Support material and package

Abstract

When a load is applied to the leg portion in a state where the electronic device is accommodated in the packaging box, the leg portion may be deformed. In order to avoid such a problem, it is conceivable to dispose the buffer material at a position away from the leg portion. However, since the layout of the leg portions is determined by the arrangement, weight, and the like of components incorporated in the electronic device, in some cases, the leg portions are densely arranged or irregularly arranged, which makes it difficult to arrange the cushioning material. Further, since it is difficult to arrange the cushioning material in this way, even if the product is directly placed on the plate-shaped portion of the support material, there is a possibility that the leg portion is deformed.SOLUTION: In a support material having a plate-like part for supporting an electronic apparatus in a packed state, the plate-like part has a hole for receiving a plurality of leg parts provided on a bottom surface of the electronic apparatus, and a thickness dimension of the plate-like part and a depth dimension of the hole are equal to or larger than a projection dimension of the leg part from the bottom surface.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present invention relates to a support for supporting an electronic device in a packaged state.The present invention also relates to a packaged product. [Background technology]

[0002] Conventionally, cushioning materials have been used to buffer external forces applied to electronic devices, as shown in Patent Document 1. Specifically, in Patent Document 1, the electronic device is housed in a packaging box. In addition to the electronic device, the packaging box also houses a support material for supporting the electronic device. The support material has a flat plate-like portion, and the plate-like portion is provided with a plurality of cushioning materials for buffering external forces applied to the electronic device. The electronic device is supported by the support material via the cushioning materials. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2023-120487 Summary of the Invention [Problem to be solved by the invention]

[0004] The bottom of an electronic device may be provided with legs, such as rubber legs, to support the main body of the electronic device. When the electronic device is housed in a packaging box, if a load is applied to the legs, the legs may be deformed, which is undesirable for the product to be provided to the user. While it is expected that the legs will deform in the user's environment, it is undesirable for the legs to be already deformed when the product is provided.

[0005] For example, the packaging box described in Patent Document 1 uses a support material to support an electronic device. The support material has a plate-shaped portion equipped with a cushioning material, which supports the electronic device. However, if some of the multiple legs climb onto the cushioning material, the leg may be deformed. To avoid this problem, it may be possible to position the cushioning material away from the legs. However, the layout of the legs is determined by the arrangement and weight of the components built into the electronic device. In some cases, the legs may be densely or irregularly arranged, making it difficult to position the cushioning material. Furthermore, because this difficulty in positioning the cushioning material makes it possible for the legs to be deformed even if the product is placed directly on the plate-shaped portion of the support material. [Means for solving the problem]

[0006] In order to solve the above problem, the support material of the present invention is a support material having a plate-shaped portion that supports an electronic device in a packaged state, wherein the plate-shaped portion has holes that accept multiple legs provided on the bottom surface of the electronic device, and the thickness dimension of the plate-shaped portion and the depth dimension of the holes are greater than or equal to the protrusion dimension of the legs from the bottom surface.

[0007] The packaging product of the present invention is characterized by comprising an electronic device having a plurality of legs on its bottom surface, the support material that supports the electronic device in a packaged state, cushioning material that cushions impacts applied to the electronic device, and a packaging box in which the electronic device, the support material, and the cushioning material are stored. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. [Figure 2] FIG. 2 is a perspective view of the packaged product with the lid of the packaging box open. [Figure 3] FIG. [Figure 4] FIG. [Figure 5] 3 is a cross-sectional view of the package taken along line AA in FIG. 2. [Figure 6]FIG. 2 is a perspective view of a support material, a cushioning material, a corner protection member, and a partition member. [Figure 7] FIG. [Figure 8] FIG. 10 is a plan view of the support material that supports the electronic device, viewed from the second surface side. [Figure 9] FIG. [Figure 10] 3A and 3B are diagrams illustrating a support material, a cushioning material, and legs of the electronic device. [Figure 11] 10A and 10B are diagrams illustrating a support material, a cushioning material, and a leg portion of an electronic device according to another embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] The present invention will be briefly described below. The support material of the first aspect is a support material having a plate-shaped portion that supports an electronic device in a packaged state, the plate-shaped portion having holes that receive multiple legs provided on the bottom surface of the electronic device, and the thickness dimension of the plate-shaped portion and the depth dimension of the holes are greater than or equal to the protrusion dimension of the legs from the bottom surface.

