Resin composition and display device

Abstract

The present invention provides a resin composition and a display device that exhibit excellent coating properties, ensure that adhesive members are fixed without lifting even at their end portions, and possess excellent flexibility, thereby improving reliability. [Solution] The resin composition contains 1% to 10% by weight of a urethane (meth)acrylate having two (meth)acrylic groups in one molecule and a weight-average molecular weight of 10,000 to 40,000, 80% to 97% by weight of a monofunctional (meth)acrylate monomer with a weight-average molecular weight of 500 or less, and 0.01% to 0.5% by weight of a silicone-based surfactant. The monofunctional (meth)acrylate monomer is included in an amount of 0% to 20% by weight relative to the total weight of the resin composition and contains a first monomer having a hydroxyl group, and a second monomer different from the first monomer, thereby exhibiting excellent coating properties up to the edge region and providing excellent flexibility and peel angle after curing.

Description

Technical Field

[0001] The present invention relates to a resin composition and a display device, and more particularly to a display device including a resin composition and an adhesive member made of the resin composition.

Background Art

[0002] A variety of display devices used in multimedia devices such as televisions, mobile phones, tablets, computers, navigation systems, and game machines have been developed. Recently, in order to improve user convenience, display devices equipped with flexible display members that can be folded, bent, or rolled up, and electronic modules with various functions have been applied, and development has been advanced for display devices including stepped portions by introducing a printed layer considering design. The adhesive resin composition used to form an adhesive member applied to such display devices of various shapes needs to have excellent coating properties for members of various forms of display devices.

Summary of the Invention

Problems to be Solved by the Invention

[0003] An object of the present invention is to provide a resin composition having excellent coating properties.

[0004] Another object of the present invention is to provide a display device in which the adhesive member is fixed without floating even at the end portion, has excellent flexibility, and has improved reliability.

Means for Solving the Problems

[0005] One embodiment provides a resin composition comprising, with respect to the total weight of the resin composition, 1% to 10% by weight of a urethane (meth)acrylate having two (meth)acrylic groups in one molecule and a weight-average molecular weight of 10,000 to 40,000, 80% to 97% by weight of a monofunctional (meth)acrylate monomer with a weight-average molecular weight of 500 or less, and 0.01% to 0.5% by weight of a silicone-based surfactant, wherein the monofunctional (meth)acrylate monomer is present in an amount greater than 0 and less than 20% by weight of the total weight of the resin composition and has a hydroxyl group, and a second monomer different from the first monomer.

[0006] The resin composition may have a droplet surface tension of 25 mN / m or more and 30 mN / m or less.

[0007] The first monomer may be present in an amount of 10% to 20% by weight relative to the total weight of the resin composition.

[0008] The aforementioned resin composition may be solvent-free.

[0009] The resin composition may have a viscosity of 5 mPa·s or more and 20 mPa·s or less at 30°C.

[0010] The urethane (meth)acrylate and the monofunctional (meth)acrylate monomer may each have a glass transition temperature of less than 0°C.

[0011] The first monomer may include 4-hydroxybutyl acrylate.

[0012] The second monomer may comprise at least one of 2-ethylhexyl acrylate, 2-ethylhexyldiglycol acrylate, and tetrahydrofurfuryl acrylate.

[0013] The resin composition may further contain a photopolymerization initiator.

[0014] The resin composition may be provided by inkjet printing or dispensing.

[0015] One embodiment provides a display device comprising a display module, a window disposed on the display module, and an adhesive member made of the above-described resin composition, disposed between the display module and the window.

[0016] The adhesive member may have a storage modulus of 0.01 MPa or more and 0.1 MPa or less at 25°C.

[0017] The adhesive member may have an adhesive strength of 800 gf / 25 mm or more to a glass substrate or polyethylene terephthalate (PET) film at 25°C.

[0018] The lower surface of the window module adjacent to the adhesive member is glass, the upper surface of the display module adjacent to the adhesive member is polyethylene terephthalate (PET), and the resin composition may have a droplet surface tension of 25 mN / m or more and 30 mN / m or less relative to the polyethylene terephthalate (PET).

[0019] The display module may be capable of being folded with respect to at least one folding axis.

[0020] The display device further includes a light control layer disposed between the adhesive member and the window, and an optical adhesive layer disposed between the light control layer and the window, wherein the optical adhesive layer may include a polymer derived from the resin composition.

[0021] One embodiment provides an electronic device including a display device that is arranged between adjacent members and includes at least one adhesive member made of the above-described resin composition.

[0022] The display device may be a vehicle display device, a television, a monitor, a game machine, a tablet, a mobile phone, a camera, a notebook computer, a personal computer, a personal information terminal, or a billboard.

Advantages of the Invention

[0023] A resin composition according to an embodiment contains an oligomer, a monofunctional monomer, and a silicone-based surfactant in specific contents, and by adjusting the content of a first monomer having a hydroxy group contained in the monofunctional monomer, it can exhibit excellent coating characteristics up to the edge portion of the substrate to be coated while not leaking to the outside of the substrate to which the resin composition is applied, and can exhibit viscosity characteristics that are easy to apply by an inkjet printing method or the like.

[0024] A display device according to an embodiment includes an adhesive member made of the resin composition described above, and can exhibit excellent reliability characteristics by maintaining the bonding of the modules and members of the display device without floating at the edge portion. Further, since the adhesive member made of the resin composition described above exhibits excellent flexibility, it can be usefully applied to a flexible display device.

Brief Description of the Drawings

[0025] [Figure 1a] It is a perspective view showing a display device according to an embodiment. [Figure 1b] It is a perspective view showing a display device according to an embodiment. [Figure 1c] It is a plan view showing a display device according to an embodiment. [Figure 1d] It is a perspective view showing a display device according to an embodiment. [Figure 2] It is an exploded perspective view showing a display device according to an embodiment. [Figure 3] It is a cross-sectional view showing a portion corresponding to the line I-I' in FIG. 2. [Figure 4] It is a cross-sectional view showing a part of a display device according to an embodiment. [Figure 5a] It is a diagram exemplarily showing steps of providing a resin composition according to an embodiment. [Figure 5b]This figure illustrates the steps taken after the adhesive members of one embodiment have been bonded together. [Figure 6] This figure schematically shows the coating characteristics of a resin composition according to one embodiment. [Figure 7] This is a cross-sectional view showing a display device in one embodiment. [Figure 8] This is a cross-sectional view showing a display device in one embodiment. [Modes for carrying out the invention]

[0026] Because the present invention can be modified in various ways and take on various forms, specific embodiments are illustrated in the drawings and described in detail in the text. However, this should be understood not as an attempt to limit the present invention to any particular disclosure, but rather as including all modifications, equivalents, or substitutes that fall within the spirit and technical scope of the present invention.

[0027] In this specification, when a component (or region, layer, part, etc.) is referred to as "on top of," "combined with," or "combined with" another component, it means that it can be directly placed on top of, connected to, or combined with the other component, or that a third component can be placed between them.

[0028] The same drawing symbol refers to the same component. Furthermore, in drawings, the thickness, proportions, and dimensions of components are exaggerated for the sake of effective explanation of the technical content. "and / or" includes all combinations of one or more components defined by the relevant component.

[0029] Terms such as "first," "second," etc., are used to describe a variety of components, but the components are not limited to those defined by these terms. These terms are used solely for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be named the second component, and similarly, the second component may also be named the first component. A singular form may include plural expressions unless the context clearly indicates otherwise.

[0030] Furthermore, terms such as "down," "on the lower side," "up," and "on the upper side" are used to describe the relationships between the components shown in the drawing. These terms are relative concepts and are described in relation to the direction shown in the drawing.

[0031] Terms such as "includes" or "has" indicate the presence of features, figures, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood not to pre-exist to exclude the presence or possibility of adding one or more other features, figures, steps, actions, components, parts, or combinations thereof.

[0032] In this specification, “directly arranged” may mean that there are no additional layers, films, regions, plates, etc. between one part and another. For example, “directly arranged” may mean that two layers or two members are arranged without the use of additional members such as adhesive members.

[0033] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as those generally understood by those skilled in the art in the field to which the present invention pertains. Furthermore, terms defined in commonly used dictionaries should be interpreted as having the same meaning as they do in the context of the relevant art, and should not be interpreted in an overly idealistic or formal sense unless expressly defined herein.

[0034] The following describes a resin composition and a display device of one embodiment with reference to the drawings.

[0035] For example, an electronic device may include a display device DD and a control unit (not shown) that controls the display device DD. An electronic device in one embodiment may be a device activated by an electrical signal. An electronic device may include electronic devices of various embodiments. For example, a display device may include large display devices such as televisions, monitors, or external billboards, as well as vehicle display devices such as personal computers, laptop computers, personal information terminals, and car navigation systems, and small to medium-sized display devices such as mobile phones, tablets, game consoles, portable electronic devices, and cameras. However, the embodiments are not limited to these.

[0036] Figure 1a and others exemplify that the display device DD is a mobile phone. Figure 1a is a perspective view of the display device DD in an unfolded state according to one embodiment. Figure 1b is a perspective view showing the folding operation of the display device DD according to one embodiment. Figure 1c is a plan view of the display device DD in a folded state according to one embodiment. Figure 1d is a perspective view showing the folding operation of the display device DD according to one embodiment.

[0037] The display device DD may include a first display surface FS defined by a first directional axis DR1 and a second directional axis DR2 intersecting the first directional axis DR1. The display device DD may provide video IM to the user via the first display surface FS. Video IM may include both dynamic and static images. The display device DD may display video IM on the first display surface FS parallel to the first directional axis DR1 and the second directional axis DR2, respectively, in the direction of the third directional axis DR3.

