Radiation detection sensor, radiation imaging apparatus, manufacturing method, and radiation imaging system

Abstract

To provide a radiation detection sensor in which pixels and wiring are appropriately arranged.SOLUTION: The radiation-detecting sensor 100 includes a pixel matrix including a first imaging pixel 101a, a detection pixel 101c, and a second imaging pixel 101b, a driving line 11, and a driving line 12, in which a mean area of openings of the second imaging pixel 101b included in a first row is smaller than a mean area of openings of the first imaging pixel 101a included in a second row, and an area of each opening of the first imaging pixel 101a included in the second row is within 1% of the mean area.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a radiation detection sensor.A radiation imaging device equipped with a radiation detection sensor is used as a medical diagnostic device or a non-destructive testing device, and is used as, for example, an X-ray flat panel detector. [Background technology]

[0002] Conventionally, in a radiation imaging device that acquires a radiation image based on radiation, a technology is known in which the amount of radiation incident on the radiation imaging device during radiation imaging is measured and used for imaging control. One example of such a technology is an automatic exposure control (AEC) function. By using the AEC function, it is possible to reduce the amount of radiation exposure of a subject during radiation imaging.

[0003] Patent Document 1 discloses a radiation imaging device with an AEC function. The radiation imaging device of Patent Document 1 is provided with additional wiring, such as a gate wiring connected to an imaging photoelectric conversion element, and a routing wiring connected to a monitoring photoelectric conversion element. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 4659337 Summary of the Invention [Problem to be solved by the invention]

[0005] When additional wiring is provided in a partial region of the pixel matrix as in Patent Document 1, the placement of apertures in pixels located near the additional wiring is restricted. Since partial disturbance in the placement of apertures in the pixel matrix leads to image distortion, it is desirable to arrange the pixels and wiring in an appropriate layout.

[0006] The present invention has been made in view of the above-mentioned problems, and has an object to provide a radiation detection sensor in which pixels and wiring are appropriately arranged. [Means for solving the problem]

[0007] The present invention provides a radiation detection sensor comprising a pixel matrix in which a plurality of pixels are arranged in a matrix, each pixel including a conversion element that converts radiation or light into an electric charge and a switching element, the pixel matrix including a plurality of imaging pixels used to acquire a radiographic image and a plurality of detection pixels used to detect a radiation dose, a first drive line for driving the switching elements of the imaging pixels included in a first row of the pixel matrix, and a second drive line for driving the switching elements of the detection pixels included in the first row of the pixel matrix, wherein a second row different from the first row does not include the detection pixel or the second drive line, and the openings of a plurality of first-shaped imaging pixels corresponding to all of the imaging pixels included in the first row have smaller areas than the openings of second-shaped imaging pixels included in the second row. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide a radiation detection sensor in which pixels and wiring are appropriately arranged. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a diagram showing the configuration of a radiation imaging system including a radiation imaging apparatus. [Figure 2] FIG. 1 is a diagram showing the configuration of a radiation imaging apparatus. [Figure 3] FIG. 2 is a plan view of a pixel. [Figure 4] FIG. 2 is a plan view of a pixel matrix according to the first embodiment. [Figure 5] FIG. 2 is a cross-sectional view of a pixel. [Figure 6] FIG. 10 is a plan view of a pixel matrix according to a second embodiment. [Figure 7] FIG. 11 is a plan view of a pixel matrix according to a third embodiment. [Figure 8]FIG. 10 is a plan view of a pixel matrix according to a fourth embodiment. [Figure 9] FIG. 13 is a plan view of a pixel matrix according to a fifth embodiment. [Figure 10] FIG. 2 is a cross-sectional view of a pixel. [Figure 11] 3 is a diagram showing an example of the configuration of an amplifier unit of the radiation imaging apparatus of FIG. 2; [Figure 12] 3 is a diagram showing an example of driving the radiation imaging apparatus of FIG. 2. [Figure 13] 3 is a timing chart showing an example of driving the radiation imaging apparatus of FIG. 2. [Figure 14] 3 is a timing chart showing an example of driving the radiation imaging apparatus of FIG. 2. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, the embodiments of the present invention will be described in detail with reference to examples. Similar elements throughout the examples will be designated by the same reference numerals, and duplicated explanations will be omitted. Furthermore, the configurations described in the examples may be modified or combined as appropriate.

[0011] Example 1 <Radiation imaging system> FIG. 1 shows an example of the configuration of a radiation imaging system 500 including a radiation imaging apparatus 100. The radiation imaging system 500 includes the radiation imaging apparatus 100 (radiation detection apparatus, radiation imaging apparatus), a radiation source 501, a radiation source interface 502, a communication interface 503, a controller 504, a grid 600, and an object 700. While FIG. 1 shows an example in which the radiation imaging apparatus 100 and the radiation source 501 (radiation generation apparatus) communicate via a wire, they may also be configured to communicate wirelessly. The grid 600 is configured to be placed to remove scattered radiation. Depending on the imaging content, the grid 600 may not be used.

[0012] In radiography, first, imaging information such as dose, irradiation time (ms), tube current (mA), tube voltage (kV), and radiation collection field, which is an area where radiation is detected, is input to the controller 504. Thereafter, when an exposure switch attached to the radiation source 501 is operated, the controller 504 transmits a start request signal to the radiation imaging apparatus 100. The start request signal is a signal requesting the start of radiation irradiation. In response to receiving the start request signal, the radiation imaging apparatus 100 begins preparations for radiation irradiation. Once preparations are complete, the radiation imaging apparatus 100 transmits a start possible signal to the radiation source interface 502 via the communication interface 503. The start possible signal is a signal notifying that radiation irradiation can be started. In response to receiving the start possible signal, the radiation source interface 502 causes the radiation source 501 to start radiation irradiation.

[0013] The radiation imaging device 100 detects the dose of irradiated radiation, and when the integrated value of the dose reaches a target threshold, transmits a stop notification to the radiation source interface 502 via the communication interface 503. The stop notification is a signal requesting the end of radiation irradiation. In response to receiving the stop notification, the radiation source interface 502 causes the radiation source 501 to end radiation irradiation. The target dose threshold is determined based on the input value of the dose, the radiation irradiation intensity, the communication delay between each unit, the processing delay, etc.

[0014] <Radiation imaging device> 2 shows an example of the configuration of the radiation imaging apparatus 100. The radiation imaging apparatus 100 includes a radiation detection sensor IR (radiation detection panel) corresponding to an imaging region, a drive circuit 150, a readout circuit 160, a signal processing unit 170, a control unit 180, and a communication I / F 190.

[0015] The radiation detection sensor IR has a plurality of pixels (pixel matrix) arranged in a matrix to form a plurality of rows and a plurality of columns, a plurality of drive lines 10, 11, 12, and a plurality of signal lines 20. The plurality of drive lines 10, 11, 12 are arranged in corresponding rows in the pixel matrix. In other words, at least one of the drive lines 10, 11, 12 is arranged in each row of the pixel matrix. The plurality of signal lines 20 are arranged corresponding to a plurality of columns of pixels. In other words, each column of the plurality of signal lines 20 corresponds to one pixel column.

[0016] The pixel matrix of the radiation detection sensor IR includes a plurality of pixels of different types. The plurality of types of pixels includes first imaging pixels 101a used to acquire a radiographic image and one or more detection pixels 101c (detection elements) used to detect the amount of radiation irradiated. The plurality of types of pixels also includes a plurality of second imaging pixels 101b arranged in the same row as the detection pixels 101c and used to acquire a radiographic image.

[0017] The first imaging pixel 101a includes a conversion element 102a that converts radiation into an electrical signal and a switch element 103a that connects the conversion element 102a to a corresponding signal line 20. The second imaging pixel 101b includes a conversion element 102b that converts radiation into an electrical signal and a switch element 103b that connects the conversion element 102b to a corresponding signal line 20.

[0018] The detection pixel 101c includes a conversion element 102c that converts radiation into an electrical signal, and a switch element 103c that connects the corresponding signal line 20 and the conversion element 102c to each other.

[0019] Here, the majority of the pixel matrix is ​​made up of imaging pixels (imaging pixels 101a, 101b), and the detection pixels 101c are arranged isolated from the imaging pixels at intervals so as to blend in with them.

[0020] The conversion elements 102a, 102b, and 102c are each configured, for example, by a scintillator that converts radiation into light and a photoelectric conversion element that converts light into an electrical signal. The scintillator is formed in a sheet shape so as to cover the pixel matrix. Instead of the above configuration, the conversion elements 102a, 102b, and 102c may be configured by a conversion element that directly converts radiation into an electrical signal.

[0021] The switch elements 103a, 103b, and 103c may be configured by thin film transistors (TFTs) whose active regions are configured by semiconductors such as amorphous silicon or polycrystalline silicon, but are not limited thereto, and any appropriate elements may be used as the switch elements 103a, 103b, and 103c as long as they are elements that can control the connection or disconnection between the conversion elements 102a, 102b, and 102c and the signal line 20.

