Indication device

Abstract

By placing a reinforced substrate relatively close to the display area that emits the image, a display device with improved durability is provided. [Solution] The display device according to this specification may include a display panel including a display area and a non-display area surrounding the display area; a light-emitting element section including a plurality of light-emitting elements arranged on the display area of ​​the display panel; a rigidity reinforcing layer arranged on the upper part of the display panel; and a polarizing layer on the rigidity reinforcing layer.

Description

Technical Field

[0001] This specification relates to a display device capable of improving durability.

Background Art

[0002] Display devices are applied to various electronic devices such as televisions, mobile phones, notebook computers, and tablet PCs. For this reason, research for developing thinner, lighter, and lower power consumption of display devices has been continuously conducted.

[0003] Examples of display devices include a liquid crystal display device (LCD), a plasma display panel device (PDP), a field emission display device (FED), an electro-wetting display device (EWD), and an organic light emitting display (OLED).

[0004] Among display devices that display various information as images, an organic light emitting display (OLED) includes a plurality of pixel regions arranged in a display area where an image is displayed, and organic light emitting elements arranged corresponding to the plurality of pixel regions. Since an organic light emitting element is a self-emitting element that emits light by itself, an organic light emitting display device has advantages such as a faster response speed, higher luminous efficiency, higher brightness, larger viewing angle, and better contrast ratio and color reproduction rate compared to a liquid crystal display device.

[0005] The description provided in the background art of the invention should not be assumed as prior art. The background art of the invention may include information explaining one or more aspects of the subject technology, and this description does not limit the invention.

Summary of the Invention

Problems to be Solved by the Invention

[0006] The organic light-emitting device may include a first substrate on which organic light-emitting elements are arranged, and a second substrate arranged opposite to the first substrate. The organic light-emitting elements contain organic materials that are easily degraded by moisture and oxygen. In this case, a frit sealing material is placed between the first and second substrates, surrounding the edges of the organic light-emitting device, and the organic light-emitting elements placed inside the frit sealing material are sealed by an air gap.

[0007] However, a gap may form between the first and second substrates, and the frit sealant may separate from either the first or second substrate, potentially causing defects where it acts as a foreign object within the display device. Furthermore, the organic light-emitting element placed between the first and second substrates has limitations in that it lacks rigidity and is susceptible to damage due to being sealed via an air gap.

[0008] Thus, the problem to be solved by one embodiment of this specification is to provide a display device with improved durability by placing a reinforced substrate in a position relatively close to the display area that emits an image.

[0009] The problem to be solved by one embodiment of this specification is to provide a display device that can prevent defects from occurring due to delamination between layers that overlap in the upper and lower directions by applying an adhesive member that covers the entire surface of the display area.

[0010] The problem to be solved by one embodiment of this specification is to reduce the overall weight of a display device by providing a reinforced substrate that can increase the rigidity of the display device and eliminate the need for multiple layers for surface treatment.

[0011] The problems to be solved by one embodiment of this specification are not limited to the objectives mentioned above. Other objectives and advantages of the present invention not mentioned can be understood from the following description and will be more clearly understood from the embodiments of this specification. Furthermore, it will be readily understood that the objectives and advantages of this specification can be achieved by the means and combinations thereof shown in the claims.

[0012] Further details of the embodiments specified herein are included in the detailed description and drawings. [Means for solving the problem]

[0013] A display device according to one embodiment of this specification may include a display panel including a display area and a non-display area surrounding the display area; a light-emitting element section including a plurality of light-emitting elements arranged on the display area of ​​the display panel; a rigidity reinforcing layer arranged on the upper part of the display panel; and a polarizing layer on the rigidity reinforcing layer.

[0014] According to the embodiments of this specification, the rigidity of the display device can be increased, thereby improving its durability.

[0015] According to the embodiments of this specification, by arranging an adhesive member that covers the entire area of ​​the display panel and arranging a rigid reinforcing layer on top thereof, it is possible to prevent defects in which the adhesive member peels off between the films and acts as a foreign object.

[0016] According to the embodiments of this specification, a rigidity-reinforcing layer to increase the rigidity of the display device can be placed below the polarizing layer located at the top of the display device. This eliminates the need for multi-layer functional layers for surface treatment, resulting in a lightweight display device and thus reducing the overall weight of the product.

[0017] The effects described herein are not limited to those mentioned above, and any other effects not mentioned can be clearly understood by those skilled in the art from the following description. [Brief explanation of the drawing]

[0018] [Figure 1] It is a plan view schematically showing a part of a display device according to an embodiment of this specification. [Figure 2] It is a cross-sectional view showing the display device of FIG. 1 from one side. [Figure 3] It is an enlarged cross-sectional view showing region 3 of FIG. 2. [Figure 4] It is a cross-sectional view showing the display device shown in FIG. 1 along line 4-4. [Figure 5] It is a cross-sectional view showing the display device shown in FIG. 1 along line 5-5. [Figure 6] It is a cross-sectional view showing the display device shown in FIG. 1 along line 6-6. [Figure 7] It is a cross-sectional view showing another embodiment of the display device of FIG. 1 from one side. [Figure 8] It is an enlarged cross-sectional view showing region 8 of FIG. 7. [Figure 9] It is a cross-sectional view showing another embodiment of the display device shown in FIG. 1 along line 9-9. [Figure 10] It is a cross-sectional view showing another embodiment of the display device shown in FIG. 1 along line 10-10. [Figure 11] It is a cross-sectional view showing another embodiment of the display device shown in FIG. 1 along line 11-11. [Figure 12] It is a figure showing the viewing angle distance of the embodiment of this specification. [Figure 13] It is a cross-sectional view showing another embodiment of the display device of FIG. 1 from one side. [Figure 14] It is an enlarged cross-sectional view showing region 14 of FIG. 13.

Mode for Carrying Out the Invention

[0019] The advantages and features of this specification, and the methods for achieving them, will become clear with reference to the embodiments described below in detail, along with the accompanying drawings. However, this specification is not limited to the embodiments disclosed below, but can be embodied in a variety of different forms. These embodiments are provided to complete the disclosure of this specification and to fully inform those who have ordinary skill in the art to which this specification pertains of the scope of the invention.

[0020] The shapes, sizes, proportions, angles, and quantities disclosed in the drawings for the purpose of illustrating embodiments of this specification are illustrative, and this specification is not limited to those depicted. The same reference numerals throughout the specification refer to the same components. In addition, if a specific description of the relevant known technology is deemed to obscure the gist of this specification, such description will be omitted. Where "includes," "has," "becomes," etc., as used in this specification, other parts may be added unless "only" is used. When a component is shown singly, it includes cases where it includes multiple components unless otherwise explicitly stated.

[0021] When interpreting the constituent elements, even if not explicitly stated elsewhere, they shall be interpreted as including a margin of error.

[0022] When describing the positional relationship between two parts, for example, using phrases like "on top of," "above," "below," or "to the side," it is acceptable for one or more other parts to be located between the two parts, unless "immediately" or "directly" is used.

[0023] When describing temporal relationships, for example, when describing the sequence of events using phrases such as "after," "following," "next," or "before," it is acceptable to include cases that are not consecutive, unless "immediately" or "directly" is used.

[0024] While terms such as "First," "Second," etc., are used to describe various components, these components are not limited by these terms. These terms are simply used to distinguish one component from another. Therefore, the first component referred to below may also be the second component within the technical concept of this specification.