[0038] In this specification, the first directional axis DR1 and the second directional axis DR2 are orthogonal to each other, and the third directional axis DR3 may be the normal direction to the plane defined by the first directional axis R1 and the second directional axis DR2. The thickness direction of the display device DD may be aligned with the third directional axis DR3. The front (or top) and back (or bottom) surfaces are opposite each other along the third directional axis DR3, and the normal directions of the front (or top) and back (or bottom) surfaces, respectively, may be parallel to the third directional axis DR3. The front (or top) surface means the surface adjacent to the first display surface FS, and the back (or bottom) surface means the surface separated from the first display surface FS, or the surface close to the second display surface RS, which will be described later. The upper side means the direction approaching the first display surface FS, and the lower side means the direction away from the first display surface FS.

[0039] A cross-section refers to a plane aligned with the thickness direction DR3, while a plane refers to a plane perpendicular to the thickness direction DR3. A plane refers to the plane defined by the first directional axis DR1 and the second directional axis DR2.

[0040] The directions indicated by the first to third directional axes DR1, DR2, and DR3 described herein are relative concepts and can be converted to other directions. Furthermore, the directions indicated by the first to third directional axes DR1, DR2, and DR3 may be described as the first to third directions, and the same drawing reference numerals may be used.

[0041] The display device DD can sense external inputs applied from the outside. External inputs can include various forms of input provided from outside the display device DD. For example, external inputs include not only contact by a part of the user's body such as their hand, but also external inputs applied from close proximity to the display device DD or adjacent at a predetermined length (e.g., hovering). Furthermore, external inputs can take various forms such as force, pressure, temperature, and light.

[0042] The display device DD may include a first display surface FS and a second display surface RS. The first display surface FS may include a first active area F-AA, a first peripheral area F-NAA, and an electronic module area EMA. The second display surface RS may be defined as the surface facing at least a portion of the first display surface FS. In other words, the second display surface RS may be defined as a portion of the rear surface of the display device DD.

[0043] The first active region F-AA may be a region that is activated by an electrical signal. The first active region F-AA may be a region where video IM is displayed and where various forms of external input can be sensed.

[0044] The first peripheral region F-NAA may be adjacent to the first active region F-AA. The first peripheral region F-NAA may have a predetermined color. The first peripheral region F-NAA may surround the first active region F-AA. Thereafter, the shape of the first active region F-AA may be substantially defined by the first peripheral region F-NAA. However, this is illustrative, and the first peripheral region F-NAA may be located on only one side of the first active region F-AA, or may be omitted.

[0045] The electronic module area (EMA) can accommodate a variety of electronic modules. For example, an electronic module may include at least one of a camera, speaker, light sensor, and thermal sensor. The electronic module area (EMA) can sense external objects received via the display surface FS, RS, or provide audio signals, such as voice, to the outside via the display surface FS, RS. An electronic module may include multiple configurations and is not limited to any one embodiment.

[0046] The electronic module region (EMA) may be surrounded by the first peripheral region (F-NAA). However, this is illustrative and not limited to any one embodiment. For example, the electronic module region (EMA) may be surrounded by the first active region (F-AA) and the first peripheral region (F-NAA), and the electronic module region (EMA) may be located within the first active region (F-AA).

[0047] In one embodiment, the display device DD may be a flexible display device. The display device DD of one embodiment may include at least one folding region FA and a plurality of non-folding regions NFA1, NFA2 extending from the folding region FA. For example, a first non-folding region NFA1, a folding region FA, and a second non-folding region NFA2 may be defined along a second direction DR2. In one embodiment, the display device DD may include a first non-folding region NFA1 and a second non-folding region NFA2 separated from each other in the second direction DR2 with the folding region FA in between. For example, the first non-folding region NFA1 may be located on one side of the folding region FA following the second direction DR2, and the second non-folding region NFA2 may be located on the other side of the folding region FA along the second direction DR2.

[0048] Figure 1a and others show one embodiment of a display device DD that includes one folding region FA, but the examples are not limited to this, and a display device DD may have multiple folding regions defined. For example, the display device according to one embodiment may include two or more folding regions, and may also include three or more non-folding regions arranged between the folding regions.

[0049] Figure 1b is a perspective view showing the folding operation of the display device DD according to one embodiment. Figure 1c is a plan view of the display device DD in the folded state according to one embodiment. Figure 1d is a perspective view showing the folding operation of the display device DD according to one embodiment.

[0050] Referring to Figure 1b, in one embodiment, the display device DD can be folded with respect to a first folding axis FX1 that extends in a first direction DR1. When the display device DD is folded, the folding region FA may have a predetermined curvature and radius of curvature. The display device DD can be folded with respect to the first folding axis FX1, and the first non-folding region NFA1 and the second non-folding region NFA2 can be deformed into an in-folding state so that the first display surface FS is not exposed to the outside.

[0051] Referring to Figure 1c, in one embodiment, the display device DD is folded inward, allowing the second display surface RS to be visible to the user. In this case, the second display surface RS may include a second active area R-AA for displaying images. The second active area R-AA may be an area that is activated by an electrical signal. The second active area R-AA may be an area where images are displayed and which can sense various forms of external inputs.

[0052] The second peripheral region R-NAA may be adjacent to the second active region R-AA. The second peripheral region R-NAA may have a predetermined color. The second peripheral region R-NAA may surround the second active region R-AA. On the other hand, although not shown, the display device DD may further include an electronic module region on the second display surface RS in which various electronic modules are arranged, and is not limited to any one embodiment.

[0053] Referring to Figure 1d, in one embodiment, the display device DD can be folded with respect to a second folding axis FX2 that extends in a first direction DR1. The display device DD can be deformed into an out-folding state by folding with respect to the second folding axis FX2 so that the first display surface FS is exposed to the outside. In one embodiment, the display device DD may be configured to repeatedly perform actions of unfolding, folding inward, and folding outward.

[0054] Figures 1a to 1d illustrate folding based on folding axis FX1 or FX2, but the number of folding axes and the resulting number of non-folding areas are not limited to these. For example, the display can be folded based on multiple folding axes so that parts of the first display surface FS and the second display surface RS face each other. Also, although the first and second folding axes FX1 and FX2 are shown aligned with the long side of the display device DD, the embodiment is not limited to this, and the first and second folding axes FX1 and FX2 may be aligned with the short side of the display device DD.

[0055] In the display device DD, the first non-folding region NFA1 and the second non-folding region NFA2 can be defined as having display surfaces FS and RS aligned with the planes defined by the first directional axis DR1 and the second directional axis DR2 when folded, as shown in Figure 1c, and the folding region FA can be defined as the region between the first non-folding region NFA1 and the second non-folding region NFA2. The folding region FA may include a curved surface portion that is bent to have a predetermined curvature when folded.

[0056] Figure 2 is an exploded perspective view showing a display device DD of one embodiment. Referring to Figure 2, the display device DD according to one embodiment may include a display module DM, a window WP disposed on the display module DM, and an adhesive member AP disposed between the display module DM and the window WP. The display device DD may further include a support member SM disposed below the display module DM, a protective layer PF disposed on the window WP, and a housing HAU that houses the display module DM and the like.

[0057] The housing (HAU) may include materials with relatively high rigidity. For example, the housing (HAU) may include multiple frames and / or plates made of glass, plastic, or metal. The housing (HAU) may provide a predetermined housing space. The display module (DM) may be housed within this housing space and protected from external impacts.

[0058] The support member SM may include a metallic material or a polymeric material. For example, the support member SM may be formed from stainless steel, aluminum, or an alloy thereof. Alternatively, the support member SM may be made of carbon fiber reinforced plastic (CFRP), etc. However, the examples are not limited to these, and the support member SM may include a non-metallic substance, plastic, glass fiber reinforced plastic, or glass. Unlike in the illustration, the support member SM may be omitted.

[0059] Although not shown in the diagram, the display device DD may further include a cushioning layer, a shielding layer, etc., located beneath the support member SM. The cushioning layer may include a sponge, foam, or an elastomer such as urethane resin. The shielding layer may be an electromagnetic shielding layer or a heat dissipation layer.

[0060] The display module DM can be activated by an electrical signal. When activated, the display module DM can display the image IM (Figure 1a) on the display surface FS (Figure 1a) of the display device DD. The display module DM may have a display area AA-DM and a non-display area NAA-DM defined within it. The display area AA-DM may be an area that is activated by an electrical signal. The non-display area NAA-DM may be an area adjacent to at least one side of the display area AA-DM. Circuits and wiring for driving the display area AA-DM may be placed in the non-display area NAA-DM.

[0061] An adhesive member AP may be placed on the display module DM. The display module DM and the window WP may be bonded by the adhesive member AP. The adhesive member AP may be in contact with the lower surface of the window WP and the upper surface of the display module DM. In one embodiment, the adhesive resin AP may be made of the resin composition of one embodiment described later. In Figure 2, the adhesive member AP is shown to be placed between the window WP and the display panel DM, but the embodiment is not limited to this. The adhesive member AP made of the resin composition of one embodiment may be placed between adjacent members of the components included in the display device DD, and the display device DD may include at least one adhesive member AP.

[0062] The adhesive resin AP of one embodiment may contain a polymer derived from the resin composition of one embodiment. In one embodiment, the adhesive resin AP may be formed by photocuring after providing the resin composition of one embodiment, which will be described later. The adhesive member AP made from the resin composition of one embodiment can be positioned while sufficiently covering the bends and steps on one surface of adjacent display modules DM and windows WP. Furthermore, the adhesive member AP according to one embodiment can exhibit excellent bonding characteristics, as the adhesive member AM is positioned with a substantially uniform thickness even to the portion adjacent to the edge region of the display module DM and window WP, depending on the viscosity, surface tension, and adhesive strength characteristics of the resin composition of one embodiment.

