Through-via detection device and method for TGV glass substrates

Abstract

This invention provides a through-via detection device for TGV glass substrates. [Solution] A first depth-of-field camera and a first sighting light source, installed on a glass substrate, face the upper surface of the glass substrate, while a second depth-of-field camera and a second sighting light source, installed below the glass substrate, face the lower surface of the glass substrate. The first and second sighting light sources emit a first sighting beam and a second sighting beam, respectively, onto the glass substrate, and the wavelength band of the light of the first sighting beam is the same as or different from the wavelength band of the light of the second sighting beam. The first and second depth-of-field cameras are used to acquire a first image and a second image, respectively, and the microcontroller unit of the TGV glass substrate through-via detection device obtains at least one detection result for at least one glass substrate through-via in the glass substrate based on the first and second images.

Description

Technical Field

[0001] The present invention relates to a through-via detection device and method for a TGV (Through Glass Via) glass substrate. More specifically, it relates to a through-via detection device and detection method for a TGV glass substrate (Via detection device and method for TGV(Through Glass Via)substrate) that obtains the detection result of through vias in a glass substrate by using two depth-of-field cameras and two collimating light sources located above and below the glass substrate.

Background Art

[0002] Conventional two-dimensional (2D) chip packaging technology can no longer meet the current chip speed, efficiency, and slimming requirements, so two-and-a-half-dimensional (2.5D) and three-dimensional (3D) chip packaging technologies have been proposed. Since 2.5D and 3D chip packaging technologies need to use an interposer with through vias to electrically connect different chips, conventionally, a silicon substrate with through silicon vias (TSV) (note: a silicon substrate with TSV is also called a TSV silicon substrate) has been used as the interposer. However, since silicon is a Group Ⅳ semiconductor material, the surrounding charge carriers can move freely under the action of an electric field or magnetic field, which may affect adjacent circuits and signals and have a significant impact on the performance of the chip. However, since glass materials have no freely moving charges, they have good dielectric properties and a thermal expansion coefficient (CTE) close to that of silicon. Therefore, a glass substrate with through glass vias (TGV) (note: a glass substrate with TGV is also called a TGV glass substrate) has been proposed and is replacing the silicon substrate as the interposer.

[0003] The manufacturing method for a glass substrate having through-vias involves first modifying the glass substrate by irradiating it with a laser at predetermined locations on the glass substrate where the through-vias will be formed. Next, through-vias are formed at predetermined locations using immersion etching. Figure 1 is a schematic plan view from above of a glass substrate having through-vias according to one embodiment of the present invention. Figure 2 is a schematic side view of the cross-section shown in Figure 1. The cross-section in Figure 2 is a cross-section along the cross-sectional line AA in Figure 1. The glass substrate 1 has a plurality of through-vias 12 that penetrate the upper surface 10 and the lower surface 12 of the glass substrate 1. Each of the through-vias 12 has an upper opening 121 on the upper surface 10 and a lower opening 123 on the lower surface 11, and there is a waist depth between the upper surface 10 and the lower surface 11. Through-vias 122 are formed in the waist depth. The upper opening 121 and the lower opening 123 have opening diameters Rt and Rb, respectively, and the through-via 122 in the waist depth forms a through-via diameter Rm.

[0004] It is necessary to detect parameter information such as aperture diameter Rt, Rb, and through-via diameter Rm to evaluate whether the glass substrate 1 meets the requirements. One of the prior art methods involves detection using X-rays. However, detection using X-rays may damage the glass substrate 1, and other defects may occur in the glass substrate 1. Another prior art method involves detection using a microscope, but inspection using a microscope is very time-consuming and not economically beneficial. Yet another prior art method involves first filling the glass substrate through-via 12 with a lossless plasticizer, then removing the lossless plasticizer to make the above information measurable. However, this method requires filling with a lossless plasticizer, and in addition to the problems of cost and detection time, there is also the problem of the lossless plasticizer remaining in the glass substrate through-via 12. Therefore, in view of the above problems, the present invention proposes a novel glass substrate through-via detection technology to solve the above technical problems. [Overview of the Initiative] [Problems that the invention aims to solve]

[0005] This invention has been made in view of these circumstances, and its purpose is to provide a through-via detection device for TGV glass substrates. [Means for solving the problem]

[0006] To solve the above problems, a TGV glass substrate through-via detection device according to one aspect of the present invention comprises a first depth-of-field camera, a first sighting light source, a second depth-of-field camera, a second sighting light source, and a microcontroller unit. The first depth-of-field camera and the first sighting light source are mounted on a glass substrate having at least one glass substrate through-via and are facing the upper surface of the glass substrate. The second depth-of-field camera and the second sighting light source are mounted below the glass substrate and are facing the lower surface of the glass substrate. The microcontroller unit is electrically connected to the first depth-of-field camera, the first sighting light source, the second depth-of-field camera, and the second sighting light source. The first sighting light source and the second sighting light source emit a first sighting beam and a second sighting beam, respectively, onto the glass substrate, and the wavelength band of the light of the first sighting beam is different from the wavelength band of the light of the second sighting beam. The first depth-of-field camera and the second depth-of-field camera are used to acquire the first and second images, respectively, and the microcontroller unit is used to obtain at least one detection result of at least one glass substrate through-via based on the first and second images.

