Electronic device

Abstract

To improve the heat dissipation of an electronic apparatus and to make it thinner.SOLUTION: The electronic device includes a housing, a battery case accommodated in the housing and having a first outer surface provided with a first recess, a battery accommodated in the battery case, a heat generating component accommodated in the housing and generating heat, and a first heat pipe thermally connected to the heat generating component and accommodated in the first recess.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present invention relates to an electronic device. [Background technology]

[0002] 2. Description of the Related Art Conventionally, electronic devices have been known that include a housing, a battery case housed in the housing, a battery housed in the battery case, and a heat-generating component housed in the housing. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-135851 Summary of the Invention [Problem to be solved by the invention]

[0004] For this type of electronic device, it would be beneficial if the heat dissipation performance of the electronic device could be improved and the device could be made thinner.

[0005] Therefore, one of the objects of the present invention is to improve the heat dissipation performance of electronic devices and to reduce their thickness. [Means for solving the problem]

[0006] An electronic device according to a first aspect of the present invention comprises a housing, a battery case having a first outer surface with a first recess and housed in the housing, a battery housed in the battery case, a heat-generating component housed in the housing, and a first heat pipe thermally connected to the heat-generating component and placed in the first recess.

[0007] The electronic device includes, for example, a plurality of the batteries, and the first recess is provided between two adjacent batteries.

[0008] In the electronic device, for example, the first heat pipe has a first portion located outside the first recess and thermally connected to the heat-generating component, and a second portion connected to the first portion and placed in the first recess.

[0009] In the electronic device, for example, the first outer surface is provided with a plurality of the first recesses, and the first heat pipe has a plurality of the second portions inserted into the plurality of the first recesses.

[0010] In the electronic device, for example, the first outer surface is provided with two first recesses, and the first heat pipe has two second portions inserted into the two first recesses and is formed endless.

[0011] The electronic device comprises, for example, a plurality of the first heat pipes and a second heat pipe that thermally connects the first portions of the plurality of first heat pipes and thermally connects the heat-generating component to the first portions, and the first outer surface is provided with a plurality of the first recesses, and the first heat pipe has the second portion inserted into the first recess and is formed endless.

[0012] The electronic device, for example, includes a fixed part fixed to the housing by a fastener, the battery case has a second outer surface opposite the first outer surface, and the second outer surface has a second recess into which the fastener is placed.

[0013] The electronic device includes, for example, a fixture that is placed in the first recess and fixes the battery case to the housing. [Effects of the Invention]

[0014] According to the above aspects of the present invention, it is possible to improve the heat dissipation performance of an electronic device and to reduce its thickness. [Brief explanation of the drawings]

[0015] [Figure 1] FIG. 1 is an exemplary perspective view of an electronic device according to a first embodiment, seen from the front side, with a display unit positioned at an unfolded position. [Figure 2] FIG. 2 is an exemplary bottom view of the base unit of the electronic device of the first embodiment, with the lower cover removed. [Figure 3] FIG. 3 is an exemplary bottom view of the base unit of the electronic device of the first embodiment, with the lower cover and the first heat pipe removed. [Figure 4] FIG. 4 is an exemplary perspective view of the battery pack in the electronic device of the first embodiment. [Figure 5] FIG. 5 is an exemplary front view of the battery pack in the electronic device of the first embodiment. [Figure 6] FIG. 6 is an exemplary cross-sectional view of the base portion of the electronic device according to the first embodiment. [Figure 7] FIG. 7 is an exemplary cross-sectional view of the base portion of the electronic device according to the first embodiment. [Figure 8] FIG. 8 is an exemplary bottom view of the base unit of the electronic device according to the second embodiment, with the lower cover removed. [Figure 9] FIG. 9 is an exemplary bottom view of the base unit of the electronic device according to the third embodiment, with the lower cover removed. [Figure 10] FIG. 10 is an exemplary bottom view of the base unit of the electronic device according to the fourth embodiment, with the lower cover removed. [Figure 11] FIG. 11 is an exemplary bottom view of the base unit of the electronic device according to the fifth embodiment, with the lower cover removed. DETAILED DESCRIPTION OF THE INVENTION

[0016] Exemplary embodiments of the present invention are disclosed below. The configurations of the embodiments described below, as well as the actions and effects brought about by the configurations, are merely examples. The present invention can also be realized by configurations other than those disclosed in the following embodiments. Furthermore, according to the present invention, it is possible to obtain at least one of the various effects (including derivative effects) obtained by the configurations.