[0025] The features of the various embodiments described herein can be combined or linked together, either partially or entirely, and are technically capable of various interlocking and driving mechanisms. Each embodiment can be implemented independently of the others or in conjunction with them.

[0026] The display devices according to each embodiment of the present invention will be described below with reference to the attached drawings.

[0027] Figure 1 is a schematic plan view showing a part of a display device according to one embodiment of this specification. Figure 2 is a cross-sectional view of the display device of Figure 1, showing one side. Figure 3 is an enlarged cross-sectional view showing region 3 of Figure 2. For convenience of explanation, Figure 1 shows only the display panel (PNL), printed circuit board 1020, flexible circuit board 1010, and integrated circuit chip 1015 arranged on the flexible printed circuit board 1010 among the various components of the display device 1000, but the components of the display device 1000 according to this specification are not limited to these. On the other hand, the components of each display device according to any embodiment of this specification are all configured by operational coupling.

[0028] Referring to Figures 1 to 3, a display device 1000 according to one embodiment of this specification may include a display panel (PNL), a cover substrate 160 above the display panel (PNL), and a backplate portion 180 below the display panel (PNL). A polarizing layer 153 may be placed between the display panel (PNL) and the cover substrate 160, and a protective coating layer 170 may be placed between the display panel (PNL) and the backplate portion 180. The display panel (PNL) and the polarizing layer 153 may be bonded via a first adhesive member 150, and the backplate portion 180 may be bonded to the protective coating layer 170 via a second adhesive member 173.

[0029] The display panel (PNL) includes a base substrate 101. The base substrate 101 may include a transparent material such as plastic or glass. In some exemplary embodiments, the base substrate 101 is made from a flexible plastic material or a flexible polymer film. For example, flexible polymer films can be made from one of the following materials: polyimide (PI), polyethylene terephthalate (PET), acrylonitrile-butadiene-styrene copolymer (ABS), polymethyl methacrylate (PMMA), polyethylene naphthalate (PEN), polycarbonate (PC), polyethersulfone (PES), polyarylate (PAR), polysulfone (PSF), cyclic olefin copolymer (COC), triacetylcellulose (TAC), polyvinyl alcohol (PVA), and polystyrene (PS), and this disclosure is not limited to these materials.

[0030] The base substrate 101 may have a rectangular shape with a longer side in the first direction and a shorter side in the second direction when viewed from above. Alternatively, the base substrate 101 may have a square shape with rounded corners, but is not limited to this. The first direction may be, for example, the X-axis direction or the transverse direction of the base substrate 101, and the second direction may be, for example, the Y-axis direction or the vertical direction of the first substrate 100, but is not limited to this.

[0031] A display panel (PNL) may include a display area (AA) and a non-display area (NAA) located outside the display area (AA). For example, the non-display area (NAA) may be located near the display area (AA), surround the display area (AA), or be located around the display area (AA), but is not limited to these.

[0032] Multiple subpixels (P) may be arranged in the display area (AA) of the base substrate 101. Images or videos can be displayed in the display area (AA) via the multiple subpixels (P). Multiple subpixels (P) are the smallest units that constitute the display area (AA), and n subpixels (P) can form one pixel. Each of the multiple subpixels (P) can emit light having a different wavelength from each other. Multiple subpixels may include a first to third subpixel that emits light of different colors from each other. For example, multiple subpixels (P) may include a red subpixel (PR) as the first subpixel, a green subpixel (PG) as the second subpixel, and a blue subpixel (PB) as the third subpixel. Also, multiple subpixels (SP) may include a white subpixel.

[0033] For example, a plurality of subpixels (P) may include red, green, and blue subpixels, where the red, green, and blue subpixels may be arranged in a repeating pattern. Alternatively, a plurality of subpixels (P) may include red, green, blue, and white subpixels, where the red, green, blue, and white subpixels may be arranged in a repeating pattern, or the red, green, blue, and white subpixels may be arranged in a quad type. For example, the red subpixel, blue subpixel, and green subpixel may be arranged sequentially along the row direction, or the red subpixel, blue subpixel, green subpixel, and white subpixel may be arranged sequentially along the row direction. However, in the embodiments of this specification, the hue type, arrangement type, and arrangement order of the subpixels are not limiting and can be configured in various forms depending on the emission characteristics, element lifetime, and element specifications.

[0034] On the other hand, subpixels may have different light emission regions depending on their emission characteristics. For example, a subpixel that emits light of a different hue than a blue subpixel may have a different light emission region than the blue subpixel. For example, a red subpixel, a blue subpixel, and a green subpixel, or a red subpixel, a blue subpixel, a white subpixel, and a green subpixel may each have different light emission regions.

[0035] The non-display area (NAA) may have multiple drive units to drive multiple subpixels (P) located in the display area (AA). The drive units may include, but are not limited to, gate drive units, data drive units, touch drive units, and timing controllers.

[0036] The non-display area (NAA) can be defined as the area surrounding the display area (AA) where no video or image is displayed. The non-display area (NAA) may include, for example, the upper edge area, lower edge area, left edge area, and right edge area of ​​the display panel (PNL). A flexible circuit board 1010 and a printed circuit board 1020 may be placed on at least one side edge of the non-display area (NAA).

[0037] An integrated circuit chip 1015 may be placed on the flexible circuit board 1010. One side of the flexible circuit board 1010 is coupled to the base board 101, and the other side is coupled to the printed circuit board 1020, so that power and various signals supplied from the printed circuit board 1020 can be provided to the display area (AA) of the base board 101 for driving the light-emitting element. Various signals may include, for example, high potential voltage, low potential voltage, scan signals, data signals, or touch-sensing signals.

[0038] The printed circuit board 1020 can supply signals to the integrated circuit chip 1015 located on the flexible circuit board 1010. Various components may be arranged on the printed circuit board 1020 to supply various signals to the integrated circuit chip 1015. In Figure 1, the flexible circuit board 1010 and the printed circuit board 1020 are shown as one each, but this is not limited to them. For example, multiple flexible circuit boards 1010 and multiple printed circuit boards 1020 may be arranged on one side edge of the base board 101.

[0039] Referring to Figure 1, the display area (AA) of the base substrate 101 may have multiple data lines (DL) and multiple scan lines (SL). Each of the multiple data lines (DL) may be arranged to intersect with each of the multiple scan lines (SL). A subpixel (P) is defined by the intersecting data lines (DL) and scan lines (SL), and multiple subpixels (P) may be arranged in the display area (AA). One subpixel (P) can be electrically connected to, for example, a gate line and a data line.

[0040] One scan line (SL) extends along a first direction of the base substrate 101. Each of multiple scan lines (SL) may be spaced apart from each other in a second direction intersecting the first direction. One data line (DL) extends along a second direction. Each of multiple data lines (DL) may be spaced apart from each other in a first direction intersecting the second direction. The first direction may be, for example, the X-axis direction or the transverse direction of the base substrate 101, and the second direction may be, for example, the Y-axis direction or the longitudinal direction of the first substrate 100, but is not limited to these.

[0041] Multiple subpixels (P) arranged on the display area (AA) can form a matrix arrangement (M*N, where M and N are natural numbers) on the display area (AA) of the base substrate 101. Each subpixel (P) is equipped with a light-emitting element and can emit light of different hues. For example, it can emit red, green, or blue light, but is not limited to these.

