different manner from the above-described embodiment in accordance with an embodiment of the present invention, and shows a portion corresponding to P1 in FIG. [Figure 15a] FIG. 15a is a plan view showing that, in one embodiment of the present invention, the light emitting elements are arranged in a different form from the above-described embodiment, and shows a portion corresponding to P1 in FIG. [Figure 15b] FIG. 15b is a simplified conceptual diagram of the light-emitting device shown in FIG. 15a. [Figure 16a] FIG. 16a is a plan view showing a part of a display module according to an embodiment of the present invention, illustrating that fixing members are provided between adjacent module substrates. [Figure 16b] FIG. 16b is a cross-sectional view taken along line BB' of FIG. 16a, showing one embodiment of the present invention. [Figure 16c] FIG. 16c is a cross-sectional view taken along line BB' of FIG. 16a, showing one embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0024] Because the present invention can be modified in various ways and can take various forms, specific embodiments are shown in the drawings and will be described in detail herein, but it should be understood that this is not intended to limit the invention to the particular disclosed form, and that the invention includes all modifications, equivalents, and alternatives falling within the spirit and technical scope of the invention.

[0025] The present invention relates to a display device including pixels. When each light-emitting element in the display device of the present invention is used as a pixel for displaying an image, the display device can be used as a display device. Examples of the display device include televisions, tablets, e-book display devices, computer monitors, kiosks, digital cameras, game consoles, mobile phones, PDAs, vehicle displays, and large indoor / outdoor electronic billboards.

[0026] A display device according to an embodiment of the present invention includes a micro light-emitting element. The micro light-emitting element may have a width or length on the scale of about 1 micrometer to about 800 micrometers, about 1 micrometer to about 500 micrometers, or about 10 micrometers to about 300 micrometers. However, the width or length of each micro light-emitting element according to an embodiment of the present invention does not necessarily have to be within the above range, and may be smaller or larger as needed. Hereinafter, all micro light-emitting elements will be referred to as "light-emitting elements."

[0027] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings.

[0028] Fig. 1 is a perspective view showing a display device according to an embodiment of the present invention, and Fig. 2 is a plan view showing a portion corresponding to P1 in Fig. 1.

[0029] Fig. 3 is a perspective view conceptually illustrating one corner of a display module of a display device according to an embodiment of the present invention, and Fig. 4a and Fig. 4b are cross-sectional views taken along line A-A' in Fig. 3, illustrating examples according to an embodiment of the present invention.

[0030] 1 to 3, 4a and 4b, a display device 100 according to an embodiment of the present invention includes a support substrate 160 and a plurality of display modules 110 arranged on the support substrate 160. Each display module 110 has a pixel region 111 where an image is displayed, and may be arranged along rows and columns on the support substrate 160. At least one pixel, preferably a plurality of pixels, may be formed in the pixel region 111 of the display module 110.

[0031] The support substrate 160 has a wiring portion and each light emitting element 130 formed thereon, and may be rigid or flexible. The support substrate 160 may be formed to have an area larger than that of the individual display modules 110, so that multiple display modules 110 can be mounted on the support substrate 160. In this embodiment, a display device 100 having a large display screen can be realized by combining multiple display modules 110.

[0032] The support substrate 160 may be, for example, glass, quartz, ceramic, Si, SiC, metal, fabric, polymer, etc., and may be a transparent or opaque substrate. The support substrate 160 may also be a rigid or flexible printed circuit board (PCB).

[0033] In one embodiment, the support substrate 160 may be a transparent substrate such as glass, quartz, transparent ceramic, or transparent PCB. The wiring portion on the support substrate 160 may also be formed of a transparent film such as a transparent conductive oxide film. When the support substrate 160 is a transparent substrate, the background may be observed through the support substrate 160 before the display device is turned on. For example, if the support substrate 160 is attached to a wall, when the display device is turned off, the display screen may be barely visible, but the wall surface may be visible. Because each light-emitting element 130 is very small, the background may be observed through the areas between each light-emitting element 130. This may provide a transparent display device such as a head-up display.

[0034] Furthermore, if the support substrate 160 is made of a flexible plastic, a flexible display can be realized.

[0035] Each of the display modules 110 includes a module substrate 120 and a plurality of light emitting elements 130 mounted on the upper surface of the module substrate 120 .

[0036] Each module substrate 120 of the display module 110 may be made of various materials. For example, the module substrate 120 may be formed of a light-transmitting insulating material. Here, the module substrate 120 having "light transmissivity" includes not only a transparent substrate that transmits all light, but also a semi-transparent or partially transparent substrate that transmits only light of a predetermined wavelength or only a portion of light of a predetermined wavelength. Examples of materials for the module substrate 120 include glass, quartz, organic polymers, and organic-inorganic composite materials. However, the material for the module substrate 120 is not limited thereto, and may be any material that is light-transmitting and insulating.

