Semiconductor device and method for manufacturing semiconductor device

Abstract

To provide a semiconductor device having a structure capable of providing an optical path independent of resin body formation.SOLUTION: The optical device 11 includes a light emitting element 21, an optical window member 23 having an element surface 23b, a light receiving element 25 having a light receiving surface 25b, an optical component 13 having a light emitting surface 21b configured to emit light from the light emitting element 27 and a light incident surface 25b configured to receive light to the light receiving surface 23c, a support 15 having a main surface 15b on which the light emitting element 21 and the light receiving element 25 are mounted, and a resin component 17 provided on the main surface 15b of the support 15 so as to hold the optical component 13. The light-receiving devices 25 are provided on the supporting member 15 between the supporting member 15 and the optical window member 23, and each of the light-receiving devices 25 includes at least one photodetector. The light-receiving surface 25b of each of the light-receiving devices 25 receives light through the device surface 23b and the light incident surface 23c of the optical window member 23.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] FIELD The present disclosure relates to semiconductor devices and methods of making semiconductor devices. [Background technology]

[0002] Patent Document 1 discloses an optical device. The optical device includes an optical element and a sealing resin. The optical element has an optically functional area and is mounted on a support. The sealing resin seals the optical element so as to avoid the optically functional area. The sealing resin has a recess located above the optical element, and the optically functional area is exposed at the bottom of the recess. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2009-99680 Summary of the Invention [Problem to be solved by the invention]

[0004] The semiconductor device for an optical encoder includes a light source that provides light for encoding to an object, a light receiver that receives light from the object, a mounting member for mounting the light source and the light receiver, and a resin body. The light source and the light receiver of the semiconductor device are provided as, for example, a light-emitting semiconductor chip including a light-emitting diode and a light-receiving semiconductor chip including a photodiode, respectively. In the semiconductor device, the resin body has a shape that does not cover the light-emitting surface of the light-emitting semiconductor chip or the light-receiving surface of the photodiode chip. Such a resin body is manufactured using a mold.

[0005] In an exemplary fabrication method, a light-receiving semiconductor chip is mounted on a mounting member to form an intermediate product, and the intermediate product is placed in a molding die and subjected to resin molding before a light-emitting semiconductor chip is mounted on the mounting area of ​​the mounting member. The formed molding resin does not cover the light-receiving surface of the light-receiving semiconductor chip or the mounting area of ​​the mounting member. After resin molding, the light-emitting semiconductor chip is mounted on the mounting area of ​​the mounting member.

[0006] Forming a resin body that does not cover the mounting area of ​​the mounting member on which the light-emitting semiconductor chip is mounted and the light-receiving surface of the photodiode chip makes the internal shape of the molding die complex, which makes it impossible to simplify the shape of the resin body. The complex internal shape of the molding die creates the possibility of resin leaking onto, for example, the light-receiving surface of the photodiode chip during the formation of the resin body.

[0007] What is needed is a structure for semiconductor devices that provides an optical path that is unaffected by resin formation.

[0008] An object of the present disclosure is to provide a semiconductor device having a structure capable of providing an optical path independent of the formation of a resin body, and a method for manufacturing the semiconductor device. [Means for solving the problem]

[0009] A semiconductor device according to a first aspect of the present disclosure includes a light-emitting device including a semiconductor light-emitting element, an optical window member having a device surface, and a light-receiving device having a light-receiving surface, and also includes an optical component having a light-emitting surface configured to emit light from the semiconductor light-emitting element and a light-incident surface configured to receive light onto the light-receiving surface, a support having a main surface on which the light-emitting device and the light-receiving device are mounted, the light-receiving device being arranged on the support between the support and the optical window member, and a resin body arranged on the main surface of the support to hold the optical component, wherein the light-receiving device includes at least one light-receiving element, and the light-receiving element is configured to receive light through the device surface and the light-incident surface of the optical window member and the light-receiving surface of the light-receiving device.

[0010] A method for fabricating a semiconductor device according to a second aspect of the present disclosure is a method for fabricating a semiconductor device, comprising: preparing an optical assembly including a plurality of assembly parts, the assembly part including a support part having a main surface including a plurality of compartments; and a plurality of optical parts provided in each of the compartments of the support part, the optical parts having a light emitting device, a light receiving device, and an optical window member, the light emitting device including a semiconductor light emitting element, the light receiving device including at least one light receiving element, the optical parts having a light emitting surface configured to emit light from the semiconductor light emitting element and a light receiving surface configured to receive light to the light receiving element. The method includes preparing an optical assembly having a light incident surface and the optical window member having a device surface; preparing a molding die; providing a state in which the optical assembly is in a cavity of the molding die; and forming a resin assembly including the optical assembly and a resin mass using the molding die and molten resin injected into the molding die, the resin mass having at least one opening at the position of the optical window member and the light-emitting device in each of the compartments, and the light-receiving device is provided between the optical window member and the support part. [Effects of the Invention]

[0011] According to the above aspects, a semiconductor device having a structure capable of providing an optical path independent of the formation of the resin body, and a method for manufacturing the semiconductor device are provided. [Brief explanation of the drawings]

[0012] [Figure 1] FIG. 1 is a partially cutaway view showing a semiconductor device according to this embodiment. [Figure 2] FIG. 2 is a plan view showing an exemplary assembly of a semiconductor device according to this embodiment. [Figure 3] FIG. 3 is a perspective view showing an exemplary light emitting device of the semiconductor device according to this embodiment. [Figure 4]FIG. 4 is a diagram schematically illustrating an optical encoder device including an exemplary optical encoder and an exemplary scale of a semiconductor device according to this embodiment. [Figure 5] FIG. 5 is a diagram schematically showing intermediate products of the main steps of the method for fabricating a semiconductor device according to this embodiment. [Figure 6] FIG. 6 is a diagram schematically showing intermediate products of the main steps of the method for fabricating a semiconductor device according to this embodiment. [Figure 7] FIG. 7 is a diagram schematically showing intermediate products of the main steps of the method for fabricating a semiconductor device according to this embodiment. [Figure 8] FIG. 8 is a diagram schematically showing intermediate products of the main steps of the method for fabricating a semiconductor device according to this embodiment. [Figure 9] Parts (a), (b) and (c) of FIG. 9 are drawings showing an exemplary mold die. [Figure 10] FIG. 10 is a diagram schematically showing intermediate products of the main steps of the method for fabricating a semiconductor device according to this embodiment. [Figure 11] FIG. 11 is a diagram schematically showing intermediate products of the main steps of the method for fabricating a semiconductor device according to this embodiment. [Figure 12] Parts (a) and (b) of FIG. 12 are diagrams that schematically show an individual mold die and a general-purpose mold die, respectively. [Figure 13] Parts (a) and (b) of FIG. 13 are schematic diagrams showing intermediate products produced using an individual mold die and a general-purpose mold die, respectively. [Figure 14] FIG. 14 is a diagram showing the separation of an intermediate product produced using a general-purpose mold. [Figure 15] Parts (a) and (b) of FIG. 15 are drawings showing the front and back surfaces, respectively, of a semiconductor device fabricated using a general-purpose molding die. [Figure 16] FIG. 16 is a flowchart illustrating an exemplary manufacturing method according to this embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0013] Hereinafter, embodiments for carrying out the present disclosure will be described with reference to the drawings. Identical parts will be designated by the same reference numerals, and duplicated descriptions will be omitted.

