Photoelectric mixed galvanizing system

Abstract

To provide an optical-electric mixed-signal device having an optical connection structure with high connectivity reliability. [Solution] This optical-electric mixed-signal device comprises a wiring board, an optical integrated circuit disposed on the upper surface of the wiring board, an optical connection waveguide member disposed on the upper surface of the wiring board, and a holding member that holds the optical integrated circuit and the optical connection waveguide member, wherein the holding member is fixed to the upper surface of the wiring board.

Description

Technical Field

[0001] The present invention relates to an optoelectronic hybrid device.

Background Art

[0002] In a data center or the like where various devices such as computers and data communication devices are installed, an optical connection structure for connecting an optical integrated circuit and other components may be used. As an example of such an optical connection structure, there is a structure in which an optical connection waveguide member such as a planar optical waveguide is adhesively fixed to the end face of the input / output waveguide of an optical integrated circuit, and the two are optically connected (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the above-described optical connection structure, since the optical integrated circuit and the optical connection waveguide member are adhesively fixed with a small adhesive area, the adhesive strength between the two is weak. Therefore, when stress is applied to the connection portion between the optical integrated circuit and the optical connection waveguide member, there is a risk of breakage between the optical integrated circuit and the optical connection waveguide member, and the connection reliability cannot be said to be high.

[0005] The present invention has been made in view of the above points, and an object thereof is to provide an optoelectronic hybrid device having an optical connection structure with high connection reliability.

Means for Solving the Problems

[0006] This optical-electric mixed-signal device comprises a wiring board, an optical integrated circuit disposed on the upper surface of the wiring board, an optical connection waveguide member disposed on the upper surface of the wiring board, and a holding member that holds the optical integrated circuit and the optical connection waveguide member, wherein the holding member is fixed to the upper surface of the wiring board. [Effects of the Invention]

[0007] According to the disclosed technology, it is possible to provide an optoelectronic hybrid device having an optical connection structure with high connectivity reliability. [Brief explanation of the drawing]

[0008] [Figure 1] This is a cross-sectional view illustrating a photoelectric mixed-signal device according to the first embodiment. [Figure 2] This is a perspective view illustrating a retaining member according to the first embodiment. [Figure 3] This is a cross-sectional view illustrating a method for manufacturing a photoelectric mixed-signal device according to the first embodiment. [Figure 4] This is a cross-sectional view showing an example of use of the photoelectric mixed-loading device according to the first embodiment. [Figure 5] This is a cross-sectional view illustrating a photoelectric mixed-loading device according to Modification 1 of the First Embodiment. [Figure 6] This is a perspective view illustrating a retaining member according to a modified example 1 of the first embodiment. [Figure 7] This is a cross-sectional view illustrating a method for manufacturing a photoelectric mixed-signal device according to a modified example 1 of the first embodiment. [Figure 8] This is a cross-sectional view illustrating a photoelectric mixed-loading device according to a modified example 2 of the first embodiment. [Figure 9] This is a perspective view illustrating a retaining member according to a modified example 2 of the first embodiment. [Modes for carrying out the invention]

[0009] The embodiments for carrying out the invention will be described below with reference to the drawings. In each drawing, the same reference numerals are used for identical components, and redundant explanations may be omitted.

[0010] <First Embodiment> Figure 1 is a cross-sectional view illustrating an optoelectronic mixed-signal device according to the first embodiment. Referring to Figure 1, the optoelectronic mixed-signal device 1 includes a wiring board 10, an optical integrated circuit 20, an optical connection waveguide member 30, a semiconductor device 50, and a holding member 70.

[0011] The wiring board 10 is, for example, rectangular in shape when viewed from above. The wiring board 10 is a substrate on which wiring made of copper or the like is formed, for example, on a resin substrate such as a glass epoxy substrate. The wiring board 10 may also be a multilayer wiring board.

[0012] The photonic integrated circuit (PIC) 20 is located on the upper surface of the wiring board 10. The photonic integrated circuit 20 is, for example, flip-chip mounted face-down on the upper surface of the wiring board 10.

