LED transparent display screen

Abstract

This invention provides an LED transparent display screen that facilitates removal and maintenance of the transparent display screen, and avoids the impact on display effectiveness caused by directly applying adhesive to the chip. [Solution] The LED transparent display screen comprises a PCB substrate, a plurality of connecting pieces, and a plurality of LED chips arranged in an array on the PCB substrate, wherein the PCB substrate is provided with a plurality of first vias, the plurality of LED chips are distributed around the plurality of first vias, the plurality of connecting pieces are all distributed on the side of the PCB substrate opposite to the plurality of LED chips, each of the connecting pieces is provided with a plurality of connecting pillars on the side facing the PCB substrate, the plurality of connecting pillars penetrate the plurality of first vias, and adhesive is provided on their end faces. In the LED transparent display screen according to an embodiment of the present invention, the transparent display screen can be fixed and connected to transparent glass through the adhesive at the ends of the connecting pillars.

Description

Technical Field

[0001] This application claims the priority of a Chinese patent application with the application number 202422263408.X, and the entire content thereof is incorporated herein by reference.

[0002] The present invention relates to the technical field of electronic display devices, and particularly to LED transparent display screens.

Background Art

[0003] LED transparent display screens are currently widely used and may be fixed to transparent glass to enhance the strength and texture of the display screen. Currently, a common method of fixing the display screen to transparent glass is to apply an adhesive to the surface of the chip and adhere the lamp surface to the transparent glass through the adhesive. However, this structure is difficult to remove and maintain, and directly applying the adhesive to the chip also affects the display effect.

Summary of the Invention

Problems to be Solved by the Invention

[0004] In view of the above problems, embodiments of the present invention are proposed to provide an LED transparent display screen that solves the above problems or at least a part thereof.

Means for Solving the Problems

[0005] Embodiments of the present invention include a PCB substrate, a plurality of connection pieces, and a plurality of LED chips. The plurality of LED chips are arranged in an array on the PCB substrate. A plurality of first vias are provided on the PCB substrate, and the plurality of LED chips are distributed around the plurality of first vias. The plurality of connection pieces are all distributed on the surface of the PCB substrate opposite to the plurality of LED chips. A plurality of connection columns are provided on the surface of each connection piece facing the PCB substrate. The plurality of connection columns penetrate through the plurality of first vias, and an adhesive is provided on their end faces, providing an LED transparent display screen.

[0006] Furthermore, the connecting piece is provided with second vias corresponding to the plurality of first vias.

[0007] Furthermore, the height of the connecting column, which is higher than the PCB substrate, is greater than or equal to the height of the LED chip, which is also higher than the PCB substrate.

[0008] Furthermore, the connecting column and the connecting piece are an integrated structure.

[0009] Furthermore, the LED transparent display screen further includes a reinforcing plate provided between the PCB substrate and the connecting piece, through which the ends of the plurality of connecting columns pass.

[0010] Furthermore, the reinforcing plate is provided with third vias corresponding to the plurality of first vias, and the ends of the plurality of connecting columns sequentially pass through the third vias and the first vias.

[0011] Furthermore, the reinforcing plate is a carbon fiber board.

[0012] Furthermore, the multiple connecting columns in one of the connecting pieces are each located on both sides of the joint between the two PCB substrates.

[0013] Furthermore, the four connecting pieces are provided at the four corners of the PCB substrate on the side opposite to the plurality of LED chips.

[0014] Furthermore, the multiple connecting pieces are provided at equal intervals on the side of the PCB substrate opposite to the multiple LED chips.

[0015] Furthermore, the radius of the second via is greater than or equal to the radius of the first via.

[0016] Furthermore, the diameter of the connecting column is less than the diameter of the first via.

[0017] Furthermore, the difference between the radius of the first via and the radius of the connecting column is 0.2 mm or more and 0.3 mm or less.

[0018] Furthermore, a guide surface is provided circumferentially at the end of the connecting column opposite to the PCB substrate.

[0019] Furthermore, the connecting piece is provided with at least one of the connecting columns. There is at least one of the first vias between two adjacent connecting columns.

[0020] Furthermore, in the connecting piece, at least the portion that is flush with the connecting column is made of a transparent material.

[0021] Furthermore, the peripheral surface of the connecting column is a matte finish.