[0014] Fig. 1 is a partially cutaway view showing a semiconductor device according to the present embodiment. Fig. 2 is a plan view showing an exemplary assembly of the semiconductor device according to the present embodiment. Fig. 3 is a perspective view showing an exemplary light-emitting device of the semiconductor device according to the present embodiment. Fig. 4 is a drawing schematically showing an optical encoder apparatus including an exemplary optical encoder and an exemplary scale of the semiconductor device according to the present embodiment.

[0015] 1 and 4, an optical encoder device 10 can include an optical encoder and an exemplary scale 12. In the present disclosure, the optical encoder is provided as, for example, a semiconductor device 11. The optical encoder and scale 12 are arranged such that the optical encoder irradiates the scale 12 with output light LOUT and receives reflected light LIN from the scale 12. The optical encoder also receives reflected light LIN from the scale 12 and generates an encoded electrical signal from the reflected light LIN. The following description will be given of the semiconductor device 11 that can provide the optical encoder.

[0016] 1 and 2, a semiconductor device 11 includes an optical component 13, a support 15, and a resin body 17. The optical component 13 and the support 15 can form an assembly 14.

[0017] The exemplary optical component 13 may include a light-emitting device 21, an optical window member 23, and a light-receiving device 25, and may have a light incident surface 23c that receives light to the light-receiving device 25 and a light exit surface 21b that emits light from the light-emitting device 21. The light-emitting device 21 may include a semiconductor light-emitting element 27, and light from the semiconductor light-emitting element 27 may be emitted through the light exit surface 21b of the optical component 13. The optical window member 23 may have a device surface 23b. The exemplary optical window member 23 may be provided with the light incident surface 23c of the optical component 13. The light-receiving device 25 may include at least one light-receiving element 29. The light-receiving device 25 may have a light-receiving surface 25b, and light to the light-receiving surface 25b may be irradiated onto the light incident surface 23c of the optical component 13. The light-receiving surface 25b is configured to receive light through the device surface 23b and the light incident surface 23c of the optical window member 23.

[0018] The light exit surface 21b of the optical component 13 can be configured to provide light from the light-emitting device 21. Specifically, the light exit surface 21b is configured to emit light from the semiconductor light-emitting element 27 to the outside, while the light entrance surface 23c of the optical component 13 can be configured to receive light from the outside. The received light enters the light-receiving device 25 via the device surface 23b and the light-receiving surface 25b of the optical window member 23.

[0019] The support 15 may have a main surface 15b, which is configured to mount the light-emitting device 21 and the light-receiving device 25. The support 15 may have a back surface 15c located opposite the main surface 15b.

[0020] The support 15, the optical window member 23, and the light-receiving device 25 can be arranged such that the light-receiving device 25 is provided between the support 15 and the optical window member 23. In an exemplary arrangement, the optical window member 23 and the light-receiving device 25 can be stacked to form a stack 33.

[0021] The resin body 17 can be provided on the main surface 15b of the support body 15 so as to support the optical component 13. Specifically, the resin body 17 can be provided so as to hold the light-emitting device 21, the optical window member 23, and the light-receiving device 25.

[0022] The resin body 17 is formed on the main surface 15b of the support 15 and is configured to support the light-receiving device 25 and the optical window member 23. Specifically, when the resin body 17 holds the light-receiving device 25 and the optical window member 23, the optical window member 23 and the light-receiving device 25 can be arranged so that light reaches the light-receiving surface 25b of the light-receiving device 25 through the light-incident surface 23c and the device surface 23b of the optical window member 23. Such an arrangement of the optical window member 23 and the light-receiving device 25 can provide the semiconductor device 11 with a structure that forms an optical path from the light-incident surface 23c of the optical window member 23 to the light-receiving surface 25b of the light-receiving device 25. This optical path excludes the resin body 17 of the semiconductor device 11.

[0023] The resin body 17 may include a material that does not transmit light from the light-emitting device 21. The resin body 17 may also include a material that does not transmit light input to the light-receiving device 25. An exemplary resin body 17 is not transparent to the light input to the light-receiving device 25 and the light from the light-emitting device 21, and may be colored, for example, black, so as not to transmit light from the light-emitting device 21. The resin body 17 may include, for example, carbon particles or Si filler.

[0024] The resin body 17 may have an upper surface 17b and a lower surface 17c located opposite the upper surface 17b. The exemplary upper surface 17b may extend along a reference plane REF that intersects with a direction from one side of the optical component 13 and the support 15 to the other side (for example, a direction of the reference axis Ax1).

[0025] The resin body 17 has at least one recess 17c extending from the upper surface 17b of the resin body 17 along a direction from one side of the optical component 13 to the other side of the support body 15. The optical component 13 is disposed in the at least one recess 17c. The optical component 13 can provide the semiconductor device 11 with a structure that can form optical paths from the semiconductor light emitting element 27 to the light emitting surface 21b, and from the light incident surface 23c of the optical window member 23 to the light receiving surface 25b of the light receiving device 25, in the recess 17c of the resin body 17.

[0026] The optical window member 23 may comprise a material that is transmissive to the light to be provided by the semiconductor light emitting element 27. The optical window member 23 may also comprise a material that is transmissive to the light to be received by the light receiving device 25.

[0027] An exemplary optical window member 23 can be made of a material that can withstand the temperature of resin molding, such as glass (for example, quartz glass) and transparent resin (for example, epoxy resin).

[0028] The optical window member 23 can be positioned relative to the light-receiving device 25 so as to cover at least a portion of the light-receiving region of the light-receiving element 29 of the light-receiving device 25. Alternatively, the optical window member 23 may be positioned relative to the light-receiving device 25 so as to cover the entire light-receiving region of the light-receiving element 29 of the light-receiving device 25. The light-receiving element 29 converts incident light from the light-receiving region into an electrical signal.

[0029] The semiconductor device 11 may further include a member 20 configured to fill the gap between the device surface 23b of the optical window member 23 and the light-receiving surface 25b of the light-receiving device 25. The member 20 may include, for example, a refractive index matching material. The member 20 may also have adhesive properties so that the optical window member 23 and the light-receiving device 25 can be positioned relative to each other.

