Replaceable module for charged particle device

Abstract

Interchangeable modules are provided within the charged particle device. [Solution] Disclosed herein is a module for supporting a device configured to operate a charged particle path in a charged particle apparatus, the module comprising a support configuration configured to support the device, the support configuration being configured for the device to operate a charged particle path within the charged particle apparatus, and a support positioning system configured to move the support configuration within the module, the module being arranged in a field-replaceable manner in the charged particle apparatus.

Description

Technical Field

[0001] Cross - reference to Related Applications

[0001] This application claims priority to U.S. Patent Application No. 63 / 037,481, filed on June 10, 2020, and European Patent Application No. 20197510.9, filed on September 22, 2020, which are hereby incorporated by reference in their entireties.

[0002]

[0002] Embodiments provided herein generally relate to the provision of an electron - optical assembly in a charged - particle device. The electron - optical assembly is configured to manipulate a charged - particle beam, such as by deflecting and / or focusing one or more charged - particle beams. Embodiments provide an electron - optical device in an interchangeable module in a charged - particle device. Embodiments also provide techniques for properly aligning the electron - optical assembly with an incident source beam.

Background Art

[0003]

[0003] When manufacturing a semiconductor integrated circuit (IC) chip, for example, due to optical effects and incidental particles, unwanted pattern defects inevitably occur on a substrate (i.e., a wafer) or a mask during the manufacturing process, thereby reducing the yield. Therefore, monitoring the extent of unwanted pattern defects is an important process in the manufacture of IC chips. More generally, inspection and / or measurement of the surface of a substrate or other object / material is an important process during and / or after its manufacture.

[0004]

[0004] Pattern inspection tools using charged particle beams have been used to inspect objects, for example, to detect pattern defects. These tools generally use electron microscopy techniques such as scanning electron microscopes (SEMs). In an SEM, a primary electron beam of relatively high-energy electrons is targeted in a final deceleration step to land on the sample with a relatively low landing energy. The electron beam is focused onto the sample as a probing spot. The interaction between the material structure at the probing spot and the landed electrons from the electron beam causes electrons such as secondary electrons, backscattered electrons, or Auger electrons to be emitted from the surface. The generated secondary electrons may be emitted from the material structure of the sample. By scanning the primary electron beam as a probing spot across the sample surface, secondary electrons can be emitted across the sample surface. By collecting these emitted secondary electrons from the sample surface, the pattern inspection tool can obtain an image representing the material structure features of the sample surface.

[0005]

[0005] Another application of charged particle beams is lithography. A charged particle beam reacts with a resist layer on the surface of a substrate. A desired pattern in the resist can be created by controlling the location on the resist layer to which the charged particle beam is directed. A charged particle apparatus may generate one or more charged particle beams, or it may be an apparatus for illuminating, projecting, and / or detecting one or more charged particle beams. Within the charged particle apparatus, one or more electro-optical devices are provided to manipulate one or more charged particle beams. There is a general need to improve upon known techniques for providing electro-optical devices in a charged particle apparatus. [Overview of the Initiative]

[0006]

[0006] Embodiments provided herein disclose a module including an electro-optical device. The module is replaceable in-field within the charged particle apparatus. Thus, the electro-optical device can be easily replaced by removing the module from the charged particle apparatus and reinstalling the module with a different electro-optical device. Alternatively, a different module including a different electro-optical device may be installed.

[0007]

[0007] The embodiments also provide techniques for aligning the electro-optical device with other components in the charged particle apparatus.

[0008]

[0008] According to a first aspect of the present invention, there is a module for supporting a device configured to operate a charged particle path in a charged particle apparatus, the module comprising a support configuration configured to support the device, wherein the device is configured to operate a charged particle path within the charged particle apparatus, and a support positioning system configured to move the support configuration within the module, the module being arranged in a field-replaceable manner in the charged particle apparatus.

[0009]

[0009] According to a second aspect of the present invention, a module is provided for supporting a device configured to manipulate the path of charged particles in a charged particle apparatus, wherein the module includes a module flange configured to be attached to and detached from the housing flange of the housing of the charged particle apparatus, such that the module is replaceable in situ within the charged particle apparatus.

[0010]

[0010] According to a third aspect of the present invention, a charged particle apparatus is provided which includes a field-replaceable module according to the first or second aspect.

[0011]

[0011] According to a fourth aspect of the present invention, a method is provided for installing an electro-optical device in a charged particle apparatus, the method comprising: attaching the electro-optical device to a module; making rough adjustments to the Rx state, Ry state, and / or z position of the electro-optical device with respect to the body of the module; and fixing the module to the charged particle apparatus.

[0012]

[0012] A fifth aspect of the present invention provides a method for aligning an electro-optical device with a charged particle beam or multibeam in a charged particle apparatus, the method comprising: fixing a module containing the electro-optical device to the charged particle apparatus, thereby installing the electro-optical device in the charged particle apparatus; making one or more fine adjustments to the x position, y position, and / or Rz state of the electro-optical device with respect to the body of the module; and making adjustments to the path of the charged particle beam or multibeam in the charged particle apparatus.

[0013]

[0013] According to a sixth aspect of the present invention, an electron-optical column is provided configured to project an electron beam onto a sample, comprising: a frame configured to define a coordinate system for the column; a chamber for receiving an in-situ replaceable module including an electron-optical device; an engagement configuration configured to engage with the in-situ replaceable module for aligning the in-situ replaceable module with the frame; and an active positioning system configured to position the beam and device relative to each other for fine alignment.

[0014]

[0014] According to a seventh aspect of the present invention, a field-replaceable module is provided which is arranged to be removablely inserted into an electron-optical column, and which includes an electron-optical element configured to manipulate the path of an electron beam in the electron-optical column, a support configured to support the electron-optical element, and an engagement configuration configured to align the support with the frame of the electron-optical column in all degrees of freedom.

[0015]

[0015] The module according to the embodiment advantageously allows for the easy replacement of the electro-optical device without substantial disassembly of the charged particle apparatus.

[0016]

[0016] Other advantages of the present invention will become apparent from the following description, in conjunction with the accompanying drawings, which describe specific embodiments of the present invention as examples and illustrations.

[0017]

[0017] The above and other aspects of the present disclosure will become more apparent from the description of exemplary embodiments in conjunction with the accompanying drawings. [Brief explanation of the drawing]

[0018] [Figure 1]

[0018] This is a schematic diagram showing an exemplary charged particle beam inspection apparatus. [Figure 2]

[0019] Figure 1 is a schematic diagram showing an exemplary multi-beam system, which is part of an exemplary charged particle beam inspection system. [Figure 3]

[0020] Figure 1 is a schematic diagram of an exemplary multi-beam apparatus showing an exemplary configuration of the source conversion unit of an exemplary charged particle beam inspection apparatus. [Figure 4A]

[0021] This is a schematic diagram of a part of a charged particle apparatus according to one embodiment. [Figure 4B]

[0022] This is a schematic diagram of a part of a charged particle apparatus according to one embodiment. [Figure 5]

[0023] This is a schematic cross-sectional view of a module according to one embodiment installed in a charged particle apparatus. [Figure 6]

[0024] This is a schematic cross-sectional view through an electron-optical device according to one embodiment, installed in a charged particle apparatus. [Figure 7]

[0025] This is a schematic diagram of a cross-section of a module according to one embodiment of the process inserted into a charged particle device. [Figure 8]

[0026] Schematic cross-sectional view through a part of the module according to the first embodiment. [Figure 9]

[0027] Schematic cross-sectional view through a part of the module according to the first embodiment. [Figure 10A]

[0028] Schematic cross-sectional view through a part of the module according to the second embodiment. [Figure 10B]

[0029] Schematic cross-sectional view through a part of the module according to the second embodiment. [Figure 11A]

[0030] Schematic cross-sectional view through the module according to one implementation form of the third embodiment. [Figure 11B]

[0031] Schematic cross-sectional view through a part of the module according to one implementation form of the third embodiment. [Figure 11C]

[0032] Schematic plan view of the stage showing the operating state of the piezoelectric actuator according to one implementation form of the third embodiment. [Figure 11D]

[0032] Schematic plan view of the stage showing the operating state of the piezoelectric actuator according to one implementation form of the third embodiment. [Figure 11E]

[0032] Schematic plan view of the stage showing the operating state of the piezoelectric actuator according to one implementation form of the third embodiment. [Figure 11F]

[0033] Schematic cross-sectional view through the module according to one implementation form of the third embodiment. [Figure 11G]

[0034] Schematic plan view of the stage showing the operating state of the piezoelectric actuator according to one implementation form of the third embodiment. [Figure 11H]

[0034] Schematic plan view of the stage showing the operating state of the piezoelectric actuator according to one implementation form of the third embodiment. [Figure 11I]

[0034] Schematic plan view of the stage showing the operating state of the piezoelectric actuator according to one implementation form of the third embodiment. [Figure 12A]

[0035] This is a schematic cross-sectional view of a module according to one implementation configuration of the fourth embodiment. [Figure 12B]

[0036] This is a schematic cross-sectional view of a module passing through a portion of it according to one implementation configuration of the fourth embodiment. [Figure 12C]

[0037] This is a schematic cross-sectional view of a module passing through a portion of it according to one implementation configuration of the fourth embodiment. [Figure 12D]

[0038] This is a schematic cross-sectional view of a module passing through a portion of it according to one implementation configuration of the fourth embodiment. [Figure 13]

[0039] This is a schematic diagram of a cross-section passing through a portion of the module according to the fifth embodiment. [Figure 14A]

[0040] This is a schematic diagram of a module fixed to a charged particle device according to the sixth embodiment. [Figure 14B]

[0041] This is a schematic diagram of the flange on the charged particle apparatus according to the sixth embodiment. [Figure 15A]

[0042] This is a schematic diagram of a portion of a module according to the seventh embodiment within the charged particle device. [Figure 15B]

[0043] This is a schematic diagram of the tightening bolt configuration according to the seventh embodiment. [Figure 16]

[0044] This is a schematic diagram of a charged particle apparatus according to one embodiment. [Figure 17]

[0045] This is a flowchart of a method according to one embodiment. [Figure 18]

[0046] This is a flowchart of a method according to one embodiment. [Modes for carrying out the invention]

[0019]

[0047] Hereafter, exemplary embodiments will be described in detail, examples of which are shown in the accompanying drawings. The following description will refer to the accompanying drawings, and unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementations described below in the description of exemplary embodiments do not represent all implementations consistent with the present invention. Rather, they are merely examples of apparatus and methods consistent with embodiments related to the present invention as described in the accompanying claims.

[0020]

[0048] The reduction in the physical size of devices and the improvement in the computing power of electronic devices can be achieved by significantly increasing the mounting density of circuit components such as transistors, capacitors, and diodes on an IC chip. This has been made possible by improvements in resolution, which allows for the fabrication of even smaller structures. For example, an IC chip in a smartphone available before 2019, the size of a thumbnail, could contain more than 2 billion transistors, with each transistor being less than 1 / 1000th the size of a human hair. Therefore, it is not surprising that semiconductor IC manufacturing is a complex and time-consuming process with hundreds of individual steps. Even an error in a single step can dramatically affect the functionality of the final product. Just one "killer defect" can cause a device to fail. The goal of the manufacturing process is to improve the overall yield of the process. For example, to achieve a 75% yield for a process with 50 steps (where a step can represent the number of layers formed on a wafer), each individual step must have a yield of more than 99.4%. If each individual step has a yield of 95%, the overall process yield is low, at 7-8%.

[0021]

[0049] In IC chip manufacturing equipment, while high process yield is desirable, maintaining high substrate (i.e., wafer) throughput, defined as the number of substrates processed per hour, is also essential. High process yield and high substrate throughput can be affected by the presence of defects. This is especially true when operator intervention is required to investigate defects. Therefore, high-throughput detection and identification of microscale and nanoscale defects using inspection tools (such as scanning electron microscopes ("SEM")) is essential to maintain high yield and low costs.

[0022]

[0050] A scanning electron microscope (SEM) includes a scanning device and a detector. The scanning device includes an illumination device containing an electron source for generating primary electrons, and a projection device for scanning a sample, such as a substrate, with one or more focused beams of primary electrons. The primary electrons interact with the sample, generating interaction products such as secondary electrons and / or backscattered electrons. The detector captures the secondary electrons and / or backscattered electrons from the sample as it is scanned, so that the SEM can generate an image of the scanning area of ​​the sample. For high-throughput inspection, some inspection devices use multiple focused beams of primary electrons, i.e., multibeams. The component beams of a multibeam are sometimes called subbeams or beamlets. A multibeam can scan different parts of a sample simultaneously. Therefore, a multibeam inspection device can inspect a sample much faster than a single-beam inspection device.

[0023]

[0051] In multibeam inspection systems, several paths of the primary electron beam are displaced away from the central axis of the scanning device, i.e., the midpoint of the primary electron optical axis (also referred to herein as the charged particle axis). To ensure that all electron beams reach the sample surface at substantially the same angle of incidence, sub-beam paths with a greater radial distance from the central axis must be manipulated to move at a larger angle than sub-beam paths closer to the central axis. This more forceful manipulation can introduce aberrations that blur the resulting image and cause it to defocus. One example is spherical aberration, which causes the focal plane of each sub-beam path to be different. Specifically, with respect to sub-beam paths not on the central axis, the change in the focal plane of the sub-beam increases with radial displacement from the central axis. Such aberrations and defocusing effects can remain associated with secondary electrons when detected from the target, affecting, for example, the shape and size of the spots formed by the sub-beams on the target. Therefore, such aberrations degrade the quality of the resulting image generated during inspection.

[0024]

[0052] The following describes known implementation configurations of multibeam inspection systems.

[0025]

[0053] The figures are schematic diagrams. Therefore, in the drawings, the relative dimensions of the components are enlarged for clarity. In the following description of the drawings, the same or similar reference numbers refer to the same or similar components or entities, and only the differences to individual embodiments are described. Although the description and drawings pertain to electron-optical devices, it should be understood that the embodiments are not used to limit this disclosure to specific charged particles. Therefore, throughout this document, references to electrons can be considered, more generally, to charged particles, and charged particles are not necessarily electrons.

[0026]

[0054] Referring now to Figure 1, which is a schematic diagram showing an exemplary charged particle beam inspection apparatus 100. The charged particle beam inspection apparatus 100 in Figure 1 includes a main chamber 10, a loading lock chamber 20, an electron beam tool 40, an instrument front-end module (EFEM) 30, and a controller 50.

[0027]

[0055] The EFEM30 includes a first loading port 30a and a second loading port 30b. The EFEM30 may include one or more additional loading ports. The first loading port 30a and the second loading port 30b can receive, for example, a front-opening unified pod (FOUP) containing a substrate to be inspected (e.g., a semiconductor substrate or a substrate made of other materials) or a sample (hereinafter, substrates, wafers, and samples are collectively referred to as "samples"). One or more robotic arms (not shown) of the EFEM30 carry the sample into the loading lock chamber 20.

[0028]

[0056] The loading lock chamber 20 is used to remove gas from around the sample. This creates a vacuum, which is a local gas pressure lower than the ambient pressure. The loading lock chamber 20 may be connected to a loading lock vacuum pump system (not shown), which removes gas particles from within the loading lock chamber 20. The operation of the loading lock vacuum pump system allows the loading lock chamber to reach a first pressure below atmospheric pressure. After reaching the first pressure, one or more robotic arms (not shown) carry the sample from the loading lock chamber 20 to the main chamber 10. The main chamber 10 is connected to a main chamber vacuum pump system (not shown). The main chamber vacuum pump system removes gas molecules from within the main chamber 10 so that the pressure around the sample reaches a second pressure below the first pressure. After reaching the second pressure, the sample is carried to an electron beam tool, which can then be examined. The electron beam tool 40 may include a single-beam or multi-beam electron-optical device.

[0029]

[0057] The controller 50 is electronically connected to the electron beam tool 40. The controller 50 may also be a processor (such as a computer) configured to control the charged particle beam inspection device 100. The controller 50 may also include processing circuits configured to perform various signal and image processing functions. In Figure 1, the controller 50 is shown as an external component of the structure, which includes the main chamber 10, the loading lock chamber 20, and the EFEM 30, but it is understood that the controller 50 may also be part of the structure. The controller 50 may be located inside one of the component elements of the charged particle beam inspection device, or the controller 50 may be distributed across at least two of the component elements. While this disclosure provides an example of a main chamber 10 housing an electron beam inspection tool, it should be noted that aspects of this disclosure are not, in a broad sense, limited to chambers housing electron beam inspection tools. Rather, it is understood that the principles described above can be applied to other tools and other arrangements of devices operating under a second pressure.

[0030]

[0058] Referring here to Figure 2, Figure 2 is a schematic diagram showing an exemplary electron beam tool 40, which includes a multibeam inspection tool that is part of the exemplary charged particle beam inspection apparatus 100 of Figure 1. The multibeam electron beam tool 40 (also referred to herein as apparatus 40) includes an electron source 201, a gun aperture plate 271, a focusing lens 210, a source conversion unit 220, a primary projection device 230, a motorized stage 209, and a sample holder 207. The electron source 201, the gun aperture plate 271, the focusing lens 210, and the source conversion unit 220 are components of the illumination apparatus encompassed by the multibeam electron beam tool 40. The sample holder 207 is supported by the motorized stage 209 to hold a sample 208 (e.g., a substrate or a mask) for inspection. The multibeam electron beam tool 40 may further include a secondary projection device 250 and associated electron detection devices 240. The primary projection device 230 may include an objective lens 231. The electronic detection device 240 may include a plurality of detection elements 241, 242, and 243. The beam separator 233 and the deflection scanning unit 232 may be located within the primary projection device 230.

[0031]

[0059] The components used to generate the primary beam can be aligned with the primary electron optical axis of the apparatus 40. These components may include an electron source 201, a gun aperture plate 271, a focusing lens 210, a source conversion unit 220, a beam separator 233, a deflection scanning unit 232, and a primary projection device 230. A secondary projection device 250 and its associated electron detection device 240 can be aligned with the secondary electron optical axis 251 of the apparatus 40.

[0032]

[0060] The primary electron optical axis 204 is comprised of the electron optical axis of the electron beam tool 40, which is an illumination device. The secondary electron optical axis 251 is the electron optical axis of the electron beam tool 40, which is a detection device. The primary electron optical axis 204 may also be referred to herein (for ease of reference) as the principal optical axis or primary charged particle optical axis. The secondary electron optical axis 251 may also be referred to herein as the secondary optical axis or secondary charged particle optical axis.

[0033]

[0061] The electron source 201 may include a cathode (not shown) and an extractor or anode (not shown). During operation, the electron source 201 is configured to emit electrons from the cathode as primary electrons. The primary electrons are extracted or accelerated by the extractor and / or anode to form a primary electron beam 202 that forms a primary beam crossover (virtual or real image) 203. The primary electron beam 202 can be visualized once it is emitted from the primary beam crossover 203.

[0034]

[0062] The formed primary electron beam 202 may be a single beam, and a multibeam may be generated from this single beam. Therefore, at different locations along the beam path, the primary electron beam 202 can be either a single beam or a multibeam. By the time it reaches the sample, preferably before it reaches the projection device, the primary electron beam 202 is a multibeam. Such a multibeam can be generated from the primary electron beam in many different ways. For example, a multibeam can be generated by a multibeam array located before the crossover 203, a multibeam array located in the source conversion unit 220, or a multibeam array located at any point between these locations. A multibeam array may include multiple electron beam manipulating elements arranged in an array along the beam path. Each manipulating element may influence at least a portion of the primary electron beam to generate a subbeam. Thus, the multibeam array generates a multibeam path in the downbeam of the multibeam array by interacting with the incident primary beam path. The interaction of the multibeam array with the primary beam may include one or more aperture arrays, individual deflectors (e.g., for each subbeam), lenses, astigmatism correctors and (aberration) correctors (again, e.g., for each subbeam).

[0035]

[0063] The gun aperture plate 271 is configured to block peripheral electrons of the primary electron beam 202 during operation to reduce the Coulomb effect. The Coulomb effect can enlarge the sizes of the probe spots 221, 222, and 223 of the primary sub-beams 211, 212, and 213, respectively, and thus reduce the inspection resolution. The gun aperture plate 271 may also include multiple apertures for generating primary sub-beams (not shown) even in front of the source conversion unit 220, and may sometimes be called a Coulomb aperture array.

