Method for manufacturing an IC card and IC card

Abstract

This invention provides an IC card that allows the identification information associated with the card to be read without damaging the card, even after IC implementation. [Solution] An IC card comprising an IC module 20 and a card body 10 having a recess 100 in which the IC module 20 is placed, wherein an individual identification code or individual identification pattern is formed on the bottom surface 100a of the recess 100 by printing with metallic ink or by providing a metallic foil. As a result, the individual identification code can be detected by an X-ray device, and the identification information related to the IC card can be read without damaging the IC card even after IC mounting.

Description

Technical Field

[0001] The present invention relates to a method for manufacturing an IC card and an IC card.

Background Art

[0002] Conventionally, as an IC card, a contact type IC card that inputs and outputs an electrical signal through an external connection terminal on the card surface, or a dual interface IC card that can perform non-contact communication by inputting and outputting an electrical signal by electromagnetic induction or the like through an antenna is used.

[0003] Such an IC card is formed, for example, by including a card body and an IC module, forming a recess for mounting the IC module in the card body, and mounting the IC module in this recess. In particular, as a method for forming the above-described recess, milling processing in which a part of the card is cut with a milling cutter rotating at high speed can be mentioned.

[0004] By the way, currently, with the increase in the quantity of IC cards as described above, the importance of traceability in the manufacturing process of IC cards such as the milling process, the substrate lamination process, and the press process of IC cards has been increasing. Specifically, when communication failures occur in the manufacturing process and the market, there are cases where it is desired to trace whether there are any abnormalities in each process and the quality. In such a case, if the solid identification information of the card body and the manufacturing log of each process are linked one-to-one, it can be very useful for identifying the cause of the failure.

[0005] However, in terms of the aesthetics of the card, ordinary IC cards are subject to requests or restrictions from customers regarding printing designs, printing, etc., and in many cases, printing or marking of numbering or marks for the manufacturer to identify the production lot is not allowed.

[0006] Therefore, as a card that can be traced without impairing the aesthetic appearance of the IC card, a method for manufacturing an IC card is known in which, when mounting the IC module of the IC card onto the IC card base, a recess for mounting the IC module is formed by counterboring (corresponding to the milling process described above) from the surface of the card base, and the IC module is adhesively fixed to the first recess of the formed recess for mounting the IC module, wherein an individual identification code or individual identification pattern that identifies the manufacturing date or manufacturing lot number of the IC card is engraved or printed on the bottom surface of the second recess after counterboring the recess for mounting the IC module (see Patent Document 1).

[0007] According to the IC cards manufactured using this method, displaying an individual identification code on the card surface prevents the card's appearance from being compromised, and in the event of a malfunction in the IC card, the manufacturing lot can be identified by peeling off the IC and reading the individual identification code or individual identification pattern. [Prior art documents] [Patent Documents]

[0008] [Patent Document 1] Japanese Patent Publication No. 2004-38852 [Overview of the project] [Problems that the invention aims to solve]

[0009] However, with the aforementioned IC cards, it was necessary to detach the IC chip from the card in order to read the individual identification code or pattern attached to the IC card. This resulted in deformation of the card or damage to the IC chip, and therefore the card had to be destroyed.

[0010] On the other hand, since the cards being investigated, whether market-defective or in-process defective, are not necessarily destructible, there is a need for a method that allows for non-destructive identification information to be investigated even after the IC has been mounted.

[0011] This invention was made to solve the above problems, and aims to provide an IC card that allows identification information related to the IC card to be read without damaging the IC card, even after IC mounting. [Means for solving the problem]

[0012] To achieve the above objective, the IC card according to the present invention is an IC card comprising an IC module and a card body having a recess in which the IC module is arranged, wherein an individual identification code or individual identification pattern is formed by printing with metallic ink on the bottom surface of the recess or by providing a metallic foil.