[0030] The member 20 is configured to fill or fill the gap between the device surface 23b of the optical window member 23 and the light-receiving surface 25b of the light-receiving device 25, and fixes the optical window member 23 and the light-receiving device 25 to each other.

[0031] The member 20 may include a material that is transmissive to the light to be provided by the semiconductor light emitting element 27. The member 20 may also include a material that is transmissive to the light to be received by the light receiving device 25. An exemplary member 20 may be made of a material that can withstand the temperature at which the resin body 17 is molded, such as an epoxy resin or a silicone resin.

[0032] Exemplary support 15 can include a wiring board or a lead frame. The wiring board and lead frame can provide electrical conductors and external electrodes for interconnection to support 15. Referring to Figure 1, a wiring board is depicted as an exemplary support 15.

[0033] The assembly 14 will be described with reference to Figures 1 and 2. Part (a) of Figure 2 shows the arrangement of the light-emitting device 21, the optical window member 23, and the light-receiving device 25 on the main surface 15b of the support body 15. Part (b) of Figure 2 shows the back surface 15c of the support body 15. In part (a) of Figure 2, the reference axis Ax1 is drawn to intersect (for example, be perpendicular to) the main surface 15b of the support body 15.

[0034] An exemplary assembly 14 can include a wiring board as the support 15. Such a support 15 can have a body 15d (e.g., a conductive or insulating body) that provides support, a conductive layer 15f on an insulating main surface 15b, a conductive layer 15g (e.g., an external electrode) on an insulating back surface 15c, and a conductor 15h that penetrates a part or all of the body 15d to connect the respective conductive layers (15f, 15g).

[0035] As already described, the exemplary assembly 14 can include a lead frame as the support 15. Specifically, such a support 15 can have a body (e.g., a conductive body such as an island) that provides support, and multiple conductive layers, e.g., lead terminals, for interconnection.

[0036] The exemplary semiconductor device 11 may further include a processing circuit 28 configured to process the electrical signal from the light-receiving element 29. The exemplary light-receiving device may be provided with the processing circuit 28 in addition to the light-receiving element 29. The processing circuit 28 may generate an encoded signal indicating, for example, the position of the scale 12 from the electrical signal from the light-receiving element 29. If possible, the exemplary semiconductor device 11 may further include a drive circuit for driving the semiconductor light-emitting element 27.

[0037] In the exemplary semiconductor device 11, the light-emitting device 21 and the light-receiving device 25 may share at least one of a high-potential power supply terminal and a low-potential power supply terminal, or may not share the high-potential power supply terminal and the low-potential power supply terminal. The light-emitting device 21 and the light-receiving device 25 are not connected via a signal line that transmits a signal from one of the light-emitting device and the light-receiving device to the other.

[0038] The support 15 has areas (15j, 15k) on the main surface 15b where the light emitting device 21 and the light receiving device 25 are mounted, respectively.

[0039] The light-receiving device 25 may have electrodes 25c, such as pads, on the light-receiving surface 25b for electrical connection.

[0040] The exemplary light receiving device 25 and light receiving element 29 may include one or more photodiodes, and the exemplary semiconductor light emitting element 27 may include one or more light emitting diodes.

[0041] The light incident surface 23c of the optical window member 23, the device surface 23b of the optical window member 23, the light receiving surface 25b of the light receiving device 25, and the main surface 15b of the support body 15 are arranged in a direction intersecting the main surface 15b of the support body 15. The light receiving surface 25b of the light receiving device 25 is provided between the device surface 23b of the optical window member 23 and the main surface 15b of the support body 15.

[0042] The light incident surface 23c of the optical window member 23, the device surface 23b of the optical window member 23, the light receiving surface 25b of the light receiving device 25, and the main surface 15b of the support body 15 each extend along a respective reference plane that intersects with the reference axis Ax1.

[0043] 1, the light emitting device 21 may be provided with a light emitting surface 21b. Specifically, the light emitting device 21 may include a container 31 having the light emitting surface 21b, and the semiconductor light emitting element 27 may be provided inside the container 31.

[0044] Referring to FIG. 3, an exemplary enclosure 31 for light emitting device 21 is described.

[0045] 3(a), in the exemplary light-emitting device 21, the semiconductor light-emitting element 27 is mounted on a mounting member 31h such as a submount. The mounting member 31h is mounted on an electrode wiring layer 31f provided on an insulating support base 31b, and one electrode of the semiconductor light-emitting element 27 is connected to the wiring layer 31f via the mounting member 31h. The other electrode of the semiconductor light-emitting element 27 is connected to an electrode wiring layer 31g provided on the insulating support base 31b via a conductor such as a bonding wire.

[0046] 3(b), the semiconductor light emitting element 27, together with the mounting member 31h, the wiring layer 31f, and the wiring layer 31g, can be covered and sealed by a sealing resin body 31j. The sealing resin body 31j can include a material that transmits light from the light emitting device 21. The external electrodes (31c, 31d) of the container 31 are not covered by the sealing resin body 31j. The sealing resin body 31j can be shaped, for example, to provide the light emitting device 21 with a light emitting surface 21b. However, the present disclosure is not limited thereto.

[0047] 1 , in the exemplary semiconductor device 11, the light-receiving device 25 can be disposed on the main surface 15b of the support 15 so as to be spaced apart from the light-emitting device 21. A stack 33 of the light-receiving device 25 and the optical window member 23 can be disposed on the main surface 15b of the support 15 so as to be spaced apart from the light-emitting device 21.

[0048] The resin body 17 is provided so as to fill the space between the light-receiving device 25 and the container 31 of the light-emitting device 21. The resin body 17 can also be provided so as to fill the space between the optical window member 23 and the container 31 of the light-emitting device 21. The resin body 17 can hold the optical window member 23 and the light-emitting device 21 between the light-receiving device 25 and the light-emitting device 21.

[0049] In the combination of the resin body 17, the container 31, and the laminate 33, the laminate 33 can be spaced apart from the container 31. Specifically, when the resin body 17 is provided in the gap between the laminate 33 and the container 31, the resin body 17 can be configured to fill in the steps on the main surface 15b of the support 15 between the laminate 33 and the light-emitting device 21 and the main surface 15b.

[0050] The exemplary resin body 17 may have a first depression 17f and a second depression 17g as the at least one depression 17c. Each of the first depression 17f and the second depression 17g extends from the upper surface 17b of the resin body 17 along a direction from one of the optical component 13 and the support 15 to the other.

