Processing waste liquid treatment equipment

Abstract

A processing waste liquid treatment device is provided that reclaims pure water from waste liquid discharged from processing equipment including a CMP device or a CMP processing mechanism. [Solution] A processing waste liquid treatment device (1) that treats polishing waste liquid discharged from a CMP device (10) that supplies slurry to polish wafers and regenerates pure water, and is equipped with a polishing waste liquid tank (30) that stores the polishing waste liquid, a polishing debris removal filter (32) that removes at least the polishing debris from the polishing waste liquid and extracts treated water, a polishing waste liquid pump (31) that sends the polishing waste liquid from the polishing waste liquid tank to the polishing debris removal filter, a pH adjustment mechanism (33) that neutralizes the pH of the treated water, and a pure water generation unit (34) that generates pure water from the treated water adjusted by the pH adjustment mechanism.

Description

[Technical Field]

[0001] The present invention relates to a processing waste liquid treatment device. [Background technology]

[0002] A grinding machine that grinds wafers with a grinding wheel supplies pure water to the area where grinding is performed to remove processing heat and processing debris. As disclosed in Patent Document 1, the pure water is reclaimed by performing a process to remove processing debris from processing wastewater that contains processing debris and is discharged from the grinding machine.

[0003] As disclosed in Patent Document 2, a processing apparatus equipped with a grinding mechanism for performing grinding and a CMP (Chemical Mechanical Polishing) processing mechanism for performing chemical mechanical polishing uses a slurry as a processing fluid in the CMP processing. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2022-089048 [Patent Document 2] Japanese Patent Application Laid-Open No. 2005-153090 Summary of the Invention [Problem to be solved by the invention]

[0005] In CMP processing, a slurry with an alkaline or acidic pH is supplied, and therefore the processing waste liquid (polishing waste liquid) discharged after CMP processing using the slurry becomes alkaline or acidic, making it difficult to regenerate pure water.

[0006] Therefore, there is a need for a processing waste liquid treatment device that reclaims pure water from waste liquid discharged from a CMP apparatus that supplies slurry to polish wafers or a processing apparatus that includes a CMP processing mechanism. [Means for solving the problem]

[0007] One aspect of the present invention is a processing waste liquid treatment device that treats polishing waste liquid containing at least polishing debris discharged from a CMP device that supplies slurry to polish wafers and regenerates pure water, and includes a polishing waste liquid tank that stores the polishing waste liquid, a polishing debris removal filter that removes at least the polishing debris from the polishing waste liquid and extracts treated water, a polishing waste liquid pump that transports the polishing waste liquid from the polishing waste liquid tank to the polishing debris removal filter, a pH adjustment mechanism that neutralizes the pH of the treated water, and a pure water generation unit that generates pure water from the treated water adjusted by the pH adjustment mechanism.

[0008] One aspect of the present invention is a processing waste liquid treatment device that treats a mixed waste liquid of processing waste liquid containing processing debris discharged from a processing device that processes a wafer by supplying pure water to a processing point where a processing tool contacts the wafer, and polishing waste liquid containing polishing debris discharged from a CMP device that polishes a wafer by supplying slurry, and regenerates pure water.The device includes a waste liquid tank that stores the mixed waste liquid, a removal filter that removes the processing debris and polishing debris from the mixed waste liquid and extracts treated water, a waste liquid pump that transports the mixed waste liquid from the waste liquid tank to the removal filter, a pH adjustment mechanism that neutralizes the pH of the treated water, and a pure water generation unit that generates pure water from the treated water whose pH has been adjusted by the pH adjustment mechanism.

