Bridge beam, semiconductor device handling apparatus, and semiconductor device testing apparatus

Abstract

To provide a bridge beam capable of highly accurately positioning an optical probe with respect to a semiconductor device.SOLUTION: A bridge beam 50 is mounted on a wafer prober 30 for handling a semiconductor wafer 100. The bridge-beam 50 includes a beam-shaped main body 51 on which the probe card 20 having the probes 21 electrically connected to the terminals 112 on the DUT110 is mounted, and first actuators 54 mounted on the main body 51 and configured to move optical probes 52, which emit and / or receive optical signals to and / or from the DUT110, relative to the DUT110.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a bridge beam attached to a semiconductor device handling apparatus that handles a device under test (hereinafter simply referred to as a "DUT" (Device Under Test)) such as a semiconductor integrated circuit element, a semiconductor device handling apparatus equipped with the bridge beam, and a semiconductor device testing apparatus equipped with the semiconductor device handling apparatus. [Background technology]

[0002] A known test device required for testing chips at the wafer level is one that includes a wafer prober and a wafer tester having a contact module (probe card) (see, for example, Patent Document 1). The contact module is used to connect a device-side interface of the wafer tester to an interface of a chip on a wafer fixed to the wafer prober.

[0003] A chip with an optoelectronic integrated circuit has contact pads as an electrical interface and a grating coupler or the like as an optical interface. In wafer-level testing of such chips, the contact module described above has needles that contact the contact pads of the chip and an optical interface that can be assigned to a grating coupler or the like.

[0004] The wafer described above is fixed to a positioning stage of a wafer prober, and this positioning stage is used to position the contact pads relative to the needles and the optical interface relative to the grating coupler or the like. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Special Publication No. 2024-514646 Summary of the Invention [Problem to be solved by the invention]

[0006] In the above-mentioned conventional technology, when the positioning stage to which the wafer is fixed is driven, the relative position of the contact pad to the needle and the relative position of the optical interface to the optical deflection element change simultaneously, which results in the problem that it is not possible to change only the relative position of the optical interface to the optical deflection element, and therefore it may not be possible to position the optical interface to the optical deflection element with high precision.

[0007] The problem to be solved by the present invention is to provide a bridge beam, a semiconductor device handling apparatus, and a semiconductor device testing apparatus that are capable of positioning an optical probe with high precision relative to a semiconductor device. [Means for solving the problem]

[0008] [1] Aspect 1 of the present invention is a bridge beam mounted on a semiconductor device handling apparatus that handles semiconductor devices, comprising: a beam-shaped main body portion on which a probe card having contacts that electrically connect with terminals of the semiconductor device is mounted; and a first actuator mounted on the main body portion, which emits an optical signal to the semiconductor device and / or moves an optical probe that is incident on the semiconductor device relative to the semiconductor device.

[0009] [2] A second aspect of the present invention may be the bridge beam of the first aspect, further comprising a holder attached to the first actuator and configured to hold the optical probe.

[0010] [3] Aspect 3 of the present invention is a bridge beam according to aspect 1 or 2, wherein the bridge beam further comprises an optical detection unit that detects the optical signal emitted from the optical probe, and the optical detection unit outputs the detection result to a calculation device that calculates the intensity of the optical signal based on the detection result.

[0011] [4] A fourth aspect of the present invention is a bridge beam according to the third aspect, wherein the bridge beam further comprises a second actuator that moves the optical detection unit relative to the optical probe, thereby moving the optical detection unit to a position where the optical signal can be received.

[0012] [5] A fifth aspect of the present invention may be the bridge beam of any one of the first to fourth aspects, wherein the bridge beam further includes the optical probe.

[0013] [6] A sixth aspect of the present invention may be a bridge beam according to any one of the first to fourth aspects, wherein the first actuator has three degrees of freedom in the X, Y and Z directions.

[0014] [7] A seventh aspect of the present invention may be a bridge beam of the sixth aspect, wherein the Z direction is the thickness direction of the main body portion, and the first actuator is capable of adjusting the relative distance in the Z direction between the optical probe and the semiconductor device.

