Air conditioning system

Abstract

The objective of this invention is to provide an air conditioning system in which an air conditioning outlet is provided on the upper floors of a facility and an air conditioning intake is provided on the lower floors, and in which heat emitted from equipment placed in the space to be air-conditioned can be efficiently exchanged using a coil. [Solution] By installing air-blocking members at some of the specified through-holes among the multiple through-holes that connect the upper floors with the floor one floor below, a path is formed in which air that passes through the multiple through-holes from the air conditioning outlet via a first heat-generating device is sucked into the air conditioning intake port via a second heat-generating device located on the floor one floor below the upper floor.

Description

[Technical Field]

[0001] The present invention relates to an air conditioning system. [Background technology]

[0002] In recent years, various air conditioning systems have been proposed (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 8-303029 Summary of the Invention [Problem to be solved by the invention]

[0004] For example, in factories where high levels of cleanliness are required for production lines, production equipment that handles raw materials and products may be located on upper floors, while auxiliary equipment such as auxiliary machinery for the production equipment may be located on lower floors. In the case of a semiconductor manufacturing factory, semiconductor manufacturing equipment that handles silicon wafers may be located on upper floors, while auxiliary equipment such as vacuum pumps and refrigerators required for the operation of the semiconductor manufacturing equipment may be located on lower floors. Because foreign particles such as dust floating in the air tend to settle downwards on average, locating production equipment that handles raw materials and products on upper floors and auxiliary equipment on lower floors minimizes the possibility of foreign particles being mixed into raw materials or products. In this case, it is preferable to locate the air conditioning system installed in the factory with its air conditioning outlets on upper floors and its air conditioning intakes on lower floors.

[0005] However, when the air conditioning outlet is located on an upper floor and the air conditioning intake is located on a lower floor, temperature stratification like that in displacement air conditioning does not occur. As a result, it is difficult to form a high-temperature area in the space to be air-conditioned, and it is not easy to efficiently exchange heat emitted from equipment located in the space to be air-conditioned with the coils of the air conditioning system.

[0006] In one aspect, the present disclosure has been made in consideration of this situation, and its purpose is to provide an air conditioning system in which air conditioning outlets are provided on the upper floors of a facility and air conditioning inlets are provided on the lower floors, and which is capable of efficiently exchanging heat emitted from equipment placed in the space to be air-conditioned using a coil. [Means for solving the problem]

[0007] In order to solve the above problem, in the present invention, air-blocking members are installed at some of the specified through-holes among the multiple through-holes that connect the upper floors with the floor one floor below, thereby forming a path through which air that passes through the multiple through-holes from the air conditioning outlet via a first heat generating device is sucked into the air conditioning intake port via a second heat generating device located on the floor one floor below the upper floor.

[0008] In detail, the present invention is an air conditioning system for a facility in which heat-emitting devices are located on each of multiple floors, and the air conditioning system comprises a plurality of air conditioning outlets arranged on the ceiling of the upper floor where the first heat-generating device is located and blowing air downward, an air conditioning intake port arranged on the lower floor of the facility, a heat exchange coil that exchanges heat with the air drawn in through the air conditioning intake port and sent to the air conditioning outlet, a plurality of through-holes arranged on the floor of the upper floor for connecting the upper floor with the floor one level below, and air-blocking members installed at certain of the plurality of through-holes, the air-blocking members being installed at certain selected through-holes so as to form a path through which air that has passed from the air conditioning outlet via the first heat-generating device and passed through the plurality of through-holes is drawn into the air conditioning intake port via a second heat-generating device located on the floor one level below the upper floor.

[0009] Here, the term "heat-generating device" refers to a device that generates heat during operation, such as production equipment that uses air cooling to cool the heat generated during operation. The term "first heat-generating device" refers to a heat-generating device located on an upper floor, and is a concept that encompasses not only a single type of device but also multiple types of devices located on an upper floor. The term "second heat-generating device" refers to a heat-generating device located on the floor one floor below the upper floor, and is a concept that encompasses not only a single type of device but also multiple types of devices located on the floor one floor below the upper floor. The term "air-blocking member" refers to a member that blocks airflow through a through-hole, such as a non-perforated panel that obstructs airflow. The term "upper floor" refers to a floor above the area targeted by the air-conditioning system, and does not refer to the top floor in a building that has floors above the area targeted by the air-conditioning system. The same applies to the term "lower floor," and is a lower floor within the area targeted by the air-conditioning system, and does not refer to the bottom floor in a building that has floors below the area targeted by the air-conditioning system.

[0010] In the above air conditioning system, air blown downward from the air conditioning outlets arranged on the ceiling of the upper floor passes through the first heat generating device located on the upper floor, then passes through the second heat generating device located on the floor one floor below the upper floor, and is then drawn into the air conditioning intake. As a result, the air drawn into the air conditioning intake becomes hotter, and the heat from each heat generating device can be efficiently exchanged by the heat exchange coil.