[0013] The optical integrated circuit 20 is, for example, an optical waveguide, a light-emitting element, a light-receiving element, etc., provided on a substrate such as silicon. The optical integrated circuit 20 is sometimes referred to as silicon photonics. The optical integrated circuit 20 may have the function of converting an optical signal input from a fiber array, etc., located outside the optoelectronic mixed-signal device 1 via an optical connection waveguide member 30 into an electrical signal and outputting it to a semiconductor device 50. The optical integrated circuit 20 may also have the function of converting an electrical signal input from the semiconductor device 50 into an optical signal and outputting it via an optical connection waveguide member 30 to a fiber array, etc., located outside the optoelectronic mixed-signal device 1. The optical integrated circuit 20 may have both of these functions.

[0014] The optical connection waveguide member 30 is disposed on the upper surface of the wiring board 10. The optical connection waveguide member 30 is disposed adjacent to the optical integrated circuit 20 and is optically connected to the optical integrated circuit 20. The end face of the optical connection waveguide member 30 is exposed on the end face of the wiring board 10 and can be optically connected to a fiber array or the like located outside the optoelectronic hybrid device 1. The optical connection waveguide member 30 is, for example, a planar lightwave circuit (PLC). The optical connection waveguide member 30 may be a silicon waveguide, a silicon nitride waveguide, a glass waveguide, a polymer waveguide, or the like.

[0015] The semiconductor device 50 is mounted on the lower surface of the wiring board 10. The semiconductor device 50 is, for example, flip-chip mounted in a face-down state on the lower surface of the wiring board 10. The semiconductor device 50 may be mounted in a face-up state on the lower surface of the wiring board 10 and connected to the wiring of the wiring board 10 by bonding wires or the like. The semiconductor device 50 is electrically connected to the optical integrated circuit 20 via the wiring of the wiring board 10. The semiconductor device 50 may be mounted on the upper surface of the wiring board 10.

[0016] The semiconductor device 50 is, for example, a semiconductor chip. The semiconductor device 50 may be a semiconductor package in which an insulating layer and rewiring are formed on the semiconductor chip. In addition to the semiconductor device 50, passive elements such as capacitors, inductors, and resistors may be mounted on the wiring board 10.

[0017] The semiconductor device 50 may have a function of amplifying an electrical signal input from the optical integrated circuit 20. The electrical signal input from the optical integrated circuit 20 is high-speed and easily attenuated. Therefore, by connecting the optical integrated circuit 20 and the semiconductor device 50 with a short wiring and amplifying the electrical signal that is being attenuated with the semiconductor device 50, the quality of the electrical signal output from the semiconductor device 50 can be improved. When the semiconductor device 50 is mounted on the lower surface of the wiring board 10, it is preferably arranged so that the optical integrated circuit 20 and the semiconductor device 50 overlap in a plan view. Thereby, the optical integrated circuit 20 and the semiconductor device 50 can be connected by a through-wiring penetrating the wiring board 10 in a short path.

[0018] The holding member 70 holds the optical integrated circuit 20 and the optical connection waveguide member 30 in a mutually positioned state. The holding member 70 is fixed to the upper surface of the wiring board 10. The holding member 70 can be composed of, for example, glass or metal.

[0019] FIG. 2 is a perspective view illustrating the holding member according to the first embodiment. As shown in FIG. 2, the holding member 70 has a recess 71 and a recess 72. The holding member 70 has a first surface 70m and a second surface 70n, and the recesses 71 and 72 open to the first surface 70m side. The depth of each recess can be appropriately determined in consideration of the height of the components to be arranged. When mounting the components fixed in the recesses on the wiring board 10 with solder balls or the like, the depth of each recess is determined in consideration of the height of the solder balls or the like.

[0020] Returning to FIG. 1, the optical integrated circuit 20 is fixed to the recess 71, and the optical connection waveguide member 30 is fixed to the recess 72. For fixing the optical integrated circuit 20 and the optical connection waveguide member 30 to the holding member 70, any adhesive can be used, but it is preferable to use an ultraviolet curable and low shrinkage adhesive. When using an adhesive with a high shrinkage rate, the positional relationship between the optical integrated circuit 20 and the optical connection waveguide member 30 is likely to change due to shrinkage by heat when heated and cured.