[0007] To solve the above problems, another aspect of the present invention, a TGV glass substrate through-via detection device, comprises a first depth-of-field camera, a first sighting light source, a second depth-of-field camera, a second sighting light source, a spectrometer module, a third depth-of-field camera, and a control microcontroller unit. The first depth-of-field camera and the first sighting light source are mounted on a glass substrate having at least one glass substrate through-via and are facing the upper surface of the glass substrate. The second depth-of-field camera and the second sighting light source are mounted below the glass substrate and are facing the lower surface of the lower surface of the glass substrate. The control microcontroller unit is electrically connected to the first depth-of-field camera, the first sighting light source, the second depth-of-field camera, the second sighting light source, and the third depth-of-field camera. The spectrometer module is mounted between the upper surface of the glass substrate and the first sighting light source. The third depth-of-field camera is mounted on one side of the spectrometer module. The first and second sighting light sources emit the first and second sighting beams, respectively, onto the glass substrate. The spectrometer module is used for the first sighting beam emitted toward the glass substrate, the first sighting beam reflected by the glass substrate, and the second sighting beam transmitted through the glass substrate. A portion of the spectrally separated second sighting beam transmitted through the glass substrate via, a portion of the spectrally separated first sighting beam emitted toward the glass substrate, and a portion of the spectrally separated first sighting beam reflected by the glass substrate are received by the third depth-of-field camera. The remaining spectrally separated portion of the second sighting beam transmitted through the glass substrate via, and the remaining spectrally separated portion of the first sighting beam reflected by the glass substrate are received by the first depth-of-field camera. The remaining spectrally separated portion of the first sighting beam emitted toward the glass substrate irradiates the glass substrate. The wavelength band of the first sighting beam light is the same as or different from the wavelength band of the second sighting beam light. The first depth-of-field camera, the second depth-of-field camera, and the third depth-of-field camera are used to acquire the first image, the second image, and the third image, respectively, and the control microcontroller unit is used to obtain at least one detection result of at least one glass substrate through-via based on the first image, the second image, and the third image.

[0008] Furthermore, in order to achieve the above objective, another further aspect of the present invention, a method for detecting through-vias in a TGV glass substrate, is performed in a through-via detection device for a TGV glass substrate, and involves moving the first depth-of-field camera, first sighting light source, second depth-of-field camera, and second sighting light source of the through-via detection device for a TGV glass substrate, wherein the first depth-of-field camera and first sighting light source are placed on a glass substrate having at least one through-via and face the upper surface of the glass substrate, and the second depth-of-field camera and second sighting light source are placed below the glass substrate and face the lower surface of the glass substrate, and the through-via detection device for a TGV glass substrate The process includes the steps of: using a microcontroller unit to control a first depth-of-field camera, a first sighting light source, a second depth-of-field camera, and a second sighting light source, causing the first sighting light source and the second sighting light source to emit a first sighting beam and a second sighting beam onto a glass substrate, respectively, and using the first depth-of-field camera and the second depth-of-field camera to acquire a first image and a second image, respectively, wherein the wavelength band of the light of the first sighting beam is different from the wavelength band of the light of the second sighting beam; and using a microcontroller unit of a through-via detection device for a TGV glass substrate to obtain at least one detection result of at least one through-via of the glass substrate based on the first image and the second image.

[0009] In summary, the present invention provides a through-via detection device and detection method for optical TGV glass substrates that do not require the filling of lossless plasticizing material, thereby shortening detection time, reducing costs, and further preventing damage to the glass substrate. [Brief explanation of the drawing]

[0010] [Figure 1] This is a schematic plan view from above of a glass substrate having through-vias according to one embodiment of the present invention. [Figure 2] This is a schematic side view of the cross-section shown in Figure 1. [Figure 3] This is a schematic top view of a glass substrate detected by a through-via detection device for TGV glass substrates according to one embodiment of the present invention. [Figure 4]This is a schematic cross-sectional view of a glass substrate detected by a through-via detection device for TGV glass substrates according to one embodiment of the present invention. [Figure 5] This is a schematic diagram showing a first depth-of-field camera and a first sighting light source according to one embodiment of the present invention, which are realized by a first telecentric lens imaging module. [Figure 6] This is a schematic diagram showing the first and second images according to one embodiment of the present invention. [Figure 7] This is a type of defect that can be detected by a through-via detection device for TGV glass substrates according to one embodiment of the present invention. [Figure 8A] This is a schematic inclined view of a partial configuration showing a through-via detection device for a TGV glass substrate according to one embodiment of the present invention. [Figure 8B] This is a schematic front view of a partial configuration showing a through-via detection device for a TGV glass substrate according to one embodiment of the present invention. [Figure 8C] A schematic side view of a partial configuration showing a through-via detection device for a TGV glass substrate according to one embodiment of the present invention. [Figure 9] A schematic side view of a through-via detection device for a TGV glass substrate according to another embodiment of the present invention, with respect to the glass substrate detection side. [Modes for carrying out the invention]

[0011] Embodiments of the present invention will be described in detail below. However, the present invention is not limited thereto, and various modifications are possible within the scope described. Embodiments obtained by appropriately combining the technical means disclosed in different embodiments are also included within the technical scope of the present invention.