[0010] According to this aspect, the support member has a plate-like portion that supports the electronic device in a packaged state, and has holes that receive multiple legs provided on the bottom surface of the electronic device, and the depth of the holes is equal to or greater than the length of the legs that protrude from the bottom surface, so that the bottom surface of the electronic device comes into contact with the plate-like portion and is supported. This makes it difficult for a load to be applied to the legs, and prevents deformation of the legs. In addition, since the thickness of the plate-like portion is equal to or greater than the protrusion of the legs from the bottom surface, the legs do not get in the way when providing cushioning material on the surface of the plate-like portion opposite the surface that supports the electronic device, improving the degree of freedom in arranging the cushioning material and making it easier to arrange the cushioning material. In other words, the cushioning material can be arranged in a desired position without being affected by the layout of the legs.

[0011] A second aspect is an aspect dependent on the first aspect, characterized in that the hole is a through-hole that penetrates the plate-like portion in a thickness direction. According to this aspect, the holes are through holes that penetrate the plate-like portion in the thickness direction, and therefore the holes can be formed easily and at low cost.

[0012] A third aspect is an aspect dependent on the first aspect, characterized in that the holes are blind holes that do not penetrate the plate-like portion in a thickness direction. According to this aspect, since the holes are blind holes that do not penetrate the plate-shaped portion in the thickness direction, the thickness of the plate-shaped portion can be ensured and the rigidity of the plate-shaped portion can be improved.

[0013] A fourth aspect is an aspect dependent on the first aspect, characterized in that the plate-shaped portion is made of corrugated cardboard. According to this aspect, the plate-shaped portion is made of corrugated cardboard, and therefore, a predetermined impact absorbing effect can be obtained by the plate-shaped portion. It should be noted that this aspect is not limited to the first aspect, but may be subordinate to the second or third aspect.

[0014] The fifth aspect is a dependent aspect of the first aspect, characterized in that a plurality of shock-absorbing materials are provided on the surface of the plate-shaped portion opposite to the surface that supports the electronic device. According to this aspect, since a plurality of cushioning materials are provided on the surface of the plate-shaped portion opposite to the surface supporting the electronic device, an appropriate shock-absorbing effect can be obtained. Furthermore, the effect of the first aspect increases the degree of freedom in arranging the cushioning materials, making it easier to arrange the cushioning materials. In particular, the cushioning materials can be arranged in desired positions without being affected by the layout of the legs. It should be noted that this aspect is not limited to the first aspect, but may be subordinate to any of the second to fourth aspects.

[0015] The sixth aspect is a dependent aspect of the fifth aspect, characterized in that the holes are through holes that penetrate the thickness direction of the plate-like portion, and when the plate-like portion is viewed in a plane, a portion of the cushioning material is located in a position that overlaps at least a portion of the plurality of holes.

[0016] According to this aspect, the holes are through holes that penetrate the plate-like portion in the thickness direction, and therefore the holes can be formed easily and at low cost. Furthermore, when the plate-shaped portion is viewed in a plane, a portion of the cushioning material is positioned so as to overlap at least a portion of the plurality of holes. Therefore, when the electronic device is subjected to an impact from being dropped, at least a portion of the plurality of legs can be supported by the cushioning material, i.e., the impact can be absorbed by both the cushioning material and the legs.

[0017] The seventh aspect is a dependent aspect of the fourth aspect, and is characterized in that a plurality of shock-absorbing cushioning materials made of cardboard are provided on the surface of the plate-shaped portion opposite the surface that supports the electronic device. According to this aspect, since a plurality of cushioning materials are provided on the surface of the plate-shaped portion opposite to the surface supporting the electronic device, an appropriate shock-absorbing effect can be obtained. Furthermore, the effect of the first aspect increases the degree of freedom in arranging the cushioning materials, making it easier to arrange the cushioning materials. In particular, the cushioning materials can be arranged in desired positions without being affected by the layout of the legs. Furthermore, since both the plate-shaped portion and the cushioning material are made of cardboard, the plate-shaped portion and the cushioning material can be considered as a whole as a cushioning material. This makes it easier to design impact cushioning. In addition, by considering the plate-shaped portion as part of the cushioning material, the overall thickness of the package can be reduced when the cushioning material is provided in addition to the plate-shaped portion, which in turn contributes to reducing the height of the entire package.

