Manufacturing method for molded products

Abstract

The objective is to provide a method for manufacturing molded articles with a high filler content while using a thermosetting resin composition. [Solution] A method for manufacturing a molded article, comprising molding a molding material containing a filler and a thermosetting resin composition under heat and pressure to thermoset the thermosetting resin composition, Using the thermosetting resin composition whose viscosity, measured with an E-type viscometer at 25°C and 5 rpm, is 50.0 Pa·s or less, The present invention provides a method for manufacturing a molded article, wherein the thermosetting of the thermosetting resin composition is carried out at a temperature of (X-40)°C or higher and X°C or lower, when the exothermic peak temperature of the thermosetting resin composition, as determined by differential scanning calorimetry, is X°C.

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a molded body.

Background Art

[0002] Various resin products are widely used because they are lighter and more corrosion-resistant than metal products. In conventional methods for manufacturing resin products, various molding methods such as injection molding, transfer molding, extrusion molding, and press molding are employed. Resin products are either used as the molded body obtained by such molding methods as they are, or are produced by subjecting the molded body to secondary processing.

[0003] When manufacturing this type of molded body, a molding material containing a resin composition suitable for the properties required for the resin product is prepared. When it is difficult for the molded body to have sufficient strength when composed only of the resin composition, the molded body is sometimes manufactured using a molding material containing a filler such as inorganic particles or fibers together with the resin composition. Conventionally, in addition to the purpose of enhancing the mechanical strength of the molded body, the filler has also been used for the purpose of enhancing electrical conductivity or thermal conductivity. For example, Patent Document 1 below describes manufacturing a thermally conductive molded body excellent in thermal conductivity by highly filling thermally conductive fibers such as carbon fibers and metal fibers.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] To significantly enhance the properties of a filler in a molded article, it is conceivable to increase the filler's density. However, simply reducing the proportion of the resin composition in the molding material makes it difficult for the resin composition to adequately fill the gaps in the filler, resulting in poorly formed molded articles. For this reason, in order to manufacture molded articles with a high filler density, it is conceivable to prepare a molding material containing a certain excess of the resin composition and increase the molding temperature to improve the fluidity of the resin composition, thereby facilitating its outflow from the molded space. However, if the resin composition is thermosetting, increasing the molding temperature may cause the resin composition to harden at an unintended time, potentially having the opposite effect. On the other hand, lowering the molding temperature increases the time it takes for the resin composition to harden, leading to a decrease in productivity. Therefore, the present invention aims to provide a method for manufacturing molded articles with a high filler content while using a thermosetting resin composition. [Means for solving the problem]

[0006] To solve the above problems, the present invention provides: A method for manufacturing a molded article, comprising molding a molding material containing a filler and a thermosetting resin composition under heat and pressure to thermoset the thermosetting resin composition, Using the thermosetting resin composition whose viscosity, measured with an E-type viscometer at 25°C and 5 rpm, is 50.0 Pa·s or less, The present invention provides a method for manufacturing a molded article, wherein the thermosetting of the thermosetting resin composition is carried out at a temperature of (X-40)°C or higher and X°C or lower, when the exothermic peak temperature of the thermosetting resin composition, as determined by differential scanning calorimetry, is X°C. [Effects of the Invention]

[0007] According to the present invention, a molded article with a high filler content can be manufactured while using a thermosetting resin composition. [Brief explanation of the drawing]

[0008] [Figure 1a]Figure 1a is a schematic perspective view of a mold used in the manufacture of a molded product. [Figure 1b] Figure 1b is a schematic perspective view of a different mold than the one in Figure 1a. [Figure 2] Figure 2 is a schematic perspective view showing the process of loading molding material into a mold. [Figure 3] Figure 3 is a schematic plan view showing the arrangement of molding material in the mold. [Figure 4] Figure 4 is a schematic plan view showing the arrangement of molding material in the mold during the molding process. [Figure 5] Figure 5 is a schematic cross-sectional view of a different mold than those in Figures 1a and 1b. [Figure 6a] Figure 6a is a schematic diagram showing an example of using the molding die shown in Figure 5. [Figure 6b] Figure 6b is a schematic diagram showing an example of using the molding die shown in Figure 5. [Figure 6c] Figure 6c is a schematic diagram showing an example of using the molding die shown in Figure 5. [Modes for carrying out the invention]

[0009] The following describes one embodiment of the present invention. The method for manufacturing a molded article according to this embodiment includes a material preparation step of preparing a molding material containing a filler and a thermosetting resin composition, a molding step of producing a molded article by molding the molding material prepared in the material preparation step under heat and pressure, and a secondary processing step of performing secondary processing on the molded article as necessary after the molding step.

[0010] In the manufacturing method of the molded article of this embodiment, a molding material with a lower filler content than the molded article produced in the molding process is prepared in the material preparation step. Then, in the molding process, the fluidity of the thermosetting resin composition is increased by the pressure and temperature applied to the molding material, and the excess thermosetting resin composition that is not required to form the molded article is discharged and removed. That is, the molding material prepared in the material preparation step is separated in the molding process into a molded article with a higher filler concentration than the molding material and a discharge material with a lower filler concentration than the molding material. Furthermore, even if air bubbles are trapped in the molding material in the material preparation step, these air bubbles can be transferred to the discharge material side along with the excess thermosetting resin composition, so that a molded article can be produced while suppressing the formation of voids. In other words, in this embodiment, air bubbles are easily trapped in the material preparation step, and the process when degassing to remove voids can be simplified, and in some cases the degassing process itself can be omitted, thus improving the productivity of the molded article.

[0011] In the molding process, the molding material is heated, causing a thermosetting reaction in the thermosetting resin composition. In this embodiment, in order to quickly remove excess thermosetting resin composition before it heat-cures, the thermosetting resin composition is prepared in the material preparation step to have a specific viscosity. In the material preparation step, the thermosetting resin composition is prepared so that the viscosity measured with an E-type viscometer at 25°C and 5 rpm is 50.0 Pa·s or less, and a molding material containing a thermosetting resin composition exhibiting such viscosity is prepared. The viscosity of the thermosetting resin composition at 25°C measured with an E-type viscometer at 5 rpm may be, for example, 30.0 Pa·s or less, 10.0 Pa·s or less, 8.0 Pa·s or less, 6.0 Pa·s or less, or 5.0 Pa·s or less. The viscosity of the thermosetting resin composition at 25°C may be, for example, 0.5 Pa·s or more. The viscosity of the thermosetting resin composition at 25°C may be, for example, 1.0 Pa·s or higher.