[0012] Figure 3 is a schematic top view of a glass substrate detected by a through-via detection device for TGV glass substrates according to one embodiment of the present invention. Figure 4 is a schematic cross-sectional view of a glass substrate detected by a through-via detection device for TGV glass substrates according to one embodiment of the present invention. The cross-sectional view of the glass substrate 1 in Figure 4 shows a cross-section obtained by cutting along the cross-sectional line BB in Figure 3. The through-via detection device for TGV glass substrates includes a first depth-of-field camera 211, a first sighting light source 212, a second depth-of-field camera 221, a second sighting light source 222, and a microcontroller unit 23. The first depth-of-field camera 211 and the first sighting light source 212 can be realized by integrating them as a single first telecentric lens imaging module 21, and the second depth-of-field camera 221 and the second sighting light source 222 can be realized by integrating them as a single second telecentric lens imaging module 22, but the present invention is not limited thereto.

[0013] The first depth-of-field camera 211 and the first sighting light source 212 are mounted on a glass substrate 1 having at least one glass substrate through via 12, and are facing the upper surface 10 of the glass substrate 1. Here, "facing the upper surface 10 of the glass substrate 1" means that the extension directions of both the imaging end of the first depth-of-field camera 211 and the exit end of the first sighting light source 212 are perpendicular to the upper surface 10 of the glass substrate 1. The second depth-of-field camera 221 and the second sighting light source 222 are mounted below the glass substrate 1, and are facing the lower surface 11 of the glass substrate 1. Here, the statement that the second depth-of-field camera 221 and the second sighting light source 222 are directly facing the lower surface 11 of the glass substrate 1 means that the extension directions of both the imaging end of the second depth-of-field camera 221 and the emission end of the second sighting light source 222 are perpendicular to the lower surface 11 of the glass substrate 1.

[0014] The microcontroller unit 23 is electrically connected to the first depth-of-field camera 211, the first sighting light source 212, the second depth-of-field camera 221, and the second sighting light source 222, and the first depth-of-field camera 211, the first sighting light source 212, the second depth-of-field camera 221, and the second sighting light source 222 are controlled by the microcontroller unit 23. The microcontroller unit 23 controls the first sighting light source 212 and the second sighting light source 222 to emit the first sighting beam L1 and the second sighting beam L2 onto the glass substrate 1, respectively, so that the wavelength band of the light of the first sighting beam L1 is the same as or different from the wavelength band of the light of the second sighting beam L2. The statement that the wavelength band of the light of the first sighting beam L1 is the same as or different from the wavelength band of the light of the second sighting beam L2 means that the color of the beam of the first sighting beam L1 is the same as or different from the color of the beam of the second sighting beam L2. For example, the beam color of the first sighting beam L1 and the beam color of the second sighting beam L2 are selected from red, green, blue, and white. Incidentally, the sighting accuracy of the first sighting beam L1 and the second sighting beam L2 is related to the depth of the glass substrate through via 12, that is, related to the thickness of the glass substrate 1. The first depth-of-field camera 211 and the second depth-of-field camera 221 may be monochrome or color cameras depending on the actual usage conditions.

[0015] The first sighting beam L1 and the second sighting beam L2 are irradiated onto the glass substrate 1, and then the second sensing beam and the first sensing beam are generated and provided to the first depth-of-field camera 211 and the second depth-of-field camera 221, respectively, so that the first depth-of-field camera 211 and the second depth-of-field camera 221 acquire the first image and the second image. Next, the microcontroller unit 23 is used to obtain at least one detection result of at least one glass substrate through-via 12 based on the first image and the second image. Incidentally, the maximum discrimination depth of the first depth-of-field camera 211 and the second depth-of-field camera 221 is related to the depth of the glass substrate through-via 12, that is, related to the thickness of the glass substrate 1.

[0016] Furthermore, refer to Figures 3, 4, and 7. The detection results include at least one of the following: the upper opening diameter Rt and lower opening diameter Rb of the upper opening 121 and lower opening 123 of the glass substrate through via 12 (to determine whether there is any hole diameter abnormality), opening coordinates, opening roundness (to determine whether there is any roundness abnormality), crack detection results, dirt detection results, impact detection results, abrasion detection results, impurity detection results, edge chipping detection results, through via diameter Rm of the glass substrate through via 12, hole blockage detection results of the glass substrate through via 12 (to determine whether there is any hole blockage abnormality), and the amount of displacement between the upper opening and the lower opening (to determine whether there is any displacement abnormality).

