Cooling device and cooling method for fire boots based on a new thermoelectric structure

Abstract

This invention discloses a cooling device and method for firefighter boots based on a novel thermoelectric structure. [Solution] This device mainly includes fire boots, a first semiconductor cooling chip, a temperature sensor, memory, a controller, a power supply, a heat exchanger, and a second semiconductor cooling chip. When the first semiconductor cooling chip and each component are specifically installed, when a firefighter wears fire boots and enters a high-temperature, high-temperature fire scene to extinguish the fire or provide rescue, the inside of the fire boots, the boots themselves, and the feet are all efficiently and rapidly cooled, reducing the safety risks to the firefighter due to the high-temperature, high-temperature fire environment.

Description

Technical Field

[0001] The present invention relates to the technical field of cooling of fire boots, and specifically, to a cooling device and a cooling method for fire boots based on a new thermoelectric structure.

Background Art

[0002] Since a fire scene is usually exposed to high temperature and intense heat, firefighters need to wear fire boots and enter the fire scene during fire extinguishing and rescue operations. Fire boots have fire resistance and heat insulation properties, and due to their long boot shafts, wearing them for a long time easily causes sweating and heat on the legs and feet, and in severe cases, it may cause problems such as skin ulcers.

[0003] Regarding this problem, among the conventional technical solutions, Chinese Patent Publication CN112956777A discloses a fire boot with a protection function. This fire boot includes a sole rubber plate, a boot body, a suspension fitting, a water bag airbag, and a water gate valve. A water bag airbag is installed on the inner surface of the boot body, a water gate valve is attached above the water bag airbag, slots are opened on the surface, and the inside of the boot body is cooled by the water bag airbag. Also, Chinese Patent Publication CN114145539A discloses a temperature-adjustable sole and its system. This sole includes a sole body, and the sole body is cooled by a semiconductor cooling member, and adjustment control is performed by a single-chip microcomputer to achieve the purpose of temperature control of the sole. The inventor has disclosed a cooling and dehumidifying fire boot based on a thermoelectric device in Chinese Utility Model CN212014682U. A semiconductor cooling chip is installed at the bottom of the sole pad to cool the inside of the boot body.

[0004] Conventional technical solutions can achieve some degree of cooling inside the shoe, but they have the following drawbacks: The volume of the water bag airbag itself is small and unsuitable for increasing its size within the limited internal space of the shoe shaft, making continuous cooling impossible. In shoes using semiconductor thermoelectric cooling, most semiconductor cooling chips are conventional flat-plate thermoelectric structures, i.e., non-flexible flat-plate structures, which can cool the foot of a firefighter's boot when installed on a wide sole, but are unsuitable for the shoe shaft. Furthermore, they only cool one side of the inside of the shoe during work and release heat to the outside, so they cannot cool and protect the shoe itself. [Overview of the project] [Problems that the invention aims to solve]

[0005] Therefore, in order to solve the above problems, the present invention provides a cooling device and cooling method for fire boots based on a new thermoelectric structure.

[0006] The objective of this invention is to provide a cooling device and cooling method for firefighter boots based on a new thermoelectric structure. By simplifying the arrangement of the cooling device and optimizing the thermoelectric structure, cooling is achieved on both the inside and the outer upper part of the firefighter boot shaft. Furthermore, by rationally arranging the thermoelectric elements, the heat dissipation method of the semiconductor cooling chip is improved, further enhancing the cooling performance of the firefighter boots. [Means for solving the problem]

[0007] To solve the above technical problems, the present invention is realized by the following technical means. Embodiments of the present invention provide a cooling device for fire boots based on a novel thermoelectric structure, comprising a fire boot, a first semiconductor cooling chip, a temperature sensor, a memory, a controller, a power supply, a heat exchanger, and a second semiconductor cooling chip. The first semiconductor cooling chip is attached to the intermediate layer of the boot shaft of the fire boot and cools the inside and outside upper part of the boot shaft. The heat exchanger is installed in the intermediate layer of the boot shaft. The hot end of the first semiconductor cooling chip is connected to the heat exchanger. The second semiconductor cooling chip is attached between the sole layers of the fire boot and cools the foot. A temperature sensor is attached to the inside of the ankle of the fire boot and measures the temperature inside the fire boot and transmits the measurement value to the memory. The first semiconductor cooling chip, the second semiconductor cooling chip, the controller, and the memory are all electrically connected to a power supply. The first semiconductor cooling chip, the second semiconductor cooling chip, the memory, and the temperature sensor are each electrically connected to a controller.

