Dicing device

Abstract

The present invention provides a dicing device that reduces the time and effort required to input blade information when replacing or reusing blades, thereby preventing a decrease in overall throughput. [Solution] The dicing device 10 includes an RFID tag 52, which is a storage means for storing blade information and is provided on the hub 50 of the blade 12; a control unit 26, which functions as a control means for controlling the cutting process of the workpiece by the blade 12 based on the blade information stored in the RFID tag 52; a determination means for the control unit 26 that determines whether or not the blade 12 is usable based on the blade information; and a monitor, which is a notification means that notifies that the blade 12 needs to be replaced if the determination means determines that it is not usable.

Description

Technical Field

[0001] The present invention relates to a dicing device, and more particularly to a dicing device that cuts a workpiece such as a semiconductor wafer with a blade while relatively moving the workpiece and a rotating blade.

Background Art

[0002] In the semiconductor manufacturing process, various processes are performed on the surface of a semiconductor wafer to manufacture a plurality of semiconductor elements having electronic devices. After the electrical characteristics of each chip of the semiconductor element are inspected by an inspection device, the chips are separated one by one by a blade rotating at high speed in a dicing device.

[0003] Since the blade wears over time, it is replaced with a new blade. Also, when changing the type of workpiece, it may be replaced with another type of blade corresponding to that workpiece. When the blade is replaced in this way, since the shape of the blade before and after replacement is different, an operation of registering blade information such as the shape of the blade after replacement in the dicing device is performed. The dicing device controls the cutting depth of the blade with respect to the workpiece based on the registered blade information after replacement, and continues the cutting process.

[0004] Patent Document 1 discloses a dicing device (processing device) that performs a blade replacement operation using an operation screen for blade replacement. In this dicing device, when the blade is replaced, information such as lot ID, new / old information, blade outer diameter, blade thickness, flange outer diameter, etc. is input as blade information according to the display on the displayed operation screen.

[0005] In addition, known blades include electroplated blades, which are made by electroplating diamond abrasive grains or CBN (Cubic Boron Nitride) abrasive grains with nickel, and metal-resin bonded blades, which are bonded with a resin mixed with metal powder. The size of the blade is selected in various ways depending on the processing content, but for dicing typical semiconductor wafers, blades with a diameter of φ50-60 mm and a thickness of around 30 μm are used. [Prior art documents] [Patent Documents]

[0006] [Patent Document 1] Japanese Patent Publication No. 2009-194326 [Overview of the Initiative] [Problems that the invention aims to solve]

[0007] However, in the dicing apparatus disclosed in Patent Document 1, the operator must input blade information using the operation screen each time the blade is replaced, and the dicing apparatus must be stopped during this input process.

[0008] Furthermore, when reusing blades, it is necessary to obtain the latest blade information (blade outer diameter, blade thickness, etc.) using a separate detection device, and it is also necessary to input the acquired latest blade information.

[0009] Thus, conventional dicing machines have a problem in that the overall throughput is reduced because the process of inputting blade information when replacing or reusing blades is time-consuming and laborious.

[0010] This invention has been made in view of these circumstances, and aims to provide a dicing device that can reduce the effort and time required for inputting blade information when replacing or reusing blades, thereby preventing a decrease in overall throughput. [Means for solving the problem]

[0011] To achieve the above objective, one embodiment of the dicing apparatus according to the present invention comprises: a processing unit that cuts a workpiece with a blade while relatively moving the workpiece and the blade; a read / write means capable of reading and writing blade information to an RFID tag provided on the blade; and a control means that controls the processing unit based on the blade information read by the read / write means, and writes blade information created or updated in conjunction with the cutting process by the processing unit to the RFID tag via the read / write means.

[0012] In one embodiment of the dicing apparatus according to the present invention, the blade information includes at least one of the following: the outer diameter of the blade's cutting edge, the thickness of the cutting edge, and the amount of protrusion of the cutting edge.