[0012] The viscosity of the thermosetting resin composition at 25°C can be measured, for example, using a cone plate type spindle "CPE-40" in an E-type viscometer named "DV-II+Pro" manufactured by Brookfield.

[0013] In the material preparation process, the thermosetting resin composition and the filler may be prepared separately and then mixed to prepare the molding material, or the preparation of the molding material may be carried out simultaneously and in parallel with the preparation of the thermosetting resin composition. That is, in the material preparation process, for example, after mixing a part of the components of the thermosetting resin composition and the filler to prepare a mixture, the remaining components of the thermosetting resin composition and the mixture may be mixed to prepare the molding material. The filler of the present embodiment may be a thread or a woven fabric as described later. Therefore, the material preparation process may be carried out by a method of impregnating such a filler with the thermosetting resin composition. Since the thermosetting resin composition of the present embodiment has the viscosity as described above, the impregnation property into the thread or the woven fabric can also be good.

[0014] When the molding process is carried out using a mold, the material preparation process may prepare the molding material in the molding space of the mold. For example, when male and female molds are used in the molding process, after accommodating the filler in the female mold, the thermosetting resin composition may be introduced into the female mold to prepare the molding material in the mold. The introduction of the thermosetting resin composition into the mold may be carried out in an open state or in a closed state. For example, if the mold has a path for introducing the thermosetting resin composition into the molding space from outside the mold in a closed state, the molding material can be prepared in the mold in a closed state.

[0015] The molded body obtained in the present embodiment is formed as a composite of a cured product formed by thermosetting of the thermosetting resin composition and the filler, and can be formed as a composite in a state where the fillers are bound by the cured product.

[0016] The molded body obtained in this embodiment can have, for example, a volume ratio of the filler of 50% by volume or more. The volume ratio of the filler in the molded body may be 60% by volume or more, 70% by volume or more, 80% by volume or more, or 85% by volume or more. The volume ratio of the filler in the molded body is, for example, 95% by volume or less.

[0017] The filler used in this embodiment may be composed of an inorganic material, an organic material, or a composite material containing an inorganic material and an organic material. When the filler is composed of two or more materials, it may be such that one material coats the substrate composed of the other material. Specifically, it may be a granule having a core-shell structure, a fiber having a core-sheath structure or a side-by-side structure, a sheet having a multilayer structure, etc. The filler may be a composite material of two or more inorganic materials or a composite material of two or more organic materials.

[0018] Inorganic materials that constitute part or all of the filler include, for example, carbon such as carbon and graphite; metals such as iron, copper, aluminum, nickel, silver, gold, zirconium, tin, bismuth, indium, zinc and alloys based thereon; inorganic oxides such as silicon oxide, aluminum oxide, zinc oxide, titanium oxide and zirconium oxide; inorganic carbides such as silicon carbide; inorganic nitrides such as silicon nitride, aluminum nitride, boron nitride, gallium nitride and titanium nitride; inorganic hydroxides such as aluminum hydroxide and magnesium hydroxide; inorganic carbon oxides such as calcium carbonate and magnesium carbonate; minerals (clay minerals such as talc, clay, mica and smectite, basalt, shirasu, etc.); glass; ceramics, etc. Composite materials of inorganic materials include, for example, combinations of metals such as gold-copper composite materials, silver-copper composite materials, silver-nickel composite materials and gold-nickel composite materials. These specific forms can include, for example, gold-coated copper particles, silver-coated copper particles, silver-coated nickel particles, gold-coated nickel particles, gold-coated copper fibers, silver-coated copper fibers, silver-coated nickel fibers, gold-coated nickel fibers, gold-coated copper foil, silver-coated copper foil, silver-coated nickel foil, and gold-coated nickel foil. As for composite materials of inorganic materials, combinations of metals and other materials, such as metal-coated ceramics, may also be used.

[0019] Examples of organic materials that constitute part or all of the filler include engineering plastics such as polyamide (PA), polyacetal (POM), polycarbonate (PC), polyphenylene ether (PPE), polybutylene terephthalate (PBT), and ultra-high molecular weight polyethylene (UHMW-PE); super engineering plastics such as aromatic polyamide (aramid) (PPA), polysulfone (PSU), polyethersulfone (PES), polyphenylene sulfide (PPS), polyarylate (PAR), polyamide-imide (PAI), polyetherimide (PEI), polyetheretherketone (PEEK), polyimide (PI), and fluororesins (polytetrafluoroethylene (PTFE), tetrafluoroethylene-hexafluoropropylene copolymer (FEP), tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA)); and synthetic polymers such as general-purpose rubber and plastics. The organic material may also be a natural polymer such as cellulose, cotton, hemp, silk, or wool. Examples of composite materials made from organic materials include fluororesin-polyamide composite materials and fluororesin-cellulose composite materials.

[0020] Examples of composite materials combining inorganic and organic materials include copper-polyimide composites, aluminum-polyimide composites, carbon-polyimide composites, copper-polyamide composites, aluminum-polyamide composites, and carbon-polyamide composites.

[0021] The constituent materials of the filler can be selected from among those listed below, based on factors such as physical properties, productivity, and cost-effectiveness. One type may be used alone, or two or more types may be used in combination.

[0022] The filler may be, for example, granular, wire, or surface material. The filler may also be, for example, a block material such as a sponge or a three-dimensional fabric. If the filler is granular, the granular material may be, for example, hollow particles (balloons) or solid particles. Solid particles may have, for example, multiple micropores opening on their surface. The shape of the granular material may be, for example, spherical, needle-shaped, plate-shaped, or irregularly shaped. Even if the filler is a wire, surface material, or block material other than granular material, the constituent material is not limited to being solid but may be hollow, as is the case when the filler is granular.

[0023] If the filler is a wire, the wire may be thread-like or rod-like. If it is thread-like, it may be a monofilament or multifilament yarn composed of continuous fibers, or a spun yarn made by spinning short fibers.

[0024] If the filler is a facing material, the facing material may be, for example, a woven fabric such as plain weave, twill weave, or satin weave; a glass mat; or a nonwoven fabric. If the filler is a facing material, the facing material may be a mesh such as a perforated mesh or an expanded mesh. The mesh may be a thin sheet body such as metal foil that has been perforated or expanded.

