Large polishing or grinding disc

Abstract

The utility model discloses a large polishing or grinding disc, belongs to the technical field of polishing or grinding, and particularly relates to a small polishing or grinding head and a large polishing or grinding disc, which are characterized in that the top of the large polishing or grinding disc is convex. According to the utility model, the problems of non-uniform distribution of polishing or grinding liquid and poor wafer flatness in the polishing or grinding process of the wafer in the prior art are solved.

Description

Technical Field

[0001] This utility model belongs to the field of polishing or grinding technology, and specifically relates to a large polishing or grinding disc. Background Technology

[0002] Wafer preparation operation: S1, Chamfer the wafer (or other items that require flatness processing); S2, Protect the back of the wafer after chamfering by fixing it to the polishing or grinding head using an adhesive or absorbent pad; S3, The polishing or grinding head and the polishing or grinding disc work together to polish or grind the main surface of the wafer; S4, Remove the wafer from the polishing or grinding head after polishing or grinding; S5, Clean the wafer.

[0003] Existing technologies mostly involve flat polishing or grinding disks. During the polishing or grinding process, because the edge of the wafer is located at the outer edge of the polishing or grinding disk, the central part of the wafer cannot fully contact the fresh polishing or grinding fluid. At the same time, the linear velocity at the outer edge of the polishing or grinding disk is higher than that inside the disk, resulting in a higher removal rate at the outer edge of the wafer than at the center and the inner side, which leads to a deterioration in wafer flatness. Utility Model Content

[0004] To solve the above problems, the present invention adopts the following technical solution:

[0005] A polishing or grinding disc includes: a polishing or grinding disc body, wherein the top of the polishing or grinding disc body is convex.

[0006] Furthermore, the protrusions on the polishing or grinding disc body are annular protrusions.

[0007] Furthermore, the outer surface of the annular protrusion is semi-circular.

[0008] Furthermore, the outer ring diameter of the annular protrusion is not greater than the diameter of the polishing or grinding disc body.

[0009] Furthermore, the inner ring diameter of the annular protrusion is not less than the diameter of the central hole of the polishing or grinding disc body.

[0010] Furthermore, the center of the annular protrusion is concentric with the center of the polishing or grinding disc body.

[0011] The beneficial effects of this utility model are:

[0012] This invention reduces the uneven distribution of polishing or grinding fluid, reduces the mechanical action at the edge of the large disk, makes the removal rate of each part of the wafer more uniform, and improves the flatness of the wafer; it solves the problems of uneven distribution of polishing or grinding fluid and poor wafer flatness in the prior art during the polishing or grinding process. Attached Figure Description

[0013] Figure 1 This is a front view of a polishing or grinding disc according to the present invention;

[0014] Figure 2 This is a top view of a polishing or grinding disc according to the present invention.

[0015] In the picture: 1. Polishing or grinding the large disc body; 2. Annular protrusion. Detailed Implementation

[0016] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0017] Example 1

[0018] refer to Figures 1 to 2 A polishing or grinding disc includes: a polishing or grinding disc body 1, the top of which is raised.

[0019] Preferably, the raised part of the polished or ground disc body 1 is an annular raised part 2.

[0020] Preferably, the outer surface of the annular protrusion 2 is semi-circular.

[0021] Preferably, the outer ring diameter of the annular protrusion 2 is not greater than the diameter of the polishing or grinding disc body 1.

[0022] Preferably, the inner ring diameter of the annular protrusion 2 is not less than the diameter of the central hole of the polished or ground large disc body 1.

[0023] Preferably, the center of the annular protrusion 2 is concentric with the center of the polished or ground disc body 1.

[0024] In this embodiment, the height of the annular protrusion is 10 micrometers to 200 micrometers.

[0025] In this embodiment, the ratio of the highest point value of the annular protrusion to the difference between the outer and inner diameters of the annular protrusion is 1.5E. -5 ~2.6E -4 .

[0026] In specific implementation, the wafer preparation operation is as follows: S1, chamfer the wafer (or other items requiring flatness processing); S2, protect the back of the chamfered wafer by fixing it to the polishing or grinding head using an adhesive or absorbent pad; S3, the polishing or grinding head and the polishing or grinding disc work together to polish or grind the main surface of the wafer; S4, remove the wafer from the polishing or grinding head after polishing or grinding; S5, clean the wafer. Because the polishing or grinding disc in S3 has been optimized, the uneven distribution of the polishing or grinding fluid is reduced, the mechanical action at the wafer edges is decreased, the removal rate of each part of the wafer is more uniform, and the wafer flatness level is improved.

[0027] The above description is merely a preferred embodiment of this utility model and is not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model are included within the protection scope of this utility model.

Claims

1. A large polishing or grinding disc, characterized in that, include: The polishing or grinding disc body has a raised top.

2. A polishing or grinding platen according to claim 1, wherein The raised part of the polishing or grinding disc body is a ring-shaped raised part.

3. A polishing or grinding platen according to claim 2, wherein, The outer surface of the annular protrusion is semi-circular.

4. A polishing or grinding platen according to claim 3, wherein, The outer ring diameter of the annular protrusion is not greater than the diameter of the polishing or grinding disc body.

5. A polishing or grinding platen according to claim 4, wherein, The inner ring diameter of the annular protrusion is not less than the diameter of the central hole of the polishing or grinding disc body.

6. A polishing or grinding platen according to claim 5, wherein, The center of the annular protrusion is concentric with the center of the polishing or grinding disc body.

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