[0017] Furthermore, the following embodiments include similar components, which are given the same reference numerals and will not be described again.

[0018] First Embodiment FIG. 1 is an exemplary perspective view of an electronic device 1 according to a first embodiment, seen from the front side, with a display unit 4 positioned in an unfolded position.

[0019] As shown in Fig. 1, electronic device 1 is configured as, for example, a notebook (clamshell) personal computer and includes a base unit 2 and a display unit 4. Base unit 2 is placed on a flat surface of a placement unit such as a desk, stand, or shelf. Display unit 4 is supported by base unit 2 so as to be rotatable about a rotation center axis C relative to base unit 2, and is movable between an unfolded position (Fig. 1) and a closed position (not shown). Specifically, display unit 4 is connected to base unit 2 via a hinge 5.

[0020] As shown in each drawing, for convenience, the X-axis, Y-axis, and Z-axis are defined in this specification. The X-axis, Y-axis, and Z-axis are perpendicular to each other. The X-axis extends along the front-rear direction of the base portion 2. The Y-axis extends along the width direction of the base portion 2. The Z-axis extends along the up-down direction of the base portion 2.

[0021] Furthermore, in this specification, the X direction, Y direction, and Z direction are defined. The X direction is a direction along the X axis and includes the +X direction indicated by the X axis arrow and the -X direction opposite to the X axis arrow. The Y direction is a direction along the Y axis and includes the +Y direction indicated by the Y axis arrow and the -Y direction opposite to the Y axis arrow. The Z direction is a direction along the Z axis and includes the +Z direction indicated by the Z axis arrow and the -Z direction opposite to the Z axis arrow. The +Z direction coincides with the upward direction in the vertical direction of the base portion 2.

[0022] The base unit 2 has a first housing 11, a keyboard 12 supported by the first housing 11, and a touchpad 35 supported by the first housing 11. The keyboard 12 is supported by the first housing 11 so as to be operable from above. The touchpad 35 is fixed to the first housing 11 with screws 36 (FIG. 6) so as to be operable from above. The first housing 11 is an example of a housing. The touchpad 35 is an example of a fixing member. The screws 36 are an example of a fixing tool. The touchpad 35 is also called a pad module or a click pad.

[0023] Fig. 2 is an exemplary bottom view of the base unit 2 in the electronic device 1 of the first embodiment, with the lower cover 13 removed. Fig. 3 is an exemplary bottom view of the base unit 2 in the electronic device 1 of the first embodiment, with the lower cover 13 and the first heat pipe 52 removed.

[0024] As shown in FIGS. 2 and 3, the first housing 11 accommodates a substrate 3, a battery pack 41, and a heat dissipation unit 51. Various electronic components are mounted on the substrate 3. The various electronic components include, for example, a CPU 33 (Central Processing Unit), a ROM (Read Only Memory), and a RAM (Random Access Memory). At least a portion of the electronic circuit of the electronic device 1 is configured by the wiring provided on the substrate 3 and the multiple electronic components, including the CPU 33, mounted on the substrate 3. The CPU 33 is mounted on the upper surface of the substrate 3. The CPU 33 operates using supplied power and generates heat during operation.

[0025] 1, the display section 4 has a second housing 21 and a display unit 22. The display unit 22 is supported by the second housing 21 so that a display screen 22a is visible from the front.