[0042] Referring to Figures 2 and 3, the base substrate 101 may include transistors (TR), light-emitting elements (EL), and touch sensor elements (TS) for driving subpixels. The base substrate 101 may include a first surface and a second surface facing the first surface. Circuit elements including transistors (TR) may be arranged on the first surface of the base substrate 101, and a protective coating layer 170 may be arranged on the second surface where transistors (TR) and other elements are not arranged.

[0043] A transistor (TR) may include a gate electrode 103, a gate insulating layer 105, a semiconductor layer 107, and source / drain electrodes 111. The gate insulating layer 105 may be located between the gate electrode 103 and the semiconductor layer 107. Figure 3 illustrates a bottom-gate structure for the transistor (TR), but is not limited to this. The transistor (TR) may also have a top-gate or double-gate structure, for example.

[0044] The gate electrode 103 may be formed from a single layer or multiple layers of any of the following: molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0045] The semiconductor layer 107 may consist of an oxide semiconductor or a silicon-based semiconductor material. The semiconductor layer 107 may include, for example, a transparent oxide semiconductor material such as indium-gallium-zinc-oxide (IGZO) or indium-zinc-oxide (IZO). Alternatively, the semiconductor layer 107 may include a low-temperature grown silicon semiconductor material. The semiconductor layer 107 may include a channel region and source / drain regions arranged on both sides of the channel region. The gate insulating layer 105 may consist of a single layer or more layers of silicon oxide (SiOx) or silicon nitride (SiNx), but is not limited thereto. For example, the gate insulating layer 105 may be formed from a single or multi-layer inorganic film. For instance, a single-layer inorganic film may be a silicon oxide (SiOx) film or a silicon nitride (SiNx) film, and a multi-layer inorganic film may be formed by alternately stacking one or more silicon oxide (SiOx) films, one or more silicon nitride (SiNx) films, and one or more amorphous silicon (a-Si), but this specification is not limited thereto.

[0046] The base substrate 101 and the gate electrode 103 may further include a buffer layer containing an insulating material that reduces or prevents the penetration of moisture or impurities by the base substrate 101, and a light-shielding layer positioned to block external light incident on the semiconductor layer 107.

[0047] The light-shielding layer may be placed on the base substrate 101. The light-shielding layer blocks light incident on the semiconductor layers 107 of multiple transistors, minimizing leakage current. For example, the light-shielding layer is placed beneath the semiconductor layer 107 of a drive transistor (TR) to block light incident on the semiconductor layer 107. When light irradiates the semiconductor layer 107, leakage current is generated, reducing the reliability of the drive transistor (TR). Therefore, the light-shielding layer, which blocks light, is placed on the base substrate 101 to improve the reliability of the transistor. The light-shielding layer can be, but is not limited to, made of an opaque conductive material such as copper (Cu), aluminum (Al), molybdenum (Mo), nickel (Ni), titanium (Ti), chromium (Cr), or alloys thereof.

[0048] The buffer layer may be placed on the light-shielding layer. The buffer layer can reduce the penetration of moisture or impurities by the base substrate 101. For example, the buffer layer may consist of a single layer, a double layer, or more layers of silicon oxide (SiOx) or silicon nitride (SiNx), but is not limited thereto. For example, the buffer layer may be formed from a single or multi-layer inorganic film, for example, a single-layer inorganic film may be a silicon oxide (SiOx) film or a silicon nitride (SiNx) film, and a multi-layer inorganic film may be formed by alternately stacking one or more silicon oxide (SiOx) films, one or more silicon nitride (SiNx) films, and one or more amorphous silicon (a-Si), but is not limited thereto. However, the buffer layer may be omitted depending on the type of base substrate 101 or the type of drive transistor (TR), but is not limited thereto.

[0049] An interlayer insulating layer 109 may be placed on the gate electrode 103. Source / drain electrodes 111 may be placed that penetrate the interlayer insulating layer 109 and connect to the source / drain region of the semiconductor layer 107. The source / drain electrodes 111 may be placed so as to cover a portion of the upper surface of the interlayer insulating layer 109.

[0050] A planarization layer 115 may be disposed on the interlayer insulating layer 109 and the source / drain electrodes 111. The planarization layer 115 can consist of a single layer or multiple layers. The planarization layer 115 can flatten steps generated by the lower circuit elements, including transistors (TRs). The planarization layer 115 may contain an organic insulating material such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin. However, it is not limited to this, and may contain any organic insulating material that can flatten steps.

[0051] The planarization layer 115 may expose a portion of the surface of one of the source / drain electrodes 111 of the transistor (TR) and may include a contact hole 117 that penetrates the planarization layer 115. The contact hole 117 may also be called a pixel contact hole.

[0052] A light-emitting element (EL) may be arranged on the planarization layer 115. The light-emitting element (EL) may include an organic light-emitting element (ED) comprising a first electrode 120, an organic light-emitting layer 123, and a second electrode 125, and a bank 121 having bank holes 122. The first electrode 120 of the organic light-emitting element (ED) may also be called an anode electrode or a pixel electrode, and the second electrode 125 may also be called a cathode electrode or a counter electrode.

[0053] The first electrode 120 may be positioned on the planarization layer 115. The first electrode 120 may, for example, extend into the contact hole 117 and contact the source / drain electrode 111 whose surface is exposed by the contact hole 117. A portion of the first electrode 120 extending into the contact hole 117 may be a contact electrode. This allows the first electrode 120 to be electrically connected to the transistor (TR).

[0054] The first electrode 120 may contain a transparent metal oxide such as indium tin oxide (ITO) or indium zinc oxide (IZO). Alternatively, the first electrode 120 may contain, but is not limited to, a torticultural or multilayer structure including a reflective metal film formed from silver (Ag), aluminum (Al), gold (Au), nickel (Ni), chromium (Cr), and compounds thereof.

[0055] A bank 121 having bank holes 122 may be arranged on the planarization layer 115. The bank 121 can separate each subpixel (P, see Figure 1). For this purpose, the bank 121 can cover the edge of the first electrode 120. The bank 121 can also prevent the mixing of light of other colors between adjacent subpixels. For example, the bank 121 may be composed of a black bank with a high light absorption rate to suppress the mixing of hues between adjacent subpixels. For example, the bank 121 may, but is not limited to, an organic insulating film such as polyimide or epoxy.

[0056] The bank hole 122 allows a portion of the first electrode 120 to be exposed. The exposed portion of the first electrode 120 can become a light-emitting region. An organic light-emitting layer 123 may be placed on the first electrode 120. In one example, the organic light-emitting layer 123 may contain an organic material that emits a different color for each subpixel. The organic light-emitting layer 123 may emit any of the following hues, for example, red, green, blue, and white. In another example, the organic light-emitting layer 123 may consist of an organic material that emits white light and can also show any of the following hues, red, green, or blue, through a color filter.

[0057] In one embodiment, the organic light-emitting layer 123 may be formed to cover the first electrode 120 while also covering a portion of the side surface of the bank 121. In another embodiment, the organic light-emitting layer 123 may extend across the entire surface of the display area (AA) to cover the exposed surfaces of the first electrode 120 and the bank 121.

[0058] The organic light-emitting layer 123 may include a stack structure comprising a hole transporting layer (HTL), an emission material layer (EML), an electron transporting layer (ETL), a hole blocking layer (HBL), a hole injection layer (HIL), an electron blocking layer (EBL), and an electron injection layer (EIL). The emission material layer (EML) of the organic light-emitting layer 123 can emit light through the recombination of holes injected from the first electrode 120 and electrons injected from the second electrode 125.