[0015] [8] In an eighth aspect of the present invention, in the bridge beam of the sixth or seventh aspect, the first actuator may be a bridge beam having six degrees of freedom in the XYZ directions, the roll direction, the pitch direction, and the yaw direction.

[0016] [9] A ninth aspect of the present invention is the bridge beam of any one of the first to eighth aspects, wherein the bridge beam may be detachably attached to the semiconductor device handling apparatus.

[0017]

[10] A tenth aspect of the present invention is the bridge beam of any one of the first to ninth aspects, wherein the first actuator may be a bridge beam that aligns the optical probe with respect to the semiconductor device.

[0018]

[11] Aspect 11 of the present invention may be a bridge beam of aspect 10, wherein the first actuator includes a third actuator that coarsely aligns the optical probe with respect to the semiconductor device, and a fourth actuator that finely aligns the optical probe with respect to the semiconductor device after the coarse alignment is completed.

[0019]

[12] A twelfth aspect of the present invention is a semiconductor device handling apparatus for handling semiconductor devices, which is a semiconductor device handling apparatus including the bridge beam of any one of the first to eleventh aspects.

[0020]

[13] A thirteenth aspect of the present invention may be a semiconductor device handling apparatus according to the twelfth aspect, further comprising a probe card attached to the bridge beam and having contacts electrically connected to terminals of the semiconductor device.

[0021]

[14] A fourteenth aspect of the present invention may be a semiconductor device handling apparatus according to the twelfth or thirteenth aspect, further comprising a moving device that moves the semiconductor device to bring the terminals and the contactors into contact with each other and press the semiconductor device against the probe card, a base portion that supports the moving device, and a support frame that stands on the base portion and supports the bridge beam.

[0022]

[15] A fifteenth aspect of the present invention may be a semiconductor device handling apparatus according to the fourteenth aspect, wherein the first actuator aligns the optical probe with the semiconductor device by moving the optical probe relative to the semiconductor device while the moving device presses the semiconductor device against the probe card.

[0023]

[16] Aspect 16 of the present invention is a semiconductor device handling device according to any one of aspects 12 to 15, wherein the bridge beam further comprises an optical detection unit that detects the optical signal emitted from the optical probe and outputs the detection result, and the semiconductor device handling device may be a semiconductor device handling device that comprises a calculation unit that calculates the intensity of the optical signal based on the detection result output from the optical detection unit.

[0024]

[17] A seventeenth aspect of the present invention may be a semiconductor device handling device according to the sixteenth aspect, wherein the calculation device determines that the optical probe is normal when the detection result output from the optical detection unit is a light intensity within a predetermined range.

[0025]

[18] Aspect 18 of the present invention is a semiconductor device testing apparatus for testing a conductor device, comprising a semiconductor device handling apparatus according to any one of aspects 12 to 17, the probe card, and a tester to which the probe card is electrically connected and which performs testing of the semiconductor device. [Effects of the Invention]

[0026] According to the present invention, by providing the main body with a first actuator that moves the optical probe relative to the semiconductor device, it is possible to independently adjust the relative positional relationship between the optical probe and the semiconductor device. This makes it possible to position the optical probe with high precision relative to the semiconductor device. Furthermore, according to the present invention, it is possible to add a function for positioning the optical probe with high precision relative to the semiconductor device to a semiconductor device testing apparatus without significantly modifying the semiconductor device testing apparatus. [Brief explanation of the drawings]

[0027] [Figure 1] FIG. 1 is a cross-sectional view showing an example of a semiconductor device testing apparatus when a semiconductor wafer and a probe card are spaced apart from each other in an embodiment of the present invention. [Figure 2] FIG. 2 is a cross-sectional view showing an example of a semiconductor device testing apparatus when a semiconductor wafer is pressed against a probe card in an embodiment of the present invention. [Figure 3] FIG. 3 is an enlarged cross-sectional view of a portion III in FIG. [Figure 4] FIG. 4 is a block diagram showing an outline of a semiconductor device testing apparatus according to an embodiment of the present invention. [Figure 5] FIG. 5 is an enlarged cross-sectional view showing a modified example of the bridge beam in the embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0028] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0029] Fig. 1 is a cross-sectional view showing an example of a semiconductor device testing apparatus 1 in this embodiment when a semiconductor wafer 100 and a probe card 20 are separated from each other. Fig. 2 is a cross-sectional view showing an example of a semiconductor device testing apparatus 1 in this embodiment when a semiconductor wafer 100 is pressed against a probe card 20. Fig. 3 is an enlarged cross-sectional view of part III in Fig. 1. Fig. 4 is a block diagram showing an outline of the semiconductor device testing apparatus 1 in this embodiment.

