Mold remover composition

Abstract

To provide a mold-removing agent composition which exhibits good adhesion to a target surface when sprayed toward the target surface in a spray container, and can suppress the generation of splashes rebounding from the target surface without adhering to the target surface and dripping from a spray port.SOLUTION: The mold remover composition comprises (A) a clay mineral, (B) a hypochlorite and (C) an alkali agent.SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates to a mold removal composition. [Background technology]

[0002] Compositions containing hypochlorite are used as mold remover compositions, because the hypochlorous acid released from the hypochlorite acts as a powerful chlorine-based bleaching agent, and can remove and bleach mold stains that occur in so-called wet areas such as bathrooms, bathtubs, kitchens, toilets, drainage pipes, etc. The mold remover composition can be enclosed in a spray container and sprayed over a wide area.

[0003] Patent Document 1 discloses a liquid bleaching composition containing an alkali metal hypochlorite salt, and a liquid bleaching product in a spray container obtained by filling the composition in a container equipped with a trigger-type spray. Patent Document 2 discloses a spray-type bleaching agent obtained by filling a bleaching composition containing an alkali metal hypochlorite salt in a container equipped with a spraying means. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2010-235723 [Patent Document 2] Japanese Patent Application Laid-Open No. 2009-030035 Summary of the Invention [Problem to be solved by the invention]

[0005] After the mold removal composition is placed in a spray container such as a sprayer and sprayed onto a target surface where mold stains exist, the mold removal composition must exhibit good adhesion to the target surface. Furthermore, droplets may bounce back from the target surface without adhering to the surface, and drips may occur from the spray nozzle without being sprayed onto the target surface. These droplets and drips may cause skin irritation when they come into contact with the human body, such as the hands and fingers holding the spray, or may adhere to clean floors, flooring, mats, etc., causing unintended bleaching.

[0006] The present invention has been made in consideration of the above circumstances, and has as its object the provision of a mold remover composition that, when placed in a spray container and sprayed onto a target surface, exhibits good adhesion to the target surface, and can suppress the occurrence of droplets bouncing off the target surface without adhering to the surface, and the occurrence of dripping from the spray nozzle. [Means for solving the problem]

[0007] The present invention includes the following. (1) A mold remover composition comprising (A) a clay mineral, (B) a hypochlorite, and (C) an alkaline agent. (2) The mold remover composition according to claim 1, further comprising (D) a chelating agent. (3) The mold remover composition according to (1) or (2), wherein the clay mineral (A) is uniformly dispersed in the mold remover composition. (4) The mold remover composition according to any one of (1) to (3), which is in a gel or solid state when left standing. (5) The mold remover composition according to any one of (1) to (4), wherein the content of the clay mineral (A) is 0.5% by mass or more and 10% by mass or less, with the total amount of the mold remover composition being 100% by mass. (6) The mold remover composition according to any one of (1) to (5), further comprising a surfactant. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide a mold remover composition that, when placed in a spray container and sprayed onto a target surface, exhibits good adhesion to the target surface, and can suppress the occurrence of droplets that bounce off the target surface without adhering to the surface, and the occurrence of dripping from the spray nozzle. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a schematic diagram of a spray container containing a mold remover composition according to one embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0010] An embodiment of the present invention (hereinafter also referred to as the present embodiment) will be described below, although the present embodiment is not limited thereto.

[0011] The mold remover composition of this embodiment contains (A) a clay mineral (hereinafter also referred to as component (A)), (B) a hypochlorite (hereinafter also referred to as component (B)), and (C) an alkaline agent (hereinafter also referred to as component (C)).

[0012] The spray container capable of spraying the mold remover composition of this embodiment will be briefly described below. In this specification, the term "target surface" refers to a surface on which mold stains exist, and a surface from which mold stains have been removed with a mold remover composition.