[0059] A second electrode 125 may be disposed on the organic light-emitting layer 123. The second electrode 125 can be formed to cover the organic light-emitting layer 123. The second electrode 125 may be formed in common on multiple subpixels (SPs). The second electrode 125 may contain a transparent metal oxide such as indium-tin oxide (ITO) or indium-zinc oxide (IZO). Alternatively, the second electrode 125 may include, but is not limited to, a torticultural or multilayer structure containing a reflective metal film formed from silver (Ag), aluminum (Al), gold (Au), nickel (Ni), chromium (Cr), and compounds thereof.

[0060] On the other hand, depending on whether the display device is bottom-emitting or top-emitting, one of the first and second electrodes may include a single layer or multiple layers of an opaque conductive material having relatively high reflectivity. On the other hand, the other one of the first and second electrodes may, but is not limited to, include a transparent conductive material or a translucent conductive material.

[0061] For example, opaque conductive materials may include materials with relatively low work functions, such as aluminum (Al), silver (Ag), copper (Cu), lead (Pb), molybdenum (Mo), titanium (Ti), and alloys thereof. Transparent conductive materials may include, but are not limited to, indium tin oxide (ITO) or indium zinc oxide (IZO).

[0062] Sealing layers 127, 129, and 130 may be arranged on the light-emitting element (EL). The sealing layers 127, 129, and 130 can protect the light-emitting element (EL) and the transistor (TR) from external oxygen or moisture. The sealing layers 127, 129, and 130 may extend to the non-display area (NAA, see Figure 1) that surrounds the display area (AA, see Figure 1) while covering the display area (AA). The sealing layers 127, 129, and 130 may include a multilayer structure in which a first sealing layer 127, a second sealing layer 129, and a third sealing layer 130 are stacked.

[0063] The first sealing layer 127 may be arranged to cover the second electrode 125 of the light-emitting element (EL). The first sealing layer 127 may contain an insulating material. For example, the first sealing layer 127 may contain at least one inorganic insulating material selected from silicon nitride (SiNx), silicon oxide (SiOx), or silicon oxynitride (SiON).

[0064] The second sealing layer 129 may have sufficient thickness to cover the first sealing layer 127 and have a flat surface. The second sealing layer 129 can prevent foreign matter from penetrating the light-emitting element (EL) or transistor (TR). The second sealing layer 129 may contain an insulating material. The second sealing layer 129 may contain at least one material selected from, for example, epoxy, polyimide, polyethylene, or acrylate.

[0065] A third sealing layer 130 may be placed on the second sealing layer 129. The third sealing layer 130 may contain an inorganic insulating material while covering the second sealing layer 129. The third sealing layer 130 may contain, for example, at least one of the following materials: silicon nitride (SiNx), silicon oxide (SiOx), or silicon oxynitride (SiON).

[0066] On the other hand, the sealing layer is not limited to three layers, but may include, for example, n layers (where n is an integer greater than 3) alternately stacked between an inorganic sealing layer and an organic sealing layer.

[0067] The base substrate 101 may include a dam structure 126 positioned between the display area and the pad area where the pad electrodes 145 are located. The dam structure 126 is intended to prevent the second sealing layer 129 from flowing into the pad area and overflowing. The dam structure 126 may include, for example, a structure in which a first dam formed on the same plane as the flattening layer 115 and a second dam formed on the same plane as the bank 121 are stacked on top of each other. For example, the first dam may be formed from the same material as the flattening layer 115, but is not limited to that. For example, the second dam may be formed from the same material as the bank 121, but is not limited to that.

[0068] The first sealing layer 127 extends to the portion of the display panel (PNL) that is part of the dam structure 126, and can cover the sides of the flattening layer 115 and the dam structure 126.

[0069] A touch sensor (TS) may be placed on the third sealing layer 130. The touch sensor (TS) may include a touch buffer film 130, a touch sensor placed on the touch buffer film 130 and including a plurality of touch electrodes 135, 137 and a plurality of bridge electrodes 139, an inter-touch insulating layer 136, and a touch protective film 143.

[0070] The intertouch insulating layer 136 can be placed between multiple touch electrodes 135, 137 and multiple bridge electrodes 139 to insulate them from each other. The intertouch insulating layer 136 may include contact holes that expose a portion of the surface of the bridge electrode 139. Multiple touch electrodes 135, 137 can be electrically connected to adjacent touch electrodes via the contact holes.

[0071] The multiple touch electrodes 135, 137 may include a plurality of first touch electrodes 135 and a plurality of second touch electrodes 137. The plurality of first touch electrodes 135 and the plurality of second touch electrodes 137 and the plurality of bridge electrodes 139 may be located in different layers from each other. The plurality of first touch electrodes 135 may be spaced apart from each other in a first direction of the base substrate 101, for example, and the plurality of second touch electrodes 137 may be spaced apart from each other in a second direction of the base substrate 101 that intersects the first direction. The second touch electrodes 137 may be located between a plurality of first touch electrodes 135 that are adjacent to each other. The plurality of first touch electrodes 135 that are adjacent to each other can be electrically connected via bridge electrodes 139 located in other layers.

[0072] Multiple touch electrodes 135, 137 can be electrically connected to a pad electrode 145 via multiple touch link wirings 140, each located on the outer casing of the display area (AA). The touch link wirings 140 may, but are not limited to, be located on the same layer as the multiple touch electrodes 135, 137. The touch link wirings 140 may extend along the exposed surface of the inter-touch insulating layer 136 and be connected to the pad electrode 145.

[0073] The touch protective film 143 may be arranged to cover a plurality of touch electrodes 135, 137. The touch protective film 143 may contain an organic insulating material.

[0074] A polarizing layer 153 may be placed on the touch protective film 143. The polarizing layer 153 can suppress external light reflection and change the polarization state of the light emitted from the light-emitting element (EL). The polarizing layer 153 may be bonded to the display panel (PNL) via a first adhesive member 150. The first adhesive member 150 may include, for example, a pressure-sensitive adhesive (PSA).

[0075] A cover substrate 160 may be placed on the polarizing layer 153. The cover substrate 160 covers the display panel (PNL) including the base substrate 101 and can protect the transistors (TR), light-emitting elements (EL), and circuit elements on the base substrate 101. The cover substrate 160 may also be referred to as a cover window, window cover, or cover glass.

[0076] The cover substrate 160 may include a glass substrate. An optical adhesive member 155 may further be included between the polarizing layer 153 and the cover substrate 160. The optical adhesive member 155 may, but is not limited to, an optically clearly adhesive film (OCA).

[0077] The front face of the cover substrate 160 may be a light-emitting surface through which light emitted from the light-emitting element (EL) is emitted to the outside. The user can view the video or image displayed from the display panel (PNL) through the front face of the cover substrate 160. Multiple functional layers, such as an anti-fingerprint coating layer, an anti-reflective layer, and a non-glare layer, may be arranged in a multi-layer structure on the front face of the cover substrate 160, but are not limited to this.

[0078] The rear face of the cover substrate 160, opposite the front face, may be the light incident surface to which light emitted from the light-emitting element (EL) enters. A light-shielding pattern 157 may be arranged on the rear face of the cover substrate 160. The light-shielding pattern 157 functions to prevent the user from seeing the circuit pattern placed on the non-display area (NAA). For example, the circuit pattern placed on the non-display area (NAA) may include, but is not limited to, metal wiring, pad electrodes, integrated circuit chips, flexible circuit boards, or printed circuit boards.