[0008] Furthermore, the cooling device for fire boots based on the novel thermoelectric structure of the present invention may have the following additional technical features. In some embodiments, the first semiconductor cooling chip is a chain-type semiconductor cooling chip.

[0009] In some embodiments, the second semiconductor cooling chip is a flat-plate semiconductor cooling chip.

[0010] In some embodiments, the chain-type semiconductor cooling chip comprises a plurality of electrically connected thermoelectric units, one thermoelectric unit including a first metal sheet, a first N-type semiconductor, a first threaded metal post, a second N-type semiconductor, a second metal sheet, a first P-type semiconductor, a second threaded metal post, a second P-type semiconductor, a third metal sheet, a first heat-absorbing sheet, a second heat-absorbing sheet, a third heat-absorbing sheet, and a fourth heat-absorbing sheet. The first metal sheet is connected to the positive terminal of the power supply. The third metal sheet is connected to the negative terminal of the power supply. The first metal sheet, the first N-type semiconductor, the first threaded metal post, the second N-type semiconductor, the second metal sheet, the first P-type semiconductor, the second threaded metal post, the second P-type semiconductor, and the third metal sheet are sequentially sandwiched between the first heat-absorbing sheet and the second heat-absorbing sheet. The first heat-absorbing sheet is connected to the second heat-absorbing sheet only via the second metal sheet. Both sides of the first metal sheet are connected to the first N-type semiconductor and the fourth heat-absorbing sheet, respectively. The first N-type semiconductor and the second N-type semiconductor are connected by the first threaded metal post. The second N-type semiconductor and the first P-type semiconductor are connected by the second metal sheet. The first P-type semiconductor and the second P-type semiconductor are connected by the second threaded metal post. The third metal sheet is connected to the second P-type semiconductor and the third heat-absorbing sheet, respectively.

[0011] In some embodiments, the first heat-absorbing sheet and the second heat-absorbing sheet are formed in an arc shape.

[0012] In some embodiments, multiple thermoelectric units are connected end to end to form a chain.

[0013] In some embodiments, the materials of the first N-type semiconductor, the second N-type semiconductor, the first P-type semiconductor, the second P-type semiconductor, and the second semiconductor cooling chip are all bismuth telluride material. The materials of the first metal sheet, the second metal sheet, the third metal sheet, the first threaded metal post, and the second threaded metal post are pure copper. The materials of the first heat-absorbing sheet, the second heat-absorbing sheet, the third heat-absorbing sheet, and the fourth heat-absorbing sheet are alumina.

[0014] In some embodiments, in each thermoelectric unit, the end faces of the third and fourth heat-absorbing sheets are for high-temperature heat dissipation, and the first and second heat-absorbing sheets are for low-temperature heat absorption.

[0015] In some embodiments, the third heat-absorbing sheet and the fourth heat-absorbing sheet in each thermoelectric unit are in contact with the evaporation section of the heat exchanger.

[0016] In some embodiments, the heat exchanger uses pulsating heat pipes. The pulsating heat pipes are attached to the third and fourth heat-absorbing sheets by pins.

[0017] In some embodiments, ventilation holes are provided in the shoe shaft corresponding to the condensation section of the pulsating heat pipe.

[0018] In some embodiments, the memory compares the temperature value measured by the temperature sensor with a preset threshold and feeds it back to the controller, which in turn controls the power supply to achieve various levels of cooling.

[0019] Furthermore, the embodiments of the present invention further provide a method for cooling fire boots based on a new thermoelectric structure, and using the above-mentioned cooling device for fire boots based on a new thermoelectric structure, Step S1 involves, before the firefighter enters the fire scene, putting on their fire boots, turning on the controller to form a closed circuit, and activating the first semiconductor cooling chip and the second semiconductor cooling chip. Step S2 includes the following steps: After a firefighter enters the fire scene, the temperature sensor detects a change in the internal temperature of the fire boots and feeds the temperature measurement back to the memory, the memory compares the measured temperature with a preset temperature threshold, and if the measured temperature is lower than the preset temperature threshold, the controller temporarily turns off the power, and when the temperature sensor detects that the temperature measurement of the fire boots is above the preset temperature threshold, the controller turns on the power and increases the output power, the first semiconductor cooling chip and the second semiconductor cooling chip improve the cooling efficiency, and the heat exchanger detects a temperature change at its hot end and starts operating accordingly to lower the temperature at the hot end, thereby achieving cooling of the inside and outside of the fire boot shaft and the foot.