[0009] In one embodiment, the waste liquid tank comprises a polishing waste liquid tank for storing the polishing waste liquid of the mixed waste liquid, and a machining waste liquid tank for storing the machining waste liquid, the removal filter comprises a polishing debris removal filter for removing the polishing debris and extracting treated water, and a machining debris removal filter for removing the machining debris and extracting treated water, and the waste liquid pump comprises a polishing waste liquid pump for sending the polishing waste liquid from the polishing waste liquid tank to the polishing debris removal filter, and a machining waste liquid pump for sending the machining waste liquid from the machining waste liquid tank to the machining debris removal filter. [Effects of the Invention]

[0010] According to the processing waste liquid treatment device of the present invention, pure water can be reclaimed from waste liquid discharged from a CMP device that supplies slurry to polish wafers or a processing device that includes a CMP processing mechanism. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a diagram showing a processing waste liquid treatment apparatus according to a first embodiment. [Figure 2] FIG. 1 is a diagram showing a schematic configuration of a CMP apparatus. [Figure 3] FIG. 2 is a diagram showing the configuration of a pH adjusting mechanism in the processing waste liquid treatment device. [Figure 4] FIG. 10 is a diagram showing a processing waste liquid treatment apparatus according to a second embodiment. [Figure 5] FIG. 10 is a diagram showing a processing waste liquid treatment apparatus according to a third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0012] 1 treats polishing waste liquid discharged by a CMP apparatus 10, and reclaims pure water from the polishing waste liquid. As shown in Fig. 2, the CMP apparatus 10 is a processing apparatus that holds a wafer W, which is a workpiece, on a holding table 11, presses a polishing pad 12 against the upper surface (surface to be polished) of the wafer W, supplies a slurry S, which is a polishing liquid, to the contact point between the wafer W and the polishing pad 12, and rotates the holding table 11 and the polishing pad 12 relative to each other to perform CMP (Chemical Mechanical Polishing) on ​​the upper surface of the wafer W.

[0013] As shown in FIG. 2, the CMP apparatus 10 includes a holding table 11 for holding a wafer W and a polishing unit 13 to which a polishing pad 12 is attached. The holding table 11 is disposed so that its upper holding surface faces the lower surface of the polishing pad 12. The area of ​​the lower surface of the polishing pad 12 is larger than that of the holding surface of the holding table 11. The holding table 11 is supported for horizontal movement by a horizontal movement mechanism 14, such as a ball screw mechanism. The holding table 11 is also supported for rotation about an axis extending in the vertical direction by a table rotation mechanism 15 equipped with a motor. The polishing unit 13 includes a disk-shaped mounter 17 attached to the lower end of a spindle 16, which is a rotation axis extending in the vertical direction. The polishing pad 12 is attached to the lower surface of the mounter 17. The spindle 16 is rotated by a spindle motor 18, and the rotation of the spindle 16 rotates the polishing pad 12. The polishing unit 13 is supported for vertical movement by an elevation mechanism 19, such as a ball screw mechanism.

[0014] The polishing unit 13 is formed with a flow path 20 that passes through the inside of the spindle 16 and the mounter 17. Slurry S delivered from a slurry supply source 21 is supplied to the underside of the polishing pad 12 through the flow path 20. The slurry supply source 21 is composed of a tank that stores the slurry S, a pump that delivers the slurry S from the tank at a predetermined pressure, and the like.

[0015] The slurry S for CMP processing is prepared by mixing and dispersing free abrasive grains such as alumina, silica, and zirconia in an alkaline or acidic aqueous solution. Alternatively, a slurry without free abrasive grains may be used. When using a slurry without free abrasive grains, the polishing pad 12 may contain abrasive grains. An alkaline slurry or an acidic slurry is appropriately selected depending on the type of workpiece to be processed and the processing conditions. In the case of an alkaline slurry, for example, an alkaline aqueous solution containing an alkaline dispersant such as cerium is used. In the case of an acidic slurry, for example, an acidic aqueous solution containing an oxidizing agent such as hydrogen peroxide is used.