[0018] An eighth aspect is a mode dependent on the first aspect, characterized in that the plate-like portion has a size sufficient to cover the electronic device in a plan view. According to this aspect, the plate-shaped portion is large enough to cover the electronic device in a plan view, and therefore can appropriately support the electronic device. It should be noted that this aspect is not limited to the first aspect, but may be subordinate to any of the second to sixth aspects.

[0019] The packaging product of the ninth aspect is characterized by comprising an electronic device having a plurality of legs on its bottom surface, a support material of any of the first to eighth aspects that supports the electronic device in a packaged state, a cushioning material that absorbs impacts applied to the electronic device, and a packaging box in which the electronic device, the support material, and the cushioning material are stored. According to this aspect, the packaged product can achieve the effects of any one of the first to eighth aspects described above.

[0020] A tenth aspect of the present invention is characterized in that in the ninth aspect, the support material, the cushioning material, and the packaging box are made of cardboard. According to this aspect, since the support material, the cushioning material, and the packaging box are made of cardboard, it is possible to eliminate the use of plastic in packaging materials. Furthermore, since both the support material and the cushioning material are made of cardboard, the support material and the cushioning material can be considered as a whole cushioning material. This makes it easier to design impact cushioning. In addition, by considering the support material as part of the cushioning material, the overall thickness dimension when the cushioning material is provided in addition to the support material can be reduced, and therefore the height dimension of the entire package can be reduced.

[0021] The present invention will be specifically described below. 1 and 2, packaged product 1 is configured by accommodating electronic device 50 and various packaging materials in packaging box 2. Electronic device 50 is supported by support material 6 inside packaging box 2. Cushioning material 10 (see FIG. 6) is provided below plate-shaped portion 7. Inside packaging box 2, corners of the top surface of electronic device 50 are protected by corner protection members 3 and 4. In this embodiment, of the components of packaged product 1, packaging box 2, corner protection members 3 and 4, plate-shaped portion 7, and cushioning materials 10 and 11 are all made of cardboard.

[0022] Here, the electronic device 50 is, for example, a printing device such as an inkjet printer, etc. However, the electronic device 50 is not limited to a printing device, and may be other electronic devices such as an image reading device that reads an image of a document, a projector that projects an image, a monitor that displays an image, or a computer that processes information. The package 1 will be described in detail below.

[0023] The XYZ coordinate system shown in each drawing is a Cartesian coordinate system for explaining each component of package 1, and is based on the component of electronic device 50. Electronic device 50 is hexahedral in shape and has a front surface 51, a right side surface 52, a left side surface 53, a top surface 54, a back surface 55, and a bottom surface 56 (see FIG. 5). The XY plane is a plane parallel to bottom surface 56 and top surface 54, the XZ plane is a plane parallel to front surface 51 and back surface 55, and the YZ plane is a plane parallel to right side surface 52 and left side surface 53.

[0024] In this embodiment, the Z-axis direction is parallel to the vertical direction, the +Z direction in which the arrow points is the vertically upward direction, and the opposite, -Z direction is the vertically downward direction. The X-axis direction is the width direction of the electronic device 50, the +X direction in which the arrow points is the left direction as seen by an operator facing the front surface 51, and the opposite, -X direction is the right direction. The Y-axis direction is the depth direction of the electronic device 50, the +Y direction in which the arrow points is the direction from the back surface 55 to the front surface 51, and the opposite, -Y direction is the direction from the front surface 51 to the back surface 55. An operation panel (not shown) is provided on a front surface 51 of the electronic device 50. Below, each component of the package 1 will be explained using such an XYZ coordinate system.