[0030] 1 and 4, the semiconductor device testing apparatus 1 in this embodiment is an apparatus for testing a DUT 110 (see FIG. 4) built into a semiconductor wafer 100. The semiconductor device testing apparatus 1 includes a tester 10, a probe card 20, a wafer prober 30, and an optical control device 60. The DUT 110 corresponds to an example of a "semiconductor device" in an aspect of the present invention, and the wafer prober 30 corresponds to an example of a "semiconductor device handling apparatus" in an aspect of the present invention.

[0031] As shown in Fig. 4, a DUT 110 is formed on a semiconductor wafer 100. Note that, for convenience, one DUT 110 is formed on the semiconductor wafer 100 in Fig. 4, but in reality, a plurality of DUTs 110 are formed on the semiconductor wafer 100.

[0032] Each DUT 110, which is the test target of the semiconductor device testing apparatus 1, is a device capable of handling electrical signals and optical signals, and is a composite circuit element comprising an electronic circuit 111 and an optical circuit 113. The electronic circuit 111 is a circuit that operates based on electrical signals, and has terminals 112 for inputting and outputting electrical signals. As shown in FIG. 1 , the terminals 112 are arranged on the top surface 101 of the semiconductor wafer 100.

[0033] On the other hand, as shown in FIG. 4, the optical circuit 113 is a circuit that operates based on an optical signal or an electrical signal generated from a received optical signal, and is formed using, for example, silicon photonics technology. This optical circuit 113 includes an optical connection unit 114 for inputting and outputting an optical signal. As shown in FIG. 1, the optical connection unit 114 is disposed on the upper surface 101 of the semiconductor wafer 100, similar to the above-described terminal 112. As shown in FIG. 4, the optical connection unit 114 in this embodiment includes, but is not limited to, a light receiving unit 115 that receives an optical signal and a light emitting unit 116 that emits an optical signal. Specific examples of such light receiving unit 115 and light emitting unit 116 include, but are not limited to, a grating coupler, for example.

[0034] When testing this DUT 110, an electrical signal is input / output to / from the electronic circuit 111 via the terminal 112, and an optical signal is input / output to / from the optical circuit 113 via the optical connection section 114. For example, after this test is completed, the semiconductor wafer 100 is diced to separate the DUTs 110, and the separated DUTs 110 are mounted on a substrate and connected to optical fibers to become a final product. This final product is not particularly limited, but may be, for example, a CPO (Co-Packaged Optics) device.

[0035] The DUT 110 to be tested by the semiconductor device test apparatus 1 of this embodiment may be a bare die including the electronic circuit 111 and the optical circuit 113. In other words, the DUT 110 to be tested may be a single die before being mounted on a substrate.

[0036] The tester 10 is a test device that tests a DUT 110 using electrical signals and optical signals, and as shown in FIG. 1, it comprises a test head 11 and a main frame (tester body) 12 (see FIG. 4), and the test head 11 is connected to the main frame 12 via a cable.

[0037] A probe card 20 is electrically connected to the test head 11. The probe card 20 enters the interior of the wafer prober 30 through an opening 32 formed in an upper base 31 of the wafer prober 30. The probe card 20 is fixed relatively to the wafer prober 30.

[0038] The probe card 20 includes a plurality of probes 21 mounted on a wiring board. The probes 21 are electric probes that come into contact with terminals 112 of the DUTs 110 on the semiconductor wafer 100. The plurality of probes 21 are arranged so as to correspond to the plurality of terminals 112 of one DUT 110 on the semiconductor wafer 100. These probes 21 correspond to an example of a "contactor" in this embodiment of the present invention.

[0039] Although not particularly limited, specific examples of the probe 21 include a pogo pin, a vertical probe needle, a cantilever probe needle, an anisotropic conductive rubber sheet, a bump on a membrane, or a contactor fabricated using MEMS technology.