[0026] When the display unit 4 is in the unfolded position (FIG. 1), the top surface 11a and keyboard 12 of the first housing 11 do not face the front surface 21a of the second housing 21 and the display screen 22a of the display unit 22, and the top surface 11a of the first housing 11, the keyboard 12, the front surface 21a of the second housing 21, and the display screen 22a of the display unit 22 are exposed. At this time, the front surface 21a and the rear surface 21b of the second housing 21 face forward and backward, respectively.

[0027] On the other hand, when the display unit 4 is in the closed position (not shown), the top surface 11a and keyboard 12 of the first housing 11 face the front surface 21a of the second housing 21 and the display screen 22a of the display unit 22.

[0028] The first housing 11 has a generally rectangular parallelepiped shape that is flat in the vertical direction. The first housing 11 has a plurality of walls, such as a bottom wall 11c, a top wall 11d, a front wall 11e, a rear wall 11f, a left wall 11g, and a right wall 11h.

[0029] The lower wall 11c includes a lower surface 11b, and the upper wall 11d includes an upper surface 11a. The lower wall 11c and the upper wall 11d both extend in a direction perpendicular to the Z direction and are provided parallel to each other with a gap in the Z direction. The upper wall 11d has two armrest portions 11p. The two armrest portions 11p are provided on the +X direction side of the keyboard 12 and are arranged side by side with a gap in the Y direction. A touchpad 35 is disposed between the two armrest portions 11p.

[0030] The front wall 11e and the rear wall 11f both extend in a direction perpendicular to the X direction and are provided parallel to each other with a gap in the X direction. The front wall 11e and the rear wall 11f respectively constitute a front end portion 11i and a rear end portion 11j of the first housing 11. The front end portion 11i is spaced apart from the rotation center axis C. The rear end portion 11j is provided on the rotation center axis C side relative to the front end portion 11i.

[0031] The left wall 11g and the right wall 11h both extend in a direction perpendicular to the Y direction and are provided parallel to each other with a gap in the Y direction. The left wall 11g and the right wall 11h form the left end 11k and the right end 11m of the first housing 11, respectively.

[0032] The first housing 11 is made up of a combination of multiple members. For example, the first housing 11 has a lower cover 13 including a bottom wall 11c and an upper cover 14 including a top wall 11d.

[0033] Fig. 4 is an exemplary perspective view of the battery pack 41 in the electronic device 1 of the first embodiment. Fig. 5 is an exemplary front view of the battery pack 41 in the electronic device 1 of the first embodiment. Fig. 6 is an exemplary cross-sectional view of the base unit 2 in the electronic device 1 of the first embodiment.

[0034] 4 to 6, the battery pack 41 includes a battery case 42 and a plurality of batteries 43. The battery pack 41 is also called a battery module. The batteries 43 are also called battery cells.

[0035] 5 and 6, the plurality of batteries 43 are arranged at intervals in the Y direction. The batteries 43 are, for example, secondary batteries such as lithium ion batteries, but are not limited to this.

[0036] 4 and 5, the shape of the battery case 42 is a generally rectangular parallelepiped that is flat in the vertical direction. The battery case 42 is made up of, for example, a combination of multiple members.

[0037] The battery case 42 has multiple outer surfaces, such as a bottom surface 42c, a top surface 42d, a front surface 42e, a rear surface 42f, a left surface 42g, and a right surface 42h. The bottom surface 42c is an example of a first outer surface, and the top surface 42d is an example of a second outer surface.

[0038] The lower surface 42c and the upper surface 42d both extend in a direction perpendicular to the Z direction and are provided parallel to each other with an interval in the Z direction. The upper surface 42d is the surface opposite the lower surface 42c.

[0039] The front surface 42e and the rear surface 42f both extend in a direction perpendicular to the X direction and are provided parallel to each other with a gap in the X direction.

[0040] The left surface 42g and the right surface 42h both extend in a direction perpendicular to the Y direction, and are provided parallel to each other with a gap in the Y direction.