[0079] For this purpose, the light-shielding pattern 157 may be located on the non-display area (NAA) and have a closed loop shape surrounding the four edge portions on the back of the cover substrate 160. The light-shielding pattern 157 may include, for example, an upper edge region, a lower edge region, a left edge region, and a right edge region. The light-shielding pattern 157 may include a film mixed with an opaque pigment. The opaque pigment may include, for example, carbon black or titanium black.

[0080] Referring further to Figure 2, a protective coating layer 170 may be placed on the second surface of the base substrate 101. During the process of performing a vapor deposition process or other process to form a transistor (TR, see Figure 3) on the first surface of the base substrate 101, minute damage may occur on the second surface. The portion of the second surface of the base substrate 101 where minute damage remains may have lower rigidity than the portion where no damage has occurred. As a result, defects such as the base substrate 101 breaking even with a small impact may occur. In this case, the damaged portion of the second surface of the base substrate 101 can be removed by an etching process, and a protective coating layer 170 can be placed on the removed surface of the second surface. The protective coating layer 170 can improve the rigidity of the base substrate 101. The protective coating layer 170 can be formed by coating with an opaque insulating material. The protective coating layer 170 may, for example, contain black resin, but is not limited to this.

[0081] A backplate portion 180 may be placed on the second surface of the base substrate 101 on which the protective coating layer 170 is placed. The backplate portion 180 reinforces the rigidity of the base substrate 101 and can provide heat dissipation and absorb external shocks. For this purpose, the backplate portion 180 may, but is not limited to, include a multilayer structure of a second adhesive member 173, an impact absorption layer 175, a third adhesive member 177, and a heat dissipation layer 179.

[0082] The second adhesive member 173 can adhere the shock-absorbing layer 175 to the protective coating layer 170. The second adhesive member 173 may contain a pressure-sensitive adhesive (PSA). The shock-absorbing layer 175 is made of a foam material and can mitigate external impacts. The shock-absorbing layer 175 may, but is not limited to, contain polyurethane (PU). The shock-absorbing layer 175 can prevent the display panel (PNL) from being damaged by external impacts.

[0083] The heat dissipation layer 179 may be attached to the shock absorption layer 175 via the third adhesive member 177. The second adhesive member 173 may contain a pressure-sensitive adhesive (PSA). The heat dissipation layer 179 can release heat generated inside the display panel (PNL) to the outside when the light-emitting element (EL) is driven. The heat dissipation layer 179 may contain a highly thermally conductive metallic material and can also function as a grounding member for circuit elements placed on the display panel (PNL). Furthermore, the heat dissipation layer 179 may contain a relatively rigid metallic material and can reinforce the rigidity of the display panel (PNL). The heat dissipation layer 179 may, for example, contain aluminum (Al), but is not limited thereto.

[0084] Figure 4 is a cross-sectional view of the display device shown in Figure 1 along line 4-4. Figure 5 is a cross-sectional view of the display device shown in Figure 1 along line 5-5. And Figure 6 is a cross-sectional view of the display device shown in Figure 1 along line 6-6. In Figures 4 to 6, the display panel (PNL) and plate portion 180 are shown schematically for ease of explanation.

[0085] Referring to Figure 1 in conjunction with Figures 4 to 6, the display device 1000 may include a display area (AA) and a non-display area (NAA) surrounding the outer edge of the display area (AA). The non-display area (NAA) may be a first area (dt-a1, ds-a1, db-a1) between the outermost end portion 160E of the cover substrate 160 and the boundary of the display area (AA). The first area (dt-a1, ds-a1, db-a1) of the non-display area (NAA) may be a first area on the upper edge of the display panel (PNL) (dt-a1, see Figure 4), a first area on the left and right edges (ds-a1, see Figure 5), and a first area on the lower edge of the display panel (PNL) (db-a1, see Figure 6).

[0086] The non-display area (NAA) may overlap with the view area (V / A). The view area (V / A) may be the area visible to the user. The active area (AA) may be the area on which video or images are displayed. To form the view area (V / A), a light-shielding pattern 157 can be arranged surrounding four parts of the outer frame of the cover substrate 160. The view area (V / A) may be located between the inner end portion 157E of the light-shielding pattern 157, which is positioned close to the boundary of the display area (AA), and the boundary of the display area (AA). The view area (V / A) may be, for example, a first separation distance (dt-a2, ds-a2, db-a2) between the inner end portion 157E of the light-shielding pattern 157 and the boundary of the display area (AA). The first separation distances (dt-a2, ds-a2, db-a2) of the field of view (V / A) may be the first separation distance of the upper edge of the display panel (PNL) (dt-a2, see Figure 4), the first separation distances of the left and right edges (ds-a2, see Figure 5), and the first separation distance of the lower edge of the display panel (PNL) (db-a2, see Figure 6). For example, the length of the first region (dt-a1) at the upper edge of the display panel (PNL) in the second direction of the base substrate 101 is the same as the sum of the first separation distance (dt-a2) at the upper edge of the display panel (PNL) and the length of the light-shielding pattern 157 (see Figure 4). For example, the length of the first region (ds-a1) at the left and right edges of the display panel (PNL) in a first direction of the base substrate 101 is the same as the sum of the first separation distance (ds-a2) at the left and right edges of the display panel (PNL) and the length of the light-shielding pattern 157 (see Figure 5). For example, the length of the first region (db-a1) at the lower edge of the display panel (PNL) in a second direction of the base substrate 101 is the same as the sum of the first separation distance (db-a2) at the lower edge of the display panel (PNL) and the length of the light-shielding pattern 157 (see Figure 6). However, this specification is not limited thereto.

[0087] In one embodiment of this specification, the display device may have a cover substrate 160 located in the uppermost layer of the display device 1000. The cover substrate 160, by including glass, requires functional layers for surface treatment of the cover substrate 160. For example, multiple functional layers such as an anti-fingerprint coating layer, an anti-reflective layer, and a non-glare layer may be arranged in a multi-layer structure on the front surface of the cover substrate 160. However, each of these functional layers must be formed in a multi-layer structure, requiring separate manufacturing processes, which increases manufacturing costs. Furthermore, foreign matter may be generated during the process of forming the multi-layer structure, potentially resulting in defects. As a result, the quality of the display device's image or video may deteriorate.

[0088] This requires a structure that can reduce manufacturing costs while simultaneously lowering the quality of the image or video displayed on the display device.

[0089] Figure 7 is a cross-sectional view showing one side of another embodiment of the display device shown in Figure 1. Figure 8 is an enlarged cross-sectional view showing region 8 in Figure 7. In Figures 7 and 8, the same components as in Figures 2 and 3 may include the same reference numerals. Therefore, redundant explanations will be omitted or briefly explained, and differences will be explained.

[0090] Referring to Figures 7 and 8, in other embodiments of this specification, a display device may have a rigidity reinforcing layer 200 disposed on top of the display panel (PNL). A polarizing layer 153 may be disposed on top of the rigidity reinforcing layer 200. The display panel (PNL) may include a light-emitting element (EL) disposed on a base substrate 101 equipped with a transistor (TR) and a touch sensor (TS). The light-emitting element (EL) can be sealed with a sealing layer including a first sealing layer 127, a second sealing layer 129, and a third sealing layer 130. The touch sensor (TS) may be disposed on the sealing layers 127, 129, and 130. A plate portion 180 may be disposed at the bottom of the display panel (PNL).