[0013] Fig. 1 is a schematic diagram showing an example of a spray container containing the mold remover composition of this embodiment. As shown in Fig. 1, the spray container 10 includes a storage container 20 and a spraying device 30. The storage container 20 can store the mold remover composition of this embodiment. The spraying device 30 includes a trigger 31, a piston 32, a cylinder 33, and a nozzle 34. The nozzle 34 has a spray opening 34a.

[0014] The spray container 10 can spray the mold remover composition stored in the storage container 20 to the outside of the spray container 10 using the spray device 30. Specifically, by pulling the trigger 31 in the direction of the piston 32, the piston 32 and the cylinder 33 are actuated, and the composition stored in the storage container 20 is drawn up into the spray device 30. The drawn-up composition is sprayed from the spray port 34a of the nozzle 34.

[0015] The mold remover composition in this embodiment has thixotropy. Thixotropy refers to the property of increasing fluidity (decreasing viscosity) when subjected to shear stress and returning to its original state (increasing viscosity) when the shear stress is removed. A mold remover composition with thixotropy is in a sol or liquid state when its viscosity is reduced, and in a gel or solid state when its viscosity is increased. In this specification, "sol" refers to a state in which low-viscosity colloids are dispersed, and "gel" refers to a state in which high-viscosity colloids are dispersed.

[0016] For example, when a thixotropic mold remover composition is stored in storage container 20 and used in spray container 10, even if the composition is in a gel or solid state when left to stand, the fluidity of the composition increases and it becomes a sol or liquid state, allowing it to be sprayed onto the target surface, by vibrating spray container 10 before spraying, or by the composition being sucked up into spray device 30 during spraying. When the shear stress is removed, the viscosity of the composition sprayed onto the target surface increases again, and the composition becomes a gel or solid state, which allows it to adhere to the target surface and exhibit good adhesion.

[0017] Because the mold remover composition of this embodiment is thixotropic, the viscosity of the composition that adheres to the target surface increases again, turning it into a gel or solid. Therefore, the mold remover composition exhibits good adhesion to the target surface, allowing it to remain attached to the target surface and suppressing the occurrence of splashes. Furthermore, the viscosity of the composition remaining in the spray port 34a of the nozzle 34 after spraying increases again, turning it into a gel or solid, thereby suppressing the occurrence of dripping.

[0018] [Mold removal composition] <Component (A)> The mold remover composition contains a clay mineral as component (A). The clay mineral as component (A) can impart thixotropy by being uniformly dispersed in the mold remover composition. In this specification, clay mineral refers to a layered silicate mineral in which a layer containing silicate and a layer mainly composed of metal are stacked. The layered silicate mineral may be partially or entirely crystalline, or partially or entirely amorphous. The clay mineral as component (A) may be a natural clay mineral or a synthetic clay mineral.

[0019] Examples of the clay minerals of component (A) include natural clay minerals such as smectite clay minerals, such as bentonite, saponite, montmorillonite, hectorite, beidellite, sauconite, nontronite, and stevensite; kaolinite clay minerals, such as kaolinite, halloysite, dickanite, and nacrite; talc clay minerals; vermiculite clay minerals; and mica clay minerals, such as muscovite and phlogopite; and LAPONITE (registered trademark, manufactured by BYK, synthetic clay, chemical formula: Na + 0.7 [(Si8Mg 5.5 Li 0.3 )O 20 (OH)4] -0.7, bentonite, hectorite, and other smectite-based synthetic clay minerals), Bengel (registered trademark, manufactured by Hojun Co., Ltd.), Lucentite (registered trademark, manufactured by Katakura Co-op Agri Co., Ltd.), Kunipia (registered trademark, manufactured by Kunimine Industries Co., Ltd., montmorillonite, bentonite, and other smectite-based synthetic clay minerals), Benclay (registered trademark, manufactured by Mizusawa Industrial Chemicals Co., Ltd.), Veegum (registered trademark, manufactured by Vanderbilt Chemicals Co., Ltd.), and Sumecton (registered trademark, manufactured by Kunimine Industries Co., Ltd., saponite, stevensite, hectorite, and other smectite-based synthetic clay minerals). The component (A) used in the mold remover composition can be any of the above clay minerals, or two or more of them can be used in combination. The clay mineral of component (A) preferably contains a synthetic clay mineral, more preferably a smectite-based synthetic clay mineral, and even more preferably at least one selected from the group consisting of LAPONITE, KUNIPIA, and SUMETON, from the viewpoint of facilitating adjustment of the viscosity and thixotropy of the mold remover composition and exhibiting excellent quality stability. The synthetic clay mineral may be commercially available under the above-mentioned trade names.