[0013] In one embodiment of the dicing apparatus according to the present invention, a determination means is provided to determine whether or not a blade is usable based on blade information read by a read / write means. [Effects of the Invention]

[0014] According to the present invention, the effort and time required to input blade information when replacing or reusing blades can be reduced, thereby preventing a decrease in overall throughput. [Brief explanation of the drawing]

[0015] [Figure 1] Overall perspective view showing the dicing apparatus of this embodiment [Figure 2] A perspective view showing the structure of the processing section of the dicing apparatus shown in Figure 1. [Figure 3] (A) is a plan view of the blade, and (B) is a cross-sectional view of the blade. [Figure 4] Block diagram showing the configuration of the dicing apparatus of this embodiment. [Figure 5] This diagram shows an example of blade information stored in an RFID tag. [Figure 6]Flowchart showing an example of the operation of the dicing apparatus according to the present embodiment [Figure 7] Flowchart showing another example of the operation of the dicing apparatus according to the present embodiment

Mode for Carrying Out the Invention

[0016] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0017] First, the dicing apparatus 10 according to the present embodiment will be described. FIG. 1 is an overall perspective view showing the dicing apparatus 10 according to the present embodiment.

[0018] As shown in FIG. 1, the dicing apparatus 10 according to the present embodiment is a dicing apparatus called a twin spindle dicer in which a pair of blades 12, 12 are arranged to face each other. This dicing apparatus 10 includes a pair of spindles 14 having built-in high-frequency motors with blades 12 mounted at their tip ends, and a work table 16 on which a semiconductor wafer W as a work is placed and which adsorbs and holds the semiconductor wafer W, and includes a processing unit 18. This processing unit 18 cuts the semiconductor wafer W with the blade 12 while relatively moving the semiconductor wafer W and the blade 12.

[0019] Further, the dicing apparatus 10 is provided with a cleaning unit 20 for spin-cleaning the processed semiconductor wafer W, a load port 22 on which a cassette storing a plurality of semiconductor wafers W is placed, and a transfer device 24 for transferring the semiconductor wafer W, which are respectively arranged at predetermined positions. Further, the dicing apparatus 10 has a built-in control unit (control means) 26 for comprehensively controlling the operations of the respective members of the dicing apparatus 10.

[0020] FIG. 2 is a perspective view showing the structure of the processing unit 18.

[0021] As shown in Figure 2, the machining section 18 includes an X-table 34. The X-table 34 is guided by X-guides 30, 30 provided on the X-base 28 and driven in the X direction indicated by arrow XX by a linear motor 32. A rotary table 36 that rotates in the θ direction is fixed to the upper surface of the X-table 34, and the work table 16 is mounted on this rotary table 36. Therefore, the work table 16 is moved in the X direction by the X-table 34 and rotated in the θ direction by the rotary table 36.

[0022] Furthermore, the machining section 18 includes a Y-base 38 configured in a gate shape that straddles the X-base 28. A pair of Y-tables 42, 42 are provided on the wall surface of the Y-base 38. The pair of Y-tables 42, 42 are guided by Y-guides 40, 40 fixed to the wall surface of the Y-base 38 and are driven in the Y direction indicated by the arrow YY by a drive device consisting of a stepping motor and a ball screw (not shown).

[0023] Each of the Y-tables 42, 42 is provided with a Z-table 44, 44. The Z-tables 44, 44 are guided by a Z-guide (not shown) provided on the Y-table 42 and driven in the Z-direction indicated by the arrow ZZ by a drive device consisting of a stepping motor and a ball screw (not shown). Spindles 14, 14 are fixed to the Z-tables 44, 44 in an opposing position, and blades 12, 12 attached to the tips of the spindles 14, 14 are positioned opposite each other.