[0011] In addition, the through opening may be a first through opening, and the air-blocking member may be a first air-blocking member, arranged on the floor of the floor one level below the upper floor, and further comprising a plurality of second through openings for connecting the floor one level below the upper floor with the floor one level below, and second air-blocking members installed at certain of the plurality of second through openings, and the second air-blocking members may be installed at certain selected second through openings so as to form a path through which air that has passed through the plurality of second through openings from the plurality of first through openings via a second heat generating device is sucked into an air conditioning intake port via a third heat generating device located on the floor two levels below the upper floor.

[0012] Here, the third heat generating device is a heat generating device located two floors below the upper floor, and is a concept that includes not only a single type of device located two floors below the upper floor, but also multiple types of devices.

[0013] In the above air conditioning system, air blown downward from air conditioning outlets arranged on the ceiling of the upper floor passes through a first heat generating device located on the upper floor, then passes through a second heat generating device located on the floor one floor below the upper floor, and then passes through a third heat generating device located two floors below the upper floor before being drawn into the air conditioning intake. As a result, the air drawn into the air conditioning intake becomes hotter, realizing efficient heat exchange in the heat exchange coil, and allowing the heat of each heat generating device to be efficiently exchanged by the heat exchange coil.

[0014] Furthermore, at least a portion of the second air-blocking member may be installed in a different position from the first air-blocking member when the facility is viewed from above. By locating the second air-blocking member in such a position, heat from each heat-generating device can be efficiently exchanged by the heat exchange coil.

[0015] Furthermore, the floor two floors below the upper floor may be a lower floor, and the second air-blocking member may be installed in a predetermined second through-hole located away from the air conditioning intake port. By locating the second air-blocking member in such a position, heat from each heat-generating device can be efficiently exchanged by the heat exchange coil.

[0016] The airflow blocking member may be installed in a predetermined through-hole selected according to the heat generation amount of each of the first heat generating device and the second heat generating device. If the airflow blocking member is arranged in this manner, an air path according to the heat generation amount of each heat generating device is formed, and the heat of each heat generating device can be efficiently exchanged by the heat exchange coil.

[0017] Furthermore, the number of air blocking members installed in a predetermined number of through-holes may be determined based on the volume of air blown out from the plurality of air conditioning outlets. If the number of air blocking members to be installed is determined in this manner, it becomes possible to ensure an airflow volume at the through-holes that corresponds to the volume of air blown out from the air conditioning outlets.

[0018] The first heating device may have a front portion that receives operation by an operator, and the air blocking member may be installed in a through-hole other than the one corresponding to the front portion. If the air blocking member is positioned in this manner, the front portion can be kept at a lower temperature than the other portions.

[0019] The air conditioning system may further include a breathable closing member installed at a through hole other than a predetermined through hole among the plurality of through holes. Here, the breathable closing member is a member that closes the through hole while maintaining breathability, such as a perforated panel that allows air to pass through. If such a breathable closing member is installed at the through hole, it becomes possible to close the through hole while ensuring breathability of the through hole.

[0020] The air conditioning system may further include an outdoor air conditioning unit having a dehumidifying coil that cools and dehumidifies the outdoor air to be supplied into the facility, and a reheating coil that heats the outdoor air that has passed through the dehumidifying coil with a heat medium that has passed through a heat exchanger coil. This allows the outdoor air to be reheated using heat from the heat generating device recovered by the heat exchanger coil, thereby enabling effective use of heat. [Effects of the Invention]

[0021] In the above air conditioning system, when the air conditioning outlet is located on the upper floor of the facility and the air conditioning intake is located on the lower floor, the heat emitted from the equipment placed in the space to be air-conditioned can be efficiently heat exchanged using the coil. [Brief explanation of the drawings]

[0022] [Figure 1] FIG. 1 is a schematic diagram of an air conditioning system according to an embodiment. [Figure 2] Figure 2 is a system diagram of the heat source system. [Figure 3] FIG. 3 is a diagram showing an example of airflow in a factory building. [Figure 4]FIG. 4 shows an example of the simulation results of temperature distribution inside a factory building. [Figure 5] FIG. 5 is a diagram showing a modified example of airflow in a factory building. DETAILED DESCRIPTION OF THE INVENTION

[0023] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The following describes embodiments of the present invention. The embodiments described below are merely examples of the present invention, and the technical scope of the present invention is not limited to the following aspects.

[0024] <Embodiment> FIG. 1 is a schematic diagram of an air conditioning system according to an embodiment. The air conditioning system 1 is a system that conditions the air inside a factory building B having multiple floors. In this embodiment, the factory building B that is air-conditioned by the air conditioning system 1 is illustrated as a building having three floors: a first floor F1, a second floor F2, and a third floor F3. However, the application of the air conditioning system 1 is not limited to buildings having three floors. The air conditioning system 1 may also be applied to buildings having two floors, or to buildings having four or more floors. Furthermore, in this embodiment, all three floors of the factory building B are areas that are to be air-conditioned by the air conditioning system 1, but there may be floors that are not to be air-conditioned by the air conditioning system 1.