[0022] The first electrode of each conversion element 102a is connected to the first main electrode of the switch element 103a, and the second electrode of each conversion element 102a is connected to a bias line 17. One bias line 17 extends in the column direction and is commonly connected to the second electrodes of the plurality of conversion elements 102a arranged in the column direction. The bias line 17 receives a bias voltage Vs from a power supply circuit 140. The second main electrodes of the switch elements 103a of one or more first imaging pixels 101a in one column are connected to one signal line 20. The control electrodes of the switch elements 103a of one or more first imaging pixels 101a in one row are connected to one drive line 10. The second imaging pixel 101b is connected to a second drive line 11. The detection pixel 101c is connected to a detection drive line 12. Here, in a given row, the second drive line 11 is connected to one side of the second imaging pixel 101b, and the detection drive line 12 is connected to the other side (opposite side) of the detection pixel 101c. A plurality of detection pixels 101c may be arranged in a given row.

[0023] The drive circuit 150 is configured to supply drive signals to the pixels to be driven via multiple drive lines 10, 11, and 12 in accordance with control signals from the control unit 180. The drive lines 10 and 11 connected to the imaging pixels and the detection drive line 12 connected to the detection pixels may be connected to different drive circuits. Specifically, the drive lines 10 and 11 may be connected to a drive circuit for imaging, and the detection drive line 12 may be connected to a drive circuit for radiation detection. In this embodiment, the drive signals are signals for turning on switch elements included in the pixels to be driven. The switch elements of each pixel are turned on by a high-level signal and turned off by a low-level signal. Here, a high-level signal is referred to as a drive signal. When a drive signal is supplied to a pixel, the signal accumulated in the conversion element of that pixel becomes readable by the readout circuit 160. In the configuration shown in FIG. 2, the multiple drive lines 10 and 11 driving the imaging pixels 101a and 101b and the multiple drive lines 12 driving the detection pixel 101b are each connected to the same drive circuit 150. However, this is not a limitation. The drive circuit that drives the multiple drive lines 10 and 11 connected to the imaging pixels 101a and 101b and the drive circuit that drives the multiple drive lines 12 connected to the detection pixel 101c may be arranged separately. In other words, the drive circuit 150 may include a first drive circuit to which the multiple drive lines 10 and 11 are connected, and a second drive circuit to which the multiple drive lines 12 are connected. Furthermore, the supply of drive signals from the drive circuit 150 to the pixels may be expressed as "the drive circuit 150 drives the drive lines 10, 11, and 12."

[0024] The readout circuit 160 is a circuit configured to read out signals from a plurality of pixels through a plurality of signal lines 20. The readout circuit 160 includes a plurality of amplifiers 161, a multiplexer 162, and an analog-to-digital converter (hereinafter, referred to as an AD converter) 163. Each of the plurality of signal lines 20 is connected to a corresponding one of the plurality of amplifiers 161 of the readout circuit 160. One signal line 20 corresponds to one amplifier 161. The multiplexer 162 selects one of the plurality of amplifiers 161 in a predetermined order and supplies a signal from the selected amplifier 161 to the AD converter 163. The AD converter 163 converts the supplied signal into a digital signal and outputs it. Note that a plurality of detection pixels 101c arranged in different rows may be connected to the same signal line, and signals may be read out from this signal line by the readout circuit 160.

[0025] The signals read out from the imaging pixels 101a and 101b are supplied to the signal processing unit 170, where they are subjected to processing such as calculation and storage. Specifically, the signal processing unit 170 includes a calculation unit 171 and a storage unit 172. The calculation unit 171 generates a radiographic image based on the signals read out from the imaging pixels 101a and 101b, and supplies the generated radiographic image to the control unit 180.

[0026] However, since there is no imaging pixel at the coordinates where the detection pixel 101c is located, a defect appears in the radiographic image. Therefore, when generating a radiographic image, a process is performed to complement the defect using signals from the first and second imaging pixels near the defect. The signal read from the detection pixel 101c is supplied to the signal processing unit 170, where it is processed by the calculation unit 171, including calculation and storage. Specifically, the signal processing unit 170 outputs information indicating irradiation of the radiographic imaging device 100 with radiation, based on the signal read from the detection pixel 101c. For example, the signal processing unit 170 detects irradiation of the radiographic imaging device 100 with radiation, and determines the radiation exposure dose and / or cumulative exposure dose.

[0027] The control unit 180 is a controller that controls the drive circuit 150 and the readout circuit 160 based on information from the signal processing unit 170. The control unit 180 performs overall control of the radiation imaging apparatus 100. The control unit 180 includes a CPU as an arithmetic processing circuit, and ROM and RAM as memories. The control unit 180, for example, loads a program stored in the ROM into the RAM, and the CPU executes this program to achieve various controls. Note that the control unit 180 may use an MPU or ASIC instead of a CPU as the arithmetic processing circuit. The control unit 180 controls, for example, the start and end of exposure (accumulation of charges corresponding to irradiated radiation by the imaging pixels 101a and 101b) based on information from the signal processing unit 170.

[0028] To determine the radiation exposure dose, the control unit 180 controls the drive circuit 150 to scan only the detection drive lines 12 during radiation exposure, thereby enabling readout of only the signal from the detection pixel 101c. Next, the control unit 180 controls the readout circuit 160 to read out the signal from the column corresponding to the detection pixel 101c and output it as information indicating the radiation exposure dose. Through this operation, the radiation imaging device 100 can obtain exposure information for the detection pixel 101c during radiation exposure. One or more detection pixels 101c and detection drive lines 12 are arranged in a predetermined row within a radiation detection field, which is an area where radiation is detected. One or more radiation detection fields are arranged in the imaging area. If there are multiple radiation detection fields, a radiation detection field suitable for imaging is selected. By driving the detection drive lines 12 within the selected radiation detection field, the signal from the detection pixel 101c is read out, and the radiation dose irradiated to the selected radiation detection field can be detected.

[0029] <Pixel and wiring layout> FIG. 3 shows a plan view of a pixel. Each pixel has a conversion element, and a bias line is located above the conversion element. The bias line is connected to the upper electrode of the conversion element. The openings 112a, 112b, and 112c, which are areas where radiation or light converted from radiation can be detected, are areas (portions) of the conversion element that are not shielded by the bias line. In other words, the bias line functions as a light-shielding portion. The opening 112a is the opening of the first imaging pixel 101a, the opening 112b is the opening of the second imaging pixel 101b, and the opening 112c is the opening of the detection pixel 101c. In FIG. 3, the opening areas are indicated by diagonal lines. As described above, when radiation is irradiated onto the openings, charge corresponding to the amount of incident radiation accumulates in the pixel, and the magnitude of this charge appears in the image as the pixel's shade. Therefore, it is desirable for the opening area of ​​all imaging pixels to be uniform. Here, the driving lines 10 and 11 connected to the first imaging pixel 101a, the second imaging pixel 101b, and other imaging pixels are arranged at equal intervals. That is, the width (vertical width) of the arrangement area between two driving lines is constant. Similarly, the signal lines 20 connected to each pixel are arranged at equal pitches. That is, the width (horizontal width) of the arrangement area between two signal lines is constant. However, in the row (predetermined row) in which the detection pixel 101c is arranged, the shape of the opening of the second imaging pixel 101b arranged in the same row as the detection pixel 101c is affected by the size of the arrangement area of ​​the detection driving line 12. Specifically, the shape of the opening of the second imaging pixel 101b (first shape) is smaller than the shape of the opening of the first imaging pixel 101a (second shape).

[0030] In this embodiment, a detection pixel 101c is provided with an opening 112c of approximately the same size as the opening 112b of the second imaging pixel 101b. In this case, in the row including the detection pixel 101c, the second driving line 11 is connected to the second imaging pixel 101b from one side, and the detection driving line 12 is connected to the detection pixel 101c from the other side (opposite side). This configuration efficiently ensures sufficient area for the openings of the second imaging pixel 101b and the detection pixel 101c. Therefore, the amount of charge accumulated in the second imaging pixel 101b can be made closer to the amount of charge accumulated in the first imaging pixel 101a, thereby suppressing image distortion. Furthermore, in this embodiment, imaging pixels and detection pixels are arranged in a single arrangement area (pixel space), without being mixed. This ensures sufficient opening size for the second imaging pixel 101b and the detection pixel 101c. The area (average area) of the opening 112b of the second imaging pixel 101b is preferably 80% or more of the area (average area) of the opening 112a of the first imaging pixel 101a. Similarly, the area (average area) of the opening 112c of the detection pixel 101c is preferably 80% or more of the area (average area) of the opening 112a of the first imaging pixel 101a.

[0031] In this embodiment, all imaging pixels arranged in the same row as the detection pixel 101c are uniformly formed as the second imaging pixel 101b. In this way, imaging pixels with different aperture areas are not mixed in the same row, thereby suppressing image distortion.