[0051] In the exemplary semiconductor device 11, the exemplary light emitting device 21 can be provided in the first recess 17f. Furthermore, the exemplary optical window member 23 can be provided in the second recess 17g. The resin body 17 extends along the side surfaces of the light emitting device 21, the optical window member 23, and the light receiving device 25, and is provided so as to surround the light emitting device 21, the optical window member 23, and the light receiving device 25.

[0052] The light exit surface 21b is located in the first recess 17f, and the light entrance surface 23c is located in the second recess 17g.

[0053] The optical window member 23 and the container 31 of the light-emitting device 21 are respectively disposed in the first depression 17f and the second depression 17g of the resin body 17. The resin body 17 having this structure makes it possible to arrange the light incident surface 23c of the optical window member 23 associated with the light receiving element 29 and the light exit surface 21b of the container 31 associated with the semiconductor light-emitting element 27 so that the height of the upper surface 17b of the resin body 17 is aligned with the height of the main surface 15b of the support 15.

[0054] The first recess 17f and the second recess 17g extend in a direction from the resin body 17 to the support body 15, with the exemplary first recess 17f reaching the main surface 15b of the support body 15 and the exemplary second recess 17g reaching the light receiving surface 25b of the light receiving device 25.

[0055] The light exit surface 21b is aligned with the upper surface 17b of the resin body 17 in the first depression 17f, and the light incident surface 23c is aligned with the upper surface 17b of the resin body 17 in the second depression 17g.

[0056] The resin body 17 may be provided with a resin portion disposed between the light-emitting device 21 and the light-receiving device 25 so as to define the first recess 17f and the second recess 17g. Such a resin portion ensures that the light-emitting device 21 is optically isolated from the optical window member 23 and the light-receiving device 25.

[0057] The resin body 17 is configured to support and cover the side surface of the optical window member 23, and also to support and cover the side surface of the light-receiving device 25. The resin body 17 is also configured to support and cover the side surface of the container 31 having the light exit surface 21b.

[0058] As already described, the resin body 17 is provided, on the upper surface 17b of the resin body 17, with a first recess 17f configured to accommodate the optical window member 23 and a second recess 17g configured to accommodate the container 31 of the light-emitting device 21. Specifically, in this resin body 17, the first recess 17f extends from the upper surface 17b of the resin body 17 to reach the light-receiving surface 25b of the light-receiving device 25, and the second recess 17g extends from the upper surface 17b of the resin body 17 to reach the main surface 15b of the support body 15.

[0059] As can be understood from the above description, the optical window member 23 is disposed on the light-receiving surface 25b of the light-receiving device 25, but is not disposed on the light-emitting device 21. However, the present disclosure is not limited thereto. In the exemplary semiconductor device 11, the optical window member 23 can be disposed in a single recess in the resin body 17 and cover the light-receiving surface 25b of the light-receiving device 25 and the light-emitting surface 21b of the light-emitting device 21. Such an optical window member 23 can include optical isolation so that light from the light-emitting device 21 does not interfere with the light-receiving device 25 through internal propagation in the optical window member 23. In this semiconductor device 11, the optical window member 23 can cover the top surfaces of the light-emitting device 21 and the light-receiving device 25.

[0060] In the semiconductor device 11 shown in FIG. 1, the light emitting surface 21b of the light emitting device 21 can be positioned in a direction intersecting the main surface 15b of the support 15 with reference to the main surface 15b.

[0061] The light incident surface 23c of the optical window member 23 can be positioned in a direction intersecting the main surface 15b of the support body 15 with reference to the main surface 15b.

[0062] The resin body 17 can be provided to fill the gap between the optical window member 23, the light receiving device 25 and the light emitting device 21 positioned on the main surface 15b of the support body 15, and to fill this gap.

[0063] In addition, in the semiconductor device 11 shown in FIG. 1, the light-emitting surface 21b of the light-emitting device 21 and the light-incident surface 23c of the optical window member 23 can be aligned in a direction intersecting the main surface 15b of the support 15, with the main surface 15b as a reference.

[0064] The alignment of the light exit surface 21b of the container 31 of the light-emitting device 21 with the light entrance surface 23c of the optical window member 23 enables the resin body 17 to be formed to fill the gap between the optical window member 23 and the light-receiving device 25 and the container 31 of the light-emitting device 21.

[0065] When the light exit surface 21b of the container 31 and the light incident surface 23c of the optical window member 23 are aligned, the resin body 17 is formed so as to fill the gaps between the optical window member 23 and the light-receiving device 25 and the container 31. The upper surface 17b of the resin body 17 is aligned with the light exit surface 21b of the container 31 and the light incident surface 23c of the optical window member 23 in a direction intersecting with the main surface 15b of the support 15, with the main surface 15b as a reference.

[0066] Specifically, the exemplary resin body 17 can be provided so as to be flush with the light exit surface 21b of the enclosure 31 of the light emitting device 21. The exemplary resin body 17 can be provided so as to be flush with the light incident surface 23c of the optical window member 23. The exemplary resin body 17 can be provided so as to be flush with the light exit surface 21b of the enclosure 31 of the light emitting device 21 and the light incident surface 23c of the optical window member 23.

[0067] The upper surface 17b of the resin body 17 is configured to be aligned with the light exit surface 21b of the container 31 of the light-emitting device 21 and the light entrance surface 23c of the optical window member 23 in a direction intersecting the main surface 15b of the support 15 based on the main surface 15b.

[0068] The light emitting surface 21b of the enclosure 31 of the light emitting device 21 can extend along a reference plane REF that intersects with the reference axis Ax1.

[0069] The light incident surface 23c of the optical window member 23 extends, for example, along the reference plane REF.

[0070] The light exit surface 21b of the container 31 and the light entrance surface 23c of the optical window member 23 extend, for example, along the reference plane REF.

[0071] The light exit surface 21b of the container 31, the surface of the resin body 17 between the container 31 and the optical window member 23, and the light entrance surface 23c of the optical window member 23 extend along, for example, the reference plane REF.

[0072] The surface of the resin body 17 between the container 31 of the light-emitting device 21 and the optical window member 23, and the light incident surface 23c of the optical window member 23, extend along, for example, the reference plane REF.

[0073] The surface of the resin body 17 between the container 31 of the light-emitting device 21 and the optical window member 23, and the light-emitting surface 21b of the container 31 of the light-emitting device 21 extend along the reference plane REF.

[0074] The light-emitting surface 21b of the enclosure 31 of the light-emitting device 21 and the light-incident surface 23c of the optical window member 23 extend along the reference plane REF.

[0075] The light receiving device 25 may include a semiconductor light receiving element, such as a photodiode, configured to provide a light receiving element 29 .

[0076] The distance between the device surface 23b and the light incident surface 23c of the optical window member 23 (referred to as the thickness T23 of the optical window member) can be specified so that the sum of the distance between the light receiving surface 25b of the light receiving device 25 and the main surface 15b of the support 15 (referred to as the thickness T25 of the light receiving device 25) and the thickness T23 of the optical window member is matched to the height of the light emitting device 21 above the support 15 (referred to as the height T21 of the light emitting device 21 or the container 31).