[0063] The window WP may include a glass substrate. The window WP may protect the display module DM, etc. The image IM (Figure 1a) generated by the display panel DM may be provided to the user through the window WP. For example, the window WP may include UTG (Ultra Thin Glass).

[0064] The window WP may include a transparent region TA and a bezel region BZA. The transparent region TA may overlap with at least a portion of the display region AA-DM of the display module DM. The transparent region TA may be an optically transparent region. The image IM (Figure 1a) may be provided to the user via the transparent region TA.

[0065] The bezel region (BZA) may be a region with relatively lower light transmittance compared to the transparent region (TA). The bezel region (BZA) may define the shape of the transparent region (TA). The bezel region (BZA) may be adjacent to or surround the transparent region (TA).

[0066] The bezel area BZA may have a predetermined color. The bezel area BZA covers the non-display area NAA-DM of the display module DM, thereby blocking the non-display area NAA-DM from being visible from the outside. However, the embodiment is not limited to this, and the bezel area BZA may be positioned adjacent to only one side of the transparent area TA, or at least a part of it may be omitted.

[0067] The protective layer PF may be a functional layer that protects one surface (e.g., the top surface) of the window WP. The protective layer PF may contain polyethylene terephthalate (PET). The protective layer PF may contain anti-fingerprint coating agents, hard coating agents, antistatic agents, etc. On the other hand, an auxiliary adhesive layer (not shown) is placed between the window WP and the protective layer FP, and the auxiliary adhesive layer (not shown) may contain a polymer derived from the resin composition RC of one embodiment described later (Figures 5a and 6a). Contrary to the illustrations, the protective layer PF may be omitted.

[0068] Figure 3 is a cross-sectional view showing the portion corresponding to the line I-I' in Figure 2. Figure 3 is a cross-sectional view showing a display device DD according to one embodiment. For ease of explanation, the housing HAU is omitted in Figure 3, and the support member SM, display module DM, adhesive member AP, window WP, and protective layer PF are shown.

[0069] Referring to Figure 3, the support plate SM may include a first support portion MP1 superimposed on a first non-folding region NFA1 and a second support portion MP2 superimposed on a second non-folding region NFA1. The first support portion MP1 and the second support portion MP2 may be separated from the folding region FA. The first support portion MP1 and the second support portion MP2 may not superimpose on the folding region FA. Contrary to the illustration, at least a portion of the first support portion MP1 and at least a portion of the second support portion MP2 may superimpose on the folding region FA.

[0070] The display module DM may include a display panel DP and an input sensing unit TP positioned on the display panel DP. The display panel DP may include a base substrate BS, a circuit layer DP-CL positioned on the base substrate BS, a display element layer DP-EL positioned on the circuit layer DP-CL, and a sealing layer TFE covering the display element layer DP-EL. An adhesive member AP may be positioned between the display panel DP and the window WP. An adhesive member AP may also be positioned between the input sensing unit TP and the window WP.

[0071] The configuration of the display panel DP shown in Figure 3 is illustrative, and the configuration of the display panel DP is not limited to this. For example, the display panel DP may include liquid crystal display elements, in which case the sealing layer TFE may be omitted.

[0072] The base substrate BS may provide a base surface on which the circuit layer DP-CL is placed. The base substrate BS may be a flexible substrate that can be bent, folded, rolled, etc. The base substrate BS may be a glass substrate, a metal substrate, or a polymer substrate. However, the examples are not limited to these, and the base substrate BS may include an inorganic layer, an organic layer, or a composite material layer.

[0073] The circuit layer DP-CL may include an insulating layer, semiconductor patterns, conductive patterns, and signal lines. For example, the circuit layer DP-CL may include a switching transistor and a drive transistor for driving the light-emitting element ED (Figure 4) of the display element layer DP-EL.

[0074] The display element layer DP-EL may include light-emitting elements ED (Figure 4). For example, the light-emitting elements ED (Figure 4) may include organic light-emitting materials, inorganic light-emitting materials, organic-inorganic light-emitting materials, quantum dots, quantum rods, micro-LEDs, or nano-LEDs.

[0075] The encapsulation layer TFE may be placed on top of the display element layer DP-EL. The encapsulation layer TFE can protect the light-emitting element layer DP-EL from foreign matter such as moisture, oxygen, and / or dust particles. The encapsulation layer TFE may include at least one inorganic layer. Alternatively, the encapsulation layer TFE may include at least one organic layer and at least one inorganic layer. For example, the encapsulation layer TFE may include sequentially stacked inorganic layers, organic layers, and inorganic layers.

[0076] The input sensing unit TP may be positioned between the display panel DP and the window WP. For example, the input sensing unit TP may be positioned directly on top of the sealing layer TFE of the display panel DP.

[0077] In this specification, the direct placement / provision of one component on top of another component means that no third component is placed / provision between the two components. In other words, "direct placement / provision" of one component on top of another component means that the two components are in "contact".

[0078] The input sensing unit TP can sense external input, convert it into a predetermined input signal, and provide the input signal to the display panel DP. For example, in one embodiment of the display device DD, the input sensing unit TP may be a touch sensing unit that senses touches. The input sensing unit TP may recognize a direct touch by a user, an indirect touch by a user, a direct touch by an object, or an indirect touch by an object.

[0079] The input sensing unit TP can sense at least one of the following: the position of an externally applied touch and the intensity (pressure) of the touch. In one embodiment, the input sensing unit TP may have a variety of structures or be made of a variety of materials, and is not limited to any one embodiment. For example, the input sensing unit TP may sense external input using a capacitive method. The display panel DP receives an input signal from the input sensing unit TP and can generate an image in response to the input signal.

[0080] The window WP may include a base layer BL and a print layer BM. Although not shown, the window WP may further include at least one functional layer (not shown) provided on top of the base layer BL. For example, the functional layer (not shown) may be a hard coating layer, an anti-fingerprint coating layer, etc., but the examples are not limited to these.

[0081] The base layer BL may contain an optically transparent insulating material. The base layer BL may be a glass substrate or a plastic substrate. For example, the base layer BL may be a tempered glass substrate. Also, the base layer BL may have a thickness that is thin or thick enough to allow for folding.

[0082] The base layer BL may be a UTG substrate. The window WP may be made of a flexible polymer resin. For example, the base layer BL may consist of polyimide, polyacrylate, polymethyl methacrylate, polycarbonate, polyethylene naphthalate, polyvinylidene chloride, polyvinylidene fluoride, polystyrene, ethylene-vinyl alcohol copolymer, or a combination thereof. However, the examples are not limited to these, and any common material known to be usable as a cover window in the relevant art may be used without limitation.

[0083] The print layer BM may be placed on one surface of the base layer BL. The print layer BM may be provided as a pattern layer on the underside of the base layer BL adjacent to the display module DM. The print layer BM may be placed in the edge region of the base layer BL. The print layer BM may be an ink print layer. Alternatively, the print layer BM may be a layer formed containing a pigment or dye. In a window WP, the bezel region BZA may be the portion where the print layer BM is provided.

[0084] A step SP-a may exist between the printed layer BM and a portion of the base layer BL where the printed layer BM is not provided. The adhesive member AP is made of a resin composition according to one embodiment and can be attached to the window WP without lifting at the step SP-a portion.

[0085] The thickness T0 of the adhesive member AP may be 10 μm or more and 500 μm or less, 10 μm or more and 300 μm or less, or 10 μm or more and 100 μm or less. For example, the thickness T0 of the adhesive member AP may be 10 μm or more and 50 μm or less. However, this is an example, and the thickness T0 of the adhesive member AP is not limited to these values.

[0086] In one embodiment, the adhesive member AP may have a storage modulus of 0.01 MPa or more and 0.1 MPa or less at 25°C. The storage modulus may be measured using a dynamic viscoelasticity measuring device, MCR302 (manufactured by Anton Paar). The adhesive member AP of one embodiment, having a storage modulus of 0.01 MPa or more and 0.1 MPa or less at 25°C, has excellent flexibility and can easily be folded and unfolded. Therefore, the adhesive member AP of one embodiment is applicable to the flexible display device DD.

[0087] In one embodiment, the adhesive member AP may have a 180° peel strength of 800 gf / 25 mm or more at 25°C to at least one of the glass substrate and polymer substrate. The polymer substrate may include polyethylene terephthalate (PET). Because the adhesive member AP of one embodiment has a 180° peel strength of 800 gf / 25 mm or more at 25°C to at least one of the glass substrate and polymer substrate, it can exhibit excellent adhesive reliability.

[0088] The adhesive member of one embodiment has a storage modulus of 0.01 MPa or more and 0.1 MPa or less at 25°C, and a 180° peel force of 800 gf / 25 mm or more to at least one of the glass substrate and polymer substrate, and does not peel or break when bent, so it can be applied to a flexible display device DD.

[0089] In one embodiment, the adhesive member AP may be in contact with the lower surface of the window WP and the upper surface of the display module DM. For example, the lower surface of the window WP may be glass, and the upper surface of the display module DM may be polyethylene terephthalate (PET).

[0090] Figure 4 is a cross-sectional view specifically illustrating the display module DM shown in Figure 3. The configuration of the display module DM shown in Figure 4 is illustrative, and the embodiment is not limited thereto.

[0091] In Figure 4, the base substrate BS may include a single layer or a multilayer. For example, the base substrate BS may include a first synthetic resin layer, a multilayer or single-layer inorganic layer, and a second synthetic resin layer disposed on the multilayer or single-layer inorganic layer. The first synthetic resin layer and the second synthetic resin layer may each contain a polyimide resin. Furthermore, the first synthetic resin layer and the second synthetic resin layer may each contain at least one of acrylic resins, methacrylic resins, polyisoprene resins, vinyl resins, epoxy resins, urethane resins, cellulose resins, siloxane resins, polyamide resins, and perylene resins. In this specification, "○○" resin means containing the "○○" active group.