[0017] Figure 5 is a schematic diagram showing a first depth-of-field camera and a first sighting light source according to one embodiment of the present invention, which are realized by a first telecentric lens imaging module. The first telecentric lens imaging module 21 comprises a light-receiving lens module 213, a telecentric lens module 214, and an imaging module 215. The external shape of the first telecentric lens imaging module 21 is T-shaped. The imaging module 215 is installed at the upper end of the first telecentric lens imaging module 21, the light-receiving lens module 213 is installed at the side end of the first telecentric lens imaging module 21, and the telecentric lens module 214 is installed at the bottom end of the first telecentric lens imaging module 21. The light-receiving lens module 213 receives the beam L0 of the initial light source, the telecentric lens module 214 emits the first sighting beam L1 and is used to receive the first sensing beam L2' (generated by being irradiated onto the glass substrate 1 from the second sighting beam L2), and the imaging module 215 is used to generate the first image based on the first sensing beam L2'.

[0018] Furthermore, similar to FIG. 5, the second telecentric lens imaging module 22 in FIG. 4 includes another light-receiving lens module, another telecentric lens module, and another imaging module. The outer shape of the second telecentric lens imaging module 22呈a T shape. The other imaging module is installed at the upper end of the second telecentric lens imaging module 22, the other light-receiving lens module is installed at the side end of the second telecentric lens imaging module 22, and the other telecentric lens module is installed at the bottom end of the second telecentric lens imaging module 22. The other light-receiving lens module receives the beam of another initial light source, and the other telecentric lens module is used to emit the second collimation beam L2 and receive the second sensing beam (generated by irradiating the glass substrate 1 from the first collimation beam L1). The other imaging module is used to generate a second image based on the second sensing beam.

[0019] FIG. 6 is a schematic configuration diagram showing a first image and a second image according to an embodiment of the present invention. The left side of FIG. 6 shows the first image, and the right side of FIG. 6 shows the second image. The first image shows a partial image of the upper opening 121 of at least one glass substrate through hole 12 of the glass substrate 1, the through hole 122 of the waist depth, and the upper surface 10 of the glass substrate 1 near the upper opening 121. The color of the through hole is the color of the beam of the second collimation beam L2, the color from the upper opening 121 to the through hole 122 is black, and the partial color of the upper surface 10 of the glass substrate 1 near the upper opening 121 is a mixed color of the color of the beam of the first collimation beam L1 and the color of the beam of the second collimation beam L2.

[0020] The second image shows a partial image of the lower opening 123 of at least one glass substrate through-hole 12 of the glass substrate 1, the through-hole 122 with a waist depth, and the lower surface 11 of the glass substrate 1 near the lower opening 123. The color of the through-hole 122 is the color of the beam of the first collimation beam L1, the color from the lower opening 123 to the through-hole 122 is black, and the color of the partial lower surface 11 of the glass substrate 1 near the lower opening 123 is a mixed color of the color of the beam of the first collimation beam L1 and the color of the beam of the second collimation beam L2.

[0021] Furthermore, the through-hole detection device for the TGV glass substrate further includes a main frame (not shown) and a glass substrate mounting structure (not shown). The glass substrate mounting structure is installed in the main frame and is used to contact at least a part of the glass substrate 1 (for example, the four corners, but the present invention is not limited thereto), and mounts the glass substrate 1. Also, refer to FIGS. 8A to 8C. FIG. 8A is a schematic inclined view of a partial configuration showing a through-hole detection device for a TGV glass substrate according to an embodiment of the present invention. FIG. 8B is a schematic front view of a partial configuration showing a through-hole detection device for a TGV glass substrate according to an embodiment of the present invention. FIG. 8C is a schematic side view of a partial configuration showing a through-hole detection device for a TGV glass substrate according to an embodiment of the present invention. In addition to the main frame (not shown) and the glass substrate mounting structure (not shown), the through-hole detection device for the TGV glass substrate further includes a base structure 24 for mounting and fixing the first telecentric lens imaging module 21 and the second telecentric lens imaging module 22. The base structure 24 includes a common base 240, a first base 241a, and a second base 241b, and the first base 241a and the second base 241b are installed on opposite sides of the common base 240 and are used to mount and fix the first telecentric lens imaging module 21 and the second telecentric lens imaging module 22, respectively.

[0022] In one embodiment, if the size of the glass substrate 1 is not large, complete first and second images of the glass substrate 1 can be obtained without moving the first telecentric lens imaging module 21 and the second telecentric lens imaging module 22, and the joint base 240 is fixed in the main frame. The glass substrate mounting structure is also fixed in the main frame, and the glass substrate 1 does not move relative to the first telecentric lens imaging module 21 and the second telecentric lens imaging module 22. If the size of the glass substrate 1 is too large, complete first and second images of the glass substrate 1 cannot be obtained without moving the first telecentric lens imaging module 21 and the second telecentric lens imaging module 22, and therefore the glass substrate 1 needs to be designed to be movable relative to the first telecentric lens imaging module 21 and the second telecentric lens imaging module 22. In this case, the joint base 240 may be fixed in the main frame and the glass substrate mounting structure may be designed to be movable in the main frame, or the joint base 240 may be movable in the main frame and the glass substrate mounting structure may be fixed in the main frame. Furthermore, the TGV glass substrate through-via detection device is further equipped with a transmission mechanism for moving it by connecting it to either the connecting and movable joint base 240 or the glass substrate mounting structure, thereby making the glass substrate 1 movable relative to the first telecentric lens imaging module 21 and the second telecentric lens imaging module 22.