[0016] When CMP processing a wafer W in the CMP apparatus 10, the underside of the wafer W is suction-held on the holding surface of the holding table 11, and the holding table 11 is rotated by the table rotation mechanism 15. The spindle motor 18 is driven to rotate the spindle 16, and the lifting mechanism 19 is driven to lower the polishing unit 13, so that the polishing pad 12 is pressed against the upper surface of the wafer W while rotating. At this time, slurry S is delivered from the slurry supply source 21 to the flow path 20 and supplied to the contact point between the wafer W and the polishing pad 12. In this manner, the polishing pad 12 is pressed against the upper surface of the wafer W while the holding table 11 and the polishing pad 12 are rotated relative to each other, and the upper surface of the wafer W is CMP-processed while supplying the slurry S to the contact point. The position of the holding table 11 is moved horizontally by the horizontal movement mechanism 14, so that the entire upper surface of the wafer W is CMP-processed.

[0017] In CMP processing, the top surface of the wafer W is chemically treated by components contained in the slurry S, and is mechanically polished by abrasive grains contained in the slurry S or the polishing pad 12. By using both chemical and mechanical treatments, the polishing rate of the wafer W can be improved, and fine scratches remaining on the top surface of the wafer W after polishing can be reduced, resulting in a mirror finish.

[0018] When CMP processing is performed, polishing waste liquid containing used slurry S and polishing debris generated during processing is generated. The polishing waste liquid flows around the holding table 11 and is collected inside the CMP apparatus 10. The collected polishing waste liquid is discharged from the CMP apparatus 10 and undergoes various processes in the processing waste liquid treatment device 1 to regenerate pure water. The processing waste liquid treatment device 1 will be described with reference to FIGS. 1 and 3.

[0019] The CMP apparatus 10 is equipped with an outlet (not shown) for discharging polishing waste liquid, and the polishing waste liquid discharged from the outlet is stored in the polishing waste liquid tank 30 of the processing waste liquid treatment device 1. The method for sending the polishing waste liquid from the CMP apparatus 10 to the polishing waste liquid tank 30 is not limited. For example, the outlet of the CMP apparatus 10 and the polishing waste liquid tank 30 may be connected by a pipe so that the polishing waste liquid is sent directly from the CMP apparatus 10 to the polishing waste liquid tank 30. Alternatively, the polishing waste liquid tank 30 may be installed at a location away from the CMP apparatus 10, and when a certain amount of polishing waste liquid discharged from the CMP apparatus 10 has accumulated, the polishing waste liquid may be placed in a transport container and transported to the polishing waste liquid tank 30.

[0020] The polishing waste liquid stored in the polishing waste liquid tank 30 is sent to the polishing debris removal filter 32 at a predetermined pressure by the polishing waste liquid pump 31. The polishing debris removal filter 32 is a filter capable of collecting polishing debris generated during processing in the CMP apparatus 10, and the polishing debris is removed from the polishing waste liquid that passes through the polishing debris removal filter 32, and treated water is extracted. For example, the polishing debris removal filter 32 is made up of a bundle of many hollow fiber membranes, and a flow path is formed so that the polishing waste liquid flows from the outside to the inside of the hollow fiber membranes. In other words, the polishing debris is collected on the outer surface of the hollow fiber membranes. The flow path is blocked as the polishing debris is collected by the hollow fiber membranes. As a countermeasure, the polishing debris removal filter 32 receives air from an air source 38 (FIG. 3), which flows in the reverse direction through the flow path, temporarily separating the polishing debris collected on the outer surface of the hollow fiber membrane from the outer surface of the hollow fiber membrane. This allows the polishing debris to be collected by the polishing debris removal filter 32 while allowing the polishing waste liquid to pass through the hollow fiber membrane. In other words, the polishing debris removal filter 32 is periodically backwashed with air supplied from the air source 38, filtering the polishing debris from the polishing waste liquid. The polishing debris removal filter 32, which uses a hollow fiber membrane, has high filtering performance for capturing extremely fine particles and is capable of removing free abrasive grains contained in the slurry S. In other words, the polishing debris removed by the polishing debris removal filter 32 also includes free abrasive grains in the slurry S.