[0025] The support material 6 and the buffer material 10 provided below the support material 6 will be explained later, and the corner protection members 3 and 4 and the partition member 5 will be explained first below. 3 , the corner protection member 3 has plate-shaped portions 3a-1, 3a-2, 3a-3, and 3a-4. The plate-shaped portion 3a-1 faces a left side surface 53 of the electronic device 50. The plate-shaped portion 3a-2 faces a +X direction region of a top surface 54 of the electronic device 50. The plate-shaped portion 3a-3 faces a +X direction region of a front surface 51 of the electronic device 50. The plate-shaped portion 3a-4 faces a +X direction region of a back surface 55 of the electronic device 50.

[0026] Cushioning material 11 for absorbing impact is provided at a position on each plate-shaped portion facing each surface of electronic device 50. In this embodiment, a laminated block of stacked cardboard is used as cushioning material 11. In this embodiment, the cardboard constituting cushioning material 11 has a square shape in a plan view, but may have a rectangular or other shape. Cushioning material 11 can be bonded to each plate-shaped portion with an adhesive. Various adhesives, including hot-melt types, can be used as the adhesive, but it is preferable that the adhesive does not contain organic solvents. By covering the upper part of the electronic device 50 in the +X direction with such a corner protection member 3, two corners at the upper part in the +X direction, namely, the corner formed by the top surface 54, the front surface 51, and the left side surface 53, and the corner formed by the top surface 54, the back surface 55, and the left side surface 53, are protected.

[0027] Next, the corner protection member 4 has plate-shaped portions 4a-1, 4a-2, 4a-3, and 4a-4, as shown in Fig. 4. The plate-shaped portion 4a-1 faces a right side surface 52 of the electronic device 50. The plate-shaped portion 4a-2 faces a -X direction region of a top surface 54 of the electronic device 50. The plate-shaped portion 4a-3 faces a -X direction region of a front surface 51 of the electronic device 50. The plate-shaped portion 4a-4 faces a -X direction region of a back surface 55 of the electronic device 50. The above-mentioned buffer material 11 is provided on each plate-like portion at a position facing each surface of the electronic device 50.

[0028] By covering the upper part of the electronic device 50 in the -X direction with such a corner protection member 4, two corners at the upper part in the -X direction, namely, the corner formed by the top surface 54, the front surface 51, and the right side surface 52, and the corner formed by the top surface 54, the back surface 55, and the right side surface 52, are protected.

[0029] Furthermore, among the cushioning materials 11 provided on the corner protection members 3 and 4, the cushioning materials 11 facing the side surfaces that form the periphery of the electronic device 50, i.e., the front surface 51, right side surface 52, left side surface 53, and back surface 55, hold the electronic device 50 immovable in the XY plane while it is housed in the packaging box 2. Among the cushioning materials 11 provided on the corner protection members 3 and 4, the cushioning material 11 facing the top surface 54 of the electronic device 50, and a cushioning material 10 described later, hold the electronic device 50 immovable in the Z-axis direction while it is housed in the packaging box 2. Furthermore, the cushioning materials 11 provided on the corner protection members 3 and 4 and a cushioning material 10 described later protect the electronic device 50 from impacts applied to the packaged item 1 from various directions.

[0030] As shown in FIG. 1 , a partition member 5 is provided in the −X direction relative to the corner protection member 4. The partition member 5 includes a plate-shaped portion 5a that forms a surface along the plate-shaped portion 4a-1 of the corner protection member 4, and a partition plate 5b that forms a surface along the YZ plane. Multiple partition plates 5b are provided at intervals along the Y-axis direction. As a result, as shown in FIG. 2 , when the electronic device 50, corner protection member 3, and corner protection member 4 are housed in the packaging box 2, storage spaces 2a and 2b are formed along the Y-axis direction at the −X-direction end of the inside of the packaging box 2 between the partition member 5 and the packaging box 2. Accessories for the electronic device 50, such as a power cable (not shown) and ink bottles (not shown) in this embodiment, can be stored in the storage spaces 2a and 2b. If there is no need to store accessories, the partition member 5 may be omitted.