[0023] In addition, the first base 241a and the second base 241b are each equipped with an adjustment structure, which may be, for example, an adjustment gasket, an adjustment screw, an adjustment bearing, or other adjustment member, but the present invention is not limited to these. The adjustment structures of the first base 241a and the second base 241b are used to adjust the displacement of the first telecentric lens imaging module 21 and the second telecentric lens imaging module 22, respectively, and the displacement may be, for example, a displacement of the X-axis and Y-axis, or a displacement of the X-axis, Y-axis, and Z-axis. Overall, the present invention does not limit the method of realizing the adjustment structure. Furthermore, as described above, in the present invention, when the first telecentric lens imaging module 21 and the second telecentric lens imaging module 22 move relative to the glass substrate 1, the movement of the first telecentric lens imaging module 21 and the second telecentric lens imaging module 22 relative to the glass substrate 1 is designed to be a jointly linked movement. The advantages include the fact that, after adjusting the displacement, the first telecentric lens imaging module 21 and the second telecentric lens imaging module 22 do not shift again when moved independently, thus preventing the need for readjustment. This results in improved measurement accuracy and reduced time and human costs associated with adjusting the displacement.

[0024] Furthermore, based on the above, the present invention further provides a method for detecting through-vias in a TGV glass substrate. The method for detecting through-vias in a TGV glass substrate is performed in a TGV glass substrate through-via detection device, and involves moving the first depth-of-field camera, first sighting light source, second depth-of-field camera, and second sighting light source of the TGV glass substrate through-via detection device, wherein the first depth-of-field camera and first sighting light source are placed on a glass substrate having at least one glass substrate through-via and are facing the upper surface of the glass substrate, and the second depth-of-field camera and second sighting light source are placed below the glass substrate and are facing the lower surface of the glass substrate, and using the microcontroller unit of the TGV glass substrate through-via detection device, The method includes the steps of controlling a depth-of-field camera, a first sighting light source, a second depth-of-field camera, and a second sighting light source to emit a first sighting beam and a second sighting beam onto a glass substrate, respectively, and using the first depth-of-field camera and the second depth-of-field camera to acquire a first image and a second image, respectively, wherein the color of the first sighting beam is different from the color of the second sighting beam, and using a microcontroller unit of a TGV glass substrate through-via detection device to obtain at least one detection result for at least one glass substrate through-via based on the first image and the second image.

[0025] Figure 9 is a schematic side view of a through-via detection device for a TGV glass substrate according to another embodiment of the present invention, with respect to the glass substrate detection side. Unlike the embodiment in Figure 4, in this embodiment the through-via detection device further comprises a prism-type beam splitter module 25 located on the upper surface 10 of the glass substrate 1 and the first telecentric lens imaging module 21, and a third telecentric lens imaging module 26 located on one side (e.g., the right side) of the prism-type beam splitter module 25. The third telecentric lens imaging module 26 includes a third depth-of-field camera 261 and a third sighting light source 262, wherein the third sighting light source 262 is disabled here, i.e., does not emit a third sighting beam. The third depth-of-field camera 261 is electrically connected to a control microcontroller unit 23. The second sighting beam L2 is transmitted through the glass substrate 1 to the sighting. The second sighting beam either passes through the portion of the glass substrate 1 other than the through via 122 and the upper opening 121 (when the upper opening diameter Rt is greater than or equal to the lower opening diameter Rb), or the second sighting beam passes through the portion of the glass substrate 1 other than the through via 122 and the lower opening 123 (when the upper opening diameter Rt is less than the lower opening diameter Rb). The prism-type beam splitter module 25 is used to spectrally separate the second sighting beam L2 that passes through the glass substrate 1, and is also used to spectrally separate the first sighting beam L1 that is emitted toward the glass substrate 1 and the first sighting beam L1 that is reflected by the glass substrate 1.

[0026] A portion of the second sighting beam L2 that passes through the glass substrate 1, a portion of the first sighting beam L1 that is emitted toward the glass substrate 1, and a portion of the first sighting beam L1 that is reflected by the glass substrate 1 are received by the third depth-of-field camera 261 and form a third image. The remaining portion of the second sighting beam L2 that passes through the glass substrate 1 after spectral separation and the remaining portion of the first sighting beam L1 that is reflected by the glass substrate 1 after spectral separation are received by the first depth-of-field camera 211 and form a first image. In this way, the brightness of the third image is higher and the color of the first sighting beam L1 is deflected compared to the first image. The remaining portion of the first sighting beam L1 that is emitted toward the glass substrate 1 after spectral separation is partially transmitted through the glass substrate 1 and partially reflected by the glass substrate 1. In this way, the second depth-of-field camera 221 receives the first sighting beam L1 that passes through the glass substrate 1 and the second sighting beam L2 that is reflected by the glass substrate 1, and a second image is formed.

[0027] In this embodiment, the detection results of the glass substrate through-beams 12 are obtained more accurately using the first, second, and third images. Furthermore, in this embodiment, the beam color of the first sighting beam L1 and the beam color of the second sighting beam L2 are made to be the same or different from each other. For example, the beam color of the first sighting beam L1 and the beam color of the second sighting beam L2 are each selected from white, red, green, and blue. Also, depending on the actual situation, the first depth-of-field camera 211, the second depth-of-field camera 221, and the third depth-of-field camera 261 may be color or monochrome cameras.