[0092] The display panel DP may include a transistor TR and a light-emitting element ED. The transistor TR and the light-emitting element ED may be placed on a base substrate BS. Although one transistor TR is shown in Figure 4, the display panel DP may include multiple transistors and at least one capacitor to substantially drive the light-emitting element ED.

[0093] The circuit layer DP-CL may be placed on the base substrate BS. The circuit layer DP-CL may include a shielding electrode BML, a transistor TR, a connecting electrode CNE, and a plurality of insulating layers BFL and INS1 to INS6. The plurality of insulating layers BFL and INS1 to INS6 may include a buffer layer BFL and the first to sixth insulating layers INS1 to INS6. However, the laminated structure of the circuit layer DP-CL shown in Figure 4 is illustrative, and the laminated structure of the circuit layer DP-CL may be changed depending on the configuration of the display panel DP and processes such as the manufacturing of the circuit layer DP-CL.

[0094] The shielding electrode BML may be placed on the base substrate BS. The shielding electrode BML may be superimposed on the transistor TR. The shielding electrode BML may protect the transistor TR by blocking light incident on the transistor TR from below the display panel DP. The shielding electrode BML may contain a conductive material. When a voltage is applied to the shielding electrode BML, the threshold voltage of the transistor TR placed on the shielding electrode BML may be maintained. However, the embodiment is not limited to this, and the shielding electrode BML may be a floating electrode. The shielding electrode BML may be omitted.

[0095] The buffer layer BFL may be placed on the base substrate BS and cover the light-shielding electrode BML. The buffer layer BFL may include an inorganic layer. The buffer layer BFL may improve the bonding force between the semiconductor pattern or conductive pattern placed on the buffer layer BFL and the base substrate BS.

[0096] A transistor TR may include a source S1, a channel C1, a drain D1, and a gate G1. The source S1, channel C1, and drain D1 of the transistor TR may consist of a semiconductor pattern. The semiconductor pattern of the transistor TR may include polysilicon, amorphous silicon, or metal oxides, but is not limited to any one of these materials as long as it has semiconductor properties.

[0097] A semiconductor pattern may contain multiple regions that are divided by their conductivity. Regions of the semiconductor pattern that are doped with a dopant or where metal oxides are reduced may have high conductivity and can effectively function as the source and drain electrodes of a transistor TR. Regions of the semiconductor pattern with high conductivity may correspond to the source S1 and drain D1 of the transistor TR. Regions of the semiconductor pattern that are not doped, are doped at a low concentration, or where metal oxides are not reduced and have low conductivity may correspond to the channel C1 (or active) of the transistor TR.

[0098] The first insulating layer INS1 may be placed on top of the buffer layer BFL, covering the semiconductor pattern of the transistor TR. The gate G1 of the transistor TR may be placed on top of the first insulating layer INS1. On a plane, the gate G1 may be superimposed on the channel C1 of the transistor TR. The gate G1 may function as a mask in the process of doping the semiconductor pattern of the transistor TR.

[0099] A second insulating layer INS2 may be placed on top of the first insulating layer INS1, covering the gate G1. A third insulating layer INS3 may be placed on top of the second insulating layer INS2.

[0100] The connecting electrode CNE may include a first connecting electrode CNE1 and a second connecting electrode CNE2 for electrically connecting the transistor TR and the light-emitting element ED. However, the configuration of the connecting electrode CNE for electrically connecting the transistor TR and the light-emitting element ED is not limited to this, and one of the first and second connecting electrodes CNE1 and CNE2 may be omitted, or additional connecting electrodes may be included.

[0101] The first connecting electrode CNE1 may be placed on the third insulating layer INS3. The first connecting electrode CNE1 may be connected to the first drain D1 via a first contact hole CH1 that penetrates the first to third insulating layers INS1 to INS3. The fourth insulating layer INS4 may be placed on the third insulating layer INS3 while covering the first connecting electrode CNE1. The fifth insulating layer INS5 may be placed on the fourth insulating layer INS4.

[0102] The second connecting electrode CNE1 may be placed on the fifth insulating layer INS5. The second connecting electrode CNE2 may be connected to the first connecting electrode CNE1 via a second contact hole CH2 that penetrates the fourth and fifth insulating layers INS4 and INS5. The sixth insulating layer INS6 may be placed on the fifth insulating layer INS5 while covering the second connecting electrode CNE2.

[0103] Each of the first to sixth functional layers INS1 to INS6 may include an inorganic layer or an organic layer. For example, the inorganic layer may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide. The organic layer may include at least one of acrylic resin, methacrylic resin, polyisoprene resin, vinyl resin, epoxy resin, urethane resin, cellulose resin, siloxane resin, polyamide resin, and ferylene resin.

[0104] The display element layer DP-EL may include a pixel definition film PDL and a light-emitting element ED. The light-emitting element ED may include a first electrode AE, a hole control layer HCL, a light-emitting layer EML, an electron control layer TCL, and a second electrode CE.

[0105] The first electrode AE ​​may be placed on the sixth insulating layer INS6. The first electrode AE ​​may be connected to the second connecting electrode CNE2 via a third contact hole CH3 that penetrates the sixth insulating layer INS6. The first electrode AE ​​may be electrically connected to the drain D1 of the transistor TR via the first and second connecting electrodes CNE1 and CNE2.

[0106] The first electrode AE ​​may consist of a metallic material, a metallic alloy, or a conductive compound. The first electrode AE ​​may be an anode or a cathode, however, the examples are not limited to these. The first electrode AE ​​may also be a pixel electrode. The first electrode AE ​​may be a transmissive electrode, a semitransmissive electrode, or a reflective electrode. The first electrode AE ​​may contain at least one selected from Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF, Mo, Ti, W, In, Sn, and Zn, 22 or more compounds selected from these, a mixture of two or more selected from these, or oxides thereof.

[0107] If the first electrode AE ​​is a transmissive electrode, it may contain transparent metal oxides, such as ITO (indium tin oxide), IZO (indium zinc oxide), ZnO (zinc oxide), ITZO (indium tin zinc oxide), etc. If the first electrode AE ​​is a semi-transmissive or reflective electrode, it may contain Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF / Ca (a layered structure of LiF and Ca), LiF / Al (a layered structure of LiF and Al), Mo, Ti, W, or compounds or mixtures thereof (for example, a mixture of Ag and Mg). Alternatively, the first electrode AE ​​may have a multi-layer structure including a reflective or semi-transmissive film made of the aforementioned materials, and a transparent conductive film made of ITO, IZO, ZnO, ITZO, etc. For example, the first electrode AE ​​may have a three-layer structure of ITO / Ag / ITO, but is not limited to this. Furthermore, the examples are not limited to those described above, and the first electrode AE ​​may include the metal material described above, a combination of two or more metal materials selected from the metal materials described above, or an oxide of the metal material described above.

[0108] The pixel definition film PDL may be placed on the sixth insulating layer INS6. The pixel definition film PDL may have an emission aperture PX_OP that exposes a portion of the first electrode AE. The portion of the first electrode AE ​​exposed by the emission aperture PX_OP may be defined as an emission region LA.

[0109] The display area AA-DM of the display module DM may include an emission area LA and a light-shielding area NLA. The area where the pixel definition film PDL is placed may correspond to the light-shielding area NLA. The light-shielding area NLA may surround the emission area LA within the display area AA-DM.

[0110] The hole control layer (HCL) may be placed on the first electrode (AE) and the pixel definition film (PDL). The hole control layer (HCL) may be provided as a common layer superimposed on the light-emitting region (LA) and the light-shielding region (NLA). Alternatively, the hole control layer (HCL) may be provided only in the region corresponding to the light-emitting aperture (PX-OP). The hole control layer (HCL) may include at least one of a hole transport layer, a hole injection layer, and an electron blocking layer. The hole control layer (HCL) may include a known hole injection material and / or a known hole transport material.

[0111] The emissive layer (EML) may be placed on the hole control layer (HCL). The emissive layer (EML) may be placed in the region corresponding to the light emission aperture (PX_OP). Alternatively, the emissive layer (EML) may be provided as a common layer. The emissive layer (EML) may contain organic and / or inorganic photoluminescent materials. The emissive layer (EML) may emit light of any one of the following colors: red, green, and blue. For example, the emissive layer (EML) may emit blue light.

[0112] The electron control layer (TCL) may be placed on top of the light-emitting layer (EML). The electron control layer (TCL) may be provided as a common layer superimposed on the light-emitting region (LA) and the light-shielding region (NLA). Alternatively, the electron control layer (TCL) may be provided only in the region corresponding to the light-emitting aperture (PX-OP). The electron control layer (TCL) may include at least one of an electron transport layer, an electron injection layer, and a hole blocking layer. The electron control layer (TCL) may include a known electron injection material and / or a known electron transport material. The second electrode CE may be placed on the electronic control layer TCL. The second electrode CE may be provided as a common layer superimposed on the light-emitting region LA and the light-shielding region NLA.

[0113] The second electrode CE may be a common electrode. The second electrode CE may be a cathode or an anode, but the examples are not limited to these. For example, if the first electrode AE ​​is an anode, the second electrode may be a cathode, and if the first electrode AE ​​is a cathode, the second electrode CE may be an anode. The second electrode CE can be a transmissive electrode, a semi-transmissive electrode, or a reflective electrode. If the second electrode CE is a transmissive electrode, it can be made of a transparent metal oxide, such as ITO, IZO, ZnO, ITZO, etc.