[0041] The lower surface 42c is provided with a plurality of (for example, two) first recesses 42i. Each of the two first recesses 42i extends in the X direction and is provided parallel to each other with a gap in the Y direction. The first recess 42i is open in the +Z direction and also in the +X and −X directions. The first recess 42i forms a gap between the battery case 42 and the lower wall 11c of the first housing 11. As shown in FIG. 6, a portion of the first heat pipe 52 of the heat dissipation unit 51 is placed in the first recess 42i.

[0042] As shown in FIGS. 4 to 6, the top surface 42d is provided with a plurality of (for example, two) second recesses 42j. Each of the two second recesses 42j extends in the X direction and is provided parallel to each other with a gap in the Y direction. The two second recesses 42j are aligned with the two first recesses 42i in the Z direction. The second recesses 42j are open in the -Z direction and also open in the +X direction. The second recesses 42j form a gap between the battery case 42 and the top wall 11d of the first housing 11. As shown in FIG. 6, the screw 36 is inserted in the second recess 42j. Specifically, at least the head 36a of the screw 36, consisting of the head 36a and the male thread portion 36b, is inserted in the second recess 42j.

[0043] The battery case 42 also has a plurality of (for example, two) partitions 42k extending in the X direction. Each of the two partitions 42k extends in the X direction and is provided parallel to each other with a gap in the Y direction. The partitions 42k divide the interior of the battery case 42 into a plurality of storage chambers that store batteries 43. Each partition 42k has a first recess 42i and a second recess 42j. That is, the first recess 42i and the second recess 42j are provided between two adjacent batteries 43.

[0044] As shown in FIG. 3, the battery case 42 is fixed to the top wall 11d of the first housing 11 by a plurality of screws 44 (for example, five screws). Two of the screws 44 are provided at the corners of the battery case 42, and the other two screws 44 are provided in the first recess 42i. The screws 44 provided in the first recess 42i extend from the first recess 42i through the second recess 42j to the top wall 11d. The heads 44a of the screws 44 provided in the first recess 42i are inserted into the first recess 42i. The screws 44 are an example of a fastener.

[0045] 2, the heat dissipation unit 51 has a first heat pipe 52. The first heat pipe 52 is thermally connected to the CPU 33 and is placed in the first recess 42i of the battery case 42. Specifically, the first heat pipe 52 has a base 52a and two extensions 52b. The base 52a is an example of a first portion, and the two extensions 52b are an example of a second portion.

[0046] The base 52a is located outside the first recess 42i and is fixed to the substrate 3 while being in contact with the lower surface 3a of the substrate 3. In other words, the base 52a is thermally connected to the CPU 33 via the substrate 3. The base 52a extends in the Y direction.

[0047] The two extensions 52b extend in the +X direction from both ends of the base 52a in the Y direction. The two extensions 52b are arranged parallel to each other and spaced apart in the Y direction. The two extensions 52b are placed in the two first recesses 42i of the battery case 42. At this time, the extensions 52b and the battery case 42 are spaced apart. The two extensions 52b are in contact with the inner surface of the bottom wall 11c of the first housing 11.

[0048] In the heat dissipation unit 51, the base 52a of the first heat pipe 52 receives heat generated by the CPU 33 via the substrate 3. The heat received by the base 52a is transferred from the base 52a to the two extensions 52b. The heat transferred to the extensions 52b is transferred from the extensions 52b to the bottom wall 11c of the first housing 11, and is dissipated from the bottom wall 11c to the outside of the first housing 11 (electronic device 1). This cools the CPU 33. As can be seen from the above, in this embodiment, the heat generated by the CPU 33 is transferred by the heat dissipation unit 51 to the +X direction side of the first housing 11 and dissipated.

[0049] 6, the touchpad 35 has a pad portion 35a that accepts touch operations and a support portion 35b that supports the pad portion 35a. The support portion 35b is fixed to a fixing portion 14a provided on the first housing 11 with a screw 36. The fixing portion 14a is included in the upper wall 14b.