[0028] In conclusion, the present invention provides a through-via detection device and detection method for optical TGV glass substrates that does not require filling with lossless plasticizing material, and the detectable items include at least one of the following: the opening diameter of the upper and lower openings of the glass substrate through-via, the opening coordinates, the roundness of the opening, the crack detection result, the impurity detection result, the edge chipping detection result, the through-via diameter of the glass substrate through-via, the hole occlusion detection result of the glass substrate through-via, and the amount of displacement between the upper and lower openings. Furthermore, the TGV glass substrate through-via detection device and detection method according to the present invention shortens the detection time, reduces costs, and further prevents damage to the glass substrate.

[0029] The embodiments described above are provided to facilitate understanding of the present invention and are not intended to limit its interpretation. The present invention may be modified and improved without departing from its spirit, and it goes without saying that equivalents thereof are included. [Explanation of Symbols]

[0030] 1. Glass substrate 10 Top side 11 Bottom side 12 glass substrate through-vias 121 Top opening 122 Through vias 123 Lower opening 21. First telecentric lens imaging module 211 First depth-of-field camera 212 1st collimated light source 213 Light-receiving lens module 214 Telecentric Lens Module 215 Imaging Module 22. Second telecentric lens imaging module 221 Second depth-of-field camera 222 Second collimated light source 23 Microcontroller Unit 25 Spectrometer Module 26. Second telecentric lens imaging module 261 Third depth-of-field camera 262 Third collimated light source Rt Upper opening diameter Rb Lower opening diameter Rm Through via diameter AA section line BB cross section line L1 First sighting beam L2 Second sighting beam L2' First sensing beam L0 beam

Claims

1. A first depth-of-field camera (211) and a first sighting light source (212) are installed on a glass substrate (1) having at least one glass substrate through via (12) and facing the upper surface (10) of the glass substrate (1), A second depth-of-field camera (221) and a second sighting light source (222) are installed beneath the glass substrate (1) and facing directly towards the lower surface (11) of the glass substrate (1), The system comprises a first depth-of-field camera (211), a first sighting light source (212), a second depth-of-field camera (221), and a microcontroller unit (23) electrically connected to the second sighting light source (222), The first sighting light source (212) and the second sighting light source (222) emit a first sighting beam (L1) and a second sighting beam (L2) onto the glass substrate (1), respectively. The wavelength band of the light of the first sighting beam (L1) is the same as or different from the wavelength band of the light of the second sighting beam (L2). The first depth-of-field camera (211) and the second depth-of-field camera (221) are used to acquire the first image and the second image, respectively. The microcontroller unit (23) is used to obtain at least one detection result of at least one glass substrate through-via (12) based on the first image and the second image, Through-via detection device for TGV glass substrates.

2. The TGV glass substrate through-via detection device according to claim 1, characterized in that the detection results include at least one of the following: the opening diameters (Rt, Rb) of the upper opening (121) and lower opening (123) of the glass substrate through-via (12), the opening coordinates, the roundness of the opening, the crack detection result, the dirt detection result, the impact detection result, the scratch detection result, the impurity detection result, the edge chipping detection result, the through-via diameter (Rm) of the glass substrate through-via (12), the hole occlusion detection result of the glass substrate through-via (12), and the amount of displacement between the upper opening and the lower opening.

3. The first depth-of-field camera (211) and the first sighting light source (212) are integrated as a first telecentric lens imaging module (21), the first telecentric lens imaging module (21) comprises a light-receiving lens module (213), a telecentric lens module (214), and an imaging module (215), the external shape of the first telecentric lens imaging module (21) is T-shaped, the imaging module (215) is installed at the upper end of the first telecentric lens imaging module (21), and the light-receiving lens module (213) is the first telecentric lens imaging module The through-via detection device for a TGV glass substrate according to claim 1, characterized in that a telecentric lens module (214) is installed at the side end of the image module (21), the light-receiving lens module (213) receives the beam (L0) of the initial light source, the telecentric lens module (214) is used to emit the first sighting beam (L1) and receive the first sensing beam (L2'), and the imaging module (215) is used to generate the first image based on the first sensing beam (L2').

4. The second depth-of-field camera (221) and the second sighting light source (222) are integrated as a second telecentric lens imaging module (22), the second telecentric lens imaging module (22) comprises another light-receiving lens module, another telecentric lens module, and another imaging module, the external shape of the second telecentric lens imaging module (22) is T-shaped, the other imaging module is installed at the upper end of the second telecentric lens imaging module (22), and the other light-receiving lens module is the second telecentric The TGV glass substrate through-via detection device according to claim 3, wherein a lens module is installed at the side end of the cleanse imaging module (22), another telecentric lens module is installed at the bottom end of the second telecentric lens imaging module (22), another light-receiving lens module receives the beam of another initial light source, another telecentric lens module is used to emit the second sighting beam (L2) and receive the second sensing beam, and another imaging module is used to generate the second image based on the second sensing beam.