[0114] If the second electrode CE is a semi-transparent or reflective electrode, the second electrode CE may contain Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF / Ca, LiF / Al, Mo, Ti, Yb, W, or compounds or mixtures containing these (e.g., AgMg, AgYb, or MgYb). Alternatively, the second electrode CE may have a multi-layer structure including a reflective or semi-transparent film made of the above-mentioned material, and a transparent conductive film made of ITO, IZO, ZnO, ITZO, etc. For example, the second electrode CE may contain the above-mentioned metallic material, a combination of two or more metallic materials selected from the above-mentioned metallic materials, or an oxide of the above-mentioned metallic material.

[0115] The sealing layer TFE may be placed on the second electrode CE to cover the light-emitting element ED. The sealing layer TFE may include multiple thin films. For example, the sealing layer TFE may include an inorganic film placed on the second electrode CE and an organic film placed between the inorganic films. The inorganic film may protect the light-emitting element ED from moisture / oxygen, and the organic film may protect the light-emitting element ED from foreign matter such as dust particles.

[0116] The input sensing unit TP may include a first sensing insulating layer IL1, a second sensing insulating layer IL2, and a third sensing insulating layer IL3. The input sensing unit TP may include at least one conductive layer disposed on top of the sensing insulating layers. The input sensing unit TP may include a first conductive layer CDL1 and a second conductive layer CDL2.

[0117] The first sensing insulating layer IL1 may be placed on top of the sealing layer TFE. The first sensing insulating layer IL1 may include at least one inorganic insulating layer. The first sensing insulating layer IL1 may be in contact with the sealing layer TFE. Alternatively, the first sensing insulating layer IL1 may be omitted, in which case the first conductive layer CD1 may be in contact with the sealing layer TFE.

[0118] A first conductive layer CDL1 may be placed on a first sensing insulating layer IL1. The first conductive layer CDL1 may include a plurality of first conductive patterns. The plurality of first conductive patterns may be placed on the first sensing insulating layer IL1. A second sensing insulating layer IL2 may be placed on the first sensing insulating layer IL1 so as to cover at least a portion of the first conductive layer CDL1.

[0119] A second conductive layer CDL2 may be placed on top of a second sensing insulating layer IL2. The second conductive layer CDL2 may contain a plurality of second conductive patterns. The plurality of second conductive patterns may be placed on top of the second sensing insulating layer IL2. Each of the plurality of second conductive patterns may be connected to a plurality of first conductive patterns via contact holes formed in the second sensing insulating layer IL2.

[0120] Each of the multiple first conductive patterns of the first conductive layer CDL1 and each of the multiple second conductive patterns of the second conductive layer CDL2 may be arranged in accordance with the light-shielding region NLA. Each of the multiple first conductive patterns of the first conductive layer CDL1 and each of the multiple second conductive patterns of the second conductive layer CDL2 may correspond to a mesh pattern.

[0121] The third sensing insulating layer IL3 may be positioned on top of the second sensing insulating layer IL2 and cover the second conductive layer CDL2. The second sensing insulating layer IL2 and the third sensing insulating layer IL3 may each include an inorganic insulating layer or an organic insulating layer.

[0122] The first conductive layer CDL1 and the second conductive layer CDL2 may each have a monolayer structure or a multilayer structure stacked along a third direction DR3. The monolayer conductive layers CDL1 and CDL2 may include a metal layer or a transparent conductive layer. The metal layer may include molybdenum, silver, titanium, copper, aluminum, or alloys thereof. The transparent conductive layer may include transparent conductive oxides such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), and indium tin zinc oxide (ITZO). The transparent conductive layer may also include conductive polymers such as PEDOT, metal nanowires, graphene, etc.

[0123] The multilayer conductive layers CDL1 and CDL2 may include a metal layer. The metal layer may have a three-layer structure such as titanium (Ti) / aluminum (Al) / titanium (Ti). The multilayer conductive layers CDL1 and CDL2 may include at least one metal layer and at least one transparent conductive layer.

[0124] Figure 5a is a schematic diagram showing the steps of providing the resin composition of one embodiment. Figure 5b is a schematic diagram showing the steps after the adhesive members of one embodiment have been bonded. Figure 6 is a schematic diagram showing the coating characteristics of the resin composition of one embodiment.

[0125] Referring to Figure 5a, the resin composition RC of one embodiment can be applied to one surface of a base substrate in a fluid liquid state. In Figure 5a, a display module DM is shown as an example of a base substrate to which the resin composition RC is provided, but the embodiment is not limited to this, and the resin composition RC may be provided in a liquid state to one surface of a window WP (Figure 3) and then subjected to a photocuring process.

[0126] The resin composition RC is placed on one surface of the display module DM, in which case the resin composition RC in a fluid liquid state may be provided up to the edge portion of the outer casing of the display module DM. That is, the edge of the applied resin composition RC and the edge of the display module DM may be substantially aligned in cross-section. In this specification, substantially the same includes cases where the physical numerical values ​​are the same and cases where there are differences within the tolerance range of the process.

[0127] The resin composition RC of one embodiment may be provided by an inkjet printing method or a dispensing method. The resin composition RC of one embodiment may be adjusted to an amount with an appropriate viscosity so that it is easily dispensed by an inkjet printing device or a dispensing device and the amount dispensed can be adjusted.

[0128] For example, the viscosity of the resin composition RC may be between 5 mPa·s and 20 mPa·s. The viscosity of the resin composition RC may be measured at a temperature of 30°C using the JIS K2283 method. In one example, the resin composition RC has a viscosity of between 5 mPa·s and 20 mPa·s at a temperature of 30°C, making it easy to dispense from equipment such as a nozzle NZ, and allowing for uniform application in terms of volume and thickness. If the viscosity of the resin composition RC is less than 5 mPa·s at a temperature of 30°C, deviations in the dispensed volume and thickness after application are likely to occur. If the viscosity of the resin composition RC exceeds 20 mPa·s at a temperature of 30°C, dispensing failures and clogging of the nozzle NZ may occur.

[0129] The resin composition RC is supplied by inkjet printing or dispensing and exhibits properties that make it easy to coat various components included in the display device DD (Figure 1a). On the other hand, Figure 5a shows that the resin composition RC of one embodiment is supplied onto the display module DM using a nozzle NZ, but the configuration for supplying the resin composition RC is not limited to this.

[0130] The resin composition RC of one example may comprise an oligomer, a monofunctional monomer, and a silicone-based surfactant, and may further comprise a photopolymerization initiator. The oligomer of one example may have two (meth)acrylic groups in one molecule, and the monofunctional monomer may have one (meth)acrylic group in one molecule. In this specification, (meth)acrylic group means acrylic group or methacrylic group.

[0131] The resin composition RC of one example may contain an oligomer having a weight-average molecular weight of 10,000 to 40,000. The resin composition RC of one example may contain at least one urethane (meth)acrylate as an oligomer having a weight-average molecular weight of 10,000 to 40,000. For example, the resin composition RC of one example may contain one type of urethane (meth)acrylate having the weight-average molecular weight of 10,000 to 40,000 as described above as an oligomer. Furthermore, the resin composition RC of one example may contain two or more types of urethane (meth)acrylate as oligomers, each having a weight-average molecular weight of 10,000 to 40,000 and having different weight-average molecular weights from each other. The urethane (meth)acrylate contained in the resin composition RC of one example may have a glass transition temperature (Tg) of less than 0°C.

[0132] Urethane (meth)acrylates with a weight-average molecular weight of 10,000 to 40,000 may be in an oligomer state with a relatively high degree of polymerization. If the resin composition RC contains a urethane (meth)acrylate having the above-mentioned weight-average molecular weight, the resin composition RC can maintain a high degree of polymerization even after photocuring and exhibit excellent flexibility. Therefore, the adhesive member AP made of the resin composition RC of one embodiment can achieve both excellent adhesion and flexibility.

[0133] For example, the urethane (meth)acrylate may include at least one of UF-C051 (urethane acrylate, product of Kyoeisha Chemical Co., Ltd.) and UV3300B (urethane acrylate, manufactured by Mitsubishi Chemical Holdings). However, this is illustrative and the urethane (meth)acrylate contained in the resin composition RC is not limited to these.

[0134] The resin composition RC of one embodiment may contain urethane (meth)acrylate in an amount of 1% to 10% by weight relative to the total weight of the resin composition. For example, the resin composition RC may contain approximately 1% to 10% by weight of urethane (meth)acrylate based on 100% by weight of the resin composition. If the resin composition RC of one embodiment contains urethane (meth)acrylate within the above-mentioned content range, the resin composition RC will satisfy the viscosity range described above at a temperature of 30°C and can be appropriately dispensed by inkjet printing or dispensing to be uniformly applied to a base substrate.

[0135] The resin composition RC of one example may contain monofunctional monomers with a weight-average molecular weight of 500 or less. For example, the monofunctional monomer may be a monofunctional (meth)acrylate monomer. The resin composition RC of one example may contain a monofunctional (meth)acrylate monomer with a weight-average molecular weight of 500 or less as a monofunctional monomer. For example, the weight-average molecular weight of the monofunctional (meth)acrylate monomer may be between 100 and 500. The glass transition temperature (Tg) of the monofunctional (meth)acrylate monomer contained in the resin composition RC of one example may be less than 0°C.

[0136] In one example of the resin composition RC, the monofunctional (meth)acrylate monomer may include a first monomer, each having a weight-average molecular weight of 500 or less, and a second monomer different from the first monomer. The first monomer may have a hydroxyl group, and the second monomer may not have a hydroxyl group. In one example, the first monomer may be a hydroxyl group-containing monofunctional (meth)acrylate monomer. The second monomer may include at least one of an alicyclic monofunctional (meth)acrylate monomer and an alkyl monofunctional (meth)acrylate monomer. The resin composition RC in one example may contain both the first monomer and the second monomer. For example, the resin composition RC in one example may contain 4-hydroxybutyl acrylate as the first monomer, but the example is not limited to this. The resin composition RC in one example may contain two or more monofunctional monomers with different weight-average molecular weights as second monomers. For example, the resin composition RC of one example may contain two or more monomers selected from 2-ethylhexyl acrylate, 2-ethylhexyl diglycol acrylate, and tetrahydrofurfuryl acrylate as second monomers. Specifically, the resin composition RC of one example may contain any of 2-ethylhexyl acrylate, 2-ethylhexyl diglycol acrylate, and tetrahydrofurfuryl acrylate as second monomers, but the examples are not limited to these.