[0021] For example, the holding member 70 preferably has a transmittance of 80% or more to ultraviolet light. This allows ultraviolet light to be irradiated onto the ultraviolet-curable adhesive from various directions via the holding member 70, making it easy to cure the ultraviolet-curable adhesive. Examples of materials with a transmittance of 80% or more to ultraviolet light include glass.

[0022] From another perspective, the holding member 70 is preferably made of a metal material with heat-dissipating properties. This allows heat to be released through the holding member 70. For example, when a light source is mounted on the optical integrated circuit 20, the amount of heat generated increases, so a structure that allows heat to be dissipated from the vicinity of the optical integrated circuit 20 is preferable, and materials such as aluminum, copper, stainless steel, or alloys thereof can be used.

[0023] It is preferable that a through hole 71x is provided within the recess 71 of the retaining member 70. If the optical integrated circuit 20 has alignment marks on its upper surface, the optical integrated circuit 20 can be fixed to the retaining member 70 such that the alignment marks are located within the through hole 71x in a plan view. This allows the retaining member 70 to be accurately positioned at a predetermined location on the upper surface of the wiring board 10 using the alignment marks while the optical integrated circuit 20 and the optical connection waveguide member 30 are held in place.

[0024] Figure 3 is a cross-sectional view illustrating a method for manufacturing an optical-electric combined-signal device according to the first embodiment. To manufacture the optical-electric combined-signal device 1, first, the optical integrated circuit 20 and the optical connection waveguide member 30 are held by a holding member 70. Specifically, first, an uncured UV-curing adhesive is applied to the inside of the recesses 71 and 72 of the holding member 70. Then, the optical connection waveguide member 30 is placed in the recess 72. After that, the optical integrated circuit 20 is mounted in the recess 71 and connected to the optical connection waveguide member 30 by active alignment, thereby enabling the optical integrated circuit 20 and the optical connection waveguide member 30 to transmit and receive optical signals. In this state, the uncured UV-curing adhesive is irradiated with ultraviolet light to cure it. The holding member 70 can be manufactured, for example, by cutting a glass plate or a metal plate. As mentioned above, when using a UV-curing adhesive, it is preferable that the holding member 70 is made of glass. It is also possible to mount everything by passive alignment.

[0025] Next, a wiring board 10 with a semiconductor device 50 mounted on its lower surface is prepared, and a retaining member 70 for holding the optical integrated circuit 20 and the optical connection waveguide member 30 is fixed to the upper surface of the wiring board 10. Specifically, for example, an uncured ultraviolet-curing adhesive is applied to the first surface 70m of the retaining member 70. Then, it is placed in a predetermined position on the upper surface of the wiring board 10. If the optical integrated circuit 20 has alignment marks on its upper surface, the retaining member 70 can be accurately placed in a predetermined position on the upper surface of the wiring board 10 by recognizing the alignment marks located in the through-holes 71x with the mounting machine. When placing the retaining member 70 on the upper surface of the wiring board 10, electrical wiring between the optical integrated circuit 20 and the wiring board 10 is performed by reflow or the like. After that, ultraviolet light is irradiated onto the uncured ultraviolet-curing adhesive to cure it. This completes the photoelectric mixed-signal device 1.

[0026] Alternatively, the optical integrated circuit 20 and the optical connection waveguide member 30 may be fixed in place at a predetermined position on the upper surface of the wiring board 10. In this case as well, for example, active alignment is performed to adjust the relative positions of the optical integrated circuit 20 and the optical connection waveguide member 30, so that the optical integrated circuit 20 and the optical connection waveguide member 30 are in a state where optical signals can be transmitted and received.