[0020] The content of component (A) in the mold remover composition is preferably 0.5 to 15% by mass, more preferably 0.5 to 10% by mass, even more preferably 1.0 to 5.0% by mass, even more preferably 1.0 to less than 5.0% by mass, and particularly preferably 1.2 to 4.0% by mass, based on 100% by mass of the entire mold remover composition, from the viewpoints of improving adhesion of the mold remover composition to the target surface and further suppressing splashing and dripping. The content of component (A) may be 1.6% by mass or more, or may be 2.5% by mass or more, from the viewpoint of improving adhesion of the mold remover composition to the target surface.

[0021] <(B) component> The mold remover composition contains a hypochlorite as component (B), which liberates hypochlorous acid in the mold remover composition, thereby imparting bleaching and cleaning properties that remove mold stains to the mold remover composition.

[0022] Examples of the hypochlorite salt of component (B) include alkali metal hypochlorite salts such as sodium hypochlorite and potassium hypochlorite; and alkaline earth metal hypochlorite salts such as magnesium hypochlorite and calcium hypochlorite. As component (B) used in the mold remover composition, the above hypochlorite salts can be used alone or in combination of two or more. From the viewpoint of imparting better bleaching and cleaning properties to the mold remover composition, the hypochlorite salt of component (B) preferably contains an alkali metal hypochlorite salt, and more preferably contains sodium hypochlorite.

[0023] From the viewpoint of imparting better bleaching and cleaning properties to the mold remover composition, the content of component (B) in the mold remover composition is preferably 0.1% by mass or more and 10% by mass or less, more preferably 0.5% by mass or more and 5.0% by mass or less, even more preferably 1.0% by mass or more and 3.0% by mass or less, and particularly preferably 2.0% by mass or more and 3.0% by mass or less, with the entire mold remover composition being 100% by mass.

[0024] <(C) component> The mold remover composition contains an alkaline agent as component (C). The alkaline agent as component (C) makes the mold remover composition alkaline and can stabilize hypochlorite. From the viewpoint of further stabilizing hypochlorite, the pH of the mold remover composition at 20°C is preferably 9.0 or higher, more preferably 11.0 or higher, and even more preferably 12.0 or higher, and is preferably 13.5 or lower, more preferably 13.3 or lower, and even more preferably 13.0 or lower.

[0025] Examples of the alkaline agent of component (C) include alkali metal hydroxides such as lithium hydroxide, sodium hydroxide, and potassium hydroxide; alkali metal carbonates such as sodium carbonate and potassium carbonate; alkaline earth metal hydroxides such as magnesium hydroxide and calcium hydroxide; and alkaline earth metal carbonates such as magnesium carbonate and calcium carbonate. The alkaline agent of component (C) used in the mold remover composition may be any of the above alkaline agents, or two or more of them may be used in combination. From the viewpoints of availability and the stability of hypochlorite, the alkaline agent of component (C) preferably contains an alkali metal hydroxide, and preferably contains sodium hydroxide.

[0026] From the viewpoint of making the hypochlorite more stable, the content of component (C) in the mold remover composition is preferably 0.01% by mass or more and 15% by mass or less, more preferably 0.1% by mass or more and 10% by mass or less, even more preferably 0.1% by mass or more and 3% by mass or less, and even more preferably 0.3% by mass or more and 1% by mass or less, based on 100% by mass of the entire mold remover composition.

[0027] <(D) component> The mold removal composition preferably contains a chelating agent (D) (hereinafter also referred to as component (D)). The chelating agent (D) can inhibit the decomposition of hypochlorite even in the presence of heavy metals such as those contained in component (A), thereby stabilizing the hypochlorite.

