Display panel and method for manufacturing display panel
The OLED display panel design with inclined sealing portions addresses interference issues in manufacturing, enhancing yield and reliability by allowing complete coverage of the encapsulation layer without damaging the light-emitting units.
Patent Information
- Application Number
- JP2025127248
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-07-30
- Filing Date
- 2025-07-30
- Publication Date
- 2026-02-12
AI Technical Summary
Conventional OLED display panels face reliability issues due to interference between film layers during manufacturing processes, leading to damage and poor production yield.
The display panel design includes an isolation structure with inclined sealing portions that form a trapezoidal cross-section, ensuring that subsequent film layers can cover the encapsulation layer without interference, thereby protecting the light-emitting units and improving yield.
This design prevents damage to light-emitting units and enhances the production yield and reliability of OLED display panels by ensuring complete coverage of the encapsulation layer during subsequent processes.
Smart Images

Figure 2026022641000001_ABST
Abstract
Description
[Technical Field]
[0001] The present application relates to the technical field of displays, and in particular to display panels and methods for making display panels. [Background technology]
[0002] Among conventional display panels, OLED (Organic Light Emitting Display) panels have been widely used due to their excellent display effects in terms of color, image quality, etc. Summary of the Invention [Problem to be solved by the invention]
[0003] The present application provides a display panel and a method for manufacturing the same that can prevent damage to light-emitting units and improve product yield. [Means for solving the problem]
[0004] In a first aspect, according to an embodiment of the present application, a display panel is provided, comprising: a substrate; an isolation structure provided on one side of the substrate, surrounding and closing the isolation structure to form a plurality of isolation openings; a plurality of light-emitting units provided on a side of the substrate closer to the isolation structure; and a sealing layer having a plurality of first sealing portions located on the side of at least one light-emitting unit away from the substrate and overlapping and connected to a side of the isolation structure facing the isolation opening, wherein, in a cross section along the thickness direction of the substrate, the first sealing portion has a first side wall, and the angle between at least some of the first side walls and a plane on which the substrate is located is less than or equal to 90°.
[0005] In a second aspect, the present application provides a display panel including: a substrate; an isolation structure provided on one side of the substrate, surrounding and enclosing a plurality of isolation openings; a plurality of light-emitting units, each including a first sub-pixel, provided on a side of the substrate closer to the isolation structure; and a sealing layer including a first sealing portion located on a side of at least one of the light-emitting units facing the isolation opening of the isolation structure, the first sealing portion being overlaid and connected to a side of the isolation structure facing the isolation opening, the first side wall of the display panel being exposed through the isolation opening; points A and B on a cross section along the thickness direction of the display panel and passing through the central axis of the isolation opening corresponding to the first sealing portion, the first side wall of the first sealing portion having a distance Ha to a plane on which the substrate is located and a distance La to the central axis of the isolation opening corresponding to the first sealing portion; and the distance Hb to the plane on which the substrate is located and a distance Lb to the central axis of the isolation opening corresponding to the first sealing portion, where Ha≦Hb and La≧Lb.
[0006] In a third aspect, according to an embodiment of the present application, there is provided a display device including the display panel according to any one of the embodiments of the first and second aspects.
[0007] In a fourth aspect, according to an embodiment of the present application, there is provided a method for manufacturing a display panel, including: providing a substrate; forming an isolation structure with the substrate to surround and close it to form a plurality of isolation openings; sequentially depositing a first light-emitting material layer, a first electrode material layer, and a first sealing material layer; patterning the first sealing material layer by adjusting different etching rates to form a first sealing portion, and making the angle between at least a first sidewall of the first sealing portion and a plane on which the substrate is located less than or equal to 90°; patterning the first electrode material layer and the first light-emitting material layer to form light-emitting units, and exposing the light-emitting units from the isolation openings. [Effects of the Invention]
[0008] The display panel according to the embodiment of the present application is provided with an encapsulating layer, and the encapsulating layer has a plurality of encapsulating portions corresponding to the light-emitting units, and the plurality of encapsulating portions include a first encapsulating portion. In a cross section parallel to the thickness direction, the cross-sectional shape formed by the first side wall of the first encapsulating portion is inclined and forms an angle of less than 90° with the plane on which the substrate is located. This allows the encapsulating portion to have a structural form in which the upper part is smaller and the lower part is larger, and the cross-sectional shape is close to a trapezoid. This prevents the chamfered structure caused by the inward recess of the bottom of the encapsulating layer from interfering with the subsequent formation of pixel electrodes, and improves the production yield and reliability of the display panel. [Brief explanation of the drawings]
[0009] The features, advantages, and technical effects of exemplary embodiments of the present application are described below with reference to the drawings.
[0010] [Figure 1] 1 is a structural schematic diagram of a display panel according to an embodiment of the present application; [Figure 2] FIG. 10 is a structural schematic diagram of a display panel according to another embodiment of the present application. [Figure 3] FIG. 10 is a structural schematic diagram of a display panel according to a further embodiment of the present application. [Figure 4] FIG. 2 is a cross-sectional view taken along the line AA′ shown in FIG. [Figure 5] 2 is another cross-sectional view taken along the line AA' in FIG. 1. FIG. [Figure 6] FIG. 6 is an enlarged view of a local structure of the cross-sectional view shown in FIG. [Figure 7] 6 is an enlarged view of another local structure of the cross-sectional view shown in FIG. 5. [Figure 8] 2 is a further cross-sectional view taken along the line AA' in FIG. 1. FIG. [Figure 9] 2 is yet another cross-sectional view taken along the line AA' in FIG. 1. FIG. [Figure 10] 1 is a structural schematic diagram of a display device according to an embodiment of the present application; [Figure 11] 1 is a flowchart of a method for manufacturing a display panel according to one embodiment of the present application. [Figure 12]10 is a flowchart of a method for manufacturing a display panel according to another embodiment of the present application. DETAILED DESCRIPTION OF THE INVENTION
[0011] OLED display panels are widely used due to their excellent display performance, and in the manufacturing process, the pixels of the previous lot must be encapsulated first to prevent the processing of the pixels of the next lot from affecting the pixels obtained in the previous lot. In conventional manufacturing processes, there are often reliability issues in the product due to interference between film layers in subsequent processes and structures such as encapsulation layers.
[0012] To solve the above problems, the embodiments of the present application provide a display panel, a display device, and a method for manufacturing the display panel, in which the display panel adjusts the shape structure after patterning of the encapsulation layer to ensure that the film layer in the subsequent process can cover smoothly up to a predetermined position, avoiding the occurrence of pixel damage and improving its production yield and reliability.
[0013] For a better understanding of the present invention, a display panel, a display device, and a manufacturing method of a display panel according to embodiments of the present invention will be described in detail below with reference to FIGS.
[0014] Referring to Figures 1 to 4, Figure 1 is a structural schematic diagram of a display panel according to one embodiment of the present application, Figure 2 is a structural schematic diagram of a display panel according to another embodiment of the present application, Figure 3 is a structural schematic diagram of a display panel according to a further embodiment of the present application, and Figure 4 is a cross-sectional view of the A-A' portion shown in Figure 1.
[0015] In a first aspect, an embodiment of the present application provides a display panel 100 including a substrate 10, an isolation structure 20, light-emitting units 30, and an encapsulation layer 40, wherein the isolation structure 20 is disposed on one side of the substrate 10, and the isolation structure 20 surrounds and closes the light-emitting units 30 to form a plurality of isolation openings 21; the light-emitting units 30 are disposed on a side of the substrate 10 close to the isolation structure 20, and at least some of the light-emitting units 30 are exposed through the isolation openings 21; the encapsulation layer 40 includes a plurality of encapsulation portions 41, and the plurality of encapsulation portions 41 are spaced apart from one another. The sealing portion 41 is located on a side of the light emitting unit 30 that faces away from the substrate 10 and is overlapped and connected to a side surface of the isolation structure 20 that faces the isolation opening 21, among which the plurality of sealing portions 41 include a plurality of first sealing portions 411, and the first sealing portions 411 include first side walls 412 that are located on the side of the isolation structure 20 that faces away from the substrate 10, and in a cross section along the thickness direction of the substrate 10, an included angle between at least a portion of the first side walls 412 and a plane on which the substrate 10 is located is less than or equal to 90°. The included angle between at least a portion of the first side walls 412 and the plane on which the substrate 10 is located being less than or equal to 90° may mean that an included angle between a portion of the first side walls 412 and the plane on which the substrate 10 is located is less than or equal to 90°, or may mean that an included angle between all of the first side walls 412 and the plane on which the substrate 10 is located is less than or equal to 90°.