[0027] Subsequently, an uncured UV-curing adhesive is applied to the inside of the recesses 71 and 72 of the holding member 70, and to the first surface 70m of the holding member 70. Then, the holding member 70 is placed on the upper surface of the wiring board 10 such that the optical integrated circuit 20 is located in the recess 71 and the optical connection waveguide member 30 is located in the recess 72. After that, the uncured UV-curing adhesive is irradiated with ultraviolet light to cure it. This completes the photoelectric mixed-signal device 1.

[0028] Thus, in the optical-electric mixed-signal device 1, the optical integrated circuit 20 and the optical connection waveguide member 30 are held by the holding member 70 in a state where optical signals can be transmitted and received, and the holding member 70 is fixed to the upper surface of the wiring board 10. As a result, stress is less likely to concentrate at the connection portion between the optical integrated circuit 20 and the optical connection waveguide member 30, thereby reducing the risk of breakage at the connection portion between the optical integrated circuit 20 and the optical connection waveguide member 30. In other words, a highly reliable optical connection structure can be realized at the connection portion between the optical integrated circuit 20 and the optical connection waveguide member 30. Furthermore, by reducing stress concentration at the connection portion between the optical integrated circuit 20 and the optical connection waveguide member 30, the occurrence of optical loss can be reduced.

[0029] Figure 4 is a cross-sectional view showing an example of use of an optoelectronic mixed-signal device according to the first embodiment. In the example shown in Figure 4, a fiber array 40 is arranged adjacent to the optical connection waveguide member 30 of the optoelectronic mixed-signal device 1. The fiber array 40 comprises, for example, a support portion 41 and a plurality of optical fibers 42 supported by the support portion 41. The support portion 41 can be formed from, for example, glass or resin. Each optical fiber 42 constituting the fiber array 40 is optically connected to the optical connection waveguide member 30. Each optical fiber 42 constituting the fiber array 40 can transmit and receive optical signals with the optical integrated circuit 20 via the optical connection waveguide member 30. The opposing ends of each optical fiber 42 and the optical connection waveguide member 30 are joined together with, for example, an optical adhesive that has good transmittance to the wavelength of the optical signal transmitted and received between the optical fiber 42 and the optical connection waveguide member 30.

[0030] In this way, the fiber array 40 can be positioned adjacent to the optical connection waveguide member 30 of the photoelectric mixed-signal device 1. In the photoelectric mixed-signal device 1, the optical integrated circuit 20 and the optical connection waveguide member 30 are held by a holding member 70, and the holding member 70 is fixed to the upper surface of the wiring board 10. Heating is performed during fixing, such as with reflow soldering, but since the fiber array 40 is positioned after the heating is completed, the fiber array 40 is not heated. Therefore, it is possible to use a fiber array 40 with low heat resistance.

[0031] Furthermore, when mounting the optical-electric mixed-signal device 1 onto another wiring board, heating may occur during mounting. In this case, heating of the fiber array 40 can be avoided by placing the fiber array 40 after mounting the optical-electric mixed-signal device 1 onto the other wiring board. That is, when using a fiber array 40 with low heat resistance, it is preferable to place the fiber array 40 adjacent to the optical connection waveguide member 30 of the optical-electric mixed-signal device 1 after all heating processes have been completed.

[0032] <Variation 1 of the First Embodiment> Modification 1 of the first embodiment shows an example of an optoelectronic mixed-signal device having a holding member capable of holding a fiber array in addition to an optical integrated circuit and an optical connection waveguide member. In Modification 1 of the first embodiment, descriptions of components that are the same as those described in the previously described embodiment may be omitted.

[0033] Figure 5 is a cross-sectional view illustrating a modified example 1 of the first embodiment of the photoelectric combined integrator. Referring to Figure 5, the photoelectric combined integrator 1A differs from the photoelectric combined integrator 1 in that it has a fiber array 40 and has a holding member 70A instead of the holding member 70.

[0034] The structure of the fiber array 40 is the same as that shown in Figure 4. The fiber array 40 is located on the opposite side of the optical integrated circuit 20, with the optical connection waveguide member 30 in between. The optical connection waveguide member 30 is optically connected to both the optical integrated circuit 20 and the fiber array 40.