[0031] Next, the support member 6 that supports the electronic device 50 will be described. 1, the support material 6 has a flat plate-like portion 7 that supports the electronic device 50. As shown in Fig. 5, the plate-like portion 7 has a first surface 7a that supports the electronic device 50 and an opposite second surface 7b. In this embodiment, the plate-like portion 7 is made of cardboard. 1, 6, 7, and 8, a plurality of holes 8 are provided in the plate-shaped portion 7. The holes 8 according to this embodiment are through holes that penetrate the plate-shaped portion 7 in the thickness direction. However, the holes 8 may also be blind holes that have a bottom. The thickness direction of the plate-shaped portion 7 is the normal direction to the first surface 7a and the second surface 7b, and in this embodiment, the thickness direction of the plate-shaped portion 7 is along the Z-axis direction. The thickness of the plate-shaped portion 7 can also be referred to as the distance between the first surface 7a and the second surface 7b.

[0032] Here, a plurality of legs 57 are provided on the bottom surface 56 of the electronic device 50 as shown in Fig. 7. Note that the legs 57 are shown as hatched squares in Figs. 7 and 8 for convenience. The legs 57 are provided so as to protrude vertically downward from the bottom surface 56 of the electronic device 50 as shown in Fig. 10. The legs 57 are, for example, rubber legs, and a plurality of the legs 57 are provided on the bottom surface 56 as shown in Fig. 7. In this embodiment, the legs 57 are provided so as to be unevenly distributed around the four corners of the bottom surface 56. In FIG. 7, the plate-shaped portion 7 and a cushioning material 10, which will be described later, are depicted by imaginary lines (two-dot chain lines).

[0033] As shown in FIG. 8, the holes 8 provided in the plate-like portion 7 are provided at positions corresponding to all of the leg portions 57 so that all of the leg portions 57 can be received. When the electronic device 50 is placed on the plate-shaped portion 7, all of the legs 57 can fit into the corresponding holes 8. In FIG. 8, a cushioning material 10, which will be described later, is depicted by an imaginary line (two-dot chain line).

[0034] FIG. 10 is a diagram showing a schematic view of the plate-shaped portion 7, the cushioning material 10, and the leg portion 57, and is a diagram showing the dimensional relationship of each component in the Z-axis direction. Reference symbol d1 denotes the thickness of the plate-shaped portion 7. Reference symbol d2 denotes the protrusion of the leg portion 57 from the bottom surface 56. Reference symbol d3 denotes the depth of the hole 8. If the hole 8 is a through-hole, the thickness d1 of the plate-shaped portion 7 and the depth d3 of the hole 8 are equal. In this embodiment, the thickness d1 of the plate-like portion 7 and the depth d3 of the hole 8 are equal to or greater than the protrusion d2 of the leg portion 57 from the bottom surface 56.

[0035] Since the depth dimension d3 of the hole 8 is equal to or greater than the protrusion dimension d2 from the bottom surface 56 of the leg portion 57, when the electronic device 50 is supported on the plate-shaped portion 7, the bottom surface 56 of the electronic device 50 is in contact with and supported by the first surface 7a of the plate-shaped portion 7. As a result, it is difficult for a load to be applied to the leg portion 57, and deformation of the leg portion 57 can be suppressed. In addition, since the thickness dimension d1 of the plate-shaped portion 7 is equal to or greater than the protrusion dimension d2 of the leg portions 57 from the bottom surface 56, the leg portions 57 do not get in the way when providing the cushioning material 10, which will be described later, on the second surface 7b of the plate-shaped portion 7, improving the degree of freedom in arranging the cushioning material 10 and making it easier to arrange the cushioning material 10. In particular, the cushioning material 10 can be arranged in a desired position without being affected by the layout of the leg portions 57. Furthermore, since the bottom surface 56 of the electronic device 50 is in contact with and supported by the first surface 7a of the plate-shaped portion 7, if the plate-shaped portion 7 is considered to be part of the electronic device 50, the rigidity of the entire electronic device 50 during transportation can be increased. As a result, it is possible to avoid providing a separate support member for supporting the electronic device 50 below the electronic device 50.