[0032] It is desirable that the areas of the openings 112b of the second imaging pixels 101b arranged in the same row are substantially equal to each other. Specifically, it is desirable that the error in the area of ​​each opening 112b from the average area of ​​the openings 112b in the same row is within 1%, and more desirably within 0.1%.

[0033] It is desirable that the areas of the apertures 112c of the detection pixels 101c arranged in the same row are approximately equal. Specifically, it is desirable that the error in the area of ​​each aperture 112c from the average area of ​​the apertures 112c in the same row is within 1%, and more desirably within 0.1%.

[0034] Furthermore, it is desirable that the average area (average area) of the openings 112b of the second imaging pixels 101b arranged in the same row is substantially equal to the average area of ​​the openings 112c of the detection pixels 101c. Specifically, it is desirable that the error between the average area of ​​the openings 112b in the same row and the average area of ​​the openings 112c included in the same row is within 1%, and more desirably within 0.1%.

[0035] <Modification> In FIG. 3, the description has been given on the assumption that the drive lines 10, 11, and 12 have the same line width.

[0036] In the modified example, an example in which the drive line 12 is configured to have a line width narrower than the line widths of the drive lines 10 and 11 will be described.

[0037] In a row (a predetermined row) in which the detection pixel 101c and the detection drive line 12 are arranged, the shape of the opening of the second imaging pixel 101b arranged in the same row as the detection pixel 101c is affected by the size of the arrangement area of ​​the detection drive line 12. Specifically, the opening of the second imaging pixel 101b becomes smaller depending on the area of ​​the arrangement area of ​​the detection drive line 12. Therefore, it is desirable to narrow the line width of the detection drive line 12 and enlarge the shape of the opening of the second imaging pixel 101b.

[0038] Furthermore, if the aperture of the second imaging pixel 101b becomes smaller due to the influence of the detection drive line 12, the center of gravity of the second imaging pixel 101b shifts upward in the signal line direction (toward the nearest drive lines 10 and 11) compared to the first imaging pixel 101a. That is, the shapes of the apertures 112a of the first imaging pixel 101a and the apertures 112b of the second imaging pixel 101b differ, resulting in different positions of the centers of gravity 122a and 122b of the apertures between adjacent drive lines 10 and 11 in the signal line direction (direction of a predetermined column). In other words, around the second imaging pixel 101b, the distance 132aa between the centers of gravity of the apertures of the first imaging pixels 101a in the signal line direction differs from the distance 132ab between the centers of gravity of the adjacent first and second imaging pixels in the signal line direction. If the distances between the centers of gravity of the apertures of the imaging pixels differ, moiré patterns will occur when capturing images of periodic structures such as grids, affecting image quality. Therefore, it is desirable to reduce the distances between these two centers of gravity.

[0039] FIG. 4 shows a plan view of a pixel according to a modified example. In this modified example, the line width of the detection drive line 12 is adjusted to be narrower than the line widths of the drive lines 10 and 11. Specifically, in the region adjacent to the pixel row including the detection pixel 101c (within the pixel matrix), the line width of the detection drive line 12 is uniformly narrower than the line widths of the drive lines 10 and 11. This configuration allows the aperture of the second imaging pixel 101b to be enlarged by the amount corresponding to the narrower line width of the detection drive line 12. Furthermore, by reducing the difference in the shape of the apertures of the first imaging pixel 101a and the second imaging pixel 101b, the inter-center distance 132aa and the inter-center distance 132ab can be made substantially equal, thereby suppressing moiré. Considering the contrast of the moiré, it is desirable that the difference between the inter-center distances 132aa and 132ab be within 10% of the inter-center distance 132aa.

[0040] If the line width of the detection drive line 12 is narrowed, the wiring resistance will increase, which may affect the ability to supply drive signals to the switch elements. However, the number of detection pixels connected to the drive line 12 is smaller than the number of imaging pixels connected to the drive lines 10 and 11. In other words, the number of switch elements connected to the wiring is small, and the total capacitance is also small. Therefore, sufficient drive capacity can be ensured even if the line width is narrowed. However, it is desirable that the line width of the drive line 12 be 65% or more of the line width of the drive lines 10 and 11.

[0041] Similarly, the number of imaging pixels connected to the driving line 11 is smaller than the number of imaging pixels connected to the driving line 10. In other words, the number of switch elements connected to the wiring is smaller, and the total capacitance is also smaller. Therefore, within the pixel matrix, the line width of the driving line 11 may be made narrower than the line width of the driving line 10. Then, the area of ​​the opening of the second imaging pixel 101b and the detection pixel 101c may be increased by the amount of the narrowed line width of the driving line 10.

[0042] FIG. 5 is a cross-sectional view taken along the line A-A' in FIG. 4. A conversion element 102 is disposed on the left side, and a switch element 103 is disposed on the right side. The switch element 103 includes a gate electrode 301, a source electrode 302, a drain electrode 303, an insulating layer 304, a first semiconductor layer 305, and a first impurity semiconductor layer 306. The conversion element 102 includes a lower electrode 307, a second impurity semiconductor layer 308, a second semiconductor layer 309, a third impurity semiconductor layer 310, an upper electrode 311, and a protective layer 312. The drain electrode 303 is connected to the lower electrode 307 via a contact. The upper electrode 311 is connected to the bias line 17 via a contact. The gate electrode 301 of the switch element 103 forms a part of the drive line 10, and the source electrode 302 forms a part of the signal line 20. When a drive signal is supplied to the drive line 10 and the switch element 103 is turned on, the charge accumulated in the conversion element 102 is transferred to the signal line 20 as an electrical signal. A light-shielding layer (light-shielding portion) made of metal or the like may be provided on the switch element 103. The light-shielding layer is The light-shielding layer may be made of the same metal layer as 17, and the light-shielding layer and bias line may be connected. By shielding the switch element 103 from light, it is possible to prevent light from irradiating the semiconductor layer of the switch element and generating electric charges that become noise. It is also possible to prevent electric charges accumulated in the conversion element from leaking.

[0043] FIG. 10 is a cross-sectional view taken along line B-B' in FIG. 4. In FIG. 10, the driving line 12 is arranged on the left, the driving line 11 on the right, and the conversion element 102 in the center. As can be seen from FIG. 10, the driving line 12 and the driving line 11 are arranged on the same layer. Although not shown, the driving line 10 is arranged on the left side of the driving line 12 on the same layer. In this way, there are restrictions on the arrangement of the driving lines 10, 11, and 12. Furthermore, the width of the driving line 12 affects the width of the conversion element 102. For this reason, this modified example is designed so that the width of the driving line 12 is narrow.

[0044] Example 2 Next, a second embodiment will be described. The difference from the first embodiment is that the shape of the conversion element of the second imaging pixel 101b is changed to adjust the position of the center of gravity of the aperture. Fig. 6 shows a plan view of the pixel matrix of the second embodiment.

[0045] As described above, the placement of the detection drive lines 12 causes the center of gravity of the second imaging pixel 101b to shift upward compared to the first imaging pixel 101a. Therefore, in this embodiment, the upper portion of the conversion element of the second imaging pixel 101b is removed to change the shape of the opening, thereby adjusting the center of gravity downward. This configuration allows the center-of-gravity distance 132aa and the center-of-gravity distance 132ab in the signal line direction to approximately coincide with each other, thereby suppressing moiré.

[0046] 6, the distance between the apertures of the first and second imaging pixels 101a and 101b, which are adjacent to each other above and below, is large. If this distance is large, the contrast of moire patterns may become stronger. Therefore, it is desirable that the maximum distance (spacing) between the apertures of the first and second imaging pixels in the signal line direction be within 50% of the distance 132aa between the centers of gravity in the signal line direction.

[0047] In this embodiment, the shape of the lower electrode is not changed compared to FIG. 3, but only the shape of the conversion element is changed. However, the shape of the lower electrode may be changed in accordance with the shape of the conversion element.

[0048] Example 3 Next, a third embodiment will be described. This embodiment differs from the first embodiment in that the shape of the bias line of the second imaging pixel 101b is changed to change the shielded area and adjust the center of gravity of the aperture. FIG. 7 shows a plan view of the pixel matrix of the third embodiment. As shown in FIG. 7, by shielding the upper part of the conversion element with the bias line and changing the shape of the aperture to adjust the center of gravity, the distance between the centers of gravity 132aa and 132ab in the signal line direction can be made to approximately match, thereby suppressing moiré. The adjustment of the center of gravity of the second imaging pixel 101b and the distance between the apertures in the signal line direction of the first and second imaging pixels are based on the same concept as in the second embodiment shown in FIG. 6.