[0037] The module substrate 120 includes at least one pixel region 111 and a non-pixel region surrounding the pixel region 111. The pixel region 111 is a region where pixels are provided and corresponds to a region where light emitted from a light emitting element 130 (described later) travels and is visible to a user. The non-pixel region is a region excluding the pixel region 111. The non-pixel region is provided on at least one side of the pixel region 111, and in one embodiment of the present invention, is provided in a form surrounding the pixel region 111.

[0038] Since at least one light emitting element 130 is provided in the pixel region 111, in one embodiment of the present invention, a case where a plurality of light emitting elements 130 are provided in the pixel region 111 will be described as an example.

[0039] The pixel unit 113 is the smallest unit for displaying an image. Each pixel unit 113 can emit white light and / or colored light. Each pixel unit 113 can include one pixel that emits one color, or can include multiple pixels that emit different colors to emit white light and / or colored light. For example, each display module 110 can include first to third pixels.

[0040] Each pixel is provided in a pixel region 111 on the module substrate 120. At least one pixel is provided in the pixel unit 113 of each display module 110. For example, each pixel unit 113 may include first to third pixels. The first to third pixels may be implemented by first to third light emitting elements 130a, 130b, and 130c. That is, when the lights emitted by the first to third pixels are referred to as first to third lights, respectively, the first to third lights may have different wavelength bands. In one embodiment of the present invention, the first to third lights may correspond to blue, red, and green wavelength bands. However, the wavelength bands of the lights emitted by the pixels included in each display module 110 are not limited thereto and may correspond to cyan, magenta, and yellow wavelength bands.

[0041] Each light emitting device 130 is provided for each pixel and can provide light of various wavelengths. In one embodiment of the present invention, each light emitting device 130 may include first, second, and third light emitting devices 130a, 130b, and 130c that emit first, second, and third light in green, red, and blue wavelength bands, respectively. The first, second, and third light emitting devices 130a, 130b, and 130c may be implemented as blue, red, and green light emitting diodes. However, the first, second, and third light emitting devices do not necessarily have blue, red, and green wavelength bands to realize blue, red, and green colors. This is because, even if the first, second, and third light emitting devices have the same wavelength band, the color of the final emitted light can be controlled by using a light conversion layer (not shown) that converts at least a portion of the first, second, and third light emitting devices into light of a different wavelength band. The light conversion layer may include materials such as phosphors and quantum dots that convert light of a certain wavelength into light of a different wavelength. In other words, the first to third pixels do not necessarily have to use green, red, and blue LEDs to realize green, red, and / or blue, but LEDs of other colors can be used. For example, a red LED can be used to realize red, but a blue or ultraviolet LED can be used with a light conversion layer that absorbs blue light or ultraviolet light and then emits red light.

[0042] Since each light emitting element 130 is formed in a minute size, it may be mounted on a flexible module substrate such as plastic by a method such as transfer. The light emitting element 130 according to an embodiment of the present invention may be an inorganic light emitting element, which, unlike an organic light emitting element, can be formed by thin film growth of an inorganic material. This simplifies the manufacturing process and improves yield. Furthermore, since individually separated light emitting elements 130 can be simultaneously transferred onto a large-area substrate, it becomes possible to manufacture a large-area display device. Furthermore, light emitting elements made of inorganic materials have advantages over organic light emitting elements, such as high brightness, long life, and low unit cost.

[0043] 3, a recess 127 is formed on a side surface of the module substrate 120, and a connecting electrode 123 is provided within the recess 127. The recess 127 is recessed inward from the side surface of the module substrate 120, and may have a groove shape extending from the upper surface to the lower surface of the module substrate 120 by removing a portion of the module substrate 120. A connecting electrode 123, more specifically, a side electrode 123b of the connecting electrode 123, is provided on the side surface of the module substrate 120 forming the inside of the recess 127.

[0044] An upper pad 123a connected to the side electrode 123b is provided on the upper surface of the module substrate 120, and a lower pad 123c connected to the side electrode 123b is provided on the lower surface of the module substrate 120. The upper pad 123a is in contact with and connected to the connecting wire 129 or is integrally formed with the connecting wire 129, and the connecting wire 129 is electrically connected to the light emitting element 130. Although not shown, the lower pad 123c is in contact with and connected to the lower connecting wire 159 or is integrally formed with the lower connecting wire 159, and is electrically connected to a driving circuit unit or a supporting substrate. Here, the connecting wire 129 and the lower connecting wire 159 may include data lines and / or scan lines.

[0045] Each wire formed on the lower surface of module substrate 120 may be connected to a separate driving circuit unit 150. For example, referring to Fig. 4a, driving circuit unit 150 may be fabricated on a separate printed circuit board, disposed on the lower surface of module substrate 120, and then connected to each wire formed on the lower surface of module substrate 120. Each wire formed on the upper surface of module substrate 120 may be connected to each wire formed on the lower surface of module substrate 120 via connecting electrodes 123 formed in recesses 127, which will be described later.