[0025] When the filler is in the form of wire, panel, or block, compared to when the filler is granular, it is possible to suppress the transfer of the filler to the discharge material (excess thermosetting resin composition) along with the thermosetting resin composition during the molding process, thereby improving the filler content in the molded body. Furthermore, when the filler is wire, it has the advantage of being easier to separate the excess thermosetting resin composition than when it is panel or block.

[0026] When the filler is a wire, continuous fibers allow for smoother movement of the thermosetting resin composition along the length of the yarn and easier separation of excess thermosetting resin composition compared to spun yarn made from short fibers. When the filler is a yarn composed of multiple continuous fibers, for example, if it is an extremely tightly twisted yarn with 2500 twists (2500 T / m) or more per 1m length, or a tightly twisted yarn with 1000 twists (1000 T / m) or more but less than 2500 twists (2500 T / m), strong pressure is required for the impregnation of the thermosetting resin composition and the removal of excess thermosetting resin composition. Therefore, when the filler is a twisted yarn, it is preferable that the twisted yarn is a medium-twisted yarn with 500 twists (500 T / m) or more but less than 1000 twists (1000 T / m), or a loosely twisted yarn with less than 500 twists (500 T / m). If the filling material is a yarn made of continuous fibers, the yarn may not be a twisted yarn, but rather a plied yarn in which multiple fibers are simply held together.

[0027] The thermosetting resin composition, which constitutes the molding material together with the filler, contains a thermosetting resin as its main component. In this embodiment, components other than the filler that are included in the molding material constitute the thermosetting resin composition.

[0028] Examples of thermosetting resins that serve as the main component of a thermosetting resin composition include epoxy compounds, phenolic resins, cyanate resins, maleimide resins, benzoxazine resins, and melamine resins. The thermosetting resin may also be, for example, polyimide resin, polyurethane resin, silicone resin, acrylic resin, or unsaturated polyester resin.

[0029] The proportion of thermosetting resin in the thermosetting resin composition can be, for example, 50% by mass or more. The proportion of thermosetting resin in the thermosetting resin composition can be 60% by mass or more, or 70% by mass or more. The proportion of thermosetting resin in the thermosetting resin composition can be, for example, 94% by mass or less. The proportion of thermosetting resin in the thermosetting resin composition can be 92% by mass or less, or 90% by mass or less. The thermosetting resin included in the above proportions may be a single type, or two or more types may be included in total so that the proportions are as described above. Furthermore, even if the thermosetting resin contained in the thermosetting resin composition is, for example, only epoxy resin, it may be included as a single type in the proportions described above, or two or more types of epoxy resin may be included in total so that the proportions are as described above.

[0030] Examples of epoxy compounds include polyglycidyl ether-type epoxy compounds, polyglycidylamine-type epoxy compounds, polyglycidyl ester-type epoxy compounds, alicyclic epoxy compounds, and other modified epoxy compounds.

[0031] In this invention, the epoxy compound is a compound having at least one epoxy group in one molecule, and its properties may be liquid or solid at room temperature (25°C). It may also be a monomer or oligomer with a molecular weight of several hundred to several thousand, or a resin (polymer) with a molecular weight of 10,000 or more. As the epoxy compound, at least one of the following can be used: a monoepoxide having one epoxy group in one molecule, or an epoxy resin having two or more epoxy groups in one molecule. These can be used individually or in combination of two or more, depending on whether the thermosetting resin composition has a predetermined viscosity.

[0032] Examples of monoepoxides that can be used include aliphatic monoepoxides (such as propylene oxide, butylene oxide, and alkyl monoglycidyl ethers) and aromatic monoepoxides (such as styrene oxide and phenyl glycidyl ethers).

[0033] Examples of polyglycidyl ether type epoxy compounds include aromatic polyglycidyl ether type epoxy resins and aliphatic polyglycidyl ether type epoxy resins.

[0034] Examples of aromatic polyglycidyl ether type epoxy resins include those having a benzene or naphthalene skeleton, such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol AF type epoxy resin, bisphenol Z type epoxy resin, bisphenol fluorene type epoxy resin, diphenyl sulfide type epoxy resin, diphenyl ether type epoxy resin, naphthalene type epoxy resin, hydroquinone type epoxy resin, resorcinol type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, alkyl novolac type epoxy resin, styrene-phenol novolac type epoxy resin, bisphenol novolac type epoxy resin, naphthol novolac type epoxy resin, phenol aralkyl type epoxy resin, α-naphthol aralkyl type epoxy resin, β-naphthol aralkyl type epoxy resin, naphthalenediol aralkyl type epoxy resin, biphenyl aralkylphenol type epoxy resin, biphenyl type epoxy resin, and triphenylmethane type epoxy resin.

[0035] Examples of aliphatic polyglycidyl ether type epoxy resins include alkylene glycol type epoxy resins, such as alkylene diglycidyl ethers in which glycidyl groups are ether-bonded to both ends of an alkylene group, such as ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, neopentyl glycol diglycidyl ether, 1,4-butanediol diglycidyl ether, and 1,6-hexanediol diglycidyl ether; and polyoxyalkylene diglycidyl ethers in which glycidyl groups are ether-bonded to both ends of a polyoxyalkylene group, such as diethylene glycol diglycidyl ether, tripropylene glycol diglycidyl ether, and polyethylene glycol diglycidyl ether.

[0036] Examples of polyglycidylamine-type epoxy compounds include diaminodiphenylmethane-type epoxy resins, metaxylenediamine-type epoxy resins, 1,3-bisaminomethylcyclohexane-type epoxy resins, isocyanurate-type epoxy resins, aniline-type epoxy resins, hydantoin-type epoxy resins, and aminophenol-type epoxy resins.

[0037] Examples of polyglycidyl ester compounds include dimer acid type epoxy resins, hexahydrophthalic acid type epoxy resins, trimellitic acid type epoxy resins, and the like.

[0038] Examples of alicyclic epoxy compounds include alicyclic epoxy resins containing cycloalkanes such as cyclopropane, cyclobutane, cyclopentane, cyclohexane, cycloheptane, cycloloctan, cyclononane, and cyclodecane as the alicyclic skeleton. The alicyclic skeleton may also be a polycyclic skeleton such as decalin, norbornane, or dicyclopentadiene.

[0039] Other modified epoxy compounds include, for example, urethane-modified epoxy resins, oxazolidone ring-containing epoxy resins, epoxy-modified polybutadiene rubber derivatives, and carboxyl-terminated butadiene nitrile rubber (CTBN)-modified epoxy resins.