[0021] The treated water from which polishing debris has been removed by the polishing debris removal filter 32 is sent to a pH adjustment mechanism 33. The pH adjustment mechanism 33 neutralizes the pH of the treated water. As shown in FIG. 3, the pH adjustment mechanism 33 includes a control unit 40 and a pH meter 41. The pH of the treated water passing through a treated water flow path 42 is measured by the pH meter 41, and the pH value of the treated water measured by the pH meter 41 is input to the control unit 40. The pH meter 41 is a measuring instrument that measures the pH of the treated water based on the potential difference between a glass electrode and a reference electrode.

[0022] The pH adjustment mechanism 33 includes a first storage section 43 that stores an alkaline neutralizing agent and a second storage section 44 that stores an acidic neutralizing agent. The alkaline neutralizing agent stored in the first storage section 43 is a treatment agent that has the effect of raising the pH of the treated water, such as sodium hydroxide or ammonia gas. By adding an alkaline neutralizing agent to acidic treated water, the pH can be raised and the water can be neutralized. The acidic neutralizing agent stored in the second storage section 44 is a treatment agent that has the effect of lowering the pH of the treated water, such as carbon dioxide gas. By adding an acidic neutralizing agent to alkaline treated water, the pH can be lowered and the water can be neutralized. Note that the types of alkaline neutralizing agent and acidic neutralizing agent used in the pH adjustment mechanism 33 are not limited to those described above.

[0023] The pH adjustment mechanism 33 neutralizes the treated water using either an in-pipe neutralization method, in which neutralization is performed within the piping of the treated water flow path 42, or a neutralization tank method, in which neutralization is performed in a tank (neutralization tank) connected to the treated water flow path 42. In the in-pipe neutralization method, an alkaline or acidic neutralizing agent is added to the treated water passing through the treated water flow path 42, and the treated water after the neutralizing agent is added is stirred by an agitator placed midway along the treated water flow path 42 before being sent to the pH measuring device 41. In the neutralization tank method, a predetermined amount of treated water is stored in a tank placed midway along the treated water flow path 42, and an alkaline or acidic neutralizing agent is added to the tank and stirred by the agitator. In the case of the neutralization tank method, the pH measuring device 41 may measure the pH of the treated water in the tank after it has been stirred by the agitator.

[0024] The control unit 40 controls the operation of the aperture adjustment valve 45 connected to the first storage unit 43, and by opening the aperture adjustment valve 45, supplies an alkaline neutralizing agent to the treated water passing through the treated water flow path 42 or to the treated water in the tank. The amount of alkaline neutralizing agent supplied is controlled according to the aperture of the aperture adjustment valve 45 and the length of time that the aperture adjustment valve 45 is open. The control unit 40 also controls the operation of the aperture adjustment valve 46 connected to the second storage unit 44, and by opening the aperture adjustment valve 46, supplies an acidic neutralizing agent to the treated water passing through the treated water flow path 42 or to the treated water in the tank. The amount of acidic neutralizing agent supplied is controlled according to the aperture of the aperture adjustment valve 46 and the length of time that the aperture adjustment valve 46 is open.

[0025] The control unit 40 detects the pH of the treated water after the addition of the alkaline neutralizing agent or acid neutralizing agent using a pH meter 41, and controls the operation of the aperture adjustment valve 45 or the aperture adjustment valve 46 so that the pH of the treated water becomes neutral. Specifically, if the control unit 40 detects that the treated water is acidic, it opens the aperture adjustment valve 45 to supply the alkaline neutralizing agent from the first reservoir 43, and continues to supply the alkaline neutralizing agent until the pH of the treated water detected by the pH meter 41 becomes neutral (pH = 7). If the control unit 40 detects that the treated water is alkaline, it opens the aperture adjustment valve 46 to supply the acid neutralizing agent from the second reservoir 44, and continues to supply the acid neutralizing agent until the pH of the treated water detected by the pH meter 41 becomes neutral (pH = 7).

[0026] In this way, the pH of the treated water is adjusted to neutral in the pH adjustment mechanism 33. The treated water whose pH has been adjusted to neutral is sent from the pH adjustment mechanism 33 to the pure water production unit 34, where pure water is produced from the treated water. The pure water production unit 34 includes an ultraviolet unit 35, an ion exchange unit 36, and a precision filter 37.