[0077] As an exemplary alignment, the optical window member 23 can be prepared so that the sum of the thickness T25 of the light receiving device 25 and the thickness T23 of the optical window member is equal to the distance T21 between the light emitting surface 21b of the container 31 of the light emitting device 21 and the main surface 15b of the support 15.

[0078] 5 to 14 are diagrams showing schematic intermediate products of the main steps of the method for fabricating a semiconductor device according to the present invention. The method 100 may include the following steps:

[0079] 5, 6, 7, and 8, the preparation of optical assembly 47 (see FIG. 8) will be described. The preparation of optical assembly 47 can include, for example, obtaining optical assembly 47 and fabricating optical assembly 47. In the following description, optical assembly 47 will be fabricated.

[0080] The method 100 includes step S101. Step S101 may include preparing a support part 41. The support part 41 has a plurality of compartments 43, as shown in Fig. 5. The compartments 43 of the support part 41 may be arranged in one or two dimensions, and exemplary compartments 43 may be arranged in two dimensions.

[0081] 5 includes two adjacent exemplary compartments 43 and ten other compartments 43 arranged surrounding the two adjacent compartments 43. The exemplary compartments 43 can be separated by separation regions 45 to form a two-dimensional array. The separation regions 45 can be provided at the boundaries between adjacent compartments 43 and at the ends of the array of compartments 43. The support part 41 has a device region including the compartments 43 and the separation regions 45.

[0082] The front surface of each compartment 43 is configured to provide an arrangement of electrodes (15f) as shown in part (a) of Fig. 2, a first area 15j for mounting a light-emitting device 21, and a second area 15k for mounting a light-receiving device 25. The back surface of the compartment 43 is provided to provide an arrangement of external electrodes (15g) as shown in part (b) of Fig. 2.

[0083] 6 , the optical component 13 may include a light-emitting device 21, an optical window member 23, and a light-receiving device 25. An exemplary step S102 may include preparing the light-emitting device 21, preparing a support member 41, and preparing the light-receiving device 25, and may further include preparing the optical window member 23.

[0084] Next, an intermediate product is produced in which the optical components 13 are placed in each of the compartments 43 of the support part 41 .

[0085] The method 100 includes step S103, in which the light-emitting device 21 and the light-receiving device 25 are respectively arranged in a first area (15j in FIG. 5) and a second area (15k in FIG. 5) of the compartment 43, as shown in FIG. 6. Exemplary mounting includes, for example, placing the container 31 of the light-emitting device 21 and the light-receiving device 25 in the respective areas of the support part 41, and fixing the container 31 of the light-emitting device 21 and the light-receiving device 25 to the respective areas of the support part 41.

[0086] 7, the method 100 includes step S104, in which the optical window member 23 is mounted on the light-receiving surface 25b of the light-receiving device 25. An exemplary mounting includes, for example, placing the optical window member 23 on the light-receiving surface 25b of the light-receiving device 25 and fixing the optical window member 23 to the light-receiving surface 25b of the light-receiving device 25.

[0087] Alternatively, if possible, the stack 33 of the optical window member 23 and the light-receiving device 25 may be formed, and the stack 33 may be disposed in the second area (15k in FIG. 5) of the section 43.

[0088] The method 100 includes step S105, in which, after the optical component 13 is mounted, the electrodes of the light-emitting device 21 and the light-receiving device 25 are electrically connected to the electrodes of the sections 43 of the support component 41 using electrical conductors 30 such as bonding wires, as shown in FIG.

[0089] These steps complete the optical assembly 47.

[0090] Parts (a), (b) and (c) of FIG. 9 are drawings showing an exemplary mold die.

[0091] The method 100 includes step S106. As shown in part (a) of FIG. 9, step S106 may include preparing a mold die 49. An exemplary mold die 49 may be a general-purpose mold die. The mold die 49 includes an upper mold die 49b and a lower mold die 49c. The upper mold die 49b provides a ceiling surface 49f of the mold die 49, and the lower mold die 49c provides a bottom surface 49g of the mold die 49. The mold die 49 forms a cavity CAV between the ceiling surface 49f and the bottom surface 49g. For example, a release film 50 is provided on the ceiling surface 49f of the mold die 49. The release film 50 can facilitate demolding.

[0092] The method 100 includes step S107, which includes providing a state in which the optical assembly 47 is in the cavity CAV of the mold die 49 after electrical connection, as shown in part (b) of FIG.

[0093] The minimum distance between the exemplary top surface 49f and bottom surface 49g of the mold die 49 arranged to provide the cavity CAV can be adjusted to the sum of the thickness of the support part 41 and the height of the container 31 of the light-emitting device 21 above the support part 41. The minimum distance can also be adjusted to the thickness of the support part 41 and the sum of the thickness of the light-receiving device 25 and the thickness of the optical window member 23 above the support part 41.

[0094] Fig. 10 is a diagram showing a mold die 49 and an optical assembly 47 disposed in a cavity CAV of the mold die 49. Referring to part (b) of Fig. 9 and Fig. 10, the optical assembly 47 is placed on a lower die 49c to provide a state in which it is in the cavity CAV. In Fig. 10, an upper die 49b is not depicted.

[0095] The compartments 43 of the optical assembly 47 can be arranged one-dimensionally or two-dimensionally, and the exemplary compartments 43 can be arranged two-dimensionally. Also, the size of the top surface 49f and the bottom surface 49g of the mold die 49 can be set to be equal to or larger than the size of the optical assembly 47.

[0096] The method 100 includes step S108. In step S108, a resin assembly 51 is formed as shown in part (c) of Fig. 9. Specifically, the resin assembly 51 including the optical assembly 47 and the resin mass 18 is formed using a mold die 49 and molten resin injected into the mold die 49.

[0097] Fig. 11 is a diagram showing a molding die 49, and an optical assembly 47 and a resin mass 18 disposed in a cavity CAV of the molding die 49. Referring to Fig. 11, the optical assembly 47 is covered with the resin mass 18 to provide a resin assembly 51 in the cavity CAV. An upper die 49b is not depicted in Fig. 11.

[0098] 9(c) and 11, the resin lump 18 has at least one opening 18b (for example, two openings) at the position of the light incident surface 23c of the optical window member 23 and the position of the light exit surface 21b of the container 31 of the light emitting device 21. At the opening 18b of the resin lump 18, the light incident surface 23c of the optical window member 23 and the light exit surface 21b of the light emitting device 21 are not covered by the resin lump 18.