[0050] 7 is an exemplary cross-sectional view of the base unit 2 in the electronic device 1 of the first embodiment. As shown in FIG. 7, a space K1 is provided between the inner surface of the armrest unit 11p of the first housing 11 of the base unit 2 and the upper surface 42d of the battery case 42. The space K1 acts as a heat insulator and suppresses heat transfer between the armrest unit 11p and the battery case 42. This suppresses an increase in the surface temperature of the armrest unit 11p. This suppresses heat transfer to the user.

[0051] As described above, the electronic device 1 of this embodiment includes the first housing 11 (housing), the battery case 42, the battery 43, the CPU 33 (heat-generating component), and the first heat pipe 52. The battery case 42 has a lower surface 42c (first outer surface) on which a first recess 42i is provided, and is housed in the first housing 11 (housing). The battery 43 is housed in the battery case 42. The CPU 33 is housed in the first housing 11 and generates heat. The first heat pipe 52 is thermally connected to the CPU 33 and is placed in the first recess 42i.

[0052] According to this configuration, the first heat pipe 52 can improve the heat dissipation performance of the electronic device 1. In other words, the first heat pipe 52 can improve the heat dissipation efficiency of the electronic device 1. Furthermore, according to the above configuration, the first heat pipe 52 is placed in the first recess 42i, and therefore the electronic device 1 can be made thinner than in a configuration in which the first heat pipe 52 is not placed in the first recess 42i and is stacked on the battery case 42.

[0053] The electronic device 1 also includes a plurality of batteries 43. The first recess 42i is provided between two batteries 43 adjacent to each other.

[0054] With this configuration, even if a plurality of batteries 43 are provided, the electronic device 1 can have good heat dissipation properties and be made thinner.

[0055] The first heat pipe 52 has a base 52a (first portion) and an extension 52b (second portion). The base 52a is located outside the first recess 42i and is thermally connected to the CPU 33. The extension 52b is connected to the base 52a and is placed in the first recess 42i.

[0056] With this configuration, the heat generated by the CPU 33 can be transferred from the base portion 52a of the first heat pipe 52 to the extending portion 52b (second portion) and dissipated at the extending portion 52b.

[0057] Furthermore, a plurality of first recesses 42i are provided on the lower surface 42c. The first heat pipe 52 has a plurality of extensions 52b that are fitted into the plurality of first recesses 42i.

[0058] According to this configuration, the first heat pipe 52 has a plurality of extending portions 52b, so that the heat dissipation performance of the electronic device 1 can be further improved.

[0059] The electronic device 1 also includes a touchpad 35 (fixed component) fixed to the first housing 11 with screws 36 (fixtures). The battery case 42 has an upper surface 42d (second outer surface) opposite a lower surface 42c (first outer surface). The upper surface 42d is provided with a second recess 42j into which the screw 36 (fixture) is inserted.

[0060] With this configuration, the screw 36 is inserted into the second recess 42j, which makes it possible to further reduce the thickness of the electronic device 1 compared to a configuration in which the entire screw 36 is not inserted into the second recess 42j but is stacked on the battery case 42.

[0061] The electronic device 1 is also provided with screws 44 (fixing devices) that are inserted into the first recess 42i and fix the battery case 42 to the first housing 11.

[0062] With this configuration, the screw 44 is inserted into the first recess 42i, which makes it possible to further reduce the thickness of the electronic device 1 compared to a configuration in which the entire screw 44 is not inserted into the first recess 42i but is overlapped with the battery case 42. Furthermore, with the above configuration, the external dimensions of the battery case 42 can be reduced.

[0063] Additionally, a plurality of screws 44 contact the battery case 42 to fix the battery case 42 in place.

[0064] With this configuration, the strength of the battery case 42 can be improved.

[0065] <Second embodiment> FIG. 8 is an exemplary bottom view of the base unit 2 of the electronic device 1 according to the second embodiment, with the lower cover 13 removed.