[0040] Examples of phenolic resins include novolac-type phenolic resins such as phenol novolac resin, cresol novolac resin, and bisphenol A novolac resin; and resol-type phenolic resins.

[0041] Examples of cyanate resins include novolac-type cyanate resins; bisphenol-type cyanate resins such as bisphenol A-type cyanate resins, bisphenol E-type cyanate resins, and tetramethylbisphenol F-type cyanate resins; naphthol aralkyl-type cyanate resins obtained by the reaction of naphthol aralkyl-type phenol resins with cyanide halides; dicyclopentadiene-type cyanate resins; and biphenylene skeleton-containing phenol aralkyl-type cyanate resins.

[0042] Examples of maleimide resins include bismaleimide resin, biphenylaralkyl maleimide resin, and polyphenylmethanemaleimide resin.

[0043] Examples of benzoxazine resins include reaction products of bisphenol F, formalin, and aniline (Fa-type benzoxazine resin), reaction products of diaminodiphenylmethane, formalin, and phenol (Pd-type benzoxazine resin), reaction products of bisphenol A, formalin, and aniline, reaction products of dihydroxydiphenyl ether, formalin, and aniline, reaction products of diaminodiphenyl ether, formalin, and phenol, reaction products of dicyclopentadiene-phenol addition resin, formalin, and aniline, reaction products of phenolphthalein, formalin, and aniline, reaction products of diphenyl sulfide, formalin, and aniline, and reaction products of diaminodiphenylmethane, formalin, and phenol having an allyl group (ALPd-type benzoxazine resin).

[0044] Examples of melamine resins include condensation resins of amine compounds such as melamine, guanamine, and urea with formaldehyde, and resins obtained by further condensation of such resins with alcohols.

[0045] Among the thermosetting resins mentioned above, epoxy compounds are suitable for forming molded articles with excellent heat resistance and mechanical strength. Therefore, for example, 75% by mass or more of the thermosetting resin contained in the thermosetting resin composition can be epoxy compounds. The proportion of epoxy compounds in the thermosetting resin contained in the thermosetting resin composition may be 80% by mass or more, 85% by mass or more, 90% by mass or more, or 95% by mass or more. The thermosetting resin contained in the thermosetting resin composition may be substantially epoxy compounds only (for example, 99% by mass or more).

[0046] As the epoxy resin, you can use either a solid epoxy resin at room temperature (25°C) (hereinafter also referred to as "solid epoxy resin") or a liquid epoxy resin at room temperature (25°C) (hereinafter also referred to as "liquid epoxy resin").

[0047] Examples of liquid epoxy resins include bisphenol A type epoxy resin, commercially available from Mitsubishi Chemical Corporation under the trade name "jER828". Other liquid epoxy resins include alkylene diglycidyl ethers, such as 1,4-butanediol diglycidyl ether and 1,6-hexanediol diglycidyl ether, in which glycidyl groups are ether-bonded to both ends of an alkylene group. Furthermore, glycidylamine type epoxy resins such as triglycidyl-p-aminophenol are also advantageous because they are liquid at room temperature and exhibit excellent heat resistance in molded articles. To reduce the viscosity of the thermosetting resin composition at room temperature (25°C), an alicyclic epoxy resin having a dicyclopentadiene skeleton (dicyclopentadiene type alicyclic epoxy resin) may be included in the thermosetting resin composition as a liquid epoxy resin. Furthermore, dimer acid type epoxy resins are effective in giving the cured product of the thermosetting resin composition excellent toughness and impact resistance.

[0048] As a dimer acid type epoxy resin, one with a structure like that of the following formula (1) is preferred.

[0049] [ka]

[0050] Examples of solid epoxy resins include trisphenol-type epoxy resins, trisphenolmethane-type epoxy resins, bisphenol A-type epoxy resins, and phenol novolac-type epoxy resins.

[0051] Thermosetting resin compositions may contain organic solvents such as methyl ethyl ketone (MEK) to adjust viscosity at room temperature. However, since the use of organic solvents can cause voids in the molded article, it is preferable to limit the amount used. The organic solvent content in the thermosetting resin composition is, for example, 10% by mass or less. The organic solvent content in the thermosetting resin composition may be 5% by mass or less, or 2% by mass or less. The thermosetting resin composition may contain substantially no organic solvent (1% by mass or less).

[0052] Examples of organic solvents include alcohols such as terpineol, benzyl alcohol, 1-methoxy-2-propanol, and isobutanol; ketones such as methyl ethyl ketone, acetone, and acetophenone; ethers such as methyl cellosolve, ethyl cellosolve, butyl cellosolve, methyl carbitol, ethyl carbitol, butyl carbitol, diethylene glycol dimethyl ether, and tetrahydrofuran; and esters such as methyl cellosolve acetate, ethyl carbitol acetate, butyl carbitol acetate, methyl methoxybutyl acetate, propylene glycol monomethyl ethyl acetate, methoxybutyl acetate, ethyl acetate, butyl acetate, and methyl acetate. These may be used individually or in combination of two or more.

[0053] If the thermosetting resin composition contains an epoxy compound as the thermosetting resin, it may further contain a curing agent that can react with the epoxy compound. The curing agent may include amine-based curing agents such as imidazoles, diaminodiphenylmethane, diaminodiphenylsulfone, diethylenetriamine, triethylenetetramine, isophoronediamine, polyalkylene glycol polyamines, and polyamide resins synthesized from a dimer of linolenic acid and ethylenediamine; amide-based curing agents such as dicyandiamide; and acids such as phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, maleic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylnadic anhydride, hexahydrophthalic anhydride, and methylhexahydrophthalic anhydride. Anhydrous curing agents; phenolic curing agents such as polyhydric phenol compounds and their modified products, including phenol novolac resins, cresol novolac resins, phenol aralkyl resins, cresol aralkyl resins, naphthol aralkyl resins, biphenyl-modified phenol resins, biphenyl-modified phenol aralkyl resins, dicyclopentadiene-modified phenol resins, aminotriazine-modified phenol resins, naphthol novolac resins, naphthol-phenol cocondensed novolac resins, naphthol-cresol cocondensed novolac resins, etc.; BF3-amine complexes, guanidine derivatives, etc. are examples.

[0054] The curing agent in this embodiment preferably contains either an amine-based curing agent such as imidazoles or a phenol-based curing agent, or both. The phenol-based curing agent is preferably a novolac-type phenol resin such as a cresol novolac resin, a naphthol novolac resin, a naphthol-phenol cocondensed novolac resin, or a naphthol-cresol cocondensed novolac resin.