[0025] In this embodiment, a semiconductor manufacturing factory is used as an example of factory building B. A high level of cleanliness is required for clean rooms in which semiconductor manufacturing equipment such as etching equipment and CVD (Chemical Vapor Deposition) equipment is installed. Furthermore, various peripheral equipment, such as vacuum pumps and refrigerators, is required to operate the semiconductor manufacturing equipment. The peripheral equipment does not require the same high level of cleanliness as the semiconductor manufacturing equipment. Therefore, in this embodiment, semiconductor manufacturing equipment M3, which handles raw materials and products such as semiconductor wafers and chemicals, is located on the third floor F3, an upper floor, and auxiliary equipment M1 and M2 associated with semiconductor manufacturing equipment M3 are located on the second floor F2 and the first floor F1, respectively, of the lower floors. Since foreign matter such as dust floating in the air tends to settle downwards on average, if the semiconductor manufacturing equipment M3 that handles raw materials and products is placed on the third floor F3 on the upper floor, the auxiliary equipment M2 is placed on the second floor F2 on the lower floor, and the auxiliary equipment M1 is placed on the first floor F1 on the lower floor, the possibility of foreign matter being mixed into the raw materials and products can be minimized.

[0026] Factories requiring such high levels of cleanliness are not limited to semiconductor manufacturing factories. The air conditioning system 1 of this embodiment may also be applied to factories that manufacture lithium-ion batteries, precision optical equipment, and various other industrial products.

[0027] In a factory building B, where semiconductor manufacturing equipment M3, which handles raw materials and finished products, is located on the upper third floor F3, auxiliary equipment M2 is located on the lower second floor F2, and auxiliary equipment M1 is located on the lower first floor F1, it is preferable that the air conditioning system 1 installed in the factory building B also have its air conditioning outlets located on the upper floors and its air conditioning inlets located on the lower floors. Furthermore, the semiconductor manufacturing equipment M3 must meet the required temperature conditions for operation. For this reason, in the air conditioning system 1 of this embodiment, through-holes are provided in the floors of the third floor F3 and the second floor F2 for ventilation to the floors below. Air (cooled air) blown out from the air outlet units 2 arranged on the ceiling of the third floor F3 flows down the third floor F3, the second floor F2, and the first floor F1 in that order, forming a circulation path that returns the air from the air inlet units 3 installed on the first floor F1 to the air outlet units 2 via the return shaft RS. The through-holes on the floors of the third floor F3 and the second floor F2 are appropriately fitted with ventilation panels 4 and ventilating panels 5. The ventilation panels 4 are non-ventilating, non-perforated plates strong enough to withstand the weight of people and goods, such as steel plates. The ventilation panels 5 are breathable plates strong enough to withstand the weight of people and goods, such as grid-like metal plates such as gratings, or perforated punched metal plates. Therefore, in this embodiment, of the multiple through-holes on the floors of the third floor F3 and the second floor F2, only the locations where the ventilation panels 5 are installed are ventilation-enabled. The air-conditioning system 1 also includes an outdoor air-conditioning unit that takes in outside air, purifies it, adjusts the temperature and humidity, and supplies the air into the factory building B. As a result, within factory building B, the air blown out from air outlet unit 2 collects heat from semiconductor manufacturing equipment M3 as it passes through the third floor F3, collects heat from auxiliary equipment M2 as it passes through the second floor F2, and collects heat from auxiliary equipment M1 as it passes through the first floor F1, before flowing into air inlet unit 3. The air containing the heat from semiconductor manufacturing equipment M3 and auxiliary equipment M1, M2 is cooled by coils built into air inlet unit 3 and air outlet unit 2. Note that, in order not to impede the flow of air from the third floor F3 to the first floor F1, the number of ventilation blocking panels 4 is preferably determined according to the volume of air blown out from air outlet unit 2.

[0028] The air outlet unit 2 is a fan coil unit air conditioner that integrates a fan and a coil. The air outlet units 2 are arranged vertically and horizontally on the ceiling surface of the third floor F3, and blow air (cool air) directly downward. The air outlet unit 2 may be a DCFCU that uses a DC motor, or may be an air conditioner of another type. The air outlet unit 2 may also be provided with a filter that collects dust in the air and purifies the air.

[0029] The air intake unit 3 is an air conditioner with a built-in coil. The outlets 3 are arranged on the wall of the first floor F1, and use coils to cool the air flowing from the first floor F1 to the return shaft RS. Air circulation within the factory building B is basically performed by the fan of the outlet unit 2. For this reason, the inlet unit 3 is not equipped with a fan. However, an inlet unit 3 equipped with a fan may be used as appropriate depending on the capacity of the fan of the outlet unit 2 and the air flow rate within the return shaft RS. The inlet unit 3 may also be equipped with a filter that captures dust in the air and purifies the air. In this embodiment, the inlet unit 3 is installed on the wall of the first floor F1, but the inlet unit 3 may also be installed on the floor of the first floor F1 or elsewhere.