[0024] With the configuration of the processing unit 18 described above, the blades 12, 12 are indexed and fed in the Y direction and in the Z direction, while the work table 16 is cut and fed in the X direction and rotated in the θ direction. These operations are controlled by the control unit 26 (see Figure 1), but the amount of cutting in the Z direction is controlled in particular according to the amount of protrusion of the cutting edge of the blade 12, so when the blade 12 is replaced, the new amount of protrusion of the cutting edge is always input to the control unit 26 of the dicing device 10. The amount of protrusion of the cutting edge of the blade 12 will be described later.

[0025] The aforementioned X direction refers to one direction in the horizontal direction, and the Y direction refers to the direction perpendicular to the X direction in the horizontal direction. Furthermore, the Z direction refers to the vertical direction perpendicular to the X and Y directions, respectively, and the θ direction refers to the direction of rotation with the vertical axis as the central axis.

[0026] Figure 3(A) is a front view of the blade 12, and Figure 3(B) is a cross-sectional view of the blade 12.

[0027] As shown in Figures 3(A) and (B), the blade 12 is constructed by attaching a cutting edge 48 to the outer peripheral edge of one end face of a hub (also called a flange) 50 made of aluminum alloy or the like. The cutting edge 48 is provided on the hub 50 by electroforming abrasive grains such as diamond. In addition, a mounting hole 46 is provided in the center of the hub 50 for attaching the blade 12 to the spindle 14 of the dicing device 10.

[0028] The blade portion 48 is the part that cuts into the semiconductor wafer W. The thickness t (also called the blade thickness) of the blade portion 48 is at least thinner than the thickness of the semiconductor wafer W. For example, when cutting a semiconductor wafer W with a thickness of 100 μm, the thickness t of the blade portion 48 is preferably 50 μm or less, more preferably 30 μm or less, and even more preferably 10 μm or less. The cross-sectional shape of the blade portion 48 may be a straight shape with a uniform thickness, or a tapered shape in which the thickness gradually decreases towards the outer circumference.

[0029] Here, the value obtained by subtracting the outer diameter φ2 of the hub 50 from the outer diameter φ1 of the blade portion 48 and dividing the result by 2 ((φ1-φ2) / 2) is the aforementioned protrusion amount a of the blade portion 48. The protrusion amount a of the blade portion 48 is a value that decreases with the passage of processing time, and is also reset in the dicing device 10 each time the blade 12 is replaced with a new blade 12.

[0030] As mentioned above, the protrusion amount a of the blade portion 48 is a major factor in controlling the depth of cut in the Z direction. Therefore, even during processing with the same blade 12, the protrusion amount a of the blade portion is indirectly measured by a detection device that detects the position of the cutting edge of the blade 12, and the measured protrusion amount a is updated in the control unit 26 of the dicing device 10. Also, when the blade 12 is replaced, the protrusion amount a of the blade portion 48 of the replaced blade 12 is reset in the control unit 26. In the case of a new blade 12, the protrusion amount a of the blade portion 48 is specified as a catalog value.

[0031] Incidentally, as shown in Figure 3(A), the blade 12 in this embodiment is equipped with an RFID (Radio Frequency Identifier) ​​tag 52. This RFID tag 52 is a read / write storage medium and is provided on the surface of the blade 12.

[0032] The dicing device 10 of this embodiment has the following configuration for reading and writing blade information to the RFID tag 52 provided on the blade 12.

[0033] Figure 4 is a block diagram showing the configuration for reading and writing RFID tags 52 provided on blades 12 in the dicing device 10 of this embodiment.

[0034] As shown in Figure 4, the dicing apparatus 10 of this embodiment includes a reader / writer (read / write means) 54 that reads and writes blade information to an RFID tag 52 provided on the blade 12, and a control unit 26 that controls the processing unit 18 based on the blade information read by the reader / writer 54, and also controls the writing of the latest blade information to the RFID tag 52 via the reader / writer 54.

[0035] The control unit 26 is equipped with a RAM (Random Access Memory) 56 that stores blade information read by the reader / writer 54. The control unit 26 controls the processing unit 18 described above while referring to the blade information stored in the RAM 56.