[0022] Furthermore, the combined support strength of the multiple connecting pieces is more than eight times the weight of the LED transparent display screen. [Effects of the Invention]

[0023] In the technical solution according to an embodiment of the present invention, the LED transparent display screen includes a PCB substrate, a plurality of connecting pieces, and a plurality of LED chips, wherein the PCB substrate is provided with a plurality of first vias, and the plurality of LED chips are arranged in an array on the PCB substrate and distributed around the plurality of first vias, thereby forming a transparent display screen. The plurality of connecting pieces are all distributed on the side of the PCB substrate opposite to the plurality of LED chips, and a plurality of connecting pillars are provided on the side of each connecting piece facing the PCB substrate, the plurality of connecting pillars penetrate the plurality of first vias, and adhesive is provided on their end faces. The transparent display screen can be fixed and connected to transparent glass through the adhesive at the ends of the connecting pillars, thereby facilitating removal and maintenance of the transparent display screen, and also avoiding the effect of directly applying adhesive to the chips on the display screen.

[0024] To more clearly explain the technical solutions in the embodiments of the present invention or the prior art, the drawings necessary for the description of the embodiments or the prior art will be briefly described below. The drawings in the following description are some embodiments of the present invention, and it is obvious to those skilled in the art that other drawings can be obtained based on these drawings without creative effort.

Brief Description of the Drawings

[0025] [Figure 1] It is a schematic diagram of the planar connection of the LED transparent display screen according to an embodiment of the present invention. [Figure 2] It is a schematic cross-sectional view of the cross-section of the LED transparent display screen according to an embodiment of the present invention. [Figure 3] It is a schematic diagram of the further planar connection of the LED transparent display screen according to an embodiment of the present invention. [Figure 4] It is a schematic cross-sectional view of the further cross-section of the LED transparent display screen according to an embodiment of the present invention. [Figure 5] It is a schematic plan cross-sectional view when two screens of the LED transparent display screen according to an embodiment of the present invention are connected.

Modes for Carrying Out the Invention

[0026] To make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention. It is obvious that the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative labor belong to the protection scope of the embodiments of the present invention.

[0027] Furthermore, in the description of this invention, when terms such as "first," "second," etc., appear, "first," "second," etc., they are used solely to facilitate the description of different parts or names and should not be understood as indicating or implying an order, relative importance, or the number of technical features being described. Therefore, features limited by "first," "second," etc., may explicitly or implicitly include at least one feature. Also, where "and / or" appears in the text, its meaning includes three parallel forms, for example, "A and / or B," which includes form A, or form B, or a form in which both A and B are satisfied simultaneously.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art. Terms used in this specification are for illustrative purposes only and are not intended to limit the invention.

[0029] Referring to Figure 1, a schematic diagram of the planar connection of a light-emitting diode (LED) transparent display screen according to an embodiment of the present invention is shown. Hereinafter, this transparent display screen will simply be referred to as an LED transparent display screen, and the LED transparent display screen will include a printed circuit board (PCB) 10, a plurality of LED chips 20, and a plurality of connecting pieces 30.

[0030] Multiple chips 20 are coupled to a PCB substrate 10, which can transmit information to the chips 20 and supply electrical energy. When the chips 20 receive instructions transmitted from the PCB substrate 10, they emit specific light at specific times as required by the instructions, causing various screens or videos to be displayed on the LED transparent display screen.

[0031] In some embodiments of the present invention, the controller capable of executing commands is integrated into the LED chip 20, and the PCB substrate 10 plays only the role of transmitting command information and transporting electrical energy. Therefore, there is no need to connect additional electronic elements to the PCB substrate 10 for processing information or issuing commands, which results in a cleaner surface for the PCB substrate 10, a smoother appearance with no protrusions on the side where the chip 20 is located, and a flat surface on the side opposite the chip 20, ensuring that the PCB substrate 10 can be mounted.

[0032] Typically, the side of the PCB board 10 where the chip 20 is located is black, which prevents protrusion from the PCB board 10. This improves the appearance of the LED transparent display screen when not displaying anything, and also improves the viewing experience. Of course, the color of the PCB board 10 is not limited to black and may be customized according to customer needs, but it is preferable that the color of the PCB board 10 be the same color, in order to ensure appearance without negatively affecting the viewing experience.