[0091] The rigid reinforcement layer 200, with the polarizing layer 153 positioned on top, allows light passing through the rigid reinforcement layer 200 to change its polarization characteristics while passing through the polarizing layer 153. Furthermore, the polarizing layer 153 prevents external incident light sources from being reflected by metal wiring or other components on the display panel (PNL), which can reduce visibility in the display area (AA). The polarizing layer 153 may, for example, be a quarter-wavelength phase difference film, but is not limited to this.

[0092] When an external light source is incident on a display device in which a polarizing layer 153 is arranged on a rigid reinforcing layer 200 according to an embodiment of this specification, only light that coincides with the axial direction of the polarizing layer 153, for example, the first axial direction, can pass through the polarizing layer 153. The first axial direction may be the x-axis direction. When light aligned in the first axial direction of the polarizing layer 153 passes through the polarizing layer 153, its phase is changed by 45 degrees and it can then be incident on the rigid reinforcing layer 200.

[0093] Light that has passed through the rigid reinforcement layer 200 may be reflected by metal wiring or other elements arranged on the display panel (PNL), pass through the rigid reinforcement layer 200 again, and be emitted in the direction of the polarizing layer 153. The rigid reinforcement layer 200 may include an optical layer that does not generate a phase difference when light is transmitted through it.

[0094] Light that passes through the rigid reinforcement layer 200 without a change in phase and then enters the polarizing layer 153 may have a second axis direction different from the first axis direction, with a change in phase in the polarizing layer 153. The second axis direction may be, for example, the y-axis direction. As a result, the light in the second axis direction is different from the axis direction of the polarizing layer 153, and therefore is not emitted to the outside, preventing it from being visible to the user in the display area (AA). This prevents a decrease in visibility in the display area (AA). In other examples, the first axis direction may be the y-axis direction, and the second axis direction may be the x-axis direction.

[0095] Here, if the rigid reinforcement layer 200 includes an optical layer that changes the phase, the phase of the light passing through the rigid reinforcement layer 200 is changed, and the phase of the light may be further changed by the polarizing layer 153. In this case, the light aligned axially with the polarizing layer 153 is emitted to the outside, which may reduce visibility in the display area (AA).

[0096] As a result, the rigid reinforcement layer 200 may include an optical layer that does not generate a phase difference when light is transmitted through it. The rigid reinforcement layer 200 may include an optical layer that does not generate a phase difference when light emitted from the light-emitting element (EL) of the display panel (PNL), light incident from the outside, or internally reflected light of the display panel (PNL) is transmitted through it.

[0097] When a polarizing layer 153 is placed beneath the rigid reinforcing layer 200, further surface treatment processes are required on the surface of the rigid reinforcing layer 200 to improve wear resistance. For example, a hard coat layer can be formed on the surface of the rigid reinforcing layer 200. Further surface treatment processes may increase manufacturing costs.

[0098] In contrast, when the polarizing layer 153 is placed on top of the rigid reinforcing layer 200 according to the embodiment of this specification, further surface treatment steps for the rigid reinforcing layer 200 can be omitted. This reduces the manufacturing cost of the rigid reinforcing layer 200.

[0099] The rigid reinforcement layer 200 may include tempered glass, polycarbonate (PC), or polymethyl methacrylate (PMMA). The rigid reinforcement layer 200 may have a thickness in the range of 0.2 mm to 0.5 mm to ensure the rigidity of the display device. For example, the rigid reinforcement layer 200 may have a thickness of 0.25 mm to 0.45 mm, but is not limited to this.

[0100] The rigid reinforcement layer 200 can be bonded to the display panel (PNL) via an optical adhesive member 155. The optical adhesive member 155 may include an optically clearly adhesive film (OCA) or an optically clearly adhesive resin (OCR). When an optically clearly adhesive resin (OCR) is used as the optical adhesive member 155, the manufacturing cost of the display device can be reduced.

[0101] One side of the optical adhesive member 155 may be in contact with the upper surface of the touch protective film 143 of the touch sensor part (TS), and the other side may be in contact with the back surface of the rigid reinforcement layer 200. Since the rigid reinforcement layer 200 can be attached to the entire area of ​​the display panel (PNL) via the optical adhesive member 155, the rigidity of the display device can be increased.

[0102] The rigidity reinforcing layer 200 may include a first surface which is the light incident surface to which light emitted from the light-emitting element (EL) is incident, and a second surface which is the light emission surface to which the incident light is emitted to the outside, facing the first surface. The first surface of the rigidity reinforcing layer 200 may be, for example, in a position facing the light-emitting element (EL), and the second surface may be in a position facing the polarizing layer 153.

[0103] A light-shielding pattern 157 may be placed on the edge of the first surface of the rigid reinforcement layer 200. The light-shielding pattern 157 can prevent the circuit pattern placed on the non-display area (NAA) from being visible to the user. For example, the circuit pattern placed on the non-display area (NAA) may include, but is not limited to, metal wiring, pad electrodes, integrated circuit chips, flexible circuit boards, or printed circuit boards.

[0104] For this purpose, the light-shielding pattern 157 may be located on the non-display area (NAA) of the rigid reinforcement layer 200. The light-shielding pattern 157 may have a closed loop shape surrounding the four sides of the first surface of the rigid reinforcement layer 200. The light-shielding pattern 157 may be arranged, for example, including the upper edge region, lower edge region, left edge region, and right edge region of the rigid reinforcement layer 200. The light-shielding pattern 157 may include a film mixed with an opaque pigment. The opaque pigment may include, for example, carbon black or titanium black.

[0105] A polarizing layer 153 may be placed on the second surface of the rigid reinforcing layer 200. The polarizing layer 153 may be bonded to the second surface of the rigid reinforcing layer 200 via a first adhesive member 150. The first adhesive member 150 may, but is not limited to, a pressure-sensitive adhesive (PSA).

[0106] According to embodiments of this specification, the rigidity reinforcing layer 200 may be located below the polarizing layer 153. The polarizing layer 153 may be located as the uppermost layer of the display device. This allows the rigidity reinforcing layer 200 to omit multilayer structures such as functional layers for surface treatment, such as an anti-fingerprint coating layer, an anti-reflective layer, and a non-glare layer. As a result, the manufacturing process for the display device is simplified, and manufacturing costs can be reduced. In addition, multiple steps required to form a multilayer structure can be omitted, and the generation of foreign matter during each of these steps can be prevented. As a result, the quality of the image or video of the display device can be maintained.

[0107] The rigid reinforcement layer 200 is positioned relatively closer to the display panel (PNL), the polarizing layer 153 protrudes beyond the outermost part 200E of the rigid reinforcement layer 200, and a three-sided borderless design can be realized. This provides the user with the effect of a relatively larger display area (AA) compared to a display device with a bezel. As a result, the user's sense of immersion in the image or video can be further enhanced.

[0108] Furthermore, by positioning the rigid reinforcement layer 200 relatively closer to the display panel (PNL), the distance between the viewing area and the display area can be reduced. The following explanation will be given with reference to the drawings.

[0109] Figure 9 is a cross-sectional view along line 9-9 showing another embodiment of the display device shown in Figure 1. Figure 10 is a cross-sectional view along line 10-10 showing another embodiment of the display device shown in Figure 1. And Figure 11 is a cross-sectional view along line 11-11 showing another embodiment of the display device shown in Figure 1. In Figures 9 to 11, the display panel (PNL) and plate portion 180 are schematically shown for ease of explanation.