[0030] In the air conditioning system 1 of this embodiment, the air follows this path within the factory building B, so the air drawn into the air inlet unit 3 is relatively hot. For this reason, in this embodiment, the heat in the air recovered by the coil of the air inlet unit 3 is used as a heat source for the hot water system. In this embodiment, the air blown out from the air outlet unit 2 follows a path that recovers heat from the semiconductor manufacturing equipment M3, the auxiliary equipment M2, and the auxiliary equipment M1 in that order. Therefore, compared to recovering heat from an air conditioning air inlet provided on each floor, for example, it is possible to recover higher temperature heat, making this system suitable for use as a heat source for the hot water system.

[0031] Fig. 2 is a system diagram of a heat source system. The air conditioning system 1 is equipped with a heat source system 8 as shown in Fig. 2. The heat source system 8 is equipped with, for example, a heat medium system 8A, a cooling water system 8B, and a hot water system 8C.

[0032] The heat transfer medium system 8A is a system through which a heat transfer medium circulates to supply cold and hot heat to equipment that handles the air to be conditioned, such as the air outlet unit 2, the air inlet unit 3, and the outdoor air-conditioning unit 6. The heat transfer medium system 8A is equipped with a refrigerator 8A1 for producing cold, a heat transfer medium circulation pump 8A2 for circulating the heat transfer medium, a heat transfer medium supply header 8A3 that sends the heat transfer medium to each air-conditioning equipment, and a heat transfer medium return header 8A4 to which the heat transfer medium distributed to each air-conditioning equipment is returned. In the heat transfer medium system 8A, the heat transfer medium that has passed through the evaporator of the refrigerator 8A1 is sent to the heat transfer medium supply header 8A3 by the heat transfer medium circulation pump 8A2, which is installed midway along the heat transfer medium piping 8A10 that connects the refrigerator 8A1 to the heat transfer medium supply header 8A3. The heat medium sent to the heat medium supply header 8A3 flows to the heat medium pipe 8A20 connected to the coil 2C of the outlet unit 2, the heat medium pipe 8A12 connected to the coil 3C of the inlet unit 3, and the heat medium pipe 8A13 connected to the cooling coil 6C of the outdoor-air-conditioning unit 6. The heat medium that flows to the coil 2C of the outlet unit 2 returns to the heat medium return header 8A4 through the heat medium pipe 8A21, the heat medium that flows to the coil 3C of the inlet unit 3 returns to the heat medium return header 8A4 through the heat medium pipe 8A15, and the heat medium that flows to the cooling coil 6C of the outdoor-air-conditioning unit 6 returns to the heat medium return header 8A4 through the heat medium pipe 8A16. The heat medium that returns to the heat medium return header 8A4 passes through the heat medium pipe 8A11 and passes through the evaporator of the chiller 8A1 again. In Figure 2, the heat transfer medium system 8A is provided with only one outlet unit 2, one inlet unit 3, one outdoor air conditioning unit 6, and one chiller 8A1, but any number of devices, valves, pipes, and pumps may be provided in the heat transfer medium system 8A.

[0033] The cooling water system 8B is a system through which cooling water circulates to cool the condenser of the chiller 8A1 provided in the heat transfer medium system 8A. The cooling water system 8B is equipped with a cooling water circulation pump 8B1 for circulating the cooling water and a cooling tower 8B2 for cooling the cooling water. In the cooling water system 8B, the heat transfer medium that has passed through the condenser of the chiller 8A1 is sent to the cooling tower 8B2 by the cooling water circulation pump 8B1 provided midway through the cooling water piping 8B4 connecting the chiller 8A1 to the cooling tower 8B2. The cooling water sent to the cooling tower 8B2 drips from the top of the cooling tower 8B2 and accumulates at the bottom of the cooling tower 8B2. The cooling water that has accumulated at the bottom of the cooling tower 8B2 flows back to the condenser of the chiller 8A1 through the cooling water piping 8B3. The cooling tower 8B2 is provided with an electric fan capable of generating an updraft inside, and the electric fan starts and stops appropriately depending on the temperature of the cooling water flowing through the cooling water pipe 8B3, thereby cooling the cooling water by the principle of heat of vaporization. The on / off of the chiller is preferably controlled so that the temperature of the cooling water flowing through cooling water piping 8B3 is at a temperature that maximizes the operating efficiency of chiller 8A1. Cooling tower 8B2 is also provided with a water supply means such as a ball tap valve that supplies cooling water so that the level of cooling water pooling in the bottom of cooling tower 8B2 is maintained at a constant level. Although Fig. 2 shows only one chiller 8A1, one cooling tower 8B2, and one cooling water circulation pump 8B1 in chiller system 8B, various devices, valves, piping, and pumps are provided in chiller system 8B as appropriate.

[0034] The hot water system 8C is a system that supplies hot water to various locations in the factory building B in which the air conditioning system 1 is installed. An appropriate heat source is used for the hot water system 8C. Examples of heat sources that can be used for the hot water system 8C include heat from heat source equipment such as a heat pump or a boiler, and exhaust heat generated by utility equipment such as a compressor.