[0040] 1 and 2, the wafer prober 30 includes a moving device 40 and a bridge beam 50. The moving device 40 is a device that holds the semiconductor wafer 100 and moves the semiconductor wafer 100. The moving device 40 is supported by a lower base 33. The lower base 33 corresponds to an example of a "base portion" in an aspect of the present invention.

[0041] The moving device 40 includes a holder 41 and a moving unit 42. The semiconductor wafer 100 is placed on the holder 41, and the holder 41 holds the semiconductor wafer 100. Although not particularly limited, the semiconductor wafer 100 may be held on a wafer tray or the like, and the wafer tray may be fixed to the holder 41, thereby indirectly holding the semiconductor wafer 100 on the holder 41.

[0042] The moving unit 42 can move in the X, Y, and Z directions in the figure, and can also rotate around the Z axis. The moving unit 42 is installed on the lower base 33 of the wafer prober 30 so that the holding unit 41 faces the probes 21 of the probe card 20 in the Z axis direction in the figure. As shown in Figure 2, when the moving unit 42 raises the holding unit 41, it comes into contact with the terminals 112 of the DUT 110 and the probes 21, and the tips of the optical probes 52 face the optical connection units 114 of the DUT 110.

[0043] Although not particularly limited, the moving unit 42 includes, for example, an actuator, a transmission mechanism, and a guide mechanism. Although not particularly limited, specific examples of the actuator include a motor including an electric motor (a rotary motor, a linear motor, or the like) and an electric actuator including the electric motor or the like, while a specific example of the transmission mechanism includes a ball screw mechanism, and an example of the guide mechanism includes a linear guide mechanism including a guide rail and a block that can slide on the guide rail.

[0044] 1 and 2, the probe card 20 is attached to the underside of the bridge beam 50. The bridge beam 50 is a beam-shaped member that receives a reaction force from the probes 21 when the semiconductor wafer 100 and the probe card 20 are brought into contact with each other by the wafer prober 30.

[0045] In this embodiment, the bridge beam 50 is indirectly supported by the support frame 34 via a pair of tilt adjustment mechanisms 35 of the wafer prober 30. The pair of tilt adjustment mechanisms 35 are mechanisms for adjusting the tilt of the bridge beam 50, and the bridge beam 50 is bridged between the pair of tilt adjustment mechanisms 35. The bridge beam 50 is detachably attached to the tilt adjustment mechanisms 35 by bolt screws 57.

[0046] As described above, in this embodiment, the bridge beam 50 is detachably attached to the wafer prober 30. Therefore, a plurality of types of bridge beams 50 can be prepared in advance, and when the probe card 20 is replaced depending on the type of DUT 110, for example, the bridge beam 50 can also be replaced with one corresponding to the probe card 20. Therefore, the bridge beam 50 may be distributed independently of the wafer prober 30 in the market.

[0047] The support frame 34 supports the tilt adjustment mechanism 35 from below. The support frame 34 stands on the lower base 33 and is supported by the lower base 33 from below. In this embodiment, the bridge beam 50 is indirectly supported by the support frame 34, but this is not limiting. The bridge beam 50 may be attached to the support frame 34 or may be directly supported by the support frame 34.

[0048] As shown in FIG. 3, the bridge beam 50 includes a main body 51, an optical probe 52, a holder 53, a first actuator 54, a photodetector 55, and a second actuator 56.

[0049] 1 and 2, the main body 51 is a beam-shaped member that spans between the pair of tilt adjustment mechanisms 35. As shown in FIG. 3, the main body 51 has a bottomed accommodation hole 511 formed therein to accommodate the holder 53 and the first actuator 54. An opening 513 that penetrates the bottom 512 of the accommodation hole 511 is formed in the bottom 512. The opening 513 communicates with the opening 22 of the probe card 20.

[0050] The optical probe 52 in this embodiment is inserted through the accommodation hole 511 of the bridge beam 50 and the opening 22 of the probe card 20. This optical probe 52 emits an optical signal transmitted from an optical signal generating unit 61 of an optical control device 60 (see FIG. 4 ), which will be described later, to the optical connection unit 114 of the DUT 110, and also receives an optical signal emitted from the optical connection unit 114.