[0013] This allows for the reading of individual identification codes or patterns using an X-ray device. [Effects of the Invention]

[0014] According to the present invention, the identification information relating to the IC card can be read without destroying the IC card. [Brief explanation of the drawing]

[0015] [Figure 1] External view of IC card 1 [Figure 2] External view of the card body 10 [Figure 3] Cross-sectional view of the card body 10 and IC module 20 [Figure 4] Enlarged view of the area around recess 100 [Modes for carrying out the invention]

[0016] An IC card according to one embodiment of the present invention will be described with reference to the drawings. Figure 1 is an external view of the IC card, Figure 2 is an external view of the card body, Figure 3 is a cross-sectional view of the card body and IC module, and Figure 4 is an enlarged view of the area around the recess 100.

[0017] Note that each figure is shown schematically. Therefore, the sizes and shapes of each part are exaggerated as appropriate for easy understanding. Also, regarding the front and back of the IC card, the surface is defined as the side where the external contact terminals of the IC module are exposed. Regarding the up and down directions of the IC card, on the normal direction of the main surface of the IC card, the surface side is described as up and the back side is described as down.

[0018] Hereinafter, the IC card according to this embodiment will be described by taking an IC card for contact communication in which contact communication terminal portions are exposed on the surface as an example, but it is not limited thereto. For example, it is also applicable to Dual interface cards having a non-contact communication function in addition to the contact communication function.

[0019] An IC card 1 according to an embodiment of the present invention includes a card body 10 formed of a plurality of layers, and an IC module 20 including an IC chip, contact terminal portions, and the like. A recess 100 for mounting the IC module is formed in the card body 10. An individual identification code 200 indicating unique information of the IC card 1 is formed of a metal member on the bottom surface 100a of the recess 100.

[0020] The card body 10 is, for example, laminated with a printing layer 11, an over sheet layer 12, a core sheet layer 13, a core sheet layer 14, and an over sheet layer 15 in this order from the surface. Although not shown, as other layers, a printing layer may be further laminated on the back side, a shielding layer may be laminated at an appropriate position, a magnetic stripe may be disposed on the surface opposite to the core sheet layer 13 of the over sheet layer 12, or on the surface opposite to the core sheet layer 14 of the over sheet layer 15. In this embodiment, the core sheet layer 14 and the over sheet layer 15 are provided, but they may not be provided particularly. Also, when assuming a dual interface IC card, an antenna layer may be provided between appropriate layers.

[0021] The following describes each layer, but these are not limited to those described, and include those in which each layer is formed of only one layer or two or more layers. Also, a transparent layer may be provided between the layers, an adhesive layer for adhering the layers may be provided, etc., and the layer configuration can be appropriately modified within the range in which the present invention can be implemented.

[0022] The printing layer 11 is a layer provided on the outermost surface of the IC card 1. Therefore, the design, characters, etc. formed on the printing layer 11 become the appearance of the IC card 1. On the printing layer 11, designs such as the name and logo of the IC card 1 are formed by printing methods such as offset printing, screen printing, flexographic printing, gravure printing, thermal transfer from an ink ribbon, inkjet printing, etc. The printing layer 11 may be formed on the back side of the oversheet layer 12. Note that the printing layer 11 may be provided between the core sheet layer 13 and the oversheet layer 12.

[0023] The oversheet layers 12 and 15 are layers also referred to as the surface layer and the transparent layer. As the oversheet layer 12, for example, a transparent material having a thickness of about 0.05 mm or more and 0.18 mm or less is often used.

[0024] The core sheet layers 13 and 14 are layers also referred to as the card base material. As the core sheet layer 13, for example, various white or colored plastic sheets can be widely used, and the following single films or their composite films can be used. In particular, polyethylene terephthalate (PET), PET-G (terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer), polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, polycarbonate, polyamide, polyimide, cellulose diacetate, cellulose triacetate, polystyrene-based, ABS, polyacrylate ester, polypropylene, polyethylene, polyurethane, etc. The thickness of the core sheet layer 13 can be appropriately selected in consideration of the overall thickness of the card, but can be, for example, about 0.05 mm or more and 0.45 mm or less.