[0055] Imidazoles include, for example, alkylimidazoles such as 1-methylimidazole (1MZ), 2-methylimidazole (2MZ), 2-undecylimidazole (C11Z), and 2-heptadecylimidazole (C17Z); dialkylimidazoles such as 1,2-dimethylimidazole (1,2DMZ) and 2-ethyl-4-methylimidazole (2E4MZ); arylimidazoles such as 2-phenylimidazole (2PZ); and 1-phenyl-4-methylimidazole (2P4MZ). 2-methylimidazole (1B2MZ), 1-cyanoethyl-2-methylimidazole (2MZ-CN), 1-cyanoethyl-2-ethyl-4-methylimidazole (2E4MZ-CN), 1-cyanoethyl-2-undecylimidazole (C11Z-CN), 1-cyanoethyl-2-phenylimidazole (2PZ-CN), 1-cyanoethyl-2-ethyl-4-methylimidazolium trimellitate (2E4MZCNS), 1-cyanoethyl-2-undecylimidazole trimellitate (C11ZCNS), 1-cyanoethyl-2-phenylimidazolium trimellitate (2PZCNS-PW), 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine (2MZ-A), 2,4-diamino-6-(2'-undecylimidazolyl)-ethyl-s-triazine (C11Z-A), 2,4-diamino-6-[2'-ethyl-4-methylimidazolyl-(1')]-ethyl-s-triazine (2E4MZ-A), 2,4-diamino-6-[2'- Methylimidazolyl-(1')-ethyl-s-triazine isocyanurate adduct (2MAOK-PW), 2-phenylimidazole isocyanurate adduct, 2-methylimidazole isocyanurate adduct, 2-phenyl-4,5-dihydroxymethylimidazole (2PHZ-PW), 2-phenyl-4-methyl-5-hydroxymethylimidazole (2P4MHZ), 1-cyanoethyl-2-phenyl-4,5-di(2-cyanoethoxy)methylimidazole, etc. can be used.

[0056] Considering the ease of separation of the molding material from the molded body to the waste material (excess thermosetting resin composition) during the molding process, it is preferable to use imidazoles with a relatively high reaction initiation temperature. Examples of such preferred imidazoles include 1-cyanoethyl-2-undecylimidazolium trimellitate (C11ZCNS), 1-cyanoethyl-2-phenylimidazole (2PZ-CN), 2,4-diamino-6-[2'-ethyl-4-methylimidazolyl-(1')]-ethyl-s-triazine (2E4MZ-A), 2-phenyl-4-methyl-5-hydroxymethylimidazole (2P4MHZ), and 2-phenylimidazole (2PZ).

[0057] The thermosetting resin composition may contain various additives other than those mentioned above, such as silane coupling agents, dispersants, leveling agents, lubricants, antioxidants, anti-aging agents, weathering agents, antibacterial agents, antifungal agents, flame retardants, fragrances, defoaming agents, and colorants. These components may be included in the thermosetting resin composition in such a way that their total amount is 10% by mass or less.

[0058] In the material preparation step of the manufacturing method for the molded article of this embodiment, the prepared molding material may be degassed under reduced pressure to ensure that the thermosetting resin composition reaches every corner of the gaps in the filler.

[0059] The removal of air bubbles contained in the molding material may be carried out during the molding process. By using a vacuum heat press for pressurization and heating during the molding process, the degassing of the molding material can also be performed during the molding process. Furthermore, degassing of the molding material can also be performed by carrying out the molding process using an autoclave.

[0060] In the molding process, if the filler is a continuous fiber, the molding material may be arranged so that the continuous fiber is oriented in a predetermined direction, in order to facilitate obtaining a molded body with a high density of the filler and to facilitate the removal of air bubbles. If the molded body is a press-molded body produced by press molding in which pressure is applied in a specific direction, the separation of excess thermosetting resin composition can be simplified by extending the continuous fiber along one of the directions perpendicular to the direction in which the pressure is applied during press molding. Press molding may be performed by sandwiching the molding material between two press boards with the sides open, or by using a mold in which a molding space corresponding to the molded body is formed inside when the mold is closed, or by an autoclave method in which the molding material is covered with a bagging film and pressure is applied through the bagging film.

[0061] In this embodiment, it is preferable that the thermosetting resin composition does not become highly viscous due to the thermosetting reaction until pressure is applied to the molding material during molding, separating more of the excess thermosetting resin composition. Therefore, in this embodiment, when the exothermic peak temperature of the thermosetting resin composition determined by differential scanning calorimetry is X°C, the thermosetting of the thermosetting resin composition is carried out at a temperature of (X-40)°C or higher and X°C or lower. In this embodiment, for example, when the molding process is carried out using a mold, the molding process is carried out using a mold prepared so that the temperature of the molding surface in contact with the molding material is (X-40)°C to X°C. Also, when press molding is carried out by sandwiching the molding material between press boards, press molding is carried out so that the surface temperature of the press board in contact with the molding material is (X-40)°C to X°C. When the molded body is manufactured using an autoclave method, it is sufficient to carry out the process so that the temperature of the bagging film (pressure gas) in contact with the molding material is (X-40)°C to X°C.

[0062] The molding process may be carried out at a temperature of (X-38)°C to X°C, (X-35)°C to X°C, (X-30)°C to X°C, (X-25)°C to X°C, (X-20)°C to X°C, or (X-15)°C to X°C. It is preferable that the heat curing time in the above temperature ranges be 10 minutes or more continuously. More preferably, the heat curing time in the above temperature ranges is 15 minutes or more continuously, even more preferably 20 minutes or more continuously, and particularly preferably 25 minutes or more continuously. In the molding process, after heat curing in the above ranges, an after-cure may be performed by heating the molded body at a temperature outside the above temperature ranges to ensure that the thermosetting resin composition is properly cured. The after-cure can be performed at a temperature exceeding the above temperature ranges.

[0063] Because the molecular motion of thermosetting resins is restricted by the curing reaction, heating them with a differential scanning calorimetry analyzer reveals an exothermic peak indicating the thermosetting reaction. That is, "X (°C)" represents the temperature at which the amount of heat generated by the curing reaction of the thermosetting resin composition is maximum. This exothermic peak temperature can be determined, for example, by performing differential scanning calorimetry under conditions where the heating rate of the sample is 5°C / min while purging the inside of the apparatus with nitrogen gas.