[0016] Specifically, a partial cross-sectional view of the display panel 100 is created along a cross section parallel to the thickness direction X. The cross-sectional shape of the first sealing portion 411 is referred to as the first cross-sectional shape. The first cross-sectional shape has an edge line formed by the first side wall 412. The angle between the edge line and the straight line formed by the upper surface of the substrate 10 in the cross section can be regarded as the angle between the first side wall 412 and the plane on which the substrate 10 is located.
[0017] An embodiment of the present application provides a display panel 100, in which an isolation structure 20 is provided on a substrate 10, each of a plurality of light-emitting units 30 is exposed through an isolation opening 21 formed by at least a portion of the isolation structure 20 surrounding it, and a sealing layer 40 is provided on the side of the light-emitting unit 30 facing away from the substrate 10 to isolate water and oxygen, and the sealing layer 40 has a plurality of sealing portions 41 corresponding to the isolation openings 21, and the sealing portions 41 cover and seal the light-emitting units exposed through the isolation openings 21, and at least some of these sealing portions 41 are first sealing portions 411 having specific inclined first side walls 412.
[0018] The first sealing portion 411 has a first sidewall 412, which is preferably located on the outer side of the first sealing portion 411. That is, the sidewall at the circumferential end of the first sealing portion 411 is the first sidewall 412. The first sidewall 412 forms an angle with the plane on which the substrate 10 is located, which angle is preferably a right angle or an acute angle. That is, the first sidewall 412 of the first sealing portion 411 is inclined toward the central axis of the corresponding isolation opening 21 in the direction away from the substrate. Thus, the first sealing portion 411 has a narrow top and wide bottom structure above the isolation structure, and the sloped end of the first sealing portion 411 is located above the isolation structure. Here, the central axis is the axis of symmetry that makes the isolation opening symmetrical about its center in a plan view, and this axis preferably extends along the thickness direction X.
[0019] Preferably, the substrate 10 may further include other single or multi-layer structures, such as a pixel definition layer 11 and a second electrode 14 required for emitting light. In this embodiment, the second electrode 14 is an anode. The pixel definition layer 11 may have a pixel opening 111.
[0020] The isolation structure 20 in the display panel 100 may be directly located on the side of the pixel definition layer 11 facing away from the substrate 10. The isolation structure 20 is disposed to surround the pixel opening 111 and extends to a certain dimension in the thickness direction X, thereby forming an isolation opening 21 with a certain accommodating space and a communication port on the side facing away from the substrate 10. The isolation opening 21 and the pixel opening 111 are preferably disposed in one-to-one correspondence, and it is also preferable that one isolation opening 21 simultaneously corresponds to multiple adjacent pixel openings 111. In the thickness direction of the substrate 10, the orthogonal projection of the isolation opening 21 can cover the orthogonal projection of the pixel opening 111, i.e., the orthogonal projection of one pixel opening 111 or multiple adjacent pixel openings on the substrate 10 is located within the outline range of the orthogonal projection of one isolation opening 21 on the substrate 10, and the area of the isolation opening 21 is greater than the area of the pixel opening 111. The isolation structure 20 is provided between some adjacent pixel openings 111 to prevent crosstalk between adjacent light-emitting units 30 and problems such as oxidation failure due to the intrusion of water vapor from spreading to the surrounding area, and separates the film layers of adjacent light-emitting units 30, allowing pixel structures that are independent of each other to be formed.
[0021] Specifically, the isolation structure 20 is arranged to surround the pixel openings 111. Preferably, as shown in FIG. 1, the isolation structure 20 may be a mesh structure that extends continuously along the gaps between the pixel openings 111 and is interconnected with each other, or as shown in FIG. 2, it may be a ring structure that corresponds to the pixel openings 111, or as shown in FIG. 3, it may adopt both of the above structures simultaneously, so that the isolation structure 20 forms a ring that surrounds the multiple pixel openings 111 and is meshed between each pixel opening 111 inside the ring.
[0022] The display panel 100 includes an encapsulating layer 40, which includes a plurality of encapsulating portions 41 corresponding to and covering the light-emitting units 30. Each encapsulating portion 41 extends from the upper surface of the corresponding light-emitting unit 30 along the first sidewall 412 of the isolation structure 20 above the isolation structure 20 to form a tight seal. The light-emitting units 30 are exposed through the isolation openings 21, and the encapsulating portions 41 cover the corresponding light-emitting units 30, the corresponding isolation openings 21, and the side surfaces of the isolation structures facing the isolation openings. Specifically, the encapsulating portions 41 may be provided in one-to-one correspondence with the light-emitting units 30, i.e., one encapsulating portion 41 covers one light-emitting unit 30 and the isolation opening 21 corresponding to that light-emitting unit 30. Alternatively, one encapsulating portion 41 may be provided corresponding to multiple adjacent light-emitting units 30, i.e., one encapsulating portion 41 covers multiple light-emitting units 30 and the isolation openings 21 corresponding to that light-emitting unit 30.
[0023] It can be understood that in a conventional display panel, in order to process light emitting units 30 of different colors in batches, the light emitting units of one color are processed and then encapsulated, and then the light emitting units of a second color are manufactured. In this process, the conventional encapsulation layer is likely to have a narrow bottom structure after being dry-etched and patterned, so that the film layer formed in the subsequent process cannot cover up to the predetermined position, and further, the film layer is damaged during processes such as etching, resulting in poor display performance.
[0024] In this embodiment, the encapsulation portion corresponding to the previously fabricated light-emitting unit, i.e., the first side wall 412 of the first encapsulation portion 411, is inclined toward the central axis of the corresponding isolation opening in a direction away from the substrate, thereby forming a sloped surface on the outer periphery of the first encapsulation portion 411, so that the first encapsulation portion 411 as a whole has a structure that is narrow at the top and wide at the bottom. This allows the film layers to completely and reliably cover the outer periphery of the first encapsulation portion 411 when other film layers are fabricated in subsequent processes, forming a complete protective film above the first encapsulation portion 411 to protect the first encapsulation portion 411 and the corresponding light-emitting unit 30. This prevents processes such as etching in the formation of later fabricated light-emitting units from damaging the previously fabricated light-emitting units, and effectively improves the reliability of the resulting display panel.
[0025] In some preferred embodiments, the first sealing portion 411 extends at least partially on the side of the isolation structure 20 away from the substrate 10, and has an extension portion 413 located on the side of the isolation structure 20 away from the substrate 10, and the orthogonal projection of the extension portion 413 on the substrate 10 is located within the orthogonal projection range of the isolation structure 20 on the substrate 10.
[0026] In light of this, the first sealing portion 411 may have a structure located within the isolation opening 21, i.e., a base portion 414, which is provided to cover the side surface of the isolation structure 20 and the upper surface of the light emitting unit 30, and is connected to the extension portion 413. For the first sealing portion 411 located between two adjacent isolation structures 20, the extension portion 413 is indicated by a dotted frame in Fig. 5, and the base portion 414 is the remaining portion of the first sealing portion 411 other than the extension portion 413.
[0027] The first sealing portion 411 is provided to protrude from the isolation opening 21 and can extend from the isolation opening 21 toward the periphery above the isolation structure 20, thereby providing a more precise seal. Specifically, the portion of the first sealing portion 411 that extends above the isolation structure 20 forms an extension portion 413. Preferably, the extension portion 413 may abut against the top surface of the isolation structure 20, i.e., the surface facing away from the substrate 10, or may have a certain gap 419 between it and the isolation structure 20 in the thickness direction X.