5. Frame and, The frame further comprises a mounting structure installed within the frame, which contacts multiple corners of the glass substrate (1) and supports the glass substrate (1), The TGV glass substrate through-via detection device according to claim 4, characterized in that the first telecentric lens imaging module is movably mounted in the frame and adjacent to the upper interior side of the frame, and the second telecentric lens imaging module is movably mounted in the frame and adjacent to the bottom interior side of the frame.

6. The TGV glass substrate through-via detection device according to claim 5, further comprising a first transmission mechanism and a second transmission mechanism connected to the first telecentric lens imaging module and the second telecentric lens imaging module, respectively, for causing the first depth-of-field camera (211), the first sighting light source (212), the second depth-of-field camera (221), and the second sighting light source (222) to perform two-dimensional or three-dimensional movement.

7. The first transmission mechanism and the second transmission mechanism are, First axial movement arm and A second axial movement arm is connected perpendicularly to the first axial movement arm and connected to a portion of the frame, wherein the first axial movement arm is driven to move along the first axial direction relative to the second axial movement arm, and the second axial movement arm is driven to move along the second axial direction relative to the frame, The TGV glass substrate through-via detection device according to claim 6, comprising a third axial movement arm connected to the first telecentric lens imaging module or the second telecentric lens imaging module and connected perpendicularly to the first axial movement arm, wherein the third axial movement arm is used to move in the third axial direction relative to the first axial movement arm by being driven, and the first axial direction, the second axial direction, and the third axial direction are perpendicular to each other.

8. The through-via detection device for a TGV glass substrate according to claim 1, characterized in that the color of the first sighting beam (L1) and the color of the second sighting beam (L2) are each selected from red, green, blue, and white.

9. The first image shows an upper opening (121), waist-depth through via (122), and a partial image of the upper surface (10) of the glass substrate (1) near the upper opening (121) of at least one through via (12) of the glass substrate (1), wherein the color of the through via is the color of the second sighting beam (L2), the color from the upper opening (121) to the through via (122) is black, and the partial color of the upper surface (10) of the glass substrate (1) near the upper opening (121) is a mixture of the color of the first sighting beam (L1) and the color of the second sighting beam (L2), as described in claim 1.

10. The TGV glass substrate through-via detection device according to claim 1, wherein the second image shows the lower opening (123) of at least one glass substrate through-via (12) of the glass substrate (1), the waist-depth through-via (122), and a partial lower surface (11) of the glass substrate (1) near the lower opening (123), wherein the color of the through-via (122) is the beam color of the first sighting beam (L1), the color from the lower opening (123) to the through-via (122) is black, and the color of the partial lower surface (11) of the glass substrate (1) near the lower opening (123) is a mixture of the beam color of the first sighting beam (L1) and the beam color of the second sighting beam (L2).

11. A first depth-of-field camera (211) and a first sighting light source (212) are installed on a glass substrate (1) having at least one glass substrate through via (12) and facing the upper surface (10) of the glass substrate (1), A second depth-of-field camera (221) and a second sighting light source (222) are installed beneath the glass substrate (1) and facing directly towards the lower surface (11) of the glass substrate (1), A microcontroller unit (23) electrically connected to the first depth-of-field camera (211), the first sighting light source (212), the second depth-of-field camera (221), and the second sighting light source (222), A spectrometer module (25) is installed between the upper surface (10) of the glass substrate (1) and the first sighting light source (212), The system includes a third depth-of-field camera (261) installed on one side of the spectrometer module (25) and electrically connected to the control microcomputer unit (23), The first sighting light source (212) and the second sighting light source (222) emit a first sighting beam (L1) and a second sighting beam (L2) onto the glass substrate (1), respectively. The spectrometer module (25) is used to spectrally analyze the first sighting beam (L1) emitted toward the glass substrate (1), the first sighting beam (L1) reflected by the glass substrate (1), and the second sighting beam (L2) passing through the glass substrate via (12). A portion of the first sighting beam (L1) emitted toward the glass substrate (1) after it has been spectrally separated, a portion of the first sighting beam (L1) reflected by the glass substrate (1) after it has been spectrally separated, and a portion of the second sighting beam (L2) passing through the glass substrate via (12) after it has been spectrally separated are received by the third depth-of-field camera (261). The remaining portion of the first sighting beam (L1) reflected by the glass substrate (1) after spectral dispersion and the remaining portion of the second sighting beam (L2) passing through the glass substrate via (12) after spectral dispersion are received by the first depth-of-field camera (221). The remaining portion of the first sighting beam (L1) emitted toward the glass substrate (1) after spectral separation is partially transmitted through the glass substrate (1) and partially reflected by the glass substrate (1). The wavelength band of the first sighting beam (L1) is the same as or different from the wavelength band of the second sighting beam (L2). The first depth-of-field camera (211), the second depth-of-field camera (221), and the third depth-of-field camera (261) are used to acquire the first image, the second image, and the third image, respectively. The control microcontroller unit (23) is used to obtain at least one detection result of at least one glass substrate through-via (12) based on the first image, the second image, and the third image. Through-via detection device for TGV glass substrates.