[0137] In one example, the glass transition temperature (Tg) of the monofunctional (meth)acrylate monomer contained in composition RC may be less than 0°C. The glass transition temperatures of the first monomer and the second monomer may each be less than 0°C.

[0138] The resin composition RC of one embodiment may contain monofunctional monomers in an amount of 80% to 97% by weight relative to the total weight of the resin composition. For example, the resin composition RC may contain monofunctional (meth)acrylate monomers in an amount of 80% to 97% by weight relative to 100% by weight of the resin composition. The content of monofunctional (meth)acrylate monomers contained in the resin composition RC may be the total content of the first monomer and the second monomer. In other words, the resin composition RC of one embodiment may contain a total content of the first monomer and the second monomer in an amount of 80% to 97% by weight relative to 100% by weight of the resin composition.

[0139] If the resin composition RC of one embodiment contains monofunctional (meth)acrylate monomers within the above-mentioned content range, the resin composition RC will satisfy the above-mentioned viscosity range at a temperature of 30°C and can be appropriately dispensed by inkjet printing or dispensing to be applied to a base substrate with a uniform thickness.

[0140] In one embodiment, the first monomer may be present in an amount of 20% or more by weight, or more than 0% but less than or equal to 20% by weight, relative to the total weight of the resin composition RC. For example, the first monomer may be present in an amount of 10% or more by weight and less than or equal to 20% by weight, based on 100% by weight of the resin composition.

[0141] In one embodiment, if the resin composition RC contains the first monomer within the specified content range, the internal cohesiveness and adhesion to glass of the cured resin are enhanced, thereby suppressing glass delamination. On the other hand, if the content of the first monomer in the resin composition RC exceeds 20% by weight, the internal cohesiveness of the cured resin composition RC increases, while the adhesion to glass decreases, potentially causing glass delamination. This is because, when there is an excessive amount of hydroxyl groups, which contribute to glass adhesion, they are incorporated into the cured resin by forming hydrogen bonds between the hydroxyl groups. Furthermore, if the resin composition RC does not contain the first monomer, the internal cohesiveness and adhesion to glass are greatly reduced, potentially causing glass delamination.

[0142] In one embodiment, if the resin composition RC has a surface tension of 25 mN / m or more and 30 mN / m or less, it can be applied uniformly to the base substrate without overflowing. If the surface tension of the resin composition RC exceeds 30 mN / m, it can be applied unevenly to the base substrate. On the other hand, if the surface tension of the resin composition RC is less than 25 mN / m, the resin composition RC will overflow to the base substrate.

[0143] The resin composition RC of one embodiment may contain a surfactant containing silicon (Si). In the resin composition RC of one embodiment, the surfactant may be a silicone-based surfactant. For example, the silicone-based surfactant may include at least one selected from BYK-1797 (polyether-modified foaming polysiloxane, manufactured by BYK Chemie) and BYK-378 (polyether-modified dimethylpolysiloxane, manufactured by BYK Chemie).

[0144] In the resin composition RC of one embodiment, the silicone-based surfactant may be included in an amount of 0.01% by weight or more and 0.5% by weight or less of the total weight of the resin composition. If the content of the silicone-based surfactant in the resin composition is less than 0.01% by weight, the pinning properties that suppress liquid movement will not be exhibited, and the resin composition may leak outside the base substrate. Furthermore, in the resin composition RC of one embodiment, if the content of the silicone-based surfactant exceeds 0.5% by weight, the surface tension of the resin composition may decrease, which may cause the resin composition to spread more when applied and overflow outside the base substrate.

[0145] The resin composition RC of one embodiment may contain a photopolymerization initiator. In one embodiment, the photopolymerization initiator may be a radical polymerization initiator. The resin composition RC of one embodiment may contain one type of photopolymerization initiator, or two or more different photopolymerization initiators. If the resin composition RC contains multiple photopolymerization initiators, the different photopolymerization initiators may be activated by ultraviolet light with different central wavelengths. The resin composition RC of one embodiment may contain about 0.01% to 5% by weight of the photopolymerization initiator based on the total weight of the resin composition, but the content of the photopolymerization initiator contained in the resin composition is not limited to this.

[0146] For example, the resin composition RC of one example may contain phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide as a photopolymerization initiator, but the examples are not limited to this.

[0147] On the other hand, the resin composition of one example may contain known photopolymerization initiators. For example, the photopolymerization initiator may be at least one of 2,2-dimethoxy-1,2-diphenylethane-1-one, 1-hydroxy-cyclohexyl-phenyl ketone, 2-hydroxy-2-methyl-1-phenyl-1-propanone, 2-hydroxy-1-[4-(2-hydroxyethoxy)phenyl]-2-methyl-1-propanone, and 2-hydroxy-1-{4-[4-(2-hydroxy-2-methyl-propionyl)-benzyl]phenyl}-2-methylpropan-1-one.

[0148] Furthermore, the photopolymerization initiator may be at least one of 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1, 2-dimethylamino-2-(4-methyl-benzyl)-1-(4-morpholin-4-yl-phenyl)-butan-1-one, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, [1-(4-phenylsulfanylbenzoyl)heptylideneamino]benzoate, [1-[9-ethyl-6-(2-methylbenzoyl)carbazole-3-yl]ethylideneamino]acetate, and bis(2,4-cyclopentadienyl)bis[2,6-difluoro-3-(1-pyryl)phenyl]titanium(IV).

[0149] The resin composition RC of one embodiment may be solvent-free. The resin composition RC may be free of volatile organic solvents. The resin composition RC of one embodiment may be provided in a solvent-free form. The solvent-free type of resin composition RC may have improved ejection properties when provided by an inkjet head or dispensing method. Furthermore, in the process of manufacturing adhesive member AP, using the solvent-free type of resin composition RC may improve process efficiency because, unlike resin compositions containing volatile organic solvents, heating steps to dry the volatile organic solvents can be omitted. The resin composition RC of one embodiment is solvent-free and may have a viscosity of 15 mPa·s to 20 mPa·s, making it suitable for application by inkjet printing or the like.

[0150] The resin composition RC of one embodiment may have a surface tension of 25 mN / m to 30 mN / m. As a result, the resin composition RC of one embodiment can spread to the coating surface with sufficient wettability to cover even the edge portion of the base substrate, and at the same time, the fluidity of the droplets can be controlled so that the shape of the coating is maintained without the resin composition RC overflowing onto the outside of the base substrate.

[0151] Referring to Figure 6, in one embodiment, when the surface tension of the droplet of the resin composition RC is 25 mN / m or more and 30 mN / m or less, the contact angle θ of the droplet with respect to the lower film SUB is IN The contact angle θ can be between 10° and 20°. IN This can correspond to the contact angle 2 seconds after the resin composition RC is provided on the lower film SUB. In one embodiment, the resin composition RC has a contact angle θ of 10° to 20° with respect to the lower film SUB. IN It can maintain the shape of a droplet while possessing certain properties.

[0152] In one embodiment, the lower film SUB may be polyethylene terephthalate (PET). That is, the resin composition RC of one embodiment has a surface tension of 25 mN / m or more and 30 mN / m or less for droplets on polyethylene terephthalate (PET), and the contact angle θ of the droplets on polyethylene terephthalate (PET)IN The angle can be between 10° and 20°. In one embodiment, the upper surface of the display module DM (Figure 5a) provided with the resin composition RC may be polyethylene terephthalate PET.

[0153] The resin composition RC of one embodiment, due to its surface tension properties, provides a pinning effect that controls the flow of droplets so that the applied resin composition RC does not overflow outside the base substrate, and can be attached to the surface without floating, even at edges, thus exhibiting excellent adhesive properties.

[0154] In other words, when the resin composition RC of one embodiment is applied to a base substrate, the surface tension is adjusted to have a predetermined range of contact angles, thereby limiting the fluidity of the droplets and allowing for easy control of the application range of the resin composition RC.

[0155] After applying the resin composition RC, ultraviolet light is applied to the resin composition RC. This allows the resin composition RC to be photocured and formed into the adhesive member AP.

[0156] The step of providing ultraviolet light to the resin composition RC may be carried out by providing the resin composition RC to the upper surface of the display module DM and then directly irradiating the resin composition RC with ultraviolet light. Alternatively, the step of providing ultraviolet light to the resin composition RC may be carried out by providing the resin composition RC on the display module DM, placing the window WP on the coated resin composition RC, and then irradiating the window WP with ultraviolet light through its upper surface.

[0157] Alternatively, the process can be carried out by applying the resin composition RC to the underside of the window WP and directly irradiating the resin composition RC applied to the underside of the window WP with ultraviolet light. In this case, the display module DM can be bonded to the resin composition RC after it has been cured by irradiation with ultraviolet light.

[0158] If the resin composition RC is photocured before the window WP is placed, ultraviolet light is applied to form it on the adhesive member AP, and then the window WP is placed. Next, pressure PR is applied on the window WP to laminate the display module DM and the window WP with the adhesive member AP in between.

[0159] Furthermore, even when the adhesive member AP is formed by irradiating ultraviolet light through the upper surface of the window WP after it has been positioned, applying pressure PR on the window WP allows the display module DM and the window WP to be bonded together while the adhesive member AP has a uniform thickness.