[0049] Example 4 Next, a fourth embodiment will be described. This embodiment differs from the first embodiment in that the shape of the conversion element of the first imaging pixel 101a is changed to adjust the center of gravity. FIG. 8 shows a plan view of the pixel matrix of the fourth embodiment. The arrangement of the detection drive lines 12 causes the center of gravity of the second imaging pixel 101b to shift upward compared to the first imaging pixel 101a. By removing the lower portion of the conversion element of the first imaging pixel 101a, changing the shape of the opening, and adjusting the center of gravity upward, the center-of-gravity distance 132aa and the center-of-gravity distance 132ab in the signal line direction can be approximately matched, thereby suppressing moiré. Alternatively, the shape of the conversion element of the first imaging pixel 101a may be made the same as the shape of the conversion element of the second imaging pixel 101b, thereby matching the center-of-gravity distances. Furthermore, by reducing the shape of the conversion element of the first imaging pixel 101a, the area in which the drive lines can be arranged can be expanded. In other words, the position of the drive lines can be changed. Therefore, the position of the drive line of the first imaging pixel 101a may be changed in a row adjacent to the row where the second imaging pixel 101b is located. The shape of the conversion element of the first imaging pixel 101a may be changed to approximately match the distance between the centers of gravity. The distance between the openings in the signal line direction of the first and second imaging pixels is based on the same concept as in Example 2 of FIG. 6. In this example, the shape of the lower electrode is changed according to the shape of the conversion element of the first imaging pixel 101a. However, the shape of the lower electrode may be the same as in FIG. 3, and only the shape of the conversion element may be different from that in FIG. 3 to approximately match the distance between the centers of gravity. Furthermore, as shown in FIG. 7, the shape of the opening may be changed in the shielded region of the bias line of the first imaging pixel 101a to approximately match the distance between the centers of gravity.

[0050] Example 5 Next, a fifth embodiment will be described. This embodiment differs from the first embodiment in that the distance between the centers of gravity is approximately equalized using a row including a detection pixel and a second imaging pixel 101b and multiple rows including the neighboring first imaging pixels 101a. FIG. 9 shows a plan view of a pixel matrix in the fifth embodiment. FIG. 9 shows a configuration in which the distances between the centers of gravity 132a1b, 132a1a2, 132aa2, and 132aa are approximately equal across multiple rows. That is, the difference between the distances between the centers of gravity 132a1b and 132a1a2 is within 10% of the distance between the centers of gravity 132a1b. The difference between the distances between the centers of gravity 132a1a2 and 132aa2 is within 10% of the distance between the centers of gravity 132a1a2. The difference between the distances between the centers of gravity 132aa2 and 132aa is within 10% of the distance between the centers of gravity 132aa2. Furthermore, the inter-center-of-gravity distance 132a1b is preferably shorter than the inter-center-of-gravity distance 132a1a2. The inter-center-of-gravity distance 132a1a2 is preferably shorter than the inter-center-of-gravity distance 132aa2. The inter-center-of-gravity distance 132aa2 is preferably shorter than the inter-center-of-gravity distance 132aa. For the second imaging pixel 101b, whose center of gravity position differs from that of the first imaging pixel 101a, adjusting the center of gravity position including multiple neighboring first imaging pixels 101a can distribute the influence of the different inter-center-of-gravity distances across multiple rows. The adjustment of each inter-center-of-gravity distance may be performed using one or more of the methods described in Example 1 of FIG. 4, Example 2 of FIG. 6, Example 3 of FIG. 7, and Example 4 of FIG. 8. That is, the center of gravity positions can be appropriately changed by changing the size and shape of the light-shielding portion (bias line 17) and the sizes and shapes of the conversion elements 102a, 102b, and 102c.

[0051] In a radiation imaging device in which the imaging pixels and the AEC pixels are connected to separate drive lines, there may be cases where the imaging pixels arranged in multiple pixel rows are simultaneously driven, such as by binning. The following describes the operation when multiple pixel rows are simultaneously driven. In the following description, pixels used to acquire a radiation image, such as the first imaging pixel 101a and the second imaging pixel 101b, may be simply referred to as imaging pixels 101a. Furthermore, when there is no need to distinguish between the imaging pixel 101a and the detection pixel 101c, they may be simply referred to as pixels 101. Regarding the drive lines 10 and 11, the drive line to which the imaging pixel 101a is connected may also be collectively referred to as drive line 10.

[0052] FIG. 11 shows a detailed circuit configuration example of the amplifier unit 161. The amplifier unit 161 may include a differential amplifier circuit AMP and a sample-and-hold circuit SH. The differential amplifier circuit AMP amplifies and outputs a signal appearing on a signal line 20. The control unit 180 can reset the potential of the signal line 20 by supplying a control signal φR to a switch element of the differential amplifier circuit AMP. The output of the differential amplifier circuit AMP can be held by the sample-and-hold circuit SH. The control unit 180 causes the sample-and-hold circuit SH to hold the signal by supplying a control signal φSH to the switch element of the sample-and-hold circuit SH. The signal held in the sample-and-hold circuit SH is read out by the multiplexer 162.

[0053] Next, the operation of the radiation imaging device 100 of this embodiment will be described with reference to FIGS. 12 to 14. In the radiation imaging device 100 of this embodiment, the drive circuit 150 has an operation mode in which a predetermined number of drive lines 10 (two or more) connected to the imaging pixels 101a are simultaneously driven. For example, in binning drive, which reads signals from the imaging pixels 101a to acquire a binned image after radiation irradiation, or in automatic detection drive, which detects the start of radiation irradiation, a predetermined number of drive lines 10 (two or more) are simultaneously driven. In this case, the drive line 12 connected to the detection pixel 101c is used, for example, to detect the accumulated radiation dose and may not be used for binning drive or automatic detection drive. Therefore, in binning drive, automatic detection drive, or the like, driving the drive line 12 to read signals may result in a deterioration in the image quality of the binning pixel or a decrease in the detection sensitivity for the start of radiation irradiation. Therefore, in this embodiment, the plurality of drive lines 12 arranged in the radiation detection sensor IR includes two drive lines 12 with no other drive lines 12 arranged between them. In this case, the number of drive lines 10 arranged between two drive lines 12 that have no other drive lines arranged between them is a natural number multiple of the number of drive lines 10 that are driven simultaneously in binning driving, automatic detection driving, or the like. Furthermore, the drive circuit 150 does not need to drive multiple drive lines 12 in operation modes that simultaneously drive a predetermined number of drive lines 10, such as binning driving and automatic detection driving. This reduces the effect of reading out the drive lines 12 connected to the imaging pixels 101a in these operation modes, making it possible to prevent degradation of image quality and detection accuracy.

[0054] FIG. 12 is a diagram showing an example of the arrangement of the drive lines 10 and the drive lines 12. For example, the drive circuit 150 may have an operation mode in which two of the multiple drive lines 10 are simultaneously operated, and another operation mode in which three drive lines 10 (not two) are simultaneously driven. In this case, the number of drive lines 10 arranged between two drive lines 12 that are not interposed between the multiple drive lines 10 may be a common multiple of two and three. In the configuration shown in FIG. 12, six drive lines 10 are arranged between the two drive lines 12. However, the operation mode in which two or more drive lines 10 are simultaneously driven may drive four or more drive lines instead of two or three drive lines. Furthermore, the drive circuit 150, which operates under the control of the control unit 180, may have three or more operation modes. It can also be said that the radiation imaging device 100 has three or more operation modes. In these operation modes, the drive circuit 150 may simultaneously drive a predetermined number of consecutively arranged drive lines 10 out of the plurality of drive lines 10, as will be described below.

[0055] In the following description, signals applied to the drive lines 10 that drive the imaging pixels 101a are designated Vg1 to Vgn, and signals applied to the drive lines 12 that drive the detection pixels 101c are designated Vd1 and Vd2. No other drive lines 12 are arranged between the drive line 12 to which the signal Vd1 is supplied and the drive line 12 to which the signal Vd2 is supplied. For example, when binning driving is performed to simultaneously drive two drive lines 10 to which signals Vg2 to Vg7 are supplied from the drive circuit 150, drive signals (high level) are simultaneously supplied to the signals Vg2 and Vg3, and the corresponding drive lines 10 are simultaneously driven. As a result, signals are simultaneously read out from the imaging pixels 101a connected to the drive lines 10 to which the signals Vg2 and Vg3 are supplied. The drive lines 10 to which the signals Vg2 and Vg3 are supplied may be continuously arranged in the pixel column direction, as shown in FIG. 12 . Similarly, drive signals are simultaneously supplied to signals Vg4 and Vg5, driving the corresponding drive lines 10 simultaneously, and drive signals are simultaneously supplied to signals Vg6 and Vg7, driving the corresponding drive lines 10 simultaneously. Furthermore, for example, in binning drive, which simultaneously drives three drive lines 10, drive signals are simultaneously supplied to signals Vg2, Vg3, and Vg4, driving the corresponding drive lines 10 simultaneously, and drive signals are simultaneously supplied to signals Vg5, Vg6, and Vg7, driving the corresponding drive lines 10 simultaneously. In this way, by arranging the number of drive lines 10 between two drive lines 12 so that it is a natural number multiple of the number of drive lines 10 driven simultaneously, and skipping a drive line 12, it is possible to suppress the influence of driving the drive line 12 in binning drive or automatic detection drive.