[0020] Implementing the technical solution of the present invention yields at least the following beneficial effects. By designing the thermoelectric unit of the first semiconductor cooling chip with a rational structure, compared to a P-type semiconductor of the same material and volume, the first P-type semiconductor and the second P-type semiconductor are connected by adding a threaded metal post between them after the original volume is divided equally. This designed intermediate threaded metal post separates the low-temperature and high-temperature ends of the thermoelectric unit by a certain distance so as not to affect conductivity, reducing Fourier heat conducted directly from the high-temperature end to the low-temperature end of the thermoelectric unit, and thus reducing internal energy loss due to the Fourier effect. Furthermore, the threaded metal post itself functions as a radiator, with the threads resembling fins, releasing heat conducted from the high-temperature end to the low-temperature end, and also reducing heat conducted from the high-temperature end to the low-temperature end, mitigating the adverse effects of the Fourier effect and achieving a large cooling capacity. Similarly, the first N-type semiconductor and the second N-type semiconductor play the same role.

[0021] By connecting the threaded metal posts and metal sheets of the thermoelectric unit in a chain-like manner to the semiconductors, it becomes easier to sandwich them between the first heat absorption sheet and the second heat absorption sheet. In particular, when the first heat absorption sheet and the second heat absorption sheet are installed in an arc shape, the first heat absorption sheet approaches the inside of the body, and the second heat absorption sheet approaches the outside of the body, making it easier to install them inside the body layer of the fire boots. Furthermore, by connecting the ends of multiple thermoelectric units to form a ring shape, each space in the entire boot shaft can be effectively cooled.

[0022] The first heat absorption sheet and the second heat absorption sheet are connected only to the second metal sheet and are both used as the low-temperature ends, realizing the simultaneous cooling of the inside and outside of the body of the fire boots, improving the cooling effect on the legs of the firefighters, and fully protecting the boot body outside the conductor. In this case, the third heat absorption sheet and the fourth heat absorption sheet are in close contact with the third metal sheet and the first metal sheet respectively, and as the high-temperature ends, heat is released from the body ventilation holes by the pulsating heat pipe, and there is no heat dissipation device that protrudes from the instep and hinders wearing and work.

[0023] Generally, since the instep and the sole are not integrated, it is inconvenient to install a chain-type semiconductor cooling chip. Therefore, a second semiconductor cooling chip, especially a flat-type semiconductor cooling chip, is installed inside the sole layer of the fire boots, making full use of the large flat space of the sole to install the flat-type semiconductor cooling chip to cool the feet.

[0024] The memory compares the temperature value measured by the temperature sensor with a preset threshold value and feeds it back to the controller. Thereby, the controller controls the power supply to achieve cooling effects at various levels, reduce the consumption of electrical energy, and extend the usage time.

[0025] Other aspects and advantages of the present disclosure will be presented in part in the following description, will become apparent in part from the following description, or will be understood by implementing the present disclosure.

Brief Description of the Drawings

[0026] [Figure 1] It is a diagram showing a cooling device for fire boots based on a new thermoelectric structure according to the present invention. [Figure 2] It is a diagram showing the configuration of a chain-type semiconductor cooling chip of the present invention. [Figure 3] It is a perspective view showing a chain-type semiconductor cooling chip of the present invention. [Figure 4] It is a diagram showing the configuration of a heat exchanger of the present invention.

Embodiments for Carrying Out the Invention

[0027] In the description of the present invention, "a plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined. In addition, all directional indications (up, down, left, right, front, back, top, bottom, etc.) in the embodiments of the present invention are only used to interpret the relative positional relationship and movement status between each member in a specific posture (as shown in the drawings), and when the specific posture changes accordingly, the directional indications also change. Also, the terms "include" and "have", and any variations thereof, are intended to non-exclusively include. For example, a process, method, system, product or device including a series of steps or units is not limited to the listed steps or units, and may optionally further include steps or units not listed, or may further include other steps or units inherent to these processes, methods, products or devices.

[0028] Also, "Examples" in this specification means that specific features, structures or characteristics described in accordance with the examples are included in at least one example of the present invention. This phrase appearing at various positions in this specification does not necessarily mean the same example, nor is it mutually exclusive or alternative to other examples. It is explicitly and implicitly understood by those skilled in the art that the examples described in this specification may be combined with other examples.