[0036] The thickness d1 of the plate-like portion 7 and the depth d3 of the hole 8 may be the same as the protruding dimension d2 of the leg portion 57 from the bottom surface 56, or may be larger than the protruding dimension d2. Furthermore, in this embodiment, one hole 8 is provided for one leg portion 57, but this is not limiting, and one hole 8 may be provided for a plurality of leg portions 57.

[0037] In this embodiment, the holes 8 are through-holes that penetrate the plate-like portion 7 in the thickness direction. This allows the holes 8 to be formed easily and at low cost. The through-holes can be formed by, for example, punching. In addition, in this embodiment, the plate-shaped portion 7 is made of corrugated cardboard, and therefore the plate-shaped portion 7 can provide a predetermined shock absorbing effect. However, the plate-like portion 7 is not limited to being made of corrugated cardboard, and may of course be made of other suitable materials.

[0038] 8, which is a plan view, the plate-shaped portion 7 is large enough to cover the electronic device 50 in a plan view. Since the plate-shaped portion 7 is large enough to cover the electronic device 50 in a plan view, the electronic device 50 can be appropriately supported. If the plate-shaped portion 7 is not large enough to cover the electronic device 50 in a planar view, multiple plate-shaped portions 7 may be used to support the electronic device 50. In this case, it may not be possible to adequately cushion the impact on the electronic device 50. However, if the plate-shaped portion 7 is large enough to cover the electronic device 50 in a planar view, it is possible to adequately cushion the impact on the electronic device 50.

[0039] Next, the buffer material 10 provided on the second surface 7b of the plate-shaped portion 7 will be described. As shown in FIG. 6, a plurality of shock-absorbing cushioning materials 10 are provided on the second surface 7b of the plate-shaped portion 7. In this embodiment, the cushioning materials 10 are laminated blocks of stacked cardboard, similar to the cushioning material 11 described above. In this embodiment, the cardboard constituting the cushioning material 10 has a square shape in a plan view, but may have a rectangular or other shape. The cushioning materials 10 can be bonded to the plate-shaped portion 7 with an adhesive. This adhesive is similar to the adhesive used to bond the cushioning material 11 described above.

[0040] In this way, since a plurality of cushioning materials 10 are provided on the second surface 7b of the plate-shaped portion 7, an appropriate shock absorbing effect can be obtained. Furthermore, as described above, the degree of freedom in arranging the cushioning materials 10 is improved, and the cushioning materials 10 can be easily arranged. In particular, the cushioning materials 10 can be arranged in desired positions without being affected by the layout of the leg portions 57.

[0041] The cushioning material 10 according to this embodiment is made by joining a plurality of cardboard sheets with an adhesive, and has a first cushioning portion 10a and a second cushioning portion 10b as shown in FIG. The first buffer section 10a is made up of a stack of first buffer sheets 10c, and the second buffer section 10b is made up of a stack of second buffer sheets 10d. The density of the core provided in the first buffer sheet 10c is higher than the density of the core provided in the second buffer sheet 10d, and therefore the first buffer sheet 10c has higher strength in the Z-axis direction than the second buffer sheet 10d.

[0042] According to this configuration, as described in Patent Document 1, when the buffer material 10 is interposed between the electronic device 50 and the floor, i.e., when the packaged product 1 is dropped from a predetermined height, the second buffer sheet 10d, which has a relatively low strength in the Z-axis direction, is compressed and crushed before the first buffer sheet 10c. However, the first buffer sheet 10c, which is arranged on the electronic device 50 side, can absorb the impact. In this case, in a graph (not shown) in which the vertical axis represents the external force applied to the electronic device 50 via the cushioning material 10 and the horizontal axis represents the time from when the external force begins to be applied to the electronic device 50 via the cushioning material 10, the waveform of the external force applied to the electronic device 50 via the cushioning material 10 is a half-sine wave. This makes it possible to reduce the possibility of resonance occurring in a system including the electronic device 50 and the cushioning material 10, compared to an embodiment in which the cushioning material 10 is composed only of the second cushioning sheet 10d, and makes it possible to reduce the occurrence of malfunctions in the electronic device 50.