[0056] FIG. 13 shows an example of operation in binning driving in which three drive lines 10 are driven simultaneously. Binning driving is a driving method in which signals are simultaneously read out from pixels 101 arranged in multiple pixel rows in order to acquire a radiographic image. In binning driving, drive signals are simultaneously supplied to the drive lines 10 that are simultaneously driven. After supplying the drive signal, the drive circuit 150 supplies a control signal φR to the switch element of the sample-and-hold circuit SH of the amplifier unit 161, thereby resetting the potential of the signal line 120. In binning driving, the drive circuit 150 sequentially repeats these operations.

[0057] During binning driving, the drive lines 10 are driven in sequence. The drive line 12 supplied with the signal Vd1 is not driven, and the three drive lines 10 supplied with the signals Vg2, Vg3, and Vg4 are simultaneously driven. This causes signals to be read out from the imaging pixels 101a connected to the three drive lines 10 supplied with the signals Vg2, Vg3, and Vg4. Next, the three drive lines 10 supplied with the signals Vg5, Vg6, and Vg7 are simultaneously driven. This causes signals to be read out from the imaging pixels 101a connected to the three drive lines 10 supplied with the signals Vg5, Vg6, and Vg7. Next, the drive circuit 150 does not drive the drive line 12 supplied with the signal Vd2, and subsequently drives each drive line 10 in the same manner until the drive line 10 supplied with the signal Vgn is driven. As described above, by performing binning driving without driving the drive lines 12, it is possible to suppress degradation in the quality of the radiographic image caused by driving the drive lines 12.

[0058] FIG. 14 shows an example of operation in auto-detection driving in which three drive lines 10 are driven simultaneously to detect the start of radiation irradiation. In the example of operation shown in FIG. 14, the drive lines 10 supplied with signals Vg1 to Vg3 are driven, followed by the drive lines 10 supplied with signals Vg7 to Vg9. Furthermore, the drive lines 10 supplied with signals Vg4 to Vg6 are driven, followed by the drive lines supplied with signals Vg10 to Vg12. In this way, FIG. 14 shows an example in which signals are alternately read out from the imaging pixels 101a connected to a drive line group formed by three drive lines 10. To alternately read out signals means that the radiation detection sensor IR is scanned so as to read out signals in order from the imaging pixels 101a connected to the drive lines 10 supplied with signals Vg1 to Vg3 and the imaging pixels 101a connected to the drive lines 10 supplied with signals Vg7 to Vg9. Thereafter, the radiation detection sensor IR is scanned so as to sequentially read out signals from the imaging pixels 101a connected to the drive lines 10 to which the signals Vg4 to Vg6 are supplied and the imaging pixels 101a connected to the drive lines 10 to which the signals Vg10 to Vg12 are supplied. Although not shown, the drive lines 10 to which the signals Vg13 to Vgn are supplied are also driven during the period from when drive signals are supplied to the signals Vg1 to Vg3 until when drive signals are supplied to the signals Vg7 to Vg9, during the period from when drive signals are supplied to the signals Vg7 to Vg9 until when drive signals are supplied to the signals Vg4 to Vg6, and during the period from when drive signals are supplied to the signals Vg4 to Vg6 until when drive signals are supplied to the signals Vg10 to Vg12, etc.

[0059] Furthermore, the order in which drive signals are supplied to the drive lines 10 is not limited to the example operation shown in Fig. 14. For example, the drive circuit 150 may supply drive signals to signals Vg1 to Vg3, and then supply drive signals to signals Vg4 to Vg6. Furthermore, the drive circuit 150 may supply drive signals to signals Vg7 to Vg9, and then supply drive signals to signals Vg10 to Vg12. In this case, signals are read out in order, for example, from the imaging pixels 101a arranged in a predetermined number of pixel rows at one end of the radiation detection sensor IR to the imaging pixels 101a arranged in a predetermined number of pixel rows at the other end.

[0060] In FIG. 14 , period T1 is a period during which radiation irradiation is awaited. Specifically, period T1 begins when the radiation imaging device 100 is powered on, resets the pixels 101, and becomes ready to capture a radiographic image, and ends when the exposure switch of the radiation source 501 is operated and radiation irradiation is detected. As described above, the drive circuit 150 simultaneously drives three drive lines 10 in a predetermined order, thereby alternately reading out signals from the imaging pixels 101a connected to the drive line group formed by the three drive lines 10. Drive signals are simultaneously supplied to the three simultaneously driven drive lines 10. During period T1, signals Vd1 and Vd2 remain low, and the drive line 12 is not driven. When radiation irradiation begins, charges accumulate in the imaging pixels 101a. When the accumulated charges are read out, the bias voltage fluctuates due to the movement of the charges. Therefore, for example, the signal processing circuit 170 detects the start of radiation irradiation by monitoring the fluctuation in the bias voltage resulting from the readout of the imaging pixels 101a. When the start of radiation irradiation is detected, the period moves to period T2.

[0061] During period T2, radiation is irradiated and an accumulation operation for acquiring a radiographic image is performed in the imaging pixel 101a. During period T2, the signals Vg1 to Vgn applied to the drive line 10 remain at a low level, causing charges corresponding to the radiation irradiation to accumulate in the conversion element 102a of the imaging pixel 101a. Also, as shown in FIG. 14, during period T2, the drive circuit 150 may drive multiple drive lines 12 in accordance with the control unit 180. Specifically, the drive circuit 150 supplies drive signals (high level) to the signals Vd1 and Vd2, thereby reading out a signal from the detection pixel 101c. The signal processing circuit 170 acquires the dose and cumulative dose of incident radiation based on the signal output from the detection pixel 101c. The control unit 180 transmits a termination request signal to the radiation source interface 502 via the communication interface 503 in accordance with irradiation information, such as the dose and cumulative dose of incident radiation, obtained by the signal processing circuit 170. In response to the reception of the termination request signal, the radiation source interface 502 causes the radiation source 501 to terminate the radiation irradiation. This realizes automatic exposure control (AEC). When the radiation irradiation is terminated, the period moves to period T3.

[0062] Period T3 is a period during which signals accumulated in the imaging pixels 101a in response to the incident radiation are read out after the radiation irradiation has ended. During period T3, unlike period T1, for example, the drive circuit 150 supplies drive signals to the imaging pixels 101a to which the signals Vg1 to Vgn are respectively supplied, one pixel row at a time. As a result, the signals accumulated in the imaging pixels 101a are read out by the readout circuit 160, one pixel row at a time, in turn. In this manner, the drive circuit 150 may change the number of drive lines 10 that are simultaneously driven between when detecting the start of radiation irradiation and when reading out signals from the imaging pixels 101a after radiation irradiation. During period T3, signals Vd1 and Vd2 remain at low level, and the drive line 12 is not driven.

[0063] Consider a case where, when performing automatic detection driving to detect the start of radiation irradiation, the drive lines 12 are driven and signals are also read from the detection pixels 101c. In this case, the number of detection pixels 101c arranged in one pixel row is smaller than the number of imaging pixels 101a arranged in one pixel row. Therefore, the fluctuation in bias voltage caused by reading out the charge accumulated in the pixels 101 due to radiation irradiation becomes small, which may reduce the sensitivity for detecting the start of radiation irradiation. Therefore, as described above, the number of drive lines 10 between the drive lines 12 is arranged so that it is a natural number multiple of the number of drive lines 10 driven simultaneously, and the drive lines 12 are not driven when performing automatic detection driving, thereby preventing a decrease in the detection accuracy for detecting the start of radiation irradiation.

[0064] (Other Examples) Although the present invention has been described above with reference to the embodiments, the present invention is not limited to the above embodiments. Inventions modified within the scope of the present invention and inventions equivalent to the present invention are also included in the present invention. For example, not all of the combinations of features described in the above embodiments are necessarily essential to the solution of the present invention. Some features may be replaced with other features or deleted as long as the effects of the present invention are obtained. Furthermore, the dimensions, materials, shapes, and relative positions of components described in the above embodiments are merely examples and can be changed as appropriate depending on the conditions. Furthermore, the above-described embodiments and modifications can be combined as appropriate within the scope of the present invention.

[0065] (Addendum) This specification includes the following disclosure.

[0066] [Appendix 1] a pixel matrix in which a plurality of pixels, each including a conversion element and a switching element for converting radiation or light into an electric charge, are arranged in a matrix, the pixel matrix including a plurality of imaging pixels used for acquiring a radiographic image and a plurality of detection pixels used for detecting the radiation dose; a first drive line for driving a switch element of the imaging pixel included in a first row of the pixel matrix; a second drive line for driving the switch elements included in a first row of the pixel matrix; a second row different from the first row does not include the detection pixel and the second drive line; a first average area being an average area of ​​openings of a plurality of first-shaped imaging pixels that are the imaging pixels included in the first row, a second average area being an average area of ​​openings of second-shaped imaging pixels that are the imaging pixels included in the second row, the first average area being smaller than the second average area, and an error of the area of ​​each opening of the first-shaped imaging pixels included in the first row from the first average area being within 1%.