[0064] Considering the pot life of the thermosetting resin composition and the separability of the thermosetting resin composition during the molding process, it is preferable that the exothermic peak temperature (X°C) be above a certain temperature. The thermosetting resin composition can be prepared so that the exothermic peak temperature (X°C) is, for example, 90°C or higher. The exothermic peak temperature (X°C) may be 100°C or higher, 110°C or higher, or 120°C or higher. On the other hand, considering the workability of the molding process, it is preferable that the exothermic peak temperature (X°C) is not excessively high. The exothermic peak temperature (X°C) is, for example, 200°C or lower. The exothermic peak temperature (X°C) may be, for example, 190°C or lower, 180°C or lower, or 170°C or lower.

[0065] The molding process can be carried out using a mold 10 as shown in Figure 1a, for example. The mold 10 illustrated in the figure has a horizontal direction Dx, a horizontal direction Dy perpendicular to the horizontal direction Dx, and a vertical direction Dz perpendicular to a plane (horizontal plane) parallel to the horizontal direction Dx and the depth direction Dy. The mold 10 illustrated in the figure comprises a male mold 11 and a female mold 12 positioned below the male mold 11, with their respective mating surfaces 11f and 12f facing each other in the vertical direction. The mold 10 illustrated in the figure is configured to switch between a closed state and an open state by moving the male mold 11 and the female mold 12 closer together and further apart in the vertical direction Dz.

[0066] As shown in Figure 2, the female mold 12 is provided with a receiving recess 12a for receiving the molding material M. The receiving recess 12a opens upward in the center of the upper surface (mold-fitting surface 12f) of the female mold 12. The female mold 12 is provided with a bottom surface 12w1 that defines the lower edge of the receiving recess 12a, and a peripheral wall surface 12w2 that extends upward from the outer peripheral surface of the bottom surface 12w1, with the opening edge of the receiving recess 12a defined by the upper edge of the peripheral wall surface 12w2.

[0067] The male mold 11 has a protrusion 11a that enters the receiving recess 12a from above when the mold is closed. The cross-sectional shape of the protrusion 11a in the horizontal plane is smaller than the cross-sectional shape of the receiving recess 12a. In this embodiment, the height of the protrusion 11a of the male mold 11 from the mold-fitting surface 11f is shorter than the depth of the receiving recess 12a from the mold-fitting surface 12f. Therefore, the molding die 10 is configured such that when the male mold 11 and the female mold 12 are brought into contact with each other at their mold-fitting surfaces 11f, 12f and the mold is closed, the bottom surface 12w1 of the receiving recess 12a and the tip surface 11w1 of the protrusion 11a face each other at a distance in the vertical direction. Furthermore, the molding die 10 is configured such that when the mold is closed, the peripheral wall surface 12w2 defining the side edge of the receiving recess 12a and the side wall surface 11w2 of the protrusion 11a face each other with a small clearance (gap). In other words, the mold 10 is configured to form a molding space in which, when the mold is closed, the lower edge is defined by the bottom surface 12w1 of the female mold 12, the upper edge is defined by the tip surface 11w1 of the protrusion 11a of the male mold 11, and the side edge is defined by the peripheral wall surface 12w2 of the female mold 12. Furthermore, the mold 10 is configured to change the volume of the molding space by changing the distance between the mold-fitting surfaces 11f, 12f and changing the depth to which the protrusion 11a penetrates into the receiving recess 12a.

[0068] In this embodiment, the female mold 12 may be composed of multiple divided molds as shown in the figure. The female mold 12 illustrated in Figure 1a is divisible in the lateral direction Dx and is composed of a first divided mold 121 and a second divided mold 122. The first divided mold 121 and the second divided mold 122 are configured such that the plane including their interface divides the molding space into left and right halves. That is, in the female mold 12 illustrated in Figure 1a, the interface between the first divided mold 121 and the second divided mold 122 is formed to connect the space outside the mold and the molding space.

[0069] In the molding process of this embodiment, a larger volume of molding material M than the volume of the molding space when the mold mating surfaces 11f and 12f are in contact is placed in the receiving recess 12a. The convex portion 11a of the male mold 11 is inserted into the receiving recess 12a, and pressure is applied in the direction that brings the male mold 11 and the female mold 12 closer together, while the molding material M is heated to perform thermosetting of the thermosetting resin composition. At this time, any excess thermosetting resin composition contained in the molding material M is discharged out of the mold through the gap between the peripheral wall surface 12w2 of the female mold 12 that defines the side edge of the receiving recess 12a and the side wall surface 11w2 of the convex portion 11a of the male mold 11. At this time, by using continuous fibers as a filler and extending the continuous fibers along one of the directions perpendicular to the vertical direction Dz to orient the filler in a specific direction, the discharge of excess thermosetting resin composition out of the mold can be promoted.

[0070] When continuous fibers are used as a filler, as shown in Figure 3, by using continuous fibers M1 that are shorter than the depth Dy dimension of the receiving recess 12a, the fiber density near the peripheral wall surface 12w2 of the female mold 12 can be reduced, thereby suppressing obstruction of the flow of the thermosetting resin composition M2 moving in the vertical direction Dz along the peripheral wall surface 12w2 by the continuous fibers M1. In other words, this reduces the resistance to the passage of the thermosetting resin composition discharged between the peripheral wall surface 12w2 and the side wall surface 11w2. Furthermore, this allows for the formation of a resin reservoir near the peripheral wall surface 12w2, making it easier to increase the filler density in the central part of the molding space. Thus, in the molding process of this embodiment, by arranging the continuous fibers to extend in a direction perpendicular to the direction in which pressure is applied, and using continuous fibers whose length in this direction is shorter than the length of the molding space, a molded body with a high filler content can be easily produced. The formed resin reservoir can be removed in a secondary processing step as needed.

[0071] The mold 10 of this embodiment may be provided with a flow channel (a through-hole connecting the molding space and the external space) that opens at one end to the molding surface and at the other end to the outer surface of the mold 10, thereby promoting the discharge of excess thermosetting resin composition and air bubbles. Furthermore, the mold 10 of this embodiment may be provided with grooves extending in the vertical direction Dz on either or both of the side wall surface 11w2 of the male mold 11 and the peripheral wall surface 12w2 of the female mold 12, thereby promoting the discharge of excess thermosetting resin composition and air bubbles.