[0033] Specifically, referring to Figures 2-5, the plurality of LED chips 20 are arranged in an array on the PCB substrate, the PCB substrate 10 is provided with a plurality of first vias 110, the plurality of LED chips 20 are distributed around the plurality of first vias 110, the plurality of connecting pieces 30 are all provided on the side of the PCB substrate 10 opposite to the plurality of LED chips 20, a plurality of connecting columns 310 are provided on the side of each connecting piece 30 facing the PCB substrate 10, the plurality of connecting columns 310 penetrate the plurality of first vias 110, and adhesive 320 is provided on their end faces.

[0034] The transparent glass abuts against the end of the connecting column 310 and is bonded to the support end via adhesive 320. Therefore, there is no need to apply adhesive to the LED chip, and the LED chip and the support object are spaced apart or in close contact without a connecting medium between them, thereby not affecting the removal or maintenance of the LED chip.

[0035] Specifically, the plurality of first vias 110 are opened in the PCB substrate 10, and the size of the plurality of first vias 110 may be determined according to the area, thickness of the PCB substrate 10 and the specific specifications of the display screen. The plurality of first vias 110 are distributed in an array on the PCB substrate 10, and the plurality of LED chips 20 are provided in the gaps between these first vias 110, thereby arranging the plurality of LED chips 20 in an array on the PCB substrate. Generally, a plurality of first vias 110 are provided around one LED chip 20, and by opening the plurality of first vias 110 in the PCB substrate 10 on which the plurality of LED chips 20 are arranged in this way, the LED display screen becomes an LED transparent display screen, that is, it is visible from one side of the display screen to the other.

[0036] The layer of the LED chip 20 is located in the center of the array of first vias 110. In this configuration, one LED chip 20 has four through-first vias 110 provided at equal intervals in the circumferential direction, and with the LED chip 20 as the center, the angle between two adjacent first vias 110 is 90°. Similarly, one first via 110 has four LED chips 20 provided at equal intervals in the circumferential direction, and with the first via 110 as the center, the angle between two adjacent LED chips 20 is also 90°. Only one LED chip 20 can be mounted in the space between the four adjacent first vias 110. This achieves optimal transparency without affecting the mounting of the LED chips 20.

[0037] On the side of the PCB substrate 10 opposite to the plurality of LED chips 20, the plurality of connecting pieces 30 are provided. That is, the connecting pieces 30 and the LED chips 20 are located on the front and rear surfaces of the PCB substrate 10, respectively, and the connecting pieces 30 are provided with the plurality of connecting columns 310 extending toward the PCB substrate 10. Here, the plurality of connecting columns 310 are generally distributed in a one-to-one correspondence with the plurality of first vias 110 of the PCB substrate 10, and the diameter of the connecting columns 310 is slightly smaller than the inner diameter of the first vias 110. As a result, the plurality of connecting columns 310 penetrate the plurality of first vias 110, and the ends of the connecting columns 310 extend to the surface of the PCB substrate 10 on which the LED chips 20 are provided, and are higher than the surface of the LED chips 20. Furthermore, the end faces of the connecting columns 310 are provided with the adhesive 320, which has high adhesive strength. When it is necessary to fix the LED transparent display screen to transparent glass, the connecting piece 30 can be bonded and fixed to the transparent glass by penetrating the adhesive 320 at the end of the connecting column 310 of the first via 110. The LED transparent display screen can be fixed and connected to the transparent glass through the adhesive 320 at the end of the connecting column 310, thereby facilitating the removal and maintenance of the transparent display screen, and avoiding the impairment of the display effect that would occur if adhesive were applied directly to the LED chip.

[0038] The distance between the connecting column 310 and the hole wall of the first via 110 is 0.2 mm to 0.3 mm, and the connecting column 310 only needs to be large enough to be inserted into the first via 110. The larger the diameter of the connecting column 310, the higher its support strength, and therefore, it is preferable that the diameter of the connecting column 310 be as large as possible, as long as it can pass through the first via 110.

[0039] In some embodiments of the present invention, as shown in Figures 2 to 5, a guide surface is provided in the circumferential direction of the support end, and the end of the connecting column 310 opposite to the connecting body is inclined toward the support end in the circumferential direction, thereby guiding the connecting column 310 so that it can easily enter the first via 110.