[0067] [Appendix 2] the first row and the second row are adjacent rows, the pixel matrix includes a third row adjacent to the second row on an opposite side to the first row, the third row including imaging pixels of the second shape; the pixel matrix has a first imaging pixel included in a first row, a second imaging pixel included in the second row and adjacent to the first imaging pixel, and a third imaging pixel included in the third row and adjacent to the second imaging pixel; 2. The radiation detection sensor according to claim 1, wherein the distance between the centers of gravity of the first imaging pixel and the second imaging pixel is approximately equal to the distance between the centers of gravity of the second imaging pixel and the third imaging pixel.

[0068] [Appendix 3] 3. The radiation detection sensor according to claim 2, wherein a difference between a distance between the centers of gravity of the first imaging pixel and the second imaging pixel and a distance between the centers of gravity of the second imaging pixel and the third imaging pixel is within 10%.

[0069] [Appendix 4] The radiation detection sensor according to claim 2 or 3, wherein the size of the gap between the first imaging pixel and the second imaging pixel is within 50% of the distance between the centers of gravity of the first imaging pixel and the second imaging pixel.

[0070] [Appendix 5] 5. The radiation detection sensor according to claim 1, wherein the second driving lines have a narrower line width than the first driving lines.

[0071] [Appendix 6] 6. The radiation detection sensor according to claim 1, wherein the first-shaped imaging pixel and the conversion element have different shapes from the second-shaped imaging pixel and the conversion element.

[0072] [Appendix 7] 7. The radiation detection sensor according to claim 1, wherein the opening of the first-shaped imaging pixel is a region of the conversion element of the first-shaped imaging pixel excluding a region that is shielded by a light-shielding portion.

[0073] [Appendix 8] The radiation detection sensor described in any one of appendixes 1 to 7, wherein the opening of the second-shaped imaging pixel is a region of the conversion element of the second-shaped imaging pixel excluding a portion that is shielded by a light-shielding portion.

[0074] [Appendix 9] 9. The radiation detection sensor according to claim 1, wherein the first drive line is provided on the opposite side of the second drive line, sandwiching the imaging pixel included in the first row therebetween.

[0075] [Appendix 10] 10. The radiation detection sensor according to any one of claims 1 to 9, further comprising a third drive line connected to the second-shaped imaging pixels included in the second row, the third drive line having a narrower line width than the first drive line.

[0076] [Appendix 11] A radiation imaging device for acquiring a radiation image based on radiation, a pixel matrix in which a plurality of pixels, each including a conversion element and a switching element for converting radiation or light into an electric charge, are arranged in a matrix, the pixel matrix comprising imaging pixels used for acquiring a radiographic image and detection pixels used for detecting the radiation dose; a first drive line for driving a switch element of the imaging pixel included in a first row of the pixel matrix; a second drive line for driving a switch element of the detection pixel included in a first row of the pixel matrix; a second row different from the first row does not include the detection pixel and the second drive line; a first average area being an average area of ​​the openings of a plurality of first-shaped imaging pixels that are imaging pixels included in the first row, a second average area being an average area of ​​the openings of a plurality of second-shaped imaging pixels that are imaging pixels included in the second row, the first average area being smaller than the second average area, and an error of 1% or less between the area of ​​each opening of the first-shaped imaging pixels included in the first row and the first average area.

[0077] [Appendix 12] A method for manufacturing a radiation detection sensor, comprising: providing a pixel matrix in which a plurality of pixels, each including a conversion element for converting radiation or light into an electric charge and a switching element, are arranged in a matrix, the pixel matrix including a plurality of imaging pixels used for acquiring a radiographic image and a plurality of detection pixels used for detecting a radiation dose; providing a first drive line for driving a switch element of the imaging pixel included in a first row of the pixel matrix; providing a second drive line for driving a switch element of the detection pixel included in a first row of the pixel matrix; a second row different from the first row does not include the detection pixel and the second drive line; a first average area being an average area of ​​the openings of a plurality of first-shaped imaging pixels that are imaging pixels included in the first row, a second average area being an average area of ​​the openings of second-shaped imaging pixels that are imaging pixels included in the second row, the first average area being smaller than the second average area, and an error of 1% or less between the area of ​​each opening of the first-shaped imaging pixels included in the first row and the first average area.

[0078] [Appendix 13] a pixel matrix in which a plurality of pixels, each including a conversion element and a switching element for converting radiation or light into an electric charge, are arranged in a matrix, the pixel matrix comprising imaging pixels used for acquiring a radiographic image and detection pixels used for detecting the radiation dose; a first drive line for driving a switch element of the imaging pixel included in a predetermined row of the pixel matrix; a second drive line for driving a switch element of the detection pixel included in a predetermined row of the pixel matrix; The radiation detection sensor is characterized in that the line width of the second drive line is narrower than the line width of the first drive line.

[0079] [Appendix 14] 14. The radiation detection sensor according to claim 13, wherein the first drive line is provided on the opposite side of the second drive line, with the imaging pixels included in the first row interposed therebetween.

[0080] [Appendix 15] 15. The radiation detection sensor according to claim 13, further comprising a third drive line connected to a second-shaped imaging pixel included in a row different from the predetermined row, the third drive line having a narrower line width than the first drive line.

[0081] [Appendix 16] A radiation imaging device for acquiring a radiation image based on radiation, a pixel matrix in which a plurality of pixels, each including a conversion element and a switching element for converting radiation or light into an electric charge, are arranged in a matrix, the pixel matrix comprising imaging pixels used for acquiring a radiographic image and detection pixels used for detecting the radiation dose; a first drive line for driving a switch element of the imaging pixel included in a predetermined row of the pixel matrix; a second drive line for driving a switch element of the detection pixel included in the predetermined row of the pixel matrix; The radiation imaging device, wherein the second drive lines have a narrower line width than the first drive lines.

[0082] [Appendix 17] A method for manufacturing a radiation detection sensor, comprising: providing a pixel matrix in which a plurality of pixels, each including a conversion element for converting radiation or light into an electric charge and a switching element, are arranged in a matrix, the pixel matrix including imaging pixels used for acquiring a radiographic image and detection pixels used for detecting a radiation dose; providing a first drive line for driving a switch element of the imaging pixel included in a predetermined row of the pixel matrix; providing a second drive line for driving a switch element of the detection pixel included in a predetermined row of the pixel matrix; The manufacturing method, wherein the line width of the second drive line is narrower than the line width of the first drive line.

[0083] [Appendix 18] a pixel matrix in which a plurality of pixels, each including a conversion element and a switching element for converting radiation or light into an electric charge, are arranged in a matrix, the pixel matrix including a plurality of imaging pixels used for acquiring a radiographic image and a plurality of detection pixels used for detecting the radiation dose; a first drive line for driving a switch element of the imaging pixel included in a first row of the pixel matrix; a second drive line for driving a switch element of the detection pixel included in a first row of the pixel matrix; a second row adjacent to the first row and a third row adjacent to the second row do not include the detection pixel and the second drive line; a first imaging pixel having a first shape is provided in a predetermined column of the first row; a second imaging pixel having a second shape is provided in a predetermined column of the second row; a third imaging pixel that is an imaging pixel of the second shape is provided in a predetermined column of the third row, a distance between the center of gravity of the opening of the first imaging pixel and the center of gravity of the opening of the second imaging pixel substantially coincides with a distance between the center of gravity of the opening of the second imaging pixel and the center of gravity of the opening of the third imaging pixel.

[0084] [Appendix 19] 19. The radiation detection sensor of claim 18, wherein a difference between a first inter-center distance between the center of gravity of the opening of the first imaging pixel and the center of gravity of the opening of the second imaging pixel and a second inter-center distance between the center of gravity of the opening of the second imaging pixel and the center of gravity of the opening of the third imaging pixel is within 10% of the first inter-center distance.

[0085] [Appendix 20] a fourth imaging pixel that is an imaging pixel of a second shape is provided in a predetermined column of the third row, and a distance between a center of gravity of an opening of the third imaging pixel and a center of gravity of an opening of the fourth imaging pixel is a third center-of-gravity distance; 20. The radiation detection sensor according to claim 19, wherein a difference between the second inter-center distance and the third inter-center distance is within 10% of the second inter-center distance.

[0086] [Appendix 21] 19. The radiation detection sensor of claim 18, wherein a first inter-centroid distance between the center of gravity of the opening of the first imaging pixel and the center of gravity of the opening of the second imaging pixel is shorter than a second inter-centroid distance between the center of gravity of the opening of the second imaging pixel and the center of gravity of the opening of the third imaging pixel.