[0046] In the embodiment of the present invention, the driving circuit unit 150 is fabricated on a separate printed circuit board and disposed on the underside of the module substrate 120, but this is not limiting, and an additional separate driving circuit unit may be provided. The additional driving circuit unit may be provided with separate wiring on the support substrate 160. For example, referring to FIG. 4B, each wiring formed on the underside of the module substrate 120 may be connected to the support substrate 160.

[0047] In one embodiment of the present invention, although not shown, the module substrate 120 may be formed with not only a plurality of wires but also driving elements for driving each of the light emitting elements 130. In this case, the driving elements may be thin film transistors, and each thin film transistor may be connected to each of the light emitting elements 130 by an external driving signal to turn each of the light emitting elements 130 on or off.

[0048] The first to third light emitting elements 130a, 130b, and 130c may be various types of light emitting diodes.

[0049] 5 is a cross-sectional view showing a simplified light emitting device 130 according to an embodiment of the present invention. The light emitting device 130 shown in FIG. 3 may be any one of the first to third light emitting devices 130a, 130b, and 130c.

[0050] Referring to FIG. 5, the light-emitting element includes an element substrate 131, a first semiconductor layer 132, an active layer 133, a second semiconductor layer 134, a first contact electrode 135a, a second contact electrode 135b, an insulating film 136, a first contact pad 137a, and a second contact pad 137b.

[0051] In one embodiment, for a light emitting device that emits green light, the first semiconductor layer 132, the active layer 133, and the second semiconductor layer 134 may include indium gallium nitride (InGaN), gallium nitride (GaN), aluminum indium gallium nitride (AlInGaN), gallium phosphide (GaP), aluminum gallium indium phosphide (AlGaInP), and aluminum gallium phosphide (AlGaP). In one embodiment, for a light emitting device that emits red light, the first semiconductor layer 132, the active layer 133, and the second semiconductor layer 134 may include aluminum gallium arsenide (AlGaAs), gallium arsenide phosphide (GaAsP), aluminum gallium indium phosphide (AlGaInP), and gallium phosphide (GaP). In one embodiment, in the case of a light emitting device that emits blue light, the first semiconductor layer 132, the active layer 133, and the second semiconductor layer 134 may include gallium nitride (GaN), indium gallium nitride (InGaN), aluminum indium gallium nitride (AlInGaN), and zinc selenide (ZnSe).

[0052] Here, the first and second semiconductor layers 132 and 134 may be doped with impurities of opposite types, and may be n-type or p-type semiconductor layers depending on the type of impurity. For example, the first semiconductor layer 132 may be an n-type semiconductor layer and the second semiconductor layer 134 may be a p-type semiconductor layer. Conversely, the first semiconductor layer 132 may be a p-type semiconductor layer and the second semiconductor layer 134 may be an n-type semiconductor layer.

[0053] Although the first semiconductor layer 132 and the second semiconductor layer 134 are each shown as a single layer in the drawings, these layers may be multiple layers or may include a superlattice layer. The active layer 133 may include a single quantum well structure or a multiple quantum well structure, and the composition ratio of the nitride-based semiconductor is adjusted to emit a desired wavelength.

[0054] A first contact electrode 135a is disposed on the first semiconductor layer 132 where the active layer 133 and the second semiconductor layer 134 are not provided, and a second contact electrode 135b is disposed on the second semiconductor layer 134.

[0055] The first and / or second contact electrodes 135a, 135b may be made of a single layer or multi-layer metal, and materials for the first and / or second contact electrodes 135a, 135b may include various metals such as Al, Ti, Cr, Ni, Au, Ag, Cu, and alloys thereof.

[0056] An insulating film 136 is provided on the first and second contact electrodes 135a and 135b, and a first contact pad 137a and a second contact pad 137b are provided on the insulating film 136. The first contact electrode 135a is connected to the first contact pad 137a and the second contact electrode 135b is connected to the second contact pad 137b. In this embodiment, the first contact pad 137a is connected to the first contact electrode 135a and the second contact pad 137b is connected to the second contact electrode 135b. However, this is for convenience of explanation and is not intended to be limiting. For example, the second contact pad 137b may be connected to the first contact electrode 135a and the first contact pad 137a may be connected to the second contact electrode 135b.

[0057] The first contact pad 137a and / or the second contact pad 137b may be made of a single layer or multi-layer metal, and may be made of metals such as Al, Ti, Cr, Ni, Au, and alloys thereof.

[0058] Although the light emitting device 130 has been simply described with reference to the drawings in one embodiment of the present invention, the light emitting device 130 may further include layers having additional functions in addition to the layers described above. For example, various layers may further be included, such as a reflective layer that reflects light, an additional insulating layer that insulates specific components, and a solder barrier layer that prevents solder diffusion.