[0040] Furthermore, in another preferred embodiment of the present invention, the connecting piece 30 is provided with second vias 330 corresponding to the plurality of first vias 110.

[0041] The second via 330 is coaxial with the first via 110 and has a diameter greater than or equal to that of the first via 110, so as not to obstruct it. The second via 330 and the connecting column 310 all correspond to the corresponding first vias; that is, a portion of the first via 110 is coaxial with the connecting column 310, and the remaining portion of the first via 110 is coaxial with the second via 330. Such a design ensures good transparency for the LED transparent display screen.

[0042] If the connecting column 310 is not made of a transparent material, it is understood that the first via 110 into which the connecting column 310 is inserted will lose its light transmittance due to shielding by the connecting column 310, affecting the light transmittance effect of the LED transparent screen. Therefore, in some embodiments of the present application, as shown in Figures 2 to 5, the connecting piece is manufactured from a transparent material so that light can easily pass through, at least the connecting column and the portion flush with the connecting column. In other words, the connecting piece 30 may be transparent only at the connection point with the connecting column 310, with the remaining portion being opaque, or it may be manufactured from a transparent material similar to the connecting column 310. In the latter case, the connecting piece is completely transparent, but the present application does not particularly limit it as long as it does not affect light transmission. This transparent material may be polycarbonate (PC) or acrylic plastic, but acrylic plastic or PC plastic has excellent transparency.

[0043] Furthermore, in another preferred embodiment of the present invention, the height of the connecting column 310, which is higher than the PCB substrate 10, is greater than or equal to the height of the LED chip 20, which is also higher than the PCB substrate 10.

[0044] Specifically, on the side of the PCB substrate 10 opposite to the connecting piece 30, the height of the connecting column 310 is greater than or equal to the height of the chip 20. In this design, when the LED transparent display screen is fixed and connected to the transparent glass, the LED chip 20 is kept at a certain distance from the transparent glass or is in contact with the transparent glass. This protects the LED chip 20 while also being advantageous for removal and maintenance in the event of damage to the LED panel.

[0045] Furthermore, in another preferred embodiment of the present invention, as shown in Figures 2 to 5, the connecting column 310 and the connecting body are an integrated structure, that is, the connecting piece is integrated.

[0046] Here, the connecting column 310 and the connecting plate may be injection-molded as a single unit. Doing so increases the strength of the connecting piece 30 and improves the reliability of fixing and connecting the LED transparent display screen to the transparent glass using the connecting piece 30.

[0047] In this design, when the LED transparent display screen is fixed and connected to the transparent glass, the LED chips 20 are spaced apart from the transparent glass or in contact with it. This serves to protect the LED chips 20 while also facilitating removal and maintenance in case the LED panel breaks.

[0048] Since there are multiple chips on the periphery of the connecting column 310, and refraction and reflection are unavoidable when light from the chips is incident on the transparent connecting column 310, it is understandable that the transparency at the location where the connecting column 310 exists and the display effect on the periphery of the connecting column 310 will be affected.

[0049] To solve the above problems, in some embodiments of the present invention, as shown in Figures 2 to 5, the circumferential surface of the connecting column 310 is a matte surface, and when light from the LED chip 20 strikes the refraction prevention cross section, the refractive index decreases significantly, thereby not affecting the display effect or transparency of the LED transparent display screen. When light is shone on the circumferential matte surface of the connecting column 310, it is reflected to the maximum extent rather than refracted within the connecting column 310.

[0050] Furthermore, in another preferred embodiment of the present invention, as shown in Figures 2 to 5, the LED transparent display screen is

[0051] The system further includes a reinforcing plate 40 provided between the PCB substrate 10 and the connecting piece 30, through which the ends of multiple connecting columns 310 pass.

[0052] Specifically, the reinforcing plate 40 is further provided on the back of the PCB substrate 10, that is, between the PCB substrate 10 and the connecting piece 30, and the reinforcing plate 40 can improve the strength of the PCB substrate 10, that is, improve the strength of the entire LED transparent display screen.

[0053] Furthermore, in another preferred embodiment of the present invention, the reinforcing plate 40 is provided with third vias 410 corresponding to the plurality of first vias 110, and the ends of the plurality of connecting columns 310 sequentially pass through the third vias 410 and the first vias 110.