[0043] 3 and 4, similarly to the cushioning material 10, a plurality of first buffer sheets 10c are arranged on the side of the electronic device 50, and a plurality of second buffer sheets 10d are arranged on the side farther from the electronic device 50 than the first buffer sheets 10c, and the cushioning material 11 has the same effect as the cushioning material 10.

[0044] 7 and 8, in this embodiment, the cushioning material 10 is positioned so that a portion of the cushioning material 10 overlaps at least a portion of the plurality of holes 8. As a result, when the electronic device 50 is dropped and receives an impact, at least a portion of the plurality of legs 57 can be supported by the cushioning material 10, i.e., the impact can be received by both the cushioning material 10 and the legs 57. In this embodiment, some of the holes 8 are positioned so as to overlap the cushioning material 10, but all of the holes 8 may be positioned so as to overlap the cushioning material 10.

[0045] Furthermore, because both the plate-shaped portion 7 and the cushioning material 10 are made of cardboard, the plate-shaped portion 7 and the cushioning material 10 can be considered as a whole as the cushioning material 10. This makes it easier to design the impact buffer. In addition, by considering the plate-shaped portion 7 as part of the cushioning material 10, the overall thickness dimension da (see FIG. 9) when the cushioning material 10 is provided in addition to the plate-shaped portion 7 can be reduced, which in turn contributes to reducing the overall height dimension of the packaged item 1.

[0046] The packaging product 1 according to this embodiment includes an electronic device 50 having a plurality of legs 57 on a bottom surface 56, a support material 6 that supports the electronic device 50 in a packaged state, a cushioning material 10 that cushions impacts applied to the electronic device 50, and a packaging box 2 that houses the electronic device 50, the support material 6, and the cushioning material 10. Therefore, with this packaging product 1, the above-described operational effects of the support material 6 can be obtained. In addition, in this embodiment, the packaging box 2, corner protection members 3 and 4, support material 6, and cushioning materials 10 and 11 that make up the packaging product 1 are all made of cardboard, making it possible to eliminate the use of plastic in packaging materials.

[0047] The packaging procedure can be as follows: First, the support material 6 provided with the buffer material 10 is placed on a workbench or floor, and the electronic device 50 is placed on the support material 6. Next, the electronic device 50 and the support member 6 are placed in the packaging box 2, and the corner protection members 3 and 4 and the partition member 5 are arranged. Then, accessories for the electronic device 50 are stored in the storage spaces 2a and 2b, and if there is an instruction manual or the like, it is placed on the top surface 54 of the electronic device 50, and the packaging box 2 is closed. It should be noted that this procedure can be modified as appropriate. For example, the electronic device 50 may be placed on the support material 6 after the support material 6 has been housed in the packaging box 2 in advance. Also, the internal configuration of the packaging box 2 may be assembled, and then the entire assembly may be housed in the packaging box 2.

[0048] The dimension of the plate-shaped portion 7 of the support material 6 in the Y-axis direction is slightly smaller than the dimension of the Y-axis direction of the internal space of the packaging box 2. This makes it possible to prevent the electronic device 50 and the support material 6 from rattling in the Y-axis direction when they are housed in the packaging box 2. In this embodiment, the dimension of the plate-shaped portion 7 of the support material 6 in the X-axis direction is smaller than the dimension of the X-axis direction of the internal space of the packaging box 2. Movement of the electronic device 50 and the support material 6 in the X-axis direction inside the packaging box 2 is restricted by the partition plate 5b of the partition member 5. However, the dimension of the plate-shaped portion 7 of the support material 6 in the X-axis direction may also be slightly smaller than the dimension of the X-axis direction of the internal space of the packaging box 2.