[0110] Referring to Figure 1 in conjunction with Figures 9 to 11, the display device 1000 may include a display area (AA) and a non-display area (NAA) surrounding the outer edge of the display area (AA). The non-display area (NAA) may be a second area (dt-b1, ds-b1, db-b1) between the outermost end portion 200E of the rigid reinforcement layer 200 and the boundary of the display area (AA). The second area (dt-b1, ds-b1, db-b1) of the non-display area (NAA) may be the second area of ​​the upper edge of the display panel (PNL) (dt-b1, see Figure 9), the second areas of the left and right edges (ds-b1, see Figure 10), and the second area of ​​the lower edge of the display panel (PNL) (db-b1, see Figure 11).

[0111] The non-display area (NAA) may overlap with the view area (V / A). The view area (V / A) may be the area visible to the user. The active area (AA) may be the area on which a video or image is displayed. To form the view area (V / A), a light-shielding pattern 157 can be arranged surrounding four parts of the outer frame of the rigid reinforcement layer 200. The view area (V / A) may be located between the inner end portion 157E of the light-shielding pattern 157, which is positioned close to the boundary of the display area (AA), and the boundary of the display area (AA). The view area (V / A) may be, for example, the second separation distance (dt-b2, ds-b2, db-b2) between the inner end portion 157E of the light-shielding pattern 157 and the boundary of the display area (AA). The second separation distances (dt-b2, ds-b2, db-b2) of the field of view (V / A) may be the second separation distance of the upper edge of the display panel (PNL) (dt-b2, see Figure 9), the second separation distances of the left and right edges (ds-b2, see Figure 10), and the second separation distance of the lower edge of the display panel (PNL) (db-b2, see Figure 11). For example, the length of the second region (dt-b1) at the upper edge of the display panel (PNL) in the second direction of the base substrate 101 is the same as the sum of the second separation distance (dt-b2) at the upper edge of the display panel (PNL) and the length of the light-shielding pattern 157 (see Figure 9). For example, the length of the second region (ds-b1) at the left and right edges of the display panel (PNL) in the first direction of the base substrate 101 is the same as the length of the second separation distance (ds-b2) at the left and right edges of the display panel (PNL) and the length of the light-shielding pattern 157 (see Figure 10). For example, the length of the second region (db-b1) at the lower edge of the display panel (PNL) in the second direction of the base substrate 101 is greater than the sum of the second separation distance (db-b2) at the lower edge of the display panel (PNL) and the length of the light-shielding pattern 157 (see Figure 11). However, this specification is not limited thereto.

[0112] By positioning the rigidity reinforcement layer 200 closer to the display panel (PNL), the second separation distance (dt-b2, ds-b2, db-b2) between the viewing area and the display area can be further reduced than the first separation distance (dt-a2, ds-a2, db-a2) between the viewing area and the display area when the cover substrate 160 is positioned at the top.

[0113] Figure 12 shows the viewing angle distances of embodiments of this specification. Figure 12(a) shows the viewing angle distance of a display device according to one embodiment of this specification. Figure 12(b) shows the viewing angle distance of a display device according to another embodiment of this specification.

[0114] Referring to Figure 12, the viewing angle (θ) may be a viewing range in which no difference in brightness or color reproduction occurs when the display device is viewed at an angle of 45 degrees from the front of the display device.

[0115] Referring to Figure 12(a), the viewing angle distance (VDref) of a display device according to one embodiment of this specification may be the sum of a first gap (G1) through which the viewing angle (θ) reaches from the inner end portion 157E of the light-shielding pattern 157 and a second gap (G2) between the inner end portion 157E of the light-shielding pattern 157 and the surface of the display panel (PNL). Also, referring to Figure 12(b), the viewing angle distance (VDex) of a display device according to another embodiment of this specification may be the sum of a third gap (G3) through which the viewing angle (θ) reaches from the inner end portion 157E of the light-shielding pattern 157 and a fourth gap (G4) between the inner end portion 157E of the light-shielding pattern 157 and the surface of the display panel (PNL).

[0116] In other embodiments of this specification, a rigidity reinforcing layer 200 may be placed below the polarizing layer 153. As the distance between the light-shielding pattern 157 on the rigidity reinforcing layer 200 and the display panel (PNL) decreases, the distance of the fourth gap (G4) between the light-shielding pattern 157 and the display panel (PNL) may decrease compared to the second gap (G2). As a result, the second separation distance (dt-b2) of the viewing area (V / A) when the rigidity reinforcing layer 200 is placed may be shorter than the first separation distance (dt-a2) when the cover substrate 160 is placed as the uppermost layer of the display device.

[0117] The rigid reinforcement layer 200 according to the embodiments of this specification can also be applied to a display panel (PNL) in which a touch sensor (TS) is not located.

[0118] Figure 13 is a cross-sectional view showing one side of another embodiment of the display device of Figure 1. Figure 14 is an enlarged cross-sectional view showing region 14 of Figure 13. In Figures 13 and 14, the same components as in Figures 8 and 9 include the same reference numerals, so redundant explanations will be omitted or briefly explained, and differences will be explained.

[0119] Referring to Figures 13 and 14, in other embodiments of this specification, the display device may have a rigidity reinforcing layer 200 disposed on top of the display panel (PNL). The display panel (PNL) may include a light-emitting element (EL) disposed on a base substrate 101 having a transistor (TR). The light-emitting element (EL) may include an organic light-emitting element (ED) having a first electrode 120, an organic light-emitting layer 123 and a second electrode 125, and a bank 121 having a bank hole 122. The light-emitting element (EL) can be sealed with sealing layers 127, 129, 130. The sealing layers 127, 129, 130 may include a first sealing layer 127, a second sealing layer 129 and a third sealing layer 130. A plate portion 180 may be disposed below the base substrate 101 of the display panel (PNL) to reinforce the rigidity of the display device and mitigate external impacts. Furthermore, the plate portion 180 can release heat generated inside the display panel (PNL) to the outside.

[0120] The base substrate 101 may include a dam structure 126 positioned between a display area and a pad area where pad electrodes 145 are placed. The dam structure 126 may include, for example, a structure in which a first dam made of the same layer as the flattening layer 115 and a second dam made of the same layer as the bank 121 are stacked on top of each other. The dam structure 126 may be covered with a first sealing layer 127 and a third sealing layer 130.

[0121] A rigidity reinforcing layer 200 may be disposed on the third sealing layer 130. The rigidity reinforcing layer 200 may be attached to the third sealing layer 130 of the display panel (PNL) via an optical adhesive member 155. The optical adhesive member 155 may include an optically transparent adhesive film (OCA) or an optically transparent adhesive resin (OCR). The optical adhesive member 155 can be positioned so that the rigidity reinforcing layer 200 is in contact with the entire area of ​​the display panel (PNL). By positioning the rigidity reinforcing layer 200 in close contact with the entire area of ​​the display panel (PNL), the rigidity of the display device can be increased.

[0122] A light-shielding pattern 157 may be placed on the edge portion of the first surface of the rigid reinforcement layer 200. The light-shielding pattern 157 may have a closed loop shape that surrounds the four edge portions of the outer frame portion of the rigid reinforcement layer 200.