[0054] Here, in order to ensure the transparency effect of the entire LED transparent display screen, the reinforcing plate 40 also needs to have corresponding third vias 410. Specifically, the reinforcing plate 40 is provided with a plurality of third vias 410, and the plurality of third vias 410 and the plurality of first vias 110 correspond perfectly one-to-one, and in a preferred embodiment, both of these are the same size. The ends of the plurality of connecting columns 310 sequentially pass through the third vias 410 and the first vias 110, then extend above the PCB substrate 10 and are bonded to the transparent glass. Furthermore, in another preferred embodiment of the present invention, the reinforcing plate 40 is a carbon fiber board.

[0055] Here, since the carbon fiber plate has the advantages of being lightweight and high strength, by using the carbon fiber plate as the reinforcing plate 40, the strength requirement is met, the thickness of the reinforcing plate 40 is made as small as possible, and the weight reduction of the LED transparent display screen is promoted, making its installation and fixing easier.

[0056] Furthermore, in another preferred embodiment of the present invention, the plurality of connecting columns 310 of one connecting piece 30 are each located on both sides of the joint of the two PCB boards 10. Here, the connecting piece 30 has the function of bonding and connecting the PCB boards 10 to the transparent glass, as well as joining the plurality of PCB boards 10. Specifically, the connecting piece 30 is provided at the joint of the two PCB boards 10, and the plurality of connecting columns 310 of the connecting piece 30 are each located on both sides of the joint of the two PCB boards 10. In this way, when the plurality of connecting columns 310 are each inserted into the first via 110 of the two PCB boards 10, the two PCB boards 10 can be easily connected.

[0057] In other words, at least one connecting piece 30 is located between two adjacent PCB boards, and at least one connecting post 310 on the connecting piece 30 is located on another PCB board, in which case the connecting piece 30 has the effect of connecting the two adjacent PCB boards. In this case, some of the multiple connecting posts 310 of the connecting piece 30 are located within the first via 110 of one PCB board, and the remainder are located within the first via 110 of the other PCB board. The number of connecting posts 310 located on the two adjacent PCB boards is the same. To balance the connection, half of the connecting posts 310 of the same connecting piece 30 are located on one PCB board 10, and the other half are located on the other PCB board 10.

[0058] Furthermore, in another preferred embodiment of the present invention, the four connecting pieces 30 are each located at the four corners of the face of the PCB substrate 10 opposite to the plurality of LED chips 20.

[0059] Specifically, the LED transparent display screen is generally rectangular in cross-section, and the PCB substrate 10 is also rectangular in cross-section. In order to ensure the strength when the LED transparent display screen is bonded to the transparent glass, the connecting pieces 30 are generally provided at each of the four corners of the side of the PCB substrate 10 opposite to the plurality of LED chips 20, thereby achieving a more balanced adhesive force between the PCB substrate 10 and the transparent glass.

[0060] Furthermore, in another preferred embodiment of the present invention, the plurality of connecting pieces 30 are provided at equal intervals on the side of the PCB substrate 10 opposite to the plurality of LED chips 20.

[0061] Specifically, when the area of ​​the PCB substrate 10 is large, in order to have a relatively uniform adhesive force between the LED transparent display screen and the transparent glass, a plurality of connecting pieces 30 are provided on the side of the PCB substrate 10 opposite to the plurality of LED chips 20, and these connecting pieces 30 are distributed at equal intervals.

[0062] Here, the specific number of the multiple connecting pieces 30 is generally determined by the area of ​​the PCB substrate 10 and the specific size of a single connecting piece 30.

[0063] The number of connecting columns 310 in a connecting piece 30 may be more than one. If a connecting piece 30 has only one connecting column 310, not only is less material used, but the support to the transparent glass is also more flexible. The spacing between two adjacent connecting columns 310 may be equal or not. Additional connecting pieces 30 may be added to areas with weak support. However, in a configuration with only one connecting column 310, the end of the connecting column 310 opposite the connecting piece 30 is prone to rotation if it is not bonded to the transparent glass. Therefore, it is preferable that the number of connecting columns 310 in a connecting piece 30 be two or more. The more connecting columns 310 there are, the higher the support strength provided by the connecting piece 30. However, as the number of connecting columns 310 increases, although an anti-refraction surface is provided in the circumferential direction of the connecting column 310, it is not possible to completely prevent a small amount of light from being refracted into the connecting column 310. This affects the display effect of the portion of the LED transparent display screen located on the connecting piece 30. Therefore, there should not be too many connecting columns 310, and two adjacent connecting columns 310 should be spaced at least one first via 110 apart, thereby preventing light from being refracted within the connecting columns 310 and negatively affecting the display effect.