[0035] In other words, each optical fiber 42 constituting the fiber array 40 is optically connected to the optical connection waveguide member 30. Each optical fiber 42 constituting the fiber array 40 can transmit and receive optical signals with the optical integrated circuit 20 via the optical connection waveguide member 30. The opposing ends of each optical fiber 42 and the optical connection waveguide member 30 are joined together, for example, with an optical adhesive that has good transmittance for the wavelength of the optical signal transmitted and received between the optical fiber 42 and the optical connection waveguide member 30.

[0036] The holding member 70A holds the optical integrated circuit 20, the optical connection waveguide member 30, and the fiber array 40 in a relative position. The holding member 70A is fixed to the upper surface of the wiring board 10.

[0037] Figure 6 is a perspective view illustrating a retaining member according to Modification 1 of the First Embodiment. As shown in Figure 6, the retaining member 70A has recesses 71, 72A, and 73. The retaining member 70A has a first surface 70m and a second surface 70n, and recesses 71, 72A, and 73 open to the first surface 70m side. Recess 72A is longer in the longitudinal direction of the retaining member 70A than recess 72. This makes it easier to arrange the optical connection waveguide member 30. The depth of each recess can be appropriately determined considering the height of the component to be placed. When mounting the component fixed in the recess to the wiring board 10 with solder balls or the like, the depth of each recess should also be determined considering the height of the solder balls or the like.

[0038] Returning to Figure 5, the optical integrated circuit 20 is fixed in the recess 71, the optical connection waveguide member 30 is fixed in the recess 72A, and the fiber array 40 is fixed in the recess 73. Any adhesive can be used to fix the optical integrated circuit 20, the optical connection waveguide member 30, and the fiber array 40 to the holding member 70A, but it is preferable to use an ultraviolet-curing adhesive with low shrinkage. If an adhesive with a high shrinkage rate is used, the positional relationship between the optical integrated circuit 20, the optical connection waveguide member 30, and the fiber array 40 is likely to change due to shrinkage caused by heat during heating and curing.

[0039] The retaining member 70A, like the retaining member 70, can be formed from a material with high transmittance to ultraviolet light, such as glass. The retaining member 70A may also be formed from a heat-dissipating metal material such as aluminum, copper, stainless steel, or alloys thereof. It is preferable that the retaining member 70A, like the retaining member 70, has a through hole 71x within the recess 71.

[0040] Figure 7 is a cross-sectional view illustrating a method for manufacturing a photoelectric mixed-signal device according to Modification 1 of the First Embodiment. To manufacture the photoelectric mixed-signal device 1A, first, the optical integrated circuit 20, the optical connection waveguide member 30, and the fiber array 40 are held by a holding member 70A. Specifically, first, an uncured UV-curing adhesive is applied to the inside of the recesses 71, 72A, and 73 of the holding member 70A. Then, the optical connection waveguide member 30 is placed in recess 72A and the fiber array 40 is placed in recess 73. Next, for example, active alignment is performed to adjust the relative positions of the optical connection waveguide member 30 and the fiber array 40. After that, the optical integrated circuit 20 is mounted in recess 71 and connected to the optical connection waveguide member 30 by active alignment, thereby enabling the optical integrated circuit 20, the optical connection waveguide member 30, and the fiber array 40 to transmit and receive optical signals. In this state, the uncured UV-curing adhesive is irradiated with ultraviolet light to cure it. The retaining member 70A can be manufactured, for example, by cutting a glass plate or a metal plate. As mentioned above, when using an ultraviolet-curing adhesive, it is preferable that the retaining member 70A is made of glass. It is also possible to mount everything using passive alignment.

[0041] Next, similar to the first embodiment, a wiring board 10 with a semiconductor device 50 mounted on its lower surface is prepared, and a holding member 70A for holding the optical integrated circuit 20, optical connection waveguide member 30, and fiber array 40 is fixed to the upper surface of the wiring board 10. This completes the optoelectronic mixed-signal device 1A.