[0035] When heating air in an air conditioning system, hot water generated by a hot water system 8C is typically used. However, in the air conditioning system 1 of this embodiment, the heat medium that has passed through the coil 2C flows through the heating coil 6B and reheat coil 6D of the outdoor air-conditioning unit 6, which processes outdoor air, thereby reducing the power required to heat the air. That is, as shown in the system diagram of FIG. 2, the heat medium pipe 8A14 is connected as a branch path to the heat medium pipe 8A15 connecting the coil 2C to the heat medium return header 8A4, for dividing the heat medium to the heating coil 6B and reheat coil 6D. The heat medium that branches off to the heat medium pipe 8A14 then flows to the heating coil 6B and reheat coil 6D via the heat medium pipe 8A18. The heat medium that passes through the heating coil 6B and reheat coil 6D then rejoins the heat medium pipe 8A15 via the heat medium pipe 8A19 and flows to the heat medium return header 8A4.

[0036] As described above, the heat medium system 8A of the heat source system 8 is provided with a path for sending the heat medium that has passed through coil 3C to the heating coil 6B and the reheat coil 6D. Therefore, when heat is generated from semiconductor manufacturing equipment M3 and auxiliary equipment M1 and M2 due to the operation of each facility installed in factory building B, the generated heat heats the indoor air, which then heats the heat medium that passes through coil 3C. Because the heat medium system 8A is provided with a path for sending the heat medium that has passed through coil 3C to the heating coil 6B and the reheat coil 6D, the heat medium heated in coil 3C flows from coil 3C to the heating coil 6B and the reheat coil 6D, heating outside air in the heating coil 6B and also heating air cooled by the cooling coil 6C, which dehumidifies the outside air, in the reheat coil 6D. Therefore, according to the air conditioning system 1, the heat generated by the semiconductor manufacturing equipment M3 and the auxiliary equipment M1, 2 is effectively utilized to heat the outside air taken in by the outdoor air conditioning unit 6 and to heat the air after it has been dehumidified by the cooling coil 6C, thereby reducing the air conditioning energy consumed by the entire air conditioning system 1.

[0037] In the heat medium system 8A of this embodiment, the heat medium that has passed through the coil 3C flows through the heating coil 6B and reheat coil 6D of the outdoor air-conditioning unit 6, heating the air in the outdoor air-conditioning unit 6. Therefore, for example, the system configuration is simpler than when a two-stage heat transport system is adopted in which the heat medium that passes through the coil 3C and the heat medium that passes through the heating coil 6B and reheat coil 6D are separated and heat is exchanged between the systems of each heat medium using a heat pump or the like. Therefore, the energy required to transport heat from the coil 3C to the reheat coil 6D is reduced as much as possible.

[0038] To prevent the air passing through the reheat coil 6D from being overcooled, the heat transfer medium system 8A is provided with regulating valves 8A8 and 8A9 that regulate the flow rate of the heat transfer medium passing through the reheat coil 6D. The regulating valves 8A8 and 8A9 are valves whose openings are adjusted based on the measurement value of a temperature sensor 8A7 that measures the temperature of the heat transfer medium passing through the reheat coil 6D. For example, if the measurement value of the temperature sensor 8A7 is higher than the set value, the opening of the regulating valve 8A8 is decreased, and the opening of the regulating valve 8A9 is increased. For example, if the measurement value of the temperature sensor 8A7 is lower than the set value, the opening of the regulating valve 8A8 is increased, and the opening of the regulating valve 8A9 is decreased. This allows the air passing through the reheat coil 6D to be adjusted to an appropriate temperature.

[0039] In addition, in preparation for cases where the heat generated by semiconductor manufacturing equipment M3 is insufficient to heat the heat medium passing through coil 3C due to reasons such as semiconductor manufacturing equipment M3 being shut down or just starting up, heat source system 8 is provided with a means for heating the heat medium flowing from coil 3C to heating coil 6B and reheat coil 6D with the heat of hot water from hot water system 8C. That is, heat source system 8 is provided with heat exchanger 8C2 between heat medium piping 8A14 and heat medium piping 8A18 of heat medium system 8A for heat exchange with the hot water of heat source system 8, and adjustment valve 8A17 in a bypass path for increasing or decreasing the flow rate of the heat medium passing through heat exchanger 8C2. In addition, hot water system 8C is provided with adjustment valve 8C1 for adjusting the flow rate of hot water from heat exchanger 8C2 in response to a measurement value from temperature sensor 8A6 that measures the temperature of the heat medium flowing from heat exchanger 8C2 to heat medium piping 8A18 so that the heat medium passing through heat exchanger 8C2 reaches a predetermined temperature. In addition, heat transfer medium piping 8A14 is provided with a heat transfer medium booster pump 8A5 to compensate for insufficient flow rate due to pressure loss when the heat transfer medium passes through heat exchanger 8C2. Adjustment valve 8A17 controls the flow rate of the heat transfer medium passing through heating coil 6B and reheat coil 6D by increasing or decreasing its valve opening to maintain an appropriate pressure difference between heat transfer medium piping 8A14 and heat transfer medium piping 8A18. For example, if the heat generated by semiconductor manufacturing equipment M3 is not sufficient to heat the heat transfer medium passing through coil 3C and the heat transfer medium passing through coil 3C is below a predetermined temperature, the adjustment valve 8C1 is opened and closed until the heat transfer medium passing through heat exchanger 8C2 reaches the predetermined temperature. This allows the heat transfer medium flowing from coil 3C to heating coil 6B and reheat coil 6D to be heated by the hot water in hot water system 8C. Furthermore, for example, if the heat medium passing through coil 3C is sufficiently heated by the heat generated from semiconductor manufacturing equipment M3 and the heat medium passing through coil 3C is at or above a predetermined temperature, the opening of adjustment valve 8C1 is reduced so that the heat medium passing through heat exchanger 8C2 becomes below the predetermined temperature, causing adjustment valve 8C1 to close, and the heat medium flowing from coil 3C to heating coil 6B and reheat coil 6D is not heated by the heat of the hot water in hot water system 8C.Because the heat source system 8 is configured in this manner, the air conditioning system 1 is able to reduce the air conditioning energy consumed by the entire air conditioning system 1 when the semiconductor manufacturing equipment M3 is operating, while supplying air at an appropriate temperature from the outdoor air conditioning unit 6 to the area to be air-conditioned immediately after the semiconductor manufacturing equipment M3 is stopped or started.