[0099] The optical assembly 47 mounts the optical window member 23, the light-receiving device 25, and the container 31 of the light-emitting device 21 in each of the compartments 43 so that light reaches the light-receiving surface 25b of the light-receiving device 25 through the device surface 23b and the light incident surface 23c of the optical window member 23. The optical assembly 47 can also mount the resin mass 18 in each of the compartments 43 and the separation region 45.

[0100] As can be understood from the above description, the optical assembly 47 is placed in the cavity CAV of the mold die 49, and the mold die 49 and molten resin injected into the mold die 49 can be used to form the resin assembly 51.

[0101] The shape of the cavity of the mold die 49 and the arrangement of the optical assembly 47 within the cavity are configured so that the resin mass 18 of the resin assembly 51 has at least one opening 18b in each of the compartments 43 at the position of the optical window member 23 and the position of the light emitting device 21. The light incident surface 23c of the optical window member 23 and the light exit surface 21b of the light emitting device 21 appear in the openings 18b of the resin mass 18.

[0102] The arrangement of the optical window member 23 and the light-receiving device 25 of the optical assembly 47 enables an optical path to be formed from the light incident surface 23c of the optical window member 23 to the light receiving surface 25b of the light-receiving device 25 in each compartment 43. This formation provides the semiconductor device 11 with a structure that can reduce the production of unwanted resin that may occur when forming the resin body 17 of the semiconductor device 11. In addition, the resin body 17 enables the container 31 of the light-emitting device 21 to form an optical path from the semiconductor light-emitting element 27 to the light emitting surface 21b.

[0103] In each of the compartments 43 of the support part 41 , the enclosure 31 of the light-emitting device 21 can be spaced apart from the optical window member 23 and the light-receiving device 25 .

[0104] Parts (a) and (b) of FIG. 12 are diagrams that schematically show an individual mold die and a general-purpose mold die, respectively.

[0105] 12(a) includes an upper mold part 48b and a lower mold part 48c, which are configured to provide the individual mold part 48 with cavities designed specifically for the structure of the optical encoder to be fabricated. The cavities of the exemplary individual mold part 48 are shaped to provide openings (e.g., two openings) at the position of the light-receiving surface 25b of the light-receiving device 25 and the position of the light-emitting device 21, respectively.

[0106] The upper die 48b of the individual molding die 48 has an inner structure that prevents the resin mass 18 from covering the light-receiving device 25 (e.g., the light-receiving surface of a photodiode chip) and the arrangement area of ​​the light-emitting device (e.g., the mounting area for mounting a bare light-emitting diode chip). Such an inner structure makes the internal shape of the molding die complex.

[0107] A complex internal shape increases the possibility of resin leaking onto the light-receiving surface of a photodiode chip during resin molding, and increasing the clamping force of the molding die to reduce resin leakage can increase the possibility of cracks forming in the semiconductor chip.

[0108] Furthermore, preparing a molding die for each semiconductor device for an optical encoder complicates manufacturing management. What is needed is a method for reducing undesirable problems that may occur during resin molding.

[0109] 12(b) is configured to provide a cavity designed to match the height of the optical encoder to be manufactured in the mold die 49. Also, a ceiling surface 49f of the upper mold die 49b and a bottom surface 49g of the lower mold die 49c can have an area capable of receiving the support part 41.

[0110] The exemplary mold die 49 is different from the mold die 48. Specifically, the mold die 49 does not have a cavity shape that defines an opening at the position of the light-receiving surface 25b of the light-receiving device 25 to provide an atmospheric light path to the light-receiving surface 25b and an opening that provides a placement area where the light-emitting device 21 is to be mounted.

[0111] Specifically, the minimum distance between the ceiling surface 49f of the upper mold 49b and the bottom surface 49g of the lower mold 49c, which are arranged to form the cavity CAV, can be adjusted to the sum of the thicknesses of the support part 41, the light-receiving device 25, and the optical window member 23. Here, the thickness of the release material such as the release film 50 is excluded from this calculation because it is thin.

[0112] The ceiling surface 49f of the upper mold 49b can be substantially flat in the top area facing the device region of the optical assembly 47, and the bottom surface 49g of the lower mold 49c can be substantially flat in the bottom area facing the device region of the optical assembly 47.

[0113] The ceiling surface 49f of the upper mold 49b and the bottom surface 49g of the lower mold 49c can have an area equal to or larger than the area of ​​the device region of the optical assembly 47.

[0114] Parts (a) and (b) of Figure 13 are diagrams that schematically show intermediate products removed from an individual mold die and a universal mold die, respectively. Part (a) of Figure 13 shows an intermediate product 52, which is produced using an individual mold die 48. Part (b) of Figure 13 shows an intermediate product 53, which is produced using a universal mold die 49.

[0115] In parts (a) and (b) of Fig. 13, arrows DV indicate the positions of separation of intermediate products 52 and 53. Fig. 14 is a diagram showing separation of intermediate products produced using a general-purpose mold.

[0116] Returning to the description of method 100, method 100 includes step S109. Step S109 may comprise separating the resin assembly 51 to create the semiconductor devices 11. Separation of the resin assembly 51 may be performed, for example, by dicing. As shown in FIG. 14 , dicing removes separation regions 45 of the support part 41 to form individual semiconductor devices 11 separated by spaces SEP.

[0117] Parts (a) and (b) of Fig. 15 are drawings showing the front and back surfaces, respectively, of a semiconductor device fabricated using a general-purpose mold. As shown in Fig. 14 and parts (a) and (b) of Fig. 15, the method 100 can fabricate the semiconductor device 11 shown in Fig. 1.

[0118] FIG. 16 shows a flow chart illustrating an exemplary manufacturing method according to this embodiment.

[0119] 16 , method 200 is shown. Exemplary method 200 can include steps S201 and S202. Step S201 includes performing method 100 to fabricate semiconductor device 11 from optical assembly 47. Step S202 includes performing a process equivalent to method 100 to fabricate a semiconductor device different from semiconductor device 11 from a second optical assembly different from optical assembly 47. Steps S201 and S202 use a mold die 49.

[0120] The assembly parts of the second optical assembly may include a support part, for example a support part having a plurality of compartments, such as support part 41, and a plurality of optical components, for example optical component 13, provided in each of the compartments of the support part of the second optical assembly.

[0121] The difference between the optical assembly 47 and the second optical assembly can include any difference that does not prevent the use of the mold die 49 .

[0122] Exemplary differences can include differences in the geometric shapes, such as the size and thickness, of the support member 41 and the optical component 13. Also, exemplary differences can include differences in the geometric shapes, such as the size and thickness, of the light-emitting device 21, the optical window member 23, and the light-receiving device 25 of the optical component 13, as well as differences in the optical properties of the optical component 13. Furthermore, exemplary differences can include differences in the design or design philosophy between the optical assembly 47 and the second optical assembly.