[0036]

[0064] The focusing lens 210 is configured to focus (or collimate) the primary electron beam 202. In some embodiments, the focusing lens 210 may be designed to focus (or collimate) the primary electron beam 202 so that it becomes a substantially parallel beam and is incident substantially perpendicular to the source conversion unit 220. The focusing lens 210 may also be a movable focusing lens, which may be configured such that the position of its principal plane is movable. In some embodiments, the movable focusing lens may be configured to move, for example, along the optical axis 204. Alternatively, the movable focusing lens may consist of two or more electro-optic elements in which the principal plane of the focusing lens moves in response to variations in the intensity of individual electro-optic elements (lenses). The (movable) focusing lens may be configured to be magnetic, electrostatic, or a combination of magnetic and electrostatic lenses. In further embodiments, the focusing lens 210 may be an anti-rotation focusing lens. The anti-rotation focusing lens may be configured to maintain a constant rotation angle when the focusing force (collimating force) of the focusing lens 210 changes, and / or when the principal plane of the focusing lens moves.

[0037]

[0065] In one embodiment of the source conversion unit 220, the source conversion unit 220 may include an image-forming element array, an aberration compensator array, a beam-limiting aperture array, and a pre-bending microdeflector array. The pre-bending microdeflector array may be optional, for example, and may be present in embodiments where the focusing lens does not ensure substantially perpendicular incidence of subbeams originating from the Coulomb aperture array onto the beam-limiting aperture array, image-forming element array, and / or aberration compensator array. The image-forming element array may be configured to generate multiple subbeams of a multi-beam path, i.e., primary subbeams 211, 212, and 213. The image-forming element array may include, for example, multiple electron beam manipulators such as micro-deflectors, microlenses (or a combination thereof) to influence multiple primary sub-beams 211, 212, and 213 of the primary electron beam 202, and to form multiple parallel images (virtual or real images) of the primary beam crossover 203 (one for each of the primary sub-beams 211, 212, and 213). The aberration compensator array may include, for example, an image field curvature compensator array (not shown) and an astigmatism compensator array (not shown). The image field curvature compensator array may include, for example, multiple microlenses for compensating for the image field curvature aberration of the primary sub-beams 211, 212, and 213. The astigmatism compensator array may include multiple micro-astigmatism correctors for compensating for the astigmatism of the primary sub-beams 211, 212, and 213. The beam limiting aperture array may be configured to define the diameters of individual primary subbeams 211, 212, and 213. Figure 2 shows three primary subbeams 211, 212, and 213 as an example, but it should be understood that the source conversion unit 220 may be configured to form any number of primary subbeams. The controller 50 may be connected to various parts of the charged particle beam inspection apparatus 100 in Figure 1, such as the source conversion unit 220, the electronic detection device 240, the primary projection device 230, or the motorized stage 209. As will be described in more detail below, the controller 50 may perform various image and signal processing functions.The controller 50 can also generate various control signals to control the operation of charged particle beam inspection equipment, including a charged particle multibeam device.

[0038]

[0066] The focusing lens 210 may be further configured to adjust the currents of the primary subbeams 211, 212, and 213 in the downbeam of the source conversion unit 220 by varying the focusing force (collimating force) of the focusing lens 210. Alternatively or additionally, the currents of the primary subbeams 211, 212, and 213 may be modified by changing the radial size of the beam limiting apertures in the beam limiting aperture array corresponding to each primary subbeam.

[0039]

[0067] The objective lens 231 can be configured to focus sub-beams 211, 212, and 213 onto the sample 208 for inspection, and in this embodiment, three probe spots 221, 222, and 223 can be formed on the surface of the sample 208.

[0040]

[0068] The beam separator 233 may be, for example, a Wien filter including an electrostatic dipole field and a magnetic dipole field (not shown in Figure 2). When in operation, the beam separator 233 may be configured to exert an electrostatic force on the individual electrons of the primary sub-beams 211, 212, and 213 by the electrostatic dipole field. In one embodiment, the electrostatic force is equal in magnitude to, but opposite in direction to, the magnetic force exerted on the individual primary electrons of the primary sub-beams 211, 212, and 213 by the magnetic dipole field of the beam separator 233. Thus, the primary sub-beams 211, 212, and 213 can pass through the beam separator 233 at least substantially straight with at least substantially zero deflection angle. The direction of the magnetic force depends on the direction of electron motion, while the direction of the electrostatic force does not depend on the direction of electron motion. Therefore, since secondary electrons and backscattered electrons generally move in the opposite direction to primary electrons, the magnetic force acting on secondary electrons and backscattered electrons no longer cancels out the electrostatic force, and as a result, the secondary electrons and backscattered electrons traveling through the beam separator 233 are deflected away from the optical axis 204.

[0041]

[0069] The deflection scanning unit 232 is configured, during operation, to deflect the primary sub-beams 211, 212, and 213 to scan probe spots 221, 222, and 223 across individual scanning areas of a section of the surface of sample 208. In response to the incidence of the primary sub-beams 211, 212, and 213 onto the probe spots 221, 222, and 223 on sample 208, electrons, including secondary electrons and backscattered electrons, are generated from sample 208. In this embodiment, the secondary electrons propagate in three secondary electron beams 261, 262, and 263. The secondary electron beams 261, 262, and 263 generally have secondary electrons (with electron energies of 50 eV or less) and may also have at least some backscattered electrons (with electron energies between 50 eV and the landing energies of the primary sub-beams 211, 212, and 213). The beam separator 233 is positioned to deflect the paths of the secondary electron beams 261, 262, and 263 toward the secondary projection device 250. Subsequently, the secondary projection device 250 focuses the paths of the secondary electron beams 261, 262, and 263 onto a plurality of detection regions 241, 242, and 243 of the electron detection device 240. The detection regions may be, for example, separate detection elements 241, 242, and 243 positioned to detect the corresponding secondary electron beams 261, 262, and 263. The detection regions may generate corresponding signals, which are sent, for example, to a controller 50 or a signal processing system (not shown) to construct an image of the corresponding scanning area of ​​the sample 208.

[0042]

[0070] Detection elements 241, 242, and 243 can detect the corresponding secondary electron beams 261, 262, and 263. When the secondary electron beam is incident on detection elements 241, 242, and 243, the elements may generate corresponding intensity signal outputs (not shown). The outputs may be directed to an image processing system (e.g., controller 50). Each detection element 241, 242, and 243 may contain one or more pixels. The intensity signal output of a detection element may also be the sum of the signals generated by all pixels within the detection element.

[0043]

[0071] The controller 50 may include an image processing system including an image acquirer (not shown) and a storage device (not shown). For example, the controller may include a processor, computer, server, mainframe host, terminal, personal computer, any type of mobile computing device, or a combination thereof. The image acquirer may include at least some of the processing functions of the controller. Therefore, the image acquirer may include at least one or more processors. The image acquirer may be communicatively coupled to an electronic detection device 240 of a device 40 that enables signal communication, such as a conductor, optical fiber cable, portable storage medium, IR, Bluetooth, the Internet, wireless network, wireless radio, or a combination thereof. The image acquirer can receive signals from the electronic detection device 240, process the data contained in the signals, and construct an image therefrom. Therefore, the image acquirer can acquire an image of sample 208. The image acquirer can also perform various post-processing functions, such as contour generation and superimposition of indicators onto the acquired image. The image acquirer may be configured to adjust the brightness and contrast of the acquired image. The storage may be a storage medium such as a hard disk, flash drive, cloud storage, random access memory (RAM), or other types of computer-readable memory. The storage may also be combined with an image acquirer and can be used to save scanned raw image data as the original image or to save post-processed images.

[0044]

[0072] The image acquirer can acquire one or more images of a sample based on an imaging signal received from the electronic detection device 240. The imaging signal may correspond to a scanning operation for performing charged particle imaging. The acquired image may be a single image containing multiple imaging areas. The single image can be stored in storage. The single image may be the original image which can be divided into multiple regions. Each region may contain one imaging area containing features of sample 208. The acquired image may contain multiple images of a single imaging area of ​​sample 208 sampled multiple times over a period of time. The multiple images can be stored in storage. The controller 50 may be configured to perform image processing steps using multiple images of the same location of sample 208.

[0045]

[0073] The controller 50 may include a measurement circuit (e.g., an analog-to-digital converter) to obtain the distribution of detected secondary electrons. The electron distribution data collected during the detection time window can be used in combination with the corresponding scan path data of the primary sub-beams 211, 212, and 213 incident on the sample surface to reconstruct an image of the sample structure under inspection. The reconstructed image can be used to reveal various features of the internal or external structure of the sample 208. Thus, the reconstructed image can be used to reveal any defects that may be present in the sample.

[0046]

[0074] The controller 50 can, for example, further control the motorized stage 209 to move the sample 208 during, before, or after inspection of the sample 208. In one embodiment, the controller 50 may enable the motorized stage 209 to move the sample 208 in a certain direction, for example, continuously, for example, at a constant speed, at least during the inspection of the sample. The controller 50 can control the movement of the motorized stage 209 so that the speed of movement of the sample 208 changes depending on various parameters, for example. For example, the controller can control the stage speed (including its direction) according to the characteristics of the inspection step in the scanning process.

[0047]

[0075] Figure 2 shows that the apparatus 40 uses three primary electron subbeams, but it is understood that the apparatus 40 may use two or more primary electron subbeams. This disclosure does not limit the number of primary electron beams used in the apparatus 40.

[0048]

[0076] Referring now to Figure 3, Figure 3 is a schematic diagram of an exemplary multibeam apparatus showing an exemplary configuration of the source conversion unit of the exemplary charged particle beam inspection apparatus of Figure 1. Apparatus 300 may include an electron source 301, a pre-subbeamforming aperture array 372 (also called Coulomb aperture array 372), a focusing lens 310 (similar to the focusing lens 210 in Figure 2), a source conversion unit 320, an objective lens 331 (similar to the objective lens 231 in Figure 2), and a sample 308 (similar to the sample 208 in Figure 2). The electron source 301, the Coulomb aperture array 372, and the focusing lens 310 may also be components of the illumination apparatus included by apparatus 300. The source conversion unit 320 and the objective lens 331 may also be components of the projection apparatus included by apparatus 300. The source conversion unit 320 may be similar to the source conversion unit 220 in Figure 2, where the image-forming element array in Figure 2 is the image-forming element array 322, the aberration compensator array in Figure 2 is the aberration compensator array 324, the beam-limiting aperture array in Figure 2 is the beam-limiting aperture array 321, and the pre-bent micro-deflector array in Figure 2 is the pre-bent micro-deflector array 323. The electron source 301, Coulomb aperture array 372, focusing lens 310, source conversion unit 320, and objective lens 331 are aligned with the primary electron optical axis 304 of the apparatus. The electron source 301 generates a primary electron beam 302 along approximately the primary electron optical axis 304 and using a (virtual or real) source crossover 301S. The Coulomb aperture array 372 cuts peripheral electrons from the primary electron beam 302 to reduce the resulting Coulomb effect. The primary electron beam 302 can be reduced to a specified number of subbeams (such as three subbeams 311, 312, and 313) by the Coulomb aperture array 372 of the pre-subbeamforming mechanism. While the three subbeams and their paths are mentioned above and below, it should be understood that this description is intended for application to devices, tools, or systems using any number of subbeams.

[0049]

[0077] The source conversion unit 320 may include a beamlet limiting aperture array 321 having beam limiting apertures configured to define the outer dimensions of the sub-beams 311, 312, and 313 of the primary electron beam 302. The source conversion unit 320 may also include an image-forming element array 322 having image-forming micro-deflectors 322_1, 322_2, and 322_3. Each micro-deflector is associated with the path of each sub-beam. The micro-deflectors 322_1, 322_2, and 322_3 are configured to deflect the paths of the sub-beams 311, 312, and 313 toward the electron optical axis 304. The deflected sub-beams 311, 312, and 313 form a virtual image (not shown) of the source crossover 301S. In this embodiment, these virtual images are projected onto the sample 308 by the objective lens 331, forming probe spots on the sample, which are three probe spots 391, 392, and 393. Each probe spot corresponds to the incident location of the sub-beam path on the sample surface. The source conversion unit 320 may further include an aberration compensator array 324 configured to compensate for any aberrations that may be present in each sub-beam. The aberration compensator array 324 may include, for example, a field curvature compensator array (not shown) with microlenses. The field curvature compensator and microlenses may be configured to compensate for individual sub-beams with respect to significant field curvature at probe spots 391, 392, and 393. The aberration compensator array 324 may include an astigmatism compensator array (not shown) with a micro astigmatism correction device. The micro-astigmatism correction device can be controlled, for example, to act on the sub-beam to compensate for astigmatism otherwise present in probe spots 391, 392, and 393.

[0050]

[0078] The source conversion unit 320 may further include a pre-bending microdeflector array 323, which comprises pre-bending microdeflectors 323_1, 323_2, and 323_3 for bending the sub-beams 311, 312, and 313, respectively. The pre-bending microdeflectors 323_1, 323_2, and 323_3 can bend the sub-beam paths toward the beamlet-limiting aperture array 321. In one embodiment, the pre-bending microdeflector array 323 may be configured to bend the sub-beam path toward a plane orthogonal to the beamlet-limiting aperture array 321. In an alternative embodiment, the focusing lens 310 may adjust the path direction of the sub-beam toward the beamlet-limiting aperture array 321. The focusing lens 310 can, for example, focus (collimate) the three sub-beams 311, 312, and 313 so that they form a beam substantially parallel to the primary electron optical axis 304, and so the three sub-beams 311, 312, and 313 are incident substantially perpendicularly on the source conversion unit 320, which may correspond to a beamlet limiting aperture array 321. In such alternative embodiments, a pre-bent micro-deflector array 323 may not be necessary.

[0051]

[0079] The image-forming element array 322, the aberration compensator array 324, and the pre-bending micro-deflector array 323 may include multiple layers of the sub-beam manipulating device, some of which may be in an array shape (e.g., micro-deflectors, microlenses, or micro-astigmatism correction devices).

[0052]

[0080] In this example of the source conversion unit 320, the sub-beams 311, 312, and 313 of the primary electron beam 302 are deflected toward the primary electron optical axis 304 by the micro-deflectors 322_1, 322_2, and 322_3 of the image-forming element array 322, respectively. It is understood that the path of sub-beam 311 may not need to be deflected by the micro-deflector 322_1, since the path of sub-beam 311 may already coincide with the electron optical axis 304 before reaching the micro-deflector 322_1.

[0053]

[0081] The objective lens 331 focuses the sub-beams onto the surface of the sample 308, that is, the objective lens 331 projects three virtual images onto the sample surface. The three images formed on the sample surface by the three sub-beams 311-313 form three probe spots 391, 392, and 393 on the sample surface. In one embodiment, the deflection angles of the sub-beams 311-313 are adjusted to pass through the front focal point of the objective lens 331 or approach the front focal point of the objective lens 331 in order to reduce or limit the off-axis aberration of the three probe spots 391-393.

[0054]

[0082] In the embodiment of the multibeam inspection tool 300 shown in Figure 3, the secondary electron beam path, beam separator (similar to the Wien filter 233), secondary projection optics (similar to the secondary projection optics 250 in Figure 2), and electron detection device (similar to the electron detection device 240) are omitted for clarity. However, it should be apparent that similar beam separators, secondary projection optics, and electron detection devices may be present in this embodiment of Figure 3 for registering and generating an image of the sample surface using secondary electrons or backscattered electrons.

[0055]

[0083] At least some of the components shown in Figures 2 and 3 are sometimes referred to as manipulator arrays or manipulators, individually or in combination with each other, because they manipulate one or more charged particle beams or sub-beams.

[0056]

[0084] The above embodiment of a multibeam inspection tool includes a multibeam charged particle apparatus (sometimes called a multibeam charged particle optical apparatus) with a single charged particle source. The multibeam charged particle apparatus includes an illumination device and a projection device. The illumination device can generate a charged particle multibeam from the electron beam of the source. The projection device projects the charged particle multibeam toward the sample. At least a portion of the surface of the sample can be scanned with the charged particle multibeam.

[0057]

[0085] A multibeam charged particle system includes one or more electro-optical devices for manipulating subbeams of a multibeam of charged particles. The operations applied may include, for example, deflection of the subbeam path and / or focusing operations applied to the subbeam. The one or more electro-optical devices may include MEMS.

[0058]

[0086] The charged particle apparatus may include a beam path manipulator located up-beam of the electro-optical device, and optionally located within the electro-optical device. The beam path may be linearly manipulated in a direction perpendicular to the charged particle axis, i.e., the optical axis, by two sets of electrostatic deflectors operating across the entire beam. The two sets of electrostatic deflectors may be configured to deflect the beam path in the orthogonal direction. Each set of electrostatic deflectors may include two electrostatic deflectors arranged contiguously along the beam path. The first electrostatic deflector in each set provides corrective deflection, and the second electrostatic deflector restores the beam to the correct angle of incidence to the electro-optical device. The corrective deflection provided by the first electrostatic deflector may be overcorrected so that the second electrostatic deflector can provide deflection to ensure a desired angle of incidence to the MEMS. The locations of the electrostatic deflector sets may be several locations up-beam of the electro-optical device. The beam path may be rotationally manipulated. Rotational correction may be provided by a magnetic lens. Additionally or alternatively, rotational compensation may be achieved by existing magnetic lenses, such as a focusing lens configuration.

[0059]

[0087] In charged particle systems, such as multi-beam charged particle systems, it may be necessary to replace electro-optical devices. For example, different electro-optical devices may be required for specific applications, such as when a different beam specification of the charged particle system is needed. Another example is when an electro-optical device within the charged particle system fails and needs to be replaced.

[0060]

[0088] Known techniques for replacing electro-optical devices in charged particle devices involve at least partially disassembling the device so that a replacement electro-optical device can be installed. The result of at least partial disassembly is the loss of the vacuum within the device. After the replacement electro-optical device is installed, the device must be reassembled. At this time, the vacuum within the device must be restored, a process that can take several hours. Therefore, known techniques for replacing electro-optical devices in charged particle devices are complex and time-consuming.

[0061]

[0089] The replacement electro-optical device also needs to be properly positioned within the charged particle apparatus so that it is properly aligned with the beam or multibeam of the charged particle path.

[0062]

[0090] The embodiments improve upon known techniques for replacing electro-optical devices in charged particle apparatuses. The embodiments also provide coarse and / or fine positioning techniques for appropriately aligning electro-optical devices with a beam or multibeam of a charged particle path, with up to six degrees of freedom.

[0063]

[0091] According to the embodiment, the electro-optical device is supported by a module within a charged particle apparatus, such as a multi-beam charged particle apparatus. The module can be easily removed from and reinserted into the charged particle apparatus. Thus, the module is a field-replaceable component of the charged particle apparatus. Field-replaceable is intended to mean that the component can be replaced in a factory where the charged particle apparatus is in operation, without the need to remove the charged particle apparatus. The component can be easily removed and efficiently replaced so as to minimize tool downtime and keep the mechanical process as simple as possible. This attempts to maximize uptime and reduce the resources required for repair time and component replacement. Therefore, the process for replacing an electro-optical device in a charged particle apparatus includes removing the module, replacing the electro-optical device supported by the module, and then reinserting the module into the charged particle apparatus. Alternatively, different modules containing different electro-optical devices may be inserted into the charged particle apparatus. Substantial disassembly and reassembly of at least a portion of the charged particle apparatus is advantageously unnecessary. For example, if the electro-optical device needs to be replaced due to a change in the use of the charged particle device or due to a malfunction of the electro-optical device, the downtime of the charged particle device can be significantly reduced.

[0064]

[0092] The electro-optical device supported by the module according to the embodiment may include a MEMS device and a PCB. The PCB may provide a stage for the MEMS device. The MEMS device of the electro-optical device may be for manipulating a charged particle beam or a multibeam. The electro-optical device may be fixed to the module's stage.

[0065]

[0093] The embodiment includes providing a vacuum lock in the charged particle device so that the portion of the charged particle device housing the replaceable module can be separated from the vacuum state of the rest of the charged particle device. The time required to establish a vacuum state after the module is inserted is advantageously significantly less than the time required to establish a vacuum state for the entire charged particle device.