[0025] The IC module 20 comprises an IC chip section 21 in which an IC chip is coated with resin, a substrate 22, and a contact communication terminal section 23 having a metal layer. In the IC module 20, the electrodes of the IC chip embedded in the IC chip section 21 and each terminal of the contact communication terminal section 23 are electrically connected by gold wires or the like. As a result, when an electrical signal is input to each terminal of the contact communication terminal section 23 from an external reader / writer, the IC chip section 21 performs a predetermined function, and the IC card 1 operates as an IC card for contact communication.

[0026] The IC chip unit 21 includes a CPU for controlling the operation of contact communication and a storage device such as RAM, ROM, EEPROM, or flash memory. Furthermore, the IC chip unit 21 includes various circuits such as an interface circuit for decoding the input signal and generating the output signal of contact communication, and a power generation circuit. Note that these various circuits may be provided as separate elements from the IC chip unit 21.

[0027] The substrate 22 is provided between the IC chip portion 21 and the contact communication terminal portion 23, with the contact communication terminal portion 23 arranged on one side and the IC chip portion 21 arranged on the other side. The substrate 22 is made by bonding copper foil to both sides of a flexible insulating resin film such as glass epoxy resin or polyimide resin via adhesive, and leaving the copper foil bonded to the front and back sides of the resin film to form a predetermined pattern.

[0028] The contact communication terminal section 23 has defined compartments for external terminals as defined by the ISO / IEC 7816-2 standard. Each compartment is a metal layer and is electrically connected to the IC chip section 21, and communication takes place between the IC chip section 21 and external terminals such as contact-type readers through the contact communication terminal section 23.

[0029] An IC card 1 is formed by attaching an IC module 20 to the card body 10 described above. This form of IC card 1 conforms to ISO / IEC 7816, the international standard for IC cards. The card body 10 has a recess 100 for mounting the IC module so that the surface of the contact communication terminal portion 23 of the IC module 20 is positioned to be substantially the same as the surface of the card body 10.

[0030] As shown in Figure 3, the recess 100 is integrally formed in the thickness direction of the IC card 1, with a first recess 110 having a small depth from the surface and a second recess 120 having a greater depth than the first recess 110. The substrate 22 of the IC module 20 is housed in the first recess 110, and the IC chip portion 21 of the IC module 20 is housed in the second recess 120. The position and size of each recess only need to meet ISO standards, and the formation method will be described later.

[0031] An individual identification code 200 associated with the unique identification information of the IC card 1 is formed on the bottom surface 100a of the recess 100. The individual identification code 200 is formed from a metal-containing material that is difficult for X-rays to penetrate. For example, this can be done by printing with metal ink or by attaching metal foil. Examples of metals that can be contained include aluminum, titanium, zinc, lead, chromium, iron, cobalt, cadmium, and copper. In this embodiment, the individual identification code 200 was formed using a metal ink containing aluminum. The concealing ink that forms the aforementioned concealing layer (not shown) uses aluminum, and there is an advantage that the same material can be used for the individual identification code 200 in this embodiment. Since the individual identification code 200 is formed from a metal-containing material that is difficult for X-rays to penetrate, it can be read by an X-ray device.

[0032] Individual identification code 200 may include, for example, letters, numbers, and symbols. It may also include barcodes and two-dimensional codes. In addition to individual identification code 200, it may also be a unique identification pattern that includes lines, figures, patterns, etc.

[0033] One method for reading the individual identification code 200 is to use, for example, a device of model μRay8000 manufactured by Matsusada Precision Co., Ltd., and read it under a tube voltage of 40kV.