[0028] Examples of the chelating agent for component (D) include aminocarboxylic acid chelating agents such as ethylenediaminetetraacetic acid (EDTA), nitrilotriacetic acid (NTA), and diethylenetriaminepentaacetic acid (DTPA); hydroxycarboxylic acid chelating agents such as hydroxyethylethylenediaminetriacetic acid (HEDTA) and hydroxyethyliminodiacetic acid (HIDA); phosphonic acid chelating agents such as hydroxyethylidene diphosphonic acid (HEDP), aminotrismethylenephosphonic acid (ATMP), phosphonobutanetricarboxylic acid (PBTC), and ethylenediaminetetramethylenephosphonic acid (EDTMP), as well as salts thereof. Examples of the salts include alkali metal salts such as lithium salts, sodium salts, and potassium salts; and alkaline earth metal salts such as magnesium salts and calcium salts. The component (D) used in the mold remover composition can be any of the above chelating agents, either alone or in combination. The chelating agent of component (D) is easily available and, from the viewpoint of stabilizing hypochlorite, preferably contains a phosphonic acid chelating agent or a salt thereof, and more preferably contains PBTC or a salt thereof.

[0029] From the viewpoint of further stabilizing the hypochlorite even in the presence of heavy metals, the content of component (D) in the mold remover composition is preferably 0.1% by mass or more and 5% by mass or less, more preferably 0.4% by mass or more and 3% by mass or less, and even more preferably 0.4% by mass or more and 2% by mass or less, with the entire mold remover composition being 100% by mass.

[0030] <Other ingredients> In addition to the above components (A) to (D), the mold remover composition may contain surfactants, fragrances, colorants, pH adjusters, solubilizers, penetrants, suspending agents, thickeners other than component (A), antibacterial agents, acidic substances, alcohols, etc.

[0031] The mold remover composition may contain a surfactant to improve adhesion to the target surface and to further suppress splashback. The mold remover composition may contain a surfactant to increase viscosity and reduce surface tension, thereby extending the time the composition remains attached to the target surface. Examples of surfactants include anionic surfactants, cationic surfactants, nonionic surfactants, and amphoteric surfactants.

[0032] Examples of anionic surfactants include alkyl sulfates such as sodium decyl sulfate and sodium lauryl sulfate; alkyl ether sulfates such as sodium lauryl ether sulfate; sulfonates such as sodium hexanesulfonate and sodium decylsulfonate; alkylbenzenesulfonates such as sodium decylbenzenesulfonate and sodium laurylbenzenesulfonate; and aliphatic carboxylates such as sodium decanoate, sodium laurate, sodium stearate, and sodium oleate. Examples of cationic surfactants include alkylamine salts such as methylamine chloride, dimethylamine chloride, and trimethylamine chloride; alkylammonium salts such as tetraammonium chloride; dialkyl-type quaternary ammonium salts; and trialkyl-type quaternary ammonium salts such as benzyltrimethylammonium chloride. Examples of nonionic surfactants include ether surfactants such as polyoxyalkylene alkyl ethers and polyoxyalkylene alkylaryl ethers; and ester surfactants such as polyglycerin fatty acid esters, polyoxyalkylene fatty acid esters, and polyoxyalkylene polyol fatty acid esters. Examples of amphoteric surfactants include alkyl betaines such as trimethylacetic acid betaine and trimethylcarboxymethyl betaine; fatty acid amidopropyl betaines such as lauric acid amidopropyl betaine; and alkyl amine oxides such as coconut oil dimethylamine oxide and lauryl dimethylamine oxide. The mold remover composition can use the above surfactants alone or in combination of two or more. The surfactant contained in the mold remover composition may contain an amphoteric surfactant, an alkylamine oxide, or lauryldimethylamine oxide, for the purposes of improving adhesion to the target surface and further suppressing splashback.