[0040] For example, as shown in Figure 2, a case will be described where the temperature of the heat medium in the heat medium supply header 8A3 is designed to be 14°C. When the target temperature value of the heat medium set in the controller of the chiller 8A1 is 14°C, the heat medium in the heat medium supply header 8A3 will be 14°C. As described above, the 14°C heat medium in the heat medium supply header 8A3 is sent to the coil 2C of the outlet unit 2, the coil 3C of the inlet unit 3, and the cooling coil 6C of the outdoor air-conditioning unit 6. The 14°C heat medium sent to the cooling coil 6C of the outdoor air-conditioning unit 6 cools the outside air flowing into the outdoor air-conditioning unit 6 by the suction of the electric fan 6E.

[0041] Meanwhile, the 14°C heat medium sent to coil 3C of air inlet unit 3 is heated to, for example, about 26°C by cooling the air flowing into air inlet unit 3. As described above, the heat medium heated to about 26°C in coil 3C is sent from coil 3C to heating coil 6B and reheat coil 6D. Therefore, in outdoor air-conditioning unit 6, outside air flowing into outdoor air-conditioning unit 6 is heated by the 26°C heat medium in heating coil 6B. Also, in outdoor air-conditioning unit 6, outside air cooled by the 14°C heat medium in cooling coil 6C is heated by the 26°C heat medium in reheat coil 6D.

[0042] In the air conditioning system 1 of this embodiment, the heat medium that branches off from the heat medium supply header 8A3 and is diverted to the air inlet unit 3 and the outdoor air-conditioning unit 6 is not returned directly to the heat medium return header 8A4, but part of the heat medium that has passed through the air inlet unit 3 is used for heating in the outdoor air-conditioning unit 6. Therefore, with a simple system configuration, the air-conditioning energy required for heat transport is reduced as much as possible, and the heat contained in the indoor air is effectively utilized.

[0043] FIG. 3 is a diagram showing an example of airflow within a factory building B. In the air conditioning system 1 of this embodiment, air outlet units 2 are arranged vertically and horizontally on the ceiling surface of the third floor F3 to satisfy the temperature conditions of each piece of semiconductor manufacturing equipment M3 installed on the third floor F3. Furthermore, in the air conditioning system 1 of this embodiment, in order to efficiently recover exhaust heat from the semiconductor manufacturing equipment M3 and the accessories M1 and M2 in the air inlet unit 3, air flow paths within the factory building B are formed using the air-blocking panels 4 and the ventilation panels 5 so that air blown out from the air outlet units 2 flows through the semiconductor manufacturing equipment M3, the accessories M2, and the accessories M1 in this order. In order to form such air flow paths, in the air conditioning system 1 of this embodiment, when viewed from above the factory building B, at least some of the air-blocking panels 4 installed in the through holes in the floor of the second floor F2 are positioned differently from the air-blocking panels 4 installed in the through holes in the floor of the third floor F3. For example, in the configuration illustrated in FIG. 3 , an air blocking panel 4 is installed in the through-hole on the second floor F2 directly below the location where the ventilation panel 5 is installed on the floor of the third floor F3, and a ventilation panel 5 is installed in the through-hole on the third floor F3 directly below the location where the air blocking panel 4 is installed. In this embodiment, by installing the air blocking panels 4 and the ventilation panels 5 in the through-holes in a staggered relationship between the upper and lower floors, air blown downward from the air outlet unit 2 is prevented from flowing downward from the third floor F3 to the first floor F1 without passing through the semiconductor manufacturing equipment M3 and the auxiliary machines M1 and M2. In this embodiment, by installing the air blocking panels 4 and the ventilation panels 5 in the through-holes in a staggered relationship between the upper and lower floors, air blown downward from the air outlet unit 2 passes through the semiconductor manufacturing equipment M3, the auxiliary machines M2, and the auxiliary machines M1 in this order before being drawn into the air inlet unit 3, thereby increasing the temperature of the air drawn into the air inlet unit 3. If the air drawn into the suction port unit 3 is heated, efficient heat exchange is achieved in the coil 3C of the suction port unit 3, making it possible to efficiently utilize the heat from the semiconductor manufacturing equipment M3 and auxiliary equipment M1, 2.