[0034] The X-ray device only needs to be capable of detecting and visually inspecting the individual identification code 200 through the contact communication terminal section 23. For example, if the thickness of the metal layer of the contact communication terminal section 23 is 50 μm or less, contrast can be ensured at the boundary with the individual identification code 200, making it easier to detect and visually inspect the individual identification code 200. Also, if the mass percentage of metal particles in the total metal ink, which is a mixture of metal particles and binder forming the individual identification code 200, is 10% or more, or if the thickness of the metal foil is 5 μm or more, contrast can be ensured at the boundary with the contact communication terminal section 23, making it easier to detect and visually inspect the individual identification code 200. Furthermore, by setting both the contact communication terminal section 23 and the individual identification code 200 within the above-mentioned numerical range, detection and visual inspection of the individual identification code 200 becomes even easier.

[0035] Identification information includes, for example, manufacturing information related to IC card 1. Manufacturing information may include, for example, the lot number of the components of IC card 1, the processing date and time of IC card 1, the processing plant number, the processing equipment number, the processing lot number, or the inspection lot number. Furthermore, it may include the processing date and time of recess formation, the processing plant number, the processing equipment number or processing lot number, or the inspection lot number. This further enhances the accuracy of traceability.

[0036] The individual identification code 200 is formed, for example, as shown in the enlarged view of the area around the recess 100 in Figure 4, as "12345-abcd" within the recess 100. The individual identification code 200 may be formed on either the bottom surface 110a of the first recess 110 or the bottom surface 120a of the second recess 120, as shown in Figures 4(a) and (b), or it may be formed spanning from the bottom surface 110a of the first recess 110 to the bottom surface 120a of the second recess 120, as shown in Figure 4(c).

[0037] The manufacturing method for the IC card 1 described above will now be explained. Starting from the front side of the IC card 1, the printing layer 11, oversheet layer 12, core sheet layer 13, core sheet layer 14, and oversheet layer 15 are stacked in this order. Then, the stack of large sheets in which the cards are arranged in multiple rows vertically and horizontally is sandwiched between stainless steel plates from above and below in the thickness direction, and heat and pressure are applied to the stack through the stainless steel plates.

[0038] By going through such a heat pressing process, a large-format sheet-type card base can be obtained in which each layer of the laminate is integrated. Furthermore, if any of the printing layer, oversheet layer, or core layer has heat resistance that prevents heat fusion at a predetermined temperature, an adhesive sheet that heats together at a predetermined temperature is sandwiched between each layer, or an adhesive is applied. Then, by subjecting these to a heat pressing process, an integrated large-format sheet-type card base can be obtained.

[0039] The large sheet of card base material, in which the cards are arranged in multiple vertical and horizontal orientations, obtained as described above, is punched out using a die-cutting machine into card bodies 10 that conform to the ISO / IEC 7816 card size. Furthermore, a recess 100 for embedding the IC module 20 is formed in the card body 10 by cutting with an end mill. This yields the cut card bodies 10.

[0040] In the manufacturing of the IC card 1, at the stage when the recess 100 is formed, an individual identification code 200 is formed on at least one of the bottom surface 110a of the first recess 110 and the bottom surface 120a of the second recess 120 by printing with metallic ink or attaching a metal foil. For example, possible methods include punching out a metal foil into the shape of a specific character or the like and attaching it to the bottom surface 110a or 120a with adhesive, or applying heat and pressure using a thermal head or hot press to a film-like metal foil with adhesive applied to one side in contact with the bottom surface 110a or 120a to heat-transfer a portion of the metal foil to the bottom surface 110a or 120a in the shape of a specific character or the like.