[0042] Alternatively, the optical integrated circuit 20, the optical connection waveguide member 30, and the fiber array 40 may be fixed in place at predetermined positions on the upper surface of the wiring board 10. In this case as well, for example, active alignment is performed to adjust the relative positions of the optical integrated circuit 20, the optical connection waveguide member 30, and the fiber array 40, so that the optical integrated circuit 20, the optical connection waveguide member 30, and the fiber array 40 are in a state where optical signals can be transmitted and received.

[0043] Subsequently, an uncured UV-curing adhesive is applied to the inside of the recesses 71, 72A, and 73 of the retaining member 70A, as well as to the first surface 70m of the retaining member 70A. Then, the retaining member 70A is placed on the upper surface of the wiring board 10 such that the optical integrated circuit 20 is located in recess 71, the optical connection waveguide member 30 is located in recess 72A, and the fiber array 40 is located in recess 73. After that, the uncured UV-curing adhesive is irradiated with ultraviolet light to cure it. This completes the photoelectric mixed-signal device 1A.

[0044] Thus, in the optical-electric mixed-signal device 1A, the optical integrated circuit 20, the optical connection waveguide member 30, and the fiber array 40 are held by the holding member 70A in a state where optical signals can be transmitted and received, and the holding member 70A is fixed to the upper surface of the wiring board 10. As a result, stress is less likely to concentrate at the connection portion between the optical integrated circuit 20 and the optical connection waveguide member 30, thereby reducing the risk of fracture at the connection portion between the optical integrated circuit 20 and the optical connection waveguide member 30. Furthermore, stress is less likely to concentrate at the connection portion between the optical connection waveguide member 30 and the fiber array 40, thereby reducing the risk of fracture at the connection portion between the optical connection waveguide member 30 and the fiber array 40. In other words, a highly reliable optical connection structure can be realized at the connection portion between the optical integrated circuit 20 and the optical connection waveguide member 30, and at the connection portion between the optical connection waveguide member 30 and the fiber array 40. Furthermore, by reducing stress concentration at the connection points between the optical integrated circuit 20 and the optical connection waveguide member 30, and at the connection points between the optical connection waveguide member 30 and the fiber array 40, the occurrence of optical loss can be reduced.

[0045] In the photoelectric mixed-signal device 1A, the optical integrated circuit 20, the optical connection waveguide member 30, and the fiber array 40 are held by a holding member 70A, and the holding member 70A is fixed to the upper surface of the wiring board 10. Since heating is performed during fixing due to reflow soldering, etc., it is preferable to use a fiber array with high heat resistance. In other words, if a fiber array with low heat resistance is used, it is preferable to use the holding member 70 shown in the first embodiment and to position the fiber array after all heating processes have been completed.

[0046] <Modification 2 of the First Embodiment> Modification 2 of the first embodiment shows an example of an optoelectronic mixed-signal device that does not have an optical connection waveguide member 30. In Modification 2 of the first embodiment, descriptions of components that are the same as those described in the previously described embodiment may be omitted.

[0047] Figure 8 is a cross-sectional view illustrating a modified example of the first embodiment, part 2, of the photoelectric combined casing apparatus. Referring to Figure 8, the photoelectric combined casing apparatus 1B differs from the photoelectric combined casing apparatus 1A in that it does not have an optical connection waveguide member 30, and has a holding member 70B instead of a holding member 70.

[0048] In the optical-electric mixed-signal device 1B, the holding member 70B holds the optical integrated circuit 20 and the fiber array 40 in a relative position. The holding member 70B is fixed to the upper surface of the wiring board 10. Each optical fiber 42 constituting the fiber array 40 is optically connected to the optical integrated circuit 20. Each optical fiber 42 constituting the fiber array 40 is capable of transmitting and receiving optical signals with the optical integrated circuit 20. Opposite ends of each optical fiber 42 and the optical integrated circuit 20 are joined by, for example, an optical adhesive with good transmittance to the wavelength of the optical signal transmitted and received between the optical fiber 42 and the optical integrated circuit 20.

[0049] Figure 9 is a perspective view illustrating a retaining member according to a modified example 2 of the first embodiment. As shown in Figure 9, the retaining member 70B has recesses 71 and 73. The retaining member 70B has a first surface 70m and a second surface 70n, and recesses 71 and 73 open to the first surface 70m side. The depths of recesses 71 and 73 from the first surface 70m may be the same or different.