[0028] The orthogonal projection of the extension portion 413 on the substrate 10 is located within the orthogonal projection range of the isolation structure 20 on the substrate 10, that is, the extension dimension of the extension portion 413 does not exceed the width of the isolation structure 20, thereby avoiding the extension portion 413 from interfering with the adjacent light-emitting unit 30.
[0029] Preferably, in the thickness direction X, the orthogonal projection of the extension portion 413 and the projection of the isolation structure 20 may have an overlapping area, and the overlapping area can extend in the same direction as the isolation structure 20, and in a cross section perpendicular to the extension direction of the isolation structure 20, the width of the extension portion 413 is less than half the width of the corresponding isolation structure 20.
[0030] In some preferred embodiments, the extension 413 has a first sub-surface 4131 facing towards the substrate 10 and a second sub-surface 4132 facing away from the substrate 10, and the first sidewall 412 connects the first sub-surface 4131 and the second sub-surface 4132.
[0031] The extension 413 has opposite surfaces in the thickness direction X, and one surface farther from the isolation structure 20 may be located within the outline of the orthogonal projection of the other opposite surface. Specifically, if the surface of the extension 413 facing the substrate 10, i.e., the surface closer to the isolation structure 20, is referred to as a first sub-surface 4131, and the opposite surface farther from the substrate 10 is referred to as a second sub-surface 4132, the first sidewall 412 may be connected between the two sub-surfaces.
[0032] In some preferred embodiments, the included angle between at least a portion of the first sidewalls 412 and the first sub-surfaces 4131 is less than or equal to 90°. By making the included angle between the first sidewalls 412 and the first sub-surfaces 4131 of the extensions 413 similarly a right angle or an acute angle, the cross section of the extensions 413 can be formed into a structural form that is wider at the top and narrower at the bottom, such as a trapezoid, and the sidewalls of the first encapsulation can be further ensured to slope toward the corresponding isolation openings in a direction away from the substrate, allowing a film layer, especially an electrode material layer, subsequently formed thereon to completely cover the first encapsulation, thereby improving the reliability of the display panel 100.
[0033] Considering that the included angle between the first sidewall 412 and the substrate 10 is a right angle or an acute angle, the included angle between the first sidewall 412 and the first sub-surface 4131 may also be less than or equal to 90°. Specifically, the two surfaces, the first sub-surface 4131 and the top surface of the isolation structure 20, preferably extend along a direction parallel or approximately parallel to the plane in which the substrate 10 is located.
[0034] In some preferred embodiments, the orthogonal projection of the second sub-surface 4132 of the extension 413 on the substrate 10 is located within the range of the orthogonal projection of the first sub-surface 4131 on the substrate 10 .
[0035] Considering the aforementioned inclined first sidewall 412, the second sub-surface 4132 may have a small area. Preferably, the extension 413 has an inwardly inclined first sidewall 412 on the outside, and may have an outwardly inclined first sidewall 412 on the inside close to the central axis of the isolation opening 21, or a first sidewall 412 perpendicular to the plane on which the substrate 10 is located, thereby ensuring that the orthogonal projection of the second sub-surface 4132 is located within the outline range of the orthogonal projection of the first sub-surface 4131 and that the extension 413 has a structural form that is narrow at the top and wide at the bottom.
[0036] Illustratively, the second sub-surface 4132 of the extension 413 may have a small orthogonal projection area, and its orthogonal projection edge contour may be spaced apart from the orthogonal projection contour of the adjacent sealing portion 41 .
[0037] By ensuring that the angle between the first side wall 412 of the extension portion 413 and the first sub-surface 4131 is similarly a right angle or an acute angle, it is ensured that the first encapsulating portion 411 has an overall structure that is narrow at the top and wide at the bottom. During the processing process, the subsequently deposited layer structure is completely and reliably covered on the first side wall 412 of the first encapsulating portion 411, which reduces the possibility that the film layer, especially the electrode material layer, will not be able to form a continuous film layer structure on the first side wall 412 of the first encapsulating portion 411 in the subsequent manufacturing process, thereby improving the overall yield rate and reliability of the display panel 100.
[0038] In some preferred embodiments, the first sealing portion 411 comprises at least one sealing sub-layer.
[0039] Preferably, depending on the required sealing parameters, the sealing layer 40 may comprise at least one sealing sub-layer, and the first sealing portion 411 may accordingly comprise one or more sealing sub-layers. It is understood that the number of sealing sub-layers in the first sealing portion 411 may be different from the total number of sealing sub-layers in the entire sealing layer 40.
[0040] 4, in some preferred embodiments, the first encapsulating portion 411 includes one encapsulating sub-layer. The outer peripheral surface of the encapsulating sub-layer forms a first sidewall 412, and the first sidewall 412 can be inclined by adjusting a patterning method or patterning parameters, etc. By configuring the first encapsulating portion 411 with one encapsulating sub-layer, processing can be simplified and the overall processing efficiency of the display panel 100 can be improved.
[0041] 5 to 7, FIG. 5 is a cross-sectional view of the A-A' portion shown in FIG. 1, FIG. 6 is an enlarged view of the local structure of the cross-sectional view shown in FIG. 5, and FIG. 7 is an enlarged view of another local structure of the cross-sectional view shown in FIG. 5.
[0042] In some preferred embodiments, the first sealing portion 411 includes a plurality of stacked sealing sublayers, each of which includes a first sealing sublayer 415 and a second sealing sublayer 416 adjacent to each other, with the second sealing sublayer 416 being located on the side of the first sealing sublayer 415 facing away from the substrate 10. The plurality of stacked sealing sublayers includes at least two sealing sublayers, and may include two, three, or even more sealing sublayers, without being limited thereto. This embodiment will be described using only two adjacent sealing sublayers.
[0043] Preferably, the first sealing portion 411 may have a plurality of sub-layers stacked together so as to enable the first sealing portion 411 to have a narrow top and wide bottom structure, and among the plurality of stacked sealing sub-layers, any two adjacent sealing sub-layers may be specifically a first sealing sub-layer 415 and a second sealing sub-layer 416 stacked together, and the second sealing sub-layer 416 is located on the side of the first sealing sub-layer 415 facing away from the substrate 10.
[0044] By providing multiple sealing sub-layers, the inclination direction of the first side wall 412 and the structural form of the extension portion 413 and the first sealing portion can be easily adjusted based on differences in parameters such as etching rate, making it easier to process the display panel 100 and improving processing efficiency.
[0045] In some preferred embodiments, the first sidewall 412 includes a first sub-sidewall 4121 located on the first sealing sub-layer 415 and a second sub-sidewall 4122 located on the second sealing sub-layer 416, and in a cross section along the thickness direction X of the substrate 10, an included angle α between the first sub-sidewall 4121 and a plane on which the substrate 10 is located is less than or equal to 90°, and / or an included angle β between the second sub-sidewall 4122 and a plane on which the substrate 10 is located is less than or equal to 90°. The first sealing sub-layer 415 includes a first surface 4141 close to the substrate 10 and a third surface 4143 remote from the substrate 10, and the first sub-sidewall 4121 connects the first surface 4141 and the third surface 4143. The second encapsulating sub-layer 416 has a fourth surface 4144 closer to the substrate 10 and a second surface 4142 farther from the substrate 10, and the second sub-sidewall 4122 connects the fourth surface 4144 and the second surface 4142. The angle α between the first sub-sidewall 4121 and the plane on which the substrate 10 is located may be the angle formed at the connection point between the first surface 4141 and the first sub-sidewall 4121, and the angle β between the second sub-sidewall 4122 and the plane on which the substrate 10 is located may be the angle formed at the connection point between the fourth surface 4144 and the second sub-sidewall 4122.