[0029] The technical solutions in embodiments of the present invention will be described more clearly and completely below with reference to the drawings of embodiments of the present invention. The embodiments described are only a part of the embodiments of the present invention, and not all embodiments of the present invention. All other embodiments that a person skilled in the art could obtain based on embodiments of the present invention without creative work should all be included within the scope of protection of the present invention.

[0030] As analyzed in the background technology section, conventional fire boots have certain drawbacks, and in particular, no effective solution has yet been proposed for the cooling problem inside and outside the boot shaft. For example, conventional technologies such as water cooling, air cooling, and / or flat-plate semiconductor cooling have not been able to solve the cooling problem inside and outside the boot shaft.

[0031] Embodiments of the present invention have been made in view of the present invention, and provide a cooling device for firefighter boots based on a new thermoelectric structure, which achieves cooling inside and outside the boot shaft mainly by an improved chain-type semiconductor cooling chip. For specific technical details, please refer to the following description.

[0032] Refer to Figures 1 to 4. In some embodiments, a cooling device for fire boots based on a new thermoelectric structure includes a fire boot 1, a first semiconductor cooling chip 2, a temperature sensor 3, a memory 4, a controller 5, a power supply 6, a heat exchanger 7, lead wires 8, and a second semiconductor cooling chip 9. The first semiconductor cooling chip 2 is attached to the middle layer of the boot shaft of the fire boot 1 and cools the inside and outside of the boot shaft of the fire boot 1. The heat exchanger 7 is installed in the middle layer of the boot shaft. The hot end of the first semiconductor cooling chip 2 is connected to the heat exchanger 7. The second semiconductor cooling chip 9 is attached between the sole layers of the fire boot 1 and cools the foot. The temperature sensor 3 is attached to the inside of the ankle of the fire boot 1 and measures the temperature inside the fire boot 1 and transmits the measured value to the memory 4. The first semiconductor cooling chip 2, the second semiconductor cooling chip 9, the controller 5, and the memory 4 are all electrically connected to the power supply 6 by lead wires 8. The first semiconductor cooling chip 2, the second semiconductor cooling chip 9, the memory 4, and the temperature sensor 3 are each electrically connected to the controller 5 by lead wires 8 (control wires).

[0033] In some preferred embodiments, the first semiconductor cooling chip 2 is a chain-type semiconductor cooling chip.

[0034] In some preferred embodiments, a chain-type semiconductor cooling chip comprises a plurality of electrically connected thermoelectric units, mainly including a first metal sheet 201, a first N-type semiconductor 202, a first threaded metal post 203, a second N-type semiconductor 204, a second metal sheet 205, a first P-type semiconductor 206, a second threaded metal post 207, a second P-type semiconductor 208, a third metal sheet 209, a first heat-absorbing sheet 210, and a second heat-absorbing sheet 211.

[0035] In a specific embodiment, both sides of the first metal sheet 201 are in contact with the fourth heat-absorbing sheet 213 and the first N-type semiconductor 202, respectively. The first metal sheet 201 is connected to the positive terminal of the power supply 6 as a current input terminal. The second metal sheet 205 is sandwiched between the second N-type semiconductor 204 and the first P-type semiconductor 206. Both sides of the third metal sheet 209 are in contact with the third heat-absorbing sheet 212 and the second P-type semiconductor 208, respectively. The third metal sheet 209 is connected to the negative terminal of the power supply 6 as a current output terminal.

[0036] In a specific embodiment, the first threaded metal post 203 is located between the first N-type semiconductor 202 and the second N-type semiconductor 204, and the second threaded metal post 207 is located between the first P-type semiconductor 206 and the second P-type semiconductor 208.

[0037] In some preferred embodiments, the first metal sheet 201, the second metal sheet 205, and the third metal sheet 209 are made of copper material, and the first threaded metal post 203 and the second threaded metal post 207 are both made of copper material, which are used for normal conduction of the circuit, while also dissipating the heat generated in the semiconductor more quickly and efficiently, thus avoiding damage to the semiconductor cooling chip due to high temperatures.