[0072] In this embodiment, since the female mold 12 is composed of multiple segmented molds and is detachable, the molded body in the receiving recess 12a can be easily removed after the molding process. Furthermore, in this embodiment, since the mold 10 is configured such that the interface between the first segmented mold 121 and the second segmented mold 122 connects the space outside the mold and the molding space, a clearance can be provided between the first segmented mold 121 and the second segmented mold 122 to form a slit 12s that serves as a channel for excess thermosetting resin composition and bubbles. In that case, as shown in Figure 4, the excess thermosetting resin composition can be discharged not only from the gap between the male mold 11 and the female mold 12 but also from the gap between the segmented molds 121 and 122 (slit 12s). Therefore, even if the pressure P applied to the mold and the heating conditions of the mold are the same, the separation of the molded body MD and the discharged material ME (excess thermosetting resin composition) will be performed more quickly compared to when the female mold 12 is not composed of segmented molds.

[0073] The same effect can be obtained when using a mold 10 as shown in Figure 1b. The female mold 12 in the mold 10 shown in Figure 1b is composed of five divided molds. The female mold 12 comprises a rectangular plate-shaped bottom plate 123 with its plate surface oriented horizontally, and four side wall blocks 124 positioned above the bottom plate 123. The four side wall blocks 124 are arranged in a rectangular tubular shape along the outer circumference of the bottom plate 123. The inside of these rectangular tubular side wall blocks 124 forms a receiving recess 12a. Even in such a mold 10, by providing a predetermined clearance between the bottom plate 123 and the side wall blocks 124, and between the side wall blocks 124 themselves, the discharge of the thermosetting resin composition from the mold during the molding process can be improved.

[0074] As mentioned above, the material preparation process may be carried out to prepare the molding material in the molding space of the mold. In that case, for example, the mold shown in Figure 5 may be used. The mold 10' shown in Figure 5 is similar to the mold 10 shown in Figures 1a and 1b in that it has a male mold 11 and a female mold 12. The mold 10' shown in Figure 5 is provided with a flow channel in the female mold 12 that connects the molding space 10v formed inside when the mold is closed with the external space 50v outside the mold. The mold 10' is provided with two through holes, a first through hole 12e1 and a second through hole 12e2, which penetrate the side wall of the female mold 12, as the flow channel. Furthermore, the mold 10' shown in Figure 5 has a sealing member that seals the male mold 11 and the female mold 12 when the mold is closed, and is configured to make the molding space 10v airtight. The first through-hole 12e1 and the second through-hole 12e2 can also be used as channels for discharging excess thermosetting resin composition, air bubbles, etc., during the molding process.

[0075] A method for manufacturing a molded body using such a mold 10' is described below. First, as shown in Figure 6a, a filler M1 is placed in the female mold 12, and then the male mold 11 is set to place the filler M1 in the molding space 10v. In this state, the molding material M can be prepared in the mold 10' by introducing the resin composition M2 into the molding space 10v through the first through hole 12e1 and / or the second through hole 12e2. In this material preparation step, as shown in Figure 6a, a discharge path L1 for exhausting air from the molding space 10v may be connected to the first through hole 12e1 via a first on-off valve (first valve V1), and a supply path L2 for supplying the thermosetting resin composition to the molding space 10v may be connected to the second through hole 12e2 via a second on-off valve (second valve V2). Alternatively, the molding space 10v may be depressurized before supplying the thermosetting resin composition to the molding space 10v. In this case, the first valve V1 is opened and the second valve V2 is closed to discharge the air in the molding space 10v through the discharge path L1, thereby reducing the pressure inside the molding space 10v. Then, as shown in Figure 6b, the second valve V2 is opened and the thermosetting resin composition (R-comp.) is introduced into the reduced-pressure molding space 10 through the second through hole 12e2. At this time, because the thermosetting resin composition in this embodiment has low viscosity, the resistance to passing through the second through hole 12e2 is low and it has excellent impregnation properties into the filler M1. Furthermore, since the gaps between the filler M1s are also reduced in pressure beforehand, the thermosetting resin composition can quickly spread to every corner, and the remaining air bubbles between the filler M1s are suppressed.

[0076] In the mold 10' into which the thermosetting resin composition M2 has been introduced into the molding space 10v, pressure (P) can be applied in the direction that brings the male mold 11 and female mold 12 closer together, as shown in Figure 6c, using a hot press or the like. Then, by thermosetting the thermosetting resin composition M2 contained in the molding material M under this pressure, a molded body with a high content of filler M1 can be obtained.

[0077] As described above, the material preparation step in this embodiment may involve molding and introducing the filler and thermosetting resin composition into the mold to prepare the molding material within the mold. In this case, the filler alone or the filler and a portion of the thermosetting resin may be introduced into the mold first, followed by the addition of the thermosetting resin composition. In this case, the addition of the thermosetting resin composition may be carried out with the mold closed. Furthermore, after introducing the filler into the mold, the molding space within the mold containing the filler may be depressurized, and the thermosetting resin composition may be added to the depressurized molding space. By employing such a method, molded bodies with fewer voids can be efficiently manufactured.

[0078] Various methods can be used for the material preparation and molding processes, not limited to the examples given above.

[0079] Suitable examples of molded articles produced in this embodiment include, for example, heat dissipation components such as heat spreaders.

[0080] When manufacturing a molded body with excellent thermal conductivity, carbon fiber can be suitably selected as a filler. A molded body with a high concentration of carbon fiber may have a thermal conductivity of 100 W / m·K or higher in at least one specific direction. The thermal conductivity of the molded body in one direction may be 200 W / m·K or higher, 300 W / m·K or higher, or 500 W / m·K or higher.

[0081] As carbon fibers, for example, vapor-grown carbon materials such as carbon nanotubes and carbon nanoribbons, PAN-based carbon fibers, and pitch-based carbon fibers can be used, with pitch-based carbon fibers, which have high crystallinity of carbon atoms, being preferred.