[0066] 8, this embodiment differs from the first embodiment in the configuration of the first heat pipe 52. The following mainly describes the differences between this embodiment and the first embodiment.

[0067] The first heat pipe 52 of this embodiment is formed endlessly. In other words, the first heat pipe 52 is formed in a ring shape. More specifically, the first heat pipe 52 has a base 52a, two extensions 52b, and a connection 52c. The connection 52c connects the ends of the two connection parts 52c opposite to the base 52a. The connection 52c is located on the +X direction side of the battery case 42 and is aligned with the battery case 42 at a distance in the X direction. The connection 52c is located on the +X direction side of the battery case 42 and is aligned with the battery case 42 at a distance in the X direction. The connection 52c is in contact with the inner surface of the bottom wall 11c of the first housing 11.

[0068] In the heat dissipation section 51, the base 52a of the first heat pipe 52 receives heat generated by the CPU 33 via the substrate 3. The heat received by the base 52a is transferred from the base 52a to the two extension sections 52b. A portion of the heat transferred to the extension sections 52b is transferred from the extension sections 52b to the bottom wall 11c of the first housing 11 and is radiated from the bottom wall 11c to the outside of the first housing 11 (electronic device 1). A portion of the heat transferred to the extension sections 52b is transferred from the extension sections 52b to the connection sections 52c and is radiated from the connection sections 52c to the bottom wall 11c to the outside of the first housing 11 (electronic device 1). This cools the CPU 33.

[0069] As described above, in the electronic device 1 of this embodiment, the lower surface 42c is provided with two first recesses 42i. The first heat pipe 52 has two extensions 52b inserted into the two first recesses 42i, and is formed endless.

[0070] With this configuration, the first heat pipe 52 has two extending portions 52b inserted into the two first recesses 42i and is formed endlessly, which further improves the heat dissipation of the electronic device 1. Furthermore, with the above configuration, heat can be diffused over a wide area within the first housing 11. This makes it easier to achieve uniform heat distribution in the battery 43, thereby extending the life of the battery 43.

[0071] <Third embodiment> FIG. 9 is an exemplary bottom view of the base unit 2 of the electronic device 1 according to the third embodiment, with the lower cover 13 removed.

[0072] 9, this embodiment differs from the first embodiment in that the heat dissipation unit 51 includes two first heat pipes 52 and a second heat pipe 52A. The following mainly describes the differences between this embodiment and the first embodiment.

[0073] Each of the two first heat pipes 52 is similar to that of the second embodiment and has a base 52a, two extensions 52b, and a connecting portion 52c, and is formed endless. The two first heat pipes 52 are spaced apart from each other in the Y direction. One of the two extensions 52b of each first heat pipe 52 is inserted into one of the two first recesses 42i of the battery case 42. The other of the two extensions 52b of each first heat pipe 52 is located outside the battery case 42 in the X direction and is aligned with the battery case 42 at a distance in the X direction.

[0074] The second heat pipe 52A thermally connects the bases 52a of the multiple first heat pipes 52 and also thermally connects the CPU 33 to the bases 52a. Specifically, the second heat pipe 52A has a base 52d and two connection portions 52e. The base 52d is fixed to the substrate 3 in contact with the lower surface 3a of the substrate 3. The two connection portions 52e extend in the Y direction from both ends of the base 52d. The two connection portions 52e are connected to the bases 52a of the two first heat pipes 52.

[0075] In the heat dissipation section 51, the base 52d of the second heat pipe 52A receives heat generated by the CPU 33 via the substrate 3. The heat received by the base 52d is transferred from the base 52a to the bases 52a of the two first heat pipes 52 via the two connecting sections 52e. The heat transferred to the bases 52a of the first heat pipes 52 is transferred to the extension sections 52b. A portion of the heat transferred to the extension sections 52b is transferred from the extension sections 52b to the bottom wall 11c of the first housing 11 and is radiated from the bottom wall 11c to the outside of the first housing 11 (electronic device 1). A portion of the heat transferred to the extension sections 52b is transferred from the extension sections 52b to the connecting sections 52c and is radiated from the connecting sections 52c to the bottom wall 11c to the outside of the first housing 11 (electronic device 1). This cools the CPU 33.