[0066]

[0094] The module according to the embodiment may be configured so that the electro-optical device can move relative to the body of the module. This movement allows the electro-optical device to be repositioned after the module has been installed so that the electro-optical device 404 can be properly aligned with the charged particle beam or multibeam.

[0067]

[0095] The embodiments will be described in more detail below.

[0068]

[0096] Figure 4A is a schematic diagram of a part of the charged particle apparatus 401 according to one embodiment. Figure 4B is a schematic diagram of a part of the charged particle apparatus 401 shown in Figure 4A.

[0069]

[0097] The charged particle device 401 includes a source 402. The source 402 emits a charged particle beam, referred to herein as the source beam. Similar to the optical axes 204 and 304 described above, a charged particle axis exists within the charged particle device 401. A charged particle beam path 403, which may be a multi-beam path, referred herein as the charged particle path 403, may substantially align with the charged particle axis.

[0070]

[0098] The electro-optical device 404 is located in the charged particle path 403. The electro-optical device 404 may be supported in the charged particle path 403 by module 405. An opening exists in the wall of the charged particle apparatus 401 such that module 405, and consequently the electro-optical device 404 supported by module 405, are interchangeable components of the charged particle apparatus 401. The charged particle apparatus 401 includes an up-beam vacuum lock 406. The up-beam vacuum lock 406 is closer to the source 402 than module 405. The charged particle apparatus 401 also includes a down-beam vacuum lock 407. The down-beam vacuum lock 407 is further from the source 402 than module 405. During operation, the sample / substrate 408 is irradiated with a charged particle beam or multi-beam emitted from the charged particle apparatus 401.

[0071]

[0099] The embodiment includes several techniques for ensuring that the electro-optical device 404 is properly aligned with the charged particle path 403. Proper alignment may require positional adjustments of the electro-optical device 404 and / or the charged particle path 403 in several degrees of freedom. Specifically, the charged particle path 403 may define a z-direction. In a plane orthogonal to the charged particle path 403, orthogonal x and y directions may be defined. Up to six degrees of freedom may be defined as linear positional adjustments in the x, y, and z directions, as well as rotational positional adjustments around the x-axis (i.e., Rx), y-axis (i.e., Ry), and z-axis (i.e., Rz). It is worth noting that some of the devices, which can be mounted on a field-replaceable module, may be planar or have a planar structure. In operation, this structure may be alignable with a plane orthogonal to the beam path, and therefore the planar structure may be present along the x and y axes and rotatable around Rz.

[0072]

[0100] The embodiments include coarse alignment techniques and fine alignment techniques for making positional adjustments. The coarse alignment technique may include a pre-calibration technique.

[0073]

[0101] Coarse alignment techniques can position the electro-optical device 404 within a known region of the physical structure of the charged particle device 401. For example, coarse alignment techniques can position the electro-optical device 404 within a known region of the vacuum chamber of the charged particle device 401 for receiving the housing and / or module 405 of the charged particle device 401. Coarse alignment techniques are provided by the connection between the flange 701 of the module 405 and the charged particle device 401, as shown by 411 in Figure 4B. In other words, coarse alignment techniques allow for the fixing of the module 405 to the charged particle device 401 by means of a frame (not shown) or the like to fix the module in the coordinate system of the charged particle device 401. Alignment pins are used in the connection between the flange 701 and the charged particle device 401. Alignment pins can make it possible to determine the position of the module 405 relative to the charged particle device 401 with up to six degrees of freedom. The position of module 405 is known to be subject to tolerances in the coarse alignment process. The coarse positioning technique will be described in more detail below in the sixth embodiment.

[0074]

[0102] The pre-calibration technique according to the embodiment may be applied before the module 405 is inserted into the charged particle device 401. The pre-calibration technique is shown by 410 in Figure 4B. The pre-calibration technique adjusts the position of the electro-optical device 404 fixed to the module 405 relative to the body of the module 405, and in particular relative to the flange 701 of the module 405. The pre-calibration technique can adjust the position of the electro-optical device 404 relative to the flange 701 with up to six degrees of freedom. The pre-calibration technique will be described in more detail below in the seventh embodiment.

[0075]

[0103] The micro-alignment technique is used to align the electro-optical device 404 with the charged particle path 403.

[0076]

[0104] The fine alignment technique may include mechanically adjusting the position of the electro-optical device 404 relative to the body of module 405 when module 405 is installed in the charged particle device 401, as shown by 409 in Figure 4B. The mechanical fine alignment technique can adjust the position of the electro-optical device 404 with up to six degrees of freedom. In a preferred implementation, the mechanical fine alignment technique can adjust the position of the electro-optical device 404 with three degrees of freedom (i.e., x, y, and Rz). The mechanical fine alignment technique will be described in more detail in the first to fifth embodiments.

[0077]

[0105] The fine alignment technique may additionally or alternatively include electronically adjusting the position of the charged particle path 403 relative to the electro-optical device 404 when the electro-optical device 404 is installed in the charged particle apparatus 401, as shown by 412 in Figure 4B. The electronic fine alignment technique may use electrostatic and magnetic manipulators and lenses to adjust the position of the charged particle path 403 with up to six degrees of freedom, for example. In a preferred implementation, the electronic fine alignment technique may adjust the position of the electro-optical device 404 with four degrees of freedom (i.e., x, y, z, and Rz). Adjustment of the charged particle path 403 in the z direction may be achieved by changing the focus of the charged particle beam or multibeam. The electronic fine alignment technique will be described in more detail in the eighth embodiment.

[0078]

[0106] Coarse alignment techniques and pre-calibration techniques are passive techniques in that they are applied before and during the process of fixing the electro-optical device 404 to the charged particle apparatus 401. Fine alignment techniques are active techniques in that they are applied mechanically or electronically after the electro-optical device 404 has been installed in the charged particle apparatus 401.

[0079]

[0107] Although not shown in Figures 4A and 4B, the charged particle apparatus 401 may include alternative and / or additional components on the charged particle path 403, such as lenses and other components as previously described with reference to Figures 1-3. Specifically, embodiments also include a charged particle projection apparatus that splits the charged particle beam from the source into a plurality of sub-beams. Each of the plurality of objective lenses may project a sub-beam onto the sample. In some embodiments, a plurality of focusing lenses are provided in the up beam from the objective lens. The focusing lenses focus each sub-beam to an intermediate focus in the up beam of the objective lens. In some embodiments, a collimator is provided in the up beam from the objective lens. Correctors may be provided to reduce focus error and / or aberrations. In some embodiments, such correctors are incorporated into the objective lens or positioned directly adjacent to the objective lens. If a focusing lens is provided, such a compensator may be additionally or alternatively incorporated into the focusing lens, positioned directly adjacent to the focusing lens, and / or positioned at an intermediate focal point, or positioned directly adjacent to an intermediate focal point. A detector is provided to detect charged particles emitted by the sample. The detector may be incorporated into the objective lens. The detector may be positioned on the bottom surface of the objective lens so as to face the sample in use. The focusing lens, objective lens, and / or detector may be formed as MEMS or CMOS devices.

[0080]

[0108] As shown in Figure 4A, the up-beam vacuum lock 406 and the down-beam vacuum lock 407 allow the vacuum chamber of the charged particle apparatus to be separated from the vacuum state of the rest of the charged particle apparatus 401.

[0081]

[0109] The process for replacing module 405 may include the following steps: Power supply to the source may be shut off to prevent the release of charged particles. The up-beam vacuum lock 406 and down-beam vacuum lock 407 may be closed so that the area of ​​the charged particle apparatus 401 containing module 405 can be separated from the vacuum state of the rest of the charged particle apparatus 401. Next, the area of ​​the charged particle apparatus 401 containing module 405 may be ventilated and module 405 may be removed from the charged particle apparatus 401. Next, the new module, which has been pre-calibrated, may be inserted and secured to the charged particle apparatus 401 using coarse positioning techniques according to the embodiment. A pumping process may be performed to return the area of ​​the charged particle apparatus 401 containing module 405 to a vacuum state, and a baking process may also be performed. Next, both the up-beam vacuum lock 406 and down-beam vacuum lock 407 may be opened. Power supply to the source may be turned on so that charged particles can be released. When the up-beam vacuum lock 406 and the down-beam vacuum lock 407 are open, these locks do not obstruct the charged particle path 403. Therefore, the charged particle path 403 can pass through both the up-beam vacuum lock 406 and the down-beam vacuum lock 407 when both are open. Mechanical fine alignment processes according to embodiments may be performed. High-voltage tests may be performed. Electrical fine alignment processes according to embodiments may be performed. Once it is determined that the electro-optical device is properly aligned with the charged particle path 403, the charged particle apparatus 401 is ready for use at any time.

[0082]

[0110] Figures 5 and 6 are schematic diagrams of module 405 installed in the charged particle device 401.

[0083]

[0111] Figure 5 shows a schematic cross-sectional view through module 405 and the portion of the charged particle apparatus 401 containing module 405. The cross-section lies in a plane that can be perpendicular to the charged particle path 403.

[0084]

[0112] For module 405 to be replaceable, it is preferable that both module 405 can be removed and inserted into the charged particle device 401 without substantial movement of substantial components of the charged particle device 401. In Figure 5, components 501, 502, and 504 are depictions of components of the charged particle device 401. Component 504 may also be a structure that defines the volume to which the module must fit. For example, component 504 may be a vacuum chamber wall. Components 501 and 502 may also be substantial components of the charged particle device, such as a flood column or other substantial components that limit the maximum size of component 504.

[0085]

[0113] The nearest spacing across component 504 may be, for example, within the range of 80mm to 120mm. The maximum width of module 405 should be less than or equal to the nearest spacing across component 504.

[0086]

[0114] Module 405 includes an electro-optical device 404. The module may include a flange 701. Support circuits and connections for the electro-optical device 404 may be present within the flange.

[0087]

[0115] Figure 6 shows another schematic cross-sectional view through a portion of the charged particle apparatus 401, including module 405. The cross-section lies in a plane that may contain the charged particle path 403. The electro-optical device supported by the module is shown, but the body of the module is not.

[0088]

[0116] In Figure 6, components 601 and 602 are components of the charged particle device 401, between which module 405 needs to be fitted. Component 601 may be a component of the lighting device, such as an up-beam vacuum lock 406 or other components. Component 602 may be a down-beam vacuum lock 407 or other components. The closest distance between the parts of the charged particle device 401 between which module 405 needs to be fitted, in the direction along the charged particle path 403, may be in the range of 40 mm to 70 mm. The maximum height of module 405 should be less than or equal to this closest distance along the charged particle path 403.

[0089]

[0117] Figure 7 shows a further schematic cross-sectional view through module 405 and the portion of the charged particle device 401 containing module 405. The cross-section lies in the same plane as shown in Figure 6. As indicated by the arrows, Figure 7 shows module 405 in the process of being installed within the charged particle device 401.

[0090]

[0118] Module 405 includes a body 702 that supports the electro-optical device 404. The body 702 is the portion of Module 405 that is inserted into the charged particle device 401. The body 702 of Module 405 may be inserted into a vacuum chamber for receiving Module 405 within the charged particle device 401. Module 405 also includes a flange 701, referred to herein as the module flange 701. The module flange 701 may be a portion of Module 405 that can be fixed to and detached from the charged particle device 401. The module flange 701 remains outside the charged particle device 401 and is not inserted into the charged particle device 401. Several electrical connectors may be provided between the electro-optical device 404 and the support circuit within the flange 701.

[0091]

[0119] The positions of other components in the charged particle device 401 define the charged particle path 403. Module 405 can position the electro-optical device 404 within the charged particle device 401 so that the electro-optical device 404 can be located on the charged particle path 403. After module 405 is fixed to the charged particle device 401, fine adjustments to the position of the electro-optical device 404 and / or the charged particle path may be made so that the electro-optical device is properly aligned with the charged particle path 403.

[0092]

[0120] The embodiments include several different techniques for fine-tuning the position of the electro-optical device 404 relative to the charged particle path 403 when module 405 is fixed to the charged particle device 401.

[0093]

[0121] Module 405 may include a support configuration arranged to support the electro-optical device 404 in module 405. The electro-optical device 404 is held by the support configuration so that it is fixed to the support configuration. The electro-optical device 404 may include a PCB / stage fixed to the support configuration. Additionally or alternatively, the support configuration may include a stage to which the electro-optical device 404 is fixed.

[0094]

[0122] Module 405 may further include a support positioning system positioned to move the support configuration relative to the main body 702 of module 405. The electro-optical device 404 is fixed to the support configuration and is thereby moved when the support positioning system moves the support configuration.

[0095]

[0123] The electro-optical device 404 may be a substantially planar structure substantially orthogonal to the charged particle path 403. The plane of the electro-optical device 404 is sometimes called the xy-plane. The charged particle axis is sometimes called the z-axis. The module can also be considered a substantially planar structure substantially located in the xy-plane.

[0096]

[0124] The support configuration and support positioning system may also be substantially planar structures within the xy-plane.

[0097]

[0125] The support positioning system may include a position detection system for determining the movement and / or position of the support configuration. Using the position detection system can improve the accuracy of the movement and positioning of the support configuration. The position detection system can determine the position of the support configuration using grid marks such as encoders. The position detection system can determine the movement and / or position of the support configuration and / or the electro-optical device 404 using features of the support configuration and / or the electro-optical device 404. For example, the support configuration and / or the electro-optical device 404 may include features such as markers (e.g., fiducials), alignment apertures (e.g., for use in the manufacture of the electro-optical device 404), and functional features (e.g., apertures through a beam manipulator). Any of these features can be used to determine the movement and / or position of the support configuration and / or the electro-optical device 404, thereby determining the accuracy of the applied movement.

[0098]

[0126] Figure 8 shows a schematic cross-sectional view through module 405 according to the first embodiment. The cross-section lies in a plane containing the charged particle path 403 and shows some details of the support positioning system 801 of the first embodiment.

[0099]

[0127] Figure 9 shows a schematic cross-sectional view through module 405 according to the first embodiment. The cross-section lies in a plane perpendicular to the charged particle path 403 and shows some further details of the support positioning system 801 of the first embodiment.

[0100]

[0128] The support configuration 807 is positioned to hold the electro-optical device 404. The support configuration 807 is fixed to the support positioning system 801. In this embodiment, the support configuration 807 may be a separate component from the support positioning system 801, or it may be fixed to the support positioning system 801. For example, the support configuration may include a flexure configuration to accommodate the thermal expansion of the electro-optical device. Alternatively, the support configuration 807 may be integrated with the support positioning system 801 such that the support configuration 807 and the support positioning system 801 are part of the same structure.

[0101]

[0129] The support positioning system 801 includes a substantial disk. The disk has an up-beam surface and a down-beam surface. The up-beam surface and the down-beam surface are opposite principal surfaces of the disk. In this embodiment, the up-beam surface of the disk is the principal surface of the disk closest to the electro-optical device 404. The down-beam surface of the disk is the principal surface of the disk furthest from the electro-optical device 404 and faces a portion of the base 805 of module 405. However, this is simply a design choice in this design, and it should become clear that the electro-optical device 404 may be positioned closer to the down-beam surface of the disk.

[0102]

[0130] The disk may be substantially annular and may include a preferred central opening 806 for the charged particle path 403. The support configuration 807 may also be substantially annular and may include a central opening for the charged particle path 403. In plan view, the outer circumference of the disk may be substantially circular. However, embodiments also include outer circumferences of disks that are not substantially circular in plan view. For example, the outer circumference of the disk may be substantially hexagonal or have an irregular shape.

[0103]

[0131] In this embodiment, the disc is supported in module 405 by a plurality of ball bearings 803, 804, or other types of load-bearing rotatable objects. One or more ball bearings 804 may be in contact with the up-beam surface of the disc. For example, there may be three ball bearings 804 in contact with the up-beam surface of the disc. There may be at least three ball bearings 803 in contact with the down-beam surface of the disc. Alternatively, instead of ball bearings, springs may be provided in contact with the up-beam surface of the disc. The springs may be positioned to apply force to the up-beam surface guided toward the base 805 of module 405.

[0104]

[0132] Each ball bearing 803 in contact with the down beam surface may also be in contact with the base 805 of module 405. Each ball bearing 804 in contact with the up beam surface of the disc may also be in contact with a plate 808 in contact with a spring 802, such as a leaf spring, compression spring, or other type of elastic member. Each spring 802 may also be an axle spring. Each spring 802 may be fixed to the housing of module 405, including the base 805 of module 405. The spring 802 applies a force that presses all of the ball bearings 803, 804 against the disc. The ball bearings 803 in contact with the down beam surface are also pressed against the base of module 405. Thereafter, all of the ball bearings 803, 804 are held in place under the compression of the spring 802.

[0105]

[0133] While there may be one corresponding spring for each plate 808, embodiments also include the presence of a single annular axis spring acting on all plates. Alternatively, two or more springs may be used, and the number of springs used is not limited to the number of plates 808.

[0106]

[0134] In the alternative configuration, the shaft spring is provided where plate 808 is shown in Figure 8, and the rigid plate is provided where spring 802 is shown. The shaft spring, which may be a compression spring or another type of elastic member, similarly applies a force that presses all of the ball bearings 803 and 804 against the disk.

[0107]

[0135] Multiple actuators 901, 902, and 903 are provided to move the disk within the plane of module 405. Each actuator 901, 902, and 903 may include an actuator arm. Each actuator arm may be part of actuators 901, 902, and 903. Alternatively, each actuator arm may be a separate component from each actuator 901, 902, and 903, with each actuator arm connected to the actuators 901, 902, and 903. Roller bearings at the ends of each actuator arm, or other means may be present to allow the actuators to move along the disk 801 with relatively little friction. Each actuator 901, 902, and 903 may be a linear actuator having a longitudinal axis, for example, configured so that the actuator arm moves along the longitudinal axis. Some or all of actuators 901, 902, and 903 can be operated, for example, manually and / or automatically. Alternatively, some or all of the actuators 901, 902, and 903 may be motorized, pneumatically controlled, or otherwise movable so that the actuator arms can be moved automatically. The disc in this embodiment includes a plurality of receiving portions 906, 907, and 908 in the sidewall of the disc. Each receiving portion 906, 907, and 908 may be positioned to receive one end of an actuator arm so that the actuator arm can apply force to the disc. Each of the receiving portions 906 and 908 may be a substantially smooth surface of the cylindrical sidewall of the disc. Roller bearings at the end of each actuator arm allow movement along the sidewall. Receiving portion 907 may constitute, for example, a recess, groove, or other structural element in the sidewall of the disc. Alternatively, each receiving portion 906, 907, and 908 may constitute, for example, a recess, groove, or other structural element in the sidewall of the disc.

[0108]

[0136] The first actuator 901 may be positioned to move the disk in a first linear direction that may exist in the xy-plane. The second actuator 902 may be positioned to move the disk in a second direction that is orthogonal to the first direction and may also exist in the xy-plane. The third actuator 903 may be positioned to impart a rotation to the disk in the xy-plane, which may be, for example, Rz rotation (i.e., movement of the disk about the z axis).

[0109]

[0137] In this embodiment, the first actuator 901 may be oriented such that its longitudinal axis is aligned with the first direction and the center of rotation of the disk in Rz. Thus, movement of the arm of the first actuator 901 along the longitudinal axis moves the disk only in the first direction and does not substantially rotate the disk. Movement by the arm in the first direction creates relative motion between the receiving portions 908, 907, and 906 and the corresponding rollers, so that the rollers can roll on the surfaces of the receiving portions 908, 907, and 906.

[0110]

[0138] In this embodiment, the second actuator 902 may be oriented such that its longitudinal axis is aligned with the second direction and the center of rotation of the disk in Rz. Thus, movement of the arm of the second actuator 902 along the longitudinal axis moves the disk only in the second direction and does not substantially rotate the disk. Movement by the arm in the second direction creates relative motion between the receiving portions 908, 907, and 906 and the corresponding rollers, so that the rollers can roll on the surfaces of the receiving portions 908, 907, and 906.