[0044] FIG. 4 shows an example of the results of a simulation of temperature distribution in factory building B. In this embodiment, cool air is blown downward from each air outlet unit 2 arranged on the ceiling of the third floor F3. As can be seen from FIG. 4, the temperature near the ceiling of the third floor F3 is the lowest in factory building B. The air on the third floor F3 rises in temperature due to heat generated by each semiconductor manufacturing device M3 and flows to the second floor F2 below through ventilation panels 5 installed in through-holes in the floor of the third floor F3. As can be seen from FIG. 4, the air flowing to the second floor F2 rises in temperature due to heat generated by each auxiliary device M2 and further flows to the first floor F1 below through ventilation panels 5 installed in through-holes in the floor of the second floor F2.

[0045] In this embodiment, the ventilation blocking panels 4 and the ventilation panels 5 are disposed at appropriate locations on the through-holes in the floor of the third floor F3 and the second floor F2, so that the air blown downward from the air outlet unit 2 passes through the semiconductor manufacturing equipment M3, the auxiliary equipment M2, and the auxiliary equipment M1 in that order before being drawn into the air inlet unit 3. As can be seen from FIG. 4 , the temperature of the air blown downward from the air outlet unit 2 gradually increases as it travels from the third floor F3 to the second floor F2 and toward the first floor F1 due to the exhaust heat from the semiconductor manufacturing equipment M3 and the auxiliary equipment M1 and M2. As a result, the air drawn into the air inlet unit 3 on the first floor F1 is hotter than, for example, if an air inlet were provided on each floor, and efficient heat exchange is achieved in the coil 3C of the air inlet unit 3. As a result, the temperature of the heat transfer medium flowing from the coil 3C of the suction port unit 3 to the heat exchanger 8C2, the heating coil 6B, and the reheating coil 6D via the heat transfer medium piping 8A14 is increased, making it possible to more efficiently and effectively utilize the heat from the semiconductor manufacturing equipment M3 and the auxiliary equipment M1 and M2.

[0046] The installation locations of the airflow blocking panels 4 and the ventilation panels 5 are not limited to the configuration shown in Fig. 3. Fig. 5 is a diagram showing a modified example of the airflow in the factory building B. For example, as shown in Fig. 5, the airflow blocking panels 4 and the ventilation panels 5 are installed on the third floor F3 and the second floor F4. The number of panels may be different for each floor F2. Furthermore, ventilation panels 5 may be placed at the central through-holes on the second floor F2, and ventilation blocking panels 4 may be placed at the other through-holes, so that the ventilation path from the second floor F2 to the first floor F1 is concentrated at a through-hole near the center of the first floor F1. In this modified example, air flowing down from the second floor F2 to the first floor F1 passes through a greater number of auxiliary devices M1 than in the configuration shown in FIG. 3 before being drawn into the air inlet unit 3, thereby increasing the temperature of the air drawn into the air inlet unit 3. This results in efficient heat exchange in the coil 3C of the air inlet unit 3, enabling efficient and effective utilization of the heat from the semiconductor manufacturing equipment M3 and the auxiliary devices M1 and M2.

[0047] 3 and 5 , the ventilation panels 4 and 5 may be installed in other appropriate locations. The installation locations of the ventilation panels 5 and 4 can be changed as appropriate depending on, for example, the heat generation and shape of each semiconductor manufacturing equipment M3 and each auxiliary equipment M1, M2, the thermal insulation performance of the building materials used in the factory building B, the air volume blown out of each air outlet unit 2, the ventilation resistance of the ventilation panels 5, and the number, size, and location of the through-holes on the third floor F3 and the second floor F2. For example, if each semiconductor manufacturing equipment M3 has a front portion that receives operations from an operator and the temperature of the front portion is lower than that of other portions, the ventilation panels 4 can be installed in the through-holes other than those corresponding to the front portion, and the ventilation panels 5 can be installed in the through-holes corresponding to the front portion to ensure air flow in the front portion and lower the temperature of the front portion compared to other portions.