[0038] Furthermore, the first threaded metal post 203 not only easily connects the first N-type semiconductor 202 and the second N-type semiconductor 204 to form a chain-like thermoelectric unit, but also primarily separates the low-temperature and high-temperature ends of the thermoelectric unit by a certain distance to avoid affecting conductivity, thereby reducing Fourier heat directly conducted from the high-temperature end to the low-temperature end of the thermoelectric unit and reducing internal energy loss due to the Fourier effect. Moreover, the threaded metal post itself functions as a radiator, with the threads resembling fins, releasing heat conducted from the high-temperature end to the low-temperature end, and also reducing heat conducted from the high-temperature end to the low-temperature end, mitigating the adverse effects of the Fourier effect and achieving a large cooling capacity. Similarly, the second threaded metal post 207 is connected to the first P-type semiconductor 206 and the second P-type semiconductor 208 and performs the same role.

[0039] In a specific embodiment of the present invention, a first metal sheet 201, a first N-type semiconductor 202, a first threaded metal post 203, a second N-type semiconductor 204, a second metal sheet 205, a first P-type semiconductor 206, a second threaded metal post 207, a second P-type semiconductor 208, and a third metal sheet 209 are sandwiched between the first heat-absorbing sheet 210 and the second heat-absorbing sheet 211.

[0040] Furthermore, the first semiconductor cooling chip 2 is attached to the intermediate layer of the boot shaft of the fire boot 1. The first heat-absorbing sheet 210 cools and protects the main body of the fire boot 1 in its outer layer and also provides primary cooling to the inside of the boot shaft, while the second heat-absorbing sheet 211 improves the internal cooling effect of the boot shaft of the fire boot 1 in its inner layer, significantly improving leg protection through two-layer cooling. For example, the material of the first heat-absorbing sheet 210 and the second heat-absorbing sheet 211 is alumina, but other insulating materials with excellent heat transfer properties may be used.

[0041] In some preferred embodiments, the first and second heat-absorbing sheets are arc-shaped to conform to the annular cross-sectional structure of the boot shaft intermediate layer, facilitating attachment to the boot shaft intermediate layer of the firefighting boot.

[0042] In a specific embodiment of the present invention, the first N-type semiconductor 202, the second N-type semiconductor 204, the first P-type semiconductor 206, and the second P-type semiconductor 208 have the same volume.

[0043] For example, the first N-type semiconductor 202, the second N-type semiconductor 204, the first P-type semiconductor 206, the second P-type semiconductor 208, and the planar semiconductor cooling chip 9 are all bismuth telluride materials, and in some embodiments, they may be bismuth selenide materials or other semiconductor materials that produce a Peltier effect when energized.

[0044] In this invention, the specific number of thermoelectric units is not limited; for example, there are three thermoelectric units, which are connected at their ends to form a ring. This allows for effective cooling of each space within the entire shoe tube.

[0045] In some preferred embodiments, a fourth heat-absorbing sheet 213 is installed in close contact with one side of a first metal sheet 201, and a third heat-absorbing sheet 212 is installed in close contact with one side of a third metal sheet 209. The fourth heat-absorbing sheet 213 and the third heat-absorbing sheet 212 play a role in releasing the heat conducted to the first metal sheet 201 and the third metal sheet 209 as heat dissipation at the high-temperature end. For example, the material of the third heat-absorbing sheet 212 and the fourth heat-absorbing sheet 213 is alumina, but of course, other insulating materials with excellent heat transfer properties may be used.

[0046] In some preferred embodiments, the third heat-absorbing sheet 212 and the fourth heat-absorbing sheet 213 are provided with corresponding fixing mechanisms, such as locking parts, to facilitate connection, contact, and heat exchange with the heat exchanger 7.

[0047] In a specific embodiment, the heat exchanger 7 uses pulsating heat pipes and is attached to the third heat absorption sheet 212 and the fourth heat absorption sheet 213 by pins and tightened by the fixing mechanism of the third heat absorption sheet 212 and the fourth heat absorption sheet 213. The third heat absorption sheet 212 and the fourth heat absorption sheet 213 are in contact with the evaporation section of the pulsating heat pipe and conduct heat to the condensation section of the pulsating heat pipe.

[0048] The pulsating heat pipe is made of a metal capillary tube bent into a serpentine structure, and its diameter is small (the inner diameter is generally 0.5 to 3 mm), making it suitable for installation in the space of the middle layer of a small shoe tube. One bent end is the evaporation section, and the other end is the condensation section. In this embodiment, the specific structure and form of the pulsating heat pipe are not limited; any pulsating heat pipe capable of releasing heat is acceptable.