[0111]

[0139] This embodiment further illustrates a third actuator 903 that can be oriented such that the longitudinal axis of the third actuator 903 is not aligned with the center of rotation of the disk at Rz. The receiving portion 907 of the longitudinal axis of the arm of the third actuator may be a projection from the side wall of the disk. Thus, movement of the arm of the third actuator 903 along the longitudinal axis rotates the disk. The rotational movement of the disk generates relative rotational motion between the receiving portions 908, 907, 906 and the corresponding rollers, so that the rollers can roll on the surfaces of the receiving portions 908, 907, 906.

[0112]

[0140] The support positioning system 801 may also include a plurality of plane springs 904, 905, or other force-applying devices or elastic members for biasing the position of the disk in the xy plane of module 405 to the actuator.

[0113]

[0141] Each of the planar springs 904, 905 may be, for example, linear springs positioned to apply force in the direction of the longitudinal axis. The ends of each planar spring 904, 905 may be fixed to the base 805 of module 405, and the opposite ends of each spring 904, 905 may be fixed to the side wall of the disk or pressed against the side wall of the disk.

[0114]

[0142] The longitudinal axis of the xy plane spring 905 can be aligned with the center of the disk's Rz rotation (which is located at the center of the opening 806, as shown in Figure 9). The xy plane spring 905 can be described as being positioned on the opposite side of the disk from the receiving portion 908 of the actuator arm of the first actuator 901 and the receiving portion 906 of the actuator arm of the second actuator 902, for example. That is, the connection of the xy plane spring 905 can be positioned on the disk so that the xy plane spring can counteract the forces applied to the disk 901 by the actuators 901 and 902 at the first and second receiving portions 906 and 908. The xy plane spring can be configured to contribute to holding the disk under compression in the first and second directions, for example.

[0115]

[0143] In this embodiment, the longitudinal axis of the rotating plane spring 904 is not aligned with the center of Rz rotation of the disk. The rotating plane spring 904 may be fixed, for example, to a projection 909 on the side of the disk. The rotating plane spring may be positioned so that it extends when the actuator arm of the third actuator 903 extends to rotate the disk. In one embodiment, the third actuator arm acts relative to a third receiving surface 907 on the side of the disk. As shown in Figure 9, the actuator arm extends to rotate the disk in a clockwise direction. The rotating plane spring 904 is connected to the disk so that it extends when the disk is rotated clockwise and compresses when the disk rotates counterclockwise. Thereafter, the rotating plane spring 904 is biased to the rotation given when the actuator arm of the third actuator 903 extends.

[0116]

[0144] In the alternative implementation of this embodiment, a single planar spring is used to hold the disk under compression in the first and second directions, and also to deflect the rotation given when the actuator arm of the third actuator 903 extends. One end of the planar spring may be fixed to the base 805 of module 405, and the other end of the spring may be fixed near the edge of the central opening of the disk. The spring may be positioned so as not to be aligned with the center of Rz rotation of the disk.

[0117]

[0145] Actuators 901, 902, and 903 may be part of the charged particle device 401, and such actuators may not be part of module 405. The actuator arms may contact the receiving portions 906, 907, and 908 by extending through the openings of module 405. Alternatively, actuators 901, 902, and 903 may be contained collectively within module 405, or they may be an integrated part of module 405.

[0118]

[0146] The position detection system may be configured and positioned to determine the movement and / or position of each actuator arm. Alternatively or additionally, the position detection system may be configured and positioned to determine the movement and / or position of each roller bearing at the end of the actuator arm. Changes in position and / or movement can be determined by encoders. The position detection system may be located in each actuator arm and / or each roller bearing, at the end of the actuator opposite to the roller bearing. Using these position and / or movement determinations, the movement and / or position of the support configuration 807, and thereby the movement and / or position of the electro-optical device 404, can be estimated. Alternatively, the position detection system may be configured and positioned to determine the movement and / or position of a rotating disk including the support configuration 807 in order to determine the movement and / or position of the electro-optical device 404.

[0119]

[0147] Therefore, the operation of the first actuator 901, the second actuator 902, and the third actuator 903 can move the support configuration in the xy plane relative to the body 702 of module 405, in particular the flange 701 of module 405, and can also impart Rz rotation to the support configuration.

[0120]

[0148] According to the second embodiment, the support positioning system includes an Rz flexure configuration and an xy flexure configuration. The Rz flexure configuration and the xy flexure configuration may be stacked. Each flexure configuration may be a substantially planar structure located in the xy plane. The support positioning system according to the second embodiment may be used in place of the support positioning system described in the first embodiment. The embodiment also includes the use of elements of the support positioning system according to the second embodiment in addition to those described in the first embodiment.

[0121]

[0149] Figure 10A shows a schematic cross-sectional view through the Rz flexure configuration according to the second embodiment. The cross-section lies in a plane perpendicular to the charged particle path 403.

[0122]

[0150] Figure 10B shows a schematic cross-sectional view through the xy flexure configuration according to the second embodiment. The cross-section lies in a plane perpendicular to the charged particle path 403 and is located at a different position along the charged particle path than the cross-section shown in Figure 10A.

[0123]

[0151] As shown in Figure 10A, the Rz flexure configuration includes a substantially circular structure 1005, which preferably defines an opening 1017 of the Rz flexure configuration at its center. The opening 1017 allows the charged particle path 403 to pass through the Rz flexure configuration. When in use, the Rz flexure configuration can be positioned such that the center of the opening 1017 is preferably substantially aligned with the center of the charged particle path 403. The substantially circular structure may be circular in plan view or substantially cylindrical along the beam path.

[0124]

[0152] In this embodiment, the Rz flexure configuration also includes crossbars arranged to form a cross shape. The cross is formed by a first crossbar and a second crossbar. The first and second crossbars intersect each other in a substantially circular structure 1005.

[0125]

[0153] The first and second crossbars are preferably both in the xy-plane. The first crossbar may be aligned in a first direction. The second crossbar may be aligned in a second direction. The first and second directions may be orthogonal to each other.

[0126]

[0154] The first crossbar may include a first portion 1001 and a second portion 1003. A substantially circular structure 1005 may be located between the first portion 1001 and the second portion 1003 of the first crossbar and supported by them. The second crossbar may include a first portion 1004 and a second portion 1002. A substantially circular structure 1005 may be located between the first portion 1004 and the second portion 1002 of the second crossbar and supported by them. The substantially circular structure 1005 may also be a cylindrical structure that is circular in plan view.

[0127]

[0155] The flexure configuration includes a flexure base 1011 and a movable body 1010. The flexure base 1011 is fixed to the body 702 of module 405 and is substantially immovable relative to the body 702 of module 405.

[0128]

[0156] The movable body 1010 may be substantially C-shaped or crescent-shaped.

[0129]

[0157] One end of the first portion 1001 of the first crossbar may be fixed to the flexure base 1011, with the other end of the first portion 1001 fixed to a substantially circular structure 1005. One end of the second portion 1003 of the first crossbar may be fixed to the movable body 1010, with the other end of the second portion 1003 fixed to a substantially circular structure 1005.

[0130]

[0158] One end of the first portion 1004 of the second crossbar may be fixed to the flexure base 1011, with the other end of the first portion 1004 fixed to a substantially circular structure 1005. One end of the second portion 1002 of the second crossbar may be fixed to the movable body 1010, with the other end of the second portion 1002 fixed to a substantially circular structure 1005. Thus, the movable body 1010 is attached to the flexure base 1011 by the first crossbar, the second crossbar, and the substantially circular structure 1005.

[0131]

[0159] The first and second crossbars can be bent so that the movable body 1010 can rotate in Rz. The center of rotation of the movable body 1010 in Rz may be near the center of the substantially circular structure 1005, or at the center of the structure 1005.

[0132]

[0160] The support positioning system may include a spring 1006, or other force-applying devices or elastic members. One end of the spring 1006 may be fixed to the flexure base 1011, and the other end may be fixed to the end of the movable part 1010. One end of the spring 1006 fixed to the flexure base 1011 may be fixed in substantially the same position as one end of the first portion 1004 of the second crossbar fixed to the flexure base 1011. When the spring is compressed, the bias force applied by the spring 1006 may be perpendicular to the side wall of the flexure base and not in a direction substantially aligned with the circular structure 1005. Therefore, the force applied by the spring 1006 is not directed toward the center of rotation of the movable body 1010. Thus, the effect of the spring 1006 is to apply a bias force that rotates the movable body 1010 about the z-axis.

[0133]

[0161] As described in relation to the first embodiment, a third linear actuator 1009 may be provided for rotating the Rz flexure configuration. The third linear actuator 1009 may be operated manually or automatically. The Rz flexure configuration includes a receiving portion 1018. The receiving portion 1018 is positioned to receive the end of the actuator arm of the third actuator 1009 so that the actuator arm can apply force to rotate the Rz flexure configuration.

[0134]

[0162] The movable body 1010 may be fixed to the xy flexure configuration (e.g., by bolting).

[0135]

[0163] As shown in Figure 10B, the xy flexure configuration includes an outer structure 1014 which can be fixed to the Rz flexure configuration. The outer structure 1014 may be substantially L-shaped. The outer structure 1014 may also be a rigid body.

[0136]

[0164] The xy flexure configuration includes a central structure 1012 which contains a substantially circular structure 1017 that defines an opening in the xy flexure configuration. The central structure 1012 may be a rigid body. The opening allows a charged particle path 403 to pass through the xy flexure configuration. When in use, the xy flexure configuration may be positioned such that the center of the opening is substantially aligned with the charged particle path 403.

[0137]

[0165] As described in relation to the first embodiment, a first linear actuator 1007 and a second linear actuator 1008 are provided for moving the xy flexure configuration in an orthogonal direction in the xy plane. The first linear actuator 1007 and the second linear actuator 1008 may be operated manually or automatically. The xy flexure configuration includes a first receiving portion 1015 and a second receiving portion 1016. Each receiving portion 1015, 1016 is positioned to receive one end of these actuator arms so that the actuator arms can apply force to the xy flexure configuration.

[0138]

[0166] The xy flexure configuration includes an intermediate structure 1013. The intermediate structure 1013 may have a substantially square perimeter around a substantially square opening. The intermediate structure 1013 may be a rigid body. A central structure 1012 may be provided in the opening of the intermediate structure 1013 such that the central structure 1012 is surrounded by the intermediate structure 1013 in the xy plane. The intermediate structure 1013 may be at least partially surrounded by an outer structure 1014, a receiving portion 1015, and a receiving portion 1016.

[0139]

[0167] The receiving portion 1015 may be directly connected to the central structure 1012 by a first connector such as a rod or bar. A spring 1019 or other type of bias device may be provided between the intermediate structure 1013 and the outer structure 1014, substantially aligned with the longitudinal axis of the second linear actuator 1008 and on the opposite side of the connection point of the first connector on the central structure.

[0140]

[0168] The receiving portion 1016 may be directly connected to the central structure 1012 by a second connector, such as a rod or bar. A spring 1020 or other type of bias device may be provided between the central structure 1012 and the outer structure 1014, substantially aligned with the longitudinal axis of the first linear actuator 1007 and on the opposite side of the connection point of the second connector of the central structure.

[0141]

[0169] The xy flexure configuration includes leaf springs 1021, 1022, 1023, and 1024. Alternatively, leaf springs 1021, 1022, 1023, and 1024 may be other types of elastic members.

[0142]

[0170] The intermediate structure 1013 may be connected to the outer structure 1014 by leaf springs 1021 and 1024. The leaf springs 1021 and 1024 may be positioned on both sides of the intermediate structure 1013. Both the leaf springs 1021 and 1024 may be positioned so that they are aligned substantially perpendicular to the longitudinal axis of the second linear actuator 1008.

[0143]

[0171] The intermediate structure 1013 may be connected to the central structure 1012 by leaf springs 1022 and 1023. The leaf springs 1022 and 1023 may be positioned on both sides of the intermediate structure 1013. Both the leaf springs 1022 and 1023 may be positioned so that they are aligned substantially perpendicular to the longitudinal axis of the first linear actuator 1007.

[0144]

[0172] The leaf springs 1022 and 1023 allow the central structure 1012 to move relative to the intermediate structure 1013. This causes the central structure 1012 to move relative to the outer structure 1014. Therefore, linear extension of the arm of the first actuator 1007 can move the central structure 1012 in a second direction against the bias of the spring 1020. Similarly, the bias of the spring 1020 can move the central structure 1012 in the opposite direction when the arm of the first actuator 1007 is retracted.

[0145]

[0173] The leaf springs 1021 and 1024 allow the movement of the intermediate structure 1013, and consequently the central structure 1012, relative to the outer structure 1014. Therefore, linear extension of the arm of the second actuator 1008 can move the central structure 1012 in a second direction against the bias of the spring 1019. Similarly, the bias of the spring 1019 can move the central structure 1012 in the opposite direction when the arm of the second actuator 1008 is retracted.

[0146]

[0174] Therefore, the first actuator 1007 and the second actuator 1008 may be configured to move the central structure 1012 in orthogonal directions in the xy-plane.

[0147]

[0175] As described above, the flexure configuration of this embodiment may be a stack of Rz flexure configurations and xy flexure configurations. The Rz flexure configuration may be fixed to the base of the module, and the xy flexure configuration may be fixed on top of the Rz flexure configuration (for example, on the up beam). The circular structure 1005 of the Rz flexure configuration may be substantially aligned with the circular structure 1017 of the xy flexure configuration.

[0148]

[0176] The longitudinal axis of the arm of the first actuator 1007 may be substantially aligned with the longitudinal axis of the first crossbar of the Rz flexure configuration and the center of Rz rotation of the movable body 1010. Thus, movement of the arm along the longitudinal axis moves the movable body 1010 only in the first direction and does not substantially rotate the movable body 1010.

[0149]

[0177] The longitudinal axis of the arm of the second actuator 1008 may be substantially aligned with the longitudinal axis of the second crossbar of the Rz flexure configuration and the center of Rz rotation of the movable body 1010. Thus, movement of the arm along the longitudinal axis moves the movable body 1010 only in the second direction and does not substantially rotate the movable body 1010.

[0150]

[0178] The longitudinal axis of the arm of the third actuator 1009 is not aligned with the center of Rz rotation of the movable body 1010. The receiving portion of the longitudinal axis of the arm of the third actuator 1009 may be a recess or notch on the side of the movable body 1010. Thus, movement of the arm along the longitudinal axis rotates the flexure configuration to Rz. The Rz rotation given by the extension of the arm of the third actuator 1009 can compress the spring 1006 so that the movable body 1010 is held in place under rotational compression.

[0151]

[0179] The xy flexure configuration is fixed to the movable body 1010 of the Rz flexure configuration, and therefore, when the movable body 1010 is rotated, the entire xy flexure configuration is rotated.

[0152]

[0180] The central structure 1012 of the xy flexure configuration may also be a support configuration and may include features for holding the electro-optical device 404.

[0153]

[0181] Alternatively, the support structure may be a separate structure from that shown in Figure 10B and may be fixed to the central structure 1012. The support structure may be fixed to the central structure 1012 such that there is substantially no relative movement between the support structure and the central structure 1012.

[0154]

[0182] Therefore, the flexure configuration includes a movable body 1010 that can be moved by actuators 1007, 1008, and 1009 in the xy plane and in Rz. As described with respect to the first embodiment, the position detection system can determine the movement and / or position of each actuator arm or movable body. Using these determinations, the movement and / or position of the support configuration can be estimated, and finally, the movement and / or position of the electro-optical device 404 (not shown) can be determined.

[0155]

[0183] The xy flexure configuration may be a single structure. Alternatively, the xy flexure configuration may include multiple stacked flexures. For example, it may include a first flexure for movement in a first direction by a first actuator 1007 and a second linear flexure for movement in a second direction by a second actuator 1008.

[0156]

[0184] In an alternative implementation of the xy flexure configuration, the receiving portion 1015 may be directly connected to the intermediate structure 1013 by the first connector, instead of the first connector connecting to the central structure 1012. Movement in the first direction by the first actuator 1007 is advantageously small in terms of the force exerted on the leaf spring 1022. The spring 1020 may also be positioned between the central structure 1012 and the intermediate structure 1013, instead of the central structure 1012 and the outer structure 1014. Movement in the second direction by the second actuator 1008 is advantageously small in terms of the force exerted on the leaf spring 1021.

[0157]

[0185] In a preferred implementation of the second embodiment, the Rz flexure configuration is fixed directly to the body of the module, and the xy flexure configuration is mounted on top of the Rz flexure configuration and fixed only to the Rz flexure configuration. In this implementation, the forces applied by the first linear actuator 1007 and the second linear actuator 1008 are substantially aligned with the longitudinal axis of the crossbar of the Rz flexure configuration. However, embodiments also include the xy flexure configuration being fixed directly to the body of the module, and the Rz flexure configuration being mounted on top of the xy flexure configuration and fixed only to the xy flexure configuration.

[0158]

[0186] According to the third embodiment, the support positioning system includes a plurality of piezo actuator configurations configured to move the stage. The support positioning system according to the third embodiment may be used instead of the support positioning systems described in the first and / or second embodiments. Unlike the first and second embodiments, the actuators may be contained within a module. The embodiment also includes the use of elements of the support positioning system according to the third embodiment in addition to those described in the first and / or second embodiments. In such a configuration, the actuators may be located both within and outside the module.

[0159]

[0187] A third embodiment is shown in Figures 11A to 11I. Figure 11A shows a schematic plan view of a cross-section through module 405 in a plane perpendicular to the charged particle path 403. Figure 11B shows a schematic cross-section through module 405 in a plane containing the charged particle path 403. Figures 11C to 11E show schematic plan views of stage 1109 showing the operating state of the piezo actuator configuration in the first implementation form of the third embodiment.

[0160]

[0188] As shown in Figures 11C to 11E, for example, there may be three piezo actuator configurations 1101, 1102, and 1103 equidistant from each other around the stage 1109. All of the piezo actuator configurations 1101, 1102, and 1103 may be in contact with the same main surface of the stage 1109, for example, the main surface of the stage 1109 facing module 405 as shown in Figure 11B. In plan view, all of the piezo actuator configurations 1101, 1102, and 1103 overlap with the stage 1109. For each of the piezo actuator configurations 1101, 1102, and 1103, a contact pad may be provided between the piezo actuator and the stage 1109. The contact pad may be made of ceramic or a different material along with an insulating layer.

[0161]

[0189] Each of the piezo actuator configurations 1101, 1102, and 1103 may be, for example, a two-axis shear mode piezo actuator. As shown in Figure 11B, each of the piezo actuator configurations 1101, 1102, and 1103 may include a stack of two piezo actuators. Each piezo actuator in each stack may be arranged to move the stage in two opposite directions. Each of the piezo actuator configurations 1101, 1102, and 1103 may include two piezo actuators arranged such that the movement of the stage by one piezo actuator is orthogonal to the movement of the stage by the other piezo actuator.

[0162]

[0190] Each piezo component 1101, 1102, and 1103 may be acted upon by an elastic member, such as springs 1104 and 1105, or other force-applying devices. Although not shown in Figure 11B, each spring may be a coil spring. Each spring 1104 and 1105 is positioned to contact the main surface of the stage 1109 opposite to the corresponding piezo actuators 1101, 1102, and 1103, which are acted upon by the springs 1104 and 1105. Thereafter, the stage 1109 is pressed against the piezo actuators 1101, 1102, and 1103 by the springs 1104 and 1105. As shown in Figures 11A and 11B, piezo component 1101 is acted upon by spring 1104, and piezo component 1102 is acted upon by spring 1105.

[0163]

[0191] The piezo configurations 1101, 1102, and 1103 can be controlled to move the stage linearly in a first direction (which may also be the x-direction), move it linearly in a second direction (which may be perpendicular to the first direction, i.e., the y-direction), and rotate the stage 1109 within the plane of the stage 1109 (which may also be movement in Rz).

[0164]

[0192] As shown in Figure 11C, all of the piezo configurations 1101, 1102, and 1103 can be operated to generate differently induced linear forces, the net effect of which is a force that rotates the stage. The direction of rotation can be changed by changing the direction of all the linear movements of the piezo configurations 1101, 1102, and 1103.

[0165]

[0193] As shown in Figure 11D, all of the piezo configurations 1101, 1102, and 1103 can be operated to generate differently induced linear forces, the net effect of which is a force that moves the stage linearly in the x-direction. The direction of movement can be changed by changing the direction of linear movement of all of the piezo configurations 1101, 1102, and 1103.