[0082] The thermal conductivity of a molded body can be measured, for example, using a plate-shaped sample with a thickness of 1 mm or more cut from the molded body. The thermal conductivity (λ: W / m·K) is equal to the thermal diffusivity (α: m) of the plate-shaped sample. 2 (s) and specific heat (C: J / kg·K) and density (ρ: kg / m³) 3The thermal diffusivity of a plate-shaped sample (α: m) can be calculated by determining the product of these values ​​(λ = α × C × ρ). 2 The specific heat (C:J / kg·K) of a plate-shaped sample can be measured, for example, by the laser flash method, using a thermophysical property measuring device (product name "TA35") manufactured by Bethel Co., Ltd. The specific heat (C:J / kg·K) of a plate-shaped sample can be measured, for example, based on JIS K 7123:1987 "Method for determining the specific heat capacity of plastics". The measurement value at 25°C measured by the DSC method based on the said standard can be used as the specific heat (C:J / kg·K) of the plate-shaped sample. For measurement, for example, a differential scanning calorimeter (product name "X-DSC7000") manufactured by Hitachi High-Tech Science Co., Ltd. can be used. The density of a plate-shaped sample can be measured, for example, based on JIS K 7112-1:2023 "Plastics - Method for determining the density of non-foamed plastics - Part 1: Substitution method in water, liquid pycnometer method and buoyancy method", and can be measured by the substitution method in water. For measurement, for example, an electronic hydrometer (product name "EW-300SG") manufactured by Alpha Mirage Co., Ltd. can be used.

[0083] While metals such as copper and aluminum, which have been widely used as forming materials for components such as heat spreaders, have a thermal conductivity of approximately 300 W / m·K, as described above, this embodiment makes it possible to provide components using carbon fibers that exhibit thermal conductivity comparable to or even greater than that of such metals. Moreover, since the molded body composed of a cured thermosetting resin composition and carbon fibers has a lower density than metals, it is effective in reducing the weight of the molded body itself and the equipment that employs the molded body as a component. Furthermore, when a molded body using carbon fibers is used for heat dissipation by contacting a heat-generating mating material such as a semiconductor element, an oxide film does not grow on the surface layer as does with copper or aluminum, so there is a low risk of increased interfacial thermal resistance.

[0084] In the manufacturing method of the molded body of this embodiment, a block-shaped molded body is first formed in the molding process, and then processed into the final product form in the secondary processing process. As for the processing method at that time, general methods using milling machines, end mills, dicing devices, etc., can be employed. When the filler is carbon fiber, the molded body that becomes the final product can exhibit excellent thermal conductivity by being secondary processed so that the cut surfaces of the carbon fibers are exposed on the surface. When the carbon fiber of the filler is continuous fiber, it is preferable that the molded body includes continuous fibers that extend from one surface area to another surface area, and that the cut surfaces of the continuous fibers are exposed on one surface area and the other surface area, respectively.

[0085] The above examples relating to the manufacturing method of the molded article of this embodiment are merely limited examples, and the present invention is not limited in any way to the above examples, and can be implemented by making appropriate modifications to the above examples. As described above, this embodiment includes the following disclosures.

[0086] [1] A method for manufacturing a molded article, comprising molding a molding material containing a filler and a thermosetting resin composition under heat and pressure to thermoset the thermosetting resin composition, Using the thermosetting resin composition whose viscosity, measured with an E-type viscometer at 25°C and 5 rpm, is 50.0 Pa·s or less, A method for manufacturing a molded article, wherein the thermosetting of the thermosetting resin composition is carried out at a temperature of (X-40)°C or higher and X°C or lower, when the exothermic peak temperature of the thermosetting resin composition determined by differential scanning calorimetry is X°C. [2] The method for producing a molded article according to [1], wherein the thermosetting resin composition comprises an epoxy resin and a curing agent. [3] A method for manufacturing a molded article according to [1] or [2], wherein the filler is made of continuous fibers. [Examples]

[0087] The present invention will now be described in more detail with reference to examples, but the present invention is not limited to these examples.

[0088] <Preparation of thermosetting resin composition> To prepare the molding material, five types of thermosetting resin compositions, numbered #1 to #5, were first prepared with the formulations shown in Table 1 below. Furthermore, the viscosity of each of the thermosetting resin compositions #1 to #5 was measured using an E-type viscometer at 25°C and 5 rpm, and the exothermic peak temperature was determined by differential scanning calorimetry. The results are also shown in Table 1.

[0089] [Table 1]

[0090] (Examples 1-5, Comparative Examples 1-5) Molding materials were prepared by impregnating carbon fibers with thermosetting resin compositions #1 to #5. At this time, thermosetting resin compositions #1 to #4 could be impregnated into the carbon fibers without any problems, but thermosetting resin composition #5 did not show sufficient impregnation into the carbon fibers. Next, the obtained molding material was placed in a mold that had been preheated to a predetermined temperature (T°C: thermosetting temperature) and quickly hot-pressed. The discharge of the thermosetting resin composition from the gaps in the mold was checked, and the resulting molded body was inspected. For the molded body, it was checked whether it had hardened sufficiently, whether there were any voids, and whether the presence of voids would cause cracks or other defects during secondary processing.

[0091] The molded body was prepared so that the carbon fibers were oriented in one direction. A plate-shaped sample was cut from the obtained molded body and its thermal conductivity was measured. The plate-shaped sample was cut so that the orientation of the carbon fibers was in the thickness direction. The thermal conductivity was calculated by measuring the thermal diffusivity in the thickness direction of the plate-shaped sample, as well as measuring the specific heat and density, and then using these measured values. The results are shown in Table 2 below.

[0092] [Table 2]

[0093] From the above, it can be seen that a molded article with a high filler content can be manufactured by thermosetting a molding material containing a thermosetting resin composition of a predetermined viscosity at a predetermined temperature. [Explanation of Symbols]

[0094] 10: Molding mold, 11: Male mold, 11a: Convex part, 11f: Mold-fitting surface, 11w1: Tip surface, 11w2: Side wall surface, 12: Female mold, 12a: Receiving recess, 12f: Mold-fitting surface, 12w1: Bottom surface, 12w2: Peripheral wall surface, 121: First split type, 122: Second split type, 123: Base plate, 124: Side wall block, M: Molding material, M1: Continuous fiber (filler), M2: Thermosetting resin composition, MD: Molded object.

Claims

1. A method for manufacturing a molded article, comprising molding a molding material containing a filler and a thermosetting resin composition under heat and pressure to thermoset the thermosetting resin composition, Using the thermosetting resin composition whose viscosity, as measured with an E-type viscometer at 25°C and 5 rpm, is 50.0 Pa·s or less, A method for manufacturing a molded article, wherein the thermosetting of the thermosetting resin composition is carried out at a temperature of (X - 40)°C or higher and X°C or lower, when the exothermic peak temperature of the thermosetting resin composition determined by differential scanning calorimetry is X°C.

2. The method for producing a molded article according to claim 1, wherein the thermosetting resin composition comprises an epoxy resin and a curing agent.

3. The method for manufacturing a molded article according to claim 1 or 2, wherein the filler is a continuous fiber.

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