[0046] Considering that the first sealing portion 411 has multiple stacked sealing sub-layers, the first side wall 412 may correspondingly have a first sub-side wall 4121 located in the first sealing sub-layer 415 and a second sub-side wall 4122 located in the second sealing sub-layer 416, and the included angle between at least a portion of the first side wall 412 and the plane on which the substrate 10 is located being less than or equal to 90° may mean that the included angle α between the first sub-side wall 4121 and the plane on which the substrate 10 is located is less than or equal to 90°, or that the included angle β between the second sub-side wall 4122 and the plane on which the substrate 10 is located is less than or equal to 90°, or that the included angles between the first sub-side wall 4121, the second sub-side wall 4122 and the plane on which the substrate 10 is located are all less than or equal to 90°.
[0047] Preferably, the first sub-sidewall 4121 located closer to the isolation structure 20 has an included angle α less than or equal to 90° with the plane on which the substrate 10 is located, thereby ensuring that the bottom region of the side of the first encapsulating portion 411 closer to the isolation structure 20 has a narrow top and wide bottom structure. Alternatively, the included angle β between the second sub-sidewall 4122 and the plane on which the substrate 10 is located may also be less than or equal to 90°, and its function is the same as that of the inclined first sub-sidewall 4121, so a description thereof will not be repeated here. Alternatively, it is preferable that the included angles between the first sub-sidewall 4121 and the plane on which the substrate 10 is located are all less than or equal to 90°, thereby forming a structure in which each portion of the configured first sidewall 412 is inclined toward the inside of the isolation opening 21.
[0048] In some preferred embodiments, referring to FIG. 6, in a cross section along the thickness direction X of the substrate 10, the angle α between the first sub-sidewall 4121 and the plane on which the substrate 10 is located is not equal to the angle β between the second sub-sidewall 4122 and the plane on which the substrate 10 is located.
[0049] Preferably, in an embodiment in which the first sealing portion 411 has two stacked sealing sub-layers, the first sub-sidewall 4121 and the second sub-sidewall 4122 located in each of the two sealing sub-layers have included angles of different magnitudes with the plane on which the substrate 10 is located, and it is preferable that both of the included angles are less than or equal to 90°.
[0050] Specifically, the relative size relationship between the included angle α between the first sub-sidewall 4121 and the substrate 10 and the included angle β between the second sub-sidewall 4122 and the substrate 10 is preferably designed based on process parameters such as etching, and the present application does not particularly limit the relative size relationship between the two included angles mentioned above, provided that the first sidewall 412 as a whole tends to incline in a direction approaching the central axis of the isolation opening 21.
[0051] By making the first sub-sidewall 4121 and the second sub-sidewall 4122 each form a different angle with the substrate 10, the display panel 100 can be adapted to different patterning methods, reducing the processing difficulty and improving the processing efficiency.
[0052] In some preferred embodiments, in a cross section along the thickness direction X of the substrate 10, the first sub-sidewall 4121 and the second sub-sidewall 4122 are not parallel to each other.
[0053] Similar to the above-mentioned embodiment having different included angles, the first sub-side wall 4121 and the second sub-side wall 4122 may not be parallel to each other, that is, the extension directions of the two may intersect, and the specific installation method and effect thereof are the same as those of the above-mentioned embodiment, and the present application will not repeat the description here.
[0054] In some preferred embodiments, the orthogonal projection of the second encapsulation sub-layer 416 on the substrate 10 is located within the contour range of the orthogonal projection of the first encapsulation sub-layer 415 on the substrate 10 .
[0055] Preferably, the first sealing sub-layer 415 and the second sealing sub-layer 416 are arranged directly opposite each other in the thickness direction X, and the orthogonal projection of the first sealing sub-layer 415 may completely cover the orthogonal projection of the second sealing sub-layer 416, thereby avoiding the problem of chamfering any edge region of the sealing portion 41 and further improving the reliability of the display panel 100.
[0056] In some preferred embodiments, the first sealing portion 411 has an extension 413 located on the side of the isolation structure 20 away from the substrate 10, and the orthogonal projection of the extension 413 on the substrate 10 is located within the orthogonal projection range of the isolation structure 20 on the substrate 10, and the orthogonal projection of the area located within the extension 413 of the first sealing sub-layer 415 on the substrate 10 is arranged to cover the orthogonal projection of the area located within the extension 413 of the second sealing sub-layer 416 on the substrate 10.
[0057] As mentioned above, in the embodiment having the extension portion 413, the orthogonal projection of the extension portion 413 on the substrate 10 may be located within the orthogonal projection range of the isolation structure 20 on the substrate 10, thereby avoiding the problem of the extension portion 413 interfering with or short-circuiting the light-emitting units 30 in the adjacent isolation openings 21.
[0058] In light of this, the extending portion 413 may be simultaneously composed of a first sealing sub-layer 415 and a second sealing sub-layer 416, and the two sub-layers in the extending portion 413 may have a structure that is narrow at the top and wide at the bottom, that is, the orthogonal projection of a portion of the second sealing sub-layer 416 in the extending portion 413 is positioned within the orthogonal projection range of a portion of the first sealing sub-layer 415 in the extending portion 413, so that the extending portion has a shape that is narrow at the top and wide at the bottom, thereby improving the continuity of subsequent film layers in the extending portion and reducing the possibility of damage to the first sealing portion and the corresponding light-emitting units.
[0059] In some preferred embodiments, the etch rate of second encapsulation sub-layer 416 is greater than the etch rate of first encapsulation sub-layer 415 .
[0060] In some preferred embodiments, the density of the second sealing sub-layer 416 is less than the density of the first sealing sub-layer 415 .
[0061] In some preferred embodiments, the refractive index of the second sealing sub-layer 416 is less than the refractive index of the first sealing sub-layer 415 .
[0062] In some preferred embodiments, the thickness of the first sealing sub-layer 415 is greater than the thickness of the second sealing sub-layer 416 .
[0063] Preferably, parameters of the first and second encapsulating sublayers 415 and 416 may be changed to facilitate processing while maintaining the relative size relationship between them for the display panel 100. For example, the second encapsulating sublayer 416 may have a higher etching efficiency during etching, a looser film layer structure, or a lower refractive index. In any case, the second encapsulating sublayer 416 may have a smaller orthogonal projection area than the first encapsulating sublayer 415 after processing. Alternatively, the thicknesses of the two encapsulating sublayers may be adjusted so that the lower first encapsulating sublayer 415 has a relatively large thickness. This allows the encapsulating sublayers to be patterned so that at least a portion of the first sidewall of the first encapsulating portion is more quickly inclined toward the central axis of the isolation opening, thereby improving the reliability of the display panel.
[0064] In some preferred embodiments, along the thickness direction, the first encapsulating sub-layer 415 has a first surface 4141 close to the substrate 10 and a third surface 4143 far from the substrate 10, and the orthogonal projection of the third surface 4143 on the substrate 10 is located within the outline of the orthogonal projection of the first surface 4141 on the substrate 10, i.e., the orthogonal projection of the edge line of the third surface 4143 on the substrate 10 is located within the outline of the orthogonal projection of the edge line of the first surface 4141 on the substrate 10, and the first encapsulating sub-layer 415 has an approximately trapezoidal shape that is wide at the bottom and narrow at the top, and subsequent film layers cover the sides of the first encapsulating sub-layer 415 to form continuous film layers along the sides of the first encapsulating sub-layer 415, thereby improving the overall yield rate and reliability of the display panel 100.
[0065] Similarly, in some preferred embodiments, along the thickness direction, the second encapsulating sub-layer 416 has a fourth surface 4144 close to the substrate 10 and a second surface 4142 far from the substrate 10, and the orthogonal projection of the second surface 4142 on the substrate 10 is located within the outline of the orthogonal projection of the fourth surface 4144 on the substrate 10, i.e., the orthogonal projection of the edge line of the second surface 4142 on the substrate 10 is located within the outline of the orthogonal projection of the edge line of the fourth surface 4144 on the substrate 10, i.e., the second encapsulating sub-layer 416 has an approximately trapezoidal shape that is wide at the bottom and narrow at the top, and subsequent film layers cover the sides of the second encapsulating sub-layer 416 to form continuous film layers along the sides of the second encapsulating sub-layer 416, thereby improving the overall yield rate and reliability of the display panel 100.