[0166]

[0194] As shown in Figure 11E, all of the piezo configurations 1101 and 1102 can be operated to generate differently induced linear forces, the net effect of which is a force that moves the stage linearly in the y-direction. The direction of movement can be changed by changing the direction of linear movement of the piezo configurations 1101 and 1102.

[0167]

[0195] A second implementation of the third embodiment is shown in Figures 11F to 11I. The second implementation may differ from the first implementation in that at least two of the piezo actuator configurations 1106, 1107, and 1108 are triaxial shear mode piezo actuators. The stacked configuration of the three piezo actuators provides further mobility, thereby improving the accuracy of the movement provided by the piezo actuator configurations 1106, 1107, and 1108 in the x and y directions, as well as the rotational movement around Rz.

[0168]

[0196] The second implementation may differ from the first implementation in terms of the orientation of the piezo actuator configurations 1106, 1107, and 1108. In the second implementation, each of the piezo configurations 1106, 1107, and 1108 may be preloaded by springs 1104, 1105, or other force-applying devices, as described with respect to the first implementation.

[0169]

[0197] Figure 11F shows a schematic plan view of stage 1109, which shows the orientation of the piezo actuator configurations 1106, 1107, and 1108 in the second implementation form.

[0170]

[0198] Figure 11G shows the possible operating states of the first piezo actuator 1106a, the second piezo actuator 1106b, and the third piezo actuator 1106c in the piezo actuator configuration 1106. Each piezo actuator is positioned to move the stage 1109 linearly in two opposite directions. The movement provided by the first piezo actuator 1106a may be in the y-direction. The movement provided by the second piezo actuator 1106b may be in the x-direction. The third piezo actuator 1106c may provide linear movement oblique to the directions of movement provided by the first and second piezo actuators, i.e., not parallel or orthogonal. The direction of movement provided by the third piezo actuator 1106c may be substantially tangential to the nearest part around the stage 1109, and thereby positioned to impart rotation to the stage 1109.

[0171]

[0199] Figure 11H shows the possible operating states of the first piezo actuator 1107a, the second piezo actuator 1107b, and the third piezo actuator 1107c in the piezo actuator configuration 1107. Each piezo actuator is positioned to move the stage linearly in two opposite directions. The movement provided by the first piezo actuator 1107a may be in the y-direction. The movement provided by the second piezo actuator 1107b may be in the x-direction. The third piezo actuator 1107c may provide linear movement oblique to the directions of movement provided by the first and second piezo actuators, i.e., not parallel or orthogonal. The direction of movement provided by the third piezo actuator 1107c may be substantially tangential to the nearest part around the stage 1109, and thereby positioned to impart rotation to the stage 1109.

[0172]

[0200] The piezo actuator configuration 1108 may include only a stack of two piezo actuators. Figure 11I shows possible operating states of the first piezo actuator 1108a and the second piezo actuator 1108b in the piezo actuator configuration 1108. Each piezo actuator configuration is arranged to move the stage linearly in two opposite directions. The movement provided by the first piezo actuator 1108a may be in the y-direction. The movement provided by the second piezo actuator 1108b may be in the x-direction.

[0173]

[0201] The stack may include spacers 1108c, i.e., blanks, so that it is the same height as the other stacks.

[0174]

[0202] The embodiments shown in Figures 11F to 11I allow the stage to be moved in the x and y directions simply by activating the piezo actuators of each stack, which are arranged to provide movement in the x and y directions. The stage can be rotated by providing movement by the third piezo actuators 1106c and 1107c, as well as movement by the second piezo actuator 1108b.

[0175]

[0203] In the first and second implementations of this embodiment described above, when the stage is moved, the end of the preload spring may move on the surface of the stage 1109. To avoid this, alternatively, the first and second implementations of this embodiment may have corresponding piezo actuator configurations arranged to act on the up-beam main surface and the down-beam main surface of the stage. That is, the preload spring, or other force application device, may come into contact with the first piezo actuator configuration that is in contact with the up-beam main surface stage 1109. A second piezo actuator configuration, corresponding to the first piezo actuator configuration and arranged in a line with the first piezo actuator configuration in the z-direction, may come into contact with the down-beam main surface stage 1109 and the base of the module. Contact pads may be provided between each component.

[0176]

[0204] In this embodiment, the support configuration may be part of the stage 1109 configured to hold the electro-optical device 404. Alternatively, the support configuration may be a separate component fixed to the stage 1109.

[0177]

[0205] According to the fourth embodiment shown in Figures 12A to 12D, the support positioning system includes a plurality of piezo actuator configurations 1201, 1202, 1205, and 1206 configured to move the stage. The support positioning system according to the fourth embodiment may be used instead of the support positioning systems described in the first, second, and / or third embodiments. The embodiments also include the use of elements of the support positioning system according to the fourth embodiment in addition to those described in the first, second, and / or third embodiments.

[0178]

[0206]

[0179]

[0207] Figure 12A shows a schematic plan view of module 405. The module includes piezo configuration 1205 and piezo configuration 1206. Piezo configuration 1205 may be arranged so that it can move piezo configuration 1206 bidirectionally in the x-direction. Piezo configuration 1206 may be arranged so that it can move a portion of module 405, including the stage, bidirectionally in the y-direction. Embodiments also include piezo configuration 1205 providing alternative movement in the y-direction and piezo configuration 1206 providing alternative movement in the x-direction. Module 405 also includes one or more piezo configurations for providing bidirectional rotation of the stage about Rz.

[0180]

[0208] Figure 12B is a schematic plan view of a portion of module 405, including the stage and piezo actuator configurations 1201 and 1202.

[0181]

[0209] As shown in Figure 12B, the support positioning system may include two piezo components 1201 and 1202. In this embodiment, the piezo components 1201 and 1202 may be located on either side of the stage. That is, the piezo actuator component 1201 may contact the side wall of the stage at a first location, and the piezo actuator component 1202 may contact the side wall of the stage at a second location, for example, diametrically opposite to the first location.

[0182]

[0210] In the fourth embodiment, each piezo configuration 1201, 1202 may include one or more piezo actuators arranged to move in both linear directions along a first axis (which may be the x-axis). Each piezo actuator configuration 1201, 1202 may also include a block, which is a portion of the piezo actuator configuration 1201, 1202 that is moved by the piezo actuator configuration 1201, 1202 and pressed against the side wall of the stage. As previously described with respect to the third embodiment, a contact pad may be provided between each piezo actuator configuration and the stage.

[0183]

[0211] Each of the piezo actuator configurations 1201 and 1202 may be preloaded by springs 1203 and 1204, or other force-applying devices. Spring 1203 is positioned on the opposite side of the stage from piezo actuator configuration 1201 and is positioned to press piezo actuator configuration 1201 against the stage. Similarly, spring 1204 is positioned on the opposite side of the stage from piezo actuator configuration 1202 and is positioned to press piezo actuator configuration 1202 against the stage. Thereafter, the stage is held under compression by piezo actuator configurations 1201 and 1202. As shown in Figure 12B, piezo actuator configuration 1201 is preloaded by spring 1203, and piezo actuator configuration 1202 is preloaded by spring 1204.

[0184]

[0212] In the fourth embodiment, the stage may be moved in the x-direction by a piezo actuator configuration 1205. The stage may be moved in the y-direction by a piezo actuator configuration 1206.

[0185]

[0213] If the piezo actuator configuration 1201 and the piezo actuator configuration 1202 are arranged to move in opposite directions but by the same amount, the stage will rotate around Rz.

[0186]

[0214] As shown in Figure 12C, the piezo actuator configurations 1201 and 1202 may be located in the same plane as the stage. The piezo actuator configurations 1201 and 1202 are positioned as bearings supporting the stage and can impart rotation to the stage.

[0187]

[0215] Figure 12D shows an alternative configuration to the one shown in Figure 12C. The stage is mounted on mechanical bearings to support the stage. Piezo actuator configurations 1201 and 1202 can impart rotation to the stage without being the primary support of the stage.

[0188]

[0216] Embodiments also include a stage support configuration, which is an alternative to using mechanical bearings. The stage may include a circular groove located on a fixed support. One or more bias members, such as leaf springs, may be provided to press the stage against the support.

[0189]

[0217] In this embodiment, the support configuration may be part of a stage configured to hold the electro-optical device 404. Alternatively, the support configuration may be a separate component fixed to the stage.

[0190]

[0218] The fifth embodiment shown in Figure 13 differs from the fourth embodiment in that it includes a support positioning system that comprises a single piezo actuator configuration 1302 configured to rotate the stage.

[0191]

[0219] Figure 13 shows a schematic plan view of a portion of module 405, including the stage and a piezo actuator configuration 1302 for rotating the stage.

[0192]

[0220] The piezo actuator configuration 1302 may be the same as one of the piezo actuator configurations 1201, 1202 already described in the fifth embodiment. Therefore, the piezo actuator configuration can move linearly.

[0193]

[0221] The piezo actuator configuration is adjacent to and in contact with the stage in a plan view. The piezo actuator configuration 1302 can be preloaded by a spring 1301 or other force application device. The spring 1301 is positioned on the opposite side of the stage from the piezo actuator configuration 1302 and is positioned to press the piezo actuator configuration 1302 against the stage.

[0194]

[0222] Linear movement of the piezo actuator configuration 1302 in a tangential direction to the stage rotates the stage.

[0195]

[0223] The linear movement of the stage can be provided by piezo actuator configurations 1205, 1206, as already described in relation to the fourth embodiment.

[0196]

[0224] The stage may be mounted on a mechanical bearing to support the stage, as shown in Figure 12D. Alternatively, the stage may include a circular groove, as already described with respect to the fourth embodiment.

[0197]

[0225] In this embodiment, the support configuration may be part of a stage configured to hold the electro-optical device 404. Alternatively, the support configuration may be a separate component fixed to the stage.

[0198]

[0226] In all of the third to fifth embodiments described above, a position detection system may be provided. The position detection system may include encoders for determining the movement and / or position of each piezo component, and by extension, the stage.

[0199]

[0227] The first to fifth embodiments described above allow for the repositioning of the support configuration within module 405. This allows the electro-optical device 404, fixed to the support configuration, to have fine adjustments made to its position, which may be necessary to properly align the electro-optical device 404 with other components of the charged particle device 401. The first to fifth embodiments may allow the electro-optical device 404 to be moved with several degrees of freedom. Specifically, the first to fifth embodiments may allow for fine adjustments to the position of the electro-optical device 404 in the xy plane and for rotation around the z axis. The embodiments also include adapting the first to fifth embodiments described to provide only one or two degrees of freedom of fine alignment. For example, the embodiments include configurations that allow for bidirectional positional fine adjustments along a single axis in the xy plane, orthogonal positional fine adjustments in the xy plane without Rz movement, or only Rz movement.

[0200]

[0228] The embodiment also includes the following techniques for positioning the electro-optical device 404 within module 405.

[0201]

[0229] According to the sixth embodiment, a technique is provided for engaging module 405 with the housing of the charged particle device 401. The technique of the sixth embodiment may be applied in conjunction with any of the techniques of the first to fifth embodiments described above.

[0202]

[0230] Figure 14A shows a schematic diagram of module 405 fixed to the charged particle device 401 according to the sixth embodiment.

[0203]

[0231] As previously described with reference to Figure 7, module 405 includes module flange 701 and body 702. As shown in Figures 14A and 14B, the charged particle device 401 also includes flange 1401, which is referred to herein as housing flange 1401. The process of securing module 405 to the charged particle device 401 includes inserting module 405 into the charged particle device 401 and engaging module flange 701 with housing flange 1401. After module flange 701 is engaged with housing flange 1401, module flange 701 may be secured to housing flange 1401 by any known technique. For example, module flange 701 may be bolted onto housing flange 1401.

[0204]

[0232] The module flange 701 and the housing flange 1401 include corresponding engagement surfaces that engage with each other. As shown in Figure 14B, within the plane of the engagement surface of the housing flange 1401, the shape of the engagement surface may be the shape of a rectangular engagement surface surrounding a rectangular opening. The engagement surface of the module flange 701 may have a corresponding shape. The opposing surfaces of the module flange 701 and the housing flange 1401 may coincide with each other to provide a seal when they are fixed together. The opposing surfaces may be coplanar and flat. A vacuum seal may be provided to ensure that the connection between the module flange 701 and the housing flange 1401 is airtight so that a vacuum may be created in the portion of the charged particle device 401 including the module 405 when closed. The vacuum seal may be opened when the module is removed from the charged particle device 401.

[0205]

[0233] As also shown in Figure 14B, the housing flange 1401 may include two or more alignment pins 1402, 1403 protruding from its surface. Preferably, two alignment pins are present, provided on both sides of the opening in the housing flange 1401. The module flange 701 may include corresponding recesses for receiving the alignment pins. The alignment pins can be inserted into the corresponding recesses when the module 405 is inserted into the charged particle device 401. The insertion of the alignment pins into each recess advantageously enables coarse positioning of the module 405 in the charged particle device 401. Specifically, the direct engagement of the module flange 701 and the housing flange 1401 positions the module 405 along the charged particle path 403, which may also be in the z-direction. In this embodiment, the module 405 can also be coarsely positioned in the direction between the alignment pins, which may also be in the y-direction. Module 405 can also be coarsely positioned with respect to the insertion direction of module 405 into the charged particle path 403, which may be in the x-direction. Module 405 can also be coarsely positioned with respect to rotation around the x-direction (i.e., Rx), rotation around the y-direction (i.e., Ry), and rotation around the z-direction (i.e., Rz). Therefore, module 405 can be coarsely positioned with 6 degrees of freedom in a plane orthogonal to the charged particle path of the charged particle device.

[0206]

[0234] The embodiments also include an alternative mounting configuration in which the module flange 701 includes alignment pins and the housing flange 1401 includes corresponding recesses. Alternatively, both the module flange 701 and the housing flange 1401 may include alignment pins and corresponding recesses.

[0207]

[0235] The alignment pin and the corresponding recess may both have a circular cross-section. However, embodiments also include alignment pins having an elliptical cross-section. Alternatively or additionally, the recess may be slotted instead of circular. The use of non-circular alignment pins and / or recesses may allow the alignment tolerance to be smaller than the manufacturing tolerance.

[0208]

[0236] According to the seventh embodiment, module 405 is configured such that the position of the support positioning system within module 405 can be adjusted.

[0209]

[0237] Figure 15A shows a cross-section of the module 405 through a portion of the body 702 in a plane containing the charged particle path 403. The support positioning system for module 405 is according to the first embodiment of the module as described above with reference to Figures 8 and 9.

[0210]

[0238] The support positioning system is supported in the body 702 of module 405 by a plurality of adjustable supports 1501, 1502. The adjustable supports 1501, 1502 may be, for example, adjustable spring bolts or adjustable fasteners (such as pins with tightening bolts). For each of the ball bearings 804 that are in contact with the up beam and / or down beam surfaces of the disc, there may be corresponding adjustable supports 1501, 1502. For example, there may be three adjustable supports equally spaced around the support positioning system.

[0211]

[0239] Each adjustable support 1501, 1502 may include a hemispherical end and a longitudinal body. The longitudinal body may be a pin without threads. The hemispherical end of each adjustable support 1501, 1502 may be received by a cone or V-shaped recess in the base plate 1505. The body 702 of module 405 may include portions 1503, 1504 having channels for receiving the longitudinal bodies of each adjustable support 1501, 1502. The range into which each adjustable support 1501, 1502 is inserted into the channel may be adjustable. For example, the longitudinal body of each adjustable support 1501, 1502 may be moved to any location within the corresponding channel and then fixed in place. The longitudinal body of each adjustable support 1501, 1502 may be fixed in place within the channel by a tightening bolt configuration such as that shown in Figure 15B. The tightening bolt configuration shown in Figure 15B includes a threaded bolt 1506 and a press piece 1507. The threaded bolt 1506 and the press piece 1507 are positioned within a channel that can be perpendicular to the channel for the longitudinal body of the adjustable support 1501. When the bolt is rotated such that the end of the bolt is pressed against the press piece 1507, the press piece 1507 is pressed against the longitudinal body, thereby fixing the position of the longitudinal body within the channel. Rotation of the bolt 1506 in the opposite direction releases the force applied to the longitudinal body, thereby causing it to move along the channel.

[0212]

[0240] Therefore, the z-direction separation of each section 1503, 1504 and the base plate 1505 can be adjusted by adjusting the range in which each adjustable support 1501, 1502 is inserted into its respective channel.

[0213]

[0241] As shown in Figure 15A, the ball bearing 804 may also be in contact with the up beam surface of the disk and the module plate 802. Each module plate 802 is biased to apply force to the ball bearing 804 so that the ball bearing 804, the disk, and the ball bearing 803 are all held in place under compression between the module plate 802 and the base plate 1505. Thus, the plane of the disk, and by extension the entire support positioning system, can be held parallel to the upper surface of the base plate 1505 and in a substantially fixed relationship.

[0214]

[0242] Sections 1503 and 1504 may be fixedly connected to the flange 701 of module 405 so that they are substantially immovable relative to the flange 701. The base plate may also be connected only to the rest of the module by adjustable supports 1501 and 1502. As a result, the z-position of the base plate relative to the flange 701 can be adjusted by adjusting the amount that the adjustable supports 1501 and 1502 are inserted into the corresponding sections 1503 and 1504. By making different adjustments to all of the adjustable supports 1501 and 1502, the base plate, and thus the entire support positioning system, can be tilted in Rx and Ry, and adjusted in the z-direction.

[0215]

[0243] As a result, in this embodiment, when module 405 is outside the charged particle device 401, each adjustable support 1501, 1502 can be operated manually and / or automatically to adjust the position of the support positioning system relative to the flange 701 of module 405. Thereafter, the z position and tilt, i.e., Rx and Ry states, of the support positioning system, and by extension, the electro-optical device 404, can be set by the adjustable supports 1501, 1502 before module 405 is inserted into the charged particle device 401. Thus, the position of the electro-optical device 404 and its support configuration can be adjusted in z, Rx, and Ry relative to the flange 701 of module 405, and also relative to the housing flange 1401 if the two flanges are fixed to each other. Therefore, the position of the electro-optical device 404 can be pre-calibrated (i.e., pre-adjusted) with respect to the charged particle device, e.g., the frame of the charged particle device (not shown), before insertion of module 405 into the charged particle device 401. Therefore, after the module 405 is attached to the charged particle device 401, the support configuration and the supported electro-optical device 404 are coarsely positioned to the desired location relative to the frame.

[0216]

[0244] The adjustment of the z position and / or tilt of the electro-optical device 404 relative to the flange 701 of module 405, i.e., the Rx and Ry states, according to the seventh embodiment, may be referred to as a pre-calibration operation. In addition to the techniques of the sixth embodiment and any of the first to fifth embodiments, the techniques of the seventh embodiment may be applied.

[0217]

[0245] According to the eighth embodiment, further techniques are applied for aligning the electro-optical device 404 with the source beam. After the module 405, which includes the electro-optical device 404, is fixed to the charged particle apparatus 401, the source beam can be aligned with the electro-optical device 404 using electro-optical alignment techniques. For example, an electro- and electromagnetic charged particle manipulator, such as a deflector and lens (not shown), may be used in the up-beam of module 405 to control the source beam path so that the source beam path is properly aligned with the electro-optical device 404. For example, a manipulator, such as a multi-pole deflector, can be used to adjust the beam path along axes orthogonal to the beam path, such as the x-axis and / or y-axis. A set of two deflectors may be used along the beam path to adjust along each axis. The first deflector of each pair applies a correction to the path, and the second deflector of each set redirects the beam along the path corresponding to a desired angle of incidence to the device (which may coincide with the angle of incidence of the beam path to the first deflector of the set). Due to the re-induction of the second deflector in each set, the correction of the first deflector in each set is effectively an overcorrection. A micro-deflector array 323 may be used for this electrostatic correction, for example, if it is located in the up-beam of the module. A focusing lens configuration, such as focusing lens 210 or 310, may be controlled to apply a correction in Rz to the beam path. Electrically and magnetically charged particle manipulators, such as deflectors and lenses (not shown), may be used in the down-beam of module 405 to control one or more paths of the beam or multi-beam output from module 405.