[0076] As described above, the electronic device 1 of this embodiment includes a plurality of first heat pipes 52 and a second heat pipe 52A. The second heat pipe 52A thermally connects the bases 52a (first portions) of the plurality of first heat pipes 52 and also thermally connects the CPU 33 (heat-generating component) to the bases 52a (first portions). A plurality of first recesses 42i are provided on the lower surface 42c (first outer surface). The first heat pipe 52 has an extension 52b (second portion) inserted into the first recess 42i and is formed endlessly.

[0077] According to this configuration, the electronic device 1 includes the plurality of first heat pipes 52 and the second heat pipe 52A, and therefore the heat dissipation performance of the electronic device 1 can be further improved.

[0078] <Fourth embodiment> FIG. 10 is an exemplary bottom view of the base unit 2 of the electronic device 1 according to the fourth embodiment, with the lower cover 13 removed.

[0079] 10, this embodiment differs from the first embodiment in the configuration of the first heat pipe 52. The following mainly describes the differences between this embodiment and the first embodiment.

[0080] In this embodiment, the two extension portions 52b of the first heat pipe 52 are located outside the battery case 42 in the X direction and are aligned with the battery case 42 at an interval in the X direction. The battery case 42 is disposed between the two extension portions 52b.

[0081] In the heat dissipation section 51, the base 52a of the first heat pipe 52 receives heat generated by the CPU 33 via the substrate 3. The heat received by the base 52a is transferred from the base 52a to the two extension sections 52b. The heat transferred to the extension sections 52b is transferred from the extension sections 52b to the bottom wall 11c of the first housing 11, and is dissipated from the bottom wall 11c to the outside of the first housing 11 (electronic device 1). This cools the CPU 33.

[0082] As described above, in this embodiment, the extending portion 52b of the first heat pipe 52 is located outside the battery case 42 in the X direction, and is aligned with the battery case 42 at an interval in the X direction.

[0083] According to this configuration, the first heat pipe 52 can improve the heat dissipation performance of the electronic device 1. Furthermore, according to the above configuration, the extension portion 52b of the first heat pipe 52 is located outside the battery case 42 in the X direction and is aligned with the battery case 42 at an interval in the X direction. This makes it possible to make the electronic device 1 thinner than a configuration in which the first heat pipe 52 is not placed in the first recess 42i and is stacked on the battery case 42.

[0084] <Fifth embodiment> FIG. 11 is an exemplary bottom view of the base unit 2 of the electronic device 1 according to the fifth embodiment, with the lower cover 13 removed.

[0085] 11, this embodiment differs from the first embodiment in the configuration of the first heat pipe 52. The following mainly describes the differences between this embodiment and the first embodiment.

[0086] The first heat pipe 52 is the same as in the second embodiment and has a base 52a, two extensions 52b, and a connection 52c, and is formed endless. The two extensions 52b of the first heat pipe 52 are located outside the battery case 42 in the X direction and are aligned with the battery case 42 at a distance in the X direction. The connection 52c is located on the +X direction side of the battery case 42 and is aligned with the battery case 42 at a distance in the X direction. The connection 52c is in contact with the inner surface of the bottom wall 11c of the first housing 11.

[0087] In the heat dissipation section 51, the base 52a of the first heat pipe 52 receives heat generated by the CPU 33 via the substrate 3. The heat received by the base 52a is transferred from the base 52a to the two extension sections 52b. A portion of the heat transferred to the extension sections 52b is transferred from the extension sections 52b to the bottom wall 11c of the first housing 11 and is radiated from the bottom wall 11c to the outside of the first housing 11 (electronic device 1). A portion of the heat transferred to the extension sections 52b is transferred from the extension sections 52b to the connection sections 52c and is radiated from the connection sections 52c to the bottom wall 11c to the outside of the first housing 11 (electronic device 1). This cools the CPU 33.