[0123] At least one of these exemplary differences distinguishes the second optical assembly from the optical assembly 47. The common design principle between the optical assembly 47 and the second optical assembly is the use of a mold die 49.

[0124] Accordingly, in step S202, the second optical assembly can be placed in a cavity of the mold die 49. The mold die 49 can also be employed to fabricate a second resin assembly from the second optical assembly using molten resin injected into the mold die 49.

[0125] As can be seen from the shape of the resin mass 18 of the optical assembly 47, the resin mass of the second resin assembly (corresponding to the resin mass 18 of the optical assembly 47) can also have at least one opening (e.g., multiple openings and recesses) at the position of the light incident surface of the optical window member (corresponding to the light incident surface 23c) and at the position of the light exit surface of the container of the light-emitting device (corresponding to the light exit surface 21b).

[0126] The second resin assembly thus produced can be separated in step S109 of method 100, which is performed in step S202, to produce a semiconductor device different from semiconductor device 11. In this semiconductor device, too, the light incident surface of the optical window member (corresponding to light incident surface 23c) and the light exit surface of the container for the light-emitting device (corresponding to light exit surface 21b) are located in the recesses of the resin body.

[0127] According to the above embodiment, a semiconductor device 11 having a structure capable of providing an optical path independent of resin body formation, and methods 100 and 200 for fabricating the semiconductor device are provided.

[0128] This embodiment can have various aspects as shown below.

[0129] The semiconductor device according to a first aspect of this embodiment includes a light-emitting device including a semiconductor light-emitting element, an optical window member having a device surface, and a light-receiving device having a light-receiving surface, and also includes an optical component having a light-emitting surface configured to emit light from the semiconductor light-emitting element and a light-incident surface configured to receive light onto the light-receiving surface, a support having a main surface on which the light-emitting device and the light-receiving device are mounted, the light-receiving device being arranged on the support between the support and the optical window member, and a resin body arranged on the main surface of the support to hold the optical component, and the light-receiving device includes at least one light-receiving element, and the light-receiving element is configured to receive light through the device surface and the light-incident surface of the optical window member and the light-receiving surface of the light-receiving device.

[0130] In the semiconductor device of the second aspect according to the first aspect of this embodiment, the light emitting device is provided with the light emitting surface, the light emitting device includes a container having the light emitting surface, the semiconductor light emitting element is provided within the container, the light receiving device and the optical window member are spaced apart from the light emitting device on the main surface of the support, and the resin body can be provided to fill the gap between the optical window member and the light emitting device.

[0131] In a semiconductor device of a third aspect according to the first or second aspect of this embodiment, the light receiving device and the optical window member are stacked to form a laminate, the resin body has a first recess and a second recess extending from the upper surface of the resin body along a direction from one of the support and the optical component to the other of the support and the optical component, the optical window member being provided in the first recess, and the light emitting device being provided in the second recess.

[0132] In a semiconductor device according to a fourth aspect in accordance with the second or third aspect of this embodiment, the light incident surface of the optical window member may be positioned on the main surface of the support in a direction intersecting the main surface of the support with the main surface of the support as a reference, and the light exit surface of the light-emitting device may be positioned on the main surface of the support in a direction intersecting the main surface with the main surface of the support as a reference.

[0133] In a semiconductor device having a fifth side according to any one of the second to fourth sides of this embodiment, the upper surface of the resin body can extend along a reference plane that intersects with the direction from the light-emitting device to the support, the light-emitting device can extend along the reference plane, and the light-incident surface of the optical window member can extend along the reference plane.

[0134] In a semiconductor device according to a sixth aspect of any one of the first to fifth aspects of this embodiment, the optical window member may comprise a material that is transmissive to light to be provided by the semiconductor light-emitting element.

[0135] In a semiconductor device having a seventh side according to any one of the first to sixth sides of this embodiment, the optical window member can be positioned relative to the light receiving device so as to cover at least a portion of the light receiving area of ​​the light receiving element of the light receiving device.

[0136] The semiconductor device of an eighth aspect according to any one of the first to seventh aspects of the present embodiment may further include a processing circuit configured to process an electrical signal from the light receiving element.

[0137] In a ninth aspect of the semiconductor device according to any one of the first to eighth aspects of this embodiment, the support may include a wiring substrate or a lead frame, and the support may include a conductor and an external electrode for interconnection.

[0138] A method for fabricating a semiconductor device according to a tenth aspect of this embodiment includes preparing an optical assembly including a plurality of assembly parts, the assembly parts including a support part having a main surface including a plurality of compartments, and a plurality of optical parts provided in each of the compartments of the support part, the optical parts having a light emitting device, a light receiving device, and an optical window member, the light emitting device including a semiconductor light emitting element, the light receiving device including at least one light receiving element, the optical parts having a light emitting surface configured to emit light from the semiconductor light emitting element and a light incident surface configured to receive light to the light receiving element, The optical window member can be provided by preparing an optical assembly having a device surface, preparing a molding die, providing a state in which the optical assembly is in a cavity of the molding die, and forming a resin assembly including the optical assembly and a resin mass using the molding die and molten resin injected into the molding die, wherein the resin mass has at least one opening at the position of the optical window member and the light-emitting device in each of the compartments, and the light-receiving device can be provided between the optical window member and the support part.

[0139] The method for producing a semiconductor device of an eleventh aspect according to a tenth aspect of this embodiment can further include separating the resin assembly to produce a semiconductor device.

[0140] In a method for fabricating a semiconductor device of the twelfth aspect according to the tenth or eleventh aspect of this embodiment, the molding die includes an upper die and a lower die configured to define the cavity of the molding die, and when the upper die and the lower die of the molding die are arranged to provide the cavity, the minimum distance between the ceiling surface of the upper die and the bottom surface of the lower die can be adjusted to the sum of the thickness of the support part, the thickness of the light-receiving device, and the thickness of the optical window member.

[0141] In a method for fabricating a semiconductor device of a thirteenth aspect according to the tenth, eleventh or twelfth aspect of this embodiment, the molding die includes an upper die and a lower die configured to define the cavity of the molding die, the light-emitting device comprises a container that accommodates the semiconductor light-emitting element, and when the upper die and the lower die of the molding die are arranged to provide the cavity, the minimum distance between the ceiling surface of the upper die and the bottom surface of the lower die can be matched to the sum of the thickness of the support part and the height of the container of the light-emitting device above the support part.

[0142] In a method for fabricating a semiconductor device according to a fourteenth aspect of the present embodiment, the compartments of the optical assembly are arranged one-dimensionally or two-dimensionally, the optical assembly includes separation regions provided at boundaries between adjacent compartments and at edges of the arrangement of the compartments, the optical assembly has a device region including the compartments and the separation regions, and the ceiling surface of the upper die is substantially flat in a top area facing the device region, The bottom surface of the lower mold may be substantially flat in a bottom area facing the device region.