[0066] Preferably, the orthogonal projection of the fourth surface 4144 on the substrate 10 is located within the contour range of the orthogonal projection of the third surface 4143 on the substrate 10, or the contour of the orthogonal projection of the fourth surface 4144 on the substrate 10 coincides with the contour of the orthogonal projection of the third surface 4143 on the substrate 10, i.e., the orthogonal projection of the edge line of the fourth surface 4144 on the substrate 10 is located within the contour range of the orthogonal projection of the edge line of the third surface 4143 on the substrate 10, or the orthogonal projection of the fourth surface 4144 on the substrate 10 coincides with the contour of the orthogonal projection of the edge line of the third surface 4143 on the substrate 10. The contour of the orthogonal projection of the edge line of 144 on the substrate 10 is the same as the contour of the orthogonal projection of the edge line of the third surface 4143 on the substrate 10, and the connection point between the first sealing sub-layer 415 and the second sealing sub-layer 416 has a smooth transition, which prevents an indentation structure from appearing on the first side wall 412 of the first sealing portion 411 and prevents subsequent film layers from being separated or cracked by the first side wall 412, thereby improving the overall yield rate and reliability of the display panel 100.
[0067] In some preferred embodiments, referring to FIG. 4 , the plurality of encapsulating portions 41 include a plurality of the first encapsulating portions 411, and the plurality of first encapsulating portions 411 cover all of the light-emitting units 30, that is, the encapsulating portions 41 corresponding to all of the light-emitting units 30 are all first encapsulating portions 411, and the encapsulating portion 41 only includes the first encapsulating portion 411.
[0068] Preferably, the multiple sealing portions 41 in the display panel 100 may all be first sealing portions 411, that is, each sealing portion 41 has a first side wall 412, and the angle between the first side wall 412 and the plane on which the substrate 10 is located is all less than or equal to 90°, which can further improve the overall reliability of the display panel 100.
[0069] Among some preferred embodiments, in an embodiment in which all of the multiple sealing portions 41 may be a first sealing portion 411, the first sealing portion 411 may further include a first sub-sealing portion 4111 and a second sub-sealing portion 4112, and the angle formed between at least a portion of the first side wall 412 of the first sub-sealing portion 4111 and the plane on which the substrate 10 is located is smaller than or equal to the angle formed between the second sub-sealing portion 4112 and the plane on which the substrate 10 is located.
[0070] 8, which is a further cross-sectional view taken along line A-A' in FIG. 1. In an embodiment in which each sealing portion 41 is a first sealing portion 411 and each has a first side wall 412, the first sealing portions 411 preferably have two sub-sealing portions, i.e., a structure in which some are first sub-sealing portions 4111 and some are second sub-sealing portions 4112, and both sub-sealing portions have a first side wall 412. The angle between the first side wall 412 of the first sub-sealing portion 4111 and the substrate 10 is referred to as a first included angle δ, and the angle between the first side wall 412 of the second sub-sealing portion 4112 and the substrate 10 is referred to as a second included angle γ. The first included angle δ and the second included angle γ preferably have different angular magnitudes, and the first included angle δ may be smaller or equal to the second included angle γ.
[0071] In some preferred embodiments, referring to FIG. 5, the sealing portion 41 further comprises a second sealing portion 417, the second sealing portion 417 comprises a second side wall 418, and in a cross section along the thickness direction of the substrate 10, the included angle between at least a portion of the second side wall 418 and the plane on which the substrate 10 is located is greater than or equal to 90°.
[0072] This embodiment corresponds to the structural form in which each of the encapsulants 41 described above is the first encapsulant 411. In this embodiment, the plurality of encapsulants 41 of the display panel may be jointly formed by the first encapsulant 411 and the second encapsulant 417, wherein the second encapsulant 417 has a second sidewall 418 corresponding to the first sidewall 412, and the included angle ε between the second sidewall 418 and the plane on which the substrate 10 is located may be greater than or equal to 90°, that is, the second sidewall 418 tends to slope outward from the isolation opening 21 in a direction away from the substrate 10. In addition, the first encapsulant 411 may be the encapsulant corresponding to the first-fabricated light-emitting unit, and the second encapsulant 417 may be the encapsulant corresponding to the later-fabricated light-emitting unit. The shape of the encapsulant corresponding to the later-fabricated light-emitting unit is not limited, thereby improving the fabrication efficiency of the display panel.
[0073] Among some preferred embodiments, in an embodiment in which the multiple sealing portions 41 of the display panel may be jointly constituted by a first sealing portion 411 and a second sealing portion 417, the first sealing portion 411 further includes a first sub-sealing portion 4111 and a second sub-sealing portion 4112, and in a cross section along the thickness direction of the substrate 10, the angle formed between at least a portion of the first side wall 412 of the first sub-sealing portion 4111 and the plane on which the substrate 10 is located is smaller than or equal to the angle formed between at least a portion of the first side wall 412 of the second sub-sealing portion 4112 and the plane on which the substrate 10 is located.
[0074] Similar to the structural form in which each sealing portion 41 described above is the first sealing portion 411, in the embodiment in which the sealing portion 41 simultaneously includes the first sealing portion 411 and the second sealing portion 417, it is preferred that the first sealing portion 411 still includes the first sub-sealing portion 4111 and the second sub-sealing portion 4112, i.e., the display panel simultaneously includes the first sub-sealing portion 4111, the second sub-sealing portion 4112, and the second sealing portion 417, and the function thereof is similar to the previous embodiment, and the present application will not repeat the description here.
[0075] In some preferred embodiments, the width of the extension 413 is less than half the width of the isolation structure 20 in a cross section perpendicular to the extension direction of the isolation structure 20 .
[0076] The sealing layer 40 in the display panel 100 covers the side of the light-emitting unit 30 that faces away from the substrate 10, and the sealing layer 40 may have a plurality of sealing portions 41 that correspond to the light-emitting units 30, and the main bodies of these sealing portions 41 are disposed within the pixel opening 111 and extend from the pixel opening 111 to the isolation structure 20 surrounding the opening, covering at least some of the side surfaces and some of the top surface of the isolation structure 20, and among them, the first sealing portion 411 that covers the top surface of the isolation structure 20 may cover only a portion of the top surface, i.e., the extending portion 413 of the first sealing portion 411 may cover only a portion of the top surface.
[0077] In the thickness direction X of the display panel 100, the orthogonal projection of each first encapsulant 411 has an overlapping region with the orthogonal projection of the isolation structure 20, and the width of the overlapping region, i.e., the width of the extending portion 413, is less than or equal to half the width of the orthogonal projection of the isolation structure 20 itself. Preferably, the width refers to the extending dimension in a direction parallel to the substrate 10 and perpendicular to the extending direction of the isolation structure 20 itself, and the extending direction of the isolation structure 20 refers to the extending direction of a portion of the isolation structure 20 interposed between two light-emitting units 30 provided corresponding to adjacent encapsulants 41.
[0078] For example, in an embodiment in which a sealing portion 41 is provided on both sides of an isolation structure 20 perpendicular to its extension direction, the sealing portions 41 on both sides each extend to the top surface of the isolation structure 20 and each cover a portion of the top surface, and the two sealing portions 41 may be provided at a distance from each other or connected to each other.
[0079] In some preferred embodiments, a gap 419 is formed between the extension 413 of the first sealing portion 411 and the surface of the isolation structure 20 that faces away from the substrate 10 .
[0080] Specifically, a gap 419 may be formed between the first sealing portion 411 and the surface of the isolation structure 20 facing away from the substrate 10, thereby limiting the extension dimension of the first sealing portion 411 along the width direction of the isolation structure 20. At the same time, the sealing portions 41 corresponding to adjacent light emitting units 30 may be separated from each other on the side of the isolation structure 20 facing away from the substrate 10, i.e., the adjacent sealing portions 41 are spaced apart from each other on the side of the isolation structure 20 facing away from the substrate 10, thereby cutting off the flow path of moisture between adjacent light emitting units 30 and improving the sealing performance of the display panel 100.