[0087] [Appendix 22] a pixel matrix in which a plurality of pixels, each including a conversion element and a switching element for converting radiation or light into an electric charge, are arranged in a matrix, the pixel matrix including a plurality of imaging pixels used for acquiring a radiographic image and a plurality of detection pixels used for detecting the radiation dose; a plurality of first drive lines for driving switch elements of the plurality of imaging pixels included in the pixel matrix; a plurality of second drive lines for driving switch elements of the plurality of detection pixels included in the pixel matrix; a first row of the pixel matrix includes a first imaging pixel as the imaging pixel, the detection pixel, the first drive line, and the second drive line; a second row of the pixel matrix includes a second imaging pixel as the imaging pixel and the first drive line, but does not include the detection pixel and the second drive line; the second driving line has an influence in a direction of moving the center of gravity of the opening of the first imaging pixel closer to the nearest first driving line than the center of gravity of the opening of the second imaging pixel, a shape of the opening of the first imaging pixel that is configured to cancel out at least a part of the effect of the approaching direction, and that is different from the shape of the opening of the second imaging pixel.

[0088] [Appendix 23] 23. The radiation detection sensor of claim 22, wherein the shape of the opening of the first imaging pixel differs from the shape of the opening of the second imaging pixel depending on the shape of the conversion element or the shape of a light-shielding portion covering part of the conversion element.

[0089] [Appendix 24] A radiation imaging device comprising: a plurality of pixels arranged in a matrix to acquire a radiation image; and a drive circuit that controls the plurality of pixels via a plurality of drive lines, the plurality of pixels include a plurality of first pixels for acquiring the radiographic image and a plurality of second pixels for acquiring radiation irradiation information separately from the radiographic image; the plurality of drive lines include a plurality of first drive lines arranged to drive first pixels arranged in the same pixel row among the plurality of first pixels, and a plurality of second drive lines arranged to drive second pixels arranged in the same pixel row among the plurality of second pixels, the drive circuit has an operation mode in which a predetermined number of first drive lines, two or more, among the plurality of first drive lines are simultaneously driven; the plurality of second drive lines include two second drive lines with no other second drive lines disposed therebetween; The radiation imaging device, wherein the number of first drive lines arranged between the two second drive lines among the plurality of first drive lines is a natural number multiple of the predetermined number.

[0090] [Appendix 25] 25. The radiation imaging device according to claim 24, wherein the drive circuit does not drive the second drive lines in the operation mode.

[0091] [Appendix 26] The radiation imaging device described in Appendix 24 or Appendix 25, characterized in that in the operating mode, the drive circuit simultaneously drives the predetermined number of first drive lines that are arranged consecutively among the plurality of first drive lines.

[0092] [Appendix 27] 27. The radiation imaging device according to claim 24, wherein the operation mode is used when reading out signals from the plurality of first pixels after irradiation with radiation.

[0093] [Appendix 28] 28. The radiation imaging device according to any one of claims 24 to 27, wherein the operation mode is used when detecting the start of radiation irradiation.

[0094] [Appendix 29] 29. The radiation imaging device according to any one of claims 24 to 28, wherein the drive circuit changes the number of first drive lines to be driven simultaneously among the plurality of first drive lines when detecting the start of radiation irradiation and when reading out signals from the plurality of first pixels after radiation irradiation.

[0095] [Appendix 30] the drive circuit has an operation mode different from the operation mode in which two or more first drive lines, the number of which is different from the predetermined number, are simultaneously driven among the plurality of first drive lines; 7. The radiation imaging device according to claim 1, wherein the number of first driving lines arranged between the two second driving lines among the plurality of first driving lines is a common multiple of the predetermined number and the different numbers.

[0096] [Appendix 31] 31. The radiation imaging device according to any one of claims 24 to 30, wherein the drive circuit drives the second drive lines during irradiation of radiation.

[0097] [Appendix 32] 32. The radiation imaging device according to any one of claims 24 to 31, wherein the plurality of first driving lines and the plurality of second driving lines are connected to the same driving circuit.

[0098] [Appendix 33] 32. The radiation imaging device according to claim 24, wherein the driving circuit includes a first driving circuit to which the plurality of first driving lines are connected, and a second driving circuit to which the plurality of second driving lines are connected.

[0099] [Appendix 34] 34. The radiation imaging device of claim 24, wherein each of the plurality of pixels includes a switch element and a conversion element that is connected to one of the plurality of drive lines via the switch element and converts incident radiation into an electrical signal.

[0100] [Appendix 35] A radiation imaging apparatus according to any one of Supplementary Notes 24 to 34; a signal processing unit that processes a signal output from the radiation imaging device; A radiation imaging system comprising: [Explanation of symbols]

[0101] IR Radiation Detection Sensor 100 Radiation imaging device 101a: First imaging pixel (second shape imaging pixel) 101b Second imaging pixel (first shape imaging pixel) 101c Detector pixel 102 Conversion element 103 Switching element 10 drive line (third drive line) 11 drive line (first drive line) 12 detection drive line (second drive line) 132aa Center of gravity distance 132ab Center of gravity distance

Claims

1. a pixel matrix in which a plurality of pixels, each including a conversion element and a switching element for converting radiation or light into an electric charge, are arranged in a matrix, the pixel matrix including a plurality of imaging pixels used for acquiring a radiographic image and a plurality of detection pixels used for detecting the radiation dose; a first drive line for driving a switch element of the imaging pixel included in a first row of the pixel matrix; a second drive line for driving a switch element of the detection pixel included in a first row of the pixel matrix; a second row different from the first row does not include the detection pixel and the second drive line; a first average area of ​​the openings of a plurality of first-shaped imaging pixels that are the imaging pixels included in the first row, a second average area of ​​the openings of a plurality of second-shaped imaging pixels that are the imaging pixels included in the second row, the first average area being smaller than the second average area, and an error of 1% or less between the area of ​​each opening of the first-shaped imaging pixels included in the first row and the first average area.

2. the first row and the second row are adjacent rows, the pixel matrix has a third row adjacent to the second row on an opposite side to the first row, the third row including imaging pixels of the second shape; the pixel matrix has a first imaging pixel included in a first row, a second imaging pixel included in the second row and adjacent to the first imaging pixel, and a third imaging pixel included in the third row and adjacent to the second imaging pixel; 2. The radiation detection sensor according to claim 1, wherein the distance between the centers of gravity of the first imaging pixel and the second imaging pixel is approximately equal to the distance between the centers of gravity of the second imaging pixel and the third imaging pixel.

3. 3. The radiation detection sensor according to claim 2, wherein a difference between a distance between the centers of gravity of the first imaging pixel and the second imaging pixel and a distance between the centers of gravity of the second imaging pixel and the third imaging pixel is within 10%.

4. 3. The radiation detection sensor according to claim 2, wherein the size of the gap between the first imaging pixel and the second imaging pixel is within 50% of the distance between the centers of gravity of the first imaging pixel and the second imaging pixel.

5. 2. The radiation detection sensor according to claim 1, wherein the second driving lines have a narrower line width than the first driving lines.

6. The radiation detection sensor according to claim 1 , wherein the first-shaped imaging pixel and the conversion element have different shapes from the second-shaped imaging pixel and the conversion element have different shapes.

7. 2. The radiation detection sensor according to claim 1, wherein the opening of the first-shaped imaging pixel is a region of the conversion element of the first-shaped imaging pixel excluding a region that is shielded from light by a light-shielding portion.

8. 2. The radiation detection sensor according to claim 1, wherein the opening of the second-shaped imaging pixel is a region of the conversion element of the second-shaped imaging pixel excluding a portion that is shielded from light by a light-shielding portion.

9. The radiation detection sensor according to claim 1 , wherein the first drive lines are provided on the opposite side of the second drive lines, with the imaging pixels included in the first row sandwiched therebetween.

10. 2. The radiation detection sensor according to claim 1, further comprising a third drive line connected to the second-shaped imaging pixel included in the second row, the third drive line having a narrower line width than the first drive line.

11. A radiation imaging device for acquiring a radiation image based on radiation, a pixel matrix in which a plurality of pixels, each including a conversion element and a switching element for converting radiation or light into an electric charge, are arranged in a matrix, the pixel matrix comprising imaging pixels used for acquiring a radiographic image and detection pixels used for detecting the radiation dose; a first drive line for driving a switch element of the imaging pixel included in a first row of the pixel matrix; a second drive line for driving a switch element of the detection pixel included in a first row of the pixel matrix; a second row different from the first row does not include the detection pixel and the second drive line; a first average area of ​​the openings of a plurality of first-shaped imaging pixels that are the imaging pixels included in the first row, a second average area of ​​the openings of a plurality of second-shaped imaging pixels that are the imaging pixels included in the second row, the first average area being smaller than the second average area, and an error of 1% or less between the area of ​​each opening of the first-shaped imaging pixels included in the first row and the first average area.