[0218]

[0246] In addition to or instead of one or more techniques of the first to seventh embodiments, the electro-optical alignment technique of the eighth embodiment may be applied. Specifically, the alignment process of the electro-optical device 404 with a charged particle beam or multibeam may include determining the locations of one or more beams that have passed through the electro-optical device and / or one or more beams that have been reflected by the electro-optical device, and then making fine adjustments to the position according to the determined beam locations. The fine adjustments may include mechanical adjustments by the techniques of the first to fifth embodiments and / or the electro / electro-optical alignment technique of the eighth embodiment.

[0219]

[0247] The range of repositioning achieved by the pre-calibration technique of the seventh embodiment depends on the module design. Adjustment in the z direction may be in the range of less than 50 μm to greater than 200 μm. Adjustment of Rx and Ry may be in the range of less than 0.1 mrad to greater than 1 mrad.

[0220]

[0248] The sixth embodiment is sometimes referred to as the coarse positioning technique. Using the sixth embodiment, the electro-optical device 404 can be positioned in x, y, and z directions within a range of 50 μm to 200 μm relative to the vacuum chamber for the module in the charged particle apparatus. The positions Rx, Ry, and Rz can be between 1 mrad and 5 mrad relative to the vacuum chamber.

[0221]

[0249] The techniques of the sixth and seventh embodiments allow the electro-optical device to be positioned within a known range of locations relative to the vacuum chamber. However, due to variations in the position of the charged particle beam path, the electro-optical device may be within 1 mm in the x and / or y directions from the charged particle beam path, and within 100 mrad in Rz from the charged particle beam path.

[0222]

[0250] The first to fifth embodiments and the eighth embodiment are sometimes referred to as micro-positioning techniques. These can be used to align the electro-optical device 404 with a charged particle beam or a multi-beam.

[0223]

[0251] The first to fifth embodiments can move the electro-optical device by 0.5 μm to 100 μm in the x and / or y directions, and can also provide rotations of up to 1 rad in Rz.

[0224]

[0252] The eighth embodiment allows the charged particle beam path to be moved up to 2 mm in the x and / or y directions, and to be rotated up to 1 rad in Rz. The eighth embodiment allows the charged particle beam path to be moved in the z direction by changing the focus of the charged particle beam or multibeam.

[0225]

[0253] The embodiments also include applying manual and / or automatic repositioning techniques to other components of the charged particle apparatus 401. For example, the source 402 and / or objective lens may be moved. For example, the source beam may first be aligned with the objective lens, and then techniques according to any of the embodiments described herein may be applied to align the charged particle beam or multibeam with the electro-optical device 404.

[0226]

[0254] The embodiments also include a method for installing the electro-optical device 404 in the charged particle device 401. This method may include one or more of the following steps: attaching the electro-optical device 404 to the module 405; performing a pre-calibration process to adjust the relative positions of the electro-optical device 404 and the module 405; making a rough adjustment to the Rx state of the electro-optical device 404 relative to the body 702 of the module 405; making a rough adjustment to the Ry state of the electro-optical device 404 relative to the body 702 of the module 405; making a rough adjustment to the z position of the electro-optical device 404 relative to the body 702 of the module 405; and / or fixing the module 405 to the charged particle device 401. The module 405 may be a module according to any of the first to fifth embodiments described above. The pre-calibration process may be according to the seventh embodiment described above. The coarse alignment process may be according to the sixth embodiment described above.

[0227]

[0255] After the module 405, which includes the electro-optical device 404, is fixed to the charged particle apparatus 401, the embodiment includes a method for aligning the electro-optical device 404 with a charged particle beam or multibeam within the charged particle apparatus 401. This method may include one or more of the following steps: making fine adjustments to the x position of the electro-optical device 404 with respect to the body 702 of the module 405; making fine adjustments to the y position of the electro-optical device 404 with respect to the body 702 of the module 405; making fine adjustments to the Rz state of the electro-optical device 404 with respect to the body 702 of the module 405; and / or making adjustments to the path of the charged particle beam or multibeam within the charged particle apparatus 401. The module 405 may be a module 405 according to any of the first to fifth embodiments described above. The adjustments made to the path of the charged particle beam or multibeam within the charged particle apparatus may be according to the technique of the eighth embodiment described above.

[0228]

[0256] The above method of installing the electro-optical device 404 in the charged particle apparatus 401 may be applied in conjunction with the above method of aligning the electro-optical device 404 with a charged particle beam or multi-beam within the charged particle apparatus 401.

[0229]

[0257] A method for replacing the electro-optical device 404 in the charged particle device 401 may include turning off the power supply to the source, closing a valve that isolates the vacuum chamber containing module 405, venting the vacuum chamber, releasing the vacuum seal of the vacuum chamber, removing module 405 from the charged particle device 401, inserting the replacement module 405 into the charged particle device 401, sealing the vacuum seal of the vacuum chamber, pumping the vacuum chamber to restore it to a vacuum state and baking module 405, opening the valve that isolates the vacuum chamber, performing mechanical fine alignment, turning on the power supply to the source, performing a high-voltage test, and performing electrical fine alignment of the electro-optical device 404 and the charged particle path 403.

[0230]

[0258] Figure 17 shows a flowchart illustrating a method for installing an electro-optical device in a charged particle apparatus according to one embodiment.

[0231]

[0259] Step 1701 initiates the process.

[0232]

[0260] In step 1703, the electro-optical device is mounted to the module.

[0233]

[0261] In step 1705, rough adjustments are made to the Rx state, Ry state, and / or z position of the electro-optical device relative to the module body.

[0234]

[0262] In step 1707, the module is fixed to the charged particle device.

[0235]

[0263] Step 1709 concludes the process.

[0236]

[0264] Figure 18 shows a flowchart of a method for aligning an electron-optical device with a charged particle beam or multibeam within a charged particle apparatus, according to one embodiment.

[0237]

[0265] Step 1801 initiates the process.

[0238]

[0266] In step 1803, a module containing an electro-optical device is fixed to the charged particle device, thereby installing the electro-optical device within the charged particle device.

[0239]

[0267] In step 1805, one or more fine adjustments are made to the x-position, y-position, and / or Rz-state of the electro-optical device relative to the module body.

[0240]

[0268] In step 1807, adjustments are made to the path of the charged particle beam or multibeam within the charged particle apparatus.

[0241]

[0269] Step 1809 marks the end of the process.

[0242]

[0270] The embodiments include numerous modifications and variations of the above-described technology.

[0243]

[0271] In the above embodiment, the body 702 of module 405 is permanently fixed to the module flange 701. The embodiment also includes the fixation and optional permanent presence of a feature equivalent to the body of module 405 within the charged particle apparatus 401. The flange equivalent feature (not shown) is a removable cover that is separated from the body and effectively provides access to the body equivalent feature. The electro-optical device can be replaced by removing the flange and thereby accessing the electro-optical device on the body equivalent feature. In such an arrangement, where the flange is separated from and mechanically independent of the rest of the module, including the support and device, the module has an engagement configuration that interacts with an engagement configuration within the apparatus, preferably a column for coarse alignment of the module and, by extension, the device with respect to the frame of the apparatus. The engagement configuration of the apparatus and module may take the form of a drawer that allows alignment of the module with respect to the frame in all degrees of freedom, and may also include flange and pin features applied to this configuration and adapted from the sixth embodiment.

[0244]

[0272] Throughout the multiple embodiments, techniques for positioning electro-optical devices are described.

[0245]

[0273] Vacuum locks may also be provided elsewhere in the charged particle device 401 and the tool containing the charged particle device 401. For example, a source vacuum lock (not shown) may be present between the up-beam vacuum lock 406 and the source 402, as shown in Figure 16. The source vacuum lock allows the area of ​​the charged particle device 401 containing the source 402 to be isolated from the rest of the charged particle device 401, thereby reducing the time required to replace the source 402. The source 402 may be included by a replaceable module so that the source 402 is replaceable in the field.

[0246]

[0274] As shown in Figure 16, a vent / pump valve 1601 may be provided in the module region 1607, which is separated by the up-beam valve 406 and the down-beam valve 407. When module 405 is replaced, the vent / pump valve 1601 can be used to both ventilate and pump module region 1607. With the up-beam valve 406 open and the down-beam valve 407 closed, the vent / pump valve 1601 can also be used to ventilate and pump source region 1606. Module 405 can be removed while module region 1607 is ventilated.

[0247]

[0275] With the source region ventilated and the up-beam valve closed, the source module, including source 402 and source region 1606, can be removed from the device. In an alternative configuration, the source region may have a designated vent / pump valve. The source region may be operated independently of the module region 1607. The source module may be replaceable in the field.

[0248]

[0276] As shown in Figure 16, the tool including the charged particle apparatus 401 may also include a secondary column 1605 including a detector (not shown) and a probe (not shown). The detector may be configured to detect electrons from a sample, such as secondary electrons. Up-beam vacuum locks 1602 and down-beam vacuum locks 1603 may be provided on the up-beam and down-beam of the detector, providing a detector region 1608 separated in the secondary column. A vent / pump valve 1604 may be provided in the detector region 1608 separated by the up-beam valve 1602 and down-beam valve 1603. Thus, the detector may also be replaceable in field. With the up-beam valve 1602 closed and the down-beam valve 1603 open, the vent / pump valve 1604 can also be used to vent and pump the probe region 1609.

[0249]

[0277] In a given configuration, the device may include two or more modules 405 that can be located in one or more separable and / or independently operable module regions. The detector column may have one or more modules in one or more separable and / or independently operable module regions. Each additional module may be field-replaceable.

[0250]

[0278] The embodiment also includes the case where the device supported by module 405 is a different type of device from the electro-optical device 404.

[0251]

[0279] The charged particle device 401 may specifically be a multi-beam charged particle device. The charged particle device may include any of the components of the device described above with reference to Figures 1, 2, and 3.

[0252]

[0280] A multibeam charged particle system may be a component of an inspection (or metro inspection) tool, or part of an electron beam lithography tool. Multibeam charged particle systems can be used in many different applications, including not only SEM but also electron microscopy in general and lithography.

[0253]

[0281] A multi-beam charged particle apparatus may include two or more charged particle sources.

[0254]

[0282] Throughout the multiple embodiments, the charged particle axis is described. This axis represents the path of charged particles passing through and being output from sources 201 and 301. All sub-beams of the output multibeam may be substantially parallel to the charged particle optical axis 403. The charged particle optical axes 204 and 304 may be the same as or different from the mechanical axis of the illumination device.

[0255]

[0283] The embodiments include the following description.

[0256]

[0284] According to a first aspect of the present invention, a module is provided for supporting a device configured to manipulate a charged particle path in a charged particle apparatus, the module comprising a support configuration configured to support the device, wherein the device is configured to manipulate a charged particle path within the charged particle apparatus, and a support positioning system configured to move the support configuration within the module, the module being arranged in a field-replaceable manner within the charged particle apparatus.

[0257]

[0285] Preferably, when the module is in use in a charged particle apparatus with a device held by a support configuration, the charged particle path is substantially parallel to the charged particle axis of the charged particle apparatus.

[0258]

[0286] Preferably, the support positioning system is configured to move the support configuration with movement of at least three degrees of freedom.

[0259]

[0287] Preferably, the charged particle axis coincides with the z-axis, the module is substantially planar in the xy-plane, and at least three degrees of freedom of movement include movement in the xy-plane and rotation about the z-axis (Rz).

[0260]

[0288] Preferably, the support positioning system is a manual and / or automatic positioning system.

[0261]

[0289] Preferably, the support positioning system is configured to move the support structure to a desired position within a range of approximately 0.5 μm to 100 μm, and / or to rotate the support structure in Rz up to a maximum of 1 rad.

[0262]

[0290] Preferably, the module further includes a position detection system configured to determine the movement and / or position of a device held by the support configuration and / or the support configuration.

[0263]

[0291] Preferably, the position detection system includes grid marks such as an encoder for use in determining the movement and / or position of the support configuration and / or the device held by the support configuration.

[0264]

[0292] Preferably, the position detection system is configured to determine the movement and / or position of the support configuration and / or the device held by the support configuration based on one or more features of the device held by the support configuration.

[0265]

[0293] Preferably, one or more features of the device include an array of apertures and / or one or more fiducials.

[0266]

[0294] Preferably, the array of apertures is an array of apertures for use in aligning the substrates of a stack of substrates included by the device during manufacture of the device.

[0267]

[0295] Preferably, the array of apertures is for the path of charged particles passing through a beam manipulator included by the device.

[0268]

[0296] Preferably, the module further includes a receiving portion configured to receive each end of the actuator arm.

[0269]

[0297] Preferably, the actuator arm is included by an actuator external to the module, and the support positioning system is configured to be moved by the actuator.

[0270]

[0298] Preferably, a first receiving portion is arranged to receive the end of a first actuator arm for moving the support positioning system in a first direction, a second receiving portion is arranged to receive the end of a second actuator arm for moving the support configuration by the support positioning system in a second direction which may be perpendicular to the first direction, and a third receiving portion is arranged to receive the end of a third actuator arm for rotating the support configuration.

[0271]

[0299] Preferably, the first and second directions lie in the xy-plane, and the rotation is centered on an axis such as the z-axis that is perpendicular to the xy-plane.

[0272]

[0300] Preferably, the support positioning system includes a disk and a plurality of load-bearing rotatable objects configured to support the disk within a module.

[0273]

[0301] Preferably, the disc has an up-beam surface and a down-beam surface, a first set of one or more load-bearing rotatable objects is arranged to contact the up-beam surface of the disc, and a second set of multiple load-bearing rotatable objects is arranged to contact the down-beam surface of the disc.

[0274]

[0302] Preferably, the first set of load-bearing rotatable objects includes one, two, or three load-bearing rotatable objects, and the second set of load-bearing rotatable objects includes three load-bearing rotatable objects.

[0275]

[0303] Preferably, in a plan view, the disk is positioned such that when the module is installed in the charged particle device, the charged particle path passes through an opening defined in the disk.

[0276]

[0304] Preferably, in plan view, the disk is substantially annular.

[0277]

[0305] Preferably, the disk is a substantially planar structure in the xy-plane.

[0278]

[0306] Preferably, the disk includes a support configuration.

[0279]

[0307] Preferably, the module includes a first force-applying device positioned to apply force to the disk, the force being substantially in the same plane as the disk and for moving the disk in that plane; and the module includes a second force-applying device positioned to apply force to the disk, the force being substantially in the same plane as the disk and for rotating the disk.

[0280]

[0308] Preferably, the first force-applying device is configured such that the force applied by the first force-applying device is substantially in a direction passing through the axis of rotation of the disk, such that the force substantially does not rotate the disk.

[0281]

[0309] Preferably, during use, the disk is compressed by a force from a first force-applying device, a force applied to a first receiving portion, and a force applied to a second receiving portion.

[0282]

[0310] Preferably, during use, the second force application device is positioned to apply a force that presses the third receiving portion against the end of the third actuator arm.

[0283]

[0311] Preferably, a second force-applying device is positioned to apply force to a first protrusion from the sidewall of the disk, and / or a third receiving portion includes a second protrusion from the sidewall of the disk.

[0284]

[0312] Preferably, the module includes a force-applying device positioned to apply force to a disk, wherein the applied force is substantially in the same plane as the disk, the applied force is for linear movement of the disk in the plane, and the applied force is for rotation of the disk.

[0285]

[0313] Preferably, the module includes one or more axial force applying devices arranged such that the disk is held under compression between a first set of load-bearing rotatable bodies and a second set of load-bearing rotatable bodies.

[0286]

[0314] Preferably, each axial force applying device includes a plate that contacts one of the load-bearing rotatable bodies, and / or one or more of the axial force applying devices are elastic members such as springs.

[0287]

[0315] Preferably, the support positioning system includes a flexure configuration.

[0288]

[0316] Preferably, the flexure configuration includes a Rz flexure configuration and an xy flexure configuration.

[0289]

[0317] Preferably, both the Rz flexure configuration and the xy flexure configuration are preferably substantially planar structures in the xy plane.

[0290]

[0318] Preferably, the Rz flexure configuration and the xy flexure configuration are arranged stacked, and the Rz flexure configuration is preferably in the down beam of the xy flexure configuration.

[0291]

[0319] Preferably, in plan view, the Rz flexure configuration includes a substantially circular structure that defines an opening in the Rz flexure configuration.

[0292]

[0320] Preferably, the center of the substantially circular structure is substantially aligned with the z-axis.

[0293]

[0321] Preferably, in plan view, the Rz flexure configuration includes a cross, the cross includes first and second crossbars intersecting at an intersection, the first crossbar being aligned in a first direction in the plane of the Rz flexure configuration, and the second crossbar being aligned in a second direction in the plane of the Rz flexure configuration, the second direction being perpendicular to the first direction.

[0294]

[0322] Preferably, the circular structure is located at the intersection of the first and second crossbars, and is supported between the first and second parts of the first crossbar and between the first and second parts of the second crossbar.

[0295]

[0323] Preferably, the first crossbar is aligned with the first receiving portion, and the second crossbar is aligned with the second receiving portion.

[0296]

[0324] Preferably, the Rz flexure configuration includes a base and a movable body.

[0297]

[0325] Preferably, the third receiving portion includes a recess in the side wall of the Rz flexure configuration.

[0298]

[0326] Preferably, the Rz flexure configuration includes a rotational force application device configured to apply a force to rotate the movable body.

[0299]

[0327] Preferably, during use, the rotational force applied by the rotational force application device is configured to press the third receiving portion against the end of the third actuator arm.

[0300]

[0328] Preferably, the xy flexure configuration includes an outer structure, an intermediate structure, a central structure, and a plurality of leaf springs, wherein in the plane of the xy flexure configuration, the intermediate structure is substantially surrounded by the outer structure, a first receiving portion, and a second receiving portion; in the plane of the xy flexure configuration, the central structure is substantially surrounded by the intermediate structure; the outer structure is connected to the intermediate structure by at least one leaf spring; and the intermediate structure is connected to the central structure by at least one leaf spring.

[0301]

[0329] Preferably, at least one leaf spring is provided to connect the intermediate structure to the central structure such that the central structure moves in a first direction relative to the outer structure in response to a force applied to the first receiving portion, and at least one leaf spring is provided to connect the outer structure to the intermediate structure such that the intermediate structure moves in a second direction relative to the outer structure in response to a force applied to the second receiving portion.

[0302]

[0330] Preferably, the intermediate structure is connected to the central structure by two leaf springs positioned on either side of the central structure, and the intermediate structure is connected to the outer structure by two leaf springs positioned on either side of the intermediate structure.

[0303]

[0331] Preferably, the module further includes a first bias device positioned to apply force so that the intermediate structure and / or central structure is held in place under compression in a first direction, and a second bias device positioned to apply force so that the intermediate structure and / or central structure is held in place under compression in a second direction.

[0304]

[0332] Preferably, the outer structure of the xy flexure configuration is fixed to the movable body of the Rz flexure configuration.

[0305]

[0333] Preferably, the first and / or second bias device is an elastic member such as a spring.

[0306]

[0334] Preferably, the support positioning system includes one or more linear actuators.

[0307]

[0335] Preferably, each actuator is configured as a piezo actuator.

[0308]

[0336] Preferably, each piezo actuator configuration includes a two-axis shear mode piezo device.

[0309]

[0337] Preferably, the support positioning system includes a plurality of actuators.

[0310]

[0338] Preferably, the number of actuators included in the support positioning system is three.

[0311]

[0339] Preferably, the support positioning system includes a stage.

[0312]

[0340] Preferably, in plan view, the stage is substantially annular.

[0313]

[0341] Preferably, the actuators are spaced at substantially equal angular positions around the midpoint of the stage.

[0314]

[0342] Preferably, the actuators are aligned such that the angle between the longitudinal axes of adjacent actuators is 60 degrees.

[0315]

[0343] Preferably, the actuators are configured such that all of them can be operated together to rotate the stage in the plane of the stage.

[0316]

[0344] Preferably, the actuators are configured such that all of them can be operated together to move the stage in a first direction within the plane of the stage.

[0317]

[0345] Preferably, the actuators are configured such that all of them can be operated together to move the stage in a second direction that lies in the plane of the stage, and the second direction is perpendicular to the first direction.

[0318]

[0346] Preferably, the module further includes one or more force-applying devices, each force-applying device being positioned to apply a force that presses the actuator against the stage.