[0049] In some preferred embodiments, when a pulsating heat pipe is installed in the intermediate layer of the shoe shaft, ventilation holes are provided in the shoe shaft corresponding to the condensation area of ​​the pulsating heat pipe, preventing heat from accumulating in the intermediate layer of the shoe shaft and reducing the heat transfer effect. Furthermore, since no additional heat dissipation device is installed on the outside of the shoe, it does not interfere with wearing or working.

[0050] In some preferred embodiments, the number of first semiconductor cooling chips 2 (chain-type semiconductor cooling chips) may be multiple, and they are arranged sequentially within the space of the intermediate layer of the shoe tube to sufficiently cool the entire inside and outside of the shoe tube.

[0051] In some preferred embodiments, the second semiconductor cooling chip 9 is a flat-plate type semiconductor cooling chip. Compared to the inconvenience of installing a flat-plate type semiconductor cooling chip on the boot shaft and upper, the flat-plate type semiconductor cooling chip is installed in the wide flat space of the sole of the shoe to cool the foot, and the synergistic effect with the cooling of the leg inside the boot shaft by the first semiconductor cooling chip allows for good cooling and protection of both the firefighter's leg and foot. A normal semiconductor cooling chip may be used as the flat-plate type semiconductor cooling chip and may include the necessary heat dissipation part. Heat dissipation may be performed by the sole of the shoe.

[0052] To facilitate cooling and power consumption control, in a specific embodiment of the present invention, the temperature sensor 3 is attached to the inside of the ankle of the fire boot 1 to measure the temperature inside the fire boot 1 and transmits the measured value to the memory 4 via lead wires 8 for comparison with a preset threshold of 40°C. This allows the controller 5 to control the output of the power supply 6, enabling the first semiconductor cooling chip 2 and / or the second semiconductor cooling chip 9 to achieve various levels of cooling effect, ensuring the safety and comfort of the firefighter's legs and feet. The temperature control method in this embodiment may be implemented by any control circuit of the prior art, but the specific structural form of these circuit components is not limited in this embodiment, as long as they can perform temperature control.

[0053] Furthermore, the power supply 6 can be any form of power source, such as a battery. For example, the battery may be installed inside the fire boot body or attached to the fire suit, and connected to the controller 5, memory 4 and cooling chip 2 by installing a corresponding connection circuit.

[0054] A specific embodiment of the present invention further provides a method for cooling fire boots based on a novel thermoelectric structure. The specific method is: Step S1 involves, before the firefighter enters the fire scene, putting on their fire boots, turning on the controller 5 to form a closed circuit, and activating the first semiconductor cooling chip 2 and the second semiconductor cooling chip 9. Step S2 includes the following steps: After a firefighter enters the fire scene, the temperature sensor 3 detects a change in the internal temperature of the fire boots 1 and feeds the measured value back to the memory 4. The memory 4 compares the measured temperature with a preset temperature threshold. If the measured temperature is lower than the preset temperature threshold, the controller 5 temporarily turns off the power supply 6. If the temperature measurement is equal to or greater than the preset temperature threshold, the controller 5 turns on the power supply 6 and increases the output power, causing the first semiconductor cooling chip 2 and the second semiconductor cooling chip 9 to improve their cooling efficiency. The heat exchanger 7 detects a temperature change at its hot end and then starts operating accordingly to lower the temperature at the hot end, thereby achieving cooling of the inside and outside of the fire boot shaft and the foot.

[0055] The beneficial effects of the fire boot cooling device and cooling method based on a new thermoelectric structure according to the present invention are as follows: When a firefighter enters a high-temperature fire scene wearing fire boots, cooling can be performed by the fire boot cooling device and cooling method based on a new thermoelectric structure. By designing the thermoelectric unit of the first semiconductor cooling chip with a rational structure, the current flow path and time are shortened, and a lower temperature end can be obtained more effectively. It can be easily attached to the middle layer of the fire boot shaft and effectively cools each space of the entire boot shaft. The inside and outside of the fire boot shaft are cooled simultaneously, improving the cooling effect on the firefighter's feet and adequately protecting the outer boot body. Since there is no heat dissipation device protruding from the instep, it does not interfere with wearing or work. Various levels of cooling effect can be achieved, reducing the consumption of electrical energy and extending the usage time. It mitigates a series of safety risks to firefighters due to high-temperature fire environments.