[0059] 5, the light emitting device is shown with the first and second contact pads facing upward, but when mounted on a module substrate, the light emitting device may be inverted so that the first and second contact pads face the top surface of the module substrate. The first and second contact pads may be electrically connected to wiring portions provided on the module substrate directly or by using a conductive adhesive material.

[0060] Referring again to Figures 1 to 3, 4a and 4b, in the display device 100 according to one embodiment of the present invention, a common voltage and a data signal are applied to the light emitting element 130, turning it on and emitting light, and the emitted light travels toward the underside of the module substrate 120 through the lower module substrate 120.

[0061] In one embodiment of the present invention, each display module 110 has a structure connected to a wiring unit formed on a support substrate 160, among which is a conductive electrode unit 163. Various types of wiring units and circuits (e.g., various circuits for driving each pixel, including an additional driver) may be provided on the support substrate 160, and driving signals are provided to each light emitting device 130 arranged on each display module 110 via the conductive electrode unit 163. To this end, the module substrate 120 of the display module 110 is provided with a structure for connecting the conductive electrode unit 163 of the support substrate 160 to a connecting wiring 129 on the upper surface of the module substrate 120.

[0062] Each display module 110 according to one embodiment of the present invention has a connection structure for connecting each light emitting device 130 provided on the upper surface of the module substrate 120 to a driving unit 150 or a support substrate 160 located below the module substrate 120.

[0063] 3, at least one end of each module substrate 120 is provided with a recess 127 recessed from the end of the module substrate 120. The recess 127 may be provided in a non-pixel region other than the pixel region 111, and thus arranged along the edge of the module substrate 120. The recess 127 may be provided in the same number as the light emitting elements 130 and the number of connecting wires 129 connected to the light emitting elements 130, and for convenience of explanation, an arbitrary number of recesses 127 is shown in the drawings.

[0064] Each recess 127 is formed by cutting from the upper surface of the module substrate 120 toward the lower surface at both ends of the module substrate 120. A connecting electrode 123 is formed in each recess 127. Each connecting electrode 123 includes an upper pad 123a formed on the upper surface of the module substrate 120, a lower pad 123c formed on the lower surface of the module substrate 120, and a side electrode 123b located inside the recess 127 and connecting the upper pad 123a and the lower pad 123c. The upper pad 123a may be connected to a connecting wire 129 formed on the upper surface of the module substrate 120, and the lower pad 123c may be connected to a lower connecting wire 159 formed on the lower surface of the module substrate 120 or to a conductive electrode portion 163 of the support substrate 160.

[0065] In one embodiment of the present invention, when a driving circuit unit 150 for driving the light emitting device 130 is separately provided on the lower surface of the module substrate 120, the lower pad 123c is connected to the driving circuit unit 150 via a connecting wire 129 provided on the lower surface of the module substrate 120.

[0066] FIG. 6 is a diagram illustrating a connection relationship on the rear surface of a display device 100 according to an embodiment of the present invention when a driving circuit unit 150 is separately provided on the lower surface of a module substrate 120. As shown in FIG.

[0067] 1 to 6, the driving circuit unit 150 may be provided in a single unit or in two or more units as shown. For example, the driving circuit unit 150 may include a first driving circuit unit 151 and a second driving circuit unit 153. The first and second driving circuits 151 and 153 are electrically connected to the lower pads 123c of the connecting electrodes 123 via lower connecting wires 159 formed on the lower surface of the module substrate 120. The first and second driving circuits 151 and 153 may be, for example, a scan driver and a data driver. The first and second driving circuits 151 and 153 may be provided in regions corresponding to the pixel region 111 and / or non-pixel regions.

[0068] If a separate driving circuit unit 150 is not provided on the lower surface of the module substrate 120, or if a connection to an additional device is required even if a separate driving circuit unit 150 is provided, the lower pad 123c is connected to a conductive electrode unit 163 on the support substrate 160. When the lower pad 123c is connected to the conductive electrode unit 163 of the support substrate 160, the connection may be made in a form in which a conductive adhesive member 140, such as a solder paste, is provided between the lower pad 123c and the conductive electrode unit 163. Alternatively, when the lower pad 123c is connected to the conductive electrode unit 163 of the support substrate 160, the connection may be made in a ball grid array manner. In this case, solder balls may be provided between the lower pad 123c and the conductive electrode unit 163 of the support substrate 160.

[0069] The supporting substrate 160 may be formed with various elements, for example, a timing controller, a memory such as an EEPROM, circuits such as a voltage source for driving the light emitting device 130, and a wiring unit including various wires electrically connected to the conductive electrode unit 163. The supporting substrate 160 may be formed with a gate driver and a data driver for applying scan signals and image signals to the scan lines and the data lines, respectively.

[0070] In this structure, driving signals output from the driving circuit unit 150 or various elements on the supporting substrate 160 are transmitted to the light emitting element 130 through each connecting electrode 123, thereby turning the light emitting element 130 on or off to display an image.