12. A method for manufacturing a radiation detection sensor, comprising: providing a pixel matrix in which a plurality of pixels, each including a conversion element for converting radiation or light into an electric charge and a switching element, are arranged in a matrix, the pixel matrix including a plurality of imaging pixels used for acquiring a radiographic image and a plurality of detection pixels used for detecting a radiation dose; providing a first drive line for driving a switch element of the imaging pixel included in a first row of the pixel matrix; providing a second drive line for driving a switch element of the detection pixel included in a first row of the pixel matrix; a second row different from the first row does not include the detection pixel and the second drive line; a first average area of ​​the openings of a plurality of first-shaped imaging pixels that are imaging pixels included in the first row, a second average area of ​​the openings of a plurality of second-shaped imaging pixels that are imaging pixels included in the second row, the first average area being smaller than the second average area, and an error of 1% or less from the first average area is observed for the area of ​​each opening of the first-shaped imaging pixels included in the first row.

13. a pixel matrix in which a plurality of pixels, each including a conversion element and a switching element for converting radiation or light into an electric charge, are arranged in a matrix, the pixel matrix comprising imaging pixels used for acquiring a radiographic image and detection pixels used for detecting the radiation dose; a first drive line for driving a switch element of the imaging pixel included in a predetermined row of the pixel matrix; a second drive line for driving a switch element of the detection pixel included in a predetermined row of the pixel matrix; The radiation detection sensor according to claim 1, wherein the line width of the second driving line is narrower than the line width of the first driving line.

14. 14. The radiation detection sensor according to claim 13, wherein the first drive line is provided on the opposite side of the second drive line across an imaging pixel included in a row formed by pixels whose switch elements are driven by the first drive line.

15. 14. The radiation detection sensor according to claim 13, further comprising a third drive line connected to an imaging pixel of the second shape included in a row different from the predetermined row, the third drive line having a narrower line width than the first drive line.

16. A radiation imaging device for acquiring a radiation image based on radiation, a pixel matrix in which a plurality of pixels, each including a conversion element and a switching element for converting radiation or light into an electric charge, are arranged in a matrix, the pixel matrix comprising imaging pixels used for acquiring a radiographic image and detection pixels used for detecting the radiation dose; a first drive line for driving a switch element of the imaging pixel included in a predetermined row of the pixel matrix; a second drive line for driving a switch element of the detection pixel included in the predetermined row of the pixel matrix; The radiation imaging device, wherein the line width of the second driving lines is narrower than the line width of the first driving lines.

17. A method for manufacturing a radiation detection sensor, comprising: providing a pixel matrix in which a plurality of pixels, each including a conversion element for converting radiation or light into an electric charge and a switching element, are arranged in a matrix, the pixel matrix including imaging pixels used for acquiring a radiographic image and detection pixels used for detecting a radiation dose; providing a first drive line for driving a switch element of the imaging pixel included in a predetermined row of the pixel matrix; providing a second drive line for driving a switch element of the detection pixel included in a predetermined row of the pixel matrix; The manufacturing method is characterized in that the line width of the second drive line is narrower than the line width of the first drive line.

18. a pixel matrix in which a plurality of pixels, each including a conversion element and a switching element for converting radiation or light into an electric charge, are arranged in a matrix, the pixel matrix including a plurality of imaging pixels used for acquiring a radiographic image and a plurality of detection pixels used for detecting the radiation dose; a first drive line for driving a switch element of the imaging pixel included in a first row of the pixel matrix; a second drive line for driving a switch element of the detection pixel included in a first row of the pixel matrix; a second row adjacent to the first row and a third row adjacent to the second row do not include the detection pixel and the second drive line; a first imaging pixel having a first shape is provided in a predetermined column of the first row; a second imaging pixel having a second shape is provided in a predetermined column of the second row; a third imaging pixel that is an imaging pixel of the second shape is provided in a predetermined column of the third row; a distance between the center of gravity of the opening of the first imaging pixel and the center of gravity of the opening of the second imaging pixel substantially coincides with a distance between the center of gravity of the opening of the second imaging pixel and the center of gravity of the opening of the third imaging pixel.

19. 19. The radiation detection sensor according to claim 18, wherein a difference between a first inter-centroid distance between the center of gravity of the opening of the first imaging pixel and the center of gravity of the opening of the second imaging pixel and a second inter-centroid distance between the center of gravity of the opening of the second imaging pixel and the center of gravity of the opening of the third imaging pixel is within 10% of the first inter-centroid distance.

20. a fourth imaging pixel that is an imaging pixel of a second shape is provided in a predetermined column of the third row, and a distance between a center of gravity of an opening of the third imaging pixel and a center of gravity of an opening of the fourth imaging pixel is a third center-of-gravity distance; 20. The radiation detection sensor according to claim 19, wherein a difference between the second inter-centroid distance and the third inter-centroid distance is within 10% of the second inter-centroid distance.

21. 19. The radiation detection sensor according to claim 18, wherein a first inter-centroid distance between the center of gravity of the opening of the first imaging pixel and the center of gravity of the opening of the second imaging pixel is shorter than a second inter-centroid distance between the center of gravity of the opening of the second imaging pixel and the center of gravity of the opening of the third imaging pixel.

22. a pixel matrix in which a plurality of pixels, each including a conversion element and a switching element for converting radiation or light into an electric charge, are arranged in a matrix, the pixel matrix including a plurality of imaging pixels used for acquiring a radiographic image and a plurality of detection pixels used for detecting the radiation dose; a plurality of first drive lines for driving switch elements of the plurality of imaging pixels included in the pixel matrix; a plurality of second drive lines for driving switch elements of the plurality of detection pixels included in the pixel matrix; a first row of the pixel matrix includes a first imaging pixel as the imaging pixel, the detection pixel, the first drive line, and the second drive line; a second row of the pixel matrix includes a second imaging pixel as the imaging pixel and the first drive line, but does not include the detection pixel and the second drive line; the second driving line has an influence in a direction of moving the center of gravity of the opening of the first imaging pixel closer to the nearest first driving line than the center of gravity of the opening of the second imaging pixel, a shape of the opening of the first imaging pixel that is configured to cancel out at least a part of the effect of the approaching direction, and that is different from the shape of the opening of the second imaging pixel.

23. 23. The radiation detection sensor according to claim 22, wherein the shape of the opening of the first imaging pixel differs from the shape of the opening of the second imaging pixel depending on the shape of the conversion element or the shape of a light-shielding portion that covers part of the conversion element.

24. A radiation imaging device comprising: a plurality of pixels arranged in a matrix to acquire a radiation image; and a drive circuit that controls the plurality of pixels via a plurality of drive lines, the plurality of pixels include a plurality of first pixels for acquiring the radiographic image and a plurality of second pixels for acquiring radiation irradiation information separately from the radiographic image; the plurality of drive lines include a plurality of first drive lines respectively arranged to drive first pixels arranged in the same pixel row among the plurality of first pixels, and a plurality of second drive lines respectively arranged to drive second pixels arranged in the same pixel row among the plurality of second pixels, the drive circuit has an operation mode in which a predetermined number of first drive lines, two or more, among the plurality of first drive lines are simultaneously driven; the plurality of second drive lines include two second drive lines with no other second drive lines disposed therebetween; a number of the first driving lines arranged between the two second driving lines among the plurality of first driving lines being a natural number multiple of the predetermined number;

25. 25. The radiation imaging apparatus according to claim 24, wherein the drive circuit does not drive the second drive lines in the operation mode.

26. 25. The radiation imaging apparatus according to claim 24, wherein the drive circuit simultaneously drives the predetermined number of first drive lines that are arranged consecutively among the plurality of first drive lines in the operation mode.

27. 25. The radiation imaging apparatus according to claim 24, wherein the operation mode is used when reading out signals from the plurality of first pixels after irradiation with radiation.

28. 25. The radiation imaging apparatus according to claim 24, wherein the operation mode is used when detecting the start of radiation irradiation.

29. 25. The radiation imaging device according to claim 24, wherein the drive circuit changes the number of first drive lines to be simultaneously driven among the plurality of first drive lines when detecting the start of radiation irradiation and when reading out signals from the plurality of first pixels after radiation irradiation.

30. the drive circuit has an operation mode different from the operation mode in which two or more first drive lines, the number of which is different from the predetermined number, are simultaneously driven among the plurality of first drive lines; 25. The radiation imaging device according to claim 24, wherein the number of first driving lines arranged between the two second driving lines among the plurality of first driving lines is a common multiple of the predetermined number and the different numbers.

31. 25. The radiation imaging apparatus according to claim 24, wherein the drive circuit drives the second drive lines during irradiation of radiation.

32. 25. The radiation imaging apparatus according to claim 24, wherein the plurality of first driving lines and the plurality of second driving lines are connected to the same driving circuit.

33. 25. The radiation imaging apparatus according to claim 24, wherein the drive circuit includes a first drive circuit to which the plurality of first drive lines are connected, and a second drive circuit to which the plurality of second drive lines are connected.

34. 25. The radiation imaging device according to claim 24, wherein each of the plurality of pixels includes a switch element and a conversion element that is connected to one of the plurality of drive lines via the switch element and converts incident radiation into an electrical signal.

35. a radiation imaging device according to any one of claims 24 to 34; a signal processing unit that processes a signal output from the radiation imaging device; A radiation imaging system comprising:

Images