[0319]

[0347] Preferably, in plan view, at least one actuator is positioned beside the stage and configured such that the linear movement of the actuator rotates the stage, and a force application device is present for each actuator beside the stage, configured to apply a force that presses the actuator against the stage.

[0320]

[0348] Preferably, there are two actuators next to the stage, with the actuators on both sides of the stage.

[0321]

[0349] Preferably, the module further includes first and second linear actuators, the first linear actuator being arranged to move the second linear actuator in a first direction, and the second linear actuator being arranged to move at least one actuator located beside the stage in a second direction perpendicular to the first direction.

[0322]

[0350] A second aspect of the present invention provides a module for supporting a device configured to manipulate the path of charged particles in a charged particle apparatus, the module including a module flange configured to be attached to and detached from the housing flange of the housing of the charged particle apparatus, such that the module is replaceable in situ within the charged particle apparatus.

[0323]

[0351] Preferably, with the module supporting the device, and while the module is in use in the charged particle apparatus, the device is configured to operate a charged particle path substantially along the charged particle axis of the charged particle apparatus.

[0324]

[0352] Preferably, the charged particle axis coincides with the z-axis, and the module is a substantially planar structure in the xy-plane.

[0325]

[0353] Preferably, the module flange includes one or more holes for receiving alignment pins of the housing flange, and / or the module flange includes one or more alignment pins for insertion into the holes of the housing flange.

[0326]

[0354] Preferably, the module flange includes one or more alignment pins for insertion into the housing flange.

[0327]

[0355] Preferably, the module includes a device support configuration for supporting a device and a mechanism for adjusting the position of the device support configuration by movement of at least one degree of freedom.

[0328]

[0356] Preferably, the device support system allows the position of the device support configuration to be adjusted by movement of three degrees of freedom, the three degrees of freedom being preferably the z, Rx, and Ry positions of the device support configuration.

[0329]

[0357] Preferably, the mechanism for adjusting the z, Rx, and Ry positions of the device support configuration includes one or more adjustable supports, such as adjustable spring bolts, adjustable fasteners, or adjustable pins.

[0330]

[0358] Preferably, the adjustable support is positioned around the device support configuration.

[0331]

[0359] Preferably, the adjustable supports are spaced at substantially equal angular positions around the midpoint of the device support configuration.

[0332]

[0360] Preferably, there are three adjustable supports.

[0333]

[0361] Preferably, the adjustable supports are individually adjustable.

[0334]

[0362] Preferably, the mechanism for adjusting the z, Rx, and Ry positions of the device support configuration is configured to be operated when the module is outside the charged particle device.

[0335]

[0363] Preferably, the module is a module according to either the first and / or second embodiment.

[0336]

[0364] Preferably, the device support configuration includes a support positioning system and support configuration according to the first embodiment.

[0337]

[0365] According to a third aspect of the present invention, a charged particle apparatus is provided which includes a field-replaceable module according to either the first and / or second aspect.

[0338]

[0366] Preferably, the module includes a device configured to manipulate the charged particle path in a charged particle apparatus.

[0339]

[0367] Preferably, the charged particle device includes an actuator for moving the module's support positioning system, and the actuator is a linear actuator.

[0340]

[0368] Preferably, each actuator includes an actuator arm configured to engage with a corresponding receiving portion included by the module.

[0341]

[0369] Preferably, the end of the actuator arm includes a roller bearing.

[0342]

[0370] Preferably, the device includes a beam manipulator positioned to manipulate subbeams of a multibeam of charged particles.

[0343]

[0371] Preferably, the charged particle device includes a housing flange configured to be attachable to and detachable from the module flange of the module.

[0344]

[0372] Preferably, the housing flange includes one or more alignment pins for insertion into corresponding openings of the module flange.

[0345]

[0373] Preferably, the module flange includes one or more alignment pins for insertion into corresponding openings in the housing flange.

[0346]

[0374] Preferably, the charged particle device further includes a position detection system configured to determine the movement and / or position of the device.

[0347]

[0375] Preferably, the charged particle device further includes a charged particle source and one or more manipulator configurations configured to manipulate charged particle paths in the up beam and / or down beam of the device.

[0348]

[0376] Preferably, one or more manipulator configurations are configured to adjust the charged particle path, and / or a module is configured to adjust the position of the device so that the charged particle path is aligned with the device.

[0349]

[0377] Preferably, the charged particle system further includes a control system configured to control one or more manipulator configurations.

[0350]

[0378] Preferably, a first set of manipulator configurations is provided on the up beam of the module, and a second set of manipulator configurations is provided on the down beam of the module.

[0351]

[0379] Preferably, one or more of the manipulator configurations include an electrostatic deflector for deflecting the charged particle path.

[0352]

[0380] Preferably, one or more of the manipulator configurations include a magnetic lens for deflecting the charged particle path.

[0353]

[0381] Preferably, the charged particle apparatus further includes a source moving mechanism for adjusting the position of the source.

[0354]

[0382] Preferably, the charged particle apparatus further includes an objective lens, and the charged particle apparatus further includes a lens movement mechanism for adjusting the position of the objective lens.

[0355]

[0383] Preferably, at least one of the manipulator configurations is configured to be controllable to manipulate the charged particle path from the source so as to be aligned with the device and the objective lens.

[0356]

[0384] Preferably, the charged particle apparatus further includes an up-beam vacuum lock on the up-beam side of the module and a down-beam vacuum lock on the down-beam side of the module.

[0357]

[0385] Preferably, the up-beam vacuum lock and the down-beam vacuum lock are operable to isolate the area of ​​the charged particle apparatus, including the module, from the vacuum state of the adjacent area of ​​the charged particle apparatus.

[0358]

[0386] Preferably, the charged particle system further includes a source vacuum lock from the source to the down beam.

[0359]

[0387] Preferably, the source vacuum lock is operable to isolate the region of the charged particle apparatus containing the source from the vacuum state of the adjacent region of the charged particle apparatus.

[0360]

[0388] Preferably, the source is included by a field-replaceable module.

[0361]

[0389] Preferably, the charged particle apparatus further includes a secondary column, the secondary column including a detector configured to detect electrons from a sample.

[0362]

[0390] Preferably, the secondary column further includes one or more vacuum locks for isolating the region of the secondary column containing the detector from the vacuum state of one or more adjacent regions of the secondary column.

[0363]

[0391] Preferably, the detector is included by a field-replaceable module.

[0364]

[0392] A fourth aspect of the present invention provides a method for installing an electro-optical device in a charged particle apparatus, the method comprising: attaching the electro-optical device to a module; making rough adjustments to the Rx state, Ry state, and / or z position of the electro-optical device relative to the body of the module; and fixing the module to the charged particle apparatus.

[0365]

[0393] Preferably, the module is a module according to the first and / or second embodiment, and may also be a charged particle device.

[0366]

[0394] A fifth aspect of the present invention provides a method for aligning an electron-optical device with a charged particle beam or multibeam in a charged particle apparatus, the method comprising: fixing a module containing the electron-optical device to the charged particle apparatus, thereby installing the electron-optical device within the charged particle apparatus; making one or more fine adjustments to the x-position, y-position, and / or Rz-state of the electron-optical device with respect to the body of the module; and making adjustments to the path of the charged particle beam or multibeam within the charged particle apparatus.

[0367]

[0395] Preferably, before the electro-optical device is installed in the charged particle apparatus, the module receiving area within the charged particle apparatus for receiving the module is separated from the substantially vacuum state of adjacent areas within the charged particle apparatus by a closed internal vacuum seal, so that the module receiving area can be ventilated and become like the atmosphere outside the charged particle apparatus.

[0368]

[0396] Preferably, this method further includes closing an external vacuum seal on the module receiving area so that the module receiving area is isolated from the atmospheric conditions outside the charged particle device after the module has been fixed to the charged particle device, pumping the module receiving area so that the module receiving area is in a substantially vacuum state, baking the module, opening an internal vacuum seal, and operating the source of the charged particle device so that a charged particle beam or multibeam is present within the charged particle device.

[0369]

[0397] Preferably, the module is a module according to the first and / or second embodiment, and the charged particle device is a charged particle device according to the third embodiment.

[0370]

[0398] According to a sixth aspect of the present invention, an electron-optical column is provided configured to project an electron beam onto a sample, the column comprising a frame configured to define a coordinate system for the column, and a chamber for receiving a field-replaceable module containing an electron-optical device. The electron-optical column may include an engagement configuration configured to engage with a field-replaceable module in order to align the field-replaceable module with the frame. The electron-optical column may include an active positioning system configured to position the beam and device relative to each other for fine alignment.

[0371]

[0399] Preferably, the active positioning system includes an electron-optical element in the upbeam of a field-replaceable module that can be controlled to manipulate or deflect the electron beam path, such as a lens.

[0372]

[0400] Preferably, the active positioning system includes actuators configured to be engageable with field-replaceable modules and to be controllable to move the device relative to the electron beam path, preferably with degrees of freedom which are degrees of freedom of the device in a plane perpendicular to the electron beam path, wherein the device is a planar structure in a plane perpendicular to the electron beam path.

[0373]

[0401] Preferably, the electro-optical column further includes an up-beam valve for sealing the column of the up-beam portion of the chamber and a down-beam valve for sealing the chamber from the down-beam portion of the column, so that the chamber is preferably segmented from the rest of the column.

[0374]

[0402] Preferably, the chamber defines an opening on the side of a column configured to receive a field-replaceable module, and is configured to be sealable with the field-replaceable module.

[0375]

[0403] A seventh aspect of the present invention provides a field-replaceable module, positioned to be removably inserted into an electron-optical column, comprising an electron-optical element configured to manipulate the path of an electron beam in the electron-optical column, and a support configured to support the electron-optical element. The field-replaceable module may include an engagement configuration configured to align the support with the frame of the electron-optical column in all degrees of freedom.

[0376]

[0404] Preferably, the field-replaceable module further includes a support positioning system configured to displace the element relative to the rest of the module so that the element is positioned relative to the path of the electron beam through the column.

[0377]

[0405] Preferably, the elements are planar structures arranged orthogonal to the path of the charged particle beam, and the support positioning system is configured to displace the support in at least one degree of freedom of the plane of the planar structure, preferably in rotation around the x-axis, the y-axis, and / or the z-axis.

[0378]

[0406] Preferably, the support positioning system is configured to be engageable with an actuator associated with the frame of the electro-optical column, the actuator being associated with the plane degrees of freedom of the planar structure, and the support being operable in a manner controllable by the actuator so that the position of the support relative to the frame is adjusted.

[0379]

[0407] Preferably, the engagement configuration includes a plane and two interlock features, each assigned to an axial degree of freedom.

[0380]

[0408] Preferably, the engagement configuration is configured to seal against the side surface of the column.

[0381]

[0409] Preferably, the field-replaceable module further includes a pre-calibration system configured to be adjustable to adjust the alignment of the support relative to the frame, in degrees of freedom other than those adjusted by the support positioning system, and / or preferably in degrees of freedom outside the plane of the device's planar structure.

[0382]

[0410] While the present invention has been described in relation to various embodiments, other embodiments of the invention will become apparent to those skilled in the art in view of the specification and practices disclosed herein. This specification and examples are intended to be merely illustrative, and the true scope and spirit of the invention are shown by the following claims.

[0383]

[0411] The above description is intended to be an aid to understanding, not an limitation. Therefore, it will be apparent to those skilled in the art that modifications as described may be made without departing from the scope of the claims set forth below.

[0384]

[0412] Numerous clauses are provided.

[0385]

[0413] Clause 1: A module for supporting a device configured to operate a charged particle path in a charged particle apparatus, the module comprising a support configuration configured to support the device, wherein the device is configured to operate a charged particle path within the charged particle apparatus, and a support positioning system configured to move the support configuration within the module, the module being arranged in a field-replaceable manner in the charged particle apparatus.

[0386]

[0414] Clause 2: The module described in Clause 1, wherein, when the module is in use in a charged particle device with a device held by a support configuration, the charged particle path is substantially parallel to the charged particle axis of the charged particle device.

[0387]

[0415] Clause 3: The module according to Clause 1 or 2, wherein the support positioning system is configured to move the support configuration with at least three degrees of freedom of movement.

[0388]

[0416] Clause 4: A module as described in any of the preceding clauses, wherein the charged particle axis coincides with the z-axis, the module is substantially planar in the xy-plane, and at least three degrees of freedom of movement include movement in the xy-plane and rotation about the z-axis (Rz).

[0389]

[0417] Clause 5: A module described in any of the preceding clauses, wherein the support positioning system is a manual and / or automatic positioning system.

[0390]

[0418] Clause 6: The module described in any of the preceding clauses, wherein the support positioning system is configured to move the support configuration to a range of approximately 0.5 μm to 100 μm of a desired position of the support configuration, and / or to rotate the support configuration by up to 1 rad in Rz.

[0391]

[0419] Clause 7: The module described in any of the preceding clauses, further comprising a position detection system configured to determine the movement and / or position of a device held by the support configuration and / or support configuration.

[0392]

[0420] Clause 8: The module described in Clause 7, which includes grid marks such as encoders for use by the position detection system in determining the movement and / or position of the supported configuration and / or the device held by the supported configuration.

[0393]

[0421] Clause 9: The module described in Clause 7 or 8, wherein the position detection system is configured to determine the movement and / or position of the support configuration and / or the devices held by the support configuration based on one or more features of the devices held by the support configuration.

[0394]

[0422] Clause 10: A module as described in Clause 9, in which one or more features of the device include an array of apertures and / or one or more fiducials.

[0395]

[0423] Clause 11: The module described in Clause 10, wherein the array of apertures is an array of apertures used to align the substrates of a substrate stack contained by the device during the manufacturing of the device.

[0396]

[0424] Clause 12: The module described in Clause 10, wherein the array of apertures is for charged particle paths through a beam manipulator included by the device.

[0397]

[0425] Clause 13: A module as described in any of the preceding clauses, further comprising a receiving portion configured to receive each end of an actuator arm.

[0398]

[0426] Clause 14: The module as described in Clause 13, wherein the actuator arm is included by an actuator outside the module, and the support positioning system is configured to be moved by the actuator.

[0399]

[0427] Clause 15: The module according to Clause 14, wherein a first receiving portion is arranged to receive the end of a first actuator arm for moving a support positioning system in a first direction, a second receiving portion is arranged to receive the end of a second actuator arm for moving a support configuration by the support positioning system in a second direction which may be perpendicular to the first direction, and a third receiving portion is arranged to receive the end of a third actuator arm for rotating the support configuration.

[0400]

[0428] Clause 16: The module described in Clause 15, wherein the first and second directions are in the xy-plane and the rotation is around an axis such as the z-axis that is perpendicular to the xy-plane.

[0401]

[0429] Clause 17: A module as described in any one of the preceding clauses, wherein the support positioning system includes a disk and a plurality of load-bearing rotatable objects configured to support the disk within the module.

[0402]

[0430] Clause 18: The module according to Clause 17, wherein the disk has an up-beam surface and a down-beam surface, and a first set of one or more load-bearing rotatable objects is arranged to contact the up-beam surface of the disk, and a second set of multiple load-bearing rotatable objects is arranged to contact the down-beam surface of the disk.

[0403]

[0431] Clause 19: The module according to Clause 17 or 18, wherein the first set of load-bearing rotatable objects comprises one, two, or three load-bearing rotatable objects, and the second set of load-bearing rotatable objects comprises three load-bearing rotatable objects.

[0404]

[0432] Clause 20: A module as described in any one of Clauses 17 to 19, wherein, in a plan view, when the module is installed in a charged particle device, the disk is positioned such that the charged particle path passes through an opening defined in the disk.

[0405]

[0433] Clause 21: A module as described in any one of Clauses 17-20, wherein the disk is substantially ring-shaped in plan view.

[0406]

[0434] Clause 22: A module according to any one of Clauses 17 to 21, wherein the disk is preferably a substantially planar structure in the xy plane.

[0407]

[0435] Clause 23: A module described in any one of Clauses 17-22, which includes a supported configuration on the disk.

[0408]

[0436] Clause 24: A module as described in any one of Clauses 17 to 23, comprising a first force-applying device positioned to apply force to a disk, the force being substantially in the same plane as the disk and for moving the disk in that plane, and comprising a second force-applying device positioned to apply force to a disk, the force being substantially in the same plane as the disk and for rotating the disk.

[0409]

[0437] Clause 25: The module as described in Clause 24, wherein the first force-applying device is configured such that the force applied by the first force-applying device is substantially in a direction passing through the axis of rotation of the disk such that the force substantially does not rotate the disk.

[0410]

[0438] Clause 26: The module according to Clause 24 or 25, wherein, during use, the disk is compressed by a force from a first force-applying device, a force applied to a first receiving portion, and a force applied to a second receiving portion.

[0411]

[0439] Clause 27: The module described in any one of Clauses 24 to 26, wherein, when in use, the second force-applying device is arranged to apply a force that presses the third receiving portion against the end of the third actuator arm.

[0412]

[0440] Clause 28: A module as described in any one of Clauses 24 to 27, wherein a second force-applying device is arranged to apply force to a first protrusion from the sidewall of the disk, and / or a third receiving portion includes the second protrusion from the sidewall of the disk.

[0413]

[0441] Clause 29: A module as described in any one of Clauses 17-23, comprising a force-applying device positioned to apply force to a disk, wherein the applied force is substantially in the same plane as the disk, the applied force is for linear movement of the disk in the plane, and the applied force is for rotation of the disk.

[0414]

[0442] Clause 30: A module according to any one of Clauses 17 to 29, wherein the module includes one or more axial force applying devices arranged such that a disk is held under compression between a first set of load-bearing rotatable objects and a second set of load-bearing rotatable objects.

[0415]

[0443] Clause 31: The module according to Clause 30, wherein each axial force application device includes a plate that contacts one of the load-bearing rotatable objects, and / or one or more of the axial force application devices are elastic members such as springs.

[0416]

[0444] Clause 32: A module described in any one of Clauses 1 to 16, in which the support positioning system includes a flexure configuration.

[0417]

[0445] Clause 33: The module described in Clause 32, wherein the flexure configuration includes an Rz flexure configuration and an xy flexure configuration.

[0418]

[0446] Clause 34: The module according to Clause 33, wherein both the Rz flexure configuration and the xy flexure configuration are preferably substantially planar structures in the xy plane.

[0419]

[0447] Clause 35: The module according to Clause 33 or 34, wherein the Rz flexure configuration and the xy flexure configuration are arranged in a stacked configuration, and the Rz flexure configuration is preferably located on the downbeam of the xy flexure configuration.

[0420]

[0448] Clause 36: A module as described in any one of Clauses 33 to 35, wherein, in plan view, the Rz flexure configuration includes a substantially circular structure that defines an opening in the Rz flexure configuration.

[0421]

[0449] Clause 37: The module described in Clause 36, wherein the center of the substantially circular structure is substantially aligned with the z-axis.

[0422]

[0450] Clause 38: The module according to Clause 36 or 37, wherein, in plan view, the Rz flexure configuration includes a cross, the cross includes first and second crossbars intersecting at an intersection, the first crossbar being aligned in a first direction in the plane of the Rz flexure configuration, and the second crossbar being aligned in a second direction in the plane of the Rz flexure configuration, the second direction being perpendicular to the first direction.

[0423]

[0451] Clause 39: A module according to any one of Clauses 36 to 38, wherein a circular structure is located at the intersection of the first and second crossbars, and the circular structure is supported between the first and second parts of the first crossbar and between the first and second parts of the second crossbar.

[0424]

[0452] Clause 40: The module as described in Clause 39, wherein the first crossbar is aligned with the first receiving portion and the second crossbar is aligned with the second receiving portion.

[0425]

[0453] Clause 41: A module as described in any one of Clauses 33 to 40, wherein the Rz flexure configuration includes a base and a movable body.

[0426]

[0454] Clause 42: The module according to Clause 41, wherein the third receiving portion includes a recess in the side wall of the Rz flexure configuration.

[0427]

[0455] Clause 43: The module according to Clause 41 or 42, wherein the Rz flexure configuration includes a rotational force application device configured to apply a force to rotate the movable body.

[0428]

[0456] Clause 44: The module according to Clause 43, wherein, when in use, the rotational force applied by the rotational force application device is configured to press the third receiving portion against the end of the third actuator arm.