[0033] When the mold remover composition contains a surfactant, the content of the surfactant in the mold remover composition may be 0.001% by mass or more and 0.5% by mass or less, 0.01% by mass or more and 0.3% by mass or less, or 0.02% by mass or more and 0.1% by mass or less, in order to provide better adhesion to the target surface and to further suppress splashback.

[0034] The addition of a fragrance allows the mold remover composition to emit a fragrance, which can suppress the unpleasant odor produced by hypochlorite and enable confirmation that no mold remover composition remains on the target surface.

[0035] Examples of fragrances include synthetic fragrances such as hydrocarbon compounds such as α-pinene, β-pinene, and limonene; alcohol compounds such as geraniol; phenolic compounds such as anisole and cresol; aldehyde compounds such as citral; acetal compounds; ketone compounds such as carvone and pulegone; acid compounds such as geranic acid, acetic acid, butyric acid, valeric acid, vanillic acid, and benzoic acid; lactone compounds such as pentalide and habanolide; ester compounds such as ethyl formate and hexyl formate; nitrogen-containing compounds such as methyl anthranilate and mevantral; sulfur-containing compounds such as thiazole and limonene thiol; and natural fragrances such as ylang-ylang oil, orange oil, and chamomile oil. The fragrances used in the mold remover composition may be any of the above fragrances, or two or more of them may be used in combination.

[0036] The remainder of the mold remover composition of this embodiment is water, and from the viewpoint of storage stability, ion-exchanged water or distilled water from which trace amounts of metal ions and the like present in water have been removed is preferred. The water content in the composition of this embodiment may be 80% by mass or more, or may be 90% by mass or more, based on 100% by mass of the entire mold remover composition. The water content in the composition of this embodiment is usually 96% by mass or less, and preferably 92% by mass or less, based on 100% by mass of the entire mold remover composition.

[0037] [Method for producing mold remover composition] The method for producing the mold remover composition is not particularly limited. The mold remover composition can be obtained, for example, by adding a clay mineral (component A), a hypochlorite (component B), an alkali agent (component C), a chelating agent (component D), and other components as needed, and then adding water. The order in which the components are added is not particularly limited. In this embodiment, the mold remover composition preferably has the clay mineral uniformly dispersed to form a colloid.

[0038] [Method of using the mold remover composition] The mold remover composition of this embodiment is preferably stored in a container that can spray it in at least one of liquid, mist, and foam form. By storing the mold remover composition of this embodiment in a container that can spray it in the above forms and using it, it can adhere to mold stains on the target surface with an appropriate spread and uniformly cover the target surface. When stored in the container and used, the mold remover composition of this embodiment exhibits good adhesion to the target surface and can effectively suppress splashes and drips from the target surface. Therefore, it can be suitably used in bathrooms, bathtubs, kitchens, toilets, drainage pipes, entrances, verandas, etc. The mold remover composition of this embodiment has excellent storage stability and is less likely to expand when stored in the container for a long period of time.

[0039] The mold remover composition of this embodiment can be used in a cleaning method that includes, in this order, a step of spraying the mold remover composition onto a target surface, a step of maintaining the mold remover composition applied to the target surface, and a step of rinsing the mold remover composition with water.

[0040] In the step of spraying the mold remover composition onto the target surface, for example, a method of spraying the mold remover composition in a sprayer can be used. Examples of the sprayer that can be used include a manual pump type, an electric pump type, a high-pressure gas type, an air pressure type, an accumulator type, a Venturi type, and a trigger type as shown in Figure 1. Before the step of spraying the mold remover composition onto the target surface, the sprayer can be vibrated to reduce the viscosity of the mold remover composition.

[0041] In the step of rinsing the mold remover composition with water, the end point can be the point when no bubbles are visible or no scent is discernible, for example.

[0042] In this embodiment, after the step of spraying the mold remover composition onto the object to be cleaned, a step of spreading the sprayed mold remover composition may be included. For example, a brush, a spatula, or the like may be used in the spreading step. [Example]

[0043] The present embodiment will be described in detail below with reference to examples, but the present embodiment is not limited to these examples.