[0051] 4, the optical probe 52 in this embodiment emits an optical signal transmitted from the optical signal generating unit 61 to the light receiving unit 115 of the DUT 110. The optical probe 52 also receives an optical signal transmitted from the light emitting unit 116 of the DUT 110 and transmits it to the mainframe 12.

[0052] Such an optical probe 52 is not particularly limited, but may be, for example, an optical fiber cable having a plurality of optical fibers. Furthermore, the optical probe 52 may further include an optical element such as a mirror in addition to the optical fiber cable.

[0053] 3, the optical probe 52 is held by a holder 53. The holder 53 in this embodiment is attached to a first actuator 54, and fixes the position of the optical probe 52 relative to the first actuator 54. The holder 53 in this embodiment has a holding hole 531. The optical probe 52 is inserted into this holding hole 531 and is held by the inner wall of the holding hole 531.

[0054] Although the holder 53 in this embodiment is exemplified as a holder that holds the optical probe 52 by the holding hole 531, the present invention is not limited to this, and various fixing devices can be used as the holder 53. For example, the holder 53 may be a clip, a clamp, or the like that can clamp and fix the optical probe 52.

[0055] Furthermore, the position of the optical connection section 114 of the DUT 110 changes depending on the type of the DUT 110, but by changing the type of holder 53 depending on the type of the DUT 110, it is possible to accommodate changes in the position of the optical connection section 114.

[0056] The holder 53 is fixed to a first actuator 54. The first actuator 54 is an electric actuator that moves the optical probe 52 fixed to the holder 53 relative to the DUT 110.

[0057] The first actuator 54 includes a mounting stage 541 and a driving unit 542. The mounting stage 541 is a stage for fixing the holder 53. The driving unit 542 moves the mounting stage 541 based on a control signal from a driving control unit 62 (see FIG. 4) described later.

[0058] The driving unit 542 in this embodiment is not particularly limited, but can move the mounting stage 541 in the X direction, Y direction, Z direction, roll direction, pitch direction, and yaw direction. That is, the first actuator 54 in this embodiment has six degrees of freedom. An example of such a first actuator 54 is an actuator such as SmarPod manufactured by SmarAct. However, the first actuator 54 is not limited to this. The first actuator 54 may be any actuator as long as the driving unit 542 is provided with a motor, a transmission mechanism, and a guide mechanism. Note that the driving unit 542 may have at least three degrees of freedom, i.e., in the X direction, Y direction, and Z direction.

[0059] The first actuator 54 has an insertion hole 543 that penetrates the mounting stage 541 and the drive unit 542. This insertion hole 543 communicates with the holding hole 531 of the holder 53 and the opening 513 of the main body 51, and the optical probe 52 passes through the inside of the insertion hole 543. In this embodiment, the optical probe 52 is inserted into the accommodation hole 511 of the bridge beam 50 and the opening 22 of the probe card 20, but the present invention is not limited to this.

[0060] The optical detector 55 detects the optical signal emitted from the optical probe 52 and outputs the detection result. The optical detector 55 is provided to measure the intensity of the optical signal emitted from the optical probe 52, and the optical detector 55 transmits the detection result to an intensity calculation unit 63 of the light control device 60 (see FIG. 4), which will be described later. An example of such an optical detector 55 is a photodetector. The optical detector 55 corresponds to an example of the "optical detection unit" in this aspect of the present invention.

[0061] The photodetector 55 is fixed to a second actuator 56. In this embodiment, the second actuator 56 is provided in the main body 51. The second actuator 56 moves the photodetector 55 relative to the optical probe 52, thereby moving the photodetector 55 to a position where it can receive an optical signal. Furthermore, during testing of the DUT 110, the second actuator 56 retracts the photodetector 55 and moves it to a position where it does not receive an optical signal. Such a second actuator 56 is not particularly limited, but an air cylinder or the like can be exemplified.

[0062] 4, the light control device 60 is optically connected to the optical probe 52 and the photodetector 55, and is electrically connected to the first and second actuators 54, 56 and the main frame 12. The light control device 60 has an optical signal generation unit 61, a drive control unit 62, and an intensity calculation unit 63. The intensity calculation unit 63 corresponds to an example of the "calculation device" in this aspect of the present invention.