[0071] As described above, the display device 100 according to an embodiment of the present invention corresponds to a multi-module display device including a plurality of display modules 110. For example, in FIG. 1, 4×5 display modules 110 form one display device 100.

[0072] In this embodiment, each or at least some of the multiple display modules 110 may be driven independently, or at least some of the display modules 110 may be driven in a subordinate manner in conjunction with the remaining display modules 110. When the multiple display modules 110 are driven in conjunction with each other, a single image can be displayed.

[0073] Although the present embodiment illustrates a case in which the plurality of display modules 110 are all provided with the same size, the present invention is not limited thereto, and it is understood that at least one display module may be provided with a size different from that of the remaining display modules. Furthermore, at least one display module may have a different number of pixels from that of the remaining display modules, and therefore may have different resolutions. Furthermore, if the resolution of all regions does not need to be the same, the display device 100 may be manufactured by arranging display modules with different resolutions.

[0074] In one embodiment of the present invention, each display module 110 may be provided in a shape other than a rectangle, and in particular, may be provided in a shape other than a square depending on the overall shape of the display device 100. Furthermore, the number of support substrates 160 and the number of display modules 110 disposed on the support substrates 160 may vary depending on the size of the display device 100 to be manufactured.

[0075] When manufacturing a large-area multi-module display device, a display device having the above structure minimizes the gap between pixel regions between adjacent display modules, thereby minimizing problems such as separation of displayed images and the appearance of dark lines in images. According to one embodiment of the present invention, the connecting electrodes may be formed on the side of the module substrate on which each light-emitting element is mounted, particularly in a non-pixel region immediately adjacent to the pixel region. Here, the portion on which the connecting electrodes are formed corresponds to a portion recessed inward from one end of the module substrate, thereby eliminating the need for an additional wiring structure on the outside of the module substrate. Furthermore, in one embodiment of the present invention, a separate device for connecting the display module to the supporting substrate does not need to be provided on the side of the module substrate, thereby eliminating the space required to install the separate device on the side of the module substrate, thereby minimizing the gap between two adjacent display modules.

[0076] 7a to 7d are plan views sequentially illustrating a method of manufacturing a display device according to an embodiment of the present invention.

[0077] Referring to Figures 7a to 7d, a display device 100 according to one embodiment of the present invention can be manufactured by first manufacturing a plurality of display modules 110 and then arranging the plurality of display modules 110 on a support substrate 160.

[0078] First, the steps of manufacturing a plurality of display modules 110 will be described.

[0079] 7a, a module substrate is first provided, which may be made of an optically transparent insulating material.

[0080] A recess 127 is formed at at least one end of the module substrate 120 by removing a side portion of the module substrate 120. The recess 127 may be formed using a laser or by cutting using a tool such as a saw. However, the method for forming the recess 127 is not limited thereto, and it is understood that the recess 127 may be formed by various methods.

[0081] 7b, a conductive film CDT is formed on the side surface of the module substrate 120. The conductive film CDT may be formed on the entire side surface of the module substrate 120 where the recess 127 is formed. The conductive film CDT may be easily formed through plating. However, the method for forming the conductive film CDT is not limited thereto, and it goes without saying that other methods for forming a conductive film on the side surface of the module substrate 120 may be used.

[0082] 7c, the side surface of at least one end of module substrate 120 may then be polished. By polishing, the conductive film formed on the side surface of the one end excluding recess 127 is removed, and only the conductive film formed within recess 127 remains, functioning as connecting electrode (particularly, side connecting electrode) 123.

[0083] 7d, a protective material BM may be formed in the recess 127 where the connecting electrode 123 is formed. Forming the protective material BM in the recess 127 is optional, and if necessary, the subsequent assembly steps of the display module may be performed without protection by the protective material BM. The protective material BM may be made of a black insulating material so as to absorb light.

[0084] Then, each light emitting device is formed on the module substrate. Here, before forming each light emitting device, additional connection wires and rear connection wires may be formed on the upper and lower surfaces of the module substrate.

[0085] A driving circuit unit is prepared and arranged on the lower surface of the module substrate, and the light emitting elements are electrically connected to the driving circuit unit via the connection electrodes, thereby completing a display module.

[0086] FIG. 8 is a perspective view conceptually showing how the display module is assembled onto the support substrate.

[0087] 8, each display module 110 completed through the above steps is disposed on a support substrate 160 and then electrically connected. A plurality of display modules 110 may be disposed in rows and columns on the support substrate 160. A conductive adhesive such as solder paste or solder balls used in a ball grid array may be disposed between the display module 110 and the support substrate 160 to electrically connect the display module 110 and the support substrate 160.

[0088] As described above, a display module is manufactured by simply forming a recess in a module substrate and forming connection electrodes in the recess, and the display module is attached to a support substrate by simple soldering or a ball grid array method, thereby making it possible to manufacture a multi-module display device in a simple and low-cost manner.