[0081] In some preferred embodiments, along the direction away from the substrate 10, the light-emitting unit 30 comprises a light-emitting material layer 13 and a first electrode 12 sequentially stacked on a second electrode 14, and the isolation structure 20 comprises a conductive structure, which is electrically connected to the first electrode 12.
[0082] Preferably, each light-emitting unit 30 may include a light-emitting material layer 13 and a first electrode 12 and a second electrode 14 located on both sides of the light-emitting material layer 13, where the specific material of the light-emitting material layer 13 can be determined based on the emission color required for the light-emitting unit 30, and the electrodes on both sides may be an anode and a cathode, respectively, which are used to realize light emission after an electrical signal is applied.
[0083] Furthermore, the second electrodes 14 may be separated by the pixel definition layer 11 and controlled separately, and the first electrodes 12 may be overlapped and connected to the isolation structure 20 and electrically connected by a conductive structure provided on the isolation structure 20, so that the same electrical signal is applied to the first electrodes 12 in adjacent light-emitting units 30. For example, the first electrode 12 may be a cathode, and the isolation structure 20 may be provided with a conductor structure extending to both sides in its width direction at the position of the region contacting the first electrode 12, thereby realizing electrical connection.
[0084] In some preferred embodiments, the isolation structure 20 includes a first isolation portion 22 and a second isolation portion 23, the second isolation portion 23 being located on the side of the first isolation portion 22 facing away from the substrate 10, and the orthogonal projection of the first isolation portion 22 on the substrate 10 being located within the outline of the orthogonal projection of the second isolation portion 23 on the substrate 10. In other embodiments, the configuration, materials, etc. of the isolation structure (also referred to as a blocking structure, etc.) may refer to relevant technical solutions disclosed in patents or patent applications such as CN118251982A, 202410864269.8, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, PCT / CN2024 / 099072, CN116685174A, etc.
[0085] 4 , the isolation structure 20 may include a first isolation portion 22 and a second isolation portion 23. The second isolation portion 23 is located on the side of the first isolation portion 22 that is farther from the substrate 10. The orthogonal projection area of the second isolation portion 23 along the thickness direction X of the display panel 100 is larger than the orthogonal projection area of the first isolation portion 22. That is, the orthogonal projection of the first isolation portion 22 along the thickness direction X of the display panel 100 is located within the outline of the orthogonal projection of the second isolation portion 23. In this case, the isolation structure 20 has a bottom recessed structure, i.e., an undercut structure, in which the lower layer is narrow and the upper layer is wide. This facilitates cutting of film layers at this position to isolate adjacent light-emitting units 30, thereby preventing crosstalk between adjacent light-emitting units 30 and problems such as oxidation failure due to the intrusion of water vapor that may spread to the surroundings.
[0086] In some preferred embodiments, the substrate 10 comprises a pixel definition layer 11, which encloses and defines a plurality of pixel openings 111, the light-emitting units 30 are located within the pixel openings 111, and the isolation structures 20 are provided on the side of the pixel definition layer 11 away from the substrate 10, and the isolation openings 21 communicate with the pixel openings 111.
[0087] As mentioned above, the display panel 100 may include a pixel definition layer 11 for defining the position and shape of each light-emitting unit 30. The pixel definition layer has pixel openings 111, and the light-emitting units 30 are disposed within the pixel openings 111. Preferably, the second electrodes 14 are partially disposed below the pixel definition layer 11, which facilitates processing. Preferably, the isolation openings 21 are disposed in one-to-one correspondence with the pixel openings 111, or preferably, the isolation openings 21 are disposed corresponding to a plurality of pixel openings 111, and the two openings communicate with each other, allowing the encapsulation layer 40 to cover the light-emitting units 30.
[0088] Please refer to FIG. 9, which is yet another cross-sectional view taken along the line AA' shown in FIG.
[0089] In a second aspect, an embodiment of the present application provides a display panel 100, the display panel 100 including a substrate 10, an isolation structure 20 provided on one side of the substrate 10 and surrounding the substrate 10 to form a plurality of isolation openings 21, a light emitting unit 30 provided on a side of the substrate 10 close to the isolation structure 20 and at least a portion of the light emitting unit 30 exposed through the isolation openings 21, and a sealing layer 40 including a plurality of sealing portions 41 located on a side of the light emitting unit 30 away from the substrate 10 and overlapping and connected to a side of the isolation structure 20 facing the isolation openings 21, the sealing portion 41 being a first sealing portion 41. 1, in a cross section along the thickness direction of the display panel 100 and passing through the central axis of the isolation opening 21 corresponding to the first sealing portion 411, points A and B are provided on the first side wall 412 of the first sealing portion 411, of which point A has a distance Ha to the plane on which the substrate 10 is located and a distance La to the central axis of the isolation opening 21 corresponding to the first sealing portion 411, point B has a distance Hb to the plane on which the substrate 10 is located and a distance Lb to the central axis of the isolation opening corresponding to the first sealing portion, where Ha≦Hb and La≧Lb.
[0090] In the display panel 100, the first sealing portion 411 may include a base portion 414 and an extension portion 413, and the specific structure thereof is similar to that of the previous embodiment, and the present application will not repeat the description here.
[0091] Preferably, when a cross-sectional view of the display panel 100 is created along a cross section parallel to the thickness direction X, the first sealing portion 411 forms a first cross-sectional figure in the cross section, and the first cross-sectional figure has two edges that face each other in the thickness direction X, and an edge line formed by the first side wall 412 connects the two edges.
[0092] Based on this, points A and B are selected on the edge line, and in the thickness direction X, the distance between point A and the substrate 10 is Ha, and the distance between point B and the substrate 10 is Hb, with Ha≦Hb, i.e., point A is closer to the substrate 10 than point B. Furthermore, perpendicular lines are drawn from points A and B to the central axes of the corresponding isolating openings, and the lengths of the formed perpendicular lines are denoted as La and Lb, respectively, with La≧Lb, i.e., the distance between point A and the central axis is greater. This allows the extending portion 413 to have a narrow top and wide bottom structure, which allows a film layer to be processed in a subsequent process to completely cover the corresponding first side wall 412, thereby improving the reliability of the display panel 100.
[0093] In some preferred embodiments, at least a portion of the first sealing portion 411 extends away from the substrate 10 of the isolation structure 20, and the first sealing portion 411 has an extending portion 413 located on the side away from the substrate 10 of the isolation structure 20, the orthogonal projection of the extending portion 413 on the substrate 10 is located within the orthogonal projection range of the isolation structure 20 on the substrate 10, and a first side wall 412 of the first sealing portion 411 is formed on the side of the extending portion 413 away from the central axis of the light-emitting unit.
[0094] The first sealing portion 411 may have an extension portion 413 formed on the top surface of the isolation structure 20, and the aforementioned first side wall 412 may be located on the outer peripheral surface of the extension portion 413, and its specific structural form is the same as the structural form of the first side wall 412 on the first side, and the present application will not repeat the description here.
[0095] 10, which is a structural schematic diagram of a display device 200 according to one embodiment of the present invention. In a third aspect, according to an embodiment of the present invention, a display device 200 including a display panel 100 according to any one of the embodiments of the first to eighth aspects is provided.
[0096] The display device 200 according to the embodiments of the present application includes the display panel 100 according to any one of the above embodiments, and the display device 200 may be any product or component with a display function, such as a mobile phone, a tablet, a digital photo frame, electronic paper, etc. The display device 200 according to the embodiments of the present application has all the beneficial effects of the display panel 100 according to the embodiments of the present application, and specific details can be found in the detailed descriptions of the display panel 100 of each of the above embodiments, and this embodiment will not be described again here.