[0036] Furthermore, the RAM 56 stores blade information (latest blade information) created or updated in connection with the cutting process performed by the machining unit 18. As will be described later, the control unit 26 writes the latest blade information stored in the RAM 56 to the RFID tag 52 using the reader / writer 54.

[0037] Figure 5 shows an example of blade information stored in the RFID tag 52.

[0038] As shown in Figure 5, the blade information stored in the RFID tag 52 includes at least the outer diameter φ1, thickness t, and protrusion amount a of the blade portion 48 of the blade 12. In addition to these, it may also include the type of abrasive grain of the blade 12, the grit size (number), concentration (content), and the type of binder. The blade information may be catalog values ​​or detailed information measured after the manufacture of the blade 12.

[0039] Next, the operation of the dicing apparatus 10 of this embodiment will be described.

[0040] Figure 6 is a flowchart showing an example of the operation of the dicing apparatus 10 in this embodiment.

[0041] As shown in Figure 6, in the dicing device 10, before the blade 12 is mounted on the spindle 14, or after the blade 12 is mounted on the spindle 14, the blade information stored in the RFID tag 52 is read by the reader / writer 54 (step S100). At this time, the blade information read by the reader / writer 54 is stored in the RAM 56 of the control unit 26.

[0042] Next, the control unit 26 controls the machining unit 18 based on the blade information read by the reader / writer 54 (specifically, the blade information stored in the RAM 56) (step S110).

[0043] The control unit 26 specifically controls the machining unit 18 by referring to blade information read from the RFID tag 52, namely the outer diameter φ1, thickness t, and protrusion amount a, when driving the machining unit 18 in the Y or Z direction, and adjusting the amount of movement in the Y or Z direction. This enables cutting operations specific to that blade 12.

[0044] Next, the control unit 26 controls the reader / writer 54 to write the latest blade information to the RFID tag 52 when the processing unit 18 has finished processing or is in the middle of processing (step S120). The blade information written to the RFID tag 52 is read again by the reader / writer 54 when the blade 12 is reused, and the control unit 26 controls the processing unit 18 based on the information read.

[0045] In step S120, the blade information written to the RFID tag 52 includes, as described above, information about the shape of the blade 12, as well as history information about the blade 12's usage process (usage time, identification code that identifies the dicing device used, error information of the dicing device), etc. Information about the shape of the blade 12 is written to the RFID tag 52 by the reader / writer 54 when the blade 12 is removed from the spindle 14, or when processing is completed by the processing unit 18. For example, if the dicing device 10 is equipped with a detection device that detects the position of the cutting edge of the blade 12, the outer diameter φ1 and protrusion amount a of the blade portion 48 are calculated from the detection result of the detection device and written to the RFID tag 52 as the latest blade information. As a result, the RFID tag 52 of the blade 12 is updated and written with the latest outer diameter φ1 and protrusion amount a as it is updated. Alternatively, the RFID tag 52 of the blade 12 may be configured to write to the RFID tag 52 while retaining a history of the outer diameter φ1 and protrusion amount a after each processing completion. This makes it possible to understand the number of times the blade 12 has been replaced and the amount of wear on the blade 12 after one use, and to utilize this information for maintenance of the blade 12.

[0046] In the dicing device 10 of this embodiment, the RFID 52 of the blade 12 stores the latest blade information, so it is possible to instantly determine whether the blade 12 is usable or not based on the blade information read by the reader / writer 54 without using a separate detection device.

[0047] Figure 7 is a flowchart showing another example of the operation of the dicing device 10 of this embodiment, illustrating the process of determining whether the blade 12 is usable based on the blade information read by the reader / writer 54. The dicing device 10 is assumed to have a preset minimum value (minimum protrusion amount) of the protrusion amount a of the blade portion 48 as a reference value (threshold) for determining whether the blade 12 is usable. The minimum value of the protrusion amount a of the blade portion 48 may be set by the user via an input unit (not shown).