[0089] The display device according to an embodiment of the present invention may be manufactured by various methods and may have various shapes, etc., without departing from the concept of the present invention.

[0090] In one embodiment of the present invention, when forming recesses in module substrates, recesses may be formed individually in a single module substrate, but this is not limited thereto, and recesses may be formed simultaneously in multiple module substrates.

[0091] 9 is a perspective view conceptually showing how recesses are formed simultaneously in a plurality of module substrates. For convenience of explanation, this drawing shows the use of two module substrates.

[0092] 9, after preparing a plurality of module substrates 120a, 120b, they are arranged so that their ends, where the recesses 127 will be formed, are located on the same side. If necessary, an adhesive sheet 170 can be placed between two adjacent module substrates 120a, 120b to prevent the module substrates 120a, 120b from moving relative to each other. Next, with the plurality of module substrates 120a, 120b arranged, the ends of the plurality of module substrates 120a, 120b can be simultaneously cut using a tool such as a laser or a saw to form the recesses 127 at the ends of the plurality of module substrates 120a, 120b. The module substrates 120a, 120b with the recesses 127 formed therein can be individually separated from each other by removing the adhesive sheet 170.

[0093] Through this process, recesses can be easily formed in a plurality of module substrates.

[0094] In an embodiment of the present invention, the recess may be formed in various shapes.

[0095] FIG. 10 is a plan view showing the shape of the recessed portion according to an embodiment of the present invention.

[0096] 10 , the shape of the recessed portions 127 may be triangular, semicircular, or semielliptical when viewed in a plan view. The shape of the recessed portions 127 is not limited thereto and may be any other shape as long as it is recessed inward from one end of the module substrate 120. Furthermore, in one module substrate 120, all the recessed portions 127 may have the same shape, for example, all triangular, but is not limited thereto and various shapes may be provided and arranged in one module substrate 120. In addition, the spacing between the recessed portions 127 may be equal, but is not limited thereto and may be variously adjusted.

[0097] In an embodiment of the present invention, the connection electrodes may be formed in various shapes.

[0098] FIG. 11 is a plan view showing the shape of each of the connecting electrodes according to one embodiment of the present invention.

[0099] 11, the connecting electrode 123 may be provided in a form that completely fills the recess 127. In the above-described embodiment, the connecting electrode 123 is shown as a film formed to a predetermined thickness along the side surface of the module substrate 120 that forms the recess 127, but is not limited thereto. As shown in FIG. 11, the connecting electrode 123 may be formed in a form that fills the entire area sunken by the recess 127 and covers the side surface of the module substrate 120. In this case, the connecting electrode 123 may be provided to have the same shape as the recess 127 when viewed in a plan view.

[0100] In an embodiment of the present invention, the shape of one end of the display module may be changed into various shapes so that the formation of connection electrodes, the connection of wiring, and the assembly to a support substrate can be easily performed.

[0101] 12a to 12c are plan views illustrating the relationship between two adjacent display modules in one embodiment of the present invention.

[0102] When two adjacent module substrates among the module substrates on the support substrate are designated as first and second module substrates 120a and 120b, at least one of the first and second module substrates 120a and 120b may have a plurality of recesses at at least one end, and at least one of the first and second module substrates 120a and 120b may have protrusions at at least one end corresponding to the plurality of recesses and protruding toward the recesses.

[0103] 12a, when first and second module substrates 120a and 120b are arranged side by side as shown in FIG. 12a, the second module substrate 120b on the right side may have a recessed portion 127 recessed inward, with a connecting electrode 123 formed within the recessed portion 127. The first module substrate 120a on the left side may have a protruding portion 127p protruding toward the second module substrate 120b. The protruding portion 127p of the first module substrate 120a may be provided at a position corresponding to the recessed portion 127 of the second module substrate 120b, with a size corresponding to the size of the recessed portion 127. Therefore, when the first module substrate 120a and the second module substrate 120b are assembled, the first module substrate 120a and the second module substrate 120b may be assembled with their edge shapes interlocking with each other.

[0104] In one embodiment of the present invention, the recesses and protrusions may be variously arranged on the first and second module substrates.

[0105] For example, referring to FIG. 12b, the first module substrate 120a may have both a protrusion 127pa and a depression 127a at its end. The depression 127a may be depressed toward the inside of the first module substrate 120a, and a connecting electrode 123a may be disposed in the depression 127a. The protrusion 127pa may protrude toward the second module substrate 120b. Referring to the second module substrate 120b, a protrusion 127pb may be formed in a region corresponding to the depression 127a of the first module substrate 120a, and a depression 127b may be formed in a region corresponding to the protrusion 120pa of the first module substrate 120a. A connecting electrode 123b may be disposed in the depression 127b of the second module substrate 120b. As such, each of the first and second module substrates 120a and 120b may have the recesses 127a and 127b and the protrusions 127pa and 127pb at at least one end thereof.

