Cutting wheel and method of manufacturing the same

The cutting wheel design addresses high manufacturing costs by forming coolant channels through compression and bonding, ensuring easy and cost-effective production with uniform coolant supply.

JP2026023035APending Publication Date: 2026-02-13FS TECHN CORP
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Patent Information

Application Number
JP2024124735
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-07-31
Publication Date
2026-02-13

AI Technical Summary

Technical Problem

Conventional cutting wheels with built-in coolant channels require additional grinding after press working, leading to increased manufacturing costs due to the formation of protrusions that need to be cut off.

Method used

A cutting wheel design featuring a blade substrate formed by bonding two circular element substrates, with coolant flow paths created by flow path grooves on the bonding surfaces and slit openings along both sides, allowing for formation through compression without cutting, and a method involving press processing, bonding, and chip fixation to reduce costs.

Benefits of technology

The design enables easy and cost-effective manufacturing of cutting wheels with integrated coolant channels by eliminating deformation and reducing manufacturing steps, maintaining strength and facilitating uniform coolant supply.

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Abstract

To provide a cutting grinding wheel or the like which can be easily processed and whose manufacturing cost can be reduced.SOLUTION: A cutting grindstone 10 includes a blade substrate 11 having a mounting hole 12 to a drive shaft A in a central part and a plurality of cooling liquid flow paths 13 radially extending inside, and a plurality of segment chips 14 fixed to an outer peripheral part of the blade substrate 11, wherein the blade substrate 11 is formed by bonding first and second substrates 20 and 30, and each cooling liquid flow path 13 is constituted by first and second flow path grooves 23 and 33 formed on bonding surfaces of the first and second substrates 20 and 30. In each of the first and second substrates 2030 and, a pair of first and second slit openings 2434 and are formed along both sides of the first and second flow path grooves 2333 and.SELECTED DRAWING: Figure 1
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Citation Information

Patent Citations

  • JP1989042110U