[0048] Because the amount of heat generated by production equipment such as semiconductor manufacturing equipment M3 varies depending on the type and operating status of the equipment, the temperature distribution within factory building B is not uniform when viewed from above. Therefore, even if cool air is uniformly blown downward from the outlets of air outlet units 2 arranged on the ceiling surface of an upper floor such as the third floor F3, differences in air density due to temperature differences may cause air within factory building B to not descend uniformly from the upper third floor F3 to the lower first floor F1. In this case, localized high-temperature areas may occur within factory building B. In this regard, in this embodiment, the ventilation blocking panels 4 and the ventilation panels 5 are appropriately installed at the through-holes in the floors of the third floor F3 and the second floor F2, so that the air blown downward from the air outlet units 2 passes through the semiconductor manufacturing equipment M3 on the third floor F3, the auxiliary equipment M2 on the second floor F2, and the auxiliary equipment M1 on the first floor F1, in that order, before being drawn into the air inlet unit 3. In other words, the air blown downward from the air outlet unit 2 does not pass through, for example, the semiconductor manufacturing equipment M3 and then the auxiliary equipment M2 and M1 before being sucked into the air inlet unit 3. Therefore, even if the temperature distribution when the semiconductor manufacturing equipment M3 and the auxiliary equipment M1 and M2 are viewed from above the factory building B is not uniform, with this embodiment it is possible to prevent excessively localized high temperature areas from occurring within the factory building B.

[0049] In addition, this embodiment can be modified as appropriate within the scope of the invention disclosed in this application. [Explanation of symbols]

[0050] B.Factory building RS··Retan Shaft F1~3: 1st to 3rd floors M3 Semiconductor manufacturing equipment M1,M2...Auxiliary equipment 1. Air conditioning system 2. Air outlet unit 2C coil 2F Fan 3. Intake unit 3C coil 4. Ventilation blocking panel 5. Ventilation panel 6. Outdoor air conditioning unit 6A Filter 6B Heating coil 6C Cooling coil 6D Reheat Coil 6E··Electric fan 8. Heat Source System 8A·Heating medium system 8B··Cooling water system 8C・Hot water system 8A1·Refrigerating machine 8A2 Heat Transfer Medium Circulation Pump 8A3 Heat Transfer Header 8A4 Heat Transfer Header 8A5 Heat Transfer Medium Booster Pump 8A6, 8A7 Temperature Sensor 8A8, 8A9, 8A17 Regulating valve 8A10~8A16,8A18~8A21...Heating medium piping 8B1 Cooling water circulation pump 8B2 · Cooling tower 8B3,8B4 · Cooling water piping 8C1 Regulating valve 8C2·Heat exchanger 8C3, 8C4 Hot water piping

Claims

1. An air conditioning system for a facility in which heat-generating devices are installed on each of a plurality of floors, a plurality of air conditioning outlets arranged on the ceiling of the upper floor where the first heat generating device is arranged, the air outlets blowing air downward; an air conditioning intake located on a lower floor of the facility; a heat exchange coil that exchanges heat with air drawn in through the air conditioning intake port and sent to the air conditioning outlet; a plurality of through-holes arranged on the floor of the upper floor for communicating the upper floor with the floor one level below the upper floor; and an air-blocking member installed at a predetermined part of the plurality of through-holes, The airflow blocking member is installed at the predetermined through-hole selected so as to form a path through which air passing through the plurality of through-holes from the air conditioning outlet via the first heat generating device is drawn into the air conditioning intake port via a second heat generating device disposed on the floor one floor below the upper floor. Air conditioning system.

2. the through hole is a first through hole, the airflow blocking member is a first airflow blocking member, a plurality of second through-holes arranged on a floor one level below the upper floor for communicating the floor one level below the upper floor with the floor one level below; and second air-blocking members installed at predetermined second through-holes among the plurality of second through-holes, The second air-blocking member is installed at the predetermined second through-hole selected so as to form a path through which air that has passed through the plurality of second through-holes from the plurality of first through-holes via the second heat generating device is drawn into the air conditioning intake port via a third heat generating device located on the floor two floors below the upper floor. The air conditioning system of claim 1 .

3. When the facility is viewed from above, at least a portion of the second air-blocking member is installed at a different position from that of the first air-blocking member.

3. The air conditioning system of claim 2.

4. The floor two floors below the upper floor is the lower floor, The second airflow blocking member is installed in the predetermined second through-hole at a position spaced apart from the air conditioning intake port.

3. The air conditioning system of claim 2.

5. the airflow blocking member is installed at the predetermined through-hole selected according to the heat generation amount of each of the first heat generating device and the second heat generating device; The air conditioning system of claim 1 .

6. The airflow blocking members are installed at the predetermined through-holes, the number of which is determined based on the volume of air blown out from the plurality of air conditioning outlets. The air conditioning system of claim 1 .

7. the first heating device has a front portion that receives operation by an operator, The airflow blocking member is installed at a through hole other than a position corresponding to the front portion among the plurality of through holes. The air conditioning system of claim 1 .

8. The air-permeable closing member is further provided at each of the plurality of through holes other than the predetermined through hole. The air conditioning system of claim 1 .

9. a dehumidifying coil for cooling and dehumidifying outside air to be supplied into the facility; The outdoor air-conditioning unit further includes a reheat coil that heats the outdoor air that has passed through the dehumidifying coil with the heat medium that has passed through the heat exchange coil.

9. An air conditioning system according to any one of claims 1 to 8.

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