[0097] 11, which is a flowchart of a method for manufacturing a display panel 100 according to one embodiment of the present application. In a fourth aspect, the embodiment of the present application includes: S1 providing a substrate 10; forming an isolation structure 20 on the substrate 10 so as to enclose the isolation structure 20 and form a plurality of isolation openings 21; S3: sequentially depositing a first light-emitting material layer, a first electrode 12 material layer, and a first sealing material layer; S4: Adjusting different etching rates to pattern the first sealing material layer to form a first sealing portion, and making the included angle between at least a part of a first sidewall of the first sealing portion and a plane on which the substrate is located less than or equal to 90°. The present invention further provides a method for fabricating a display panel 100, including: patterning the first electrode material layer and the first light-emitting material layer to form light-emitting units, and exposing the light-emitting units through isolation openings (S5).
[0098] The embodiment of the present application first provides a method for fabricating a display panel 100, which first includes step S1, that is, providing a substrate 10.
[0099] Specifically, the substrate 10 in step S1 may include a pixel definition layer 11, which has a plurality of pixel openings 111 spaced apart from one another, which are used to define the positions of pixels to be fabricated, and which may be divided into different pixel openings 111 according to the emission colors of the light-emitting units 30 in the display panel 100. In addition to the pixel definition layer 11, the substrate 10 may include other single- or multi-layer structures, and may also include corresponding circuit wiring and the like for electrically connecting to the pixels and controlling their emission.
[0100] Preferably, a second electrode 14 required to form a pixel may be provided on the substrate 10 corresponding to the pixel opening 111, and the second electrode 14 is at least partially exposed from the pixel opening 111 to form a light-emitting pixel together with a subsequent light-emitting material, another electrode, etc.
[0101] In step S2, an isolation structure 20 is formed on the substrate 10. The isolation structure 20 can be offset from the pixel opening 111 and surround the pixel opening 111. That is, the isolation structure 20 can be provided between adjacent pixels to be formed, separating the film layers of the adjacent pixels and forming pixel structures that are independent of each other, thereby preventing crosstalk between adjacent pixels and problems such as oxidation failure due to the intrusion of water vapor from spreading to the surroundings. The isolation structure 20 surrounds and closes the pixel openings 111 to form a plurality of isolation openings 21. These isolation openings 21 are preferably provided in one-to-one correspondence with the pixel openings 111 and communicate with each other in the thickness direction X.
[0102] In step S3, a first light-emitting material layer, a first electrode 12 material layer, and a first encapsulating material layer are sequentially deposited on the same side of the substrate 10, i.e., the side where the isolation structure 20 is provided, so as to obtain a corresponding light-emitting material layer 13, a first electrode 12, and a first encapsulating portion 411 after patterning in a subsequent step. The first light-emitting material layer and the first electrode material layer can be processed by evaporation or other methods, and the first light-emitting material layer can be a light-emitting material required to have pixels of the same color in the display panel 100, and the color can be any suitable color, such as red, green, or blue.
[0103] In step S4, the first sealing material layer is patterned to form a first sealing portion 411, and the angle between at least a portion of the first sidewall 412 located on the outer periphery of the first sealing portion 411 and the plane on which the substrate 10 is located is set to be less than or equal to 90°.
[0104] The step of patterning the first encapsulant layer can be achieved by etching, etc. Specifically, in the process flow of patterning the first encapsulant layer, the processing method should be adjusted accordingly so that the first encapsulant 411 obtained after patterning has a first sidewall 412 perpendicular to the substrate 10 or a first sidewall 412 having an acute included angle, and has a trapezoidal structure that is narrow at the top and wide at the bottom, thereby allowing film layers in subsequent processes to smoothly cover up to a predetermined position, avoiding pixel damage and improving production yield and reliability.
[0105] In step S5, the first electrode material layer and the first light-emitting material layer are patterned to form the first electrode 12 and the light-emitting material layer 13, respectively, and finally, together with another electrode, form the light-emitting units 30, which are exposed from the isolation openings 21 and are covered by the first sealing portion 411.
[0106] In some preferred embodiments, after step S3 of sequentially depositing the first light-emitting material layer, the first electrode 12 material layer, and the first encapsulation material layer, A second light-emitting material layer, a second electrode 14 material layer, and a second sealing material layer are sequentially deposited, of which the second electrode 14 material layer further includes S6 that is continuous with and covers the first side wall 412 of the first sealing portion 411.
[0107] Preferably, after the preparation of the first encapsulating portion 411 is completed, a second light-emitting material layer, a second electrode material layer and a second encapsulating material layer may be further deposited on the substrate 10 to be subsequently processed to form the structure of another light-emitting unit 30, and it is preferred that the second light-emitting material layer emits light of a different color from that of the first light-emitting material layer.
[0108] When the second electrode 14 material layer is deposited, it can be covered on the first side wall 412 of the first encapsulating portion 411, so that the second encapsulating portion 417 has a structure that is inclined toward the inside of the corresponding light emitting unit 30 or a structure that is perpendicular to the substrate 10. The second electrode 14 material layer can smoothly cover the first side wall 412 of the first encapsulating portion 411, which reduces the possibility of damaging the already processed and shaped structure in subsequent processes such as patterning, and improves the yield of the resulting display panel 100.
[0109] 12, which is a flowchart of a method for manufacturing a display panel according to another embodiment of the present application. In some preferred embodiments, the step S3 of depositing a first encapsulating material layer includes: S31 depositing a first encapsulation sub-material layer; and depositing S32 a second encapsulation sub-material layer on the side of the first encapsulation sub-material layer facing away from the substrate.
[0110] Step S4 of patterning the first encapsulation material layer by adjusting different etching rates includes: A portion of the second encapsulation sub-material layer is patterned first at a first etching rate, and then the first encapsulation sub-material layer is patterned at a second etching rate, including S41, where the first etching rate is greater than the second etching rate.
[0111] Based on the above-mentioned processing method, the first sealing material layer may include two stacked first and second sealing sub-material layers, which are patterned to form the first sealing sub-layer 415 and the second sealing sub-layer 416, respectively, and it is preferable that the second sealing sub-layer 416 has an area smaller than or equal to the area of the first sealing sub-layer 415 based on the extension direction of the first sidewall 412.
[0112] When etching the two aforementioned sealing sub-layers, it is preferable to adopt a stepwise etching method, in which the etching rate of the second sealing sub-layer is faster than that of the first sealing sub-layer, to ensure that the area of the second sealing sub-layer 416 is smaller than or equal to the area of the first sealing sub-layer 415.
[0113] Alternatively, to improve processing efficiency, the first sealing layer and the second sealing layer may be processed using a simultaneous etching method, and the two sealing layers may be made of different materials or have different densities, so that the first sealing layer and the second sealing layer have different etching rates, thereby forming the second sealing layer and the first sealing layer with different widths using the same etching process, thereby forming the first sealing portion 411 that is narrow at the top and wide at the bottom as described above.
Claims
1. A substrate; an isolation structure provided on one side of the substrate, the isolation structure enclosing the substrate to form a plurality of isolation openings; a plurality of light emitting units provided on a side of the substrate close to the isolation structure; a sealing layer including a plurality of first sealing portions located on a side of at least one of the light emitting units away from the substrate and overlapping and connected to a side surface of the isolation structure facing the isolation opening, the first sealing portion has a first sidewall located on a side of the isolation structure that is away from the substrate, and an angle between at least a part of the first sidewall and a plane on which the substrate is located is less than or equal to 90° in a cross section along a thickness direction of the substrate; A display panel characterized by:
2. the first sealing portion is located on a side of the isolation structure that faces away from the substrate, and includes an extension portion whose orthogonal projection on the substrate is within a range of orthogonal projection of the isolation structure on the substrate.
2. The display panel according to claim 1, wherein the first and second electrodes are arranged parallel to each other.
3. the extension has a first sub-surface facing the substrate and a second sub-surface facing away from the substrate, the first sidewall being connected to the first sub-surface and the second sub-surface; an included angle between at least a portion of the first sidewall and the first sub-surface is less than or equal to 90°; an orthogonal projection of the second sub-surface of the extension portion onto the substrate is located within a range of an orthogonal projection of the first sub-surface onto the substrate; 3. The display panel according to claim 2.