[0027] The ultraviolet unit 35 irradiates the treated water with ultraviolet rays to sterilize it and decompose organic impurities. The treated water irradiated with ultraviolet rays by the ultraviolet unit 35 is sent to the ion exchange unit 36. The ion exchange unit 36 ​​is equipped with an ion exchange resin, which is a synthetic resin with ion exchange groups. The treated water passes through the ion exchange resin, and the ions are exchanged, resulting in purified water. The purified water from the ion exchange unit 36 ​​is sent to a precision filter 37. The precision filter 37 filters out fine foreign matter, such as resin debris (debris generated by the ion exchange resin), that is mixed in the pure water. The ion exchange unit 36 ​​may be an electrically regenerated ion exchange unit that performs ion exchange using power, as disclosed in JP 2021-030362 A.

[0028] When pure water is produced from treated water by treatment with an ion exchange resin in the ion exchange unit 36 ​​of the pure water production unit 34, the treated water is required to have a neutral pH. In the machining waste liquid treatment device 1, the treated water is neutralized by pH adjustment using the pH adjustment mechanism 33 before being purified by the pure water production unit 34, so that the treated water with a neutral pH can be passed through the ion exchange resin in the ion exchange unit 36 ​​and properly treated.

[0029] As described above, the processing waste fluid treatment device 1 removes polishing debris from the polishing waste fluid using the polishing debris removal filter 32 to extract treated water, adjusts the pH of the treated water to neutral using the pH adjustment mechanism 33, and generates pure water from the treated water using the pure water generation unit 34. Therefore, the processing waste fluid treatment device 1 can treat alkaline or acidic polishing waste fluid discharged from a CMP apparatus 10 that supplies slurry S to polish wafers W, thereby regenerating pure water. Conventionally, the treated water extracted by removing polishing debris from the polishing waste fluid discharged from the CMP apparatus was reused as slurry, but this method was limited in that pure water could not be regenerated from the polishing waste fluid because the polishing waste fluid contained alkaline or acidic slurry. In contrast, the processing waste fluid treatment device 1 of this embodiment allows polishing waste fluid containing slurry to be regenerated as pure water.

[0030] 4, a processing waste liquid treatment apparatus 2 of the second embodiment treats a mixed waste liquid of polishing waste liquid containing polishing debris discharged from a CMP apparatus 10 and processing waste liquid discharged from a processing apparatus 50 other than the CMP apparatus 10, to regenerate pure water. The configuration and operation of the CMP apparatus 10 are the same as those of the first embodiment, and therefore a description thereof will be omitted.

[0031] The processing device 50 processes a wafer, which is a workpiece, by bringing a processing tool into contact with the wafer, and processes the wafer by supplying pure water as a processing fluid to the processing point where the processing tool comes into contact with the wafer. Specifically, the processing device 50 cuts or grinds the wafer by bringing a processing tool such as a cutting tool, cutting blade, or grinding wheel into contact with the wafer, and supplies pure water to the processing point to remove processing heat and processing debris. The pure water supplied to the processing point contains processing debris, etc., and generates processing waste liquid.

[0032] The CMP apparatus 10 and the processing apparatus 50 can be mounted on a single processing system, with the CMP apparatus 10 functioning as a CMP processing mechanism and the processing apparatus 50 functioning as a processing mechanism that performs processing other than CMP. For example, the processing apparatus 50 is a grinding mechanism that performs grinding processing on wafers, and is configured such that by rotating a turntable provided in the processing system, a wafer held on a holding table moves to a first processing position where it undergoes grinding processing by the processing apparatus 50 and a second processing position where it undergoes CMP processing by the CMP apparatus 10. Then, the wafer that has undergone grinding processing by the processing apparatus 50 at the first processing position is transported to the second processing position where it undergoes CMP processing by the CMP apparatus 10.