[0063] The optical signal generating unit 61 transmits a test optical signal to the light receiving unit 115 of the DUT 110 via the optical probe 52. The optical signal generating unit 61 is not particularly limited, but examples thereof include light emitting elements such as LDs and LEDs driven by signals from a pattern generator or the like. The optical signal generating unit 61 may generate an optical signal based on a signal from the tester 10 (such as a signal from the test head 11 or a signal from the mainframe 12), but is not particularly limited thereto.

[0064] The drive control unit 62 controls the first actuator 54 and the second actuator 56. As will be described in detail later, the drive control unit 62 in this embodiment controls the first actuator 54 to align the optical probe 52 with the DUT 110 by moving the optical probe 52 relative to the DUT 110 while the moving device 40 presses the DUT 110 against the probe card 20, as shown in FIG.

[0065] On the other hand, the drive control unit 62 controls the second actuator 56 to move the photodetector 55 to a position where it can receive an optical signal, as shown in Fig. 3. The control of the second actuator 56 by the drive control unit 62 is not particularly limited, but is executed when the type of the DUT 110 is changed or every time a predetermined number of tests (for example, 1000 times) are performed.

[0066] 4, the intensity calculation unit 63 calculates the intensity of the optical signal based on the detection result of the optical detector 55. Then, the intensity calculation unit 63 determines that the optical probe 52 is normal when the detection result output from the optical detector 55 is an optical intensity within a predetermined range, and determines that the optical probe 52 is abnormal when the detection result is an optical intensity outside the predetermined range. Specifically, the optical probe 52 is normal when, for example, the optical probe 52 is clean or when the optical probe 52 is not malfunctioning. On the other hand, the optical probe 52 is abnormal when, for example, a foreign substance attached to the optical probe 52 blocks the optical signal or when the optical probe 52 is malfunctioning.

[0067] The drive control unit 62 and the intensity calculation unit 63 are configured, for example, by a computer. Although not particularly shown, this computer is an electronic calculator equipped with a CPU (processor), a main memory device (RAM, etc.), an auxiliary memory device (hard disk, SSD, etc.), an interface, etc. The above-mentioned control is functionally realized, for example, by the drive control unit 62 and the intensity calculation unit 63 executing a program. Note that the drive control unit 62 and the intensity calculation unit 63 may be configured by a circuit board instead of a computer.

[0068] A method for pressing the DUT 110 against the probe card 20 by the wafer prober 30 described above will be described below. First, before operating the moving device 40, the relative positional relationship between the probe 21 and the optical probe 52 is measured based on image information captured by the first camera 70. Based on the measurement results, the position of the optical probe 52 is adjusted by the first actuator 54 so that the positional relationship between the probe 21 and the optical probe 52 coincides with the positional relationship (design value) between the terminal 112 and the optical connection part 114 of the DUT 110. By thus adjusting the positional relationship between the probe 21 and the optical probe 52 to the positional relationship between the terminal 112 and the optical connection part 114 in advance, it is possible to reduce the search range and search time depending on the light intensity, as will be described later.

[0069] Next, the semiconductor wafer 100 is fixed to the holder 41 of the moving device 40, and the relative positional relationship between the probes 21 and the terminals 112 is measured based on the image information captured by the second camera 75.

[0070] Next, based on the relative positional relationship between the probes 21 and the terminals 112, the tester 10 controls the moving device 40 to move the semiconductor wafer 100 to a position where the probes 21 and the terminals 112 face each other. In other words, the semiconductor wafer 100 is aligned with the probe card 20 so that the probes 21 and the terminals 112 face each other.

[0071] Next, the moving device 40 raises the semiconductor wafer 100, thereby pressing the semiconductor wafer 100 against the probe card 20 and bringing the probes 21 into contact with the terminals 112. At this time, as shown in FIG. 2, the optical connection portions 114 and the optical probes 52 are spaced apart from each other.