[0056] The basic principles of the present invention have been explained above with reference to specific examples. However, as pointed out, the advantages, superiority, and effects mentioned in the present invention are illustrative and not intended to be limiting, and these advantages, superiority, and effects should not be considered as something that each embodiment of the present invention must possess. Furthermore, the specific details disclosed above are merely illustrative and for ease of understanding, and not intended to be limiting, and the above details do not necessarily limit the present invention to being realized using the above specific details.

[0057] The block diagrams of the devices, apparatus, equipment, and systems mentioned herein are merely illustrative and are not intended to require or suggest that connections, layouts, and arrangements must necessarily be made in accordance with the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatus, equipment, and systems can be connected, laid out, and arranged in any manner. For example, terms such as “include,” “incorporate,” and “have” are open terms meaning “include, but not limited to,” and can be used interchangeably. Unless otherwise clearly indicated by the context, the terms “or” and “and” as used herein refer to the term “and / or,” and can be used interchangeably. The term “for example” as used herein means the phrase “for example, but not limited to,” and can be used interchangeably.

[0058] It should also be noted that in the apparatus, equipment, and methods of the present invention, each component or step can be disassembled and / or reassembled. These disassemblies and / or reassemblies should be considered equivalents of the present invention. [Explanation of symbols]

[0059] 1 fire boots 2. First semiconductor cooling chip 3. Temperature sensor 4 memory 5 Controllers 6 Power supply 7 Heat exchanger 8 Lead wires 9. Second Semiconductor Cooling Chip 201 First Metal Sheet 202 Type N Semiconductor 203 1st threaded metal post 204 2nd N-type semiconductor 205 Second Metal Sheet 206 Type 1 P Semiconductor 207 Second threaded metal post 208 Type 2P Semiconductor 209 Third Metal Sheet 210 First heat absorption sheet 211 Second heat absorption sheet 212 Third heat absorption sheet 213 Fourth heat-absorbing sheet

Claims

1. A cooling device for fire boots based on a new thermoelectric structure, The system includes a fire boot (1), a first semiconductor cooling chip (2), a temperature sensor (3), a memory (4), a controller (5), a power supply (6), a heat exchanger (7), and a second semiconductor cooling chip (9). The first semiconductor cooling chip (2) is attached to the intermediate layer of the boot shaft of the fire boot (1) and cools the inside and outside of the boot shaft of the fire boot (1). The heat exchanger (7) is installed in the middle layer of the shoe tube. The high-temperature end of the first semiconductor cooling chip (2) is connected to the heat exchanger (7). The second semiconductor cooling chip (9) is installed between the sole layers of the fire boot (1) to cool the foot. The temperature sensor (3) is attached to the inside of the ankle of the fire boot (1) and measures the temperature inside the fire boot (1) and transmits the measured value to the memory (4). The first semiconductor cooling chip (2), the second semiconductor cooling chip (9), the controller (5), and the memory (4) are all electrically connected to the power supply (6). A cooling device for fire boots based on a new thermoelectric structure, characterized in that a first semiconductor cooling chip (2), a second semiconductor cooling chip (9), a memory (4), and a temperature sensor (3) are each electrically connected to a controller (5).

2. The first semiconductor cooling chip (2) is a chain-type semiconductor cooling chip, A chain-type semiconductor cooling chip consists of multiple thermoelectric units that are electrically connected in parallel. One thermoelectric unit includes a first metal sheet (201), a first N-type semiconductor (202), a first threaded metal post (203), a second N-type semiconductor (204), a second metal sheet (205), a first P-type semiconductor (206), a second threaded metal post (207), a second P-type semiconductor (208), a third metal sheet (209), a first heat-absorbing sheet (210), a second heat-absorbing sheet (211), a third heat-absorbing sheet (212), and a fourth heat-absorbing sheet (213). The first metal sheet (201) is connected to the positive terminal of the power supply (6). The third metal sheet (209) is connected to the negative terminal of the power supply (6). The first metal sheet (201), the first N-type semiconductor (202), the first threaded metal post (203), the second N-type semiconductor (204), the second metal sheet (205), the first P-type semiconductor (206), the second threaded metal post (207), the second P-type semiconductor (208), and the third metal sheet (209) are sandwiched in order between the first heat-absorbing sheet (210) and the second heat-absorbing sheet (211). The first heat-absorbing sheet (210) is connected to the second heat-absorbing sheet (211) only via the second metal sheet (205). Both sides of the first metal sheet (201) are connected to the first N-type semiconductor (202) and the fourth heat-absorbing sheet (213), respectively. The first N-type semiconductor (202) and the second N-type semiconductor (204) are connected by the first threaded metal post (203), The second N-type semiconductor (204) and the first P-type semiconductor (206) are connected by the second metal sheet (205). The first P-type semiconductor (206) and the second P-type semiconductor (208) are connected by the second threaded metal post (207), The cooling device for fire boots based on a new thermoelectric structure according to claim 1, characterized in that the third metal sheet (209) is connected to the second P-type semiconductor (208) and the third heat-absorbing sheet (212), respectively.