[0064] On the other hand, the specific number of connecting pieces 30 is generally determined by the area of ​​the PCB substrate 10, the specific size of a single connecting piece 30, and the weight of the transparent glass. Typically, the load force from all the connecting pieces 30 is at least eight times the weight of the LED transparent display screen.

[0065] The above embodiments are used solely to illustrate the technical solutions of the present invention and are not intended to limit them. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that the technical solutions described in each of the above embodiments may be modified or some of their technical features may be replaced with equivalents. However, these modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of each embodiment of the present invention.

Claims

1. An LED transparent display screen comprising a PCB substrate and a plurality of LED chips arranged in an array on the PCB substrate, wherein a plurality of first vias are provided on the PCB substrate, and the plurality of LED chips are distributed around the plurality of first vias, An LED transparent display screen, further comprising a plurality of connecting pieces, each distributed on the side of the PCB substrate opposite to the plurality of LED chips, having a plurality of connecting posts on the side facing the PCB substrate, passing through the plurality of first vias, and having adhesive applied to its end face.

2. The LED transparent display screen according to claim 1, characterized in that the connecting piece is provided with second vias corresponding to the plurality of first vias.

3. The LED transparent display screen according to claim 1, characterized in that the height of the connecting column, which is higher than the PCB substrate, is greater than or equal to the height of the LED chip, which is higher than the PCB substrate.

4. The LED transparent display screen according to claim 1, characterized in that the connecting column and the connecting piece have an integrated structure.

5. The LED transparent display screen according to claim 1, further comprising a reinforcing plate provided between the PCB substrate and the connecting piece, through which the ends of the plurality of connecting columns pass.

6. The LED transparent display screen according to claim 5, characterized in that the reinforcing plate is provided with third vias corresponding to the plurality of first vias, and the ends of the plurality of connecting columns sequentially pass through the third vias and the first vias.

7. The LED transparent display screen according to claim 5, characterized in that the reinforcing plate is a carbon fiber board.

8. The LED transparent display screen according to any one of claims 1 to 7, characterized in that the plurality of connecting columns in one of the connecting pieces are each located on both sides of the joint between the two PCB substrates.

9. The LED transparent display screen according to any one of claims 1 to 7, characterized in that the four connecting pieces are each provided at the four corners of the face of the PCB substrate opposite to the plurality of LED chips.

10. The LED transparent display screen according to any one of claims 1 to 7, characterized in that the plurality of connecting pieces are provided at equal intervals on the side of the PCB substrate opposite to the plurality of LED chips.

11. The LED transparent display screen according to claim 2, characterized in that the radius of the second via is greater than or equal to the radius of the first via.

12. The LED transparent display screen according to any one of claims 1 to 7, characterized in that the diameter of the connecting column is less than the diameter of the first via.

13. The LED transparent display screen according to claim 12, characterized in that the difference between the radius of the first via and the radius of the connecting column is 0.2 mm or more and 0.3 mm or less.

14. The LED transparent display screen according to any one of claims 1 to 7, characterized in that a guide surface is provided in the circumferential direction at the end of the connecting column opposite to the PCB substrate.

15. The connecting piece is provided with at least one of the connecting columns. The LED transparent display screen according to any one of claims 1 to 7, characterized in that there is at least one first via between two adjacent connecting columns.

16. The LED transparent display screen according to any one of claims 1 to 7, characterized in that at least the portion of the connecting piece that is flush with the connecting column is made of a transparent material.

17. The LED transparent display screen according to claim 12, characterized in that the peripheral surface of the connecting column is a matte surface.

18. The LED transparent display screen according to any one of claims 1 to 7, characterized in that the total support strength of the plurality of connecting pieces is eight times or more the weight of the LED transparent display screen.

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