[0143] In the method for fabricating a semiconductor device of the fifteenth aspect according to the thirteenth or fourteenth aspect of this embodiment, the container can be provided with the light emitting surface.

[0144] The present disclosure is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit and scope of the present disclosure, all of which are included in the technical concept of the present disclosure. [Explanation of symbols]

[0145] 10. Optical encoder device, 11. Semiconductor device, 12... scale, 13. Optical components, 14...assembly, 15...Support, 15b...principal surface, 15c...back side, 15d···body, 15f, 15g...conductive layer, 15h...conductor, 17···Resin body, 17b...Top surface, 17c...bottom surface, 18...resin mass, 20... components, 21... Light-emitting devices, 21b...Light exit surface, 23 Optical window member, 23b...Device surface, 23c...Light incidence surface, 25···Light receiving device, 25b... Light receiving surface, 27. Semiconductor light-emitting element, 28... Processing circuit, 29....Photodetector, 30... Electrical conductor (e.g., bonding wire), 31...container, 31b···Support base, 31f, 31g...wiring layer, 31h... Mounting material, 31j...Sealing resin body, 33... Laminate, 41... Support part, 43···plot, 45...separation area, 47 Optical Assembly 48... Individual mold, 48b...Top mold, 48c...Lower mold, 49···Molding die (general-purpose molding die), 49b···Upper mold, 49c...lower mold, 49th floor: ceiling surface, 49g... bottom, 50 release film, 51···Resin assembly, 52 Intermediate products, 53 Intermediate products, 100, 200... ways, CAV...cavity, DV··· arrow (cutting position), LIN...Reflected light, LOUT: Light output, Ax1: Reference axis REF...Reference plane.

Claims

1. an optical component including a light-emitting device including a semiconductor light-emitting element, an optical window member having a device surface, and a light-receiving device having a light-receiving surface, the optical component having a light-emitting surface configured to emit light from the semiconductor light-emitting element and a light-incident surface configured to receive light onto the light-receiving surface; a support having a main surface on which the light-emitting device and the light-receiving device are mounted, the light-receiving device being disposed on the support between the support and the optical window member; a resin body provided on the main surface of the support body so as to hold the optical component; Equipped with the light-receiving device includes at least one light-receiving element; the light receiving element is configured to receive light through the device surface and the light incident surface of the optical window member and the light receiving surface of the light receiving device. Semiconductor device.

2. the light-emitting device is provided with the light-emitting surface, the light-emitting device includes a container having the light-emitting surface, the semiconductor light-emitting element is provided within the container, the light-receiving device and the optical window member are spaced apart from the light-emitting device on the major surface of the support; the resin body is provided so as to fill a gap between the optical window member and the light-emitting device.

2. The semiconductor device according to claim 1.

3. the light-receiving device and the optical window member are stacked to form a stacked body; the resin body has a first depression and a second depression extending from an upper surface of the resin body along a direction from one of the support body and the optical component to the other of the support body and the optical component; the optical window member is provided in the first recess, the light emitting device is provided in the second recess; 2. The semiconductor device according to claim 1.

4. the light incident surface of the optical window member is positioned on the main surface of the support in a direction intersecting the main surface of the support with respect to the main surface of the support; the light emitting surface of the light emitting device is positioned on the main surface of the support in a direction intersecting the main surface with respect to the main surface of the support; 3. The semiconductor device according to claim 2.

5. an upper surface of the resin body extends along a reference plane intersecting a direction from the light-emitting device to the support; the light emitting surface of the light emitting device extends along the reference plane; the light incident surface of the optical window member extends along the reference plane; 3. The semiconductor device according to claim 2.

6. the optical window member comprises a material that can transmit light to be provided by the semiconductor light emitting element; 2. The semiconductor device according to claim 1.

7. the optical window member is positioned relative to the light-receiving device so as to cover at least a portion of a light-receiving area of ​​the light-receiving element of the light-receiving device; 2. The semiconductor device according to claim 1.

8. further comprising a processing circuit configured to process the electrical signal from the light receiving element; 2. The semiconductor device according to claim 1.

9. the support includes a wiring substrate or a lead frame; The support includes a conductor and an external electrode for interconnection.

2. The semiconductor device according to claim 1.

10. 1. A method of fabricating a semiconductor device, comprising: preparing an optical assembly including a plurality of assembly parts, the assembly part including a support part having a main surface including a plurality of compartments, and a plurality of optical parts provided in each of the compartments of the support part, the optical parts having a light emitting device, a light receiving device, and an optical window member, the light emitting device including a semiconductor light emitting element, the light receiving device including at least one light receiving element, the optical parts having a light exit surface configured to emit light from the semiconductor light emitting element and a light entrance surface configured to receive light to the light receiving element, the optical window member having a device surface; providing a mold tool; providing the optical assembly in a cavity of the mold; forming a resin assembly including the optical assembly and a resin mass using the molding die and molten resin injected into the molding die, the resin mass having at least one opening at the positions of the optical window member and the light emitting device in each of the compartments; Equipped with the light-receiving device is disposed between the optical window member and the support part; A method for fabricating a semiconductor device.

11. and further comprising separating the resin assembly to produce a semiconductor device. A method for fabricating a semiconductor device according to claim 10.

12. the mold includes an upper mold and a lower mold configured to define the cavity of the mold; when the upper and lower dies of the molding die are arranged to provide the cavity, a minimum distance between a ceiling surface of the upper die and a bottom surface of the lower die is adjusted to a sum of a thickness of the support part, a thickness of the light-receiving device, and a thickness of the optical window member. A method for fabricating a semiconductor device according to claim 10.

13. the mold includes an upper mold and a lower mold configured to define the cavity of the mold; the light-emitting device includes a container that houses the semiconductor light-emitting element; when the upper and lower dies of the molding die are arranged to provide the cavity, a minimum distance between a ceiling surface of the upper die and a bottom surface of the lower die is set to a sum of a thickness of the support part and a height of the container of the light-emitting device above the support part; A method for fabricating a semiconductor device according to claim 10.

14. The sections of the optical assembly are arranged in one or two dimensions; the optical assembly includes separation regions provided at boundaries between adjacent compartments and at edges of an array of compartments; the optical assembly has a device region including the compartment and the separation region; the ceiling surface of the upper die is substantially flat in a top area facing the device region; the bottom surface of the lower mold is substantially flat in a bottom area facing the device region; A method for fabricating a semiconductor device according to claim 13.

15. The container is provided with the light exit surface. A method for fabricating a semiconductor device according to claim 13.

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