3. A cooling device for fire boots based on a new thermoelectric structure according to claim 2, characterized in that multiple thermoelectric units are connected end to end to form a chain.

4. The cooling device for fire boots based on a new thermoelectric structure according to claim 3, characterized in that the second semiconductor cooling chip (9) is a flat semiconductor cooling chip.

5. The materials of the first N-type semiconductor (202), the second N-type semiconductor (204), the first P-type semiconductor (206), the second P-type semiconductor (208), and the second semiconductor cooling chip (9) are all bismuth telluride materials. The material of the first metal sheet (201), the second metal sheet (205), the third metal sheet (209), the first threaded metal post (203), and the second threaded metal post (207) is pure copper. A cooling device for fire boots based on a new thermoelectric structure according to any one of claims 2 to 4, characterized in that the material of the first heat-absorbing sheet (210), the second heat-absorbing sheet (211), the third heat-absorbing sheet (212), and the fourth heat-absorbing sheet (213) is alumina.

6. A cooling device for fire boots based on a new thermoelectric structure according to any one of claims 2 to 4, characterized in that in each thermoelectric unit, the end faces of the third heat-absorbing sheet (212) and the fourth heat-absorbing sheet (213) are for high-temperature end heat dissipation, and the first heat-absorbing sheet (210) and the second heat-absorbing sheet (211) are for low-temperature end heat absorption.

7. The cooling device for fire boots based on a new thermoelectric structure according to claim 6, characterized in that the third heat-absorbing sheet (212) and the fourth heat-absorbing sheet (213) in each thermoelectric unit are in contact with the evaporation section of the heat exchanger (7).

8. The heat exchanger (7) uses a pulsating heat pipe, The cooling device for fire boots based on a new thermoelectric structure according to claim 7, characterized in that the pulsating heat pipe is attached to the third heat-absorbing sheet (212) and the fourth heat-absorbing sheet (213) by pins.

9. A cooling device for fire boots based on a new thermoelectric structure, as described in claim 8, characterized in that the boot shaft has ventilation holes corresponding to the condensation section of the pulsating heat pipe.

10. The memory (4) compares the temperature value measured by the temperature sensor (3) with a preset threshold and feeds it back to the controller (5), thereby the controller (5) controls the power supply (6) to achieve various levels of cooling effect, characterized in that a cooling device for fire boots based on a new thermoelectric structure according to any one of claims 1 to 4.

11. A new method for cooling fire boots based on a thermoelectric structure, Using a cooling device for fire boots based on a new thermoelectric structure as described in any one of claims 1 to 4, Step S1 involves, before the firefighter enters the fire scene, putting on their fire boots, turning on the controller (5) to form a closed circuit, and activating the first semiconductor cooling chip (2) and the second semiconductor cooling chip (9), A method for cooling fire boots based on a new thermoelectric structure, comprising step S2, which includes: after a firefighter enters a fire scene, the temperature sensor (3) senses a change in the internal temperature of the fire boots (1) and feeds the measured value back to the memory (4), the memory (4) compares the measured temperature with a preset temperature threshold, and if the measured temperature is lower than the preset temperature threshold, the controller (5) temporarily turns off the power (6); when the temperature sensor (3) senses that the measured internal temperature of the fire boots (1) is equal to or greater than the preset temperature threshold, the controller (5) turns on the power (6), increases the output power, the first semiconductor cooling chip (2) and the second semiconductor cooling chip (9) improve the cooling efficiency, and the heat exchanger (7) senses a temperature change at its hot end and starts operating accordingly to lower the temperature at the hot end, thereby achieving cooling of the inside and outside of the boot shaft of the fire boots (1) and the foot.

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