[0106] Referring to FIG. 12c, the recessed portion 127a of the first module substrate 120a and the recessed portion 127b of the second module substrate 120b may be arranged at positions other than the corresponding positions.

[0107] A display device having the above-described structure can be driven in various ways. For example, in one embodiment of the present invention, each pixel can be driven in a passive or active manner.

[0108] FIG. 13 is a structural diagram showing a display device according to an embodiment of the present invention.

[0109] 13, the display device according to an embodiment of the present invention includes a timing control unit 155, a first driver 151, a second driver 153, a wiring unit, and pixels implemented by first to third light emitting elements 130a, 130b, and 130c. In this embodiment, the first driver 151 and the second driver 153 may be a scan driver and a data driver, respectively, and will be referred to as a scan driver and a data driver hereinafter.

[0110] Each pixel is individually connected to a scan driver 151, a data driver 153, etc. through a wiring portion.

[0111] The timing controller 155 receives various control signals and image data required to drive the display device from an external source (e.g., a system that transmits image data). The timing controller 155 rearranges the received image data and transmits it to the data driver 153. The timing controller 155 also generates scan control signals and data control signals required to drive the scan driver 151 and the data driver 153, and transmits the generated scan control signals and data control signals to the scan driver 151 and the data driver 153, respectively.

[0112] The scan driver 151 receives a scan control signal from the timing controller 155 and generates a scan signal in response thereto.

[0113] The data driver 153 receives a data control signal and image data from the timing controller 155 and generates a data signal in response thereto.

[0114] The wiring unit includes a plurality of signal lines. Specifically, the wiring unit includes first lines 103 connecting the scan driver 151 to each pixel and second lines 102 connecting the data driver 153 to each pixel. In one embodiment of the present invention, the first lines 103 may be scan lines, and the second lines 102 may be data lines. In addition, the wiring unit further includes lines connecting the timing controller 155 to the scan driver 151, the timing controller 155 to the data driver 153, or other components and transmitting corresponding signals.

[0115] Each scan line 103 provides each pixel with a scan signal generated by the scan driver 151. A data signal generated by the data driver 153 is output to each data line 102. The data signal output to each data line 102 is input to each pixel of a horizontal display module 110 line selected by the scan signal.

[0116] Each pixel is connected to a scan line 103 and a data line 102. When a scan signal is supplied from each scan line 103, each pixel selectively emits light in response to a data signal input from each data line 102. For example, during each frame period, each pixel emits light with a luminance corresponding to the input data signal. When a pixel receives a data signal corresponding to black luminance, it displays black by not emitting light during the corresponding frame period.

[0117] In an embodiment of the present invention, the light emitting elements may be arranged in various shapes within a pixel region to form pixel units.

[0118] FIG. 14 is a plan view showing that light emitting elements are arranged in a different manner from the above-described embodiment in accordance with an embodiment of the present invention, and shows a portion corresponding to P1 in FIG.

[0119] 14, a plurality of light emitting elements 130 may be provided in the pixel region 111 of the module substrate 120. The plurality of light emitting elements 130 may be arranged in various shapes to form a pixel unit. In the embodiment disclosed in FIG. 2, one pixel unit includes first to third light emitting elements 130a, 130b, and 130c, and the first to third light emitting elements 130a, 130b, and 130c are arranged in a triangular shape. In another embodiment of the present invention, as shown in FIG. 14, the plurality of light emitting elements 130 may be arranged in a matrix. For example, when a pixel unit includes first to third light emitting elements 130a, 130b, and 130c, the first, second, and third light emitting elements 130a, 130b, and 130c may be arranged alternately along rows or columns, or may be arranged alternately along both rows and columns. In another example, when a pixel unit is composed of first to third light-emitting elements, when the first to third light-emitting elements are arranged, the first light-emitting element, the second light-emitting element, and the third light-emitting element may be arranged in a form in which they are sequentially repeated along a row or a column, or may be arranged in a form in which they are all repeated along both the row and the column.

[0120] Figure 15a is a plan view showing that light emitting devices are arranged in a different manner from the above-described embodiment in one embodiment of the present invention, and shows a portion corresponding to P1 in Figure 1. Figure 15b is a simplified conceptual diagram of the light emitting device shown in Figure 15a.

[0121] 15a, a plurality of light emitting devices 230 are provided in the pixel region 111 of the module substrate 120, and each light emitting device forms a pixel unit. Each light emitting device 230 may include a plurality of epitaxial stacks emitting light of different colors. For example, as shown in FIG. 15b, each light emitting device 230 may include first to third epitaxial stacks 231, 233, and 235, which are three layers stacked in sequence.