[0044] The components shown below were mixed with the remainder water to prepare mold remover compositions for Experimental Examples 1 to 3. The amount of each component shown in Tables 1 to 3 below is the amount (% by mass) when the total amount of the mold remover composition is taken as 100% by mass.

[0045] (Experimental Example 1) LAPONITE (BYK): 3.0% by mass Sodium hypochlorite (manufactured by Nippon Light Metal Co., Ltd.): 2.5% by mass Sodium hydroxide (manufactured by Nissei Sangyo Co., Ltd.): 0.5% by mass Chelest PH-435 (2-phosphonobutane-1,2,4-tricarboxylic acid pentasodium salt, manufactured by Chelest): 0.8% by mass

[0046] (Experimental Example 2) LAPONITE (BYK): 1.45% by mass Sodium hypochlorite (manufactured by Nippon Light Metal Co., Ltd.): 2.5% by mass Sodium hydroxide (manufactured by Nissei Sangyo Co., Ltd.): 0.5% by mass Chelest PH-435 (2-phosphonobutane-1,2,4-tricarboxylic acid pentasodium salt, manufactured by Chelest): 0.8% by mass

[0047] (Experimental Example 3) LAPONITE (BYK): 2.2% by mass Sodium hypochlorite (manufactured by Nippon Light Metal Co., Ltd.): 2.5% by mass Sodium hydroxide (manufactured by Nissei Sangyo Co., Ltd.): 0.5% by mass Chelest PH-435 (2-phosphonobutane-1,2,4-tricarboxylic acid pentasodium salt, manufactured by Chelest): 0.8% by mass Amphitol 20N (lauryl dimethylamine oxide, manufactured by Kao Corporation): 0.035% by mass

[0048] The mold removal compositions of Experimental Examples 1 to 3 were stored in a trigger-type sprayer as the mold removal compositions of Examples 1 to 3, respectively, and a dripping test and a spraying test were carried out.

[0049] [Drip confirmation test] The trigger sprayer was gently shaken, placed on a horizontal surface so that it was perpendicular to the target surface, and the trigger was pulled 10 times in succession to spray the mold remover composition onto the target surface. After spraying, dripping from the spray nozzle was evaluated according to the following criteria. A: There was no dripping. B: Slight dripping occurred C: Significant dripping occurred

[0050] [Spray droplet test] A 25 mm diameter hole was drilled in the center of a 270 mm diameter piece of black construction paper, and a trigger spray nozzle was inserted into the hole so that the mold remover composition could be sprayed. The trigger spray was positioned so that the distance from the trigger spray nozzle to the target surface was 100 mm. The target surface was perpendicular to the horizontal plane. The trigger was then pulled five times in succession, held still for 10 seconds after the fifth trigger pull, and then released. If the sprayed mold remover composition rebounded and formed droplets, the black construction paper on the target surface side was bleached to white. The white marks on the black construction paper on the target surface side were checked as follows to evaluate the droplets. A: A slight white mark less than 1.0 mm in diameter was confirmed. B: A slight white mark with a diameter of 1.0 mm or more and less than 2.5 mm was confirmed. C: White marks with a diameter of 2.5 mm or more or multiple white marks were confirmed

[0051] Table 1 shows the compositions of Experimental Examples 1 to 3 and the test results.

[0052] [Table 1]

[0053] From the results in Table 1, the mold remover compositions of Examples 1 to 3 were excellent, with almost no dripping and only slight white marks of splashing observed. Among them, the mold remover compositions of Examples 2 and 3 were particularly excellent, with no dripping observed and only slight white marks of 1.0 mm or less in diameter observed.

[0054] [Container expansion test] The mold remover composition of Example 1 was stored in a trigger-type sprayer equipped with a container having a width of 99.12 mm and a depth of 48.38 mm. Five such trigger-type sprayers were prepared and left to stand for 113 days, and the width and depth of the container were measured each day, and the width and depth of the five samples were averaged. The width and depth of the container storing the mold remover composition of Example 1 remained almost unchanged even after being left to stand for 113 days. The mold remover composition of Example 1 had good storage stability.