[0050] Returning to Figure 8, the optical integrated circuit 20 is fixed in the recess 71, and the fiber array 40 is fixed in the recess 73. Any adhesive can be used to fix the optical integrated circuit 20 and the fiber array 40 to the retaining member 70B, but it is preferable to use an ultraviolet-curing adhesive, as in the first embodiment. In this case, it is preferable that the retaining member 70B has an ultraviolet transmittance of 80% or more, as in the first embodiment. Also, as in the first embodiment, it is preferable that a through hole 71x is provided in the recess 71 of the retaining member 70B.

[0051] Thus, the optical integrated circuit 20 and the fiber array 40 may be directly optically connected. In this case as well, since the optical integrated circuit 20 and the fiber array 40 are held by the holding member 70B in a state where optical signals can be transmitted and received, and the holding member 70B is fixed to the upper surface of the wiring board 10, stress is less likely to concentrate at the connection portion between the optical integrated circuit 20 and the fiber array 40. Therefore, the risk of breakage at the connection portion between the optical integrated circuit 20 and the fiber array 40 can be reduced. In other words, a highly reliable optical connection structure can be realized at the connection portion between the optical integrated circuit 20 and the fiber array 40.

[0052] Although preferred embodiments and their variations have been described in detail above, the invention is not limited to the embodiments and their variations described above, and various modifications and substitutions can be made to the embodiments and their variations described above without departing from the scope of the claims.

[0053] For example, two or more retaining members spaced apart from each other may be arranged on a single wiring board. Furthermore, an ASIC (Application Specific Integrated Circuit), memory, etc., may be placed on the upper and / or lower surfaces of the wiring board. [Explanation of Symbols]

[0054] 1,1A,1B Photoelectric mixed-signal device 10 Wiring board 20 Optical Integrated Circuits 30 Waveguide members for optical connections 40 Fiber Arrays 41 Support part 42 Optical Fibers 50 Semiconductor Devices 70, 70A, 70B retaining member 70m 1st side 70n 2nd page 71, 72, 72A, 73 recessed 71x through hole

Claims

1. Wiring board and An optical integrated circuit arranged on the upper surface of the aforementioned wiring board, A waveguide member for optical connection is disposed on the upper surface of the aforementioned wiring board, The optical integrated circuit and the optical waveguide member are held by a holding member, The holding member is fixed to the upper surface of the wiring board, and is a photoelectric mixed-signal device.

2. The retaining member has a first recess and a second recess, The optical integrated circuit is fixed in the first recess, and the optical connecting waveguide member is fixed in the second recess, as described in claim 1.

3. The optical connection waveguide member further comprises a fiber array capable of transmitting and receiving optical signals with the optical integrated circuit, The retaining member further has a third recess, The optical-electric mixed-signal apparatus according to claim 2, wherein the fiber array is fixed in the third recess.

4. Wiring board and An optical integrated circuit arranged on the upper surface of the aforementioned wiring board, A fiber array capable of transmitting and receiving optical signals with the aforementioned optical integrated circuit, The optical integrated circuit and the fiber array are held by a holding member, The holding member is fixed to the upper surface of the wiring board, and is a photoelectric mixed-signal device.

5. The retaining member has a first recess and a third recess, The optical integrated circuit is fixed in the first recess, and the fiber array is fixed in the third recess, as described in claim 4.

6. The optical integrated circuit and the fiber array are fixed to the holding member with an ultraviolet-curing adhesive. The photoelectric mixed loading apparatus according to any one of claims 3 to 5, wherein the holding member has a transmittance of 80% or more to ultraviolet light.

7. The photoelectric mixed-loading apparatus according to claim 6, wherein the holding member is made of glass.

8. The aforementioned optical integrated circuit is provided with alignment marks, A through hole is provided in the first recess, The photoelectric mixed loading apparatus according to claim 2, 3, or 5, wherein the alignment mark is located within the through hole in a plan view.

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