[0122] Each epitaxial stack can emit color light in the visible light range among light in various wavelength ranges. The first epitaxial stack 231 can emit a first color light, the second epitaxial stack 233 can emit a second color light, and the third epitaxial stack 235 can emit a third color light. Here, the first to third color lights may correspond to different color lights, and the first to third color lights may be color lights in different wavelength ranges with successively shorter wavelengths. That is, the first to third color lights may have different wavelength ranges, and may be color lights in shorter wavelength ranges with increasing energy from the first color light to the third color light. In this embodiment, the first color light may be red light, the second color light may be green light, and the third color light may be blue light. However, the order of the first to third color lights is not limited thereto, and may be different from each other depending on the stacking order of the first to third epitaxial stacks 231, 233, and 235.

[0123] In this way, when one pixel unit is manufactured in a stacked structure, only one light-emitting stack needs to be mounted instead of multiple light-emitting elements, so a larger number of pixel units can be included in a unit area, and the manufacturing method is significantly simplified.

[0124] The display module according to an embodiment of the present invention may further include additional components for improving the assembly of adjacent module substrates.

[0125] Figure 16a is a plan view showing a portion of a display module according to one embodiment of the present invention, showing that a fixing member 180 is provided between adjacent module substrates 120, and Figures 16b and 16c are cross-sectional views along line B-B' in Figure 16a, showing one embodiment of the present invention.

[0126] 16a to 16c, in a display module according to an embodiment of the present invention, at least a portion of each corner of each module substrate 120 may be chamfered in various shapes. For example, at least one of the corners of four adjacent module substrates 120 may have a chamfered portion in the shape of a triangle, a quadrant, or various other shapes when viewed in a plane. In one embodiment of the present invention, as an example, all four mutually facing corners of each module substrate 120 are chamfered in the shape of a right triangle when viewed in a plane.

[0127] The chamfered portions are removed from the module substrates, forming spaces in those portions. Fixing members 180 may be provided in the spaces to firmly fasten adjacent module substrates 120. The fixing members 180 may have various shapes to easily fix the module substrates 120, and may be black to prevent reflection or interference of light from the light emitting elements.

[0128] In one embodiment of the present invention, the fixing member 180 may have a screw shape. If the fixing member 180 has a screw shape, it may have threads 181 that are inserted into the spaces and allow the fixing member 180 to be screw-fastened to each module substrate 120. In this case, threads corresponding to the threads 181 of the fixing member 180 may also be formed on the chamfered portions of each module substrate 120, and the module substrates 120 and the fixing member 180 may be fastened together in a manner in which the corresponding threads engage with each other.

[0129] In one embodiment of the present invention, the fixing member 180' may have a shape of a hook pin having elasticity. In the case of a hook pin, it may have a locking protrusion 183 that prevents the fixing member 180' from being removed after being inserted into the space.

[0130] In the above embodiment, the shape of the fixing member is shown to be the shape of a screw and a hook pin, but it is not limited to this and it is natural that the fixing member may have a different shape as long as it can be inserted into the chamfered portion and fix each module board.

[0131] The present invention has been described above with reference to preferred embodiments thereof. However, it will be understood by those skilled in the art or those with ordinary knowledge in the art that various modifications and variations of the present invention can be made without departing from the spirit and technical scope of the present invention as set forth in the claims below.

[0132] Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification, but should be defined by the claims.

Claims

1. A support substrate; a module substrate disposed on the support substrate; a plurality of light-emitting regions disposed on the module substrate; a connecting electrode disposed on the module substrate; A light emitting module comprising: the module substrate includes a plurality of recesses formed on a surface of the module substrate; the connecting electrode is disposed in at least one of the plurality of recesses; the connecting electrode is electrically connected to at least one of the plurality of light emitting regions; The module substrate includes a drive circuit unit.

2. The light emitting module of claim 1 , wherein the support substrate includes a conductive electrode region on a surface of the support substrate facing the module substrate, and the connecting electrode is electrically connected to the conductive electrode region.

3. A connecting wire disposed on the upper surface of the module substrate and electrically connected to the connecting electrode. The light emitting module of claim 1 further comprising:

4. The light emitting module according to claim 1 , wherein the connecting electrode includes a plurality of connecting electrodes, the number of the connecting electrodes corresponding to the number of the light emitting regions for driving the light emitting elements.

5. The light emitting module according to claim 1 , wherein the module substrate includes a non-light emitting region surrounding the plurality of light emitting regions.

6. The light emitting module of claim 3 , wherein the connecting wires are connected to the support substrate using a ball grid array or a conductive adhesive layer.

7. The light emitting module according to claim 1 , wherein a conductive film is disposed on a side surface of the module substrate.

8. The light emitting module according to claim 1 , wherein the connecting electrode fills the recess.

9. The light-emitting module according to claim 5 , wherein at least one of the plurality of recesses is disposed in the non-light-emitting region.

10. The light emitting module according to claim 9 , wherein the at least one of the plurality of recesses is disposed on an edge of the module substrate.

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