[0055] [Adhesion test] The mold removal compositions of Examples 1 to 3 were stored in a trigger-type sprayer, and the mold removal compositions were sprayed onto a glass surface from a distance of 100 mm. After spraying, adhesion was evaluated in an environment of 25°C based on the time the mold removal composition dripped from the position where it first adhered to the surface and the time it remained at that position. The adhesion position includes the position where it dripped and the position where it first adhered without dripping. The mold removal composition of Example 1 adhered to the position where it first adhered and did not change position for one minute or more. The mold removal composition of Example 1 exhibited good adhesion to the surface. The mold removal composition of Example 2 dripped from the position where it first adhered for about three seconds immediately after spraying. Thereafter, the mold removal composition of Example 2 adhered to the position where it dripped and did not change position for one minute or more, demonstrating good adhesion. The mold removal composition of Example 3 dripped slightly from the position where it first adhered for a very short time immediately after spraying. The mold remover composition of Example 3 then adhered to the target surface at a slightly dripping position and maintained that position for more than one minute, demonstrating good adhesion. The time that the mold remover composition of Example 3 continued to drip from the position where it first adhered to the target surface immediately after spraying was shorter than that of Example 2, demonstrating better adhesion of the mold remover composition of Example 3 than that of Example 2.

[0056] The components shown below and the remainder water were mixed to prepare the mold remover compositions of Examples 4 to 10. The mold remover compositions of Examples 4 to 10 were placed in a trigger-type sprayer, and a dripping test and a spray splash test were carried out.

[0057] [Table 2]

[0058] The following components were mixed with the remainder water to prepare mold remover compositions of Examples 11 to 17 and Comparative Examples 1 and 2. The mold remover compositions of Examples 11 to 17 and Comparative Examples 1 and 2 were placed in trigger-type sprayers, and dripping tests and spray splash tests were carried out.

[0059] [Table 3]

[0060] The components used in the mold remover compositions of Examples 4 to 14 and Comparative Examples 1 and 2 are as follows: However, explanation of the components used in the mold remover compositions of Examples 1 to 3 is omitted. Sumecton SA was a synthetic clay mineral of saponite. Sumecton SWN was a synthetic clay mineral of hectorite. Kunipia G4 was a synthetic clay mineral of montmorillonite. Sumecton SA, Sumecton SWN, and Kunipia G4 were all manufactured by Kunimine Industries Co., Ltd. Chelest PH214 (tetrasodium hydroxyethylidene diphosphonate) and Chelest 400 (tetrasodium ethylenediaminetetraacetate tetrahydrate) were both manufactured by Chelest Corporation. PULLULAN was pullulan (COSMETIC GRADE) manufactured by Nagasevita Co., Ltd. Glyroid 6C was a tamarind gum manufactured by Gokyo Food & Chemical Co., Ltd.

[0061] The embodiments and examples disclosed herein are all illustrative and should not be considered limiting. The scope of the present invention is defined not by the above-described embodiments and examples but by the claims, and is intended to include all modifications within the scope and meaning equivalent to the claims. [Explanation of symbols]

[0062] 10 spray container, 20 storage container, 30 spray device, 31 trigger, 32 piston, 33 cylinder, 34 nozzle, 34a spray nozzle

Claims

1. A mold remover composition comprising (A) a clay mineral, (B) a hypochlorite, and (C) an alkaline agent.

2. The mold remover composition of claim 1, further comprising (D) a chelating agent.

3. 3. The mold remover composition according to claim 1, wherein the clay mineral (A) is uniformly dispersed in the mold remover composition.

4. The mold remover composition according to claim 1 or 2, which is in a gel or solid state when left standing.

5. 3. The mold remover composition according to claim 1, wherein the content of the clay mineral (A) is 0.5% by mass or more and 10% by mass or less, with the total amount of the mold remover composition being 100% by mass.

6. The mold remover composition according to claim 1 or 2, further comprising a surfactant.

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