[0123] A polarizing layer 153 may be placed on the second surface of the rigid reinforcing layer 200 facing the first surface on which the light-shielding pattern 157 is arranged. The polarizing layer 153 may be bonded to the second surface of the rigid reinforcing layer 200 via a first adhesive member 150. The first adhesive member 150 may, for example, contain a pressure-sensitive adhesive (PSA).

[0124] Instead of the rigidity reinforcing layer 200 being placed on the top layer of the display device, it is attached to the display panel (PNL), and the polarizing layer 153 is placed on the top layer of the display device, thereby eliminating the need for a functional layer for surface treatment. The functional layer may, but is not limited to, a multi-layer structure such as an anti-fingerprint coating layer, an anti-reflective layer, or a non-glare layer.

[0125] By omitting the functional layer for surface treatment, the manufacturing cost of the display device can be reduced, and the occurrence of defects can be decreased or eliminated. Thus, the quality of the image or video of the display device can be maintained. In addition, by positioning the rigid reinforcement layer 200 closer to the display panel (PNL) and reducing the distance between the viewing area and the display area, the user's sense of immersion in the image or video can be further improved.

[0126] The display device according to the embodiments of this specification may include a display panel including a display area and a non-display area surrounding the display area; a light-emitting element section including a plurality of light-emitting elements disposed on the display area of ​​the display panel; a rigidity reinforcing layer disposed on the upper part of the display panel; and a polarizing layer on the rigidity reinforcing layer. The polarizing layer may be disposed to protrude further from the outermost part of the rigidity reinforcing layer with respect to the display panel. The polarizing layer may be bonded to the upper surface of the rigidity reinforcing layer via an adhesive member.

[0127] In some embodiments of the Specified Display Device, the substrate may be positioned above the light-emitting portion and further include a touch sensor portion comprising a plurality of touch electrodes.

[0128] In some embodiments of this specification, the display device may further include an optical adhesive member that is in contact with the back surface of the rigid reinforcement layer and is positioned over the entire area of ​​the display panel.

[0129] In some embodiments of the Specified Display Device, the optical adhesive member may include an optically transparent adhesive resin.

[0130] In some embodiments of the Specified Spectrum, the rigid reinforcing layer may include a material that does not produce a phase difference when light is transmitted through it, and may include tempered glass, polycarbonate, or polymethyl methacrylate.

[0131] In some embodiments of the display device described herein, the rigid reinforcing layer may have a thickness in the range of 0.2 mm to 0.5 mm.

[0132] In some embodiments of the Specified, the rigidity reinforcing layer includes a first surface facing the light-emitting portion and a second surface facing the polarizing layer opposite the first surface, and may further include a light-shielding pattern disposed on the edge portion of the first surface of the rigidity reinforcing layer.

[0133] In some embodiments of the Specified Display Device, the light-shielding pattern may include a film mixed with an opaque pigment.

[0134] In some embodiments of the display devices described herein, the opaque pigment may include carbon black or titanium black.

[0135] In some embodiments of the Specified, the light-shielding pattern may be located on the non-display area and may include a closed loop shape surrounding the four sides of the rigid reinforcement layer.

[0136] In some embodiments of the Specified Display Device, the light-shielding pattern may be arranged to surround the upper edge, left edge, right edge, and lower edge of the display panel.

[0137] In some embodiments of this specification, the display device further includes a viewing area located outside the display area and overlapping with a non-display area, the viewing area including a separation distance between the boundary of the display area and the inner end of the light-shielding pattern.

[0138] In some embodiments of the Specified Display Device, the separation distance may decrease as the light-shielding pattern, which is positioned on the rigid reinforcement layer, gets closer to the display panel.

[0139] In some embodiments of this specification, the light-emitting element unit may include an organic light-emitting element comprising a first electrode located on the display area of ​​a display panel, an organic light-emitting layer covering the exposed first electrode, and a second electrode on the organic light-emitting layer, and a bank comprising a bank hole that covers the edge of the first electrode and exposes a portion of the first electrode.

[0140] The embodiments of this specification have been described in more detail above with reference to the attached drawings. However, this specification is not necessarily limited to these embodiments, and various modifications are possible within the scope of the technical concept of this specification. Therefore, the embodiments disclosed herein are for illustrative purposes only, not to limit the technical concept of this specification, and the scope of the technical concept of this specification is not limited by these embodiments. Accordingly, the embodiments described above should be understood to be illustrative and not limiting in all respects. [Explanation of symbols]

[0141] 101 Base board 153 Polarizing layer 157 Shading Patterns 160 Cover board 180 Backplate section 200 Rigidity Reinforcement Layer PNL Display Panel TR Transistor EL light-emitting element TS Touch Sensor Unit AA display area NAA Hidden Area

Claims

1. A display panel including a display area and a non-display area adjacent to the display area, A light-emitting section including a plurality of light-emitting elements arranged on the display area of ​​the display panel, A rigidity reinforcing layer is positioned on the upper part of the display panel, The polarizing layer on the rigidity reinforcing layer, including, Display device.

2. The polarizing layer is arranged to protrude further from the outermost part of the rigidity reinforcing layer with respect to the display panel. The display device according to claim 1.

3. The polarizing layer is bonded to the upper surface of the rigid reinforcing layer via an adhesive member. The display device according to claim 1.

4. The display panel is positioned above the light-emitting element and further includes a touch sensor section containing a plurality of touch electrodes. The display device according to claim 1.

5. The optical adhesive member, which is in contact with the back surface of the rigid reinforcement layer and is arranged over the entire area of ​​the display panel, further includes The display device according to claim 1.

6. The optical adhesive member includes an optically transparent adhesive resin. The display device according to claim 5.

7. The rigid reinforcing layer contains a material that does not generate a phase difference when light is transmitted through it. The display device according to claim 1.

8. The rigidity reinforcing layer comprises tempered glass, polycarbonate, or polymethyl methacrylate. The display device according to claim 1.

9. The rigidity reinforcing layer has a thickness in the range of 0.2 mm to mm. The display device according to claim 1.

10. The rigidity reinforcing layer has a first surface facing the light-emitting portion, On the opposite side of the first surface, there is a second surface facing the polarizing layer, Includes, The rigid reinforcement layer further includes a light-shielding pattern arranged on the edge portion of the first surface, The display device according to claim 1.

11. The aforementioned light-shielding pattern includes a film mixed with opaque pigments. The display device according to claim 10.

12. The opaque pigment includes carbon black or titanium black. The display device according to claim 11.

13. The light-shielding pattern is located on the non-display area and includes a closed loop shape that surrounds the four sides of the rigid reinforcement layer. The display device according to claim 10.

14. The aforementioned light-shielding pattern surrounds the upper edge, left edge, right edge, and lower edge of the display panel. The display device according to claim 13.

15. The field of view further includes a field of view located outside the display area and overlapping with the non-display area, The field of view area includes the separation distance between the boundary of the display area and the inner end of the light-shielding pattern. The display device according to claim 10.

16. The separation distance decreases as the light-shielding pattern, which is arranged on the rigid reinforcement layer, gets closer to the display panel. The display device according to claim 15.

17. The light-emitting unit is An organic light-emitting element comprising a first electrode located on the display area of ​​the display panel, an organic light-emitting layer covering the exposed portion of the first electrode, and a second electrode on the organic light-emitting layer, A bank including a bank hole that covers the exposed edge of the first electrode and exposes the exposed portion of the first electrode, including, The display device according to claim 1.

Images