[0160] Referring to Figure 5b, after bonding, the adhesive member AP can be positioned to fully cover one side of the display module DM. In the case of the display device of one embodiment, which includes the adhesive member AP made of the resin composition RC of one embodiment, the phenomenon of the interface between the adhesive member AP and the adjacent member lifting can be minimized by the adhesive member AP having a uniform thickness up to the edge portion. Therefore, the display device of one embodiment, which includes the adhesive member AP made of the resin composition RC of one embodiment, can exhibit excellent reliability characteristics.

[0161] Figure 7 is a cross-sectional view showing a display device DD-a according to another embodiment of the present invention. In the following description of the display device for the example shown in Figure 7, we will not repeat any information that has been explained with reference to Figures 1a to 6, and will focus on the differences.

[0162] Compared to the display device DD described with reference to Figures 2 and 3, the display device DD-a shown in Figure 7 may further include a light control layer PP and an optical adhesive layer AP-a. In one embodiment, the display device DD-a may further include a light control layer PP disposed between the adhesive member AP and the window WP, and an optical adhesive layer AP-a disposed between the light control layer PP and the window WP. The light control layer PP may include a polarizing plate or a color filter layer.

[0163] The optical adhesive layer AP-a may contain a polymer derived from the resin composition RC of one embodiment (Figure 5a). The optical adhesive layer AP-a may consist of the resin composition RC of one embodiment. The optical adhesive layer AP-a consisting of the resin composition RC of one embodiment may have a storage modulus of 0.01 MPa or more and 0.1 MPa or less at 25°C. The optical adhesive layer AP-a may have a 180° peel force of 800 gf / 25 mm or more to at least one of the glass substrate and polymer substrate at 25°C. The optical adhesive layer AP-a containing a polymer derived from the resin composition RC of one embodiment (Figures 5a and 6a) may exhibit excellent flexibility and excellent adhesive reliability.

[0164] Figure 8 is a cross-sectional view showing a display device DD-b according to another embodiment of the present invention. In the following description of the display device for the display area DD-b of one embodiment shown in Figure 8, we will not repeat any information that overlaps with the information described above with reference to Figures 1 to 7, and will focus on the differences.

[0165] Compared to the display device DD described with reference to Figures 2 and 3, the display device DD-b of one embodiment shown in Figure 8 may further include a light control layer PP, an optical adhesive layer AP-a, and an interlayer adhesive layer PIB. The display device DD-b of one embodiment shown in Figure 8 may further include a light control layer PP disposed between the adhesive member AP and the window WP, and an optical adhesive layer AP-a disposed between the light control layer PP and the window WP, as shown in the display device DD-a of one embodiment shown in Figure 7.

[0166] In one embodiment of the display device DD-b, the adhesive member AP may be provided between the display panel DP and the input sensing unit TP. That is, the input sensing unit TP is not directly placed on the display panel DP, but rather the display panel DP and the input sensing unit TP can be bonded to each other by the adhesive member AP. For example, the adhesive member AP may be placed between the sealing layer TFE (Figure 3) of the display panel DP and the input sensing unit TP.

[0167] An interlayer adhesive layer PIB may be provided beneath the light control layer PP. The interlayer adhesive layer PIB is positioned between the input sensing unit TP and the light control layer PP and may consist of an adhesive material with excellent moisture-proof properties. For example, the interlayer adhesive layer PIB may be formed containing polyisobutylene. The interlayer adhesive layer PIB is positioned above the input sensing unit TP and can prevent corrosion of the sensing electrode of the input sensing unit TP. A display device DD-b of one embodiment includes an optical adhesive layer AP-a and an adhesive member AP made of the resin composition RC (Figure 5a) according to one embodiment, and the display device DD-b including the optical adhesive layer AP-a and the adhesive member AP may exhibit excellent reliability.

[0168] The following describes in detail a resin composition according to one embodiment of the present invention and an adhesive member made from the resin composition, with reference to examples and comparative examples. Furthermore, the following examples are illustrative to aid in understanding the present invention, and the scope of the present invention is not limited thereto. [Examples]

[0169] 1. Manufacturing of resin compositions Table 1 shows the composition and content of the resin compositions of the examples and comparative examples. The resin compositions of the examples and comparative examples were prepared by weighing the materials listed in Table 1 into light-shielding polyethylene containers according to the weights (g, gram) listed in Table 1, and stirring them at 1000 rpm for 30 minutes using a rotational stirring defoaming apparatus (manufactured by SHASHIN KAGAKU Co., Ltd.).

[0170] [Table 1]

[0171] The compounds used in Table 1 are as follows:

[0172] <Oligomer> UF-C051: Urethane acrylate (Tg=-43℃) (Product of Kyoeisha Chemical Co., Ltd.) UV-3300B: Urethane acrylate (Tg=-30℃) (Manufactured by Mitsubishi Chemical Holdings) CN-371NS: Amine-modified (meth)acrylate oligomer (manufactured by Sartomer) UV-3700B: Urethane acrylate (Tg=-6℃) (Manufactured by Mitsubishi Chemical Holdings)

[0173] <Monofunctional monomers> 2-EHA: 2-Ethylhexyl acrylate (Toagosei Co., Ltd. product), Tg = -80℃ IBXA: Isovonyl acrylate (product of Osaka Organic Chemical Industry Ltd.), Tg=97℃ 4-HBA-LT: 4-Hydroxybutyl acrylate (product of Osaka Organic Chemical Industry Ltd.), Tg = -40℃ SYA-4:10-hydroxydecylacrylate (Sumitomo Chemical), Tg=-55℃ IDAA: Isodecyl acrylate (product of Osaka Organic Chemical Industry Ltd.), Tg = -43℃ EHDG-AK: 2-Ethylhexyl diglycol acrylate (product of Kyoeisha Chemical Co., Ltd.), Tg = -70℃ THF-A: Tetrahydrofurfuryl acrylate (product of Kyoeisha Chemical Co., Ltd.), Tg = -12℃

[0174] <Polyfunctional monomers> Viscoat #195: 1,4-Butanediol diacrylate (product of Osaka Organic Chemical Industry Ltd.)

[0175] <Photopolymerization initiator> Omnirad 819: Phenylbis(2,4,6-trimethylbenzoyl)-phosphine oxide (manufactured by IGM Resins) Omnirad TPO-H:2,4,6-trimethylbenzoyl-diphenylphosphine oxide (manufactured by IGM Resins)

[0176] <Surfactants> BYK-1797: Polyether-modified foamed polysiloxane (manufactured by BYK Chemie) BYK-378: Polyether-modified dimethylpolysiloxane (manufactured by BYK Chemie) ACS-380: Acrylic-vinyl copolymer (product of Kyoeisha Chemical Co., Ltd.) BYK-UV3500: Polyether-modified acryloyl group-containing polydimethylsiloxane (manufactured by BYK Chemie)

[0177] Table 2 below shows the properties of the resin composition and the physical properties of the adhesive member formed by the curing of the resin composition. The evaluation method for each property is as follows.

[0178] <Viscosity Measurement> In Table 2, the viscosity of the resin composition was measured according to the JIS K2283 method using a viscometer TVE-25L (product of TOKI SANGYO Co. Ltd.) at a speed of 50 rpm and a temperature of 30°C.

[0179] <Evaluation of inkjet surfaces> After bonding an adhesive PET film to a glass plate, the resin compositions of the examples and comparative examples were applied to the PET film using a MICROJET inkjet printer at a head temperature of 30°C. Next, the applied resin compositions were irradiated with ultraviolet light, and the appearance of the cured film was observed. In Table 2 below, "◎" indicates that there was no leakage or thickness deviation of the applied resin composition, and "X" indicates that ejection was not possible (failure to eject).

[0180] <Measurement of Storage Modulus> A molded PET film (FANUC Corp., NP1000A) and a silicone rubber sheet with an 8mm diameter hole (Tigers Polymer Corp.) were sequentially laminated onto a glass slide (Matsunami Glass Ind., Ltd., S1112). 28 μL each of the resin compositions of the example and comparative example were dropped into the hole of the silicone rubber sheet. The dropped resin compositions of the example and comparative example were cured by irradiating them with ultraviolet light using a UV LED lamp with peaks at 405 nm and 365 nm, so that the total light intensity provided was 4000 mJ / cm2. This resulted in obtaining measurement specimens with a diameter of 8 mm and a thickness of 500 μm. The storage modulus at 25°C after curing of the resin compositions, which were measurement specimens prepared using a dynamic viscoelasticity analyzer (Anton Paar, MCR302), was measured. The storage modulus was measured at a frequency of 1 Hz and under conditions of a temperature rise rate of 2°C / min from -50°C to 80°C.

[0181] <Evaluation of appearance after cover glass bonding> The resin compositions of the examples and comparative examples were coated onto a PET film to a thickness of 50 μm using an inkjet printer. Next, the resin compositions of the examples and comparative examples were cured by irradiating them with ultraviolet light using a UV LED lamp with peaks at 405 nm and 365 nm so that the light intensity provided was 1000 mJ / cm2. Soda-lime glass (30 μm thick) was bonded onto the cured resin composition and processed for 5 minutes at 30°C and 0.5 MPa using an automatic heat and pressure processing device (Chiyoda Electric Co., Ltd. product, product name "ACS-230"). The resulting laminate was irradiated with ultraviolet light using a UV LED lamp with peaks at 405 nm and 365 nm so that the integrated light intensity through the glass totaled 4000 mJ / cm2, and the appearance of the laminate was observed with an optical microscope. In Table 2 below, "◎" indicates that there is no leakage of the resin composition or cured resin composition outside the substrate (PET) and no lifting of the cover glass.