[0072] Next, the drive control unit 62 controls the first actuator 54 to align the optical connection unit 114 and the optical probe 52. Although not particularly limited, the relative positional relationship between the optical connection unit 114 and the optical probe 52 is recognized, for example, based on the intensity of light output from the optical connection unit 114. Specifically, light output from the optical signal generation unit 61 of the optical control device 60 (see FIG. 4) is irradiated from the optical probe 52 toward the top surface 101 of the semiconductor wafer 100, including the optical connection unit 114. Then, the light output from the optical connection unit 114 is acquired by the optical probe 52 via a loopback circuit incorporated in the optical circuit of the DUT 110. While performing this operation, the drive control unit 62 of the optical control device 60 (see FIG. 4) causes the first actuator 54 to scan the optical probe 52 along the top surface 101 of the semiconductor wafer 100. Then, the tester 10 measures the intensity of the light output from the optical connection section 114, and the drive control section 62 stops the movement of the optical probe 52 at the position where the intensity of the light reaches a predetermined value or higher, thereby positioning the optical probe 52 relative to the optical connection section 114.

[0073] Furthermore, the alignment in this embodiment may include moving the optical probe 52 in the Z direction (thickness direction of the main body). The probe 21 of the probe card 20 is deformed by being contracted by the terminal 112, but the probe 21 gradually wears out, and the amount of deformation (overdrive amount) changes depending on the number of tests performed. As a result, the position of the semiconductor wafer 100 in the Z direction during testing changes depending on the number of tests performed. In contrast, since the first actuator 54 in this embodiment has a degree of freedom in the Z direction, the relative positions of the optical probe 52 and the optical connection part 114 in the Z direction can be aligned for each test.

[0074] As described above, in this embodiment, in addition to the moving device 40 that can change the relative position between the terminal 112 and the probe 21, the bridge beam 50 is provided with the first actuator 54 that can change the relative position between the optical connection section 114 and the optical probe 52. Therefore, the relative positional relationship between the DUT 110 and the optical probe 52 can be adjusted independently, and the positioning accuracy of the optical probe 52 with respect to the DUT 110 can be improved.

[0075] Furthermore, in this embodiment, the optical probe 52 and the first actuator 54 are provided on the bridge beam 50, so that the semiconductor device testing apparatus 1 can be provided with the function of moving the optical probe 52 independently and positioning the optical probe 52 with high precision relative to the DUT 110 without having to make major modifications to the semiconductor device testing apparatus 1.

[0076] It should be noted that the above-described embodiments have been described to facilitate understanding of the present invention, and are not intended to limit the present invention. Therefore, the elements disclosed in the above embodiments are intended to include all design modifications and equivalents that fall within the technical scope of the present invention.

[0077] For example, the first actuator 54 in the above embodiment may have a structure that allows for coarse alignment and fine alignment, as shown in Fig. 5. Fig. 5 is an enlarged cross-sectional view showing a modified example of the bridge beam 50 in this embodiment.

[0078] 5, the first actuator 54 in this modification includes a third actuator 544 and a fourth actuator 545. The third actuator 544 is placed on the bottom 512 of the accommodation hole 511. The third actuator 544 is an actuator that roughly aligns the optical probe 52 with respect to the DUT 110. This rough alignment roughly positions the optical probe 52 with respect to the DUT 110. An example of the third actuator 544 is an electric actuator equipped with a general electric motor.

[0079] The fourth actuator 545 is fixed to the third actuator 544. The fourth actuator 545 is an actuator that precisely aligns the optical probe 52 with respect to the DUT 110, and moves the optical probe 52 more precisely than the third actuator 544. This precise alignment allows the optical probe 52 to be positioned with high accuracy with respect to the DUT 110. The fourth actuator 545 is not particularly limited, but an impact-driven motor equipped with an ultrasonic motor can be exemplified.

[0080] In such a variant, the optical probe 52 can be coarsely aligned to the DUT 110 using the third actuator 544, and then the optical probe 52 can be precisely aligned to the DUT 110 using the fourth actuator 545, allowing for alignment with greater precision.