[0048] As shown in Figure 7, first, before the blade 12 is mounted on the spindle 14, or after the blade 12 is mounted on the spindle 14, the blade information stored in the RFID tag 52 is read by the reader / writer 54 (step S200). At this time, the blade information read by the reader / writer 54 is stored in the RAM 56 of the control unit 26.

[0049] Next, the control unit 26 functions as a determination means of the present invention and compares the amount of protrusion of the blade portion 48 (current protrusion amount) a included in the blade information read by the reader / writer 54 with the minimum protrusion amount described above, and determines whether the current protrusion amount a is greater than the minimum protrusion amount (S210).

[0050] In step S210, the control unit 26 determines that the blade 12 is usable if the current protrusion amount a is greater than the minimum protrusion amount (step S220). In this case, the machining unit 18 is set to a state where it can perform machining. On the other hand, if the control unit 26 determines that the current protrusion amount a is less than (or less than or equal to) the minimum protrusion amount, it determines that the blade 12 is unusable (step S230). In this case, the machining unit 18 is set to a state where it cannot perform machining, and a message indicating that the blade 12 needs to be replaced is displayed on the monitor (not shown).

[0051] The process shown in the flowchart is now complete.

[0052] As described above, with the dicing device 10 of this embodiment, an RFID tag 52 is provided on the blade 12, and the blade information (outer diameter φ1 of the blade portion 48, thickness t, protrusion amount a, etc.) stored in the RFID tag 52 is automatically read, and processing is performed based on the read blade information. Furthermore, since the latest blade information is written to the RFID tag 52 of the blade 12, there is no need to acquire the latest blade information again when the blade 12 is reused as a used blade. Therefore, the effort and time required for inputting blade information when replacing or reusing the blade 12 can be reduced, and a decrease in throughput caused by replacing the blade 12 can be prevented. As a result, the operating time of the dicing device 10 can be increased, and the overall throughput can be improved.

[0053] Furthermore, in the dicing device 10 of this embodiment, the latest blade information is stored in the RFID 52 of the blade 12, so it is possible to instantly determine whether the blade 12 is usable or not based on the blade information read by the reader / writer 54 without using a separate detection device. In other words, the determination of whether the blade 12 is usable or not is performed automatically in the dicing device 10, which reduces the burden of verification work for the user.

[0054] Furthermore, in the dicing device 10 of this embodiment, the blade 12 is provided with an RFID tag 52 as a read / write storage medium. Therefore, in addition to blade information such as the outer diameter φ1, thickness t, and protrusion amount a of the blade portion 48, history information of the usage process (usage time, identification code that identifies the dicing device used, and malfunction information of the dicing device) can be written to the RFID tag 52.

[0055] Furthermore, since blade information can be read and written to the RFID tag 52 without contact using the reader / writer 54, it is possible to read and write blade information even in environments where cutting fluid, cooling water, and cutting dust are scattered. [Explanation of Symbols]

[0056] W...Workpiece, 10...Dicing device, 12...Blade, 14...Spindle, 16...Worktable, 18...Processing section, 20...Cleaning section, 22...Load port, 24...Transfer device, 26...Control unit, 28...X base, 30...X guide, 32...Linear motor, 34...X table, 36...Rotating table, 38...Y base, 40...Y guide, 42...Y table, 44...Z table, 46...Mounting hole, 48...Blade section, 50...Hub, 52...RFID tag, 54...Reader / writer, 56...RAM

Claims

[Claim 1] A dicing apparatus comprising a blade composed of an annular cutting edge and a hub that holds the cutting edge, and a spindle for rotating the blade, wherein the apparatus cuts a workpiece with the blade while relatively moving the blade rotated by the spindle, The hub is provided with a storage means for storing blade information, A reading means for reading the blade information from the storage means of the blade mounted on the spindle, A control means that controls the cutting process of the workpiece by the blade based on the blade information read by the reading means, A determination means that determines whether the blade is usable based on the blade information stored in the storage means, If the determination means determines no, a notification means provides notification that the blade needs to be replaced. A dicing device equipped with the following features.

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