[0088] As described above, in this embodiment, the extending portion 52b of the first heat pipe 52 is located outside the battery case 42 in the X direction and is aligned with the battery case 42 at an interval in the X direction. The first heat pipe 52 is formed endlessly.

[0089] According to this configuration, the first heat pipe 52 can improve the heat dissipation of the electronic device 1. Furthermore, according to the above configuration, the extension portion 52b of the first heat pipe 52 is located outside the battery case 42 in the X direction and is aligned with the battery case 42 at a distance in the X direction. This allows the electronic device 1 to be thinner than a configuration in which the first heat pipe 52 is not inserted into the first recess 42i and is stacked on the battery case 42. Furthermore, according to the above configuration, the first heat pipe 52 is formed endlessly, which further improves the heat dissipation of the electronic device 1. Furthermore, according to the above configuration, heat can be diffused over a wide area within the first housing 11. This makes it easier to achieve uniform heat distribution in the battery 43, thereby extending the life of the battery 43.

[0090] <Other embodiments> In the above embodiments, the CPU 33 is used as an example of a heat-generating component, but the present invention is not limited to this. The heat-generating component may be an electronic component other than the CPU 33. In addition, in the above embodiments, the touchpad 35 is used as an example of a fixed component, but the present invention is not limited to this. The fixed component may be a component other than the touchpad 35.

[0091] While the embodiments of the present invention have been described above, they are merely examples and are not intended to limit the scope of the invention. The above embodiments can be implemented in various other forms, and various omissions, substitutions, combinations, and modifications can be made without departing from the spirit of the invention. Furthermore, the specifications of each configuration, shape, and the like (structure, type, direction, format, size, length, width, thickness, height, number, arrangement, position, material, etc.) can be modified as appropriate. [Explanation of symbols]

[0092] 1...Electronic equipment 11...First housing (housing) 33...CPU (heat generating component) 35...Touchpad (fixed part) 36...Screw (fixing device) 42...Battery case 42c...Bottom surface (first outer surface) 42d...Top surface (second outer surface) 42i...First recess 42j...Second recess 43...battery 44...Screw (fixing device) 52...First heat pipe 52a...base (first part) 52b...Extending part 52A...Second heat pipe

Claims

1. The housing and a battery case housed in the housing, the battery case having a first outer surface with a first recess; a battery housed in the battery case; a heat-generating component housed in the housing and generating heat; a first heat pipe thermally connected to the heat generating component and placed in the first recess; Electronic equipment equipped with

2. A plurality of the batteries are provided, The first recess is provided between two adjacent batteries. The electronic device according to claim 1 .

3. The first heat pipe a first portion located outside the first recess and thermally connected to the heat-generating component; a second part connected to the first part and placed in the first recess; It had The electronic device according to claim 1 .

4. The first outer surface is provided with a plurality of the first recesses, the first heat pipe has a plurality of second portions placed in the plurality of first recesses; The electronic device according to claim 3 .

5. The first outer surface is provided with two first recesses, the first heat pipe has two second portions inserted into the two first recesses and is formed endlessly; The electronic device according to claim 3 .

6. a plurality of the first heat pipes; a second heat pipe that thermally connects the first portions of the plurality of first heat pipes and thermally connects the heat-generating component and the first portions; Equipped with The first outer surface is provided with a plurality of the first recesses, the first heat pipe has the second portion inserted into the first recess and is formed endlessly; The electronic device according to claim 3 .

7. a fixed component fixed to the housing by a fastener; the battery case has a second outer surface opposite the first outer surface; The second outer surface is provided with a second recess into which the fastener is placed. The electronic device according to claim 1 .

8. a fixing device that is inserted into the first recess and fixes the battery case to the housing; 8. The electronic device according to claim 1.

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