[0049] Next, another embodiment of the holes provided in the plate-like portion will be described with reference to Fig. 11. Fig. 11 is also a schematic diagram similar to Fig. 10. 11 differs from the above-described embodiments in that non-through holes 9 are used instead of through holes 8. Holes 9 are formed in a plate-like portion 7A. 11, the thickness d1 of the plate-shaped portion 7A and the depth d3 of the hole 9 are equal to or greater than the protrusion d2 from the bottom surface 56 of the leg 57. As a result, similar to the above-described plate-shaped portion 7, when the electronic device 50 is supported on the plate-shaped portion 7A, the bottom surface 56 of the electronic device 50 is in contact with and supported by the first surface 7a. This makes it difficult for a load to be applied to the leg 57, and deformation of the leg 57 can be suppressed.

[0050] For example, the plate-shaped portion 7A can be formed by gluing together a cardboard sheet with through holes and a cardboard sheet without through holes with adhesive. With this configuration, similar to the plate-shaped portion 7 described above, the plate-shaped portion 7A and the cushioning material 10 can be considered as a whole as the cushioning material 10. This facilitates the design of impact buffering. Furthermore, considering the plate-shaped portion 7A as part of the cushioning material 10 reduces the overall thickness of the package 1 when the cushioning material 10 is provided in addition to the plate-shaped portion 7A, thereby contributing to reducing the overall height of the package 1. Furthermore, by forming the plate-shaped portion 7A from multiple cardboard sheets, the rigidity of the plate-shaped portion 7A can be improved.

[0051] The present invention is not limited to the embodiments and modifications described above, and various modifications are possible within the scope of the invention described in the claims, and it goes without saying that these modifications are also included within the scope of the present invention. [Explanation of symbols]

[0052] 1...packaged item, 2...packaging box, 2a, 2b...storage space, 3...corner protection member, 3a-1, 3a-2, 3a-3, 3a-4...plate-shaped portion, 4...corner protection member, 4a-1, 4a-2, 4a-3, 4a-4...plate-shaped portion, 5...partition member, 5a...plate-shaped portion, 5b...partition plate, 6...support material, 7, 7A...plate-shaped portion, 7a...first surface, 7b...second surface, 8, 9...hole, 10...cushioning material, 10a...first cushioning portion, 10b...second cushioning portion, 10c...first cushioning sheet, 10d...second cushioning sheet, 11...cushioning material, 50...electronic device, 51...front surface, 52...right side surface, 53...left side surface, 54...top surface, 55...rear surface, 56...bottom surface, 57...legs

Claims

1. A support material having a plate-shaped portion that supports an electronic device in a packaged state, the plate-shaped portion has holes for receiving a plurality of legs provided on a bottom surface of the electronic device, The thickness dimension of the plate-shaped portion and the depth dimension of the hole are equal to or greater than the protrusion dimension of the leg portion from the bottom surface. A support material characterized by:

2. 2. The support material according to claim 1, The hole is a through hole that penetrates the plate-like portion in the thickness direction. A support material characterized by:

3. 2. The support material according to claim 1, The holes are non-through holes that do not penetrate the plate-like portion in the thickness direction. A support material characterized by:

4. 2. The support material according to claim 1, The plate-shaped portion is made of cardboard. A support material characterized by:

5. 2. The support material according to claim 1, a plurality of shock-absorbing materials are provided on a surface of the plate-shaped portion opposite to a surface that supports the electronic device; A support material characterized by:

6. 6. The support material according to claim 5, the hole is a through hole that penetrates the plate-like portion in a thickness direction, When the plate-shaped portion is viewed from above, a portion of the buffer material is positioned to overlap at least a portion of the plurality of holes. A support material characterized by:

7. The support material according to claim 4, a plurality of shock-absorbing materials made of cardboard are provided on a surface of the plate-shaped portion opposite to a surface supporting the electronic device; A support material characterized by:

8. 2. The support material according to claim 1, The plate-shaped portion has a size that covers the electronic device in a plan view. A support material characterized by:

9. an electronic device having a plurality of legs on a bottom surface; The support material according to claim 1 , which supports the electronic device in a packaged state; and a cushioning material that cushions impacts applied to the electronic device; a packaging box in which the electronic device, the support material, and the cushioning material are housed; A packaging product characterized by comprising:

10. 10. The package of claim 9, The support material, the cushioning material, and the packaging box are made of cardboard. A package characterized by:

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