12. The TGV glass substrate through-via detection device according to claim 11, characterized in that the detection results include at least one of the following: the opening diameters (Rt, Rb) of the upper opening (121) and lower opening (123) of the glass substrate through-via (12), the opening coordinates, the roundness of the opening, the crack detection result, the dirt detection result, the impact detection result, the scratch detection result, the impurity detection result, the edge chipping detection result, the through-via diameter (Rm) of the glass substrate through-via (12), the hole occlusion detection result of the glass substrate through-via (12), and the amount of displacement between the upper opening and the lower opening.

13. The through-via detection device for a TGV glass substrate according to claim 11, characterized in that the color of the first sighting beam (L1) and the color of the second sighting beam (L2) are each selected from white, red, green, and blue.

14. The TGV glass substrate through-via detection device according to claim 11, wherein each of the first and third images shows an upper opening (121) of at least one glass substrate through-via (12) of the glass substrate (1), a waist-depth through-via (122), and a partial upper surface (10) of the glass substrate (1) near the upper opening (121), wherein the color of the through-via is the beam color of the second sighting beam (L2), the color from the upper opening (121) to the through-via (122) is black, and the color of the partial upper surface (10) of the glass substrate (1) near the upper opening (121) is a mixture of the beam color of the first sighting beam (L1) and the beam color of the second sighting beam (L2).

15. The TGV glass substrate through-via detection device according to claim 1, characterized in that the second image shows a lower opening (123) of at least one glass substrate through-via (12) of the glass substrate (1), a waist-depth through-via (122), and a partial image of the lower surface (11) of the glass substrate (1) near the lower opening (123), wherein the color of the through-via (122) is the color of the first sighting beam (L1), the color from the lower opening (123) to the through-via (122) is black, and the partial color of the lower surface (11) of the glass substrate (1) near the lower opening (123) is a mixture of the color of the first sighting beam (L1) and the color of the second sighting beam (L2).

16. A method for detecting through-vias in a TGV glass substrate, which is performed in a through-via detection device for TGV glass substrates, The through-via detection device comprises a first depth-of-field camera (211), a first sighting light source (212), a second depth-of-field camera (221), and a second sighting light source (222). The first depth-of-field camera (211) and the first sighting light source (212) are mounted on a glass substrate (1) having at least one glass substrate through via (12), and are facing the upper surface (10) of the glass substrate (1). The second depth-of-field camera (221) and the second sighting light source (222) are installed beneath the glass substrate (1) and facing directly toward the lower surface (11) of the glass substrate (1). The control microcontroller unit (23) of the through-via detection device for the TGV glass substrate is used to control the first depth-of-field camera (211), the first sighting light source (212), the second depth-of-field camera (221), and the second sighting light source (222), so that the first sighting light source (212) and the second sighting light source (222) emit a first sighting beam (L1) and a second sighting beam (L2) onto the glass substrate (1), and the first depth-of-field camera (211) and the second depth-of-field camera (221) are used to acquire a first image and a second image, respectively, and the wavelength band of the light of the first sighting beam (L1) is the same as or different from the wavelength band of the light of the second sighting beam (L2). The device is characterized by using the control microcontroller unit (23) of the TGV glass substrate through-via detection device to obtain at least one detection result for at least one glass substrate through-via (12) based on the first image and the second image, Method for detecting through-vias in a TGV glass substrate.

17. The method for detecting through-vias in a TGV glass substrate according to claim 16, characterized in that the detection results include at least one of the following: the opening diameters (Rt, Rb) of the upper opening (121) and lower opening (123) of the glass substrate through-via (12), the opening coordinates, the roundness of the opening, the crack detection result, the dirt detection result, the impact detection result, the scratch detection result, the impurity detection result, the edge chipping detection result, the through-via diameter (Rm) of the glass substrate through-via (12), the hole occlusion detection result of the glass substrate through-via (12), and the amount of displacement between the upper opening and the lower opening.

18. The method for detecting through-vias in a TGV glass substrate according to claim 16, characterized in that the beam color of the first sighting beam (L1) and the beam color of the second sighting beam (L2) are selected from red, green, and blue.

19. The first image shows an upper opening (121), waist-depth through via (122), and a partial image of the upper surface (10) of the glass substrate (1) near the upper opening (121) of at least one through via (12) of the glass substrate (1), wherein the color of the through via is the color of the second sighting beam (L2), the color from the upper opening (121) to the through via (122) is black, and the partial color of the upper surface (10) of the glass substrate (1) near the upper opening (121) is a mixture of the color of the first sighting beam (L1) and the color of the second sighting beam (L2), as described in 16.

20. The method for detecting through-vias in a TGV glass substrate according to claim 16, characterized in that the second image shows a partial image of the lower opening (123) of at least one through-via (12) of the glass substrate (1), a waist-depth through-via (122), and the lower surface (11) of the glass substrate (1) near the lower opening (123), wherein the color of the through-via (122) is the color of the first sighting beam (L1), the color from the lower opening (123) to the through-via (122) is black, and the partial color of the lower surface (11) of the glass substrate (1) near the lower opening (123) is a mixture of the color of the first sighting beam (L1) and the color of the second sighting beam (L2).

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