[0033] A mixed waste liquid obtained by mixing a machining waste liquid discharged from the machining apparatus 50 and containing machining debris with a polishing waste liquid discharged from the CMP apparatus 10 and containing polishing debris is stored in a waste liquid tank 51 of the machining waste liquid treatment apparatus 2. The mixed waste liquid stored in the waste liquid tank 51 is sent to a removal filter 53 by a waste liquid pump 52. The removal filter 53 removes the machining debris and polishing debris from the mixed waste liquid, and treated water is extracted. The configuration and function of the removal filter 53 are similar to those of the polishing debris removal filter 32 of the first embodiment described above.

[0034] The treated water from which machining debris and polishing debris have been removed by the removal filter 53 is sent to a pH adjustment mechanism 54. The pH adjustment mechanism 54 has the same configuration and function as the pH adjustment mechanism 33 of the first embodiment described above, and a control unit (not shown) controls the addition of an alkaline neutralizer or an acid neutralizer according to the pH value of the treated water measured by a pH measuring device (not shown), thereby adjusting the pH of the treated water to neutral.

[0035] The treated water, the pH of which has been adjusted to neutral by the pH adjustment mechanism 54, is sent to the pure water generation unit 55, which generates pure water from the treated water. The pure water generation unit 55 includes an ultraviolet unit 56, an ion exchange unit 57, and a precision filter 58. Similar to the pure water generation unit 34 of the first embodiment, the pure water generation unit 55 sterilizes the treated water by irradiating it with ultraviolet light using the ultraviolet unit 56, decomposes organic impurities, exchanges ions in the treated water using the ion exchange resin in the ion exchange unit 57 to purify it into pure water, and filters out fine foreign matter such as resin debris that has been mixed in the pure water using the precision filter 58.

[0036] As described above, the machining waste fluid treatment device 2 of the second embodiment removes machining debris and polishing debris from a mixed waste fluid of polishing waste fluid discharged from the CMP apparatus 10 and machining waste fluid discharged from the machining apparatus 50 using the removal filter 53 to extract treated water, neutralizes the pH of the treated water using the pH adjustment mechanism 54, and treats the neutralized treated water using the pure water generation unit 55 to generate pure water. In a machining system equipped with the CMP apparatus 10 and the machining apparatus 50, a conventional problem has been that when the polishing waste fluid discharged from the CMP apparatus 10 and the machining waste fluid discharged from the machining apparatus 50 are mixed, the mixed waste fluid cannot be recycled as pure water because the polishing waste fluid contains alkaline or acidic slurry. In contrast, by using the machining waste fluid treatment device 2 of this embodiment, the mixed waste fluid containing slurry can be recycled as pure water, and the recycled pure water can be reused as the machining fluid in the machining apparatus 50.

[0037] 5, a processing waste liquid treatment apparatus 3 of the third embodiment treats polishing waste liquid containing polishing debris discharged from a CMP apparatus 10 and processing waste liquid discharged from a processing apparatus 50 separate from the CMP apparatus 10 to reclaim pure water. The configuration and operation of the CMP apparatus 10 are the same as those of the first embodiment. Furthermore, the processing of wafers performed by the processing apparatus 50 includes cutting, grinding, etc., as in the second embodiment.

[0038] The machining waste liquid treatment device 3 includes a polishing waste liquid tank 60 that stores polishing waste liquid discharged from the CMP device 10, and a machining waste liquid tank 61 that stores polishing waste liquid discharged from the machining device 50. The polishing waste liquid stored in the polishing waste liquid tank 60 is sent by a polishing waste liquid pump 62 to a polishing debris removal filter 63, which removes polishing debris from the polishing waste liquid and extracts treated water. The machining waste liquid stored in the machining waste liquid tank 61 is sent by a machining waste liquid pump 64 to a machining debris removal filter 65, which removes polishing debris from the machining waste liquid and extracts treated water.

[0039] The treated water from which polishing debris has been removed by the polishing debris removing filter 63 is sent to a pH adjustment mechanism 66. The pH adjustment mechanism 66 has the same configuration and function as the pH adjustment mechanism 33 of the first embodiment described above, and a control unit (not shown) controls the addition of an alkaline neutralizer or an acid neutralizer according to the pH value of the treated water measured by a pH measuring device (not shown), thereby adjusting the pH of the treated water to neutral.