[0182] <Measurement of peel strength> The peel strength was measured using the laminate used for the appearance evaluation after bonding the cover glass as a test specimen. The peel strength was measured using a tensile testing machine (Instron, model 5965) at a speed of 300 mm / min with a peel angle of 180°. After measuring the peel strength three times at 25°C, the average value of approximately 50 mm peels was calculated, and the obtained value was multiplied by 1.25 to record the peel force for a width of 25 mm in Table 2.

[0183] <Measuring surface tension> The surface tension of the resin compositions of the examples and comparative examples was measured using the pendant drop method with a Drop Master DMo-601 contact angle meter from Kyowa Interface Science Co., Ltd.

[0184] [Table 2]

[0185] Referring to the evaluation results of the examples and comparative examples in Table 2, the resin compositions of the examples have a viscosity of 5 mPa·s to 40 mPa·s at 30°C, exhibiting excellent coating properties that allow for uniform thickness coating using the inkjet printing method. Furthermore, while the storage modulus of Examples 1 to 3 is 0.01 MPa to less than 0.1 MPa at 25°C, the peel strength is 800 gf / 25 mm or more, so peeling and breakage do not occur during bending, exhibiting excellent properties applicable to flexible displays. In addition, since the resin compositions of the examples have a viscosity of 25 mN / m to 30 mN / m, they can exhibit the characteristic of a droplet contact angle of 0° to 20° on PET. As a result, the resin compositions of the examples exhibit sufficient wettability to the coated surface and spread to the edges of the coated surface, but form a shape in which the resin composition does not overflow to the outside of the substrate.

[0186] In contrast, the resin composition of Comparative Example 1 had a urethane (meth)acrylate content exceeding 10% by weight, resulting in high viscosity and causing defects when ejected by an inkjet printer. In Comparative Example 2, the content of the silicone-based surfactant exceeded 0.5% by weight, resulting in a surface tension of less than 25 mN / m. Consequently, Comparative Example 2 showed that the low surface tension caused the applied resin composition to overflow and contaminate the substrate, resulting in a higher storage modulus and significantly reduced peel strength compared to the Examples.

[0187] In Comparative Example 3, because it does not contain a silicone-based surfactant and its flowability is not restricted at the edges, the resin composition overflows and contaminates the substrate beyond its surface.

[0188] In Comparative Example 4, the resin composition contained an excessively high amount of the primary monomer having a hydroxyl group, resulting in increased internal cohesiveness and a higher storage modulus. Consequently, the PET and the cover glass were not bonded by the cured resin composition during bonding. Furthermore, the surfactant contained in the resin composition of Comparative Example 4 contained an acrylic group, which prevented it from exhibiting pinning properties, causing the resin composition to overflow and contaminate the outside of the substrate (PET film).

[0189] Comparative Examples 5 and 6 each contained 40% by weight or more of a primary monomer having a hydroxyl group in the resin composition, exhibiting high surface tension, resulting in unevenness and non-uniform thickness when the resin composition was applied. Furthermore, Comparative Example 5 did not contain a silicone-based surfactant, and the resin composition overflowed beyond the substrate (PET film), resulting in surface unevenness. In the case of Comparative Example 6, despite containing a silicone-based surfactant, the high surface tension reduced the wettability of the resin composition to the substrate, resulting in areas where the resin composition was not applied to the substrate, and thus causing surface unevenness.

[0190] Comparative Example 7 contained 21% by weight of a first monomer having a hydroxyl group in the resin composition, which increased the internal cohesive force of the cured resin product, but reduced the glass adhesion force, resulting in peeling of the cover glass.

[0191] Comparative Example 8 lacked a first monomer having a hydroxyl group in its resin composition, resulting in a significant decrease in adhesion to the glass and causing the cover glass to peel off.

[0192] In one embodiment, the display device may include an adhesive member between the display panel and the window. The adhesive resin may be formed by photocuring the resin composition of the embodiment. The resin composition of the embodiment contains urethane (meth)acrylate, monofunctional (meth)acrylate monomer, and silicone-based surfactant in specific content ranges, but the monofunctional (meth)acrylate monomer may include a first monomer having a hydroxyl group and being present in an amount greater than 0 and less than 20% by weight of the total weight of the resin composition, and a second monomer different from the first monomer. As a result, the resin composition of the embodiment may exhibit excellent coating properties on the substrate to which it is applied, and may spread with sufficient wettability to the edge portion of the substrate by the pinning effect without overflowing to the outside of the substrate.

[0193] Furthermore, the display device of one embodiment, by including an adhesive member made of a resin composition, can exhibit excellent bonding characteristics even at the edges of the adhesive member and adjacent members, and can demonstrate excellent adhesive reliability and flexibility.

[0194] Although preferred embodiments of the present invention have been described so far with reference, a person skilled in the art or with ordinary knowledge in the art will understand that the present invention can be modified and altered in various ways without departing from the spirit and technical domain of the invention as described in the claims below.

[0195] Therefore, the technical scope of the present invention is not limited to what is described in the detailed description of the specification, but should be determined by the claims. [Explanation of Symbols]

[0196] DD: Display device DM: Display module WP: Window RC: Resin composition AP: Adhesive material

Claims

1. With respect to the total weight of the resin composition, A urethane (meth)acrylate having two (meth)acrylic groups in one molecule and a weight-average molecular weight of 10,000 to 40,000, in an amount of 1% to 10% by weight, Monofunctional (meth)acrylate monomers with a weight-average molecular weight of 500 or less, comprising 80% to 97% by weight, It contains a silicone-based surfactant in an amount of 0.01% to 0.5% by weight, The aforementioned monofunctional (meth)acrylate monomer is A resin composition comprising a first monomer having a hydroxyl group, contained in an amount greater than 0 and less than 20% by weight relative to the total weight of the resin composition, and a second monomer different from the first monomer.

2. The resin composition according to claim 1, wherein the surface tension of the droplet is 25 mN / m or more and 30 mN / m or less.

3. The resin composition according to claim 1, wherein the first monomer is contained in an amount of 10% by weight or more and 20% by weight or less based on the total weight of the resin composition.

4. The resin composition according to claim 1, which is solvent-free.

5. The resin composition according to claim 1, wherein the viscosity at 30°C is 5 mPa·s or more and 20 mPa·s or less.

6. The resin composition according to claim 1, wherein the urethane (meth)acrylate and the monofunctional (meth)acrylate monomer each have a glass transition temperature of less than 0°C.

7. The resin composition according to claim 1, wherein the first monomer comprises 4-hydroxybutyl acrylate.

8. The resin composition according to claim 1, wherein the second monomer comprises at least one of 2-ethylhexyl acrylate, 2-ethylhexyl diglycol acrylate, and tetrahydrofurfuryl acrylate.

9. The resin composition according to claim 1, further comprising a photopolymerization initiator.

10. The resin composition according to claim 1, provided by an inkjet printing method or a dispensing method.

11. Display module and, A window placed on the aforementioned display module, Displaced between the display module and the window, and including an adhesive member made of a resin composition, The aforementioned resin composition, With respect to the total weight of the resin composition, A urethane (meth)acrylate having two (meth)acrylic groups in one molecule and a weight-average molecular weight of 10,000 to 40,000, in an amount of 1% to 10% by weight, Monofunctional (meth)acrylate monomers with a weight-average molecular weight of 500 or less, comprising 80% to 97% by weight, It contains a silicone-based surfactant in an amount of 0.01% to 0.5% by weight, The aforementioned monofunctional (meth)acrylate monomer is A display device comprising a first monomer having a hydroxyl group, contained in an amount greater than 0% but less than 20% by weight relative to the total weight of the resin composition, and a second monomer different from the first monomer.

12. The display device according to claim 11, wherein the first monomer comprises 4-hydroxybutyl acrylate.

13. The display device according to claim 11, wherein the second monomer comprises at least one of 4-ethylhexyl acrylate, 2-ethylhexyl diglycol acrylate, and tetrahydrofurfuryl acrylate.

14. The display device according to claim 11, wherein the storage modulus of the adhesive member at 25°C is 0.01 MPa or more and 0.1 MPa or less.

15. The display device according to claim 11, wherein the adhesive member has an adhesive strength of 800 gf / 25 mm or more to a glass substrate or polyethylene terephthalate (PET) film at 25°C.

16. The lower surface of the window module adjacent to the adhesive member is glass. The upper surface of the display module adjacent to the adhesive member is made of polyethylene terephthalate (PET). The display device according to claim 11, wherein the resin composition has a surface tension of 25 mN / m or more and 30 mN / m or less for the droplets on polyethylene terephthalate (PET).

17. The display device according to claim 11, wherein the display module is foldable with respect to at least one folding axis.

18. The present invention further includes a light control layer disposed between the adhesive member and the window, and an optical adhesive layer disposed between the light control layer and the window, The display device according to claim 11, wherein the optical adhesive layer comprises a polymer derived from the resin composition.

19. The display device includes at least one adhesive member made of a resin composition, which is placed between adjacent members. The aforementioned resin composition is, in relation to the total weight of the resin composition, A urethane (meth)acrylate having two (meth)acrylic groups in one molecule and a weight-average molecular weight of 10,000 to 40,000, in an amount of 1% to 10% by weight, Monofunctional (meth)acrylate monomers with a weight-average molecular weight of 500 or less, comprising 80% to 97% by weight, It contains a silicone-based surfactant in an amount of 0.01% to 0.5% by weight, The aforementioned monofunctional (meth)acrylate monomer is An electronic device comprising a first monomer having a hydroxyl group, contained in an amount greater than 0 and less than 20% by weight relative to the total weight of the resin composition, and a second monomer different from the first monomer.

20. The electronic device according to claim 19, wherein the display device is a vehicle display device, television, monitor, game console, tablet, mobile phone, camera, laptop computer, personal information terminal, or billboard.

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