4. The first sealing portion one sealing sub-layer; Alternatively, the present invention may include a plurality of stacked sealing sublayers, each including a first sealing sublayer and a second sealing sublayer adjacent to each other, the first sealing sublayer being positioned on a side of the first sealing sublayer facing away from the substrate.
2. The display panel according to claim 1, wherein the first and second electrodes are arranged parallel to each other.
5. the first sidewall comprises a first sub-sidewall located in the first sealing sublayer and a second sub-sidewall located in the second sealing sublayer, and in a cross section along the thickness direction of the substrate, an included angle between the first sub-sidewall and a plane on which the substrate is located is less than or equal to 90°, and / or an included angle between the second sub-sidewall and a plane on which the substrate is located is less than or equal to 90°; 5. The display panel according to claim 4.
6. In a cross section along the thickness direction of the substrate, the angle between the first sub-sidewall and a plane on which the substrate is located is not equal to the angle between the second sub-sidewall and a plane on which the substrate is located, or In a cross section along the thickness direction of the substrate, the first sub-sidewall and the second sub-sidewall are not parallel to each other, or an orthogonal projection of the second sealing sub-layer on the substrate is located within a contour range of an orthogonal projection of the first sealing sub-layer on the substrate; 6. The display panel according to claim 5.
7. the first sealing portion is located on a side of the isolation structure away from the substrate, and includes an extension portion whose orthogonal projection on the substrate is within a range of orthogonal projection of the isolation structure on the substrate, and the orthogonal projection on the substrate of a region located within the extension of the second sealing sub-layer is within a contour range of the orthogonal projection on the substrate of a region located within the extension of the first sealing sub-layer; or along the thickness direction, the first sealing sub-layer has a first surface close to the substrate and a third surface far from the substrate, and the second sealing sub-layer has a fourth surface close to the substrate and a second surface far from the substrate, and an orthogonal projection of the fourth surface on the substrate is located within a contour range of an orthogonal projection of the third surface on the substrate, or an outline of the orthogonal projection of the fourth surface on the substrate coincides with an outline of an orthogonal projection of the third surface on the substrate.
5. The display panel according to claim 4.
8. an etching rate of the second sealing sub-layer greater than an etching rate of the first sealing sub-layer; Alternatively, the density of the second sealing sub-layer is less than the density of the first sealing sub-layer; or the refractive index of the second sealing sub-layer is less than the refractive index of the first sealing sub-layer; Alternatively, the thickness of the first sealing sub-layer is greater than the thickness of the second sealing sub-layer.
5. The display panel according to claim 4.
9. Along the thickness direction, the first encapsulation sub-layer has a first surface close to the substrate and a third surface remote from the substrate, the third surface being located within a contour of an orthogonal projection of the first surface on the substrate; and / or along the thickness direction, the second encapsulation sub-layer comprises a fourth surface close to the substrate and a second surface remote from the substrate, the orthogonal projection of the fourth surface on the substrate being within a contour of the orthogonal projection of the fourth surface on the substrate.
5. The display panel according to claim 4.
10. the sealing layer includes a plurality of the first sealing portions that cover all of the light-emitting units, Preferably, the plurality of first sealing portions further include a first sub-sealing portion and a second sub-sealing portion, and an included angle formed between at least a part of a first side wall of the first sub-sealing portion and a plane on which the substrate is located is smaller than or equal to an included angle formed between at least a part of a first side wall of the second sub-sealing portion and the plane on which the substrate is located; or the sealing layer further includes a second sealing portion located on a side of at least one of the light-emitting units away from the substrate and overlapping and connected to a side surface of the isolation structure facing the isolation opening, the second sealing portion including a second side wall located on a side of the isolation structure away from the substrate, and an included angle formed between at least a part of the second side wall and the plane on which the substrate is located is larger than or equal to 90° in a cross section along the thickness direction of the substrate; the first sealing portion further comprises a first sub-sealing portion and a second sub-sealing portion, and in a cross section along the thickness direction of the substrate, an included angle formed between at least a part of the first side wall of the first sub-sealing portion and a plane on which the substrate is located is smaller than or equal to an included angle formed between at least a part of the first side wall of the second sub-sealing portion and a plane on which the substrate is located; 2. The display panel according to claim 1, wherein the first and second electrodes are arranged parallel to each other.
11. a gap is formed between the extension of the first sealing portion and a surface of the isolation structure that faces away from the substrate; Alternatively, in a cross section perpendicular to the extension direction of the isolation structure, the width of the extension portion of the first sealing portion is smaller than half the width of the isolation structure.
3. The display panel according to claim 2.
12. The light-emitting unit includes a light-emitting material layer and a first electrode, which are sequentially stacked along a direction away from the substrate, and the isolation structure includes a conductive structure electrically connected to the first electrode; Alternatively, the isolation structure includes a first isolation portion and a second isolation portion, the second isolation portion is located on a side of the first isolation portion that is away from the substrate, and an orthogonal projection of the first isolation portion on the substrate is located within a contour range of an orthogonal projection of the second isolation portion on the substrate, Alternatively, the substrate may include a pixel definition layer that encloses and defines a plurality of pixel openings, the light-emitting units are located within the pixel openings, and the isolation structures are provided on a side of the pixel definition layer that is away from the substrate, and the isolation openings communicate with the pixel openings.
2. The display panel according to claim 1, wherein the first and second electrodes are arranged parallel to each other.
13. A display panel, A substrate; an isolation structure provided on one side of the substrate, the isolation structure enclosing the substrate to form a plurality of isolation openings; a plurality of light emitting units provided on a side of the substrate close to the isolation structure; a sealing layer including a first sealing portion located on a side of at least one of the light emitting units facing away from the substrate and overlapping and connected to a side surface of the isolation structure facing the isolation opening; In a cross section along the thickness direction of the display panel and passing through a central axis of the isolating opening corresponding to the first sealing portion, points A and B are set on a first side wall of the first sealing portion, the distance of point A to a plane on which the substrate is located is Ha and the distance of point A to the central axis of the isolating opening corresponding to the first sealing portion is La, the distance of point B to the plane on which the substrate is located is Hb and the distance of point B to the central axis of the isolating opening corresponding to the first sealing portion is Lb, where Ha≦Hb and La≧Lb. A display panel characterized by:
14. the first sealing portion is located on a side of the isolation structure away from the substrate, and an extension portion whose orthogonal projection on the substrate is located within a range of orthogonal projection of the isolation structure on the substrate, and a first side wall of the first sealing portion is formed on a side away from a central axis of the corresponding isolation opening.
14. The display panel according to claim 13.
15. Providing a substrate; forming an isolation structure in the substrate so as to enclose and form a plurality of isolation openings; sequentially depositing a first light emitting material layer, a first electrode material layer, and a first encapsulation material layer; adjusting different etching rates to pattern the first encapsulation material layer to form a first encapsulation portion, and making an included angle between at least a first sidewall of the first encapsulation portion and a plane on which the substrate is located less than or equal to 90°; patterning the first electrode material layer and the first light emitting material layer to form light emitting units, and exposing the light emitting units through the isolation openings; A method for manufacturing a display panel comprising:
16. After sequentially depositing the first light-emitting material layer, the first electrode material layer, and the first sealing material layer as described above, The method further includes sequentially depositing a second light-emitting material layer, a second electrode material layer, and a second sealing material layer, wherein the second electrode material layer is continuous with and covers a first sidewall of the first sealing portion.
16. The method for manufacturing a display panel according to claim 15.
17. The step of depositing the first encapsulation material layer includes: depositing a first encapsulation sub-material layer; depositing a second encapsulation sub-material layer on a side of the first encapsulation sub-material layer away from the substrate; The above-described method of patterning the first sealing material layer by adjusting different etching rates to form the first sealing portion includes: first patterning a portion of the second encapsulation sub-material layer at a first etch rate and then patterning a portion of the first encapsulation sub-material layer at a second etch rate, the first etch rate being greater than the second etch rate.
16. The method for manufacturing a display panel according to claim 15.