[0041] If IC card 1 is a dual interface card, although not shown in the diagram, the card body 10 is equipped with an antenna wire for contactless communication. Both ends of this antenna wire are electrically connected to the IC chip 21 and are therefore located in the recess 100 on the plane. In this case, it is more preferable that the individual identification code 200 be formed in a position that does not overlap with this antenna wire when viewed along the thickness direction. That is, when a metal material such as an antenna wire is placed in the recess 100, it is more preferable that the individual identification code 200 be formed in a position where this metal material does not obstruct the reading of the X-ray device. Other metal materials include conductive plates provided at the ends of the antenna wire. Furthermore, since the individual identification code 200 is formed in the recess 100, it does not interfere with the antenna and does not affect the contactless communication function of the dual interface card.

[0042] After the individual identification code 200 is formed on the bottom surface 100a of the recess 100, the IC module 20 is embedded in the recess 100 to integrate the card body 10 and the IC module 20. At this time, the substrate 22 and the bottom surface 110a of the first recess are connected via, for example, a heat-sealing adhesive (not shown). In this state, a predetermined heat block is pressed against the IC module 20 and a predetermined amount of heat and pressure is applied toward the card body 10 for a predetermined time, thereby bonding the card body 10 and the IC module 20 together as a single unit.

[0043] As described above, the IC card 1 according to this embodiment comprises an IC module 20 and a card body 10 having a recess 100 in which the IC module 20 is placed. An individual identification code 200 or individual identification pattern is formed on the bottom surface 100a of the recess 100 by printing with metallic ink or by providing metallic foil. This allows the individual identification code 200 to be read from above the IC module 20 using an X-ray device.

[0044] According to the IC card 1 of this embodiment, the individual identification code 200 can be read from the IC module, so identification information related to the IC card 1 can be obtained without damaging the IC card 1.

[0045] Furthermore, since the individual identification code 200 or individual identification pattern is associated with identification information unique to the IC card, the traceability of IC card 1 can be enhanced.

[0046] Furthermore, since the identification information includes manufacturing information related to the IC card, the traceability of the IC card 1 can be further enhanced.

[0047] Furthermore, the IC module 20 is equipped with a contact communication terminal section 23, and since the metal layer thickness of the contact communication terminal section 23 is 50 μm or less, individual identification information can be easily read.

[0048] Furthermore, if the individual identification code 200 or the individual identification pattern is formed by printing with metallic ink, the metallic ink is formed by mixing metal particles and a binder, and since the mass percentage of metal particles in the whole is 10% or more, the individual identification information can be easily read.

[0049] Furthermore, if the individual identification code 200 or the individual identification pattern is formed by providing a metal foil, the thickness of the metal foil is 5 μm or more, so the individual identification information can be easily read. [Explanation of Symbols]

[0050] 1: IC card, 10: Card body, 11: Printed layer, 12-15: Oversheet layer, 13-14: Core sheet layer, 20: IC module, 21: IC chip section, 22: Substrate, 23: Contact communication terminal section, 100: Recess, 100a: Bottom surface of recess, 110: First recess, 110a: Bottom surface of first recess, 120: Second recess, 120a: Bottom surface of second recess, 200: Individual identification code

Claims

1. An IC card comprising an IC module and a card body having a recess in which the IC module is arranged, An individual identification code or individual identification pattern is formed by printing a metallic ink on the bottom surface of the recess or by providing a metallic foil. IC card.

2. The individual identification code or individual identification pattern is associated with the identification information unique to the IC card. IC card according to claim 1

3. The identification information includes manufacturing information relating to the IC card. The IC card according to claim 2.

4. The IC module includes a contact communication terminal section having a metal layer, The thickness of the metal layer is 50 μm or less. The IC card according to any one of claims 1 to 3.

5. If the individual identification code or individual identification pattern is formed by printing with the metallic ink, The aforementioned metallic ink is formed by mixing metal particles and a binder, and the mass percentage of metal particles in the total is 10% or more. The IC card according to any one of claims 1 to 3.

6. If the individual identification code or individual identification pattern is formed by providing the metal foil, The thickness of the aforementioned metal foil is 5 mm or more. The IC card according to any one of claims 1 to 3.

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