[0081] Furthermore, although the bridge beam 50 in the above embodiment includes one optical probe 52, the present invention is not limited to this and may include a plurality of optical probes 52. [Explanation of symbols]

[0082] 1...Semiconductor device testing equipment 10...Tester 11...Test head 12...Mainframe 20...Probe card 21...Probe 22…Aperture 30...Wafer prober 31...Upper Base 32…Aperture 33...Lower base 34...Support frame 35…Tilt adjustment mechanism 40...Moving device 41...Holding part 42...Moving section 50...Bridge beam 51...Main body 511... Storage hole 512…Bottom 513...Aperture 52...Optical probe 53...Holder 531...Retaining hole 54...First actuator 541...Placement stage 542...Drive unit 543...Through hole 544...Third actuator 545...Fourth actuator 55...Photodetector 56...Second actuator 57...Bolt screw 60...Light control device 61...optical signal generating unit 62...Drive control unit 63...Strength calculation section 70...First camera 75...Second camera 100...Semiconductor wafer 101…Top surface 110...DUT 111...Electronic circuit 112...Terminal 113...Optical circuit 114...Optical connection part 115...Light receiving section 116...Light emitting part

Claims

1. A bridge beam attached to a semiconductor device handling apparatus that handles semiconductor devices, a beam-shaped main body on which a probe card having contacts electrically connected to terminals of the semiconductor device is mounted; a first actuator attached to the main body portion and configured to emit an optical signal to the semiconductor device and / or move an optical probe incident thereon relative to the semiconductor device.

2. 2. The bridge beam of claim 1, The bridge beam further comprises a holder attached to the first actuator and configured to hold the optical probe.

3. 2. The bridge beam of claim 1, the bridge beam further includes an optical detection unit that detects the optical signal emitted from the optical probe; The optical detector outputs the detection result to a calculation device that calculates the intensity of the optical signal based on the detection result of the optical detector.

4. 4. The bridge beam of claim 3, The bridge beam further includes a second actuator that moves the optical detection unit relative to the optical probe, thereby moving the optical detection unit to a position where it can receive the optical signal.

5. 2. The bridge beam of claim 1, The bridge beam further comprises the optical probe.

6. 2. The bridge beam of claim 1, The first actuator is a bridge beam having three degrees of freedom in the X, Y, and Z directions.

7. 7. The bridge beam of claim 6, The Z direction is a thickness direction of the main body portion, The first actuator is a bridge beam capable of adjusting the relative distance between the optical probe and the semiconductor device in the Z direction.

8. 2. The bridge beam of claim 1, The bridge beam is detachably attached to the semiconductor device handling apparatus.

9. 2. The bridge beam of claim 1, the first actuator aligns the optical probe with respect to the semiconductor device; The first actuator includes: a third actuator for coarsely aligning the optical probe with respect to the semiconductor device; a fourth actuator for finely aligning the optical probe with respect to the semiconductor device after the coarse alignment is complete.

10. A semiconductor device handling apparatus for handling semiconductor devices, comprising: A semiconductor device handling apparatus comprising the bridge beam of claim 1.

11. 11. The semiconductor device handling apparatus according to claim 10, The semiconductor device handling apparatus further comprises a probe card attached to the bridge beam and having contacts for electrically connecting with terminals of the semiconductor devices.

12. 11. The semiconductor device handling apparatus according to claim 10, The semiconductor device handling apparatus includes: a moving device that moves the semiconductor device to bring the terminals and the contacts into contact with each other and presses the semiconductor device against the probe card; a base portion supporting the moving device; The semiconductor device handling apparatus further comprises a support frame erected on the base portion and supporting the bridge beam.

13. 13. The semiconductor device handling apparatus of claim 12, A semiconductor device handling apparatus, wherein the first actuator aligns the optical probe with the semiconductor device by moving the optical probe relative to the semiconductor device while the moving device presses the semiconductor device against the probe card.

14. 11. The semiconductor device handling apparatus according to claim 10, the bridge beam further includes an optical detection unit that detects the optical signal emitted from the optical probe and outputs a detection result; The semiconductor device handling apparatus includes a calculation device that calculates the intensity of the optical signal based on the detection result output from the optical detection unit.

15. 15. The semiconductor device handling apparatus of claim 14, The calculation device determines that the optical probe is normal when the detection result output from the light detection unit is within a predetermined range of light intensity.

16. A semiconductor device testing apparatus for testing a semiconductor device, comprising: A semiconductor device handling apparatus according to any one of claims 10 to 15, the probe card; a tester to which the probe card is electrically connected and which tests the semiconductor device.

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