[0040] First treated water, from which polishing debris has been removed by the polishing debris removing filter 63 and whose pH has been adjusted to neutral by the pH adjusting mechanism 66, and second treated water, from which machining debris has been removed from machining wastewater by the machining debris removing filter 65, are combined and sent to a pure water production unit 67, where pure water is produced. The pure water production unit 67 includes an ultraviolet unit 68, an ion exchange unit 69, and a precision filter 70. Similar to the pure water production unit 34 of the first embodiment, the pure water production unit 67 sterilizes the treated water by irradiating it with ultraviolet rays using the ultraviolet unit 68 to decompose organic impurities, exchanges ions in the treated water with the ion exchange resin of the ion exchange unit 69 to purify it into pure water, and filters out fine foreign matter such as resin debris that has been mixed in the pure water using the precision filter 70.

[0041] As described above, the machining waste fluid treatment device 3 of the third embodiment includes, as waste fluid tanks, a polishing waste fluid tank 60 that stores polishing waste fluid discharged from the CMP device 10 and a machining waste fluid tank 61 that stores machining waste fluid discharged from the machining device 50. As waste fluid pumps, a polishing waste fluid pump 62 that sends polishing waste fluid from the polishing waste fluid tank 60 to the polishing debris removing filter 63 and a machining waste fluid pump 64 that sends machining waste fluid from the machining waste fluid tank 61 to the machining debris removing filter 65 are included. The polishing debris is removed from the polishing waste fluid stored in the polishing waste fluid tank 60 by the polishing debris removing filter 63, which is a first removal filter, to extract first treated water, and the pH of the first treated water is neutralized by the pH adjusting mechanism 66. Furthermore, the machining debris is removed from the machining waste fluid stored in the machining waste fluid tank 61 by the machining debris removing filter 65, which is a second removal filter, to extract second treated water. In this way, the polishing waste liquid and the machining waste liquid are treated separately in two systems to extract treated water, and then the respective treated waters are joined (mixed) and treated in the pure water production unit 67 to produce pure water. In other words, the machining waste liquid treatment device 3 of this embodiment neutralizes the treated water in the pH adjustment mechanism 66 when treating the polishing waste liquid, and then mixes the treated water (pH adjusted) obtained by treating the polishing waste liquid with the treated water obtained by treating the machining waste liquid, which is different from the machining waste liquid treatment device 2 of the second embodiment, which mixes the polishing waste liquid and the machining waste liquid before adjusting the pH.

[0042] Because the slurry used in CMP processing is an alkaline or acidic aqueous solution, the treated water obtained by simply removing polishing debris from the slurry-containing polishing wastewater cannot be reused as pure water. However, according to the processing wastewater treatment device of each of the above embodiments, the pH adjustment mechanism neutralizes the pH of the treated water, and then the water is purified, thereby making it possible to regenerate pure water from the polishing wastewater discharged from the CMP device. In recent years, various processing systems have been required to reuse the wastewater discharged after processing as much as possible and to discharge it in a manner that minimizes environmental impact. The processing wastewater treatment device to which the present invention is applied can meet these demands by regenerating the wastewater discharged from CMP processing as pure water.

[0043] The CMP apparatus may be configured as a stand-alone processing apparatus as in the first embodiment, or may be a CMP processing mechanism that configures a processing system together with other processing apparatuses as in the second and third embodiments. When the CMP apparatus configures a processing system together with other processing apparatuses, pure water can be reclaimed from the alkaline or acidic polishing waste liquid discharged from the CMP apparatus, and the pure water can be reused not only as a slurry in the CMP apparatus, but also as a processing liquid in the processing apparatus, which can greatly contribute to reducing the environmental load and operating costs.