[0429]

[0457] Clause 45: A module according to any one of Clauses 33 to 44, wherein the xy flexure configuration comprises an outer structure, an intermediate structure, a central structure, and a plurality of leaf springs, wherein in the plane of the xy flexure configuration, the intermediate structure is substantially surrounded by the outer structure, a first receiving portion, and a second receiving portion, and in the plane of the xy flexure configuration, the central structure is substantially surrounded by the intermediate structure, the outer structure is connected to the intermediate structure by at least one leaf spring, and the intermediate structure is connected to the central structure by at least one leaf spring.

[0430]

[0458] Clause 46: The module according to Clause 45, wherein at least one leaf spring is arranged to connect the intermediate structure to the central structure such that the central structure is positioned to move in a first direction relative to the outer structure in response to a force applied to the first receiving portion, and at least one leaf spring is arranged to connect the outer structure to the intermediate structure such that the intermediate structure is positioned to move in a second direction relative to the outer structure in response to a force applied to the second receiving portion.

[0431]

[0459] Clause 47: The module according to Clause 46, wherein the intermediate structure is connected to the central structure by two leaf springs positioned on either side of the central structure, and the intermediate structure is connected to the outer structure by two leaf springs positioned on either side of the intermediate structure.

[0432]

[0460] Clause 48: The module according to any one of Clauses 45 to 47, further comprising a first bias device arranged to apply force such that the intermediate structure and / or central structure is held in place under compression in a first direction, and a second bias device arranged to apply force such that the intermediate structure and / or central structure is held in place under compression in a second direction.

[0433]

[0461] Clause 49: A module as described in any one of Clauses 45-48, subject to Clause 41, wherein the outer structure of the xy flexure configuration is fixed to the movable body of the Rz flexure configuration.

[0434]

[0462] Clause 50: A module as described in any one of Clauses 32 to 49, wherein the first and / or second bias device is an elastic member such as a spring.

[0435]

[0463] Clause 51: A module described in any one of Clauses 1 to 16, wherein the support positioning system includes one or more linear actuators or actuator configurations.

[0436]

[0464] Clause 52: The module described in Clause 51, wherein each actuator is a piezo actuator configuration.

[0437]

[0465] Clause 53: Each piezo actuator configuration includes a two-axis shear mode piezo device, as described in Clause 52.

[0438]

[0466] Clause 54: A support positioning system comprising a module as described in any one of Clauses 51 to 53, including a plurality of actuators.

[0439]

[0467] Clause 55: The module described in Clause 54, wherein the number of actuators included by the support positioning system is 3.

[0440]

[0468] Clause 56: A support positioning system comprising a stage, as described in any one of Clauses 51 to 55.

[0441]

[0469] Clause 57: The module described in Clause 56, wherein the stage is substantially annular in plan view.

[0442]

[0470] Clause 58: The module according to Clause 56 or 57, wherein the actuators are spaced at substantially equal angular positions with respect to the midpoint of the stage.

[0443]

[0471] Clause 59: The module described in Clause 58, wherein the actuators are aligned such that the angle between the longitudinal axes of adjacent actuators is 60 degrees.

[0444]

[0472] Clause 60: A module as described in any one of Clauses 51 to 59, wherein the actuators are configured such that all or all actuator components can be operated together to rotate the stage in the plane of the stage.

[0445]

[0473] Clause 61: A module as described in any one of Clauses 51 to 60, wherein the actuators are configured such that all of the actuators can be operated together to move the stage in a first direction within the plane of the stage.

[0446]

[0474] Clause 62: A module as described in any one of Clauses 51 to 61, wherein the actuators are configured such that all of the actuators can be operated together to move the stage in a second direction which lies in the plane of the stage, and the second direction is perpendicular to the first direction.

[0447]

[0475] Clause 63: A module according to any one of Clauses 51 to 62, further comprising one or more force-applying devices, each force-applying device being arranged to apply a force that presses the actuator against the stage.

[0448]

[0476] Clause 64: A module according to any one of Clauses 51 to 57, wherein, in plan view, at least one actuator is positioned beside the stage, and the linear movement of the actuators is configured to rotate the stage, and for each actuator beside the stage, there is a force-applying device configured to apply a force that presses the actuator against the stage.

[0449]

[0477] Clause 65: The module described in Clause 64, wherein there are two actuators adjacent to the stage, and the actuators are located on both sides of the stage.

[0450]

[0478] Clause 66: The module according to Clause 64 or 65, further comprising first and second linear actuators, wherein the first linear actuator is arranged to move the second linear actuator in a first direction, and the second linear actuator is arranged to move at least one actuator located beside the stage in a second direction perpendicular to the first direction.

[0451]

[0479] Clause 67: A module for supporting a device configured to manipulate the path of charged particles in a charged particle apparatus, the module comprising a module flange configured to be attached to and detached from the housing flange of the housing of the charged particle apparatus, such that the module is field-replaceable within the charged particle apparatus.

[0452]

[0480] Clause 68: The module according to Clause 67, wherein, with the module supporting the device, the device is configured to operate a charged particle path substantially along the charged particle axis of the charged particle device when the module is in use in the charged particle device.

[0453]

[0481] Clause 69: The module according to Clause 68, wherein the charged particle axis coincides with the z-axis and the module is substantially a planar structure in the xy-plane.

[0454]

[0482] Clause 70: A module as described in any one of Clauses 67 to 69, wherein the module flange includes one or more holes for receiving alignment pins of the housing flange, and / or the module flange includes one or more alignment pins for insertion into the holes of the housing flange.

[0455]

[0483] Clause 71: The module described in Clause 70, wherein the module flange includes one or more alignment pins for insertion into the housing flange.

[0456]

[0484] Clause 72: A module as described in any one of Clauses 67 to 71, comprising a device support configuration for supporting a device and a mechanism for adjusting the position of the device support configuration by movement of at least one degree of freedom.

[0457]

[0485] Clause 73: The module according to Clause 72, wherein the device support system allows the position of the device support configuration to be adjusted by movement of three degrees of freedom, the movement of the three degrees of freedom being preferably the z, Rx, and Ry positions of the device support configuration.

[0458]

[0486] Clause 74: The module described in Clause 72 or 73, wherein the mechanism for adjusting the z, Rx, and Ry positions of the device support configuration includes one or more adjustable supports such as adjustable spring bolts, adjustable fasteners, or adjustable pins.

[0459]

[0487] Clause 75: Adjustable support is provided around the module described in Clause 74, which is arranged around the device support configuration.

[0460]

[0488] Clause 76: The module described in Clause 74 or 75, wherein the adjustable supports are spaced at substantially equal angular positions with respect to the midpoint of the device support configuration.

[0461]

[0489] Clause 77: A module described in any one of Clauses 74-76 for which three adjustable supports exist.

[0462]

[0490] Clause 78: Adjustable support is available for any module specified in any one of Clauses 74-76, which is individually adjustable.

[0463]

[0491] Clause 79: A module as described in any one of Clauses 72-78, wherein the mechanism for adjusting the z, Rx, and Ry positions of the device support configuration is configured to be operated when the module is outside the charged particle device.

[0464]

[0492] Clause 80: A module that is a module described in any one of Clauses 1 to 66, and is a module described in any one of Clauses 67 to 79.

[0465]

[0493] Clause 81: The module described in Clause 80, wherein the device support configuration includes a support positioning system and support configuration as described in any one of Clauses 1 to 67.

[0466]

[0494] Clause 82: A charged particle apparatus including a field-replaceable module as described in any one of Clauses 1 to 81.

[0467]

[0495] Clause 83: A charged particle apparatus as described in Clause 82, wherein the module includes a device configured to operate a charged particle path in the charged particle apparatus.

[0468]

[0496] Clause 84: The charged particle apparatus according to Clause 83, wherein the charged particle apparatus includes an actuator for moving a module support positioning system, and the actuator is a linear actuator.

[0469]

[0497] Clause 85: The charged particle apparatus according to Clause 84, comprising an actuator arm configured so that each actuator engages with a corresponding receiving portion included by the module.

[0470]

[0498] Clause 86: The charged particle apparatus according to Clause 85, wherein the end of the actuator arm includes a roller bearing.

[0471]

[0499] Clause 87: A charged particle apparatus as described in any one of Clauses 83 to 86, wherein the device includes a beam manipulator arranged to manipulate subbeams of a multibeam of charged particles.

[0472]

[0500] Clause 88: A charged particle device as described in any one of Clauses 82 to 86, comprising a housing flange configured to be attachable to and detachable from the module flange of a module.

[0473]

[0501] Clause 89: The charged particle apparatus according to Clause 88, wherein the housing flange includes one or more alignment pins for insertion into corresponding openings of the module flange.

[0474]

[0502] Clause 90: A charged particle apparatus according to Clause 88 or 89, wherein the module flange includes one or more alignment pins for insertion into corresponding openings of the housing flange.

[0475]

[0503] Clause 91: A charged particle device as described in any one of Clauses 83 to 90, further comprising a position detection system configured to determine the movement and / or position of the device.

[0476]

[0504] Clause 92: A charged particle device as described in any one of Clauses 83 to 91, further comprising a charged particle source and one or more manipulator configurations configured to operate charged particle paths in the up beam and / or down beam of the device.

[0477]

[0505] Clause 93: The charged particle apparatus according to Clause 92, wherein one or more manipulator configurations are configured to adjust the charged particle path, and / or a module is configured to adjust the position of the device so that the charged particle path is aligned with the device.

[0478]

[0506] Clause 94: The charged particle apparatus according to Clause 92 or 93, further comprising a control system configured to control one or more manipulator configurations.

[0479]

[0507] Clause 95: A charged particle apparatus according to any one of Clauses 92 to 94, wherein a first set of manipulator configurations is provided on the up beam of the module, and a second set of manipulator configurations is provided on the down beam of the module.

[0480]

[0508] Clause 96: A charged particle apparatus as described in any one of Clauses 92 to 95, wherein one or more of the manipulator configurations include an electrostatic deflector for deflecting a charged particle path.

[0481]

[0509] Clause 97: A charged particle apparatus as described in any one of Clauses 92 to 96, wherein one or more of the manipulator configurations include a magnetic lens for deflecting the charged particle path.

[0482]

[0510] Clause 98: A charged particle device as described in any one of Clauses 92 to 97, further comprising a source moving mechanism for adjusting the position of the source.

[0483]

[0511] Clause 99: A charged particle device according to any one of Clauses 92 to 98, wherein the charged particle device further includes an objective lens, and the charged particle device further includes a lens moving mechanism for adjusting the position of the objective lens.

[0484]

[0512] Clause 100: The charged particle apparatus according to Clause 99, wherein at least one of the manipulator configurations is configured to be controllable to manipulate the charged particle path from the source so as to be aligned with the device and the objective lens.

[0485]

[0513] Clause 101: A charged particle apparatus as described in any one of Clauses 92 to 100, further comprising an up-beam vacuum lock on the up-beam side of the module and a down-beam vacuum lock on the down-beam side of the module.

[0486]

[0514] Clause 102: The charged particle apparatus according to Clause 101, wherein up-beam vacuum locks and down-beam vacuum locks are operable to isolate the area of ​​the charged particle apparatus, including modules, from the vacuum state of the adjacent area of ​​the charged particle apparatus.

[0487]

[0515] Clause 103: A charged particle apparatus as described in any one of Clauses 92 to 102, wherein the charged particle system further includes a source vacuum lock from the source to the down beam.

[0488]

[0516] Clause 104: The charged particle apparatus according to Clause 103, wherein a source vacuum lock is operable to isolate the area of ​​the charged particle apparatus containing the source from the vacuum state of the adjacent area of ​​the charged particle apparatus.

[0489]

[0517] Clause 105: A charged particle apparatus as described in Clause 104, wherein the source is included by a field-replaceable module.

[0490]

[0518] Clause 106: A charged particle apparatus as described in any one of Clauses 92 to 105, further comprising a secondary column, the secondary column comprising a detector configured to detect electrons from a sample.

[0491]

[0519] Clause 107: The charged particle apparatus according to Clause 106, wherein the secondary column further includes one or more vacuum locks for separating a region of the secondary column containing a detector from the vacuum state of one or more adjacent regions of the secondary column.

[0492]

[0520] Clause 108: A charged particle apparatus as described in Clause 107, wherein the detector is included by a field-replaceable module.

[0493]

[0521] Clause 109: A method for installing an electro-optical device in a charged particle apparatus, comprising: attaching the electro-optical device to a module; making coarse adjustments to the Rx state, Ry state, and / or z position of the electro-optical device relative to the body of the module; and fixing the module to the charged particle apparatus.

[0494]

[0522] Clause 110: The method according to Clause 109, wherein the module is a module described in any one of Clauses 1 to 81, and the charged particle device is a charged particle device described in any one of Clauses 82 to 108.

[0495]

[0523] Clause 111: A method for aligning an electro-optical device with a charged particle beam or multibeam in a charged particle apparatus, comprising: fixing a module containing the electro-optical device to the charged particle apparatus, thereby installing the electro-optical device within the charged particle apparatus; making one or more fine adjustments to the x-position, y-position, and / or Rz-state of the electro-optical device with respect to the body of the module; and making adjustments to the path of the charged particle beam or multibeam within the charged particle apparatus.

[0496]

[0524] Clause 112: The method according to Clause 111, wherein, before the electro-optical device is installed in the charged particle device, the module receiving area in the charged particle device for receiving the module is separated from the substantially vacuum state of the adjacent area in the charged particle device by a closed internal vacuum seal so that the module receiving area can be ventilated and become atmospheric conditions outside the charged particle device.

[0497]

[0525] Clause 113: The method according to Clause 112, further comprising: closing an external vacuum seal of a module receiving area so that the module receiving area is isolated from the atmospheric conditions outside the charged particle device after the module has been fixed to the charged particle device; pumping the module receiving area so that the module receiving area is in a substantially vacuum state; baking the module; opening an internal vacuum seal; and operating the source of the charged particle device so that a charged particle beam or multibeam is present within the charged particle device.

[0498]

[0526] Clause 114: The method according to any one of Clauses 111 to 113, wherein the module is a module described in any one of Clauses 1 to 81, and the charged particle device is a charged particle device described in any one of Clauses 82 to 108.

[0499]

[0527] Clause 115: An electron-optical column configured to project an electron beam onto a sample, comprising: a frame configured to define a coordinate system for the column; a chamber for receiving a field-replaceable module including an electron-optical device; an engagement configuration configured to engage with the field-replaceable module for aligning the field-replaceable module with the frame; and an active positioning system configured to position the beam and device relative to each other for fine alignment.

[0500]

[0528] Clause 116: An electron-optical column as described in Clause 115, comprising an electron-optical element in the upbeam of a field-replaceable module, controllable by an active positioning system to manipulate or deflect the electron beam path, such as a lens.

[0501]

[0529] Clause 117: An electron-optical column according to Clause 115 or 116, comprising an actuator configured to be able to engage with a field-replaceable module and to be able to control the movement of the device relative to the path of an electron beam in degrees of freedom which are degrees of freedom of the device in a plane orthogonal to the path of the electron beam, wherein the device is a planar structure in a plane orthogonal to the path of the electron beam.

[0502]

[0530] Clause 118: An electro-optical column according to any one of Clauses 115 to 117, further comprising an up-beam valve for sealing the column of the up-beam portion of the chamber, and a down-beam valve for sealing the chamber from the down-beam portion of the column, preferably such that the chamber is segmented from the rest of the column.

[0503]

[0531] Clause 119: An electro-optical column as described in any one of Clauses 115 to 118, wherein the chamber is configured to have an opening on the side of the column configured to receive a field-replaceable module, and is configured to be sealable with a field-replaceable module.

[0504]

[0532] Clause 120: A field-replaceable module, positioned to be removablely inserted into an electron-optical column, comprising: a) an electron-optical element configured to manipulate the path of an electron beam in the electron-optical column; b) a support configured to support the electron-optical element; and c) an engagement configuration configured to align the support with the frame of the electron-optical column in all degrees of freedom.

[0505]

[0533] Clause 121: A field-replaceable module as described in Clause 120, further comprising a support positioning system configured to displace an element relative to the rest of the module so that the element is positioned relative to the path of an electron beam through a column.

[0506]

[0534] Clause 122: A field-replaceable module as described in Clause 121, wherein the elements are planar structures arranged orthogonal to the path of a charged particle beam, and the support positioning system is configured to displace the support in at least one degree of freedom of the plane of the planar structure, preferably in the x-axis, in the y-axis, and / or in rotation about the z-axis.

[0507]

[0535] Clause 123: A field-replaceable module as described in Clause 121 or 122, wherein the support positioning system is configured to be engageable with an actuator associated with the frame of an electro-optical column, the actuator being associated with the plane of a planar structure, and the support being controllable by the actuator so that the position of the support relative to the frame is adjusted.

[0508]

[0536] Clause 124: A field-replaceable module as described in any one of Clauses 120 to 123, wherein the engagement configuration includes a plane and two interlock features, each assigned to an axial degree of freedom.

[0509]

[0537] Clause 125: A field-replaceable module as described in any one of Clauses 120 to 124, wherein the engagement configuration is configured to seal against the side of the column.

[0510]

[0538] Clause 126: A field-replaceable module as described in any one of Clauses 120 to 125, further comprising a pre-calibration system configured to be adjustable to adjust the alignment of the support to the frame in degrees of freedom other than those adjusted by the support positioning system, and / or preferably in degrees of freedom outside the plane of the device's planar structure.

Claims

1. An electron-optical column configured to project an electron beam onto a sample, wherein the electron-optical column is A frame configured to define the coordinate system of the aforementioned electron-optical column, A chamber for receiving field-replaceable modules, including electro-optical devices, An engagement configuration configured to engage with the field-replaceable module in order to align the field-replaceable module with the frame, An active positioning system configured to position the electron beam and the electron-optical device relative to each other for fine alignment. Includes an electro-optics column.

2. The electron-optical column according to claim 1, wherein the active positioning system includes an electron-optical element positioned on the up-beam side of the field-replaceable module, and the electron-optical element is controllable to manipulate the electron beam.

3. The electron-optical column according to claim 2, wherein the electron-optical element is a lens configured to deflect the path of an electron beam.

4. The electro-optical column according to claim 1, wherein the active positioning system includes one or more actuators configured to be engageable with the field-replaceable module.

5. The electron-optical column according to claim 4, wherein the actuator is controllable to move the electron-optical device relative to the path of the electron beam, and the movement is performed in at least one degree of freedom.

6. The electron-optical column according to claim 4 or 5, wherein at least one of the actuators is a piezoelectric actuator.

7. The electron-optical column according to claim 5, wherein the degrees of freedom are the degrees of freedom of the electron-optical device in a plane perpendicular to the path of the electron beam.

8. The electron-optical column according to claim 7, wherein the electron-optical device is a planar structure arranged in the plane perpendicular to the path of the electron beam.

9. The path of the electron beam corresponds to the z-axis, The electron-optical column according to claim 7 or 8, wherein the degrees of freedom in the plane are translation in the x-y plane and / or rotation around the z axis.

10. The actuator is a linear actuator, The electro-optical column according to claim 4, wherein each actuator includes an actuator arm configured to engage with a corresponding receiving portion provided on the field-replaceable module.

11. The electro-optical column according to claim 10, wherein the end of the actuator arm includes a roller bearing.

12. An up-beam valve that seals the column on the up-beam side of the chamber, A downbeam valve that seals the chamber from the downbeam portion of the column and It further includes, The electron-optical column according to claim 1, wherein the chamber is segmented from the rest of the electron-optical column.

13. The system further includes a vent / pump valve located in a region isolated by the up-beam valve and the down-beam valve, The electro-optical column according to claim 12, wherein the vent / pump valve is configured to vent and pump the region when the field-replaceable module is replaced.

14. The chamber defines an opening on the side of the electron-optical column, The electron-optical column according to claim 1, wherein the opening is configured to receive a field-replaceable module and can be sealed by the field-replaceable module.

15. Including secondary columns, The secondary column includes a detector configured to detect electrons from a sample, The electron-optical column according to claim 1, wherein the secondary column further includes one or more vacuum locks for isolating the region containing the detector from the vacuum conditions of the adjacent region of the secondary column.

Images