[0044] The embodiments of the present invention are not limited to the above-described embodiments and modifications, and may be variously changed, substituted, or modified without departing from the spirit of the technical idea of ​​the present invention. Furthermore, if the technical idea of ​​the present invention can be realized in a different way due to technological advances or other derived technologies, it may be implemented using that method. Therefore, the claims cover all embodiments that may fall within the scope of the technical idea of ​​the present invention. [Industrial Applicability]

[0045] According to the processing waste liquid treatment device of the present invention, pure water can be regenerated from waste liquid discharged from processing equipment including a CMP device or a CMP processing mechanism, thereby reducing the environmental impact of CMP processing and realizing efficient use of pure water. [Explanation of symbols]

[0046] 1: Processing waste liquid treatment equipment 2: Processing waste liquid treatment equipment 3: Processing waste liquid treatment equipment 10:CMP equipment 11: Holding table 12: Polishing pad 13: Polishing unit 21: Slurry supply source 30: Polishing waste liquid tank 31: Polishing waste liquid pump 32: Polishing debris removal filter 33:pH adjustment mechanism 34: Pure water generation unit 35: Ultraviolet Unit 36: Ion exchange unit 37: Precision filter 40: Control section 41:pH measuring device 42: Treated water flow path 43: First storage section 44: Second storage section 45: Opening adjustment valve 46: Opening adjustment valve 50: Processing equipment 51: Waste liquid tank 52: Waste pump 53: Removal filter 54:pH adjustment mechanism 55: Pure water generation unit 56: Ultraviolet Unit 57: Ion exchange unit 58: Precision filter 60: Polishing waste liquid tank (waste liquid tank) 61: Processing waste liquid tank (waste liquid tank) 62: Polishing waste liquid pump (waste liquid pump) 63: Polishing debris removal filter (removal filter) 64: Processing waste fluid pump (waste fluid pump) 65: Processing debris removal filter (removal filter) 66:pH adjustment mechanism 67: Pure water generation unit 68: Ultraviolet Unit 69: Ion exchange unit 70: Precision filter S: Slurry W: wafer

Claims

1. A processing waste liquid treatment apparatus for treating polishing waste liquid containing at least polishing debris discharged from a CMP apparatus that supplies slurry to polish wafers, and regenerating pure water, comprising: The processing waste liquid treatment device comprises a polishing waste liquid tank for storing the polishing waste liquid, a polishing debris removal filter for removing at least polishing debris from the polishing waste liquid and extracting treated water, a polishing waste liquid pump for sending the polishing waste liquid from the polishing waste liquid tank to the polishing debris removal filter, a pH adjustment mechanism for neutralizing the pH of the treated water, and a pure water generation unit for generating pure water from the treated water adjusted by the pH adjustment mechanism.

2. A processing waste liquid treatment device for treating a mixed waste liquid of processing waste liquid containing processing debris discharged from a processing device that processes a wafer by supplying pure water to a processing point where a processing tool contacts the wafer, and polishing waste liquid containing polishing debris discharged from a CMP device that polishes the wafer by supplying slurry, and regenerating pure water, The processing waste liquid treatment device comprises a waste liquid tank for storing the mixed waste liquid, a removal filter for removing machining debris and polishing debris from the mixed waste liquid and extracting treated water, a waste liquid pump for sending the mixed waste liquid from the waste liquid tank to the removal filter, a pH adjustment mechanism for neutralizing the pH of the treated water, and a pure water production unit for producing pure water from the treated water whose pH has been adjusted by the pH adjustment mechanism.

3. the waste liquid tank includes a polishing waste liquid tank for storing the polishing waste liquid of the mixed waste liquid, and a processing waste liquid tank for storing the processing waste liquid; The removal filter includes a polishing debris removal filter that removes the polishing debris and extracts treated water, and a processing debris removal filter that removes the processing debris and extracts treated water, 3. The processing waste liquid treatment device according to claim 2, wherein the waste liquid pump comprises a polishing waste liquid pump that sends the polishing waste liquid from the polishing waste liquid tank to the polishing debris removal filter, and a processing waste liquid pump that sends the processing waste liquid from the processing waste liquid tank to the processing debris removal filter.

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